TW202304669A - System and method for teaching silicon wafer taking and placing of manipulator relative to bearing space - Google Patents

Abstract

The embodiment of the invention discloses a system and method for teaching silicon wafer taking and placing of a manipulator relative to a bearing space, and the system comprises a touch part which is disposed on the manipulator; the driving device is used for enabling the manipulator to move so that the touch piece can make contact with a plurality of parts of the bearing part defining the bearing space, and is used for enabling the manipulator to stop moving when the touch piece makes contact with each part of the bearing part; the obtaining unit is used for obtaining the positions of the multiple parts of the bearing part according to the direction of the manipulator when the manipulator stops moving every time and the position of the part, making contact with the bearing part, of the touch part in the touch part; the analysis unit is used for analyzing the orientation and the contour shape of the bearing space according to the positions of the multiple parts; and the determining unit is used for determining the teaching orientation of the manipulator according to the orientation and the contour shape of the bearing space.

Description

System and method for teaching manipulator to pick and place silicon wafer relative to carrying space

The invention belongs to the field of semiconductor silicon wafer production, in particular to a system and method for teaching a manipulator to pick and place silicon wafers relative to a carrying space.

After the Czochralski crystal ingot is cut by wire, multiple silicon wafers can be obtained. During the subsequent processing, the silicon wafers will be temporarily stored in the silicon wafer box for transportation and other operations. When it needs to be used or processed Take it out of the silicon box.

Putting the silicon wafers into the silicon wafer box or taking the silicon wafers out of the silicon wafer box as mentioned above is usually done by manipulator operation. In this case, it is necessary to teach the manipulator to pick and place the silicon wafer relative to the silicon wafer box, so that, for example, when the manipulator puts the carried silicon wafer into the silicon wafer box, the silicon wafer can be placed in the The correct position in the silicon wafer box, or the silicon wafer can be accurately clamped when the robot arm takes out the silicon wafer placed in the silicon wafer box.

In the related art, the teaching of the manipulator is usually done manually. Specifically, the manipulator and the silicon wafer are not interfered with the inner wall and rib of the silicon wafer box. slowly move the wafers together into the wafer box, and then fine-tune the position of the manipulator several times according to the visual inspection until it is manually judged that the silicon wafers are carried in the silicon wafer box in an appropriate way, and the position of the manipulator at this time is used as Teach orientation.

However, the positions used to carry silicon wafers in different types of wafer cassettes or the teaching orientation of the manipulator are different. It is necessary to identify and judge the position of the wafer and the manipulator in the wafer cassette with the naked eye, and to accurately control the distance , speed, and repeated verification of the teaching orientation, not only the process is complicated, the accuracy is poor, and it is easy to cause scratches on the silicon chip and damage to the manipulator.

In order to solve the above technical problems, the embodiment of the present invention expects to provide a system and method for teaching the manipulator to pick and place silicon wafers relative to the carrying space, which can realize the automatic teaching of the manipulator without manual work and judgment, and can not only ensure The precise positioning of the manipulator can also ensure the safety of the manipulator and reduce the risk of silicon wafer being scratched.

Technical scheme of the present invention is realized like this: In the first aspect, an embodiment of the present invention provides a system for teaching a manipulator to pick and place silicon wafers relative to a carrying space. The system includes: a touch piece, the touch piece is arranged on the manipulator; a driving device, the driving device is used to move the manipulator so that the touch piece contacts a plurality of parts of the carrying part defining the carrying space, and is used for when the touch part touches each part of the carrying part stop the robot from moving; An acquisition unit, configured to acquire the positions of the plurality of positions of the carrying part according to the orientation of the manipulator each time the movement stops and the position of the contact part of the touch part with the carrying part in the touch part ; An analysis unit, configured to analyze the orientation and contour shape of the bearing space according to the positions of the multiple parts; A determination unit is configured to determine the teaching orientation of the manipulator according to the orientation and contour shape of the bearing space.

