TW202316110A - Detecting test piece and electrode manufacturing method - Google Patents

Abstract

An electrode manufacturing method includes a wire coating step, a region coating step, and a material cutting step. In the wire coating step, the first screen is used to coat the conductive material on the surface of a die, so that the conductive material forms a plurality of transmission circuits on the surface of the die. In the area coating step, a second screen is used to coat the conductive material on the surface of the die, so that the conductive material forms a preparation area on the surface of the die. The preparation area is connected to one end of the plurality of transmission circuits. In the material engraving step, part of the conductive material in the preparation area is removed, so that the conductive material in the preparation area forms a plurality of detection electrodes at one end of the plurality of transmission circuits, and make the plurality of detection electrodes have a fixed distance.

Description

Detection test piece and electrode manufacturing method

The invention relates to an electrode manufacturing technology, in particular to an electrode manufacturing method, and a test piece containing the electrode.

Blood sugar (English: Blood sugar) refers to the glucose in the blood. The glucose in the digested food will enter the blood from the small intestine and be transported to various cells in the body. It is the main energy source of the cells.

In the human body, the blood sugar concentration in the blood is strictly controlled. The normal value of fasting blood sugar is 60mg/dL～99mg/dL. If the fasting blood sugar exceeds 126mg/dL, it is diabetes. 60mg/dL～139mg/dL, if the blood sugar value after meal exceeds 200mg/dL, it is diabetes.

The imbalance of blood sugar concentration in the blood can lead to various diseases, such as hyperglycemia in which the blood sugar concentration is too high, and hypoglycemia in which the blood sugar concentration is too low, and persistent hyperglycemia caused by various reasons will lead to diabetes, which is also related to blood sugar concentration. The most relevant diseases, while hypoglycemia will cause dizziness, inability to concentrate, and even shock and other symptoms.

In order to enable patients with blood sugar-related symptoms to measure blood sugar at any time, commercially available blood sugar test tablets can provide patients with blood sugar-related symptoms to measure blood sugar anytime and anywhere. Avoid damage to the human body caused by high or low blood sugar.

Generally, a conductive layer is provided on the blood glucose test sheet to provide electrical measurement for the blood glucose measuring machine. The current manufacturing methods of the conductive layer include screen printing, sputtering, evaporation, etc., among which , The manufacturing cost of screen printing is low, and it is widely used in the manufacture of electrodes on the detection test piece.

However, the electrode structure produced by screen printing cannot be detailed, the width of the electrode structure will be greater than 75 μm, and the sides of the electrode structure will have burrs or irregular shapes, which will cause the spacing of multiple electrode structures to be large or small. Affect the electrical detection of the test piece.

As can be seen from the above description, the current detection test strip has the following disadvantages:

1. The cost is too high:

After the conductive material is coated on the bare chip, all the electrode patterns are produced by etching, which will consume a relatively high manufacturing cost.

2. The area of the detection area is too large:

Although screen printing alone can obtain test pieces with low manufacturing costs, the electrode structure produced cannot be refined. If the width of the electrode structure is too large, or the distance between multiple electrodes is too large, the area of the detection area will be reduced. is too big.

3. Uneven distribution of reactants:

Continuing from the above, because the area of the reaction zone is too large, not only will there be too many reactants used in the reaction zone, but also the electrode structure arranged in the reaction zone will not be fine. When the reactant is coated on the reaction zone When, more can produce the situation of reactant coating layer inhomogeneity.

Therefore, how to manufacture a relatively detailed electrode structure at the best cost to further reduce the area of the reaction zone, thereby reducing the amount of reactants and coating the reactants in the reaction zone in a uniform manner, is a related technology. A goal that people desperately need to work on.

In view of this, the object of the present invention is to provide an electrode manufacturing method, which includes a wire coating step, an area coating step, and a material removal step.

In the wire coating step, a first screen is used to coat the surface of a bare chip with conductive material, and the first screen has at least one circuit pattern, so that the conductive material forms a plurality of layers on the surface of the bare chip. transmission circuit.

In the area coating step, a second screen is used to coat the surface of the bare chip with conductive material, the second screen has at least one area pattern, so that the conductive material forms a surface on the surface of the die. The marking preparation area is connected to one end of the multiple transmission circuit.

