TW202248646A - Testing fixture for testing semiconductor package with antenna element, testing system and testing method thereof - Google Patents

Abstract

The subject disclosure relates to a testing fixture for testing semiconductor package with antenna element and testing method thereof. The testing fixture comprises a base portion, a cover portion and a clamp. The cover portion is disposed on the base portion, and the cover portion and the base portion define an inner space. The cover portion includes an first portion and an second portion which are moveable related to each other. The clamp connects the first portion and the second portion and has a first end extending into the inner spacer. When the second portion moves related to the first portion, the first end of the clamp is moved in the inner space.

Description

Test fixture for testing semiconductor package structure with antenna element and test method thereof

The disclosure relates to a test fixture and a test method for testing a semiconductor package structure with an antenna element.

The OTA (Over-The-Air) test is a set of radiation performance tests developed by CTIA and GCF for radio mobile communication devices to verify the "radiated transmission power" and "radiated reception" of products in three-dimensional space. Sensitivity". Its main test items include total radiated power (TRP) and total isotropic sensitivity (TIS).

OTA can be compared to the transmission scenario of a product's wireless signal in the air. It can also take into account factors such as product internal radiation interference, product structure, antenna factors, RF chip transceiver algorithms, and even human impact. It is a comprehensive test method for verifying the air interface performance of wireless products in free space, which is very close to the actual product. Condition of use.

In some embodiments, the present disclosure provides a test fixture for testing an object under test. The test fixture includes: a base, a cover disposed on the base, and a fixture connected to the cover. The cover and the base jointly define an inner space, and the cover includes a first part installed on the base and a second part that cooperates with the first part and can move relative to the first part; The first part of the clamp and the cover part is connected with the second part and has a first end extending in the inner space. When the second part moves relative to the first part, the clamp is driven to make the first end move in the inner space.

In some embodiments, the present disclosure provides a test fixture for testing an object under test. The test fixture includes: a bottom member, a cover member that cooperates with the bottom member, and a cover member that cooperates with the bottom member and the bottom member. Fixtures for connecting upper cover components. The upper cover member is configured to move relative to the bottom member, and jointly defines an inner space with the bottom member; moreover, the upper cover member has an opening communicating with the inner space. The clamp includes a first end extending in the inner space, and the first end of the clamp is configured to move when the upper cover member moves relative to the bottom member.

In some embodiments, the present disclosure provides a test method; providing a test object to a test fixture, wherein the test fixture has an opening, which is configured so that the test fixture placed on the test fixture One surface of the object is in communication with one of the outside of the test fixture; one of the upper cover members of the test fixture is pressed down so that one of the clamps of the test fixture bears against the object to be tested; and the object to be tested is tested .

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only and are not meant to be limiting. For example, in the following description, "causing a first member to be formed over or on a second member" may include embodiments in which the first member and the second member are in direct contact, and may also Embodiments are included in which an additional member may be formed between the first member and the second member such that the first member and the second member may not be in direct contact. In addition, the present disclosure may repeat element symbols and/or letters in various examples. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

In addition, for convenience of description, spatially relative terms (such as "below", "below", "under", "above", "on", "above" and the like) may be used herein to describe an element or member. The relationship with another element(s) or component is as shown in the figure. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein interpreted accordingly.

As used herein, terms such as "first", "second" and "third" describe various elements, components, regions, layers and/or sections, which elements, components, regions, layers and/or Sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another. Terms such as "first", "second" and "third" when used herein do not imply a sequence or order unless clearly indicated by the context.

As used herein, the terms "substantially", "substantially", "substantially" and "about" are used to describe and explain small variations. When used in connection with an event or circumstance, the terms can refer to both instances in which the event or circumstance occurred exactly as well as instances in which the event or circumstance occurred in close approximation. For example, when used in connection with a numerical value, the term may refer to a variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to Equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a difference between two values is less than or equal to ±10% of the mean value of one of those values (such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), such values may be deemed to be "substantially" the same or equal . For example, "substantially" parallel may involve an angular range of less than or equal to ±10° relative to 0°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, "substantially" perpendicular may refer to an angular range of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

The wireless module with its own antenna has a high degree of directivity, and it is necessary to consider the directivity and radiation efficiency of the antenna radiation pattern of the DUT (Device Under Test) during the test. The strongest power point of the general radiation pattern of the DUT with its own antenna will be located at its phase center, and when the DUT is measured, the accuracy of the radiation beam of the antenna structure is easily affected by medium interference and shielding, resulting in microwave The signal generates wrong phase difference and received data during testing.

