KR20220168444A - camera device - Google Patents

Abstract

The present embodiment relates to a camera device comprising: a fixing unit including a first substrate; a first moving unit including a lens; a second moving unit including a second substrate spaced apart from the first substrate and an image sensor electrically connected to the second substrate; a first driving unit moving the first moving unit in an optical axis direction; a second driving unit moving the second moving unit in a direction perpendicular to the optical axis direction; and a connection substrate electrically connecting the first substrate and the second moving unit. The connection substrate comprises a first coupling unit coupled to the second substrate, a second coupling unit coupled to the first substrate; and a connection unit connecting the first coupling unit and the second coupling unit. The second substrate includes a first terminal disposed on a lower surface of the second substrate. The first coupling unit of the connection substrate includes a terminal coupled to the first terminal of the second substrate. Accordingly, the manufacturing cost of the connection substrate can be reduced.

Description

camera device {camera device}

This embodiment relates to a camera device.

A camera device is a device that takes a picture or video of a subject and is mounted on an optical device such as a smartphone, a drone, or a vehicle.

In camera devices, an optical image stabilization (OIS) function is required to compensate for shaking of an image caused by a user's movement in order to improve image quality.

In a camera device, an image stabilization function is performed by moving a lens in a direction perpendicular to an optical axis. However, according to the recent trend of high-pixelization, the diameter of the lens increases and the weight of the lens increases. Accordingly, there is a problem in that it is difficult to secure electromagnetic force for moving the lens in a limited space.

The present embodiment is intended to provide a camera device that performs a hand shake correction function by moving an image sensor.

The present embodiment is intended to provide a camera device that drives an image sensor in two axes, that is, with an x-axis shift and a y-axis shift.

Furthermore, the present embodiment intends to provide a camera device that drives an image sensor in three axes: x-axis shift, y-axis shift, and z-axis rolling.

A camera device according to the present embodiment includes a fixing unit including a first substrate; a first moving unit including a lens; a second moving unit including a second substrate spaced apart from the first substrate and an image sensor electrically connected to the second substrate; a first driving unit for moving the first moving unit in the optical axis direction; a second driving unit for moving the second moving unit in a direction perpendicular to the optical axis direction; and a connecting substrate electrically connecting the first substrate and the second movable unit, wherein the connecting substrate includes a first coupling portion coupled to the second substrate, a second coupling portion coupled to the first substrate, , A connection portion connecting the first coupling portion and the second coupling portion, the second substrate includes a first terminal disposed on a lower surface of the second substrate, and the first coupling portion of the connection substrate A terminal coupled to the first terminal of the second substrate may be included.

At least a portion of the first coupling part of the connecting substrate may overlap the second substrate in the optical axis direction and may be disposed under the second substrate.

The connection substrate may be formed separately from the second substrate and coupled through a conductive member.

The lower surface of the second substrate includes a first area and a second area disposed on the opposite side of the first area, and the first terminal of the second substrate is connected to the first area and the second area. Can be placed individually.

The second movable part may include a third substrate coupled to the lower surface of the second substrate, and the first coupling part of the connection substrate may overlap the third substrate in a direction perpendicular to the optical axis direction.

The image sensor may be disposed on an upper surface of the third substrate, and the first coupling part of the connection substrate may be disposed lower than the image sensor.

The second substrate includes a second terminal disposed spaced apart from the first terminal on the lower surface of the second substrate, and the third substrate includes a terminal coupled to the second terminal of the second substrate, , the first terminal of the second substrate includes a plurality of first terminals, the second terminal of the second substrate includes a plurality of second terminals, and the distance between the plurality of first terminals is It may be narrower than the interval between the plurality of second terminals.

The lower surface of the second substrate includes third and fourth regions disposed opposite to each other, and fifth and sixth regions disposed opposite to each other, and the second terminal of the second substrate includes the third to fourth regions disposed opposite to each other. 9 may be arranged in the sixth area.

The first coupling part of the second substrate may be disposed perpendicular to the optical axis direction.

The second coupling part and the connection part of the second substrate may be disposed parallel to the optical axis direction, and the connection part may include a portion bent in the direction perpendicular to the optical axis direction.

The second movable unit includes a holder disposed on the second substrate, the holder includes a groove formed on a lower surface of the holder and a protrusion protruding from an upper surface of the holder, and a portion of the connection substrate is formed on the holder. It is disposed in the groove of, and another part of the connecting substrate may be adhered to an outer surface of the protrusion of the holder with an adhesive.

The fixing part includes a base disposed on the first substrate, the base includes a protrusion protruding from an upper surface of the base, and at least a part of the second coupling part of the connecting substrate is an outer surface of the protruding part of the base. can be attached with an adhesive.

The camera device may include an elastic member connecting the base and the holder, and the first coupling part of the connection substrate may be disposed between the elastic member and the holder.

The first coupling part of the connection substrate may be disposed higher than the upper surface of the base.

The terminal of the connection substrate may be coupled to the first terminal of the second substrate through an anisotropic conductive film (ACF).

A camera device according to the present embodiment includes a fixing unit including a first substrate; a lens disposed within the fixing unit; a moving unit including an image sensor disposed at a position corresponding to the lens; a driving unit for moving the moving unit in a direction perpendicular to the optical axis direction; and a connecting member connecting the first substrate and the moving unit, wherein the connecting member includes a first coupling unit coupled to the moving unit, a second coupling unit coupled to the first substrate, and the first coupling unit. and a connection portion connecting the second coupling portion to the coupling portion, and at least a portion of the first coupling portion of the coupling member overlaps the moving portion in the optical axis direction and may be disposed under the moving portion.

The moving unit includes a second substrate electrically connected to the image sensor, the connecting member includes a flexible connection substrate electrically connecting the first substrate and the second substrate, and the second substrate A first terminal disposed on a lower surface of the second substrate, and the connection substrate may include a terminal coupled to the first terminal of the second substrate.

The moving unit may include a third substrate coupled to the lower surface of the second substrate, and the first coupling unit of the connection substrate may overlap the third substrate in a direction perpendicular to the optical axis direction.

The second substrate includes a second terminal disposed spaced apart from the first terminal on the lower surface of the second substrate, and the third substrate includes a terminal coupled to the second terminal of the second substrate, , the first terminal of the second substrate includes a plurality of first terminals, the second terminal of the second substrate includes a plurality of second terminals, and the distance between the plurality of first terminals is It may be narrower than the interval between the plurality of second terminals.

The optical device according to the present embodiment includes a main body; a camera device disposed on the main body; and a display disposed on the main body and outputting a video or image captured by the camera device.

Through this embodiment, it is possible to perform the hand shake correction function by moving the image sensor.

In addition, as the connection substrate is manufactured separately from the second substrate and bonded to the lower surface of the second substrate, the height of the first coupling portion of the connection substrate is lowered, thereby increasing the length of the connection portion of the connection substrate in the optical axis direction. Through this, the rigidity of the connecting substrate in the direction of the optical axis is increased and more conductive lines can be disposed at the connecting portion of the connecting substrate.

Alternatively, the height at which the camera device protrudes from the smartphone may be minimized by reducing the shoulder height of the camera device without increasing the length of the connecting portion of the connecting substrate in the direction of the optical axis.

In addition, as the connection substrate is manufactured separately from the second substrate and bonded, the manufacturing cost of the connection substrate can be reduced.

1 is a perspective view of a camera device according to an embodiment.
2 is an exploded perspective view of a state in which a cover member is separated from the camera device according to the present embodiment.
3 is a plan view of the camera device according to the present embodiment.
4 is a cross-sectional view viewed from AA of FIG. 3 .
5 is a cross-sectional view viewed from BB of FIG. 3 .
6 is a cross-sectional view viewed from CC of FIG. 3 .
7 is an exploded perspective view of the camera device according to the present embodiment.
FIG. 8 is an exploded perspective view of the camera device according to the present embodiment viewed from a direction different from that of FIG. 7 .
9 is an exploded perspective view of a first moving unit and related components of the camera device according to the present embodiment.
10 is an exploded perspective view of a second movable unit and related components of the camera device according to the present embodiment.
11 is a perspective view of a state in which a cover member is omitted in the camera device according to the present embodiment.
12 is a perspective view illustrating a sensing structure and an energizing structure for AF feedback control of the camera device according to the present embodiment.
13 is a perspective view of a part of the configuration of the camera device according to the present embodiment.
14 is a perspective view illustrating a second movable unit, a connecting substrate, and an elastic member of the camera device according to the present embodiment.
15 is a perspective view showing an elastic member of the camera device according to the present embodiment.
16 is a cross-sectional perspective view showing a part of the elastic member of the camera device according to the present embodiment.
17 is a side view of a state in which a cover member is omitted in the camera device according to the present embodiment.
18 is a perspective view illustrating a second movable part, a fixed part, and a connection substrate of the camera device according to the present embodiment.
19 is a perspective view illustrating a part of the second movable unit and a connection substrate of the camera device according to the present embodiment.
20 is a perspective view of a connection substrate and a second substrate of the camera device according to the present embodiment.
21 is a bottom view of the second substrate and the sensor substrate of the camera device according to the present embodiment.
22 is a bottom view illustrating a coupled state of the connection substrate, the second substrate, and the sensor substrate of the camera device according to the present embodiment.
23 is a cross-sectional view showing a coupled state of a connection substrate and a holder of the camera device according to the present embodiment.
24 is a cross-sectional view showing a coupled state of a connection substrate and a base of the camera device according to the present embodiment.
FIG. 25(a) is a perspective view of the connection substrate and the metal plate of the camera device according to the present embodiment, and FIG. 25(b) is a cross-sectional view of the connection substrate and the metal plate of the camera device according to the present embodiment.
26 is an exploded perspective view showing the connection substrate and the metal plate of the camera device according to the present embodiment in a separated manner.
27 is a diagram showing various examples of a metal plate of the camera device according to the present embodiment.
28 is a perspective view of a magnet and a coil of the camera device according to the present embodiment.
29 is a cross-sectional view of the camera device according to the present embodiment. Wires of the camera device according to this embodiment may be omitted in some drawings.
30 is a diagram for explaining the operation of the auto focus function of the camera device according to the present embodiment.
31 to 33 are diagrams for explaining the operation of the hand shake correction function of the camera device according to the present embodiment. In more detail, FIG. 31 is a diagram for explaining driving in which the image sensor of the camera device according to the present embodiment is shifted along the x-axis. 32 is a diagram for explaining driving in which the image sensor of the camera device according to the present embodiment is shifted along the y-axis. 33 is a diagram for explaining driving in which an image sensor of a camera device according to an exemplary embodiment is rolled around a z-axis.
34 is a perspective view of an optical device according to the present embodiment.
FIG. 35 is a perspective view of the optical device according to the present embodiment viewed from a direction different from that of FIG. 34 .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in a variety of different forms, and if it is within the scope of the technical idea of the present invention, one or more of the components among the embodiments can be selectively implemented. can be used in combination or substitution.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless explicitly specifically defined and described, can be generally understood by those of ordinary skill in the art to which the present invention belongs. It can be interpreted as meaning, and commonly used terms, such as terms defined in a dictionary, can be interpreted in consideration of contextual meanings of related technologies.

Also, terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In this specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when described as "at least one (or more than one) of A and (and) B and C", A, B, and C are combined. may include one or more of all possible combinations.

