TWM502941U - Waterproof thin-film circuit board structure and waterproof keyboard thereof - Google Patents
Waterproof thin-film circuit board structure and waterproof keyboard thereof Download PDFInfo
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- TWM502941U TWM502941U TW103220679U TW103220679U TWM502941U TW M502941 U TWM502941 U TW M502941U TW 103220679 U TW103220679 U TW 103220679U TW 103220679 U TW103220679 U TW 103220679U TW M502941 U TWM502941 U TW M502941U
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Description
本創作係有關一種薄膜電路板結構,尤指一種防水薄膜電路板結構及其防水鍵盤。 The present invention relates to a thin film circuit board structure, in particular to a waterproof film circuit board structure and a waterproof keyboard thereof.
資訊產品已成為現代人生活中不可或缺的一部分。鍵盤更是常用的輸入裝置。然日常生活中會有不慎將飲料打翻而潑濺至鍵盤的狀況。在戶外使用也可能遇到下雨而有雨水滲入按鍵之間的情形。 Information products have become an indispensable part of modern life. The keyboard is a commonly used input device. However, in daily life, there is a situation in which the beverage is accidentally knocked over and splashed onto the keyboard. It may also be raining when used outdoors, and rain may seep between the buttons.
習知按鍵模組一般僅包括一按鍵蓋及一鍵帽,按鍵蓋黏接於鍵帽上。鍵帽為一彈性體,其可於外力之作用下發生變形並於外力撤去後恢復形狀。該按鍵模組套設於可攜式電子裝置之外殼孔內,而於該按鍵模組與該可攜式電子裝置之間形成細微空隙。所述按鍵模組若經常置於潮濕度高或下雨天被不小心淋濕時,水或水汽會經由按鍵與外殼之細微空隙滲入可攜式電子裝置內部,從而影響可攜式電子裝置之電路板運作系統。 The conventional button module generally only includes a button cover and a key cap, and the button cover is adhered to the key cap. The key cap is an elastic body which can be deformed by an external force and restored to a shape after the external force is removed. The button module is sleeved in the housing hole of the portable electronic device, and a fine gap is formed between the button module and the portable electronic device. If the button module is frequently placed in a humid or rainy day, the water or water vapor may penetrate into the portable electronic device through the fine gap between the button and the outer casing, thereby affecting the circuit of the portable electronic device. Board operating system.
習知的按鍵模組會在按鍵與外殼,甚至薄膜電路板間塗佈一層防水膠,但是因為在長久使用下,防水膠經水氣侵蝕或者老化的緣故,依然無法達到全面性的防水效果,導致水氣仍會侵入可攜式電子裝置之內部,造成其內部電子元件之損壞。 The conventional button module will apply a layer of waterproof glue between the button and the outer casing, or even the thin film circuit board, but because of the long-term use, the waterproof rubber is not eroded or aged due to moisture, and still cannot achieve a comprehensive waterproof effect. As a result, moisture will still invade the inside of the portable electronic device, causing damage to its internal electronic components.
有鑒於此,本案之創作人有鑑於目前可攜式電子裝置之防水機構 仍具有許多缺點與不足,故極力加以研究創作,終於研發完成本創作。 In view of this, the creators of this case have the waterproof mechanism of the portable electronic device. There are still many shortcomings and deficiencies, so I tried my best to research and create, and finally developed this creation.
本創作目的之一,在於提供一種防水薄膜電路板結構及其防水鍵盤,有效防止水液進入產品內部,以延長壽命。 One of the purposes of the present invention is to provide a waterproof film circuit board structure and a waterproof keyboard thereof, which effectively prevent water from entering the product to extend the life.
為達上述目的,本創作提供一種防水薄膜電路板結構,包括複數片體及一防水結構。每一片體具有一造型邊緣。防水結構沿造型邊緣連續設置,其中防水結構包含兩防水膠,該兩防水膠為間隔設置。 To achieve the above object, the present invention provides a waterproof film circuit board structure including a plurality of sheets and a waterproof structure. Each piece has a styling edge. The waterproof structure is continuously disposed along the edge of the shape, wherein the waterproof structure comprises two waterproof glues, and the two waterproof glues are spaced apart.
