TW202328501A - Method for plating black nickel surface treatment of usb inner housing and a connector having the same - Google Patents
Method for plating black nickel surface treatment of usb inner housing and a connector having the same Download PDFInfo
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- TW202328501A TW202328501A TW112109003A TW112109003A TW202328501A TW 202328501 A TW202328501 A TW 202328501A TW 112109003 A TW112109003 A TW 112109003A TW 112109003 A TW112109003 A TW 112109003A TW 202328501 A TW202328501 A TW 202328501A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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Abstract
Description
本發明關於連接器技術領域,尤指一種連接器的USB內殼鍍黑鎳表面處理方法。The invention relates to the technical field of connectors, in particular to a surface treatment method for black-nickel plating of a USB inner shell of a connector.
隨著電子產品的持續發展,連接器得到廣泛運用,連接器廣泛應用於電子類產品充電與訊號傳輸,連接器以適應更快、更兼容、更耐用等性能趨勢。USB連接器應用於個人電腦和移動設備等訊息通訊產品,並擴展至攝影器材、數字電視、游戲機等其它相關領域,已經在各類外部設備中廣泛的被採用。With the continuous development of electronic products, connectors are widely used. Connectors are widely used in charging and signal transmission of electronic products. Connectors adapt to performance trends such as faster, more compatible, and more durable. USB connectors are used in information and communication products such as personal computers and mobile devices, and have been extended to photographic equipment, digital TVs, game consoles and other related fields, and have been widely used in various external devices.
USB連接器具有熱插拔功能,USB連接器可連接多種外設;由於USB連接器熱插拔功能,USB連接器需要可靠的更耐用及安全性,現有連接器內殼的耐磨性和抗腐蝕能力較差;並且常規USB內殼電鍍黑鎳,鍍層顔色為淺黑色,不具濃濃的深黑色美觀。The USB connector has a hot-swappable function, and the USB connector can be connected to a variety of peripheral devices; due to the hot-swappable function of the USB connector, the USB connector needs to be reliable, more durable and safe, and the wear resistance and resistance of the existing connector inner shell The corrosion ability is poor; and the conventional USB inner shell is electroplated with black nickel, and the color of the coating is light black, which does not have a thick and deep black appearance.
為了克服現有技術的缺點,本發明的目的一是提供一種USB內殼鍍黑鎳表面處理工藝,能達到增進產品美觀度效果。In order to overcome the disadvantages of the prior art, the first object of the present invention is to provide a surface treatment process of black nickel plating on the USB inner shell, which can achieve the effect of improving the aesthetics of the product.
目的二是提供一種具有鍍黑鎳表面處理方法製作的USB內殼的連接器,在保持產品品質的同時,也提升產品抗腐蝕性能。The second purpose is to provide a connector with a USB inner shell made by a black nickel-plated surface treatment method, which can improve the corrosion resistance of the product while maintaining the product quality.
為解決現有技術問題,本發明採用以下技術手段:In order to solve the prior art problems, the present invention adopts the following technical means:
一種USB內殼鍍黑鎳表面處理工藝,方法如下:
步驟§10.除油處理;
步驟§11、放料:殼子工件投入,殼子工件備料生產;
步驟§12、清洗:殼子工件除油除污;
步驟§121、除油污:除油槽加入除油粉(脫脂粉),除油粉在陰極電流條件下進行除油;
製程條件:除油粉濃度50~120g/L,溫度50~65℃,除油時間為5~10s,電壓2~12V,陰極電流密度5~10ASD;
除油槽中除油,徹底去除殼子工件衝壓表面的衝壓油殘留;
步驟§13、水洗:水洗噴嘴以傾斜30~60角度,沖洗殼子工件產品,水質清潔;清洗殼子工件衝壓表面殘留的除油溶液;
步驟§20.電鍍鎳(鍍普鎳+黑鎳):
素材殼子工件投入(進入)連續電鍍線(機)。
步驟§22、鍍普鎳:
鍍鎳組液中:
