TW202314397A - Holding device, exposure device and method for manufacturing article capable of suppressing deterioration in optical performance - Google Patents
Holding device, exposure device and method for manufacturing article capable of suppressing deterioration in optical performance Download PDFInfo
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Abstract
Description
本發明,有關保持裝置、曝光裝置及物品之製造方法。The present invention relates to a holding device, an exposure device and a method for manufacturing an article.
在液晶面板、有機EL顯示器或半導體裝置等的製造中,使用經由投影光學系統在塗布有感光材料的基板以原版的圖案進行曝光的曝光裝置。曝光裝置由於需要精度佳地轉印微細的圖案,故要求精度佳地保持被搭載於曝光裝置的光學元件。In the manufacture of liquid crystal panels, organic EL displays, semiconductor devices, etc., an exposure device that exposes a substrate coated with a photosensitive material in an original pattern via a projection optical system is used. Since the exposure device needs to transfer a fine pattern with high precision, it is required to hold the optical element mounted on the exposure device with high precision.
於日本特開2021-005018號公報中,揭露了有關具備可使因自重變形的光學元件的面形狀恢復成變形前的狀態的機構的保持裝置。另外,於日本特開 2021-005018號公報中,記載了將在光學元件局部產生的應力除去的手法。 Japanese Patent Application Laid-Open No. 2021-005018 discloses a holding device including a mechanism capable of restoring the surface shape of an optical element deformed by its own weight to a state before deformation. In addition, specially opened in Japan Publication No. 2021-005018 describes a method for removing stress locally generated in an optical element.
[發明所欲解決之課題][Problem to be Solved by the Invention]
另外,搭載於曝光裝置的光學元件,由於因外擾的影響導致的振動模式的產生,存在對曝光精度帶來影響之虞。在日本特開2021-005018號公報中,並未認識到在光學元件產生的振動對曝光精度帶來不良影響如此之課題,未揭露有關針對在光學元件產生的振動的對策。尤其,繞與光學元件的光軸垂直的方向的軸而旋轉的振動模式,由於光學元件的敏感度比其他振動模式高,因而可能成為導致光學性能不良化的主要原因之一。In addition, the optical element mounted in the exposure device may affect the exposure accuracy due to the generation of a vibration mode due to the influence of external disturbance. In Japanese Unexamined Patent Application Publication No. 2021-005018, the problem that the vibration generated in the optical element adversely affects the exposure accuracy is not recognized, and the countermeasure against the vibration generated in the optical element is not disclosed. In particular, the vibration mode that rotates around an axis perpendicular to the optical axis of the optical element may be one of the causes of deterioration in optical performance because the sensitivity of the optical element is higher than other vibration modes.
因而,本發明的目的在於提供有利於抑制光學性能的降低的保持裝置。 [發明內容] Accordingly, an object of the present invention is to provide a holding device that is advantageous in suppressing a decrease in optical performance. [Content of the invention]
為了達成前述目的,作為本發明的一方案的保持裝置為一種保持裝置,保持光學元件,具有:基底;第1保持部,其保持前述光學元件與前述基底;以及第2保持部,其在與前述第1保持部保持前述光學元件的保持位置不同的位置保持前述光學元件與前述基底;被構成為,可變更前述第1保持部及前述第2保持部中的至少一方的剛性。 本發明的進一步的特徵將由以下之實施方式(在參照圖式之下)而趨於清楚。 In order to achieve the foregoing object, a holding device as one aspect of the present invention is a holding device that holds an optical element and has: a base; a first holding portion that holds the optical element and the base; and a second holding portion that is in contact with the optical element. The first holding portion holds the optical element and the substrate at different holding positions of the optical element, and is configured such that rigidity of at least one of the first holding portion and the second holding portion can be changed. Further features of the present invention will become apparent from the following embodiments (below referring to the drawings).
於以下,基於圖式而詳細說明本發明的優選實施方式。另外,各圖中,針對相同的構件,標注相同的參考符號,重複的說明省略。Hereinafter, preferred embodiments of the present invention will be described in detail based on the drawings. In addition, in each figure, the same reference numerals are assigned to the same members, and overlapping descriptions are omitted.