本創作另一較廣義的實施態樣還提供一種防水鍵盤,包括一按鍵層、一薄膜電路板及一底板。薄膜電路板設於按鍵層之下。薄膜電路板包括複數片體,且各片體分別具有一造型邊緣。底板設置於薄膜電路板下方。薄膜電路板之每一片體間沿造型邊緣連續設置一防水結構。防水結構包含兩防水膠,該兩防水膠為間隔設置。 Another broad implementation of the present invention also provides a waterproof keyboard comprising a button layer, a film circuit board and a backplane. The thin film circuit board is disposed under the button layer. The thin film circuit board includes a plurality of sheets, and each of the sheets has a molding edge. The bottom plate is disposed under the thin film circuit board. A waterproof structure is continuously disposed along each edge of the film circuit board along the molding edge. The waterproof structure comprises two waterproof glues, and the two waterproof glues are arranged at intervals.
本創作又一較廣義的實施態樣還提供一種防水鍵盤,包括一按鍵層、一薄膜電路板、一底板及一防水層。薄膜電路板設於按鍵層之下。底板設置於薄膜電路板下方,且底板具有一造型邊緣。防水層設置於底板下方。防水層對應造型邊緣連續設置一防水結構。防水結構包含兩防水膠,該兩防水膠為間隔設置。 A more general implementation of the present invention also provides a waterproof keyboard comprising a button layer, a film circuit board, a bottom plate and a waterproof layer. The thin film circuit board is disposed under the button layer. The bottom plate is disposed under the thin film circuit board, and the bottom plate has a molding edge. The waterproof layer is disposed below the bottom plate. The waterproof layer is continuously provided with a waterproof structure corresponding to the shape edge. The waterproof structure comprises two waterproof glues, and the two waterproof glues are arranged at intervals.
100‧‧‧薄膜電路板 100‧‧‧film circuit board
110‧‧‧片體 110‧‧‧ tablets
120‧‧‧造型邊緣 120‧‧‧ shape edge
130‧‧‧上薄膜層 130‧‧‧Upper film layer
140‧‧‧間隔層 140‧‧‧ spacer
150‧‧‧下薄膜層 150‧‧‧ lower film layer
200‧‧‧防水結構 200‧‧‧Waterproof structure
210‧‧‧防水膠 210‧‧‧Waterproof glue
210a‧‧‧第一防水膠 210a‧‧‧First waterproof glue
210b‧‧‧第二防水膠 210b‧‧‧Second waterproof glue
220‧‧‧介質層 220‧‧‧ dielectric layer
300‧‧‧防水鍵盤 300‧‧‧Waterproof keyboard
310‧‧‧按鍵層 310‧‧‧ button layer
320‧‧‧鍵帽 320‧‧‧Key Cap
330‧‧‧連接機構 330‧‧‧Connecting mechanism
340‧‧‧彈性件 340‧‧‧Flexible parts
400‧‧‧底板 400‧‧‧floor
500‧‧‧防水層 500‧‧‧Waterproof layer
圖1為繪示本創作防水薄膜電路板結構之分解圖。 FIG. 1 is an exploded view showing the structure of the water-repellent film circuit board of the present invention.
圖2為圖1其中一片體的平面圖。 Figure 2 is a plan view of one of the bodies of Figure 1.
圖3A為圖2中3A之部分放大圖。 Fig. 3A is a partial enlarged view of 3A in Fig. 2.
圖3B為圖3A之另一實施例圖。 FIG. 3B is a view of another embodiment of FIG. 3A.
圖3C為圖3A之又一實施例圖。 FIG. 3C is a view of still another embodiment of FIG. 3A.
圖4為繪示本創作防水鍵盤之分解圖。 FIG. 4 is an exploded view showing the waterproof keyboard of the present invention.
圖5為繪示本創作防水鍵盤另一實施例之分解圖。 FIG. 5 is an exploded view showing another embodiment of the water-repellent keyboard of the present invention.