When using a test fixture to measure an object under test with its own antenna, no matter the test fixture is used for a manual test machine or an automatic test machine, it is necessary to use an upper cover to press the object under test so that the test platform The pogo pins on the upper part of the device can really withstand the electrical connectors (such as solder balls) located on the lower side of the DUT, and then obtain the data signal in the IC of the DUT; because the upper cover needs to be used to press down the DUT, the DUT There is the upper cover above the object under test; moreover, usually the antenna elements of the object under test are arranged adjacent to the upper surface of the object under test; therefore, when the upper cover presses down on the upper surface of the object under test, the upper cover It will cover the antenna radiation of the object under test, and then affect the accuracy of measuring the surface radiation beam of the object under test.

FIG. 1A is a three-dimensional schematic diagram of a test fixture 1 according to an embodiment of the present disclosure, and FIG. 1B is an exploded schematic view of the test fixture 1 according to an embodiment of the present disclosure. In some embodiments of the present disclosure, the test fixture 1 is used for measuring a semiconductor package structure with an antenna element. As shown in FIG. 1A and FIG. 1B , the test fixture 1 has a base 11 , a cover 13 , a clamp 15 and an elastic member 17 .

In some embodiments of the present disclosure, the base 11 is configured to be placed on a test platform. The base 11 has a groove 113, and the groove 113 is configured to accommodate the object to be tested, such as a semiconductor device or a semiconductor package structure with an antenna element or an antenna module to be tested, and is configured to allow the detection of the test platform. The needle extends into it.

The cover part 13 is disposed on the base 11, and the cover part 13 and the base 11 cooperate with each other to form an inner space, and the groove 113 of the base 11 is located in the inner space. In some embodiments of the present disclosure, the cover portion 13 has a first part 131 and a second part 133 that cooperate with each other and can move relative to each other; the first part 131 is configured to be fixed on an upper surface of the base 11 , and The first part 131 has an opening 1310; in some embodiments of the present disclosure, the first part 131 is generally a ring-shaped body, and when the first part 131 is fixed on the base 11, the ring-shaped body It roughly surrounds the groove 113 of the base 11 . The second part 133 is configured to cooperate with the first part 131 in a movable manner relative to the first part 131 , in other words, the second part 133 cooperates with the first part 131 and can move up and down relative to the first part 131 . The second component 133 also has an opening 1330 . In some embodiments of the present disclosure, the second part 133 has an annular body configured to be sleeved on the first part 131 . When the second part 133 is mated with the first part 131, the opening 1330 of the second part 133 is configured to form the opening 135 of the cover 13 together with the opening 1310 of the first part 131, so that the cover The internal space jointly formed by the base 13 and the base 11 can communicate with the external space through the opening 135 . In some embodiments of the present disclosure, the opening 135 of the cover 13 is substantially aligned with the groove 113 of the base 11 .

In some embodiments of the present disclosure, the test fixture 1 has a pair of clamps 15 for fixing the object under test placed in the groove 113 of the base 11; the clamps 15 are connected to the cover 13 and extend into the cover 13 and the base 11 The inner space is formed together, and it is configured to move as the second part 133 of the cover part 13 moves relative to the first part 131 . A first end 151 of the clamp 15 is configured to extend into the inner space formed by the cover 13 and the base 11 . Furthermore, a second end 153 opposite to the first end 151 of the clamp 15 is configured to be connected to the second part 133 of the cover 13; in some embodiments of the present disclosure, the second end of the clamp 15 The part 153 has a shaft 1530, and the shaft 1530 of the clamp 15 is installed in a groove 1332 of the second part 133, so that the clamp 15 can cooperate with the groove 1332 of the second part 133 through its shaft 1530 And pivot relative to the second part 133 . In addition, the clamp 15 has a pivot portion 155 between the first end portion 151 and the second end portion 153 , and the clamp 15 is pivotally connected to the first component 131 through the pivot portion 155 . When the second part 133 of the cover 13 moves up and down relative to the first part 131 , the clamp 15 can be driven to move its first end 151 up and down in the inner space formed by the cover 13 and the base 11 .