In addition, in describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the term is not limited to the nature, order, or order of the corresponding component.

And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, the component is directly 'connected', 'coupled', or 'connected' to the other component. In addition to the case, it may include cases where the component is 'connected', 'combined', or 'connected' due to another component between the component and the other component.

In addition, when it is described as being formed or disposed on the "upper (above)" or "lower (below)" of each component, "upper (above)" or "lower (below)" means that two components are directly connected to each other. It includes not only contact, but also cases where one or more other components are formed or disposed between two components. In addition, when expressed as "upper (above)" or "lower (down)", the meaning of not only an upward direction but also a downward direction may be included based on one component.

Hereinafter, a camera device according to this embodiment will be described with reference to the drawings.

1 is a perspective view of a camera device according to this embodiment, FIG. 2 is an exploded perspective view of a state in which a cover member is separated from the camera device according to this embodiment, FIG. 3 is a plan view of the camera device according to this embodiment, 4 is a cross-sectional view viewed from A-A in FIG. 3, FIG. 5 is a cross-sectional view viewed from B-B in FIG. 3, FIG. 6 is a cross-sectional view viewed from C-C in FIG. 3, and FIG. 7 is an exploded perspective view of the camera device according to the present embodiment. 8 is an exploded perspective view of the camera device according to the present embodiment viewed from a direction different from that of FIG. 7, FIG. 9 is an exploded perspective view of a first moving unit and related components of the camera device according to the present embodiment, and FIG. An exploded perspective view of a second moving unit and related components of a camera device according to an embodiment, FIG. 11 is a perspective view of a camera device according to an embodiment in which a cover member is omitted, and FIG. 12 is a camera device according to an embodiment. 13 is a perspective view of some components of the camera device according to the present embodiment, and FIG. 14 is a second moving unit of the camera device according to the present embodiment, Fig. 15 is a perspective view showing an elastic member of the camera device according to the present embodiment, and Fig. 16 is a cross-sectional perspective view showing a part of the elastic member of the camera device according to the present embodiment. 17 is a side view of the camera device according to the present embodiment in which the cover member is omitted, and FIG. 18 is a perspective view showing the second movable part, the fixed part and the connection substrate of the camera device according to the present embodiment, 19 is a perspective view showing a part of a second movable part and a connection board of a camera device according to this embodiment, FIG. 20 is a perspective view of a connection board and a second board of a camera device according to this embodiment, and FIG. 22 is a bottom view showing a coupled state of the connection substrate, the second substrate, and the sensor substrate of the camera device according to the present embodiment, and FIG. shows the coupling state of the connection substrate and the holder of the camera device according to the present embodiment. 24 is a cross-sectional view showing a coupled state of a connection substrate and a base of a camera device according to this embodiment, and FIG. 25(a) is a connection substrate and a metal plate of a camera device according to this embodiment. 25(b) is a cross-sectional view of the connection substrate and the metal plate of the camera device according to the present embodiment, and FIG. 26 is an exploded view showing the connection substrate and the metal plate of the camera device according to the present embodiment by being separated. 27 is a perspective view of various embodiments of a metal plate of a camera device according to this embodiment, FIG. 28 is a perspective view of a magnet and a coil of a camera device according to this embodiment, and FIG. 29 is a view of this embodiment. It is a cross-sectional view of the camera device according to. Wires of the camera device according to this embodiment may be omitted in some drawings.

The camera device 10 may capture at least one of an image and a video. The camera device 10 may be a camera. The camera device 10 may be a camera module. The camera device 10 may be a camera assembly. The camera device 10 may be a camera unit. The camera device 10 may include a lens driving device. The camera device 10 may include a sensor driving device. The camera device 10 may include a voice coil motor (VCM). The camera device 10 may include an auto focus assembly. The camera device 10 may include a hand shake correction assembly. The camera device 10 may include an auto focus device. The camera device 10 may include an image stabilization device. The camera device 10 may include an actuator. The camera device 10 may include a lens driving actuator. The camera device 10 may include a sensor-driven actuator. The camera device 10 may include an auto focus actuator. The camera device 10 may include a hand shake compensation actuator.

The camera device 10 may include a fixing part 100 . The fixed part 100 may be a relatively fixed part when the moving parts 200 and 300 move. The fixing part 100 may be a relatively fixed part when at least one of the first moving part 200 and the second moving part 300 moves. The fixing part 100 may accommodate the first moving part 200 and the second moving part 300 . The fixing part 100 may be disposed outside the first moving part 200 and the second moving part 300 .

Although the first substrate 110 has been described as one component of the fixing unit 100 throughout the specification, the first substrate 110 may be understood as a separate component from the fixing unit 100 . The fixing part 100 may be disposed on the first substrate 110 . The fixing part 100 may be disposed on the first substrate 110 . The fixing part 100 may be disposed on the first substrate 110 .

The camera device 10 may include a first substrate 110 . The fixing part 100 may include the first substrate 110 . The first substrate 110 may be a main substrate. The first substrate 110 may be a substrate. The first substrate 110 may be a printed circuit board (PCB). The first substrate 110 may be connected to a power source of the optical device 1 . The first substrate 110 may include a connector connected to a power source of the optical device 1 .

The camera device 10 may include a base 120 . The fixing part 100 may include a base 120 . The base 120 may be disposed on the first substrate 110 . The base 120 may be disposed on the first substrate 110 . The base 120 may be disposed on the first substrate 110 . The base 120 may be fixed to the first substrate 110 . The base 120 may be coupled to the first substrate 110 . The base 120 may be attached to the first substrate 110 by an adhesive. The base 120 may be disposed between the first substrate 110 and the housing 130 .

The base 120 may include a protrusion 121 . The protrusion 121 may be formed on the upper surface of the base 120 . The protrusion 121 may protrude upward from the base 120 . The protrusion 121 may be coupled to the elastic member 500 . The elastic member 500 may include a hole into which the protrusion 121 of the base 120 is inserted. The protrusion 121 of the base 120 may be coupled to the hole of the elastic member 500 . The protrusion 121 may include a plurality of protrusions. The protrusion 121 may include four protrusions. The four protrusions 121 may be disposed in four corner regions of the upper surface of the base 120 .

The base 120 may include a protrusion 122 . The protrusion 122 may protrude from the upper surface of the base 120 . The protrusion 122 may be formed on the upper surface of the base 120 . The protrusion 122 may protrude upward from the upper surface of the base 120 . At least a portion of the second coupling portion 630 of the connecting substrate 600 may be adhered to the outer surface of the protruding portion 122 of the base 120 with an adhesive. A portion of the connecting substrate 600 may be adhered to the outer surface of the protruding portion 122 of the base 120 with an adhesive. The connecting substrate 600 may be attached to the protruding portion 122 of the base 120 with an adhesive. The connecting substrate 600 may be disposed on the protrusion 122 of the base 120 . The connecting substrate 600 may be fixed to the protrusion 122 of the base 120 . The connecting substrate 600 may be coupled to the protrusion 122 of the base 120 . The connecting substrate 600 may include a portion adhered to the protruding portion 122 of the base 120 with an adhesive. The connecting substrate 600 may be fixed to the base 120 . The second coupling part 630 of the connecting substrate 600 may be fixed to the base 120 .

The camera device 10 may include a housing 130 . The fixing part 100 may include a housing 130 . Housing 130 may be disposed on base 120 . Housing 130 may be disposed on base 120 . The housing 130 may be disposed above the base 120 . The housing 130 may be fixed to the base 120 . Housing 130 may be coupled to base 120 . The housing 130 may be attached to the base 120 by an adhesive. The housing 130 may be disposed on the first substrate 110 . The housing 130 may be disposed on the first substrate 110 . The housing 130 may be formed as a separate member from the base 120 .

The camera device 10 may include a cover member 140 . The fixing part 100 may include a cover member 140 . The cover member 140 may be coupled to the base 120 . The cover member 140 may be coupled to the housing 130 . The cover member 140 may be coupled to the first substrate 110 . The cover member 140 may be fixed to the base 120 . The cover member 140 may be fixed to the housing 130 . The cover member 140 may be fixed to the first substrate 110 . The cover member 140 may cover at least a portion of the base 120 . The cover member 140 may cover at least a portion of the housing 130 .

The cover member 140 may be a 'cover can' or a 'shield can'. The cover member 140 may be formed of a metal material. The cover member 140 may block electromagnetic interference (EMI). The cover member 140 may be electrically connected to the first substrate 110 . The cover member 140 may be grounded to the first substrate 110 .

The cover member 140 may include a top plate. The cover member 140 may include a hole formed in the top plate. The hole may be formed at a position corresponding to the lens 220 . The cover member 140 may include side plates. The side plate may include a plurality of side plates. The side plate may include four side plates. The side plate may include first to fourth side plates. The side plates may include first and second side plates disposed opposite to each other, and third and fourth side plates disposed opposite to each other. The cover member 140 may include a plurality of corners between a plurality of side plates.

Throughout the specification, the cover member 140 has been described as one component of the fixing unit 100, but the cover member 140 may be understood as a separate component from the fixing unit 100. The cover member 140 may be coupled to the fixing part 100 . The cover member 140 may cover the first moving unit 200 .

The camera device 10 may include a first moving unit 200 . The first movable unit 200 may move with respect to the fixing unit 100 . The first moving unit 200 may move in the optical axis direction based on the fixing unit 100 . The first movable part 200 may be disposed within the fixing part 100 . The first movable unit 200 may be movably disposed within the fixing unit 100 . The first movable unit 200 may be disposed within the fixing unit 100 to be movable in the optical axis direction. When the first moving unit 200 moves in the optical axis direction with respect to the fixing unit 100, an auto focus (AF) function may be performed. The first moving unit 200 may be disposed on the second moving unit 300 .

The camera device 10 may include a bobbin 210 . The first moving unit 200 may include a bobbin 210 . The bobbin 210 may be disposed on the first substrate 110 . The bobbin 210 may be disposed on the first substrate 110 . The bobbin 210 may be disposed spaced apart from the first substrate 110 . Bobbin 210 may be disposed within housing 130 . The bobbin 210 may be disposed inside the housing 130 . At least a portion of the bobbin 210 may be accommodated in the housing 130 . The bobbin 210 may be movably disposed in the housing 130 . The bobbin 210 may be movably disposed in the housing 130 in the optical axis direction. The bobbin 210 may be coupled to the lens 220 . The bobbin 210 may include a hollow or hole. The lens 220 may be disposed in the hollow or hole of the bobbin 210 . An outer circumferential surface of the lens 220 may be coupled to an inner circumferential surface of the bobbin 210 .

The bobbin 210 may include a protrusion 211 . The protrusion 211 may protrude from the upper surface of the bobbin 210 . The protrusion 211 may be a boss. The protrusion 211 may be formed as a rib. The protrusion 211 may be disposed adjacent to the connecting portion 713 of the upper elastic member 710 . The protrusion 211 may include a curved surface. The protrusion 211 may include a curved surface having a curvature corresponding to a curvature of a portion adjacent to the connection portion 713 of the upper elastic member 710 . A damper may be disposed on the protrusion 211 . The damper may connect the bobbin 210 and the upper elastic member 710. The damper may have viscosity. The damper may be a viscous epoxy. The damper may connect the connection part 713 of the bobbin 210 and the upper elastic member 710. The damper may connect the protrusion 211 of the bobbin 210 and the upper elastic member 710 . The damper may connect the protrusion 211 of the bobbin 210 and the connecting portion 713 of the upper elastic member 710 . The protrusion 211 may include a plurality of protrusions. The protrusion 211 may include four protrusions.

