TW202247979A - Molding die, resin molding device, and method for manufacturing resin molded article - Google Patents

Molding die, resin molding device, and method for manufacturing resin molded article Download PDF

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TW202247979A
TW202247979A TW111105742A TW111105742A TW202247979A TW 202247979 A TW202247979 A TW 202247979A TW 111105742 A TW111105742 A TW 111105742A TW 111105742 A TW111105742 A TW 111105742A TW 202247979 A TW202247979 A TW 202247979A
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lead frame
resin
molding die
molding
die
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TW111105742A
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Chinese (zh)
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TWI800266B (en
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山川智行
高橋范行
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The purpose of the present invention is to provide a molding die that can suppress or prevent deformation of a lead frame even with the lead frame having no frame member. A molding die (1000) of the present invention molds a resin with a rear surface of a pad (301) of a lead frame (300) exposed and comprises an upper mold (100) and a lower mold (200). At least one of the upper mold (100) and the lower mold (200) is provided with a deformation suppression mechanism (120) or (211) that suppresses or prevents deformation of the lead frame (300) during mold clamping.

Description

成型模、樹脂成型裝置及樹脂成型品的製造方法Mold, resin molding device, and method for manufacturing resin molded product

本發明涉及一種成型模、樹脂成型裝置及樹脂成型品的製造方法。The present invention relates to a molding die, a resin molding device and a method for manufacturing a resin molding.

IC、半導體晶片等電子元件（下文也稱為“晶片”）通常進行樹脂封裝（樹脂成型）後使用。更具體而言，例如通過對晶片進行樹脂封裝，能夠製成所述晶片被樹脂封裝後的電子部件（也稱為作為完成品的電子部件，或封裝體等。下文也僅稱為“電子部件”）。Electronic components such as ICs and semiconductor chips (hereinafter also referred to as "chips") are usually used after being encapsulated in resin (resin molding). More specifically, for example, by resin-encapsulating a chip, it is possible to manufacture an electronic component (also referred to as an electronic component as a finished product, or a package, etc.) in which the chip is resin-encapsulated. ").

在電子部件的製造中，例如，如專利文獻1和2所述，可以對搭載晶片的引線框架（或僅稱為框架）進行樹脂封裝（樹脂成型）。In the manufacture of electronic components, for example, as described in Patent Documents 1 and 2, resin encapsulation (resin molding) may be performed on a lead frame (or simply called a frame) on which a chip is mounted.

引線框架例如包括載置晶片的基島（pad）、引線和連筋（tie bar），包括基島、引線和連筋的整體被框部件包圍。例如，在專利文獻1的圖1～3所述的引線框架1中，島3相當於基島，連筋6相當於連筋，包圍它們的框架2相當於框部件。A lead frame includes, for example, a pad on which a chip is mounted, leads, and tie bars, and the whole including the pad, leads, and tie bars is surrounded by a frame member. For example, in the lead frame 1 described in FIGS. 1 to 3 of Patent Document 1, the island 3 corresponds to a base island, the rib 6 corresponds to a rib, and the frame 2 surrounding them corresponds to a frame member.

現有技術文獻 專利文獻 專利文獻1：特許第3150083號公報 專利文獻2：特開2004-152994號公報 prior art literature patent documents Patent Document 1: Patent No. 3150083 Patent Document 2: JP-A-2004-152994

發明要解決的問題The problem to be solved by the invention

近年來，從引線框架的輕量化、節省資源、低成本化等角度，需要使用不具有框部件（包括引線框架的支架部分）的引線框架。但是，不具有框部件的引線框架比具有框部件的引線框架的強度低，在成型模合模時，引線框架可能會變形。In recent years, from the viewpoints of weight reduction, resource saving, and cost reduction of the lead frame, it is necessary to use a lead frame that does not have a frame member (including a frame portion of the lead frame). However, a lead frame without a frame member has lower strength than a lead frame with a frame member, and the lead frame may be deformed when the mold is closed.

因此，本發明的目的是提供一種即使使用不具有框部件的引線框架，也可以抑制或防止引線框架變形的成型模、樹脂成型裝置和樹脂成型品的製造方法。Therefore, an object of the present invention is to provide a molding die, a resin molding device, and a method of manufacturing a resin molded product that can suppress or prevent deformation of the lead frame even when using a lead frame that does not have a frame member.

問題解決方案problem solution

為達到該目的，本發明的成型模 是用於使其的引線框架的基島的背面露出而進行樹脂成型的成型模， 具有上模和下模， 所述上模和所述下模中的至少一個具備在合模時抑制或防止引線框架變形的變形抑制機構。 To achieve this purpose, the molding die of the present invention It is a molding die for exposing the back side of the base island of the lead frame and performing resin molding, with upper and lower dies, At least one of the upper mold and the lower mold is provided with a deformation suppression mechanism for suppressing or preventing deformation of the lead frame during mold clamping.

本發明的樹脂成型裝置包括本發明的成型模。The resin molding device of the present invention includes the molding die of the present invention.

本發明的樹脂成型品的製造方法 是使用成型模使引線框架的基島的背面露出而進行樹脂成型的樹脂成型品的製造方法， 所述成型模是本發明的成型模， 所述引線框架除所述基島外，還具有引線、連筋和懸吊引腳（pin）， 所述基島通過所述懸吊引腳從所述連筋懸吊下來， 所述引線框架不具有包圍包括所述基島、所述連筋和所述懸吊引腳整體的框部件， 所述樹脂成型品的製造方法包括： 引線框架載置工序，其將所述引線框架載置於所述下模， 連筋移動抑制工序，其通過所述變形抑制機構抑制或防止所述連筋移動， 在通過所述變形抑制機構防止所述連筋移動的狀態下，所述上模和所述下模合模，對所述引線框架進行樹脂成型。 Method for producing resin molded article of the present invention It is a method of manufacturing a resin molded product in which the back surface of the base island of the lead frame is exposed using a molding die and resin molded, The molding die is the molding die of the present invention, In addition to the base island, the lead frame also has leads, ribs and suspension pins, the base island is suspended from the connecting rod by the suspension pin, The lead frame does not have a frame member surrounding the entirety of the base island, the ribs and the suspension pins, The manufacturing method of the resin molded product comprises: a lead frame placing step of placing the lead frame on the lower mold, a connecting-beam movement suppression step of suppressing or preventing movement of the connecting-beam by the deformation suppressing mechanism, The upper mold and the lower mold are clamped together in a state in which the rib is prevented from moving by the deformation suppressing mechanism, and the lead frame is resin-molded.

發明的效果The effect of the invention

通過本發明，可以提供一種即使使用不具有框部件的引線框架，也可以抑制或防止引線框架變形的成型模、樹脂成型裝置和樹脂成型品的製造方法。According to the present invention, it is possible to provide a molding die, a resin molding device, and a method of manufacturing a resin molded product that can suppress or prevent deformation of the lead frame even when using a lead frame that does not have a frame member.

接著，舉例對本發明進行詳細說明。但是本發明不限於下述說明。Next, the present invention will be described in detail with examples. However, the present invention is not limited to the following description.

在本發明的成型模中，例如 所述引線框架除所述基島外，還具有引線、連筋和懸吊引腳， 所述基島通過所述懸吊引腳從所述連筋懸吊下來， 所述引線框架可以不具有包圍包括所述基島、所述連筋和所述懸吊引腳整體的框部件。 In the molding die of the present invention, for example In addition to the base island, the lead frame also has leads, ribs and suspension pins, the base island is suspended from the connecting rod by the suspension pin, The lead frame may not have a frame member surrounding the entirety of the base island, the ribs, and the suspension pins.

在本發明的成型模中，例如所述變形抑制機構可以包括抑制或防止所述連筋移動的突起部。In the molding die of the present invention, for example, the deformation suppressing mechanism may include a protrusion that suppresses or prevents movement of the rib.

在本發明的成型模中，例如所述突起部可以設置在所述下模。另外，所述突起部例如也可以設置在所述上模，也可以設置在所述上模和下模兩者。In the molding die of the present invention, for example, the protrusion may be provided on the lower die. In addition, the protrusion may be provided, for example, on the upper die, or may be provided on both the upper die and the lower die.

