TW202304689A - Manufacturing method for water-proof button and electronic device using the same - Google Patents

Manufacturing method for water-proof button and electronic device using the same Download PDF

Info

Publication number
TW202304689A
TW202304689A TW110126324A TW110126324A TW202304689A TW 202304689 A TW202304689 A TW 202304689A TW 110126324 A TW110126324 A TW 110126324A TW 110126324 A TW110126324 A TW 110126324A TW 202304689 A TW202304689 A TW 202304689A
Authority
TW
Taiwan
Prior art keywords
mold
key
waterproof
keycaps
button
Prior art date
Application number
TW110126324A
Other languages
Chinese (zh)
Other versions
TWI778713B (en
Inventor
黃子軒
葉俊良
江銨畯
Original Assignee
和碩聯合科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 和碩聯合科技股份有限公司 filed Critical 和碩聯合科技股份有限公司
Priority to TW110126324A priority Critical patent/TWI778713B/en
Application granted granted Critical
Publication of TWI778713B publication Critical patent/TWI778713B/en
Publication of TW202304689A publication Critical patent/TW202304689A/en

Links

Images

Abstract

A manufacturing method for a waterproof button and an electronic device using the same. The manufacturing method includes: providing a button substrate, in which the button substrate includes a plate, a plurality of keycaps and at least one connecting part; providing a first mold, in which the first mold includes a plurality of hollow convex columns; placing the button substrate on the first mold, in which the keycaps are correspondingly located on the hollow convex columns; providing a second mold, in which the second plate includes a plurality of grooves; pressing the second mold to the button substrate and the first mold, so that the second mold is pushed against the plate until the hollow convex columns are respectively accommodated in the grooves; injecting a soft material between the first mold and the second mold; and removing the first mold and the second mold to obtain the waterproof button.

Description

防水按鍵之製造方法及使用該防水按鍵之電子裝置Manufacturing method of waterproof key and electronic device using the waterproof key

本揭示內容是有關於一種防水按鍵之製造方法及使用該防水按鍵之電子裝置,特別是利用模具以射出成型方式形成具防水層的防水按鍵之製造方法及使用該防水按鍵之電子裝置。The present disclosure relates to a manufacturing method of a waterproof key and an electronic device using the waterproof key, especially a manufacturing method of using a mold to form a waterproof key with a waterproof layer by injection molding and an electronic device using the waterproof key.

隨著用戶體驗要求不斷的提升,手持電子產品對於設計的要求也越來越高,為了延長產品的使用壽命與產品使用場合的方便性,防水防塵已成了許多手持電子產品的標配。With the continuous improvement of user experience requirements, the design requirements of handheld electronic products are also getting higher and higher. In order to prolong the service life of the product and the convenience of product use, waterproof and dustproof has become the standard configuration of many handheld electronic products.

現有技術中例如透過防水傳動罩進行密封防水功效,施力按壓按鍵時透過防水傳動罩傳遞力量至下方觸動開關(tact switch)。此種防水按鍵設計其軟質材料會介於硬質按鍵與觸動開關之間,使得可能會有不夠明確、清脆的按壓感覺進而影響到按鍵的按壓手感。In the prior art, for example, the waterproof transmission cover is used to perform the sealing and waterproof effect, and when the button is pressed with force, the force is transmitted to the lower tact switch through the waterproof transmission cover. The soft material of this kind of waterproof button design will be between the hard button and the touch switch, so that there may be an unclear and crisp pressing feeling, which will affect the pressing feel of the button.

另外,現有的防水按鍵設計多無法一次成型複數個防水按鍵,其硬質按鍵因受到外殼結構需夾緊軟質材料的影響,在外殼的開孔處周圍會設置整圈側牆或凸肋,使得產品為具有複數個按鍵且需達到防水要求時,每個按鍵需各別成型與組裝,將產生材料成型成本與成品組裝成本增加等問題。In addition, most of the existing waterproof button designs cannot form multiple waterproof buttons at one time. The hard buttons are affected by the clamping of soft materials in the shell structure, and a full circle of side walls or convex ribs will be set around the opening of the shell, making the product In order to have a plurality of buttons and meet the waterproof requirement, each button needs to be molded and assembled separately, which will cause problems such as increased material molding costs and finished product assembly costs.

再者,若使用傳統嵌入成型(Insert molding)製程來解決增加成品組裝成本,在材料成型時需將複數按鍵一一各別放入模具中,再進行嵌入成型,此時每個按鍵的各別組裝費用與時間只是轉嫁到了成型成本上面,實質效益不大。Furthermore, if the traditional insert molding (Insert molding) process is used to solve the problem of increasing the assembly cost of the finished product, multiple buttons need to be placed in the mold one by one when the material is molded, and then the insert molding is performed. At this time, each button is individually The assembly cost and time are only passed on to the molding cost, with little real benefit.

有鑑於此,本揭示內容於一實施例中提供一種防水按鍵的製造方法,包括提供按鍵基板,按鍵基板包括板體、複數鍵帽及至少一連接段,板體開設複數開口,複數鍵帽分別對應設置於複數開口,且各複數鍵帽透過至少一連接段與板體相連接;提供第一模具,第一模具包括第一基座及複數中空凸柱,複數中空凸柱間隔設置該第一基座之一表面,並對應於複數鍵帽的排列設置;將按鍵基板放置於第一模具,並使得複數鍵帽分別對應位於複數中空凸柱上;提供第二模具,第二模具包括第二基座及複數凹槽,複數凹槽凹設於第二基座之一表面,並對應於複數鍵帽的排列設置;將第二模具對應壓合於按鍵基板及第一模具,使得第二模具之第二基座推抵板體至複數連接段斷開,複數鍵帽與對應之中空凸柱分別容設於複數凹槽中,且板體夾設於第一基座與第二基座之間;注入成型軟質材料於第一模具及第二模具間,並使軟質材料覆蓋板體及環繞複數鍵帽以形成防水層;以及移除第一模具及第二模具以獲得防水按鍵。In view of this, the present disclosure provides a method of manufacturing a waterproof button in an embodiment, including providing a button substrate. The button substrate includes a board body, a plurality of keycaps, and at least one connecting section. The board body is provided with a plurality of openings, and the plurality of keycaps are respectively Correspondingly arranged in the plurality of openings, and each of the plurality of keycaps is connected to the plate body through at least one connecting section; a first mold is provided, the first mold includes a first base and a plurality of hollow bosses, and the plurality of hollow bosses are arranged at intervals. One surface of the base, and corresponding to the arrangement of the plurality of keycaps; placing the button substrate on the first mold, and making the plurality of keycaps correspondingly located on the plurality of hollow bosses; providing a second mold, the second mold includes a second The base and the plurality of grooves, the plurality of grooves are recessed on one surface of the second base, and are arranged corresponding to the arrangement of the plurality of keycaps; the second mold is correspondingly pressed on the key substrate and the first mold, so that the second mold The second base pushes against the board until the plurality of connecting sections are disconnected, the plurality of keycaps and the corresponding hollow protrusions are respectively accommodated in the plurality of grooves, and the board is sandwiched between the first base and the second base space; injecting soft material between the first mold and the second mold, and making the soft material cover the plate body and surround the plurality of keycaps to form a waterproof layer; and remove the first mold and the second mold to obtain waterproof keys.

