TW202302791A - Integrated dicing/die bonding film and method for producing semiconductor device - Google Patents

Abstract

Disclosed is an integrated dicing/die bonding film which comprises a base layer, one or more pressure-sensitive adhesive layers including an ultraviolet-curable pressure-sensitive adhesive layer comprising an ultraviolet-curable pressure-sensitive adhesive, and an adhesive layer in this order. The ultraviolet-curable pressure-sensitive adhesive layer included in the pressure-sensitive adhesive layers is in contact with the adhesive layer. The ultraviolet-curable pressure-sensitive adhesive comprises a (meth)acrylic resin having a functional group capable of undergoing chain polymerization and photopolymerization initiators. The ultraviolet-curable pressure-sensitive adhesive contains at least a first photopolymerization initiator and a second photopolymerization initiator, which differs from the first photopolymerization initiator in maximum-absorption wavelength in the ultraviolet region, as the photopolymerization initiators. The content of the photopolymerization initiators is 1.5 parts by mass or higher per 100 parts by mass of the whole (meth)acrylic resin.

Description

Dicing die bonding integrated film and method of manufacturing semiconductor device

The present invention relates to a dicing die bonding integrated film and a method for manufacturing a semiconductor device.

A semiconductor device is manufactured through the following steps. First, a dicing step is performed with the adhesive film for dicing attached to the wafer. Thereafter, an expanding step, a pick-up step, a die bonding step, and the like are performed.

In the manufacturing process of semiconductor devices, a film called a dicing die-bonding integrated film is used. This film has a structure in which a base material layer, an adhesive layer, and an adhesive layer are laminated in this order, and is used, for example, as follows. First, the surface on the adhesive layer side is attached to the wafer, and the wafer is diced while the wafer is fixed with a dicing ring. Thereby, the wafer is singulated into a plurality of wafers. Next, after reducing the adhesive force of the adhesive layer with respect to the adhesive layer by irradiating ultraviolet rays to the adhesive layer, the wafer and the adhesive sheet obtained by singulating the adhesive layer are picked up from the adhesive layer together. Thereafter, a semiconductor device is manufactured by a step of mounting the wafer on a substrate or the like via an adhesive sheet. Moreover, the laminated body which consists of the wafer obtained by the dicing process, and the adhesive sheet attached thereto is called the wafer with the adhesive sheet.

Conventionally, as a method for dicing wafers and adhesive layers, dicing by a blade or the like, ie, blade dicing, is widely known. In recent years, stealth dicing has become popular due to the high integration of semiconductor packages and the thinning of wafers (see Patent Documents 1 and 2). Stealth dicing is a method of cutting the wafer and the adhesive layer along the predetermined cutting line to obtain a wafer with an adhesive sheet after forming a predetermined cutting line inside the object by laser.

[Patent Document 1] Japanese Patent Laid-Open No. 2002-192370 [Patent Document 2] Japanese Unexamined Patent Publication No. 2003-338467

However, there is a problem that the yield rate decreases when manufacturing the wafer with the adhesive sheet using the thinned wafer. According to the studies of the inventors of the present invention, it has been found that peeling may occur between the end of the wafer with the adhesive sheet and the adhesive layer before the wafer with the adhesive sheet is picked up from the adhesive layer. When such peeling occurs, the peeled portion of the adhesive layer comes into contact with oxygen, and after the ultraviolet ray is irradiated to the adhesive layer, the adhesive force of the adhesive layer to the adhesive layer is not sufficiently reduced, and the pick-up property decreases.

Therefore, the main object of the present invention is to provide a dicing die-bonding integrated film which can make the adhesive layer relative to the adhesive layer when the adhesive layer is irradiated with ultraviolet rays even when the adhesive layer is in contact with oxygen. The adhesion of the agent layer is sufficiently reduced.

The present invention relates to a dicing die bonding integrated film. The dicing die bonding integrated film sequentially includes a base material layer, an adhesive layer including an ultraviolet curable adhesive layer composed of an ultraviolet curable adhesive, and an adhesive layer. The ultraviolet curable adhesive layer contained in the adhesive layer is provided in contact with the adhesive layer. The ultraviolet curable adhesive agent contains the (meth)acrylic resin (it may be called "(meth)acrylic resin A" hereafter) which has the functional group which can chain-polymerize, and a photoinitiator. The ultraviolet curable adhesive includes at least a first photoinitiator and a second photoinitiator having a different maximum absorption wavelength in the ultraviolet range from the first photoinitiator as a photoinitiator. Content of a photoinitiator is 1.5 mass parts or more with respect to 100 mass parts of total amounts of (meth)acrylic-type resin A.

According to this dicing die bonding integrated film, the content of the photopolymerization initiator is sufficiently large, and from the viewpoint of effective use of light in the ultraviolet region, even when the adhesive layer is in contact with oxygen, the When the adhesive layer is irradiated with ultraviolet rays, the adhesive force of the adhesive layer can be sufficiently reduced.

The functional group of the (meth)acrylic resin A may be at least one selected from an acryl group and a methacryl group.

Regarding (meth)acrylic resin A, at least a part thereof may be crosslinked by a crosslinking agent.

Another aspect of the present invention relates to a method of manufacturing a semiconductor device. The manufacturing method of the semiconductor device includes the following steps. (A) Step of preparing the above-mentioned dicing die bonding integrated film (preparation step) (B) Step of dicing wafer (dicing step) (C) The step of attaching the wafer to the adhesive layer of the diced die-bonding integrated film (wafer attaching step) (D) A step of obtaining a wafer with an adhesive sheet by expanding the substrate layer under cooling conditions and obtaining a wafer with an adhesive layer singulated (cooling expansion step) (E) A step of reducing the adhesion of the adhesive layer to the wafer with the adhesive sheet attached by irradiating the adhesive layer with ultraviolet rays (ultraviolet irradiation step) (F) Step of picking up the wafer with the adhesive sheet attached from the adhesive layer (pick-up step) (G) The step of mounting the picked-up wafer with the adhesive sheet on the substrate or other wafers (mounting step)

The present invention provides the dicing die-bonding integrated film of [1] to [3] and the manufacturing method of the semiconductor device of [4].

[1] A dicing die bonding integrated film comprising, in this order, a base material layer, an adhesive layer including an ultraviolet curable adhesive layer composed of an ultraviolet curable adhesive, and an adhesive layer, wherein The aforementioned ultraviolet curable adhesive layer included in the adhesive layer is provided in contact with the aforementioned adhesive layer, The aforementioned ultraviolet curable adhesive includes a (meth)acrylic resin having chain-polymerizable functional groups and a photopolymerization initiator, The ultraviolet curable adhesive includes at least a first photoinitiator, and a second photoinitiator having a maximum absorption wavelength in an ultraviolet region different from that of the first photoinitiator as the photoinitiator, Content of the said photoinitiator is 1.5 mass parts or more with respect to 100 mass parts of total amounts of the said (meth)acrylic-type resin. [2] The dicing die bonding integrated film according to [1], wherein The aforementioned functional group is at least one selected from acryl and methacryl. [3] The dicing die-bonding integrated film according to [1] or [2], wherein At least a part of the (meth)acrylic resin is crosslinked by a crosslinking agent. [4] A method of manufacturing a semiconductor device, comprising: (A) A step of preparing the dicing die-bonding integrated film described in any one of [1] to [3]; (B) Steps of dicing wafers; (C) A step of attaching the aforementioned wafer to the aforementioned adhesive layer of the aforementioned diced die-bonding integrated film; (D) The step of expanding the aforementioned substrate layer under cooling conditions, thereby obtaining a wafer with an adhesive sheet formed by singulating the aforementioned wafer and the aforementioned adhesive layer; (E) A step of irradiating ultraviolet rays to the adhesive layer, thereby reducing the adhesive force of the adhesive layer relative to the wafer with the adhesive sheet attached; (F) the step of picking up the aforementioned wafer with the adhesive sheet attached from the aforementioned adhesive layer; and (G) A step of mounting the picked-up wafer with the adhesive sheet on a substrate or other wafers. [Invention effect]

According to the present invention, there is provided a dicing die-bonding integrated film capable of making the adhesive layer adhere to the adhesive layer when the adhesive layer is irradiated with ultraviolet rays even when the adhesive layer is in contact with oxygen. The force is fully reduced. Also, according to the present invention, there is provided a method of manufacturing a semiconductor device using such a diced die-bonding integrated film.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments.

In this specification, the numerical range represented by "-" shows the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In the numerical ranges described step by step in this specification, the upper limit or lower limit of the numerical range of a certain step can be replaced by the upper limit or lower limit of the numerical range of other steps. In addition, in the numerical range described in this specification, the upper limit or the lower limit of the numerical range may be replaced with the value shown in an Example. In addition, the upper limit and lower limit described separately can be combined arbitrarily. Moreover, in this specification, "(meth)acrylate" means at least one of acrylate and the corresponding methacrylate. The same applies to "(meth)acryl", "(meth)acrylic" and other similar expressions. Also, "(poly)" indicates the existence and non-existence of the prefix of "poly". Moreover, "A or B" should just include any one of A and B, and may include both. In addition, unless otherwise specified, materials exemplified below may be used alone or in combination of two or more. When there are a plurality of substances corresponding to each component in the composition, unless otherwise specified, the content of each component in the composition means the total amount of the plurality of substances present in the composition.

