TW202320408A - Electronic device and manufacturing method thereof - Google Patents

Abstract

An electronic device, the manufacturing method of which is to stack a carrier structure by a plurality of conductive elements on a circuit board with a reflector, respectively dispose a micro strip and an antenna layer communicating with the reflector on opposite sides of the carrier structure, and dispose the antenna spacer on the carrier structure, and then encapsulate the antenna spacer with an encapsulation layer, and form an antenna portion on the encapsulation layer communicatively connected to the antenna layer. Therefore, by arranging the micro strip on the bottom of the carrier structure and the antenna layer on the top of the carrier structure to obtain better antenna performance.

Description

Electronic device and manufacturing method thereof

The invention relates to an electronic device, especially an electronic device with an antenna module and a manufacturing method thereof.

Due to the improvement of the image quality of the current multimedia content, the amount of file data has become larger, so the bandwidth of wireless transmission also needs to be enlarged, resulting in the fifth generation of wireless transmission (5G). In addition, due to the higher transmission frequency of 5G, The size requirements of the related wireless communication modules are also relatively high.

In conventional antenna modules, when the antenna structure is planar, the electromagnetic radiation characteristics between the antenna structure and the electronic components will be limited, making it difficult to improve the performance of the antenna. Therefore, how to overcome the problems of the above-mentioned conventional technologies has become an urgent problem in the industry.

In view of the problems of the prior art, the present invention provides an electronic device comprising: a circuit board; a carrying structure having opposite first and second sides, and the second side is stacked on the second side by a plurality of conductive elements On the circuit board; the antenna layer is arranged on the first side of the carrying structure; the microstrip line is arranged on the second side of the carrying structure, wherein the position of the antenna layer corresponds to the microstrip The position of the line; the antenna part is arranged on the packaging layer and communicated with the antenna layer; the antenna spacer is arranged on the first side of the bearing structure corresponding to the position of the antenna layer and between the antenna layer and the antenna layer. Between the antenna parts; the encapsulation layer is arranged on the first side of the carrier structure to cover the antenna spacer; and the reflector is arranged on the side of the circuit board facing the carrier structure, And communicate with the antenna layer.

The present invention further provides a manufacturing method of an electronic device, which includes the following steps: providing a supporting structure having opposite first and second sides, wherein an antenna layer is arranged on the first side, and an antenna layer is arranged on the second side Configure the microstrip line so that the position of the antenna layer corresponds to the position of the microstrip line; an antenna spacer is provided on the first side of the carrying structure; an encapsulation layer is formed on the first side of the carrying structure to making the encapsulation layer wrap the antenna spacer; combining an antenna portion communicatively connected to the antenna layer on the encapsulation layer on the first side of the carrier structure; and passing the carrier structure on its second side through a plurality of conductive elements It is connected to a circuit board provided with a reflector, wherein the reflector is arranged on the side of the circuit board facing the carrying structure, and communicated with the antenna layer.

In the aforementioned electronic device and its manufacturing method, a plurality of electrical contact pads are formed on the second side of the carrying structure, and the plurality of conductive elements are only disposed on a part of the plurality of electrical contact pads.

In the aforementioned electronic device and its manufacturing method, the antenna layer is a coplanar waveguide, and the width of the reflector is larger than the width of the coplanar waveguide, and the antenna layer passes through the plurality of conductive elements and part of the plurality of electrical contacts Pads are communicatively connected to the reflector.

In the aforementioned electronic device and its manufacturing method, the antenna part includes an antenna body communicatively connected to the antenna layer, and the position of the antenna body corresponds to the position of the antenna spacer, wherein the position of the reflector corresponds to the antenna layer position.

In the aforementioned electronic device and its manufacturing method, on the first side of the carrying structure An electronic component is further arranged, and when the encapsulation layer is formed on the first side of the carrying structure, the encapsulation layer is further made to cover the electronic component.

It can be seen from the above that the electronic device and its manufacturing method of the present invention are mainly provided with the microstrip line on the second side of the load-carrying structure, and each of the conductive elements is only arranged on a part of the electrical contact pads, thereby obtaining a better performance. Antenna performance.