同時,本揭示內容於一實施例中提供一種電子裝置,包括殼體、電路板、防水按鍵以及複數外蓋。殼體,具有複數按鍵槽,各複數按鍵槽於底部具有按鍵開孔。電路板容設於殼體中。防水按鍵係前述之製造方法所製成,防水按鍵設置於電路板上方並使複數鍵帽分別對應穿過複數按鍵開孔的其中之一,以容設於按鍵槽中。複數外蓋覆蓋複數鍵帽。Meanwhile, the present disclosure provides an electronic device in an embodiment, including a housing, a circuit board, a waterproof key, and a plurality of outer covers. The shell has a plurality of key slots, and each of the plurality of key slots has a key opening at the bottom. The circuit board is accommodated in the casing. The waterproof key is made by the aforementioned manufacturing method. The waterproof key is arranged above the circuit board and the plurality of key caps respectively pass through one of the plurality of key openings to be accommodated in the key groove. The plurality of outer covers cover the plurality of keycaps.

藉此,利用具有複數鍵帽之按鍵基板,可以一次完成複數按鍵之對位與設置,並於模具壓合且注入成型後,形成具有複數按鍵的防水按鍵。另外,以此製造方法製成的防水按鍵,在鍵帽上、下二側表面皆未完全被防水層所覆蓋,而可以直接與位於防水層外側之電子裝置的殼體(或外蓋)及位於防水層內側之電路板相接觸,而提升按壓手感。也因為不需要一個一個放置鍵帽於模具中,也可以大幅減少製造及組裝的時間與費用。In this way, by using the key substrate with multiple key caps, the alignment and setting of multiple keys can be completed at one time, and after the mold is pressed and injection molded, a waterproof key with multiple keys can be formed. In addition, the waterproof key made by this manufacturing method is not completely covered by the waterproof layer on the upper and lower surfaces of the keycap, but can be directly connected to the casing (or outer cover) and the casing (or outer cover) of the electronic device located outside the waterproof layer. The circuit board located inside the waterproof layer is in contact with each other to improve the pressing feeling. Also because there is no need to place the keycaps one by one in the mold, the time and cost of manufacturing and assembling can also be greatly reduced.

以下在實施方式中詳細敘述本揭示內容之詳細特徵以及優點,其內容足以使任何熟悉相關技藝者瞭解本揭示內容之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本揭示內容相關之目的及優點。The detailed features and advantages of this disclosure are described in detail below in the implementation mode, which is sufficient for any person familiar with the related art to understand the technical content of this disclosure and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and With the drawings, anyone skilled in the art can easily understand the purpose and advantages of the present disclosure.

請先參閱圖1及圖2A,圖1為本揭示所述一實施例防水按鍵的製造方法之流程圖,圖2A為本揭示所述一實施例防水按鍵的按鍵基板之上側面局部示意圖。本實施例之防水按鍵的製造方法包括提供按鍵基板10(步驟S10)。按鍵基板10包括板體11、複數鍵帽12及至少一連接段121,板體11開設複數開口111。複數鍵帽12分別對應設置於複數開口111,且各鍵帽12透過至少一連接段121與板體11相連接。由圖2A可見,在板體11上開設的每個開口111中皆設置了一個鍵帽12,而每一個鍵帽12係透過四個連接段121與板體11相連接。在本實施例中,連接段121係為寬度細小之薄肋(例如截面積尺寸為0.5mm×0.5mm),以便於後續製程要切斷時較為容易,本揭示不以此尺寸的連接段121為限,且連接段121的數量也不以四為限。另外,在本實施例中係以圓形之鍵帽12為例示,但不以此為限,鍵帽12的形狀也可以是橢圓形、多邊形、不規則形狀等,可依照實際所需進行設置。Please refer to FIG. 1 and FIG. 2A first. FIG. 1 is a flow chart of a manufacturing method of a waterproof key according to an embodiment of the present disclosure, and FIG. 2A is a partial schematic diagram of a top side of a key substrate of a waterproof key according to an embodiment of the present disclosure. The method for manufacturing a waterproof key in this embodiment includes providing a key substrate 10 (step S10 ). The key substrate 10 includes a board body 11 , a plurality of keycaps 12 and at least one connecting segment 121 , and the board body 11 defines a plurality of openings 111 . The plurality of keycaps 12 are correspondingly disposed on the plurality of openings 111 , and each keycap 12 is connected to the board body 11 through at least one connecting section 121 . As can be seen from FIG. 2A , a keycap 12 is disposed in each opening 111 opened on the board 11 , and each keycap 12 is connected to the board 11 through four connecting sections 121 . In this embodiment, the connection section 121 is a thin rib with a small width (for example, the cross-sectional area size is 0.5mm×0.5mm), so that it is easier to cut off in the subsequent manufacturing process. This disclosure does not include the connection section 121 with this size. is limited, and the number of connecting segments 121 is not limited to four. In addition, in this embodiment, a circular keycap 12 is used as an example, but it is not limited thereto. The shape of the keycap 12 can also be oval, polygonal, irregular, etc., and can be set according to actual needs. .

接著,請一併參閱圖2B,圖2B為本揭示所述一實施例防水按鍵的按鍵基板之下側面局部示意圖。在本實施例中,鍵帽12分別包括按壓柱122,延伸設置於鍵帽12之下表面123。Next, please also refer to FIG. 2B . FIG. 2B is a partial schematic diagram of the lower side of the key substrate of the waterproof key according to an embodiment of the present disclosure. In this embodiment, the keycaps 12 respectively include pressing posts 122 extending from the lower surface 123 of the keycap 12 .