鎳離子:70~120g/L; (鎳離子原料採用氨基磺酸鎳)
氯化鎳:5~15g/L;
硼酸:35~55g/L;
製程條件:溫度50~65℃,PH值3.8~4.4,時間5~10s,電壓2~12V;
膜厚控制:0.1~10μm;
步驟§221、水洗:水洗噴嘴以30~60度,沖洗產品,水質清潔。
步驟§23、鍍黑鎳:
鍍黑鎳組液中:
焦磷酸亞錫:60~160g/L;
焦磷酸鉀:180~340g/L;
氯化鎳:8~15g/L;
硫酸鎳:130~220g/L;
黑鎳劑:10~50ml/L;
製程條件:溫度30~55℃,PH值4~5.5,時間5~20s,電壓1~8V,電流密度(A/m2):1~5,陽極:碳板(或錫板、或鎳板);
鎳膜厚控制:0.025~10μm。
步驟§30.收料:
步驟§31、水洗:水洗噴嘴以傾斜30~60角度,沖洗產品,水質清潔;
步驟§32、烘乾:溫度100~130℃,時間10~20s;
步驟§33、檢驗包裝:目視比對色樣,無明顯差異,檢驗裝載。
A surface treatment process of black nickel plating on a USB inner shell, the method is as follows:
Step §10. degreasing treatment;
Step §11, feeding: the shell workpiece is put in, and the shell workpiece is prepared for production;
進一步,在一些實施例中,該步驟§121除油污後,加入步驟§122酸洗拋光;
步驟§122、酸洗拋光:
電解拋光槽加入硫酸:拋光同時進行酸中和;去除衝壓毛刺並獲得平整的基材表面,降低鍍層的孔隙率;
製程條件:硫酸30~40ml/L,溫度為常溫,陽極電流密度5~50ASD,陽極電極3~7V,陰極採用316L不鏽鋼板或銅板,時間5~10s。
Further, in some embodiments, after step §121 degreasing, add step §122 pickling and polishing;
Step §122, pickling and polishing:
Sulfuric acid is added to the electropolishing tank: acid neutralization is carried out at the same time as polishing; stamping burrs are removed to obtain a flat substrate surface and reduce the porosity of the coating;
Process conditions:
進一步,在一些實施例中,該步驟§22鍍普鎳前,加入步驟§21預鍍鎳; 步驟§21、預鍍鎳: 預鍍鎳組液中: 硫酸鎳:150~220g/L; 氯化鎳:5~15g/L; 硼酸:35~55g/L; 製程條件:溫度50~65℃,PH值3.8~4.4,時間5~10s,電壓2~12V; 膜厚控制:0.025~1μm。 Further, in some embodiments, before this step §22 nickel plating, step §21 pre-nickel plating is added; Step §21, pre-nickel plating: In the pre-plating nickel solution: Nickel sulfate: 150~220g/L; Nickel chloride: 5~15g/L; Boric acid: 35~55g/L; Process conditions: temperature 50~65℃, pH value 3.8~4.4, time 5~10s, voltage 2~12V; Film thickness control: 0.025~1μm.
進一步,在一些實施例中,該步驟§21預鍍鎳後,加入步驟§211水洗; 步驟§211、水洗:水洗噴嘴以30~60度,沖洗產品,水質清潔。 Further, in some embodiments, after the step §21 pre-nickel plating, step §211 water washing is added; Step §211, water washing: wash the nozzle with water at 30-60 degrees to rinse the product, and the water quality is clean.
一種連接器,包括上述USB內殼鍍黑鎳表面處理工藝製作的一殼體;該殼體內插設有的一舌板,該舌板遠離該殼體的一端設有一基座,該基座與該舌板中設有鑲埋成型的一端子組; 該殼體(USB內殼)包括一基材,該基材為不鏽鋼(SUS),該殼體的該基材表面外具有堆疊結構的一複合鍍層,該基材表面的該複合鍍層依次向外、按鍍覆先後為一預鍍鎳層、一普鎳層、一黑鎳層; 該預鍍鎳層為鎳鍍層,厚度:0.025~1μm; 該普鎳層為普Ni鍍層,厚度:0.1~10μm; 該黑鎳層為黑Ni鍍層,厚度: 0.025~10μm。 A connector, comprising a shell made of the above-mentioned USB inner shell with black nickel-plated surface treatment process; a tongue plate is inserted in the shell, and a base is provided at the end of the tongue plate away from the shell, and the base and A terminal group embedded and molded is arranged in the tongue plate; The shell (USB inner shell) includes a base material, the base material is stainless steel (SUS), and the surface of the base material of the shell has a composite coating with a stacked structure, and the composite coating on the surface of the base material is sequentially outward , According to the plating sequence, it is a pre-plating nickel layer, a common nickel layer, and a black nickel layer; The pre-plating nickel layer is nickel plating, thickness: 0.025~1μm; The ordinary nickel layer is an ordinary Ni plating layer, thickness: 0.1~10μm; The black nickel layer is a black Ni plating layer with a thickness of 0.025-10 μm.
