TW202322974A - Machining apparatus capable of properly tightening a cutting blade - Google Patents
Machining apparatus capable of properly tightening a cutting blade Download PDFInfo
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- TW202322974A TW202322974A TW111147337A TW111147337A TW202322974A TW 202322974 A TW202322974 A TW 202322974A TW 111147337 A TW111147337 A TW 111147337A TW 111147337 A TW111147337 A TW 111147337A TW 202322974 A TW202322974 A TW 202322974A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 243
- 238000003754 machining Methods 0.000 title abstract description 5
- 238000009434 installation Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 description 22
- 238000003384 imaging method Methods 0.000 description 10
- 230000003028 elevating effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
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- 230000008676 import Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Automatic Tool Replacement In Machine Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Details Of Spanners, Wrenches, And Screw Drivers And Accessories (AREA)
Abstract
Description
本發明係關於一種加工裝置,其包含:保持手段,其保持被加工物;切割手段,其裝設有切割刀片,所述切割刀片切割被保持於保持手段之被加工物;以及切割刀片裝設手段,其將切割刀片裝設於切割手段。The present invention relates to a processing device, which includes: holding means, which holds a workpiece; cutting means, which is equipped with a cutting blade, and the cutting blade cuts the workpiece held by the holding means; means, which installs the cutting blade on the cutting means.
在正面形成有藉由分割預定線所劃分之IC、LSI等多個元件之晶圓,係藉由具備切割刀片之加工裝置而被分割成一個個元件晶片,經分割之各元件晶片被利用於行動電話、個人電腦等電子設備。A wafer with multiple components such as ICs and LSIs formed on the front side, which is divided by the dividing line, is divided into individual component wafers by a processing device equipped with a dicing blade, and the divided component wafers are used in Mobile phones, personal computers and other electronic equipment.
本案申請人已提案一種加工裝置,其具備自動更換切割刀片之切割刀片裝設手段(例如參照專利文獻1)。The applicant of this application has already proposed a processing device having a cutting blade installation means for automatically replacing the cutting blade (for example, refer to Patent Document 1).
此加工裝置的切割手段具備:旋轉軸;固定凸緣,其配設於旋轉軸的前端且支撐切割刀片的背部;輪轂部,其從固定凸緣的中央部突出且與形成於切割刀片的中央部之開口部嵌合;以及公螺紋,其形成於輪轂部的前端。The cutting means of this processing device includes: a rotating shaft; a fixed flange disposed at the front end of the rotating shaft and supporting the back of the cutting blade; The opening part of the part fits; and the male thread is formed at the front end of the hub part.
並且,切割刀片裝設手段具備螺帽保持部,可自動將切割刀片裝設於切割手段,所述螺帽保持部裝卸自如地保持螺帽,所述螺帽與固定凸緣夾持已嵌入輪轂部之切割刀片。 [習知技術文獻] [專利文獻] In addition, the cutting blade installation means is equipped with a nut holding part, which can automatically install the cutting blade on the cutting means, and the nut holding part holds the nut freely, and the nut and the fixed flange clamp the inserted wheel hub. Part of the cutting blade. [Prior art literature] [Patent Document]
[專利文獻1]日本特開2007-98536號公報[Patent Document 1] Japanese Patent Laid-Open No. 2007-98536
[發明所欲解決的課題] 但是,在螺帽未與輪轂部的公螺紋恰當地螺合、螺帽與公螺紋之間存在垃圾、螺紋磨耗之情形等中,會對螺帽施加負載,而有在將切割刀片恰當地鎖緊於固定凸緣之前螺帽保持部的轉矩(負載電流值)便到達預定的閾值而完成鎖緊作業之問題。 [Problems to be Solved by the Invention] However, if the nut is not properly screwed into the male thread of the hub, if there is debris between the nut and the male thread, if the thread is worn, etc., a load will be applied to the nut, and it is difficult to properly lock the cutting blade. The torque (load current value) of the nut holding part reaches a predetermined threshold before the fixing flange and the locking operation is completed.
[解決課題的技術手段] 本發明的課題為提供一種可恰當地鎖緊切割刀片之加工裝置。 [Technical means to solve the problem] The object of the present invention is to provide a processing device that can properly lock the cutting blade.
根據本發明,提供解決上述課題之以下的加工裝置。亦即,提供:「一種加工裝置,其包含:保持手段,其保持被加工物;切割手段,其裝設有切割刀片,所述切割刀片切割被保持於該保持手段之被加工物;以及切割刀片裝設手段,其將切割刀片裝設於該切割手段, 該切割手段具備:旋轉軸;固定凸緣,其配設於該旋轉軸的前端且支撐切割刀片的背部;輪轂部,其從該固定凸緣的中央部突出且與形成於切割刀片的中央部之開口部嵌合;以及公螺紋,其形成於該輪轂部的前端, 該切割刀片裝設手段具備螺帽保持部,所述螺帽保持部裝卸自如地保持螺帽,所述螺帽與該固定凸緣夾持已嵌入該輪轂部之切割刀片, 將使該螺帽保持部正旋轉而將該螺帽與該輪轂部的該公螺紋螺合且轉矩到達鎖緊完成的閾值之位置作為基準位置,在使該螺帽保持部逆旋轉之後使該螺帽保持部正旋轉而在該基準位置上轉矩到達閾值之情形,判斷已恰當地鎖緊切割刀片,除此之外則判斷未恰當地鎖緊切割刀片」。 According to the present invention, there is provided a processing apparatus that solves the above-mentioned problems and the following. That is, there is provided: "A processing device comprising: a holding means, which holds a workpiece; a cutting means, which is equipped with a cutting blade, and the cutting blade cuts the workpiece held by the holding means; and a cutting means. blade attachment means for attaching a cutting blade to the cutting means, The cutting means includes: a rotating shaft; a fixed flange disposed at the front end of the rotating shaft and supporting the back of the cutting blade; The opening of the fitting; and the male thread, which is formed at the front end of the hub, The cutting blade mounting means is provided with a nut holding portion which detachably holds a nut, and the nut and the fixing flange sandwich the cutting blade inserted into the hub portion, Taking the position where the nut is screwed into the male thread of the hub portion by forward rotation of the nut holder and the torque reaches the locking completion threshold as a reference position, after the nut holder is reversely rotated, the If the nut holder is rotating and the torque reaches the threshold at the reference position, it is judged that the cutting blade has been properly locked, otherwise it is judged that the cutting blade is not properly locked.