在本發明的成型模中，例如所述變形抑制機構可以包括按壓所述引線框架而抑制或防止所述連筋移動的按壓部件。In the molding die of the present invention, for example, the deformation suppression mechanism may include a pressing member that presses the lead frame to suppress or prevent movement of the rib.

在本發明的成型模中，例如所述按壓部件可以設置在所述上模和所述下模中的至少一個。In the molding die of the present invention, for example, the pressing member may be provided in at least one of the upper die and the lower die.

在本發明的成型模中，例如可以在所述按壓部件上設置抑制或防止所述連筋移動的突起部。In the molding die of the present invention, for example, a protrusion that suppresses or prevents movement of the rib may be provided on the pressing member.

在本發明的成型模中，例如所述按壓部件可以設置在能夠按壓所述引線框架最外部的位置。In the molding die of the present invention, for example, the pressing member may be provided at a position capable of pressing the outermost portion of the lead frame.

在本發明中，成型模沒有特殊限制，例如可以是金屬模，也可以是陶瓷制模等。In the present invention, the forming mold is not particularly limited, and may be, for example, a metal mold or a ceramic mold.

另外，在本發明中，“防止”和“抑制”沒有明確的區別。例如，在本發明中，在“防止”引線框架變形時，如無特別說明不限於使引線框架的變形量為零，也包括將引線框架的變形量抑制為較小（即，抑制引線框架變形）。另外，在本發明中，例如在“防止”連筋移動時，如無特別說明，不限於使連筋的移動量為零，也包括將連筋的移動量抑制為較小（即，抑制連筋的移動量）。另外，反過來，在本發明中，在“抑制”引線框架變形時，如無特別說明，不限於將引線框架的變形量抑制為較小，也包括使引線框架的變形量為零。在本發明中，例如在“抑制”連筋移動時，如無特別說明，不限於將連筋的移動量抑制為較小，也包括使連筋的移動量為零。In addition, in the present invention, there is no clear distinction between "prevention" and "suppression". For example, in the present invention, when "preventing" the deformation of the lead frame, unless otherwise specified, it is not limited to making the deformation of the lead frame zero, but also includes suppressing the deformation of the lead frame to be small (that is, suppressing the deformation of the lead frame ). In addition, in the present invention, for example, when "preventing" the movement of the connecting ribs, unless otherwise specified, it is not limited to making the moving amount of the connecting ribs zero, but also includes suppressing the moving amount of the connecting ribs to be small (that is, suppressing the moving amount of the connecting ribs). tendon movement). In addition, conversely, in the present invention, when "suppressing" the deformation of the lead frame, unless otherwise specified, it is not limited to suppressing the deformation of the lead frame to be small, and also includes making the deformation of the lead frame zero. In the present invention, for example, when "suppressing" the movement of the connecting ribs, unless otherwise specified, it is not limited to suppressing the moving amount of the connecting ribs to be small, and it also includes making the moving amount of the connecting ribs zero.

在本發明中，樹脂成型品沒有特殊限制，例如可以是將晶片樹脂封裝後的電子部件。另外，一般而言，“電子部件”有時指進行樹脂封裝前的晶片，有時指晶片已進行樹脂封裝的狀態。但在本發明中，所述晶片也稱為“電子元件”，“電子部件”是指將所述晶片樹脂封裝後的電子部件（作為完成品的電子部件）。在本發明中，“晶片”與“電子元件”意思相同。在本發明中，“晶片”或“電子元件”是指樹脂封裝前的晶片，具體而言，例如可舉例IC、半導體晶片、用於控制電功率的半導體元件、電阻元件、電容器元件等晶片。另外，“半導體元件”例如是指由半導體製成的電路元件。在本發明中，為了與樹脂封裝後的電子部件進行區分，方便起見，將樹脂封裝前的晶片稱為“晶片”或“電子元件”。但是，本發明的“晶片”或“電子元件”只要是樹脂封裝前的晶片即可，沒有特殊限制，可以不是晶片形狀。In the present invention, the resin molded product is not particularly limited, and may be, for example, an electronic component in which a chip is resin-sealed. In addition, generally speaking, an "electronic component" may refer to the wafer before resin-encapsulation, and may refer to the state which resin-encapsulates a wafer. However, in the present invention, the wafer is also referred to as an "electronic component", and an "electronic component" refers to an electronic component (an electronic component as a finished product) in which the wafer is resin-encapsulated. In the present invention, "wafer" has the same meaning as "electronic component". In the present invention, "wafer" or "electronic element" refers to a wafer before resin encapsulation, specifically, for example, IC, semiconductor wafer, semiconductor element for controlling electric power, resistor element, capacitor element, etc. wafer. In addition, a "semiconductor element" means, for example, a circuit element made of a semiconductor. In the present invention, for the sake of distinction from resin-encapsulated electronic components, the wafer before resin-encapsulation is referred to as "wafer" or "electronic element". However, the "wafer" or "electronic device" in the present invention is not particularly limited as long as it is a wafer before resin sealing, and may not have a wafer shape.

在本發明中，成型前的樹脂材料和成型後的樹脂沒有特殊限制，例如可以是環氧樹脂、矽酮樹脂等熱固性樹脂，也可以是熱塑性樹脂。另外，也可以是部分包括熱固性樹脂或熱塑性樹脂的複合材料。在本發明中，作為成型前的樹脂材料的形態，例如可列舉粉粒狀樹脂（包括顆粒狀樹脂）、液態樹脂、片狀樹脂、板狀樹脂、粉末狀樹脂等。另外，在本發明中，液態樹脂可以是在常溫下為液態，也包括通過加熱熔融成液態的熔融樹脂。所述樹脂的形態只要可以供給至成型模的模腔、罐體等即可，也可以是其他形態。In the present invention, the resin material before molding and the resin after molding are not particularly limited, for example, they may be thermosetting resins such as epoxy resins and silicone resins, or thermoplastic resins. In addition, a composite material partially including a thermosetting resin or a thermoplastic resin may also be used. In the present invention, examples of the form of the resin material before molding include powdery resin (including granular resin), liquid resin, sheet-like resin, plate-like resin, powdery resin, and the like. In addition, in the present invention, the liquid resin may be in a liquid state at normal temperature, and includes a molten resin that is melted into a liquid state by heating. The form of the resin may be other forms as long as it can be supplied to a cavity of a molding die, a tank body, or the like.

在本發明的樹脂成型品的製造方法中，樹脂成型方法沒有特殊限制，例如可以是傳遞成型、注射成型、壓縮成型等。In the manufacturing method of the resin molded article of the present invention, the resin molding method is not particularly limited, and may be, for example, transfer molding, injection molding, compression molding, or the like.

下文基於圖示說明本發明的具體實施例。為便於說明，各圖進行適當省略、誇張等，進行示意性描述。Specific embodiments of the present invention are explained below based on illustrations. For the convenience of description, each figure is appropriately omitted, exaggerated, etc., and is schematically described.

[實施例1][Example 1]

在本實施例中，對本發明的成型模的一例，使用其的本發明的樹脂成型品的製造方法的一例，和用於其的引線框架的一例進行說明。In this embodiment, an example of the molding die of the present invention, an example of the method for producing a resin molded article of the present invention using the same, and an example of the lead frame used therefor will be described.

