TW202310977A - Replacement device and replacement method - Google Patents

Abstract

A replacement device of the invention replaces a processing tool used by a processing device. The processing device comprises a holding section which holds an object to be processed, a processing mechanism to which a process tool that processes the object to be processed held by the holding device can be mounted in a replaceable manner, and an external cover which houses the holding section and the processing mechanism. The replacement device comprises a replacement mechanism, a movement mechanism, a traveling stage, and a traveling mechanism. The replacement mechanism attaches the processing tool to the processing mechanism, or removes the processing tool from the processing mechanism. The movement mechanism moves the replacement mechanism from the outside of the external cover to the inside through an entrance in the external cover. The traveling stage supports the movement mechanism. The traveling mechanism causes the traveling stage to travel.

Description

Replacement device and replacement method

The present invention relates to a replacement device and a replacement method.

The grinding equipment described in Patent Document 1 has a mandrel, a grinding wheel seat arranged at the lower end of the mandrel, and a grinding wheel detachably installed on the lower surface of the grinding wheel seat. The grinding wheel includes a ring-shaped grinding wheel base, and a plurality of ring-shaped grinding stones arranged under the grinding wheel base. The operator installs the grinding wheel abutment under the grinding wheel seat with fastening bolts. [Prior Art Literature] [Patent Document]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2019-177444

[Problem to be solved by the invention]

One aspect of the present invention is to provide a technique for preventing workers from being soiled when changing processing tools. [Means to solve the problem]

A replacement device according to an aspect of the present invention replaces a processing tool used in a processing device. The processing device has: a holding part for holding the processing object; a processing mechanism for installing the processing tool for processing the processing object held in the holding part in a replaceable manner; and an outer cover for accommodating the holding part and the processing object. Processing institutions. The replacement device has a replacement mechanism, a moving mechanism, a moving platform, and a moving mechanism. The replacement mechanism installs the processing tool on the processing mechanism or removes the processing tool from the processing mechanism. The moving mechanism enables the replacement mechanism to move from the outside of the outer cover to the inside through the entrance of the outer cover. The mobile station supports the mobile mechanism. The moving mechanism moves the moving platform. [Effect of Invention]

According to an aspect of the present invention, it is possible to prevent a worker from being soiled when replacing a processing tool.

[Mode for Carrying out the Invention]

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing, the same symbol is attached to the same or corresponding structure, and description may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a vertical direction.

As shown in FIG. 1, for example, a grinding system 1 for grinding a substrate W, a replacement device 7 for replacing a grinding tool D mounted on the grinding system 1, a storage room 8 for storing the replacement device 7, a storage grinding system 1, etc. are installed in a factory room. The storage part 9 of the sharpening tool D. The factory may also be, for example, a semiconductor factory, and its room may also be, for example, a clean room.

The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may further include an element layer formed on the surface of a semiconductor substrate or a glass substrate. The component layer contains electronic circuits. In addition, the substrate W may be a laminated substrate in which a plurality of substrates are bonded together.

As shown in FIG. 1 , a plurality of grinding systems 1 may be installed in a factory room, or only one grinding system 1 may be installed. The grinding system 1 grinds a substrate W with a grinding tool D. As shown in FIG. When the grinding tool D is worn out, it is replaced by the changing device 7 . Since the grinding tool D is replaced by the changing device 7 instead of a person, it is possible to prevent the person from being soiled. Replacing the grinding tool D includes the steps of removing the used grinding tool D and installing the unused grinding tool D.

The storage unit 9 stores the grinding tool D. As shown in FIG. The used grinding tool D and the unused grinding tool D are stored in the same storage unit 9 in this embodiment, but may be stored in different storage units 9 . The storage unit 9 is provided outside the grinding system 1 . Therefore, the grinding system 1 can be miniaturized. Since the storage unit 9 is provided outside the grinding system 1 , it is different from the case where the storage unit 9 is provided inside the grinding system 1 , and a self-propelled robot is used as the replacement device 7 .

The replacement device 7 waits in the storage 8 until a grinding tool D replacement command is received. When the replacement device 7 receives the replacement command, it moves to, for example, the grinding system 1 to remove the used grinding tool D from the grinding system 1 . Next, the replacement device 7 moves to the storage unit 9 in a state of holding the removed used grinding tool D, and places the used grinding tool D in the storage unit 9 . Afterwards, the replacement device 7 obtains the unused grinding tool D from the storage unit 9, moves to the grinding system 1 in the state of holding the obtained unused grinding tool D, and installs the unused grinding tool D on the Grinding system 1. Finally, the replacement device 7 returns to the storage 8 to stand by.

Or, when the replacement device 7 receives the replacement command, it first moves to the storage unit 9, obtains an unused grinding tool D in the storage unit 9, and transfers to the grinding tool D in a state of holding the obtained unused grinding tool D. Cut system 1. Then, the changing device 7 removes the used grinding tool D from the grinding system 1 . Then, the replacement device 7 installs the unused grinding tool D in the grinding system 1 . Thereafter, the replacement device 7 moves to the storage unit 9 in a state of holding the removed used grinding tool D, and places the used grinding tool D in the storage unit 9 . Finally, the replacement device 7 returns to the storage 8 to stand by.

The storage unit 9 is common to the plurality of grinding systems 1 . Compared with the case where storage units 9 are provided for each grinding system 1, the number of storage units 9 installed can be reduced.

In addition, as shown in FIG. 2 , the storage unit 9 may be provided for each grinding system 1 . In this case, the storage unit 9 can be installed in the vicinity of the grinding system 1 compared to the case where the storage unit 9 is commonly used by a plurality of grinding systems 1 .

In addition, the storage unit 9 shown in FIGS. 1 and 2 is provided separately from the replacement device 7 , and the replacement device 7 may have a storage unit 9 as shown in FIG. 11 . The storage unit 9 of the replacement device 7 is moved together with the transfer table 73 of the replacement device 7 . In this case, the travel distance of the replacement device 7 can be shortened. The storage unit 9 of the replacement device 7 temporarily stores the grinding tool D conveyed between the storage unit 9 (see FIG. 1 or FIG. 2 ) fixed outside the replacement device 7 and the machining mechanism 43 of the grinding system 1 .

Next, the grinding system 1 will be described with reference to FIG. 3 . The grinding system 1 has a loading and unloading unit 2 , a cleaning unit 3 , a grinding unit 4 , and a control unit 5 . The loading and unloading unit 2 , the cleaning unit 3 , and the grinding unit 4 are sequentially arranged from the negative side in the X-axis direction to the positive side in the X-axis direction.

The loading/unloading unit 2 has a mounting table 21 . The loading table 21 is used for loading the cassette C. As shown in FIG. The cassette C stores a plurality of substrates W at intervals in the vertical direction. The mounting table 21 includes a plurality of mounting plates 22 arranged in a row in the Y-axis direction. The cassettes C are placed on the plurality of loading plates 22, respectively. In addition, the number of placing plates 22 is not particularly limited. Likewise, the number of cassettes C is not particularly limited.

Moreover, the import/export unit 2 has a first conveyance area 23 . In a plan view, the first transfer area 23 is disposed beside the mounting table 21 and a transition device 35 described later so as to be sandwiched between the mounting table 21 and the transition device 35 . The loading/unloading unit 2 has a first transport device 24 that transports the substrate W in the first transport area 23 . The first transfer device 24 transfers the substrate W between a plurality of devices arranged on the side of the first transfer area 23 . The first transport device 24 includes a first transport arm 24a holding the substrate W. As shown in FIG. The first transfer arm 24a can move horizontally (in both directions of the X-axis and Y-axis) and vertically, and can rotate around the vertical axis. The number of the 1st conveyance arm 24a may be one or plural.

