TW202328501A - Method for plating black nickel surface treatment of usb inner housing and a connector having the same - Google Patents

Method for plating black nickel surface treatment of usb inner housing and a connector having the same Download PDF

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TW202328501A
TW202328501A TW112109003A TW112109003A TW202328501A TW 202328501 A TW202328501 A TW 202328501A TW 112109003 A TW112109003 A TW 112109003A TW 112109003 A TW112109003 A TW 112109003A TW 202328501 A TW202328501 A TW 202328501A
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Taiwan
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nickel
plating
black
degreasing
shell
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TW112109003A
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Chinese (zh)
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李國棟
徐紅強
許立軍
郭林釗
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大陸商東莞立德精密工業有限公司
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present disclosure provides a method for plating black nickel surface treatment of USB inner housing and a connector having the same. The present disclosure improves aesthetic effect of the product. The present disclosure cleans a USB stainless surface of an inner iron housing. Then the normal nickel is electroplated. Then the plating black nickel is implemented. The housing comprises a tongue plate. The tongue plate includes a base plate. The base plate is disposed on one side of the tongue plate. A terminals is disposed between the base plate and the tongue plate. The housing comprises a substrate which is stainless steels. The surface of the housing includes composite coatings in a layered-structure. The composite coating comprises a pre-plating nickel layer, a normal nickel layer, and a black nickel layer. The present disclosure is applied on computer peripheral equipments. The products of the present may have uniform tincture, improving the aesthetic effect of the product and improving the product corrosion resistance.

Description

USB內殼鍍黑鎳表面處理工藝及關聯的連接器Black nickel-plated surface treatment process of USB inner shell and associated connector

本發明關於連接器技術領域,尤指一種連接器的USB內殼鍍黑鎳表面處理方法。The invention relates to the technical field of connectors, in particular to a surface treatment method for black-nickel plating of a USB inner shell of a connector.

隨著電子產品的持續發展,連接器得到廣泛運用,連接器廣泛應用於電子類產品充電與訊號傳輸,連接器以適應更快、更兼容、更耐用等性能趨勢。USB連接器應用於個人電腦和移動設備等訊息通訊產品,並擴展至攝影器材、數字電視、游戲機等其它相關領域,已經在各類外部設備中廣泛的被採用。With the continuous development of electronic products, connectors are widely used. Connectors are widely used in charging and signal transmission of electronic products. Connectors adapt to performance trends such as faster, more compatible, and more durable. USB connectors are used in information and communication products such as personal computers and mobile devices, and have been extended to photographic equipment, digital TVs, game consoles and other related fields, and have been widely used in various external devices.

USB連接器具有熱插拔功能,USB連接器可連接多種外設;由於USB連接器熱插拔功能,USB連接器需要可靠的更耐用及安全性,現有連接器內殼的耐磨性和抗腐蝕能力較差;並且常規USB內殼電鍍黑鎳,鍍層顔色為淺黑色,不具濃濃的深黑色美觀。The USB connector has a hot-swappable function, and the USB connector can be connected to a variety of peripheral devices; due to the hot-swappable function of the USB connector, the USB connector needs to be reliable, more durable and safe, and the wear resistance and resistance of the existing connector inner shell The corrosion ability is poor; and the conventional USB inner shell is electroplated with black nickel, and the color of the coating is light black, which does not have a thick and deep black appearance.

為了克服現有技術的缺點,本發明的目的一是提供一種USB內殼鍍黑鎳表面處理工藝,能達到增進產品美觀度效果。In order to overcome the disadvantages of the prior art, the first object of the present invention is to provide a surface treatment process of black nickel plating on the USB inner shell, which can achieve the effect of improving the aesthetics of the product.

目的二是提供一種具有鍍黑鎳表面處理方法製作的USB內殼的連接器,在保持產品品質的同時,也提升產品抗腐蝕性能。The second purpose is to provide a connector with a USB inner shell made by a black nickel-plated surface treatment method, which can improve the corrosion resistance of the product while maintaining the product quality.