In the second aspect, an embodiment of the present invention provides a method for teaching a manipulator to pick and place silicon wafers relative to a carrying space, the method comprising: moving the manipulator so that the touch member carried by the manipulator contacts multiple parts of the carrying part defining the carrying space; stopping the movement of the manipulator when the touch piece contacts each part of the bearing part; Obtaining the positions of the plurality of positions of the carrying part according to the orientation of the manipulator and the position of the contact part of the touching part in the touching part when the movement is stopped each time; Analyzing the orientation and contour shape of the bearing space according to the positions of the multiple parts; The teaching orientation of the manipulator is determined according to the orientation and contour shape of the bearing space.

Embodiments of the present invention provide a system and method for teaching the manipulator to pick and place silicon wafers relative to the carrying space. Since the teaching orientation of the manipulator can be obtained, it is not only possible to use the manipulator to place the silicon wafers in the carrying space according to the teaching azimuth. The silicon chip at a specific position in the robot can be taken out, and the silicon chip can be placed into the specific position in the carrying space according to the teaching orientation by the manipulator, and the automatic teaching of the manipulator is realized without manual work and judgment.

In order for Ligui examiners to understand the technical characteristics, content and advantages of the present invention and the effects it can achieve, the present invention is hereby combined with the accompanying drawings and appendices, and is described in detail in the form of embodiments as follows, and the drawings used therein , the purpose of which is only for illustration and auxiliary instructions, and not necessarily the true proportion and precise configuration of the present invention after implementation, so it should not be interpreted based on the proportion and configuration relationship of the attached drawings, and limit the application of the present invention in actual implementation The scope is described first.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical" , "horizontal", "top", "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description , rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

Referring to FIG. 1 , an embodiment of the present invention provides a system 1 for teaching a manipulator MH to pick and place a silicon wafer W relative to a carrying space S. The system 1 may include: a touch piece 10, the touch piece 10 is arranged on the manipulator MH; A driving device 20, the driving device 20 is used to move the manipulator MH so that the touch member 10 contacts a plurality of positions CP of the carrying part C defining the carrying space S, wherein, it is exemplarily shown in FIG. 1 Therefore, the driving device 20 moves the manipulator MH to three orientations, as indicated by the three manipulators MH shown by dotted lines in FIG. At a position, as represented by the three touch members 10 shown by dotted lines in FIG. The part CP1, the part CP2 schematically shown by the "dot" and the part CP3 schematically shown by the "square point", it should be noted that the driving device 20 can move the manipulator MH to make the setting The touch member 10 on the manipulator MH contacts more other positions of the carrying part C except the above three positions, that is to say the three positions shown in FIG. 1 are only exemplary, and its purpose is to facilitate For understanding but not limitation, the driving device 20 is also used to stop the movement of the manipulator MH when the touch member 10 contacts each part CP of the bearing part C; An acquisition unit 30, configured to acquire the carrying part according to the orientation of the manipulator MH each time it stops moving and the position 10P of the touch part 10 in contact with the carrying part C in the touch part 10 The positions of the multiple parts CP of C, wherein, Fig. 1 exemplarily shows the three parts where the touch member 10 is in contact with the carrier part C, that is, the part 10P1 schematically shown by "cross". , the position 10P2 schematically shown by the "circle point" and the position 10P3 schematically shown by the "square point". In addition, it needs to be explained that firstly, the initial orientation of the manipulator MH can be known and The orientation when it stops moving can be known according to the initial orientation and the amount of movement. Secondly, since the touch piece 10 is arranged on the manipulator MH, the position of the touch piece 10 relative to the manipulator MH is fixed and can be known. Yes, once again, for the touch member 10, it is easy to know which part is in contact with the bearing part C, that is to say, the part where contact is made, such as the part 10P1, the part 10P2 and the part shown in FIG. 1 The position of 10P3 in the touch member 10 is easy to know, so that the positions of the parts 10P1, 10P2 and 10P3 in the entire moving space can be known, and referring to FIG. 1, it is easy to understand that the parts 10P1, 10P2 and The positions of the parts 10P3 in the entire moving space are respectively the positions of the parts CP1, CP2 and CP3 of the bearing part C in the entire moving space. In addition, in FIG. 1, only the acquisition unit 30 is shown for the purpose of clarity The connection line between the uppermost manipulator MH and the part 10P1 is used to indicate the orientation of the manipulator MH and the position of the part 10P1 in the touch member 10 that the acquisition unit 30 needs to use, and the connection with the other two positions is not shown. The connection line between the manipulator MH and parts 10P2 and 10P3;