進一步,在一些實施例中,該端子組的插接端設置在該舌板上;該端子組的自由端延伸至該基座之外; 該預鍍鎳層厚度:0.03~0.2μm; 該普鎳層厚度:2~3μm; 該黑鎳層厚度:0.05~0.85μm。 Further, in some embodiments, the plug-in end of the terminal set is disposed on the tongue plate; the free end of the terminal set extends out of the base; The thickness of the pre-plating nickel layer: 0.03~0.2μm; The thickness of the ordinary nickel layer: 2~3μm; The thickness of the black nickel layer: 0.05~0.85μm.
本發明採用USB內殼鍍黑鎳表面處理技術製造的USB連接器,產品主要用於電腦周邊設備、PC領域等,產品外觀色澤均勻,增進產品美觀度效果,同時也提升產品防腐能力。本發明更好地確保USB內殼鍍層緻密性,抗鹽霧性能顯著提升,可以耐受24H以上的鹽霧環境而不起鏽。The invention adopts the USB connector manufactured by the black nickel-plated surface treatment technology of the USB inner shell. The product is mainly used in the field of computer peripheral equipment, PC, etc., and the appearance and color of the product are uniform, and the aesthetic effect of the product is improved, and the anti-corrosion ability of the product is also improved at the same time. The present invention better ensures the compactness of the plating layer of the USB inner shell, significantly improves the anti-salt spray performance, and can withstand the salt spray environment of more than 24H without rusting.
為能進一步瞭解本發明的特徵、技術手段以及所達到的具體目的、功能,下面結合附圖與具體實施方式對本發明作進一步詳細描述。以下藉由特定的具體實施例說明本發明的實施方式,令所屬技術領域具有通常知識者可由本說明書所揭示的內容輕易地瞭解本發明的其他優點及功效。本發明亦可藉由其他不同的具體實例加以施行或應用,本發明說明書中的各項細節亦可基於不同觀點與應用在不悖離本發明的精神下進行各種修飾與變更。In order to further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. The implementation of the present invention is described below through specific specific examples, so that those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in the description of the present invention based on different viewpoints and applications without departing from the spirit of the present invention.
本發明提升產品抗腐蝕性能及增進產品美觀度效果,提升產品的品質,提升了產品耐腐蝕能力,獲得產品外觀色澤均勻的堆疊鍍層。The invention improves the anti-corrosion performance of the product and the aesthetics of the product, improves the quality of the product, improves the anti-corrosion ability of the product, and obtains stacked coatings with uniform appearance and color of the product.