In the material removal step, part of the conductive material in the preparation area is removed, so that the conductive material in the preparation area forms a plurality of detection electrodes at one end of the plurality of transmission circuits.

Another technical means of the present invention is that in the above-mentioned material etching step, the method of removing part of the conductive material in the preparation area is selected from one of laser etching, chemical etching, and dry etching. .

Another technical means of the present invention is that the above-mentioned electrode manufacturing method further includes a foreign matter cleaning step before the region coating step, to remove foreign matter on the surface of the die.

Another technical means of the present invention is that in the above-mentioned foreign matter cleaning step, the foreign matter on the surface of the bare chip is removed by using a roller cleaning technique or an air blowing technique.

Another technical means of the present invention lies in that the conductive material on the surface of the bare chip is carbon.

Another technical means of the present invention lies in the above-mentioned wire coating step, further comprising the following sub-steps:

a first primer coating step, coating the surface of the die with silver; and

A first top coating step applies carbon to the surface of the silver.

Another technical means of the present invention lies in the above-mentioned area coating step, further comprising the following sub-steps:

a second primer coating step, coating the surface of the die with silver; and

A second top coating step applies carbon to the surface of the silver.

Another technical measure of the present invention is that in the above-mentioned area coating step, the conductive material coated on the surface of the bare chip covers one end of the plurality of transmission circuits.

Another technical means of the present invention lies in the above-mentioned electrode manufacturing method, which further includes a quality control inspection step after the material engraving step, and in the wire coating step, a plurality of contact electrodes are formed at one end of the plurality of transmission circuits , in the area coating step, the marking area and the plurality of contact electrodes are separately arranged at the two ends of the plurality of transmission circuits, and in the quality control detection step, the quality control liquid is coated on the plurality of detection electrodes, with the The plurality of contact electrodes are detection points, and the electrical properties of the plurality of transmission circuits, the plurality of detection electrodes, and the quality control liquid are measured to judge whether the plurality of detection electrodes meet the standards.

Another technical means of the present invention is that in the above-mentioned material removal step, the plurality of detection electrodes are arranged in parallel and have a zigzag shape on their sides, and the adjacent zigzag sides of the plurality of detection electrodes are correspondingly arranged in convex and concave shapes.

Another object of the present invention is to provide an electrode manufacturing method, which includes a coating step and an ablation step.

In the coating step, conductive material is coated on the surface of a die using screen printing.

In the etching step, part of the conductive material on the surface of the bare chip is removed, so that the conductive material remaining on the surface of the bare chip forms a plurality of transmission circuits, and the plurality of transmission circuits are short-circuited with each other. The terminals are respectively a detection electrode and a contact electrode. The plurality of detection electrodes are close to each other for coating a reaction layer, and the plurality of contact electrodes are close to each other for a blood glucose measuring machine to detect the electrical properties of the reaction layer.

Another object of the present invention is to provide a test piece, the electrode in the test piece is suitable for the above-mentioned electrode manufacturing method, the test piece includes a bottom plate, a conductive layer, a middle partition, an upper plate, and a reaction layer.

The conductive layer is arranged on the surface of the lower base plate, and the conductive layer includes a plurality of transmission circuits, a plurality of detection electrodes arranged at one end of the plurality of transmission circuits, and a plurality of contact electrodes arranged at the other end of the plurality of transmission circuits.

The middle partition and the lower bottom board are attached together, the plurality of transmission circuits are covered between the middle partition and the lower bottom board, and the plurality of detection electrodes and the plurality of contact electrodes are exposed to the outside.

The upper plate includes an attached portion attached to the intermediate plate, and an extension portion connected to the attached portion, the extension portion is spaced from the lower base plate, and the plurality of detection electrodes and defines a Accommodate space.

The reaction layer is arranged in the accommodating space, and the reaction layer is attached to the lower base plate and covers the plurality of detection electrodes.

The beneficial effect of the present invention is that the wire coating step has used screen printing technology to complete the complex transmission circuit, which can reduce the area of the conductive material removed in the material etching step, thereby reducing the time and cost of manufacturing, and In the material etching step, the size and spacing of the plurality of contact electrodes are reduced, thereby reducing the area of the detection region.

