TW202322231A - metal mask for printing - Google Patents

metal mask for printing Download PDF

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TW202322231A
TW202322231A TW111129131A TW111129131A TW202322231A TW 202322231 A TW202322231 A TW 202322231A TW 111129131 A TW111129131 A TW 111129131A TW 111129131 A TW111129131 A TW 111129131A TW 202322231 A TW202322231 A TW 202322231A
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Taiwan
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hole
printing
mask
mask body
hole portion
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TW111129131A
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Chinese (zh)
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中島貴士
堀之內強
高嶋健一
五郎丸佑也
林田真幸
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日商麥克賽爾股份有限公司
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Priority claimed from JP2021148709A external-priority patent/JP2023041368A/en
Priority claimed from JP2021209222A external-priority patent/JP2023094025A/en
Application filed by 日商麥克賽爾股份有限公司 filed Critical 日商麥克賽爾股份有限公司
Publication of TW202322231A publication Critical patent/TW202322231A/en

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  • Chemical & Material Sciences (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

The invention provides a metal mask for printing, which can further improve the printing precision when forming a printing layer, and can form a high-precision and high-quality printing layer. This metal mask for printing is provided with: a mask body (7) having a rear surface (9) facing a printing target (2); and a plurality of through holes (10) which penetrate the mask main body (7) on the front and back and are filled with the printing paste (4). The through hole (10) is configured from a first hole section (13) that opens in the front surface (8) of the mask main body (7), and a second hole section (14) that is continuous with the first hole section (13) and opens in the back surface (9) of the mask main body (7). Either the first hole portion (13) or the second hole portion (14) is composed of a linear hole, and the cross-sectional shape of the inner surface of the other is formed in an R shape.

Description

印刷用金屬遮罩metal mask for printing

本發明係關於針對金屬遮罩,改善印刷層的滲透、褪色等之印刷不良的技術。作為本發明的金屬遮罩,可舉出例如當藉由網版印刷法,印刷形成用來將焊球暫時固定於基板上的助焊劑(印刷漿)的層時所使用之印刷用金屬遮罩。The present invention relates to a technology for improving printing defects such as penetration and fading of a printing layer for a metal mask. As the metal mask of the present invention, for example, a metal mask for printing used when printing and forming a layer of flux (printing paste) for temporarily fixing solder balls on a substrate by a screen printing method .

作為謀求印刷用金屬遮罩的印刷精度提升之技術,本案申請人已提案有專利文獻1。在專利文獻1,將形成於以電鑄法所製作的金屬遮罩之透孔的剖面形狀形成為電鑄面側的孔徑小而電鑄母模面側的孔徑大之錐形狀。當進行印刷時,該電鑄面側成為表面側亦即刮刀面側,電鑄母模面側成為背面側亦即被印刷體(印刷對象)側。當形成墨水、漿料(印刷漿)的層(印刷層)時,首先,使金屬遮罩的被印刷體側密接於被印刷體上,其次,將墨水、漿料置於金屬遮罩的刮刀面,將刮刀面上的墨水、漿料以刮刀延伸並填充至透孔的內部。當墨水、漿料對透孔之填充結束後,藉由將金屬遮罩從被印刷體分離,能夠將對應於透孔之墨水、漿料的印刷層印刷形成於被印刷體。 [先前技術文獻] [專利文獻] The applicant of this application has already proposed Patent Document 1 as a technique for improving the printing accuracy of a metal mask for printing. In Patent Document 1, the cross-sectional shape of the through-hole formed in the metal mask produced by the electroforming method is formed into a tapered shape in which the diameter of the hole on the side of the electroformed surface is small and the diameter of the hole on the side of the electroformed master mold is large. When printing, the electroformed surface side becomes the front side, that is, the squeegee surface side, and the electroformed master surface side becomes the back side, that is, the object to be printed (printed object) side. When forming a layer (printing layer) of ink and paste (printing paste), first, make the printed body side of the metal mask adhere to the printed body, and then place the ink and paste on the scraper of the metal mask On the surface, the ink and paste on the scraper surface are extended and filled into the inside of the through hole with the scraper. After filling the through holes with ink and paste, by separating the metal mask from the to-be-printed body, a printing layer of ink and paste corresponding to the through-holes can be printed and formed on the to-be-printed body. [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開平10-305670號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 10-305670

[發明所欲解決之問題][Problem to be solved by the invention]

在專利文獻1的金屬遮罩,由於藉由將透孔作成為朝背面側擴大的錐形孔,使墨水、漿料之版剝離性變佳,故,當從被印刷體分離金屬遮罩時,既可進行金屬遮罩的分離,又可抑制墨水、漿料的一部分被去除,因此能夠防止滲透、褪色等的印刷不良產生。但,在專利文獻1的金屬遮罩,由於墨水、漿料與透孔的孔內表面全體接觸,故,依然會有已經填充於透孔的內部之墨水、漿料附著於透孔的孔內表面,金屬遮罩在一部分的墨水、漿料附著的狀態下從被印刷體分離,造成印刷形狀歪斜或印刷退色等之印刷不良產生。又,由於墨水、漿料的附著狀態並非在各個透孔呈均等,故,亦會產生各印刷層的墨水、漿料的量不均等之印刷不良。In the metal mask of Patent Document 1, since the through hole is made into a tapered hole that expands toward the back side, the plate releasability of ink and paste is improved, so when separating the metal mask from the printed body , It can not only separate the metal mask, but also prevent part of the ink and paste from being removed, so printing defects such as bleeding and fading can be prevented. However, in the metal mask of Patent Document 1, since the ink and paste are in contact with the entire inner surface of the through hole, the ink and paste that have been filled in the through hole still adhere to the inside of the through hole. On the surface, the metal mask is separated from the object to be printed with a part of the ink or paste adhered, causing printing defects such as distortion of the printed shape or fading of the printed color. In addition, since the adhesion state of ink and paste is not uniform in each through hole, printing defects such as uneven amounts of ink and paste in each printing layer may also occur.

本發明的目的係在於提供可進一步提升當印刷形成印刷層時的印刷精度,能夠形成高精度且高品質的印刷層之印刷用金屬遮罩。 [解決問題之技術手段] An object of the present invention is to provide a metal mask for printing which can further improve the printing accuracy when printing to form a printing layer, and can form a high-precision and high-quality printing layer. [Technical means to solve the problem]

本發明的印刷用金屬遮罩,係具備:由金屬薄板構成,其背面9面對印刷對象2之遮罩本體7;及朝表背貫通遮罩本體7,並填充有印刷漿4,且由圓孔構成之多數個通孔10。又,通孔10由朝遮罩本體7的表面8開口且以直狀孔構成之第1孔部13;及內表面的剖面形狀形成為R形並與第1孔部13圓滑地連續且擴大,且朝遮罩本體7的背面9開口之第2孔部14構成。The metal mask for printing of the present invention comprises: a mask body 7 made of a thin metal plate whose back 9 faces the printing object 2; The circular hole constitutes a plurality of through holes 10 . Also, the through hole 10 is opened toward the surface 8 of the mask body 7 and constitutes a first hole 13 with a straight hole; , and the second hole 14 opening toward the back surface 9 of the mask body 7 is formed.

可採用以下的形態,亦即,第1孔部13由直狀圓孔構成,第2孔部14由鐘形孔構成。A form in which the first hole portion 13 is formed of a straight circular hole and the second hole portion 14 is formed of a bell-shaped hole may be employed.

當將遮罩本體7的厚度T設為1時,以第1孔部13的孔深度所規定的H1設定成0.2以上0.6以下為佳。When the thickness T of the mask body 7 is set to 1, H1 defined by the hole depth of the first hole portion 13 is preferably set to 0.2 or more and 0.6 or less.

更理想為,當將遮罩本體7的厚度T設為1時,以第1孔部13的孔深度所規定的H1設定成0.2以上、未滿0.5為佳。More desirably, when the thickness T of the mask body 7 is set to 1, H1 defined by the hole depth of the first hole portion 13 is preferably set to 0.2 or more and less than 0.5.

可採用以下形態,亦即,當將第2孔部14的孔深度規定為H2、第2孔部14的擴大尺寸的一半規定為D3時,以符合不等式(H2<D3)的方式,形成第2孔部14。The following form can be adopted, that is, when the hole depth of the second hole portion 14 is defined as H2, and half of the enlarged dimension of the second hole portion 14 is defined as D3, the second hole is formed in a manner that conforms to the inequality (H2<D3). 2 holes 14.

可採用以下形態,亦即,當將遮罩本體7的表面8之第1孔部13的開口尺寸規定為D1、遮罩本體7的背面9之第2孔部14的開口尺寸規定為D2時,開口尺寸D2設定為開口尺寸D1的1.5倍以上。The following form can be adopted, that is, when the opening size of the first hole portion 13 on the surface 8 of the mask body 7 is specified as D1, and the opening size of the second hole portion 14 on the back surface 9 of the mask body 7 is specified as D2 , The opening size D2 is set to be more than 1.5 times the opening size D1.

遮罩本體7的厚度T設定為25μm以下為佳。The thickness T of the mask body 7 is preferably set to be 25 μm or less.