首先，對用於本實施例的引線框架的一例進行說明。在本實施例中，露出引線框架的基島（晶片安裝板，也稱為載片台）的背面（未安裝晶片一側的面）而成型。圖6（a）是示出用於後述的本實施例的成型模和使用其的本發明的樹脂成型品的製造方法中使用的引線框架的一例的平面圖。圖6（b）是圖6（a）左上角中矩形框線所包圍的部分的放大圖。在圖6（b）中，僅示出最左側的一列基島，省略其內側列的基島。圖6（c）是圖6（b）示出的部分的立體圖。如圖所示，該引線框架300具有基島301、連筋302、懸吊引腳303和引線304以及連結部件311。引線框架300整體為矩形，兩個長形板狀的連結部件311配置在引線框架300的矩形長邊部分。引線304與連結部件311平行地配置在基島301的兩側。連筋302為棒狀，多個連筋302與引線304垂直交叉配置。各連筋302的兩端分別與連結部件311連結。基島301為矩形，有多個。多個基島301以夾在相鄰的兩個連筋302之間的方式配置。另外，如圖6（c）所示，各基島301通過懸吊引腳303從連筋302懸吊下來。懸吊引腳303的粗細沒有特殊限制，例如比引線304細。如圖所示，該引線框架300不具有包圍包括基島301、連筋302、引線304和懸吊引腳303整體的框部件。即，如圖6（b）的框線A包圍的部分所示，在引線框架300的最外側不存在框部件。如圖所示，在框線A包圍的部分中，沒有框部件而存在引線304。連結部件311僅從兩側夾著基島301、連筋302、引線304和懸吊引腳303，不包圍整體。由此，該引線框架300不存在框部件，未連結最外側的引線304，因此與存在框部件的引線框架相比，可實現輕量化、節省資源、低成本化等。另一方面，因為該引線框架300與存在框部件的引線框架相比強度低，所以連筋302等容易變形。另外，如圖6（b）的框線B包圍的部分所示，連筋302並非對多個基島301的每一個獨立或分離而設置，即，一個連筋302與多個基島301共通而設置，是較長的。具體而言，如圖6（a）所示，對各連筋302而言，一個連筋302從與一個連結部件311連結的部分連續到與另一個連結部件311連結的部分。像這樣連筋302較長，也是連筋302容易變形的原因。另外，在圖6的引線框架300中，連筋302的作用是連接兩個連結部件311彼此而保持引線框架300的骨架，同時經懸吊引腳303固定基島301。與此同時，連筋302也有防止從模腔302洩漏樹脂的作用。First, an example of a lead frame used in this embodiment will be described. In this embodiment, the back surface (the surface on the side where the chip is not mounted) of the base island (chip mounting board, also referred to as a stage) of the lead frame is exposed and molded. 6( a ) is a plan view showing an example of a lead frame used in a molding die of this embodiment described later and a method of manufacturing a resin molded article of the present invention using the same. Figure 6(b) is an enlarged view of the part surrounded by the rectangular frame line in the upper left corner of Figure 6(a). In Fig. 6(b), only the leftmost row of base islands is shown, and the inner row of base islands is omitted. FIG. 6( c ) is a perspective view of the portion shown in FIG. 6( b ). As shown in the figure, the lead frame 300 has a base island 301 , a rib 302 , a suspension pin 303 , a lead 304 and a connecting part 311 . The lead frame 300 has a rectangular shape as a whole, and two elongated plate-shaped connecting members 311 are arranged on the long sides of the lead frame 300 . The lead wires 304 are arranged on both sides of the base island 301 in parallel with the connecting member 311 . The connecting rib 302 is rod-shaped, and a plurality of connecting ribs 302 and the lead wire 304 are vertically intersected. Both ends of each connecting rib 302 are respectively connected to connecting members 311 . The base island 301 is rectangular and there are multiple ones. The plurality of base islands 301 are arranged to be sandwiched between two adjacent ribs 302 . In addition, as shown in FIG. 6( c ), each base island 301 is suspended from the connecting rib 302 through the suspension pin 303 . The thickness of the suspending pin 303 is not particularly limited, for example, it is thinner than the lead wire 304 . As shown in the figure, the lead frame 300 does not have a frame part surrounding the whole of the base island 301 , ribs 302 , leads 304 and suspension pins 303 . That is, as shown in the portion surrounded by the frame line A in FIG. 6( b ), there is no frame member on the outermost side of the lead frame 300 . As shown in the figure, in the portion surrounded by the frame line A, there is no frame member and the lead wire 304 exists. The connecting member 311 only sandwiches the base island 301 , the rib 302 , the lead wire 304 and the suspension pin 303 from both sides, and does not surround the whole. As a result, the lead frame 300 does not have a frame member and the outermost lead 304 is not connected. Therefore, compared with a lead frame having a frame member, weight reduction, resource saving, and cost reduction can be achieved. On the other hand, since the lead frame 300 has lower strength than a lead frame including frame members, the ribs 302 and the like are easily deformed. In addition, as shown in the part enclosed by the frame line B in FIG. 6( b ), the connecting rib 302 is not provided independently or separately for each of the plurality of base islands 301 , that is, one connecting rib 302 is shared with a plurality of base islands 301 And the setup, is longer. Specifically, as shown in FIG. 6( a ), for each of the connecting ribs 302 , one connecting rib 302 continues from a portion connected to one connecting member 311 to a portion connected to the other connecting member 311 . The connecting rib 302 is long like this, which is also the reason why the connecting rib 302 is easily deformed. In addition, in the lead frame 300 of FIG. 6 , the function of the connecting rib 302 is to connect the two connecting members 311 to maintain the skeleton of the lead frame 300 , and fix the base island 301 through the suspending pin 303 . At the same time, the ribs 302 also have the function of preventing the resin from leaking from the cavity 302 .

圖6（d）示出了將圖6（a）的引線框架300載置於一般的成型模的下模的狀態。如圖所示，在引線框架300中，基島301配置於下模模腔201的底面，懸吊引腳303從基島301向斜上方延伸，懸吊引腳303連接的連筋302和與連筋交叉連接的引線304以從下模200的模面略微懸空的狀態配置。FIG. 6( d ) shows a state where the lead frame 300 of FIG. 6( a ) is placed on a lower die of a general molding die. As shown in the figure, in the lead frame 300, the base island 301 is arranged on the bottom surface of the lower mold cavity 201, the suspending pin 303 extends obliquely upward from the base island 301, and the connecting rib 302 connected with the suspending pin 303 and the The lead wires 304 cross-connected by the ribs are arranged in a state of being slightly suspended from the die surface of the lower die 200 .

在使用一般的成型模進行樹脂成型時，如圖7的示意圖所示，會有合模時的壓力使連筋302向外側彎曲的可能。使用圖8（a）～（c）的工序截面圖，對該現象進行具體說明。如該圖所示，成型模1000具有上模100和下模200。上模100具有上模模腔101。下模200具有下模模腔201。上模模腔101和下模模腔201設置在相互對向的位置。在上模100和下模200合模時，上模模腔101和下模模腔201一起形成模腔，可以在該模腔內進行樹脂成型。When resin molding is performed using a general molding die, as shown in the schematic diagram of FIG. 7 , the ribs 302 may bend outward due to the pressure during mold closing. This phenomenon will be specifically described using the process sectional views of FIGS. 8( a ) to ( c ). As shown in the figure, the molding die 1000 has an upper die 100 and a lower die 200 . The upper mold 100 has an upper mold cavity 101 . The lower mold 200 has a lower mold cavity 201 . The upper mold cavity 101 and the lower mold cavity 201 are arranged at positions facing each other. When the upper mold 100 and the lower mold 200 are closed, the upper mold cavity 101 and the lower mold cavity 201 together form a mold cavity, and resin molding can be performed in the mold cavity.

使用圖8的成型模1000和圖6的引線框架300進行樹脂成型時，例如會發生如圖8（a）～（c）的工序截面圖所述的情況。另外，在圖8（a）～（c）中，圖的左端是引線框架300的最外側，圖的右側方向是引線框架300的內側方向。When resin molding is performed using the molding die 1000 of FIG. 8 and the lead frame 300 of FIG. 6 , for example, the situation described in the process sectional views of FIGS. 8( a ) to ( c ) occurs. In addition, in FIGS. 8( a ) to ( c ), the left end of the figure is the outermost side of the lead frame 300 , and the right direction of the figure is the inner direction of the lead frame 300 .