[Saw Die Bonding Integrated Film] FIG. 1( a ) is a plan view showing one embodiment of a dicing die-bonding integrated film, and FIG. 1( b ) is a schematic cross-sectional view along line B-B shown in FIG. 1( a ). The dicing die-bonding integrated film 10 (hereinafter, simply referred to as “the film 10 ” as the case may be) can be suitably used in the manufacturing process of a semiconductor device including the (A) step to (G) step.

The film 10 includes a substrate layer 1 , an adhesive layer 3 composed of an ultraviolet-curable adhesive, and an adhesive layer 5 in this order. In this embodiment, an example is shown in which a laminate of one adhesive layer 3 and adhesive layer 5 is formed on a square base material layer 1, but the base material layer 1 may have a predetermined length (for example, 100 m or more), and the laminates of the adhesive layer 3 and the adhesive layer 5 are arranged at predetermined intervals along the longitudinal direction thereof.

＜Adhesive layer＞ The adhesive layer 3 includes an ultraviolet curable adhesive layer composed of an ultraviolet curable adhesive. The ultraviolet curable adhesive includes a (meth)acrylic resin and a photopolymerization initiator. Regarding the (meth)acrylic resin, at least a part thereof can be crosslinked by a crosslinking agent. Hereinafter, components containing an ultraviolet curable adhesive will be described in detail.

((meth)acrylic resins with chain-polymerizable functional groups) The ultraviolet curable adhesive contains (meth)acrylic resin A. The functional group may be at least one selected from acryl and methacryl. Content of the functional group in (meth)acrylic resin A may be 0.1-1.2 mmol/g, 0.3-1.0 mmol/g, or 0.5-0.8 mmol/g, for example. When the content of the functional group is 0.1 mmol/g or more, the adhesive force can be appropriately reduced by irradiation of ultraviolet rays. On the other hand, if it is 1.2 mmol/g or less, excellent pick-up properties tend to be easily achieved.

The (meth)acrylic resin A can be obtained by making a (meth)acrylic resin (hereinafter sometimes referred to as It is "(meth)acrylic resin a".) It is obtained by reacting with the compound which introduce|transduces a functional group mentioned later. The (meth)acrylic resin A may also be referred to as a reaction product of the (meth)acrylic resin a and the functional group-introducing compound.

The (meth)acrylic resin a can be synthesized by a known method. Examples of synthesis methods include solution polymerization, suspension polymerization, emulsion polymerization, bulk polymerization, precipitation polymerization, gas phase polymerization, plasma polymerization, and supercritical polymerization. Also, as the type of polymerization reaction, other ATRP (atom transfer radical polymerization) such as radical polymerization, cationic polymerization, anionic polymerization, living radical polymerization, living cationic polymerization, living anionic polymerization, coordination polymerization, immortal polymerization, etc. Polymerization) and RAFT (Reversible Addition Fragmentation Chain Transfer Polymerization) and other methods. Among them, the synthesis by radical polymerization using the solution polymerization method not only has good economy, fast reaction rate, easy polymerization control, etc., but also has the advantages of being able to directly use the resin solution obtained by polymerization for compounding.

Herein, the synthesis method of (meth)acrylic resin a will be described in detail by taking the method of obtaining (meth)acrylic resin a by performing radical polymerization using a solution polymerization method as an example.

The monomer used for synthesizing the (meth)acrylic resin a is not particularly limited as long as it has one (meth)acryl group in one molecule. Specific examples thereof include methyl methacrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, Butoxyethyl (meth)acrylate, Isoamyl (meth)acrylate, Hexyl (meth)acrylate, 2-Ethylhexyl (meth)acrylate, Heptyl (meth)acrylate , Octylheptyl (meth)acrylate, Nonyl (meth)acrylate, Decyl (meth)acrylate, Undecyl (meth)acrylate, Lauryl (meth)acrylate, Decyl (meth)acrylate, Tridecyl(meth)acrylate, tetradecyl(meth)acrylate, pentadecyl(meth)acrylate, hexadecyl(meth)acrylate, octadecyl(meth)acrylate ) acrylate, behenyl (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, ethoxypolyethylene glycol (meth)acrylate, methoxypolypropylene glycol ( Aliphatic (meth)acrylates such as meth)acrylate, ethoxylated polypropylene glycol (meth)acrylate, mono(2-(meth)acryloxyethyl)succinate, etc.; cyclo(meth)acrylate ) pentyl acrylate, cyclohexyl (meth)acrylate, pentyl cyclo(meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (Meth)acrylates, mono(2-(meth)acryloxyethyl)tetrahydrophthalate, mono(2-(meth)acryloxyethyl)hexahydrophthalate Alicyclic (meth)acrylates such as dicarboxylates; benzyl (meth)acrylate, phenyl (meth)acrylate, o-biphenyl (meth)acrylate, 1-naphthyl (meth)acrylate base) acrylate, 2-naphthyl (meth)acrylate, phenoxyethyl (meth)acrylate, p-cumylphenoxyethyl (meth)acrylate, o-phenylphenoxyethyl 1-naphthyloxyethyl (meth)acrylate, 1-naphthyloxyethyl (meth)acrylate, 2-naphthyloxyethyl (meth)acrylate, phenoxy polyethylene glycol (meth)acrylate, Nonylphenoxy polyethylene glycol (meth)acrylate, phenoxy polypropylene glycol (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-hydroxy- 3-(o-phenylphenoxy)propyl (meth)acrylate, 2-hydroxy-3-(1-naphthyloxy)propyl (meth)acrylate, 2-hydroxy-3-(2- Aromatic (meth)acrylates such as naphthyloxy)propyl (meth)acrylate; 2-tetrahydrofurfuryl (meth)acrylate, N-(meth)acryloxyethylhexahydroortho Phthalimide, 2-(meth)acryloxyethyl-N-carbazole and other heterocyclic (meth)acrylates, such caprolactone modified products, ω-carboxy-polycaprolactone Ester Mono(meth)acrylate, Glycidyl(meth)acrylate, α-Ethylglycidyl(meth)acrylate, α-Propylglycidyl(meth)acrylate, α-Butylglycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 2-ethylglycidyl (meth)acrylate, 2-propylcyclopropyl Oxypropyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 3,4-epoxyheptyl (meth)acrylate, α-ethyl-6,7- Epoxyheptyl (meth)acrylate, 3,4-epoxycyclohexylmethyl methacrylate, o-vinylbenzylglycidyl ether, m-vinylbenzylglycidyl ether, p- Vinyl benzyl glycidyl ether and other compounds with ethylenically unsaturated groups and epoxy groups; (2-ethyl-2-oxetanyl) methyl methacrylate, (2-methyl- 2-oxetanyl)methyl methacrylate, 2-(2-ethyl-2-oxetanyl)ethyl (meth)acrylate, 2-(2-methyl-2 -oxetanyl)ethyl (meth)acrylate, 3-(2-ethyl-2-oxetanyl)propyl (meth)acrylate, 3-(2-methyl - Compounds with ethylenically unsaturated groups and oxetane groups such as 2-oxetanyl)propyl (meth)acrylate; 2-(meth)acryloxyethyl isocyanate, etc. Compounds with unsaturated groups and isocyanate groups; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxy (meth)butyl acrylate, 3-chloro-2 -Compounds with ethylenically unsaturated groups and hydroxyl groups, such as hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, etc. The target (meth)acrylic resin a can be obtained by combining these suitably.

The (meth)acrylic resin a has at least one functional group selected from a hydroxyl group, a glycidyl group (epoxy group), an amine group, and the like as a reaction point for a functional group-introducing compound or a crosslinking agent to be described later. Examples of monomers used to synthesize (meth)acrylic resin a having a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4- Butyl hydroxy(meth)acrylate, 3-chloro-2-hydroxypropyl(meth)acrylate, 2-hydroxy(meth)butyl acrylate, etc. Compounds having ethylenically unsaturated groups and hydroxyl groups, etc.

Examples of monomers used to synthesize (meth)acrylic resin a having a glycidyl group include glycidyl (meth)acrylate, α-ethylglycidyl (meth)acrylate , α-propylglycidyl (meth)acrylate, α-butylglycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 2-ethyl Glycidyl (meth)acrylate, 2-propylglycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 3,4-epoxyheptyl (meth)acrylate, α-ethyl-6,7-epoxyheptyl (meth)acrylate, 3,4-epoxycyclohexyl methyl methacrylate, o-vinylbenzyl epoxy Propyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether and other compounds with ethylenically unsaturated groups and epoxy groups.

