TW202305302A - 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 - Google Patents

蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 Download PDF

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Publication number
TW202305302A
TW202305302A TW111127247A TW111127247A TW202305302A TW 202305302 A TW202305302 A TW 202305302A TW 111127247 A TW111127247 A TW 111127247A TW 111127247 A TW111127247 A TW 111127247A TW 202305302 A TW202305302 A TW 202305302A
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TW
Taiwan
Prior art keywords
steam
liquid flow
passage
width
vapor
Prior art date
Application number
TW111127247A
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English (en)
Chinese (zh)
Inventor
小田和範
高橋伸一郎
太田貴之
山木誠
小鶴洋次
Original Assignee
日商大日本印刷股份有限公司
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Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202305302A publication Critical patent/TW202305302A/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
TW111127247A 2021-07-20 2022-07-20 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 TW202305302A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021119907 2021-07-20
JP2021-119907 2021-07-20

Publications (1)

Publication Number Publication Date
TW202305302A true TW202305302A (zh) 2023-02-01

Family

ID=84980015

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111127247A TW202305302A (zh) 2021-07-20 2022-07-20 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器

Country Status (6)

Country Link
US (1) US20240353182A1 (https=)
JP (1) JPWO2023003018A1 (https=)
KR (1) KR20240038011A (https=)
CN (2) CN116964401A (https=)
TW (1) TW202305302A (https=)
WO (1) WO2023003018A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116242176B (zh) * 2021-12-08 2026-01-09 亚浩电子五金塑胶（惠州）有限公司 均温板
CN117190762A (zh) * 2023-10-24 2023-12-08 深圳市顺熵科技有限公司 吸液芯及其制备方法、均温板
CN119533175A (zh) * 2024-12-12 2025-02-28 华南理工大学 一种大面积超薄均热板及其制备方法和电池热管理系统
CN121409021A (zh) * 2025-06-18 2026-01-27 宁波威茨科技有限公司 一种超薄均热板及其制备方法与应用

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100414694C (zh) * 2002-08-21 2008-08-27 三星电子株式会社 平板传热装置及其制造方法
CN102811590B (zh) * 2012-07-31 2014-12-31 华南理工大学 一种均热板的吸液芯结构
JP6057952B2 (ja) 2014-07-09 2017-01-11 東芝ホームテクノ株式会社 シート型ヒートパイプ
JP6191561B2 (ja) * 2014-08-28 2017-09-06 東芝ホームテクノ株式会社 シート型ヒートパイプ
JP2018194197A (ja) * 2017-05-15 2018-12-06 富士通株式会社 ヒートパイプ及び電子機器
EP3421917B1 (en) * 2017-06-30 2021-06-02 Nokia Solutions and Networks Oy Wick structures and heat pipe networks
CN107401941B (zh) * 2017-08-28 2023-09-26 华南理工大学 一种超薄均热板结构
JP7145412B2 (ja) * 2017-09-28 2022-10-03 大日本印刷株式会社 ベーパーチャンバおよび電子機器
CN109579584A (zh) * 2018-11-30 2019-04-05 华南理工大学 一种超薄环路均热板
CN109579583A (zh) * 2018-11-30 2019-04-05 华南理工大学 一种超薄仿叶片均热板
JPWO2021141110A1 (https=) * 2020-01-10 2021-07-15

Also Published As

Publication number Publication date
JPWO2023003018A1 (https=) 2023-01-26
US20240353182A1 (en) 2024-10-24
CN116964401A (zh) 2023-10-27
KR20240038011A (ko) 2024-03-22
WO2023003018A1 (ja) 2023-01-26
CN117751269A (zh) 2024-03-22

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