在通孔10的內表面及遮罩本體7的背面9,形成有抑制印刷漿4的附著之塗佈層17。當將第1孔部13之塗佈層17的層厚規定為C1、將第2孔部14之塗佈層17的層厚規定為C2、並將遮罩本體7的背面9之塗佈層17的層厚規定為C3時,以符合不等式(C1≦C2≦C3)的方式,形成塗佈層17。 [發明效果] On the inner surface of the through hole 10 and the back surface 9 of the mask body 7, a coating layer 17 for suppressing the adhesion of the printing paste 4 is formed. When the layer thickness of the coating layer 17 of the first hole 13 is specified as C1, the layer thickness of the coating layer 17 of the second hole 14 is specified as C2, and the coating layer of the back surface 9 of the mask body 7 When the layer thickness of 17 is defined as C3, the coating layer 17 is formed so as to satisfy the inequality (C1≦C2≦C3). [Invention effect]

在本發明的印刷用金屬遮罩,朝表背貫通遮罩本體7的通孔10,由朝遮罩本體7的表面8開口且以直狀孔構成之第1孔部13;及內表面的剖面形狀形成為R形並與第1孔部13圓滑地連續且擴大,且朝遮罩本體7的背面9開口之第2孔部14構成。如此,若朝遮罩本體7的表面8開口之第1孔部13以直孔構成,則能夠將當朝通孔10進行填充時之印刷漿4的流動方向以朝垂直方向延伸的第1孔部13的孔內表面進行導引,因此,在通孔10內,可使該印刷漿4確實地落入至遮罩本體7的厚度方向(垂直方向)。又,連接於第1孔部13的第2孔部14,其內表面的剖面形狀形成為R形,與第1孔部13圓滑地連續且擴大而開口於遮罩本體7的背面9,因此,印刷漿4被第1孔部13的孔內表面導引而到達兩孔部13、14的邊界部分附近時,可在該邊界部分附近,從第2孔部14的孔內表面使印刷漿4剝離。又,在已經從第2孔部14的孔內表面剝離的狀態下,可使印刷漿4到達第2孔部14的遮罩本體7之背面9側。如此,若依據本發明的印刷用金屬遮罩,因可在兩孔部13、14的邊界部分附近,從第2孔部14的孔內表面使印刷漿4剝離,所以,比起以往的金屬遮罩,可將通孔10的孔內表面與印刷漿4之接觸面積縮小,在將遮罩從印刷對象2分離時,可將附著於遮罩而從印刷對象2去除之印刷漿4的量減容。如以上說明,若依據本發明的印刷用金屬遮罩,可抑制印刷對象2上之印刷層的印刷形狀歪斜、印刷褪色等之印刷不良產生,所以,可謀求當印刷形成印刷層時之印刷精度的提升,能夠在印刷對象2上形成高精度且高品質之印刷層。In the metal mask for printing of the present invention, the through hole 10 that passes through the mask body 7 towards the front and back is the first hole portion 13 that is open to the surface 8 of the mask body 7 and constitutes a straight hole; and the inner surface The cross-sectional shape is R-shaped, and the first hole 13 is smoothly continuous and enlarged, and the second hole 14 opening toward the back surface 9 of the mask body 7 is formed. In this way, if the first hole portion 13 opening toward the surface 8 of the mask body 7 is configured as a straight hole, the flow direction of the printing paste 4 when filling the through hole 10 can be made the first hole extending vertically. Since the inner surface of the hole of the portion 13 is guided, the printing paste 4 can be reliably dropped in the thickness direction (vertical direction) of the mask body 7 in the through hole 10 . Also, the second hole portion 14 connected to the first hole portion 13 has an R-shaped cross-sectional shape on its inner surface, which is smoothly continuous with the first hole portion 13 and expanded to open on the back surface 9 of the mask body 7. When the printing paste 4 is guided by the hole inner surface of the first hole portion 13 and reaches the vicinity of the boundary portion of the two hole portions 13,14, the printing paste can be applied from the hole inner surface of the second hole portion 14 near the boundary portion. 4 peel off. In addition, the printing paste 4 can reach the back surface 9 of the mask main body 7 of the second hole 14 in a state where it has been peeled off from the hole inner surface of the second hole 14 . Thus, according to the metal mask for printing of the present invention, since the printing paste 4 can be peeled off from the hole inner surface of the second hole portion 14 in the vicinity of the boundary portion of the two hole portions 13 and 14, compared with the conventional metal mask, The mask can reduce the contact area between the inner surface of the through hole 10 and the printing paste 4, and when the mask is separated from the printing object 2, the amount of printing paste 4 attached to the mask and removed from the printing object 2 can be reduced. Reduce capacity. As explained above, according to the metal mask for printing of the present invention, it is possible to suppress the occurrence of printing defects such as distortion of the printed shape of the printed layer on the printed object 2, printing fading, etc., so that printing accuracy can be achieved when the printed layer is formed by printing. The improvement of the method can form a high-precision and high-quality printing layer on the printing object 2.

若第1孔部13以直狀圓孔構成,第2孔部14以鐘形孔構成,則,比起第1孔部13及第2孔部14由具有角部的多角形孔形成的形態,能夠將通孔10的內表面形狀作成為不具有角部之圓滑的內表面形狀,因此,能夠進一步抑制印刷漿4附著於角部而造成印刷對象2上之印刷層的印刷形狀變得歪斜、印刷褪色等之印刷不良產生。If the first hole 13 is made of a straight circular hole and the second hole 14 is made of a bell-shaped hole, then, compared with the first hole 13 and the second hole 14 formed by polygonal holes with corners, , the inner surface shape of the through hole 10 can be made into a smooth inner surface shape without corners, so it can further prevent the printing paste 4 from adhering to the corners and causing the printed shape of the printed layer on the printing object 2 to become skewed , Printing fading and other poor printing.

當將遮罩本體7的厚度T設為1時,以第1孔部13的孔深度所規定的H1設定成0.2以上0.6以下為佳。這是因為孔深度H1未滿0.2或者孔深度H1超過0.6,則會產生印刷不良之故。更具體而言,若孔深度H1未滿0.2,則藉由第1孔部13的孔內表面之印刷漿4的導引效果變得不充分,當印刷時印刷漿4被朝意外的方向填充,造成印刷層的形狀變得歪斜,或印刷層褪色,其結果,產生印刷不良。又,若孔深度H1超過0.6,則印刷漿4附著於第1孔部13的孔內表面,其一部分與金屬遮罩被去除,造成印刷層的形狀變得歪斜,或印刷層褪色,其結果,產生印刷不良。When the thickness T of the mask body 7 is set to 1, H1 defined by the hole depth of the first hole portion 13 is preferably set to 0.2 or more and 0.6 or less. This is because the hole depth H1 is less than 0.2 or the hole depth H1 exceeds 0.6, and printing failure occurs. More specifically, if the hole depth H1 is less than 0.2, the guiding effect of the printing paste 4 by the hole inner surface of the first hole portion 13 becomes insufficient, and the printing paste 4 is filled in an unexpected direction during printing. , causing the shape of the printed layer to become distorted, or the printed layer to fade, and as a result, poor printing occurs. Also, if the hole depth H1 exceeds 0.6, the printing paste 4 adheres to the hole inner surface of the first hole portion 13, and part of it and the metal mask are removed, causing the shape of the printed layer to become distorted, or the printed layer to fade, and as a result , resulting in poor printing.

更理想為,當將遮罩本體7的厚度T設為1時,以第1孔部13的孔深度所規定的H1設定成0.2以上、未滿0.5為更佳,藉此,可抑制之後的印刷不良產生,能夠獲得大致良好之厚度的印刷層。More ideally, when the thickness T of the mask body 7 is set to 1, the H1 specified by the hole depth of the first hole portion 13 is set to be more than 0.2 and less than 0.5. Printing defects occur, and a printed layer with a substantially good thickness can be obtained.

當將第2孔部14的孔深度規定為H2、第2孔部14的擴大尺寸的一半規定為D3時,以符合不等式(H2<D3)的方式形成第2孔部14,則可將構成由鐘形孔所形成的第2孔部14的孔內表面之剖面形狀的曲率形成較大,因此,能夠促進第2孔部14處之印刷漿4的剝離。When the hole depth of the 2nd hole portion 14 is defined as H2, and half of the enlarged dimension of the 2nd hole portion 14 is defined as D3, the 2nd hole portion 14 is formed in a manner conforming to the inequality (H2<D3), then the constitution can be Since the curvature of the sectional shape of the hole inner surface of the 2nd hole part 14 formed by the bell-shaped hole is made large, peeling of the printing paste 4 in the 2nd hole part 14 can be accelerated|stimulated.

當將遮罩本體7的表面8處之第1孔部13的開口尺寸規定為D1、遮罩本體7的背面9處之第2孔部14的開口尺寸規定為D2時,開口尺寸D2設定為開口尺寸D1的1.5倍以上,則與前述同樣地,可將構成由鐘形孔所形成的第2孔部14的孔內表面之剖面形狀的曲率形成較大,因此,能夠促進第2孔部14處之印刷漿4的剝離。When the opening size of the first hole portion 13 at the surface 8 of the mask body 7 is specified as D1, and the opening size of the second hole portion 14 at the back side of the mask body 7 at 9 places is specified as D2, the opening size D2 is set as 1.5 times or more of the opening size D1, then similarly to the above, the curvature of the cross-sectional shape of the hole inner surface constituting the second hole 14 formed by the bell-shaped hole can be formed larger, so that the second hole can be promoted to be formed. Stripping of printing paste 4 at 14 places.

