TW202307668A - System for detecting abnormalities and method for detecting abnormalities, electronic device, and storage medium - Google Patents

System for detecting abnormalities and method for detecting abnormalities, electronic device, and storage medium Download PDF

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TW202307668A
TW202307668A TW110130766A TW110130766A TW202307668A TW 202307668 A TW202307668 A TW 202307668A TW 110130766 A TW110130766 A TW 110130766A TW 110130766 A TW110130766 A TW 110130766A TW 202307668 A TW202307668 A TW 202307668A
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information
envelope curve
detection result
value
standard value
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TWI799958B (en
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徐鵬
馬晨陽
蔣抱陽
余志成
何林炳
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大陸商深圳富桂精密工業有限公司
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Abstract

The present application provides a system for detecting abnormalities. The system includes a sensor, a data acquisition card, and an electronic device. The present application also provides a method for detecting abnormalities, an electronic device, and a storage medium. The method includes: acquiring data of a component during a normal operation, and extracting a plurality of principal components of the data using a principal component analysis algorithm; calculating a standard value based on the plurality of principal components; generating an envelope curve based on the standard value; obtaining data to be tested when the component is currently running, and detecting whether the component is currently running abnormally according to the data to be tested and the envelope curve. By utilizing the present application, an abnormality detection efficiency and a detection accuracy of an equipment can be improved.

Description

異常檢測系統和異常檢測方法、電子設備及儲存介質Abnormality detection system and abnormality detection method, electronic device and storage medium

本申請涉及資訊分析領域,尤其涉及一種異常檢測系統和異常檢測方法、電子設備及存儲介質。The present application relates to the field of information analysis, and in particular to an anomaly detection system and anomaly detection method, electronic equipment and storage media.

在生產的鍛壓過程中,偶爾會發生異常,導致鍛壓產品不合格,增加生產成本。同時鍛壓過程中出現的異常隱蔽性較強,容易導致相關人員不能及時的發現異常。In the forging process of production, abnormalities occasionally occur, resulting in unqualified forged products and increasing production costs. At the same time, abnormalities in the forging process are highly concealed, and it is easy for relevant personnel to fail to discover abnormalities in time.

鑒於以上內容,有必要提供一種異常檢測方法、電子設備及存儲介質,能提高設備的異常檢測效率和檢測準確率。In view of the above, it is necessary to provide an anomaly detection method, an electronic device and a storage medium, which can improve the abnormality detection efficiency and detection accuracy of the device.

本申請提供一種異常檢測方法,所述方法包括:獲取元器件正常運行時的資訊,透過主成分分析演算法提取所述資訊的多個主成分;根據所述多個主成分計算標準值;根據所述標準值生成包絡曲線;獲取所述元器件當前運行時的待測資訊,根據所述待測資訊與所述包絡曲線檢測所述元器件當前是否運行異常。The present application provides an anomaly detection method, the method comprising: obtaining information on normal operation of components, extracting multiple principal components of the information through a principal component analysis algorithm; calculating standard values according to the multiple principal components; The standard value generates an envelope curve; obtains information to be tested when the component is currently running, and detects whether the component is running abnormally according to the information to be tested and the envelope curve.

在一種可能的實現方式中,所述獲取元器件正常運行時的資訊,透過主成分分析演算法提取所述資訊的多個主成分包括:透過第一感測器獲取鍛壓機正常運行時的第一資訊,及透過第二感測器獲取鍛壓模具正常運行時的第二資訊;透過主成分分析演算法提取所述第一資訊的多個第一主成分,及透過主成分分析演算法提取所述第二資訊的多個第二主成分。In a possible implementation manner, the acquiring the information of the components during normal operation, and extracting multiple principal components of the information through the principal component analysis algorithm includes: acquiring the first sensor during the normal operation of the forging press through the first sensor One information, and the second information obtained by the second sensor when the forging die is in normal operation; the multiple first principal components of the first information are extracted through the principal component analysis algorithm, and all the first principal components are extracted through the principal component analysis algorithm A plurality of second principal components of the second information.

在一種可能的實現方式中,所述根據所述多個主成分計算標準值包括:根據所述多個第一主成分計算得到第一標準值;根據所述多個第二主成分計算得到第二標準值。In a possible implementation manner, the calculating the standard value according to the multiple principal components includes: calculating the first standard value according to the multiple first principal components; calculating the first standard value according to the multiple second principal components. Two standard values.

在一種可能的實現方式中,所述根據所述標準值生成包絡曲線包括:根據所述第一標準值和預設的第一上偏差值確定第一上包絡曲線;根據所述第一標準值和預設的第一下偏差值確定第一下包絡曲線;將所述第一上包絡曲線和所述第一下包絡曲線確定為所述第一包絡曲線;根據所述第二標準值和預設的第二上偏差值確定第二上包絡曲線;根據所述第二標準值和預設的第二下偏差值確定第二下包絡曲線;將所述第二上包絡曲線和所述第二下包絡曲線確定為所述第二包絡曲線。In a possible implementation manner, the generating the envelope curve according to the standard value includes: determining a first upper envelope curve according to the first standard value and a preset first upper deviation value; Determine the first lower envelope curve with the preset first lower deviation value; determine the first upper envelope curve and the first lower envelope curve as the first envelope curve; according to the second standard value and the preset The set second upper deviation value determines the second upper envelope curve; determines the second lower envelope curve according to the second standard value and the preset second lower deviation value; the second upper envelope curve and the second A lower envelope curve is determined as the second envelope curve.

