TW202315045A - Light source device, preparation method of light source device and display equipment - Google Patents

Abstract

The invention belongs to the technical field of display, and provides a light source device, a preparation method of the light source device and display equipment. The light source device comprises a driving chip, at least one LED chip set, a circuit line layer, a channel wire, a first metal bonding pad and a second metal bonding pad, wherein the first metal bonding pad is arranged on the first surface of the driving chip, the circuit line layer and the second metal bonding pad are arranged on the second surface of the driving chip, the side surface of the driving chip is provided with the channel wire used for connecting the circuit line layer and the first metal bonding pad, and the LED chip set is arranged on the second surface of the driving chip and connected with the second metal bonding pad; and the channel wire is arranged on the side surface of the driving chip to connect the circuit line layer and the first metal bonding pad on the two surfaces of the driving chip, the size of the light source device is reduced, and the problem that the size of a packaging body of an existing light source body is large and cannot be reduced is solved.

Description

Light source element, preparation method of light source element, and display device

The present invention relates to the technical field of display, in particular to a light source element, a preparation method of the light source element and a display device.

In the display screen market, with the rapid development of technology, transparent display screens have become the mainstream devices used in emerging markets, and the main components of transparent display screens are integrated light sources including driver chips and LED (light-emitting diode) chips Body, the existing LED light source body uses the vertical structure packaging technology to fix the driver chip on the circuit carrier in a flip-chip manner, fix the front-emitting LED chip directly above the driver chip, and then solder The LED chip is electrically connected with the driving chip and the circuit carrier by means of conducting wires, so as to realize the driving of the integrated LED light source body.

However, the above-mentioned design has the problem that a space for soldering wires needs to be reserved on the circuit board, so that the size of the package cannot be reduced.

The object of the present invention is to provide a light source element, a preparation method of the light source element and a display device, aiming at solving the problem that the package size of the existing light source body is large and cannot be reduced.

The first aspect of the embodiment of the present invention provides a light source element, including: a driving chip, the first surface of the driving chip is provided with a plurality of first metal pads, and the first surface of the driving chip is opposite to the first surface of the driving chip. The circuit line layer and a plurality of second metal pads provided on both sides, the circuit line layer is connected to a plurality of the second metal pads, and connected to the first surface of the driving chip and the second side of the driving chip. The side of the driving chip on the surface is provided with a plurality of channel wires exposed to the driving chip, and the plurality of channel wires are connected to the circuit line layer and respectively connected to a plurality of the first metal pads; and at least one An LED chip group, the LED chip group is arranged on the second surface of the driving chip and connected to a plurality of the second metal pads.

Preferably, the light source element further includes: a circuit substrate, the driving chip is arranged on the upper surface of the circuit substrate and the first surface of the driving chip faces the upper surface of the circuit substrate, and the circuit substrate A plurality of electrical contacts are provided on the lower surface of the circuit board; and an outer sealing colloid covers the driving chip and the LED chip group and connects the periphery of the upper surface of the circuit substrate.

Preferably, the LED chip group includes a red LED chip, a green LED chip and a blue LED chip.

Preferably, both the LED chip group and the plurality of second metal pads are located in the middle area of the second surface of the driving chip.

Preferably, at least one LED chip group is a plurality of the LED chip groups, and the plurality of the LED chip groups and the plurality of the second metal pads are distributed in the four corners of the second surface of the driving chip.

Preferably, a plurality of the first metal pads are distributed in the surrounding area of the first surface of the driving chip.

