TW202323186A - 碳基導電墨水 - Google Patents
碳基導電墨水 Download PDFInfo
- Publication number
- TW202323186A TW202323186A TW111132521A TW111132521A TW202323186A TW 202323186 A TW202323186 A TW 202323186A TW 111132521 A TW111132521 A TW 111132521A TW 111132521 A TW111132521 A TW 111132521A TW 202323186 A TW202323186 A TW 202323186A
- Authority
- TW
- Taiwan
- Prior art keywords
- nanosheets
- liquid composition
- carbon nanotubes
- film
- graphene
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/159—Carbon nanotubes single-walled
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/194—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/324—Inkjet printing inks characterised by colouring agents containing carbon black
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/02—Single-walled nanotubes
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/20—Nanotubes characterized by their properties
- C01B2202/34—Length
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/20—Nanotubes characterized by their properties
- C01B2202/36—Diameter
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2204/00—Structure or properties of graphene
- C01B2204/04—Specific amount of layers or specific thickness
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/10—Solid density
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Computer Networks & Wireless Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Carbon And Carbon Compounds (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP21194844.3 | 2021-09-03 | ||
| EP21194844 | 2021-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202323186A true TW202323186A (zh) | 2023-06-16 |
Family
ID=77640478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111132521A TW202323186A (zh) | 2021-09-03 | 2022-08-29 | 碳基導電墨水 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20240384123A1 (https=) |
| EP (1) | EP4396296B1 (https=) |
| JP (1) | JP2024533149A (https=) |
| KR (1) | KR20240055037A (https=) |
| CN (1) | CN117897455A (https=) |
| AU (1) | AU2022338190A1 (https=) |
| CA (1) | CA3230227A1 (https=) |
| TW (1) | TW202323186A (https=) |
| WO (1) | WO2023031383A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202306892A (zh) * | 2021-03-04 | 2023-02-16 | 英商先進材料發展有限公司 | 具有低熱放射率之裝置 |
| DE202024103283U1 (de) * | 2024-06-18 | 2025-09-25 | Exentis Knowledge Gmbh | Druckpaste |
| DE202024103284U1 (de) * | 2024-06-18 | 2025-09-25 | Exentis Knowledge Gmbh | Druckpaste |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8278757B2 (en) | 2008-02-05 | 2012-10-02 | Vorbeck Materials Corporation | Printed electronics |
| EP2562766A1 (de) * | 2011-08-22 | 2013-02-27 | Bayer MaterialScience AG | Kohlenstoffnanoröhren und Graphenplättchen umfassende Dispersionen |
| CN104640808B (zh) * | 2011-11-14 | 2020-10-02 | 沃尔贝克材料有限公司 | 包含石墨烯的组合物 |
| CA2916516A1 (en) * | 2013-06-28 | 2014-12-31 | Graphene 3D Lab Inc. | Dispersions for nanoplatelets of graphene-like materials |
| GB201517737D0 (en) | 2015-10-07 | 2015-11-18 | Cambridge Entpr Ltd | Layered materials and methods for their processing |
| EP3636592A1 (en) | 2018-10-12 | 2020-04-15 | Advanced Material Development Limited | Liquid-exfoliated nanomaterials |
| TW202140695A (zh) | 2020-03-05 | 2021-11-01 | 英商先進材料發展有限公司 | 碳基導電墨水 |
| CN111876025A (zh) * | 2020-08-05 | 2020-11-03 | 深圳市展旺新材料科技有限公司 | 一种石墨烯导电油墨 |
-
2022
- 2022-08-29 TW TW111132521A patent/TW202323186A/zh unknown
- 2022-09-02 CA CA3230227A patent/CA3230227A1/en active Pending
- 2022-09-02 JP JP2024513872A patent/JP2024533149A/ja active Pending
- 2022-09-02 AU AU2022338190A patent/AU2022338190A1/en active Pending
- 2022-09-02 EP EP22773169.2A patent/EP4396296B1/en active Active
- 2022-09-02 KR KR1020247010442A patent/KR20240055037A/ko active Pending
- 2022-09-02 US US18/687,122 patent/US20240384123A1/en active Pending
- 2022-09-02 WO PCT/EP2022/074424 patent/WO2023031383A1/en not_active Ceased
- 2022-09-02 CN CN202280059364.XA patent/CN117897455A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240055037A (ko) | 2024-04-26 |
| EP4396296B1 (en) | 2026-04-22 |
| US20240384123A1 (en) | 2024-11-21 |
| CN117897455A (zh) | 2024-04-16 |
| AU2022338190A1 (en) | 2024-02-22 |
| CA3230227A1 (en) | 2023-03-09 |
| EP4396296A1 (en) | 2024-07-10 |
| WO2023031383A1 (en) | 2023-03-09 |
| JP2024533149A (ja) | 2024-09-12 |
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