[發明功效] 本發明的加工裝置包含: 保持手段,其保持被加工物;切割手段,其裝設有切割刀片,所述切割刀片切割被保持於該保持手段之被加工物;以及切割刀片裝設手段,其將切割刀片裝設於該切割手段, 該切割手段具備:旋轉軸;固定凸緣,其配設於該旋轉軸的前端且支撐切割刀片的背部;輪轂部,其從該固定凸緣的中央部突出且與形成於切割刀片的中央部之開口部嵌合;以及公螺紋,其形成於該輪轂部的前端, 該切割刀片裝設手段具備螺帽保持部,所述螺帽保持部裝卸自如地保持螺帽,所述螺帽與該固定凸緣夾持已嵌入該輪轂部之切割刀片, 將使該螺帽保持部正旋轉而將該螺帽與該輪轂部的該公螺紋螺合且轉矩到達鎖緊完成的閾值之位置作為基準位置,在使該螺帽保持部逆旋轉之後使該螺帽保持部正旋轉而在該基準位置上轉矩到達閾值之情形,判斷已恰當地鎖緊切割刀片,除此之外則判斷未恰當地鎖緊切割刀片,因此可恰當地鎖緊切割刀片。 [Efficacy of the invention] Processing device of the present invention comprises: holding means, which holds the workpiece; cutting means, which is equipped with a cutting blade that cuts the workpiece held by the holding means; and cutting blade mounting means, which mounts the cutting blade on the means of cutting, The cutting means includes: a rotating shaft; a fixed flange disposed at the front end of the rotating shaft and supporting the back of the cutting blade; The opening of the fitting; and the male thread, which is formed at the front end of the hub, The cutting blade mounting means is provided with a nut holding portion which detachably holds a nut, and the nut and the fixing flange sandwich the cutting blade inserted into the hub portion, Taking the position where the nut is screwed into the male thread of the hub portion by forward rotation of the nut holder and the torque reaches the locking completion threshold as a reference position, after the nut holder is reversely rotated, the If the nut holding part is rotating and the torque reaches the threshold at the reference position, it is judged that the cutting blade has been properly locked, otherwise it is judged that the cutting blade is not properly locked, so the cutting blade can be properly locked. blade.
以下,針對遵循本發明所構成之加工裝置的較佳實施方式,一邊參照圖式一邊進行說明。Hereinafter, preferred embodiments of the processing apparatus configured according to the present invention will be described with reference to the drawings.
(加工裝置2)
如同圖1所示,以符號2表示整體之加工裝置包含:保持手段4,其保持被加工物;切割手段6,其裝設有切割刀片,所述切割刀片切割被保持於保持手段4之被加工物;以及切割刀片裝設手段8,其將切割刀片裝設於切割手段6。
(processing unit 2)
As shown in FIG. 1 , the overall processing device represented by
(保持手段4)
若參照圖2及圖3進行說明,則保持手段4具備:X軸可動板12,其在基台10(參照圖2)的上表面被設成在X軸方向移動自如;支柱14,其固定於X軸可動板12的上表面;以及蓋板16,其固定於支柱14的上端。在蓋板16形成圓形開口16a,將通過圓形開口16a往上方延伸之卡盤台18旋轉自如地裝設於支柱14的上端。
(keep means 4)
2 and 3, the holding means 4 includes: an X-axis
此外,X軸方向為圖1中以箭頭X所示之方向。並且,圖1中以箭頭Y所示之Y軸方向為與X軸方向正交之方向,圖1中以箭頭Z所示之Z軸方向為與X軸方向及Y軸方向正交之上下方向。X軸方向及Y軸方向所規定之XY平面為實質上水平。In addition, the X-axis direction is the direction indicated by arrow X in FIG. 1 . Moreover, the Y-axis direction shown by arrow Y in FIG. 1 is the direction perpendicular to the X-axis direction, and the Z-axis direction shown by arrow Z in FIG. 1 is the up-down direction perpendicular to the X-axis direction and the Y-axis direction. . The XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.
在卡盤台18的上端部分配置有與吸引手段(未圖示)連接之多孔的圓形的吸附卡盤20。在卡盤台18的周緣,在圓周方向隔著間隔而設有多個夾具22。A porous
而且,在保持手段4中,藉由以吸引手段在吸附卡盤20的上表面生成吸引力,而吸引保持載置於吸附卡盤20的上表面之被加工物。如此,吸附卡盤20的上表面成為保持被加工物之保持面,且保持面被定位於XY平面上。Then, in the holding means 4 , the workpiece placed on the upper surface of the
並且,保持手段4的卡盤台18係藉由內置於支柱14之卡盤台用馬達(未圖示)而以Z軸方向作為軸心進行旋轉,且藉由X軸進給手段24而在X軸方向進行加工進給。In addition, the chuck table 18 of the
X軸進給手段24具有:滾珠螺桿26,其與X軸可動板12連結且在X軸方向延伸;以及馬達28,其使滾珠螺桿26旋轉。X軸進給手段24係藉由滾珠螺桿26而將馬達28的旋轉運動轉換成直線運動並傳遞至X軸可動板12,使X軸可動板12沿著基台10上的導軌10a在X軸方向移動,且將卡盤台18在X軸方向進行加工進給。The X-axis feeding means 24 has a
如同圖2所示,加工裝置2包含跨越保持手段4而配置之門型的框架30。框架30具有:一對支柱32,其等在Y軸方向隔著間隔而從基台10的上表面往上方延伸;以及樑34,其架設於一對支柱32的上端之間且在Y軸方向延伸。As shown in FIG. 2 , the
(切割手段6)
在樑34的單側的側面(圖2中背面側的側面)於Y軸方向隔著間隔而設有一對切割手段6。在圖示的實施方式中,一對切割手段6被設成切割刀片面對,可藉由一對切割刀片而同時對被保持於保持手段4之被加工物施行切割加工。此外,切割手段6亦可為一個。
(cutting means 6)
A pair of cutting means 6 are provided on one side of the beam 34 (the side on the rear side in FIG. 2 ) at intervals in the Y-axis direction. In the illustrated embodiment, a pair of cutting means 6 is provided so that the cutting blades face each other, and the workpiece held by the