2: Electronic device

2a: Antenna module

2b: circuit board

20: Bearing structure

20a: First side

20b: Second side

200: insulating layer

201: line layer

202: Antenna layer

203: Microstrip line

21: Electronic components

21a: Action surface

21b: Non-active surface

210: conductive bump

22: Antenna spacer

220: bonding layer

23: Encapsulation layer

24: Antenna

24a: Antenna body

24b: Inclusion

240: dielectric layer

242: insulating protective layer

25: reflector

26: Conductive element

260: electrical contact pad

9: Support

90: Adhesive layer

A: The first area

B: the second area

H: distance

P1: width of reflector

P2: width of coplanar waveguide

FIG. 1 is a schematic cross-sectional view of an electronic device of the present invention.

FIG. 2 is a schematic bottom view of the antenna module of the electronic device of the present invention.

3A to 3G are schematic cross-sectional views of the manufacturing method of the electronic device of the present invention.

The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, references in this specification such as "upper", "first", "second" and The words "one" and so on are only for the convenience of description, and are not used to limit the applicable scope of the present invention. The change or adjustment of their relative relationship shall also be regarded as the possibility of the present invention if there is no substantial change in the technical content. scope of implementation.

FIG. 1 is a schematic cross-sectional view of an electronic device of the present invention. As shown in Figure 1, the electronic device 2 at least includes: an antenna module 2a and a circuit board 2b equipped with a reflector 25, wherein the antenna module 2a includes a carrying structure 20, an electronic component 21, an antenna The spacer 22 , an encapsulation layer 23 and an antenna part 24 .

The carrying structure 20 has opposite first side 20a and second side 20b, and at least one antenna layer 202 is arranged on the first side 20a for serving as a coplanar waveguide (CPW for short), and microchips are arranged on the second side 20b. Strip line (micro strip) 203, so that the position of the antenna layer 202 corresponds to the position of the microstrip line 203, so that the antenna layer 202 covers the microstrip line 203. In addition, a plurality of conductive strips are planted on the second side 20b. elements 26, so that the antenna module 2a is stacked on the circuit board 2b through the conductive elements 26. Wherein, the conductive element 26 can be a ball grid array connector, solder ball, metal pillar, micro-bump or other similar elements, and the material forming the conductive element 26 can be made of solder, copper, aluminum, gold, nickel, silver, Composed of palladium, tin and a combination of the aforementioned materials.

The electronic component 21 is disposed on the first side 20 a of the carrying structure 20 and is electrically connected to the carrying structure 20 .

The antenna spacer 22 is also disposed on the first side 20 a of the carrying structure 20 , and the antenna spacer 22 is configured separately from the electronic component 21 .

The encapsulation layer 23 is disposed on the first side 20 a of the carrying structure 20 and covers the electronic component 21 and the antenna spacer 22 .

The antenna part 24 has an antenna body 24 a covered by an insulating material, disposed on the encapsulation layer 23 , and communicated with the carrying structure 20 .

The reflector 25 is disposed on a surface of the circuit board 2b facing the second side 20b of the carrier structure 20 (that is, the reflector 25 is disposed between the second side 20b of the carrier structure 20 and the circuit board 2b), and The carrier structure 20 is communicatively connected.

In one embodiment, the electronic device 2 of the present invention can form a plurality of electrical contact pads 260 on the second side 20b of the carrying structure 20 to combine the conductive elements 26, and the conductive elements 26 are only arranged on a part The electrical contact pads 260 are arranged in a row as shown in FIG. 2 (but not limited thereto), so as to improve the gain of the electronic device 2 of the present invention.

Therefore, in the electronic device 2 of the present invention, the position of the microstrip line 203 is set in the second side 20b of the carrying structure to increase the length of the microstrip line 203. On the top, the electronic device 2 of the present invention can greatly improve the performance, for example, increase the bandwidth (Bandwidth) to about 7.4GHz, the center frequency (Center Frequency) to about 60GHz and/or the gain (Gain) to about 6.7dB.

Furthermore, the antenna layer 202 (CPW) of the electronic device 2 of the present invention is connected to the reflector 25 through the conductive element 26 and part of the electrical contact pad 260, so that the CPW is grounded. Solder balls, the electronic device 2 of the present invention can greatly improve performance, for example, increase the gain of the antenna of the present invention (about 5dB).

3A to 3G are schematic cross-sectional views of the manufacturing method of the electronic device 2 of the present invention.

As shown in FIG. 3A, a load-bearing structure 20 disposed on the support member 9 is provided, the load-bearing structure 20 has a first side 20a and a second side 20b opposite to each other, wherein the first side 20a is fixed There is a first area A and a second area B adjacent to each other, and the carrying structure 20 is bonded to the support member 9 with its second side 20b.