The second aspect of the embodiment of the present invention provides a method for preparing a light source element, and the method includes the following steps: Manufacture a driving chip wafer, the driving chip wafer has a plurality of sub-blocks, a plurality of longitudinal slits and a plurality of transverse slits, the plurality of transverse slits perpendicularly intersect with the plurality of longitudinal slits and divides a plurality of said sub-blocks separated from each other; forming a plurality of through holes in the plurality of longitudinal slits and the plurality of transverse slits, and filling the through holes with conductive material to form channel wires; A plurality of first metal pads are arranged on the first side of the sub-block, and a circuit line layer and a plurality of connecting the circuit lines are arranged on the second side of the sub-block opposite to the first side of the sub-block. layer of the second metal pad, and make the channel wire connect the first metal pad and the circuit line layer of two adjacent sub-blocks; Cutting along the respective centerline positions of the plurality of longitudinal dicing lines and cutting along the respective midline positions of the plurality of transverse dicing lines so that the sub-blocks form driving wafers; A circuit carrier is provided, a plurality of the driver chips are arranged on the upper surface of the circuit carrier and the first surface of the driver chip faces the upper surface of the circuit carrier, and the circuit carrier The lower surface is provided with a plurality of electrical contacts; At least one LED chip is assembled on the second surface of the driving chip and connected to a plurality of the second metal pads of the driving chip; Making an outer packaging layer, the outer packaging layer covers a plurality of the driving chips and a plurality of the LED chip groups and connects the surrounding area of the upper surface of the circuit carrier and is located between the plurality of driving chips the gap area between; and The outer packaging layer and the circuit carrier are cut along the gaps between the plurality of driving chips to obtain a plurality of light source elements.

Preferably, the circuit line layer and the plurality of second metal pads on the second surface of the sub-block are formed by etching a metal layer.

Preferably, the plurality of first metal pads of the sub-block are formed in a redistribution layer manner.

The third party of the embodiment of the present invention provides a display device, including: a transparent conductive plate and a plurality of light source elements as described in any one of the above, and a plurality of the light source elements are arranged in an array on the transparent conductive plate And the plurality of first metal pads on the first surface of the driving chip are electrically connected to the transparent conductive plate.

The light source element and its preparation method provided by the embodiments of the present invention are to realize the electrical connection design of the double-sided circuit layer by using the space of the wafer dicing lane to realize the electrical connection design of the double-sided circuit layer. Compared with the existing chip, the circuit design is done by avoiding the position of the through hole inside. limitations of the present invention, the method of the embodiment of the present invention is more flexible, so that the internal design of the circuit can be better dense, thereby releasing the area space of the driver chip, so that when the light source body is packaged, it can achieve a single The size is more miniaturized. The drive chip formed in this way is integrated with at least one LED chip group. Under the same performance conditions, it can achieve the miniaturization and meet the improvement of the luminous brightness of the product. Therefore, its products can be used in the transparent display device market. To achieve the requirement of smaller dot pitch and high brightness display without affecting the transparent effect.

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

In the description of the present invention, it should be understood that the terms "first" and "second" are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features.

As shown in Figure 1, the main component of the current transparent display screen is the LED light source body (including the driver chip and the LED chip), because the vertical structure packaging technology adopted by the existing LED light source body is to flip the driver chip 11 Fixed and electrically connected to the circuit substrate 10, the front-emitting LED chip 13 is fixed directly above the driver chip 11, and then the LED chip 13 is electrically connected to the driver chip 11 and the circuit substrate 10 by soldering a conductive wire. , and then encapsulated by molding colloid 12 so as to realize the integrated light source of the driver chip and the LED chip. The size of the LED light source body realized by this technology is difficult to be miniaturized, and it needs to be pre-prepared on the circuit substrate 10. A certain space for soldering wires is reserved, so that the size of the package cannot be reduced.

Although in the prior art there is also a Through Silicon Via (TSV) technology (Through Silicon Via, TSV) as shown in FIG. 21, but when designing the internal structural circuit 22 of the driver chip 21, the internal circuit of the chip must avoid the reserved space range required for making TSVs. This design structure not only increases the difficulty of realizing the internal circuit of the driver chip 21 , also increases the design cost of the wafer, and the area of the driver wafer 21 designed in this way is also difficult to reduce.

In order to solve the above-mentioned technical problems, an embodiment of the present invention provides a light source element. As shown in FIG. 3, FIG. 4, FIG. 5a, FIG. 5b and FIG. The line layer 03 , the channel wire 04 , the first metal pad 01 , the second metal pad 02 and at least one LED chip group 50 .