首先，如圖8（a）所示，在下模200上載置引線框架300。如圖所示，引線框架300以基島301接觸下模模腔201的底面的方式載置。如上所述，基島301通過懸吊引腳303從連筋302懸吊下來。為了使基島301的背面露出而成型，懸吊引腳303的高度設計為比下模模腔201的深度略高，以使基島301確實地接觸下模模腔201的底面，或可以將基島301按壓在模腔底面。因此，如圖所示，連筋302和引線304為從下模200略微懸空的狀態。First, as shown in FIG. 8( a ), the lead frame 300 is placed on the lower mold 200 . As shown in the figure, the lead frame 300 is placed such that the base island 301 contacts the bottom surface of the lower mold cavity 201 . As mentioned above, the base island 301 is suspended from the ribs 302 by the suspension pins 303 . In order to make the back side of the base island 301 exposed and molded, the height of the suspension pin 303 is designed to be slightly higher than the depth of the lower mold cavity 201, so that the base island 301 really contacts the bottom surface of the lower mold cavity 201, or it can be The base island 301 is pressed against the bottom of the mold cavity. Therefore, as shown in the drawing, the ribs 302 and the leads 304 are in a state of being slightly suspended from the lower mold 200 .

接著，如圖8（b）的箭頭X31所示，使下模200上升。由此，如圖所示，連筋302和引線304接觸上模100。Next, as shown by the arrow X31 in FIG. 8( b ), the lower die 200 is raised. Thus, as shown in the figure, the ribs 302 and the leads 304 contact the upper mold 100 .

使下模200進一步上升，如圖8（c）的箭頭X32所示，使上模100和下模200合模。由此，上模模腔101和下模模腔201一起形成模腔，可以在該模腔內進行樹脂成型。此時，懸吊引腳303、連筋302和引線304被合模的壓力按壓，上模100和引線框架300（引線框架300的引線304和連筋302）和下模200無縫隙接觸，進行合模。如果是具有框部件的引線框架，合模的壓力主要作用於上下方向，基島301被按壓在下模模腔201的底面，基島301連接的懸吊引腳303變形，進行合模。但是，在使用不具有框部件的本實施例的引線框架300時，由於該合模壓力，不僅是基島301連接的懸吊引腳303，如圖的箭頭Y11、Y12和Y13所示，懸吊引腳303連接的連筋302向外側被按壓而移動，連筋302作為整體彎曲（即變形）。該連筋302和引線304越向引線框架300的外側變形越大，最外部（最外側）的連筋302的變形量最大（參照圖7）。連筋302像這樣變形的原因可認為是因為將基島301按壓至下模模腔底面的力分散至水準方向，該水準方向的力使連筋302變形。The lower mold 200 is further raised, and the upper mold 100 and the lower mold 200 are clamped as shown by the arrow X32 in FIG. 8( c ). Thus, the upper mold cavity 101 and the lower mold cavity 201 together form a cavity, and resin molding can be performed in the cavity. At this time, the suspending pin 303, the connecting rib 302 and the lead wire 304 are pressed by the pressure of the mold clamping, and the upper mold 100 and the lead frame 300 (the lead wire 304 and the connecting rib 302 of the lead frame 300) and the lower mold 200 are in seamless contact, and the Clamping. If it is a lead frame with frame parts, the pressure of mold clamping mainly acts on the up and down direction, and the base island 301 is pressed on the bottom surface of the lower mold cavity 201, and the suspension pins 303 connected to the base island 301 are deformed to perform mold clamping. However, when using the lead frame 300 of this embodiment that does not have a frame member, due to the clamping pressure, not only the suspending pins 303 connected to the base island 301 are suspended as shown by arrows Y11, Y12, and Y13 in the figure. The connecting rib 302 connected with the hanging pin 303 is pressed and moved outward, and the connecting rib 302 as a whole bends (that is, deforms). The ribs 302 and the leads 304 deform more toward the outside of the lead frame 300 , and the outermost (outermost) ribs 302 have the largest deformation amount (see FIG. 7 ). The reason why the ribs 302 are deformed in this way is considered to be that the force that presses the base island 301 to the bottom surface of the cavity of the lower die is dispersed in the horizontal direction, and the force in the horizontal direction deforms the ribs 302 .

本發明者為抑制或防止該引線框架變形反復探討，最終完成了本發明。The inventors of the present invention repeatedly studied to suppress or prevent the deformation of the lead frame, and finally completed the present invention.

圖1（a）～（c）的工序截面圖示出了本實施例的成型模和使用其的本實施例的樹脂成型品的製造方法的工序的一部分。如圖所示，在本實施例的成型模1000中，除上模100具有引線框架按壓機構120，下模200具有突起部211外，與圖8的成型模1000相同。引線框架按壓機構120和突起部211分別相當於本發明的成型模的“變形抑制機構”。The process cross-sectional views of FIGS. 1( a ) to ( c ) show a part of the process of the molding die of this example and the method of manufacturing a resin molded article of this example using the same. As shown in the figure, the molding die 1000 of this embodiment is the same as the molding die 1000 of FIG. The lead frame pressing mechanism 120 and the protrusion 211 respectively correspond to the "deformation suppressing mechanism" of the molding die of the present invention.

引線框架按壓機構120包括彈性部件121和按壓部件122。本實施例的按壓部件122為可按壓引線框架300的最外部（最外側）的引線304整體的大小的俯視矩形形狀（與後述圖4（f）的按壓部件222形狀相同，與圖4（f）不同，設於上模100），設置於可以按壓位於引線框架300的兩端的最外部的引線304的位置。按壓部件122經彈性部件121安裝在上模100的主體上，從上模100的模面突出而設置（參照圖1（a））。按壓部件122通過彈性部件121的伸縮而可以上下移動，通過合模，與上模100的模面齊平。The lead frame pressing mechanism 120 includes an elastic member 121 and a pressing member 122 . The pressing member 122 of this embodiment is a planar rectangular shape capable of pressing the entire size of the outermost (outermost) lead 304 of the lead frame 300 (same shape as the pressing member 222 in FIG. ) is different, it is set on the upper mold 100 ), and it is set at a position where the outermost leads 304 located at both ends of the lead frame 300 can be pressed. The pressing member 122 is attached to the main body of the upper mold 100 via the elastic member 121 , and protrudes from the mold surface of the upper mold 100 (see FIG. 1( a )). The pressing member 122 can move up and down by the expansion and contraction of the elastic member 121 , and is flush with the mold surface of the upper mold 100 by mold closing.

為了在合模時上模100和下模200之間沒有縫隙，突起部211具有在引線框架300的厚度以下的高度（厚度），為可以配置於相鄰的引線304之間的形狀（參照圖4（i））。在本實施例中，各突起部211為正方體形狀。如圖4（b）所示，在引線框架300載置於下模200時，各突起部211設置於與最外部的連筋302的外側和自外側起第二個連筋302的內側接觸的位置。通過將各突起部設置於該位置，可以抑制或防止連筋302移動。另外，在本實施例中，在配置於一個連筋302的突起部211中，相鄰的突起部211之間的距離（中心之間的距離）約為5.2mm。但是，在本發明中，相鄰的突起部之間的距離不限於此，是任意的。In order that there is no gap between the upper mold 100 and the lower mold 200 at the time of mold clamping, the protrusion 211 has a height (thickness) below the thickness of the lead frame 300 and has a shape that can be arranged between adjacent leads 304 (see FIG. 4(i)). In this embodiment, each protrusion 211 is in the shape of a cube. As shown in FIG. 4( b ), when the lead frame 300 is placed on the lower mold 200 , each protrusion 211 is provided on a side that is in contact with the outside of the outermost rib 302 and the inner side of the second rib 302 from the outside. Location. By providing each protrusion at this position, movement of the rib 302 can be suppressed or prevented. In addition, in this embodiment, among the protrusions 211 arranged in one rib 302 , the distance between adjacent protrusions 211 (distance between centers) is about 5.2 mm. However, in the present invention, the distance between adjacent protrusions is not limited to this, and is arbitrary.

使用了圖1的成型模1000的樹脂成型品的製造方法例如是如下方式進行的。另外，圖1（a）～（c）示出的引線框架300與圖6所示的引線框架300相同。A method of manufacturing a resin molded article using molding die 1000 of FIG. 1 is performed, for example, as follows. Note that the lead frame 300 shown in FIGS. 1( a ) to ( c ) is the same as the lead frame 300 shown in FIG. 6 .

