TW202325552A - Tape attaching device - Google Patents

Abstract

A tape attaching device includes a tape, a first film, and a tape pick-and-place mechanism. The tape includes a first surface and a second surface opposite to the first surface. The first film includes a third surface and, a fourth surface opposite to the third surface, and a side surface connecting the third surface and the fourth surface. The fixed object us attached to the third surface of the first film. The tape pick-and-place mechanism is configured to pick up the tape and fixes the first surface of the tape. The tape pick-and-place mechanism is further configured to attach the second surface of the tape onto the third surface of the film. The second surface of the tape extends outward from the side surface of the film to expose a portion of the second surface.

Description

SMD attaching device

The present invention relates to a patch attaching device, in particular to a device for automatically attaching a patch to a first adhesive film attached to a fixture, and the patch is used to assist a tearing mechanism to automatically The fixing object removes the first adhesive film.

The wafer (Wafer) is cut to form multiple dies. Since the distance between the cut dies is extremely small, when the dies are in the process of being transported or picked up, if there is a collision, the dies will be damaged. The sides will be broken.

In order to solve the possible collision problem of the diced bare wafers, a wafer expansion process is performed after a wafer dicing process. Before the wafer is diced, the bottom surface of the wafer is pre-attached with a stretchable expansion film, and after the wafer is cut and separated from the bare die, the expansion film is evenly stretched through the expansion device, which can At the same time, the distance between the dies is evenly stretched.

When the distance between the dies is stretched by the spreader film, the opposite side of the die to which the spreader film is attached is then attached with an unstretched transfer film to fix the distance between the dies. After the die is attached with the transfer film, the expansion film must be removed.

Since the outer contour of the diced bare die is approximately circular, the side of the expansion film will also be cut into a circular shape. The contact area between the circular spreader film and the attached die on the side of the spreader film will increase as the size of the wafer increases, and the increase in the contact area means that the spreader The increased difficulty of film removal makes the side portions of the expander film less likely to be torn off by any automated equipment.

During the adhesive tearing process of the existing adhesive tearing mechanism, it is often necessary to manually tear the side part of the expansion film away from the bare die by a certain area, so that the adhesive tearing mechanism can continue the adhesive tearing process. In the production line, since the continuous glue tearing process needs to be alternately continued between manual and glue tearing mechanisms, the glue tearing process in the prior art is not conducive to automated manufacturing or cannot effectively improve production efficiency.

In order to solve the problems faced by a glue tearing mechanism after a wafer expansion process in the prior art during a glue tearing process, the present invention provides a chip attaching device. The patch sticking device includes a patch, a first adhesive film, a fixture, and a patch pick-and-place mechanism. The patch includes a first surface and a second surface opposite to the first surface. The first adhesive film includes a third surface, a fourth surface opposite to the third surface, and a side connecting the third surface and the fourth surface. The fixing object is attached to the third surface of the first adhesive film. The patch pick-and-place mechanism is used to pick up the patch and fix the first surface of the patch. The patch pick-and-place mechanism is also used to attach the second surface of the patch to the third surface of the first adhesive film. The second surface of the patch extends outward from the side of the first adhesive film to expose a part of the second surface of the patch. When tearing off the first adhesive film with a glue tearing mechanism, the glue tearing mechanism is connected to the fourth surface of the first glue film and the second surface of the patch, and the glue tearing mechanism tears through the patch. lifting the first adhesive film so that the first adhesive film is separated from the fixed object.

In one embodiment, the second surface of the sticker includes a first area and a second area, the first area protrudes from the side of the first adhesive film, the second area is attached to the first on the third surface of an adhesive film.

In one embodiment, the patch pick-and-place mechanism includes a suction head for picking up the patch or releasing the patch on the first adhesive film.

In one embodiment, the patch attaching device of the present invention further includes a patch supply mechanism. The patch supply mechanism is used to supply the patch to the patch pick-and-place mechanism to pick up.

In one embodiment, the patch pick-and-place mechanism further includes a first moving component. The first moving component is connected with the suction head. The suction head of the patch pick-and-place mechanism goes back and forth between the patch supply mechanism and the third surface of the first adhesive film via the first moving component.