The features and technical contents of the relevant patent applications of the present invention will be clearly presented in the following detailed descriptions of four preferred embodiments with reference to the drawings. Before proceeding with the detailed description, it should be noted that like elements are denoted by the same reference numerals.

Referring to FIG. 1 , it is a first preferred embodiment of an electrode manufacturing method according to the present invention. The electrode manufacturing method includes a coating step 81 and an etching step 82 .

In the coating step 81, screen printing is used to coat the surface of a bare chip with a conductive material. Preferably, a conductive layer formed of a layer of carbon can be coated on the surface of a B4-sized bare chip. The conductive layer Covering the surface of the die, in actual implementation, the die can use other sizes, and after two screen printings, the first screen printing is coated with silver material, the second screen printing is coated with carbon material, The bottom layer is silver and the top layer is carbon, but it should not be limited thereto.

In the etching step 82, part of the conductive material on the surface of the die is removed, so that the conductive material remaining on the surface of the die forms a plurality of transmission circuits. In the first preferred embodiment, the removal of the conductive material The removal technology is laser ablation technology. In actual implementation, other removal technologies can be used and should not be limited to this. The plurality of transmission circuits are short-circuited with each other. The two ends of each transmission circuit are respectively a detection electrode and a contact electrode. The plurality of detection electrodes are close to each other, and the plurality of contact electrodes are close to each other.

Please refer to Fig. 2, which is the pattern formed after removing the conductive material on the bare chip, wherein, the test piece boundary 22 in Fig. In the etched area of the shot, the white area displayed in the area surrounded by the test strip boundary 22 is the conductive material remaining on the bare chip.

It can be understood from FIG. 2 that after the etching step 82, the conductive material remaining on the die will be divided into a first transmission circuit 61, a second transmission circuit 62, and a third transmission circuit 63 by the etching line 23. and a fourth transmission circuit 64, the two ends of the first transmission circuit 61 are respectively the first detection electrode 611, and a first contact electrode 612, the two ends of the second transmission circuit 62 are respectively the second detection electrode 621, and a second contact electrode 622, the two ends of the third transmission circuit 63 are respectively the third detection electrodes 631, and a third contact electrode 632, the two ends of the fourth transmission circuit 64 are respectively the fourth detection electrodes 641, And a fourth contact electrode 642, the first detection electrode 611, the second detection electrode 621, the third detection electrode 631, and the fourth detection electrode 641 are located on the top of the detection test piece and close to each other, the first The contact electrode 612 , the second contact electrode 622 , the third contact electrode 632 , and the fourth contact electrode 642 are located at the bottom of the testing strip and are close to each other.

Please refer to FIG. 3 , a reaction layer manufacturing step will be performed after the etching step 82, mainly coating a reaction layer 65 on a plurality of detection electrodes, in the first preferred embodiment, on the first detection electrode 611, the second detection electrode 621, and the third detection electrode 631 are coated with a reactant to form a reaction layer 65, and the reaction layer 65 is connected to the first detection electrode 611, the second detection electrode 621, and the third detection electrode 631. The detection electrode 631 is electrically connected, and the reaction layer 65 is not electrically connected to the fourth detection electrode 641. In actual implementation, the coating area of the reaction layer 65 should be based on actual use and should not be limited thereto.

Please refer to Fig. 4, after completing the manufacturing step of the reaction layer, you can enter a sticking and cutting step, which is to attach a middle layer board on the surface of the bare chip with conductive material, and form a plurality of detection areas 66 on the bare chip, and a plurality of Contact area 67, then attach an upper layer board 68 on the middle layer board and carry out the cutting of the bare chip, to obtain a plurality of detection test pieces 69 with detection area 66 and contact area 67, the detection area 66 is used to accommodate blood, the reaction layer 65 produces a corresponding electrical response to the contained blood, the contact area 67 can be used for electrical detection by the blood glucose measuring machine, and is used to obtain the electrical response of the reaction layer 65 for analysis The characteristics of the blood contained in the detection area 66 are displayed.

Referring to Fig. 5, Fig. 6, and Fig. 7, it is a second preferred embodiment of a detection test piece 5 of the present invention. An upper plate 54 and a reaction layer 56 .