The camera device 10 may include a lens 220 . The first moving unit 200 may include a lens 220 . Lens 220 may be coupled to bobbin 210 . The lens 220 may be fixed to the bobbin 210 . The lens 220 may move integrally with the bobbin 210 . The lens 220 may be screwed to the bobbin 210 . The lens 220 may be attached to the bobbin 210 by an adhesive. The lens 220 may be disposed at a position corresponding to the image sensor 330 . An optical axis of the lens 220 may coincide with an optical axis of the image sensor 330 . The optical axis may be a z-axis. The lens 220 may include a plurality of lenses. The lens 220 may include 5 or 6 lenses.

The camera device 10 may include a lens module. The lens module may be coupled to the bobbin 210 . The lens module may include a barrel and one or more lenses 220 disposed within the barrel.

The camera device 10 may include a second moving unit 300 . The second movable unit 300 may move with respect to the fixing unit 100 . The second moving unit 300 may move in a direction perpendicular to the optical axis direction based on the fixing unit 100 . The second movable part 300 may be disposed within the fixing part 100 . The second movable unit 300 may be movably disposed within the fixing unit 100 . The second movable unit 300 may be disposed within the fixing unit 100 to be movable in a direction perpendicular to the optical axis direction. When the second movable unit 300 moves in a direction perpendicular to the optical axis direction with respect to the fixing unit 100, the OIS function may be performed. The second movable unit 300 may be disposed between the first movable unit 200 and the first substrate 110 .

The camera device 10 may include a second substrate 310 . The second moving unit 300 may include a second substrate 310 . The second substrate 310 may be a substrate. The second substrate 310 may be a printed circuit board (PCB). The second substrate 310 may be spaced apart from the first substrate 110 . The second substrate 310 may be disposed between the first moving unit 200 and the first substrate 110 . The second substrate 310 may be disposed between the bobbin 210 and the first substrate 110 . The second substrate 310 may be disposed between the lens 220 and the first substrate 110 . The second substrate 310 may be spaced apart from the fixing part 100 . The second substrate 310 may be spaced apart from the fixing part 100 in an optical axis direction and a direction perpendicular to the optical axis direction. The second substrate 310 may move in a direction perpendicular to the optical axis direction. The second substrate 310 may be electrically connected to the image sensor 330 . The second substrate 310 may move integrally with the image sensor 330 . The second substrate 310 may include a hole. An image sensor 330 may be disposed in a hole of the second substrate 310 .

The second substrate 310 may include a first terminal 311 . The first terminal 311 may be disposed on the lower surface of the second substrate 310 . The first terminal 311 may be formed on the lower surface of the second substrate 310 . The lower surface of the second substrate 310 may include a first area and a second area disposed on the opposite side of the first area. Eighteen first terminals 311 of the second substrate 310 may be disposed in each of the first and second regions. A total of 36 first terminals 311 of the second substrate 310 may be formed. Alternatively, ten or more first terminals 311 of the second substrate 310 may be disposed in each of the first area and the second area. Fifteen or more first terminals 311 of the second substrate 310 may be disposed in each of the first and second regions. Eighteen or more first terminals 311 of the second substrate 310 may be disposed in each of the first and second regions. 24 or less first terminals 311 of the second substrate 310 may be disposed in each of the first area and the second area.

The second substrate 310 may include a second terminal 312 . The second terminal 312 may be disposed on the lower surface of the second substrate 310 . The second terminal 312 may be spaced apart from the first terminal 311 . The second terminal 312 may be spaced apart from the first terminal 311 . The second terminal 312 may be electrically separated from the first terminal 311 . The second terminal 312 may be coupled to the terminal 321 of the sensor substrate 320 . The second substrate 310 may be formed separately from the sensor substrate 320 . The second substrate 310 may be formed separately from and coupled to the sensor substrate 320 . The terminal 321 of the sensor substrate 320 may be soldered to the second terminal 312 of the second substrate 310 . The lower surface of the second substrate 310 may include third and fourth regions disposed opposite to each other, and fifth and sixth regions disposed opposite to each other. In this case, nine second terminals 312 of the second substrate 310 may be disposed in each of the third to sixth regions. A total of 36 second terminals 312 of the second substrate 310 may be formed. The number of second terminals 312 of the second substrate 310 may be the same as the number of first terminals 311 . Three or more second terminals 312 of the second substrate 310 may be disposed in each of the third to sixth regions. Five or more second terminals 312 of the second substrate 310 may be disposed in each of the third to sixth regions. Eight or more second terminals 312 of the second substrate 310 may be disposed in each of the third to sixth regions. Twelve or less second terminals 312 of the second substrate 310 may be disposed in each of the third to sixth regions.

The first terminal 311 of the second substrate 310 may include a plurality of first terminals 311 . The second terminal 312 of the second substrate 310 may include a plurality of second terminals 312 . The distance between the plurality of first terminals 311 may be narrower than the distance between the plurality of second terminals 312 . The interval between the plurality of first terminals 311 may be different from the interval between the plurality of second terminals 312 . As a modified example, the interval between the plurality of first terminals 311 may be greater than the interval between the plurality of second terminals 312 . An area of each of the plurality of first terminals 311 may be smaller than an area of each of the plurality of second terminals 312 . The area of each of the plurality of first terminals 311 may be different from the area of each of the plurality of second terminals 312 . As a modified example, the area of each of the plurality of first terminals 311 may be greater than that of each of the plurality of second terminals 312 . The number of the plurality of first terminals 311 may be the same as the number of the plurality of second terminals 312 . Alternatively, the number of the plurality of first terminals 311 may be different from the number of the plurality of second terminals 312 .

The camera device 10 may include a sensor substrate 320 . The sensor substrate 320 may be a third substrate. The second moving unit 300 may include a sensor substrate 320 . The sensor substrate 320 may be a substrate. The sensor board 320 may be a printed circuit board (PCB). The sensor substrate 320 may be coupled to the image sensor 330 . The sensor substrate 320 may be coupled to the second substrate 310 . The sensor substrate 320 may be coupled to the lower surface of the second substrate 310 .

The sensor substrate 320 may include a terminal 321 . The terminal 321 of the sensor substrate 320 may be coupled to the second terminal 312 of the second substrate 310 . The sensor substrate 320 may be coupled to the lower surface of the second substrate 310 . The sensor substrate 320 may be disposed below the second substrate 310 . The sensor substrate 320 may be coupled under the second substrate 310 with the image sensor 330 coupled thereto.

The camera device 10 may include an image sensor 330 . The second moving unit 300 may include an image sensor 330 . The image sensor 330 may be disposed on the sensor substrate 320 . The image sensor 330 may be disposed on an upper surface of the sensor substrate 320 . The image sensor 330 may be mounted on the sensor substrate 320 . The image sensor 330 may be coupled to the sensor substrate 320 . The image sensor 330 may be fixed to the sensor substrate 320 . The image sensor 330 may be disposed between the sensor substrate 320 and the sensor base 350 . The image sensor 330 may be electrically connected to the second substrate 310 . The image sensor 330 may move integrally with the second substrate 310 .

Light passing through the lens 220 and the filter 360 may be incident on the image sensor 330 to form an image. The image sensor 330 may be electrically connected to the sensor substrate 320 , the second substrate 310 and the first substrate 110 . The image sensor 330 may include an effective image area. The image sensor 330 may convert light irradiated onto the effective image area into an electrical signal. The image sensor 330 may include one or more of a charge coupled device (CCD), a metal oxide semi-conductor (MOS), a CPD, and a CID.

The camera device 10 may include a holder 340 . The second moving unit 300 may include a holder 340 . Holder 340 may be formed of an insulating material. The holder 340 may be disposed on the second substrate 310 . The holder 340 may be disposed on the second substrate 310 . The holder 340 may be disposed on the second substrate 310 . The holder 340 may be fixed to the second substrate 310 . The holder 340 may be coupled to the second substrate 310 . The holder 340 may include a hollow or hole in which the image sensor 330 is disposed. A second coil 440 may be disposed in the holder 340 . The holder 340 may include a protrusion around which the second coil 440 is wound. The holder 340 may include a hole in which the hall sensor 445 is disposed.

The holder 340 may include a groove 341 . The groove 341 may be formed on the lower surface of the holder 340 . The groove 341 may be recessed from the lower surface of the holder 340 . The groove 341 may be recessed from the outer surface of the holder 340 . A portion of the connecting substrate 600 may be disposed in the groove 341 of the holder 340 . The first coupling part 610 of the connecting substrate 600 may be disposed in the groove 341 of the holder 340 . A portion where the first coupling portion 610 of the connection substrate 600 and the connection portion 620 meet may be disposed in the groove 341 of the holder 340 . The groove 341 of the holder 340 may be formed so that the bent portion of the connecting substrate 600 does not interfere with the edge of the holder 340 .

Holder 340 may include a protrusion 342 . The protrusion 342 may protrude from the upper surface of the holder 340 . The protrusion 342 may be formed on an upper surface of the holder 340 . The protrusion 342 may protrude upward from the top surface of the holder 340 . A portion of the connecting substrate 600 may be attached to an outer surface of the protruding portion 342 of the holder 340 with an adhesive. The connecting substrate 600 may be attached to the protrusion 342 of the holder 340 with an adhesive. The connecting substrate 600 may be disposed on the protrusion 342 of the holder 340 . The connecting substrate 600 may be fixed to the protrusion 342 of the holder 340 . The connecting substrate 600 may be coupled to the protrusion 342 of the holder 340 . The connecting substrate 600 may include a portion adhered to the protruding portion 342 of the holder 340 with an adhesive. The connecting substrate 600 may be fixed to the holder 340 . The connecting portion 620 of the connecting substrate 600 may be fixed to the holder 340 .

The camera device 10 may include a sensor base 350 . The second moving unit 300 may include a sensor base 350 . The sensor base 350 may be disposed on the sensor substrate 320 . The sensor base 350 may include a hole formed at a position corresponding to the image sensor 330 . The sensor base 350 may include a groove in which the filter 360 is disposed.

The camera device 10 may include a filter 360 . The second moving unit 300 may include a filter 360 . The filter 360 may be disposed between the lens 220 and the image sensor 330 . Filter 360 may be disposed on sensor base 350 . The filter 360 may block light of a specific frequency band from entering the image sensor 330 from light passing through the lens 220 . The filter 360 may include an infrared cut filter. The filter 360 may block infrared rays from being incident on the image sensor 330 .

The camera device 10 may include a driving unit. The driving unit may move the movable units 200 and 300 relative to the fixed unit 100 . The driving unit may perform an auto focus (AF) function. The driving unit may perform an image stabilization (OIS) function. The driving unit may move the lens 220 . The driving unit may move the image sensor 330 . The driving unit may include a magnet and a coil. The driving unit may include a shape memory alloy (SMA).

The camera device 10 may include a first driving unit. The first driving unit may be an AF driving unit. The first driving unit may move the first moving unit 200 in the optical axis direction. The first driving unit may move the bobbin 210 in the optical axis direction. The lens 220 may be moved in the optical axis direction. The first driving unit may perform an auto focus (AF) function. The first driving unit may move the first moving unit 200 upward in the optical axis direction. The first driving unit may move the first moving unit 200 downward in the optical axis direction.