(Meth)acrylic resin A contains chain-polymerizable functional groups. The chain-polymerizable functional group is, for example, at least one selected from acryl and methacryl. The chain-polymerizable functional group, for example, can be obtained by making a (meth)acrylic system having at least one functional group selected from hydroxyl, glycidyl (epoxy) and amine groups synthesized as described above. Resin a is introduced into this (meth)acrylic resin a by reacting with the following compound (functional group introducing compound). Specific examples of compounds introducing functional groups include: 2-methacryloxyethyl isocyanate, α,α-dimethyl-4-isopropenylbenzyl isocyanate, allyl isocyanate, 1, 1-(Bisacryloxymethyl)ethyl isocyanate; by reacting a diisocyanate compound or polyisocyanate compound with hydroxyethyl(meth)acrylate or 4-hydroxybutylethyl(meth)acrylate Acryl monoisocyanate compound obtained by reaction; acryl monoisocyanate compound obtained by reacting diisocyanate compound or polyisocyanate compound, polyol compound, hydroxyethyl (meth)acrylate, etc. Among them, the compound introducing the functional group may be 2-methacryloxyethyl isocyanate.

The (meth)acrylic resin A may mainly have at least one functional group selected from hydroxyl, glycidyl (epoxy), amine, etc. crosslinking. That is, at least a part of (meth)acrylic resin A can be crosslinked by a crosslinking agent. The ultraviolet curable adhesive may contain (meth)acrylic resin A which has chain-polymerizable functional groups and is crosslinked by a crosslinking agent.

The crosslinking agent is used for the purpose of controlling the storage modulus and/or adhesiveness of the adhesive layer, for example. As long as the crosslinking agent is a compound having two or more functional groups in one molecule, the functional groups can be combined with the hydroxyl group, glycidyl group, amino group, etc. of the (meth)acrylic resin A. At least one functional group reacts. Examples of the bond formed by the reaction between the (meth)acrylic resin A and the crosslinking agent include an ester bond, an ether bond, an amide bond, an imide bond, a urethane bond, and a urea bond. keys etc.

The crosslinking agent may be, for example, a polyfunctional isocyanate having two or more isocyanate groups in one molecule. When such polyfunctional isocyanate is used, it can easily react with the hydroxyl group, glycidyl group, amino group, etc. which (meth)acrylic-type resin A has, and can form a strong crosslinked structure.

Examples of polyfunctional isocyanates having two or more isocyanate groups in one molecule include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3-xylene diisocyanate, 1,4 -Xylene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, Isocyanate compounds such as isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine isocyanate, and the like.

The crosslinking agent may be a reactant (isocyanate group-containing oligomer) of a polyfunctional isocyanate and a polyol having two or more hydroxyl groups in one molecule. Examples of polyhydric alcohols having two or more hydroxyl groups in one molecule include ethylene glycol, propylene glycol, butanediol, 1,6-hexanediol, 1,8-octanediol, 1,9- Nonanediol, 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, glycerin, trimethylolpropane, neopentyl glycol, dipenteopentyl glycol , 1,4-cyclohexanediol, 1,3-cyclohexanediol, etc.

In these, the crosslinking agent may be a reactant of a polyfunctional isocyanate having 2 or more isocyanate groups in one molecule and a polyol having 3 or more hydroxyl groups in one molecule (isocyanate group-containing oligomer ). By using such an isocyanate group-containing oligomer as a crosslinking agent, the adhesive layer 3 forms a dense crosslinked structure, thereby tending to suppress adhesion of the adhesive to the adhesive layer 5 in the pickup step.

The content of the crosslinking agent when reacting the (meth)acrylic resin A with the crosslinking agent can be appropriately set in accordance with the cohesive force, elongation at break, adhesiveness with the adhesive layer, etc. obtained for the adhesive layer. Specifically, the content of the crosslinking agent may be, for example, 0.1 to 10 parts by mass, 0.2 to 7 parts by mass, or 0.3 to 5 parts by mass with respect to 100 parts by mass of the total amount of the (meth)acrylic resin A. If the content of the crosslinking agent is within this range, the characteristics required for the adhesive layer in the dicing step and the characteristics required for the adhesive layer in the die bonding step can be well balanced, and excellent pickup.

When the content of the crosslinking agent is 0.1 parts by mass or more with respect to 100 parts by mass of the total amount of the (meth)acrylic resin A, it is difficult to make the formation of the crosslinked structure insufficient, and it is sufficiently reduced in the pick-up step. The interface adhesion of the adhesive layer is not easy to produce poor tendency when picking up. On the other hand, when the content of the crosslinking agent is 10 parts by mass or less with respect to 100 parts by mass of the total amount of (meth)acrylic resin A, it is difficult to make the adhesive layer too hard, and it is difficult to peel off the wafer in the expansion step. tendency.

The (meth)acrylic resin A may be the main component of the ultraviolet curable adhesive (or the adhesive layer 3 ). The content of (meth)acrylic resin A may be 80 mass % or more, 85 mass % or more, 90 mass % or more, or 95 mass % or more based on the total amount of the ultraviolet curable adhesive (or adhesive layer 3 ). Or more than 98% by mass.

(photopolymerization initiator) The ultraviolet curable adhesive includes at least a first photoinitiator and a second photoinitiator having a different maximum absorption wavelength in the ultraviolet range from the first photoinitiator as a photoinitiator.

In this specification, the "ultraviolet region" means the region with a wavelength of 220 to 400 nm, and the "maximum absorption wavelength" means that in the spectral absorption spectrum, when there are multiple absorption peaks (absorption maximums), the largest peak is displayed among them. Intensity (absorbance) is the peak intensity of the absorption peak. The spectral absorption spectrum can be measured, for example, by the method described in the Examples.

The ultraviolet curable adhesive may contain two or more photopolymerization initiators having different maximum absorption wavelengths in the ultraviolet region, may contain three or more types, or may contain four or more types. The ultraviolet curable adhesive may further contain a third photopolymerization initiator having a maximum absorption wavelength in the ultraviolet region different from that of the first photopolymerization initiator and the second photopolymerization initiator, as a photopolymerization initiator, in addition to the third photopolymerization initiator. In addition to the polymerization initiator, you may further contain the 4th photoinitiator which differs from the 1st photoinitiator, the 2nd photoinitiator, and the 3rd photoinitiator in the maximum absorption wavelength of an ultraviolet region.

The photopolymerization initiator is not particularly limited as long as it is an active species capable of chain polymerization by irradiating ultraviolet rays. As a photoinitiator, a photoradical polymerization initiator etc. are mentioned, for example. Wherein, the chain-polymerizable active species refers to one that initiates a polymerization reaction by reacting with a chain-polymerizable functional group.

Examples of photoradical polymerization initiators include benzoin ketals such as 2,2-dimethoxy-1,2-diphenylethan-1-one; 1-hydroxycyclohexylphenyl Methanone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1- α-hydroxy ketones such as propan-1-one; 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 1,2-methyl-1 -[4-(methylthio)phenyl]-2-morpholinopropan-1-one and other α-amino ketones; 1-[4-(phenylthio)phenyl]-1,2-octanedi Keto-2-(benzoyl)oxime and other oxime esters; bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, bis(2,6-dimethoxybenzoyl) )-2,4,4-trimethylpentylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and other phosphine oxides; 2-(o-chlorophenyl)-4,5 -Diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenyl imidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer 2,4,5-triaryl imidazole dimer; benzophenone, N,N,N',N'-tetramethyl-4,4'-diaminobenzophenone, N,N, Benzophenone compounds such as N',N'-tetraethyl-4,4'-diaminobenzophenone and 4-methoxy-4'-dimethylaminobenzophenone; 2-ethyl Anthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzoanthraquinone, 2,3-benzoanthraquinone, 2-phenylanthraquinone, 2,3-diphenyl Baseanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthrenequinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethyl Quinone compounds such as anthraquinone; benzoin ethers such as benzoin methyl ether, benzoin ethyl ether, and benzoin phenyl ether; benzoin compounds such as benzoin, methyl benzoin, and ethyl benzoin; benzyl compounds such as benzyl dimethyl ketal; 9-benzoacridine , 1,7-bis(9,9'-acridylheptane) and other acridine compounds; N-phenylglycine, coumarin, etc.

The 1st photoinitiator and the 2nd photoinitiator can select any one which differs in the maximum absorption wavelength of an ultraviolet region from these photoinitiators. The combination of the first photopolymerization initiator and the second photopolymerization initiator can be, for example, a photopolymerization initiator having a maximum absorption wavelength in the region of 220 nm or more and less than 300 nm, and a photopolymerization initiator in the region of 300 nm or more and 400 nm or less. A combination of photopolymerization initiators having a maximum absorption wavelength.

The content of the photopolymerization initiator (the total amount of the first photopolymerization initiator, the second photopolymerization initiator, etc.) in the ultraviolet curable adhesive relative to the total amount of (meth)acrylic resin A 100 mass The part is 1.5 parts by mass or more, and may be 1.7 parts by mass or more, 2.0 parts by mass or more, 2.3 parts by mass or more, or 2.5 parts by mass or more. If the content of the photopolymerization initiator is within this range, even when the adhesive layer is in contact with oxygen, the adhesive force of the adhesive layer with respect to the adhesive layer can be made sufficient after irradiating the adhesive layer with ultraviolet rays. It tends to be less likely to cause pick-up failure. The content of the photopolymerization initiator in the ultraviolet curable adhesive may be 10 parts by mass or less, 7 parts by mass or less, or 5 parts by mass or less with respect to 100 parts by mass of the total amount of (meth)acrylic resin A. When content of a photoinitiator exists in such a range, it exists in the tendency which can prevent the contamination (transfer of a photoinitiator to an adhesive layer) to an adhesive layer.