本發明的一種USB內殼鍍黑鎳表面處理工藝,其方法主要是透過執行下列步驟實現,具體實施例如下:
步驟§10.除油處理。
步驟§11、放料:殼子工件投入,殼子工件備料生產。
步驟§12、清洗:殼子工件除油除污;
步驟§121、除油污:除油槽加入除油粉(脫脂粉),除油粉在陰極電流條件下進行除油;
製程條件:除油粉濃度50~120g/L,溫度50~65℃,除油時間為5~10s,電壓2~12V,陰極電流密度5~10ASD;
除油槽中除油,徹底去除殼子工件衝壓表面的衝壓油殘留。
步驟§122、酸洗拋光:
電解拋光槽加入硫酸:拋光同時進行酸中和,去除衝壓毛刺並獲得平整的基材表面,降低鍍層的孔隙率;
製程條件:硫酸30~40ml/L,溫度為常溫,陽極電流密度5~50ASD,陽極電極3~7V,陰極採用316L不鏽鋼板或銅板,時間5~10s。
步驟§13、水洗:水洗噴嘴以傾斜30~60角度,沖洗殼子工件產品,水質清潔;清洗殼子工件衝壓表面殘留的除油溶液。
步驟§20.電鍍鎳(鍍普鎳+黑鎳):
素材殼子工件投入連續電鍍線。
步驟§21、預鍍鎳:
預鍍鎳組液中:
硫酸鎳:150~220g/L;
氯化鎳:5~15g/L;
硼酸:35~55g/L;
製程條件:溫度50~65℃,PH值3.8~4.4,時間5~10s,電壓2~12V;
膜厚控制:0.025~1μm;
步驟§211、水洗:水洗噴嘴以30~60度,沖洗產品,水質清潔;
步驟§22、鍍普鎳:
鍍鎳組液中:
鎳離子:70~120g/L;(鎳離子原料採用氨基磺酸鎳)
氯化鎳:5~15g/L;
硼酸:35~55g/L;
製程條件:溫度50~65℃,PH值3.8~4.4,時間5~10s,電壓2~12V;
膜厚控制:0.1~10μm;
步驟§221、水洗:水洗噴嘴以30~60度,沖洗產品,水質清潔;
步驟§23、鍍黑鎳(恒基電鍍):
鍍黑鎳組液中:
焦磷酸亞錫:60~160g/L;
焦磷酸鉀:180~340g/L;
氯化鎳:8~15g/L;
硫酸鎳:130~220g/L;
黑鎳劑:10~50ml/L;
製程條件:溫度30~55℃,PH值4~5.5,時間5~20s,電壓1~8V,電流密度(A/m2):1~5,陽極:碳板(或錫板、或鎳板);
鎳膜厚控制:0.025~10μm;
步驟§30.收料:
步驟§31、水洗:水洗噴嘴以傾斜30~60角度,沖洗產品,水質清潔;
步驟§32、烘乾:溫度100~130℃,時間10~20s;
步驟§33、檢驗包裝:目視比對色樣,無明顯差異,檢驗裝載。
A kind of black nickel-plated surface treatment process of the USB inner shell of the present invention, its method is mainly realized by performing the following steps, and the specific embodiments are as follows:
Step §10. Degreasing treatment.
Step §11, feeding: the shell workpiece is put in, and the shell workpiece is prepared for production.
進一步,本發明的連接器包括一殼體61及插設在該殼體61內的一舌板62,該舌板62一端設有一基座63,該基座63與該舌板62中設有鑲埋成型的一端子組64;Further, the connector of the present invention includes a
該端子組64的插接端設置在該舌板62上;該端子組64的自由端延伸至該基座63之外。The insertion end of the terminal set 64 is disposed on the tongue plate 62 ; the free end of the terminal set 64 extends out of the base 63 .
該殼體61(USB內殼)包括一基材40,該基材40為不銹鋼(SUS),該殼體61的該基材40表面外具有堆疊結構的一複合鍍層,該基材40表面的該複合鍍層依次向外、按鍍覆先後為一預鍍鎳層41、一普鎳層42、一黑鎳層43;
該預鍍鎳層41為鎳鍍層,厚度:0.025~1μm;
該普鎳層42為普Ni鍍層,厚度:0.1~10μm;
該黑鎳層43為黑Ni鍍層,厚度:0.025~10μm。
The shell 61 (USB inner shell) includes a
該殼體61(USB內殼)堆疊鍍層說明:
進一步,在一些實施例中,該預鍍鎳層41厚度:0.03~0.2μm;該普鎳層42厚度2~3μm;該黑鎳層43厚度:0.05~0.85μm。Further, in some embodiments, the thickness of the
本生產技術發明,運用到USB內鐵殼鍍鎳(預鍍鎳+普鎳+黑鎳)生產中,流程如下:This production technology invention is applied to the production of nickel plating (pre-plating nickel + ordinary nickel + black nickel) on the inner iron shell of the USB. The process is as follows:
①對USB不鏽鋼內鐵殼表面進行清洗;②先電鍍普鎳+③最後鍍黑鎳處理,在保持原產品品質的同時,外觀色澤均勻,還能達到增進產品美觀度效果;同時也提升產品防腐能力,耐鹽霧測試時間提升至24H以上。①Clean the surface of the USB stainless steel inner iron shell; ②Electroplate ordinary nickel first + ③Finally black nickel plating, while maintaining the quality of the original product, the appearance color is uniform, and it can also achieve the effect of improving the aesthetics of the product; at the same time, it also improves the anti-corrosion of the product Ability, salt spray resistance test time increased to more than 24H.