<第1實施方式>
參照圖1,針對保持光學元件1的保持裝置100進行說明。圖1(a)及圖1(b),為針對本實施方式的保持裝置100的構成進行繪示的圖。在本實施方式中,將重力方向定義為Z軸方向,將相對於Z軸方向垂直的方向且相互正交的方向分別定義為X軸方向、Y軸方向。圖1(a)為從X軸方向觀看的保持裝置100的側視圖,圖1(b)為從Y軸方向觀看圖1(a)所示的點劃線A-A'的截面的圖。本實施方式中的保持裝置100,如圖1(a)及圖1(b)所示般,在直角座標系所定義的空間中,將光學元件1保持成光學面的面法線相對於重力方向正交。
<First Embodiment>
Referring to FIG. 1 , the
保持裝置100具有基底2、固定並保持光學元件1的固定部5、連結部13(第1保持部)、連結部10(第2保持部)以及振動感測器20、21、22。固定部5經由連結部10、13而與基底2結合。固定部5並非必要構成,亦可為連結部10、13與光學元件1直接連結的構成。連結部10及連結部13中的至少一方,被構成為可變更基底2保持光學元件1的保持力。即,連結部10及連結部13中的至少一方,具有可變更基底2保持光學元件1從而給予光學元件1的剛性的剛性調整手段。The
如圖1(b)所示般,在固定部5,為了計測以固有振動頻率振動的光學元件1的變形形狀,設有對在光學元件1產生的振動進行檢測的振動感測器20、21、22(振動檢測部)。圖2為針對本實施方式中的振動感測器20、21、22的配置位置詳細地進行了繪示的圖。振動感測器20檢測光學元件1的Y軸方向的振動成分,振動感測器21檢測光學元件1的X軸方向的振動成分,振動感測器22檢測光學元件1的Z軸方向的振動成分。As shown in FIG. 1( b ), in the
在本實施方式中,為了在光學元件1的每個區域計測Y方向的振動成分,設有3個振動感測器20。由此,可測定Y方向的並進的振動。
另外,可透過已知的方法,從以振動感測器20、21、22分別計測出的振動成分,算出繞X軸的旋轉成分ωX、繞Z軸的旋轉成分ωZ。另外,關於配置振動感測器20、21、22的數量、位置,亦可基於欲計測的振動成分而任意設定。
In the present embodiment, three
參照圖3而詳細說明連結部13的構成。圖3為針對保持裝置100中的連結部13的構成進行繪示的圖。在以下的說明,雖說明有關連結部13具有剛性調整手段之例,惟亦可連結部10透過與連結部13同樣的構成從而具有剛性調整手段。另外,亦可為僅連結部10透過以下說明的構成從而具有剛性調整手段。The configuration of the connecting
連結部13具有連結構件11a、11b和板簧12(剛性調整手段)。連結構件11a將固定部5的1個部位固定,經由板簧12和連結構件11b而與基底2連結。連結構件11b將基底2的2個部位固定。板簧12被以在固定部5與基底2之間在Y方向橋接的方式經由連結構件11a、11b地配置。板簧12呈在配置了光學元件1之後亦可變更的構成,呈透過變更板簧12的材質、厚度、數量等從而可對保持光學元件1和基底2的保持力進行調整的構成。The
在本實施方式中,連結部10、13如圖1(a)所示般,在不包含光學元件1的光軸的區域保持光學元件1。光軸通過光學元件1的中心,光軸方向為與Y軸方向平行的方向。在本實施方式中,經由複數個連結部將基底2和固定部5固定,連結部10在與連結部13保持光學元件1的保持位置不同的位置保持光學元件1和基底2。In this embodiment, the
然而,在如本實施方式般構成複數個連結部的情況下,若各個連結部保持光學元件1的保持力不同,則例如會在光學元件1的傾轉ωX(繞是與光學元件1的光軸垂直的方向的X軸的旋轉)方向產生振動模式。However, in the case of configuring a plurality of connection parts as in the present embodiment, if the holding force of each connection part to hold the
連結部10、13被構成為在設計階段不產生影響光學性能之虞大的旋轉的振動模式。然而,由於保持裝置100的各部件中的公差或保持裝置100的組裝時的製造誤差等,存在產生比設計值大的旋轉的振動模式之虞。The connecting
旋轉的振動模式方面,依連結部10保持光學元件1的剛性與連結部13保持光學元件1的剛性之差而產生旋轉振動模式。為此,優選上,連結部10及連結部13被構成為,連結部10保持光學元件1的保持力與連結部13保持光學元件1的保持力之差被減低。在本實施方式中,連結部10及連結部13中的至少一方,被構成為在設置後可變更材質、厚度、數量等。Regarding the rotational vibration mode, a rotational vibration mode is generated depending on the difference between the rigidity of the