為解決現有技術問題,本發明採用以下技術手段:In order to solve the prior art problems, the present invention adopts the following technical means:

一種USB內殼鍍黑鎳表面處理工藝,方法如下: 步驟§10.除油處理; 步驟§11、放料:殼子工件投入,殼子工件備料生產; 步驟§12、清洗:殼子工件除油除污; 步驟§121、除油污:除油槽加入除油粉(脫脂粉),除油粉在陰極電流條件下進行除油; 製程條件:除油粉濃度50~120g/L,溫度50~65℃,除油時間為5~10s,電壓2~12V,陰極電流密度5~10ASD; 除油槽中除油,徹底去除殼子工件衝壓表面的衝壓油殘留; 步驟§13、水洗:水洗噴嘴以傾斜30~60角度,沖洗殼子工件產品,水質清潔;清洗殼子工件衝壓表面殘留的除油溶液; 步驟§20.電鍍鎳(鍍普鎳+黑鎳): 素材殼子工件投入(進入)連續電鍍線(機)。 步驟§22、鍍普鎳: 鍍鎳組液中: 鎳離子:70~120g/L; (鎳離子原料採用氨基磺酸鎳) 氯化鎳:5~15g/L; 硼酸:35~55g/L; 製程條件:溫度50~65℃,PH值3.8~4.4,時間5~10s,電壓2~12V; 膜厚控制:0.1~10μm; 步驟§221、水洗:水洗噴嘴以30~60度,沖洗產品,水質清潔。 步驟§23、鍍黑鎳: 鍍黑鎳組液中: 焦磷酸亞錫:60~160g/L; 焦磷酸鉀:180~340g/L; 氯化鎳:8~15g/L; 硫酸鎳:130~220g/L; 黑鎳劑:10~50ml/L; 製程條件:溫度30~55℃,PH值4~5.5,時間5~20s,電壓1~8V,電流密度(A/m2):1~5,陽極:碳板(或錫板、或鎳板); 鎳膜厚控制:0.025~10μm。 步驟§30.收料: 步驟§31、水洗:水洗噴嘴以傾斜30~60角度,沖洗產品,水質清潔; 步驟§32、烘乾:溫度100~130℃,時間10~20s; 步驟§33、檢驗包裝:目視比對色樣,無明顯差異,檢驗裝載。 A surface treatment process of black nickel plating on a USB inner shell, the method is as follows: Step §10. degreasing treatment; Step §11, feeding: the shell workpiece is put in, and the shell workpiece is prepared for production; Step 12. Cleaning: Degreasing and decontaminating the shell workpiece; Step §121, degreasing: adding degreasing powder (skimming powder) to the degreasing tank, and the degreasing powder is degreasing under the condition of cathodic current; Process conditions: degreasing powder concentration 50~120g/L, temperature 50~65℃, degreasing time 5~10s, voltage 2~12V, cathode current density 5~10ASD; Remove oil in the oil removal tank to completely remove the stamping oil residue on the stamping surface of the shell workpiece; Step §13, water washing: the water washing nozzle is tilted at an angle of 30~60, and the shell workpiece product is rinsed, and the water quality is clean; the degreasing solution remaining on the stamping surface of the shell workpiece is cleaned; Step §20. Electroplated nickel (common nickel + black nickel): The material shell workpiece is put into (enter) the continuous electroplating line (machine). Step §22, common nickel plating: In nickel plating solution: Nickel ions: 70~120g/L; (Nickel ions are made of nickel sulfamate) Nickel chloride: 5~15g/L; Boric acid: 35~55g/L; Process conditions: temperature 50~65℃, pH value 3.8~4.4, time 5~10s, voltage 2~12V; Film thickness control: 0.1~10μm; Step §221, water washing: wash the nozzle with water at 30-60 degrees, rinse the product, and the water quality is clean. Step §23, black nickel plating: In the black nickel plating solution: Stannous pyrophosphate: 60~160g/L; Potassium pyrophosphate: 180~340g/L; Nickel chloride: 8~15g/L; Nickel sulfate: 130~220g/L; Black nickel agent: 10~50ml/L; Process conditions: temperature 30~55℃, pH value 4~5.5, time 5~20s, voltage 1~8V, current density (A/m2): 1~5, anode: carbon plate (or tin plate, or nickel plate) ; Nickel film thickness control: 0.025~10μm. Step §30. Receipt: Step §31, water washing: the water washing nozzle is tilted at an angle of 30~60, and the product is rinsed, and the water quality is clean; Step §32, drying: temperature 100~130℃, time 10~20s; Step §33, inspect the package: visually compare the color samples, if there is no significant difference, inspect the package.

進一步,在一些實施例中,該步驟§121除油污後,加入步驟§122酸洗拋光; 步驟§122、酸洗拋光: 電解拋光槽加入硫酸:拋光同時進行酸中和;去除衝壓毛刺並獲得平整的基材表面,降低鍍層的孔隙率; 製程條件:硫酸30~40ml/L,溫度為常溫,陽極電流密度5~50ASD,陽極電極3~7V,陰極採用316L不鏽鋼板或銅板,時間5~10s。 Further, in some embodiments, after step §121 degreasing, add step §122 pickling and polishing; Step §122, pickling and polishing: Sulfuric acid is added to the electropolishing tank: acid neutralization is carried out at the same time as polishing; stamping burrs are removed to obtain a flat substrate surface and reduce the porosity of the coating; Process conditions: sulfuric acid 30~40ml/L, temperature at room temperature, anode current density 5~50ASD, anode electrode 3~7V, cathode 316L stainless steel plate or copper plate, time 5~10s.