遮罩本體7的厚度T設定為25μm以下為佳。這是因為伴隨印刷用金屬遮罩的高精細化,第1孔部13的開口尺寸D1也微小化,但若遮罩本體7的厚度T超過25μm的話,則對於開口尺寸D1,通孔10的孔深度變大,因此,有藉由刮刀朝通孔10之印刷漿4的填充變得不充分之虞。The thickness T of the mask body 7 is preferably set to be 25 μm or less. This is because the opening size D1 of the first hole portion 13 is also miniaturized along with the high-definition metal mask for printing. Since the depth of the hole becomes large, filling of the printing paste 4 to the through hole 10 by the doctor blade may become insufficient.

若在通孔10的內表面及遮罩本體7的背面9,形成有抑制印刷漿4的附著之塗佈層17,則可圓滑地進行藉由第1孔部13之印刷漿4的導引、及第2孔部14處之印刷漿4的剝離。又,亦可採用以下的形態,亦即,當將形成於第1孔部13之塗佈層17的層厚規定為C1、將形成於第2孔部14之塗佈層17的層厚規定為C2、並將形成於遮罩本體7的背面9之塗佈層17的層厚規定為C3時,以符合不等式(C1≦C2≦C3)的方式,形成塗佈層17。在這樣的形態,藉由設定為塗佈層17的層厚C1為最小,能夠使規定印刷層的形狀之第1孔部13的開口徑D1的形狀變化變小。又,在這樣的形態,藉由將塗佈層17的層厚C3形成為較層厚C1、C2大,能夠更長期間維持因與印刷對象2的接觸而逐漸磨損之塗佈層17的效果。If the coating layer 17 that suppresses the adhesion of the printing paste 4 is formed on the inner surface of the through hole 10 and the back surface 9 of the mask body 7, the printing paste 4 can be smoothly guided through the first hole portion 13. , and the peeling off of the printing paste 4 at the second hole portion 14. In addition, the following form can also be adopted, that is, when the layer thickness of the coating layer 17 formed in the first hole portion 13 is specified as C1, and the layer thickness of the coating layer 17 formed in the second hole portion 14 is specified When C2 is defined and the layer thickness of the coating layer 17 formed on the back surface 9 of the mask body 7 is defined as C3, the coating layer 17 is formed so as to satisfy the inequality (C1≦C2≦C3). In such a form, by setting the layer thickness C1 of the coating layer 17 to be the smallest, it is possible to reduce the shape variation of the opening diameter D1 of the first hole portion 13 which defines the shape of the printed layer. Also, in such a form, by forming the layer thickness C3 of the coating layer 17 to be larger than the layer thicknesses C1 and C2, the effect of the coating layer 17 that is gradually worn away by the contact with the printing object 2 can be maintained for a longer period of time. .

(第1實施形態)圖1至圖4係顯示本發明的印刷用金屬遮罩之第1實施形態。再者,在各圖之厚度、寬度等的尺寸並非顯示實際的樣子,分別是示意地顯示。如圖3所示,印刷用金屬遮罩(以下僅稱為遮罩)1用來藉由網版印刷法來印刷形成印刷層,該印刷層為由用來將焊球暫時接著於形成在電路基板(印刷對象)2的表面的電極3上的助焊劑(印刷漿)4所構成。(First Embodiment) FIGS. 1 to 4 show a first embodiment of a metal mask for printing according to the present invention. In addition, dimensions such as thickness and width in each figure are not shown in actual form, but are shown schematically. As shown in FIG. 3 , a metal mask for printing (hereinafter simply referred to as a mask) 1 is used to print and form a printing layer by screen printing. The solder flux (printing paste) 4 on the electrode 3 on the surface of the substrate (printing object) 2 is constituted.

在圖2中,遮罩1是以由金屬薄板構成的遮罩本體7作為基座,在遮罩本體7開口有多數個通孔10,前述金屬薄板是以鎳、銅、鎳-鈷的鎳合金等所構成的電沉積金屬為材料,藉由電鑄法所形成,前述通孔是由將該遮罩本體的盤面從表面8朝背面9貫通的圓孔所形成。遮罩1形成為一邊250mm的正方形狀,當將該遮罩1分割成四個象限時,在各象限分別區劃有圖案形成區域M。通孔10以配設成與電路基板2的電極3對應的電極圖案之狀態,設在圖案形成區域M內。在圖案形成區域M的周圍,以包圍該區域M的方式,區劃有用來印刷切割標記的切割標記形成區域C,該切割標記為當在進行了網版印刷後的製程將電路基板2切割成規定形狀時所使用。遮罩1以單體或者框體固定於四周緣的狀態,裝設於網版印刷裝置的遮罩固定部。In Fig. 2, the mask 1 is based on the mask body 7 made of thin metal plates, and a plurality of through holes 10 are opened in the mask body 7. The aforementioned thin metal plates are made of nickel, copper, nickel-cobalt. Electrodeposited metal composed of alloy etc. is used as a material, and formed by electroforming, and the above-mentioned through hole is formed by a circular hole penetrating through the disk surface of the mask body from the front surface 8 to the back surface 9 . The mask 1 is formed in a square shape with 250 mm on one side, and when the mask 1 is divided into four quadrants, a pattern formation area M is defined in each quadrant. The through hole 10 is provided in the pattern forming region M in a state of being arranged in an electrode pattern corresponding to the electrode 3 of the circuit board 2 . Around the pattern forming area M, in a manner surrounding the area M, a dicing mark forming area C for printing a dicing mark for cutting the circuit board 2 into a predetermined pattern in a process after screen printing is defined. used for the shape. The mask 1 is attached to the mask fixing part of the screen printing apparatus in a state of being fixed to the periphery of a single body or a frame body.

如圖1所示,通孔10藉由朝遮罩本體7的表面8開口之第1孔部13、和朝遮罩本體7的背面9開口之第2孔部14構成。第1孔部13是由朝遮罩本體7的厚度方向延伸的直狀圓孔構成,第2孔部14是與第1孔部13圓滑地連續而由向下擴張的鐘形孔構成。As shown in FIG. 1 , the through hole 10 is composed of a first hole portion 13 opening toward the front surface 8 of the mask body 7 and a second hole portion 14 opening toward the back surface 9 of the mask body 7 . The first hole 13 is formed of a straight circular hole extending in the thickness direction of the mask body 7 , and the second hole 14 is formed of a bell-shaped hole extending downward smoothly continuous with the first hole 13 .

遮罩本體7的厚度T設定為25μm以下為佳,18μm以下為更佳。在本實施形態,遮罩本體7的厚度T設定為18μm。The thickness T of the mask body 7 is preferably set to be less than 25 μm, more preferably less than 18 μm. In this embodiment, the thickness T of the mask main body 7 is set to 18 μm.

當將遮罩本體7的厚度T設為1時,第1孔部13的孔深度H1(參照圖1)設定成0.2以上未滿0.5。本實施形態的孔深度H1設定為3.6μm,當將遮罩本體7的厚度T設定為1時的孔深度H1為0.2(3.6/18=0.2)。When the thickness T of the mask body 7 is set to 1, the hole depth H1 (see FIG. 1 ) of the first hole portion 13 is set to be 0.2 or more and less than 0.5. The hole depth H1 in this embodiment is set to 3.6 μm, and the hole depth H1 when the thickness T of the mask body 7 is set to 1 is 0.2 (3.6/18=0.2).

第1孔部13的開口尺寸,亦即,開口徑(直徑)D1(參照圖1)為設定成與要形成在電極3的助焊劑4的層之直徑尺寸相同。一般的助焊劑4的層之直徑尺寸,設定為20μm~50μm,因此,本實施形態的開口徑D1設定為40μm。第1孔部13的開口徑D1規定進行印刷形成的印刷層之平面形狀,在電極3上,形成有俯視視角呈圓形的印刷層。The opening size of the first hole 13 , that is, the opening diameter (diameter) D1 (see FIG. 1 ) is set to be the same as the diameter of the layer of flux 4 to be formed on the electrode 3 . Generally, the diameter of the layer of flux 4 is set at 20 μm to 50 μm, therefore, the opening diameter D1 of this embodiment is set at 40 μm. The opening diameter D1 of the first hole portion 13 defines the planar shape of the printed layer formed by printing, and the printed layer is formed on the electrode 3 with a circular shape in plan view.

第2孔部14的孔深度H2(參照圖1)為遮罩本體7的厚度T減去第1孔部13的孔深度H1後的尺寸,在本實施形態,設定為14.4μm。如前述說明,因當將遮罩本體7的厚度T設為1時的孔深度H1被設定為未滿0.5,所以,第1孔部13的孔深度H1與第2孔部14的孔深度H2之關係是以符合不等式(H1<H2)的方式進行設定。The hole depth H2 (see FIG. 1 ) of the second hole portion 14 is the thickness T of the mask body 7 minus the hole depth H1 of the first hole portion 13 , and is set to 14.4 μm in this embodiment. As described above, since the hole depth H1 when the thickness T of the mask body 7 is set to 1 is set to be less than 0.5, the hole depth H1 of the first hole portion 13 and the hole depth H2 of the second hole portion 14 The relationship is set in such a way as to satisfy the inequality (H1<H2).

