TW202248616A - Method and electronic device for detecting abnormality of stamping equipment - Google Patents

Abstract

A method and electronic device for detecting anomaly of a stamping equipment. The detection method includes acquiring a stamping vibration signal generated by the stamping equipment. Performing data processing on the stamping vibration signal to generate a stamping vibration curve. Comparing the punching vibration curve with a monitoring envelope curve. Analyzing whether the stamping vibration curve exceeds the monitoring envelope curve to determine whether the stamping equipment is in an abnormal working state. This application monitors the vibration signal of the stamping equipment in real time, and establishes a monitoring envelope curve after processing the vibration signal. Predicting the production status of stamping equipment during the production process to avoid producing unqualified products under abnormal working conditions and improve production quality.

Description

Stamping equipment abnormal detection method and electronic device

The present application relates to the field of stamping, and in particular to a method for detecting abnormality of stamping equipment and an electronic device.

During the stamping manufacturing process, the abnormality of the stamping equipment may lead to abnormal product batches, so as to interrupt production. Furthermore, when the stamping equipment has a failure trend in the initial stage, if the equipment is not found to be in an abnormal state, subsequent cascading failures may occur due to the problem of a single structural part of the stamping equipment, resulting in high maintenance costs and backup costs. piece fee. Therefore, it is usually necessary to detect the abnormality of the stamping equipment. However, the cause of the abnormality of the stamping equipment often occurs inside the stamping equipment, such as foreign matter entering the mold, which cannot be directly seen by the naked eye during the normal operation of the stamping equipment, which is very inconvenient.

In view of this, it is necessary to provide a stamping equipment abnormal detection method to monitor the long-term vibration parameters of the stamping equipment, so as to predict the abnormal operation status of the stamping equipment during the production process.

An embodiment of the present application provides a stamping equipment abnormality detection method, the method comprising: acquiring a stamping vibration signal generated by the stamping equipment; performing data processing on the stamping vibration signal to generate a stamping vibration curve; combining the stamping vibration curve with the A monitoring envelope curve is compared, and whether the stamping vibration curve exceeds the monitoring envelope curve is analyzed to determine whether the stamping equipment is in an abnormal working state.

Optionally, the stamping vibration signal generated by the stamping equipment is acquired through a vibration sensor and a data acquirer, wherein the vibration sensor is electrically connected to the stamping equipment, and the data acquirer is connected to the vibration sensor electrical connection.

Optionally, acquiring the stamping vibration signal generated by the stamping equipment includes: acquiring parameters of the data acquirer, wherein the parameters include: stamping equipment connection address, collection frequency, data format, signal channel and trigger mode; and configure the data acquirer according to the parameters, so that the data acquirer acquires the stamping vibration signal from the vibration sensor, wherein the stamping vibration signal passes through the vibration sensor Obtained from the stamping equipment.

Optionally, the data processing of the stamping vibration signal to generate the stamping vibration curve includes: extracting an effective signal of the stamping vibration signal, wherein the effective signal is the clamping of the upper and lower molds of the stamping equipment signal generated instantaneously; and performing de-high frequency processing on the effective signal to obtain the stamping vibration curve, wherein the de-high frequency processing on the effective signal includes: obtaining a cut-off frequency; The effective signal is converted from a time-domain signal to a frequency-domain signal; and signals below the cutoff frequency in the frequency-domain signal are retained, and then converted into a time-domain signal.

Optionally, obtaining the monitoring envelope curve includes: acquiring a number of sampling times to determine the number of stamping vibration curves required to generate the monitoring envelope curve; extracting time-domain features and frequency features for each stamping vibration curve domain characteristics; and generating the monitoring envelope curve according to the time domain characteristics and frequency domain characteristics.

Optionally, the monitoring envelope curve includes an upper envelope curve and a lower envelope curve, comparing the stamping vibration curve with a monitoring envelope curve, analyzing whether the stamping vibration curve exceeds the monitoring envelope curve, to determine Whether the stamping equipment is in an abnormal working state includes: when the stamping vibration curve is between the upper envelope and the lower envelope, judging that the stamping equipment is in a normal working state; when the stamping vibration curve When the upper envelope line is exceeded, a first abnormal signal is issued; and when the stamping vibration curve exceeds the lower envelope line, a second abnormal signal is issued.