進一步,在一些實施例中,該步驟§22鍍普鎳前,加入步驟§21預鍍鎳; 步驟§21、預鍍鎳: 預鍍鎳組液中: 硫酸鎳:150~220g/L; 氯化鎳:5~15g/L; 硼酸:35~55g/L; 製程條件:溫度50~65℃,PH值3.8~4.4,時間5~10s,電壓2~12V; 膜厚控制:0.025~1μm。 Further, in some embodiments, before this step §22 nickel plating, step §21 pre-nickel plating is added; Step §21, pre-nickel plating: In the pre-plating nickel solution: Nickel sulfate: 150~220g/L; Nickel chloride: 5~15g/L; Boric acid: 35~55g/L; Process conditions: temperature 50~65℃, pH value 3.8~4.4, time 5~10s, voltage 2~12V; Film thickness control: 0.025~1μm.

進一步,在一些實施例中,該步驟§21預鍍鎳後,加入步驟§211水洗; 步驟§211、水洗:水洗噴嘴以30~60度,沖洗產品,水質清潔。 Further, in some embodiments, after the step §21 pre-nickel plating, step §211 water washing is added; Step §211, water washing: wash the nozzle with water at 30-60 degrees to rinse the product, and the water quality is clean.

一種連接器,包括上述USB內殼鍍黑鎳表面處理工藝製作的一殼體;該殼體內插設有的一舌板,該舌板遠離該殼體的一端設有一基座,該基座與該舌板中設有鑲埋成型的一端子組; 該殼體(USB內殼)包括一基材,該基材為不鏽鋼(SUS),該殼體的該基材表面外具有堆疊結構的一複合鍍層,該基材表面的該複合鍍層依次向外、按鍍覆先後為一預鍍鎳層、一普鎳層、一黑鎳層; 該預鍍鎳層為鎳鍍層,厚度:0.025~1μm; 該普鎳層為普Ni鍍層,厚度:0.1~10μm; 該黑鎳層為黑Ni鍍層,厚度: 0.025~10μm。 A connector, comprising a shell made of the above-mentioned USB inner shell with black nickel-plated surface treatment process; a tongue plate is inserted in the shell, and a base is provided at the end of the tongue plate away from the shell, and the base and A terminal group embedded and molded is arranged in the tongue plate; The shell (USB inner shell) includes a base material, the base material is stainless steel (SUS), and the surface of the base material of the shell has a composite coating with a stacked structure, and the composite coating on the surface of the base material is sequentially outward , According to the plating sequence, it is a pre-plating nickel layer, a common nickel layer, and a black nickel layer; The pre-plating nickel layer is nickel plating, thickness: 0.025~1μm; The ordinary nickel layer is an ordinary Ni plating layer, thickness: 0.1~10μm; The black nickel layer is a black Ni plating layer with a thickness of 0.025-10 μm.

進一步,在一些實施例中,該端子組的插接端設置在該舌板上;該端子組的自由端延伸至該基座之外; 該預鍍鎳層厚度:0.03~0.2μm; 該普鎳層厚度:2~3μm; 該黑鎳層厚度:0.05~0.85μm。 Further, in some embodiments, the plug-in end of the terminal set is disposed on the tongue plate; the free end of the terminal set extends out of the base; The thickness of the pre-plating nickel layer: 0.03~0.2μm; The thickness of the ordinary nickel layer: 2~3μm; The thickness of the black nickel layer: 0.05~0.85μm.

本發明採用USB內殼鍍黑鎳表面處理技術製造的USB連接器,產品主要用於電腦周邊設備、PC領域等,產品外觀色澤均勻,增進產品美觀度效果,同時也提升產品防腐能力。本發明更好地確保USB內殼鍍層緻密性,抗鹽霧性能顯著提升,可以耐受24H以上的鹽霧環境而不起鏽。The invention adopts the USB connector manufactured by the black nickel-plated surface treatment technology of the USB inner shell. The product is mainly used in the field of computer peripheral equipment, PC, etc., and the appearance and color of the product are uniform, and the aesthetic effect of the product is improved, and the anti-corrosion ability of the product is also improved at the same time. The present invention better ensures the compactness of the plating layer of the USB inner shell, significantly improves the anti-salt spray performance, and can withstand the salt spray environment of more than 24H without rusting.