首先，如圖1（a）所示，在下模200上載置引線框架300（引線框架載置工序）。此時，如圖所示，引線框架300以基島301接觸下模模腔201的底面的方式載置。如上所述，基島301通過懸吊引腳303從連筋302懸吊下來。與圖8同樣地，懸吊引腳303的高度設計為比下模模腔201的深度略高。因此，如圖所示，連筋302和引線304為從下模200的模面略微懸空的狀態。First, as shown in FIG. 1( a ), the lead frame 300 is placed on the lower mold 200 (lead frame placement step). At this time, as shown in the figure, the lead frame 300 is placed such that the base island 301 contacts the bottom surface of the lower mold cavity 201 . As mentioned above, the base island 301 is suspended from the ribs 302 by the suspension pins 303 . Similar to FIG. 8 , the height of the suspension pin 303 is designed to be slightly higher than the depth of the cavity 201 of the lower mold. Therefore, as shown in the drawing, the ribs 302 and the leads 304 are in a state of being slightly suspended from the die surface of the lower die 200 .

接著，如圖1（b）的箭頭X11所示，使下模200上升。由此，如圖所示，按壓部件122向下方按壓最外部的引線304。此時，設置於下模200的突起部211嵌合於最外部的連筋302的外側（參照圖4（i））。由此，抑制或防止最外部的連筋302移動。Next, as indicated by the arrow X11 in FIG. 1( b ), the lower die 200 is raised. Thereby, as shown in the drawing, the pressing member 122 presses the outermost lead wire 304 downward. At this time, the protruding portion 211 provided on the lower mold 200 is fitted to the outside of the outermost rib 302 (see FIG. 4( i )). Thereby, movement of the outermost rib 302 is suppressed or prevented.

接著，如圖1（c）的箭頭X12所示，使下模200進一步上升，使上模100和下模200合模。此時，彈性部件121壓縮，按壓部件122上升。通過合模，上模模腔101和下模模腔201一起形成模腔，使該模腔內可以進行樹脂成型。此時，與圖8（c）相同，連筋302被合模的壓力按壓，主要是懸吊引腳303變形，上模100和引線框架300（引線框架300的引線304）和下模200無縫隙地接觸，進行合模。在本實施例中，此時，下模200的突起部211嵌合於自外側起第2個連筋302內側，抑制或防止連筋302移動。如圖所示，由於抑制或防止連筋302移動，連筋302不會像圖7和圖8所示般向外側彎曲。即，在本實施例中，抑制或防止引線框架300變形。Next, as indicated by the arrow X12 in FIG. 1( c ), the lower mold 200 is further raised to close the upper mold 100 and the lower mold 200 . At this time, the elastic member 121 is compressed, and the pressing member 122 rises. By closing the molds, the upper mold cavity 101 and the lower mold cavity 201 together form a mold cavity, so that resin molding can be performed in the mold cavity. At this time, the same as in Fig. 8(c), the ribs 302 are pressed by the mold clamping pressure, mainly the suspension pins 303 are deformed, and the upper mold 100 and the lead frame 300 (lead wires 304 of the lead frame 300) and the lower mold 200 have no Contact with a gap to close the mold. In the present embodiment, at this time, the protruding portion 211 of the lower mold 200 fits inside the second connecting rib 302 from the outside, so that the moving of the connecting rib 302 is suppressed or prevented. As shown, the ribs 302 do not bend outwardly as shown in FIGS. 7 and 8 by inhibiting or preventing movement of the ribs 302 . That is, in the present embodiment, deformation of the lead frame 300 is suppressed or prevented.

另外，在圖1（b）和（c）中，通過按壓部件122按壓引線304而抑制或防止連筋302移動的工序、使突起部211嵌合於最外部的連筋302而抑制或防止連筋302移動的工序、以及使突起部211嵌合於自外側起第二個連筋而抑制或防止連筋302移動的工序可以分別是本發明的樹脂成型品的製造方法中“連筋移動抑制工序” 的一部分。但是，如後所述，本發明的“連筋移動抑制工序” 不限於此。例如，在圖1（b）和（c）中，也可以僅將通過按壓部件122按壓引線304而抑制或防止連筋302移動的工序、使突起部211嵌合於最外部的連筋302而抑制或防止連筋302移動的工序、以及使突起部211嵌合於自外側起第二個連筋302而抑制或防止連筋302移動的工序中的一部分作為本發明的樹脂成型品的製造方法中的“連筋移動抑制工序”。In addition, in FIG. 1( b ) and ( c ), the process of suppressing or preventing the movement of the connecting rib 302 by pressing the lead wire 304 with the pressing member 122 suppresses or prevents the connecting rib 302 by fitting the protrusion 211 into the outermost connecting rib 302 . The process of moving the rib 302 and the process of fitting the protrusion 211 to the second rib from the outside to suppress or prevent the movement of the rib 302 can be respectively referred to as "suppressing the movement of the rib" in the method for manufacturing the resin molded article of the present invention. part of the process". However, as will be described later, the "step of suppressing movement of connecting ribs" in the present invention is not limited to this. For example, in FIGS. 1( b ) and ( c ), only the step of suppressing or preventing the movement of the connecting rib 302 by pressing the lead wire 304 with the pressing member 122 , and fitting the protrusion 211 into the outermost connecting rib 302 may be completed. Part of the process of suppressing or preventing the movement of the rib 302 and the process of fitting the protrusion 211 to the second rib 302 from the outside to suppress or prevent the movement of the rib 302 are the manufacturing method of the resin molded article of the present invention. "Continuous tendon movement suppression process" in .

在本實施例中，樹脂成型方法沒有特殊限制，例如可以與一般的樹脂成型方法相同或相當，本實施例的樹脂成型方法例如如上所述，可以是傳遞成型、注射成型、壓縮成型等。更具體而言，例如可以在圖1（a）的工序後，圖1（b）的工序前，向下模模腔201內供給固體狀的樹脂材料（未圖示），通過成型模1000的熱量使其熔融，進行樹脂成型。該樹脂材料的形態也如上所述沒有特殊限制，可以是粉粒狀樹脂（包括顆粒狀樹脂）、片狀樹脂、板狀樹脂等。另外，例如，可以在如圖1（c）所示的合模後，將液態樹脂（未圖示）注入上模模腔101和下模模腔201組成的模腔內，使其固化（硬化），進行樹脂成型。該液態樹脂沒有特殊限制，例如如上所述，可以是常溫下為液態樹脂，也可以是加熱熔融後成為液態的熔融樹脂。In this embodiment, the resin molding method is not particularly limited. For example, it may be the same as or equivalent to a general resin molding method. For example, the resin molding method in this embodiment may be transfer molding, injection molding, compression molding, etc. as described above. More specifically, for example, after the process of FIG. 1(a) and before the process of FIG. The heat makes it melt and resin molding takes place. The form of the resin material is not particularly limited as described above, and may be powdery resin (including granular resin), sheet-like resin, plate-like resin, and the like. In addition, for example, after closing the mold as shown in Figure 1(c), a liquid resin (not shown) can be injected into the mold cavity composed of the upper mold cavity 101 and the lower mold cavity 201 to solidify (harden) ), for resin molding. The liquid resin is not particularly limited. For example, as described above, it may be a liquid resin at normal temperature, or may be a molten resin that becomes liquid after being heated and melted.