Analysis unit 40, which is used to analyze the orientation and contour shape of the carrying space S according to the positions of the multiple parts CP. It should be noted here that the carrying part C is obviously composed of multiple parts In other words, it is "enveloped", and as long as enough positions of such parts are known, then the orientation and contour shape of the carrying part C can be known, and thus the orientation and contour shape of the carrying space S can also be known , and as mentioned above, as long as the touch member 10 contacts enough parts of the carrying part C, the positions of enough parts of the carrying part C can be known; Determining unit 50, the determining unit 50 is used to determine the teaching orientation of the manipulator MH according to the orientation and contour shape of the carrying space S, as shown in Fig. The silicon wafer W at the position and the manipulator MH at the teaching orientation. It should be noted that it is always desirable to place the silicon wafer W at a specific position in the carrying space S, so as long as the contour shape of the carrying space S is determined , then the teaching orientation relative to the carrying space S can be determined, and when the orientation of the carrying space S is also determined, the teaching orientation can be determined in the entire moving space.

In this way, since the teaching orientation of the manipulator MH can be obtained, it is not only possible to use the manipulator MH to take out the silicon wafer W carried at a specific position in the carrying space S according to the teaching azimuth, but also to use the manipulator MH to take out the silicon wafer W carried at a specific position in the carrying space S according to the teaching orientation. Azimuth puts the silicon wafer W into a specific position in the carrying space S, and realizes the automatic teaching of the manipulator without manual work and judgment.

As mentioned above, as long as the touch member 10 touches the carrier part C, the driving device 20 needs to stop driving the manipulator MH so that the manipulator MH stops moving. For this, in an optional embodiment of the present invention, refer to FIG. 2. The touch piece 10 can be a pressure sensor, so as to sense the pressure on the touch piece 10 due to contact with the multiple parts CP of the bearing part C and sense that the touch piece 10 is under pressure When generating a command signal, such as a command signal CS schematically indicated by a dotted arrow in FIG. 2 , the drive device 20 stops the movement of the manipulator MH based on the command signal CS.

As mentioned above, the touch piece 10 needs to be set on the manipulator MH so as to move together with the manipulator MH. On the other hand, the manipulator MH itself is used to clamp the silicon wafer M. Therefore, in order to facilitate the touch The arrangement of the touch piece 10, in an alternative embodiment of the present invention, referring to FIG. 1 or FIG. 2, the touch piece 10 may have the same contour shape as the silicon wafer W so as to be fabricated in the same manner as the silicon wafer W. The manipulator MH carries. In this case, since the carrying part C itself is used to carry the silicon wafer W, its contour shape must be associated with the contour shape of the silicon wafer W. Therefore, compared with the contact member 10 having other contour shapes, The touch piece 10 having the same outline shape as the silicon wafer W can make contact with different parts of the carrier part C with less movement, thereby reducing the workload of the driving device 20 .

In the above situation, the touch member 10 can determine the position of the pressured part 10P in the touch member 10 , so that the determined position can be directly used by the acquisition unit 30 . In this regard, for example, when different parts of the touch member 10 are under pressure, in addition to generating the above-mentioned command signal CS, other signals different from each other can also be generated. According to such signals, it can be determined that the touch member 10 is Which part is under pressure.

In an alternative embodiment of the present invention, referring to FIG. 3 , the carrying space S can be composed of two side walls SW of the wafer box WC and a plurality of ribs R protruding inward from the two side walls SW and arranged vertically. limited out.