圖6為繪示本創作防水鍵盤又一實施例之分解圖。 FIG. 6 is an exploded view showing still another embodiment of the water-repellent keyboard of the present invention.
本創作是一種防止水液進入產品內部,以延長壽命的防水薄膜電路板結構及其防水鍵盤。在此所指的薄膜電路板包含但不限於應用於鍵盤的薄膜電路板。此外,本創作的防水鍵盤圖示中,僅僅繪示單一的按鍵,但實際應用時亦可應於整個鍵盤結構,並不限制。有關本創作之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。 This creation is a waterproof film circuit board structure that prevents water from entering the inside of the product to extend its life and its waterproof keyboard. A thin film circuit board as referred to herein includes, but is not limited to, a thin film circuit board applied to a keyboard. In addition, in the waterproof keyboard illustration of the present invention, only a single button is shown, but the actual application may also be applied to the entire keyboard structure, and is not limited. The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.
如圖1所示,為本創作防水薄膜電路板結構之分解圖。如圖所示,本創作提供一種防水薄膜電路板結構,包括複數片體110及一防水結構200。每一片體110具有一造型邊緣120。防水結構200沿造型邊緣120連續設置,其中防水結構200包含兩防水膠210(如圖3A所示),該兩防水膠210為間隔設置。 As shown in Fig. 1, an exploded view of the structure of the waterproof circuit board is created. As shown, the present invention provides a waterproof film circuit board structure including a plurality of sheets 110 and a waterproof structure 200. Each piece 110 has a contoured edge 120. The waterproof structure 200 is continuously disposed along the molding edge 120, wherein the waterproof structure 200 includes two waterproof glues 210 (shown in FIG. 3A), and the two waterproof adhesives 210 are spaced apart.
在如圖1的實施例中,每一片體110包括一上薄膜層130、一下薄膜層150以及一間隔層140,其中間隔層140設於上薄膜層130及下薄膜層150之間。上薄膜層130、間隔層140與下薄膜層150可組成 一薄膜電路板(圖未標示)。一般而言,上薄膜層130與下薄膜層150相對之表面設有電路及對應電極,而中間為不導電的塑膠片140且對應該些電極之處設有破孔。當上薄膜層130與下薄膜層150的電極透過該破孔相互抵觸時,就會接觸形成通電,即完成電性導通。 In the embodiment of FIG. 1 , each of the sheets 110 includes an upper film layer 130 , a lower film layer 150 , and a spacer layer 140 . The spacer layer 140 is disposed between the upper film layer 130 and the lower film layer 150 . The upper film layer 130, the spacer layer 140 and the lower film layer 150 may be composed A thin film circuit board (not shown). Generally, the surface of the upper film layer 130 opposite to the lower film layer 150 is provided with a circuit and a corresponding electrode, and the middle is a non-conductive plastic piece 140 and a hole is formed corresponding to some electrodes. When the electrodes of the upper film layer 130 and the lower film layer 150 are in contact with each other through the holes, the contacts are energized, that is, the electrical conduction is completed.
如圖2所示,為繪示圖1其中一片體的平面示意圖。防水結構200可以設置於單一片體110或每一片體110上,視需要而改變。此外,防水結構200設置於中間的間隔層(未標示)亦具有黏著的效果,使上下兩片體110貼合一起。在本實施例中,片體110可為任一片體,例如上或下薄膜層。防水結構200可以沿任一片體110的造型邊緣120連續設置。造型邊緣120可為如圖2所示的構成薄膜電路板(圖未標示)的一外型輪廓或為形成於薄膜電路板上的複數孔洞邊緣。請同時參考圖3A所示,為圖2中3A之部分放大圖。兩防水膠210包含一第一防水膠210a及一第二防水膠210b,第一防水膠210a與第二防水膠210b之間更包含一介質層220。此介質層220較佳為一空氣介質。 As shown in FIG. 2, a schematic plan view of one of the bodies of FIG. 1 is shown. The waterproof structure 200 may be disposed on the single sheet 110 or each of the sheets 110, as needed. In addition, the spacer layer (not shown) provided with the waterproof structure 200 in the middle also has an adhesive effect, so that the upper and lower sheets 110 are attached together. In this embodiment, the sheet 110 can be any sheet, such as an upper or lower film layer. The waterproof structure 200 can be continuously disposed along the molding edge 120 of any of the sheets 110. The styling edge 120 can be an outline of a thin film circuit board (not shown) as shown in FIG. 2 or a plurality of hole edges formed on the thin film circuit board. Please refer to FIG. 3A at the same time, which is a partial enlarged view of 3A in FIG. 2 . The two waterproof adhesives 210 include a first waterproof adhesive 210a and a second waterproof adhesive 210b. The first waterproof adhesive 210a and the second waterproof adhesive 210b further comprise a dielectric layer 220. The dielectric layer 220 is preferably an air medium.