在一種可能的實現方式中,所述獲取所述元器件當前運行時的待測資訊,根據所述待測資訊與上述包絡曲線檢測所述元器件當前是否運行異常包括:透過所述第一感測器獲取所述鍛壓機的第一暫態資訊,及透過所述第二感測器獲取所述鍛壓模具的第二暫態資訊;基於所述第一暫態資訊得到第一統計值,及基於所述第二暫態資訊得到第二統計值;根據所述第一統計值和所述第一包絡曲線確定所述第一檢測結果,及根據所述第二統計值和所述第二包絡曲線確定所述第二檢測結果;根據所述第一檢測結果和所述第二檢測結果確定鍛壓過程是否存在異常。In a possible implementation manner, the acquiring the information to be tested when the component is currently running, and detecting whether the component is running abnormally according to the information to be tested and the envelope curve includes: through the first sensor obtaining the first transient information of the forging press by a detector, and obtaining the second transient information of the forging die through the second sensor; obtaining a first statistical value based on the first transient information, and Obtaining a second statistical value based on the second transient information; determining the first detection result according to the first statistical value and the first envelope curve, and determining the first detection result according to the second statistical value and the second envelope The curve determines the second detection result; and determines whether there is an abnormality in the forging process according to the first detection result and the second detection result.

在一種可能的實現方式中,所述根據所述第一統計值和所述第一包絡曲線確定所述第一檢測結果包括:判斷所述第一統計值是否包含在所述第一包絡曲線內;當所述第一統計值包含在所述第一包絡曲線內時,確定所述第一檢測結果為正常;當所述第一統計值不包含在所述第一包絡曲線內時,確定所述第一檢測結果為異常。In a possible implementation manner, the determining the first detection result according to the first statistical value and the first envelope curve includes: judging whether the first statistical value is included in the first envelope curve ; When the first statistical value is included in the first envelope curve, determine that the first detection result is normal; when the first statistical value is not included in the first envelope curve, determine that the The above-mentioned first detection result is abnormal.

在一種可能的實現方式中,所述根據所述第一檢測結果和所述第二檢測結果確定鍛壓過程是否存在異常包括:當所述第一檢測結果及所述第二檢測結果中每個檢測結果均為正常時,確定所述鍛壓過程正常;當所述第一檢測結果及所述第二檢測結果中至少有一個檢測結果是異常,確定所述鍛壓過程存在異常。In a possible implementation manner, the determining whether there is an abnormality in the forging process according to the first detection result and the second detection result includes: when each of the first detection result and the second detection result detects When the results are all normal, it is determined that the forging process is normal; when at least one of the first detection result and the second detection result is abnormal, it is determined that the forging process is abnormal.

本申請還提供一種異常檢測系統,所述異常檢測系統包括:感測器,用於採集元器件的資訊;資訊獲取卡,與所述感測器通信連接,用於接收所述資訊;電子設備,與所述資訊獲取卡通信連接,用於對所述資訊進行資訊分析,得到異常檢測結果;根據所述異常檢測結果確定所述元器件是否存在異常。The present application also provides an abnormality detection system, the abnormality detection system includes: a sensor, used to collect information of components; an information acquisition card, communicated with the sensor, used to receive the information; electronic equipment , communicated with the information acquisition card, and is used to analyze the information to obtain an abnormality detection result; determine whether the components are abnormal according to the abnormality detection result.

本申請還提供一種電子設備,所述電子設備包括處理器和記憶體,所述處理器用於執行所述記憶體中存儲的電腦程式時實現所述的異常檢測方法。The present application also provides an electronic device, the electronic device includes a processor and a memory, and the processor is configured to implement the abnormality detection method when executing a computer program stored in the memory.

本申請還提供一種電腦可讀存儲介質,所述電腦可讀存儲介質上存儲有電腦程式,所述電腦程式被處理器執行時實現所述的異常檢測方法。The present application also provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the abnormality detection method is implemented.

本申請公開的異常檢測方法及相關設備,採用鍛壓包絡線曲線和PCA演算法結合的方法來檢測鍛壓過程是否存在異常,提高了異常檢測的準確率。The anomaly detection method and related equipment disclosed in the present application use a method combining the forging envelope curve and the PCA algorithm to detect whether there is an anomaly in the forging process, which improves the accuracy of anomaly detection.

為了使本申請的目的、技術方案和優點更加清楚,下面結合附圖和具體實施例對本申請進行詳細描述。In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

圖1是本申請實施例提供的一種異常檢測系統。如圖1所示,異常檢測系統1包括:感測器10、資訊獲取卡11、電子設備12。其中,所述感測器10用於採集元器件的資訊,安裝於所述元器件的表面,所述資訊獲取卡11與所述感測器通信連接,用於接收所述資訊,所述電子設備12與所述資訊獲取卡通信連接,用於對所述資訊進行資訊分析,得到異常檢測結果。FIG. 1 is an anomaly detection system provided by an embodiment of the present application. As shown in FIG. 1 , the anomaly detection system 1 includes: a sensor 10 , an information acquisition card 11 , and an electronic device 12 . Wherein, the sensor 10 is used to collect information of components, and is installed on the surface of the components, and the information acquisition card 11 is connected to the sensor for receiving the information, and the electronic The device 12 is communicatively connected with the information acquisition card, and is used for performing information analysis on the information to obtain abnormality detection results.

在本申請的一個實施例中,所述元器件包括鍛壓機13和鍛壓模具14。所述感測器10包括至少一個第一感測器101和至少一個第二感測器102,其中,所述第一感測器101用於採集所述鍛壓機13的資訊,所述第二感測器102用於採集所述鍛壓模具14的資訊。In one embodiment of the present application, the components include a forging press 13 and a forging die 14 . The sensor 10 includes at least one first sensor 101 and at least one second sensor 102, wherein the first sensor 101 is used to collect information of the forging press 13, and the second The sensor 102 is used for collecting information of the forging die 14 .