接著,針對在本實施方式中針對剛性調整手段進行調整的調整方法進行說明。首先,透過振動感測器20、21、22取得振動成分。從以振動感測器20、21、22取得的振動成分,算出旋轉的振動模式。算出旋轉的振動模式的結果,例如在產生出ωX方向的旋轉的振動模式的情況下,可認為產生連結部10保持光學元件1的保持力與連結部13保持光學元件1的保持力之差。Next, an adjustment method for adjusting the rigidity adjustment means in this embodiment will be described. First, the vibration components are obtained through the
為此,在本實施方式中,調整板簧12,從而降低連結部10保持光學元件1的保持力與連結部13保持光學元件1的保持力之差。具體而言,在連結部13保持光學元件1的保持力,比連結部10保持光學元件1的保持力小的情況下,將板簧12的材質變更為變形量小的材質。由此,可提高保持力。或者,亦可透過增大板簧12的厚度使變形量變小來提高保持力,還可以透過增加板簧12的數量使變形量變小來提高保持力。Therefore, in this embodiment, the
透過執行上述的調整,可使光學元件1的旋轉的振動模式減低。更詳細而言,可將光學元件1的旋轉的振動模式變換成並進的振動模式。光學元件1的並進的振動模式,敏感度比旋轉的振動模式小。因此,本實施方式中的保持裝置100,可抑制光學性能的降低。By performing the above-mentioned adjustment, the vibration mode of the rotation of the
<第2實施方式>
在第1實施方式,針對剛性調整手段為板簧的例子進行了說明。在本實施方式中,針對板簧以外的剛性調整手段進行說明。參照圖4,針對保持光學元件1的保持裝置200進行說明。圖4(a)及圖4(b),為針對本實施方式的保持裝置200的構成進行繪示的圖。在本實施方式中,將重力方向定義為Z軸方向,將相對於Z軸方向垂直的方向且相互正交的方向分別定義為X軸方向、Y軸方向。圖4(a)為從Y軸方向觀看的保持裝置200的正面圖,圖4(b)為從X軸方向觀看圖4(a)所示的點劃線B-B'的截面的圖。本實施方式中的保持裝置200,如圖4(a)及圖4(b)所示般,在直角座標系所定義的空間中,將光學元件1保持成光學面的面法線相對於重力方向正交。
<Second Embodiment>
In the first embodiment, an example in which the rigidity adjusting means is a leaf spring has been described. In this embodiment, rigidity adjustment means other than leaf springs will be described. Referring to FIG. 4 , the holding
保持裝置200具有基底2a、2b、載置有光學元件1的連結部16(第1保持部)、載置部17(第2保持部)以及振動感測器20、21、22。光學元件1經由載置部17而由基底2a保持。另外,光學元件1經由連結部16而由基底2b保持。連結部16及載置部17中的至少一方,被構成為可變更基底2a、2b保持光學元件1的保持力。即,連結部16及載置部17中的至少一方,具有可變更基底2a、2b保持光學元件1從而給予光學元件1的剛性的剛性調整手段。The holding
如圖4(a)所示般,在光學元件1的背面,為了計測以固有振動頻率振動的光學元件1的變形形狀,設有針對在光學元件1產生的振動進行檢測的振動感測器20、21、22(振動檢測部)。振動感測器20檢測光學元件1的Y軸方向的振動成分,振動感測器21檢測光學元件1的X軸方向的振動成分,振動感測器22檢測光學元件1的Z軸方向的振動成分。As shown in FIG. 4(a), on the back of the
基底2b被構成為,搭載在基底2a的上部,將基底2a的內部加蓋。連結部16直接保持光學元件1的上部中央的1個部位,具備剛性調整手段而與基底2b連結。載置部17在與光學元件1的外周相接的下方2個部位在相對於由光軸(Y軸)和Z軸構成的Y-Z平面成為對稱的位置支撐光學元件1的自重。在載置部17,被構成為以限制光學元件1的Y方向的方式夾住光學元件1的表面和背面。The
參照圖5而詳細說明連結部16的構成。圖5為針對保持裝置200中的連結部16的構成進行繪示的圖。在以下的說明,雖說明有關連結部16具有剛性調整手段之例,惟亦可載置部17透過與連結部16同樣的構成從而具有剛性調整手段。另外,亦可為僅載置部17透過以下說明的構成從而具有剛性調整手段。The configuration of the connecting
連結部16具有連結構件14和螺栓15(剛性調整手段)。螺栓15在複數個部位固定基底2b和連結部16。螺栓15成為在配置光學元件1之後亦可變更螺栓15的配置、緊固扭力、數量等的構成。
成為透過變更螺栓15的配置、緊固扭力(tightening torque)、數量等而可對保持光學元件1和基底2b的保持力進行調整的構成。
The
雖然由連結構件14連結光學元件1和基底2b,但由於光學元件1配置成光學面的面法線與重力方向正交,故為了支撐光學元件1的上部而會變成懸臂樑構造。因如此之構成,可能會成為產生出光學元件1在ωX方向振動的振動模式的原因。Although the