接著請參閱圖1、圖3及圖4,圖3為本揭示所述一實施例防水按鍵的第一模具、按鍵基板與第二模具之示意圖,圖4為本揭示所述一實施例防水按鍵的第一模具、按鍵基板與第二模具之剖視示意圖。接著,執行步驟S20,提供第一模具20。第一模具20包括第一基座21及複數中空凸柱22,複數中空凸柱22間隔設置於第一基座21之一表面211(以圖4來看,中空凸柱22間隔設置於第一基座21之上表面211),並對應於複數鍵帽12的排列設置。Next, please refer to FIG. 1, FIG. 3 and FIG. 4. FIG. 3 is a schematic diagram of the first mold, the key substrate and the second mold of a waterproof button according to an embodiment of the disclosure, and FIG. 4 is a schematic diagram of a waterproof button according to an embodiment of the disclosure. A schematic cross-sectional view of the first mold, the key substrate and the second mold. Next, step S20 is executed to provide a first mold 20 . The first mold 20 includes a first base 21 and a plurality of hollow protrusions 22, and the plurality of hollow protrusions 22 are arranged at intervals on a surface 211 of the first base 21 (as seen in FIG. 4, the hollow protrusions 22 are arranged at intervals on the first The upper surface 211 of the base 21 ), and is arranged corresponding to the arrangement of the plurality of keycaps 12 .

接著,執行步驟S30,將按鍵基板10放置於第一模具20。使得複數鍵帽12分別對應位於複數中空凸柱22上。由圖3可見,在第一模具20的上表面側凸設有複數個中空凸柱22。這些中空凸柱22係對應於按鍵基板10上複數鍵帽12的排列方式進行設置,使得當按鍵基板10置於第一模具20時,每一個鍵帽12都可以對應於一個中空凸柱22放置。進一步,當按鍵基板10放置於第一模具20時,位於鍵帽12之下表面123之按壓柱122分別穿入對應的中空凸柱22的中空部份,使鍵帽12分別對應於中空凸柱22。此時,按壓柱122也可以提供對位之效果,使得鍵帽12的中心與中空凸柱22的中心對齊,避免後續在注入軟質材料而成型防水層40時可能會有偏移的問題(詳見步驟S60之說明)。Next, step S30 is executed to place the key substrate 10 on the first mold 20 . The plurality of keycaps 12 are correspondingly located on the plurality of hollow bosses 22 . As can be seen from FIG. 3 , a plurality of hollow bosses 22 are protruded on the upper surface of the first mold 20 . These hollow protrusions 22 are set corresponding to the arrangement of the plurality of key caps 12 on the key substrate 10, so that when the key substrate 10 is placed on the first mold 20, each key cap 12 can be placed corresponding to a hollow protrusion 22 . Further, when the key substrate 10 is placed on the first mold 20, the pressing columns 122 on the lower surface 123 of the keycap 12 respectively penetrate into the hollow parts of the corresponding hollow convex columns 22, so that the keycaps 12 respectively correspond to the hollow convex columns. twenty two. At this time, the pressing column 122 can also provide the effect of alignment, so that the center of the keycap 12 is aligned with the center of the hollow convex column 22, so as to avoid the possible offset problem when the waterproof layer 40 is formed by injecting soft materials later (details See the description of step S60).

於一些實施例中,中空凸柱22之橫截面外周形狀係與相對應之鍵帽12的形狀相同,且中空凸柱22之橫截面的面積小於鍵帽12的面積。舉例來說,中空凸柱22為圓柱狀,其橫截面為中空環狀外周為圓形,而鍵帽12的形狀亦為圓形,但本揭示不以此為限,中空凸柱22之橫截面外周形狀亦可與鍵帽12的形狀不同。In some embodiments, the cross-sectional peripheral shape of the hollow post 22 is the same as that of the corresponding keycap 12 , and the cross-sectional area of the hollow post 22 is smaller than that of the keycap 12 . For example, the hollow post 22 is cylindrical, and its cross-section is hollow and annular, and the outer circumference is circular, and the shape of the keycap 12 is also circular, but this disclosure is not limited thereto. The peripheral shape of the cross section can also be different from the shape of the keycap 12 .

接著,執行步驟S40,提供第二模具30。第二模具30包括第二基座31及複數凹槽32,複數凹槽32凹設於第二基座31之一表面311(以圖4來看,凹槽32凹設於第二基座31之下表面311),並對應於複數鍵帽12的排列設置。凹槽32係對應於按鍵基板10上複數鍵帽12的排列方式進行設置,使得第二模具30要對應壓合於第一模具20時,每一個凹槽32都會對應到一個開口111。Next, step S40 is executed to provide a second mold 30 . The second mold 30 includes a second base 31 and a plurality of grooves 32, and the plurality of grooves 32 are recessed on a surface 311 of the second base 31 (in view of FIG. 4, the grooves 32 are recessed on the second base 31 lower surface 311 ), and correspond to the arrangement of the plurality of keycaps 12 . The grooves 32 are arranged corresponding to the arrangement of the plurality of keycaps 12 on the key substrate 10 , so that when the second mold 30 is correspondingly pressed to the first mold 20 , each groove 32 corresponds to an opening 111 .

隨後,同時參閱圖1及圖5,圖5為本揭示所述一實施例防水按鍵的第二模具向第一模具壓合之剖視作動示意圖。在第二模具30、按鍵基板10及第一模具20相對位置設置好後,執行步驟S50,將第二模具30對應壓合於按鍵基板10及第一模具20。如圖5所示,於壓合過程中,當第二模具30下壓至接觸按鍵基板10上表面時,使得第二模具30之第二基座31持續向下推頂板體11至連接段121斷開。連接段121一旦斷開後,板體11失去連接段121與鍵帽12之連接,將會在地心引力的作用下落下至第一基座21的表面211。Subsequently, referring to FIG. 1 and FIG. 5 at the same time, FIG. 5 is a schematic cross-sectional action diagram of pressing the second mold of the waterproof keypad to the first mold according to an embodiment of the present disclosure. After the relative positions of the second mold 30 , the key substrate 10 and the first mold 20 are set, step S50 is performed to press-fit the second mold 30 to the key substrate 10 and the first mold 20 correspondingly. As shown in FIG. 5 , during the pressing process, when the second mold 30 is pressed down to contact the upper surface of the button substrate 10 , the second base 31 of the second mold 30 continues to push down the top plate body 11 to the connecting section 121 disconnect. Once the connection section 121 is disconnected, the board body 11 loses the connection between the connection section 121 and the keycap 12 , and will fall to the surface 211 of the first base 21 under the action of gravity.