在本申請的一個實施例中,針對鍛壓模具硬度高、不易開槽加工的特點,採用粘貼安裝方式將超聲感測器固定在所述鍛壓模具表面,無需破壞鍛壓模具的本體結構。In one embodiment of the present application, the ultrasonic sensor is fixed on the surface of the forging die by pasting and mounting, without destroying the main body structure of the forging die, in view of the characteristics of high hardness of the forging die and difficulty in grooving.

在本申請的一個實施例中,所述資訊獲取卡11上安裝有鐳射觸發裝置111,用於對所述資訊進行切分。In one embodiment of the present application, the information acquisition card 11 is equipped with a laser trigger device 111 for dividing the information.

在本申請的一個實施例中,所述電子設備12顯示資訊分析介面,所述資訊分析介面上顯示資訊分析結果,用於展示所述異常檢測結果。透過展示所述異常檢測結果便於相關人員及時發現問題。In one embodiment of the present application, the electronic device 12 displays an information analysis interface, and the information analysis interface displays information analysis results for displaying the abnormality detection results. By displaying the abnormal detection results, it is convenient for relevant personnel to find problems in time.

透過安裝所述感測器,即時監控鍛壓過程,並透過所述感測器獲取資訊,預警鍛壓過程的健康狀態。By installing the sensor, the forging process can be monitored in real time, and information can be obtained through the sensor to warn the health status of the forging process.

請參閱圖2,圖2為本申請一實施例的電子設備12的示意圖。參閱圖2所示,所述電子設備12包括,但不局限於,記憶體121和至少一個處理器122上述元件之間可以透過匯流排連接,也可以直接連接。Please refer to FIG. 2 , which is a schematic diagram of an electronic device 12 according to an embodiment of the present application. As shown in FIG. 2 , the electronic device 12 includes, but is not limited to, a memory 121 and at least one processor 122 . The above components may be connected through a bus bar or directly.

所述電子設備12可以是電腦、手機、平板電腦、個人數位助理(Personal Digital Assistant,PDA)等安裝有應用程式的設備。本領域技術人員可以理解,所述示意圖2僅僅是電子設備12的示例,並不構成對電子設備12的限定,可以包括比圖示更多或更少的部件,或者組合某些部件,或者不同的部件,例如所述電子設備12還可以包括輸入輸出設備、網路接入設備、匯流排等。The electronic device 12 may be a computer, a mobile phone, a tablet computer, a personal digital assistant (Personal Digital Assistant, PDA) and other devices installed with application programs. Those skilled in the art can understand that the schematic diagram 2 is only an example of the electronic device 12, and does not constitute a limitation to the electronic device 12. For example, the electronic device 12 may also include input and output devices, network access devices, bus bars, and the like.

如圖3所示,是本申請異常檢測方法的較佳實施例的流程圖。所述異常檢測方法應用在所述電子設備12中。根據不同的需求,該流程圖中步驟的順序可以改變,某些步驟可以省略。在本實施方式中,所述異常檢測方法包括:As shown in FIG. 3 , it is a flow chart of a preferred embodiment of the anomaly detection method of the present application. The abnormality detection method is applied in the electronic device 12 . According to different requirements, the order of the steps in the flowchart can be changed, and some steps can be omitted. In this embodiment, the abnormality detection method includes:

S11、獲取元器件正常運行時的資訊,透過主成分分析演算法提取所述資訊的多個主成分。S11. Acquiring information on normal operation of components, and extracting multiple principal components of the information through a principal component analysis algorithm.

在本申請的一個實施例中,所述獲取元器件正常運行時的資訊,透過主成分分析演算法提取所述資訊的多個主成分包括:透過第一感測器獲取鍛壓機正常運行時的第一資訊,及透過第二感測器獲取鍛壓模具正常運行時的第二資訊;透過主成分分析演算法提取所述第一資訊的多個第一主成分,及透過主成分分析演算法提取所述第二資訊的多個第二主成分。主成分分析(Principal components analysis, PCA)是一種透過降維技術把多個變數化為少數幾個主成分的統計方法。它可以對高維資訊進行降維減少預測變數的個數,同時經過降維除去雜訊。In one embodiment of the present application, the acquisition of the information of the normal operation of the components, and the extraction of multiple principal components of the information through the principal component analysis algorithm include: obtaining the information of the normal operation of the forging press through the first sensor The first information, and the second information obtained by the second sensor when the forging die is in normal operation; the plurality of first principal components of the first information are extracted through the principal component analysis algorithm, and extracted through the principal component analysis algorithm A plurality of second principal components of the second information. Principal components analysis (PCA) is a statistical method that converts multiple variables into a few principal components through dimensionality reduction techniques. It can reduce the dimensionality of high-dimensional information to reduce the number of predictive variables, and remove noise through dimensionality reduction.

具體實施時,During specific implementation,

(1)對所述第一資訊進行標準化處理,得到第一標準化資訊。透過所述PCA演算法對所述第一標準化資訊進行降維,得到若干個第一主成分,具體地,計算所述第一標準化資訊的第一協方差矩陣,進而計算所述第一協方差矩陣的第一特徵值和第一特徵向量,獲取每個所述第一特徵值的貢獻率,並將所述貢獻率大於預設第一閾值的第一主成分作為所述多個第一主成分。(1) Standardize the first information to obtain first standardized information. Using the PCA algorithm to reduce the dimensionality of the first standardized information to obtain several first principal components, specifically, calculate the first covariance matrix of the first standardized information, and then calculate the first covariance The first eigenvalue and the first eigenvector of the matrix, the contribution rate of each of the first eigenvalues is obtained, and the first principal component whose contribution rate is greater than the preset first threshold is used as the plurality of first principal components Element.