The cleaning unit 3 has a first cleaning device 31 . The first cleaning device 31 scrubs the substrate W ground by the grinding device 40 which will be described later. The first cleaning device 31 includes a cleaning body such as a sponge or a brush, and removes fine particles such as grinding chips by the cleaning body.

In addition, the cleaning unit 3 has a second cleaning device 32 . The second cleaning device 32 etches the substrate W ground by the grinding device 40 with a chemical solution. The second cleaning device 32 includes a spin chuck for holding the substrate W, and a nozzle for ejecting a chemical solution. The nozzle supplies the chemical solution to the center of the upper surface of the rotating substrate W.

The cleaning unit 3 may further include a third cleaning device 33 . The third cleaning device 33 is different from the first cleaning device 31 and the second cleaning device 32 , and cleans the substrate W before being ground by the grinding device 40 . The third cleaning device 33 scrubs the substrate W in the same manner as the first cleaning device 31 . It is possible to prevent foreign matter from being caught between the chuck 42 of the grinding device 40 and the substrate W, and to grind the substrate W flat.

The cleaning unit 3 has a detection device 34 . The detection device 34 detects the center of the substrate W before being ground by the grinding device 40 . The center of the chuck 42 of the grinding device 40 can be aligned with the center of the substrate W when viewed from above. In addition to detecting the center of the substrate W, the detecting device 34 can also detect the crystallographic orientation of the substrate W, specifically, it can also detect notches or orientation planes representing the crystallographic orientation of the substrate W. In the rotating coordinate system that rotates together with the chuck 42, the crystal orientation of the substrate W can be aligned with a desired orientation.

The first cleaning device 31 , the third cleaning device 33 , and the detection device 34 can also be stacked vertically to reduce the installation area of the grinding system 1 . For example, from the lower side to the upper side, the detection device 34 , the first cleaning device 31 , and the third cleaning device 33 are arranged in sequence. However, the order is not particularly limited.

The cleaning section 3 has a transition device 35 . The transition unit 35 temporarily accommodates the substrate W. A plurality of transition devices 35 can also be stacked vertically. The configuration and number of transition devices 35 are not particularly limited.

The cleaning unit 3 has a second conveyance area 36 . In a plan view, the second transfer area 36 is arranged beside the first cleaning device 31 , the second cleaning device 32 and the transition device 35 such that the first cleaning device 31 , the second cleaning device 32 and the transition device 35 surround three sides. The cleaning unit 3 has a second transport device 37 for transporting the substrate W in the second transport area 36 . The second transfer device 37 transfers the substrate W between a plurality of devices arranged beside the second transfer area 36 . The second transfer device 37 includes a second transfer arm 37a holding the substrate W. As shown in FIG. The second transfer arm 37a can move horizontally (both directions of the X-axis and Y-axis) and vertically, and can rotate around the vertical axis. The number of the 2nd conveyance arm 37a may be one or plural.

The cleaning unit 3 has a shape in which corners of a rectangle are truncated in plan view, and a third transfer area 38 is arranged at the truncated position. In plan view, the third transfer area 38 is arranged beside the second transfer area 36 , the first cleaning device 31 and the grinding device 40 so as to be surrounded on three sides by the second transfer area 36 , the first cleaning device 31 and the grinding device 40 . The 3rd conveying area 38 also can be arranged in the inside of the housing that covers cleaning part 3 and the 3rd conveying area 38 both, also can be located in the inside of the housing different from the housing that covers cleaning part 3, and be connected to cleaning. part 3

The grinding system 1 has a third transfer device 39 for transferring the substrate W in the third transfer area 38 . The third transfer device 39 transfers the substrate W between a plurality of devices arranged beside the third transfer area 38 . The third transfer device 39 includes an adsorption pad 39a for holding the substrate W. As shown in FIG. The adsorption pad 39a adsorbs the substrate W from above. The suction pad 39a can move in the horizontal direction (both directions of the X-axis direction and the Y-axis direction) and the vertical direction, and can rotate around the vertical axis.

The grinding unit 4 includes a grinding device 40 . The grinding device 40 grinds the substrate W. As shown in FIG. Grinding includes grinding. The abrasive grains used for grinding may be either fixed abrasive grains or free abrasive grains. The grinding device 40 has, for example, a table 41 , four suction pads 42 , and three processing mechanisms 43 .

The table 41 holds four suction pads 42 at equal intervals around the rotation center line R1, and rotates around the rotation center line R1. The four suction pads 42 rotate together with the table 41 and move sequentially to the loading and unloading position A0, the primary grinding position A1, the secondary grinding position A2, the tertiary grinding position A3, and the loading and unloading position A0.

The loading/unloading position A0 also serves as a position where substrates W are loaded in and a location where substrates W are loaded out. In addition, in this embodiment, the import position and the export position are the same position, but the import position and the export position may be different positions. The primary grinding position A1 is a position where primary grinding of the substrate W is performed. The secondary grinding position A2 is a position where secondary grinding of the substrate W is performed. The tertiary grinding position A3 is a position where the tertiary grinding of the substrate W is performed.

The four suction pads 42 are rotatably attached to the table 41 around each rotation center line R2 (see FIG. 4 ). At the primary grinding position A1 , the secondary grinding position A2 , and the tertiary grinding position A3 , the chuck 42 rotates about each rotation center line R2 .

One processing mechanism 43 performs primary grinding on the substrate W at the primary grinding position A1. Another processing mechanism 43 performs secondary grinding on the substrate W at the secondary grinding position A2. The rest of the processing mechanism 43 grinds the substrate W three times at the third grinding position A3.

In addition, the number of the processing mechanism 43 should just be one or more. In addition, the number of suction pads 42 only needs to be greater than the number of processing mechanisms 43 . However, it doesn't matter if there is no Taiwan 41. When there is no table 41, the number of suction cups 42 can be the same as that of the processing mechanism 43, or one.

The control unit 5 is, for example, a computer, and has a CPU (Central Processing Unit) 51 and a storage medium 52 such as a memory. Programs for controlling various processes executed in the grinding system 1 are stored in the storage medium 52 . The control unit 5 controls the operation of the grinding system 1 by causing the CPU 51 to execute the program stored in the storage medium 52 .

Next, the operation of the grinding system 1 will be described. The following operations are carried out under the control of the control unit 5 .

First, the first transfer device 24 takes out the substrate W from the cassette C and transfers it to the transition device 35 . Next, the second transfer device 37 transfers the substrate W from the transition device 35 to the third cleaning device 33 .

Then, the third cleaning device 33 cleans the substrate W before being ground by the grinding device 40 . A clean substrate W can be placed on the suction pad 42 of the grinding device 40, and foreign objects can be suppressed from being caught. Therefore, the substrate W can be ground flat, and the deterioration of the thickness variation of the substrate W can be suppressed. After the substrate W is dried, the second transfer device 37 transfers the substrate W from the third cleaning device 33 to the detection device 34 .

In addition, when the unground substrate W is clean, or when the grinding device 40 has a mechanism for cleaning the unground substrate W, there is no problem without the third cleaning device 33 . At this time, the second transport device 37 transports the substrate W from the transition device 35 to the detection device 34 .

Then, the detection device 34 detects the center of the substrate W. As shown in FIG. The detection device 34 may also detect the crystal orientation of the substrate W, specifically, may also detect notches and the like. Thereafter, the third transfer device 39 transfers the substrate W from the detection device 34 to the chuck 42 of the grinding device 40 . During this period, the control unit 5 controls the third transfer device 39 to align the center of the chuck 42 with the center of the substrate W according to the detection result of the detection device 34 . In addition, the control unit 5 controls the third transfer device 39 based on the detection result of the detection device 34, and aligns the crystal orientation of the substrate W with a desired orientation in the rotation coordinate system that rotates together with the chuck 42.