如同圖4所示,切割手段6具備:矩形狀的Y軸可動構件36,其在Y軸方向移動自如地被支撐於樑34的單側的側面;Y軸進給手段38,其將Y軸可動構件36在Y軸方向進行分度進給;剖面L字狀的Z軸可動構件40,其在Z軸方向升降自如地被支撐於Y軸可動構件36;Z軸進給手段42,其將Z軸可動構件40在Z軸方向進行切入進給;以及外殼44,其固定於Z軸可動構件40的下端。As shown in FIG. 4 , the
在Y軸可動構件36的單側的側面(圖4中前側的側面)形成有在Z軸方向隔著間隔並在Y軸方向延伸之一對被引導槽36a,被引導槽36a係滑動自如地與一對導軌(未圖示)連結,所述一對導軌係在樑34的單側的側面於Z軸方向隔著間隔並在Y軸方向延伸。On one side of the Y-axis movable member 36 (the front side in FIG. 4 ), a pair of guided
Y軸進給手段38具有:滾珠螺桿46,其與Y軸可動構件36連結且在Y軸方向延伸;以及馬達48,其使滾珠螺桿46旋轉。Y軸進給手段38係藉由滾珠螺桿46而將馬達48的旋轉運動轉換成直線運動並傳遞至Y軸可動構件36,將Y軸可動構件36沿著附設於樑34的單側的側面之導軌而在Y軸方向進行分度進給。The Y-axis feeding means 38 has a
在Y軸可動構件36的另一側的側面(圖4中背面側的側面)形成有在Y軸方向隔著間隔並在Z軸方向延伸之一對導軌(未圖示),Z軸可動構件40具有滑動自如地與Y軸可動構件36的一對導軌連結之一對被引導槽(未圖示)。A pair of guide rails (not shown) extending in the Z-axis direction at intervals in the Y-axis direction is formed on the other side of the Y-axis movable member 36 (the side on the back side in FIG. 4 ). 40 has a pair of guided grooves (not shown) that are slidably connected to a pair of guide rails of the Y-axis
Z軸進給手段42具有:滾珠螺桿(未圖示),其與Z軸可動構件40連結且在Z軸方向延伸;以及馬達50,其使此滾珠螺桿旋轉。Z軸進給手段42係藉由滾珠螺桿而將馬達50的旋轉運動轉換成直線運動並傳遞至Z軸可動構件40,將Z軸可動構件40沿著Y軸可動構件36的導軌而在Z軸方向進行切入進給。The Z-axis feeding means 42 has a ball screw (not shown) that is connected to the Z-axis
若參照圖5及圖6進行說明,則切割手段6進一步具備:旋轉軸52;固定凸緣56,其配設於旋轉軸52的前端且支撐切割刀片54的背部(參照圖6);輪轂部58,其從固定凸緣56的中央部突出且與形成於切割刀片54的中央部之開口部54a嵌合(參照圖6);以及公螺紋58a,其形成於輪轂部58的前端(參照圖6)。If described with reference to Fig. 5 and Fig. 6, then cutting means 6 further comprises: rotating
(旋轉軸52)
旋轉軸52係以Y軸方向作為軸心而旋轉自如地被支撐於外殼44。並且,在外殼44容納有使旋轉軸52旋轉之馬達(未圖示)。
(rotation axis 52)
The
(切割刀片54)
如同圖6所示,切割刀片54具有:環狀的基台60;以及環狀的切削刀刃62,其固定於基台60的外周部。基台60能由鋁合金等適當的金屬材料所形成。切割刀片54的開口部54a為圓形,且位於基台60的中央部。切削刀刃62係由金剛石等磨粒與金屬或樹脂等結合材而形成為預定的厚度(例如10~30μm左右),且從基台60的外周緣往徑向外側突出。
(cutting blade 54)
As shown in FIG. 6 , the
(固定凸緣56)
固定凸緣56係從旋轉軸52的外周面往徑向外側突出成環狀。在固定凸緣56的前端面的徑向內側部分形成有環狀的凹處56a。固定凸緣56的前端面的外周側部分成為在軸向突出之環狀的支承部56b。
(fixing flange 56)
The
若參照圖6繼續說明,則藉由將切割刀片54的開口部54a嵌入輪轂部58,且將螺帽64裝設於輪轂部58的公螺紋58a,而將切割刀片54夾在固定凸緣56的支承部56b與螺帽64之間並裝卸自如地固定於輪轂部58。此外,在螺帽64的側面,在圓周方向隔著等間隔形成有多個銷孔64a,所述銷孔64a被後述之螺帽保持部116的銷138插入。If the description continues with reference to FIG. 6 , by inserting the opening 54a of the
如同圖5所示,在外殼44的前端裝設有覆蓋切割刀片54之刀片蓋66。刀片蓋66具有:第一蓋構件66a,其固定於外殼44的前端;以及第二蓋構件66b,其移動自如地裝設於第一蓋構件66a的前端。第二蓋構件66b係藉由氣缸等適當的致動器(未圖示)而在X軸方向移動,且在更換切割刀片54時被定位於圖5所示之開放位置,在切割加工時被定位於圖4所示之閉塞位置。As shown in FIG. 5 , a
並且,如同圖2所示,在樑34的另一側的側面(圖2中前側的側面)於Y軸方向移動自如地設有拍攝被保持於保持手段4之被加工物之一對攝像手段68,且裝設有使攝像手段68在Y軸方向移動之一對移動手段70。And, as shown in FIG. 2 , a pair of imaging means for photographing the workpiece held by the holding means 4 is provided on the other side of the beam 34 (the front side in FIG. 2 ) to move freely in the Y-axis direction. 68, and a pair of moving
移動手段70具有:滾珠螺桿72,其與攝像手段68連結且在Y軸方向延伸;以及馬達74,其使滾珠螺桿72旋轉。移動手段70將馬達74的旋轉運動轉換成直線運動並傳遞至攝像手段68,使攝像手段68沿著附設於樑34的另一側的側面之導軌34a在Y軸方向移動。此外,攝像手段68亦可為一個。The moving means 70 has a
(切割刀片裝設手段8)
如同圖7所示,切割刀片裝設手段8具備:切割刀片保管手段76,其保管多個切割刀片54;搬出搬入手段78,其從切割刀片保管手段76將切割刀片54搬出及搬入;Y軸方向定位手段80,其將搬出搬入手段78相對於切割刀片保管手段76而定位於Y軸方向的作用位置與撤離位置;Z軸移動手段82,其將搬出搬入手段78在Z軸方向進行移動;以及X軸移動手段84,其將搬出搬入手段78在X軸方向進行移動,並作用於被裝設於切割手段6的旋轉軸52之切割刀片54。
(cutting blade mounting means 8)
As shown in FIG. 7, the cutting blade installation means 8 has: a cutting blade storage means 76 for storing a plurality of cutting
(切割刀片保管手段76)
若參照圖8進行說明,則切割刀片保管手段76包含:驅動齒輪88,其具有在Y軸方向延伸之旋轉軸86;從動齒輪92,其在Z軸方向與驅動齒輪88分離且具有在Y軸方向延伸之旋轉軸90;履帶94,其捲繞於驅動齒輪88與從動齒輪92;以及在Y軸方向延伸之支撐軸96,其以預定的間隔配設於履帶94,且與切割刀片54的開口部54a嵌合而支撐切割刀片54。
(cutting blade storage means 76)
8, the cutting blade storage means 76 includes: a driving
如同圖7及圖8所示,圖示的實施方式的切割刀片保管手段76包含:基座板98(參照圖7);支撐壁100,其從基座板98的上表面往上方延伸;以及馬達102,其固定於支撐壁100的單面。如同圖8所示,在馬達102連結有驅動齒輪88的旋轉軸86,馬達102使驅動齒輪88以Y軸方向作為軸心進行旋轉。As shown in FIGS. 7 and 8 , the cutting blade storage means 76 of the illustrated embodiment includes: a base plate 98 (see FIG. 7 ); a