Specifically, the first surface of the driving chip 40 is provided with a plurality of first metal pads 01, and the second surface of the driving chip 40 opposite to the first surface of the driving chip 40 is provided with a circuit line layer 03 and a plurality of second metal pads. Welding pad 02, circuit line layer 03 connects a plurality of second metal pads 02, connects the first side of driving chip 40 and the side of driving chip 40 of the second side of driving chip 40, is provided with a plurality of exposed to driving chip 40 Channel wires 04, a plurality of channel wires 04 are connected to the circuit wire layer 03 and respectively connected to a plurality of first metal pads 01; at least one LED chip group 50 is arranged on the second surface of the driver chip 40 and soldered to the plurality of second metal pads Disk 02 is connected.

In this embodiment, as shown in FIG. 5b, the circuit line layer 03 is connected to a plurality of second metal pads 02, and the plurality of second metal pads 02 are connected to the LED chip group 50. The circuit line layer 03 is used to connect the LED The chip group 50 provides the driving signal. Since the second surface of the driving chip 40 is provided with the circuit line layer 03, it is possible to realize the circuit transfer connection of a plurality of second metal pads 02 with unlimited positions, thereby reducing the size of the light source element. Moreover, a plurality of channel wires 04 exposed to the driver chip 40 are provided on the side of the driver chip 40, and the through holes 502 of the plurality of channel wires 04 are arranged on the dicing lines 501 of the wafer, and a plurality of driver chips are formed after the wafer is diced. 40, the channel wire 04 is used to connect the first metal pad 01 on the first side of the driver chip 40 and the circuit line layer 03 on the second side of the driver chip 40. This design not only reduces the length of the connecting line, but also The occupation of the position of the lead wire is avoided, the size of the light source element is greatly reduced, and the problem that the size of the package body existing in the existing light source body is large and cannot be reduced is solved.

FIG. 5 a and FIG. 5 b are schematic diagrams of the circuit structure on the surface of the driver chip 40 in which at least one LED chip group 50 is one LED chip group 50 and a plurality of LED chip groups 50 , respectively.

In this embodiment, the second surface of the driver chip 40 is provided with a circuit line layer 03 and a plurality of second metal pads 02, and through a plurality of channel wires 04, the plurality of first metal pads on the first surface of the driver chip 40 The pad 01 is conductively connected to the circuit line layer 03 on the second side of the driver chip 40, and the plurality of second metal pads 02 on the second side of the driver chip 40 are connected to at least one LED chip group 50, thereby forming a brand new Miniaturized double-sided line driver chip 40 .

In one embodiment, the size of the through hole 502 provided in the dicing street 501 of the wafer is 50-200 μm in order to achieve a higher interconnection density.

In one embodiment, as shown in FIG. 6 a and FIG. 6 b , the light source element further includes: a circuit substrate 10 and an external sealing compound 60 . Specifically, the driving chip 40 is arranged on the upper surface of the circuit substrate 10 and the first surface of the driving chip 40 faces the upper surface of the circuit substrate 10, and the lower surface of the circuit substrate 10 is provided with a plurality of electrical contacts; Covers the driver chip 40 and the LED chip group 50 and connects the periphery of the upper surface of the circuit board 10 .

In this embodiment, the circuit substrate 10 may be a printed circuit board (Printed Circuit Board) or the like; the LED chip group 50 is fixed directly above the driving chip 40 through a flip-chip process and is electrically connected to the second metal pad 02, In this way, a light source body in which the drive chip 40 and at least one LED chip group 50 can be integrated into one package with the ultimate package size is formed, which saves the space reserved on the circuit substrate 10 for placing the light source body and welding wires, and greatly reduces the size of the package. Encapsulate the size of the product, so that the size of the light source element becomes smaller and more refined, so that its product can be used in the transparent display device market to achieve a smaller dot pitch and high brightness display without affecting the transparent effect. need.