In this embodiment, the carrying structure 20 is composed of an insulating layer (dielectric layer) 200 and a circuit layer 201 such as a fan out redistribution layer (RDL for short). Wherein, the material forming the wiring layer 201 can be copper or gold, and the material forming the insulating layer 200 can be polybenzoxazole (PBO for short), polyimide (PI for short), etc. , prepreg (Prepreg, PP for short) and other dielectric materials.

Moreover, the bearing structure 20 is configured at least one antenna layer 202 in the insulating layer 200 of the uppermost layer (ie, the top layer) for use as a coplanar waveguide (CPW for short), and the bearing structure 20 is placed on the lowermost layer ( The circuit layer 201 in the insulating layer 200 (such as the PI layer) of the bottom layer) has a micro strip line (micro strip) 203, so that the position of the antenna layer 202 corresponds to the position of the micro strip line 203, so that the antenna layer 202 The microstrip line 203 is covered.

Moreover, the support 9 can be, for example, a plate made of semiconductor material (such as silicon or glass), and the carrying structure 20 can be fixed on the support 9 through materials such as an adhesive layer 90 .

As shown in FIG. 3B, at least one electronic component 21 is arranged on the first area A of the first side 20a of the carrying structure 20, and at least one antenna is arranged on the second area B of the first side 20a of the carrying structure 20. Spacer 22. Wherein, the antenna spacer 22 is configured separately from the electronic component 21 .

In this embodiment, the electronic component 21 is an active component, a passive component or a combination thereof, and the active component is such as a semiconductor chip, and the passive component is such as a resistor, a capacitor and an inductor. In this embodiment, the electronic component 21 is a semiconductor chip, such as a radio frequency chip (Radio Frequency Integrated Circuits, referred to as RFID), which has an opposite active surface 21a and a non-active surface 21b, the electronic component 21 is provided on the circuit layer 201 in a flip-chip manner by a plurality of conductive bumps 210 such as solder materials and Electrically connect the circuit layer 201; or, the electronic component 21 can be electrically connected to the circuit layer 201 by a plurality of bonding wires (not shown); or, the electronic component 21 can directly contact the circuit layer 201 . However, the manner in which the electronic component 21 is electrically connected to the carrying structure 20 is not limited to the above.

Furthermore, the antenna spacer 22 is a block made of glass or silicon material. In this embodiment, the antenna spacer 22 is a chip specification such as a carrier chip. For example, the antenna spacer 22 can be pasted on the carrier structure 20 by a bonding layer 220 such as adhesive to cover the antenna layer 202 .

As shown in FIG. 3C , an encapsulation layer 23 is formed on the first side 20 a of the carrying structure 20 , so that the encapsulation layer 23 covers the electronic component 21 and the antenna spacer 22 . In this embodiment, the packaging layer 23 is an insulating dielectric material, such as ABF (Ajinomoto Build-up Film), photosensitive resin, polyimide (polyimide, referred to as PI), bismaleimide triazine (Bismaleimide Triazine, referred to as BT), FR5 prepreg (Prepreg, referred to as PP), dry film (dry film), epoxy resin (epoxy), molding resin (molding compound), molding epoxy resin (Epoxy Molding Compound, EMC for short) or other suitable materials can be formed on the first side 20a of the carrying structure 20 by lamination or molding.

As shown in FIG. 3D, an antenna portion 24 is formed on the encapsulation layer 23, and the antenna portion 24 includes a dielectric layer 240 formed on the encapsulation layer 23 and an antenna body formed on the dielectric layer 240. 24a. In this embodiment, the antenna body 24a is a patch antenna (Patch antenna), which is pasted on the dielectric layer 240 . In other embodiments, a metal layer may also be formed by electroplating, chemical coating, physical vapor deposition, sputtering or other suitable methods to serve as the antenna body 24a.

Furthermore, the antenna body 24a and the antenna layer 202 are connected in communication with each other (such as signal inductive coupling). For example, the position of the antenna body 24 a corresponds to the position of the antenna spacer 22 , that is, the two are opposite up and down.

Moreover, the encapsulation layer 23 and the dielectric layer 240 can be made of the same or different materials, and there is no special limitation.

In addition, the antenna part 24 can be provided with an insulating protective layer 242 covering the antenna body 24a as required, and the insulating protective layer 242 is a dielectric material, which is formed on the dielectric layer 240, so the insulating protective layer 242 It can be regarded as an integral body with the dielectric layer 240 and serves as a covering body 24b to cover the antenna body 24a. It should be understood that the dielectric layer 240 can also be omitted, and the antenna body 24 a is directly disposed on the encapsulation layer 23 .