第2孔部14的開口尺寸,亦即,開口徑(直徑)D2(參照圖1)設定成較開口徑D1大,在本實施形態,開口徑D2設定成開口徑D1的1.5倍以上。並且,第2孔部14的半徑的擴徑尺寸(開口的擴大尺寸的一半)D3設定成較孔深度H2大(H2<D3)。圖1中之擴徑尺寸D3係指開口徑D2減去開口徑D1後的值之一半((D2-D1)/2)。開口徑(直徑)D2理想為設定成50μm~100μm,本實施形態的開口徑D2設定成80μm。伴隨此,擴徑尺寸D3設定成20μm。在本實施形態,擴徑尺寸D3與孔深度H2之關係以符合不等式(H2<D3)的方式進行設定,因此,第2孔部14的內表面之剖面形狀形成為在遮罩本體7的厚度方向具有短軸之象限橢圓弧狀。又,第2孔部14的開口端與遮罩本體7的背面9圓滑地相連續。The opening size of the second hole 14, that is, the opening diameter (diameter) D2 (see FIG. 1 ) is set larger than the opening diameter D1, and in this embodiment, the opening diameter D2 is set to be 1.5 times or more the opening diameter D1. Furthermore, the enlarged diameter dimension (half the enlarged dimension of the opening) D3 of the radius of the second hole portion 14 is set to be larger than the hole depth H2 (H2<D3). The enlarged diameter dimension D3 in Fig. 1 refers to half of the value after subtracting the opening diameter D1 from the opening diameter D2 ((D2-D1)/2). The opening diameter (diameter) D2 is ideally set to 50 μm to 100 μm, and the opening diameter D2 in this embodiment is set to 80 μm. Along with this, the enlarged diameter dimension D3 is set to 20 μm. In this embodiment, the relationship between the enlarged diameter dimension D3 and the hole depth H2 is set in a manner that conforms to the inequality (H2<D3), therefore, the cross-sectional shape of the inner surface of the second hole portion 14 is formed to be equal to the thickness of the mask body 7 Orientation Quadrant elliptical arc with minor axis. In addition, the opening end of the second hole portion 14 is smoothly continuous with the back surface 9 of the mask body 7 .

本實施形態的電極3形成為圓形,當將電極3的直徑設為D4時,第1孔部13的開口徑D1形成為較直徑D4小,第2孔部14的開口徑D2形成為較直徑D4大,換言之,開口徑D1與開口徑D2形成為符合不等式(D1<D4<D2)(參照圖1)。The electrode 3 of the present embodiment is formed in a circular shape. When the diameter of the electrode 3 is D4, the opening diameter D1 of the first hole 13 is formed to be smaller than the diameter D4, and the opening diameter D2 of the second hole 14 is formed to be smaller than the diameter D4. The diameter D4 is large, in other words, the opening diameter D1 and the opening diameter D2 are formed so as to satisfy the inequality (D1<D4<D2) (see FIG. 1 ).

如圖1所示,在通孔10的孔內表面及遮罩本體7的背面9,形成有塗佈層17。塗佈層17係用來抑制助焊劑4附著至通孔10的孔內表面及遮罩本體7的背面9。第1孔部13處之塗佈層17的層厚C1、第2孔部14處之塗佈層17的層厚C2、及遮罩本體7的背面9處之塗佈層17的層厚C3設定為符合不等式(C1≦C2≦C3)。又,由於第1孔部13的孔內表面規定印刷層的形狀,故,該部分處之塗佈層17的層厚C1形成較其他部分薄,藉此,可使開口徑D1的形狀變化小,遮罩本體7的背面9在使用印刷用金屬遮罩1時與電路基板2接觸,因此,藉由將該部分處之塗佈層17的層厚C3形成較其他部分厚,可提升其耐久性。因此,塗佈層17的各層厚C1、C2、C3設定成符合不等式(C1≦C2≦C3)且符合式子(C1≠C3)。As shown in FIG. 1 , a coating layer 17 is formed on the inner surface of the through hole 10 and the back surface 9 of the mask body 7 . The coating layer 17 is used to prevent the flux 4 from adhering to the inner surface of the through hole 10 and the back surface 9 of the mask body 7 . The layer thickness C1 of the coating layer 17 at the first hole 13, the layer thickness C2 of the coating layer 17 at the second hole 14, and the layer thickness C3 of the coating layer 17 at the 9 back sides of the mask body 7 Set to satisfy the inequality (C1≦C2≦C3). Also, since the inner surface of the hole of the first hole portion 13 defines the shape of the printing layer, the layer thickness C1 of the coating layer 17 at this portion is formed thinner than other portions, whereby the shape change of the opening diameter D1 can be made small. The back surface 9 of the mask body 7 is in contact with the circuit board 2 when the metal mask 1 for printing is used. Therefore, by forming the layer thickness C3 of the coating layer 17 at this part thicker than other parts, its durability can be improved. sex. Therefore, the thicknesses C1, C2, and C3 of the coating layer 17 are set so as to satisfy the inequality (C1≦C2≦C3) and the expression (C1≠C3).

本實施形態之層厚C1設定為0.5μm,在層厚C2,其與第1孔部13鄰接部分設定為0.5μm,與遮罩本體7的背面9鄰接部分設定為1.0μm,層厚C3設定為1.0μm。第2孔部14處之塗佈層17的層厚C2形成為從第1孔部13側朝遮罩本體7的背面9側逐漸變厚,作為無階差部之光滑的塗佈層17。塗佈層17可藉由浸漬形成或噴霧塗佈加以形成。再者,本實施形態的塗佈層17是以微米級(μm)形成,但,亦可藉由nm等級形成塗佈層17。The layer thickness C1 of this embodiment is set to 0.5 μm, and in the layer thickness C2, the portion adjacent to the first hole 13 is set to 0.5 μm, and the portion adjacent to the back surface 9 of the mask body 7 is set to 1.0 μm, and the layer thickness C3 is set to 1.0 μm. The layer thickness C2 of the coating layer 17 at the second hole portion 14 is formed gradually thicker from the first hole portion 13 side toward the back surface 9 side of the mask body 7, as a smooth coating layer 17 without a step. The coating layer 17 can be formed by dipping or spray coating. Furthermore, the coating layer 17 in this embodiment is formed on the order of microns (μm), but the coating layer 17 may also be formed on the order of nm.

又,塗佈層17亦可設定成符合不等式(C1<C2<C3)。具體而言,當層厚C3設為1時,層厚C1設定成未滿0.5,層厚C2設定成超過0.5且未滿1。In addition, the coating layer 17 may also be set so as to satisfy the inequality (C1<C2<C3). Specifically, when the layer thickness C3 is 1, the layer thickness C1 is set to be less than 0.5, and the layer thickness C2 is set to be more than 0.5 and less than 1.

遮罩本體7的表面8構成刮刀面,當進行由助焊劑4構成的印刷層之印刷形成時,使遮罩本體7的背面9與電路基板2的表面相面對,並使電極3與通孔10相對位之狀態下,將兩者(遮罩1、電路基板2)密接。印刷是藉由以刮刀S刮載置於刮刀面(表面8)上的助焊劑4,將助焊劑4填充至通孔10及切割標記用開口,使得在電路基板2的表面,形成與通孔10及切割標記匹配之由助焊劑4構成的印刷層。刮刀S在其前端與刮刀面(遮罩本體7的表面8)接觸的狀態下,從遮罩1的正前方(面向圖2為下側)向深部側(面向圖2為上側)一邊移動一邊印刷形成印刷層。The surface 8 of the mask body 7 constitutes the scraper surface, and when the printing of the printing layer made of the flux 4 is performed, the back surface 9 of the mask body 7 faces the surface of the circuit board 2, and the electrode 3 is connected to the communication layer. In the state where the holes 10 are facing each other, the two (the mask 1 and the circuit board 2) are closely connected. Printing is to scrape the flux 4 placed on the scraper surface (surface 8) with a scraper S, and fill the flux 4 into the through hole 10 and the opening for cutting marks, so that the through hole is formed on the surface of the circuit board 2. 10 and the printing layer made of flux 4 matching the cutting marks. The scraper S moves from the front of the mask 1 (the lower side in FIG. 2 ) to the deep side (the upper side in FIG. 2 ) while its front end is in contact with the scraper surface (the surface 8 of the mask body 7 ). Printing forms the print layer.

印刷時之助焊劑4從遮罩本體7的表面8填充至第1孔部13的內部。侵入至通孔10的助焊劑4被第1孔部13的孔內表面導引,在填充方向為遮罩本體7的厚度方向,亦即,向朝電極3之方向落入的狀態下侵入。侵入至通孔10的內部之助焊劑4,在第1孔部13與第2孔部14之邊界部分從第2孔部14剝離而朝向電極3,到達了遮罩本體7的背面9之助焊劑4接觸電極3上,形成如圖3所示的由助焊劑4所構成的印刷層。The flux 4 during printing is filled from the surface 8 of the mask body 7 to the inside of the first hole 13 . The flux 4 that has penetrated into the through hole 10 is guided by the inner surface of the first hole portion 13 , and penetrates in a state where the filling direction is the thickness direction of the mask body 7 , that is, falls toward the electrode 3 . The flux 4 intruded into the inside of the through hole 10 is peeled off from the second hole 14 at the boundary portion between the first hole 13 and the second hole 14 and goes toward the electrode 3 and reaches the back surface 9 of the mask body 7. The flux 4 is in contact with the electrode 3 to form a printed layer composed of the flux 4 as shown in FIG. 3 .