在此須說明的是,防水膠210的材質包含但不限於矽利康(silicone)、3M接著劑、PU防水膠單液、PU防水膠環氧樹脂(A/B膠)等。每一防水膠210a、210b的寬度較佳介於0.02~0.05毫米(mm)。 It should be noted that the material of the waterproof adhesive 210 includes, but is not limited to, silicone, 3M adhesive, PU waterproof rubber single liquid, PU waterproof rubber epoxy resin (A/B glue) and the like. The width of each of the waterproof adhesives 210a, 210b is preferably between 0.02 and 0.05 millimeters (mm).
如圖4所示,本創作另一較廣義的實施態樣還提供一種防水鍵盤300,包括一按鍵層310、一薄膜電路板100及一底板400。薄膜電路板100設於按鍵層310之下。薄膜電路板100包括複數片體110,且每一片體110分別具有一造型邊緣120。底板400設置於薄膜電 路板100下方。薄膜電路板100之每一片體110間沿造型邊緣120連續設置一防水結構200。防水結構200包含兩防水膠210,該兩防水膠210為間隔設置。 As shown in FIG. 4, another broad implementation of the present invention provides a waterproof keyboard 300 including a button layer 310, a thin film circuit board 100, and a bottom plate 400. The thin film circuit board 100 is disposed under the key layer 310. The thin film circuit board 100 includes a plurality of sheets 110, and each of the sheets 110 has a molding edge 120. The bottom plate 400 is disposed on the film Below the road plate 100. A waterproof structure 200 is continuously disposed between each of the sheets 110 of the thin film circuit board 100 along the molding edge 120. The waterproof structure 200 includes two waterproof glues 210, and the two waterproof glues 210 are spaced apart.
在此需特別說明的是,如圖4所示的防水鍵盤雖僅僅繪示單一的按鍵層310,但熟悉此技藝的通常知識者仍可實際應用於整體的鍵盤結構,因此本創作中就不再繪示出整個的鍵盤結構。如圖4所示,每一片體110包含一上薄膜層130、一下薄膜層150以及一間隔層140,其中間隔層140設於上薄膜層130及下薄膜層150之間。上薄膜層130、下薄膜層150以及間隔層140分別對應按鍵層310的每一鍵帽320,其中片體110還設有複數孔洞(可視為造型邊緣120之一)。按鍵層310則包括鍵帽320、鍵帽320下方的連接機構330以及彈性件340等元件,連接機構330帶動鍵帽320相對於底板400運動,彈性件340則提供鍵帽320按壓後的復位彈力。因此當按壓鍵帽320時,鍵帽320分別觸動連接機構330及彈性件340,彈性件340之部分將抵觸上薄膜層130,使上薄膜層130與下薄膜層150接觸,就會形成通電,即完成電性導通。相反地,當釋放該鍵帽320時,彈性件340及連接機構330會回復原位,上薄膜層130與下薄膜層150分離,即形成斷路。 It should be particularly noted that although the waterproof keyboard shown in FIG. 4 only shows a single button layer 310, those who are familiar with the art can still practically apply to the overall keyboard structure, so this creation does not The entire keyboard structure is again depicted. As shown in FIG. 4, each of the sheets 110 includes an upper film layer 130, a lower film layer 150, and a spacer layer 140. The spacer layer 140 is disposed between the upper film layer 130 and the lower film layer 150. The upper film layer 130, the lower film layer 150 and the spacer layer 140 respectively correspond to each of the key caps 320 of the button layer 310, wherein the sheet body 110 is further provided with a plurality of holes (which can be regarded as one of the molding edges 120). The button layer 310 includes a key cap 320, a connecting mechanism 330 under the key cap 320, and an elastic member 340. The connecting mechanism 330 drives the key cap 320 to move relative to the bottom plate 400, and the elastic member 340 provides a return elastic force after the key cap 320 is pressed. . Therefore, when the key cap 320 is pressed, the key cap 320 respectively touches the connecting mechanism 330 and the