The lower base plate 51, the middle partition plate 53, and the upper plate 54 are all made of thin plastic plates, and their shape is roughly elongated. The conductive layer 52 is arranged on the lower base plate 51 by coating. The structure of the conductive layer 52 includes a plurality of transmission circuits 521, a plurality of detection electrodes 522 arranged at one end of the plurality of transmission circuits 521, and a plurality of contact electrodes 523 arranged at the other end of the plurality of transmission circuits 521. The plurality of detection electrodes 522 and the plurality of contact electrodes 523 are respectively arranged at opposite ends of the lower base plate 51, and the two ends of the lower base plate 51 respectively define a detection area 57 and a contact area 58, and the plurality of detection electrodes 522 are arranged in the detection area In 57 , the plurality of contact electrodes 523 are disposed in the contact region 58 .

The bottom surface of the middle partition 53 is attached to the top surface of the lower bottom plate 51. The plurality of transmission circuits 521 are covered between the middle partition 53 and the lower bottom 51. The flat plate of the middle partition 53 The area is slightly smaller than that of the bottom plate 51 so that the detection area 57 and the contact area 58 are exposed to the outside, and the plurality of detection electrodes 522 and the plurality of contact electrodes 523 are exposed to the outside.

The upper plate 54 includes an attachment portion 541, and an extension portion 542 connected with the attachment portion 541, the bottom surface of the attachment portion 541 is attached to the top surface of the middle partition 53, and the extension portion 542 The area of the flat plate matches the area of the detection area 57, and the setting position of the extension 542 corresponds to the detection area 57 and is spaced from each other. 522 are spaced apart from each other and cooperate to define an accommodating space 55 , while the contact area 58 on the lower bottom plate 51 remains exposed to the outside.

The reaction layer 56 is disposed in the accommodating space 55 , the reaction layer 56 is attached to the lower base plate 51 by coating, and the reaction layer 56 covers the plurality of detection electrodes 522 , the accommodating space 55 It can be accommodated by blood, and the reaction layer 56 can generate an electrical response to glucose in the blood. The plurality of contact electrodes 523 on the contact area 58 can be used for electrical contact of the blood glucose measuring machine, thereby electrifying the reaction layer 56 In order to detect electrical properties, it is finally converted into a blood sugar level and displayed externally. In actual implementation, the reaction layer 56 can use other substances to measure other liquids, and should not be limited thereto.

Please refer to Fig. 8, for the second preferred embodiment, the electrode manufacturing method on the surface of the detection test piece 5, the electrode manufacturing method includes a wire coating step 91, an area coating step 92, and a material removal Step 93.

In the wire coating step 91, a first screen (not shown in the drawing) is used to coat the surface of a bare chip 21 with conductive material, and the first screen has at least one circuit pattern to make the conductive material The material forms a plurality of transmission circuits 31 on the surface of the die 21 .

Please refer to FIG. 9 , which is a pattern after coating conductive material on the bare chip 21. The conductive material on the bare chip 21 will form a plurality of transmission circuits 31 and a plurality of contact electrodes 32. The plurality of transmission circuits 31 are opposite to the plurality of contact electrodes. One end of the electrode 32 should not be coated with conductive material, so as to leave a blank area. Although only one set of transmission circuits 31 and contact electrodes 32 are shown in FIG. 9 , multiple sets of circuits can be coated on the bare chip 21 The pattern should not be limited to the example of this preferred embodiment. After the die 21 is cut, it will form the lower base plate of the multiple detection test pieces. Wherein, the conductive material used is carbon powder, and the conductive material is printed by screen printing. For coating on the die 21 , other conductive materials may be used in actual implementation.

In the area coating step 92, a second screen (not shown in the drawing) is used to coat the surface of the die 21 with conductive material, and the second screen has at least one area pattern to make the conductive material The material forms a marking preparation area 33 on the surface of the bare chip 21, which is covered with conductive materials in the preparation marking area 33, and the conductive material in the preparation marking area 33 is connected to one end of the complex transmission circuit 31, wherein the conductive material used The material is carbon powder, and the conductive material is coated on the die 21 by screen printing. In actual implementation, other conductive materials can be used.