本實施方式中的調整剛性調整手段的調整方法,與第1實施方式同樣,基於由感測器20、21、22計測出的振動成分,以旋轉的振動模式減低的方式進行調整。在本實施方式中,將螺栓15調整為,連結部16保持光學元件1的保持力與載置部17保持光學元件1的保持力之差減小。具體而言,在連結部16保持光學元件1的保持力比載置部17保持光學元件1的保持力小的情況下,透過增加螺栓15的數量,可提高保持力。或者,亦可透過加大螺栓15的緊固扭力來提高保持力,亦可透過對螺栓15的配置下工夫從而減小變形量來提高保持力。The adjustment method for adjusting the rigidity adjusting means in this embodiment is similar to the first embodiment, and adjusts so that the rotational vibration mode is reduced based on the vibration components measured by the
因此,透過執行上述的調整,可使光學元件1的旋轉的振動模式減低。更詳細而言,可將光學元件1的旋轉的振動模式變換成並進的振動模式。光學元件1的並進的振動模式,敏感度比旋轉的振動模式小。因此,本實施方式中的保持裝置200,可抑制光學性能的降低。Therefore, by performing the above adjustment, the vibration mode of the rotation of the
針對本實施方式的變形例,參照圖6進行說明。圖6(a)及圖6(b),為針對本實施方式的變形例的保持裝置300的構成進行繪示的圖。圖6(a)為從Y軸方向觀看的保持裝置300的正面圖,圖6(b)為從X軸方向觀看圖6(a)所示的點劃線C-C'的截面的圖。圖4中的保持裝置200,在進一步具有動態吸振器30、31之點不同。關於動態吸振器30、31以外的構成,與圖4中的保持裝置200同樣,故省略說明。A modified example of this embodiment will be described with reference to FIG. 6 . 6( a ) and FIG. 6( b ) are diagrams illustrating the configuration of a
動態吸振器30、31可使在設計階段預先掌握的光學元件1的高次的旋轉振動模式衰減。動態吸振器30、31直接安裝於光學元件1,按欲予以衰減的振動模式配置2個。例如,動態吸振器30配置在光學元件1的背面上部,使光學元件1的ωX方向的旋轉振動衰減。動態吸振器31配置在光學元件1的外周部,使光學元件1的ωZ方向的旋轉振動衰減。The
透過使用動態吸振器30、31,可使高次的旋轉的振動成分衰減,但仍會殘留因保持裝置300的各部件中的公差或保持裝置300組裝時的製造誤差等而產生的低次的振動成分。為此,針對高次的振動可透過動態吸振器30、31予以降低,針對低次的振動可透過調整剛性調整手段來改善光學性能的不良化。By using the
因此,透過執行上述的調整,可使光學元件1的旋轉的振動模式減低。更詳細而言,可將光學元件1的旋轉的振動模式變換成並進的振動模式。光學元件1的並進的振動模式,敏感度比旋轉的振動模式小。因此,本實施方式中的保持裝置300,可抑制光學性能的降低。Therefore, by performing the above adjustment, the vibration mode of the rotation of the
<曝光裝置的實施方式>
針對將上述的保持裝置100、200、300適用於曝光裝置的實施方式,參照圖7進行說明。圖7為針對本實施方式的曝光裝置EXP的構成進行繪示的示意圖。曝光裝置EXP具有:保持原版M(遮罩)的原版台40;將由照明光學系統IL照明的原版M的圖案投影至基板P的投影光學系統PO;以及保持基板P的基板台44。從未圖示的光源照射的曝光光,透過照明光學系統IL被聚光於原版M。
<Embodiments of Exposure Device>
An embodiment in which the above-described
投影光學系統PO為供用將形成在原版M上的圖案投影到塗布有感光材料的基板P上以轉印圖案用的光學系統。在本實施方式中,設想利用了Offner型的光學系統的投影光學系統。在Offner型的光學系統的情況下,為了確保良好的像區域,原版M在圓弧形狀的照明區域被照射。此外,到達於基板P的曝光光的照射形狀亦成為圓弧形狀。未圖示的光源,例如為高壓水銀燈或利用了LED的光源。