Moreover, the test fixture 1 has one or more elastic members 17 disposed between the second part 133 and the first part 131 . In some embodiments of the present disclosure, the elastic member 17 includes a spring. In some embodiments of the present disclosure, the elastic member 17 can be replaced by other elastic members. When the second part 133 of the pressing part 13 is pressed to move the second part 133 downward relative to the first part 131, the second part 133 simultaneously compresses the elastic member 17 between the second part 133 and the first part 131 . When the pressing force is removed, the elastic member 17 between the second part 133 and the first part 131 will push the second part 133 to move upward relative to the first part 131 with its elastic force, so that the second part 133 Return to its position when no force is applied.

As mentioned above, the first part 131 of the cover part 13 is fixed on the base 11 , and the second part 133 of the cover part 13 is movably engaged with the first part 131 . Therefore, the base 11 of the test fixture 1 and the first part 131 of the cover 13 fixed thereon can be regarded as a fixed bottom member, and the second part 133 of the cover 13 of the test fixture 1 can be regarded as a An upper cover component that cooperates with the bottom component and can move relative to the bottom component.

In addition, in some embodiments of the present disclosure, the second part 133 of the cover part 13 , the first part 131 and the clip 15 can be regarded as a component that can cooperate with the base 11 .

FIG. 2A is a schematic side view of the test fixture 1 in a state where its cover is pressed according to an embodiment of the present disclosure. FIG. 2B is a schematic cross-sectional view of the test fixture 1 shown in FIG. 2A . As mentioned above, when the second part 133 of the cover part 13 is pressed under force, the second part 133 can be moved downward relative to the first part 131, that is, the second part 133 can face the first part fixed on the base 11 131 and the second part 133 simultaneously compresses the elastic member 17 between the second part 133 and the first part 131 . Furthermore, the second end 153 of the clamp 15 is connected with the movable second part 133, and its pivot part 155 is connected with the first part 131 fixed on the base 11; when the second part 133 is opposite to the first part When 131 moves downwards, the second end 153 of the clamp 15 will move downward together with the second part 133; however, the pivoting part 155 of the clamp 15 is connected with the fixed first part 131, so relative to the second The first end 151 of the end 153 is driven to move upward, that is, the first end 151 of the clamp moves away from the base 11 and the groove 131 of the base 11 ; thus, the clamp 15 is in an open state. When the clamp 15 is in the open state, the distance between the first ends 151 of the two clamps 15 is greater than the width of the semiconductor package structure 10 to be tested, so that the semiconductor package structure 10 to be tested can pass through the cover portion 13 The opening 133 is inserted into the groove 113 of the base 11 . Moreover, the semiconductor package structure 10 to be tested has the antenna element 101 disposed adjacent to its upper surface. When the semiconductor package structure 10 is placed in the groove 113, the upper surface of the semiconductor package structure 10 to be tested with the antenna element 101 is Facing the opening 135 of the test fixture 1 .