(2)對所述第二資訊進行標準化處理,得到第二標準化資訊。透過所述PCA演算法對所述第二標準化資訊進行降維,得到若干個第二主成分,具體地,計算所述第二標準化資訊的第二協方差矩陣,進而計算所述第二協方差矩陣的第二特徵值和第二特徵向量,獲取每個所述第二特徵值的貢獻率,並將所述貢獻率大於預設第二閾值的第二主成分作為所述多個第二主成分。(2) Standardize the second information to obtain second standardized information. Using the PCA algorithm to reduce the dimension of the second normalized information to obtain several second principal components, specifically, calculate the second covariance matrix of the second normalized information, and then calculate the second covariance The second eigenvalue and the second eigenvector of the matrix, obtaining the contribution rate of each of the second eigenvalues, and using the second principal component whose contribution rate is greater than the preset second threshold as the plurality of second principal components Element.

透過利用主成分分析演算法將大量資訊降維為少量資訊,減少了資訊的複雜性,可以提高資訊分析的效率和準確率。By using the principal component analysis algorithm to reduce a large amount of information into a small amount of information, the complexity of the information is reduced, and the efficiency and accuracy of information analysis can be improved.

S12、根據所述多個主成分計算標準值。S12. Calculate a standard value according to the plurality of principal components.

在本申請的一個實施例中,所述根據所述多個主成分計算標準值包括:根據所述多個第一主成分計算得到第一標準值;根據所述多個第二主成分計算得到第二標準值。In an embodiment of the present application, the calculating the standard value according to the plurality of principal components includes: calculating the first standard value according to the plurality of first principal components; calculating and obtaining the standard value according to the plurality of second principal components second standard value.

具體實施時,所述根據所述多個第一主成分計算得到第一標準值包括:During specific implementation, the first standard value calculated according to the plurality of first principal components includes:

將所述多個第一主成分輸入至預先訓練完成的PCA模型,輸出所述第一標準值為 ,其中, 為顯著性水準, 為服從第一自由度為 ,第二自由度為 的 分佈。Input the multiple first principal components into the pre-trained PCA model, and output the first standard value , where is the significance level, and is a distribution that obeys the first degree of freedom and the second degree of freedom.

作為一種可選的實施方式,所述根據所述多個第一主成分計算得到第一標準值還包括:As an optional implementation manner, the calculating and obtaining the first standard value according to the plurality of first principal components further includes:

將所述多個第一主成分輸入至預先訓練完成的PCA模型,輸出所述第一標準值為 。Input the multiple first principal components into the pre-trained PCA model, and output the first standard value as .

具體實施時,所述根據所述多個第二主成分計算得到第二標準值包括:During specific implementation, the second standard value calculated according to the plurality of second principal components includes:

將所述多個第二主成分輸入至預先訓練完成的PCA模型,輸出所述第二標準值為 ,其中, 為顯著性水準, 為服從第一自由度為 ,第二自由度為 的 分佈。The plurality of second principal components are input to the pre-trained PCA model, and the second standard value is outputted, where is the significance level, and is a distribution that obeys the first degree of freedom and the second degree of freedom.

作為一種可選的實施方式,所述根據所述多個第二主成分計算得到第二標準值還包括:As an optional implementation manner, the calculating and obtaining the second standard value according to the plurality of second principal components further includes:

將所述多個第二主成分輸入至預先訓練完成的PCA模型,輸出所述第二標準值為 。Input the plurality of second principal components into the pre-trained PCA model, and output the second standard value as .

在本申請的一個實施例中,所述標準值為所述元器件正常運行時的標準資訊。In one embodiment of the present application, the standard value is standard information when the component is in normal operation.

S13、根據所述標準值生成包絡曲線。S13. Generate an envelope curve according to the standard value.

在本申請的一個實施例中,所述根據所述標準值生成包絡曲線包括:根據所述第一標準值生成第一包絡曲線;根據所述第二標準值生成第二包絡曲線。In an embodiment of the present application, the generating the envelope curve according to the standard value includes: generating a first envelope curve according to the first standard value; generating a second envelope curve according to the second standard value.

在本申請的一個實施例中,所述根據所述第一標準值生成第一包絡曲線包括:設置第一上偏差值和第一下偏差值;根據所述第一標準值和所述第一上偏差值確定第一上包絡曲線;根據所述第一標準值和所述第一下偏差值確定第一下包絡曲線;將所述第一上包絡曲線和所述第一下包絡曲線確定為所述第一包絡曲線。In an embodiment of the present application, the generating the first envelope curve according to the first standard value includes: setting a first upper deviation value and a first lower deviation value; The upper deviation value determines the first upper envelope curve; the first lower envelope curve is determined according to the first standard value and the first lower deviation value; the first upper envelope curve and the first lower envelope curve are determined as The first envelope curve.

具體實施時,將所述第一標準值與所述第一上偏差值的和作為第一上頂點,將所述第一標準值與所述第一下偏差值的差作為第一下頂點。根據所述步驟S11中的所述第一資訊繪製第一資訊曲線圖,例如,圖4所示的資訊圖。接著在所述第一資訊曲線圖中標誌出所述第一上頂點和所述第一下頂點。在所述第一資訊曲線圖中查找小於所述第一上頂點的極大值點,並連接所述第一上頂點和所述極大值點,得到所述第一上包絡曲線。在所述第一資訊曲線圖中查找小於所述第一下頂點的極小值點,並連接所述第一下頂點和所述極小值點,得到所述第一下包絡曲線。將所第一上包絡曲線和所述第一下包絡曲線確定為所述第一包絡曲線。例如,圖5所示的包絡曲線圖。During specific implementation, the sum of the first standard value and the first upper deviation value is used as the first upper vertex, and the difference between the first standard value and the first lower deviation value is used as the first lower vertex. Draw a first information graph according to the first information in the step S11 , for example, the information graph shown in FIG. 4 . Then mark the first upper vertex and the first lower vertex in the first information graph. Finding a maximum value point smaller than the first upper vertex in the first information graph, and connecting the first upper vertex and the maximum value point to obtain the first upper envelope curve. Finding a minimum value point smaller than the first lower vertex in the first information graph, and connecting the first lower vertex and the minimum value point to obtain the first lower envelope curve. The first upper envelope curve and the first lower envelope curve are determined as the first envelope curve. For example, the envelope graph shown in Figure 5.