上述對實施例的描述是為了便於所屬技術領域具有通常知識者能夠理解和應用本案技術,僅表達了本發明的一種實施方式,其描述較為具體和詳細,但並不能因此而理解為對本發明專利範圍的限制。應當指出的是,對於所屬既屬領域具有通常知識者來說,在不脫離本發明構思的前提下,還可以做出複數個變形和改進,這些都屬於本發明的保護範圍。因此,本發明專利的保護範圍應以所附發明申請專利範圍的請求項為準。The above description of the embodiments is to facilitate the understanding and application of the technology of this case by those with ordinary knowledge in the technical field. It only expresses an implementation mode of the present invention. Scope limitation. It should be noted that for those with ordinary knowledge in the field, without departing from the concept of the present invention, multiple modifications and improvements can be made, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the patent for the present invention shall be subject to the claims of the appended scope of patent application for the invention.
步驟§10:除油處理 步驟§11:放料 步驟§12:清洗 步驟§121:除油汙 步驟§122:酸洗拋光 步驟§13:水洗 步驟§20:電鍍鎳 步驟§21:預鍍鎳 步驟§211:水洗 步驟§22:鍍普鎳 步驟§221:水洗 步驟§23:鍍黑鎳 步驟§30:收料 步驟§31:水洗 步驟§32:烘乾 步驟§35:檢驗包裝 40:基材 41:預鍍鎳層 42:普鎳層 43:黑鎳層 61:殼體 62:舌板 63:基座 64:端子組 Step §10: Degreasing treatment Step §11: Unloading Step §12: Cleaning Step §121: Degrease Step §122: Pickling and Polishing Step §13: Washing Step §20: Nickel Electroplating Step §21: Pre-Nickel Plating Step §211: Washing Step §22: Nickel Plating Step §221: Washing Step §23: Black Nickel Plating Step §30: Receiving Step §31: Washing Step §32: Drying Step §35: Inspect Packaging 40: Substrate 41: Pre-plated nickel layer 42: common nickel layer 43: black nickel layer 61: shell 62: tongue plate 63: base 64: Terminal group
圖1是本發明實施例的流程示意圖。 圖2是本發明實施例除油處理程序的流程示意圖。 圖3是本發明實施例電鍍鎳程序的流程示意圖。 圖4是本發明實施例收料程序的流程示意圖。 圖5是本發明實施例連接器的示意圖。 圖6是本發明實施例殼體的立體示意圖。 圖7是本發明實施例殼體(USB內殼)的剖面結構圖。 Fig. 1 is a schematic flow chart of an embodiment of the present invention. Fig. 2 is a schematic flow chart of an oil removal treatment procedure according to an embodiment of the present invention. Fig. 3 is a schematic flow chart of an electroplating nickel procedure according to an embodiment of the present invention. Fig. 4 is a schematic flow chart of the receiving program of the embodiment of the present invention. Fig. 5 is a schematic diagram of a connector according to an embodiment of the present invention. Fig. 6 is a three-dimensional schematic view of the casing of the embodiment of the present invention. Fig. 7 is a cross-sectional structure diagram of the casing (USB inner casing) of the embodiment of the present invention.
§10~§30:步驟 §10~§30: Steps
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CN202310018614.1A CN116083980A (en) | 2023-01-06 | 2023-01-06 | USB inner shell black nickel plating surface treatment process and related connector |
CN202310018614.1 | 2023-01-06 |
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TW202328501A true TW202328501A (en) | 2023-07-16 |
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