FIG. 3A is a schematic side view of the test fixture 1 in an embodiment of the present disclosure in a state where the cover is not pressed, and FIG. 3B is a schematic cross-sectional view of the test fixture 1 shown in FIG. 3A . As mentioned above, when the pressing force is removed, the elastic member 17 located between the second part 133 and the first part 131 will push the second part 133 to move upward relative to the first part 131 with its elastic force, that is, The second part 133 moves away from the first part 131 . Furthermore, the second end 153 of the clamp 15 is connected with the movable second part 133, and its pivot part 155 is connected with the first part 131 fixed on the base 11; when the second part 133 is opposite to the first part When 131 moves upwards, the second end 153 of the clamp 15 will move upward together with the second part 133; however, the pivoting part 155 of the clamp 15 is connected with the fixed first part 131, so relative to the second end The first end 151 of 153 will be driven to move downward, that is, the first end 151 of the clamp 15 will move toward the base 11 and the groove 131 of the base 11 ; thus, the clamp 15 is in a closed state. And when the clamp 15 was in the closed state, the first ends 151 of the two clamps 15 were close to the groove 113 of the base 11, and the distance between them was slightly smaller than the width of the semiconductor package structure 10 to be tested. The first end 151 of 15 will be pressed against the two sides of the semiconductor package structure 10 to be tested placed in the groove 13 of the base 11, and the semiconductor package structure 10 to be tested can be pushed against and fixed by the clamp 15, and the test platform The pogo pins can contact the electrical connectors on the bottom surface of the semiconductor package structure 10 to be tested through the slots 113 of the base 11 . In addition, since the clamp 15 only abuts against the side of the upper surface of the semiconductor package structure 10 to be tested, the antenna element 101 located on the upper surface of the semiconductor package structure 10 to be tested will not be covered by the clamp 15 .

FIG. 4 is a test system 100 for testing a semiconductor package structure 10 with an antenna unit according to an embodiment of the present disclosure. As shown in FIG. 4, the test system 100 has a robot arm 2 that can control a suction module 21. The suction module 21 is configured to suction the semiconductor package structure 10 to be tested, which is the same as or similar to that shown in FIG. 1A and FIG. 1B. The test fixture 1 of the disclosed embodiment is located in the test box 3 and set on the docking plate 35 with the test platform 33 . The robot arm 2 controls the suction module 21 to suck the semiconductor package structure 10 to be tested and place it in the test fixture 1 located in the test box 3. In some embodiments of the present disclosure, when the suction module 21 will When the semiconductor package structure 10 to be tested is put into the test fixture 1 , the upper part 133 and the lower part 131 of the cover part 13 of the test fixture 1 will be pressed together at the same time. Furthermore, an antenna module 31 (Horn Antenna) and related accessories whose operating frequency band matches the semiconductor package structure 10 to be tested are erected above the test box 3; the semiconductor package structure 10 to be tested is put into a test fixture After 1, the antenna module 31 located above the test box 3 can be used to measure the semiconductor package structure 10 to be tested. When the robot arm 2 controls the suction module 21 to place the semiconductor package structure 10 to be tested on the test fixture 1, the robot arm 2 and the suction module 21 will move out of the test box 3, so that the antenna module 31 and the There is no barrier between the test fixtures 1, so the antenna module 31 is configured to directly face the test fixture 1. Moreover, because the cover 13 of the test fixture 1 has the opening 1330 of the upper part 133 and the The opening 135 jointly formed by the opening 1310 of the lower part 131, so when the semiconductor package structure 10 to be tested is placed in the test fixture 1, the semiconductor package structure 10 to be tested is directly facing the antenna module 31, There is no barrier between the semiconductor package structure 10 to be tested and the antenna module 31; in this way, when using the antenna module 31 to measure the semiconductor package structure 10 to be tested, such as OTA measurement, the semiconductor package to be tested The radiated power of the antenna elements of the structure 10 will not be shielded and disturbed.

5A and 5B are schematic diagrams of the operation of the test fixture 1 according to the embodiment of the present disclosure. As mentioned above, the robot arm 2 controls the suction module 21 to suck the semiconductor package structure 10 to be tested and place it in the test fixture 1 located in the test box 3; referring to FIG. 5A, the robot arm 2 can control the suction module 10. Set 21 to make it enter the inner space of the test fixture 1 to place the semiconductor package structure 10 to be tested; during the process of placing the semiconductor package structure 10 to be tested into the test fixture 1 by the suction module 21, the suction module 21 will press down the cover 13 of the test fixture 1 to push the upper part 133 of the cover 13 to move downward; and when the upper part 133 of the cover 13 moves downward, the clamp 15 of the test fixture 1 will be Drive to move the first end portion 151 upwards, so that the clamp 15 is in an open state. When the clamp 15 of the test fixture 1 is in an open state, the pick-up module 21 can place the semiconductor package structure 10 to be tested that it picks up into the groove 113 of the base 11 of the test fixture 1 . In addition, when the semiconductor package structure 10 to be tested is placed in the groove 113 , the upper surface of the semiconductor package structure 10 to be tested on which the antenna element 101 is disposed faces upward.

