TW202311835A - Camera device - Google Patents

Abstract

The present embodiment relates to a camera device comprising: a fixed part; a first moving part comprising a lens and disposed inside the fixed part; a second moving part comprising an image sensor and disposed inside the fixed part; a first magnet and a second magnet disposed in the fixed part; a first coil disposed in the first moving part and disposed at a position corresponding to the first magnet; and a second coil disposed in the second moving part and disposed at a position corresponding to the second magnet, wherein the first coil moves the first moving part in an optical axis direction, wherein the first magnet is overlapped with the second magnet in the optical axis direction, and wherein the length of the first magnet in the optical axis direction is longer than the length of the second magnet.

Description

camera device

The technical field relates to a camera device.

A camera is a device that takes pictures or videos of the subject, and is installed in optical devices such as smartphones, drones, and vehicles.

In order to improve image quality, camera devices are required to have a hand-shake correction (optical image stabilization, OIS) function to correct image shakes caused by user actions.

In an imaging device, the jitter correction function is performed by moving the lens in a direction perpendicular to the optical axis. However, as the diameter of the lens increases in accordance with the recent trend of high pixel density, the weight of the lens increases accordingly, and accordingly, there is a problem that it is difficult to secure the electromagnetic force to move the lens in a limited space.

This embodiment aims to provide a camera device that implements jitter correction through a moving image sensor.

The purpose of this embodiment is to provide an imaging device that drives Moving image sensor: X-axis movement, Y-axis movement and Z-axis movement.

An imaging device according to an embodiment of the present invention includes: a fixed part; a first moving part including a bobbin and a lens coupled with the bobbin and arranged in the fixed part; a second moving part including an image sensor and arranged in the fixed part ; the first magnet and the second magnet are arranged in the fixed part; the first coil is arranged in the first moving part and is arranged at a position corresponding to the first magnet. and a second coil, which is placed in the second moving part and is placed at a position corresponding to the second magnet, wherein the first coil moves the first moving part along the optical axis direction, wherein the first magnet and the second The two magnets overlap in the direction of the optical axis, wherein the first magnet includes a first unit magnet and a second unit magnet, which are mutually placed relative to the optical axis. Wherein the third unit magnet and the fourth unit magnet are arranged with respect to the optical axis, wherein the first unit magnet includes a part protruding to the outside of the bobbin in the X-axis direction perpendicular to the optical axis direction, wherein the part of the first unit magnet can be placed on the optical axis. The axis direction and the Y axis direction perpendicular to the X axis direction coincide with the third unit magnet. The bracket may include a protruding part formed on the outer edge of the upper surface of the bracket, and the first part of the connecting substrate may be bonded with an adhesive The protruding part is fixed on the bracket.

The first magnet may include a portion protruding in the X-axis direction with respect to an imaginary plane including an outer side surface of the bobbin.

The unprotruded first region of the first magnet may overlap the bobbin in the X-axis direction.

A region of the second magnet under the first region of the first magnet may not overlap the bobbin in the X-axis direction.

The imaging device according to the present embodiment includes. The fixed part; the first moving part includes the bobbin and moves in the direction of the optical axis; the second moving part includes the image sensor and moves in the direction perpendicular to the optical axis; the first magnet and the second magnet are arranged on the fixed In the component; the first coil is set in the first moving component and is set at a position corresponding to the first magnet. and a second coil, which is placed in the second moving part and is placed at a position corresponding to the second magnet, wherein the bobbin includes first to fourth side surfaces, and wherein the first magnet includes a first unit magnet , which is disposed corresponding to the first side surface of the bobbin, and a second unit magnet is disposed corresponding to the second side surface of the bobbin. and a third unit magnet, It is arranged to correspond to the third side surface of the bobbin, wherein the first side surface and the second side surface of the bobbin are opposite to each other, and a part of the first unit magnet can be aligned with the third side in the direction of the Y axis perpendicular to the direction of the optical axis. Unit magnets coincide.

The first unit magnet is arranged between the first corner and the second corner of the fixing member, and may be arranged closer to the first corner than the second corner.

The imaging device according to the present embodiment includes an image sensor moving in a direction perpendicular to an optical axis direction; a housing provided in the image sensor; a bobbin provided in the housing; and a lens coupled to the bobbin. a first magnet and a second magnet disposed in the casing, wherein the casing includes first to fourth side surfaces, wherein the second magnet includes a first unit magnet disposed corresponding to the first side surface of the casing, The second unit magnet is arranged corresponding to the second side surface of the casing. and a third unit magnet, the unit magnet is arranged to correspond to the third side surface of the housing, wherein the first side surface and the second side surface of the housing are opposite to each other, and wherein the first unit magnet of the second magnet A part of the second magnet may overlap with the third unit magnet of the second magnet in a Y-axis direction perpendicular to the optical axis direction.

The imaging device includes: a first coil placed at a position corresponding to the first magnet; and a second coil placed at a position corresponding to the second magnet, wherein the first unit magnet of the second magnet is included in the light A portion protruding to the outside of the second coil in the X-axis direction and the X-axis direction perpendicular to the Y-axis direction.

The portion of the first unit magnet of the second magnet may not overlap with the second coil in the direction of the optical axis.

The imaging device according to the present embodiment includes a fixed part; a first moving part including a lens and provided in the fixed part; a second moving part including an image sensor and provided in the fixed part; a first magnet and a second magnet It is arranged in the fixed part; the first coil is arranged in the first moving part and is arranged at a position corresponding to the first magnet. and a second coil, which is placed in the second moving part and is placed at a position corresponding to the second magnet, wherein the first coil moves the first moving part in the direction of the optical axis, wherein the first magnet moves in the direction of the optical axis The axial direction overlaps with the second magnet, wherein the first magnet includes a first unit magnet and a second unit magnet, which are mutually placed relative to the optical axis. The third unit magnet and the fourth unit magnet are arranged relative to the optical axis, wherein the first unit magnet includes a A first surface of the coil, and the first unit magnet may overlap the third unit magnet in a direction perpendicular to the first surface.

The first moving part includes a bobbin in which the first coil is placed, and the first magnet may include protruding in the direction of the X axis perpendicular to the direction of the optical axis when viewed in the direction facing the first surface. to the part outside the spool.

The length of the second coil in the horizontal direction may be greater than the length of the second magnet in the horizontal direction when viewed in the direction facing the first surface.

A portion of the first magnet may overlap the second coil in the direction of the optical axis.

The second magnet may include a portion that does not overlap the second coil in the direction of the optical axis.

A part of the first magnet may not overlap a part of the second magnet in the optical axis direction.

The first magnet includes: a first magnetic pole formed on a first surface facing the first coil; and a second magnetic pole formed on a second surface opposite to the first surface, wherein the second magnet may include on the first pole of the first magnet with the an overlapping second magnetic pole, and a first magnetic pole overlapping the second magnetic pole of the first magnet in the direction of the optical axis.

The second coil is disposed outside the bobbin when viewed from the top, and may include a portion disposed below the bobbin and protrudes more than an edge of the bobbin when viewed from a direction facing the first surface.

The third unit magnet may be configured as a long strip in a direction perpendicular to the first surface.

The first unit magnet may not overlap the second unit magnet in a direction in which the first surface faces.

The fixing part includes a first side portion located between the first corner portion and the second corner portion, the first unit magnet is arranged to have a longer length in an arrangement direction of the first side portion, and the first unit magnet may be arranged to closer to the first corner than the second corner.

The fixing part includes a third side part between the first corner part and the fourth corner part, the third unit magnet is arranged to be longer in the arrangement direction of the third side part, and the third unit magnet can be longer than the first corner part. The corner is disposed closer to the fourth corner.

The fixing part includes: a first side part and a second side part arranged opposite to each other; a third side part and a fourth side part arranged opposite to each other; a first corner part arranged between the first side part and the third side part and a second corner disposed between the first side and the fourth side, wherein the first unit magnet is disposed on the first side of the fixing member and may be closer to the first corner than the second corner set up.

The fixing part includes: a third corner arranged between the second side and the fourth side; and a fourth corner arranged between the second side and the third side, wherein the second unit magnet is arranged on the fixed The second side of the component, and may be closer to the third corner than the fourth corner.

In the direction of the optical axis, the length of the first magnet may be longer than that of the second magnet.

The first magnet may be in contact with the second magnet.

The first magnet may be bonded to the second magnet by an adhesive.

A yoke disposed between the first magnet and the second magnet may be included.

The fixing part includes: a first substrate disposed under the image sensor; a base disposed in the first substrate; and a housing disposed in the base, wherein the first magnet and the second magnet may be disposed in the housing.

The first magnet may be a two-pole magnet, and the second magnet may be a four-pole magnet.

The first magnet may be a bipolar magnet, the second magnet may be a bipolar magnet, and a neutral region without polarity may be formed between the first magnet and the second magnet.

The first magnet is configured to have a longer length in a first direction perpendicular to the optical axis direction, and in the first direction, the length of the first magnet may be longer than that of the second magnet.

The length of the first magnet may be shorter than the length of the second magnet in the optical axis direction and in the second direction perpendicular to the first direction.

In the first direction, the length of the second magnet may be longer than the length of the second coil.

In a direction perpendicular to the direction of the optical axis, the first coil overlaps the first magnet, and the second coil may overlap the second magnet in the direction of the optical axis.

When a driving current in a first direction is applied to the first coil, the first moving part moves downward to the first position in the direction of the optical axis; when a driving current in a second direction opposite to the first direction is applied to the first coil, The first moving part in the direction of the optical axis moving upward to the second position; when the first moving part is at the first position and at the second position, the first coil can overlap with the first magnet in a direction perpendicular to the direction of the optical axis.

The imaging device according to the present embodiment includes. The fixed part; the first moving part, including the bobbin and the lens coupled with the bobbin and arranged in the fixed part; the second moving part, including the image sensor and arranged in the fixed part; the first magnet and the second magnet are arranged in Inside the fixed part; the first coil is set inside the first moving part and at a position corresponding to the first magnet. and a second coil, which is arranged in the second moving part and is arranged at a position corresponding to the second magnet, wherein the first coil moves the first moving part in the direction of the optical axis, wherein the first magnet is in the optical axially overlaps with the second magnet, wherein the fixed member includes a first side between the first corner and the second corner, wherein the first magnet may include a first unit magnet, and its arrangement on the first side The direction is arranged to have a longer length, and wherein the first unit magnet may be arranged closer to the first corner than the second corner.

The first magnet may be directly coupled to the second magnet, or a yoke may be coupled therebetween, and the first magnet may be larger than the second magnet.

The first magnet may be bonded to the second magnet by an adhesive.

The first magnet may be a two-pole magnet, and the second magnet may be a four-pole magnet.

Each of the first magnet and the second magnet includes a first unit magnet and a second unit magnet arranged relative to the optical axis, and a third unit magnet and a fourth unit magnet arranged relative to the optical axis, wherein the first unit The magnet includes a first surface facing the first coil, and wherein the first unit magnet may overlap the third unit magnet in a direction facing the first surface.

The optical device according to the present embodiment includes a main body; a camera provided in the main body; and a display provided in the main body and outputting video or images captured by the camera.