In one embodiment, the LED chip group 50 includes a red LED chip, a green LED chip and a blue LED chip for combining and emitting light of different colors.

In one embodiment, at least one LED chip group 50 is an LED chip group 50, and the plurality of second metal pads 02 are located in the middle area of the second surface of the driver chip 40, thereby forming a new miniaturized The double-sided circuit-driven chip 40 greatly reduces the size of the light source element, and solves the problem that the package size of the existing light source body is large and cannot be reduced.

In one embodiment, at least one LED chip group 50 is a plurality of LED chip groups 50, and the plurality of LED chip groups 50 and the plurality of second metal pads 02 are all distributed in the four corners of the second surface of the driving chip 40, so that The light source element emits light more evenly.

In one embodiment, a plurality of first metal pads 01 are distributed in the surrounding area of the first surface of the driving chip 40, and the surrounding area is the edge position close to the channel wire 04 on the first surface, so as to realize the double-sided circuit layer structure design , which is more flexible.

In this embodiment, by making the layout of the channel wires 04 on the surrounding sides of the driving chip 40, the internal space of the driving chip 40 is released, and when the light source body element is packaged, the size of the single body can be further miniaturized, because The space flexibility of the layout channel wires 04 around the side of the driver chip 40, the driver chip 40 with the same single area can also realize the layout of multiple groups of metal pads on the front and back, and when the light source body is packaged in a certain space, the product’s Luminous brightness can also achieve a greater improvement.

In one embodiment, FIG. 6a is a schematic diagram of an LED chip group 50, and FIG. 6b is a schematic diagram of multiple LED chip groups 50, and the LED chip group 50 is connected to a plurality of corresponding second metal pads 02. A LED chip group 50 fully improves the luminous effect, makes the emitted light cells uniform, the irradiation range is wider, and the color is more uniform.

In this embodiment, a plurality of LED chip groups 50 are arranged in an array, arranged neatly, and have a better light emitting effect.

In addition, an embodiment of the present invention also provides a method for manufacturing a light source element, as shown in FIG. 7 , the method includes steps S10 to S80.

In step S10, the driving chip wafer is manufactured. As shown in FIG. The longitudinal cutting lines 501 vertically intersect and divide a plurality of sub-blocks separated from each other.

In step S20 , a plurality of through holes 502 are formed in the plurality of longitudinal scribe lines 501 and the plurality of transverse scribe lines 501 , and a conductive material is filled in the through holes 502 to form the channel wires 04 . In one embodiment, the channel wire 04 is processed by TSV (Through Silicon Via) technology, which can realize the electrical connection between different metal pads and realize the miniaturization of component integration. Since the dicing line 501 is on the periphery of the sub-block of the driver wafer, making the channel wire 04 in the dicing line 501 will not affect the wiring arrangement inside the sub-block, and there is no need to reserve the channel wire 04 inside the sub-block space, reducing the size of the light source components.

In step S30, a plurality of first metal pads 01 are provided on the first surface of the sub-block, and a circuit line layer 03 and a plurality of connection circuits are provided on the second surface of the sub-block opposite to the first surface of the sub-block. The second metal pad 02 of the line layer 03, and the channel wire 04 is connected to the first metal pad 01 and the circuit line layer 03 of two adjacent sub-blocks.

In step S40, cutting along the respective midline positions of the plurality of longitudinal dicing lines 501 and cutting along the respective midline positions of the plurality of transverse dicing lines 501 makes the sub-blocks form the driving wafer 40, so that the sides of each driving wafer 40 There are a plurality of channel wires 04 exposed to the driver chip 40 .

In step S50, a circuit carrier is provided, a plurality of driving chips 40 are arranged on the upper surface of the circuit carrier and the first surface of the driving chip 40 faces the upper surface of the circuit carrier, and a plurality of driver chips 40 are arranged on the lower surface of the circuit carrier. an electrical contact.

In step S60 , at least one LED chip group 50 is disposed on the second surface of the driver chip 40 and connected to the plurality of second metal pads 02 of the driver chip 40 .