Next, the grinding device 40 grinds the upper surface of the substrate W. As shown in FIG. The substrate W rotates together with the table 41, and moves sequentially to the loading and unloading position A0, the primary grinding position A1, the secondary grinding position A2, the tertiary grinding position A3, and the loading and unloading position A0. During this period, primary grinding, secondary grinding, and tertiary grinding are performed. Thereafter, the third transfer device 39 transfers the substrate W from the chuck 42 to the first cleaning device 31 .

Then, the first cleaning device 31 cleans the upper surface of the substrate W to remove particles such as grinding chips. After the substrate W is dried, the second transfer device 37 transfers the substrate W from the first cleaning device 31 to the second cleaning device 32 .

Next, the second cleaning device 32 etches the upper surface of the substrate W to remove grinding marks. After the substrate W is dried, the second transfer device 37 transfers the substrate W from the second cleaning device 32 to the transition device 35 . Then, the first transfer device 24 transfers the substrate W to the cassette C from the transition device 35 . And the substrate W is accommodated in the cassette C.

Next, referring to FIG. 4 , the processing mechanism 43 of the grinding device 40 will be described. The processing mechanism 43 has a movable part 43a on which the grinding tool D is installed. The machining mechanism 43 is a driving mechanism for driving the grinding tool D. The substrate W is ground by bringing the grinding tool D into contact with the substrate W. FIG. The grinding tool D has, for example, a disc-shaped grinding wheel D1 and a plurality of grinding stones D2 arranged in a ring under the grinding wheel D1.

The movable part 43a includes a flange 43a1 on which the grinding tool D is installed, a spindle 43a2 provided with the flange 43a1 at the lower end, and a spindle motor 43a3 for rotating the spindle 43a2. The flange 43a1 is arranged horizontally, and the grinding tool D is mounted below it so that fastening tools E such as bolts can be replaced. A plurality of fastening tools E are provided at intervals along the periphery of the flange 43a1. The mandrel 43a2 is arranged vertically. The spindle motor 43a3 rotates the spindle 43a2 to rotate the grinding tool D attached to the flange 43a1. The rotation center line R3 of the grinding tool D is the rotation center line of the spindle 43a2.

The processing mechanism 43 further has an elevating portion 43b for elevating the movable portion 43a. The lifting unit 43b includes, for example, a vertical Z-axis guide 43b1, a Z-axis slider 43b2 that moves along the Z-axis guide 43b1, and a Z-axis motor 43b3 that moves the Z-axis slider 43b2. The movable part 43a is fixed to the Z-axis slider 43b2, and the movable part 43a and the grinding tool D are raised and lowered together with the Z-axis slider 43b2. The lifting part 43b further includes a position detector 43b4 for detecting the position of the grinding tool D. As shown in FIG. The position detector 43b4 detects the rotation of the Z-axis motor 43b3 to detect the position of the grinding tool D, for example.

The raising and lowering part 43b lowers the grinding tool D from a standby position. The grinding tool D rotates while descending, contacts the upper surface of the rotating substrate W, and grinds the entire upper surface of the substrate W. When the thickness of the substrate W reaches a set value, the lifting portion 43b stops the grinding tool D from descending. Thereafter, the raising and lowering unit 43b raises the grinding tool D to the standby position.

Next, the installation and removal of the grinding tool D of the processing mechanism 43 will be described with reference to FIGS. 5 and 6 . As shown in FIG. 5 , the grinding device 40 has an outer cover 44 . The outer cover 44 accommodates the suction cup 42 as a holding part for holding the substrate W, and the processing mechanism 43 which is installed as a replaceable grinding tool D. The outer cover 44 suppresses particles such as grinding chips generated inside from flowing out to the outside. And can keep the room of the factory clean.

The outer cover 44 has an entrance port 44 a through which the replacement device 7 passes when entering from the outside of the outer cover 44 to the inside. Instead of people, the changing device 7 enters from the outside of the outer cover 44 to the inside, and the grinding tool D is replaced inside the outer cover 44 .

Since the replacement device 7 enters the inside of the outer cover 44 instead of a person to replace the grinding tool D, it is possible to prevent people from being soiled by the deposits inside the outer cover 44 . Also, since the replacement device 7 is provided outside the grinding device 40 , the grinding device 40 can be miniaturized compared to the case where the replacement device 7 is provided inside the grinding device 40 .

The grinding device 40 has a shutter 45 for opening and closing the entrance 44 a of the outer cover 44 . The shutter 45 basically blocks the entrance 44a, and opens the entrance 44a when the replacement device 7 enters. Compared with the case where the inlet 44a is always open, particles can be suppressed from flowing out from the inside of the cover 44 to the outside through the inlet 44a, and the room of the factory can be kept clean.

The grinding device 40 may also have a moving mechanism 46 for moving the shutter 45 between an open position for opening the entrance 44a (such as the position shown in FIG. 5 ) and a closed position for blocking the entrance 44a. The moving mechanism 46 is a pneumatic cylinder or an electric cylinder or the like. An electric cylinder consists of a motor and a ball screw. The shutter 45 can be moved automatically instead of manually.

As shown in FIG. 3 , the grinding device 40 has a plurality of processing mechanisms 43 , and an inlet 44 a is provided for each processing mechanism 43 . For example, a processing mechanism 43 and an inlet 44 a are respectively provided at the primary grinding position A1 , the secondary grinding position A2 , and the tertiary grinding position A3 . Each entrance 44a is provided with a shutter 45, and the shutter 45 is moved according to each entrance 44a.

The more the number of processing mechanisms 43 is, the more significantly the effect of installing the replacement device 7 outside the grinding device 40 can be obtained. Different from this embodiment, when the replacement device 7 is arranged inside the grinding device 40 according to each processing mechanism 43, or when the replacement device 7 common to a plurality of processing mechanisms 43 is arranged inside the grinding device 40, the grinding The cutting device 40 will be enlarged. On the other hand, according to this embodiment, since the replacement device 7 is provided outside the grinding device 40, the grinding device 40 can be miniaturized. However, the number of processing mechanism 43 can also be one.

As shown in FIG. 5 , the grinding device 40 may have a restriction mechanism 47 . The restriction mechanism 47 restricts gas from flowing out from the inside of the outer cover 44 to the outside through the inlet 44 a of the outer cover 44 . By restricting the outflow of gas, the outflow of particles can be suppressed, and the room of the factory can be kept clean.

For example, the restricting mechanism 47 has an exhaust line 47a that makes the inside of the outer cover 44 negative in pressure compared to the outside. The exhaust line 47a is a conduit or the like, and connects the outer cover 44 to an exhaust source. The exhaust source is such as a vacuum pump or an ejector. In the middle of the exhaust line 47a, for example, an air pressure controller 47b is provided. The air pressure controller 47b controls the air pressure inside the outer cover 44 . The airflow from the inlet 44a of the outer cover 44 to the inside is formed by the air pressure difference. As a result, the outflow of gas from the inside of the outer cover 44 to the outside can be restricted.

The connection port of the exhaust pipeline 47a with the outer cover 44 is above the inlet 44a of the outer cover 44 in FIG. 5 , or it may be lower. In the latter case, a downflow can be formed inside the outer cover 44 . The top of the outer cover 44 can also be provided with air blowers such as a fan filter group. The air supply volume and exhaust volume are controlled so that the inside of the outer cover 44 has a negative pressure compared to the outside.