在本申請的一個實施例中,所述根據所述第二標準值生成第二包絡曲線包括:設置第二上偏差值和第二下偏差值;根據所述第二標準值和所述第二上偏差值確定第二上包絡曲線;根據所述第二標準值和所述第二下偏差值確定第二下包絡曲線;將所述第二上包絡曲線和所述第二下包絡曲線確定為所述第二包絡曲線。In an embodiment of the present application, the generating the second envelope curve according to the second standard value includes: setting a second upper deviation value and a second lower deviation value; according to the second standard value and the second The upper deviation value determines the second upper envelope curve; determines the second lower envelope curve according to the second standard value and the second lower deviation value; determines the second upper envelope curve and the second lower envelope curve as The second envelope curve.

具體實施時,將所述第二標準值與所述第二上偏差值的和作為第二上頂點,將所述第二標準值與所述第二下偏差值的差作為第二下頂點。根據所述步驟S11中的所述第二資訊繪製第二資訊曲線圖。接著在所述第二資訊曲線圖中標誌出所述第二上頂點和所述第二下頂點。在所述第二資訊曲線圖中查找小於所述第二頂點的極大值點,並連接所述第二上頂點和所述極大值點,得到所述第二上包絡曲線。在所述第二資訊曲線圖中查找小於所述第二下頂點的極小值點,並連接所述第二下頂點和所述極小值點,得到所述第二下包絡曲線。將所第二上包絡曲線和所述第二下包絡曲線確定為所述第二包絡曲線。During specific implementation, the sum of the second standard value and the second upper deviation value is used as the second upper vertex, and the difference between the second standard value and the second lower deviation value is used as the second lower vertex. Draw a second information graph according to the second information in the step S11. Then mark the second upper vertex and the second lower vertex in the second information graph. Finding a maximum value point smaller than the second vertex in the second information graph, and connecting the second upper vertex and the maximum value point to obtain the second upper envelope curve. Finding a minimum value point smaller than the second lower vertex in the second information graph, and connecting the second lower vertex and the minimum value point to obtain the second lower envelope curve. The second upper envelope curve and the second lower envelope curve are determined as the second envelope curve.

透過根據正常資訊的標準值繪製包絡曲線,明確了正常資訊區間,後續透過所述包絡曲線可以直接確定正常資訊和異常資訊。By drawing the envelope curve according to the standard value of the normal information, the interval of the normal information is defined, and the normal information and the abnormal information can be directly determined through the envelope curve subsequently.

S14、獲取所述元器件當前運行時的待測資訊,根據所述待測資訊與上述包絡曲線檢測所述元器件當前是否運行異常。S14. Obtain the information to be tested when the component is currently running, and detect whether the component is running abnormally according to the information to be tested and the envelope curve.

在本申請的一個實施例中,所述獲取所述元器件當前運行時的待測資訊,根據所述待測資訊與上述包絡曲線檢測所述元器件當前是否運行異常包括:In one embodiment of the present application, the acquisition of the information to be tested when the component is currently running, and detecting whether the component is currently running abnormally according to the information to be tested and the above envelope curve includes:

(1)透過所述第一感測器獲取所述鍛壓機的第一暫態資訊,及透過所述第二感測器獲取所述鍛壓模具的第二暫態資訊。具體實施時,獲取到所述第一暫態資訊和所述第二暫態資訊後,透過所述鐳射觸發裝置對所述第一暫態資訊和所述第二暫態資訊進行切分。透過資訊切分可以去除掉不規範資訊和多餘資訊,得到有用資訊。(1) Obtaining first transient information of the forging press through the first sensor, and obtaining second transient information of the forging die through the second sensor. During specific implementation, after the first transient information and the second transient information are obtained, the first transient information and the second transient information are segmented through the laser trigger device. Irregular information and redundant information can be removed through information segmentation to obtain useful information.

(2)基於所述第一暫態資訊得到第一統計值,及基於所述第二暫態資訊得到第二統計值。其中,所述第一統計值為第一T2值,所述第二統計值為第二T2值。具體實施時,利用所述PCA演算法對所述第一暫態資訊進行計算得到所述第一T2值,及利用所述PCA演算法對所述第二暫態資訊進行計算得到所述第二統計值T2。(2) Obtaining a first statistical value based on the first transient information, and obtaining a second statistical value based on the second transient information. Wherein, the first statistical value is a first T2 value, and the second statistical value is a second T2 value. During specific implementation, the PCA algorithm is used to calculate the first transient information to obtain the first T2 value, and the PCA algorithm is used to calculate the second transient information to obtain the second Statistics T2.

(3)根據所述第一統計值和所述第一包絡曲線確定所述第一檢測結果,及根據所述第二統計值和所述第二包絡曲線確定所述第二檢測結果。具體實施時,判斷所述第一T2值是否包含在所述第一包絡曲線內,當所述第一T2值包含在所述第一包絡曲線內時,說明所述第一暫態資訊為正常資訊,確定所述第一檢測結果為正常。當所述第一T2值不包含在所述第一包絡曲線內時,說明所述第一暫態資訊為異常資訊,確定所述第一檢測結果為異常。接著判斷所述第二T2值是否包含在所述第二包絡曲線內,當所述第二T2值包含在所述第二包絡曲線內時,說明所述第二暫態資訊為正常資訊,確定所述第二檢測結果為正常。當所述第二T2值不包含在所述第二包絡曲線內時,說明所述第二暫態資訊為異常資訊,確定所述第二檢測結果為異常。(3) Determine the first detection result according to the first statistical value and the first envelope curve, and determine the second detection result according to the second statistical value and the second envelope curve. During specific implementation, it is judged whether the first T2 value is included in the first envelope curve, and when the first T2 value is included in the first envelope curve, it means that the first transient information is normal Information, determine that the first detection result is normal. When the first T2 value is not included in the first envelope curve, it indicates that the first transient information is abnormal information, and the first detection result is determined to be abnormal. Then judge whether the second T2 value is included in the second envelope curve, when the second T2 value is included in the second envelope curve, it means that the second transient information is normal information, and determine The second detection result is normal. When the second T2 value is not included in the second envelope curve, it indicates that the second transient information is abnormal information, and the second detection result is determined to be abnormal.