從動齒輪92配置於驅動齒輪88的上方,從動齒輪92的旋轉軸90係以Y軸方向作為軸心旋轉自如,且在Z軸方向升降自如地被支撐於支撐壁100。在支撐壁100設有使從動齒輪92在Z軸方向升降之升降手段(未圖示)。升降手段可為具有下述構件之構成:滾珠螺桿,其與從動齒輪92的旋轉軸90連結且在Z軸方向延伸;以及馬達,其使此滾珠螺桿旋轉。The driven
履帶94係由相互連結之多個鏈接片(省略符號)所構成,且捲繞於驅動齒輪88與從動齒輪92。履帶94係因應驅動齒輪88藉由馬達102進行旋轉而旋轉。The
支撐軸96係隔著預定的間隔而在履帶94配設有多個。如同藉由同時參照圖8與圖9所理解,支撐軸96具有:圓柱狀的基部104,其與履帶94連結;以及圓柱狀的軸部106,其從基部104的端面在Y軸方向延伸。A plurality of
在支撐軸96中,切割刀片54的開口部54a會與軸部106嵌合,以軸部106支撐多個(例如五個)切割刀片54。在圖示的實施方式中,如同藉由參照圖8所理解,在多個支撐軸96之中的半數支撐軸96支撐有切割刀片54。並且,如同圖9所示,在軸部106的前端側,在圓周方向隔著間隔而裝設有多個滾珠柱塞(ball plunger)108,所述滾珠柱塞108用於防止以軸部106支撐之切割刀片54的跳出。In the
如同圖10所示,在支撐軸96的各基部104的內部形成有流路104a,且與各流路104a的一端部連通之多個流路94a形成於履帶94。各流路104a的另一端部係如同圖9所示,在比軸部106更靠徑向外側的基部104的端面開口。As shown in FIG. 10 , a
並且,如同圖8所示,在支撐壁100設有在驅動齒輪88的下方於Y軸方向突出之空氣噴嘴110。空氣噴嘴110係與高壓空氣供給手段(未圖示)連接。在圖示的實施方式中,伴隨履帶94的旋轉之在支撐軸96的軌道中位於最下端之支撐軸96係與空氣噴嘴110的前端面對。In addition, as shown in FIG. 8 , an
然後,在搬出位於軸部106的前端側之切割刀片54之情形中,藉由從空氣噴嘴110透過履帶94的流路94a而將高壓空氣供給至位於最下端之支撐軸96的基部104的流路104a,而可將殘留於軸部106之切割刀片54推出至軸部106的前端側。但是,因滾珠柱塞108的作用,切割刀片54不會從軸部106落下。Then, in the case of carrying out the
(搬出搬入手段78)
若參照圖11進行說明,則搬出搬入手段78具備:Z旋轉軸112,其在Z軸方向延伸;刀片保持部114,其放射狀地與Z旋轉軸112連結,且吸引保持切割刀片54;以及螺帽保持部116,其裝卸自如地保持螺帽64,所述螺帽64與固定凸緣56夾持已嵌入切割手段6的輪轂部58之切割刀片54。
(Move-out and import means 78)
11, the carrying-in
圖示的實施方式的搬出搬入手段78進一步具備殼體118。殼體118具有:正六角形狀的頂板120;以及矩形板狀的六個側壁122,其等係從頂板120的周緣垂下。上述Z旋轉軸112係從頂板120的上表面突出。在殼體118的內部容納有與Z旋轉軸112連結之馬達(未圖示)。The carrying-in/out means 78 of the illustrated embodiment further includes a
在圖示的實施方式中,殼體118的六個側壁122之中,在四個側壁122裝設有刀片保持部114,且在兩個側壁122裝設有螺帽保持部116。兩個螺帽保持部116被設於相對之一對側壁122。如此,搬出搬入手段78相對於一個螺帽保持部116具備兩個刀片保持部114。In the illustrated embodiment, among the six
(刀片保持部114)
刀片保持部114被形成為圓筒狀,在刀片保持部114的端面124設有:圓形的中央開口部126,其能接受上述支撐軸96的軸部106及切割手段6的輪轂部58;以及多個吸引孔128,其等在中央開口部126的周圍於圓周方向隔著等間隔而配置。吸引孔128係與吸引手段(未圖示)連接。
(blade holder 114)
The
然後,刀片保持部114係在被定位於刀片保持部114的端面124與切割刀片保管手段76所保管之切割刀片54的基台60接觸之位置之狀態下,藉由吸引手段而在吸引孔128生成吸引力,而吸引保持切割刀片54。Then, the
(螺帽保持部116)
若參照圖11及圖12繼續說明,則螺帽保持部116包含:圓筒狀的外殼130,其固定於殼體118的側壁122(參照圖11);環狀的旋轉體132,其旋轉自如地被容納於外殼130的內部(參照圖11);以及馬達133,其使旋轉體132旋轉(參照圖12)。
(Nut holder 116)
11 and 12, the
在旋轉體132形成有能接受切割手段6的輪轂部58之中央開口部134。在旋轉體132的端面132a於圓周方向隔著間隔而交互地設有多個吸引孔136與多個銷138。吸引孔136係與吸引手段(未圖示)連接。銷138係藉由內置於旋轉體132之彈簧(未圖示)而被定位於從旋轉體132的端面132a突出之位置(圖11所示之位置),且若被推向旋轉體132的內部,則彈簧會收縮而被容納於旋轉體132的內部。並且,銷138係與形成於螺帽64之銷孔64a的位置對應而配置。A
如同圖12所示,在螺帽保持部116中,在以吸引手段在吸引孔136生成吸引力而吸引保持螺帽64,且銷138插入螺帽64的銷孔64a之狀態下,藉由馬達133而使旋轉體132旋轉,藉此可將螺帽64鎖緊於輪轂部58的公螺紋58a及卸除,所述螺帽64用於將切割刀片54固定於切割手段6的輪轂部58。As shown in FIG. 12 , in the
此外,在從輪轂部58卸除螺帽64之際,即使為螺帽保持部116的銷138的位置與螺帽64的銷孔64a的位置偏離之情形,在使旋轉體132的端面132a接近裝設於輪轂部58之螺帽64的端面,並將銷138容納於旋轉體132的內部之後,若藉由馬達133而使旋轉體132旋轉,則在銷138的位置與銷孔64a的位置一致時,銷138被彈簧推出,且銷138插入銷孔64a。In addition, when detaching the
在圖示的實施方式中,如同圖7所示,能如同上述所構成之搬出搬入手段78配設於框體140的內部。框體140係在Y軸方向移動自如地被支撐於升降台142,升降台142係在Z軸方向升降自如地被支撐於基座架台144。In the illustrated embodiment, as shown in FIG. 7 , the loading/unloading means 78 configured as described above is arranged inside the
若同時參照圖7及圖13進行說明,則框體140包含:矩形板狀的底部146;四個支柱148,其等從底部146的上表面四個角落往上方延伸;以及板狀的頂棚部150,其固定於各支柱148的上端(參照圖7)。在底部146的下表面,於X軸方向隔著間隔而設有一對被引導構件152,所述被引導構件152形成有在Y軸方向延伸之槽152a。7 and 13, the
如同圖13所示,升降台142包含:矩形板狀的頂板154;以及四個圓柱狀的腳部156,其等從頂板154的下表面四個角落往下方延伸。在頂板154的上表面,於X軸方向隔著間隔而設有在Y軸方向延伸之一對導軌158,一對導軌158係滑動自如地與框體140的一對被引導構件152的槽152a嵌合。As shown in FIG. 13 , the
(Y軸方向定位手段80)
在升降台142的頂板154的上表面設有Y軸方向定位手段80。Y軸方向定位手段80具有:滾珠螺桿160,其在一對導軌158之間於Y軸方向延伸;以及馬達162,其使滾珠螺桿160旋轉。滾珠螺桿160的螺帽部(未圖示)固定於框體140的底部146的下表面。
(Y-axis direction positioning means 80)
A Y-axis direction positioning means 80 is provided on the upper surface of the
Y軸方向定位手段80係藉由滾珠螺桿160而將馬達162的旋轉運動轉換成直線運動並傳遞至框體140,使框體140沿著一對導軌158在Y軸方向移動。如此,配設有搬出搬入手段78之框體140係能滑動地被支撐於配設在升降台142且在Y軸方向延伸之導軌158,且藉由Y軸方向定位手段80而相對於切割刀片保管手段76被定位於Y軸方向的作用位置與撤離位置。The positioning means 80 in the Y-axis direction converts the rotational motion of the
上述作用位置為搬出搬入手段78的刀片保持部114已接近切割刀片保管手段76之位置,且為能藉由刀片保持部114而吸引保持被支撐於切割刀片保管手段76之切割刀片54之位置。並且,上述撤離位置為搬出搬入手段78的刀片保持部114比上述作用位置更離開切割刀片保管手段76之位置。The above-mentioned action position is the position where the