The projection optical system PO is an optical system for projecting a pattern formed on the original plate M onto a substrate P coated with a photosensitive material to transfer the pattern. In this embodiment, a projection optical system using an Offner type optical system is assumed. In the case of an Offner-type optical system, the original M is illuminated in an arc-shaped illumination area in order to secure a good image area. In addition, the irradiation shape of the exposure light which reaches the board|substrate P also becomes an arc shape. The unillustrated light source is, for example, a high-pressure mercury lamp or a light source using an LED.
從光源照射的光線透過照明光學系統IL、原版M,依次在梯形鏡41、凹面鏡42、凸面鏡43、凹面鏡42、梯形鏡41反射之後,到達基板P,原版M上的圖案被轉印到基板P上。凸面鏡43例如由在第1實施方式所說明的保持裝置100來保持。The light irradiated from the light source passes through the illumination optical system IL and the original plate M, and after being reflected by the
另外,凹面鏡42由於比凸面鏡43大,故優選上被比第1實施方式中的保持裝置100更穩定地保持。為此,優選上,以能支撐凹面鏡42的自重的方式,如第2實施方式中的保持裝置200般,為可支撐光學元件的底面的構成。為此,凹面鏡42例如被透過第2實施方式所說明的保持裝置200來保持。In addition, since the
在上述的例子中對由保持裝置100或保持裝置200保持投影光學系統PO的至少1個光學元件的例子進行了說明,但並不限於此,例如亦可由保持裝置100或保持裝置200來保持照明光學系統IL中的至少一個光學元件。In the above-mentioned example, the example in which at least one optical element of the projection optical system PO is held by the holding
透過由與本發明有關的保持裝置來保持曝光裝置EXP中的凹面鏡42、凸面鏡43,使得在設置曝光裝置EXP之後亦可使旋轉的振動模式減低。因此,使用了曝光裝置EXP的曝光處理,可抑制曝光性能的降低,故相比歷來的方法在物品的性能、品質、生產率、生產成本中的至少一者方面為有利。By holding the
<物品之製造方法的實施方式> 涉及本發明的實施方式的物品之製造方法,例如適於製造平板顯示器(FPD)。本實施方式的物品之製造方法包括:在被塗布到基板上的感光劑上透過利用了上述的曝光裝置的曝光而形成潛像圖案,獲得曝光基板的程序(曝光程序);以及對透過該程序形成潛像圖案的曝光基板進行顯影,獲得顯影基板的程序(顯影程序)。再者,該製造方法包含其他周知的程序(氧化、成膜、蒸鍍、摻雜、平坦化、蝕刻、抗蝕劑剝離、切割、接合、封裝等)。本實施方式的物品之製造方法,比起歷來的方法,在物品之性能、品質、生產性、生產成本中的至少一者方面有利。 <Embodiments of the manufacturing method of the article> The manufacturing method of the article concerning embodiment of this invention is suitable for manufacturing a flat panel display (FPD), for example. The manufacturing method of the article according to this embodiment includes: forming a latent image pattern on the photosensitive agent coated on the substrate through exposure using the above-mentioned exposure device to obtain an exposed substrate (exposure process); A process of developing the exposed substrate on which the latent image pattern is formed to obtain a developed substrate (development process). Furthermore, the manufacturing method includes other well-known procedures (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method of manufacturing an article according to this embodiment is advantageous in at least one of article performance, quality, productivity, and production cost compared to conventional methods.