elastic member 340, and a portion of the elastic member 340 will abut the upper film layer 130, so that the upper film layer 130 is in contact with the lower film layer 150, and electricity is formed. That is, electrical conduction is completed. Conversely, when the keycap 320 is released, the elastic member 340 and the connecting mechanism 330 are returned to the original position, and the upper film layer 130 is separated from the lower film layer 150, that is, an open circuit is formed.
如圖4所示,防水結構200可以僅單一的連續沿造型邊緣120設置在薄膜電路板100上,即可有效達到防止水氣進入鍵盤內部。然而如圖5所示的實施例中,防水結構200亦可僅單一的連續沿造型邊緣120設置在底板400下的防水層500中上,同樣也可以達到防止液體滲入底板400之下的效果而延長產品壽命。如圖5所示,本創作又提供一種防水鍵盤,包括一按鍵層310、一薄膜電路板100 、一底板400及一防水層500。薄膜電路板100設於按鍵層310之下。底板400設置於薄膜電路板100下方,且底板400具有一造型邊緣120。防水層500設置於底板400下方。防水層200對應造型邊緣120連續設置一防水結構200。防水結構200包含兩防水膠210(可一併參考圖3A至圖3C),該兩防水膠210為間隔設置。在此所述的按鍵310結構與防水結構200與前述實施例相同,在此不再贅述。 As shown in FIG. 4, the waterproof structure 200 can be disposed on the thin film circuit board 100 only in a single continuous edge along the molding edge 120, thereby effectively preventing moisture from entering the interior of the keyboard. However, in the embodiment shown in FIG. 5, the waterproof structure 200 can also be disposed only in the waterproof layer 500 under the bottom plate 400 along the molding edge 120, and the effect of preventing liquid from penetrating under the bottom plate 400 can also be achieved. Extend product life. As shown in FIG. 5, the present invention further provides a waterproof keyboard, including a button layer 310 and a thin film circuit board 100. A bottom plate 400 and a waterproof layer 500. The thin film circuit board 100 is disposed under the key layer 310. The bottom plate 400 is disposed under the thin film circuit board 100, and the bottom plate 400 has a molding edge 120. The waterproof layer 500 is disposed under the bottom plate 400. The waterproof layer 200 is continuously provided with a waterproof structure 200 corresponding to the molding edge 120. The waterproof structure 200 includes two waterproof glues 210 (refer to FIG. 3A to FIG. 3C together), and the two waterproof glues 210 are spaced apart. The structure of the button 310 and the waterproof structure 200 described herein are the same as those of the foregoing embodiment, and are not described herein again.
為加強防水效果,更可以分別在薄膜電路板100與底板400下方設置防水結構200,如圖6所示。在如圖6所示的實施例中,薄膜電路板100的表面片體上及底板400下方的防水層500,同時設置防水結構200。關於防水結構200之關係以及造型邊緣120的形狀等,前述實施例已有揭露,在此不再贅述。 In order to enhance the waterproof effect, a waterproof structure 200 may be disposed under the thin film circuit board 100 and the bottom plate 400, respectively, as shown in FIG. In the embodiment shown in FIG. 6, the waterproof layer 500 on the surface sheet of the thin film circuit board 100 and under the bottom plate 400 is provided with the waterproof structure 200 at the same time. The foregoing embodiments have been disclosed with respect to the relationship of the waterproof structure 200 and the shape of the molding edge 120, and the like, and will not be described herein.