As shown in FIG. 3E , the support member 9 and the adhesive layer 90 on it are removed to expose the second side 20 b of the carrying structure 20 . In this embodiment, the adhesive layer 90 can be a release film to facilitate removal of the support member 9 .

As shown in FIG. 3F , a plurality of conductive elements 26 such as solder balls are disposed on the second side 20 b of the carrying structure 20 , which are electrically connected to the circuit layer 201 of the carrying structure 20 .

In this embodiment, a plurality of electrical contact pads 260 electrically connected to the circuit layer 201 can be formed on the second side 20b of the carrier structure 20 to combine the conductive elements 26, through the electrical contact pads 260 The configuration is beneficial to planting these conductive elements 26 .

Furthermore, the conductive elements 26 are only arranged on a part of the electrical contact pads 260, A row as shown in Figure 2.

As shown in FIG. 3G , the carrier structure 20 is mounted on a circuit board 2 b with at least one reflector 25 through the conductive elements 26 , so that the circuit layer 201 of the carrier structure 20 passes through the plurality of conductive elements 26 and the circuit board 2 b. The circuit board 2b is electrically connected, and the reflector 25 is communicatively connected to the antenna layer 202, so that the microstrip line 203, the antenna layer 202, the antenna spacer 22, the antenna portion 24 and the reflector 25 serve as an antenna structure, wherein the The antenna layer 202 is used as a coplanar waveguide (CPW) of the antenna structure, and is electrically connected to the reflector 25 of the circuit board 2b through the circuit layer 201 and the conductive element 26, so that the CPW is grounded.

In this embodiment, the reflector 25 can be formed on the circuit board 2 b by using RDL wiring process, so that the reflector 25 does not contact the second side 20 b of the carrying structure 20 . Therefore, by arranging the antenna layer 202 (coplanar waveguide) on the first side 20a of the carrier structure 20, the distance H between the CPW and the reflector 25 will be increased, so that the electronic device 2 can be further obtained. Good resonance effect and better antenna performance.

Moreover, by arranging the reflector 25 on the circuit board 2b, the reflector 25 can effectively reflect the signal from the antenna body 24a of the antenna part 24 through the antenna layer 202 of the carrying structure 20, so as to enhance the The signal directivity of the antenna body 24a further enables the radiation direction of the antenna body 24a to face an ideal direction.

Moreover, the reflector 25 and the antenna layer 202 are inductively coupled to each other. For example, the position of the reflector 25 corresponds to the position of the antenna layer 202 , that is, the two are vertically aligned relative to the second side 20 b.

In addition, the width P1 of the reflector 25 is larger than the width P2 of the coplanar waveguide, so as to avoid the problems of scattering and gain reduction.

Therefore, in the manufacturing method of the electronic device 2 of the present invention, the carrier structure 20, the antenna spacer 22, the antenna part 24 and the reflector 25 are stacked up and down to form a three-dimensional antenna structure, so that in the manufacturing process, the carrier structure 20, The antenna spacer 22 and the antenna part 24 can be integrated with the electronic component 21, that is, packaged together, so that the packaging layer 23 can cover the electronic component 21 and the antenna spacer 22, so the mold used for the packaging process can correspond to the The size of the carrying structure 20 is thus beneficial to the packaging process.

Furthermore, the manufacturing method of the present invention is to arrange the antenna part 24 corresponding to the electronic component 21 in the same antenna module 2a, so that the reflector 25 of the antenna structure only needs to be connected to any one of the antenna modules 2a. The radio frequency chip (the electronic component 21) of the frequency can make the antenna part 24 of the electronic device 2 send the 5G millimeter wave of the required frequency, so when the electronic device 2 is mass-produced, the manufacturing method of the present invention can produce various Frequency of radio frequency products, so the number of production lines can be reduced to reduce production costs, and production speed can be increased to increase production capacity.

In addition, in the manufacturing method of the present invention, the antenna structure is manufactured by using the circuit substrate manufacturing process, so that the antenna structure can be manufactured by the encapsulation process during the manufacturing process, which is beneficial to the encapsulation operation.