圖4顯示實施形態之遮罩1的製造方法。 (圖案結構製程) 如圖4(a)所示,對具有導電性之例如不銹鋼、黃銅製的母模21之表面全體,形成預定厚度的光阻劑層22後,使具有與通孔10對應的圓形及與切割標記對應的線狀的透光孔之由玻璃遮罩構成的圖案薄膜23密接。在此狀態下,照射紫外線光而進行曝光,進行顯像、乾燥之各種處理。在此所稱的光阻劑層22,將一片或複數片的負型的薄片狀感光性乾膜光阻劑層積並進行熱壓合固定而形成,成為預定的厚度。其次,藉由將未曝光部分的光阻劑層22予以溶解去除,如圖4(b)所示,獲得具有與通孔10和切割標記對應的光阻劑體24之圖案光阻劑25。 FIG. 4 shows a manufacturing method of the mask 1 of the embodiment. (pattern structure process) As shown in Figure 4 (a), after forming a photoresist layer 22 with a predetermined thickness on the entire surface of a conductive master mold 21 such as stainless steel or brass, make a circular shape corresponding to the through hole 10 and a The linear light-transmitting holes corresponding to the cutting marks are in close contact with the patterned film 23 made of a glass mask. In this state, exposure is performed by irradiating ultraviolet light, and various processes such as development and drying are performed. The photoresist layer 22 referred to here is formed by laminating one or a plurality of sheets of negative-type sheet-shaped photosensitive dry film photoresist and fixing them by thermocompression bonding to have a predetermined thickness. Next, by dissolving and removing the photoresist layer 22 of the unexposed part, as shown in FIG.

(電鑄製程) 置入到製作有形成前述圖案光阻劑25的母模21之電鑄槽,如圖4(c)所示,在不會超過光阻劑體24的上端緣的範圍下,進行電沉積金屬的電沉積,形成電鑄層26,亦即,形成作為遮罩本體7之層。此時,因電鑄金屬的成長前端之緣部成長為象限橢圓弧狀,所以,僅在母模21上進行電沉積金屬的電沉積,即可形成鐘形的第2孔部14。 (Electroforming process) Put it into the electroforming tank of the master mold 21 that forms the photoresist 25 of the aforementioned pattern, as shown in Figure 4 (c), under the range that will not exceed the upper edge of the photoresist body 24, carry out electrodeposition metal Electrodeposition, forming an electroformed layer 26, that is, forming a layer as a mask body 7. At this time, since the edge of the growing front end of the electroformed metal grows into a quadrant elliptical arc shape, the bell-shaped second hole 14 can be formed only by electrodepositing the electrodeposited metal on the master mold 21 .

(剝離製程) 如圖4(d)所示,從母模21將電鑄層26、和圖案光阻劑25剝離,並且將圖案光阻劑25溶解去除,藉此,獲得如圖3所示的遮罩1。再者,亦可在所獲得的遮罩本體7的外周緣藉由接著劑接著框體,作成為遮罩本體7與框體不可分離地接合之具備框體的遮罩1。 (Peel-off process) As shown in Figure 4(d), the electroformed layer 26 and the patterned photoresist 25 are peeled off from the master mold 21, and the patterned photoresist 25 is dissolved and removed, thereby obtaining the mask 1 as shown in Figure 3 . Furthermore, the outer peripheral edge of the obtained mask body 7 may be bonded to the frame by an adhesive to make the mask 1 with the frame in which the mask body 7 and the frame are inseparably bonded.

如以上所述,在本實施形態的遮罩1,因朝遮罩本體7的表面8開口之第1孔部13以直孔構成,所以,能夠將當朝通孔10進行填充時之助焊劑4的流動方向以朝垂直方向延伸的第1孔部13的孔內表面進行導引,可使助焊劑4確實地落入至遮罩本體7的厚度方向(垂直方向)。又,將第2孔部14以內表面的剖面形狀形成為R形,且以與第1孔部13圓滑地連續且擴大而開口於遮罩本體7的背面9的鐘形孔構成,因此,助焊劑4被第1孔部13的孔內表面導引而到達兩孔部13、14的邊界部分附近時,可在該邊界部分附近,從第2孔部14的孔內表面使助焊劑4剝離。又,在已經從第2孔部14的孔內表面剝離的狀態下,可使助焊劑4到達第2孔部14的遮罩本體7之背面9側。如此,若依據本實施形態的遮罩1,因可在兩孔部13、14的邊界部分附近,從第2孔部14的孔內表面使助焊劑4剝離,所以,比起以往的金屬遮罩,可將通孔10的孔內表面與助焊劑4之接觸面積縮小,在將遮罩1從電路基板2分離時,可將附著於遮罩1而從電路基板2去除之助焊劑4的量減容。如以上說明,若依據本實施形態的遮罩1,可抑制電路基板2上之印刷層的印刷形狀歪斜、印刷褪色等之印刷不良產生,所以,可謀求當印刷形成印刷層時之印刷精度的提升,能夠在電路基板2上形成高精度且高品質之印刷層。As described above, in the mask 1 of the present embodiment, since the first hole 13 opening toward the surface 8 of the mask body 7 is constituted by a straight hole, it is possible to dissipate the flux when filling the through hole 10. The flow direction of flux 4 is guided by the inner surface of the first hole portion 13 extending in the vertical direction, so that the flux 4 can surely fall into the thickness direction (vertical direction) of the mask body 7 . Also, the second hole 14 is formed in an R-shaped cross-sectional shape on the inner surface, and is formed as a bell-shaped hole that is smoothly continuous with the first hole 13 and expanded to open on the back surface 9 of the mask body 7. When the flux 4 is guided by the inner surface of the first hole 13 and reaches the vicinity of the boundary between the two holes 13 and 14, the flux 4 can be peeled off from the inner surface of the second hole 14 near the boundary. . In addition, the flux 4 can reach the back surface 9 side of the mask main body 7 of the second hole 14 in a state where it has been peeled off from the hole inner surface of the second hole 14 . Thus, according to the mask 1 of this embodiment, since the flux 4 can be peeled off from the hole inner surface of the second hole portion 14 in the vicinity of the boundary portion of the two hole portions 13 and 14, compared with the conventional metal mask The mask can reduce the contact area between the inner surface of the through hole 10 and the flux 4, and when the mask 1 is separated from the circuit board 2, the amount of the flux 4 attached to the mask 1 and removed from the circuit board 2 can be reduced. volume reduction. As described above, according to the mask 1 of this embodiment, printing defects such as distortion of the printed shape of the printed layer on the circuit board 2 and printing fading can be suppressed, so that the printing accuracy can be improved when the printed layer is formed by printing. As a result, a high-precision and high-quality printed layer can be formed on the circuit board 2 .

又,若依據藉由以直狀圓孔構成的第1孔部13、以鐘形孔構成的第2孔部14所構成之通孔10,則能夠將通孔10的內表面形狀作成為不具有角部之圓滑的內表面形狀,因此,能夠進一步抑制助焊劑4附著於角部而造成電路基板2上之印刷層的印刷形狀變得歪斜、印刷褪色等之印刷不良產生。Also, according to the through hole 10 constituted by the first hole portion 13 constituted by a straight circular hole and the second hole portion 14 constituted by a bell-shaped hole, the inner surface shape of the through hole 10 can be made different. The rounded inner surface shape of the corners can further suppress printing failures such as distortion of the printed shape of the printed layer on the circuit board 2 and fading of the printing caused by the adhesion of the flux 4 to the corners.

當將遮罩本體7的厚度T設為1時,以第1孔部13的孔深度所規定的H1設定成0.2以上0.6以下為佳。這是因為孔深度H1未滿0.2或者孔深度H1超過0.6,則會產生印刷不良之故。更具體而言,若孔深度H1未滿0.2,則藉由第1孔部13的孔內表面之助焊劑4的導引效果變得不充分,當印刷時助焊劑4被朝意外的方向填充,造成印刷層的形狀變得歪斜,或印刷層褪色,其結果,產生印刷不良。又,若孔深度H1超過0.6,則助焊劑4附著於第1孔部13的孔內表面,其一部分與金屬遮罩被去除,造成印刷層的形狀變得歪斜,或印刷層褪色,其結果,產生印刷不良。When the thickness T of the mask body 7 is set to 1, H1 defined by the hole depth of the first hole portion 13 is preferably set to 0.2 or more and 0.6 or less. This is because the hole depth H1 is less than 0.2 or the hole depth H1 exceeds 0.6, and printing failure occurs. More specifically, if the hole depth H1 is less than 0.2, the guiding effect of the flux 4 by the inner surface of the first hole 13 becomes insufficient, and the flux 4 is filled in an unexpected direction during printing. , causing the shape of the printed layer to become distorted, or the printed layer to fade, and as a result, poor printing occurs. Also, if the hole depth H1 exceeds 0.6, the flux 4 adheres to the hole inner surface of the first hole portion 13, and part of it and the metal mask are removed, causing the shape of the printed layer to become distorted, or the printed layer to fade, and as a result , resulting in poor printing.

且,當將遮罩本體7的厚度T設為1時,以第1孔部13的孔深度所規定的H1設定成0.2以上、未滿0.5為更佳,藉此,可抑制之後的印刷不良產生,能夠獲得大致良好之厚度的印刷層。Moreover, when the thickness T of the mask body 7 is set to 1, it is more preferable to set H1 specified by the hole depth of the first hole portion 13 to 0.2 or more and less than 0.5, thereby suppressing subsequent printing failures. Produced, a printing layer with a substantially good thickness can be obtained.

