TW202311304A - 永久膜之製造方法、積層體之製造方法及裝置之製造方法以及永久膜 - Google Patents

永久膜之製造方法、積層體之製造方法及裝置之製造方法以及永久膜 Download PDF

Info

Publication number
TW202311304A
TW202311304A TW111122448A TW111122448A TW202311304A TW 202311304 A TW202311304 A TW 202311304A TW 111122448 A TW111122448 A TW 111122448A TW 111122448 A TW111122448 A TW 111122448A TW 202311304 A TW202311304 A TW 202311304A
Authority
TW
Taiwan
Prior art keywords
group
pattern
resin composition
permanent film
preferable
Prior art date
Application number
TW111122448A
Other languages
English (en)
Chinese (zh)
Inventor
山下広祐
中村敦
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202311304A publication Critical patent/TW202311304A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW111122448A 2021-06-18 2022-06-16 永久膜之製造方法、積層體之製造方法及裝置之製造方法以及永久膜 TW202311304A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021101336 2021-06-18
JP2021-101336 2021-06-18

Publications (1)

Publication Number Publication Date
TW202311304A true TW202311304A (zh) 2023-03-16

Family

ID=84527565

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111122448A TW202311304A (zh) 2021-06-18 2022-06-16 永久膜之製造方法、積層體之製造方法及裝置之製造方法以及永久膜

Country Status (3)

Country Link
JP (1) JPWO2022265030A1 (https=)
TW (1) TW202311304A (https=)
WO (1) WO2022265030A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI886465B (zh) * 2023-04-12 2025-06-11 奇美實業股份有限公司 感光性樹脂組成物、硬化膜圖案及其製作方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250151361A (ko) * 2023-03-08 2025-10-21 가부시끼가이샤 레조낙 감광성 수지 조성물, 감광성 수지 필름, 다층 프린트 배선판 및 반도체 패키지, 및 다층 프린트 배선판의 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013115170A (ja) * 2011-11-28 2013-06-10 Hitachi Chemical Co Ltd プリント配線板及びその製造方法並びに感光性樹脂組成物
JP2014204023A (ja) * 2013-04-08 2014-10-27 日立化成株式会社 導体配線を有する構造体の製造方法、その方法により製造された導体配線を有する構造体、熱硬化性樹脂組成物、樹脂フィルム、感光性樹脂組成物及びドライフィルムレジスト
TWI625232B (zh) * 2016-02-26 2018-06-01 富士軟片股份有限公司 積層體、積層體的製造方法、半導體元件以及半導體元件的製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI886465B (zh) * 2023-04-12 2025-06-11 奇美實業股份有限公司 感光性樹脂組成物、硬化膜圖案及其製作方法

Also Published As

Publication number Publication date
WO2022265030A1 (ja) 2022-12-22
JPWO2022265030A1 (https=) 2022-12-22

Similar Documents

Publication Publication Date Title
TWI888627B (zh) 硬化物的製造方法、積層體的製造方法及半導體元件的製造方法
TWI841777B (zh) 硬化膜的製造方法、積層體的製造方法及電子元件的製造方法
TW202219034A (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202234158A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202219080A (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法、半導體器件、聚醯亞胺前驅物及其製造方法
TW202235490A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202219119A (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法、半導體器件、聚醯亞胺前驅物及其製造方法
TWI835240B (zh) 硬化物之製造方法、積層體之製造方法及半導體元件之製造方法以及處理液
TW202212425A (zh) 硬化物的製造方法、積層體的製造方法及半導體元件的製造方法
KR102857827B1 (ko) 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스
WO2022210233A1 (ja) 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス
TW202236012A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202219637A (zh) 感光性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件
KR102877409B1 (ko) 경화물의 제조 방법, 적층체의 제조 방법, 및, 반도체 디바이스의 제조 방법, 및, 처리액, 및, 수지 조성물
TW202311304A (zh) 永久膜之製造方法、積層體之製造方法及裝置之製造方法以及永久膜
KR102875352B1 (ko) 영구막의 제조 방법, 적층체의 제조 방법, 및, 반도체 디바이스의 제조 방법
TWI893199B (zh) 複合圖案的製造方法、樹脂組成物、積層體的製造方法及半導體裝置的製造方法
TWI882163B (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202313572A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體裝置的製造方法及半導體裝置、以及鹼產生劑
TW202222912A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202234156A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件以及化合物
TW202136375A (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
WO2023286571A1 (ja) 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス
TW202219161A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TW202219120A (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件以及化合物