In one embodiment, the patch pick-and-place mechanism further includes a second moving component. The first moving component is connected to the suction head via the second moving component. The suction head of the patch pick-and-place mechanism goes back and forth between the patch supply mechanism and the third surface of the first adhesive film via the first moving component and the second moving component.

In one embodiment, the second moving component moves along a first axis via the first moving component, and the suction head moves along a second axis via the second moving component. The first axis is perpendicular to the second axis. The second axis is perpendicular to the first adhesive film.

In one embodiment, the first moving assembly and the second moving assembly include a slide rail and slider set or a telescopic cylinder.

In one embodiment, the patch supply mechanism includes a patch accommodating space and a patch cutting element. The sticker accommodating space is used for accommodating a sticker coil. The patch cutting element is used for cutting the patch roll material into the patch.

In one embodiment, the patch supply mechanism includes a patch accommodating space. The patch accommodating space is used for accommodating a plurality of stacked patches.

Utilizing the chip attaching device of the present invention can solve the problems faced in the glue tearing process after the wafer expansion process. The patch attaching device can automatically attach the patch on the third surface of the first adhesive film attached to the fixture and partially protrude from the side of the first adhesive film, so that the patch The sheet can assist the adhesive tearing mechanism to automatically tear off the first adhesive film from the fixed object, so as to achieve automatic manufacturing and improve production efficiency.

In order to make the above and other objects, features, and advantages of the present invention more comprehensible, preferred embodiments of the present invention will be exemplified below in detail together with the attached drawings.

Please refer to FIG. 1 , which is a perspective view of the patch attaching device of the present invention. The patch attaching device includes a patch pick-and-place mechanism 300 . The patch pick-and-place mechanism 300 is used to stick a patch 100 on a first adhesive film 400 .

As shown in FIG. 1 , in an embodiment, the patch pick-and-place mechanism 200 includes a suction head 310 . The suction head 310 is used to pick up the patch 100 or release the patch 100 on the first adhesive film 400 . The suction head 310 is connected to a vacuum system. When the suction head 310 touches the patch 100 , the vacuum system is activated so that the suction head 310 picks up the patch 100 . When the suction head 310 sticks the patch 100 on the first adhesive film 400 , the vacuum system stops, so that the suction head 310 releases the patch 100 .

Please refer to Figure 2 and Figure 3 . FIG. 2 is a top view of the patch 100 attached to the first adhesive film 400 . FIG. 3 is a cross-sectional view of a partial area A of FIG. 2 along the section line A-A. The patch 100 includes a first surface 110 and a second surface 120 opposite to the first surface 110 . The first adhesive film 400 includes a third surface 410 , a fourth surface 420 opposite to the third surface 410 , and a side edge 430 connecting the third surface 410 and the fourth surface 420 .

In this embodiment, the patch 100 fixes the first surface 110 of the patch 100 via the suction head 310 of the patch pick-and-place mechanism 300, and attaches the second surface 120 of the patch 100 to On the third surface 410 of the first adhesive film 400 . The second surface 120 of the patch 100 extends outward from the side 430 of the first adhesive film 400 to expose a part of the second surface 120 of the patch 100 .

As shown in FIG. 2 and FIG. 3 , the second surface 120 of the patch 100 includes a first area 130 and a second area 140 . The first region 130 protrudes from the side 430 of the first adhesive film 400 . The second region 140 is attached on the third surface 410 of the first adhesive film 400 . The first area 130 is the area where the second surface 120 of the patch 100 described in the above embodiment extends outward from the side 430 of the first adhesive film 400 and is exposed.

In this embodiment, the third surface 410 of the first adhesive film 400 is attached with a fixing object 500 , and the fourth surface 420 of the first adhesive film 400 is adsorbed on a vacuum platform 600 and kept fixed. After a wafer expansion process, the first adhesive film 400 used in the wafer expansion process must be removed to facilitate subsequent processes. Therefore, the first adhesive film 400 and the fixture 500 after the wafer expansion process are placed on the vacuum platform 600 to wait for a peeling process to remove the first adhesive film 400 . The fixture 500 mentioned above includes a wafer or a plurality of dies obtained by dicing the wafer.