Optionally, comparing the stamping vibration curve with a monitoring envelope curve and analyzing whether the stamping vibration curve exceeds the monitoring envelope curve to determine whether the stamping equipment is in an abnormal working state includes: obtaining a fault tolerance rate to set the stamping vibration curve allowed to exceed the range of the monitoring envelope curve.

Optionally, the method further includes: displaying whether the stamping equipment is in an abnormal working state.

Optionally, the method further includes: generating a historical health status, the historical health status is a record of the working status of the stamping equipment in previous strokes, wherein the working status includes normal working status and abnormal working status; and A working condition prediction rate is generated, where the working condition prediction rate is a ratio of the number of times the stamping equipment successfully predicts the working condition to the total number of strokes.

The present application also provides an electronic device, the electronic device includes: a processor and a memory, and a plurality of program modules are stored in the memory, and the plurality of program modules are loaded by the processor and execute the above-mentioned Abnormal detection method of stamping equipment.

Compared with the prior art, the present application has at least the following beneficial effects: by monitoring the vibration signal of the stamping equipment in real time, and establishing a monitoring envelope curve after the vibration signal is processed, the production status of the stamping equipment in the production process can be predicted to avoid Produce unqualified products under abnormal working conditions, improve production quality, and, by further controlling the operation of stamping equipment, avoid subsequent stamping equipment chain failures caused by abnormal stamping equipment, resulting in high maintenance costs and spare parts piece fee.

In order to understand the above purpose, features and advantages of the present application more clearly, the present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the implementation modes of the present application and the features in the implementation modes can be combined with each other.

It should be noted that when an element is referred to as being "electrically connected" to another element, it may be directly on the other element or may be present in an intervening element. When an element is considered to be "electrically connected" to another element, it may be connected by contact, eg, by wire connection, or by non-contact connection, eg, by non-contact coupling.

A lot of specific details are set forth in the following description to facilitate a full understanding of the application, and the described implementations are only part of the implementations of the application, not all of them. Based on the implementation modes in this application, all other implementation modes obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific implementations, and is not intended to limit the application.

The present application provides a method for detecting abnormality of stamping equipment, which is applied to one or more electronic devices. The electronic device is a device that can automatically perform numerical calculations and/or information processing according to preset or stored instructions, and its hardware includes but not limited to microprocessors, application specific integrated circuits (ASIC) , Field-Programmable Gate Array (Field-Programmable Gate Array, FPGA), Digital Processor (Digital Signal Processor, DSP), embedded devices, etc.

The electronic device may be a computing device such as a desktop computer, a notebook computer, a tablet computer, or a cloud server. The device can perform human-computer interaction with the user through keyboard, mouse, remote control, touch panel or voice control device. The device can also be embedded inside a stamping device.

The first voltage interface 140 is electrically connected to the first channel 121 . The first current interface 150 is electrically connected to the second channel 122 . The second voltage interface 160 is electrically connected to the third channel 131 . The second current interface 170 is electrically connected to the fourth channel 132 .

Please refer to FIG. 1 , the abnormality detection method for stamping equipment specifically includes the following steps:

Step S11, acquiring the stamping vibration signal generated by the stamping equipment.

It can be understood that please refer to FIG. 2 together. In step S11, the stamping equipment may be the stamping equipment 20 shown in FIG. 2 .

In this embodiment, the acquiring the stamping vibration signal generated by the stamping equipment 20 includes: acquiring the stamping vibration signal generated by the stamping equipment 20 through a vibration sensor 10 and a data acquirer 30 . Wherein the vibration sensor 10 is electrically connected to the stamping equipment 20 , and the data acquirer 30 is electrically connected to the vibration sensor 10 .

In this embodiment, the stamping vibration signal is a voltage signal, and the vibration sensor 10 can convert the vibration signal generated by the stamping equipment 20 into the voltage signal.

In this embodiment, the acquisition of the stamping vibration signal generated by the stamping equipment 20 includes: acquiring the parameters of the data acquirer 30; and configuring the data acquirer 30 according to the parameters, so that the data acquirer 30 acquires the stamping vibration signal from the vibration sensor 10 .

Wherein, the parameters include: stamping equipment connection address, collection frequency, data format and signal channel.

The stamping equipment connection address is used to connect the stamping equipment 20 .