Through this embodiment, the image sensor can be moved to perform the jitter correction function.

With the magnet arrangement structure according to the present embodiment, the electromagnetic force for driving AF and OIS can be enhanced.

Accordingly, since the size of the magnet can be reduced, the size and weight of the imaging device can be reduced.

1: Optical equipment

10: camera device

20: subject

30: display

100: fixed parts

110: the first substrate

120: base

121: protruding parts

122: Groove

123: The first protrusion

124: second protrusion

130: Shell

140: cover

200: Moving Parts

210: Spool

220: lens

300: Moving Parts

310: second substrate

311: terminal

320: sensor substrate

321: terminal

330: image sensor

340: Bracket

350: Sensor base

360: filter

410: first magnet

411: unit magnet

412: unit magnet

413: unit magnet

414: unit magnet

415: neutral zone

420: second magnet

421: unit magnet

422: unit magnet

423: unit magnet

424: unit magnet

425: Yoke

425a: Yoke

425b: Yoke

425c: Yoke

425d: Yoke

430: first coil

440: second coil

441: second-first coil

442:Second-second coil

445: Hall sensor

450: induction magnet

460: correction magnet

470: Induction Substrate

480: Driver IC (integrated circuit)

490:Gyroscope sensor

495: Driver IC

600: connect substrate

601: insulation layer

602: Conductive layer

610: connecting parts

620: extension parts

630: Terminal parts

631: terminal

650: metal plate

660: overhang

700: Elastic parts

710: upper elastic part

720: lower elastic part

720-1: lower elastic unit

720-2: lower elastic unit

800: wire

FIG. 1 is a perspective view of an imaging device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a state in which a cover is omitted from the imaging device according to the embodiment of the present invention.

Fig. 3 is a plan view of an imaging device according to an embodiment of the present invention.

Fig. 4 is a cross-sectional view taken along line A-A of Fig. 3 .

Fig. 5 is a cross-sectional view taken along line B-B of Fig. 3 .

Fig. 6 is a cross-sectional view taken along line C-C of Fig. 3 .

Fig. 7 is a developed view of the imaging device according to the present embodiment.

FIG. 8 is a developed view of the imaging device according to the present embodiment viewed from a different direction from FIG. 7 .

Fig. 9 is an expanded view of a first moving part and related configurations of the imaging device according to an embodiment of the present invention.

Fig. 10 is a second moving part of the camera device according to an embodiment of the present invention and an expanded view of the associated configuration.

FIG. 11 is a perspective view of a state in which a cover member is omitted from the imaging device according to the embodiment of the present invention.

FIG. 12 is a side view of a state in which a cover member is omitted from the imaging device according to the embodiment of the present invention.

FIG. 13 is a perspective view illustrating a second moving part, a fixing part, and a connection substrate of the imaging device according to the embodiment of the present invention.

14 is a perspective view illustrating a part of a second moving part and a connection substrate of the imaging device according to the embodiment of the present invention.

"(a)" of FIG. 15 is a perspective view of a connection substrate and a metal plate of an imaging device according to an embodiment of the present invention, and "(b)" of FIG. 15 is a connection substrate and a metal plate of an imaging device according to an embodiment of the present invention. sectional view.

16 is an exploded perspective view illustrating separation of a connection substrate and a metal plate of the imaging device according to the embodiment of the present invention.

FIG. 17 is a perspective view of a connection substrate and a metal plate of an image pickup device according to an embodiment of the present invention.

Fig. 18 is a perspective view illustrating a partial configuration of a bobbin and a driving unit of an imaging device according to an embodiment of the present invention.

FIG. 19 is a perspective view of a magnet and a coil of an imaging device according to an embodiment of the present invention.

20 is a cross-sectional view of a magnet and a coil of an imaging device according to an embodiment of the present invention.

Fig. 21a is a cross-sectional view of a magnet and a coil of an imaging device according to a first modified embodiment.

Fig. 21b is a cross-sectional view of a magnet and a coil of an imaging device according to a second modified embodiment.

22 is a cross-sectional view of a magnet and a coil of an imaging device according to a third modified embodiment.

23 is a cross-sectional view of a magnet and a coil of an imaging device according to fourth to seventh modified embodiments.

Fig. 24 is a cross-sectional view of a magnet and a coil of an imaging device according to an eighth modified embodiment.

Fig. 25 is a cross-sectional view of a magnet and a coil of an imaging device according to a ninth modified embodiment.

Fig. 26 is a cross-sectional view of the imaging device according to the present embodiment. Wires of the imaging device according to the present embodiment may be omitted in some drawings.

FIG. 27 is a diagram for explaining the driving of the autofocus function of the imaging device according to the present embodiment.

28 to 30 are diagrams for explaining the operation of the hand shake correction function of the imaging device according to the embodiment of the present invention. In more detail, FIG. 28 is a diagram for explaining driving of an image sensor of an imaging device according to an embodiment of the present invention moving along an X-axis. FIG. 29 is a diagram for explaining driving in which the image sensor of the imaging device according to the present embodiment moves along the Y axis. FIG. 30 is a view for explaining driving in which the image sensor of the imaging device according to the present embodiment moves around the Z axis.

Fig. 31 is a perspective view of an optical device according to an embodiment of the present invention.

Fig. 32 is a perspective view of an optical device according to an embodiment of the present invention, viewed from a different direction from Fig. 31 .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some embodiments to be described, but can be implemented in various forms, and within the scope of the technical idea of the present invention, one or more constituent elements can be selectively selected between the embodiments Combine or replace.

In addition, the terms (including technical and scientific terms) used in the embodiments of the present invention, unless clearly defined and described, can be interpreted as meanings that can be generally understood by those skilled in the art. Commonly used terms such as those defined in dictionaries can be considered relevant The contextual meaning of the technology is explained.

In addition, the terms used in this specification are for describing the embodiments and are not intended to limit the present invention.

In this specification, the singular form may include the plural form, unless it is specifically stated in the phrase, when it is described as "at least one (or more than one) of A and B and C", it may include the same One or more of all combinations combined by C.

Also, terms such as first, second, A, B, (a) and (b) may be used when describing constituent parts of the embodiment of the present invention. These terms are just These terms are intended to distinguish an element from another element, and these terms do not limit the nature, order or sequence of the element.

Moreover, when an element is described as being 'connected', 'coupled' or 'interconnected' to another element, the element is not only directly connected, coupled or interconnected to the other element, but may also include The condition of being 'connected', 'coupled' or 'interconnected' between such other elements.

In addition, when it is described as being formed or arranged "on (on)" or "under (under)" each element, "upper (on)" or "under (lower)" means that it includes not only two elements The case of direct contact also includes the case where one or more other elements are formed or arranged between the two elements. In addition, when expressed as "upper (on)" or "lower (lower)", it includes not only an upward direction but also a meaning of a downward direction based on one element.

Next, an imaging device according to an embodiment of the present invention will be described with reference to the drawings.

1 is a perspective view of an imaging device according to an embodiment of the present invention; FIG. 2 is a perspective view of a state in which a cover is omitted from the imaging device according to an embodiment of the present invention; FIG. 3 is a plan view of the imaging device according to an embodiment of the present invention; Figure 4 is along Figure 3 A-A Fig. 5 is a sectional view taken along line B-B of Fig. 3; Fig. 6 is a sectional view taken along line C-C of Fig. 3 . 6 is a cross-sectional view taken along line C-C of FIG. 3; FIG. 7 is an expanded view of the imaging device according to an embodiment of the present invention; FIG. 8 is an expanded view of the imaging device according to an embodiment of the present invention viewed from different directions in FIG. 7 ; FIG. 9 is an expanded view of the first moving parts and related configurations of the imaging device according to an embodiment of the present invention; FIG. 10 is an expanded view of the second moving parts and related configurations of the imaging device according to an embodiment of the present invention; FIG. 11 is A perspective view illustrating a state in which a cover is omitted from an imaging device according to an embodiment of the present invention; FIG. 12 is a side view illustrating a state in which a cover is omitted from an imaging device according to an embodiment of the present invention; FIG. The perspective view of the second moving part, the fixed part and the connecting substrate of the camera device of . 13 is a perspective view illustrating a second moving part, a fixed part, and a connection substrate of an imaging device according to an embodiment of the present invention; FIG. 14 is a perspective view illustrating a part of a second moving part and a connection substrate of an imaging device according to an embodiment of the present invention Figures; "(a)" of FIG. 15 is a perspective view illustrating a connection substrate of an imaging device according to an embodiment of the present invention. 15 is a perspective view of a connection substrate and a metal plate of an imaging device according to an embodiment of the present invention; "(b)" of FIG. 15 is an imaging device according to an embodiment of the present invention The cross-sectional view of the connection substrate and the metal plate of the device; FIG. 16 is an exploded perspective view illustrating the separation of the connection substrate and the metal plate of the camera device according to an embodiment of the present invention; FIG. 17 is a connection substrate and a metal plate of the camera device according to an embodiment of the present invention A perspective view of a metal plate 18 is a perspective view illustrating a partial configuration of a bobbin and a drive unit of an imaging device according to an embodiment of the present invention; FIG. 19 is a perspective view of a magnet and a coil of an imaging device according to an embodiment of the present invention; FIG. 20 is A cross-sectional view of an imaging device according to an embodiment of the present invention. 20 is a cross-sectional view of a magnet and a coil of an imaging device according to an embodiment of the present invention; FIG. 21 a is a cross-sectional view of a magnet and a coil of an imaging device according to a first modified embodiment; FIG. 21 b is a cross-sectional view of a coil according to a second modified embodiment A cross-sectional view of a magnet and a coil of an imaging device; FIG. 22 is a cross-sectional view of an imaging device according to an embodiment of the present invention. 22 is a cross-sectional view of a magnet and a coil of an imaging device according to a third modified embodiment; FIG. 23 is a cross-sectional view of a magnet and a coil of an imaging device according to fourth to seventh modified embodiments; FIG. 24 is a cross-sectional view of a magnet and a coil of an imaging device according to a third modified embodiment. 24 is a cross-sectional view of a magnet and a coil of an imaging device according to an eighth modified embodiment; FIG. 25 is a cross-sectional view of a magnet and a coil of an imaging device according to a ninth modified embodiment; A cross-sectional view of the imaging device according to this embodiment. Wires of the imaging device according to the present embodiment may be omitted in some drawings.

The camera 10 may capture any one or more of images and videos. The camera device 10 may be a camera. The camera device 10 may be a camera module. The imaging device 10 may be an imaging element. The camera device 10 may be a camera unit. The camera device 10 may include a lens driving device. The imaging device 10 may include a sensor driving device. The camera 10 may include a voice coil motor (VCM). Camera 10 may include an autofocus element. The imaging device 10 may include a jitter correction element. The camera 10 may include an autofocus device. The imaging device 10 may include a hand-shake correction device. Camera 10 may include an actuator. The imaging device 10 may include a lens driving actuator. The camera 10 may include a sensor-driven actuator. The camera 10 may include an autofocus actuator. The imaging device 10 may include a jitter correction actuator.