The grinding device 40 may also have a cleaning mechanism 48 . The cleaning mechanism 48 supplies cleaning liquid to the grinding tool D or peripheral members of the grinding tool D through nozzles or the like. The cleaning solution is, for example, DIW (deionized water) or the like. The peripheral member of the grinding tool D is, for example, a flange 43a1 or a spindle 43a2. Before removing the used grinding tool D from the machining mechanism 43, the grinding tool D and the like are cleaned. Thereby, contamination of the replacement device 7 can be suppressed. In addition, if the grinding tool D is cleaned by the cleaning mechanism 48, it is possible to suppress the particles from being transported outside together with the grinding tool D.

The grinding device 40 has a control unit 50 . The control unit 50 is, for example, a computer, and has a storage medium 50b such as a CPU 50a and a memory. Programs for controlling various processes executed by the grinding device 40 are stored in the storage medium 50b. The control part 50 controls the operation|movement of the grinding apparatus 40 by CPU50a executing the program memorize|stored in the memory medium 50b. The control unit 50 of the grinding device 40 can also be a part of the control unit 5 of the grinding system 1 .

The replacement device 7 has, for example, a replacement mechanism 71 , a moving mechanism 72 , a moving table 73 , and a moving mechanism 74 . The replacement mechanism 71 attaches the grinding tool D to the machining mechanism 43 or removes the grinding tool D from the machining mechanism 43 . The replacement mechanism 71 is capable of movement in the horizontal direction (both directions of the X-axis direction and the Y-axis direction) and the vertical direction, and rotation about the vertical axis. The moving mechanism 72 moves the replacement mechanism 71 from the outside of the outer cover 44 to the inside through the entrance 44 a of the outer cover 44 . The moving mechanism 72 is, for example, a limb joint arm, with one end holding the replacement mechanism 71 and the other end connected to the moving platform 73 . The mobile platform 73 supports the mobile mechanism 72 . The moving mechanism 74 moves the moving platform 73 .

Since the replacement device 7 is provided outside the grinding device 40 , a self-propelled robot is used as the replacement device 7 unlike the case where the replacement device 7 is provided inside the grinding device 40 . The grinding tool D is changed by the changing device 7 instead of a person. And can prevent people from being soiled. Also, since the replacement device 7 is provided outside the grinding device 40 , the grinding device 40 can be miniaturized compared to the case where the replacement device 7 is provided inside the grinding device 40 .

As shown in FIG. 6, the exchange mechanism 71 has the holding mechanism 71a which holds the grinding tool D. As shown in FIG. The holding mechanism 71a holds the container F for storing the grinding tool D. The container F is a box shape with an open top, and a concave portion is arranged on the top. The grinding tool D is accommodated in this recessed part. The container F stores the grinding tool D, and prevents the grinding fluid or grinding chips from falling when the grinding tool D is removed. In addition, the holding mechanism 71a can also hold the grinding tool D.

The replacement mechanism 71 has a rotation stop mechanism 71b that stops the rotation of the spindle 43a2 of the processing mechanism 43 . The rotation stop mechanism 71b includes, for example, a clip that grips the flange 43a1 or the spindle 43a2. Alternatively, the rotation deterring mechanism 71b includes a pin inserted into a hole in the flange 43a1 or the spindle 43a2. The rotation of the spindle 43a2 is stopped by the rotation stop mechanism 71b, and the fastening tool E can be fastened or loosened while the rotation of the grinding tool D is stopped.

The replacement mechanism 71 has an operating mechanism 71c for fastening or loosening the fastening tool E that fastens the grinding tool D and the machining mechanism 43 . When the fastening tool E is a bolt, the operating mechanism 71c is constituted by a tool such as a wrench or a wrench fitted to the bolt, and a rotation mechanism for rotating the tool.

As shown in Fig. 1 etc., the combination of the replacement mechanism 71 and the moving mechanism 72 can also be set up in multiple groups, and controlled independently. One set is used for the installation of the grinding tool D, and the other set is used for the removal of the grinding tool D. If the combination of the replacement mechanism 71 and the moving mechanism 72 is a plurality of groups, which are different from one group, the removal and installation of the grinding tool D can be carried out rapidly one after another. In other words, the replacement device 7 does not need to go back and forth between the grinding device 40 and the storage unit 9 during the removal and installation of the grinding tool D.

In addition, if the storage part 9 (refer to FIG. 11 ) of the replacement device 7 stores both the used grinding tool D and the unused grinding tool D, even if the replacement mechanism 71 and the moving mechanism 72 are each one, they can be replaced successively. Quickly implement the removal and installation of the grinding tool D. Also, if the storage unit 9 (refer to FIG. 11 ) of the replacement device 7 stores a plurality of used grinding tools D and unused grinding tools D, the storage unit 9 fixed to the outside of the replacement device 7 may not be used. (Refer to FIG. 1 and FIG. 2 ) and back and forth between the grinding device 40, and continuously perform replacement operations on a plurality of processing mechanisms 43.

The replacement device 7 may also have a photographing device 75 for photographing the replacement mechanism 71 . The imaging device 75 is attached to one end of the moving mechanism 72 similarly to the changing mechanism 71 . It is possible to control the replacement mechanism 71 while monitoring the operation of the replacement mechanism 71 with the camera 75 .

The replacement device 7 has a control unit 76 . The control unit 76 is, for example, a computer, and has a storage medium 76b such as a CPU 76a and a memory. Programs for controlling various processes executed by the replacement device 7 are stored in the storage medium 76b. The control unit 76 controls the operation of the replacement device 7 by causing the CPU 76a to execute the program stored in the storage medium 76b.

Next, the functions of the control unit 50 of the grinding device 40 and the function of the control unit 76 of the replacement device 7 will be described with reference to FIG. 7 . In addition, each functional block shown in FIG. 7 is conceptual and does not necessarily need to be physically configured as shown. All or a part of each functional block may be configured by functionally or physically dispersing and integrating all or part of each functional block in any unit. All or any part of each processing function performed by each function block can be realized by a program executed by the CPU or by hardware of wired logic.

First, the function of the control unit 50 of the grinding device 40 will be described. The control unit 50 includes, for example, a replacement command creation unit 50c, a position detection unit 50d, a switch control unit 50e, a negative pressure control unit 50f, a cleaning control unit 50g, and an automatic setting control unit 50h.

The replacement command creation unit 50c determines whether or not the grinding tool D needs to be replaced, and creates a grinding tool D replacement command. Specifically, the replacement command generation unit 50c monitors, for example, the number of substrates W ground by the grinding tool D, the amount of wear of the grinding tool D, or the time elapsed since the grinding tool D was mounted. When the value reaches the set value, a replacement command will be made. The generated replacement command is sent to the control unit 76 of the replacement device 7 by wireless or wired. The replacement device 7 and the grinding device 40 can also send and receive signals through an external computer. The replacement device 7 moves to the grinding device 40 when receiving the replacement command and receiving the request from the grinding device 40 .

The position detecting part 50d uses the detecting part 53 to detect whether the moving table 73 of the changing device 7 has reached the position for changing the grinding tool D (such as the position shown in FIG. 5 ). The position for replacing the grinding tool D is set outside the outer cover 44, which is also used as a position for installing the grinding tool D and a position for removing the grinding tool D. The detecting unit 53 detects that, for example, the moving table 73 of the changing device 7 has reached a set position outside the outer cover 44 . The detection part 53 is installed, for example, on the outer wall surface of the outer cover 44, and is installed above the inlet 44a. The detection unit 53 is, for example, a camera or the like.