The collection frequency is used to control the sampling frequency of the data acquisition device 30 within 1 second. The data acquisition device 30 in this embodiment is a high-speed data acquisition device 30, generally 2^5 K ~ 2^8 K times/second, for example, in a specific embodiment, the collection frequency may be 2^6 K times/second, that is, 64000 times/second.

The data format is the storage format of the stamping vibration signal, which can be set in CSV format, EXCEL format, JSON format, etc.

The signal channel is used to select the corresponding vibration sensor 10 according to the need when the stamping equipment 20 is provided with multiple vibration sensors 10 to obtain the output signal thereof.

It can be understood that in other implementation manners of the present application, the parameters of the data acquirer 30 also include a trigger mode. The triggering method is used to select to adopt the voltage signal sent by the vibration sensor 10 in a specific period of time. The selection of the trigger mode is related to the signal trigger device provided on the stamping equipment 20 , for example, a rising edge trigger or a falling edge trigger can be selected.

It can be understood that, in the embodiment of the present application, the stamping vibration signal is obtained from the stamping equipment 20 through the vibration sensor 10 .

Step S12, performing data processing on the stamping vibration signal to generate a stamping vibration curve.

In this embodiment, the pressing vibration curve is a voltage curve.

It can be understood that the data processing of the stamping vibration signal to generate the stamping vibration curve includes: extracting an effective signal of the stamping vibration signal; and performing high frequency removal processing on the effective signal to obtain the stamping vibration curve.

In the extraction of the effective signal of the stamping vibration signal in this embodiment, different effective signals of the vibration signal are determined according to different research objects. In this embodiment, since what needs to be studied is the signal at the moment when the upper and lower molds are closed during the stamping process of the stamping equipment 20, the effective signal is the signal at the moment when the upper and lower molds are closed.

Please refer to FIG. 3. In the embodiment of the present application, three vibration sensors 10 shown in FIG. The process of effective signal. Wherein, when the stamping equipment 20 completes one stroke, the corresponding angle of the electronic cam (not shown) of the stamping equipment 20 is 0~360°, and the angle of the electronic cam corresponding to the moment when the upper and lower molds are closed during the stamping process is 167~170°. In the second vibration sensor 10 shown in Figure 3 (b), the effective signal of the impact as shown in Figure 3 (d) appears, and the signal is windowed again, so that the high frequency is removed in sections Processing, as shown in FIG. 3(e), is a part of effective signals during the windowing process.

In this embodiment, the high-frequency processing is performed on the effective signal to generate a high-frequency signal, so as to obtain a stamping vibration curve after the high-frequency processing. Specifically, a cutoff frequency is obtained, and the effective signal is converted from a time domain signal to a frequency domain signal by Fourier transform; and signals below the cutoff frequency in the frequency domain signal are retained, and then converted into a time domain signal, to Obtain the stamping vibration curve after high-frequency processing.

Please refer to FIG. 4 . FIG. 4 is a schematic diagram of high-frequency removal processing for effective signals in this embodiment. As shown in Figure 4(a), the effective signal has more burrs (that is, high-frequency components). In order to better display the results, the effective signal is converted from a time-domain signal to a frequency-domain signal by Fourier transform, as shown in As shown in Figure 4(b), use a filter to remove high-frequency interference signals above 1kHz, and then perform an inverse Fourier transform to convert it into a time-domain signal to generate a high-frequency signal as shown in Figure 4(c).

Step S13, comparing the stamping vibration curve with a monitoring envelope curve, and analyzing whether the stamping vibration curve exceeds the monitoring envelope curve, so as to determine whether the stamping equipment is in an abnormal working state.

In this embodiment, the obtaining the monitoring envelope curve includes: acquiring a number of sampling times to determine the number of the stamping vibration curves required to generate the monitoring envelope curve; extracting the time domain for each stamping vibration curve features and frequency domain features; and generating said monitoring envelope curve based on said time domain features and frequency domain features.

Specifically, the stamping vibration curve required to generate the monitoring envelope curve is formed by the stamping equipment 20 in a certain number of strokes before the current stroke. For the specific forming process, refer to step S11~step S12. The certain number of times is The number of samples obtained. The monitoring envelope curve generated by a plurality of stamping vibration curves can better reflect the fluctuation range of the stamping vibration curve.