The imaging device 10 may include a fixing part 100 . When the moving parts 200 and 300 move, the fixed part 100 may be a relatively fixed part. When one or more of the first moving part 200 and the second moving part 300 moves, the fixed Part 100 may be a relatively fixed part. The fixed part 100 may accommodate the first moving part 200 and the second moving part 300 . The fixed part 100 may be disposed outside the first moving part 200 and the second moving part 300 .

Although the first substrate 110 is described as one configuration of the fixing part 100 throughout the specification, the first substrate 110 may be understood as a configuration separate from the fixing part 100 . The fixing part 100 may be disposed in the first substrate 110 . The fixing part 100 may be disposed on the first substrate 110 . The fixing part 100 may be disposed over the first substrate 110 .

The camera 10 may include a first substrate 110 . The fixing part 100 may include a first substrate 110 . The first substrate 110 may be a main substrate. The first substrate 110 may be one substrate. The first substrate 110 may be a printed circuit board (PCB). The first substrate 110 may be connected to a power source of the optical device 1 . The first substrate 110 may include a connector connected to a power source of the optical device 1 . The first substrate may be disposed under the image sensor 330 .

The camera device 10 may include a base 120 . The fixing part 100 may include a base 120 . The base 120 may be disposed in the first substrate 110 . Base 120 can to be disposed on the first substrate 110 . The base 120 may be disposed above the first substrate 110 . The base 120 may be fixed on the first substrate 110 . The base 120 may be coupled with the first substrate 110 . The base 120 may be attached to the first substrate 110 by an adhesive. The base 120 may be placed between the first substrate 110 and the case 130 .

The camera device 10 may include a housing 130 . The fixing part 100 may include a housing 130 . The case 130 may be disposed in the base 120 . The case 130 may be disposed on the base 120 . The case 130 may be disposed above the base 120 . The housing 130 may be fixed on the base 120 . The case 130 may be coupled with the base 120 . The case 130 may be bonded to the base 120 by an adhesive. The case 130 may be disposed on the first substrate 110 . The case 130 may be disposed over the first substrate 110 . The case 130 may be formed of a separate part from the base 120 . The housing 130 may be integrally formed.

The camera device 10 may include a cover 140 . The fixing part 100 may include a cover part 140 . The cover part 140 may be coupled with the base 120 . The cover 140 may be coupled with the case 130 . The cover 140 may be coupled with the first substrate 110 . The cover 140 may be fixed on the base 120 . The cover 140 may be fixed to the case 130 . The cover 140 may be fixed to the first substrate 110 . Cover 140 can cover At least a portion of the base 120 is covered. The cover 140 may cover at least a portion of the case 130 .

Cover 140 may be a "cover can" or a "shroud can". The cover part 140 may be formed of a metal material. The cover 140 may prevent electromagnetic interference (EMI). The cover 140 may be electrically connected to the first substrate 110 . The cover 140 may be grounded to the first substrate 110 .

The cover 140 may include an upper plate. The cover 140 may include holes formed on the upper plate. The hole may be formed at a position corresponding to the lens 220 . The cover member 140 may include a side panel. The side panels may include a plurality of side panels. The side panels may include four side panels. The side panels may include first to fourth side panels. The side panels may include first and second side panels disposed opposite to each other, and third and fourth side panels disposed opposite to each other. The cover 140 may include a plurality of corners between the plurality of side panels.

Although throughout the specification, the cover 140 is described as one configuration of the fixing member 100 , the cover 140 may be understood as a separate configuration from the fixing member 100 . The cover 140 may be coupled with the fixing part 100 . The cover 140 may cover the first moving part 200 .

The camera 10 may include a first moving part 200 . The first moving part 200 may move relative to the fixed part 100 . The first moving part 200 can move in the optical axis direction relative to the fixed part 100 . The first moving part 200 may be disposed inside the fixed part 100 . The first moving part 200 may be movably disposed inside the fixed part 100 . The first moving part 200 may be arranged to be movable in the direction of the optical axis of the fixed part 100 . An auto focus (AF) function may be performed by moving the first moving part 200 in an optical axis direction relative to the fixed part 100 . The first moving part 200 may be disposed on the second moving part 300 .

The camera device 10 may include a bobbin 210 . The first moving part 200 may include a bobbin 210 . The bobbin 210 may be disposed on the first substrate 110 . The bobbin 210 may be disposed over the first substrate 110 . The bobbin 210 may be disposed spaced apart from the first substrate 110 . The spool 210 may be disposed within the housing 130 . The spool 210 may be disposed within the housing 130 . At least a portion of the spool 210 may be received within the housing 130 . The bobbin 210 may be movably disposed within the housing 130 . The bobbin 210 may be movably disposed on the housing 130 in an optical axis direction. The spool 210 may be coupled with a lens 220 . The spool 210 may include a hollow or a hole. Lens 220 can set bobbin 210 in the hollow or in the hole. An outer peripheral surface of the lens 220 may be coupled with an inner peripheral surface of the bobbin 210 .

The camera 10 may include a lens 220 . The first moving part 200 may include a lens 220 . Lens 220 may be coupled to bobbin 210 . Lens 220 may be fixed to bobbin 210 . The lens 220 can move integrally with the bobbin 210 . Lens 220 may be attached to bobbin 210 with screws. Lens 220 may be bonded to bobbin 210 by adhesive. The lens 220 may be disposed at a position corresponding to the image sensor 330 . The optical axis of the lens 220 can coincide with the optical axis of the image sensor 330 . The optical axis may be the Z axis. The lens 220 may include a plurality of lenses. Lens 220 may include five or six lenses.

The camera device 10 may include a lens module. The lens module can be coupled with the bobbin 210 . The lens module may include a barrel and one or more lenses 220 placed within the barrel.

The camera 10 may include a second moving part 300 . The second moving part 300 may move relative to the fixed part 100 . The second moving part 300 may move in a direction perpendicular to the optical axis direction relative to the fixing part 100 . second moving part 300 may be provided inside the fixing part 100 . The second moving part 300 may be movably disposed inside the fixed part 100 . The second moving part 300 may be movably disposed inside the fixing part 100 in a direction perpendicular to the optical axis direction. An hand-shake correction (OIS) function may be performed by moving the second moving part 300 relative to the fixed part 100 in a direction perpendicular to the optical axis direction. The second moving part 300 may be disposed between the first moving part 200 and the first substrate 110 .

The camera 10 may include a second substrate 310 . The second moving part 300 may include a second substrate 310 . The second substrate 310 may be one substrate. The second substrate 310 may be a printed circuit board (PCB). The second substrate 310 may be disposed between the first moving part 200 and the first substrate 110 . The second substrate 310 may be disposed between the bobbin 210 and the first substrate 110 . The second substrate 310 may be disposed between the lens 220 and the first substrate 110 . The second substrate 310 may be spaced apart from the fixing part 100 . The second substrate 310 may be spaced apart from the fixing member 100 in a direction perpendicular to the optical axis direction and the optical axis direction. The second substrate 310 may move in a direction perpendicular to the optical axis direction. The second substrate 310 can be electrically connected to the image sensor 330 . The second substrate 310 can be compared with Fig. The image sensor 330 moves integrally. The second substrate 310 may include a hole. The image sensor 330 may be disposed in a hole of the second substrate 310 .

The second substrate 310 may include one terminal 311 . Terminals 311 may be disposed on the lower surface of the second substrate 310 . The terminal 311 may be coupled with the terminal 321 of the sensor substrate 320 . The second substrate 310 may be formed separately from the sensor substrate 320 . The second substrate 310 may be formed separately from the sensor substrate 320 to be coupled thereto. The terminal 321 of the sensor substrate 320 may be soldered to the terminal 311 of the second substrate 310 .

The camera 10 may include a sensor substrate 320 . The second moving part 300 may include a sensor substrate 320 . The sensor substrate 320 may be one substrate. The sensor substrate 320 may be a printed circuit board (PCB). The sensor substrate 320 may be coupled with an image sensor 330 . The sensor substrate 320 may be coupled with the second substrate 310 .

The sensor substrate 320 may include a terminal 321 . The terminal 321 of the sensor substrate 320 may be coupled with the terminal 311 of the second substrate 310 . The sensor substrate 320 may be coupled to the lower surface of the second substrate 310 . The sensor substrate 320 may be disposed under the second substrate 310 . The sensor substrate 320 may be coupled under the second substrate 310 while being coupled with the image sensor 330 .

The camera 10 may include an image sensor 330 . The second moving part 300 may include an image sensor 330 . The image sensor 330 may be disposed in the sensor substrate 320 . The image sensor 330 may be disposed between the sensor substrate 320 and the sensor mount 350 . The image sensor 330 can be electrically connected to the second substrate 310 . The image sensor 330 may move integrally with the second substrate 310 .

The light passing through the lens 220 and the filter 360 may enter the image sensor 330 to form an image. The image sensor 330 can be electrically connected with the sensor substrate 320 , the second substrate 310 and the first substrate 110 . Image sensor 330 may include an active image area. The image sensor 330 can convert the light irradiated to the effective image area into electrical signals. The image sensor 330 may include any one or more of a Charge Coupled Device (CCD), Metal Oxide Semiconductor (MOS), CPD, and CID.

The camera device 10 may include a bracket 340 . The second moving part 300 may include a bracket 340 . The bracket 340 may be formed of insulating material. The fixer 340 may be disposed in the second substrate 310 . The fixer 340 may be disposed on the second substrate 310 . The fixer 340 may be disposed over the second substrate 310 . Fixer 340 may be fixed on the second substrate 310 . The fixer 340 may be coupled with the second substrate 310 . The holder 340 may include a hollow or a hole in which the image sensor 330 is disposed. The second coil 440 may be placed in the holder 340 . The fixer 340 may include a protrusion on which the second coil 440 is wound. The holder 340 may include a hole in which the Hall sensor 445 is seated.

Camera device 10 may include a sensor mount 350 . The second moving part 300 may include a sensor base 350 . The sensor base 350 may be disposed in the sensor substrate 320 . The sensor base 350 may include holes formed at positions corresponding to the image sensors 330 . The sensor base 350 may include a groove in which the filter 360 is disposed.

The camera device 10 may include a screening program 360 . The second moving part 300 may include a filter 360 . A filter 360 may be placed between the lens 220 and the image sensor 330 . A filter 360 may be provided in the sensor base 350 . The filter 360 can block light of a specific frequency band in the light passing through the lens 220 from being incident on the image sensor 330 . Filter 360 may include an infrared cut filter. The filter 360 can prevent infrared rays from incident on the image sensor 330 .

The camera 10 may include a drive unit. The driving unit may move the moving parts 200 and 300 relative to the fixed part 100 . The driving unit may perform an auto focus (AF) function. The drive unit can perform hand-shake correction (OIS) function. The driving unit can move the lens 220 . The driving unit can move the image sensor 330 . The drive unit may include a magnet and a coil. The driving unit may include a shape memory alloy (SMA).

The imaging device 10 may include a first driving unit. The first drive unit may be an AF drive unit. The first driving unit may move the first moving part 200 in the optical axis direction. The first driving unit may move the rotating shaft 210 in the optical axis direction. The lens 220 can move in the optical axis direction. The first driving unit may perform an auto focus (AF) function. The first driving unit may move the first moving part 200 in the optical axis direction. The first driving unit may move the first moving part 200 downward along the optical axis direction.