The switch control unit 50 e controls the moving mechanism 46 of the shutter 45 to control the position of the shutter 45 . When the moving table 73 of the changing device 7 reaches the position for changing the grinding tool D, the switch control unit 50e changes the position of the shutter 45 from the closed position to the open position. Also, when the moving table 73 of the changing device 7 withdraws from the position for changing the grinding tool D, the switch control unit 50e changes the position of the shutter 45 from the open position to the closed position.

The negative pressure control unit 50f controls the air pressure controller 47b of the exhaust pipeline 47a to make the inside of the outer cover 44 negative in pressure compared to the outside. The negative pressure control unit 50f makes the inside of the outer cover 44 have a negative pressure than the outside at least while the shutter 45 opens the inlet 44a of the outer cover 44 .

The cleaning control unit 50g controls the cleaning mechanism 48 to supply the cleaning liquid to the grinding tool D or peripheral components of the grinding tool D before the door 45 opens the inlet 44a of the outer cover 44 . The supply of the cleaning liquid is implemented after the replacement command of the grinding tool D is made, for example. In addition, the supply of the cleaning liquid may also be performed during grinding of the substrate W or at the end of grinding.

The automatic setting control unit 50h executes the automatic setting when the replacement of the grinding tool D is completed and the changing device 7 withdraws from the position where the grinding tool D is replaced. Automatic settings include, for example, dressing of unused grinding tools D or temperature regulation of the interior of the outer cover 44 .

Next, the function of the control unit 76 of the replacement device 7 will be described. The control unit 76 has, for example, a travel control unit 76c, a movement control unit 76d, and an exchange control unit 76e.

The traveling control unit 76c controls the traveling mechanism 74 to control the position of the traveling platform 73 . For example, the traveling control unit 76c controls the traveling mechanism 74 so that the traveling table 73 travels between the position where the grinding tool D is stored and the position where the grinding tool D is replaced.

The movement control part 76d controls the movement mechanism 72, and controls the position of the replacement mechanism 71. The moving table 73 stops at the position where the grinding tool D is replaced, and when the changing device 7 detects that the entrance 44a of the outer cover 44 is opened by the signal sent from the grinding device 40, the movement control part 76d makes the changing mechanism 71 pass through the outer The inlet 44a of the cover 44 is moved from the outside of the outer cover 44 to the inside. Also, before the moving table 73 withdraws from the position for replacing the grinding tool D, the movement control unit 76d moves the replacement mechanism 71 from the inside of the outer cover 44 to the outside through the entrance 44a of the outer cover 44 .

The replacement control part 76e controls the replacement mechanism 71, and controls removal or attachment of the grinding tool D. As shown in FIG. The replacement control unit 76e fastens or loosens the fastening tool E with the operating mechanism 71c while the grinding tool D is held by the holding mechanism 71a and the rotation of the spindle 43a2 is stopped by the rotation stopping mechanism 71b. The replacement control unit 76e controls the replacement mechanism 71 while monitoring the operation of the replacement mechanism 71 with the imaging device 75 .

Next, the operations of the grinding device 40 and the replacement device 7 will be collectively described. The grinding device 40 determines whether or not the grinding tool D needs to be replaced, and generates a grinding tool D replacement command. Then, the grinding device 40 sends the generated replacement command to the replacement device 7 . Furthermore, when the grinding device 40 determines that the grinding tool D needs to be replaced, it stops grinding the substrate W and performs cleaning by the cleaning mechanism 48 . On the other hand, the replacement device 7 approaches the grinding device 40 when receiving a replacement command from the grinding device 40 . When the grinding device 40 detects that the moving table 73 of the changing device 7 has arrived at the position for changing the grinding tool D, it opens the blocking door 45 . Afterwards, the replacement device 7 allows the replacement mechanism 71 to enter the inside from the inlet 44 a of the outer cover 44 . Next, the replacement device 7 removes the used grinding tool D from the processing mechanism 43 and installs the unused grinding tool D on the processing mechanism 43 . After that, the replacement device 7 makes the replacement mechanism 71 withdraw from the inlet 44 a of the outer cover 44 to the outside. Thereafter, the grinding device 40 closes the shutter 45 and implements automatic setting control. Then, the grinding device 40 starts grinding the substrate W again. In addition, the replacement device 7 may also have a cleaning part or a cleaning tool not shown in the figure, and after the used grinding tool D is removed from the processing mechanism 43, the unused grinding tool D is installed in front of the processing mechanism 43 , the contact surface between the processing mechanism 43 and the grinding tool D is cleaned with a cleaning part or a cleaning tool.

Next, referring to FIG. 8 , the grinding device 40 and the replacement device 7 according to the first modified example will be described. Hereinafter, differences from the above-mentioned embodiment will be mainly described.

The restricting mechanism 47 of the grinding device 40 of this modified example has a sealing member 47c in addition to the exhaust duct 47a. In addition, the restricting mechanism 47 may only have the sealing member 47c. The sealing member 47c comes into contact with the arm or the like of the replacement device 7 that enters the inlet 44a of the outer cover 44 to block the inlet 44a of the outer cover 44 . The outflow of gas can be restricted by the sealing member 47c, and the outflow of particles can be suppressed.

The sealing member 47 c is attached to the shutter 45 , for example, and moves together with the shutter 45 . A pair of shutter doors 45 is provided, and a sealing member 47c is attached to the surfaces of the pair of shutter doors 45 facing each other. The pair of sealing members 47c sandwich and enclose the replacement device 7 to block the entrance 44a of the outer cover 44 . The sealing member 47c is formed of a flexible material such as rubber, and deforms following the outer shape of the replacement device 7 .

When the moving table 73 of the replacement device 7 reaches the set position outside the outer cover 44, the switch control unit 50e changes the position of the shutter 45 from the closed position to the open position. Thereafter, the movement control unit 76 d moves the replacement mechanism 71 from the outside of the outer cover 44 to the inside through the entrance 44 a of the outer cover 44 . At this time, the sealing member 47c does not contact the replacement device 7 .

Thereafter, the switch control unit 50e changes the position of the shutter 45 from the open position to the sealed position (for example, the position shown in FIG. 8 ). The sealing position is a position where the sealing member 47c contacts the arm of the replacement device 7 and blocks the inlet 44a of the outer cover 44 . The replacement control unit 76e controls the replacement mechanism 71 to remove or mount the grinding tool D in a state where the sealing member 47c blocks the inlet port 44a.

When the removal or installation of the grinding tool D is completed, the switch control unit 50e changes the position of the shutter 45 from the sealed position to the open position. Next, the movement control unit 76d moves the replacement mechanism 71 from the outside of the outer cover 44 to the inside through the inlet 44a of the outer cover 44 . Afterwards, the traveling control unit 76c controls the traveling mechanism 74 to move the traveling table 73 from the position where the grinding tool D is replaced to the position where the grinding tool D is stored.

Next, referring to FIG. 9 , the grinding device 40 and the replacement device 7 according to the second modified example will be described. Hereinafter, differences from the above-mentioned embodiment and the above-mentioned first modified example will be mainly described.

The outer cover 44 of the grinding device 40 of this modified example has a main housing 44b forming an inlet 44a, and a sub-housing 44c mounted on the outer wall of the main housing 44b to surround the inlet 44a of the main housing 44b. The main housing 44b accommodates the suction cup 42 serving as a holding portion for holding the substrate W, and the processing mechanism 43 that is installed replaceably with the grinding tool D.

The sub-casing 44c includes a second inlet port 44d through which the replacement device 7 passes when entering from the outside of the sub-casing 44c to the inside. After the replacement device 7 reaches the position for replacing the grinding tool D, it enters the inside of the main casing 44b through the second inlet 44d and the inlet 44a in sequence, and replaces the grinding tool D inside the main casing 44b.