另外，在本發明中可以使用的引線框架不限於圖6和圖7的形態，是任意的，可以是任意的引線框架。但是，根據本發明，如上所述，即使使用不具有框部件的引線框架也可以抑制或防止引線框架的變形。因此，在本發明中，優選使用不具有框部件的引線框架。若使用不具有框部件的引線框架，例如如上所述，可以實現引線框架的輕量化，節省資源，低成本化等。例如，因為引線框架不具有框部件，所以樹脂成型後無需切斷去除引線框架的框部件的工序，可以實現與之相應的低成本化。另外，在本發明中，引線框架“不具有框部件”是指不具有包圍引線框架整體（例如包括基島、引線、連筋和懸吊引腳的整體）的框部件。例如，在圖6的引線框架300中，兩個連結部件311配置在引線框架300的矩形長邊部分，但不存在於引線框架300的矩形短邊部分。即，如上所述，連結部件311僅從兩側夾著基島301、引線304、連筋302和懸吊引腳303，不包圍整體。因此，連結部件311不是“框部件”。在本發明中，不具有框部件的引線框架例如可以是引線框架周緣部的至少一部分不具有連結部件的引線框架。在圖6的引線框架300中，周緣部的兩邊具有連結部件，另兩邊不具有連結部件。但是，在本發明中，不具有框部件的引線框架不限於此。例如，不具有框部件的引線框架可以是周緣部的三邊具有連結部件、另一邊不具有連結部件的引線框架，也可以是周緣部的一邊具有連結部件、另三邊不具有連結部件的引線框架。另外，不具有框部件的引線框架例如可以是周緣部長度的10%以上、20%以上、30%以上、40%以上或50%以上不具有連結部件的引線框架。另外，在本發明中，不具有框部件的引線框架例如可以是引線框架的周緣部的至少一部分配置有引線、連筋、懸吊引腳或基島的引線框架。對具有框部件的引線框架而言，在引線框架周緣部的整體配置有框部件，但對不具有框部件的引線框架而言，在周緣部的至少一部分配置有不是框部件的部件。這種不是框部件的部件例如如上所述，可以是引線、連筋、懸吊引腳或基島。例如，圖6的引線框架300如上所述，引線304配置於周緣部的兩邊。在本發明中，不具有框部件的引線框架例如可以是在周緣部的四個邊中的一邊、兩邊、三邊或四邊配置有引線、連筋、懸吊引腳或基島的引線框架。另外，在本發明中，不具有框部件的引線框架例如可以是在周緣部的長度的10%以上、20%以上、30%以上、40%以上或50%以上配置有引線、連筋、懸吊引腳或基島的引線框架。但是，在本發明中使用的引線框架如上所述，沒有特殊限制，是任意的。In addition, the lead frame which can be used in this invention is not limited to the form of FIG. 6 and FIG. 7, It is arbitrary, and may be any lead frame. However, according to the present invention, as described above, deformation of the lead frame can be suppressed or prevented even if a lead frame having no frame member is used. Therefore, in the present invention, it is preferable to use a lead frame that does not have a frame member. Using a lead frame that does not have a frame member, for example, as described above, can reduce the weight of the lead frame, save resources, reduce costs, and the like. For example, since the lead frame does not have a frame member, it is not necessary to cut and remove the frame member of the lead frame after resin molding, and accordingly cost reduction can be achieved. In addition, in the present invention, the lead frame "does not have a frame part" means that it does not have a frame part surrounding the whole lead frame (for example, the whole including the base island, leads, ribs and suspension pins). For example, in the lead frame 300 of FIG. 6 , the two connection members 311 are arranged on the long side of the lead frame 300 but not on the short side of the lead frame 300 . That is, as described above, the connecting member 311 only sandwiches the base island 301, the lead wire 304, the rib 302, and the suspending pin 303 from both sides, and does not surround the whole. Therefore, the connecting member 311 is not a "frame member". In the present invention, the lead frame that does not have a frame member may be, for example, a lead frame that does not have a connecting member in at least a part of the peripheral portion of the lead frame. In the lead frame 300 of FIG. 6 , the two sides of the peripheral portion have connecting members, and the other two sides have no connecting members. However, in the present invention, the lead frame having no frame member is not limited thereto. For example, a lead frame without a frame member may be a lead frame having a connecting member on three sides of the peripheral portion and not having a connecting member on the other side, or may be a lead frame having a connecting member on one side of the peripheral portion and not having a connecting member on the other three sides. frame. In addition, the lead frame not having a frame member may be, for example, a lead frame having no connection member for 10%, 20%, 30%, 40%, or 50% of the peripheral length. In addition, in the present invention, the lead frame not having a frame member may be, for example, a lead frame in which leads, ribs, suspending pins, or base islands are arranged on at least a part of the peripheral portion of the lead frame. In a lead frame having a frame member, the frame member is arranged on the entire peripheral portion of the lead frame, but in a lead frame having no frame member, a member other than a frame member is arranged on at least a part of the peripheral portion. Such components that are not frame components may be, for example, leads, tie bars, suspension pins or base islands, as described above. For example, in the lead frame 300 of FIG. 6, the lead wires 304 are arranged on both sides of the peripheral portion as described above. In the present invention, a lead frame without a frame member may be, for example, a lead frame in which leads, ribs, suspension leads, or base islands are arranged on one, two, three, or four sides of the peripheral portion. In addition, in the present invention, in the lead frame not having a frame member, for example, 10% or more, 20% or more, 30% or more, 40% or more, or 50% or more of the length of the peripheral portion may be provided with leads, ribs, suspensions, etc. Hanging pins or leadframes for base islands. However, the lead frame used in the present invention is arbitrary as described above and not particularly limited.

另外，本發明的樹脂成型裝置如上所述，是包括本發明的成型模的樹脂成型裝置。本發明的樹脂成型裝置的構成沒有特殊限制，例如可以除包括本發明的成型模以外，與一般的樹脂成型裝置相同或相當。本實施例的樹脂成型裝置的整體構成也沒有特殊限制，例如可以是如圖2所示的構成。下文對圖2進行說明。In addition, the resin molding apparatus of the present invention is a resin molding apparatus including the molding die of the present invention as described above. The configuration of the resin molding device of the present invention is not particularly limited, and may be the same as or equivalent to a general resin molding device, for example, except for including the molding die of the present invention. The overall configuration of the resin molding device of this embodiment is not particularly limited, and may be, for example, the configuration shown in FIG. 2 . Fig. 2 is explained below.

圖2的平面圖示出了本發明的樹脂成型裝置整體構成的一例。如圖所示，該樹脂成型裝置1具備供給樹脂封裝（樹脂成型）前的引線框架300以及樹脂片T的供給模組2，進行樹脂成型的例如2個樹脂成型模組1000A、1000B，和用於搬出樹脂成型品的搬出模組4分別作為構成要件。另外，作為構成要件的供給模組2、樹脂成型模組1000A、1000B和搬出模組4各自相對於其他構成要件可以相互裝卸，且可以更換。FIG. 2 is a plan view showing an example of the overall configuration of the resin molding apparatus of the present invention. As shown in the figure, the resin molding apparatus 1 includes a supply module 2 for supplying a lead frame 300 and a resin sheet T before resin encapsulation (resin molding), two resin molding modules 1000A and 1000B for performing resin molding, and The unloading module 4 for unloading the resin molded product serves as a constituent element respectively. In addition, the supply module 2 , the resin molding modules 1000A, 1000B, and the carry-out module 4 , which are constituent elements, are mutually detachable and replaceable with respect to other constituent elements.

另外，樹脂成型裝置1具備將由供給模組2供給的引線框架300和樹脂片T運送至樹脂成型模組1000A、1000B的運送機構5（下文稱為“裝料器5”），和將由樹脂成型模組1000A、1000B樹脂成型後的樹脂成型品運送至搬出模組4的運送機構6（下文稱為“卸料器6”）。另外，樹脂片T可以通過熔融成為熔融樹脂。另外，該熔融樹脂可以通過固化（硬化），成為對引線框架300進行樹脂封裝的封裝樹脂。In addition, the resin molding apparatus 1 includes a transport mechanism 5 (hereinafter referred to as "loader 5") for transporting the lead frame 300 and the resin sheet T supplied from the supply module 2 to the resin molding modules 1000A, 1000B, and the lead frame 300 to be molded from the resin. The resin molded product molded by the modules 1000A and 1000B is conveyed to the conveying mechanism 6 (hereinafter referred to as “unloader 6 ”) of the unloading module 4 . In addition, the resin sheet T may become molten resin by melting. In addition, the molten resin can be cured (cured) to become an encapsulating resin for encapsulating the lead frame 300 with resin.

本實施方式的供給模組2是由基板供給模組7和樹脂供給模組8集成的。The supply module 2 of this embodiment is integrated with the substrate supply module 7 and the resin supply module 8 .