為能進一步瞭解本發明的特徵、技術手段以及所達到的具體目的、功能,下面結合附圖與具體實施方式對本發明作進一步詳細描述。以下藉由特定的具體實施例說明本發明的實施方式,令所屬技術領域具有通常知識者可由本說明書所揭示的內容輕易地瞭解本發明的其他優點及功效。本發明亦可藉由其他不同的具體實例加以施行或應用,本發明說明書中的各項細節亦可基於不同觀點與應用在不悖離本發明的精神下進行各種修飾與變更。In order to further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. The implementation of the present invention is described below through specific specific examples, so that those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in the description of the present invention based on different viewpoints and applications without departing from the spirit of the present invention.

本發明提升產品抗腐蝕性能及增進產品美觀度效果,提升產品的品質,提升了產品耐腐蝕能力,獲得產品外觀色澤均勻的堆疊鍍層。The invention improves the anti-corrosion performance of the product and the aesthetics of the product, improves the quality of the product, improves the anti-corrosion ability of the product, and obtains stacked coatings with uniform appearance and color of the product.

本發明的一種USB內殼鍍黑鎳表面處理工藝,其方法主要是透過執行下列步驟實現,具體實施例如下: 步驟§10.除油處理。 步驟§11、放料:殼子工件投入,殼子工件備料生產。 步驟§12、清洗:殼子工件除油除污; 步驟§121、除油污:除油槽加入除油粉(脫脂粉),除油粉在陰極電流條件下進行除油; 製程條件:除油粉濃度50~120g/L,溫度50~65℃,除油時間為5~10s,電壓2~12V,陰極電流密度5~10ASD; 除油槽中除油,徹底去除殼子工件衝壓表面的衝壓油殘留。 步驟§122、酸洗拋光: 電解拋光槽加入硫酸:拋光同時進行酸中和,去除衝壓毛刺並獲得平整的基材表面,降低鍍層的孔隙率; 製程條件:硫酸30~40ml/L,溫度為常溫,陽極電流密度5~50ASD,陽極電極3~7V,陰極採用316L不鏽鋼板或銅板,時間5~10s。 步驟§13、水洗:水洗噴嘴以傾斜30~60角度,沖洗殼子工件產品,水質清潔;清洗殼子工件衝壓表面殘留的除油溶液。 步驟§20.電鍍鎳(鍍普鎳+黑鎳): 素材殼子工件投入連續電鍍線。 步驟§21、預鍍鎳: 預鍍鎳組液中: 硫酸鎳:150~220g/L; 氯化鎳:5~15g/L; 硼酸:35~55g/L; 製程條件:溫度50~65℃,PH值3.8~4.4,時間5~10s,電壓2~12V; 膜厚控制:0.025~1μm; 步驟§211、水洗:水洗噴嘴以30~60度,沖洗產品,水質清潔; 步驟§22、鍍普鎳: 鍍鎳組液中: 鎳離子:70~120g/L;(鎳離子原料採用氨基磺酸鎳) 氯化鎳:5~15g/L; 硼酸:35~55g/L; 製程條件:溫度50~65℃,PH值3.8~4.4,時間5~10s,電壓2~12V; 膜厚控制:0.1~10μm; 步驟§221、水洗:水洗噴嘴以30~60度,沖洗產品,水質清潔; 步驟§23、鍍黑鎳(恒基電鍍): 鍍黑鎳組液中: 焦磷酸亞錫:60~160g/L; 焦磷酸鉀:180~340g/L; 氯化鎳:8~15g/L; 硫酸鎳:130~220g/L; 黑鎳劑:10~50ml/L; 製程條件:溫度30~55℃,PH值4~5.5,時間5~20s,電壓1~8V,電流密度(A/m2):1~5,陽極:碳板(或錫板、或鎳板); 鎳膜厚控制:0.025~10μm; 步驟§30.收料: 步驟§31、水洗:水洗噴嘴以傾斜30~60角度,沖洗產品,水質清潔; 步驟§32、烘乾:溫度100~130℃,時間10~20s; 步驟§33、檢驗包裝:目視比對色樣,無明顯差異,檢驗裝載。 A kind of black nickel-plated surface treatment process of the USB inner shell of the present invention, its method is mainly realized by performing the following steps, and the specific embodiments are as follows: Step §10. Degreasing treatment. Step §11, feeding: the shell workpiece is put in, and the shell workpiece is prepared for production. Step 12. Cleaning: Degreasing and decontaminating the shell workpiece; Step §121, degreasing: adding degreasing powder (skimming powder) to the degreasing tank, and the degreasing powder is degreasing under the condition of cathodic current; Process conditions: degreasing powder concentration 50~120g/L, temperature 50~65℃, degreasing time 5~10s, voltage 2~12V, cathode current density 5~10ASD; Remove the oil in the oil removal tank to completely remove the stamping oil residue on the stamping surface of the shell workpiece. Step §122, pickling and polishing: Sulfuric acid is added to the electropolishing tank: acid neutralization is carried out at the same time as polishing, to remove stamping burrs and obtain a flat substrate surface, and reduce the porosity of the coating; Process conditions: sulfuric acid 30~40ml/L, temperature at room temperature, anode current density 5~50ASD, anode electrode 3~7V, cathode 316L stainless steel plate or copper plate, time 5~10s. Step §13, water washing: the water washing nozzle is tilted at an angle of 30-60, and the shell workpiece product is rinsed, and the water quality is clean; the degreasing solution remaining on the stamping surface of the shell workpiece is cleaned. Step §20. Electroplated nickel (common nickel + black nickel): The material shell workpiece is put into the continuous electroplating line. Step §21, pre-nickel plating: In the pre-plating nickel solution: Nickel sulfate: 150~220g/L; Nickel chloride: 5~15g/L; Boric acid: 35~55g/L; Process conditions: temperature 50~65℃, pH value 3.8~4.4, time 5~10s, voltage 2~12V; Film thickness control: 0.025~1μm; Step §211, water washing: wash the nozzle with water at 30-60 degrees, rinse the product, and the water quality is clean; Step §22, common nickel plating: In nickel plating solution: Nickel ions: 70~120g/L; (Nickel ions are made of nickel sulfamate) Nickel chloride: 5~15g/L; Boric acid: 35~55g/L; Process conditions: temperature 50~65℃, pH value 3.8~4.4, time 5~10s, voltage 2~12V; Film thickness control: 0.1~10μm; Step §221, water washing: wash the nozzle at 30-60 degrees, rinse the product, and the water quality is clean; Step §23, Black Nickel Plating (Henderson Plating): In the black nickel plating solution: Stannous pyrophosphate: 60~160g/L; Potassium pyrophosphate: 180~340g/L; Nickel chloride: 8~15g/L; Nickel sulfate: 130~220g/L; Black nickel agent: 10~50ml/L; Process conditions: temperature 30~55℃, pH value 4~5.5, time 5~20s, voltage 1~8V, current density (A/m2): 1~5, anode: carbon plate (or tin plate, or nickel plate) ; Nickel film thickness control: 0.025~10μm; Step §30. Receipt: Step §31, water washing: the water washing nozzle is tilted at an angle of 30-60 degrees to rinse the product, and the water quality is clean; Step §32, drying: temperature 100~130℃, time 10~20s; Step §33, inspect the package: visually compare the color samples, if there is no significant difference, inspect the package.

