TW202304013A - Optical semiconductor device and manufacturing method therefor - Google Patents

Abstract

To provide an optical semiconductor element capable of achieving long service life. An optical semiconductor device 10 includes: an optical semiconductor element 12; an enclosure 14 which defines a light source chamber 24 storing the optical semiconductor element 12 and has an opening at the front face of the optical semiconductor element 12; a window member 16 provided to cover the opening; a window fixing member 18 which is mounted on the enclosure 14 and sandwiches the window member 16 with the enclosure 14 for fixing; and a first seal member 20 which seals the portion between the enclosure 14 and the window member 16. The light source chamber 24 can be sealed.

Description

Optical semiconductor device and method for manufacturing optical semiconductor device

The present invention relates to an optical semiconductor device and a method for manufacturing the optical semiconductor device.

The optical semiconductor element is housed in a package that protects the element from the external environment. In the case of a nitride semiconductor, it is known that deterioration of the semiconductor layer can be suppressed by sealing in an atmosphere gas containing oxygen. There has been proposed a method of enclosing oxygen into the package and suppressing the effect of oxidation of the metal material bonded between the package and the window member during bonding (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2018-093137.

[Problem to be Solved by the Invention]

In order to prolong the lifetime of the optical semiconductor device, it is preferable to seal high concentration (for example, 20% or more) of oxygen into the package. However, when trying to seal a high concentration of oxygen into the package, it is difficult to prevent oxidation of the metal material joining between the package and the window member.

This invention is made|formed in view of such a subject, and it aims at providing the technique for realizing the extension of the lifetime of an optical-semiconductor element. [Means used to solve problems]

The optical semiconductor device of the present invention is equipped with: an optical semiconductor element; a housing that separates a light source room for accommodating the optical semiconductor element, and an opening is arranged on the front surface of the optical semiconductor element; a window member is arranged to close the opening; the window is fixed A member is installed in the housing, and the window member is fixed between the housing and the window fixing member; and a first sealing member is used to seal the housing and the window member. The light source chamber can be sealed.

Another aspect of the present invention is a method of manufacturing an optical semiconductor device. The manufacturing method of this optical semiconductor device comprises: the steps of accommodating the optical semiconductor element in the light source chamber so that the opening provided in the casing separating the light source chamber is located on the front surface of the optical semiconductor element; using a window member and a window fixing member And the step of sealing the opening with the first sealing member, the window member is to close the opening, the window fixing member is to clamp the window member between the housing and the window fixing member to fix, the first sealing member is to seal the window between the housing and the window member sealing; the step of exchanging the ambient gas in the light source chamber through the gas exchange hole provided in the casing; and the step of sealing the gas exchange hole.

According to one aspect of the present invention, the lifetime of the optical semiconductor device can be extended.

Hereinafter, modes for implementing the present invention will be described in detail with reference to the drawings. In addition, in the description, the same reference numerals are assigned to the same components, and overlapping descriptions are appropriately omitted. In addition, in order to facilitate understanding of the description, the dimensional ratios of the respective constituent elements in the respective drawings do not necessarily match the actual dimensional ratios.

FIG. 1 is a diagram schematically showing the configuration of an optical semiconductor device 10 according to the embodiment. The optical semiconductor device 10 includes an optical semiconductor element 12 , a case 14 , a window member 16 , a window fixing member 18 , and a first sealing member 20 .

The light source chamber 24 in which the optical semiconductor element 12 is accommodated is sealed by the case 14 , the window member 16 , the window fixing member 18 , and the first sealing member 20 . In this embodiment, the light source chamber 24 is sealed with a sealing member such as an O-ring, thereby making it easy to seal high-concentration (for example, 20% or more) oxygen as the ambient gas in the light source chamber 24 . By enclosing high-concentration oxygen in the light source chamber 24, performance degradation accompanying the use of the optical semiconductor element 12 can be suppressed, and life extension of the optical semiconductor element 12 can be realized.

In the figure, the thickness direction of the window member 16 is defined as the z direction, and the directions perpendicular to the z direction are defined as the x direction and the y direction. Regarding the orientation of the z direction, the +z direction from the optical semiconductor element 12 toward the window member 16 may be referred to as the front side, and the -z direction on the opposite side to the front side may be referred to as the rear side. In addition, the direction in which the main body portion 14 a and the extension portion 14 b are adjacent to each other in the housing 14 is defined as the x direction. The main body portion 14a is a portion where the window fixing member 18 is mounted, and is a portion where the housing 14 and the window fixing member 18 overlap in the z direction. The extension portion 14b is a portion where the housing 14 and the window fixing member 18 do not overlap in the z direction.

The optical semiconductor element 12 is composed of a nitride semiconductor material, including a GaN-based semiconductor represented by the composition of In _1-xY Al _x Ga _y N (0≦x≦1, 0≦y≦1, 0≦x+y≦1) Material. The optical semiconductor element 12 is, for example, an LED (Light Emitting Diode) chip configured to output deep ultraviolet light having a wavelength of 360 nm or less. The optical semiconductor element 12 includes an active layer made of aluminum gallium nitride (AlGaN) having a band gap of about 3.4 eV or more.

The optical semiconductor element 12 is accommodated in a light source chamber 24 partitioned by the casing 14 . The optical semiconductor element 12 is configured such that the window member 16 is located on the front surface of the optical semiconductor element 12 . The output light of the optical semiconductor element 12 is taken out of the light source chamber 24 through the first opening 26 provided in the housing 14 , the window member 16 , and the second opening 28 provided in the window fixing member 18 . The optical semiconductor element 12 is provided on the substrate 30 . In the example shown in the drawing, a plurality of optical semiconductor elements 12 are provided on a substrate 30 . The plurality of optical semiconductor elements 12 are arranged on the substrate 30 in, for example, a two-dimensional array. Only one optical semiconductor element 12 may be provided on the substrate 30 .

The housing 14 includes a first component 32 and a second component 34 . The light source chamber 24 is separated between the first component 32 and the second component 34 . The first member 32 and the second member 34 are made of metal materials such as stainless steel and aluminum. At least one of the first member 32 and the second member 34 can also be made of resin material.

The first member 32 is arranged on the front surface side of the optical semiconductor element 12 and has the first opening 26 . The first opening 26 is a circular opening. The second member 34 is arranged on the back side of the optical semiconductor element 12 . The second component 34 has a heat sink 36 for cooling the optical semiconductor element 12 . The heat dissipation mechanism 36 has, for example, a heat sink. The heat dissipation mechanism 36 is air-cooled or water-cooled outside the light source chamber 24 . The base plate 30 is mounted to the upper surface 38 of the heat dissipation mechanism 36 and is thermally connected to the heat dissipation mechanism 36 . The upper surface 38 of the heat dissipation mechanism 36 is exposed in the light source chamber 24 .

The window member 16 is arranged to close the first opening 26 of the housing 14 . The window member 16 is fixed by being sandwiched between the housing 14 and the window fixing member 18 . The window member 16 is a disc-shaped member. The window member 16 is made of a material that transmits the deep ultraviolet light output from the optical semiconductor element 12, such as quartz glass (SiO ₂ ) or sapphire (Al ₂ O ₃ ).

The window fixing member 18 is attached to the housing 14 , and the window member 16 is fixed between the housing 14 and the window fixing member 18 . The window fixing member 18 has a second opening 28 through which the deep ultraviolet light output from the optical semiconductor element 12 passes. The second opening 28 is a circular opening, eg, has the same size as the first opening 26 . The window fixing member 18 is made of a fluororesin material such as polytetrafluoroethylene (PTFE; polytetrafluoroethylene) or polyvinylidene fluoride (PVDF; polyvinylidene fluoride). The window fixing member 18 can also be made of metal materials such as stainless steel or aluminum.

The first sealing member 20 is disposed between the housing 14 and the window member 16 and seals between the housing 14 and the window member 16 . The first sealing member 20 is, for example, an O-ring made of vinylidene fluoride (vinylidene fluoride)-based rubber (FKM (fluororubber; fluorine rubber)), tetrafluoroethylene-propylene (tetrafluoroethylene-propylene)-based rubber (FEPM (tetrafluoroethylene-propylene) rubber; Tetrafluororubber)), tetrafluoroethylene-perfluorovinyl ether (tetrafluoroethylene-perfluorovinyl ether) rubber (FFKM (perfluorocarbon rubber; perfluororubber)) and other fluororubbers. The first sealing member 20 can also be a gasket made of rubber or metal material.

The optical semiconductor device 10 may further include a second sealing member 22 . The second sealing member 22 is provided between the window member 16 and the window fixing member 18 to seal between the window member 16 and the window fixing member 18 . The second sealing member 22 may be an O-ring made of fluororubber like the first sealing member 20, or may be a gasket made of rubber or metal material. The optical semiconductor device 10 does not have to include the second sealing member 22 .

The housing 14 has a main body portion 14a and an extension portion 14b. The main body part 14a is a part to which the window fixing member 18 is attached, and is a part which overlaps with the window fixing member 18 in z direction. The main body portion 14a is provided with a first opening 26 and a heat dissipation mechanism 36 . The extension part 14b is a part that does not overlap with the window fixing member 18 in the z direction, and is a part that extends from the main body part 14a to the x direction. The extension part 14b is provided with a gas exchange hole 40 and an external connector 46 .

The gas exchange hole 40 is provided in the extension part 14 b and arranged on the front surface side of the housing 14 . The gas exchange hole 40 passes through the first member 32 and communicates with the inside and outside of the light source chamber 24 . The gas exchange holes 40 extend along the z direction. The gas exchange hole 40 is provided for exchanging the atmosphere in the light source chamber 24 in a state where the window member 16 and the window fixing member 18 are attached to the casing 14 . The airtight plug 42 is detachably installed at the entrance of the gas exchange hole 40 . By installing the sealing plug 42 at the inlet of the gas exchange hole 40 , the gas exchange hole 40 is closed and the light source chamber 24 is sealed. The sealing plug 42 is made of, for example, an external thread, and engages with a thread cutting structure formed on the inner surface of the gas exchange hole 40 . A sealing member 44 such as an O-ring is disposed between the housing 14 and the sealing plug 42 .

In order to suppress deterioration of the optical semiconductor element 12, the atmosphere system in the light source chamber 24 contains 20 vol% or more of oxygen, Preferably it contains 30 vol% or more of oxygen. The oxygen concentration of the ambient gas in the light source chamber 24 may be about 40% by volume to 50% by volume. The atmospheric gas in the light source chamber 24 may contain nitrogen or a rare gas in addition to oxygen. The atmosphere system in the light source chamber 24 is composed of dry gas to prevent dew condensation in the light source chamber 24 . The moisture concentration of the ambient gas in the light source chamber 24 is less than 0.1% by volume, preferably less than 10 ppm or less than 1 ppm. The ambient gas in the light source chamber 24 may substantially only contain oxygen and nitrogen. A desiccant (not shown) such as zeolite for adsorbing moisture in the atmosphere may also be installed in the light source chamber 24 .

The external connector 46 is provided on the extension portion 14 b and arranged on the back side of the housing 14 . The external connector 46 is inserted into the mounting hole 48 through which the second member 34 penetrates. The external connector 46 is an electrical connector for supplying a control signal and a driving current to the optical semiconductor element 12 . The external connector 46 has external terminals exposed to the outside of the light source chamber 24 . The external connector 46 is electrically connected to the optical semiconductor element 12 via the connection cable 52 , the internal connector 54 , and the substrate 30 . The internal connector 54 is, for example, provided on the substrate 30 . The connecting cable 52 is installed in the light source chamber 24 and electrically connects the external connector 46 and the internal connector 54 .

The window fixing member 18 is fixed to the housing 14 by the first fastening member 56 . The first member 32 and the second member 34 are fixed by the first fastening member 56 and the second fastening member 58 . The first fastening member 56 and the second fastening member 58 are screws, bolts, or the like. The first fastening member 56 is provided on the main body portion 14 a, and fixes the first member 32 , the second member 34 and the window fixing member 18 . The second fastening member 58 is disposed on the extension portion 14 b and fixes the first member 32 and the second member 34 .

FIG. 2 is a plan view schematically showing the configuration of the optical semiconductor device 10 of FIG. 1 , and shows the configuration of the front surface side of the optical semiconductor device 10 . Fig. 1 shows the A-A line section of Fig. 2. The window fixing member 18 has a rectangular shape with four corners chamfered or chamfered in the top view of FIG. 2 . The second opening 28 is a circular opening and is disposed in the center of the window fixing member 18 . A plurality of optical semiconductor elements 12 are arranged in a two-dimensional matrix in a region overlapping with the second opening 28 . In the example of FIG. 2, a plurality of optical semiconductor elements 12 are arranged in a triangular lattice.

The main body portion 14a has the same rectangular shape as the window fixing member 18 with its four corners chamfered or chamfered. The extension part 14b protrudes in the x direction from the main body part 14a and the window fixing member 18 . In the top view of FIG. 2 , the extension portion 14 b has a rectangular shape with chamfered corners. The sealing plug 42 is mounted on the extension part 14b.

FIG. 3 is a bottom view schematically showing the configuration of the optical semiconductor device 10 in FIG. 1 , showing the configuration of the rear side of the optical semiconductor device 10 . The first fastening members 56 are attached to the four corners and the like of the main body portion 14a. The second fastening member 58 is mounted on the extension portion 14b. The heat dissipation mechanism 36 is disposed at the center of the main body portion 14a. The external connector 46 is disposed at the center of the extension portion 14b.

FIG. 4 is a graph showing the relationship between the oxygen concentration contained in the atmosphere gas and the light output change of the optical semiconductor element 12 . The vertical axis of the graph represents the rate of change in the light output of the semiconductor element 12 based on the light output at the start of lighting. The horizontal axis of the graph represents the lighting time of the optical semiconductor element 12 . Curves B to G of the graph vary the volume ratio of the oxygen concentration contained in the atmosphere gas of the optical semiconductor element 12 within the range of 0% to 50%. The atmospheric gas contains substantially only nitrogen in addition to oxygen.

As shown in the graph of FIG. 4 , it can be seen that the lower the optical output of the optical semiconductor element 12 is, the slower the drop rate is as the oxygen concentration contained in the atmospheric gas is higher. In Curve B with an oxygen concentration of 0%, when time passes to the right end of the graph, the light output decreases by about 24%. When the same elapsed time is used as a reference, the light output decreases by about 19% in the curve C with the oxygen concentration of 10%, and the light output decreases by about 13% in the curve D with the oxygen concentration of 20%. On the other hand, the decrease in light output is about 10% in the curve E of the oxygen concentration of 30%, and the decrease of the light output is about 8% in the curve F of the oxygen concentration of 40% and the curve G of the oxygen concentration of 50%. Therefore, by making the ambient gas contain oxygen at a concentration of 30% or more higher than that contained in the standard atmosphere (about 21%), the speed at which the light output of the optical semiconductor element 12 decreases can be significantly slowed down. As a result, the lifetime of the optical semiconductor element 12 can be extended.

Next, a method of manufacturing the optical semiconductor device 10 will be described. FIG. 5 is a flowchart showing a method of manufacturing the optical semiconductor device 10 according to the embodiment. The optical semiconductor element 12, the case 14, the window member 16, the window fixing member 18, and the first sealing member 20 are prepared in advance. Next, the optical semiconductor element 12 is accommodated in the light source chamber 24 of the case 14 (S10). The optical semiconductor element 12 is configured such that the first opening 26 is located on the front surface of the optical semiconductor element 12 . The optical semiconductor element 12 may be housed in the light source chamber 24 in a state mounted on the substrate 30 . The substrate 30 is mounted, for example, on the upper surface 38 of the heat dissipation mechanism 36 . When the substrate 30 is accommodated in the light source chamber 24 , the connection cable 52 can also be used to connect the external connector 46 and the internal connector 54 .

Next, the first opening 26 of the housing 14 is sealed using the window member 16, the window fixing member 18, and the first sealing member 20 (S12). For example, after the first sealing member 20, the window member 16 and the window fixing member 18 are sequentially stacked on the casing 14, the casing 14 and the window fixing member 18 are fixed to each other using the first fastening member 56, thereby The first opening 26 is sealed. In addition, the second sealing member 22 may be arranged between the window member 16 and the window fixing member 18 to seal between the window member 16 and the window fixing member 18 .

Next, the atmosphere gas in the light source chamber 24 is exchanged through the gas exchange hole 40 (S14). For example, the sealing plug 42 is removed from the gas exchange hole 40, and the nozzle is inserted into the gas exchange hole 40, whereby the atmospheric gas is supplied from the nozzle. The atmospheric gas supplied into the light source chamber 24 preferably has an oxygen concentration of 30% by volume or more and a moisture concentration of 0.1% by volume or less.

Next, the airtightness of the light source chamber 24 is confirmed through the gas exchange hole 40 (S14). For example, high-pressure ambient gas is introduced into the light source chamber 24 from the gas exchange hole 40 , and the pressure of the ambient gas is measured at the inlet of the gas exchange hole 40 , thereby detecting whether there is gas leakage. When a gas leak is detected, that is, when the airtightness is NG (not good) (No in S18), the steps from S12 to S16 are repeated. In S12, it is also possible to check whether there is any abnormality in the housing 14, the window member 16, the window fixing member 18, and the first sealing member 20, and replace the abnormal member. When no gas leakage is detected in S18, that is, when the airtightness is OK (Yes in S18), the sealing plug 42 is attached to the gas exchange hole 40 and the gas exchange hole 40 is sealed (S20).

According to this embodiment, since the light source chamber 24 is sealed by the sealing member, it is not necessary to use heat treatment for heating and bonding metal materials in order to seal the light source chamber 24 . When the atmospheric gas sealed in the light source chamber 24 contains a high concentration of oxygen, when the metal material is heated and bonding is attempted, the metal material is oxidized. When the metal joint is oxidized, the sealing performance due to the metal joint decreases, making it impossible to seal the atmospheric gas for a long time. On the other hand, in this embodiment, since the case 14 and the window member 16 can be sealed without using a metal joint, high-concentration oxygen can be easily sealed in the light source chamber 24 .

According to this embodiment, since the gas exchange hole 40 is provided in the case 14, the atmosphere of the light source chamber 24 can be easily exchanged after the optical semiconductor device 10 is assembled. When the gas exchange hole 40 is not provided in the casing 14, the step S12 of assembling the optical semiconductor device 10 must be performed in an atmosphere gas containing a high concentration of oxygen. In environments containing high concentrations of oxygen, fires are more likely to occur than in standard atmospheres, so special consideration must be given to ensure the safety of operations. On the other hand, according to the present embodiment, after the optical semiconductor device 10 is assembled, the atmospheric gas containing high concentration of oxygen is subsequently sealed, so the step S12 itself of assembling the optical semiconductor device 10 can be performed in the standard atmosphere. As a result, the safety at the time of manufacturing the optical semiconductor device 10 can be improved.

According to this embodiment, by providing the extension part 14b on the side surface of the main body part 14a, and providing the gas exchange hole 40 in the extension part 14b, the work of exchanging the atmosphere gas after assembling the optical semiconductor device 10 is facilitated. Moreover, by providing the external connector 46 in the extension part 14b, the large heat dissipation mechanism 36 can be provided in the main body part 14a, and the cooling performance of the optical semiconductor element 12 can be improved.

The present invention has been described above based on the embodiments. The present invention is not limited to the above-mentioned embodiments, and various design changes can be made, and various modification examples can be made, and such modification examples are also within the scope of the present invention, and all belong to those with ordinary knowledge in the technical field of the present invention.

In the above embodiment, the gas exchange hole 40 is arranged on the front side of the case 14 , and the external connector 46 is arranged on the back side of the case 14 . In another embodiment, the gas exchange hole 40 may be arranged on the back side of the case 14 , and the external connector 46 may be arranged on the front side of the case 14 . In addition, both the gas exchange hole 40 and the external connector 46 may be arranged on the front side of the case 14, and both the gas exchange hole 40 and the external connector 46 may be arranged on the back side of the case 14. .

In the above-mentioned embodiment, the case where the housing 14 is comprised by the 1st member 32 and the 2nd member 34 was shown. In another embodiment, the casing 14 can also be formed by an integrated component of the first component 32 and the second component 34 . In addition, the first member 32 and the second member 34 may not be fixed by the first fastening member 56 and the second fastening member 58 , but may be fixed by an adhesive or the like. In another embodiment, at least one of the first member 32 and the second member 34 may also be composed of two or more members.

In the above embodiment, the case where the casing 14 and the window fixing member 18 are fixed by the first fastening member 56 was shown. In another embodiment, an adhesive can also be used to fix the housing 14 and the window fixing member 18 .

In the said embodiment, the case where the sealing plug 42 was attached to the gas exchange hole 40 and sealed was shown. In another embodiment, a sealing valve that can make the gas exchange hole 40 openable can also be provided at the inlet of the gas exchange hole 40 .

In the above-mentioned embodiment, the case where the optical semiconductor element 12 is a light emitting element was shown. In another embodiment, the optical semiconductor element 12 may also be a light receiving element. The optical semiconductor element 12 can be, for example, a photodiode that receives deep ultraviolet light.

Hereinafter, several aspects of the present invention will be described.

The first aspect of the present invention is an optical semiconductor device, comprising: an optical semiconductor element; a housing that separates a light source chamber for accommodating the aforementioned optical semiconductor element, and an opening is provided on the front surface of the aforementioned optical semiconductor element; a window member , is arranged to close the aforementioned opening; the window fixing member is installed on the aforementioned housing, and the aforementioned window member is clamped between the aforementioned housing and the aforementioned window fixing member to fix; and the first sealing member is configured to connect the aforementioned housing to the aforementioned window fixing member. The aforementioned window components are sealed; the aforementioned light source chamber can be airtight. According to the first aspect, since the light source chamber is sealed by the first sealing member, it is not necessary to use heat treatment for heating and joining metal materials when sealing. As a result, it becomes easy to make the atmosphere of the light source chamber contain oxygen which may oxidize the metal bonding material and lower the sealing performance.

A second aspect of the present invention is the optical semiconductor device described in the first aspect, wherein the casing has a gas exchange hole for exchanging the ambient gas in the light source chamber, and the gas exchange hole is sealable. According to the second aspect, by providing the gas exchange hole, the atmosphere in the light source chamber can be exchanged while the window member is attached to the housing, so that the work of sealing the atmosphere into the light source chamber can be easily performed.

A third aspect of the present invention is the optical semiconductor device as described in the second aspect, wherein the housing includes: a body portion overlapping the window fixing member in the thickness direction of the window member; and an extension portion extending from The aforementioned main body portion extends in a direction perpendicular to the aforementioned thickness direction; the aforementioned gas exchange holes are arranged in the aforementioned extending portion. According to the third aspect, by providing the extension part on the side surface of the main body part, the gas exchange hole is provided on the extension part, thereby facilitating the operation of exchanging the ambient gas of the light source chamber.

A fourth aspect of the present invention is the optical semiconductor device described in the third aspect, wherein the main body portion includes a heat dissipation mechanism for cooling the optical semiconductor element. According to the fourth aspect, the cooling performance of the optical semiconductor element can be improved by providing the heat dissipation mechanism in the main body.

A fifth aspect of the present invention is the optical semiconductor device according to any one of the first aspect to the fourth aspect, wherein the oxygen concentration of the atmospheric gas in the light source chamber is 30% by volume or more. According to the fifth aspect, when the oxygen concentration of the atmospheric gas is 30% by volume or more, performance degradation of the optical semiconductor element can be suppressed, and the lifetime of the optical semiconductor element can be extended.

A sixth aspect of the present invention is the optical semiconductor device according to any one of the first aspect to the fifth aspect, wherein the moisture concentration of the atmospheric gas in the light source chamber is 0.1% by volume or less. According to the sixth aspect, when the moisture concentration of the atmospheric gas is 0.1% by volume or less, dew condensation on the window member can be prevented, and performance degradation of the optical semiconductor element can be suppressed.

A seventh aspect of the present invention is the optical semiconductor device according to any one of the first aspect to the sixth aspect, further comprising a second sealing member, the second sealing member combining the window member and the window Sealing between fixed components. According to the seventh aspect, the airtightness can be further improved by further providing the second sealing member between the window member and the window fixing member.

The eighth aspect of the present invention is a method of manufacturing an optical semiconductor device, which includes: accommodating an optical semiconductor element in a light source chamber, so that the opening provided in the housing separating the aforementioned light source chamber is located in the aforementioned optical semiconductor element. The step of the front surface; the step of sealing the aforementioned opening by using a window member, a window fixing member, a first sealing member and a second sealing member, the aforementioned window member is used to close the aforementioned opening, and the aforementioned window fixing member is used to sandwich the aforementioned window member in the aforementioned case body and the window fixing member, the first sealing member seals between the housing and the window member; the second sealing member seals the window member and the window fixing member; a step of exchanging the ambient gas in the light source chamber through the gas exchange hole of the housing; and a step of sealing the gas exchange hole. According to the eighth aspect, by exchanging the atmosphere gas through the gas exchange hole after assembling the optical semiconductor device, it is possible to facilitate the work of sealing the required atmosphere gas into the light source chamber.

A ninth aspect of the present invention is the method for manufacturing an optical semiconductor device according to the eighth aspect, further comprising: introducing high-pressure atmospheric gas into the light source chamber through the gas exchange hole and confirming the airtightness of the light source chamber the steps. The reliability of the optical semiconductor device can be improved by confirming the airtightness through the gas exchange hole.

10: Optical semiconductor device 12: Optical semiconductor components 14: Housing 14a: Body part 14b: Extension 16: window components 18: Window fixing member 20: the first sealing member 22: Second sealing member 24: Light source room 26: First opening (opening) 28: Second opening 30: Substrate 32: first component 34: Second component 36: cooling mechanism 38: upper surface 40: gas exchange hole 42: Airtight bolt 44: sealing member 46: External connector 48: Mounting hole 52: Connecting cables 54: Internal connector 56: first fastening member 58: second fastening member

[ Fig. 1 ] is a cross-sectional view schematically showing the configuration of an optical semiconductor device according to an embodiment. [ Fig. 2] Fig. 2 is a plan view schematically showing the configuration of the optical semiconductor device of Fig. 1 . [ Fig. 3 ] is a bottom view schematically showing the configuration of the optical semiconductor device of Fig. 1 . [ Fig. 4 ] is a graph showing the relationship between the oxygen concentration contained in the atmospheric gas and the light output change of the optical semiconductor element. [ Fig. 5 ] is a flow chart showing a method of manufacturing an optical semiconductor device according to the embodiment.

10: Optical semiconductor device

12: Optical semiconductor components

14: Housing

14a: Body part

14b: Extension

16: window components

18: Window fixing member

20: the first sealing member

22: Second sealing member

24: Light source room

26: First opening (opening)

28: Second opening

30: Substrate

32: first component

34: Second component

36: cooling mechanism

38: upper surface

40: gas exchange hole

42: Airtight bolt

44: sealing member

46: External connector

48: Mounting hole

52: Connecting cables

54: Internal connector

56: first fastening member

58: second fastening member

Claims (9)

An optical semiconductor device comprising: Optical semiconductor components; The casing is separated from the light source chamber for accommodating the aforementioned optical semiconductor element, and an opening is provided on the front surface of the aforementioned optical semiconductor element; a window member arranged to close the aforementioned opening; The window fixing member is installed in the aforementioned housing, and the aforementioned window member is sandwiched between the aforementioned housing and the aforementioned window fixing member to fix it; and The first sealing member seals between the aforementioned casing and the aforementioned window member; The aforementioned light source chamber can be airtight. The optical semiconductor device according to claim 1, wherein the casing has a gas exchange hole for exchanging the ambient gas in the light source chamber, and the gas exchange hole can be sealed. The optical semiconductor device as described in claim 2, wherein the housing includes: The main body part is overlapped with the aforementioned window fixing member in the thickness direction of the aforementioned window member; and The extension part extends from the body part to a direction perpendicular to the thickness direction; The aforementioned gas exchange holes are disposed on the aforementioned extension portion. The optical semiconductor device according to claim 3, wherein the main body includes a heat dissipation mechanism for cooling the optical semiconductor element. The optical semiconductor device according to any one of claims 1 to 4, wherein the oxygen concentration of the ambient gas in the light source chamber is 30% by volume or more. The optical semiconductor device according to any one of claims 1 to 4, wherein the moisture concentration of the atmospheric gas in the light source chamber is 0.1% by volume or less. The optical semiconductor device according to any one of claims 1 to 4, further comprising a second sealing member that seals between the window member and the window fixing member. A method for manufacturing an optical semiconductor device, comprising: The step of accommodating the optical semiconductor element in the light source chamber, so that the opening provided in the casing separating the aforementioned light source chamber is located on the front surface of the aforementioned optical semiconductor element; A step of sealing the opening by using a window member, a window fixing member, and a first sealing member, wherein the window member closes the opening, and the window fixing member fixes the window member by sandwiching the window member between the housing and the window fixing member , the aforementioned first sealing member seals between the aforementioned casing and the aforementioned window member; a step of exchanging the ambient gas in the light source chamber through the gas exchange holes provided in the housing; and The step of sealing the aforementioned gas exchange holes. The method for manufacturing an optical semiconductor device according to Claim 8, further comprising: introducing high-pressure atmospheric gas into the light source chamber through the gas exchange hole and confirming the airtightness of the light source chamber.

Images