As shown in FIG. 1 , in an embodiment, the patch attaching device further includes a patch supply mechanism 200 . The patch supply mechanism 200 is used to supply the patch 100 to the patch pick-and-place mechanism 300 to pick up. The patch supply mechanism 200 includes a patch accommodating space 210 and a patch cutting element 220 .

In one embodiment, the patch accommodating space 210 is used for accommodating a patch roll 150 . The patch cutting element 220 is used for cutting the patch roll material 150 into the patch 100 . In another embodiment, the patch accommodating space 210 is used for accommodating a plurality of the patches 100 stacked. The patch accommodating space 210 of the patch supply mechanism 200 can be changed according to the configuration of the patch 100 accommodated, and its structure is not limited to the above content.

In one embodiment, a base material of the patch 100 includes polyethylene (polyethylene, PE), polyvinyl chloride (polyvinyl chloride, PVC), polypropylene (polypropylene, PP), polyethylene terephthalate ( polyethylene terephthalate, PET), or polyimide (polyimide, PI). Moreover, the second surface 120 of the patch 100 includes an adhesive material, and the adhesive material includes acrylic acid glue and sec-butyl acetate.

As shown in FIG. 1 , in an embodiment, the patch pick-and-place mechanism 200 further includes a first moving component 320 . The first moving component 320 is connected to the suction head 310 . The suction head 310 of the patch pick-and-place mechanism 300 travels between the patch supply mechanism 200 and the third surface 410 of the first adhesive film 400 via the first moving assembly 320 .

It should be noted that the technical features of the connection of the first moving component 320 to the suction head 310 should include that the first moving component 320 is directly connected to the suction head 310, and the first moving component 320 is indirectly connected to the suction head 310 through other components. . Therefore, the first moving assembly 320 is connected with the suction head 310 in any form to realize that the suction head 310 of the patch pick-and-place mechanism 300 goes back and forth between the patch supply mechanism 200 and the third surface 410 of the first adhesive film 400 The technical effects between all do not depart from the scope of protection of the present invention.

In this embodiment, the patch pick-and-place mechanism 200 further includes a second moving component 330 . The first moving assembly 320 is connected to the suction head 310 via the second moving assembly 330 . The suction head 310 of the patch pick-and-place mechanism 300 travels between the patch supply mechanism 200 and the third surface 410 of the first adhesive film 400 via the first moving component 320 and the second moving component 330 .

It should be noted that the technical feature that the first moving component 320 is connected to the suction head 310 via the second moving component 330 should include the direct connection between the first moving component 320 , the second moving component 330 , and the suction head 310 . connection or indirect connection. Therefore, the first moving assembly 320, the second moving assembly 330, and the suction head 310 are connected in any form to achieve the suction head 310 of the patch pick-and-place mechanism 300 going back and forth between the patch supply mechanism 200 and the suction head 310. The technical effect between the third surface 410 of the first adhesive film 400 does not depart from the protection scope of the present invention.

As shown in FIG. 1 , in one embodiment, the second moving assembly 330 can move along a first axis X via the first moving assembly 320 , and the suction head 310 can move along the first axis X via the second moving assembly 330 A second axis of Y movement. The first axis X is perpendicular to the second axis Y. The second axis Y is perpendicular to the first adhesive film 400 .

Please refer to FIG. 4 , which is a perspective view of the patch attaching device of the present invention in a first state. In this embodiment, when the patch attaching device is in the first state, the first moving assembly 320 and the second moving assembly 330 connected thereto are directed toward the patch supply mechanism along the first axis X. 200 moves, and the second moving assembly 330 and the suction head 310 connected thereto move toward the patch supply mechanism 200 along the second axis Y. In the first state, the suction head 310 of the patch pick-and-place mechanism 300 moves, aligns, and picks up the patch 100 supplied by the patch supply mechanism 200 .

In this embodiment, while the patch attaching device is in the first state, the vacuum platform 600 carries the first adhesive film 400 and the fixture 500 toward the patch attaching device along a third axis Z. Move and stop at a predetermined position in front of the patch sticking device.