(4)根據所述第一檢測結果和所述第二檢測結果確定鍛壓過程是否存在異常。當所述第一檢測結果及所述第二檢測結果中每個檢測結果均為正常時,確定所述鍛壓過程正常。當所述第一檢測結果及所述第二檢測結果中至少有一個檢測結果是異常,確定所述鍛壓過程存在異常,也就是說,當所述第一異常檢測結果為存在異常,且所述第二異常檢測結果為無異常時,確定所述鍛壓過程存在異常,當所述第一異常檢測結果為無異常,且所述第二異常檢測結果為存在異常時,確定所述鍛壓過程存在異常,當所述第一異常檢測結果為存在異常,且所述第二異常檢測結果為存在異常時,確定所述鍛壓過程存在異常。並將檢測結果在資訊分析介面上顯示,當所述鍛壓過程存在異常時,生成報警提示資訊,提醒工作人員及時進行查看。(4) Determine whether there is an abnormality in the forging process according to the first detection result and the second detection result. When each of the first detection result and the second detection result is normal, it is determined that the forging process is normal. When at least one of the first detection result and the second detection result is abnormal, it is determined that the forging process is abnormal, that is, when the first abnormal detection result is abnormal, and the When the second abnormality detection result is no abnormality, it is determined that there is an abnormality in the forging process; when the first abnormality detection result is no abnormality, and the second abnormality detection result is abnormal, it is determined that there is an abnormality in the forging process , when the first abnormality detection result is abnormal and the second abnormality detection result is abnormal, it is determined that the forging process is abnormal. And the detection results are displayed on the information analysis interface. When there is an abnormality in the forging process, an alarm message is generated to remind the staff to check it in time.

透過持續採集分析資訊,並進行生產驗證,從而減少產品的異常率。同時採用鍛壓包絡線曲線和PCA演算法結合的方法來檢測鍛壓過程是否存在異常,可以提高異常檢測的準確率。By continuously collecting and analyzing information and conducting production verification, the abnormal rate of products can be reduced. At the same time, the combination of forging envelope curve and PCA algorithm is used to detect whether there is anomaly in the forging process, which can improve the accuracy of anomaly detection.

作為一種可選的實施方式,所述方法還包括:採集異常報警的準確率,當所述準確率小於預設的閾值時,重新獲取所述元器件正常運行時的資訊,並執行步驟S11-步驟S14。As an optional implementation, the method further includes: collecting the accuracy rate of abnormal alarms, and when the accuracy rate is less than a preset threshold, reacquiring information about the normal operation of the components, and performing step S11- Step S14.

請繼續參閱圖2,本實施例中,所述記憶體121可以是電子設備12的內部記憶體,即內置於所述電子設備12的記憶體。在其他實施例中,所述記憶體121也可以是電子設備12的外部記憶體,即外接於所述電子設備12的記憶體。Please continue to refer to FIG. 2 , in this embodiment, the memory 121 may be an internal memory of the electronic device 12 , that is, a memory built in the electronic device 12 . In other embodiments, the memory 121 may also be an external memory of the electronic device 12 , that is, a memory externally connected to the electronic device 12 .

在一些實施例中,所述記憶體121用於存儲程式碼和各種資訊,並在電子設備12的運行過程中實現高速、自動地完成程式或資訊的存取。In some embodiments, the memory 121 is used to store program codes and various information, and realize high-speed and automatic access to programs or information during the operation of the electronic device 12 .

所述記憶體121可以包括隨機存取記憶體,還可以包括非易失性記憶體,例如硬碟、記憶體、插接式硬碟、智慧存儲卡(Smart Media Card,SMC)、安全數位(Secure Digital,SD)卡、快閃記憶體卡(Flash Card)、至少一個磁碟記憶體件、快閃記憶體器件、或其他易失性固態記憶體件。The memory 121 may include random access memory, and may also include non-volatile memory, such as hard disk, memory, plug-in hard disk, smart memory card (Smart Media Card, SMC), secure digital ( Secure Digital (SD) card, flash memory card (Flash Card), at least one disk memory device, flash memory device, or other volatile solid-state memory device.

在一實施例中,所述處理器122可以是中央處理單元(Central Processing Unit,CPU),還可以是其他通用處理器、數位訊號處理器 (Digital Signal Processor,DSP)、專用積體電路 (Application Specific Integrated Circuit,ASIC)、現場可程式設計閘陣列(Field-Programmable Gate Array,FPGA) 或者其他可程式設計邏輯器件、分立門或者電晶體邏輯器件、分立硬體元件等。通用處理器可以是微處理器或者所述處理器也可以是其它任何常規的處理器等。In one embodiment, the processor 122 may be a central processing unit (Central Processing Unit, CPU), and may also be other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application-specific integrated circuits (Application Specific Integrated Circuit, ASIC), Field-Programmable Gate Array (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor, or the processor may be any other conventional processor and the like.