UV-curable adhesives may contain other ingredients. As other components, for example, resins other than (meth)acrylic resins (acrylic monomers or oligomers, urethane monomers or oligomers, etc.) , Adhesive imparting agent (tackifier, etc.), antistatic imparting agent, filler (organic filler, inorganic filler, etc.), etc. From the viewpoint of easily obtaining the effect exerted by the present invention, it is preferable that the ultraviolet curable adhesive does not contain a sensitizer.

The ultraviolet curable adhesive layer included in the adhesive layer 3 can be provided in contact with the adhesive layer 5 . The adhesive layer 3 may be a single-layer structure composed of a UV-curable adhesive layer (ie, composed of a UV-curable adhesive). On the other hand, as long as the adhesive layer 3 is provided so that the ultraviolet curable adhesive layer is in contact with the adhesive layer 5, it may be composed of an ultraviolet curable adhesive layer and one or more layers other than the ultraviolet curable adhesive layer. The multi-layer structure. The layer other than the ultraviolet curable adhesive layer may be a layer composed of an ultraviolet non-curable adhesive, or an ultraviolet curable adhesive different from the ultraviolet curable adhesive constituting the ultraviolet curable adhesive layer (hereinafter referred to as Sometimes referred to as "other UV-curable adhesives".) The composition layer. As the ultraviolet non-curable adhesive and other ultraviolet curable adhesives, adhesives commonly used in this field can be used. Other UV-curable adhesives can be included in the (meth)acrylic resin A described above (including at least a part of the (meth)acrylic resin A crosslinked by a crosslinking agent), photopolymerization initiators, etc. Those who are not included may also be those who are not included.

The thickness of the adhesive layer 3 (or ultraviolet curable adhesive layer) can be appropriately set according to the conditions (temperature, tension, etc.) 15 μm. If the thickness of the adhesive layer 3 is 1 μm or more, the adhesiveness is less likely to become insufficient, and if it is 100 μm or less, the kerf width becomes wider during expansion (no stress relaxation occurs when the pin is pushed up), and pick-up becomes less likely. Inadequate tendency.

In the case where the adhesive layer 3 is a single-layer structure composed of an ultraviolet curable adhesive layer (the adhesive layer 3 is composed of an ultraviolet curable adhesive), the adhesive layer 3 is formed on the base material layer 1 . As a method for forming the adhesive layer 3 , known methods can be employed. For example, a laminate of the substrate layer 1 and the adhesive layer 3 can be formed by double-layer extrusion, or a varnish (varnish for forming an adhesive layer) of an ultraviolet-curable adhesive can be prepared and applied to the substrate. The adhesive layer 3 is formed on the surface of the layer 1, or on the film subjected to mold release treatment, and is transferred to the base material layer 1.

The varnish of the ultraviolet curable adhesive (varnish for forming an adhesive layer) may be an organic solvent capable of dissolving the (meth)acrylic resin A, a photopolymerization initiator, and a crosslinking agent, and may be volatilized by heating. Specific examples of organic solvents include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene, and p-cymene; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; methanol, ethanol, Isopropanol, butanol, ethylene glycol, propylene glycol and other alcohols; acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone and other ketones; methyl acetate, Ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, γ-butyrolactone and other esters; ethylene carbonate, propylidene carbonate and other carbonates; ethylene glycol monomethyl ether, ethylene glycol mono Diethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethyl ether Glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether and other polyol alkyl ethers; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether ester, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, etc. Alcohol alkyl ether acetate; Amides such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, etc.

Among them, from the viewpoint of solubility and boiling point, the organic solvent can be selected from, for example, toluene, methanol, ethanol, isopropanol, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methyl acetate, Ethyl acetate, butyl acetate, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether At least one selected from the group consisting of methyl ether acetate and N,N-dimethylacetamide. The solid content concentration of the varnish is usually 10 to 60% by mass.

The adhesive force of the adhesive layer 3 (or ultraviolet curable adhesive layer) with respect to the adhesive layer 5 may be 6 N/25 mm or more, 6.5 N/25 mm or more, or 7 N/25 mm or more. The adhesive force is the 30° peel strength measured under the conditions of a peel angle of 30° and a peel speed of 600mm/min at a temperature of 23°C. Fig. 2 is a cross-sectional view schematically showing a state of measuring the 30° peel strength of the adhesive layer with respect to the adhesive layer. As shown in FIG. 2 , the 30° peel strength of the adhesive layer 3 was measured with the adhesive layer 5 of the measurement sample (width 25 mm×length 100 mm) fixed on the support plate 80 . If the adhesive force (30° peel strength) of the adhesive layer 3 relative to the adhesive layer 5 is in this range, it is possible to pick up the wafer with the adhesive sheet attached from the adhesive layer (in step (F) Before), the tendency of peeling between the end of the wafer with the adhesive sheet and the adhesive layer is suppressed. The adhesive force of the adhesive layer 3 with respect to the adhesive layer 5 can be 15 N/25 mm or less, 13 N/25 mm or less, or 12 N/25 mm or less, for example.

The lower the adhesive force of the adhesive layer 3 with respect to the adhesive layer 5 becomes, the easier it is to pick up the wafer with the adhesive sheet from the adhesive layer (before (F) step). The tendency to delaminate between the end of the chip and the adhesive layer. Therefore, it can be said that the lower the adhesive force of the adhesive layer 3 with respect to the adhesive layer 5 is, the easier it is to exhibit the effect of the configuration of the present invention.

After irradiating the adhesive layer 3 with ultraviolet rays (main wavelength: 365nm) with an illuminance of 70mW/cm ² and an irradiation dose of 150mJ/cm ² , the relative adhesive strength of the adhesive layer 3 (or UV-curable adhesive layer) after irradiation with ultraviolet rays The adhesion of layer 5 may be 1.2 N/25mm or less, 1.0 N/25mm or less, or 0.9 N/25mm or less. When the adhesive force with respect to the adhesive layer 5 of the adhesive layer 3 after ultraviolet-ray irradiation exists in this range, excellent pick-up property can be realizable. The adhesive force of the adhesive layer 3 after ultraviolet irradiation to the adhesive layer 5 may be 0.3 N/25 mm or more, 0.4 N/25 mm or more, or 0.5 N/25 mm or more. In addition, the adhesive force is the same as above, which is the 30° peel strength measured at a temperature of 23°C, a peel angle of 30° and a peel speed of 600mm/min (see Figure 2).

Adhesive layer 3 after irradiating ultraviolet rays (main wavelength: 365nm) after irradiating the adhesive layer 3 with an illumination intensity of 70mW/cm ² and an irradiation dose of 150mJ/cm ² (or ultraviolet curable adhesive) under the condition of exposure to oxygen layer) with respect to the adhesive layer 5 may be 4.0N/25mm or less, 3.8N/25mm or less, or 3.5N/25mm or less. When the adhesive force with respect to the adhesive layer 5 of the adhesive layer 3 after ultraviolet-ray irradiation exists in this range, excellent pick-up property can be realizable. The adhesive force of the adhesive layer 3 after ultraviolet irradiation to the adhesive layer 5 may be 0.5 N/25 mm or more, 1.0 N/25 mm or more, 2.0 N/25 mm or more, or 2.5 N/25 mm or more. In addition, the adhesive force is the same as above, which is the 30° peel strength measured at a temperature of 23°C, a peel angle of 30° and a peel speed of 600mm/min (see Figure 2).

In this embodiment, for example, by adjusting the content of chain-polymerizable functional groups in (meth)acrylic resin A (the content of functional group-introducing compounds), it can be used for crosslinking (meth)acrylic resins. The content of the crosslinking agent of resin A, etc., or, for example, by adding resins other than (meth)acrylic resins having chain-polymerizable functional groups (acrylic monomers or oligomers, urethane monomers, etc.) body or oligomer, etc.), adhesiveness imparting agent (tackifier, etc.) Adhesion of layer 5.

＜Substrate layer＞ A known polymer sheet or film can be used for the base material layer 1, and there is no particular limitation as long as it can perform the expansion step under low temperature conditions. Specific examples of the substrate layer 1 include crystalline polypropylene, amorphous polypropylene, high-density polyethylene, medium-density polyethylene, low-density polyethylene, ultra-low-density polyethylene, low-density linear polyethylene, polypropylene Polyolefins such as butene and polymethylpentene, ethylene-vinyl acetate copolymers, ionomer resins, ethylene-(meth)acrylic acid copolymers, ethylene-(meth)acrylate (random, alternating) copolymers ethylene-butene copolymer, ethylene-hexene copolymer, polyurethane, polyethylene terephthalate, polyethylene naphthalate and other polyesters, polycarbonate, polyamide Amine, polyetheretherketone, polyimide, polyetherimide, polyamide, wholly aromatic polyamide, polyphenylene sulfide, aramid (paper), glass, glass cloth, fluororesin, polyamide Vinyl chloride, polyvinylidene chloride, cellulose-based resin, silicone resin, or a mixture of these with a plasticizer, or a cured product crosslinked by electron beam irradiation.