In addition, the 5G system requires more line configurations due to the signal quality and transmission speed requirements to improve the signal quality and transmission speed. The manufacturing method of the present invention utilizes the circuit substrate manufacturing process to manufacture the microstrip line 203 and the antenna layer 202 of the carrying structure 20 , so that under the condition that the length and width of the carrying structure 20 are fixed, the wiring space (number of layers) can be increased, thereby increasing the function of the antenna structure, so the electronic device 2 can provide the power required to operate the 5G system Performance function, that is, it can meet the requirements of the antenna operation of the 5G system.

In addition, the electronic device and its manufacturing method of the present invention, by setting the microstrip line The coplanar waveguide is arranged on the bottom layer of the bearing structure and the top layer of the bearing structure, and each conductive element is only arranged on a part of the electrical contact pad, so as to obtain better antenna performance.

The above-mentioned embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of the patent application described later.

2: Electronic device

2a: Antenna module

2b: circuit board

20: Bearing structure

20a: First side

20b: Second side

200: insulating layer

201: line layer

202: Antenna layer

203: Microstrip line

21: Electronic components

22: Antenna spacer

220: bonding layer

23: Encapsulation layer

24: Antenna

24a: Antenna body

24b: Inclusion

25: reflector

26: Conductive element

260: electrical contact pad

Claims (10)

An electronic device comprising: circuit board; The carrying structure has a first side and a second side opposite to each other, and the second side is stacked on the circuit board through a plurality of conductive elements; an antenna layer configured on the first side of the carrying structure; a microstrip line configured on the second side of the carrying structure, wherein the position of the antenna layer corresponds to the position of the microstrip line; The antenna part is arranged on the encapsulation layer and communicated with the antenna layer; an antenna spacer disposed on the first side of the load-bearing structure corresponding to the position of the antenna layer and between the antenna layer and the antenna portion; an encapsulation layer disposed on the first side of the carrier structure to enclose the antenna spacer; and The reflector is arranged on one side of the circuit board facing the bearing structure, and communicated with the antenna layer. The electronic device as claimed in claim 1, wherein a plurality of electrical contact pads are formed on the second side of the carrying structure, and the plurality of conductive elements are only disposed on a part of the plurality of electrical contact pads. The electronic device as described in Claim 1, wherein the antenna layer is a coplanar waveguide, the width of the reflector is larger than the width of the coplanar waveguide, and the antenna layer passes through the plurality of conductive elements and part of the plurality of electrical contacts Pads are communicatively connected to the reflector. The electronic device as described in Claim 1, wherein the antenna portion includes an antenna body communicatively connected to the antenna layer, and the position of the antenna body corresponds to the position of the antenna spacer, wherein the position of the reflector corresponds to the The location of the antenna layer. The electronic device according to claim 1 further includes an electronic component disposed on the first side of the carrying structure and electrically connected to the carrying structure. A method of manufacturing an electronic device, comprising the following steps: Provide a bearing structure with opposite first side and second side, wherein, the antenna layer is arranged on the first side, and the microstrip line is arranged on the second side, the position of the antenna layer corresponds to the microstrip the position of the line; disposing an antenna spacer on a first side of the load-bearing structure; forming an encapsulation layer on the first side of the carrier structure, so that the antenna spacer is covered by the encapsulation layer; bonding an antenna portion communicatively connected to the antenna layer on the encapsulation layer on the first side of the carrier structure; and The carrier structure is placed on a circuit board provided with a reflector with its second side via a plurality of conductive elements, wherein the reflector is arranged on the side of the circuit board facing the carrier structure and is connected in communication the antenna layer. The manufacturing method of an electronic device as claimed in claim 6, wherein a plurality of electrical contact pads are formed on the second side of the carrying structure, and the plurality of conductive elements are only disposed on a part of the plurality of electrical contact pads. The method of manufacturing an electronic device as described in Claim 6, wherein the antenna layer is a coplanar waveguide, the width of the reflector is larger than the width of the coplanar waveguide, and the antenna layer passes through the plurality of conductive elements and part of the plurality of The electrical contact pad communicates with the reflector. The method of manufacturing an electronic device as described in claim 6, wherein the antenna portion includes an antenna body communicatively connected to the antenna layer, and the position of the antenna body corresponds to the position of the antenna spacer, wherein the position of the reflector is the position corresponding to the antenna layer. The method for manufacturing an electronic device as described in Claim 6, wherein electronic components are further arranged on the first side of the carrying structure, and when the encapsulation layer is formed on the first side of the carrying structure, the encapsulation is further made layer encases the electronic component.

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