The camera device 10 may include a second driving unit. The second driving unit may be an OIS driving unit. The second driving unit may move the second moving unit 300 in a direction perpendicular to the optical axis direction. The second driver may move the second substrate 310 in a direction perpendicular to the optical axis direction. The second driver may move the sensor substrate 320 in a direction perpendicular to the optical axis direction. The second driver may move the image sensor 330 in a direction perpendicular to the optical axis direction. The second driver may move the holder 340 in a direction perpendicular to the optical axis direction. The second driver may move the sensor base 350 in a direction perpendicular to the optical axis direction. The second driver may move the filter 360 in a direction perpendicular to the optical axis direction. The second driver may perform an image stabilization (OIS) function.

The second driving unit may move the second moving unit 300 in a first direction perpendicular to the optical axis direction. The second driving unit may move the second moving unit 300 in a second direction perpendicular to the optical axis direction and the first direction. The second driving unit may rotate the second moving unit 300 around the optical axis.

In this embodiment, the first driving unit may include the first coil 430 . The second driving unit may include the second coil 440 . The first driving unit and the second driving unit may include a driving magnet 410 commonly used for interaction between the first coil 430 and the second coil 440 . That is, the first driving unit and the second driving unit may include individually controlled coils and common magnets.

The camera device 10 may include a driving magnet 410 . The driving unit may include a driving magnet 410 . The driving magnet 410 may be a magnet. The driving magnet 410 may be a permanent magnet. The driving magnet 410 may be a common magnet. The driving magnet 410 may be commonly used for auto focus (AF) and image stabilization (OIS).

The driving magnet 410 may be disposed on the fixing part 100 . The driving magnet 410 may be fixed to the fixing part 100 . The driving magnet 410 may be coupled to the fixing part 100 . The driving magnet 410 may be attached to the fixing part 100 by an adhesive. The driving magnet 410 may be disposed on the housing 130 . The driving magnet 410 may be fixed to the housing 130 . The driving magnet 410 may be coupled to the housing 130 . The driving magnet 410 may be attached to the housing 130 by an adhesive. The driving magnet 410 may be disposed at a corner of the housing 130 . The driving magnet 410 may be disposed close to the corner of the housing 130 .

The drive magnet 410 may be a dipole magnetized magnet including one N-pole region and one S-pole region. Each unit magnet of the drive magnet 410 may have an N pole on an inner surface and an S pole on an outer surface. Conversely, each of the unit magnets of the driving magnet 410 may have an S pole on an inner surface and an N pole on an outer surface. As a modified example, the drive magnet 410 may be a 4-pole magnetized magnet including two N-pole regions and two S-pole regions.

The driving magnet 410 may include a plurality of magnets. The driving magnet 410 may include four magnets. The driving magnet 410 may include first to fourth magnets. The first to fourth magnets may be disposed symmetrically with respect to the optical axis. The first to fourth magnets may have the same size and shape as each other.

As a modified example, the driving magnet 410 may include a first magnet disposed at a position corresponding to the first coil 430 and a second magnet disposed at a position corresponding to the second coil 440 . In this case, the first magnet and the second magnet may be disposed on the fixed part 100 and the first coil 430 and the second coil 440 may be disposed on the moving parts 200 and 300 . Alternatively, the first magnet and the second magnet may be disposed on the moving parts 200 and 300 and the first coil 430 and the second coil 440 may be disposed on the fixed part 100 .

The camera device 10 may include a first coil 430 . The driving unit may include the first coil 430 . The first coil 430 may be disposed on the first moving unit 200 . The first coil 430 may be fixed to the first moving part 200 . The first coil 430 may be coupled to the first moving part 200 . The first coil 430 may be attached to the first moving part 200 by an adhesive. The first coil 430 may be disposed on the bobbin 210 . The first coil 430 may be fixed to the bobbin 210 . The first coil 430 may be coupled to the bobbin 210 . The first coil 430 may be attached to the bobbin 210 by an adhesive. The first coil 430 may be electrically connected to the driver IC 480 . The first coil 430 may be electrically connected to the lower elastic member 720 , the sensing substrate 470 and the driver IC 480 . The first coil 430 may receive current from the driver IC 480 .

The first coil 430 may be disposed at a position corresponding to the driving magnet 410 . The first coil 430 may be disposed on the bobbin 210 at a position corresponding to the drive magnet 410 . The first coil 430 may face the driving magnet 410 . The first coil 430 may include a surface facing the driving magnet 410 . The first coil 430 may be disposed adjacent to the driving magnet 410 . The first coil 430 may interact with the driving magnet 410 . The first coil 430 may interact with the driving magnet 410 electromagnetically.

The first coil 430 may move the first moving unit 200 in the optical axis direction. The first coil 430 may move the bobbin 210 in the optical axis direction. The first coil 430 may move the lens 220 in the optical axis direction. The first coil 430 may move the first moving unit 200 upward in the optical axis direction. The first coil 430 may move the bobbin 210 upward in the optical axis direction. The first coil 430 may move the lens 220 upward in the optical axis direction. The first coil 430 may move the first moving unit 200 downward in the optical axis direction. The first coil 430 may move the bobbin 210 downward in the optical axis direction. The first coil 430 may move the lens 220 downward in the optical axis direction.

The camera device 10 may include a second coil 440 . The driving unit may include the second coil 440 . The second coil 440 may be disposed on the second moving unit 300 . The second coil 440 may be fixed to the second moving part 300 . The second coil 440 may be coupled to the second moving unit 300 . The second coil 440 may be attached to the second moving part 300 by an adhesive. The second coil 440 may be disposed in the holder 340 . The second coil 440 may be fixed to the holder 340 . The second coil 440 may be coupled to the holder 340 . The second coil 440 may be attached to the holder 340 by an adhesive. The second coil 440 may be disposed by being wound around the protrusion of the holder 340 . The second coil 440 may be disposed on the holder 340 . The second coil 440 may be electrically connected to the second substrate 310 . Both ends of the second coil 440 may be soldered to the second substrate 310 . The second coil 440 may be electrically connected to the driver IC 495. The second coil 440 may be electrically connected to the second substrate 310 and the driver IC 495 . The second coil 440 may receive current from the driver IC 495 .

The second coil 440 may be disposed at a position corresponding to the driving magnet 410 . The second coil 440 may be disposed in a position corresponding to the driving magnet 410 in the holder 340 . The second coil 440 may face the driving magnet 410 . The second coil 440 may include a surface facing the driving magnet 410 . The second coil 440 may be disposed adjacent to the driving magnet 410 . The second coil 440 may interact with the driving magnet 410 . The second coil 440 may interact with the driving magnet 410 electromagnetically.

The second coil 440 may move the second moving unit 300 in a direction perpendicular to the optical axis direction. The second coil 440 may move the second substrate 310 in a direction perpendicular to the optical axis direction. The second coil 440 may move the sensor substrate 320 in a direction perpendicular to the optical axis direction. The second coil 440 may move the image sensor 330 in a direction perpendicular to the optical axis direction. The second coil 440 may move the holder 340 in a direction perpendicular to the optical axis direction. The second coil 440 may rotate the second moving unit 300 about the optical axis. The second coil 440 may rotate the second substrate 310 about the optical axis. The second coil 440 may rotate the sensor substrate 320 about an optical axis. The second coil 440 may rotate the image sensor 330 about an optical axis. The second coil 440 may rotate the holder 340 about the optical axis.

The second coil 440 may include a plurality of coils. The second coil 440 may include four coils. The second coil 440 may include a coil for x-axis shift. The second coil 440 may include a coil for y-axis shift.

The second coil 440 may include the 2-1 coil 441 . The 2-1 coil 441 may be a first sub coil. The 2-1st coil 441 may be a coil for x-axis shift. The 2-1 coil 441 may move the second moving unit 300 in the x-axis direction. The 2-1 coil 441 may be disposed long in the y-axis. The 2-1 coil 441 may include a plurality of coils. The 2-1 coil 441 may include two coils. The two coils of the 2-1 coil 441 may be electrically connected to each other. The 2-1st coil 441 may include a connection coil connecting the two coils. In this case, the two coils of the 2-1 coil 441 may receive current together. Alternatively, the two coils of the 2-1 coil 441 may be electrically separated from each other and receive current individually.

The second coil 440 may include the 2-2 coil 442 . The 2-2 coil 442 may be a second sub coil. The 2-2nd coil 442 may be a coil for y-axis shift. The 2-2 coil 442 may move the second moving unit 300 in the y-axis direction. The 2-2nd coil 442 may be disposed long in the x-axis. The 2-1 coil 441 may include a plurality of coils. The 2-2nd coil 442 may include two coils. The two coils of the 2-2nd coil 442 may be electrically connected to each other. The 2-2nd coil 442 may include a connection coil connecting the two coils. In this case, the two coils of the 2-2nd coil 442 may receive current together. Alternatively, the two coils of the 2-2nd coil 442 may be electrically separated from each other and receive current individually.

The camera device 10 may include a hall sensor 445 . The hall sensor 445 may be disposed on the second substrate 310 . The hall sensor 445 may be disposed in a hole of the holder 340 . The Hall sensor 445 may include a Hall element (Hall IC). The hall sensor 445 may detect the driving magnet 410 . The hall sensor 445 may sense the magnetic force of the driving magnet 410 . The hall sensor 445 may face the driving magnet 410 . The hall sensor 445 may be disposed at a position corresponding to the driving magnet 410 . The hall sensor 445 may be disposed adjacent to the driving magnet 410 . The hall sensor 445 may detect the position of the second moving unit 300 . The hall sensor 445 can detect the movement of the second moving unit 300 . The hall sensor 445 may be disposed in the hollow of the second coil 440 . A sensing value sensed by the hall sensor 445 may be used to provide feedback for hand shake correction operation. The Hall sensor 445 may be electrically connected to the driver IC 495.

The Hall sensor 445 may include a plurality of Hall sensors. The Hall sensor 445 may include three Hall sensors. The hall sensor 445 may include first to third hall sensors. The first hall sensor may detect displacement of the second moving unit 300 in the x-axis direction. The second hall sensor may detect displacement of the second moving unit 300 in the y-axis direction. The third hall sensor may sense rotation of the second moving unit 300 about the z-axis either alone or together with at least one of the first hall sensor and the second hall sensor.

The camera device 10 may include a sensing magnet 450 . The sensing magnet 450 may be disposed on the first moving unit 200 . The sensing magnet 450 may be fixed to the first moving unit 200 . The sensing magnet 450 may be coupled to the first moving unit 200 . The sensing magnet 450 may be attached to the first moving part 200 by an adhesive. The sensing magnet 450 may be disposed on the bobbin 210 . The sensing magnet 450 may be fixed to the bobbin 210 . The sensing magnet 450 may be coupled to the bobbin 210 . The sensing magnet 450 may be attached to the bobbin 210 by an adhesive. The sensing magnet 450 may have a size smaller than that of the driving magnet 410 . Through this, the influence of the sensing magnet 450 on driving may be minimized.

The sensing magnet 450 may be disposed on the opposite side of the correction magnet 460 . The sensing magnet 450 and the correction magnet 460 may be disposed on opposite sides of the first moving unit 200 . The sensing magnet 450 and the correction magnet 460 may be disposed opposite to each other on the bobbin 210 .