於一些實施例中,各凹槽32的槽口之形狀對應於鍵帽12之形狀,且槽口將大於鍵帽12並小於開口111。在本實施例中,因鍵帽12為圓形,故凹槽32的槽口形狀以及開口111的形狀皆以圓形為例示。於此實施例中,凹槽32的槽口內徑D1大於鍵帽12的直徑D2並小於開口111的內徑D3。藉此,當第二模具30朝向第一模具20壓合時,槽口外圍的第二基座31會沿鍵帽12及開口111之間的連接段121下壓,而壓斷連接段121。In some embodiments, the shape of the notch of each groove 32 corresponds to the shape of the keycap 12 , and the notch is larger than the keycap 12 and smaller than the opening 111 . In this embodiment, since the keycap 12 is circular, the notch shape of the groove 32 and the shape of the opening 111 are both circular as an example. In this embodiment, the inner diameter D1 of the groove 32 is larger than the diameter D2 of the keycap 12 and smaller than the inner diameter D3 of the opening 111 . Thereby, when the second mold 30 is pressed against the first mold 20 , the second base 31 around the notch will press down along the connection section 121 between the keycap 12 and the opening 111 , thereby breaking the connection section 121 .

隨後,第二模具30持續下壓,直至如圖6所示,圖6為本揭示所述一實施例防水按鍵的第二模具壓合於第一模具之剖視示意圖。如圖6所示,鍵帽12與對應之中空凸柱22分別容設於凹槽32中,且板體11夾設於第一基座21與第二基座31之間。此時,可透過自動控制方式控制第二基座31的下壓距離,使其下壓至特定位置,而使得第二基座31與第一基座21間仍有一定間隙,以利後續軟性材料之填充,進而形成防水層40。另外,亦可設置例如感壓元件於第二模具30之凹槽32底部,一旦凹槽32底部接觸到鍵帽12時,感壓元件受壓而傳送訊號,使第二模具30停止下壓。Subsequently, the second mold 30 continues to press down until it is shown in FIG. 6 , which is a schematic cross-sectional view of the second mold of the waterproof button according to an embodiment of the present disclosure being pressed and bonded to the first mold. As shown in FIG. 6 , the keycap 12 and the corresponding hollow post 22 are respectively accommodated in the groove 32 , and the board body 11 is sandwiched between the first base 21 and the second base 31 . At this time, the pressing distance of the second base 31 can be controlled by an automatic control method, so that it can be pressed down to a specific position, so that there is still a certain gap between the second base 31 and the first base 21, so as to facilitate subsequent softness. The filling of the material further forms the waterproof layer 40 . In addition, for example, a pressure-sensitive element can also be arranged at the bottom of the groove 32 of the second mold 30 . Once the bottom of the groove 32 touches the keycap 12 , the pressure-sensitive element is pressed and sends a signal to make the second mold 30 stop pressing down.

此外,在各凹槽32的槽底具有鍵帽容置部321,鍵帽容置部321之形狀係與容設於凹槽32中的鍵帽12之形狀相同,並於第二模具30壓合於按鍵基板10且連接段121斷開後,鍵帽12的上表面側容設於鍵帽容置部321中。鍵帽容置部321可剛好位於凹槽32的底部正中間,一旦鍵帽12的上表面側容設於鍵帽容置部321中完成定位時,鍵帽12及中空凸柱22環週與凹槽32的側壁間將具有相等間距。如此,亦可避免在第二模具30下壓壓斷連接段121的過程中造成鍵帽12相對於中空凸柱22產生些微位移,進而造成後續注入軟質材料時,填充包覆不均的問題。In addition, there is a keycap accommodating part 321 at the groove bottom of each groove 32, and the shape of the keycap accommodating part 321 is the same as that of the keycap 12 accommodated in the groove 32, and is pressed by the second mold 30. After being fitted to the key substrate 10 and the connecting section 121 is disconnected, the upper surface side of the key cap 12 is accommodated in the key cap accommodating portion 321 . The keycap accommodating part 321 can just be located in the middle of the bottom of the groove 32. Once the upper surface side of the keycap 12 is accommodated in the keycap accommodating part 321 to complete the positioning, the keycap 12 and the hollow post 22 will be surrounded by The sidewalls of the recess 32 will have equal spacing. In this way, it is also possible to avoid the slight displacement of the keycap 12 relative to the hollow post 22 when the second mold 30 presses and breaks the connecting section 121 , which further causes the problem of uneven filling and coating when soft materials are injected later.

於一些實施例中,第二模具30更包括板體容置部33,板體容置部33凹設於第二基座31的表面311,且板體容置部33之形狀係對應於板體11之形狀。因此,於第二模具30壓合於按鍵基板10時,板體11可以限位在板體容置部33中,以利後續軟質材料注入時可以平均地完整覆蓋整個板體11的表面。In some embodiments, the second mold 30 further includes a plate accommodating portion 33, the plate accommodating portion 33 is recessed on the surface 311 of the second base 31, and the shape of the plate accommodating portion 33 is corresponding to the plate The shape of body 11. Therefore, when the second mold 30 is pressed onto the key substrate 10 , the plate body 11 can be limited in the plate body accommodating portion 33 , so that the entire surface of the plate body 11 can be evenly and completely covered when the subsequent soft material is injected.

另外,在第二模具30壓合至第一模具20時,除了可以利用如前所述自動控制的方式控制第二模具30下壓的高度外,亦可以透過下述結構使得第二基座31與第一基座21間具有一定間隙。如圖4所示,在第二模具30之板體容置部33於各二相鄰的凹槽32之間凸設有一間隔柱34,於第二模具30壓合於按鍵基板10時,複數間隔柱34會頂抵於板體11,故可以利用間隔柱34的高度來控制間隙的大小。In addition, when the second mold 30 is press-fitted to the first mold 20, in addition to controlling the pressing height of the second mold 30 through the aforementioned automatic control method, the second base 31 can also be made There is a certain gap with the first base 21 . As shown in FIG. 4 , a spacer column 34 is protruded between two adjacent grooves 32 in the plate body accommodating portion 33 of the second mold 30 . The spacer columns 34 are against the board body 11 , so the height of the spacer columns 34 can be used to control the size of the gap.