It can be understood that before extracting the time-domain and frequency-domain features of the stamping vibration curve, the outlier detection algorithm in statistics is first used to analyze the extreme difference, interquartile range, and mean difference of the stamping vibration curve data. Standard deviation, etc. are analyzed, and outliers are removed.

Specifically, the time-frequency domain features mainly include: average value, standard deviation, maximum value, minimum value, mean square deviation, skewness, kurtosis, crest factor, margin factor, crest factor and K factor of the waveform. The above-mentioned time-frequency domain characteristics are analyzed by principal component analysis method, complex time-frequency domain characteristics with large data range fluctuations are extracted, and the monitoring envelope curve is generated according to the extracted time-frequency domain characteristics.

Referring to FIG. 5 , FIG. 5 is a schematic diagram of the monitoring envelope curve described in the present application. Wherein, the monitoring envelope curve includes an upper envelope curve and a lower envelope curve. In this embodiment, the analyzing whether the stamping vibration curve exceeds the monitoring envelope curve to determine whether the stamping equipment 20 is in an abnormal state includes: when the stamping vibration curve is between the upper envelope curve and the lower envelope curve, between the envelopes, it is determined that the stamping equipment 20 is in a normal working state; when the stamping vibration curve exceeds the upper envelope, a first abnormal signal is sent; when the stamping vibration curve exceeds the lower envelope , to signal the second exception. For example, the point A shown in FIG. 5 is beyond the upper envelope, and at this time, the first abnormal signal is correspondingly issued.

In a specific implementation manner, the first abnormal signal is used to control the stamping equipment 20 to stop working, and the second abnormal signal is used to activate an alarm device. It can be understood that by controlling the stamping equipment 20 to stop working or activating the alarm device, it is possible to avoid subsequent cascading failures of the subsequent stamping equipment 20 due to the abnormality of the stamping equipment 20, resulting in high maintenance costs and spare parts costs.

In this embodiment, the analysis of whether the stamping vibration curve exceeds the monitoring envelope curve to determine whether the stamping equipment 20 is in an abnormal state further includes: obtaining a fault tolerance rate to set the stamping vibration curve to allow exceeding the specified Describe the scope of the monitoring envelope curve.

It can be understood that the size of the error tolerance rate can be changed according to the accuracy requirements of the abnormality detection method for stamping equipment. As shown in Figure 5, first define any point B on the stamping vibration curve to have a corresponding point C in the vertical direction with the upper envelope, and a corresponding point D with the lower envelope, and the difference between the signal values of points C and D is point The standard range of B (the standard range is a positive value), after obtaining the error tolerance rate, corresponds to a tolerable range of the point B. For example, in one of the embodiments, the error tolerance rate can be set to 10%. When the stamping vibration curve exceeds the upper envelope, and the signal value at a certain point is equal to the corresponding point in the vertical direction on the upper envelope If the absolute value of the signal value difference reaches 10% of the standard range at that point, it will exceed the tolerable range at that point, and the first abnormal signal will be issued. It can be understood that by obtaining the fault tolerance rate, the abnormality detection method of the stamping equipment 20 can still judge that the stamping equipment 20 is in a normal working state when the stamping vibration curve slightly exceeds the envelope curve, so that the The abnormality detection method of stamping equipment mentioned above can still be used normally when there is a reasonable range of error.

Further after step S14, the abnormality detection method of stamping equipment further includes: displaying on a display unit whether the stamping equipment 20 is in an abnormal state. For example, in this embodiment, when it is determined that the stamping equipment 20 is in a normal working state, a green PASS word is displayed on the display unit. When it is judged that the stamping equipment 20 is in an abnormal working state, a red NG word is displayed on the display unit. Apparently, by displaying whether the stamping equipment 20 is in an abnormal state on the display unit, the manufacturer can quickly understand the current working status of the stamping equipment 20 .

Further after step S14, the stamping equipment abnormality detection method further includes: generating historical health status and working condition prediction rate. It can be understood that the historical health status may be a record of the working status of the stamping equipment 20 in previous strokes. The working status includes normal working status and abnormal working status. The working condition prediction rate may be the ratio of the number of times the stamping equipment 20 successfully predicts the working condition to the total number of strokes in one working cycle. It can be understood that by generating historical health status and working condition prediction rate, it is possible to intuitively display the number of abnormalities in the stamping equipment 20, and intuitively show whether the abnormality detection method of the stamping equipment 20 can accurately predict the abnormality of the stamping equipment 20 .