The camera device 10 may include a calibration magnet 460 . The compensation magnet 460 may be a compensation magnet. The correction magnet 460 may be disposed on the first moving unit 200 . The correction magnet 460 may be fixed to the first moving unit 200 . The correction magnet 460 may be coupled to the first moving unit 200 . The correction magnet 460 may be attached to the first moving part 200 by an adhesive. The correction magnet 460 may be disposed on the bobbin 210 . The correction magnet 460 may be fixed to the bobbin 210 . The correction magnet 460 may be coupled to the bobbin 210 . The correction magnet 460 may be attached to the bobbin 210 by an adhesive. The correction magnet 460 may have a size smaller than that of the driving magnet 410 . Through this, the influence of the correction magnet 460 on driving may be minimized. In addition, the correction magnet 460 may be disposed on the opposite side of the sensing magnet 450 to form a magnetic balance with the sensing magnet 450 . Through this, tilt that may be generated by the sensing magnet 450 may be prevented.

The camera device 10 may include a sensing substrate 470 . The sensing substrate 470 may be a substrate. The sensing board 470 may be a printed circuit board (PCB). The sensing substrate 470 may be a flexible substrate. The sensing substrate 470 may be an FPCB. The sensing substrate 470 may be coupled to the first substrate 110 . The sensing substrate 470 may be connected to the first substrate 110 . The sensing substrate 470 may be electrically connected to the first substrate 110 . The sensing substrate 470 may be soldered to the first substrate 110 . The sensing substrate 470 may be disposed on the housing 130 . The sensing substrate 470 may be fixed to the housing 130 . The sensing substrate 470 may be coupled to the housing 130 . The housing 130 may include a groove or hole having a shape corresponding to that of the sensing substrate 470 . The sensing substrate 470 may be disposed in a groove or hole of the housing 130 .

The camera device 10 may include a driver IC 480 . The driver IC 480 may be an AF driver IC. The driver IC 480 may be electrically connected to the first coil 430 . The driver IC 480 may apply current to the first coil 430 to perform AF driving. The driver IC 480 may apply power to the first coil 430 . The driver IC 480 may apply current to the first coil 430 . The driver IC 480 may apply a voltage to the first coil 430 . The driver IC 480 may be disposed on the sensing substrate 470 . The driver IC 480 may be disposed at a position corresponding to the sensing magnet 450 . The driver IC 480 may be disposed to face the sensing magnet 450 . The driver IC 480 may be disposed adjacent to the sensing magnet 450 .

The driver IC 480 may include a sensor. The sensor may include a Hall element (Hall IC). The sensor may be disposed at a position corresponding to the sensing magnet 450 . The sensor may be disposed to face the sensing magnet 450 . The sensor may be disposed adjacent to the sensing magnet 450 . The sensor may detect the sensing magnet 450 . The sensor may detect the magnetic force of the sensing magnet 450 . The sensor may detect the position of the first moving unit 200 . The sensor may detect movement of the first moving unit 200 . A detection value detected by the sensor may be used for feedback of autofocus driving.

The camera device 10 may include a gyro sensor 490 . The gyro sensor 490 may be disposed on the first substrate 110 . The gyro sensor 490 may detect shaking of the camera device 10 . The gyro sensor 490 may sense angular velocity or linear velocity due to shaking of the camera device 10 . The gyro sensor 490 may be electrically connected to the driver IC 495 . Shaking of the camera device 10 detected by the gyro sensor 490 may be used to drive OIS.

The camera device 10 may include a driver IC 495 . The driver IC 495 may be an OIS driver IC. The driver IC 495 may be electrically connected to the second coil 440 . The driver IC 495 may apply current to the second coil 440 to perform OIS driving. The driver IC 495 may apply power to the second coil 440 . The driver IC 495 may apply current to the second coil 440 . The driver IC 495 may apply a voltage to the second coil 440 . The driver IC 495 may be disposed on the second substrate 310 .

The camera device 10 may include an elastic member 500 . The elastic member 500 may include a leaf spring. The elastic member 500 may include a spring. The elastic member 500 may be an OIS elastic member. The elastic member 500 may connect the fixing part 100 and the second movable part 300 . The elastic member 500 may connect the base 120 and the second movable part 300 . The elastic member 500 may connect the fixing part 100 and the holder 340 . The elastic member 500 may connect the base 120 and the holder 340 .

The elastic member 500 may not be electrically connected to the first substrate 110 . The elastic member 500 may be spaced apart from the first substrate 110 . The elastic member 500 may be distinguished from the metal plate 650 electrically connected to the first substrate 110 . The elastic member 500 may be distinguished from the connection substrate 600 electrically connected to the first substrate 110 . The elastic member 500 may be spaced apart from the metal plate 650 . The elastic member 500 may be spaced apart from the connecting substrate 600 . The elastic member 500 may be spaced apart from the wire 800 .

The first coupling part 610 of the connecting substrate 600 may be disposed between the elastic member 500 and the holder 340 . Alternatively, a portion of the elastic member 500 may be disposed between the first coupling portion 610 of the connecting substrate 600 and the holder 340 . The first coupling part 610 of the connecting substrate 600 may be disposed between the elastic member 500 and the holder 340 in the optical axis direction. Alternatively, a portion of the elastic member 500 may be disposed between the first coupling portion 610 of the connecting substrate 600 and the holder 340 in the optical axis direction.

In this embodiment, the total spring constant (total spring K) of the member that elastically supports the second movable part 300 with respect to the fixing part 100 is the It may be the sum of the spring constant and the spring constant of the elastic member 500 . At this time, since the coupling member of the connection substrate 600 and the metal plate 650 acts as a composite member, it may be difficult to manage the known frequency. In this embodiment, the elastic member 500 may be provided separately from the composite member. The connecting substrate 600 may be formed of only a single-layer copper foil to increase sensitivity. In this embodiment, the total spring constant may be 50 to 400 mN/mm. The spring constant of the elastic member 500 may be greater than that of the composite member. The spring constant of the elastic member 500 may be 20 to 250 mN/mm, respectively.

The elastic member 500 includes an outer part 510 coupled to the fixing part 100, an inner part 520 coupled to the second moving part 300, and a connection part connecting the outer part 510 and the inner part 520 ( 530) may be included. The connecting portion 530 may extend in the direction perpendicular to the optical axis direction. The height of the connector 530 in the optical axis direction (see a in FIG. 16 ) may be 0.5 to 5 times the width in a direction perpendicular to the optical axis direction (see b in FIG. 16 ). A spring constant of the connector 530 in a direction perpendicular to the optical axis direction may be smaller than a spring constant in the optical axis direction. Through this, the movement of the connector 530 in the optical axis direction may be smaller than the movement in the direction perpendicular to the optical axis direction. That is, the elastic member 500 may guide the second moving unit 300 to move in a direction perpendicular to the optical axis direction while limiting movement in the optical axis direction. The connecting portion 530 may be formed of at least three strands. The elastic member 500 may include a structure that is easy to move left and right and requires more current consumption for movement in the Z direction. The elastic member 500 may include a structure that suppresses deflection of the moving body in a vertical direction.

One of the elastic member 500 and the elastic member 700 may be referred to as a first elastic member, and the other may be referred to as a second elastic member.

The camera device 10 may include a damper. The damper may have viscosity. The damper may include a viscous epoxy. The damper may be disposed on the elastic member 500. The damper may be applied to the elastic member 500 . The damper may contact the elastic member 500 . The damper 500 may be connected to the elastic member 500 . The damper may be disposed at the connecting portion 530 of the elastic member 500 . The damper may be applied to the connecting portion 530 of the elastic member 500 . The damper may come into contact with the connecting portion 530 of the elastic member 500 . The damper 500 may be connected to the connecting portion 530 of the elastic member 500 . The damper may connect the outer portion 510 of the elastic member 500 and the connection portion 530 . As a modified example, the damper may connect the inner portion 520 of the elastic member 500 and the connecting portion 530 .

The camera device 10 may include a connection member. The connection member may be an interposer. The connecting member may support the movement of the second moving unit 300 . The connection member may movably support the second movable unit 300 . The connecting member may connect the second moving unit 300 and the fixing unit 100 . The connecting member may connect the first substrate 110 and the second substrate 310 . The connecting member may electrically connect the first substrate 110 and the second substrate 310 . The connecting member may connect the first substrate 110 and the second movable unit 300 . The connecting member may guide the movement of the second moving unit 300 . The connecting member may guide the second moving unit 300 to move in a direction perpendicular to the optical axis direction. The connection member may guide the second movable unit 300 to rotate about the optical axis. The connecting member may limit the movement of the second moving unit 300 in the optical axis direction.

The connecting member includes a first coupling portion 610 coupled to the second moving unit 300, a second coupling portion 630 coupled to the first substrate 110, a first coupling portion 610, and a second coupling portion 610. A connection part 620 connecting the coupling part 630 may be included. At least a portion of the first coupling portion 610 of the connecting member overlaps the second moving portion 300 in the optical axis direction and may be disposed under the second moving portion 300 .

Interposer of sensor shift and module tilt must have electrical and mechanical characteristics. The image sensor 330 may be attached to the second substrate 310 that is a rigid PCB. At this time, the image sensor 330 may be attached by a sensor substrate 320, which is a separate additional PCB. A sensor base 350 that is a holder for protecting the image sensor 330 and an IR filter may be attached to the second substrate 310 .

A terminal may be required to connect the second substrate 310 and the connection substrate 600 to each other. Signals and power of the image sensor 330 and the driver IC 495 may be applied through the terminals.

Methods for electrically connecting the second substrate 310 and the connecting substrate 600 include methods such as SMT and soldering, and in particular, an ACF method is also available. Since the second substrate 310 and the connection substrate 600 are separated from each other, it is not necessary to use an RF PCB, and thus, component prices can be reduced by half.

The connecting substrate 600 should function as a spring, and a composite material made of a spring material may be further added. One side of both sides may be grounded (GND) for impedance matching. EMI tape can be electrically connected to ground for impedance matching. The impedance value is between 40 and 60 [ohm], and may have a frequency range between 1 and 10 GHz.

The connecting member may include the connecting substrate 600 . The connecting member may include an elastic member connecting the fixing part 100 and the second moving part 300 . The connecting member may include a leaf spring. The connection member may include the wire 800. The connecting member may include a ball disposed between the fixing part 100 and the second moving part 300 .

The camera device 10 may include a connection substrate 600 . The connection substrate 600 may be a connection part. The connecting substrate 600 may be a connecting member. The connection substrate 600 may be a flexible substrate. The connecting substrate 600 may be a flexible substrate. The connection board 600 may be a flexible printed circuit board. The connection board 600 may be a flexible printed circuit board (FPCB). The connecting substrate 600 may have flexibility in at least a part.

The connection substrate 600 may be formed separately from the second substrate 310 . The connection substrate 600 may be manufactured separately from the second substrate 310 . The connection substrate 600 may be formed separately from the second substrate 310 and coupled through a conductive member. In this case, the conductive member may include at least one of solder and conductive epoxy. The terminal 611 of the connection board 600 may be coupled to the first terminal 311 of the second board 310 through an anisotropic conductive film (ACF). ACF can be a conductive double-sided film or a conductive double-sided tape. The ACF may electrically connect the terminal 611 of the connection board 600 and the first terminal 311 of the second board 310 by heat and pressure. When the connection substrate 600 is manufactured separately from the second substrate 310, more connection substrates 600 can be manufactured on one substrate, thereby reducing the manufacturing cost.