隨後,同時參閱圖1及圖7,圖7為本揭示所述一實施例防水按鍵於第一模具與第二模具間注入軟性材質之剖視示意圖。接著,執行步驟S60,注入成型軟質材料於第一模具20及第二模具30間。使軟質材料覆蓋板體11及環繞複數鍵帽12以形成防水層40。當軟質材料注入後,軟質材料會流動填滿第一基座21與第二基座31間的空隙。該些空隙包括,如圖6可見,板體11上表面與第二基座31間的空隙,以及凹槽32側壁與中空凸柱22間的空隙。也由於軟質材料會填滿該些空隙,即會形成覆蓋整個板體11的防水層40,以及環繞整個鍵帽12(即整個中空凸柱22外側表面)的防水層40。此時,由於按壓柱122是位於中空凸柱22的內部,故軟質材料在填充時會被中空凸柱22外側表面所阻擋,而僅會填充中空凸柱22外部的空隙,而不會進入中空凸柱22的內部。由於按壓柱122不會被防水層40所直接包覆,進而可保留按壓柱122之活動度。Subsequently, referring to FIG. 1 and FIG. 7 at the same time, FIG. 7 is a cross-sectional schematic diagram of injecting soft material between the first mold and the second mold for the waterproof button according to an embodiment of the present disclosure. Next, step S60 is executed to inject and mold the soft material between the first mold 20 and the second mold 30 . The soft material covers the board body 11 and surrounds the plurality of keycaps 12 to form a waterproof layer 40 . After the soft material is injected, the soft material will flow to fill the gap between the first base 21 and the second base 31 . These gaps include, as can be seen from FIG. 6 , the gap between the upper surface of the plate body 11 and the second base 31 , and the gap between the sidewall of the groove 32 and the hollow post 22 . Also because the soft material will fill up the gaps, a waterproof layer 40 covering the entire board body 11 and a waterproof layer 40 surrounding the entire keycap 12 (ie, the entire outer surface of the hollow post 22 ) will be formed. At this time, since the pressing column 122 is located inside the hollow convex column 22, the soft material will be blocked by the outer surface of the hollow convex column 22 when filling, and will only fill the space outside the hollow convex column 22 without entering the hollow space. Inside of the boss 22 . Since the pressing column 122 is not directly covered by the waterproof layer 40 , the mobility of the pressing column 122 can be preserved.

隨後,同時參閱圖1及圖8,圖8為本揭示所述一實施例防水按鍵之局部示意圖。接著,執行步驟S70,移除第一模具20及第二模具30以獲得防水按鍵100。由圖8可見,完成所獲得的防水按鍵100係會環繞成型於整個鍵帽12。同時,整個防水層40亦會覆蓋板體11的上表面。Subsequently, referring to FIG. 1 and FIG. 8 at the same time, FIG. 8 is a partial schematic diagram of a waterproof key according to an embodiment of the present disclosure. Next, step S70 is executed to remove the first mold 20 and the second mold 30 to obtain the waterproof key 100 . It can be seen from FIG. 8 that the waterproof key 100 obtained after completion will be formed around the entire key cap 12 . At the same time, the entire waterproof layer 40 will also cover the upper surface of the board body 11 .

藉此,一旦將防水按鍵100組設於電路板上,再蓋上外蓋時,由於防水層40與鍵帽12間無任何孔洞或間隙,而使得水及水氣無法由防水層40與鍵帽12間進入。另外,本實施例之製造方法利用具有複數鍵帽12之按鍵基板10,可以一次完成複數所需按鍵之對位與設置,並於模具壓合且注入成型後,形成具有複數可供作為按鍵的鍵帽12的防水按鍵100。也因為不需要一個一個放置鍵帽12於模具中,也可以大幅減少製造及組裝的時間與費用。In this way, once the waterproof keypad 100 is set on the circuit board and the outer cover is covered, since there is no hole or gap between the waterproof layer 40 and the keycap 12, water and moisture cannot pass between the waterproof layer 40 and the keycap. Cap 12 to enter. In addition, the manufacturing method of this embodiment utilizes the button substrate 10 with multiple keycaps 12, which can complete the alignment and setting of multiple required buttons at one time, and after mold pressing and injection molding, a plurality of buttons can be formed. The waterproof button 100 of the keycap 12. Also because there is no need to place the keycaps 12 one by one in the mold, the time and cost of manufacturing and assembling can also be greatly reduced.

又由圖8可見,以此製造方法製成的防水按鍵100,複數鍵帽12上表面會露出於防水層40。而鍵帽12下表面也因為中空凸柱22的設置而形成了中空柱狀的防水層40。因此,鍵帽12的下表面亦未完全被防水層40所覆蓋,而可以直接與位於防水層40下之電路板透過按壓柱122等與觸動開關相接觸,而提升按壓手感。It can also be seen from FIG. 8 that in the waterproof key 100 manufactured by this manufacturing method, the upper surfaces of the plurality of keycaps 12 will be exposed from the waterproof layer 40 . The lower surface of the keycap 12 also forms a hollow cylindrical waterproof layer 40 due to the arrangement of the hollow bosses 22 . Therefore, the lower surface of the keycap 12 is not completely covered by the waterproof layer 40 , but can directly contact the circuit board under the waterproof layer 40 with the touch switch through the pressing column 122 to improve the pressing feel.

又,在本實施例中,按鍵基板10係由硬質材料所製成,其中硬質材料之成型硬度大於軟質材料之成型硬度。如此,可提供防水按鍵100整體一定的堅固度,又可保有防水按鍵100因軟質材料所製成的防水層40所具有的按壓彈性。Moreover, in this embodiment, the key substrate 10 is made of hard material, wherein the molding hardness of the hard material is greater than that of the soft material. In this way, the overall firmness of the waterproof button 100 can be provided, and the pressing elasticity of the waterproof button 100 due to the waterproof layer 40 made of soft materials can be maintained.