如同圖13所示,基座架台144包含:框架164;以及矩形狀的基座板166,其固定於框架164的上部。在基座板166的四個角落形成有升降台142的腳部156滑動自如地插入之四個圓形孔168。並且,在基座板166的中央部形成有母螺紋170。As shown in FIG. 13 , the
(Z軸移動手段82)
若參照圖13繼續說明,則在升降台142及基座架台144連結有Z軸移動手段82。Z軸移動手段82包含:滾珠螺桿172,其在Z軸方向延伸;馬達174,其使滾珠螺桿172旋轉;以及連結板176,其固定於馬達174的上端。滾珠螺桿172係與基座板166的母螺紋170螺合。連結板176係藉由螺栓(未圖示)等適當的連結手段而固定於升降台142的頂板154的下表面。
(Z-axis moving means 82)
If the description is continued with reference to FIG. 13 , the Z-axis moving means 82 is connected to the elevating table 142 and the
Z軸移動手段82係藉由滾珠螺桿172而將馬達174的旋轉運動轉換成直線運動,使升降台142相對於基座架台144升降,藉此使配設有搬出搬入手段78之框體140在Z軸方向移動。The Z-axis moving means 82 converts the rotary motion of the
若參照圖14進行說明,則搬出搬入手段78配設於框體140的內部所配設之第一移動體178,第一移動體178係在垂吊之狀態下能滑動地支撐於第二移動體180的下部所配設之在X軸方向延伸之第一導軌182,且第二移動體180係在垂吊之狀態下能滑動地支撐於框體140的頂棚部150所配設之在X軸方向延伸之第二導軌184。If described with reference to FIG. 14 , the carrying-out means 78 is disposed on the first moving
第一移動體178具有矩形板狀的本體186。在本體186的中央部形成有圓形孔188。搬出搬入手段78的Z旋轉軸112插入圓形孔188,且Z旋轉軸112係不能旋轉地被固定於本體186。若與Z旋轉軸112連結之搬出搬入手段78的馬達進行驅動,則搬出搬入手段78的殼體118相對於第一移動體178進行旋轉,且刀片保持部114及螺帽保持部116被定位於任意的朝向。The first moving
在第一移動體178的本體186的上表面,於Y軸方向隔著間隔而設有一對被引導構件190,且固定有塊體192,所述一對被引導構件190形成有在X軸方向延伸之槽190a,所述塊體192形成有在X軸方向延伸之貫通孔192a。On the upper surface of the
第二移動體180具有矩形板狀的本體194,在本體194的下表面於Y軸方向隔著間隔而設有一對第一導軌182。第一導軌182係滑動自如地與第一移動體178的一對被引導構件190的槽190a嵌合,第一移動體178係在垂吊之狀態下能滑動地被支撐於第二移動體180所配設之第一導軌182。The second moving
(X軸移動手段84)
在第二移動體180的本體194的下方設有使第一移動體178相對於第二移動體180在X軸方向移動之第一X軸移動手段。圖示的實施方式的第一X軸移動手段係由氣缸196所構成。氣缸196的缸筒196a係固定於本體194的下表面,且在一對第一導軌182之間於X軸方向延伸。氣缸196的活塞桿196b的前端係與第一移動體178的塊體192的貫通孔192a嵌合並連結。
(X-axis movement means 84)
A first X-axis moving means for moving the first moving
作為第一X軸移動手段的氣缸196係藉由使活塞桿196b進退,而使第一移動體178相對於第二移動體180沿著第一導軌182在X軸方向移動。The
在第二移動體180的本體194的上表面,於Y軸方向隔著間隔而設有一對被引導構件198,且固定有塊體200,所述一對被引導構件198形成有在X軸方向延伸之槽198a,所述塊體200形成有在X軸方向延伸之母螺紋200a。On the upper surface of the
在框體140的頂棚部150的下表面,於Y軸方向隔著間隔而設有一對第二導軌184。第二導軌184係滑動自如地與第二移動體180的一對被引導構件198的槽198a嵌合,第二移動體180係在垂吊之狀態下能滑動地被支撐於框體140的頂棚部150所配設之第二導軌184。On the lower surface of the
在框體140的頂棚部150的下方設有使第二移動體180相對於頂棚部150在X軸方向移動之第二X軸移動手段202。圖示的實施方式的第二X軸移動手段202具有:滾珠螺桿204,其在一對第二導軌184之間於X軸方向延伸;以及馬達206,其使滾珠螺桿204旋轉。滾珠螺桿204係與第二移動體180的塊體200的母螺紋200a螺合。馬達206固定於頂棚部150的下表面。A second X-axis moving means 202 for moving the second moving
第二X軸移動手段202係藉由滾珠螺桿204而將馬達206的旋轉運動轉換成直線運動並傳遞至第二移動體180,使第二移動體180相對於頂棚部150沿著第二導軌184在X軸方向移動。The second X-axis moving means 202 converts the rotational motion of the
圖示的實施方式的X軸移動手段84包含:作為第一X軸移動手段的氣缸196;以及第二X軸移動手段202,其具有滾珠螺桿204及馬達206。在圖示的實施方式中,藉由以作為第一X軸移動手段的氣缸196使第一移動體178移動,而可使搬出搬入手段78快速地在X軸方向前進,且藉由以第二X軸移動手段202使第二移動體180移動,而可容易地微調整搬出搬入手段78的X軸方向位置。如此,搬出搬入手段78被構成為藉由第一移動體178及第二移動體180而在X軸方向進出自如。The X-axis moving means 84 of the illustrated embodiment includes: an
如同圖1所示,加工裝置2具備控制加工裝置2的運作之控制手段208。控制手段208係由電腦所構成,所述電腦具有:中央處理裝置(CPU),其遵循控制程式進行運算處理;唯讀記憶體(ROM),其儲存控制程式等;以及能讀寫的隨機存取記憶體(RAM),其儲存運算結果等。As shown in FIG. 1 , the
(切割加工)
在使用加工裝置2對晶圓等被加工物施行切割加工之際,首先,使被加工物吸附於卡盤台18。接著,以X軸進給手段24使卡盤台18移動至攝像手段68的下方,且以移動手段70調整攝像手段68的Y軸方向位置。接著,以攝像手段68從上方拍攝被加工物,檢測被加工物的切割區域。
(cutting processing)
When performing dicing processing on a workpiece such as a wafer using the
接著,基於以攝像手段68所檢測出之被加工物的切割區域,使卡盤台18旋轉,調整相對於切割手段6的切割刀片54之被加工物的切割區域的朝向。接著,以X軸進給手段24使卡盤台18在X軸方向移動,且以Y軸進給手段38使切割手段6在Y軸方向移動,將一對切割刀片54定位於被加工物的切割區域的上方。Next, based on the cut region of the workpiece detected by the imaging means 68 , the chuck table 18 is rotated to adjust the orientation of the cut region of the workpiece with respect to the
接著,以Z軸進給手段42使切割手段6下降,使高速旋轉之切割刀片54的切削刀刃62切入被加工物的切割區域,且一邊將切割水供給至使切割刀片54的切削刀刃62切入之部分,一邊將卡盤台18在X軸方向進行加工進給,藉此對被加工物的切割區域施行預定的切割加工。一邊以Y軸進給手段38將切割手段6在Y軸方向進行分度進給,一邊適當重複上述切割加工,對全部的被加工物的切割區域施行切割加工。將切割步驟結束之切割加工完畢的被加工物搬送至下個步驟。Then, the cutting means 6 is lowered by the Z-axis feeding means 42, and the
(切割刀片54的更換)