綜上所述,本文於此所揭示的實施例應被視為用以說明本創作,而非用以限制本創作。本創作的範圍應由後附申請專利範圍所界定,並涵蓋其合法均等物,並不限於先前的描述。 In summary, the embodiments disclosed herein are to be considered as illustrative of the present invention and are not intended to limit the present invention. The scope of this creation is defined by the scope of the appended patent application and covers its legal equivalents and is not limited to the foregoing description.
100‧‧‧薄膜電路板 100‧‧‧film circuit board
110‧‧‧片體 110‧‧‧ tablets
120‧‧‧造型邊緣 120‧‧‧ shape edge
130‧‧‧上薄膜層 130‧‧‧Upper film layer
140‧‧‧間隔層 140‧‧‧ spacer
150‧‧‧下薄膜層 150‧‧‧ lower film layer
200‧‧‧防水結構 200‧‧‧Waterproof structure
300‧‧‧防水鍵盤 300‧‧‧Waterproof keyboard
310‧‧‧按鍵層 310‧‧‧ button layer
320‧‧‧鍵帽 320‧‧‧Key Cap
330‧‧‧連接機構 330‧‧‧Connecting mechanism
340‧‧‧彈性件 340‧‧‧Flexible parts
400‧‧‧底板 400‧‧‧floor
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW103220679U TWM502941U (en) | 2014-11-21 | 2014-11-21 | Waterproof thin-film circuit board structure and waterproof keyboard thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW103220679U TWM502941U (en) | 2014-11-21 | 2014-11-21 | Waterproof thin-film circuit board structure and waterproof keyboard thereof |
Publications (1)
Publication Number | Publication Date |
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TWM502941U true TWM502941U (en) | 2015-06-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW103220679U TWM502941U (en) | 2014-11-21 | 2014-11-21 | Waterproof thin-film circuit board structure and waterproof keyboard thereof |
Country Status (1)
Country | Link |
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TW (1) | TWM502941U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI582812B (en) * | 2016-01-08 | 2017-05-11 | 致伸科技股份有限公司 | Key structure |
US10629395B1 (en) | 2018-12-13 | 2020-04-21 | Chicony Electronics Co., Ltd. | Keyboard membrane circuit board with liquid drainage path |
CN111341584A (en) * | 2018-12-18 | 2020-06-26 | 群光电子(苏州)有限公司 | Keyboard device |
CN113395816A (en) * | 2020-03-13 | 2021-09-14 | 重庆达方电子有限公司 | Flexible circuit board connecting end and thin film circuit board |
TWI778713B (en) * | 2021-07-16 | 2022-09-21 | 和碩聯合科技股份有限公司 | Manufacturing method for water-proof button and electronic device using the same |
-
2014
- 2014-11-21 TW TW103220679U patent/TWM502941U/en not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI582812B (en) * | 2016-01-08 | 2017-05-11 | 致伸科技股份有限公司 | Key structure |
US10629395B1 (en) | 2018-12-13 | 2020-04-21 | Chicony Electronics Co., Ltd. | Keyboard membrane circuit board with liquid drainage path |
CN111341584A (en) * | 2018-12-18 | 2020-06-26 | 群光电子(苏州)有限公司 | Keyboard device |
CN111341584B (en) * | 2018-12-18 | 2022-02-25 | 群光电子(苏州)有限公司 | Keyboard device |
CN113395816A (en) * | 2020-03-13 | 2021-09-14 | 重庆达方电子有限公司 | Flexible circuit board connecting end and thin film circuit board |
TWI778713B (en) * | 2021-07-16 | 2022-09-21 | 和碩聯合科技股份有限公司 | Manufacturing method for water-proof button and electronic device using the same |
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MM4K | Annulment or lapse of a utility model due to non-payment of fees |