Please refer to FIG. 5 , which is a perspective view of the patch attaching device of the present invention in a second state. In this embodiment, when the patch attaching device is in the second state, the first moving assembly 320 and the second moving assembly 330 connected thereto face toward the vacuum platform 600 along the first axis X. The predetermined position moves, and the second moving assembly 330 and the suction head 310 connected thereto move toward the first adhesive film 400 on the vacuum platform 600 along the second axis Y. In the second state, the suction head 310 of the patch pick-and-place mechanism 300 moves, aligns, and attaches the patch 100 adsorbed by the suction head 310 to the third surface of the first adhesive film 400 . surface 410 .

In this embodiment, the vacuum platform 600 carrying the first adhesive film 400 and the fixture 500 stops at the predetermined position in front of the patch attachment device, so that the first adhesive film 400 accepts patch attachment The device attaches the patch 100 . The vacuum platform 600 moves to the predetermined position to meet the condition that the side 430 of the first adhesive film 400 intersects with the suction head 310 of the patch pick-and-place mechanism 300, so that the vacuum platform 600 can cooperate with the patch attachment The device precisely sticks the patch 100 on the third surface 410 of the first adhesive film 400 and makes the patch 100 partially protrude from the side 430 of the first adhesive film 400 .

In order to achieve the movement of the first moving assembly 320 along the first axis X and the movement of the second moving assembly 330 along the second axis Y, in one embodiment, the first The moving assembly 320 and the second moving assembly 330 include a sliding rail and a slider set or a telescopic cylinder. In other words, the first moving assembly 320 or the second moving assembly 330 uses the slide rail and slider to move on the first axis X or the second axis Y, or the first moving assembly 320 or the second moving component 330 uses the telescopic cylinder to move on the first axis X or the second axis Y.

It should be noted that the patch attaching device shown in FIG. 1 , FIG. 4 , and FIG. 5 is only used to illustrate the connection relationship between the various elements of the present invention. In FIG. 1 , FIG. 4 , and FIG. 5 , the first moving component 320 is the slide rail and slider assembly, and the second moving component 330 is the telescopic cylinder. However, the first moving assembly 320 and the second moving assembly 330 of the patch pick-and-place mechanism 300 can also be two sets of slide rails and sliders, or two telescopic cylinders at the same time. The structure of the patch attaching device of the present invention can change the configuration of components according to actual use requirements, and the structures of the first moving component 320 and the second moving component 330 of the patch pick-and-place mechanism 300 are not based on the above-mentioned content. limit.

After the wafer expansion process described in the foregoing embodiments, the first adhesive film 400 used in the wafer expansion process must be removed to facilitate the adhesive tearing process. Please refer to FIG. 6 and FIG. 7 . FIG. 6 is a top view of the first adhesive film 400 attached with the patch 100 during the adhesive tearing process. FIG. 7 is a cross-sectional view of a partial area B of FIG. 6 along the section line B-B. In order to tear off the first adhesive film 400 from the fixing object 500 , after the patch 100 is attached to the first adhesive film 400 , the fixing object 500 will be attached to a surface of the first adhesive film 400 A second adhesive film 700 is attached on the vacuum platform 600 with a side of the second adhesive film 700 opposite to the fixture 500 . In other words, before performing the adhesive tearing process, the first adhesive film 400 attached with the patch 100 and the fixing object 500 will be attached to the fixing object 500 opposite to the first adhesive film 400 The surface 700 is turned upside down, and fixed on the vacuum platform 600 with the second adhesive film 700 instead.

As shown in FIG. 7 , in the glue tearing process, a glue tearing mechanism 800 is connected to the fourth surface 420 of the first adhesive film 400 and the second surface 120 of the patch 100 , and passes through the patch 100 Auxiliary to tear off the first adhesive film 400 on the fixture 500 . The second surface 120 of the patch 100 is used to provide the glue tearing mechanism 800 connection, the glue tearing mechanism 800 can apply a traction force to the patch 100, and use the traction force to pull up the patch 100 and the first glue. film 400 , so that the first adhesive film 400 is separated from the fixture 500 .