In the above situation, still referring to FIG. 3 , when the touch piece 10 moves together with the manipulator MH, it may be pressed upward by the rib R, as shown by the solid line in FIG. 3 between the touch piece 10 and the manipulator MH. position, it may be subject to downward pressure from the convex rib R, such as when the touch member 10 and the manipulator MH are in the position shown by the upper dotted line in Figure 3, and may be subject to lateral pressure from the side wall SW, such as touching When the part 10 and the manipulator MH are in the position shown by the dotted line below in Fig. 3, for this, in an alternative embodiment of the present invention, referring to Fig. 4, the touch part 10 may include three bar-shaped pressure sensors , specifically the first pressure sensor 11, the second pressure sensor 12 and the third pressure sensor 13 as shown in FIG. The second pressure sensor 12 corresponds to the side WS of the silicon wafer W, and the third pressure sensor 13 corresponds to the back WB of the silicon wafer W.

In an optional embodiment of the present invention, referring to FIG. 5 , the touch piece 10 can be in the shape of a point so that the same part of the touch piece 10 or the point-shaped touch piece 10 itself and the bearing part C Multiple parts of CP are in contact. In this case, comparing FIG. 5 with FIG. 1, it can be seen that although the manipulator MH needs to be moved more in order to make the touch member 10 contact with multiple parts of the carrier part C, it is no longer necessary to The position of the touch part 10 where the contact is completed is determined in the touch part 10 , so that the whole process of determining the teaching orientation of the manipulator MH is simplified.

Referring to FIG. 6 in conjunction with FIG. 1 , an embodiment of the present invention also provides a method for teaching the manipulator MH to pick and place the silicon wafer W relative to the carrying space S, the method may include: S601: Make the manipulator MH move so that the touch member 10 carried by the manipulator MH contacts multiple parts CP of the carrying part C defining the carrying space S; S602: stop the movement of the manipulator MH when the touch member 10 contacts each part CP of the bearing part C; S603: According to the orientation of the manipulator MH and the position of the contact part 10P of the contact part 10 and the carrier part C in the touch part 10 when the movement stops each time, obtain the information of the plurality of parts CP of the carrier part C Location; S604: Analyze the orientation and contour shape of the carrying space S according to the positions of the multiple parts CP; S605: Determine the teaching orientation of the manipulator MH according to the orientation and contour shape of the carrying space S.

In the above method, optionally, stopping the movement of the manipulator MH when the touch member 10 contacts each part CP of the bearing part C may include: Sensing the pressure generated by the touch member 10 due to contact with the plurality of parts CP of the bearing part C; generating a command signal when it is sensed that the touch member 10 is under pressure; The movement of the manipulator MH is stopped based on the command signal.

It should be noted that: the technical solutions described in the embodiments of the present invention can be combined arbitrarily if there is no conflict.

The above are only preferred embodiments of the present invention, and are not used to limit the implementation scope of the present invention. If the present invention is modified or equivalently replaced without departing from the spirit and scope of the present invention, it shall be covered by the protection of the patent scope of the present invention. in the range.

1: system 10: Touch parts 11: The first pressure sensor 12:Second pressure sensor 13: The third pressure sensor 20: Drive device 30: Get unit 40:Analysis unit 50: determine unit 10P: parts 10P1: parts 10P2: parts 10P3: parts CP: part CP1: part CP2: parts CP3: parts C: Bearing parts S: Carrying space W: Wafer WF: front WB: back WS: side CS: command signal MH: manipulator WC: Wafer box SW: side wall R: convex rib S601-S605: Steps

1 is a schematic diagram of a system for teaching a manipulator to pick and place silicon wafers relative to a carrying space according to an embodiment of the present invention; 2 is a schematic diagram of a system for teaching a manipulator to pick and place silicon wafers relative to a carrying space according to another embodiment of the present invention; Fig. 3 is a schematic front view of a carrying space according to an embodiment of the present invention; 4 is a schematic cross-sectional view of a touch element according to an embodiment of the present invention; 5 is a schematic diagram of a system for teaching a manipulator to pick and place silicon wafers relative to a carrying space according to another embodiment of the present invention; FIG. 6 is a schematic diagram of a method for teaching a manipulator to pick and place silicon wafers relative to a carrying space according to an embodiment of the present invention.