The substrate layer 1 has a surface mainly composed of at least one resin selected from the group consisting of polyethylene, polypropylene, polyethylene-polypropylene random copolymer, and polyethylene-polypropylene block copolymer, and may be This surface is in contact with the adhesive layer 3 . These resins can also be good substrates from the viewpoints of properties such as Young's modulus, stress relaxation, and melting point, price, and recycling of waste after use. The substrate layer 1 may be a single layer, or may have a multi-layer structure obtained by laminating layers composed of different materials as required. From the viewpoint of controlling the adhesiveness with the adhesive layer 3, the surface of the substrate layer 1 may be subjected to surface roughening treatments such as matting treatment and corona treatment.

The thickness of the base layer 1 may be, for example, 10 to 200 μm or 20 to 170 μm.

＜Adhesive layer＞ For the adhesive layer 5 , an adhesive composition constituting a known die bonding film can be applied. Specifically, the adhesive composition constituting the adhesive layer 5 may include an epoxy resin, an epoxy resin curing agent, and a reactive group-containing (meth)acrylic acid copolymer. The adhesive composition including the adhesive layer 5 may further include a curing accelerator and a filler. According to the adhesive layer 5 containing these components, there is a tendency to have the following characteristics: the adhesiveness between the chip/substrate and between the chip/chip is excellent, and it can also impart electrode implantability, wire implantability, etc., In addition, in the die bonding step, it is possible to bond at a low temperature, to obtain excellent curing in a short time, and to have excellent reliability after molding with a sealant, etc.

Examples of epoxy resins include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, alicyclic epoxy resins, aliphatic chain epoxy resins, phenol Novolak-type epoxy resin, cresol novolac-type epoxy resin, bisphenol A novolac-type epoxy resin, bisphenol diglycidyl ether compound, naphthalene diol diglycidyl ether compound, phenolic diglycidyl Ether compounds, diglycidyl ether compounds of alcohols and such alkyl substituted products, halides, hydrogenated products and other difunctional epoxy resins, novolac epoxy resins, etc. In addition, other commonly known epoxy resins such as polyfunctional epoxy resins and heterocyclic ring-containing epoxy resins can be used. In addition, components other than the epoxy resin may be included as impurities within the range not impairing the properties.

Examples of epoxy resin curing agents include phenol resins obtained by reacting a phenol compound with a divalent linking group, ie, a xylene compound, in the absence of a catalyst or in the presence of an oxygen catalyst. Examples of the phenolic compound used in the production of phenol resins include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, p-ethylphenol, o-n-propylphenol, m-n-propyl Phenol, p-n-propylphenol, o-isopropylphenol, m-isopropylphenol, p-isopropylphenol, o-n-butylphenol, m-n-butylphenol, p-n-butylphenol, o-isobutylphenol, m-isobutylphenol, p-isobutylphenol, octylphenol, nonylphenol, 2,4-xylenol, 2,6-xylenol, 3,5-xylenol, 2,4,6- Trimethylphenol, resorcinol, catechol, hydroquinone, 4-methoxyphenol, o-phenylphenol, m-phenylphenol, p-phenylphenol, p-cyclohexylphenol, o-allylphenol , p-allylphenol, o-benzylphenol, p-benzylphenol, o-chlorophenol, p-chlorophenol, o-bromophenol, p-bromophenol, o-iodophenol, p-iodophenol, o-fluorophenol, m-fluorophenol, p- Fluorophenol, etc. As a xylene compound which is a divalent coupling group used in the production of a phenol resin, xylene dihalides, xylene diethylene glycol, and derivatives thereof shown below can be used. That is, specific examples of xylene compounds include α,α'-dichloro-p-xylene, α,α'-dichloro-m-xylene, α,α'-dichloro-o-xylene, α,α'-Dibromo-p-xylene, α,α'-Dibromo-m-xylene, α,α'-Dibromo-o-xylene, α,α'-Diiodo-p-xylene, α, α'-Diiodo-m-xylene, α,α'-Diiodo-o-xylene, α,α'-Dihydroxy-p-xylene, α,α'-Dihydroxy-m-xylene, α,α' -dihydroxy-o-xylene, α,α'-dimethoxy-p-xylene, α,α'-dimethoxy-m-xylene, α,α'-dimethoxy-o-xylene, α,α'-diethoxy-p-xylene, α,α'-diethoxy-m-xylene, α,α'-diethoxy-o-xylene, α,α'-di-n-xylene Propoxy-p-xylene, α,α'-di-n-propoxy-m-xylene, α,α'-di-n-propoxy-o-xylene, α,α'-diisopropoxy-p- Xylene, α,α'-Diisopropoxy-m-xylene, α,α'-Diisopropoxy-o-xylene, α,α'-Di-n-butoxy-p-xylene, α, α'-Di-n-butoxy-m-xylene, α,α'-Di-n-butoxy-o-xylene, α,α'-Diisobutoxy-p-xylene, α,α'-Diiso Butoxy-m-xylene, α,α'-diisobutoxy-o-xylene, α,α'-di-tert-butoxy-p-xylene, α,α'-di-tert-butoxy - m-xylene, α,α'-di-tert-butoxy-o-xylene, etc.

When reacting phenolic compounds with xylene compounds, inorganic acids such as hydrochloric acid, sulfuric acid, phosphoric acid, polyphosphoric acid; dimethyl sulfuric acid, diethyl sulfuric acid, p-toluenesulfonic acid, methanesulfonic acid, ethanesulfonic acid, etc. Organic carboxylic acids such as trifluoromethanesulfonic acid; superacids such as trifluoromethanesulfonic acid; strong acidic ion exchange resins such as alkanesulfonic acid ion exchange resins; Name: Nafion, Nafion, manufactured by Du Pont de Nemours, Inc., "Nafion" is a registered trademark); natural and synthetic zeolites; and acid catalysts such as activated clay (acid clay) The xylene compound as a raw material substantially disappeared, and it was made to react until the reaction composition became constant, and the phenol resin was obtained. The reaction time can be appropriately set according to the raw materials and the reaction temperature, for example, it can be set to about 1 to 15 hours, and can be determined while tracking the reaction composition by GPC (gel permeation chromatography) or the like.

The reactive group-containing (meth)acrylic copolymer may be, for example, an epoxy group-containing (meth)acrylic copolymer. The (meth)acrylic copolymer containing an epoxy group can be a copolymer obtained by using glycidyl (meth)acrylate as a raw material, and the amount of the glycidyl (meth)acrylate is used relative to The obtained copolymer becomes the quantity of 0.5-6 mass %. When the content of glycidyl (meth)acrylate is 0.5% by mass or more, it becomes easy to obtain high adhesive force, while on the other hand, when it is 6% by mass or less, gelation tends to be suppressed. The monomers constituting the remainder of the reactive group-containing (meth)acrylic acid copolymer can be, for example, methyl methacrylate and other alkyl (meth)acrylates having an alkyl group with 1 to 8 carbons, benzene Ethylene, acrylonitrile, etc. Among these, the monomer constituting the remainder of the reactive group-containing (meth)acrylic copolymer may be ethyl (meth)acrylate and/or butyl (meth)acrylate. The mixing ratio can be adjusted in consideration of Tg of the reactive group-containing (meth)acrylic copolymer. When Tg is -10 degreeC or more, it exists in the tendency which can suppress the viscosity of the adhesive bond layer 5 in a B-stage state from becoming too large, and it exists in the tendency which is excellent in handleability. In addition, the glass transition temperature (Tg) of the epoxy group-containing (meth)acrylic copolymer may be, for example, 30° C. or lower. The polymerization method is not particularly limited, and examples thereof include bead polymerization, solution polymerization, and the like. As a commercially available epoxy group containing (meth)acrylic copolymer, HTR-860P-3 (product name, the Nagase Chemtex Corporation make) is mentioned, for example.

From the viewpoint of adhesiveness and heat resistance, the weight average molecular weight of the epoxy group-containing (meth)acrylic copolymer may be 100,000 or more, or 300,000 to 3 million, or 500,000 to 2 million. When the weight average molecular weight is 3 million or less, the fall of the fillability between a wafer and the substrate which supports a wafer can be suppressed. The weight average molecular weight is a polystyrene-equivalent value based on a calibration curve of standard polystyrene by gel permeation chromatography (GPC).

Examples of the curing accelerator include tertiary amines, imidazoles, quaternary ammonium salts, and the like. Specific examples of curing accelerators include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2- Phenyl imidazolium trimellitate.

The filler may be an inorganic filler. Specific examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, and aluminum borate whiskers. , boron nitride, crystalline silicon dioxide, amorphous silicon dioxide.

The thickness of the adhesive layer 5 may be, for example, 1-300 μm, 5-150 μm, or 10-100 μm. When the thickness of the adhesive layer 5 is 1 μm or more, it tends to be more excellent in adhesiveness, while on the other hand, if it is 300 μm or less, it tends to be more excellent in splittability and pick-up property at the time of spreading. The thickness of the adhesive layer 5 may be, for example, 20 μm or more, 30 μm or more, or 40 μm or more, or may be 80 μm or less, 70 μm or less, or 60 μm or less. If the thickness of the adhesive layer 5 is 20 μm or more, there is a tendency that the difference between the shrinkage during the division step by cooling expansion and the shrinkage during the thermal shrinkage step becomes large, and the adhesive layer is picked up from the adhesive layer. Before the wafer with the adhesive sheet (before the step (F)), peeling becomes less likely to occur between the end of the wafer with the adhesive sheet attached and the adhesive layer. Therefore, the more the thickness of the adhesive layer 5 is 20 μm or more, the more easily the effect of the configuration of the present invention can be exhibited.