進一步,本發明的連接器包括一殼體61及插設在該殼體61內的一舌板62,該舌板62一端設有一基座63,該基座63與該舌板62中設有鑲埋成型的一端子組64;Further, the connector of the present invention includes a shell 61 and a tongue plate 62 inserted in the shell 61, one end of the tongue plate 62 is provided with a base 63, and the base 63 and the tongue plate 62 are provided with A terminal group 64 embedded in the molding;

該端子組64的插接端設置在該舌板62上;該端子組64的自由端延伸至該基座63之外。The insertion end of the terminal set 64 is disposed on the tongue plate 62 ; the free end of the terminal set 64 extends out of the base 63 .

該殼體61(USB內殼)包括一基材40,該基材40為不銹鋼(SUS),該殼體61的該基材40表面外具有堆疊結構的一複合鍍層,該基材40表面的該複合鍍層依次向外、按鍍覆先後為一預鍍鎳層41、一普鎳層42、一黑鎳層43; 該預鍍鎳層41為鎳鍍層,厚度:0.025~1μm; 該普鎳層42為普Ni鍍層,厚度:0.1~10μm; 該黑鎳層43為黑Ni鍍層,厚度:0.025~10μm。 The shell 61 (USB inner shell) includes a base material 40, the base material 40 is stainless steel (SUS). The composite coating is sequentially outwards, and successively is a pre-plating nickel layer 41, a common nickel layer 42, and a black nickel layer 43; The pre-plated nickel layer 41 is a nickel plated layer with a thickness of 0.025-1 μm; The common nickel layer 42 is a common Ni plating layer with a thickness of 0.1-10 μm; The black nickel layer 43 is a black Ni plating layer with a thickness of 0.025-10 μm.