基板供給模組7具有基板送出部71和基板供給部72。基板送出部71將料倉內的引線框架300送至基板對齊部。基板供給部72從基板送出部71接收引線框架300，將接收的引線框架300沿預定方向對齊，並傳遞給裝料器5。The substrate supply module 7 has a substrate delivery unit 71 and a substrate supply unit 72 . The substrate delivery part 71 sends the lead frame 300 in the magazine to the substrate alignment part. The substrate supply unit 72 receives the lead frame 300 from the substrate delivery unit 71 , aligns the received lead frame 300 in a predetermined direction, and transfers it to the loader 5 .

樹脂供給模組8具有樹脂送出部81和樹脂供給部82。樹脂送出部81從後述的儲料器（stocker，未圖示）接收樹脂片T，將樹脂片T送至樹脂供給部82。樹脂供給部82從樹脂送出部81接收樹脂片T，將接收的樹脂片T沿預定方向對齊，並傳遞給裝料器5。The resin supply module 8 has a resin delivery unit 81 and a resin supply unit 82 . The resin delivery part 81 receives the resin sheet T from the stocker (not shown) mentioned later, and sends the resin sheet T to the resin supply part 82. The resin supply unit 82 receives the resin sheet T from the resin delivery unit 81 , aligns the received resin sheet T in a predetermined direction, and transfers it to the loader 5 .

樹脂成型模組1000A、1000B分別具有成型模1000。各成型模1000如圖1所示，具有下模200和上模100。Each of the resin molding die sets 1000A and 1000B has a molding die 1000 . Each molding die 1000 has a lower die 200 and an upper die 100 as shown in FIG. 1 .

另外，上模100和下模200中可以分別嵌入加熱器等加熱部（未圖示）。通過該加熱部，可以加熱上模100和下模200。In addition, heating parts (not shown) such as heaters may be respectively embedded in the upper mold 100 and the lower mold 200 . The upper mold 100 and the lower mold 200 can be heated by this heating unit.

圖2的樹脂成型裝置1的動作例如如下進行。首先，基板送出部71將料倉內的引線框架300送至基板供給部72。基板供給部72將接收的引線框架300沿預定方向對齊，傳遞給裝料器5。與此同時，樹脂送出部81將從儲料器（未圖示）接收的樹脂片T送至樹脂供給部82。樹脂供給部82將接收的樹脂片T中的所需個數（圖2中是4個）傳遞給裝料器5。The operation of the resin molding apparatus 1 of FIG. 2 is performed as follows, for example. First, the substrate delivery unit 71 sends the lead frame 300 in the magazine to the substrate supply unit 72 . The substrate supply unit 72 aligns the received lead frames 300 in a predetermined direction and transfers them to the loader 5 . At the same time, the resin sending part 81 sends the resin sheet T received from the stocker (not shown) to the resin supply part 82 . The resin supply unit 82 transfers the required number (four in FIG. 2 ) of the received resin sheets T to the loader 5 .

接著，裝料器5同時向成型模1000運送接收的2個引線框架300和4個樹脂片T。裝料器5分別向下模200的安裝部供給引線框架300，向形成在下模200的罐體（pot）內部供給樹脂片T。Next, the loader 5 conveys the received two lead frames 300 and the four resin sheets T to the molding die 1000 at the same time. The loader 5 supplies the lead frame 300 to the mounting portion of the lower mold 200 and supplies the resin sheet T inside the pot formed on the lower mold 200 .

之後，上模100和下模200合模。然後，通過柱塞（未圖示）按壓罐體塊（未圖示）內的樹脂片T被加熱而熔融形成的熔融樹脂。由此，熔融樹脂通過流道（樹脂通道）和澆口，注入至形成於上模100和下模200的模腔（參照圖1（a）～（c））的內部。接著，僅加熱熔融樹脂固化所需的時間，由此使熔融樹脂固化，形成固化樹脂。由此，模腔內的基島31被封裝在對應模腔形狀而成型的固化樹脂（封裝樹脂）內。Thereafter, the upper mold 100 and the lower mold 200 are closed. Then, the molten resin formed by heating and melting the resin sheet T in the tank block (not shown) is pressed by a plunger (not shown). Thus, molten resin is injected into the cavities (see FIGS. 1( a ) to 1 ( c )) formed in the upper mold 100 and the lower mold 200 through the runners (resin passages) and gates. Next, the molten resin is heated only for the time required for solidification, whereby the molten resin is solidified to form a cured resin. Thus, the base island 31 in the cavity is encapsulated in the cured resin (encapsulation resin) molded in accordance with the shape of the cavity.

接著，在經過固化所需的時間後，將上模100和下模200開模，使樹脂成型品（未圖示）脫模。之後，使用卸料器6，將通過成型模1000進行了樹脂封裝的樹脂成型品容納於搬出模組4的基板容納部401中。Next, after the time required for curing has elapsed, the upper mold 100 and the lower mold 200 are opened to release the resin molded product (not shown). Thereafter, the resin molded article encapsulated by the molding die 1000 is housed in the substrate housing portion 401 of the unloading module 4 using the unloader 6 .

包括上述一系列動作的樹脂成型裝置1的整體動作通過控制部9控制。在圖1中，該控制部9設置於供給模組2，但也可以設置在其他模組。另外，控制部9例如由具有CPU、內部記憶體、AD轉換器、輸入/輸出逆變器等的專用或通用電腦構成。The overall operation of the resin molding apparatus 1 including the series of operations described above is controlled by the control unit 9 . In FIG. 1 , the control unit 9 is provided in the supply module 2 , but it may be provided in another module. In addition, the control unit 9 is constituted by, for example, a dedicated or general-purpose computer including a CPU, an internal memory, an AD converter, an input/output inverter, and the like.

[實施例2][Example 2]

接著，對本發明的其他實施例進行說明。Next, other embodiments of the present invention will be described.

在本實施例中，對本發明的成型模的其他例以及使用其的本發明的樹脂成型品的製造方法的一例進行說明。另外，在本實施例中使用的引線框架與實施例1中使用的引線框架相同。In this example, another example of the molding die of the present invention and an example of a method for producing a resin molded article of the present invention using the same will be described. In addition, the lead frame used in this example is the same as the lead frame used in Example 1.

圖3（a）～（c）的工序截面圖示出了本實施例的成型模和使用其的本實施例的樹脂成型品的製造方法的工序的一部分。如圖所示，本實施例的成型模1000除下模200具有引線框架按壓機構220和突起部211以外，與圖8的成型模1000相同。The process sectional views of FIGS. 3( a ) to ( c ) show a part of the process of the molding die of this example and the method of manufacturing a resin molded article of this example using the same. As shown in the figure, the molding die 1000 of this embodiment is the same as the molding die 1000 of FIG.

在本實施例的成型模1000中，上模100不具有引線框架按壓機構120，而下模200具有引線框架按壓機構220。引線框架按壓機構220和突起部211分別相當於本發明的成型模的“變形抑制機構”。引線框架按壓機構220包括彈性部件221和按壓部件222。按壓部件222設置於可以按壓引線框架300的最外部（最外側）的連筋302的位置。按壓部件222經彈性部件221安裝於下模200的主體，從下模200的模面突出而設置。在本實施例中，該按壓部件222的突出優選為可以對載置於下模200的引線框架300中從下模的模面懸空的引線304和連筋302的部分進行支撐的距離。按壓部件222可通過彈性部件221的伸縮而上下移動，通過合模，與下模200齊平。In the molding die 1000 of this embodiment, the upper die 100 does not have the lead frame pressing mechanism 120 , while the lower die 200 has the lead frame pressing mechanism 220 . The lead frame pressing mechanism 220 and the protruding portion 211 respectively correspond to the "deformation suppressing mechanism" of the molding die of the present invention. The lead frame pressing mechanism 220 includes an elastic component 221 and a pressing component 222 . The pressing member 222 is provided at a position capable of pressing the outermost (outermost) rib 302 of the lead frame 300 . The pressing member 222 is attached to the main body of the lower die 200 via the elastic member 221 , and protrudes from the die surface of the lower die 200 . In this embodiment, the protrusion of the pressing member 222 is preferably a distance capable of supporting the parts of the lead wires 304 and ribs 302 suspended from the die surface of the lower die 200 in the lead frame 300 placed on the lower die 200 . The pressing part 222 can move up and down through the expansion and contraction of the elastic part 221 , and is flush with the lower mold 200 through mold closing.