The grinding device 40 has a second shutter 61 for opening and closing the second inlet 44d of the sub-housing 44c. The second shutter 61 basically closes the second inlet 44d, and opens the second inlet 44d when the replacement device 7 enters. Compared with the case where the second inlet 44d is always open, the flow of particles from the inside to the outside of the cover 44 through the second inlet 44d can be suppressed, and the room of the factory can be kept clean.

The grinding device 40 may have a second moving mechanism 62 that moves the second shutter 61 between the second open position that opens the second inlet 44d and the second closed position that closes the second inlet 44d. The second moving mechanism 62 is a pneumatic cylinder, an electric cylinder, or the like. The second door 61 can be moved automatically instead of manually.

The second inlet 44d is provided for each processing mechanism 43 similarly to the inlet 44a. For example, the 2nd inlet 44d is respectively provided in the primary grinding position A1, the secondary grinding position A2, and the tertiary grinding position A3. A second shutter 61 is provided at each second entrance 44d, and the second shutter 61 is moved according to each second entrance 44d.

The control part 50 of the grinding apparatus 40 has the 2nd switch control part which is not shown in figure. The second switch control unit controls the second moving mechanism 62 to control the position of the second shutter 61 . When the moving table 73 of the replacement device 7 arrived at the position for replacing the grinding device D, the second switch control unit changed the position of the second shutter 61 from the second closed position to the second open position. Again, when the moving table 73 of the changing device 7 withdraws from the position of changing the grinding tool D, the second switch control unit changes the position of the second blocking door 61 from the second open position to the second closed position.

The restriction mechanism 47 of the grinding apparatus 40 may have the 2nd sealing member 47d. The second sealing member 47d contacts the arm or the like of the replacement device 7 entering the second inlet 44d of the sub-case 44c to block the second inlet 44d of the sub-case 44c. The outflow of gas can be restricted by the second sealing member 47d to suppress the outflow of fine particles.

The second sealing member 47 d is attached to, for example, the second shutter 61 and moves together with the second shutter 61 . A pair of 2nd shutter 61 is provided, and 2nd sealing member 47d is attached to the surface which a pair of 2nd shutter 61 opposes mutually. The pair of second sealing members 47d sandwich and enclose the replacement device 7 to block the second inlet port 44d of the outer cover 44 . The second sealing member 47d is formed of a flexible material such as rubber, and deforms following the outer shape of the replacement device 7 .

When the moving platform 73 of the replacement device 7 arrived at the outside set position of the outer cover 44, the second switch control unit changed the position of the second blocking door 61 from the second closed position to the second open position. Thereafter, the movement control unit 76d moves the replacement mechanism 71 from the outside of the sub-casing 44c to the inside through the second inlet 44d of the sub-casing 44c. At this time, the second sealing member 47d does not contact the replacement device 7 .

Thereafter, the second switch control unit changes the position of the second shutter 61 from the second open position to the second sealed position (for example, the position shown in FIG. 9 ). The second sealing position is a position where the second sealing member 47d contacts the arm of the replacement device 7 and blocks the second inlet 44d of the sub-housing 44c. In the state where the second sealing member 47d blocks the second inlet port 44d, the opening and closing control unit 50e changes the position of the shutter 45 from the closed position to the open position. Next, the movement control unit 76d moves the replacement mechanism 71 from the outside of the main casing 44b to the inside through the inlet 44a of the main casing 44b. Then, the switch control unit 50e changes the position of the shutter 45 from the open position to the sealed position. Thereafter, the replacement control unit 76e controls the replacement mechanism 71 to remove or mount the grinding tool D. As shown in FIG. In addition, when the second sealing member 47d is attached to the second shutter 61, if the second sealing member 47d blocks the second inlet 44d of the sub-housing 44c, the outflow of particles can be suppressed. Therefore, it does not matter if there is no sealing member 47c. However, if the sealing member 47c is also provided, the outflow of fine particles can be further suppressed.

When the removal or attachment of the grinding tool D is completed, the switch control unit 50e changes the position of the shutter 45 from the sealed position to the open position. Next, the movement control unit 76d moves the replacement mechanism 71 from the inside of the main casing 44b to the outside through the inlet 44a of the main casing 44b. Then, the switch control unit 50e changes the position of the shutter 45 from the open position to the closed position. Thereafter, the second switch control unit changes the position of the second shutter 61 from the second sealed position to the second open position. Next, the movement control unit 76d moves the replacement mechanism 71 from the inside of the sub-casing 44c to the outside through the second inlet 44d of the sub-casing 44c. Afterwards, the traveling control unit 76c controls the traveling mechanism 74 to move the traveling table 73 from the position where the grinding tool D is replaced to the position where the grinding tool D is stored. Thus, by blocking at least one of the inlet port 44a and the inlet port 44d at the same time, it is possible to prevent the inside of the main housing 44b from being opened to the outside of the grinding device 40 .

Next, referring to FIG. 10 , a grinding device 40 and a replacement device 7 according to a third modified example will be described. Hereinafter, differences from the above-mentioned embodiment, the above-mentioned first modification example, and the above-mentioned second modification example will be mainly described.

The replacement device 7 of this modified example has a casing 77 mounted on a moving table 73 . The casing 77 contacts the outer wall surface of the outer cover 44 in a state where the replacement mechanism 71 and the moving mechanism 72 are accommodated, thereby sealing the inside of the casing 77 . The casing 77 may also have a sealing member 77 a on the contact surface with the outer cover 44 .

When the door 45 opens the inlet 44 a of the outer cover 44 , the inside of the casing 77 communicates with the inside of the outer cover 44 through the inlet 44 a of the outer cover 44 . In this state, the grinding tool D is replaced. The casing 77 can limit the outflow of gas, thereby suppressing the outflow of particles, and keeping the room of the factory clean.

In addition, as shown in FIG. 9, when the outer cover 44 has a main case 44b and a sub-case 44c, the case 77 contacts the outer wall of the sub-case 44c. When the second shutter 61 opens the second inlet 44d of the auxiliary housing 44c, and the shutter 45 opens the inlet 44a of the main housing 44b, the inside of the housing 77 communicates with the inside of the main housing 44b.

Incidentally, as shown in FIG. 6 , the machining mechanism 43 includes a replaceable mounting part (such as a flange 43a1 ) for mounting the grinding tool D, and a fastening tool E for fastening the flange 43a1 and the grinding tool D. The fastening tool E is, for example, a bolt. The fastening tool E fastens the flange 43a1 and the grinding tool D from above the flange 43a1. For example, the fastening tool E is inserted into a straight hole through which the flange 43a1 penetrates in the vertical direction, and is screwed into a screw hole formed on the upper surface of the grinding tool D (specifically, the grinding wheel D1). The operation of the fastening tool E is performed by the operating mechanism 71c. As shown in FIG. 6, the operating mechanism 71c tightens or loosens the fastening tool E over the flange 43a1.

A cover or the like covering the mandrel 43a2 may be provided above the flange 43a1 to protect the mandrel 43a2 from grinding fluid containing grinding chips. When a cover or the like is provided, it is difficult for the operating mechanism 71c to enter above the flange 43a1, and it is difficult to operate the fastening tool E.

Therefore, as shown in FIG. 12, the fastening tool E can also fasten the flange 43a1 and the grinding tool D from the side of the flange 43a1. Alternatively, the fastening tool E can fasten the flange 43a1 and the grinding tool D from obliquely below the flange 43a1. In any case, even if a cover or the like exists above the flange 43a1, since the operating mechanism 71c does not enter above the flange 43a1, the fastening tool E can be easily operated by the operating mechanism 71c.