In addition, the adhesive layer 5 may not contain a thermosetting resin (epoxy resin and epoxy resin curing agent). For example, in the case where the adhesive layer 5 includes a reactive group-containing (meth)acrylic copolymer, the adhesive layer 5 may include a reactive group-containing (meth)acrylic copolymer, a curing accelerator, and a filler. By.

Regarding the adhesive layer 5, a varnish of the adhesive composition (varnish for forming an adhesive layer) can be prepared, and the adhesive layer can be formed by applying it on the surface of the adhesive layer 3 or on a film subjected to mold release treatment. 5, and attach it to the adhesive layer 3. The varnish of the adhesive composition (varnish for forming an adhesive layer) may be an organic solvent capable of dissolving components other than the filler and volatilized by heating. Specific examples of the organic solvent include the same ones as the organic solvent in the varnish of the ultraviolet curable adhesive.

[Manufacturing method of dicing die bonding integrated film] The film 10 can be produced, for example, by a method including: a step of preparing a laminate (cut film) including a substrate layer 1 and an ultraviolet-curable adhesive provided on the substrate layer 1. Adhesive layer 3; a step of preparing a die bonding film including an adhesive layer 5; a step of attaching the adhesive layer 5 in the die bonding film on the adhesive layer 3 of the dicing film.

[Semiconductor device and manufacturing method thereof] FIG. 3 is a schematic cross-sectional view of an embodiment of a semiconductor device. The semiconductor device 100 shown in FIG. 3 has: a substrate 70, four chips S1, S2, S3, and S4 stacked on the surface of the substrate 70, electrodes (not shown) on the surface of the substrate 70, and four chips S1 , S2, S3, S4 are electrically connected wires W1, W2, W3, W4, and a sealing layer 50 for sealing them.

The substrate 70 may be, for example, an organic substrate, or a metal substrate such as a lead frame. From the viewpoint of suppressing warpage of the semiconductor device 100, the thickness of the substrate 70 may be, for example, 70 to 140 μm, or may be 80 to 100 μm.

The four wafers S1, S2, S3, and S4 can be laminated via the cured product 5C of the adhesive tablet 5P. The shapes of the wafers S1 , S2 , S3 , and S4 in plan view are, for example, square or rectangular. The areas of the chips S1, S2, S3, and S4 may be 30-250 mm ² , or 40-200 mm ² or 50-150 mm ² . The length of one side of the wafers S1, S2, S3, and S4 is, for example, 6.0 mm or more, and may be 7.0 to 18 mm or 8.0 to 15 mm. In addition, the lengths of one side of the four chips S1, S2, S3, and S4 may be the same or different from each other. Also, the four chips S1, S2, S3, and S4 may be smaller in size. That is, the areas of the chips S1 , S2 , S3 , and S4 can be, for example, less than 30 mm ² , or can be 0.1-20 mm ² or 1-15 mm ² .

The thickness of the wafers S1, S2, S3, and S4 is, for example, 10 to 200 μm, or may be 20 to 100 μm. In addition, the thicknesses of the four chips S1, S2, S3, and S4 may be the same or different from each other. Also, the thickness of the wafer may be, for example, 50 μm or less, 40 μm or less, 30 μm or less, or 20 μm or less, or may be 10 μm or more or 15 μm or more. The thinner the wafer is, the more likely it is to cause warping of the wafer, and before the wafer with the adhesive sheet is picked up from the adhesive layer (before step (F)), it is easier to remove the wafer with the adhesive sheet attached. The tendency to delaminate between the end of the wafer and the adhesive layer. Therefore, the thinner the wafer is, the more easily the effect of the configuration of the present invention can be exhibited.

The manufacturing method of the semiconductor device 100 includes the following steps. (A) Step of preparing the above-mentioned dicing die bonding integrated film (preparation step) (B) Step of dicing wafer (dicing step) (C) Step of attaching the aforementioned wafer to the aforementioned adhesive layer of the aforementioned diced die-bonding integrated film (wafer attaching step) (D) A step of obtaining a wafer with an adhesive sheet by expanding the substrate layer under cooling conditions and obtaining a wafer with an adhesive layer singulated (cooling expansion step) (E) A step of reducing the adhesion of the adhesive layer to the wafer with the adhesive sheet attached by irradiating the adhesive layer with ultraviolet rays (ultraviolet irradiation step) (F) Step of picking up the wafer with the adhesive sheet attached from the adhesive layer (pick-up step) (G) The step of mounting the picked-up wafer with the adhesive sheet on the substrate or other wafers (mounting step)

An example of a method for producing the wafer 8 with an adhesive sheet will be described with reference to FIGS. 4 and 5 . First, the above-mentioned film 10 is prepared ((A) step (preparation step)).

Next, a protective film (sometimes called "BG tape") is pasted on the circuit surface Wa of the wafer W, and a laser is irradiated on the wafer W to form a plurality of planned dicing lines L ((B) step ( cutting step), see Figure 4(a)). Call it stealth cutting. Stealth dicing can be preferably used for thin wafers W (for example, 100 μm or less). Thereafter, the wafer W may be subjected to a back grinding process for adjusting the thickness of the wafer W and a polishing process for polishing the wafer W as necessary. In addition, although stealth dicing by laser is described here, wafer W may be diced stealthly by a blade instead of stealth dicing. This is sometimes called a stealth cut cut. Stealth dicing means that the wafer W is not diced but a cut corresponding to the predetermined dicing line L of the wafer W is formed.

Next, as shown in FIG. 4( a ), the back surface Wb of the wafer W is attached to the adhesive layer 5 of the film 10 ((B) step (wafer attaching step)). At this time, the dicing ring DR may be attached to the adhesive layer 3 .

Next, as shown in FIG. 4( b ), the wafer W and the adhesive layer 5 are separated into individual pieces by cooling and spreading at a temperature of -15 to 0° C. (step (D) (cooling and spreading step)). That is, as shown in FIG. 4( b ), tension is applied to the base material layer 1 by pushing up the inner region 1 a of the dicing ring DR in the base material layer 1 by the ring Ra. Thereby, the wafer W is divided along the predetermined cutting line L, and the adhesive layer 5 is divided by the adhesive sheet 5P, and a plurality of wafers 8 with adhesive sheets are obtained on the surface of the adhesive layer 3 . The wafer 8 with an adhesive sheet is composed of a wafer S and an adhesive sheet 5P.

Next, by heating the inner region 1 a of the dicing ring DR in the base material layer 1 , the inner region 1 a is shrunk (thermally shrunk). FIG. 5( a ) is a cross-sectional view schematically showing a state in which the inner region 1 a is heated by blowing air from the heater H. As shown in FIG. By shrinking the inner region 1a into a ring shape and applying tension to the base material layer 1, the distance between adjacent wafers 8 with adhesive sheets can be increased. Thereby, the occurrence of a pickup error can be further suppressed, and the visibility of the adhesive sheet-attached wafer 8 in the pickup step can be improved.

Next, as shown in FIG. 5( b ), the adhesive force of the adhesive layer 3 is lowered by irradiating ultraviolet rays ((E) step (ultraviolet irradiation step)). The ultraviolet irradiation lamp is not particularly limited, for example, a metal halide lamp, a high pressure sodium lamp, a UV-LED lamp, etc. can be used. The illuminance of ultraviolet light on the adhesive layer 3 may be, for example, 1 to 1000 mW/cm ² , 10 to 900 mW/cm ² , or 30 to 800 mW/cm ² . The irradiation amount of ultraviolet rays to the adhesive layer 3 is, for example, 10-3000 mJ/cm ² , and may be 50-2500 mJ/cm ² or 100-2000 mJ/cm ² . Thereafter, as shown in FIG. 5(c), the wafer 8 with the adhesive sheet is peeled off from the adhesive layer 3 by pushing up the wafer 8 with the adhesive sheet 42 with the push-up jig 42, and the wafer 8 with the adhesive sheet is peeled off from the adhesive layer 3, and The chuck 44 attracts and picks up the wafer 8 with the adhesive tablet attached ((F) step (pick-up step)).

The wafer 8 with the adhesive sheet is conveyed to a semiconductor device assembly device (not shown), and is pressure-bonded to a circuit board or the like ((G) step (mounting step)). As shown in FIG. 6( a ), the wafer S1 (wafer S) of the first stage is pressure-bonded to a predetermined position of the substrate 70 via the adhesive sheet 5P. Next, the adhesive sheet 5P is cured by heating (die bonding step). Thereby, adhesive sheet 5P becomes hardened|cured material 5C by hardening. From the viewpoint of reducing voids, the curing treatment of the adhesive tablet 5P may be performed under a pressurized environment.