Please refer to FIG. 10 , for the bare chip 21 is coated with the complex transmission circuit 31 , the plurality of contact electrodes 32 , and the state of the marking area 33 , the marking area 33 is covered with conductive material, and the marking area 33 is prepared. The plurality of contact electrodes 32 are separately disposed at both ends of the plurality of transmission circuits 31 , and the conductive material in the marking area 33 is electrically connected to the plurality of transmission circuits 31 .

In the area coating step 92, the conductive material coated on the surface of the die 21 covers one end of the plurality of transmission circuits 31, please refer to FIG. 11, when the second screen is placed on the die 21, the The area pattern will cover the partial area of the complex transmission circuit 31. When the conductive material is coated with the technique of screen printing, the conductive material will cover the partial area of the complex transmission circuit 31, so that in the preparation area 33 The conductive material can be electrically connected with the plurality of transmission circuits 31 .

In the material removal step 93 , part of the conductive material in the preparation area 33 is removed, so that the conductive material in the preparation area 33 forms a plurality of detection electrodes 34 at one end of the plurality of transmission circuits 31 .

Please refer to FIG. 12 , which is the appearance of the complex transmission circuit 31, the complex contact electrodes 32, and the complex detection electrodes 34 on the bare chip 21. The complex detection electrodes 34 are electrically connected with the complex transmission circuit 31, and the marking area 33 The conductive material is removed by laser ablation technology to form a plurality of detection electrodes 34, the plurality of detection electrodes 34 are spaced apart from each other and arranged in parallel, the plurality of transmission circuits 31 are spaced apart from each other and arranged in parallel, and the plurality of contact electrodes 32 are spaced apart from each other and arranged in parallel It is provided that after the laser ablation, a redundant conductive layer will be formed in the preparation area 33 , which can be left or removed in addition, and will not affect the blood detection purpose of the test strip 5 .

Preferably, in the material etching step 93, laser etching technology is used to remove part of the conductive material in the preparation area 33. In actual implementation, chemical etching, dry etching, or other removal methods can be used. The technology of conductive materials should not be limited to this, because the laser beam in the current laser engraving machine is relatively fine, and the position of laser beam movement can be accurately controlled, so the conductive material in the engraving area 33 can be It is also possible to control the plurality of detection electrodes 34 into elongated structures by carving out very fine pitches. Based on the fine width of the plurality of detection electrodes 34 and the small distance between each other, the detection area of the detection test piece can be reduced. The installation area further reduces the amount of the reaction layer coating the detection area in subsequent processes.

Please refer to FIG. 13 , which is a third preferred embodiment of an electrode manufacturing method of the present invention. The third preferred embodiment is substantially the same as the second preferred embodiment. The same parts will not be described in detail here, and the different parts The reason is that, in the material removal step 93 , the plurality of detection electrodes 34 are arranged in parallel and form a zigzag shape 35 on the sides, and the adjacent zigzag sides of the plurality of detection electrodes 34 are correspondingly arranged with convex and concave.

Since the subsequent process of the detection test piece will coat a layer of reaction layer on the surface of the detection area, the reaction layer covers the plurality of detection electrodes 34, so that the blood glucose measuring machine can detect the electrical properties of the reaction layer, due to the The sides of the plurality of detection electrodes 34 form a zigzag shape 35, which can increase the area of electrical contact between the plurality of detection electrodes 34 and the reaction layer, and can reduce the contact resistance, so that the detection value of the reaction layer is more accurate. In addition Because the adjacent sawtooth sides of the plurality of detection electrodes 34 are correspondingly arranged with convex and concave, the distance between the plurality of detection electrodes 34 can be effectively fixed, so that the electrification distance of the reaction layer is fixed, and the error of measuring the reaction layer is effectively reduced.

It is worth mentioning that in the third preferred embodiment, the technology of laser ablation is used to form the sawtooth shape 35 on the sides of the plurality of detection electrodes 34. In actual implementation, the material ablation step 93 Afterwards, the appearance of the edges of the plurality of detection electrodes 34 can form a circular, rectangular or irregular shape (such as the circular or irregular pattern formed by the engraved line 23 of the first preferred embodiment), and should not It is limited to the example of this preferred embodiment.