The connection substrate 600 may support the second movable part 300 . The connection substrate 600 may support the movement of the second movable unit 300 . The connection substrate 600 may movably support the second movable part 300 . The connection substrate 600 may connect the second movable part 300 and the fixed part 100 . The connecting substrate 600 may connect the first substrate 110 and the second substrate 310 . The connecting substrate 600 may electrically connect the first substrate 110 and the second substrate 310 . The connecting substrate 600 may guide the movement of the second moving unit 300 . The connecting substrate 600 may guide the second moving unit 300 to move in a direction perpendicular to the optical axis direction. The connecting substrate 600 may guide the second movable part 300 to rotate about the optical axis. The connecting substrate 600 may limit the movement of the second moving unit 300 in the optical axis direction. A portion of the connecting substrate 600 may be coupled to the base 120 .

The connecting substrate 600 may include two connecting substrates 600 spaced apart from each other and formed symmetrically. Two connecting substrates 600 may be disposed on both sides of the second substrate 310 . The connection substrate 600 may be bent six times to connect the first substrate 110 and the second substrate 310 .

The connection substrate 600 may include a first region connected to the second substrate 310 and bent in the optical axis direction. The first region may be connected to the second substrate 310 and bent in the optical axis direction. The first region may be connected to the second substrate 310 and may extend in an optical axis direction. The first region may be connected to the second substrate 310 and bent and extended in the optical axis direction. The connection substrate 600 may include a second region extending from the first region. The connecting substrate 600 may include a third area bent in a direction perpendicular to the optical axis direction in the second area. The third area may be bent in a direction perpendicular to the optical axis direction in the second area. The third area may extend in a direction perpendicular to the optical axis direction from the second area. The third region may be bent and extended in a direction perpendicular to the optical axis direction in the second region.

The connecting substrate 600 may include a first coupling portion 610 including a first region. The connection substrate 600 may include a connection portion 620 including a second area and a third area. The connection substrate 600 may include a first coupling portion 610 connected to the second substrate 310 . The connection substrate 600 may include a connection portion 620 extending from the first coupling portion 610 . The connecting substrate 600 may include a second coupling portion 630 connected to the connecting portion 620 and including a terminal.

At least a portion of the first coupling portion 610 of the connection substrate 600 may overlap the second substrate 310 in the optical axis direction. At least a portion of the first coupling portion 610 of the connection substrate 600 may be disposed under the second substrate 310 in the optical axis direction. The first coupling portion 610 of the connection substrate 600 may overlap the sensor substrate 320 in a direction perpendicular to the optical axis direction. The first coupling part 610 of the connecting substrate 600 may be disposed lower than the image sensor 330 . The first coupling part 610 of the connecting substrate 600 may be disposed lower than the center of the image sensor 330 . The first coupling part 610 of the connecting substrate 600 may be disposed lower than the upper surface of the image sensor 330 . The first coupling part 610 of the connecting substrate 600 may be disposed lower than the lower surface of the image sensor 330 . The first coupling part 610 of the connecting substrate 600 may be disposed higher than the upper surface of the base 120 . The thickness of the second substrate 310 in the optical axis direction may be 0.4 mm. As a comparative example, the first coupling part 610 of the connection substrate 600 may be connected to the center of the side surface of the second substrate 310 . In this embodiment, when compared to the comparative example, the first coupling part 610 of the connecting substrate 600 may be disposed lower by about 0.25 mm. As the height of the first coupling portion 610 of the connection substrate 600 decreases, the length of the connection portion 620 of the connection substrate 600 in the optical axis direction may be increased. Through this, the rigidity of the connection substrate 600 in the optical axis direction is increased, and more conductive lines can be disposed in the connection portion 620 of the connection substrate 600 . Alternatively, the height at which the camera device 10 protrudes from the smartphone may be minimized by reducing the height of the shoulder of the camera device 10 without increasing the length of the connecting portion of the connecting substrate 600 in the direction of the optical axis.

The connecting substrate 600 may include a first coupling part 610 . The first coupling part 610 may be a first terminal part. The first coupling part 610 may be connected to the second moving part 300 . The first coupling part 610 may be coupled to the second moving part 300 . The first coupling part 610 may be fixed to the second moving part 300 . The first coupler 610 may be connected to the second substrate 310 . The first coupler 610 may be coupled to the second substrate 310 . The first coupler 610 may be fixed to the second substrate 310 . The first coupling part 610 of the second substrate 310 may be disposed perpendicular to the optical axis direction. The first coupling part 610 may be disposed in a horizontal direction.

The first coupler 610 may include a terminal 611 . The terminal 611 may be coupled to the first terminal 311 of the second substrate 310 . The terminal 611 may be disposed on an upper surface of the first coupling part 610 . The terminal 611 may include a plurality of terminals.

The connecting substrate 600 may include a connecting portion 620 . The connection part 620 may connect the first coupling part 610 and the second coupling part 630 . The connection part 620 may extend from the first coupling part 610 . The connecting portion 620 may include a bending area bent in a direction perpendicular to the optical axis direction. The bending angle of the connecting portion 620 may be 80 to 100 degrees. The bending angle of the connecting portion 620 may be 85 to 95 degrees. The connection part 620 may include a bending area bent in the optical axis direction. The connection part 620 may include a first region bent in the optical axis direction with respect to the second substrate 310 and a second region extending from the first region and bent in a direction perpendicular to the optical axis direction. One of the bending area where the first coupler 610 and the connection unit 620 meet and the bending area of the connection unit 620 may be referred to as a first bending area and the other may be referred to as a second bending area. The connecting portion 620 of the second substrate 310 may be disposed parallel to the optical axis direction. The connecting portion 620 may include a portion bent in a direction perpendicular to the optical axis direction.

The connecting substrate 600 may include a second coupling part 630 . The second coupling part 630 may be a second terminal part. The second coupling part 630 may be coupled to the fixing part 100 . The second coupling part 630 may be fixed to the fixing part 100 . The second coupling part 630 may be connected to the connection part 620 . The second coupling part 630 may be coupled to the first substrate 110 . The second coupling part 630 may be connected to the first substrate 110 . The second coupling part 630 may be soldered to the first substrate 110 . The second coupling part 630 may be fixed to the first substrate 110 . The second coupling part 630 may be coupled to the base 120 . The second coupling part 630 may be fixed to the base 120 . The second coupling part 630 of the second substrate 310 may be disposed parallel to the optical axis direction. The second coupler 630 may include a terminal 631 coupled to the first substrate 110 . The second coupling part 630 may include a terminal 631 . The terminal 631 may be coupled to the first substrate 110 .

In this embodiment, the camera device 10 may include a flexible substrate. The flexible substrate may connect the fixed part 100 and the second movable part 300 . The flexible substrate includes a first coupling portion 610 connected to the second moving portion 300, a connection portion 620 extending from the first coupling portion 610, and a terminal connected to the connection portion 620. 2 coupling part 630 may be included.

In this embodiment, the connecting substrate 600 includes a first portion coupled to the first substrate 110, a second portion coupled to the second substrate 310, and a third portion connecting the first and second portions. part may be included. The third portion may be disposed parallel to the optical axis at least in part. The third portion may have a length in the optical axis direction longer than a thickness. At least a portion of the second portion of the connection substrate 600 may be disposed parallel to the second substrate 310 . The third part of the connecting substrate 600 may be disposed perpendicular to the second part in at least a part. The third portion of the connection substrate 600 may be bent in a round shape at a portion corresponding to a corner of the second substrate 310 . The second substrate 310 may include first and second sides disposed opposite to each other, and third and fourth sides disposed opposite to each other. The second portion of the connection substrate 600 may be coupled to the first side and the second side of the second substrate 310 . The first portion of the connection substrate 600 may be coupled to portions of the first substrate 110 corresponding to the third and fourth sides of the second substrate 310 .

The camera device 10 may include a metal plate 650 . The connecting member may include a metal plate 650 . The connecting substrate 600 may include a metal plate 650 . However, the metal plate 650 may be understood as a separate component from the connecting substrate 600 . The metal plate 650 may be a metal member. The metal plate 650 may be a metal part. The metal plate 650 may be a metal layer. The metal plate 650 may be a metal thin film. The metal plate 650 may be formed of metal. The metal plate 650 may be formed of an alloy. The metal plate 650 may be formed of a copper alloy. The metal plate 650 may be formed of a conductive material. The metal plate 650 may be distinguished from the conductive layer 602 of the connecting substrate 600 . The metal plate 650 may be formed of a material different from that of the conductive layer 602 of the connecting substrate 600 . The metal plate 650 may be disposed on the connecting substrate 600 . The metal plate 650 may be coupled to the connection substrate 600 . The metal plate 650 may be fixed to the connecting substrate 600 . The metal plate 650 may be integrally formed with the connection substrate 600 . The metal plate 650 may have elasticity.

In the optical axis direction, at least a portion of the metal plate 650 may have the same length as the connecting portion 620 . The metal plate 650 may extend the same length as the connection part 620 in the optical axis direction. The thickness of the metal plate 650 may be the same as that of the connecting substrate 600 . A thickness of the metal plate 650 may be greater than a thickness of the connecting substrate 600 . The thickness of the conductive layer 602 may be 7 to 50 um. The thickness of the metal plate 650 may be 20 to 150 um. The metal plate 650 may be connected to the ground (GND) and used for impedance matching and noise suppression.

At least a portion of the metal plate 650 may be disposed on the connection portion 620 of the connection substrate 600 . The connecting portion 620 may include a bending area bent in a direction perpendicular to the optical axis direction. In this case, the metal plate 650 may be disposed in the bending area. The metal plate 650 may be disposed on an inner surface of the connecting portion 620 . The metal plate 650 may be disposed on an outer surface of the connector 620 .

The metal plate 650 may be formed of a conductive material. The metal plate 650 may be electrically connected to the second substrate 310 . The metal plate 650 may be electrically connected to the image sensor 330 . The metal plate 650 may be electrically connected to the driver IC 495 . The metal plate 650 may be connected to the terminal 631 of the connecting substrate 600 . The metal plate 650 may be electrically connected to the terminal 631 of the connecting substrate 600 . The metal plate 650 may directly contact the terminal 631 of the connecting substrate 600 . The metal plate 650 may be coupled to the terminal 631 of the connecting substrate 600 by a conductive member. The metal plate 650 may be used as a ground (GND). The metal plate 650 may be connected to the ground terminal of the connecting substrate 600 . The metal plate 650 may be electrically connected to the first substrate 110 . In this case, the number of power connection patterns of the connecting substrate 600 may be reduced.

The metal plate 650 may include a body portion disposed on the connection portion 620 and a protrusion 660 extending downward from the body portion to the terminal 631 of the connection substrate 600 . The protrusion 660 may be a protrusion. The protrusion 660 may be connected to the terminal 631 of the connecting substrate 600 . The protrusion 660 may be electrically connected to the terminal 631 of the connecting substrate 600 . The protrusion 660 may be coupled to the terminal 631 of the connecting substrate 600 . The protrusion 660 may be coupled to the terminal 631 of the connecting substrate 600 by a conductive member. The protrusion 660 may be fixed to the terminal 631 of the connecting substrate 600 . The protrusion 660 may directly contact the terminal 631 of the connecting substrate 600 . The protrusion 660 may be connected to the ground terminal of the connecting substrate 600 .