請一併參閱圖8及圖9,圖9為本揭示所述一實施例電子裝置之局部剖視示意圖。為清楚呈現防水按鍵100組設於電子裝置90中的結構示意,在此僅截取二組按鍵處進行局部示意。電子裝置90可以為手機、平板、遊戲把手等手持裝置,而防水按鍵100則是組設作為例如電源鍵、音量控制鍵等使用。電子裝置90包括殼體91、電路板92、防水按鍵100以及複數外蓋93(圖中僅例示出2個,外蓋93的數量可對應防水按鍵100之鍵帽12的數量設置)。殼體91具有複數按鍵槽911(圖中僅例示出2個,按鍵槽911的數量可對應防水按鍵100之鍵帽12的數量設置),各按鍵槽911於底部具有按鍵開孔912。電路板92容設於殼體91中。防水按鍵100係以前述之製造方法所製成,在此對防水按鍵100之各細部結構不再贅述。防水按鍵100設置於電路板92上方並使鍵帽12分別對應穿過複數按鍵開孔912的其中之一,以容設於按鍵槽911中。複數外蓋93分別覆蓋複數鍵帽12。Please refer to FIG. 8 and FIG. 9 together. FIG. 9 is a partial cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure. In order to clearly present the schematic structure of the waterproof keys 100 assembled in the electronic device 90 , only the two groups of keys are partially illustrated here. The electronic device 90 can be a handheld device such as a mobile phone, a tablet, a gamepad, etc., and the waterproof button 100 is assembled and used as, for example, a power button, a volume control button, and the like. The electronic device 90 includes a housing 91, a circuit board 92, a waterproof key 100 and a plurality of outer covers 93 (only two are shown in the figure, and the number of outer covers 93 can be set corresponding to the number of key caps 12 of the waterproof key 100). The casing 91 has a plurality of key slots 911 (only two are shown in the figure, and the number of key slots 911 can be set corresponding to the number of key caps 12 of the waterproof key 100 ), and each key slot 911 has a key opening 912 at the bottom. The circuit board 92 is accommodated in the casing 91 . The waterproof key 100 is manufactured by the aforementioned manufacturing method, and details of the detailed structure of the waterproof key 100 will not be repeated here. The waterproof key 100 is disposed above the circuit board 92 so that the key cap 12 respectively passes through one of the plurality of key openings 912 to be accommodated in the key groove 911 . The plurality of outer covers 93 respectively cover the plurality of keycaps 12 .

在完成組設後,電路板92將完全位於防水層40內側面,而殼體91則位於防水層40的外側面,整個防水層40與鍵帽12外環週緊密接合完全無任何間隙,故由殼體91側流下之液體,將無法通過防水按鍵100進入,而可提供良好的防水效果。另,若防水按鍵100之鍵帽12之下表面123側設有按壓柱122時,可利用按壓柱122直接按壓位於電路板92上的觸動開關。而由於按壓柱122可直接接觸觸動開關,而不會再隔著防水層40,故亦可提升按壓手感。After the assembly is completed, the circuit board 92 will be completely located on the inner side of the waterproof layer 40, while the housing 91 will be located on the outer side of the waterproof layer 40, and the entire waterproof layer 40 will be tightly bonded to the outer circumference of the keycap 12 without any gap, so The liquid flowing down from the side of the casing 91 will not be able to enter through the waterproof button 100 , so a good waterproof effect can be provided. In addition, if the pressing column 122 is provided on the lower surface 123 of the keycap 12 of the waterproof key 100 , the pressing column 122 can be used to directly press the touch switch on the circuit board 92 . Since the pressing column 122 can directly contact the touch switch without the waterproof layer 40 , the pressing feeling can also be improved.

再者,在中空凸柱22之橫截面的面積小於鍵帽12的面積的情形下,會使得防水層40在成型時,除了包覆鍵帽12的側面外,亦會環設於鍵帽12的下表面123,而提供鍵帽12一定之支撐。藉此,當鍵帽12被按壓向下時,包覆鍵帽12及環設於鍵帽12下方之防水層40,亦可提供鍵帽12彈性回復力。一旦施加於鍵帽12之按壓作用力消失,鍵帽12即可在彈性回復力的作用下,回到初始未被按壓時的位置。Furthermore, when the cross-sectional area of the hollow post 22 is smaller than the area of the keycap 12, the waterproof layer 40 will not only cover the side of the keycap 12, but also surround the keycap 12 during molding. The lower surface 123 of the keycap 12 provides certain support. Thereby, when the keycap 12 is pressed down, the waterproof layer 40 covering the keycap 12 and surrounding the bottom of the keycap 12 can also provide the elastic recovery force of the keycap 12 . Once the pressing force applied to the keycap 12 disappears, the keycap 12 can return to the initial position when it is not pressed under the action of the elastic restoring force.

綜上,本揭示利用具有複數鍵帽12之按鍵基板10,可以一次完成複數按鍵之對位與設置,並於模具壓合且注入成型後,形成具有複數按鍵的防水按鍵100。另外,以此製造方法製成的防水按鍵100,在鍵帽12上、下二側表面皆未完全被防水層40所覆蓋,而可以直接與位於防水層40外側之電子裝置90的殼體91及位於防水層40內側之電路板92相接觸,而提升按壓手感。也因為不需要一個一個放置鍵帽12於模具中,也可以大幅減少製造及組裝的時間與費用。In summary, the present disclosure utilizes the key substrate 10 with multiple key caps 12 to complete the alignment and arrangement of multiple keys at one time, and forms the waterproof key 100 with multiple keys after mold pressing and injection molding. In addition, the waterproof key 100 made by this manufacturing method is not completely covered by the waterproof layer 40 on the upper and lower surfaces of the keycap 12, but can be directly connected to the housing 91 of the electronic device 90 outside the waterproof layer 40. It is in contact with the circuit board 92 located inside the waterproof layer 40 to improve the pressing feeling. Also because there is no need to place the keycaps 12 one by one in the mold, the time and cost of manufacturing and assembling can also be greatly reduced.

雖然本揭示內容以前述之實施例揭露如上,然其並非用以限定本揭示內容,任何熟習相像技術者,在不脫離本揭示內容之精神和範圍內,當可作些許之更動與潤飾,因此本揭示內容之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the content of this disclosure is disclosed above with the aforementioned embodiments, it is not intended to limit the content of this disclosure. Anyone who is familiar with similar technology can make some changes and modifications without departing from the spirit and scope of this disclosure. Therefore The scope of patent protection of this disclosure shall be subject to the definition of the scope of patent application attached to this specification.