As shown in FIG. 12 , the flange 43a1 has, for example, a disc-shaped upper flange 101 and a disc-shaped lower flange 102 whose outer diameter is smaller than that of the upper flange 101 . On the other hand, the grinding tool D includes a ring portion 111 fitted with the lower flange 102 , a disk portion 112 blocking the lower portion of the ring portion 111 , and a plurality of grinding stones 113 arranged along the outer periphery of the disk portion 112 .

As shown in FIG. 12, the axial direction of the fastening tool E may also be a direction perpendicular to the rotation center line R3 of the mandrel 43a2. The fastening tool E is inserted into, for example, a straight hole through which the grinding tool D (specifically, the ring portion 111 ) penetrates radially, and is screwed into a hole formed on the flange 43a1 (specifically, the lower flange 102 ). Screw holes on the outer peripheral surface.

Alternatively, as shown in FIG. 13 , the axial direction of the fastening tool E can also be inclined so that the farther away from the rotation center line R3 of the mandrel 43a2, the lower the direction. The fastening tool E is inserted into, for example, a straight hole through which the grinding tool D is obliquely penetrated, and is screwed into a screw hole formed on the lower surface of the flange 43a1.

As shown in FIG. 14, the exchange mechanism 71 has the holding mechanism 71a which holds the grinding tool D. As shown in FIG. The holding mechanism 71a holds, for example, a grinding tool D from below. The holding mechanism 71a is provided at the front end of the limb joint arm 72a through, for example, a first rotation mechanism 71d to be described later. The front end of the limb connecting arm 72a enters below the processing mechanism 43 from the side and is lifted up. After that, the holding mechanism 71a contacts the grinding tool D to hold the grinding tool D. As shown in FIG.

The replacement mechanism 71 may have the 1st rotation mechanism 71d which rotates the holding mechanism 71a. When the holding mechanism 71a holds the grinding tool D, the rotation centerline of the holding mechanism 71a coincides with the rotation centerline R3 of the spindle 43a2. When the holding mechanism 71a is rotated by the first rotating mechanism 71d, the grinding tool D and the flange 43a1 can be rotated simultaneously, and the fastening tool E can be directed toward the operating mechanism 71c. Therefore, the operation of the operating mechanism 71c can be simplified.

When a plurality of fastening tools E are provided at intervals in the circumferential direction of the grinding tool D, the control unit 76 repeatedly executes the operation of rotating the holding mechanism 71a by the first rotating mechanism 71d and releasing the fastening tool E by the operating mechanism 71c. action. Before the operating mechanism 71c releases the fastening tool E, the rotation of the holding mechanism 71a is stopped so that the fastening tool E faces the operating mechanism 71c. At this time, the control unit 76 can also use the photographing device 75 shown in FIG. 6 to monitor the position of the fastening tool E, determine whether the position of the fastening tool E is the expected position, and control the rotation stop position of the holding mechanism 71a. When all fastening tools E are removed, the fastening of the grinding tool D and the processing mechanism 43 can be released.

The replacement mechanism 71 may also have a gas supply mechanism 71e for supplying gas between the grinding tool D and the processing mechanism 43 as shown in FIG. 15 to support the separation of the grinding tool D and the processing mechanism 43 . The gas supply mechanism 71e includes a nozzle 121 for blowing out gas. The nozzle 121 supplies gas to, for example, a gap between the lower surface of the upper flange 101 and the upper surface of the ring portion 111 . With the rapid pressure of the gas, the grinding tool D can be easily separated from the processing mechanism 43 .

As shown in FIG. 16 , the grinding tool D may be formed with a hole 114 for guiding the gas supplied from the nozzle 121 to the contact surface between the grinding tool D and the machining mechanism 43 . The hole 114 guides the gas supplied from the nozzle 121 to, for example, the gap between the lower side of the flange 43a1 and the upper side of the grinding tool D. As shown in FIG. The hole 114 can be a dedicated hole, and can also be used together with the hole for installing the fastening tool E (such as a straight hole or a screw hole).

As shown in FIG. 17, the exchange mechanism 71 may have the 2nd rotation mechanism 71f which rotates the spindle 43a2 of the processing mechanism 43. As shown in FIG. 71 f of 2nd rotation mechanisms include the roller 131, for example. The rotation center line of the roller 131 is parallel to the rotation center line R3 of the spindle 43a2, and the roller 131 is in contact with the flange 43a1. When the roller 131 is rotated, the flange 43a1 is rotated by friction.

The second rotating mechanism 71f rotates the flange 43a1 before the grinding tool D is installed on the flange 43a1, and the hole 105 (such as a screw hole or a straight hole) of the mounting fastening tool E of the flange 43a1 is directed toward the desired position. direction. At this time, the control unit 76 can also use the imaging device 75 shown in FIG. 6 to monitor the direction of the flange 43a1, and determine whether the direction of the flange 43a1 is the expected direction to control the rotation stop position of the flange 43a1.

Also, as shown in FIG. 17, the first rotating mechanism 71d rotates the grinding tool D before the grinding tool D is mounted on the flange 43a1, and the hole 115 (such as straight hole or screw hole) in the desired direction. At this time, the control unit 76 can also use the camera 75 shown in FIG. 6 to monitor the direction of the grinding tool D, and determine whether the direction of the grinding tool D is the desired direction to control the rotation stop position of the grinding tool D. Thereafter, the front end of the limb arm 72a is lifted upward, and the grinding tool D contacts the flange 43a1.

The direction of the hole 115 for attaching the fastening tool E of the grinding tool D is aligned with the direction of the hole 105 for attaching the fastening tool E of the flange 43a1. Orient any one set of holes 115, 105 toward the operating mechanism 71c. Thereafter, the front end of the limb arm 72a is lifted upward, and the grinding tool D contacts the flange 43a1. Next, the operating mechanism 71c uses the fastening tool E to fasten the grinding tool D and the flange 43a1. Thereafter, the control unit 76 repeatedly executes the operation of rotating the holding mechanism 71a by the first rotation mechanism 71d and the operation of fastening the fastening tool E by the operation mechanism 71c. At this time, the control unit 76 can also use the photographing device 75 shown in FIG. 6 to monitor the positions of the holes 115 and 105, and determine whether the positions of the holes 115 and 105 are expected to control the rotation stop position of the holding mechanism 71a. When all fastening tools E are fastened, the fastening of the grinding tool D and the processing mechanism 43 is completed.

In the above, the processing device of the present invention, the method of installing the processing tool of the processing device, the replacement device, and the replacement method have been described, but the present invention is not limited to the above-mentioned embodiments and the like. Various changes, amendments, substitutions, additions, deletions, and combinations are possible within the scope of the patent application. These also naturally belong to the technical scope of the present invention.

For example, the processing device of the present invention is a grinding device in the above embodiment, but may also be a cutting device or a cutting device. In addition, grinding includes grinding. The processing device should just be a device having a processing mechanism in which a processing tool is mounted so as to be replaceable. When the processing device is a cutting device, cutting tools such as end mills are installed in the processing mechanism so as to be replaceable. Also, when the processing device is a cutting device, cutting tools such as blades are attached to the processing mechanism so as to be replaceable. The processing tool should just be what contacts a processing object and processes a processing object. The processing tools are replaced as they wear out from contact with the process body.

Also, the processed object processed by the processing apparatus of the present invention is the substrate W in the above embodiment, but the substrate W is not limited thereto.

This application claims priority based on Japanese Patent Application No. 2020-081377 filed with the Japan Patent Office on May 1, 2020, and all content of Japanese Patent Application No. 2020-081377 is cited in this application.