所述記憶體121中的程式碼和各種資訊如果以軟體功能單元的形式實現並作為獨立的產品銷售或使用時,可以存儲在一個電腦可讀取存儲介質中。基於這樣的理解,本申請實現上述實施例方法中的全部或部分流程,例如異常檢測方法,也可以透過電腦程式來指令相關的硬體來完成,所述的電腦程式可存儲於一電腦可讀存儲介質中,所述電腦程式在被處理器執行時,可實現上述各個方法實施例的步驟。其中,所述電腦程式包括電腦程式代碼,所述電腦程式代碼可以為原始程式碼形式、物件代碼形式、可執行檔或某些中間形式等。所述電腦可讀介質可以包括:能夠攜帶所述電腦程式代碼的任何實體或裝置、記錄介質、隨身碟、移動硬碟、磁碟、光碟、電腦記憶體、唯讀記憶體(ROM,Read-Only Memory)等。If the program codes and various information in the memory 121 are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the methods of the above-mentioned embodiments, such as the anomaly detection method, which can also be completed by instructing related hardware through computer programs, and the computer programs can be stored in a computer-readable In the storage medium, when the computer program is executed by the processor, the steps of the above-mentioned various method embodiments can be realized. Wherein, the computer program includes computer program code, and the computer program code may be in the form of original code, object code, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, flash drive, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM, Read- Only Memory), etc.

可以理解的是,以上所描述的模組劃分,為一種邏輯功能劃分,實際實現時可以有另外的劃分方式。另外,在本申請各個實施例中的各功能模組可以集成在相同處理單元中,也可以是各個模組單獨物理存在,也可以兩個或兩個以上模組集成在相同單元中。上述集成的模組既可以採用硬體的形式實現,也可以採用硬體加軟體功能模組的形式實現。It can be understood that the module division described above is a logical function division, and there may be another division method in actual implementation. In addition, each functional module in each embodiment of the present application may be integrated into the same processing unit, or each module may exist separately physically, or two or more modules may be integrated into the same unit. The above-mentioned integrated modules can be implemented in the form of hardware, or in the form of hardware plus software function modules.

最後應說明的是,以上實施例僅用以說明本申請的技術方案而非限制,儘管參照較佳實施例對本申請進行了詳細說明,本領域的普通技術人員應當理解,可以對本申請的技術方案進行修改或等同替換,而不脫離本申請技術方案的精神和範圍。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application without limitation. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be Make modifications or equivalent replacements without departing from the spirit and scope of the technical solutions of the present application.

1:異常檢測系統 10:感測器 101:第一感測器 102:第二感測器 11:資訊獲取卡 111:鐳射觸發裝置 12:電子設備 121:記憶體 122:處理器 123:通訊匯流排 13:鍛壓機 14:鍛壓模具 S11~S14:步驟 1: Anomaly detection system 10: Sensor 101: The first sensor 102: Second sensor 11: Information acquisition card 111:Laser trigger device 12: Electronic equipment 121: Memory 122: Processor 123: communication bus 13: Forging press 14: Forging die S11~S14: Steps

為了更清楚地說明本申請實施例或習知技術中的技術方案,下面將對實施例或習知技術描述中所需要使用的附圖作簡單地介紹,顯而易見地,下面描述中的附圖僅僅是本申請的實施例,對於本領域普通技術人員來講,在不付出創造性勞動的前提下,還可以根據提供的附圖獲得其他的附圖。In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the accompanying drawings that need to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present application, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.

圖1是本申請實施例提供的一種異常檢測系統的結構示意圖。FIG. 1 is a schematic structural diagram of an anomaly detection system provided by an embodiment of the present application.

圖2是本申請實施例提供的一種異常檢測方法的電子設備的結構示意圖。FIG. 2 is a schematic structural diagram of an electronic device for an abnormality detection method provided by an embodiment of the present application.

圖3是本申請實施例提供的一種異常檢測方法的流程圖。FIG. 3 is a flow chart of an abnormality detection method provided by an embodiment of the present application.

圖4是本申請實施例提供的一種示例性資訊曲線圖。FIG. 4 is an exemplary information graph provided by an embodiment of the present application.

圖5是本申請實施例提供的一種示例性包絡曲線圖。Fig. 5 is an exemplary envelope curve diagram provided by an embodiment of the present application.

S11~S14:步驟 S11~S14: Steps

Claims (10)