As shown in the cross-sectional views of FIG. 3 and FIG. 7 , there is a first point P1 between the patch 100 and the third surface 410 of the first adhesive film 400 . Since FIG. 3 and FIG. 7 are only cross-sectional views as structural illustrations, in actual conditions, there are infinitely many first points P1 between the patch 100 and the third surface 410 of the first adhesive film 400. into a first line segment. Similarly, as shown in the cross-sectional view of FIG. 3 , there is a second point P2 between the first adhesive film 400 and one side 510 of the fixture 500 . Since FIG. 3 is only a cross-sectional view as a structural illustration, in actual conditions, between the first adhesive film 400 and the side 510 of the fixture 500 is a first connected by an infinite number of second points P2. Second line segment.

As shown in FIG. 7 , when the glue tearing process is in progress, since the medium on the second surface 120 of the patch 100 on both sides of the first line segment at the first point P1 extends outwards evenly, The tensile stress of the second surface 120 of the patch 100 can be dispersed without stress concentration, so the second surface 120 of the patch 100 located on the first line segment will be firmly attached to the first adhesive film 400 . In contrast, as shown in FIG. 5 , if the process of tearing glue is carried out, due to the medium of the third surface 410 of the first adhesive film 400 located on both sides of the second line segment of the second point P2 Failure to extend outward uniformly may easily cause stress concentration on the third surface 410 of the first adhesive film 400 , so the first adhesive film 400 located on the second line segment and the fixture 500 are easily separated.

In one embodiment, as shown in FIG. 2 , in order to make the medium of the second surface 120 of the patch 100 on both sides of the first line segment of the first point P1 extend outward evenly, so as to disperse The tensile stress of the second surface 120 of the patch 100 does not cause stress concentration, and the area of the second region 120 of the second surface 120 of the patch 100 accounts for about More than 30%. In other words, more than 30% of the area of the second surface 120 of the patch 100 is attached to the third surface 410 of the first adhesive film 400, so that the patch 100 can assist the tearing of the glue. The target effect of the mechanism 800 is to tear off the first adhesive film 400 from the fixture 500 .

In the conventional technology, it is often necessary to manually tear the area of the third surface 410 of the first adhesive film 400 adjacent to the side 430 away from the fixed object 500 by a certain area, so that the adhesive tearing mechanism 800 can be connected to the fixed object. Therefore, there are problems that are not conducive to automated manufacturing or cannot effectively improve production efficiency. It can be known from the description of the above embodiments with reference to FIG. 1 to FIG. 7 that the problem faced in the adhesive tearing process after the wafer expansion process can be solved by using the chip attachment device of the present invention. The patch supply mechanism 200 of the patch attaching device can automatically and continuously supply the patch 100 . The patch pick-and-place mechanism 300 can also automatically and continuously pick up the patch 100, and at the same time attach the patch 100 to the third surface 410 of the first adhesive film 400 and partially protrude from the first adhesive film. The side 430 of the membrane 400 . Therefore, when the patch 100 is connected with the glue tearing mechanism 800 to carry out the glue tearing process, the patch 100 attached to the third surface 410 of the first adhesive film 400 can be used as a guide to tear the glue The mechanism 800 tears the first adhesive film 400 with the aid of the patch, so that the first adhesive film 400 is separated from the fixing object 500 . Since the patch sticking device of the present invention can automatically stick the patch 100 on the third surface 410 of the first adhesive film 400 attached to the fixture 500 and partially protrude from the first adhesive film The side 430 of the patch 400 enables the patch 100 to assist the peeling mechanism 800 to automatically tear off the first adhesive film 400 from the fixed object 500, so as to achieve automatic manufacturing and improve production efficiency.

The above are only preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the principles of the present invention, some improvements and modifications can also be made, and these improvements and modifications should also be considered as part of the present invention. Scope of rights protection.