1: Grinding system 2: Import and export department 3: cleaning department 4: Grinding department 5: Control Department 7: Replacement device 8: Repository 9: Storage department 21: Carrying table 22: Loading plate 23: The first handling area 24: The first conveying device 24a: The first transport arm 31: The first cleaning device 32: The second cleaning device 33: The third cleaning device 34: Detection device 35: Transition device 36: The second handling area 37: The second conveying device 37a: The second transport arm 38: The 3rd handling area 39: The third handling device 39a: Adsorption pad 40: Grinding device (processing device) 41: Taiwan 42: suction cup (holding part) 43: Processing mechanism 43a: Movable part 43a1: Flange 43a2: mandrel 43a3: spindle motor 43b: Lifting part 43b1: Z-axis guide 43b2: Z-axis slider 43b3: Z-axis motor 43b4: Position detector 44: outer cover 44a: entrance 44b: main housing 44c: Sub-housing 44d: 2nd entrance 45: door stop 46: Mobile Mechanism 47: Restricted institutions 47a: exhaust pipe 47b: Air pressure controller 47c: sealing member 47d: 2nd sealing member 48: cleaning mechanism 50: Control Department 50a: CPU 50b: memory media 50c: Replacement instruction making part 50d: position detection unit 50e: switch control part 50f: Negative pressure control unit 50g: cleaning control part 50h: Automatic setting control section 51:CPU 52: memory media 53: Detection Department 61: The second door 62: The second moving mechanism 71: Replacement mechanism 71a: holding mechanism 71b: Rotation stop mechanism 71d: 1st rotating mechanism 71e: Gas supply mechanism 71f: Second rotating mechanism 72: Mobile Mechanism 73: Moving platform 74: Migration Agency 75: Shooting device 76: Control Department 76a: CPU 76b: Memory media 76c: Department of Migration Control 76d: Mobile Control Department 76e: Replace the control unit 77: Shell 101: Upper flange 102: Lower flange 105: hole 111: ring department 112: Disc Department 113: millstone 114: hole 115: hole 121: Nozzle 131: roll A0: Moving in and out position A1: primary grinding position A2: Secondary grinding position A3: Third grinding position C: Cassette D: Grinding tools (processing tools) D1: grinding wheel D2: Millstone E: Knot tool F: container R1: Centerline of rotation R2: Centerline of rotation W: substrate (processing body) X: direction Y: Direction Z: Direction

Fig. 1 is a plan view showing an example of the layout of a factory. Fig. 2 is a plan view showing another example of factory layout. Fig. 3 is a plan view showing an example of a grinding system. Fig. 4 is a cross-sectional view showing a processing mechanism of a grinding device according to an embodiment. Fig. 5 is a cross-sectional view showing a grinding device and a replacement device according to an embodiment. FIG. 6 is an enlarged sectional view of a part of FIG. 5 . Fig. 7 is a diagram showing the components of the respective control units of the grinding device and the replacement device according to an embodiment in functional blocks. Fig. 8 is a cross-sectional view showing a grinding device and a replacement device according to a first modified example. Fig. 9 is a cross-sectional view showing a grinding device and a replacement device according to a second modified example. Fig. 10 is a cross-sectional view showing a grinding device and a replacement device according to a third modified example. Fig. 11 is a plan view showing an example of a replacement device having a storage unit. Fig. 12 is a sectional view showing a first modified example of the fastening tool. Fig. 13 is a sectional view showing a second modified example of the fastening tool. Fig. 14 is a sectional view showing an example of the first rotating mechanism. Fig. 15 is a sectional view showing an example of the gas supply mechanism. Fig. 16 is a sectional view showing another example of the gas supply mechanism. Fig. 17 is a sectional view showing an example of the second rotation mechanism.

7: Replacement device

40: Grinding device (processing device)

42: suction cup (holding part)

43: Processing mechanism

43a1: Flange

43a2: mandrel

43a3: spindle motor

44: outer cover

44a: entrance

45: door stop

46: Mobile Mechanism

47: Restricted institutions

47a: exhaust pipe

47b: Air pressure controller

48: cleaning mechanism

50: Control Department

50a: CPU

50b: memory media

53: Detection Department

71: Replacement mechanism

72: Mobile Mechanism

73: Moving platform

74: Migration agency

75: Shooting device

76: Control Department

76a: CPU

76b: Memory media

A1: primary grinding position

D: Grinding tools (processing tools)

E: Knot tool

F: container

X: direction

Y: Direction

Z: Direction

Claims (14)

A replacement device, which is a replacement device for a processing tool used in a processing device, the processing device has: a holding part for holding a processing object; a processing mechanism for processing the processing object held in the holding part The processing tool is installed in a replaceable manner; and the outer cover accommodates the holding part and the processing mechanism, This replacement set contains: changing the mechanism, installing the processing tool on the processing mechanism or removing the processing tool from the processing mechanism; a moving mechanism for moving the replacement mechanism from the outside of the cover to the inside through the entrance of the cover; a mobile station supporting the mobile mechanism; and The moving mechanism makes the moving platform move. Such as the replacement device of claim 1, which further includes: The Department of Migration Control, which controls the Migration Agency; The processing tool is stored in a common storage unit for the plurality of processing devices, The moving control part controls the moving mechanism so that the moving table moves between a position for storing the processing tool and a position for replacing the processing tool. Such as the replacement device of claim 1, which further includes: The Department of Migration Control, which controls the Migration Agency; The processing tool is stored in a storage unit provided outside the processing device for each of the plurality of processing devices, The moving control part controls the moving mechanism so that the moving table moves between a position for storing the processing tool and a position for replacing the processing tool. The replacement device of any one of claim 1 to claim 3 further includes: The storage department keeps the processing tool; The storage unit is moved together with the moving platform. The replacement device of any one of claim 1 to claim 4 further includes: the housing is installed on the moving platform; The casing contacts the outer wall surface of the outer cover in a state where the replacement mechanism and the moving mechanism are accommodated, thereby sealing the inside of the casing, The inside of the casing communicates with the inside of the outer cover through the inlet of the outer cover. The replacement device according to any one of claim 1 to claim 5, wherein, The replacement mechanism includes a holding mechanism for holding the processing tool. Such as the replacement device of claim 6, wherein, The holding mechanism holds the container for accommodating the processing tool. Such as the replacement device of claim 6 or claim 7, wherein, The replacement mechanism includes a first rotation mechanism that rotates the holding mechanism. The replacement device according to any one of claim 1 to claim 8, wherein, The changing mechanism includes a rotation inhibiting mechanism that inhibits rotation of the spindle of the processing mechanism. The replacement device according to any one of claim 1 to claim 9, wherein, The replacement mechanism includes a second rotation mechanism for rotating the spindle of the machining mechanism. The replacement device according to any one of claim 1 to claim 10, wherein, The replacement mechanism has an operating mechanism for fastening or loosening the fastening tool that fastens the processing tool and the processing mechanism. The replacement device according to any one of claim 1 to claim 11, wherein, The exchange mechanism includes a gas supply mechanism for supplying gas between the processing tool and the processing mechanism. The replacement device according to any one of claim 1 to claim 12, wherein, The combination of the changing mechanism and the moving mechanism is set up in multiple groups and controlled independently. A method for replacing a processing tool used in a processing device, the processing device has: a holding part for holding a processing object; a processing mechanism for processing the processing object held in the holding part The tool is installed in a replaceable manner; and the outer cover accommodates the holding part and the processing mechanism, This replacement method includes the following steps: The replacement device of the processing tool receives the replacement instruction made in the processing device; the changing device travels to a set position on the outside of the cover; the replacement device detects that the access opening of the cover is open; the replacement device enters from the outside of the cover to the inside through the inlet of the cover; The changing device installs the processing tool on the processing mechanism or removes the processing tool from the processing mechanism.

Images