CN217786134U

CN217786134U - Test board for measuring copper thickness of PCB

Info

Publication number: CN217786134U
Application number: CN202221691525.0U
Authority: CN
Inventors: 刘孟豪; 张晓敏; 陈秋萍
Original assignee: Gultech Suzhou Electronics Co ltd
Current assignee: Gultech Suzhou Electronics Co ltd
Priority date: 2022-06-30
Filing date: 2022-06-30
Publication date: 2022-11-11
Anticipated expiration: 2032-06-30

Abstract

The utility model provides a measure test panel that PCB copper is thick usefulness, including a plurality of test units, lay the test PAD of a plurality of different widths in every test unit, can establish the qualitative curve that obtains its corresponding copper thick correspondence through this survey test panel, operating personnel as long as prepare two at least these survey test panels, under the PAD width of the PCB board that awaits measuring is different from the standard piece of the thick measuring apparatu of copper condition, also can utilize the formula to calculate its actual copper thick, reduced the use of standard piece, practiced thrift the cost.

Description

Test board for measuring copper thickness of PCB

Technical Field

The utility model belongs to the technical field of the PCB processing and specifically relates to a measure test board of thick usefulness of PCB copper is related to.

Background

In the manufacturing process of the PCB, the thickness of the copper film on the surface of the PCB directly influences the reliability, the stability and the service life of the final electronic circuit during working conduction. The coating is structurally composed of a copper coating and a substrate, and the thickness of the coating generally ranges from a few micrometers to more than a hundred micrometers. At present, the plating layer measuring method mainly comprises a micro-resistance method, a coulometric method, a surface step profile method, a micro-metallography method, an X-ray fluorescence spectrum analysis method and the like; among them, the micro-resistance method is a contact type commonly used method and widely used because of its convenience, rapidness and high precision.

However, because the surface copper thickness gauge method utilizes the relation between the copper thickness and the cross-sectional area, different standard sheets are required to be selected for calibration when surface copper with different widths is measured; on the production line, 50-100 different material numbers are produced on average every day, the material numbers need to be frequently switched, and the widths of areas for the probes to measure are different, so that the calibration needs to be carried out by using various standard sheets with different widths to collect accurate copper thickness data, the cost is greatly increased, and the production time is undoubtedly increased by replacing different standard sheets.

Disclosure of Invention

In order to solve the problem, the utility model provides a measure test board of thick usefulness of PCB copper.

The main contents of the utility model are as follows:

a test board for measuring the copper thickness of a PCB comprises a substrate, a first electrode, a second electrode and a third electrode, wherein the substrate comprises a first surface and a second surface which are oppositely arranged; the first surface and the second surface are coated with copper foil layers, and a plurality of test units are formed on the first surface in an etching mode; a single one of the test units includes test PADs of several different widths.

Preferably, the plurality of test PADs are sequentially and transversely arranged at equal intervals according to the width, and the heights of the plurality of test PADs are the same.

Preferably, a single test unit comprises a first area and a second area which are arranged up and down, and the same number and the same specification of test PADs are distributed in the first area and the second area.

Preferably, the test PADs in the first area are arranged in an order opposite to the order in which the test PADs in the second area are arranged.

Preferably, a plurality of separation grooves which are arranged in a staggered manner are etched and formed on the first surface; the first surface is divided into a plurality of test units by a plurality of dividing grooves.

Preferably, the separation grooves comprise a plurality of transverse grooves and a plurality of longitudinal grooves which are vertically intersected.

The beneficial effects of the utility model reside in that: the utility model provides a measure test board that PCB copper is thick usefulness, including a plurality of test unit, lay the test PAD of a plurality of different widths in every test unit, can establish the qualitative curve that obtains its corresponding copper thick correspondence through this survey test panel, operating personnel as long as prepare two at least these survey test panels, under the PAD width of the PCB board that awaits measuring is different from the standard piece of thick measuring apparatu of copper condition, also can utilize the formula to calculate its actual copper thick, reduced the use of standard piece, practiced thrift the cost.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

reference numerals:

10-a substrate; 100-a test unit; 110-a first region; 120-a second region; 20-test PAD; 30-separation grooves.

Detailed Description

The technical solution protected by the present invention will be specifically described below with reference to the accompanying drawings.