該殼體61(USB內殼)堆疊鍍層說明: 標號 鍍種 鍍覆層 膜厚(μm) 40 SUS不鏽鋼基材 41 預鍍鎳 預鍍鎳層 0.025~1 42 鍍普Ni 普鎳層 0.1~10 43 鍍黑Ni 黑鎳層 0.025~10 The shell 61 (USB inner shell) stacking coating description: label Plating Plating layer Film thickness (μm) 40 / SUS stainless steel substrate 41 Nickel pre-plated Pre-plated nickel layer 0.025~1 42 Plated Ni Common nickel layer 0.1~10 43 Black Ni plating black nickel layer 0.025~10

進一步,在一些實施例中,該預鍍鎳層41厚度:0.03~0.2μm;該普鎳層42厚度2~3μm;該黑鎳層43厚度:0.05~0.85μm。Further, in some embodiments, the thickness of the pre-plating nickel layer 41 is 0.03-0.2 μm; the thickness of the common nickel layer 42 is 2-3 μm; the thickness of the black nickel layer 43 is 0.05-0.85 μm.

本生產技術發明,運用到USB內鐵殼鍍鎳(預鍍鎳+普鎳+黑鎳)生產中,流程如下:This production technology invention is applied to the production of nickel plating (pre-plating nickel + ordinary nickel + black nickel) on the inner iron shell of the USB. The process is as follows:

①對USB不鏽鋼內鐵殼表面進行清洗;②先電鍍普鎳+③最後鍍黑鎳處理,在保持原產品品質的同時,外觀色澤均勻,還能達到增進產品美觀度效果;同時也提升產品防腐能力,耐鹽霧測試時間提升至24H以上。①Clean the surface of the USB stainless steel inner iron shell; ②Electroplate ordinary nickel first + ③Finally black nickel plating, while maintaining the quality of the original product, the appearance color is uniform, and it can also achieve the effect of improving the aesthetics of the product; at the same time, it also improves the anti-corrosion of the product Ability, salt spray resistance test time increased to more than 24H.

上述對實施例的描述是為了便於所屬技術領域具有通常知識者能夠理解和應用本案技術,僅表達了本發明的一種實施方式,其描述較為具體和詳細,但並不能因此而理解為對本發明專利範圍的限制。應當指出的是,對於所屬既屬領域具有通常知識者來說,在不脫離本發明構思的前提下,還可以做出複數個變形和改進,這些都屬於本發明的保護範圍。因此,本發明專利的保護範圍應以所附發明申請專利範圍的請求項為準。The above description of the embodiments is to facilitate the understanding and application of the technology of this case by those with ordinary knowledge in the technical field. It only expresses an implementation mode of the present invention. Scope limitation. It should be noted that for those with ordinary knowledge in the field, without departing from the concept of the present invention, multiple modifications and improvements can be made, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the patent for the present invention shall be subject to the claims of the appended scope of patent application for the invention.

步驟§10:除油處理 步驟§11:放料 步驟§12:清洗 步驟§121:除油汙 步驟§122:酸洗拋光 步驟§13:水洗 步驟§20:電鍍鎳 步驟§21:預鍍鎳 步驟§211:水洗 步驟§22:鍍普鎳 步驟§221:水洗 步驟§23:鍍黑鎳 步驟§30:收料 步驟§31:水洗 步驟§32:烘乾 步驟§35:檢驗包裝 40:基材 41:預鍍鎳層 42:普鎳層 43:黑鎳層 61:殼體 62:舌板 63:基座 64:端子組 Step §10: Degreasing treatment Step §11: Unloading Step §12: Cleaning Step §121: Degrease Step §122: Pickling and Polishing Step §13: Washing Step §20: Nickel Electroplating Step §21: Pre-Nickel Plating Step §211: Washing Step §22: Nickel Plating Step §221: Washing Step §23: Black Nickel Plating Step §30: Receiving Step §31: Washing Step §32: Drying Step §35: Inspect Packaging 40: Substrate 41: Pre-plated nickel layer 42: common nickel layer 43: black nickel layer 61: shell 62: tongue plate 63: base 64: Terminal group

圖1是本發明實施例的流程示意圖。 圖2是本發明實施例除油處理程序的流程示意圖。 圖3是本發明實施例電鍍鎳程序的流程示意圖。 圖4是本發明實施例收料程序的流程示意圖。 圖5是本發明實施例連接器的示意圖。 圖6是本發明實施例殼體的立體示意圖。 圖7是本發明實施例殼體(USB內殼)的剖面結構圖。 Fig. 1 is a schematic flow chart of an embodiment of the present invention. Fig. 2 is a schematic flow chart of an oil removal treatment procedure according to an embodiment of the present invention. Fig. 3 is a schematic flow chart of an electroplating nickel procedure according to an embodiment of the present invention. Fig. 4 is a schematic flow chart of the receiving program of the embodiment of the present invention. Fig. 5 is a schematic diagram of a connector according to an embodiment of the present invention. Fig. 6 is a three-dimensional schematic view of the casing of the embodiment of the present invention. Fig. 7 is a cross-sectional structure diagram of the casing (USB inner casing) of the embodiment of the present invention.