當以第2孔部14的孔深度H2、第2孔部14的半徑之擴徑尺寸D3符合不等式(H2<D3)的方式形成第2孔部14時,則可將構成由鐘形孔所形成的第2孔部14的孔內表面之剖面形狀的曲率形成較大,因此,能夠促進第2孔部14處之助焊劑4的剝離。When forming the second hole portion 14 in such a way that the hole depth H2 of the second hole portion 14 and the enlarged diameter dimension D3 of the radius of the second hole portion 14 conform to the inequality (H2<D3), then the structure can be formed by the bell-shaped hole. The curvature of the cross-sectional shape of the hole inner surface of the formed second hole portion 14 is large, so that the peeling of the flux 4 at the second hole portion 14 can be accelerated.

因將第2孔部14的開口徑D2設定為第1孔部13的開口徑D1之1.5倍以上,所以,與前述同樣地,可將構成由鐘形孔所形成的第2孔部14的孔內表面之剖面形狀的曲率形成較大,能夠促進第2孔部14處之助焊劑4的剝離。Because the opening diameter D2 of the second hole portion 14 is set to be more than 1.5 times the opening diameter D1 of the first hole portion 13, it is possible to configure the second hole portion 14 formed by the bell-shaped hole in the same manner as described above. The curvature of the cross-sectional shape of the inner surface of the hole is formed relatively large, which can promote the peeling of the flux 4 at the second hole portion 14 .

伴隨遮罩1的高精細化,第1孔部13的開口徑D1也微小化,但若遮罩本體7的厚度T變大的話,則對於開口徑D1,通孔10的孔深度變大,因此,有藉由刮刀朝通孔10之助焊劑4的填充變得不充分之虞。在本實施形態,因將遮罩本體7的厚度T設定為25μm以下(18μm),所以,不會產生前述這樣的問題,能夠避免藉由刮刀朝通孔10之助焊劑4的填充變得不充分的問題。The opening diameter D1 of the first hole portion 13 is also miniaturized as the mask 1 becomes more high-definition. However, if the thickness T of the mask body 7 becomes larger, the hole depth of the through hole 10 becomes larger with respect to the opening diameter D1. Therefore, there is a possibility that the filling of the flux 4 to the through hole 10 by the scraper becomes insufficient. In this embodiment, since the thickness T of the mask body 7 is set to be 25 μm or less (18 μm), the above-mentioned problems will not occur, and it can be avoided that the filling of the flux 4 toward the through hole 10 by the scraper becomes insufficient. full question.

因在通孔10的內表面及遮罩本體7的背面9,形成有抑制助焊劑4的附著之塗佈層17,所以,可圓滑地進行藉由第1孔部13之助焊劑4的導引、及第2孔部14處之助焊劑4的剝離。又,在塗佈層17的各層厚C1、C2、C3符合不等式(C1≦C2≦C3)的狀態下,將層厚C1設定為最小,因此,能夠使規定印刷層的形狀之第1孔部13的開口徑D1的形狀變化變小。又,因將層厚C3形成為最大,所以,能夠更長期間維持因與電路基板2的接觸而逐漸磨損之塗佈層17的效果。Because the coating layer 17 that suppresses the adhesion of the flux 4 is formed on the inner surface of the through hole 10 and the back surface 9 of the mask body 7, the flux 4 can be smoothly guided through the first hole 13. lead, and the peeling of the flux 4 at the second hole portion 14. In addition, in the state where the respective layer thicknesses C1, C2, and C3 of the coating layer 17 conform to the inequality (C1≦C2≦C3), the layer thickness C1 is set to be the minimum, so that the first hole portion that defines the shape of the printed layer can be The shape change of the opening diameter D1 of 13 becomes small. In addition, since the layer thickness C3 is formed to the maximum, the effect of the coating layer 17 which is gradually worn away due to contact with the circuit board 2 can be maintained for a longer period of time.

從以上說明可知,本實施形態之印刷用金屬遮罩,可貢獻於聯合國所提倡之永續發展目標(SDGs:Sustainable Development Goals)的目標9(建設具有韌性的基礎設施,促進包容性和永續的工業化,推動創新)及目標12(確保採用永續的消費和生產模式)者。As can be seen from the above description, the metal mask for printing in this embodiment can contribute to goal 9 of the Sustainable Development Goals (SDGs: Sustainable Development Goals) advocated by the United Nations (building resilient infrastructure, promoting inclusiveness and sustainable development) industrialization and promote innovation) and Goal 12 (ensure sustainable consumption and production patterns).

(第2實施形態)圖5係顯示本發明的印刷用金屬遮罩之第2實施形態。在本實施形態,通孔10的形狀與第1實施形態不同。再者,在圖5中,將塗佈層17省略而圖示,又,在圖5(b)中,顯示第1孔部13的四角形中的一外側的圓角四角形的線是用來顯示開口於遮罩本體7的背面9側之第2孔部14的開口端之線。(Second Embodiment) FIG. 5 shows a second embodiment of the printing metal mask of the present invention. In this embodiment, the shape of the through hole 10 is different from that of the first embodiment. Moreover, in FIG. 5, the coating layer 17 is omitted and shown in the figure. In FIG. The line of the opening end of the second hole portion 14 opened on the back surface 9 side of the mask body 7 .

通孔10構成為將開口於遮罩本體7的表面8之第1孔部13作成直狀的正方形孔(矩形孔),並將開口於遮罩本體7的背面9之第2孔部14作成與第1孔部13圓滑地連續且擴大,且其內表面的剖面形狀形成為R形。第2孔部14的內表面之剖面形狀,亦包含在底面視角之第2孔部14的四角落部分的象限圓狀的區域,形成為在遮罩本體7的厚度方向具有短軸之象限橢圓弧狀。如此,通孔10可為矩形,又,亦可為多角形,由矩形或多角形的孔構成之通孔10,亦可將其角部圓化。通孔10亦可形成為橢圓狀。The through hole 10 is constituted by making the first hole 13 opening on the surface 8 of the mask body 7 a straight square hole (rectangular hole), and making the second hole 14 opening on the back surface 9 of the mask body 7 It is smoothly continuous and enlarged with the first hole portion 13 , and the cross-sectional shape of the inner surface thereof is formed in an R shape. The cross-sectional shape of the inner surface of the second hole 14 also includes quadrant circular regions at the four corners of the second hole 14 viewed from the bottom surface, and is formed as a quadrant ellipse having a minor axis in the thickness direction of the mask body 7. arc. Thus, the through-hole 10 may be rectangular or polygonal, and the through-hole 10 formed of a rectangular or polygonal hole may have its corners rounded. The through hole 10 may also be formed in an oval shape.

當將本實施形態之構成第1孔部13的正方形孔的一邊之長度作為第1孔部13的開口尺寸D1時,該開口尺寸D1與先前之第1實施形態的第1孔部13之開口徑D1相同。在此條件下,比起第1實施形態,本實施形態之開口於遮罩本體7的表面8之第1孔部13的開口面積為變大約1.3倍。因此,在不易將開口徑(開口尺寸)D1形成較大的印刷用金屬遮罩1,欲在電極3上印刷更多的助焊劑4之情況,本實施形態這樣的開口形狀之第1孔部13極為有效。又,對於電極3構成為四角形狀(矩形、多角形狀)之情況亦為有效。When the length of one side of the square hole constituting the first hole portion 13 of the present embodiment is taken as the opening size D1 of the first hole portion 13, the opening size D1 is different from the opening size of the first hole portion 13 of the previous first embodiment. The caliber D1 is the same. Under this condition, compared with the first embodiment, the opening area of the first hole portion 13 opening on the surface 8 of the mask body 7 of the present embodiment is approximately 1.3 times larger. Therefore, in the case where it is difficult to form the metal mask 1 for printing with a large opening diameter (opening size) D1, and it is desired to print more flux 4 on the electrode 3, the first hole portion with the opening shape of this embodiment 13 is extremely effective. Moreover, it is also effective for the case where the electrode 3 is comprised in the square shape (rectangular shape, polygonal shape).

(第3實施形態)圖6係顯示本發明的印刷用金屬遮罩之第3實施形態。在本實施形態,通孔10的結構與第1實施形態不同。具體而言,將第1實施形態之第2孔部作為遮罩本體的表面側,將第1孔部作為遮罩本體的背面側之形態。再者,在圖6中,將塗佈層17省略而進行圖示。(Third Embodiment) FIG. 6 shows a third embodiment of the printing metal mask of the present invention. In this embodiment, the structure of the through hole 10 is different from that of the first embodiment. Specifically, in the first embodiment, the second hole portion is used as the front side of the mask body, and the first hole portion is used as the back side of the mask body. In addition, in FIG. 6, the coating layer 17 is abbreviate|omitted and shown in figure.