As shown in (b) of FIG. 25 , the connection substrate 600 may include two insulating layers 601 and a conductive layer 602 disposed between the two insulating layers 601 . The metal plate 650 may include a material different from that of the conductive layer 602 . The conductive layer 602 may be a conductive layer. The conductive layer 602 may be formed of copper. The metal plate 650 may be formed of a copper alloy. The metal plate 650 may include at least one of an alloy of copper and titanium and an alloy of copper and nickel. A thickness of the metal plate 650 may be greater than a thickness of the conductive layer 602 . The thickness of the conductive layer 602 may correspond to the distance between the two insulating layers 601 . In this embodiment, the connection substrate 600 may be formed with only two insulating layers 601 and a conductive layer 602 disposed between the two insulating layers 601 . The insulating layer 601 may be formed of polyimide (Pi).

As shown in (a) of FIG. 27 , the metal plate 650a may include a plurality of first grooves 375 recessed from the top and a plurality of second grooves 375 recessed from the bottom. The plurality of first grooves 375 and the plurality of second grooves 375 may be disposed at positions corresponding to each other in the optical axis direction. A width of each individual groove of the first groove 375 and the second groove 375 may be smaller than the length of the metal plate 650a in the optical axis direction.

As shown in (b) of FIG. 27, the metal plate 650b may include a first portion 653 and a second portion 654 shorter than the first portion 653 in the optical axis direction. there is. At least a portion of the second portion 654 of the metal plate 650 may be disposed in a bending area of the connecting portion 620 of the connecting member 600 .

As shown in (c) of FIG. 27 , the metal plate 650c may extend zigzag in a direction perpendicular to the optical axis direction with a shorter width than the length of the connector 620 in the optical axis direction. The metal plate 650c may extend in an optical axis and a direction inclined to a direction perpendicular to the optical axis. The metal plate 650c may include a first portion 655 and a second portion 656 extending in a zigzag shape from the first portion 655 .

As shown in (d) of FIG. 27 , the metal plate 650d may include a plurality of first grooves recessed from the top and a plurality of second grooves recessed from the bottom. The plurality of first grooves and the plurality of second grooves may be disposed at positions corresponding to each other in the optical axis direction. A width of each individual groove of the first groove and the second groove may be smaller than the length of the metal plate 650d in the optical axis direction. The metal plate 650d may include a first portion 657 and a second portion 658 connecting the first portion 657 and including a first groove and a second groove. The first part 657 of the metal plate 650d may be disposed in the bending area of the connection part 620 .

The camera device 10 may include an insulating layer. The connecting member may include an insulating layer. The connecting substrate 600 may include an insulating layer. The insulating layer may cover the metal plate 650 . An insulating layer may be disposed on an outer surface of the metal plate 650 . A metal plate 650 may be disposed between the insulating layers. The insulating layer may include an insulating material. The insulating layer may be formed of polyimide (Pi). The insulating layer may protect the metal plate 650 .

The camera device 10 may include an EMI tape. The connection member may include EMI tape. The EMI tape may be adhered to the connecting substrate 600 . An EMI tape may be disposed on the connecting substrate 600 . The EMI tape may be fixed to the connection board 600 . The EMI tape may be adhered to the connecting portion 620 of the connecting substrate 600 . The EMI tape may be connected to ground (GND).

The camera device 10 may include an elastic member 700 . The elastic member 700 may be an AF elastic member. The elastic member 700 may be a support member. The elastic member 700 may connect the fixed part 100 and the first movable part 200 . The elastic member 700 may elastically connect the fixing part 100 and the first moving part 200 . The elastic member 700 may connect the bobbin 210 and the housing 130. The elastic member 700 may elastically connect the bobbin 210 and the housing 130 . The elastic member 700 may support the first movable part 200 movably relative to the fixing part 100 . The elastic member 700 may be deformed when the first moving unit 200 moves. When the movement of the first movable part 200 is finished, the elastic member 700 may position the first movable part 200 at an initial position through restoring force (elastic force). The elastic member 700 may include a leaf spring. The elastic member 700 may include a spring. The elastic member 700 may have elasticity in at least a part. The elastic member 700 may provide restoring force (elastic force) to the first moving part.

The elastic member 700 may include an outer part coupled to the fixing part 100, an inner part coupled to the first movable part 200, and a connection part connecting the outer part and the inner part. A spring constant of the connecting portion in an optical axis direction may be smaller than a spring constant in a direction perpendicular to the optical axis direction. Through this, the movement of the elastic member 700 in the optical axis direction may be greater than the movement in a direction perpendicular to the optical axis direction. That is, the elastic member 700 may guide the first movable part 200 to move in the optical axis direction with respect to the fixing part 100 .

The camera device 10 may include an upper elastic member 710 . The elastic member 700 may include an upper elastic member 710 . The upper elastic member 710 may be disposed on the lower elastic member 720 . The upper elastic member 710 may include an inner portion 712 coupled to the bobbin 210 . The inner part 712 of the upper elastic member 710 may be coupled to the upper part of the bobbin 210 . The inner portion 712 of the upper elastic member 710 may be disposed on the upper surface of the bobbin 210 . The upper elastic member 710 may include an outer portion 711 coupled to the housing 130 . The outer portion 711 of the upper elastic member 710 may be coupled to the lower portion of the housing 130 . The outer portion 711 of the upper elastic member 710 may be disposed on the lower surface of the housing 130 . The upper elastic member 710 may include a connection portion 713 connecting the inner portion 712 and the outer portion 711 . The connecting portion 713 may have elasticity.

The camera device 10 may include a lower elastic member 720 . The elastic member 700 may include a lower elastic member 720 . The lower elastic member 720 may be disposed below the upper elastic member 710 . The lower elastic member 720 may include an inner portion coupled to the bobbin 210 . An inner portion of the lower elastic member 720 may be coupled to a lower portion of the bobbin 210 . An inner portion of the lower elastic member 720 may be disposed on a lower surface of the bobbin 210 . The lower elastic member 720 may include an outer portion coupled to the housing 130 . An outer portion of the lower elastic member 720 may be coupled to an upper portion of the housing 130 . An outer portion of the lower elastic member 720 may be disposed on an upper surface of the housing 130 . The lower elastic member 720 may include a connection portion connecting an inner portion and an outer portion. The connecting portion may have elasticity. The lower elastic member 720 may include a terminal portion 721 . The terminal portion 721 may extend from an outer portion. The terminal unit 721 may be electrically connected to the sensing substrate 470 . The terminal unit 721 may be coupled to a terminal of the sensing substrate 470 through a conductive member.

The lower elastic member 720 may include a plurality of lower elastic units. The lower elastic member 720 may include first and second lower elastic units 720-1 and 720-2. The lower elastic member 720 may include two lower elastic units 720-1 and 720-2. The two lower elastic units 720-1 and 720-2 may be spaced apart from each other to electrically connect the sensing substrate 470 and the first coil 430.

The camera device 10 may include a wire 800 . The wire 800 may be a wire spring. The wire 800 may be an elastic member. The wire 800 may be a leaf spring in a modified example. The wire 800 may connect the fixed part 100 and the second movable part 300 . The wire 800 may elastically connect the fixed part 100 and the second movable part 300 . The wire 800 may connect the housing 130 and the second substrate 310 . The wire 800 may elastically connect the housing 130 and the second substrate 310 . The wire 800 may movably support the second movable unit 300 . The wire 800 may support the second moving unit 300 to move or rotate in a direction perpendicular to the optical axis direction. The wire 800 may include four wires disposed in the corner area of the housing 130 .

Sensor Shift OIS image sensor 330 and Driver IC 495 signals to the first board 110, which is the main PCB, for electrical connection and mechanical impact reliability An interposer that simultaneously plays a role may be essential. This embodiment may include an interposer capable of securing the same characteristics. The interposer may be a connecting member. The interposer may include a connection substrate 600 and a metal plate 650 . The sensing substrate 470 may be electrically connected to the connection substrate 600 . The connection board 600 may be an interposer PCB. The metal plate 650 may be formed of a copper material. The metal plate 650 may be formed of an alloy of copper (Cu) and titanium (Ti). The metal plate 650 may be a spring. The metal plate 650 may be an elastic member. The metal plate 650 may have elasticity. A spring can be used as ground (GND) reinforcement. Even when the allowable current is required to be high due to the increase in size of the image sensor 330, impedance matching can be facilitated by using the GND connection through the metal plate 650 according to the present embodiment. The spring shape may be modified in various forms other than FIG. 27, and the spring constant (Spring K) may be lowered. As for the spring constant, K in the rotational direction is 1 times higher than that in the X and Y directions, and K in the Z direction may be 50 times higher. The metal plate 650 may be omitted. However, even in this case, the target value of the spring constant may be set the same. The interposer may be easy to move in X and Y and difficult to move in the Z direction.

By applying the connecting substrate 600 and the metal plate 650, it is possible to facilitate management of the bending portion and tolerance management. The influence of the connection substrate 600 compared to the influence of the spring may be reduced by increasing the spring constant (Spring K) compared to the individual connection substrate 600 . In order to facilitate tuning, the primary resonant frequency of the OIS should be within 40 to 150 [Hz], and the resonant frequency in the direction of rotation may be higher than the primary resonant frequency. The weight of the second moving unit 300, including the image sensor 330 and the second substrate 310, may be 2 g or less, and the value of the spring constant (K) may be 100 N/m or more. The first resonant frequency and the third resonant frequency may be managed at 100 Hz or more to facilitate tuning. The interposer substrate may be the second substrate 310 . A hole may be formed in the center of the interposer substrate.

A driver IC and a Hall element are disposed on the second substrate 310, and the rigid portion of the second substrate 310 and the FPCB portion of the connection substrate 600 are at least two can be electrically connected. At this time, it may be connected in 2 to 4 parts. FPCB can be bent twice. Since the bending portion of the connecting substrate 600 does not have a large driving displacement and needs to maintain its shape, the spring or GND may be wider than other positions. The bending angle of the connecting substrate 600 may be 80 to 100 degrees. This embodiment may include an actuator that connects a circuit signal to a main PCB using the sensor shift connection board 600 . In this embodiment, a spring may be added to a part of the interposer. The interposer may be electrically connected to the ground (GND). The primary resonant frequency may be within a range of 40 to 150 Hz. The rotation mode may be located between the primary resonant frequency and the tilt mode, and the rotation frequency may be one or more times greater than the primary resonant frequency. An interval between the first resonant frequency and the third resonant frequency may be greater than or equal to 100 Hz. Spring constants K in the X, Y and Z directions of the connecting member, which is a combination of the connecting substrate 600 and the metal plate 650, may be 50 times higher than the K in the Z direction.

In this embodiment, the first resonance point may be located within 60 to 80 Hz, the second resonance point may be located within 150 to 170 Hz, and the third resonance point may be located within 290 to 310 Hz. The gain value may be higher at the first resonance point than at the second resonance point and higher than at the third resonance point at the second resonance point. For reference, when a voltage forming an x-axis direction force is applied as a sine wave, a point where the output voltage is the largest than the input voltage may be the primary resonance point. A point where rotation occurs may be a secondary resonance point. A point where tilt is generated may be a tertiary resonance point. When measuring a resonance point, a wave form may be a sine wave. The frequency may be 5 Hz to 10 KHz. The sweep may be 300 steps/sweep. A power source may be 0Vdc, 100mV p-p. The lens weight may be 0.097g.