The camera 10 may include a second drive unit. The second drive unit may be an OIS drive unit. The second driving unit may move the second moving part 300 in a direction perpendicular to the optical axis direction. The second drive unit can be in the direction perpendicular to the optical axis The second substrate 310 is moved in the direction of . The second driving unit may move the sensor substrate 320 in a direction perpendicular to the optical axis direction. The second driving unit may move the image sensor 330 in a direction perpendicular to the optical axis direction. The second driving unit may move the bracket 340 in a direction perpendicular to the optical axis direction. The second driving unit may move the sensor base 350 in a direction perpendicular to the optical axis direction. The second driving unit may move the filter 360 in a direction perpendicular to the optical axis direction. The second drive unit can perform hand-shake correction (OIS) function.

The second driving unit may move the second moving part 300 in a first direction perpendicular to the optical axis direction. The second driving unit may move the second moving part 300 in a second direction perpendicular to the optical axis direction and the first direction. The second driving unit may rotate the second moving part 300 around the optical axis.

In this embodiment, the first driving unit may include a first coil 430 . The second driving unit may include a second coil 440 . The first driving unit may include a first magnet 410 for interacting with a first coil 430 . The second driving unit may include a second magnet 420 for interacting with a second coil 440 . as an improved As an example, the first drive unit and the second drive unit may comprise individually controlled coils and a common magnet.

The camera device 10 may include a first magnet 410 . The driving unit may include a first magnet 410 . The first driving unit may include a first magnet 410 . The first magnet 410 may be a magnet. The first magnet 410 may be a permanent magnet. The first magnet 410 can be used for auto focus (AF).

The first magnet 410 may be placed in the fixing part 100 . The first magnet 410 may be fixed to the fixing part 100 . The first magnet 410 may be coupled to the fixing part 100 . The first magnet 410 may be adhered to the fixing part 100 by an adhesive. The first magnet 410 may be placed in the housing 130 . The first magnet 410 may be fixed on the housing 130 . The first magnet 410 may be coupled to the housing 130 . The first magnet 410 may be adhered to the case 130 by an adhesive. The first magnet 410 may be disposed at one corner of the case 130 . The first magnet 410 may be configured to be biased towards one corner of the housing 130 .

The first magnet 410 may be a two-pole magnetized magnet, including an N pole region and an S pole region. As an improved embodiment, the first magnet 410 can be A 4-pole magnetized magnet consisting of two N-pole regions and two S-pole regions. The inner surface of each unit magnet of the first magnet 410 may be an S pole, and the outer surface may be an N pole. At this time, the inner surface of each unit magnet of the second magnet 420 may be an N pole, and the outer surface may be an S pole. Conversely, the inner surface of each unit magnet of the first magnet 410 may be an N pole, and the outer surface may be an S pole. At this time, the inner surface of each unit magnet of the second magnet 420 may be an S pole, and the outer surface may be an N pole. As shown in Figure 21b, the inner surface of the magnet is arranged in the order of S pole, N pole, and S pole from top to bottom, while the outer surface of the magnet can be arranged in the order of N pole, S pole, and N pole from top to bottom.

The first magnet 410 may include a plurality of magnets. The first magnet 410 may include four magnets. The first magnet 410 may include first to fourth unit magnets 411 , 412 , 413 and 414 . The first to fourth unit magnets 411, 412, 413, and 414 may be symmetrically arranged with respect to the optical axis. The first to fourth unit magnets 411, 412, 413, and 414 may be formed to have the same size and shape.

The camera 10 may include a second magnet 420 . The driving unit may include a second magnet 420 . The second driving unit may include a second magnet 420 . second magnet 420 can be a magnet. The second magnet 420 may be a permanent magnet. The second magnet 410 may be used for hand shake correction (OIS).

The second magnet 420 may be placed in the fixing part 100 . The second magnet 420 may be fixed on the fixing part 100 . The second magnet 420 may be coupled with the fixing part 100 . The second magnet 420 may be adhered to the fixing part 100 by an adhesive. The second magnet 420 may be placed in the case 130 . The second magnet 420 may be fixed on the case 130 . The second magnet 420 may be coupled to the housing 130 . The second magnet 420 may be adhered to the case 130 by an adhesive. The second magnet 420 may be disposed at one corner of the case 130 . The second magnet 420 may be configured to be biased towards one corner of the housing 130 .

The second magnet 420 may be a two-pole magnetized magnet, including an N pole region and an S pole region. As an improved embodiment, the second magnet 420 may be a quadrupole magnet composed of two N pole regions and two S pole regions.

The second magnet 420 may include a plurality of magnets. The second magnet 420 may include four magnets. The second magnet 420 may include first to fourth unit magnets 421 , 422 , 423 and 424 . The first to fourth unit magnets 421, 422, 423 and 424 can be relatively The optical axes are arranged symmetrically. The first to fourth unit magnets 421, 422, 423, and 424 may be formed to have the same size and shape.

This embodiment may involve an arrangement of an AF driver for moving the lens 220 and an OIS driver for moving the image sensor 330 . At this time, the vertical length of the AF magnet may be larger than that of the OIS magnet. The OIS magnet and OIS coil may protrude further outward than the bobbin 210 on the X-axis when viewed from the top and the side, are positioned eccentrically in a corner, and overlap adjacent magnets on the Y-axis.

However, for AF driving, the AF magnet may protrude more towards the center of the side, rather than the corner, so as to face the AF coil in the bobbin 210 on the set-up line as much as possible. Therefore, more portions of the OIS magnet may protrude from the corner toward the center side of the side than the OIS coil.

The AF magnets can also protrude with the same size as the OIS magnets are protruded further towards the corners. However, its performance may be irrelevant, if not prominent.

AF magnets and OIS magnets are fabricated in one piece, or can be fabricated to have the same dimensions for ease of assembly.

In addition, the OIS magnet can couple the AF magnet and the OIS magnet with 4 poles.

The first magnet 410 may overlap with the second magnet 420 in the direction of the optical axis. The first magnet 410 may overlap the second magnet 420 in a vertical direction. The length of the first magnet 410 in the direction of the optical axis may be longer than the length of the second magnet 420 . In an improved embodiment, the length of the first magnet 410 in the direction of the optical axis may be the same as the length of the second magnet 420 . As another modified example, the length of the first magnet 410 in the direction of the optical axis may be shorter than the length of the second magnet 420 .

The first magnet 410 and the second magnet 420 may be housed in an integrated housing 130 . The first magnet 410 may be directly coupled to the second magnet 420 . The first magnet 410 may be coupled with the second magnet 420 and the yoke 425 therebetween.

The first magnet 410 may be larger than the second magnet 420 . The first magnet 410 may have a larger volume than the second magnet 420 . The first magnet 410 may have a larger cross-sectional area than the second magnet 420 . As a modified example, the first magnet 410 may be formed to have the same size as the second magnet 420 . In another modified embodiment, the first magnet 410 may be smaller than the second magnet 420 .

The first magnet 410 may be a two-pole magnet. The second magnet 420 may be a two-pole magnet. However, each of the first magnet 410 and the second magnet 420 may be part of a single 4-pole magnet. The first magnet 410 and the second magnet 420 may be separately formed and coupled. Alternatively, the first magnet 410 and the second magnet 420 can form a single magnet.

The first magnet 410 may include a first unit magnet 411 and a second unit magnet 412 arranged with respect to an optical axis, and a third unit magnet 413 and a fourth unit magnet 414 arranged with respect to an optical axis. The first unit magnet 411 may include a first surface facing the first coil 430 . The first unit magnet 411 may overlap with the third unit magnet 413 in a direction facing the first surface. The first unit magnet 411 may not overlap the second unit magnet 412 in a direction in which the first surface faces.

The first unit magnet 411 may include a portion protruding toward the outside of the bobbin 210 in the X-axis direction perpendicular to the optical axis direction. A portion of the first unit magnet 411 may overlap the third unit magnet 413 in the optical axis direction and the Y axis direction perpendicular to the X axis direction.

The second magnet 420 may include a first unit magnet 421 and a second unit magnet 422 which are mutually arranged with respect to the optical axis direction, and a third unit magnet 423 and a fourth unit magnet 424 which are mutually arranged with respect to the optical axis direction. The first unit magnet 421 may include a first surface facing the first coil 430 . The first unit magnet 421 may overlap the third unit magnet 423 in a direction in which the first surface faces. The first unit magnet 421 may not overlap the second unit magnet 422 in a direction in which the first surface faces.

The second magnet 420 may not coincide with the bobbin 210 in a direction perpendicular to the direction of the optical axis. The second magnet 420 may include a portion that does not overlap the second coil 440 in the optical axis direction. The first unit magnet 421 of the second magnet 420 may include a portion protruding to the outside of the second coil 440 in an optical axis direction and an X-axis direction perpendicular to the Y-axis direction. The first unit magnet 421 of the second magnet 420 may include a portion that does not overlap the second coil 440 in the optical axis direction.

The first coil 430 may coincide with the first magnet 410 in a direction perpendicular to the optical axis direction. The second coil 440 may overlap the second magnet 420 in the optical axis direction. When the drive current in the first direction is applied to the first coil 430, the first moving part 200 can move down to the first position in the direction of the optical axis. When a driving current in a second direction opposite to the first direction is applied to the first coil 430, the first moving part 200 may be moved upward to the second position in the optical axis direction. When the first moving part 200 is positioned at the first position and the second position, the first coil 430 may overlap the first magnet 410 in a direction perpendicular to the direction of the optical axis. That is to say, the first coil 430 may coincide with the first magnet 410 in a direction perpendicular to the direction of the optical axis during the entire travel of the first moving part 200 in the up-and-down direction.

As shown in FIG. 20 , in this embodiment, a neutral region with neutral polarity may be provided between the first magnet 410 and the second magnet 420 . A neutral region having a neutral polarity may be formed between the first magnet 410 and the second magnet 420 .

As shown in FIG. 21 a , in the first modified embodiment, the first magnet 410 may be in contact with the second magnet 420 . The first magnet 410 may be bonded to the second magnet 420 by an adhesive. The first magnet 410 may be coupled with the second magnet 420 . The first magnet 410 may be fixed on the second magnet 420 . The first magnet 410 may be placed in the second magnet 420 .

As shown in FIG. 21b, in a second modified embodiment, the first magnet 410 may be a two-pole magnet. The second magnet 420 may be a 4-pole magnet.

As shown in FIG. 22 , in a third modified embodiment, the imaging device 10 may include a yoke 425 . The yoke 425 may be placed between the first magnet 410 and the second magnet 420 .

As shown in (a) of FIG. 23, in a fourth modified embodiment, the imaging device 10 may include a yoke 425a. The yoke 425 a may include a first portion disposed on an outer surface of the second magnet 420 and a second portion disposed between the first magnet 410 and the second magnet 420 . The second part can be bent from the first part.