5B, after the suction module 21 places the semiconductor package structure 10 to be tested in the groove 113 of the test fixture 1, the robot arm 2 controls the suction module 21 to leave the test fixture 1; once the cover of the test fixture 1 13 is no longer pressed and pressed by the suction module 21, the elastic member 17 of the test fixture 1 will push the second part 133 of the cover 13 upward with its elastic force; and when the upper part 133 of the cover 13 moves upward , the clamp 15 of the test fixture 1 will be driven to move the first end 151 downward, so that the clamp 15 is in a closed state. When the clamp 15 of the test fixture 1 is in a closed state, the first end 151 of the clamp 15 is configured to fix the semiconductor package structure 10 to be tested placed in the groove 113 against the top, so that the probe of the test platform 33 The pins 331 pass through the slots 113 of the base 11 and are in contact with the electrical connectors at the bottom of the semiconductor package structure 10 to be tested. In some embodiments of the present disclosure, the first end 151 of the jig 15 only contacts the adjacent two sides of the upper surface of the semiconductor package structure 10 to be tested, so as to avoid covering the upper space and the surface of the semiconductor package structure 10 to be tested. Avoid covering the antenna element 101 disposed on the upper surface of the semiconductor package structure 10 to be tested, thereby affecting the measurement of the antenna element 101 of the semiconductor package structure 10 to be tested by the antenna module 31 .

FIG. 6 is a schematic diagram of a test performed in an embodiment of the present disclosure. As shown in FIG. 6, when the semiconductor package structure 10 to be tested is placed in the test fixture 1, the upper surface of the semiconductor package structure 10 to be tested on which the antenna element 101 is provided can directly face the antenna mold through the opening 135. Group 31. Therefore, there is no barrier between the antenna module 31 and the upper surface of the conductor package structure 10 on which the antenna element 10 is disposed. In some embodiments of the present disclosure, after the semiconductor package structure 10 to be tested is fixed in the test fixture 1, the antenna module 31 located above the semiconductor package structure 10 to be tested can be adjusted so that the antenna module 31 is in contact with the semiconductor package structure to be tested. The distance of the semiconductor package structure 10 to be measured is the test condition of the far field; moreover, the angle of the antenna module 31 can be changed to measure the semiconductor package structure 10 to be tested, such as OTA measurement, so as to obtain the semiconductor package structure to be tested The radiated power and S parameters of the package structure 10 itself. In some embodiments of the present disclosure, when the semiconductor package structure 10 to be tested is fixed in the test fixture 1 by the fixture 15 of the test fixture 1, the electrical properties of the semiconductor package structure 10 to be tested can be measured .

FIG. 7 is an operation flow chart of the operation flow 5 of measurement using the operating system of the embodiment of the present disclosure. In the operation step 51 of the operation flow chart, the semiconductor package structure 10 to be tested can be picked up by the suction module 21, and the suction module 21 can be moved to the top of the test fixture 10 located in the test box 3 by using the robot arm 2 ( Refer to Figure 4).

In the operation step 53 of the operation flowchart, the semiconductor package structure 10 to be tested, which is adsorbed on the suction module 21 , is placed in the groove 113 of the test fixture 1 . In operation step 531 of the operation flowchart, the suction module 21 moves downward to press the cover 13 of the test fixture 1, so that the clamp 15 in the test fixture 1 moves to the open state, so that the suction module 21 can The semiconductor package structure 10 to be tested is picked up and placed in the groove 113 of the test fixture 1 (refer to FIG. 5A ). In operation step 532 of the operation flowchart, the suction module 21 leaves the test fixture 1, and the second part 133 of the cover 13 of the test fixture 1 moves upward due to the elastic force of the spring 15, and the test fixture The fixture 15 in 1 then moves to the closed state, so that the first end 151 of the fixture 15 of the test fixture 1 will press down against the semiconductor package structure 10 to be tested placed in the groove 113 (see FIG. 5B ). . In addition, the suction module 21 is further removed, so that there is no obstruction between the test fixture 1 and the antenna module 31 .