1: system

10: Touch parts

20: Drive device

30: Get unit

40:Analysis unit

50: determine unit

10P: parts

10P1: parts

10P2: parts

10P3: parts

CP: part

CP1: part

CP2: parts

CP3: parts

C: Bearing parts

S: Carrying space

W: Wafer

MH: manipulator

Claims (10)

A system for teaching a manipulator to pick and place silicon wafers relative to a carrying space, the system includes: a touch piece, the touch piece is arranged on the manipulator; a driving device, the driving device is used to move the manipulator so that the touch piece contacts a plurality of parts of the carrying part defining the carrying space, and is used for when the touch part touches each part of the carrying part stop the robot from moving; An acquisition unit, configured to acquire the positions of the plurality of positions of the carrying part according to the orientation of the manipulator each time the movement stops and the position of the contact part of the touch part with the carrying part in the touch part ; An analysis unit, configured to analyze the orientation and contour shape of the bearing space according to the positions of the multiple parts; A determination unit is configured to determine the teaching orientation of the manipulator according to the orientation and contour shape of the bearing space. The system for teaching the manipulator to pick and place silicon wafers relative to the carrying space as described in claim 1, wherein the touch part is a pressure sensor, and the touch part is connected to the multiple positions of the carrying part The pressure received by the contact is sensed and an instruction signal is generated when sensing that the touch member is under pressure, and the driving device stops the movement of the manipulator based on the instruction signal. The system for teaching a manipulator to pick and place a silicon chip relative to the carrying space as described in claim 2, wherein the touch piece has the same contour shape as the silicon chip so that it can be controlled by the robot in the same way as the silicon chip hand holding. The system for teaching the manipulator to pick and place silicon wafers relative to the carrying space as described in claim 3, wherein the touch piece can determine the position of the pressured part in the touch piece. The system for teaching the manipulator to pick and place silicon wafers relative to the carrying space as described in claim 3, wherein the carrying space is composed of two side walls of the silicon wafer box and protrudes inward from the two side walls and is vertically arranged defined by a plurality of ribs. The system for teaching the manipulator to pick and place silicon wafers relative to the carrying space as described in claim 5, wherein the touch member includes three strip-shaped pressure sensors, and the three pressure sensors are respectively connected to the silicon wafer The front, side and back correspond to each other. The system for teaching the manipulator to pick and place silicon wafers relative to the carrying space as described in claim 2, wherein the touch piece is in the shape of a point so that the same part of the touch piece is in the same position as the multiple places of the carrying part touch. A method for teaching a manipulator to pick and place silicon wafers relative to a carrying space, the method comprising: moving the manipulator so that the touch member carried by the manipulator contacts multiple parts of the carrying part defining the carrying space; stopping the movement of the manipulator when the touch piece contacts each part of the bearing part; Obtaining the positions of the plurality of positions of the carrying part according to the orientation of the manipulator and the position of the contact part of the touching part in the touching part when the movement is stopped each time; Analyzing the orientation and contour shape of the bearing space according to the positions of the multiple parts; The teaching orientation of the manipulator is determined according to the orientation and contour shape of the bearing space. The method for teaching the manipulator to pick and place silicon wafers relative to the carrying space as described in claim 8, wherein stopping the movement of the manipulator when the touch member touches each part of the carrying part includes: Sensing the pressure generated by the touch member due to contact with the plurality of parts of the bearing part; Generate a command signal when sensing that the touch piece is under pressure; The manipulator is stopped based on the command signal. The method for teaching a manipulator to pick and place a silicon chip relative to a carrying space as described in claim 8 or 9, wherein the touch piece has the same contour shape as the silicon chip so as to be handled in the same manner as the silicon chip The manipulator carries.

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