100:防水按鍵 10:按鍵基板 11:板體 111:開口 12:鍵帽 121:連接段 122:按壓柱 123:下表面 20:第一模具 21:第一基座 211:表面 22:中空凸柱 30:第二模具 31:第二基座 311:表面 32:凹槽 321:鍵帽容置部 33:板體容置部 34:間隔柱 40:防水層 90:電子裝置 91:殼體 911:按鍵槽 912:按鍵開孔 92:電路板 93:外蓋 D1:槽口內徑 D2:直徑 D3:內徑 S10-S70:步驟 100: waterproof button 10: Button substrate 11: board body 111: opening 12: Keycap 121: Connection section 122: Press column 123: lower surface 20: First Mold 21: First Pedestal 211: surface 22: Hollow boss 30: Second mold 31: The second base 311: surface 32: Groove 321: Keycap accommodation part 33: Plate housing part 34: spacer column 40: waterproof layer 90:Electronic device 91: shell 911: key slot 912: key opening 92: circuit board 93: outer cover D1: Notch inner diameter D2: diameter D3: inner diameter S10-S70: Steps

[圖1] 為本揭示所述一實施例防水按鍵的製造方法之流程圖; [圖2A] 為本揭示所述一實施例防水按鍵的按鍵基板之上側面局部示意圖; [圖2B] 為本揭示所述一實施例防水按鍵的按鍵基板之下側面局部示意圖; [圖3] 為本揭示所述一實施例防水按鍵的第一模具、按鍵基板與第二模具之示意圖; [圖4] 為本揭示所述一實施例防水按鍵的第一模具、按鍵基板與第二模具之剖視示意圖; [圖5] 為本揭示所述一實施例防水按鍵的第二模具向第一模具壓合之剖視作動示意圖; [圖6] 為本揭示所述一實施例防水按鍵的第二模具壓合於第一模具之剖視示意圖; [圖7] 為本揭示所述一實施例防水按鍵於第一模具與第二模具間注入軟性材質之剖視示意圖; [圖8] 為本揭示所述一實施例防水按鍵之局部示意圖;以及 [圖9] 為本揭示所述一實施例電子裝置之局部剖視示意圖。 [Fig. 1] is a flow chart of a method for manufacturing a waterproof button according to an embodiment of the present disclosure; [Fig. 2A] is a partial schematic diagram of the upper side of the key substrate of the waterproof key according to an embodiment of the present disclosure; [Fig. 2B] is a partial schematic diagram of the lower side of the key substrate of the waterproof key according to an embodiment of the present disclosure; [Fig. 3] is a schematic diagram of the first mold, the key substrate and the second mold of the waterproof key according to an embodiment of the present disclosure; [Fig. 4] is a schematic cross-sectional view of the first mold, the key substrate and the second mold of the waterproof key according to an embodiment of the present disclosure; [FIG. 5] It is a schematic diagram of the cross-sectional action of pressing the second mold of the waterproof button to the first mold according to an embodiment of the present disclosure; [FIG. 6] It is a schematic cross-sectional view of the second mold of the waterproof button according to an embodiment of the present disclosure, which is press-fitted to the first mold; [ FIG. 7 ] is a schematic cross-sectional view of a waterproof button injected with a soft material between the first mold and the second mold according to an embodiment of the present disclosure; [ FIG. 8 ] is a partial schematic diagram of a waterproof button according to an embodiment of the present disclosure; and [ FIG. 9 ] is a partial cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure.

S10-S70:步驟 S10-S70: Steps

Claims (9)