In operation step 55 of the operation flow chart, adjust the distance between the antenna module 31 (Horn Antenna) directly above the test fixture 1 and the test fixture 1, so that the distance between them meets the far-field test conditions, and The operating frequency band of the antenna module 31 is consistent with the antenna element 101 of the semiconductor package structure 10 to be tested. (Can refer to Figure 4).

In operation step 57 of the operation flow chart, the antenna module 31 is used to measure the antenna element 101 of the semiconductor package structure 10 to be tested placed in the test fixture 1 , such as OTA measurement. In some embodiments of the present disclosure, electrical measurements may be performed on the semiconductor package structure to be tested. Also, since there is no shield between the antenna module 31 and the test fixture 1, and the cover portion 13 of the test fixture 1 has an opening 135, the antenna module 31 is performing the antenna measurement of the semiconductor package structure 10 It can directly face the upper surface of the semiconductor package structure 10 provided with the antenna element 101 without being obstructed by any objects, so that the accuracy of the antenna measurement will not be affected. In addition, the user can change the installation angle of the antenna module 31 to perform antenna measurement on the semiconductor package structure 10 . In addition, the antenna module 31 can measure and obtain the radiation power and S-parameter or other related data of the antenna element 101 of the semiconductor package structure 10 to be tested (refer to FIG. 4 and FIG. 6 ).

In operation step 59 of the operation flowchart, the measured semiconductor package structure 10 will be transported to a large machine for classification, such as a dispenser. The large-scale machine capable of sorting can classify the measured semiconductor package structures 10 as good products and defective products, and the semiconductor package structures 10 classified as good products will be shipped or transported to other semiconductor manufacturing devices for follow-up process. In some embodiments of the present disclosure, the semiconductor package structures 10 classified as defective products are further subjected to an electrical failure analysis test (EFA test).

Utilizing the test fixture for testing a semiconductor package structure with an antenna unit of the present disclosure can make the semiconductor package structure to be tested completely empty above the test fixture, so that the antenna unit can measure the pressure of the medium without pressing materials Influence, improve the accuracy of testing antenna performance.

The features of several embodiments have been summarized above so that those skilled in the art can better understand aspects of the present disclosure. Those skilled in the art should appreciate that they may readily utilize the present disclosure as a basis for designing or modifying other programs and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions should not depart from the spirit and scope of the present disclosure, and that various changes, substitutions and alterations can be made thereto.

1: Test fixture 2: Mechanical arm 3: Test box 5: Operation process 10: Semiconductor package structure 11: base 13: Cover 15: Fixture 17: Elastic member 21: Suction module 31: Antenna module 33: Test platform 35: Butt plate 51: step 100: Test System 101: Antenna element 113: slot 131: first part 133: Second part 135: opening 151: first end 153: second end 155: pivot joint 331: Probe 1310: opening 1330: opening 1332: Groove 1530: drive shaft

Aspects of the present disclosure will be better understood from the following embodiments together with the accompanying drawings. It should be noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of illustration.

FIG. 1A is a three-dimensional schematic diagram of a test fixture according to an embodiment of the present disclosure.

FIG. 1B is an exploded schematic diagram of a test fixture according to an embodiment of the present disclosure.

FIG. 2A is a schematic side view of the test fixture according to an embodiment of the present disclosure in a state where its cover is pressed.

FIG. 2B is a schematic cross-sectional view of the test fixture shown in FIG. 2A .

FIG. 3A is a schematic side view of the test fixture according to an embodiment of the present disclosure in a state where the cover is not pressed.

FIG. 3B is a schematic cross-sectional view of the test fixture shown in FIG. 3A .

FIG. 4 is a schematic diagram of a test system according to an embodiment of the present disclosure.

FIG. 5A and FIG. 5B are schematic diagrams of the operation of the test fixture according to the embodiment of the present disclosure.