As shown in (b) of FIG. 23 , in a fifth modified embodiment, the imaging device 10 may include a yoke 425b. The yoke 425 b may include a first portion disposed on outer surfaces of the first magnet 410 and the second magnet 420 , and a second portion disposed on an upper surface of the first magnet 410 . The second part can be bent from the first part. The first magnet 410 and the second magnet 420 may contact each other.

As shown in (c) of FIG. 23, in a sixth modified embodiment, the imaging device 10 may include a yoke 425c. The yoke 425c may be disposed on the first magnet 410 surface. The yoke 425c may be formed from one flat plate. The first magnet 410 and the second magnet 420 may contact each other.

As shown in (d) of FIG. 23, in a seventh modified embodiment, the imaging device 10 may include a yoke 425d. The yoke 425d may be disposed on outer surfaces of the first magnet 410 and the second magnet 420 . The yoke 425d may be formed from a flat plate. The first magnet 410 and the second magnet 420 may contact each other.

As shown in FIG. 24, in the eighth modified embodiment, the first magnet 410 may be provided with a length in the first direction perpendicular to the optical axis direction. The length of the first magnet 410 (refer to a of FIG. 24 ) may be longer than the length of the second magnet 420 (refer to b of FIG. 24 ) in the optical axis direction and the second direction perpendicular to the first direction.

As shown in FIG. 25, in the ninth modified embodiment, the first magnet 410 may be configured to have a longer length in the first direction perpendicular to the optical axis direction. The length of the first magnet 410 in the first direction (refer to a of FIG. 25 ) may be longer than the length of the second magnet 420 (refer to b of FIG. 25 ). In the first direction, the length b of the second magnet 420 may be longer than the length of the second coil 440 (refer to c of FIG. 25 ).

This embodiment can solve the electromagnetic force optimization problem. As the driving stroke of OIS and the driving stroke of AF increase and the size of the image sensor increases, it may be necessary to optimize the electromagnetic force. This embodiment may include a structure in which coils and magnets for driving OIS are separated from those for AF.

To increase the electromagnetic force for OIS and AF, a bipolar magnetized magnet can be used, as shown in Figure 20. In this case, it can have a higher electromagnetic force than in the case of OIS using a single pole. In this embodiment, the first coil 430 as the AF coil is made smaller in the height direction compared with the first magnet 410 so that the first coil 430 overlaps the first magnet 410 in the entire moving part, so that Linearity is maintained in moving parts. A neutral zone may be formed between the first magnet 410 and the second magnet 420 .

Most of the AF electromagnetic force may be generated by the first coil 430 and the first magnet 410 . Most of the OIS electromagnetic force can be generated by the second coil 440 and the second magnet 420 . However, in the case of OIS, there is an effect of increasing the electromagnetic force of the OIS by the first magnet 410 .

In a modified embodiment, the first magnet 410 and the second magnet 420 can be used by connecting the two magnets. At this time, the neutral zone between the two magnets can be removed to increase the electromagnetic force. In this embodiment, the first magnet 410, the second magnet 420 and the neutral zone 415 may be formed by one magnet. At this time, the first magnet 410 may be a first magnet part, and the second magnet 420 may be a second magnet part.

In an improved embodiment, the electromagnetic force can be further increased by adding a yoke. In addition, the electromagnetic force for driving OIS and AF can be adjusted by the position of the yoke. The height of the first magnet 410 may be higher than that of the second magnet 420 due to the need to cover the driving stroke of AF. The second magnet 420 may have a larger height separation width. Although the height of the second magnet 420 is preferably high, the overall height of the camera device 10 may also increase, which may cause problems.

As an improved embodiment, the driving magnet can be formed as a single magnet.

The camera device 10 may include a first coil 430 . The driving means may include a first coil 430 . The first coil 430 may be disposed in the first moving part 200 . The first coil 430 may be fixed to the first moving part 200 . The first coil 430 can be to be coupled with the first moving part 200 . The first coil 430 may be bonded to the first moving part 200 by an adhesive. The first coil 430 may be disposed in the bobbin 210 . The first coil 430 may be fixed on the bobbin 210 . The first coil 430 may be coupled with the bobbin 210 . The first coil 430 may be bonded to the bobbin 210 by an adhesive. The first coil 430 can be electrically connected with the driving IC 480 . The first coil 430 can be electrically connected with the lower elastic member 720 , the sensing substrate 470 and the driving IC 480 . The first coil 430 may receive current from the driver IC 480 .

The first coil 430 may be disposed at a position corresponding to the driving magnet 410 . The first coil 430 may be disposed in the bobbin 210 at a position corresponding to the driving magnet 410 . The first coil 430 may face the driving magnet 410 . The first coil 430 may include a surface facing the driving magnet 410 . The first coil 430 may be arranged adjacent to the driving magnet 410 . The first coil 430 may interact with the driving magnet 410 . The first coil 430 may electromagnetically interact with the drive magnet 410 .

The first coil 430 may move the first moving part 200 in the optical axis direction. The first coil 430 may move the bobbin 210 in the optical axis direction. The first coil 430 may move the lens 220 in the optical axis direction. The first coil 430 can move in the direction of the optical axis Move the first moving part 200. The first coil 430 may move the bobbin 210 in an ascending direction of the optical axis direction. The first coil 430 may move the lens 220 in an ascending direction of the optical axis direction. The first coil 430 may move the first moving part 200 in the down direction of the optical axis direction. The first coil 430 may move the bobbin 210 in a downward direction of the optical axis direction. The first coil 430 may move the lens 220 in the down direction of the optical axis direction.

The camera 10 may include a second coil 440 . The driving unit may include a second coil 440 . The second coil 440 may be provided in the second moving part 300 . The second coil 440 may be fixed to the second moving part 300 . The second coil 440 may be coupled with the second moving part 300 . The second coil 440 may be bonded to the second moving part 300 by an adhesive. The second coil 440 may be placed in the holder 340 . The second coil 440 may be fixed on the bracket 340 . A second coil 440 may be coupled to the bracket 340 . The second coil 440 may be bonded to the bracket 340 by an adhesive. The second coil 440 may be wound at the protrusion of the bracket 340 and placed. The second coil 440 may be placed on the bracket 340 . The second coil 440 can be electrically connected to the second substrate 310 . Both ends of the second coil 440 may be soldered to the second substrate 310 . Second coil 440 It can be electrically connected with the driver IC 495 . The second coil 440 can be electrically connected with the second substrate 310 and the driving IC 495 . The second coil 440 may receive current from the driver IC 495 .

The second coil 440 may be disposed at a position corresponding to the second magnet 420 . The second coil 440 may be disposed at a position corresponding to the second magnet 420 in the bracket 340 . The second coil 440 may face the second magnet 420 . The second coil 440 may include a surface facing the second magnet 420 . The second coil 440 may be arranged adjacent to the second magnet 420 . The second coil 440 may interact with the second magnet 420 . The second coil 440 may electromagnetically interact with the second magnet 420 .

The second coil 440 may move the second moving part 300 in a direction perpendicular to the optical axis direction. The second coil 440 may move the second substrate 310 in a direction perpendicular to the optical axis direction. The second coil 440 may move the sensor substrate 320 in a direction perpendicular to the optical axis direction. The second coil 440 may move the image sensor 330 in a direction perpendicular to the optical axis direction. The second coil 440 may move the bracket 340 in a direction perpendicular to the optical axis direction. The second coil 440 may rotate the second moving part 300 around the optical axis. The second coil 440 may rotate the second substrate 310 around the optical axis. The second coil 440 may rotate the sensor substrate 320 about the optical axis. The second coil 440 can The image sensor 330 is rotated around the optical axis. The second coil 440 can rotate the bracket 340 around the optical axis.

The second coil 440 may include a plurality of coils. The second coil 440 may include four coils. The second coil 440 may include a coil for moving in the X-axis. The second coil 440 may include a coil for moving in the Y-axis.

The second coil 440 may include a second-first coil 441 . The second first coil 441 may be a first sub-coil. The second first coil 441 may be a coil for X-axis movement. The second first coil 441 may move the second moving part 300 in the X-axis direction. The second-first coil 441 may be disposed along the length of the Y-axis direction. The second-first coil 441 may include a plurality of coils. The second-first coil 441 may include two coils. The two coils of the second-first coil 441 may be electrically connected to each other. The second-first coil 441 may include a connection coil connecting the two coils. In this case, the two coils of the second-first coil 441 may receive current together. Alternatively, the two coils of the second-first coil 441 may be electrically separated from each other to individually receive current.

The second coil 440 may include a second second coil 442 . The second second coil 442 may be a second secondary coil. The second second coil 442 may be a coil for Y-axis movement. The second second coil 442 may move the second moving part 300 in the Y-axis direction. The second second coil 442 may have a length arranged along the x-axis direction. The second-first coil 441 may include a plurality of coils. The second second coil 442 may include two coils. The two coils of the second second coil 442 may be electrically connected to each other. The second second coil 442 may include a connection coil connecting the two coils. In this case, the two coils of the second second coil 442 may receive current together. Alternatively, the two coils of the second second coil 442 may be electrically separated from each other to individually receive current.

The camera device 10 may include a Hall sensor 445 . The hall sensor 445 may be disposed in the second substrate 310 . The Hall sensor 445 may be disposed in a hole of the bracket 340 . The Hall sensor 445 may include a Hall device (Hall IC). The Hall sensor 445 can detect the drive magnet 410 . The hall sensor 445 can detect the magnetic force of the driving magnet 410 . The Hall sensor 445 may face the driving magnet 410 . The hall sensor 445 may be disposed at a position corresponding to the driving magnet 410 . The Hall sensor 445 may be disposed adjacent to the drive magnet 410 . Hall sensor 445 can detect The position of the second moving part 300 . The hall sensor 445 may detect the motion of the second moving part 300 . The Hall sensor 445 may be disposed in the hollow of the second coil 440 . The sensing value detected by the hall sensor 445 can be used to feed back the jitter correction operation. The Hall sensor 445 can be electrically connected with the driver IC 495 .

Hall sensor 445 may include a plurality of Hall sensors. The Hall sensor 445 may include three Hall sensors. The hall sensor 445 may include first to third hall sensors. The first Hall sensor can detect the displacement of the second moving part 300 in the X-axis direction. The second Hall sensor can detect the displacement of the second moving part 300 in the Y-axis direction. The third Hall sensor may detect the rotation of the second moving part 300 around the Z-axis alone or together with any one or more of the first Hall sensor and the second Hall sensor.

The camera device 10 may include an induction magnet 450 . The induction magnet 450 may be provided in the first moving part 200 . The induction magnet 450 may be fixed to the first moving part 200 . The induction magnet 450 may be coupled to the first moving part 200 . The induction magnet 450 may be adhered to the first moving part 200 by an adhesive. An induction magnet 450 may be placed in the spool 210 . induction magnet 450 can be fixed to the spool 210 on. An induction magnet 450 may be coupled to the spool 210 . The induction magnet 450 may be bonded to the bobbin 210 by adhesive. The sensing magnet 450 may be formed to have a smaller size than the driving magnet 410 . Through this, the influence of the induction magnet 450 on the driving can be minimized.