本實施形態之通孔10藉由開口於遮罩本體7的表面(刮刀面)8之第1孔部13、和開口於遮罩本體7的背面(電路基板對向面)9之第2孔部14構成。第2孔部14是由朝遮罩本體7的厚度方向延伸的直狀圓孔構成,第1孔部13是與第2孔部14圓滑地連續而由向上擴張的鐘形孔構成,且其內表面的剖面形狀為R形。如此,若朝遮罩本體7的表面8開口之第1孔部13以鐘形孔構成,則能夠將當朝通孔10進行填充時之印刷漿以剖面形狀為R形的第1孔部13的孔內表面進行導引,因此,可使該印刷漿4確實地誘至通孔10內。又,連接於第1孔部13的第2孔部14形成為直狀,與第1孔部13圓滑地連續且開口於遮罩本體7的背面9,因此,印刷漿4被第1孔部13的孔內表面導引而到達兩孔部13、14的邊界部分附近,朝第2孔部14內導引、填充,可使印刷漿4到達第2孔部14的遮罩本體7之背面9側。如此,若依據本實施形態的印刷用金屬遮罩,因被第1孔部13所導引的印刷漿4在兩孔部13、14的邊界部分附近集結,朝第2孔部14的孔內導引,所以,即使印刷漿4與通孔10的孔內表面接觸,也能將其朝印刷對象2導引。如以上說明,若依據本實施形態的印刷用金屬遮罩,可抑制印刷對象2上之印刷層的印刷形狀歪斜、印刷褪色等之印刷不良產生,所以,可謀求當印刷形成印刷層時之印刷精度的提升,能夠在印刷對象2上形成高精度且高品質之印刷層。The through hole 10 of this embodiment is formed by the first hole 13 opened on the surface (scraper surface) 8 of the mask body 7 and the second hole opened on the back surface (circuit board facing surface) 9 of the mask body 7. Section 14 constitutes. The second hole portion 14 is made of a straight circular hole extending in the thickness direction of the mask body 7, and the first hole portion 13 is smoothly continuous with the second hole portion 14 and constituted by an upwardly expanding bell-shaped hole, and its The cross-sectional shape of the inner surface is R-shaped. In this way, if the first hole portion 13 opening toward the surface 8 of the mask body 7 is configured as a bell-shaped hole, the printing paste when filling the through hole 10 can be formed in the R-shaped first hole portion 13 in cross-section. The inner surface of the hole is guided, so that the printing paste 4 can be surely drawn into the through hole 10 . Also, the second hole portion 14 connected to the first hole portion 13 is formed in a straight shape, smoothly continuous with the first hole portion 13 and opened on the back surface 9 of the mask body 7, so the printing paste 4 is covered by the first hole portion. The inner surface of the hole of 13 is guided to reach the vicinity of the boundary portion of the two hole portions 13 and 14, guided and filled in the second hole portion 14, so that the printing paste 4 can reach the back side of the mask body 7 of the second hole portion 14 9 sides. In this way, according to the printing metal mask of the present embodiment, the printing paste 4 guided by the first hole portion 13 gathers near the boundary portion of the two hole portions 13 and 14, and moves toward the inside of the second hole portion 14. Therefore, even if the printing paste 4 comes into contact with the hole inner surface of the through hole 10, it can be guided toward the printing object 2. As described above, according to the metal mask for printing of this embodiment, printing defects such as distortion of the printed shape of the printed layer on the printing object 2 and printing fading can be suppressed, so that printing can be achieved when the printed layer is formed by printing. The improvement of precision can form a high-precision and high-quality printing layer on the printing object 2 .

在本發明的印刷用金屬遮罩,在形成塗佈層17的情況,形成於遮罩本體7的背面(電路基板對向面)9為佳。又,在將塗佈層17形成於通孔10的孔內表面之情況,僅形成於第2孔部14的孔內表面為佳。這是因為若將塗佈層17形成於遮罩本體7的表面(刮刀面)8、或第1孔部13的孔內表面,則當刮刀S刮印刷漿4時,有印刷漿4無法轉動而不能進行良好的印刷(朝通孔10內之導引、填充)之虞。再者,在將塗佈層17形成於遮罩本體7的背面9及第2孔部14的孔內表面的情況,遮罩本體7的背面9之塗佈層17的厚度形成大於第2孔部14的孔內表面之塗佈層17的厚度為佳。又,在第1實施形態之印刷用金屬遮罩,第1孔部13的開口尺寸(開口徑)D1形成為較電極3的長度尺寸(直徑)D4小,第2孔部14的開口尺寸(開口徑)D2形成為電極3的長度尺寸(直徑)D4大,藉由依據這樣的結構而印刷於印刷對象2上之印刷層的形狀,係形成為從上表面側到下表面側與第1孔部13的開口尺寸(開口徑)D1相同尺寸之柱狀體、或者上表面側尺寸與第1孔部13的開口尺寸(開口徑)D1相同且尺寸隨著朝向下表面側(印刷對象2側)逐漸擴大之剖面山型形狀。另一方面,本實施形態之印刷用金屬遮罩,第1孔部13的開口尺寸(開口徑)D1形成為較電極3的長度尺寸(直徑)D4大,第2孔部14的開口尺寸(開口徑)D2形成為較電極3的長度尺寸(直徑)D4小,藉由這樣的結構而印刷於印刷對象2上之印刷層的形狀,係形成為印刷漿4被填充於通孔10內而從上表面側到下表面側與第2孔部14的開口尺寸(開口徑)D2相同尺寸之柱狀體。如此,本實施形態的印刷用金屬遮罩,藉由開口於該遮罩的背面9之第2孔部14形成為直狀,即使對通孔10內填充印刷漿4而該印刷漿4與通孔10的孔內表面全體接觸,當將本印刷用金屬遮罩從印刷對象2分離時,也能將位於第2孔部14的孔內表面之印刷漿4印刷於印刷對象2上,比起通孔內表面之剖面形狀為R形的金屬遮罩,能夠使附著於通孔10的孔內表面而從印刷對象2被去除之印刷漿4的量減少。因此,若依據本實施形態的印刷用金屬遮罩,能夠印刷形成在印刷對象2上之印刷層的厚度均等且再現性高之印刷層。In the metal mask for printing of the present invention, when the coating layer 17 is formed, it is preferably formed on the back surface (circuit board facing surface) 9 of the mask main body 7 . Also, when the coating layer 17 is formed on the hole inner surface of the through hole 10, it is preferably formed only on the hole inner surface of the second hole portion 14. This is because if the coating layer 17 is formed on the surface (squeegee surface) 8 of the mask body 7, or the hole inner surface of the first hole portion 13, when the scraper S scrapes the printing paste 4, the printing paste 4 cannot rotate. There is a risk that good printing (guiding and filling into the through hole 10 ) cannot be performed. Furthermore, when the coating layer 17 is formed on the back surface 9 of the mask body 7 and the hole inner surface of the second hole portion 14, the thickness of the coating layer 17 on the back surface 9 of the mask body 7 is formed larger than that of the second hole. The thickness of the coating layer 17 on the inner surface of the hole of the portion 14 is preferable. In addition, in the metal mask for printing according to the first embodiment, the opening dimension (diameter) D1 of the first hole 13 is formed smaller than the length dimension (diameter) D4 of the electrode 3, and the opening dimension (diameter) of the second hole 14 ( The opening diameter) D2 is formed so that the length dimension (diameter) D4 of the electrode 3 is large, and the shape of the printing layer printed on the printing object 2 by such a structure is formed from the upper surface side to the lower surface side and the first The opening size (opening diameter) D1 of the hole 13 is the same as the columnar body, or the size of the upper surface side is the same as the opening size (opening diameter) D1 of the first hole 13, and the size increases toward the lower surface side (printing object 2 Side) The gradually expanding cross-sectional mountain shape. On the other hand, in the metal mask for printing of this embodiment, the opening size (opening diameter) D1 of the first hole 13 is formed larger than the length (diameter) D4 of the electrode 3, and the opening size (diameter) of the second hole 14 ( The opening diameter) D2 is formed to be smaller than the length dimension (diameter) D4 of the electrode 3, and the shape of the printing layer printed on the printing object 2 by such a structure is formed so that the printing paste 4 is filled in the through hole 10. A columnar body having the same size as the opening size (opening diameter) D2 of the second hole 14 from the upper surface side to the lower surface side. In this way, the metal mask for printing of this embodiment is formed in a straight shape by opening the second hole portion 14 on the back surface 9 of the mask. The entire inner surface of the hole 10 is in contact with each other. When the metal mask for printing is separated from the printing object 2, the printing paste 4 located on the inner surface of the hole of the second hole portion 14 can also be printed on the printing object 2. Compared with The cross-sectional shape of the inner surface of the through hole is an R-shaped metal mask, which can reduce the amount of printing paste 4 attached to the inner surface of the through hole 10 and removed from the printing object 2 . Therefore, according to the metal mask for printing of this embodiment, the printed layer formed on the printed object 2 can be printed with uniform thickness and high reproducibility.

在前述實施形態,將第2孔部14的內表面之剖面形狀形成為在遮罩本體7的厚度方向具有短軸之象限橢圓弧狀,但,亦可形成為在遮罩本體7的厚度方向具有長軸之象限橢圓弧狀、或圓弧狀。亦即,第2孔部14的內表面之剖面形狀為朝孔中心側突出之R形狀。例如,第2孔部14的內表面之剖面形狀,亦可為第1孔部13附近及遮罩本體7的背面9附近之曲率大、其中間部分之曲率小的R形狀這種曲率在第1孔部13與遮罩本體7的背面9之間改變的R形狀。又,在前述實施形態,將印刷用金屬遮罩1直接載置於印刷對象2上進行印刷之接觸式印刷,但,亦可為在印刷對象2與印刷用金屬遮罩1之間設置間距而進行印刷之非接觸式印刷。本發明的技術,不限於印刷用金屬遮罩,亦可轉用於蒸鍍用遮罩、焊球排列用遮罩、焊球吸附用遮罩等之金屬遮罩。In the aforementioned embodiment, the cross-sectional shape of the inner surface of the second hole 14 is formed into a quadrant elliptical arc shape having a minor axis in the thickness direction of the mask body 7, but it may also be formed so that Quadrant ellipse arc or arc with long axis. That is, the cross-sectional shape of the inner surface of the second hole portion 14 is an R-shape protruding toward the hole center side. For example, the cross-sectional shape of the inner surface of the second hole portion 14 can also be an R shape in which the curvature near the first hole portion 13 and the back surface 9 of the mask body 7 is large, and the curvature of the middle portion is small. 1 The R shape that changes between the hole portion 13 and the back surface 9 of the mask body 7. Also, in the aforementioned embodiment, the printing metal mask 1 is directly placed on the printing object 2 to perform contact printing, but it is also possible to provide a distance between the printing object 2 and the printing metal mask 1. Non-contact printing for printing. The technology of the present invention is not limited to metal masks for printing, but can also be transferred to metal masks such as vapor deposition masks, solder ball arrangement masks, and solder ball adsorption masks.