Please refer to FIG. 10 , which is a fourth preferred embodiment of an electrode manufacturing method of the present invention. The fourth preferred embodiment is substantially the same as the second preferred embodiment. The same parts will not be described in detail here. The different parts The advantage is that the electrode manufacturing method further includes a foreign matter cleaning step 94 before the area coating step 92 , and a quality control inspection step 95 after the material removal step 93 .

In the foreign matter cleaning step 94, the foreign matter on the surface of the die 21 can be removed by using the technology of roller cleaning, and the foreign matter on the surface of the die 21 can also be removed by using the technology of air blowing, so that the conductive material can be perfectly coated. Overlay on the bare chip 21 and form the preparation area 33. Since the complex detection electrodes 34 formed by laser etching have the structure and the characteristics of miniaturized spacing, any foreign matter attached will affect the complex detection electrodes 34. Therefore, it is very important to coat the conductive material after removing the foreign matter on the surface of the die 21 .

In the wire coating step 91, a plurality of contact electrodes 32 are formed at one end of the plurality of transmission circuits 31, and in the area coating step 92, the preparation area 33 and the plurality of contact electrodes 32 are separately arranged on the plurality of transmission circuits 31 In the quality control detection step 95, the quality control liquid is coated on the plurality of detection electrodes 34, and the plurality of contact electrodes 32 are used as detection points to measure the plurality of transmission circuits 31, the plurality of detection electrodes 34, and the plurality of detection electrodes. The electrical property of the quality control liquid is used to judge whether the plurality of detection electrodes 34 meet the standard.

The quality control liquid used has the characteristics of fixed electrical properties, so whether the structure of the plurality of detection electrodes 34 can be tested by using the quality control liquid, for example, when the detection resistance of the quality control liquid is higher than the standard value , indicating that the distance between the plurality of detection electrodes 34 is too large, or that the plurality of detection electrodes 34 have foreign objects and cause an open circuit. The distance between the plurality of detection electrodes 34 is too small, so the testing step of the quality control solution must be passed, and the manufactured test strip has the ability to accurately measure blood sugar. Several groups of conductive layers are used for electrode detection. In practice, all conductive layers can be used for electrode electrical detection, and should not be limited to this.

In the wire coating step 91, a first bottom layer coating step 911 and a substep of a first top layer coating step 912 are included. In the first bottom layer coating step 911, silver is coated on the bare The surface of the sheet 21, in this first top coat step 912, carbon is coated on the surface of the silver.

In the area coating step 92, a second primer coating step 921 and a sub-step of a second top coat coating step 922 are included. In the second primer coating step 921, silver is coated on the bare The surface of the sheet 21, in this second top coating step 922, carbon is coated on the surface of the silver.

Preferably, in the wire coating step 91 and the area coating step 92, the silver used is silver glue, and the carbon used is carbon powder. In actual implementation, other conductive materials can be used, and should not be used This is the limit, because silver has better conductivity, so it is placed on the bottom layer to transmit electricity, while carbon is more wear-resistant and not easy to oxidize, so it is set on the surface layer to protect the silver on the bottom layer.

As can be seen from the above description, a detection test piece 5 of the present invention, and the electrode manufacturing method really have the following effects:

1. Reduce production costs:

The plurality of transmission circuits 521 and the plurality of contact electrodes 523 in the detection test piece 5 are screen-printed with lower cost. Only the part of the plurality of detection electrodes 522 is screen-printed first and then laser engraved. The entire layer 52 does not need to be laser engraved, which effectively reduces the production cost.

2. The detection area is miniaturized:

The structure of the plurality of detection electrodes 522 can be reduced by using laser ablation technology, and the distance between the plurality of detection electrodes 522 can also be finer, so that the area of the detection region 57 can be miniaturized, and the gap between the reaction layer 56 can be further reduced. The amount of reactant used.

3. Homogenization of the reaction layer:

Since the laser ablation technology can reduce the distance between the plurality of detection electrodes 522, when the reactants are coated on the plurality of detection electrodes 522, the reactants in the liquid state will be uniformly dispersed on the plurality of detection electrodes 522. On the surface and in the crevices, when the reactant dries, a reaction layer 56 with a uniform thickness will be formed on the plurality of detection electrodes 522 .