The induction magnet 450 can be arranged opposite to the correction magnet 460 . The induction magnet 450 and the correction magnet 460 may be disposed opposite to each other in the first moving part 200 . The induction magnet 450 and the correction magnet 460 may be disposed opposite to each other in the bobbin 210 .

The camera 10 may include a correction magnet 460 . The correcting magnet 460 may be a compensating magnet. A correction magnet 460 may be provided in the first moving part 200 . The correction magnet 460 may be fixed to the first moving part 200 . The correction magnet 460 may be coupled with the first moving part 200 . The correction magnet 460 may be adhered to the first moving part 200 by an adhesive. A calibration magnet 460 may be placed in the bobbin 210 . The alignment magnet 460 may be fixed on the bobbin 210 . The correction magnet 460 may be coupled with the bobbin 210 . The alignment magnet 460 may be bonded to the bobbin 210 by adhesive. The correction magnet 460 may be formed to have a smaller size than the driving magnet 410 . Through this, the influence of the correction magnet 460 on driving can be minimized. Additionally, a calibration magnet 460 can be placed On the opposite side of the induction magnet 450 to form a magnetic force balance with the induction magnet 450 . Through this, it is possible to prevent tilting that may be generated by the induction magnet 450 .

The camera device 10 may include a sensing substrate 470 . The sensing substrate 470 may be a substrate. The sensing substrate 470 may be a printed circuit board (PCB). The sensing substrate 470 may be a flexible substrate. The sensing substrate 470 may be a flexible printed circuit board (FPCB). The sensing substrate 470 may be coupled to the first substrate 110 . The sensing substrate 470 may be connected to the first substrate 110 . The sensing substrate 470 can be electrically connected with the first substrate 110 . The sensing substrate 470 may be soldered to the first substrate 110 . The sensing substrate 470 may be placed in the housing 130 . The sensing substrate 470 can be fixed on the housing 130 . A sensing substrate 470 may be coupled to the housing 130 . The housing 130 may include a groove or a hole having a shape corresponding to the sensing substrate 470 . The sensing substrate 470 may be placed in a groove or hole of the housing 130 .

The camera 10 may include one driver IC 480 . The driver IC 480 may be an AF driver IC. The driving IC 480 can be electrically connected with the first coil 430 . The driving IC 480 may apply current to the first coil 430 to perform AF driving. The driving IC 480 may apply power to the first coil 430 . Driver IC 480 can be used for the first coil 430 Apply current. The driver IC 480 can apply voltage to the first coil 430 . The driving IC 480 may be disposed in the sensing substrate 470 . The driver IC 480 may be disposed at a position corresponding to the induction magnet 450 . The driver IC 480 may be configured to face the induction magnet 450 . The driver IC 480 may be configured adjacent to the sensing magnet 450 .

Driver IC 480 may include a sensor. The sensor may include a Hall IC. The sensor can be disposed at a position corresponding to the sensing magnet 450 . The sensor may be configured to face the induction magnet 450 . A sensor may be disposed adjacent to the sensing magnet 450 . The sensor can detect the induction magnet 450 . The sensor can detect the magnetic force of the induction magnet 450 . The sensor may detect the position of the first moving part 200 . The sensor may detect movement of the first moving part 200 . The detection value detected by the sensor can be used for feedback of auto focus drive.

The camera 10 may include a gyro sensor 490 . The gyro sensor 490 may be disposed in the first substrate 110 . The gyro sensor 490 can detect shaking of the camera device 10 . The gyro sensor 490 may detect an angular velocity or a linear velocity caused by shaking of the camera 10 . The gyroscope sensor 490 can be electrically connected to the driver IC 495 sexual connection. The shaking of the camera device 10 detected by the gyro sensor 490 can be used to drive hand shake correction (OIS).

The camera 10 may include a driver IC 495 . The driver IC 495 may be an OIS driver IC. The driving IC 495 can be electrically connected with the second coil 440 . The driver IC 495 may apply current to the second coil 440 to perform OIS driving. The driver IC 495 can apply a power supply to the second coil 440 . The driver IC 495 can apply current to the second coil 440 . The driver IC 495 can apply a voltage to the second coil 440 . The driver IC 495 may be disposed in the second substrate 310 .

The camera device 10 may include a connector. The connecting piece can be a plug-in piece. The link can support the movement of the second moving part 300 . The link may movably support the second moving part 300 . The link may connect the second moving part 300 and the fixed part 100 . The connector may connect the first substrate 110 and the second substrate 310 . The connector can electrically connect the first substrate 110 and the second substrate 310 . The link may guide the movement of the second moving part 300 . The link can guide the second moving part 300 to move in a direction perpendicular to the direction of the optical axis. The link may guide the second moving part 300 to rotate around the optical axis. The connector can limit the second moving part 300 in the light axis movement.

The connection member may include a connection substrate 600 . The connector may include an elastic member for connecting the fixed part 100 and the second moving part 300 . The link may comprise a leaf spring. The connector may include a wire 800 . The link may include a ball disposed between the fixed part 100 and the second moving part 300 .

The camera device 10 may include a connection substrate 600 . The connection substrate 600 may be a connection part. The connection substrate 600 may be a connection part. The connection substrate 600 may be a stretchable substrate. The connection substrate 600 may be a flexible substrate. The connection substrate 600 may be a flexible printed circuit board. The connection substrate 600 may be a flexible printed circuit board (FPCB). The connection substrate 600 may have flexibility in at least a portion. The second substrate 310 and the connection substrate 600 may be integrally formed.

The connection substrate 600 may support the second moving part 300 . The connection substrate 600 may support the movement of the second moving part 300 . The connection substrate 600 movably supports the second moving part 300 . The connection substrate 600 may connect the second moving part 300 and the fixed part 100 . The connection substrate 600 may connect the first substrate 110 and the second substrate 310 . The connection substrate 600 may electrically connect the first substrate 110 and the second substrate 310 . linker The board 600 may guide the movement of the second moving part 300 . The connection substrate 600 may guide the second moving part 300 to move in a direction perpendicular to the direction of the optical axis. The connection substrate 600 may guide the second moving part 300 to rotate around the optical axis. The connection substrate 600 may restrict the movement of the second moving part 300 in the optical axis direction. A portion of the connection substrate 600 may be coupled with the base 120 .

The connection substrate 600 may include two connection substrates 600 spaced apart from each other and symmetrically formed. Two connection substrates 600 may be disposed on both sides of the second substrate 310 . The connection substrate 600 may be bent 6 times in total to connect the first substrate 110 and the second substrate 310 .

The connection substrate 600 may include a first region connected to the second substrate 310 and bent in an optical axis direction. The first region is connected to the second substrate 310 and can be bent in the direction of the optical axis. The first region is connected to the second substrate 310 and can extend in the direction of the optical axis. The first region is connected to the second substrate 310 and may extend by bending in the optical axis direction. The connection substrate 600 may include a second region extending from the first region. The connection substrate 600 may include a third region bent in a direction perpendicular to the optical axis of the second region. The third region can be in the light perpendicular to the second region bend in the direction of the axis. The third area may extend in a direction perpendicular to the direction of the optical axis in the second area. The third region may be bent and extended in a direction perpendicular to the direction of the optical axis in the second region.

The connection substrate 600 may include a connection part 610 of the first region. The connection substrate 600 may include the extension part 620 of the second area and the third area. The connection substrate 600 may include a connection part 610 connected to the second substrate 310 . The connection substrate 600 may include an extension part 620 extending from the connection part 610 . The connection substrate 600 may include a terminal part 630 connected to the extension part 620 and including a terminal.

The connection substrate 600 may include a connection part 610 . The connection part 610 may be connected to the second moving part 300 . The connection part 610 may be coupled to the second moving part 300 . The connection part 610 may be fixed on the second moving part 300 . The connection part 610 may be connected to the second substrate 310 . The connection part 610 may be coupled with the second substrate 310 . The connection part 610 may be fixed on the second substrate 310 . The connection part 610 may include a first bending region bent in an optical axis direction. The connection part 610 may include a first bending area cut and bent in the optical axis direction. connecting parts 610 may include a first bending region extended in the optical axis direction. The connection part 610 may include a first region bent in an optical axis direction with respect to the second substrate 310 and a second region extending from the first region and bent in a direction perpendicular to the optical axis direction.

The connection base 600 may include an extension part 620 . The extension part 620 may connect the connection part 610 and the terminal part 630 . The extension part 620 may extend from the connection part 610 . The extension part 620 may include a second bending region bent in a direction perpendicular to the direction of the optical axis. The bending angle of the extension part 620 may be 80 to 100 degrees. The bending angle of the extension part 620 may be 85 to 95 degrees.

Any one of the bending area of the connection part 610 and the bending area of the extension part 620 may be referred to as a first bending area, and the other may be referred to as a second bending area.

The connection substrate 600 may include one terminal part 630 . The terminal part 630 may be coupled with the fixing part 100 . The terminal part 630 may be fixed to the fixing part 100 . The terminal part 630 may be coupled with the first substrate 110 . The terminal part 630 may be connected to the first substrate 110 . The terminal part 630 may be soldered to the first substrate 110 . The terminal part 630 may be fixed to the first substrate 110 . The terminal part 630 may be coupled with the base 120 . The terminal part 630 may be fixed on the base 120 . The terminal part 630 may include one terminal. Terminals may be coupled to the first substrate 110 .

In this embodiment, the camera device 10 may include a flexible substrate. The flexible substrate may connect the fixed part 100 and the second moving part 300 . The flexible substrate may include a connection part 610 connected to the second moving part 300, an extension part 620 extended from the connection part 610, and a terminal part 630 connected to the extension part 620 and including one terminal.

In this embodiment, the connection substrate 600 may include a first part coupled to the first substrate 110, a second part coupled to the second substrate 310, and a third part connecting the first part and the second part. The third portion may be arranged at least partially parallel to the optical axis. The third portion may be formed such that the length in the optical axis direction is longer than the thickness. The second portion of the connection substrate 600 may be at least partially disposed parallel to the second substrate 310 . The third portion of the connection substrate 600 may be at least partially disposed perpendicularly to the second portion. The third portion of the connection substrate 600 may be circularly bent in a portion corresponding to a corner of the second substrate 310 . The second substrate 310 may include A first side surface and a second side surface are disposed, and a third side surface and a fourth side surface are disposed opposite to each other. The second portion of the connection substrate 600 may be coupled with the first and second side surfaces of the second substrate 310 . The first portion of the connection substrate 600 may be coupled with portions of the first substrate 110 corresponding to the third and fourth side surfaces of the second substrate 310 .

The camera device 10 may include a metal plate 650 . The connector may include a metal plate 650 . The connection substrate 600 may include a metal plate 650 . However, the metal plate 650 may be understood as a separate configuration from the connection substrate 600 . Metal plate 650 may be a metal component. Metal plate 650 may be a metal component. Metal plate 650 may be a metal layer. The metal plate 650 may be a metal film. The metal plate 650 may be formed of metal. Metal plate 650 may be formed of an alloy. The metal plate 650 may be formed of copper alloy. The metal plate 650 may be formed of a conductive material. The metal plate 650 can be distinguished from the conductive layer 602 of the connection substrate 600 . The metal plate 650 may be formed of a material different from the conductive layer 602 of the connection substrate 600 . A metal plate 650 may be coupled to the connection substrate 600 . The metal plate 650 may have elasticity.