Hereinafter, driving of the camera device according to the present embodiment will be described with reference to the drawings.

30 is a diagram for explaining the operation of the auto focus function of the camera device according to the present embodiment.

When power is applied to the first coil 430 of the camera device 10 according to the present embodiment, an electromagnetic field is formed in the first coil 430, and the first coil 430 interacts electromagnetically with the driving magnet 410. It can move in the optical axis direction (z-axis direction) through At this time, the first coil 430 may move in the optical axis direction together with the first moving unit 200 including the lens 220 . In this case, since the lens 220 moves away from or closer to the image sensor 330, the focus of the subject can be adjusted. Any one or more of current and voltage may be applied to apply power to the first coil 430 .

When current in the first direction is applied to the first coil 430 of the camera device 10 according to the present embodiment, the first coil 430 moves upward in the optical axis direction through electromagnetic interaction with the driving magnet 410. (See a in FIG. 30). At this time, the first coil 430 may move the lens 220 in an upward direction of the optical axis direction to be away from the image sensor 330 .

When current in the second direction opposite to the first direction is applied to the first coil 430 of the camera device 10 according to the present embodiment, the first coil 430 has an electromagnetic interaction with the driving magnet 410. It can move in the lower direction (see b in FIG. 30) of the optical axis direction. At this time, the first coil 430 may move the lens 220 in a downward direction of the optical axis so as to be closer to the image sensor 330 .

31 to 33 are diagrams for explaining the operation of the hand shake correction function of the camera device according to the present embodiment.

When power is applied to the second coil 440 of the camera device 10 according to the present embodiment, an electromagnetic field is formed in the second coil 440, and the second coil 440 electromagnetically interacts with the driving magnet 410. Through this, it can move in a direction perpendicular to the optical axis direction. In addition, the second coil 440 may rotate about the optical axis through electromagnetic interaction with the driving magnet 410 . At this time, the second coil 440 may move or rotate together with the second moving unit 300 including the image sensor 330 . In this embodiment, the second coil 440 may move the image sensor 330 to compensate for shaking of the camera device 10 detected by the gyro sensor 490 .

31 is a diagram for explaining driving in which the image sensor of the camera device according to the present embodiment is shifted along the x-axis.

When current in the first direction is applied to the 2-1 coil 441 of the camera device 10 according to the present embodiment, the 2-1 coil 441 electromagnetically interacts with the driving magnet 410 to form an optical axis. It can move in one direction (see a in FIG. 31) among the first directions (x-axis direction) perpendicular to the direction. In this case, the 2-1 coil 441 may move the image sensor 330 in one direction among first directions perpendicular to the optical axis direction. Conversely, when current in the second direction opposite to the first direction is applied to the 2-1 coil 441, the 2-1 coil 441 is perpendicular to the optical axis direction through electromagnetic interaction with the driving magnet 410. can move in the other direction of the first direction (x-axis direction). In this case, the 2-1 coil 441 may move the image sensor 330 in another direction among the first directions perpendicular to the optical axis direction.

32 is a diagram for explaining driving in which the image sensor of the camera device according to the present embodiment is shifted along the y-axis.

When current in the first direction is applied to the 2-2 coil 442 of the camera device 10 according to the present embodiment, the 2-2 coil 442 electromagnetically interacts with the driving magnet 410 to form an optical axis. It can move in one direction (see b in FIG. 32) among the second directions (y-axis direction) perpendicular to the direction. At this time, the 2-2 coil 442 may move the image sensor 330 in one direction among the second directions perpendicular to the optical axis direction. Conversely, when current in the second direction opposite to the first direction is applied to the 2-2 coil 442, the 2-2 coil 442 is perpendicular to the optical axis direction through electromagnetic interaction with the driving magnet 410. may move in the other direction of the second direction (y-axis direction). At this time, the 2-2nd coil 442 may move the image sensor 330 in another direction among the second directions perpendicular to the optical axis direction.

33 is a diagram for explaining driving in which an image sensor of a camera device according to an exemplary embodiment is rolled around a z-axis.

When current in the first direction is applied to the 2-1 coil 441 and the 2-2 coil 442 of the camera device 10 according to the present embodiment, the 2-1 coil 441 and the 2-2 coil 441 The coil 442 may rotate in one direction around an optical axis through electromagnetic interaction with the driving magnet 410 (see c in FIG. 33 ). At this time, the 2-1 coil 441 and the 2-2 coil 442 may rotate the image sensor 330 in one direction around the optical axis. At this time, one direction may be counterclockwise. Conversely, when current in the second direction opposite to the first direction is applied to the 2-1 coil 441 and the 2-2 coil 442, the 2-1 coil 441 and the 2-2 coil 442 ) may rotate in other directions around the optical axis through electromagnetic interaction with the driving magnet 410 . At this time, the 2-1 coil 441 and the 2-2 coil 442 may rotate the image sensor 330 in the other direction around the optical axis. At this time, the other direction may be a clockwise direction.

Hereinafter, an optical device according to the present embodiment will be described with reference to the drawings.

34 is a perspective view of the optical device according to the present embodiment, and FIG. 35 is a perspective view of the optical device according to the present embodiment viewed from a direction different from that of FIG. 34 .

The optical device 1 includes a mobile phone, a mobile phone, a portable terminal, a mobile terminal, a smart phone, a smart pad, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, and personal digital assistants (PDAs). , Portable Multimedia Player (PMP), and navigation. The optical device 1 may include any device for taking images or photos.

The optical device 1 may include a body 20 . The optical device 1 may include a camera device 10 . The camera device 10 may be disposed on the main body 20 . The camera device 10 may capture a subject. The optical device 1 may include a display 30 . The display 30 may be disposed on the main body 20 . The display 30 may output any one or more of images and images captured by the camera device 10 . The display 30 may be disposed on the first surface of the main body 20 . The camera device 10 may be disposed on at least one of a first surface of the main body 20 and a second surface opposite to the first surface.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art can realize that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. you will be able to understand Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting.

Claims (20)

a fixing unit including a first substrate;
a first moving unit including a lens;
a second moving unit including a second substrate spaced apart from the first substrate and an image sensor electrically connected to the second substrate;
a first driving unit for moving the first moving unit in the optical axis direction;
a second driving unit for moving the second moving unit in a direction perpendicular to the optical axis direction; and
A connecting substrate electrically connecting the first substrate and the second moving unit;
The connection substrate includes a first coupling portion coupled to the second substrate, a second coupling portion coupled to the first substrate, and a connection portion connecting the first coupling portion and the second coupling portion;
The second substrate includes a first terminal disposed on a lower surface of the second substrate,
The camera device of claim 1 , wherein the first coupling part of the connection substrate includes a terminal coupled to the first terminal of the second substrate. According to claim 1,
At least a portion of the first coupling part of the connection substrate overlaps the second substrate in the optical axis direction and is disposed under the second substrate. According to claim 1,
The connection substrate is formed separately from the second substrate and coupled through a conductive member. According to claim 1,
The lower surface of the second substrate includes a first area and a second area disposed on the opposite side of the first area,
The camera device of claim 1 , wherein 18 first terminals of the second substrate are disposed in each of the first area and the second area. According to claim 1,
The second moving unit includes a third substrate coupled to the lower surface of the second substrate,
The camera device of claim 1 , wherein the first coupling portion of the connection substrate overlaps the third substrate in a direction perpendicular to the optical axis direction. According to claim 5,
The image sensor is disposed on the upper surface of the third substrate,
The camera device of claim 1 , wherein the first coupling part of the connection substrate is disposed lower than the image sensor. According to claim 5,
The second substrate includes a second terminal disposed spaced apart from the first terminal on the lower surface of the second substrate,
The third substrate includes a terminal coupled to the second terminal of the second substrate,
The first terminal of the second substrate includes a plurality of first terminals;
The second terminal of the second substrate includes a plurality of second terminals;
A distance between the plurality of first terminals is narrower than a distance between the plurality of second terminals. According to claim 7,
The lower surface of the second substrate includes third and fourth regions disposed opposite to each other, and fifth and sixth regions disposed opposite to each other,
The second terminal of the second substrate is disposed in each of the third to sixth regions by nine. According to claim 1,
The first coupling part of the second substrate is disposed perpendicular to the optical axis direction. According to claim 9,
The second coupling part and the connection part of the second substrate are disposed parallel to the optical axis direction;
The connection part includes a portion bent in the direction perpendicular to the optical axis direction. According to claim 1,
The second moving unit includes a holder disposed on the second substrate,
The holder includes a groove formed on a lower surface of the holder and a protrusion protruding from an upper surface of the holder,
A portion of the connecting substrate is disposed in the groove of the holder,
The camera device of claim 1 , wherein another portion of the connection substrate is bonded to an outer surface of the protruding portion of the holder with an adhesive. According to claim 11,
The fixing part includes a base disposed on the first substrate,
The base includes a protrusion protruding from the upper surface of the base,
At least a portion of the second coupling part of the connection substrate is bonded to an outer surface of the protruding part of the base with an adhesive. According to claim 12,
Including an elastic member connecting the base and the holder,
The camera device of claim 1 , wherein the first coupling part of the connection substrate is disposed between the elastic member and the holder. According to claim 12,
The camera device of claim 1 , wherein the first coupling portion of the connection substrate is disposed higher than the upper surface of the base. According to claim 1,
The camera device of claim 1 , wherein the terminal of the connection substrate is coupled to the first terminal of the second substrate through an anisotropic conductive film (ACF). a fixing unit including a first substrate;
a lens disposed within the fixing unit;
a moving unit including an image sensor disposed at a position corresponding to the lens;
a driving unit for moving the moving unit in a direction perpendicular to the optical axis direction; and
A connecting member connecting the first substrate and the moving unit;
The connecting member includes a first coupling portion coupled to the moving unit, a second coupling portion coupled to the first substrate, and a coupling portion connecting the first coupling portion and the second coupling portion,
At least a part of the first coupling part of the connecting member overlaps the moving part in the optical axis direction and is disposed below the moving part. According to claim 16,
The moving unit includes a second substrate electrically connected to the image sensor,
The connecting member includes a flexible connecting substrate electrically connecting the first substrate and the second substrate,
The second substrate includes a first terminal disposed on a lower surface of the second substrate,
The camera device of claim 1 , wherein the connection substrate includes a terminal coupled to the first terminal of the second substrate. According to claim 17,
The moving unit includes a third substrate coupled to the lower surface of the second substrate,
The camera device of claim 1 , wherein the first coupling portion of the connection substrate overlaps the third substrate in a direction perpendicular to the optical axis direction. According to claim 18,
The second substrate includes a second terminal disposed spaced apart from the first terminal on the lower surface of the second substrate,
The third substrate includes a terminal coupled to the second terminal of the second substrate,
The first terminal of the second substrate includes a plurality of first terminals;
The second terminal of the second substrate includes a plurality of second terminals;
A distance between the plurality of first terminals is narrower than a distance between the plurality of second terminals. main body;
a camera device according to any one of claims 1 to 19 disposed on the main body; and
An optical device comprising a display disposed on the main body and outputting a video or image captured by the camera device.

Images