1:印刷用金屬遮罩 2:印刷對象(電路基板) 4:印刷物(助焊劑、漿料) 7:遮罩本體 8:遮罩本體的表面 9:遮罩本體的背面 10:通孔 13:第1孔部 14:第2孔部 17:塗佈層 D1:第1孔部的開口尺寸(開口徑) D2:第2孔部的開口尺寸(開口徑) D3:第2孔部的開口的擴大尺寸之一半(半徑的擴徑尺寸) D4:電極的長度尺寸(直徑) D5:第1孔部的開口的擴大尺寸之一半(半徑的擴徑尺寸) H1:第1孔部的孔深度 H2:第2孔部的孔深度 T:遮罩本體的厚度 1: Metal mask for printing 2: Printing object (circuit board) 4: Printing (flux, paste) 7: Mask body 8: Mask the surface of the body 9: Mask the back of the body 10: Through hole 13: The first hole 14: The second hole 17: Coating layer D1: Opening size of the first hole (opening diameter) D2: Opening size of the second hole (opening diameter) D3: One half of the enlarged dimension of the opening of the second hole (diameter enlarged dimension of the radius) D4: The length dimension (diameter) of the electrode D5: One half of the enlarged dimension of the opening of the first hole (diameter enlarged dimension of the radius) H1: Hole depth of the first hole H2: Hole depth of the second hole T: Thickness of the mask body

[圖1]係顯示本發明的第1實施形態之印刷用金屬遮罩的主要部分之縱斷正面圖。 [圖2]係顯示印刷用金屬遮罩全體之平面圖。 [圖3]係顯示印刷用金屬遮罩的使用態樣例之縱斷側面圖。 [圖4]係顯示印刷用金屬遮罩的製造製程之說明圖。 [圖5]係顯示本發明的第2實施形態之印刷用金屬遮罩的主要部分,其中,(a)為縱斷正面圖,(b)為底面圖。 [圖6]係顯示本發明的第3實施形態之印刷用金屬遮罩的使用態樣例之縱斷側面圖。 [FIG. 1] It is a longitudinal front view which shows the main part of the metal mask for printing which concerns on the 1st Embodiment of this invention. [Fig. 2] is a plan view showing the entire metal mask for printing. [Fig. 3] is a vertical side view showing an example of a metal mask for printing in use. [Fig. 4] is an explanatory diagram showing the manufacturing process of a metal mask for printing. [ Fig. 5 ] shows main parts of a metal mask for printing according to a second embodiment of the present invention, wherein (a) is a longitudinal front view, and (b) is a bottom view. [ Fig. 6] Fig. 6 is a vertical side view showing an example of the usage state of the printing metal mask according to the third embodiment of the present invention.

1:印刷用金屬遮罩 1: Metal mask for printing

2:印刷對象(電路基板) 2: Printing object (circuit board)

3:電極 3: electrode

7:遮罩本體 7: Mask body

8:遮罩本體的表面 8: Mask the surface of the body

9:遮罩本體的背面 9: Mask the back of the body

10:通孔 10: Through hole

13:第1孔部 13: The first hole

14:第2孔部 14: The second hole

17:塗佈層 17: Coating layer

C1:層厚 C1: layer thickness

C2:層厚 C2: layer thickness

C3:層厚 C3: layer thickness

D1:第1孔部的開口尺寸(開口徑) D1: Opening size of the first hole (opening diameter)

D2:第2孔部的開口尺寸(開口徑) D2: Opening size of the second hole (opening diameter)

D3:第2孔部的開口的擴大尺寸之一半(半徑的擴徑尺寸) D3: One half of the enlarged dimension of the opening of the second hole (diameter enlarged dimension of the radius)

D4:電極的長度尺寸(直徑) D4: The length dimension (diameter) of the electrode

H1:第1孔部的孔深度 H1: Hole depth of the first hole

H2:第2孔部的孔深度 H2: Hole depth of the second hole

T:遮罩本體的厚度 T: Thickness of the mask body

Claims (8)

一種印刷用金屬遮罩,其特徵為具備:遮罩本體(7),其由金屬薄板構成,且背面(9)與印刷對象(2)相面對;及 多數個通孔(10),其將遮罩本體(7)朝表背貫通,且填充有印刷漿(4), 該通孔(10)朝遮罩本體(7)的表面(8)開口且以直狀孔構成之第1孔部(13);及內表面的剖面形狀形成為R形並與第1孔部(13)圓滑地連續且擴大,並朝遮罩本體(7)的背面(9)開口之第2孔部(14)構成。 A metal mask for printing, characterized by comprising: a mask body (7), which is made of a thin metal plate, and the back surface (9) faces the printing object (2); and A plurality of through holes (10), which penetrate the mask body (7) towards the front and back, and are filled with printing paste (4), The through hole (10) is opened toward the surface (8) of the mask body (7) and is a first hole portion (13) made of a straight hole; (13) The second hole portion (14) that is smoothly continuous and enlarged, and opens toward the back surface (9) of the mask body (7) is formed. 如請求項1的印刷用金屬遮罩,其中,第1孔部(13)由直狀圓孔構成,第2孔部(14)由鐘形孔構成。The metal mask for printing according to claim 1, wherein the first hole portion (13) is composed of a straight circular hole, and the second hole portion (14) is composed of a bell-shaped hole. 如請求項1或2的印刷用金屬遮罩,其中,當將遮罩本體(7)的厚度(T)設為1時,以第1孔部(13)的孔深度所規定的(H1)設定成0.2以上0.6以下。The metal mask for printing as claimed in claim 1 or 2, wherein when the thickness (T) of the mask body (7) is set to 1, the hole depth (H1) specified by the first hole portion (13) Set to 0.2 or more and 0.6 or less. 如請求項1或2的印刷用金屬遮罩,其中,當將遮罩本體(7)的厚度(T)設為1時,以第1孔部(13)的孔深度所規定的(H1)設定成0.2以上且未滿0.5。The metal mask for printing as claimed in claim 1 or 2, wherein when the thickness (T) of the mask body (7) is set to 1, the hole depth (H1) specified by the first hole portion (13) Set to 0.2 or more and less than 0.5. 如請求項1或2的印刷用金屬遮罩,其中,當將第2孔部(14)的孔深度規定為(H2)、將第2孔部(14)的擴大尺寸之一半規定為(D3)時,以符合不等式(H2<D3)的方式,形成第2孔部(14)。The metal mask for printing as claimed in claim 1 or 2, wherein, when the hole depth of the second hole (14) is specified as (H2), half of the enlarged size of the second hole (14) is specified as (D3 ), the second hole portion (14) is formed so as to satisfy the inequality (H2<D3). 如請求項1或2的印刷用金屬遮罩,其中,當將遮罩本體(7)的表面(8)之第1孔部(13)的開口尺寸規定為(D1)、遮罩本體(7)的背面(9)之第2孔部(14)的開口尺寸規定為(D2)時,開口尺寸(D2)設定為開口尺寸(D1)的1.5倍以上。The metal mask for printing as claimed in claim 1 or 2, wherein, when the opening size of the first hole (13) of the surface (8) of the mask body (7) is specified as (D1), the mask body (7 ) when the opening size of the second hole (14) on the back side (9) is specified as (D2), the opening size (D2) is set to be more than 1.5 times the opening size (D1). 如請求項1或2的印刷用金屬遮罩,其中,遮罩本體(7)的厚度(T)設定為25μm以下。The metal mask for printing according to claim 1 or 2, wherein the thickness (T) of the mask body (7) is set to be 25 μm or less. 如請求項1或2的印刷用金屬遮罩,其中,在通孔(10)的孔內表面及遮罩本體(7)的背面(9),形成有抑制印刷漿(4)的附著之塗佈層(17), 當將第1孔部(13)處之塗佈層(17)的層厚規定為(C1)、第2孔部(14)處之塗佈層(17)的層厚規定為(C2)、遮罩本體(7)的背面(9)處之塗佈層(17)的層厚規定為(C3)時,以符合不等式(C1≦C2≦C3)的方式形成塗佈層(17)。 The metal mask for printing as claimed in claim 1 or 2, wherein a coating for inhibiting the adhesion of printing paste (4) is formed on the inner surface of the through hole (10) and the back surface (9) of the mask body (7). cloth layer (17), When the layer thickness of the coating layer (17) at the first hole (13) is specified as (C1), the layer thickness of the coating layer (17) at the second hole (14) is specified as (C2), When the layer thickness of the coating layer (17) at the back side (9) of the mask body (7) is specified as (C3), the coating layer (17) is formed in a manner satisfying the inequality (C1≦C2≦C3).
TW111129131A 2021-09-13 2022-08-03 metal mask for printing TW202322231A (en)

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