In the optical axis direction, at least partially, the metal plate 650 may have the same length as the extension member 620 . The metal plate 650 may be extended to have the same length as the extension part 620 in the optical axis direction. The thickness of the metal plate 650 may be the same as that of the connection substrate 600 . The thickness of the metal plate 650 may be thicker than that of the connection substrate 600 . The thickness of the conductive layer 602 may be 7 to 50 μm. The thickness of the metal plate 650 may be 20 to 150 μm. Metal plate 650 may be connected to ground GND for impedance matching and noise suppression.

At least a portion of the metal plate 650 may be disposed in the extension part 620 of the connection substrate 600 . The extension part 620 may include a curved region that is curved in a direction perpendicular to the direction of the optical axis. At this time, the metal plate 650 may be disposed in the bending area. A metal plate 650 may be disposed on an inner surface of the extension part 620 . The metal plate 650 may be disposed on the outer surface of the extension part 620 .

The metal plate 650 may be formed of a conductive material. The metal plate 650 can be electrically connected to the second substrate 310 . The metal plate 650 can be electrically connected with the image sensor 330 . The metal plate 650 can be electrically connected with the driver IC 495 . The metal plate 650 may be connected to the terminal 631 of the connection substrate 600 . The metal plate 650 can be electrically connected with the terminal 631 of the connecting substrate 600 catch. The metal plate 650 may directly contact the terminal 631 of the connection substrate 600 . The metal plate 650 may be coupled with the terminal 631 of the connection substrate 600 through a conductive member. The metal plate 650 may serve as a ground (GND). The metal plate 650 may be connected to a ground terminal of the connection substrate 600 . The metal plate 650 can be electrically connected to the first substrate 110 . In this case, the number of power supply connection patterns connecting the substrate 600 can be reduced.

The metal plate 650 may include a body part provided in the extension part 620 and a protrusion part 660 extending downward from the body part to the terminal 631 of the connection substrate 600 . The protruding portion 660 may be a protrusion. The protruding portion 660 may be connected with the terminal 631 of the connection substrate 600 . The protruding portion 660 can be electrically connected to the terminal 631 of the connection substrate 600 . The protruding portion 660 may be coupled with the terminal 631 of the connection substrate 600 . The protruding portion 660 may be coupled to the terminal 631 of the connection substrate 600 through a conductive member. The protruding portion 660 may be fixed to the terminal 631 of the connection substrate 600 . The protruding portion 660 may directly contact the terminal 631 of the connection substrate 600 . The protruding portion 660 may be connected to a ground terminal of the connection substrate 600 .

As shown in (b) of FIG. 15 , the connection substrate 600 may include two insulating layers 601 and a conductive layer 602 disposed between the two insulating layers 601 . Metal plate 650 can A material other than the conductive layer 602 is included. Conductive layer 602 may be a conductive layer. Conductive layer 602 may be formed of copper. The metal plate 650 may be formed of copper alloy. The metal plate 650 may include at least one of an alloy of copper and titanium and an alloy of copper and nickel. The thickness of the metal plate 650 may be thicker than that of the conductive layer 602 . The thickness of the conductive layer 602 may correspond to the distance between the two insulating layers 601 . In this embodiment, the connection substrate 600 may only be formed with two insulating layers 601 and one conductive layer 602 arranged between the two insulating layers 601 . The insulating layer 601 may be formed of polyimide (Pi).

The imaging device 10 may include an insulating layer. The connector may include an insulating layer. The connection substrate 600 may include an insulating layer. The insulating layer may cover the metal plate 650 . An insulating layer may be disposed on an outer surface of the metal plate 650 . A metal plate 650 may be placed between insulating layers. The insulating layer may include an insulating material. The insulating layer may be formed of polyimide (Pi). The insulating layer can protect the metal plate 650 .

The embodiment of the present invention can solve the signal processing problem of the image sensor 330 . This embodiment can provide a method to connect the signal and power of the image sensor 330 , the Hall sensor 445 and the driving IC 495 to the first substrate 110 , that is, the main PCB. The connection substrate 600 may be made of copper (Cu) or copper-titanium alloy (cu+Ti) material with gold The metal plate 650 is coupled.

The camera device 10 may include an elastic member 700 . The elastic member 700 may be a support member. The elastic part 700 may connect the fixed part 100 and the first moving part 200 . The elastic part 700 may elastically connect the fixed part 100 and the first moving part 200 . The elastic member 700 may connect the bobbin 210 and the housing 130 . The elastic member 700 may elastically connect the bobbin 210 and the housing 130 . The elastic part 700 may movably support the first moving part 200 relative to the fixed part 100 . When the first moving part 200 moves, the elastic part 700 may deform. When the movement of the first moving part 200 ends, the elastic part 700 may position the first moving part 200 to an initial position by restoring force (elastic force). The elastic member 700 may include a leaf spring. The elastic member 700 may include a spring. The elastic member 700 may be at least partially elastic. The elastic part 700 may provide restoring force (elastic force) to the first moving part.

The camera 10 may include an upper elastic member 710 . The elastic member 700 may include an upper elastic member 710 . The upper elastic part 710 may be disposed on the lower elastic part 720 . The upper elastic member 710 may include an inner portion coupled with the bobbin 210 . upper elastic part An inner portion of the member 710 may be coupled with an upper portion of the bobbin 210 . An inner portion of the upper elastic member 710 may be provided with an upper surface of the bobbin 210 . The upper elastic member 710 may include an outer portion coupled with the case 130 . An outer portion of the upper elastic member 710 may be connected with a lower portion of the case 130 . An outer portion of the upper elastic member 710 may be disposed on a lower surface of the case 130 . The upper elastic part 710 may include a connection part connecting the inner part and the outer part. The connection part may have elasticity.

The camera device 10 may include a lower elastic member 720 . The elastic part 700 may include a lower elastic part 720 . The lower elastic part 720 may be disposed under the upper elastic part 710 . The lower elastic member 720 may include an inner portion coupled with the bobbin 210 . An inner portion of the lower elastic member 720 may be coupled with a lower portion of the bobbin 210 . An inner portion of the lower elastic member 720 may be disposed on a lower surface of the bobbin 210 . The lower elastic member 720 may include an outer portion coupled with the case 130 . An outer portion of the lower elastic member 720 may be coupled with an upper portion of the case 130 . An outer portion of the lower elastic part 720 may be disposed on an upper surface of the case 130 . The lower elastic part 720 may include a connection part connecting the inner part and the outer part. The connection part may have elasticity.

The lower elastic part 720 may include a plurality of lower elastic units. The lower elastic part 720 may include first and second lower elastic units 720-1 and 720-2. The lower elastic part 720 may include two lower elastic units 720-1 and 720-2. The two lower elastic units 720 - 1 and 720 - 2 are spaced apart from each other to electrically connect the induction substrate 470 and the first coil 430 .

The camera device 10 may include a wire 800 . The wire 800 can be a wire spring. Wire 800 may be an elastic member. In a modified embodiment, wire 800 may be a leaf spring. The wire 800 may connect the fixed part 100 and the second moving part 300 . The wire 800 may elastically connect the fixed part 100 and the second moving part 300 . The wire 800 may connect the case 130 and the second substrate 310 . The wire 800 may elastically connect the case 130 and the second substrate 310 . The wire 800 movably supports the second moving part 300 . The wire 800 may support the second moving part 300 to move or rotate in a direction perpendicular to the direction of the optical axis.

A plug-in board that can play the following roles at the same time: for connecting the signal of the image sensor 330 and the driver IC 495 of the sensor shift OIS to the electrical connection of the first substrate 110 as the main PCB; Mechanical engineering for reliability, etc., may be absolutely necessary. This embodiment may include a feature that guarantees the same plugboard. The socket can be a connector. The socket may include a connection substrate 600 and a metal plate 650 . The sensing substrate 470 can be electrically connected with the connecting substrate 600 . The connection base 600 may be a plug board. The metal plate 650 may be formed of a copper material. The metal plate 650 may be formed of an alloy of copper (Cu) and titanium (Ti). Metal plate 650 may be a spring. Metal plate 650 may be an elastic member. The metal plate 650 may have elasticity. This spring can be used to reinforce ground (GND). Even when a high allowable current is required due to an increase in size of the image sensor 330 , according to the present embodiment, by using the GND connection through the metal plate 650 , impedance matching can be facilitated. The shape of the spring can be deformed in various forms, and the spring constant K can be lowered. As for the spring constant, K in the direction of rotation can be 1 or more times higher than K in the X and Y directions, and K in the Z direction can be 50 or more times higher. The metal plate 650 may be omitted. However, even in this case, the target value of the spring constant can be set to be the same.

By employing the connection substrate 600 and the metal plate 650, it is possible to easily manage the bent portion and manage the tolerance. By increasing the spring constant k compared with the connection substrate 600, as a single product, the influence of the connection substrate 600 can be less than the effect of the spring few. For easy adjustment, the first-order resonance frequency of the OIS should be within 40 to 150 Hz, and the resonance frequency about the direction of rotation can be set higher than the first-order resonance frequency. The weight of the second moving part 300 composed of the image sensor 330 and the second substrate 310 may be 2 grams or less, and the spring constant k value may be 100 N/m or more. The first and third resonance frequencies can be managed at 100 Hz or higher for easy tuning. The interlayer substrate may be the second substrate 310 . A hole may be formed in the center of the connector substrate.

A driver IC and a Hall element are disposed in the second substrate 310, and the rigid portion of the second substrate 310 and the FPCB portion of the connection substrate 600 may be electrically connected in two or more portions. At this time, it can be connected in 2 to 4 parts. FPCB can be bent twice. Since the bent portion of the connection substrate 600 has no large driving displacement and must maintain the shape, the spring or GND may be wider than other locations. The bending angle of the connection substrate 600 may be 80 to 100 degrees. This embodiment may include an actuator using a sensor-displacement connection substrate 600 to connect circuit signals to the main PCB. In this embodiment, a spring may be incorporated into a part of the receptacle. The plug board can be electrically connected with the ground wire GND. The first order resonant frequency may be in the range of 40 to 150 Hz. The rotation mode bit is between the first resonant frequency and the tilt mode, the rotation frequency can be One or more times the first-order resonance frequency. The interval between the first-order resonance frequency and the third-order resonance frequency may be 100 Hz or more. The connector is a coupling body connecting the substrate 600 and the metal plate 650, and its spring constant k in the X, Y and Z directions may be 50 times higher than that in the Z direction.

In this embodiment, the first-order resonance point can be located within 60-80 Hz, the second-order resonance point can be located within 150-170 Hz, and the third-order resonance point can be located within 290-310 Hz. The gain value of the first-order resonance point is higher than the gain value of the second-order resonance point, and the gain value of the second-order resonance point may be higher than the gain value of the third-order resonance point. For reference, when the voltage forming the force in the X-axis direction is applied in the form of a sine wave, the point at which the output voltage is maximized rather than the point at which the input voltage is generated may be the first-order resonance point. The point where the rotation occurs may be a second-order resonance point. The point where the tilt occurs may be the third-order resonance point. When measuring the resonance point, the waveform can be a sine wave. The frequency can be from 5Hz to 10KHz. Sweep can be 300 steps/sweep. The power supply can be 0 VDC and 100mV p-p. The weight of the lens may be 0.097 grams.