To sum up, since the plurality of transmission circuits 521 and the plurality of contact electrodes 523 do not need to be coated with the reaction layer 56, and therefore do not need a circuit with higher fineness, the use of screen printing with lower cost can effectively reduce the manufacturing cost. cost, and the multiple detection electrodes 522 that need to be coated with the reaction layer 56 to require a circuit with higher fineness, and then use the laser ablation technology that can miniaturize the electrode structure and narrow the electrode spacing, the detection test piece can be made 5. The detected blood sugar value is more accurate, and the amount of reactants in the reaction layer 56 can also be reduced, and the reactants can be evenly arranged in the detection area 57, so the purpose of the present invention can indeed be achieved.

But the above are only four preferred embodiments of the present invention, and should not limit the scope of the present invention with this, that is, all simple equivalent changes and Modifications still fall within the scope covered by the patent of the present invention.

21: bare chip 22: Boundary of test piece 23: Engraving line 31: Transmission circuit 32: contact electrode 33: Preparation area 34: Detection electrode 35: Zigzag shape 5: Detection test piece 51: lower bottom plate 52: Conductive layer 521: transmission circuit 522: detection electrode 523: contact electrode 53: Middle partition 54: Upper board 541: Attachment Department 542: Extension 55:Accommodating space 56: Reaction layer 57: Detection area 58: Contact area 61: The first transmission circuit 611: the first detection electrode 612: first contact electrode 62: the second transmission circuit 621: the second detection electrode 622: second contact electrode 63: The third transmission circuit 631: The third detection electrode 632: the third contact electrode 64: The fourth transmission circuit 641: The fourth detection electrode 642: The fourth contact electrode 65: Reaction layer 66: Detection area 67: Contact area 68: Upper board 81: Coating step 82: Engraving steps 91: wire coating step 911: First Primer Coating Step 912: First Top Coating Step 92: Area coating step 921: second primer coating step 922: Second Top Coating Step 93:Material removal step 94: Foreign matter cleaning steps 95: Quality control testing steps

Fig. 1 is a flow chart, is one of first preferred embodiment of a kind of electrode manufacturing method of the present invention; Fig. 2 is a schematic front view, illustrating in the first preferred embodiment, the conductive material on the surface of a bare chip, and the complex transmission circuits formed after the etching step; Fig. 3 is a schematic front view illustrating that in the first preferred embodiment, a reaction layer is formed on the surface of the die; FIG. 4 is a schematic front view illustrating that a detection region and a contact region are formed on the die in the first preferred embodiment; Fig. 5 is a three-dimensional schematic diagram, which is a second preferred embodiment of a detection test piece of the present invention, illustrating the three-dimensional appearance of the detection test piece; Fig. 6 is an exploded schematic diagram illustrating the disassembled state of the detection test piece in the second preferred embodiment; Fig. 7 is a schematic cross-sectional view illustrating the cross-sectional appearance of the test strip in the second preferred embodiment; and Fig. 8 is a flow chart, illustrates in this second preferred embodiment, is arranged on the manufacturing method of the electrode in this test piece; 9 is a schematic front view illustrating a plurality of transmission circuits and a plurality of contact electrodes formed after coating a bare chip with a conductive material in a wire coating step in the electrode manufacturing method of the second preferred embodiment ; 10 is a schematic front view illustrating that in the electrode manufacturing method of the second preferred embodiment, in an area coating step, another conductive material is coated on the die to form a preparation area; 11 is a schematic cross-sectional view illustrating the cross-sectional appearance of the die covering the transmission circuit in the preparation area formed by conductive material in the area coating step in the electrode manufacturing method in the second preferred embodiment; Fig. 12 is a schematic front view illustrating that in the electrode manufacturing method of the second preferred embodiment, in a material etching step, after the conductive material in the preparation area is etched, a plurality of detection electrodes and a plurality of detection electrodes are formed. The front view of the bare chip of the transmission circuit and the plurality of contact electrodes; Fig. 13 is a partial schematic diagram, which is a third preferred embodiment of a detection test piece of the present invention, illustrating the appearance of a plurality of detection electrodes having a zigzag shape; and Fig. 14 is a flow chart of a fourth preferred embodiment of a method for manufacturing an electrode of a test strip according to the present invention.