In the same manner as the wafer S1 is mounted on the substrate 70 , the wafer S2 of the second stage is mounted on the surface of the wafer S1 . In addition, the structure 60 shown in FIG. 6( b ) was produced by mounting the chips S3 and S4 of the third stage and the fourth stage. After electrically connecting the chips S1, S2, S3, S4 and the substrate 70 with wires W1, W2, W3, and W4, the sealing layer 50 for sealing the semiconductor device and the wires can be formed, and by sealing the semiconductor device and wires to fabricate the semiconductor device 100 shown in FIG. 3 . [Example]

Hereinafter, although this invention is demonstrated concretely based on an Example, this invention is not limited to these Examples. In addition, unless otherwise specified, reagents (commercially available) were used for all drugs.

<Example 1> [Synthesis of (meth)acrylic resin] Add the following components to a 2000mL flask equipped with a three-in-one motor, a stirring paddle, and a nitrogen inlet tube. ・Ethyl acetate (solvent): 635 parts by mass 2-Ethylhexyl acrylate: 395 parts by mass 2-Hydroxyethyl acrylate: 100 parts by mass ・Methacrylic acid: 5 parts by mass Azobisisobutyronitrile: 0.08 parts by mass

After stirring the contents until they were sufficiently uniform, bubbling was performed at a flow rate of 500 mL/min for 60 minutes to degas the dissolved oxygen in the system. The temperature was raised to 78° C. over 1 hour, and polymerization was carried out for 6 hours after the temperature was raised. Next, the reaction solution was transferred to a pressure vessel with a capacity of 2000 mL equipped with a three-in-one motor, a stirring paddle and a nitrogen inlet pipe, heated at 120° C. and 0.28 Mpa for 4.5 hours, and then cooled to room temperature ( 25°C, the same below).

Next, 490 parts by mass of ethyl acetate was added and stirred to dilute the contents. To this was added 0.10 parts by mass of dioctyltin dilaurate as a urethanization catalyst, and then 2-methacryloxyethyl isocyanate (manufactured by SHOWA DENKO K.K., Karenz MOI (product name)) 96.0 Parts by mass were reacted at 70° C. for 6 hours, and then cooled to room temperature. Next, ethyl acetate was further added to adjust the content of non-volatile components in the (meth)acrylic resin solution to 35% by mass, and the (meth)acrylic resin containing a chain-polymerizable functional group in Production Example 1 was obtained. Solution of resin (A-1).

The solution containing the (meth)acrylic resin (A-1) obtained above was vacuum-dried overnight at 60 degreeC. The solid content thus obtained was subjected to elemental analysis by a fully automatic elemental analysis device (manufactured by Elementar, product name: vario EL), and the nitrogen content was calculated to be derived from the introduced 2-methacryloxyethyl isocyanate. As a result, the content of the functional group was 1.10 mmol/g.

Moreover, the polystyrene conversion weight average molecular weight of (meth)acrylic-type resin (A-1) was calculated|required using the following apparatus. That is, SD-8022/DP-8020/RI-8020 manufactured by TOSOH CORPORATION was used, Gelpack GL-A150-S/GL-A160-S manufactured by Showa Denko Materials Co., Ltd. was used on the column, and the eluent GPC measurements were performed using tetrahydrofuran. As a result, the weight average molecular weight in terms of polystyrene was 400,000. The hydroxyl value and acid value measured according to the method described in JIS K0070 were 22.8 mgKOH/g and 6.5 mgKOH/g.

<Example 1> [Manufacturing of dicing film (adhesive layer)] A varnish (varnish for forming an adhesive layer) of an ultraviolet curable adhesive was prepared by mixing the following components (see Table 1). The quantity of ethyl acetate (solvent) was adjusted so that the total solid content of a varnish might become 25 mass %. ・The solution containing the (meth)acrylic resin (A-1) of Production Example 1: 100 parts by mass (solid content) Photopolymerization initiator (B-1) 1-hydroxycyclohexyl phenyl ketone (manufactured by IGM RESINS B.V., Omnirad 184, "Omnirad" is a registered trademark, maximum absorption wavelength of 220 to 400 nm: 243 nm): 2.0 mass share ·Photopolymerization initiator (B-2) phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (manufactured by IGM RESINS B.V., Omnirad 819, "Omnirad" is a registered trademark, 220～ Maximum absorption wavelength at 400nm: 380nm): 0.2 parts by mass ・Photopolymerization initiator (B-3) 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butane-1 - Ketone (manufactured by IGM RESINS B.V., Omnirad 379EG, "Omnirad" is a registered trademark, maximum absorption wavelength of 220 to 400 nm: 320 nm): 0.5 parts by mass ・Photopolymerization initiator (B-4) 2,2-dimethoxy-1,2-diphenylethan-1-one (manufactured by IGM RESINS B.V., Omnirad 651, "Omnirad" is a registered trademark, Maximum absorption wavelength of 220-400nm: 252nm): 0.4 parts by mass ・Sensitizer (b-1) 2,4-diethylthio-Kushin-9-one (Tokyo Chemical Industry Co., Ltd.): 0 parts by mass ・Crosslinking agent (C-1) hexaethylene diisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., Coronate HL, solid content: 75%): 4.0 parts by mass (solid content) · Ethyl acetate (solvent)

In addition, the maximum absorption wavelength of the photopolymerization initiator used a visible-ultraviolet spectrophotometer U-3010 (manufactured by Hitachi High-Tech Science Corporation), and a solution in which 0.001% by mass of the photopolymerization initiator was dissolved in acetonitrile was used as a sample, It obtains by measuring the absorbance of the photopolymerization initiator in the wavelength range of 220 to 400 nm.

A polyethylene terephthalate film (450 mm in width, 500 mm in length, and 38 μm in thickness) in which one surface was subjected to mold release treatment was prepared. On the surface subjected to the release treatment, a varnish of an ultraviolet curable adhesive was applied using an applicator, and then dried at 80° C. for 3 minutes. Thus, a laminate (cut film) composed of a polyethylene terephthalate film and an adhesive layer having a thickness of 10 μm formed thereon was obtained.

A polyolefin film (450 mm in width, 500 mm in length, and 90 μm in thickness) having one surface subjected to corona treatment was prepared. The corona-treated surface and the adhesive layer of the above-mentioned laminate were bonded together at room temperature. Next, the adhesive layer was transferred to the polyolefin film (cover film) by pressing with a rubber roller. Thereafter, by standing at room temperature for 3 days, a dicing film with a cover film was obtained.

[Production of die bonding film (adhesive layer)] A varnish for forming an adhesive layer was prepared by mixing the following components. First, cyclohexanone (solvent) was added to a mixture containing the following components, stirred and mixed, and further mixed using a bead mill for 90 minutes. ・Epoxy resin (N-500P-10 (product name), manufactured by DIC CORPORATION, cresol novolac type epoxy resin, epoxy equivalent: 200, softening point: 85°C): 11.0 parts by mass ・Epoxy resin (EXA-830CRP (product name), manufactured by DIC CORPORATION, bisphenol F type epoxy resin, epoxy equivalent: 160, molecular weight: 1800, softening point: 85°C): 13.0 parts by mass ・Phenol resin (Millex XLC-LL (product name), manufactured by Mitsui Chemicals, Inc., phenol resin, hydroxyl equivalent: 175, water absorption: 1.8%, heating weight loss rate at 350°C: 4%): 19.0 parts by mass ・Silane coupling agent (NUC A-189 (product name) manufactured by NUC Corporation, γ-mercaptopropyltrimethoxysilane): 0.1 parts by mass ・Silane coupling agent (NUC A-1160 (product name), manufactured by ENEOS NUC Corporation, γ-ureidopropyltriethoxysilane): 0.2 parts by mass ・Filler (SC2050-HLG (product name), manufactured by ADMATECHS CO., LTD., silica, average particle size 0.500 μm): 39 parts by mass

After further adding the following components to the mixture obtained as described above, a varnish for forming an adhesive layer was obtained by steps of stirring and mixing and vacuum degassing. ・Acrylic copolymer containing epoxy group (HTR-860P-3 (product name), manufactured by Nagase Chemtex Corporation, weight average molecular weight: 800,000): 18 parts by mass · Curing accelerator (Curesol 2PZ-CN (product name), manufactured by SHIKOKU CHEMICALS CORPORATION, 1-cyanoethyl-2-phenylimidazole, "Curesol" is a registered trademark) 0.1 parts by mass

A polyethylene terephthalate film (thickness: 35 μm) was prepared, and one surface thereof was subjected to mold release treatment. After applying the varnish for forming an adhesive layer on the surface subjected to the mold release treatment using an applicator, it was heated and dried at 140° C. for 5 minutes. Thereby, a laminate (die-bonding film) composed of a polyethylene terephthalate film (carrier film) and an adhesive layer (B-stage state) having a thickness of 50 μm formed thereon was obtained.

[Manufacturing of dicing die bonding integrated film] The die-bonding film composed of the adhesive layer and the carrier film was cut into a circle with a diameter of 335 mm for each carrier film. On the diced die-bonding film, the dicing film from which the polyethylene terephthalate film was peeled was attached at room temperature, and then left to stand at room temperature for 1 day. Thereafter, the dicing film was cut into a circle having a diameter of 370 mm. In this way, a plurality of diced die-bonding integrated films of Example 1 used for various evaluation tests described later were obtained.