§10~§30:步驟 §10~§30: Steps

Claims (6)

一種USB內殼鍍黑鎳表面處理工藝,其方法如下: 步驟§10.除油處理: 步驟§11、放料:殼子工件投入,殼子工件備料生產; 步驟§12、清洗:殼子工件除油除污; 步驟§121、除油污:除油槽加入除油粉,除油粉在陰極電流條件下進行除油; 工藝條件:除油粉濃度50~120g/L,溫度50~65℃,除油時間為5~10s,電壓2~12V,陰極電流密度5~10ASD; 除油槽中除油,徹底去除殼子工件衝壓表面的衝壓油殘留; 步驟§13、水洗:水洗噴嘴以傾斜30~60角度,沖洗殼子工件產品,水質清潔;清洗殼子工件衝壓表面殘留的除油溶液; 步驟§20.電鍍鎳: 素材殼子工件投入連續電鍍綫; 步驟§22、鍍普鎳: 鍍鎳組液中: 鎳離子:70~120g/L; 氯化鎳:5~15g/L; 硼酸:35~55g/L; 製程條件:溫度50~65℃,PH值3.8~4.4,時間5~10s,電壓2~12V; 膜厚控制:0.1~10μm; 步驟§221、水洗:水洗噴嘴以30~60度,沖洗產品,水質清潔; 步驟§23、鍍黑鎳: 鍍黑鎳組液中: 焦磷酸亞錫:60~160g/L; 焦磷酸鉀:180~340g/L; 氯化鎳:8~15g/L; 硫酸鎳:130~220g/L; 黑鎳劑:10~50ml/L; 製程條件:溫度30~55℃,PH值4~5.5,時間5~20s,電壓1~8V,電流密度1~5 A/m2,陽極:碳板; 鎳膜厚控制:0.025~10μm; 步驟§30.收料: 步驟§31、水洗:水洗噴嘴以傾斜30~60角度,沖洗產品,水質清潔; 步驟§32、烘乾:溫度100~130℃,時間10~20s; 步驟§33、檢驗包裝:目視比對色樣,無明顯差異,檢驗裝載。 A kind of black nickel surface treatment process of USB inner shell, its method is as follows: Step §10. Degreasing treatment: Step §11, feeding: the shell workpiece is put in, and the shell workpiece is prepared for production; Step 12. Cleaning: Degreasing and decontaminating the shell workpiece; Step §121, degreasing: adding degreasing powder to the degreasing tank, and the degreasing powder is degreasing under the condition of cathode current; Process conditions: degreasing powder concentration 50~120g/L, temperature 50~65℃, degreasing time 5~10s, voltage 2~12V, cathode current density 5~10ASD; Remove oil in the oil removal tank to completely remove the stamping oil residue on the stamping surface of the shell workpiece; Step §13, water washing: the water washing nozzle is tilted at an angle of 30~60, and the shell workpiece product is rinsed, and the water quality is clean; the degreasing solution remaining on the stamping surface of the shell workpiece is cleaned; Step §20. Electroplated Nickel: The material shell workpiece is put into the continuous electroplating line; Step §22, common nickel plating: In nickel plating solution: Nickel ion: 70~120g/L; Nickel chloride: 5~15g/L; Boric acid: 35~55g/L; Process conditions: temperature 50~65℃, pH value 3.8~4.4, time 5~10s, voltage 2~12V; Film thickness control: 0.1~10μm; Step §221, water washing: wash the nozzle at 30-60 degrees, rinse the product, and the water quality is clean; Step §23, black nickel plating: In the black nickel plating solution: Stannous pyrophosphate: 60~160g/L; Potassium pyrophosphate: 180~340g/L; Nickel chloride: 8~15g/L; Nickel sulfate: 130~220g/L; Black nickel agent: 10~50ml/L; Process conditions: temperature 30~55℃, pH value 4~5.5, time 5~20s, voltage 1~8V, current density 1~5 A/m2, anode: carbon plate; Nickel film thickness control: 0.025~10μm; Step §30. Receipt: Step §31, water washing: the water washing nozzle is tilted at an angle of 30-60 degrees to rinse the product, and the water quality is clean; Step §32, drying: temperature 100~130℃, time 10~20s; Step §33, inspect the package: visually compare the color samples, if there is no significant difference, inspect the package. 如請求項1所述之USB內殼鍍黑鎳表面處理工藝,其中,該步驟§121除油污後,加入步驟§122酸洗拋光; 步驟§122、酸洗拋光: 電解拋光槽加入硫酸:拋光同時進行酸中和;去除衝壓毛刺並獲得平整的基材表面,降低鍍層的孔隙率; 製程條件:硫酸30~40ml/L,溫度為常溫,陽極電流密度5~50ASD,陽極電極3~7V,陰極採用316L不鏽鋼板或銅板,時間5~10s。 