Further in other embodiments, the method for detecting abnormality of stamping equipment further includes: displaying the stamping vibration signal and the monitoring envelope curve of the current stroke on the display unit in real time, and obtaining a signal display range for setting The display range of the monitoring envelope curve on the display unit.

Further in other embodiments, the abnormality detection method of stamping equipment further includes acquiring a working mode. In one embodiment, the working mode includes a first mode, a second mode and a third mode. Wherein, the first mode is data acquisition, the second mode is data acquisition and anomaly detection, and the third mode is data acquisition, anomaly detection and feedback control. It can be understood that obtaining different working modes can enable the producer to set a suitable working mode according to the needs of different working scenarios.

Please refer to FIG. 6 , which is a schematic structural diagram of an electronic device 40 according to an embodiment of the present application. The electronic device 40 includes, but is not limited to, a memory 401 , a processor 402 and a computer program 403 stored in the memory 401 and operable on the processor 402 . When the processor 402 executes the computer program 403, the steps in the method for abnormality detection of stamping equipment mentioned above are realized, such as steps S11-S13 shown in FIG. 1 .

The exemplary computer program 403 can be divided into one or more modules/units, and the one or more modules/units are stored in the memory 401 and executed by the processor 402 to Complete this application. The one or more modules/units may be a series of computer program instruction segments capable of accomplishing specific functions, and the instruction segments are used to describe the execution process of the computer program 403 in the electronic device 40 .

Those skilled in the art can understand that the schematic diagram is only an example of the electronic device 40 and does not constitute a limitation to the electronic device 40. It may include more or less components than those shown in the figure, or combine certain components, or be different. Components, for example, the electronic device 40 may also include input and output devices, network access devices, bus bars, and the like.

The so-called processor 402 may be a central processing unit (Central Processing Unit, CPU), and may also be other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC) , Ready-made programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or the processor 402 can also be any conventional processor, etc. The processor 402 is the control center of the electronic device 40, and connects the entire electronic device 40 with various interfaces and lines. various parts.

The memory 401 can be used to store the computer program 403 and/or module/unit, and the processor 402 runs or executes the computer program and/or module/unit stored in the memory 401, and Call the data stored in the memory 401 to realize various functions of the electronic device 40 . The memory 401 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application program required by a function (such as a sound playback function, an image playback function, etc.); The area can store data created according to the use of the electronic device 40 (such as audio data, phonebook, etc.) and the like. In addition, the memory 401 can include volatile and non-volatile memory, such as hard disk, memory, plug-in hard disk, smart memory card (Smart Media Card, SMC), secure digital (Secure Digital, SD) card, flash memory card (Flash Card), at least one disk memory component, flash memory device, or other memory components.

The stamping equipment abnormality detection method and electronic device provided by this application monitor the vibration signal of the stamping equipment in real time, and establish a monitoring envelope curve after the vibration signal is processed, so as to predict the production status of the stamping equipment during the production process and avoid abnormal conditions. Produce unqualified products under working conditions, improve production quality, and, by further controlling the operation of stamping equipment, avoid subsequent stamping equipment chain failures caused by stamping equipment abnormalities, resulting in high maintenance costs and spare parts costs .

It is obvious to those skilled in the art that the present application is not limited to the details of the above-mentioned exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, no matter from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the application is defined by the appended claims rather than the above description, so it is intended that All changes within meaning and scope are embraced within this application. Any reference sign in a claim should not be construed as limiting the claim to which it relates. Furthermore, it is clear that the word "comprising" does not exclude other modules or steps, and the singular does not exclude the plural. Multiple modules or electronic devices stated in the electronic device claim can also be implemented by the same module or electronic device through software or hardware. The terms first, second, etc. are used to denote names and do not imply any particular order.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and not to limit them. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be Make modifications or equivalent replacements without departing from the spirit and scope of the technical solutions of the present application.