In step S70, an outer packaging layer is produced, the outer packaging layer covers a plurality of driving chips 40 and a plurality of LED chip groups 50 and connects the surrounding area of the upper surface of the circuit carrier board and the gap between the plurality of driving chips 40 area.

In step S80 , the outer packaging layer and the circuit carrier are cut along the gaps between the plurality of driving chips 40 to obtain a plurality of light source elements. The outer packaging layer is cut along the cutting line 501 to form each outer sealing compound 60 , and the circuit carrier is cut along the cutting line to form each circuit substrate 10 .

In one embodiment, the circuit line layer 03 and the plurality of second metal pads 02 on the second surface of the sub-block are formed by etching the metal layer, as shown in FIG. 5 a and FIG. 5 b .

In one embodiment, the plurality of first metal pads 01 of the sub-block are formed by means of a redistribution layer.

In this embodiment, the method of rewiring layers increases the flexibility of the design, reduces the difficulty of layout and wiring, and can also reduce the occupied area, so that it can be arranged in a more compact manner, and the integration of the circuit is improved. and performance; when packaging the light source body in a certain space, the size of the light source element is reduced.

In this embodiment, the circuit line layer 03 and the plurality of second metal pads 02 are arranged on the second surface of the driving chip 40, the circuit line layer 03 is connected to the plurality of second metal pads 02, and the circuit line layer 03 can Realize the circuit migration connection of the second metal pad 02 without limiting the position, so that the size of the light source element is reduced, and the through hole 502 is arranged in the dicing line 501 of the driving chip wafer, which can avoid the internal preparation of the through hole in the driving chip 40. Leave space and reduce the size of the light source components.

The light source element and its manufacturing method provided by the embodiments of the present invention are to use the space of the wafer dicing lane to realize the electrical connection design of the double-sided circuit layer. Compared with the existing chip, the circuit is made by avoiding the position of the through hole inside. Due to design limitations, the flexibility of the embodiment of the present invention makes it more dense when designing the internal circuit, thereby releasing the area space of the driving chip 40, so that it can be used when packaging the light source body. Downsizing to a single body size. The driving chip 40 formed in this way is integrated with at least one LED chip group 50. Under the same performance conditions, it can not only achieve the miniaturization, but also satisfy the improvement of the luminous brightness of the product, so that its products can be used in transparent display devices. The market can meet the needs of smaller dot pitch and high brightness display without affecting the transparent effect.

The present invention also provides a display device, comprising: a transparent conductive plate and a plurality of light source elements as in any one of the above-mentioned embodiments, the plurality of light source elements are arranged in an array on the transparent conductive plate and drive the plurality of the first surface of the chip 40 A first metal pad 01 is electrically connected to the transparent conductive plate.

In the above-mentioned embodiments, the descriptions of each embodiment have their own emphases, and for parts that are not detailed or recorded in a certain embodiment, refer to the relevant descriptions of other embodiments.

The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or may also be distributed to multiple network units . Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

The above-described embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those with ordinary knowledge in the technical field of the present invention should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention, All should be included within the protection scope of the present invention.

01: The first metal pad 02: Second metal pad 03: Circuit line layer 04: Channel wire 10,20: circuit substrate 11,21,40: driver chips 12: Molded colloid 13,23:LED chip 22: Internal structure circuit 50: LED chipset 501: Cutting Road 502: Through hole 60: Outer sealing colloid

Fig. 1 is a structural schematic diagram of a light source element provided by the prior art; Fig. 2 is a structural schematic diagram of another light source element provided by the prior art; FIG. 3 is a schematic structural diagram of a driving chip provided by an embodiment of the present invention; FIG. 4 is a schematic structural view of a driving chip wafer provided by an embodiment of the present invention; Fig. 5a and Fig. 5b are schematic diagrams of the circuit structure on the surface of the driving chip provided by the embodiment of the present invention; Figure 6a and Figure 6b are exploded schematic diagrams of the light source element provided by the embodiment of the present invention; and Fig. 7 is a schematic flow chart of the preparation method provided by the embodiment of the present invention.