若重複實施切割步驟,則切割刀片54會磨耗,且若切割刀片54的磨耗到達預定量,則變得無法維持切割精確度,因此需要將裝設於切割手段6之切割刀片54更換成新的切割刀片54。並且,即使為裝設於切割手段6之切割刀片54的磨耗未到達預定量之情形,在對與先前已施行切割加工之被加工物的素材不同之素材的被加工物施行切割加工時,有時亦會需要更換成因應被加工物的素材之切割刀片54。
(Replacement of cutting blade 54)
If the cutting step is repeatedly implemented, the
在更換裝設於切割手段6之切割刀片54之際,首先,使切割刀片保管手段76的履帶94旋轉,將支撐應搬入切割手段6之新的切割刀片54之支撐軸96定位於預定位置(例如,支撐軸96的軌道中之最下端的位置)。When replacing the
接著,如同圖15所示,藉由與搬出搬入手段78的Z旋轉軸112連結之馬達而使殼體118旋轉,使裝設有刀片保持部114之殼體118的側壁122沿著X軸方向,且使刀片保持部114與切割刀片保管手段76面對。並且,使X軸移動手段84及Z軸移動手段82運作,以可將上述預定位置的支撐軸96的軸部106插入刀片保持部114的中央開口部126之方式,調整刀片保持部114的X軸方向位置及Z軸方向位置。Next, as shown in FIG. 15 , the
接著,如同圖16所示,藉由Y軸方向定位手段80而使框體140在Y軸方向移動,將搬出搬入手段78定位於能藉由刀片保持部114保持被支撐於支撐軸96之切割刀片54之作用位置。藉此,將上述預定位置的支撐軸96的軸部106插入刀片保持部114的中央開口部126,且使刀片保持部114的端面124與位於軸部106的前端側之切割刀片54的端面接觸。接著,在刀片保持部114的吸引孔128生成吸引力,以刀片保持部114吸引保持位於軸部106的前端側之切割刀片54。Next, as shown in FIG. 16 , the
接著,使Y軸方向定位手段80運作,使搬出搬入手段78從切割刀片保管手段76在Y軸方向分離並定位於撤離位置。接著,使搬出搬入手段78的殼體118旋轉180°,使已吸引保持切割刀片54之刀片保持部114的相反側的刀片保持部114與切割刀片保管手段76面對。Next, the Y-axis direction positioning means 80 is operated, and the carrying-in/out means 78 is separated from the cutter blade storage means 76 in the Y-axis direction and positioned at the evacuation position. Then, the
接著,使Y軸方向定位手段80運作,將搬出搬入手段78定位於能藉由相反側的刀片保持部114而保持支撐軸96的切割刀片54之作用位置。接著,在相反側的刀片保持部114的吸引孔128生成吸引力,藉由刀片保持部114而吸引保持位於軸部106的前端側之切割刀片54。藉此,成為以四個刀片保持部114之中對向之一對刀片保持部114吸引保持新的切割刀片54之狀態。Next, the Y-axis direction positioning means 80 is operated, and the carrying-in/out means 78 is positioned at the working position of the
接著,如同圖17所示,藉由Y軸方向定位手段80而使框體140在Y軸方向移動,且以Z軸移動手段82使升降台142在Z軸方向移動。藉此,使搬出搬入手段78從切割刀片保管手段76分離並定位於撤離位置,且調整搬出搬入手段78相對於切割手段6的Y軸方向位置及Z軸方向位置。位置調整後的搬出搬入手段78的Y軸方向位置為一對切割手段6之間,且位置調整後的搬出搬入手段78的Z軸方向位置比卡盤台18的保持面更上方。Next, as shown in FIG. 17 , the
接著,如同圖18所示,藉由作為第一X軸移動手段的氣缸196而使第一移動體178在X軸方向移動,使搬出搬入手段78朝向一對切割手段6之間前進。接著,如同圖19所示,藉由第二X軸移動手段202而使第二移動體180在X軸方向移動,調整搬出搬入手段78相對於一對切割手段6的X軸方向位置。Next, as shown in FIG. 18 , the first moving
具體而言,使以搬出搬入手段78的一對刀片保持部114吸引保持之新的一對切割刀片54的中心的X軸方向位置與裝設於一對切割手段6之一對切割刀片54的中心的X軸方向位置一致。並且,使切割刀片裝設手段8的Z軸移動手段82或切割手段6的Z軸進給手段42運作,而使刀片保持部114的切割刀片54的中心的Z軸方向位置與切割手段6的切割刀片54的中心的Z軸方向位置一致。Specifically, the X-axis position of the center of the new pair of cutting
接著,使搬出搬入手段78的殼體118旋轉60°,而使一對螺帽保持部116與一對切割手段6的切割刀片54面對。此外,亦可在使第一/第二移動體178、180前進之前,使殼體118預先旋轉60°。Next, the
接著,將一對切割手段6各自的刀片蓋66的第二蓋構件66b定位於開放位置(參照圖5)。接著,以Y軸進給手段38使切割手段6在Y軸方向移動,使將切割刀片54固定於輪轂部58之螺帽64與螺帽保持部116的旋轉體132的端面132a接觸(參照圖12)。如此一來,螺帽保持部116的銷138被推至螺帽64並被容納於旋轉體132的內部,且輪轂部58被容納於旋轉體132的中央開口部134。Next, the
接著,若以螺帽保持部116的馬達133使旋轉體132旋轉,則在銷138與螺帽64的銷孔64a一致時,銷138與銷孔64a嵌合,旋轉體132的旋轉運動透過銷138而被傳遞至螺帽64,鬆開螺帽64。藉此,可從切割手段6的輪轂部58的公螺紋58a卸除螺帽64。並且,在螺帽保持部116的吸引孔136生成吸引力,以螺帽保持部116吸引保持已卸除之螺帽64。Next, if the
接著,藉由Y軸進給手段38而使切割手段6從搬出搬入手段78分離,且使搬出搬入手段78的殼體118旋轉60°,而使未吸引保持切割刀片54之空的刀片保持部114與切割手段6的切割刀片54面對。Then, the cutting means 6 is separated from the carrying-in
接著,藉由Y軸進給手段38而使切割手段6接近搬出搬入手段78,將切割手段6的輪轂部58插入刀片保持部114的中央開口部126,且使空的刀片保持部114的端面124與切割手段6的切割刀片54的端面接觸。接著,在刀片保持部114的吸引孔128生成吸引力,以刀片保持部114吸引保持切割手段6的切割刀片54。Next, the cutting means 6 is brought close to the carrying in and out means 78 by the Y-axis feeding means 38, the
接著,藉由Y軸進給手段38而使切割手段6從搬出搬入手段78分離,且使搬出搬入手段78的殼體118旋轉60°,而使吸引保持新的切割刀片54之刀片保持部114與切割手段6的輪轂部58面對。Then, the cutting means 6 is separated from the carrying-in
接著,藉由Y軸進給手段38而使切割手段6接近搬出搬入手段78,將輪轂部58插入新的切割刀片54的開口部54a,使旋轉軸52的固定凸緣56的支承部56b與切割刀片54的端面接觸。接著,解除刀片保持部114的吸引力,將新的切割刀片54從刀片保持部114交接至切割手段6。Next, the cutting means 6 is brought close to the carrying-out means 78 by the Y-axis feeding means 38, the
接著,藉由Y軸進給手段38而使切割手段6從搬出搬入手段78分離,且使搬出搬入手段78的殼體118旋轉60°,而使吸引保持已卸除之螺帽64之螺帽保持部116與切割手段6的輪轂部58面對(參照圖20)。Then, the cutting means 6 is separated from the carrying-in
接著,藉由Y軸進給手段38而使切割手段6接近搬出搬入手段78,將以螺帽保持部116吸引保持之螺帽64定位於輪轂部58的前端。接著,如同圖21所示,使螺帽保持部116以預定的旋轉速度(例如50度/秒鐘)正旋轉,將螺帽64與輪轂部58的公螺紋58a螺合。此外,圖示的實施方式中的正旋轉係指圖21中往箭頭R1所示之方向的旋轉。Next, the cutting means 6 is brought close to the carrying-in/out means 78 by the Y-axis feeding means 38 , and the