10: Vibration sensor 20: Stamping equipment 30: Data Acquisition Device 40:Electronic device 401: Memory 402: Processor 403: computer program S11-S13: Steps

FIG. 1 is a flow chart of a method for detecting abnormalities in stamping equipment according to an embodiment of the present application. FIG. 2 is a schematic diagram of the functional modules of the vibration sensor, stamping equipment and data acquirer according to the embodiment of the present application. FIG. 3 is a schematic diagram of effective signals for extracting stamping vibration signals according to an embodiment of the present application. FIG. 4 is a schematic diagram of high-frequency removal processing for an effective signal according to an embodiment of the present application. FIG. 5 is a schematic diagram of a monitoring envelope curve according to an embodiment of the present application. FIG. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

none

S11-S13: Steps

Claims (10)

A method for detecting abnormalities in stamping equipment, the improvement of which is that the method includes: Obtain stamping vibration signals generated by stamping equipment; performing data processing on the stamping vibration signal to generate a stamping vibration curve; Comparing the stamping vibration curve with a monitoring envelope curve, and analyzing whether the stamping vibration curve exceeds the monitoring envelope curve, to determine whether the stamping equipment is in an abnormal working state. The stamping equipment abnormality detection method according to claim 1, wherein the stamping vibration signal generated by the stamping equipment is obtained through a vibration sensor and a data acquirer, wherein the vibration sensor is electrically connected to the stamping equipment, The data acquirer is electrically connected with the vibration sensor. The stamping equipment abnormality detection method as described in claim 2, wherein said acquiring stamping vibration signals generated by stamping equipment includes: acquiring parameters of said data acquirer, wherein said parameters include: stamping equipment connection address, collection Frequency, data format, signal channel and trigger mode; and configure the data acquirer according to the parameters, so that the data acquirer acquires the stamping vibration signal from the vibration sensor, wherein the A stamping vibration signal is obtained from the stamping device through the vibration sensor. The stamping equipment abnormality detection method according to Claim 1, wherein said processing the stamping vibration signal to generate a stamping vibration curve includes: extracting an effective signal of the stamping vibration signal, wherein the effective signal It is the signal generated by the upper and lower molds of the stamping equipment at the moment of mold closing; and the high-frequency processing is performed on the effective signal to obtain the stamping vibration curve, wherein the high-frequency processing is performed on the effective signal The method includes: obtaining a cutoff frequency; transforming the effective signal from a time domain signal into a frequency domain signal through Fourier transform; and retaining signals below the cutoff frequency in the frequency domain signals, and converting them into time domain signals. The abnormality detection method for stamping equipment according to claim 1, wherein obtaining the monitoring envelope curve includes: acquiring a number of sampling times to determine the number of stamping vibration curves required to generate the monitoring envelope curve; for each Extracting time-domain features and frequency-domain features from the stamping vibration curve; and generating the monitoring envelope curve according to the time-domain features and frequency-domain features. The abnormal detection method for stamping equipment according to claim 1, wherein the monitoring envelope curve includes an upper envelope curve and a lower envelope curve, and the stamping vibration curve is compared with a monitoring envelope curve to analyze the stamping vibration Whether the curve exceeds the monitoring envelope curve to determine whether the stamping equipment is in an abnormal working state, including: when the stamping vibration curve is between the upper envelope line and the lower envelope line, judging that the stamping equipment In a normal working state; when the stamping vibration curve exceeds the upper envelope, a first abnormal signal is sent; and when the stamping vibration curve exceeds the lower envelope, a second abnormal signal is sent. The abnormality detection method for stamping equipment as described in claim 1, wherein the stamping vibration curve is compared with a monitoring envelope curve, and whether the stamping vibration curve exceeds the monitoring envelope curve is analyzed to determine whether the stamping vibration curve exceeds the monitoring envelope curve. Whether the equipment is in an abnormal working state includes: acquiring a fault tolerance rate to set the stamping vibration curve allowed to exceed the range of the monitoring envelope curve. The abnormality detection method for stamping equipment according to claim 1, wherein the method further includes: displaying whether the stamping equipment is in an abnormal working state. The stamping equipment abnormality detection method according to claim 1, wherein the method further includes: generating a historical health status, the historical health status is a record of the working status of the stamping equipment in previous strokes, wherein the working The condition includes a normal working condition and an abnormal working condition; and generating a working condition prediction rate, the working condition predicting rate is a ratio of the number of times the stamping equipment successfully predicts the working condition to the total number of strokes. An electronic device, which is improved in that the electronic device includes: processor; and A memory, in which a plurality of program modules are stored, and the plurality of program modules are loaded by the processor and executed as described in any one of request items 1 to 9. The method for detecting abnormalities in stamping equipment .

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