91: wire coating step

92: Area coating step

93:Material removal step

Claims (10)

A method of manufacturing an electrode, comprising the steps of: A wire coating step, using a first screen to coat the surface of a bare chip with conductive material, the first screen has at least one circuit pattern, so that the conductive material forms a plurality of transmission circuits on the surface of the bare chip ; An area coating step, using a second screen to coat the surface of the bare chip with conductive material, the second screen has at least one area pattern, so that the conductive material forms a pattern on the surface of the die area, the conductive material in the spare area is connected to one end of the plurality of transmission circuits; and A material removal step, removing part of the conductive material in the preparation area, so that the conductive material in the preparation area forms a plurality of detection electrodes at one end of the plurality of transmission circuits. The electrode manufacturing method as described in claim 1, wherein, in the material etching step, the method of removing part of the conductive material in the preparation area is selected from laser etching, chemical etching, and dry etching. One technology. The electrode manufacturing method as described in claim 1 further includes a foreign matter cleaning step before the region coating step to remove foreign matter on the surface of the die. The electrode manufacturing method as described in Claim 1, wherein, in the wire coating step, the following sub-steps are included: a first primer coating step, coating the surface of the die with silver; and A first top coating step applies carbon to the surface of the silver. The electrode manufacturing method according to claim 1, wherein, in the area coating step, the following sub-steps are included: a second primer coating step, coating the surface of the die with silver; and A second top coating step applies carbon to the surface of the silver. The method for manufacturing electrodes in a test strip according to claim 1, wherein, in the area coating step, the conductive material coated on the surface of the bare chip covers one end of the plurality of transmission circuits. The electrode manufacturing method as described in Claim 1 further includes a quality control inspection step after the material removal step. In the wire coating step, a plurality of contact electrodes are formed at one end of the plurality of transmission circuits, and the area is coated In the covering step, the preparation area and the plurality of contact electrodes are separately arranged at both ends of the plurality of transmission circuits, and in the quality control detection step, the quality control liquid is coated on the plurality of detection electrodes, and the plurality of contact electrodes are used as the detection point, measure the electrical properties of the plurality of transmission circuits, the plurality of detection electrodes, and the quality control liquid to determine whether the plurality of detection electrodes meet the standards. The electrode manufacturing method as described in Claim 1, wherein, in the material removal step, the plurality of detection electrodes are arranged in parallel with sides forming a zigzag shape, and the adjacent zigzag sides of the plurality of detection electrodes are correspondingly arranged in convex and concave shapes. A method of manufacturing an electrode, comprising the steps of: a coating step of applying conductive material to the surface of a die using screen printing; and A removal step is to remove part of the conductive material on the surface of the bare chip, so that the conductive material remaining on the surface of the bare chip forms a plurality of transmission circuits, and the plurality of transmission circuits are short-circuited with each other, and the two ends of each transmission circuit are respectively A detection electrode and a contact electrode, the plurality of detection electrodes are close to each other for coating a reaction layer, and the plurality of contact electrodes are close to each other for a blood glucose measuring machine to detect the electrical property of the reaction layer. A detection test piece, suitable for the electrode manufacturing method described in any one of Claims 1-9, comprising: Click on the bottom plate; A conductive layer arranged on the surface of the lower base plate, the conductive layer includes a plurality of transmission circuits, a plurality of detection electrodes arranged at one end of the plurality of transmission circuits, and a plurality of contact electrodes arranged at the other end of the plurality of transmission circuits; A middle partition is attached to the lower bottom plate, the plurality of transmission circuits are covered between the middle partition and the lower bottom plate, and the plurality of detection electrodes and the plurality of contact electrodes are exposed to the outside; An upper plate, including an attachment portion attached to the middle partition, and an extension portion connected to the attachment portion, the extension portion is spaced from the lower base plate, and the plurality of detection electrodes and defines a a containment space; and A reaction layer is arranged in the accommodating space, and the reaction layer is attached to the lower bottom plate and covers the plurality of detection electrodes.

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