Next, the operation of the imaging device according to the embodiment of the present invention will be described with reference to the drawings.

FIG. 27 is a view for explaining the operation of the autofocus function of the imaging device according to the embodiment of the present invention.

When power is applied to the first coil 430 of the imaging device 10 according to the present embodiment, an electromagnetic field is formed in the first coil 430, and the first coil 430 can move in the direction of the optical axis (z-axis) through the electromagnetic interaction with the driving magnet 410. direction) to move up. At this time, the first coil 430 may move in the optical axis direction together with the first moving part 200 including the lens 220 . In this case, since the lens 220 moves away from or approaches the image sensor 330, the focus of the subject may be adjusted. To apply a power source to the first coil 430, any one or more of current and voltage may be applied.

When a current in the first direction is applied to the first coil 430 of the imaging device 10 according to the present embodiment, the first coil 430 moves in the optical axis direction by electromagnetic interaction with the driving magnet 410 (refer to a of FIG. 27 ). At this time, the first coil 430 can move the lens 220 upward in the direction of the optical axis so as to keep it away from the image sensor 330 .

When the current in the second direction opposite to the first direction is applied to the first coil 430 of the imaging device 10 according to the present embodiment, the first coil 430 can move in the lower direction of the optical axis through the electromagnetic interaction with the driving magnet 410. Direction (refer to Figure 27 b) move. At this time, the first coil 430 can move the lens 220 in the lower direction of the optical axis to be closer to the image sensor 330 .

28 to 30 are diagrams for explaining the operation of the jitter correction function of the imaging device according to the present embodiment.

When power is applied to the second coil 440 of the imaging device 10 according to the present embodiment, an electromagnetic field is formed in the second coil 440, and the second coil 440 can move in a direction perpendicular to the optical axis by electromagnetic interaction with the driving magnet 410. move. In addition, the second coil 440 may rotate relative to the optical axis by electromagnetic interaction with the driving magnet 410 . At this time, the second coil 440 may move or rotate together with the second moving part 300 including the image sensor 330 . In this embodiment, the second coil 440 can move the image sensor 330 to compensate the shaking of the camera device 10 detected by the gyro sensor 490 .

FIG. 28 is a diagram for explaining driving in which the image sensor of the imaging device according to the present embodiment moves along the X axis.

When the current in the first direction is applied to the second-first coil 441 of the imaging device 10 according to this embodiment, the second-first coil 441 can pass through the drive magnet. The electromagnetic action of 410 moves in a first direction (x-axis direction) perpendicular to the optical axis direction (refer to a of FIG. 20 ). At this time, the second-first coil 441 may move the image sensor 330 in one direction of the first direction perpendicular to the optical axis direction. On the contrary, when the current in the second direction opposite to the first direction is applied to the second first coil 441, the second first coil 441 can move in the first direction perpendicular to the optical axis through the electromagnetic interaction with the driving magnet 410. direction (X-axis direction) to move in the other direction. At this time, the second-first coil 441 may move the image sensor 330 in another direction perpendicular to the first direction of the optical axis direction.

FIG. 29 is a diagram for explaining driving in which the image sensor of the imaging device according to the present embodiment is displaced along the Y axis.

When the current in the first direction is applied to the second-first coil 442 of the imaging device 10 according to the present embodiment, the second-second coil 442 can move in a direction perpendicular to the optical axis through the electromagnetic interaction with the driving magnet 410. Move in one direction (refer to b of FIG. 29 ) of the first direction (Y-axis direction). At this time, the second second coil 442 can move the image sensor 330 in one of the second directions perpendicular to the optical axis direction. Conversely, when the current in the second direction opposite to the first direction is applied to the second second coil 442, the first The two second coils 442 can move in another direction perpendicular to the first direction (Y-axis direction) perpendicular to the optical axis direction through the electromagnetic interaction with the driving magnet 410 . At this time, the second second coil 442 may move the image sensor 330 in another direction of the second direction perpendicular to the optical axis direction.

FIG. 30 is a view for explaining that the drive of the image sensor of the imaging device according to the present embodiment is a scroll around the Z axis.

When the current in the first direction is applied to the second first coil 441 and the second second coil 442 of the imaging device 10 according to the present embodiment, the second first coil 441 and the second second coil 442 can be driven by and The electromagnetic action of the magnet 410 rotates one direction around the optical axis (refer to c of FIG. 30 ). At this time, the second first coil 441 and the second second coil 442 can make the image sensor 330 rotate around the optical axis in one direction. At this time, one direction can be counterclockwise. On the contrary, when the current in the second direction opposite to the first direction is applied to the second first coil 441 and the second second coil 442, the second first coil 441 and the second second coil 442 can pass through the drive magnet. The electromagnetic action of 410 rotates around the other direction of the optical axis. At this time, the second first coil 441 And the second second coil 442 can rotate the image sensor 330 around the optical axis in other directions. At this time, the other direction may be a clockwise direction.

Next, an optical device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 31 is a perspective view of an optical device according to an embodiment of the present invention, and FIG. 32 is a perspective view of the optical device according to an embodiment of the present invention viewed from a different direction of FIG. 31 .

The optical device 1 may include a handheld phone, a portable phone, a portable terminal, a mobile terminal, a smart phone, a smart board, a portable smart device, a digital camera, a notebook computer, a digital broadcast terminal, a personal digital assistant (PDA) ), Portable Multimedia Player (PMP) and any one or more of navigation. Optical device 1 may comprise any device for taking images or pictures.

The optical device 1 may comprise a body 20 . The optical device 1 can include a camera device 10 . The camera 10 may be placed in the main body 20 . The imaging device 10 can photograph a subject. The optical device 1 may comprise a display 30 . The display screen 30 may be disposed in the main body 20 . The display 30 may output any one or more of video and images captured by the camera 10 . The display screen 30 can be set at on the first surface of the main body 20 . The imaging device 10 may be disposed on any one or more of the first surface and the second surface opposite to the first surface of the main body 20 .

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains will understand that the present invention can be embodied in other specific forms without changing its technical spirit or essential characteristics. Therefore, it should be understood that the above-described embodiments are illustrative and not restrictive in all respects.

410: first magnet

411: unit magnet

412: unit magnet

413: unit magnet

414: unit magnet

420: second magnet

421: unit magnet

422: unit magnet

423: unit magnet

424: unit magnet

430: first coil

440: second coil

441: second-first coil

442:Second-second coil

Claims (10)

A camera device comprising: a fixed part; a first moving part including a bobbin and a lens coupled with the bobbin and arranged in the fixed part; a second moving part including an image sensor and disposed in the fixed part; a first magnet and a second magnet placed on the fixed part; a first coil is arranged on the first moving part, and is arranged at a position corresponding to the first magnet; and A second coil is arranged on the second moving part, and is arranged at a position corresponding to the second magnet; Wherein, the first coil is configured to move the first moving part in an optical axis direction; Wherein, the first magnet and the second magnet overlap in the direction of the optical axis; Wherein, the first magnet includes a first unit magnet and a second unit magnet arranged relative to the optical axis, and a third unit magnet and a fourth unit magnet arranged relative to the optical axis; Wherein, the first unit magnet includes a part protruding outward from the bobbin in an X-axis direction perpendicular to the optical axis direction; and Wherein, the part of the first unit magnet overlaps with the third unit magnet in a Y-axis direction perpendicular to the optical axis direction and the X-axis direction. The imaging device according to claim 1, wherein the first magnet includes a portion protruding in the x-axis direction with respect to an imaginary plane including an outer surface of the bobbin. The imaging device as claimed in claim 2, wherein a first region of the first magnet that does not protrude overlaps with the bobbin in the X-axis direction. The imaging device as claimed in claim 3, wherein a region of the second magnet under the first region of the first magnet does not overlap with the bobbin in the X-axis direction. A camera device comprising: a fixed part; a first moving part, including a spool, and configured to move in an optical axis direction; A second moving part includes an image sensor and is configured to move in a direction perpendicular to the optical axis direction; a first magnet and a second magnet placed on the fixed part; a first coil is arranged on the first moving part, and is arranged at a position corresponding to the first magnet; and A second coil is arranged on the second moving part, and is arranged at a position corresponding to the second magnet; wherein, the bobbin includes first to fourth side surfaces; Wherein, the first magnet includes a first unit magnet arranged corresponding to the first side surface of the bobbin, a second unit magnet arranged corresponding to the second side surface of the bobbin, and a third unit magnet configured corresponding to the third side surface of the bobbin; wherein the first side surface of the bobbin and the second side surface of the bobbin are disposed opposite each other; and Wherein, a part of the first unit magnet overlaps with the third unit magnet in a Y-axis direction perpendicular to the optical axis direction. The imaging device according to claim 5, wherein the first unit magnet is arranged between a first corner of the fixing member and a second corner of the fixing member, and is arranged closer to the second corner than the second corner. The position of the first corner. A camera device comprising: an image sensor configured to move in a direction perpendicular to an optical axis direction; a housing configured on the image sensor; a spool disposed within the housing; a lens coupled to the bobbin; A first magnet and a second magnet are arranged on the housing; Wherein, the housing includes first to fourth side surfaces; Wherein, the second magnet includes a first unit magnet disposed corresponding to the first side surface of the housing, a second unit magnet disposed corresponding to the second side surface of the housing, and a third unit magnet disposed corresponding to the third side surface of the housing; Wherein, the first side surface of the housing and the second side surface of the housing are disposed opposite to each other; and Wherein, a part of the first unit magnet of the second magnet overlaps with the third unit magnet of the second magnet in a Y-axis direction perpendicular to the optical axis direction. The imaging device as described in claim 7, comprising: a first coil disposed at a position corresponding to the first magnet; and a second coil, arranged at a position corresponding to the second magnet; Wherein, the first unit magnet of the second magnet includes a portion protruding to the outside of the second coil in the X-axis direction perpendicular to the optical axis direction and the Y-axis direction. The imaging device according to claim 8, wherein the part of the first unit magnet of the second magnet does not overlap with the second coil in the direction of the optical axis. A camera device comprising: a fixed part; a first moving part, including a lens and disposed in the fixed part; a second moving part including an image sensor and disposed in the fixed part; A first magnet and a second magnet are arranged on the fixing part; a first coil, arranged on the first moving part, and arranged at a position corresponding to the first magnet; and a second coil, arranged on the second moving part, and arranged at a position corresponding to the second magnet; Wherein, the first coil is configured to move the first moving part in an optical axis direction; Wherein, the first magnet and the second magnet overlap in the direction of the optical axis; Wherein, the first magnet includes a first unit magnet and a second unit magnet disposed relative to the optical axis, and a third unit magnet and a fourth unit magnet disposed relative to the optical axis; Wherein, the first unit magnet includes a first surface facing the first coil; and Wherein, the first unit magnet and the third unit magnet overlap together in a direction perpendicular to the first surface.

Images