然後,若螺帽64的緊固轉矩到達鎖緊完成的閾值(例如,4.3N・m左右),則使螺帽保持部116的旋轉停止。接著,將使螺帽保持部116的旋轉停止之位置作為基準位置,如同圖22所示,使螺帽保持部116僅逆旋轉預定的角度(例如20度)而鬆開螺帽64。逆旋轉為圖22中箭頭R2所示之方向。Then, when the tightening torque of the
此外,螺帽64的緊固轉矩可從螺帽保持部116的馬達133的電流值而計算。並且,螺帽保持部116的旋轉角度可藉由旋轉編碼器等適當的旋轉角度檢測感測器而求得。In addition, the tightening torque of the
之後,如同圖23所示,使螺帽保持部116往R1方向僅正旋轉與使螺帽保持部116逆旋轉之角度(上述的例子中為20度)相同的角度。亦即,使螺帽保持部116從逆旋轉後的停止位置進行正旋轉直至上述基準位置為止。然後,在基準位置中螺帽64的緊固轉矩到達鎖緊完成的上述閾值之情形中,控制手段208判斷已恰當地鎖緊切割刀片54。Afterwards, as shown in FIG. 23 , the
另一方面,針對除此之外的情形,控制手段208判斷未恰當地鎖緊切割刀片54。亦即,在(1)螺帽保持部116返回基準位置之前螺帽64的緊固轉矩便已到達上述閾值之情形,或者(2)在基準位置中螺帽64的緊固轉矩未到達上述閾值之情形中,控制手段208判斷未恰當地鎖緊切割刀片54。On the other hand, in other cases, the control means 208 judges that the
如此,在圖示的實施方式中,在螺帽64的緊固轉矩到達閾值之後,若在暫時鬆開螺帽64並再次重新鎖緊螺帽64之際發生上述(1)或(2)的情形,則控制手段208判斷輪轂部58的公螺紋58a與螺帽64的螺合發生問題。然後,在發生問題之情形中,發出用於向操作員通知上述問題的訊息。Thus, in the illustrated embodiment, after the tightening torque of the
藉此,操作員可分解切割手段6,找出螺帽64未恰當地與公螺紋58a螺合、在螺帽64與公螺紋58a之間存在垃圾、螺帽64或公螺紋58a的螺紋磨耗等問題,且可在適當的時間點實施零件的清掃/更換等各種維護作業。因此,在圖示的實施方式中,可防止在未恰當地鎖緊切割刀片54之狀態下運行加工裝置2。Thereby, the operator can disassemble the cutting means 6 to find out that the
若已恰當地鎖緊切割刀片54,則在解除螺帽保持部116的吸引力之後,將切割手段6的刀片蓋66的第二蓋構件66b定位於閉塞位置。此外,針對如同上述的螺帽64及切割刀片54的卸除、安裝,可對一對切割手段6同時進行,亦可分開進行。If the
接著,使第一/第二移動體178、180後退,且使搬出搬入手段78的殼體118旋轉60°,而使已卸除之一對切割刀片54中的其中一個與切割刀片保管手段76面對。並且,使切割刀片保管手段76的履帶94旋轉,將未支撐切割刀片54之空的支撐軸96定位於預定位置(例如,支撐軸96的軌道中之最下端的位置)。Then, the first/second
接著,使X軸移動手段84及Z軸移動手段82運作,以可將上述預定位置的支撐軸96的軸部106插入以刀片保持部114吸引保持之其中一個切割刀片54的開口部54a之方式,調整刀片保持部114的X軸方向位置及Z軸方向位置。Then, the X-axis moving means 84 and the Z-axis moving means 82 are operated so that the
接著,藉由Y軸方向定位手段80而使框體140在Y軸方向移動,將上述預定位置的支撐軸96的軸部106插入以刀片保持部114吸引保持之其中一個切割刀片54的開口部54a,且使其中一個切割刀片54的端面與支撐軸96的基部104的端面接觸。接著,解除刀片保持部114的吸引力,將已卸除之一對切割刀片54中的其中一個交接至支撐軸96。Then, the
並且,藉由Y軸方向定位手段80而使搬出搬入手段78從切割刀片保管手段76分離,且使搬出搬入手段78的殼體118旋轉180°,而使吸引保持已卸除之一對切割刀片5中的另一個之相反側的刀片保持部114與切割刀片保管手段76面對。And, by the Y-axis direction positioning means 80, the carrying-out and carrying-in
接著,藉由Y軸方向定位手段80而使框體140在Y軸方向移動,將上述預定位置的支撐軸96的軸部106插入以相反側的刀片保持部114吸引保持之另一個切割刀片54的開口部54a,且使另一個切割刀片54的端面與被支撐軸96支撐之切割刀片54的端面接觸。接著,解除刀片保持部114的吸引力,將已卸除之一對切割刀片54中的另一個交接至支撐軸96。Next, the
如同以上,在圖示的實施方式的加工裝置2中,將使螺帽保持部116正旋轉而將螺帽64與輪轂部58的公螺紋58a螺合且轉矩到達鎖緊完成的閾值之位置作為基準位置,在使螺帽保持部116逆旋轉之後使螺帽保持部116正旋轉而在基準位置上轉矩到達閾值之情形,判斷已恰當地鎖緊切割刀片54,除此之外則判斷未恰當地鎖緊切割刀片54,因此可恰當地鎖緊切割刀片54。As above, in the
2:加工裝置
4:保持手段
6:切割手段
8:切割刀片裝設手段
52:旋轉軸
54:切割刀片
54a:切割刀片的開口部
56:固定凸緣
58:輪轂部
58a:公螺紋
64:螺帽
116:螺帽保持部
2: Processing device
4: keep the means
6: Cutting means
8: Cutting blade installation means
52: axis of rotation
54:
圖1係遵循本發明所構成之加工裝置的立體圖。 圖2係圖1所示之保持手段及切割手段的立體圖。 圖3係圖1所示之保持手段的立體圖。 圖4係圖1所示之切割手段的立體圖。 圖5係在圖4所示之刀片蓋已開放之狀態中之切割手段的立體圖。 圖6係圖4所示之切割手段的分解立體圖。 圖7係圖1所示之切割刀片裝設手段的立體圖。 圖8係圖7所示之切割刀片保管手段的分解立體圖。 圖9係圖8所示之支撐軸的立體圖。 圖10係圖8所示之支撐軸的剖面圖。 圖11係圖7所示之搬出搬入手段的立體圖。 圖12係表示以圖11所示之螺帽保持部從切割手段裝卸螺帽之狀態之示意圖。 圖13係圖7所示之框體、升降台及基座架台的分解立體圖。 圖14係圖7所示之框體的分解立體圖。 圖15係表示圖7所示之切割刀片保管手段與搬出搬入手段面對之狀態之立體圖。 圖16係表示框體從圖15所示之狀態朝向切割刀片保管手段前進之狀態之立體圖。 圖17係表示框體從圖16所示之狀態後退且升降台上升之狀態之立體圖。 圖18係表示第一移動體從圖17所示之狀態朝向切割手段前進之狀態之立體圖。 圖19係表示第二移動體從圖18所示之狀態朝向切割手段前進之狀態之立體圖。 圖20係表示使已保持螺帽之螺帽保持部與輪轂部面對之狀態之立體圖。 圖21係表示使螺帽保持部以第一旋轉速度正旋轉之狀態之立體圖。 圖22係表示使螺帽保持部逆旋轉之狀態之立體圖。 圖23係表示使螺帽保持部以第二旋轉速度正旋轉之狀態之體圖。 圖24係表示已將切割刀片鎖緊於旋轉軸之狀態之立體圖。 Fig. 1 is a perspective view of a processing device constructed according to the present invention. Fig. 2 is a perspective view of the holding means and the cutting means shown in Fig. 1 . Fig. 3 is a perspective view of the holding means shown in Fig. 1 . Fig. 4 is a perspective view of the cutting means shown in Fig. 1 . Fig. 5 is a perspective view of the cutting means in the state where the blade cover shown in Fig. 4 has been opened. Fig. 6 is an exploded perspective view of the cutting means shown in Fig. 4 . Fig. 7 is a perspective view of the means for installing the cutting blade shown in Fig. 1 . Fig. 8 is an exploded perspective view of the cutting blade storage means shown in Fig. 7 . Fig. 9 is a