The black nickel-plated surface treatment process of the USB inner shell as described in claim 1, wherein, after the step §121 degreasing, add the step §122 pickling and polishing; Step §122, pickling and polishing: Sulfuric acid is added to the electropolishing tank: acid neutralization is carried out at the same time as polishing; stamping burrs are removed to obtain a flat substrate surface and reduce the porosity of the coating; Process conditions: sulfuric acid 30~40ml/L, temperature at room temperature, anode current density 5~50ASD, anode electrode 3~7V, cathode 316L stainless steel plate or copper plate, time 5~10s. 如請求項1所述之USB內殼鍍黑鎳表面處理工藝,其中,該步驟§22鍍普鎳前,加入步驟§21預鍍鎳; 步驟§21、預鍍鎳: 預鍍鎳組液中: 硫酸鎳:150~220g/L; 氯化鎳:5~15g/L; 硼酸:35~55g/L; 製程條件:溫度50~65℃,PH值3.8~4.4,時間5~10s,電壓2~12V; 膜厚控制:0.025~1μm。 The black nickel plating surface treatment process of the USB inner shell as described in claim 1, wherein, before the step §22 nickel plating, step §21 pre-nickel plating is added; Step §21, pre-nickel plating: In the pre-plating nickel solution: Nickel sulfate: 150~220g/L; Nickel chloride: 5~15g/L; Boric acid: 35~55g/L; Process conditions: temperature 50~65℃, pH value 3.8~4.4, time 5~10s, voltage 2~12V; Film thickness control: 0.025~1μm. 如請求項3所述之USB內殼鍍黑鎳表面處理工藝,其中,該步驟§21預鍍鎳後,加入步驟§211水洗; 步驟§211、水洗:水洗噴嘴以30~60度,沖洗產品,水質清潔。 The surface treatment process of black nickel plating on the USB inner shell as described in claim 3, wherein, after the step §21 pre-nickel plating, step §211 water washing is added; Step §211, water washing: wash the nozzle with water at 30-60 degrees to rinse the product, and the water quality is clean. 一種連接器,其包括請求項1至4中任一項所述的USB內殼鍍黑鎳表面處理工藝所製作的一殼體;該殼體內插設有的一舌板,該舌板遠離該殼體的一端設有一基座,該基座與該舌板中設有鑲埋成型的一端子組; 該殼體包括一基材,該基材為不鏽鋼,該殼體的該基材表面外具有堆疊結構的一複合鍍層,該基材表面的該複合鍍層依次向外、按鍍覆先後為一預鍍鎳層、一普鎳層、一黑鎳層; 該預鍍鎳層為鎳鍍層,厚度:0.025~1μm; 該普鎳層為普Ni鍍層,厚度:0.1~10μm; 該黑鎳層為黑Ni鍍層,厚度: 0.025~10μm。 A connector, which includes a shell made of the USB inner shell black nickel-plated surface treatment process described in any one of claims 1 to 4; a tongue plate is inserted in the shell, and the tongue plate is far away from the One end of the housing is provided with a base, and a terminal group is embedded and molded in the base and the tongue plate; The casing includes a base material, the base material is stainless steel, and a composite coating with a stacked structure is formed on the surface of the base material of the housing. Nickel plating layer, a common nickel layer, and a black nickel layer; The pre-plating nickel layer is nickel plating, thickness: 0.025~1μm; The ordinary nickel layer is an ordinary Ni plating layer, thickness: 0.1~10μm; The black nickel layer is a black Ni plating layer with a thickness of 0.025-10 μm. 如請求項5所述之連接器,其中,該端子組的插接端設置在該舌板上;該端子組的自由端延伸至該基座之外; 該預鍍鎳層厚度:0.03~0.2μm; 該普鎳層厚度2~3μm; 該黑鎳層厚度:0.05~0.85μm。 The connector as claimed in item 5, wherein the plug-in end of the terminal group is arranged on the tongue plate; the free end of the terminal group extends out of the base; The thickness of the pre-plating nickel layer: 0.03~0.2μm; The common nickel layer thickness is 2~3μm; The thickness of the black nickel layer: 0.05~0.85μm.
TW112109003A 2023-01-06 2023-03-10 Method for plating black nickel surface treatment of usb inner housing and a connector having the same TW202328501A (en)

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