100: patch 110: first surface 120: second surface 130: First area 140: Second area 150: SMT roll material 200: patch supply mechanism 210: Patch storage space 220: Patch cutting components 300: Patch pick-and-place mechanism 310: suction head 320: The first mobile component 330: The second mobile component 400: the first film 410: third surface 420: The fourth surface 430: the side of the first film 500: Fixtures 510: the side of the fixture 600: vacuum platform 700: Second film 800: glue tearing mechanism P1: The first point between the patch and the side of the film P2: The second point between the adhesive film and the side of the fixture A: local area A B: local area B A-A: A-A hatching B-B: B-B section line X: the first axis Y: second axis Z: the third axis

Fig. 1 is a perspective view of the patch attaching device of the present invention. Fig. 2 is a top view of a patch attached to a first adhesive film. FIG. 3 is a cross-sectional view of a partial area A of FIG. 2 along the section line A-A. Fig. 4 is a perspective view of the patch attaching device of the present invention in a first state. Fig. 5 is a perspective view of the patch attaching device of the present invention in a second state. FIG. 6 is a top view of the first adhesive film attached with the patch in a glue tearing process. FIG. 7 is a cross-sectional view of a partial area B of FIG. 6 along the section line B-B.

100: patch

150: SMT roll material

200: patch supply mechanism

210: Patch storage space

220: Patch cutting components

300: Patch pick-and-place mechanism

310: suction head

320: The first mobile component

330: The second mobile component

400: the first film

430: the side of the first film

500: Fixtures

600: vacuum platform

X: the first axis

Y: second axis

Z: the third axis

Claims (10)

A patch attachment device, comprising: A patch comprising a first surface and a second surface opposite the first surface; A first adhesive film, including a third surface, a fourth surface opposite to the third surface, and a side edge connecting the third surface and the fourth surface; a fixture attached to the third surface of the first adhesive film; and a patch pick-and-place mechanism for picking up the patch and fixing the first surface of the patch; the patch pick-and-place mechanism is also used for attaching the second surface of the patch to the first glue On the third surface of the film, the second surface of the patch extends outward from the side of the first adhesive film to expose a part of the second surface of the patch; Wherein, when the first adhesive film is torn off by a glue tearing mechanism, the glue tearing mechanism is connected to the fourth surface of the first glue film and the second surface of the sticker, and the glue tearing mechanism passes through the sticker The sheet tears the first adhesive film, so that the first adhesive film is separated from the fixing object. The patch attachment device according to claim 1, wherein the second surface of the patch includes a first area and a second area, the first area protrudes from the side of the first adhesive film, and the first area protrudes from the side of the first adhesive film. Two regions are attached on the third surface of the first adhesive film. The patch sticking device according to claim 1, wherein the patch pick-and-place mechanism includes a suction head for picking up the patch or releasing the patch on the first adhesive film. The patch sticking device according to claim 3 further includes a patch supply mechanism for supplying the patch to the patch pick-and-place mechanism for picking up. The patch attachment device according to claim 4, wherein the patch pick-and-place mechanism further includes a first moving component connected to the suction head, and the suction head of the patch pick-and-place mechanism passes through the first A moving component goes back and forth between the patch supply mechanism and the third surface of the first adhesive film. The patch attaching device according to claim 5, wherein the patch pick-and-place mechanism further includes a second moving component, the first moving component is connected to the suction head through the second moving component, and the patch pick-and-place mechanism The suction head goes back and forth between the patch feeding mechanism and the third surface of the first adhesive film via the first moving component and the second moving component. The patch attaching device according to claim 6, wherein the second moving component moves along a first axis through the first moving component, the suction head moves along a second axis through the second moving component, the The first axis is perpendicular to the second axis, and the second axis is perpendicular to the first adhesive film. The patch attaching device according to claim 6, wherein the first moving component and the second moving component include a slide rail and slider set or a telescopic cylinder. The patch attaching device according to claim 1, wherein the patch supply mechanism includes a patch accommodating space and a patch cutting element, the patch accommodating space is used to accommodate a patch coil, the The patch cutting element is used for cutting the patch roll material into the patch. The patch attaching device according to claim 1, wherein the patch supply mechanism includes a patch accommodating space, and the patch accommodating space is used for accommodating a plurality of the patches stacked.