01: The first metal pad

03: Circuit line layer

04: Channel wire

40: Driver chip

Claims (10)

A light source element, comprising: A driving chip, a first surface of the driving chip is provided with a plurality of first metal pads, a second surface of the driving chip opposite to the first surface of the driving chip is provided with a circuit line layer and a plurality of first metal pads Two metal pads, the circuit line layer is connected to a plurality of the second metal pads, and one side of the drive chip connected to the first surface of the drive chip and the second surface of the drive chip is provided with a surface exposed to the drive chip. A plurality of channel wires of the chip, the plurality of channel wires are connected to the circuit layer and respectively connected to a plurality of the first metal pads; and At least one LED chip group, the LED chip group is arranged on the second surface of the driving chip and connected to a plurality of the second metal pads. The light source element as claimed in item 1, wherein the light source element further comprises: A circuit substrate, the driving chip is arranged on the upper surface of the circuit substrate and the first surface of the driving chip faces the upper surface of the circuit substrate, and a plurality of electrical contacts are provided on the lower surface of the circuit substrate; and An outer encapsulant covers the driving chip and the LED chip group and connects the periphery of the upper surface of the circuit substrate. The light source element as claimed in claim 1, wherein the LED chip group includes a red LED chip, a green LED chip and a blue LED chip. The light source element as claimed in claim 3, wherein the LED chip group and the plurality of second metal pads are located in a middle area of the second surface of the driving chip. The light source element as described in claim 3, wherein the at least one LED chip group is a plurality of the LED chip groups, and the plurality of the LED chip groups and the plurality of the second metal pads are all distributed on the first of the driving chip A four-corner area on two sides. The light source element as claimed in claim 3, wherein a plurality of the first metal pads are distributed in a peripheral area of the first surface of the driving chip. A method for preparing a light source element, comprising the following steps: Manufacture a driver chip wafer, the driver chip wafer has a plurality of sub-blocks, a plurality of vertical scribes and a plurality of transverse scribes, the plurality of transverse scribes perpendicularly intersect with the plurality of longitudinal scribes and are separated from each other a plurality of such sub-blocks; forming a plurality of through holes in the plurality of longitudinal slits and the plurality of transverse slits, and filling the through holes with conductive material to form a channel wire; A plurality of first metal pads are arranged on a first side of the sub-block, and a circuit line layer is arranged on a second side of the sub-block opposite to the first side of the sub-block and connected to the circuit line a plurality of second metal pads of the layer, and make the channel wire connect the first metal pads and the circuit line layer of two adjacent sub-blocks; cutting along the respective midline positions of the plurality of longitudinal dicing lines and cutting along the respective midline positions of the plurality of transverse dicing lines so that the sub-block forms a drive chip; A circuit carrier is provided, a plurality of the driver chips are arranged on the upper surface of the circuit carrier and the first surface of the driver chip faces the upper surface of the circuit carrier, and the lower surface of the circuit carrier is provided with a plurality of electrical contacts; At least one LED chip group is arranged on the second surface of the driving chip and connected to the plurality of second metal pads of the driving chip; An outer encapsulation layer is made, the outer encapsulation layer covers a plurality of the driving chips and a plurality of the LED chip groups and connects a surrounding area of the upper surface of the circuit carrier board and an area between the plurality of the driving chips. clearance area; and The outer packaging layer and the circuit carrier are cut along the gaps between the plurality of driving chips to obtain a plurality of light source elements. The manufacturing method according to claim 7, wherein the circuit line layer and the plurality of second metal pads on the second surface of the sub-block are formed by etching a metal layer. The manufacturing method according to claim 7, wherein the plurality of first metal pads of the sub-block are formed in a redistribution layer. A display device, comprising: a transparent conductive plate and a plurality of the light source elements as described in any one of claims 1-6, the plurality of light source elements are arranged in an array on the transparent conductive plate and the drive chip The plurality of first metal pads on the first surface are electrically connected to the transparent conductive plate.

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