Please refer to fig. 1. The utility model provides a test board for measuring PCB copper thickness, which comprises a substrate 10, wherein the substrate 10 comprises a first surface and a second surface which are oppositely arranged; fig. 1 shows the first surface, the second surface not being shown. A copper foil layer is coated on the first surface and the second surface, and a plurality of test units 100 are etched and formed on the first surface; a single such test unit 100 includes test PADs 20 of several different widths.

In one embodiment, the plurality of test PADs 20 are sequentially arranged in the transverse direction at equal intervals and according to the width, and the heights of the plurality of test PADs 20 are the same.

Further, a single test unit 100 includes a first area 110 and a second area 120 arranged up and down, and the same number and the same specification of test PADs 20 are arranged in the first area 110 and the second area 120. Furthermore, in this embodiment, 8 test PADs 20 with different widths are uniformly distributed in the first area 110 and the second area 120, the height of each test PAD is 25mm, the test PADs in the first area 110 are arranged from small to large according to the width, and the width of each test PAD is 2mm, 4mm, 6mm, 8mm, 10mm, 15mm, 20mm and 25mm, and in order to avoid deformation of the substrate and the copper foil layer caused in the etching process, the test PADs in the second area 120 are arranged in the order opposite to the arrangement order of the test PADs in the first area 110.

In practical use, in order to calibrate the copper thickness measuring instrument, several test units can be randomly selected for slicing, and the test board is used for establishing the relationship between the PAD width to be tested, the display value of the copper thickness measuring instrument and the actual copper thickness, so that the test board can be damaged; the plurality of dividing grooves 30 divide the first surface into the plurality of test cells. When verification is required, the copper thickness of the test board can be obtained by only measuring at the separation grooves 30 with a certain tool. Further, the separation grooves 30 include a plurality of transverse grooves and a plurality of longitudinal grooves which intersect perpendicularly.

The following describes in detail how the test board is used.

In actual use, at least two test boards with different copper thicknesses are required to be prepared, firstly, a copper thickness measuring instrument is used for measuring all test PADs in a single test unit, and corresponding display values are recorded; then according to the qualitative curve y = A (B-e) of the copper thickness measuring instrument ^-Cx ) Fitting the optimal fitting values of the A, B and C positions through curve regression software, and thus creating and obtaining a qualitative curve corresponding to the test plate; different qualitative curves can be created through test boards with different copper thicknesses; as in the present example, two test boards of copper thickness were prepared, one 64.28 μm thick, which exceeds the copper thickness of the PCB board to be measured, for which a qualitative curve equation was created, noted:

the other test panel, which had a copper thickness of 30.6 μm, was used to create a qualitative curve equation, recorded as:

when the PCB different from the width of the standard sheet of the copper thickness measuring instrument needs to be measured, the actual copper thickness can be calculated by only electrically contacting four probes of the copper thickness measuring instrument on the PAD of the PCB, and substituting the width of the PAD and the display value on the copper thickness measuring instrument into the following formula, wherein the formula is marked as follows: h = H ₂ -[(y ₂ -y)/(y ₂ -y ₁ )×(h ₂ -h ₁ )]Wherein, in the present embodiment, h ₂ 60.28 μm, y ₂ Showing the display value corresponding to the PAD width calculated according to the qualitative curve; h is ₁ Is 30.6 μm, y ₁ The display value corresponding to the PAD width is calculated according to the qualitative curve, and y represents the display value of the copper thickness measuring instrument at the moment.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A test board for measuring the copper thickness of a PCB is characterized by comprising a substrate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged; the first surface and the second surface are coated with copper foil layers, and a plurality of test units are formed on the first surface in an etching mode; a single said test unit comprises test PADs of several different widths.

2. The test board for measuring copper thickness of PCB as claimed in claim 1, wherein a plurality of said test PADs are sequentially arranged in a horizontal direction at equal intervals and in width, and a plurality of said test PADs have the same height.

3. The test board for measuring copper thickness of PCB as claimed in claim 2, wherein a single test unit comprises a first area and a second area disposed one above the other, and the same number and the same specification of test PADs are disposed in the first area and the second area.

4. The test board of claim 3, wherein the test PADs in the first area are arranged in an order opposite to that of the test PADs in the second area.

5. The test board for measuring the copper thickness of the PCB of claim 1, wherein a plurality of staggered separation grooves are etched and formed on the first surface; the first surface is divided into a plurality of test units by a plurality of dividing grooves.

6. The test board for measuring copper thickness of PCB of claim 5, wherein the separation grooves comprise a plurality of transverse grooves and a plurality of longitudinal grooves which are intersected perpendicularly.