TW202249102A - 晶圓的處理方法 - Google Patents

晶圓的處理方法 Download PDF

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Publication number
TW202249102A
TW202249102A TW111111169A TW111111169A TW202249102A TW 202249102 A TW202249102 A TW 202249102A TW 111111169 A TW111111169 A TW 111111169A TW 111111169 A TW111111169 A TW 111111169A TW 202249102 A TW202249102 A TW 202249102A
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TW
Taiwan
Prior art keywords
wafer
temporary fixing
fixing material
support
processing method
Prior art date
Application number
TW111111169A
Other languages
English (en)
Chinese (zh)
Inventor
畦崇
春田佳一郎
谷本周穂
鈴木孝
木下仁
Original Assignee
日商三井化學東賽璐股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商三井化學東賽璐股份有限公司 filed Critical 日商三井化學東賽璐股份有限公司
Publication of TW202249102A publication Critical patent/TW202249102A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW111111169A 2021-03-26 2022-03-24 晶圓的處理方法 TW202249102A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-053518 2021-03-26
JP2021053518 2021-03-26

Publications (1)

Publication Number Publication Date
TW202249102A true TW202249102A (zh) 2022-12-16

Family

ID=83395832

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111111169A TW202249102A (zh) 2021-03-26 2022-03-24 晶圓的處理方法

Country Status (3)

Country Link
JP (1) JP7640675B2 (enrdf_load_stackoverflow)
TW (1) TW202249102A (enrdf_load_stackoverflow)
WO (1) WO2022202653A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118119507A (zh) * 2021-10-27 2024-05-31 东洋纺株式会社 附有保护膜的无机基板与耐热高分子膜的层叠体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9855734B2 (en) * 2012-08-10 2018-01-02 Sekisui Chemical Co., Ltd. Wafer processing method
JP2014072445A (ja) * 2012-09-28 2014-04-21 Nitto Denko Corp 半導体装置の製造方法
JP6502824B2 (ja) * 2015-10-19 2019-04-17 信越化学工業株式会社 ウエハ加工体、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
JP7045765B2 (ja) * 2018-04-16 2022-04-01 信越化学工業株式会社 回路付基板加工体及び回路付基板加工方法
JP7035915B2 (ja) * 2018-09-03 2022-03-15 信越化学工業株式会社 薄型ウエハの製造方法

Also Published As

Publication number Publication date
JPWO2022202653A1 (enrdf_load_stackoverflow) 2022-09-29
WO2022202653A1 (ja) 2022-09-29
JP7640675B2 (ja) 2025-03-05

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