perspective view of the supporting shaft shown in Fig. 8 . Fig. 10 is a sectional view of the support shaft shown in Fig. 8 . Fig. 11 is a perspective view of the unloading and loading means shown in Fig. 7 . Fig. 12 is a schematic diagram showing a state in which a nut is attached and detached from a cutting means by using the nut holder shown in Fig. 11 . Fig. 13 is an exploded perspective view of the frame body, lifting platform and base stand shown in Fig. 7 . Fig. 14 is an exploded perspective view of the frame shown in Fig. 7 . Fig. 15 is a perspective view showing a state where the cutting blade storage means and the carrying-out and carrying-in means shown in Fig. 7 face each other. Fig. 16 is a perspective view showing a state in which the frame body advances from the state shown in Fig. 15 toward the cutting blade storage means. Fig. 17 is a perspective view showing a state in which the housing is retracted from the state shown in Fig. 16 and the lift table is raised. Fig. 18 is a perspective view showing a state in which the first moving body advances from the state shown in Fig. 17 toward the cutting means. Fig. 19 is a perspective view showing a state where the second moving body advances from the state shown in Fig. 18 toward the cutting means. Fig. 20 is a perspective view showing a state in which the nut holding portion holding the nut faces the hub portion. Fig. 21 is a perspective view showing a state where the nut holding portion is normally rotated at the first rotational speed. Fig. 22 is a perspective view showing a state in which the nut holding portion is reversely rotated. Fig. 23 is a perspective view showing a state where the nut holding portion is normally rotated at the second rotational speed. Fig. 24 is a perspective view showing a state in which the cutting blade is locked to the rotating shaft.
4:保持手段 4: keep the means
6:切割手段 6: Cutting means
10:基台 10: Abutment
10a:導軌 10a: guide rail
12:X軸可動板 12: X-axis movable plate
14:支柱 14: pillar
16:蓋板 16: cover plate
16a:圓形開口 16a: round opening
18:卡盤台 18: Chuck table
20:吸附卡盤 20: Adsorption Chuck
22:夾具 22: Fixture
24:X軸進給手段 24: X-axis feed means
26:滾珠螺桿 26: Ball screw
28:馬達 28: motor
30:框架 30: frame
32:支柱 32: Pillar
34:樑 34: Beam
34a:導軌 34a: guide rail
36:Y軸可動構件 36: Y-axis movable member
38:Y軸進給手段 38: Y-axis feed means
40:Z軸可動構件 40: Z-axis movable member
42:Z軸進給手段 42: Z-axis feed means
44:外殼 44: shell
66:刀片蓋 66: Blade cover
68:攝像手段 68: Camera means
70:移動手段 70: means of movement
72:滾珠螺桿 72: Ball screw
74:馬達 74: motor
Claims (1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021202216A JP2023087754A (en) | 2021-12-14 | 2021-12-14 | Processing device |
JP2021-202216 | 2021-12-14 |
Publications (1)
Publication Number | Publication Date |
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TW202322974A true TW202322974A (en) | 2023-06-16 |
Family
ID=86723006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111147337A TW202322974A (en) | 2021-12-14 | 2022-12-09 | Machining apparatus capable of properly tightening a cutting blade |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2023087754A (en) |
KR (1) | KR20230090238A (en) |
CN (1) | CN116262368A (en) |
TW (1) | TW202322974A (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4837970B2 (en) | 2005-10-06 | 2011-12-14 | 株式会社ディスコ | Cutting blade changer |
-
2021
- 2021-12-14 JP JP2021202216A patent/JP2023087754A/en active Pending
-
2022
- 2022-12-05 KR KR1020220167233A patent/KR20230090238A/en unknown
- 2022-12-07 CN CN202211561844.4A patent/CN116262368A/en active Pending
- 2022-12-09 TW TW111147337A patent/TW202322974A/en unknown
Also Published As
Publication number | Publication date |
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KR20230090238A (en) | 2023-06-21 |
CN116262368A (en) | 2023-06-16 |
JP2023087754A (en) | 2023-06-26 |
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