一種防水按鍵的製造方法,包括: 提供一按鍵基板,該按鍵基板包括一板體、複數鍵帽及至少一連接段,該板體開設複數開口,該些鍵帽分別對應設置於該些開口,且各該些鍵帽透過該至少一連接段與該板體相連接; 提供一第一模具,該第一模具包括一第一基座及複數中空凸柱,該些中空凸柱間隔設置於該第一基座之一表面,並對應於該些鍵帽的排列設置; 將該按鍵基板放置於該第一模具,使得該些鍵帽分別對應位於該些中空凸柱上; 提供一第二模具,該第二模具包括一第二基座及複數凹槽,該些凹槽凹設於該第二基座之一表面,並對應於該些鍵帽的排列設置; 將該第二模具壓合於該按鍵基板及該第一模具,使得該第二模具之該第二基座推抵該板體至該些連接段斷開,該些鍵帽與對應之該中空凸柱分別容設於該些凹槽中,且該板體夾設於該第一基座與該第二基座之間; 注入成型一軟質材料於該第一模具及該第二模具間,並使該軟質材料覆蓋該板體及環繞該些鍵帽以形成一防水層;以及 移除該第一模具及該第二模具以獲得該防水按鍵。 A method for manufacturing a waterproof button, comprising: A button substrate is provided, the button substrate includes a plate body, a plurality of keycaps and at least one connecting section, the plate body is provided with a plurality of openings, the keycaps are respectively arranged in these openings, and each of the keycaps passes through the at least one A connection section is connected with the board body; A first mold is provided, and the first mold includes a first base and a plurality of hollow protrusions, and the hollow protrusions are arranged on a surface of the first base at intervals, and are arranged corresponding to the arrangement of the keycaps; placing the button substrate on the first mold, so that the keycaps are correspondingly located on the hollow bosses; A second mold is provided, the second mold includes a second base and a plurality of grooves, the grooves are recessed on a surface of the second base, and are arranged corresponding to the arrangement of the keycaps; The second mold is pressed onto the button substrate and the first mold, so that the second base of the second mold pushes against the board until the connecting sections are disconnected, and the keycaps and the corresponding hollow The protruding pillars are respectively accommodated in the grooves, and the board is sandwiched between the first base and the second base; Injecting a soft material between the first mold and the second mold, and making the soft material cover the board and surround the keycaps to form a waterproof layer; and The first mold and the second mold are removed to obtain the waterproof key. 如請求項1所述之防水按鍵的製造方法,其中該些鍵帽分別包含一按壓柱,延伸設置於該鍵帽之下表面,並於該按鍵基板放置於該第一模具時,該些按壓柱分別穿入該些中空凸柱,使該些鍵帽分別對應於該些中空凸柱。The manufacturing method of the waterproof key according to claim 1, wherein each of the key caps includes a pressing column extending from the lower surface of the key cap, and when the key substrate is placed on the first mould, the pressing columns The pillars respectively pass through the hollow convex pillars, so that the keycaps respectively correspond to the hollow convex pillars. 如請求項1所述之防水按鍵的製造方法,其中各該些凹槽的槽口之形狀對應於該些鍵帽之形狀,且槽口大於該鍵帽並小於該開口。The method for manufacturing a waterproof key according to claim 1, wherein the shape of the notch of each of the grooves corresponds to the shape of the keycaps, and the notch is larger than the keycap and smaller than the opening. 如請求項3所述之防水按鍵的製造方法,其中各該些凹槽的槽底具有一鍵帽容置部,該鍵帽容置部之形狀係與容設於該凹槽中的該鍵帽之形狀相同,並於該第二模具壓合於該按鍵基板且該些連接段斷開後,該鍵帽的上表面側容設於該鍵帽容置部中。The manufacturing method of the waterproof key according to claim 3, wherein the groove bottom of each of the grooves has a keycap accommodating part, and the shape of the keycap accommodating part is the same as that of the key accommodated in the groove The shapes of the caps are the same, and after the second mold is pressed onto the key substrate and the connecting sections are disconnected, the upper surface side of the key cap is accommodated in the key cap accommodating portion. 如請求項1所述之防水按鍵的製造方法,其中該第二模具更包括一板體容置部,該板體容置部凹設於該第二基座的該表面,且該板體容置部之形狀係對應於該板體之形狀,並於該第二模具壓合於該按鍵基板時,該板體限位在該板體容置部中。The manufacturing method of the waterproof button as described in claim 1, wherein the second mold further includes a plate accommodating portion, the plate accommodating portion is recessed on the surface of the second base, and the plate accommodates The shape of the placement part is corresponding to the shape of the board body, and when the second mold is pressed on the key substrate, the board body is limited in the board body accommodating part. 如請求項5所述之防水按鍵的製造方法,其中該板體容置部於各二相鄰的該些凹槽之間凸設有一間隔柱,於該第二模具壓合於該按鍵基板時,該些間隔柱頂抵於該板體。The manufacturing method of the waterproof button according to claim 5, wherein the plate housing part is provided with a spacer between two adjacent grooves, when the second mold is pressed on the button substrate , the spacing columns are against the plate body. 如請求項1所述之防水按鍵的製造方法,其中該中空凸柱之橫截面的面積小於該鍵帽的面積。The method for manufacturing a waterproof key according to claim 1, wherein the cross-sectional area of the hollow boss is smaller than the area of the key cap. 如請求項1所述之防水按鍵的製造方法,其中該按鍵基板係由一硬質材料所製成,其中該硬質材料之成型硬度大於該軟質材料之成型硬度。The method for manufacturing a waterproof key according to claim 1, wherein the key substrate is made of a hard material, wherein the hard material has a molding hardness greater than that of the soft material. 一種電子裝置,包括: 一殼體,具有複數按鍵槽,各該些按鍵槽於底部具有一按鍵開孔; 一電路板,容設於該殼體中; 一防水按鍵,該防水按鍵係以請求項1至8任一項所述之製造方法所製成,該防水按鍵設置於該電路板上方並使該些鍵帽分別對應穿過該些按鍵開孔的其中之一,以容設於該按鍵槽中;以及 複數外蓋,分別覆蓋該些鍵帽。 An electronic device comprising: A housing with a plurality of key slots, each of which has a key opening at the bottom; a circuit board accommodated in the casing; A waterproof button, the waterproof button is made by the manufacturing method described in any one of claims 1 to 8, the waterproof button is arranged above the circuit board and the keycaps are respectively passed through the button holes one of which is accommodated in the key slot; and A plurality of outer covers respectively cover the keycaps.
TW110126324A 2021-07-16 2021-07-16 Manufacturing method for water-proof button and electronic device using the same TWI778713B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110126324A TWI778713B (en) 2021-07-16 2021-07-16 Manufacturing method for water-proof button and electronic device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110126324A TWI778713B (en) 2021-07-16 2021-07-16 Manufacturing method for water-proof button and electronic device using the same

Publications (2)

Publication Number Publication Date
TWI778713B TWI778713B (en) 2022-09-21
TW202304689A true TW202304689A (en) 2023-02-01

Family

ID=84958266

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110126324A TWI778713B (en) 2021-07-16 2021-07-16 Manufacturing method for water-proof button and electronic device using the same

Country Status (1)

Country Link
TW (1) TWI778713B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7586056B2 (en) * 2006-09-15 2009-09-08 Shin-Etsu Polymer Co., Ltd Resin molded body, receiving jig and method for manufacturing push button switch member
DE102009013065A1 (en) * 2009-03-16 2010-09-30 Leonhard Kurz Stiftung & Co. Kg Device and method for decorating plastic parts
TWM502941U (en) * 2014-11-21 2015-06-11 Chicony Electronics Co Ltd Waterproof thin-film circuit board structure and waterproof keyboard thereof
TWI720757B (en) * 2019-12-23 2021-03-01 達方電子股份有限公司 Waterproof film and keyboard thereof
CN112476951B (en) * 2020-11-27 2023-05-09 昆山雷钜创鑫达塑胶制品有限公司 Assembling process adopting keyboard and keycap automatic assembling equipment

Also Published As

Publication number Publication date
TWI778713B (en) 2022-09-21

Similar Documents

Publication Publication Date Title
CA2056828C (en) Keypad and method of manufacture
US7250581B2 (en) Push-on switch
US4609791A (en) Flexible diaphragm keypad and method of manufacture
TWI778713B (en) Manufacturing method for water-proof button and electronic device using the same
KR100929150B1 (en) Dome seat structure for mobile phone keypad with integrated actuator function and manufacturing method
US5107083A (en) Resiliently deformable pushbutton switch having a contact member carrying a conductive material
JP5779802B2 (en) Two-shot injection molded housing with pedestal for user interface keycaps
KR100275297B1 (en) The manufacture method of film forming keycap and silicon rubber combination keypad
KR20130002664U (en) PCB integrated dome switch for surface mount technology
KR100397956B1 (en) Button assembly having plural buttons
JPH11288632A (en) Manufacture of key pad
CN218730540U (en) Waterproof button
JPH043045B2 (en)
KR100289034B1 (en) How to make keypad for mobile communication
CN220627651U (en) Key structure of bone conduction earphone
CN219642299U (en) Remote control key
JPH04308622A (en) Keytop for push button switch and manufacture of same
KR100650514B1 (en) Key frame key pad and method for manufacturing the same
KR100685142B1 (en) Keypad for cellular phone and manufacturing method thereof
KR100344970B1 (en) Keypad for cellular phone and method of manufacturing same
KR100944286B1 (en) Dome Sheet for Mobile Phone Keypad
KR200358343Y1 (en) Button assembly
KR101062072B1 (en) Dome sheet for mobile phone keypad and manufacturing method thereof
KR20050120550A (en) Unified key button structure with cantilever metal plate for cellular phone
JPS6136022Y2 (en)

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent