TW202302917A - 表面處理銅箔、覆銅積層板及印刷配線板 - Google Patents

表面處理銅箔、覆銅積層板及印刷配線板 Download PDF

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Publication number
TW202302917A
TW202302917A TW111101717A TW111101717A TW202302917A TW 202302917 A TW202302917 A TW 202302917A TW 111101717 A TW111101717 A TW 111101717A TW 111101717 A TW111101717 A TW 111101717A TW 202302917 A TW202302917 A TW 202302917A
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TW
Taiwan
Prior art keywords
copper foil
treatment layer
treated
treated copper
layer
Prior art date
Application number
TW111101717A
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English (en)
Chinese (zh)
Inventor
松岡佑樹
岩沢翔平
五刀郁浩
中島誓哉
三木敦史
Original Assignee
日商Ｊｘ金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｊｘ金屬股份有限公司 filed Critical 日商Ｊｘ金屬股份有限公司
Publication of TW202302917A publication Critical patent/TW202302917A/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
TW111101717A 2021-07-09 2022-01-14 表面處理銅箔、覆銅積層板及印刷配線板 TW202302917A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021114585 2021-07-09
JP2021-114585 2021-07-09

Publications (1)

Publication Number Publication Date
TW202302917A true TW202302917A (zh) 2023-01-16

Family

ID=84800489

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111101717A TW202302917A (zh) 2021-07-09 2022-01-14 表面處理銅箔、覆銅積層板及印刷配線板

Country Status (5)

Country Link
JP (1) JPWO2023281778A1 (ja)
KR (1) KR20230121117A (ja)
CN (1) CN116710601A (ja)
TW (1) TW202302917A (ja)
WO (1) WO2023281778A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010061736A1 (ja) * 2008-11-25 2010-06-03 日鉱金属株式会社 印刷回路用銅箔
JP5654581B2 (ja) * 2010-05-07 2015-01-14 Jx日鉱日石金属株式会社 印刷回路用銅箔、銅張積層板、印刷回路基板、印刷回路及び電子機器
JP2012112009A (ja) 2010-11-26 2012-06-14 Hitachi Cable Ltd 銅箔、及び銅箔の製造方法
JP2014152352A (ja) * 2013-02-06 2014-08-25 Sh Copper Products Corp 複合銅箔および複合銅箔の製造方法
CN107614760B (zh) * 2015-07-03 2018-07-13 三井金属矿业株式会社 粗糙化处理铜箔、覆铜层叠板和印刷电路板
JP6200042B2 (ja) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP6816193B2 (ja) * 2019-03-26 2021-01-20 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
JP2021095596A (ja) * 2019-12-13 2021-06-24 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
KR20230121117A (ko) 2023-08-17
JPWO2023281778A1 (ja) 2023-01-12
CN116710601A (zh) 2023-09-05
WO2023281778A1 (ja) 2023-01-12

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