FIG. 6 is a schematic diagram of a test performed in an embodiment of the present disclosure.

FIG. 7 is an operation flowchart of the testing system of the embodiment of the present disclosure.

1: Test fixture

11: base

15: Fixture

17: Elastic member

113: slot

131: first part

133: Second part

151: first end

153: second end

155: pivot joint

1310: opening

1330: opening

1332: Groove

1530: drive shaft

Claims (20)

A test fixture for testing an object to be tested, comprising: a base; A cover disposed on the base, wherein the cover and the base jointly define an internal space, wherein the cover includes: a first component mounted on the base; and a second part cooperating with the first part, wherein the second part is configured to move relative to the first part; and a clamp including a first end extending in the interior space; Wherein, when the second part moves relative to the first part, the clamp is driven to make the first end move in the inner space. The test fixture as claimed in claim 1, wherein the cover has an opening, and wherein the opening communicates with the internal space, and wherein the base has a groove for the test object to be placed, and wherein the The groove is generally aligned with the opening. The test fixture as claimed in claim 1, wherein the clamp and the first part of the cover are connected to the second part, wherein when the second part moves close to the first part, the clamp is driven to make the first part move An end moves away from the base, and wherein when the second part moves away from the first part, the clamp is actuated to move the first end closer to the base. The test fixture as claimed in claim 1, wherein the base has a groove for the object under test to be placed, and wherein when the second part moves close to the first part, the fixture is driven to make the first end moving away from the slot, and wherein the clamp is actuated to move the first end proximate to the slot when the second part is moved away from the first part. The test fixture according to claim 4, wherein when the second part moves away from the first part, the first end of the fixture is configured to move against the object under test placed in the groove . The test fixture according to claim 5, wherein the first end of the fixture is configured to abut against an edge portion of the object under test. The test fixture according to claim 1, wherein the fixture has a second end opposite to the first end and a pivot joint between the first end and the second end, and wherein the pivot joint The part is connected with the first part, and the second end is connected with the second part. The test fixture according to claim 1 further has an elastic member, wherein the elastic member is disposed between the first part and the second part. The test fixture according to claim 1, wherein the object under test has an antenna element. A component of a test fixture, comprising: a first part having an interior space; a second part cooperating with the first part, wherein the second part is configured to move relative to the first part, and wherein the second part has an opening communicating with the interior space of the first part; and a clamp connected to the first part or the second part, wherein the clamp has a first end extending in the interior space; Wherein, when the second part moves relative to the first part, the clamp can be driven to make the first end move. The member of claim 10, wherein when the second part is moved toward the first part, the clamp is actuated to move the first end generally toward the opening of the second part, and wherein when the second As the part moves away from the first part, the clamp is actuated to move the first end generally away from the opening of the second part. The member of claim 10, wherein the clamp has a second end opposite to the first end and a pivot joint between the first end and the second end, and wherein the pivot joint is Connected with the first component, the second end is connected with the second component. The member according to claim 10 further has an elastic member, wherein the elastic member is disposed between the first part and the second part. A test method comprising: Fixing an object under test with an antenna element in a test fixture; wherein the test fixture is pressed against one side of the object under test by a clamp to fix the object under test in the test fixture; and A radiation performance measurement is performed on the antenna element of the object under test. The testing method according to claim 14, further comprising: when the test fixture is fixed in the test fixture, performing an electrical measurement on the object under test. The testing method according to claim 14, wherein the testing fixture is located in a testing box. According to the test method of claim 14, an antenna module (Horn Antenna) is further erected above the test fixture, wherein an operating frequency band of the antenna module matches the antenna element of the DUT. The testing method according to claim 17, wherein an upper cover of the test fixture has an opening, so that the antenna module is configured to directly face the object under test fixed in the test fixture. The testing method according to claim 17 further includes: adjusting the antenna module so that a distance between the antenna module and the object under test complies with far-field test conditions. The test method according to claim 14, wherein the radiation performance measurement is performed on the antenna element of the test object to obtain a radiation power and/or an S parameter of the test object.

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