<Examples 2 to 7 and Comparative Examples 1 to 4> Except changing the composition of the adhesive layer of Example 1 in Table 1 to the composition of the adhesive layer of Examples 2 to 7 and Comparative Examples 1 to 4 in Table 1 and Table 2, the method was the same as that of Example 1. , A plurality of cut die bonding integrated films of Examples 2 to 7 and Comparative Examples 1 to 4 were respectively obtained.

[Evaluation Test] (1) Measurement of Adhesive Strength of Adhesive Layer to Adhesive (30° Peel Strength) The adhesion was evaluated by measuring the 30° peel strength. About the measurement sample of the adhesive layer before ultraviolet-ray irradiation, it obtained by cutting out the diced die-bonding integral type film with a width of 25 mm and a length of 100 mm. Regarding the measurement sample of the adhesive layer after irradiating ultraviolet rays, cut out a diced die-bonded integrated film with a width of 25 mm and a length of 100 mm, and irradiate it with an ultraviolet irradiation device (GS Yuasa Corporation, conveyor belt ultraviolet irradiation device CS60) Obtained with ultraviolet rays (main wavelength: 365nm) with an illuminance of 70mW/cm ² and an irradiation dose of 150mJ/cm ² . Using a tensile tester (manufactured by Shimadzu Corporation, Autograph "AGS-1000"), the amount of peel strength of the adhesive layer with respect to the adhesive layer was measured from each measurement sample. The measurement conditions were set at a peeling angle of 30° and a peeling speed of 600 mm/min. The storage of the sample and the measurement of the peel strength are carried out in an environment with a temperature of 23°C and a relative humidity of 60%. The results are shown in Table 1 and Table 2. In addition, the measurement upper limit of the peel strength is "20N/25mm", and ">20" in Table 1 and Table 2 indicates that the measurement upper limit was exceeded.

(2) The measurement of the adhesive force (30° peel strength) of the adhesive layer after irradiating the adhesive layer with ultraviolet rays under the condition of exposure to oxygen assumes that peeling occurs between the adhesive layer and the adhesive layer and the adhesive layer is separated from oxygen. In the case of contact, the adhesive layer was irradiated with ultraviolet rays under the condition of being exposed to oxygen in advance, and a dicing die bonding integrated film was produced using the adhesive layer irradiated with ultraviolet rays. Evaluation was performed by measuring the adhesive force at 30° peel strength of the adhesive layer after irradiating ultraviolet rays to the adhesive layer under the condition of contacting oxygen using the dicing die-bonding integrated film. The measurement sample was produced as follows. First, the polyethylene terephthalate film of the dicing film was peeled off, and the adhesive layer was exposed to oxygen, and then irradiated with an illuminance of 70mW/cm ² and Ultraviolet rays with an irradiation dose of 150mJ/cm ² (dominant wavelength: 365nm). Next, a dicing die-bonding integrated film for evaluation tests was obtained in the same manner as the production conditions of the above-mentioned dicing die-bonding integrated film. Next, a measurement sample was obtained by cutting out the obtained diced die-bonded integrated film with a width of 25 mm and a length of 100 mm. Using a tensile tester (manufactured by SHIMADZU CORPORATION, Autograph "AGS-1000"), the peeling strength of the adhesive layer after ultraviolet irradiation was measured under the condition that the adhesive layer of the measurement sample was exposed to oxygen. The measurement conditions were set at a peeling angle of 30° and a peeling speed of 600 mm/min. The storage of the sample and the measurement of the peel strength are carried out in an environment with a temperature of 23°C and a relative humidity of 60%. The results are shown in Table 1 and Table 2.

[Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Composition of the adhesive layer (parts by mass) (meth)acrylic resin (A-1) 100 100 100 100 100 100 100 Photopolymerization initiator (B-1) 2.0 2.0 - 2.0 3.0 0.4 0.6 (B-2) 0.2 0.2 0.2 - 0.2 0.2 0.2 (B-3) 0.5 0.5 0.5 0.5 0.5 0.5 0.5 (B-4) 0.4 - 1.0 0.4 0.6 2.0 3.0 Sensitizer (b-1) - - - - - - - crosslinking agent (C-1) 4.0 4.0 4.0 4.0 4.0 4.0 4.0 Adhesive force of the adhesive layer relative to the adhesive layer (N/25mm) Before UV irradiation 10.5 11.2 11.0 11.8 11.5 11.8 11.7 After UV irradiation 0.7 0.7 0.8 0.7 0.7 0.7 0.7 After UV irradiation (exposed to oxygen conditions) 3.3 3.3 3.6 3.3 3.1 3.2 3.1

[Table 2] Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Composition of the adhesive layer (parts by mass) (meth)acrylic resin (A-1) 100 100 100 100 Photopolymerization initiator (B-1) 1.0 1.0 - - (B-2) 0.2 0.2 - 2.0 (B-3) - - 0.5 - (B-4) - - - - Sensitizer (b-1) - - 0.1 - crosslinking agent (C-1) 4.0 1.0 4.0 4.0 Adhesive force of the adhesive layer relative to the adhesive layer (N/25mm) Before UV irradiation 12.0 >20 13.1 12.5 After UV irradiation 0.7 0.8 1.3 1.0 After UV irradiation (exposed to oxygen conditions) 4.2 6.3 6.8 6.9

As shown in Table 1 and Table 2, regarding the adhesive force (30° peel strength) of the adhesive layer after irradiating the adhesive layer under the condition of exposing the adhesive layer to oxygen (30° peel strength), the diced die bonding integrated films of Examples 1 to 7 Compared with the diced die-bonding integrated films of Comparative Examples 1 to 4, the adhesive force was sufficiently lowered. The diced die bonding integrated film of Comparative Example 3 contained a sensitizer in the adhesive layer, but the adhesive force was not sufficiently lowered. The diced die bonding integrated film of Comparative Example 4 included a predetermined amount of one type of photopolymerization initiator in the adhesive layer, but the adhesive force was not sufficiently lowered. From these results, it was confirmed that the diced die-bonding integrated film of the present invention can make the adhesive layer relatively The adhesive force of the adhesive layer is sufficiently reduced.

1: Substrate layer 3: Adhesive layer 5: Adhesive layer 8: Chip with adhesive sheet 10: Cutting Die Bonding Integrated Film W: Wafer

FIG. 1( a ) is a plan view showing one embodiment of a dicing die-bonding integrated film, and FIG. 1( b ) is a schematic cross-sectional view along line B-B shown in FIG. 1( a ). Fig. 2 is a cross-sectional view schematically showing a state of measuring the 30° peel strength of the adhesive layer with respect to the adhesive layer. FIG. 3 is a schematic cross-sectional view of an embodiment of a semiconductor device. 4(a) and 4(b) are cross-sectional views schematically showing the process of manufacturing a wafer with an adhesive tablet. Fig. 5(a), Fig. 5(b) and Fig. 5(c) are cross-sectional views schematically showing the process of manufacturing a wafer with an adhesive tablet. 6( a ) and FIG. 6( b ) are cross-sectional views schematically showing the process of manufacturing the semiconductor device shown in FIG. 3 .

1: Substrate layer

3: Adhesive layer

5: Adhesive layer

10: Cutting Die Bonding Integrated Film

W: Wafer

Claims (4)

A dicing die bonding integrated film, which sequentially includes a substrate layer, an adhesive layer including an ultraviolet curable adhesive layer composed of an ultraviolet curable adhesive, and an adhesive layer, wherein The aforementioned ultraviolet curable adhesive layer included in the adhesive layer is provided in contact with the aforementioned adhesive layer, The aforementioned ultraviolet curable adhesive includes a (meth)acrylic resin having chain-polymerizable functional groups and a photopolymerization initiator, The ultraviolet curable adhesive includes at least a first photoinitiator and a second photoinitiator having a maximum absorption wavelength in the ultraviolet region different from that of the first photoinitiator as the photoinitiator , Content of the said photoinitiator is 1.5 mass parts or more with respect to 100 mass parts of total amounts of the said (meth)acrylic-type resin. The dicing die bonding integrated film as claimed in claim 1, wherein The aforementioned functional group is at least one selected from acryl and methacryl. The dicing die bonding integrated film according to claim 1 or claim 2, wherein At least a part of the (meth)acrylic resin is crosslinked by a crosslinking agent. A method of manufacturing a semiconductor device, comprising: (A) the step of preparing the dicing die-bonding integrated film described in claim 1 or claim 2; (B) Steps of dicing wafers; (C) A step of attaching the aforementioned wafer to the aforementioned adhesive layer of the aforementioned diced die-bonding integrated film; (D) The step of expanding the aforementioned substrate layer under cooling conditions, thereby obtaining a wafer with an adhesive sheet formed by singulating the aforementioned wafer and the aforementioned adhesive layer; (E) A step of irradiating ultraviolet rays to the adhesive layer, thereby reducing the adhesive force of the adhesive layer relative to the wafer with the adhesive sheet attached; (F) the step of picking up the aforementioned wafer with the adhesive sheet attached from the aforementioned adhesive layer; and (G) A step of mounting the picked-up wafer with the adhesive sheet on a substrate or other wafers.

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