一種異常檢測方法,其中,所述異常檢測方法包括: 獲取元器件正常運行時的資訊,透過主成分分析演算法提取所述資訊的多個主成分; 根據所述多個主成分計算標準值; 根據所述標準值生成包絡曲線; 獲取所述元器件當前運行時的待測資訊,根據所述待測資訊與所述包絡曲線檢測所述元器件當前是否運行異常。 An anomaly detection method, wherein the anomaly detection method includes: Obtain the information of the normal operation of the components, and extract multiple principal components of the information through the principal component analysis algorithm; calculating standard values based on the plurality of principal components; generating an envelope curve according to said standard value; Obtaining the information to be tested when the component is currently running, and detecting whether the component is running abnormally according to the information to be tested and the envelope curve. 如請求項1所述的異常檢測方法,其中,所述獲取元器件正常運行時的資訊,透過主成分分析演算法提取所述資訊的多個主成分包括: 透過第一感測器獲取鍛壓機正常運行時的第一資訊,及透過第二感測器獲取鍛壓模具正常運行時的第二資訊; 透過主成分分析演算法提取所述第一資訊的多個第一主成分,及透過主成分分析演算法提取所述第二資訊的多個第二主成分。 The abnormality detection method as described in claim item 1, wherein said acquisition of information of components during normal operation, and extracting multiple principal components of said information through a principal component analysis algorithm include: Obtain the first information when the forging press is in normal operation through the first sensor, and obtain the second information when the forging die is in normal operation through the second sensor; A plurality of first principal components of the first information are extracted through a principal component analysis algorithm, and a plurality of second principal components of the second information are extracted through a principal component analysis algorithm. 如請求項2所述的異常檢測方法,其中,所述根據所述多個主成分計算標準值包括: 根據所述多個第一主成分計算得到第一標準值; 根據所述多個第二主成分計算得到第二標準值。 The anomaly detection method according to claim 2, wherein said calculating standard values according to said plurality of principal components includes: calculating a first standard value according to the plurality of first principal components; A second standard value is obtained by calculating the plurality of second principal components. 如請求項3所述的異常檢測方法,其中,所述根據所述標準值生成包絡曲線包括: 根據所述第一標準值和預設的第一上偏差值確定第一上包絡曲線; 根據所述第一標準值和預設的第一下偏差值確定第一下包絡曲線; 將所述第一上包絡曲線和所述第一下包絡曲線確定為所述第一包絡曲線; 根據所述第二標準值和預設的第二上偏差值確定第二上包絡曲線; 根據所述第二標準值和預設的第二下偏差值確定第二下包絡曲線; 將所述第二上包絡曲線和所述第二下包絡曲線確定為所述第二包絡曲線。 The anomaly detection method according to claim 3, wherein said generating an envelope curve according to said standard value comprises: determining a first upper envelope curve according to the first standard value and a preset first upper deviation value; determining a first lower envelope curve according to the first standard value and a preset first lower deviation value; determining the first upper envelope curve and the first lower envelope curve as the first envelope curve; determining a second upper envelope curve according to the second standard value and a preset second upper deviation value; determining a second lower envelope curve according to the second standard value and a preset second lower deviation value; The second upper envelope curve and the second lower envelope curve are determined as the second envelope curve. 如請求項4所述的異常檢測方法,其中,所述獲取所述元器件當前運行時的待測資訊,根據所述待測資訊與上述包絡曲線檢測所述元器件當前是否運行異常包括: 透過所述第一感測器獲取所述鍛壓機的第一暫態資訊,及透過所述第二感測器獲取所述鍛壓模具的第二暫態資訊; 基於所述第一暫態資訊得到第一統計值,及基於所述第二暫態資訊得到第二統計值; 根據所述第一統計值和所述第一包絡曲線確定所述第一檢測結果,及根據所述第二統計值和所述第二包絡曲線確定所述第二檢測結果; 根據所述第一檢測結果和所述第二檢測結果確定鍛壓過程是否存在異常。 The abnormality detection method as described in claim item 4, wherein said obtaining the information to be tested when the component is currently running, and detecting whether the component is currently running abnormally according to the information to be tested and the envelope curve includes: acquiring first transient information of the forging press through the first sensor, and acquiring second transient information of the forging die through the second sensor; obtaining a first statistical value based on the first transient information, and obtaining a second statistical value based on the second transient information; determining the first detection result according to the first statistical value and the first envelope curve, and determining the second detection result according to the second statistical value and the second envelope curve; Determine whether there is an abnormality in the forging process according to the first detection result and the second detection result. 如請求項5所述的異常檢測方法,其中,所述根據所述第一統計值和所述第一包絡曲線確定所述第一檢測結果包括: 判斷所述第一統計值是否包含在所述第一包絡曲線內; 當所述第一統計值包含在所述第一包絡曲線內時,確定所述第一檢測結果為正常; 當所述第一統計值不包含在所述第一包絡曲線內時,確定所述第一檢測結果為異常。 The anomaly detection method according to claim 5, wherein said determining the first detection result according to the first statistical value and the first envelope curve comprises: judging whether the first statistical value is included in the first envelope curve; When the first statistical value is included in the first envelope curve, determining that the first detection result is normal; When the first statistical value is not included in the first envelope curve, it is determined that the first detection result is abnormal. 如請求項6所述的異常檢測方法,其中,所述根據所述第一檢測結果和所述第二檢測結果確定鍛壓過程是否存在異常包括: 當所述第一檢測結果及所述第二檢測結果中每個檢測結果均為正常時,確定所述鍛壓過程正常; 當所述第一檢測結果及所述第二檢測結果中至少有一個檢測結果是異常,確定所述鍛壓過程存在異常。 The abnormality detection method according to claim 6, wherein said determining whether there is an abnormality in the forging process according to the first detection result and the second detection result includes: When each of the first detection result and the second detection result is normal, it is determined that the forging process is normal; When at least one of the first detection result and the second detection result is abnormal, it is determined that the forging process is abnormal. 一種異常檢測系統,其中,所述異常檢測系統包括: 感測器,用於採集元器件的資訊; 資訊獲取卡,與所述感測器通信連接,用於接收所述資訊; 電子設備,與所述資訊獲取卡通信連接,用於執行如請求項1至7所述的異常檢測方法,對所述資訊進行資訊分析,得到異常檢測結果,並根據所述異常檢測結果確定所述元器件是否存在異常。 An anomaly detection system, wherein the anomaly detection system includes: Sensors are used to collect information about components; an information acquisition card, communicatively connected to the sensor, for receiving the information; The electronic device is communicatively connected with the information acquisition card, and is used to execute the abnormality detection method as described in the request items 1 to 7, perform information analysis on the information, obtain the abnormality detection result, and determine the abnormality detection result according to the abnormality detection result. Check whether the above components are abnormal. 一種電子設備,其中,所述電子設備包括處理器和記憶體,所述處理器用於執行記憶體中儲存的電腦程式以實現如請求項1至請求項7中任意一項所述的異常檢測方法。An electronic device, wherein the electronic device includes a processor and a memory, and the processor is used to execute a computer program stored in the memory to implement the abnormality detection method described in any one of claim 1 to claim 7 . 一種電腦可讀儲存介質,其中,所述電腦可讀儲存介質儲存有至少一個指令,所述至少一個指令被處理器執行時實現如請求項1至請求項7中任意一項所述的異常檢測方法。A computer-readable storage medium, wherein the computer-readable storage medium stores at least one instruction, and when the at least one instruction is executed by a processor, the abnormality detection as described in any one of request item 1 to request item 7 is realized method.
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