以上,雖說明有關本發明之優選實施方式,惟本發明當然不限定於此等實施方式,在其要旨之範圍內,可進行各種的變形及變更。As mentioned above, although the preferred embodiment of this invention was described, it goes without saying that this invention is not limited to these embodiment, Various deformation|transformation and a change are possible within the range of the summary.
依本發明時,可提供在為了抑制光學性能的降低方面有利的保持裝置。According to the present invention, it is possible to provide a holding device which is advantageous in order to suppress a decrease in optical performance.
1:光學元件 2:基底 10:連結部(第2保持部) 12:板簧(剛性調整手段) 13:連結部(第1保持部) 100:保持裝置 1: Optical components 2: base 10: Connecting part (second holding part) 12: Leaf spring (rigid adjustment means) 13: Connecting part (1st holding part) 100: holding device
[圖1]針對第1實施方式中的保持裝置的構成進行繪示的示意圖。 [圖2]用於說明振動感測器的配置的圖。 [圖3]用於說明第1實施方式中的剛性調整手段的圖。 [圖4]針對第2實施方式中的保持裝置的構成進行繪示的示意圖。 [圖5]用於說明第2實施方式中的剛性調整手段的圖。 [圖6]針對第2實施方式中的保持裝置的變形進行繪示的示意圖。 [圖7]為針對曝光裝置的構成進行繪示的示意圖。 [ Fig. 1 ] A schematic diagram illustrating the configuration of a holding device in a first embodiment. [ Fig. 2 ] A diagram for explaining a configuration of a vibration sensor. [ Fig. 3 ] A diagram for explaining rigidity adjusting means in the first embodiment. [ Fig. 4 ] A schematic diagram illustrating the configuration of a holding device in a second embodiment. [ Fig. 5 ] A diagram for explaining a rigidity adjusting means in a second embodiment. [ Fig. 6 ] A schematic diagram illustrating a modification of the holding device in the second embodiment. [FIG. 7] It is a schematic diagram which shows the structure of an exposure apparatus.
1:光學元件 1: Optical components
2:基底 2: base
5:固定部 5: fixed part
11a,11b:連結構件 11a, 11b: Connecting components
12:板簧(剛性調整手段) 12: leaf spring (rigid adjustment means)
13:連結部(第1保持部) 13: Connecting part (1st holding part)
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DE102017207763A1 (en) * | 2017-05-09 | 2018-04-19 | Carl Zeiss Smt Gmbh | Joint arrangement for an optical element, in particular in a microlithographic projection exposure apparatus |
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