在嵌合於引線框架300的最外部的連筋302的外側和自外側起第二個連筋302的內側的位置設置多個本實施例的突起部211，由此，可以抑制或防止連筋302的移動。另外，在本實施例中，最外部的突起部211未設置於下模200的主體，而設置於按壓部件222的上端。A plurality of protrusions 211 of this embodiment are provided on the outside of the outermost connecting rib 302 and the inner side of the second connecting rib 302 from the outer side of the lead frame 300, thereby suppressing or preventing the connecting rib. 302 for the move. In addition, in this embodiment, the outermost protrusion 211 is not provided on the main body of the lower die 200 , but is provided on the upper end of the pressing member 222 .

使用了圖3的成型模1000的樹脂成型品的製造方法例如可以如下進行。另外，圖3（a）～（c）示出的引線框架300如上所述，與實施例1中使用的引線框架，即圖6示出的引線框架300相同。The manufacturing method of the resin molded article using the molding die 1000 of FIG. 3 can be performed as follows, for example. Note that the lead frame 300 shown in FIGS. 3( a ) to ( c ) is the same as the lead frame used in Example 1, that is, the lead frame 300 shown in FIG. 6 , as described above.

首先，如圖3（a）所示，在下模200上載置引線框架300（引線框架載置工序）。與實施例1 相同，引線框架300以基島301接觸下模模腔201的底面的方式載置。另外，懸吊引腳303的高度設計為略高於下模模腔201的深度，由此連筋302和引線304為從下模200的模面略微懸空的狀態。在本實施例中，如上所述，將引線框架按壓機構220的按壓部件222設置為藉由彈性部件221而從下模200只突出這一懸空的距離。因此，此時，設置於下模200的按壓部件222的突起部211嵌合於最外部的連筋302，按壓部件122從下方支撐引線框架300的最外部的引線304和連筋302。因此，與實施例1相比，可抑制或防止最外部的連筋302移動。First, as shown in FIG. 3( a ), the lead frame 300 is placed on the lower mold 200 (lead frame placement step). As in the first embodiment, the lead frame 300 is placed such that the base island 301 is in contact with the bottom surface of the lower mold cavity 201 . In addition, the height of the suspension pins 303 is designed to be slightly higher than the depth of the cavity 201 of the lower mold, so that the ribs 302 and the leads 304 are slightly suspended from the mold surface of the lower mold 200 . In this embodiment, as mentioned above, the pressing part 222 of the lead frame pressing mechanism 220 is set to only protrude from the lower mold 200 by the suspended distance through the elastic part 221 . Therefore, at this time, the protrusion 211 of the pressing member 222 provided on the lower die 200 is fitted into the outermost rib 302 , and the pressing member 122 supports the outermost lead 304 and the rib 302 of the lead frame 300 from below. Therefore, compared with Embodiment 1, movement of the outermost rib 302 can be suppressed or prevented.

接著，如圖3（b）的箭頭X21所示，使下模200上升，使連筋302和引線304與上模100接觸。Next, as shown by the arrow X21 in FIG. 3( b ), the lower die 200 is raised to bring the ribs 302 and the leads 304 into contact with the upper die 100 .

接著，如圖3（c）的箭頭X22所示，使下模200進一步上升，上模100和下模200合模。此時，彈性部件221收縮，按壓部件222下降。通過合模，上模模腔101和下模模腔201一起形成模腔，可以在該模腔內進行樹脂成型。此時，與實施例1的圖1（c）相同，通過合模的壓力按壓連筋302，上模100和引線框架300（引線框架300的引線304）和下模200無縫隙接觸，進行合模。此時，與實施例1的圖1（c）同樣地，下模200的突起部211嵌合於自外側起第二個連筋，抑制或防止連筋302移動。如圖所示，通過抑制或防止連筋302移動，連筋302不會如圖7所示般向外側彎曲。即，在本實施例中，抑制或防止引線框架300變形。Next, as indicated by the arrow X22 in FIG. 3( c ), the lower mold 200 is further raised, and the upper mold 100 and the lower mold 200 are clamped. At this time, the elastic member 221 shrinks, and the pressing member 222 descends. By closing the molds, the upper mold cavity 101 and the lower mold cavity 201 together form a mold cavity, and resin molding can be performed in the mold cavity. At this time, as in FIG. 1(c) of Example 1, the upper mold 100 and the lead frame 300 (lead wires 304 of the lead frame 300 ) and the lower mold 200 are in contact with each other without gaps by pressing the ribs 302 with the pressure of mold clamping, and the joint is performed. mold. At this time, similarly to FIG. 1( c ) of the first embodiment, the protruding portion 211 of the lower die 200 is fitted into the second rib from the outside to suppress or prevent the rib 302 from moving. As shown, by inhibiting or preventing movement of the ribs 302, the ribs 302 do not bend outward as shown in FIG. 7 . That is, in the present embodiment, deformation of the lead frame 300 is suppressed or prevented.

另外，在圖3（b）和（c）中，通過按壓部件222按壓連筋302而抑制或防止連筋302移動的工序，使突起部211嵌合於最外部的連筋302而抑制或防止連筋302移動的工序，以及使突起部211嵌合於自外側起第二個連筋而抑制或防止連筋302移動的工序可以分別為本發明的樹脂成型品的製造方法中“連筋移動抑制工序”的一部分。但是，本發明的“連筋移動抑制工序”不限於此。例如，在圖3（b）和（c）中，也可以僅將通過按壓部件222按壓連筋302而抑制或防止連筋302移動的工序，使突起部211嵌合於最外部的連筋302而抑制或防止連筋302移動的工序，以及使突起部211嵌合於自外側起第二個連筋302而抑制或防止連筋302移動的工序中的一部分作為本發明的樹脂成型品的製造方法中的“連筋移動抑制工序”。In addition, in FIG. 3( b ) and ( c ), the pressing member 222 presses the connecting rib 302 to suppress or prevent the movement of the connecting rib 302 , and the protrusion 211 is fitted into the outermost connecting rib 302 to suppress or prevent The process of moving the connecting rib 302 and the process of fitting the protrusion 211 to the second connecting rib from the outside to suppress or prevent the moving of the connecting rib 302 can be referred to as "moving the connecting rib" in the manufacturing method of the resin molded article of the present invention, respectively. part of the suppression process". However, the "suppressing step of moving ribs" in the present invention is not limited to this. For example, in FIGS. 3( b ) and ( c ), only the process of suppressing or preventing the movement of the connecting rib 302 by pressing the connecting rib 302 with the pressing member 222 may be performed so that the protrusion 211 fits into the outermost connecting rib 302 . The process of suppressing or preventing the movement of the rib 302 and the process of fitting the protrusion 211 to the second rib 302 from the outside to suppress or prevent the movement of the rib 302 are part of the production of the resin molded article of the present invention. "Continuous tendon movement suppression process" in the method.

另外，在本實施例中，樹脂成型方法沒有特殊限制，例如可以與一般的樹脂成型方法相同或相當，例如也可以與實施例1中說明的樹脂成型方法相同。進一步，樹脂成型裝置整體的構成和其動作也沒有特殊限制，例如可以與圖2（實施例1）相同。In addition, in this embodiment, the resin molding method is not particularly limited, for example, it may be the same as or equivalent to a general resin molding method, for example, it may be the same as the resin molding method described in Embodiment 1. Furthermore, the overall configuration and operation of the resin molding device are not particularly limited, and may be the same as those in FIG. 2 (Example 1), for example.

[實施例3][Example 3]

進一步，本發明不僅限於實施例1和2。在本實施例中，對本發明的成型模的各種示例進行說明。Further, the present invention is not limited to Examples 1 and 2. In this embodiment, various examples of the molding die of the present invention will be described.

圖4（a）～（h）示出了本發明的成型模的下模的各種示例。在圖4（a）～（h）中，與圖1和3相同的構成要件用相同符號表示。4( a ) to ( h ) show various examples of the lower die of the molding die of the present invention. In FIGS. 4( a ) to ( h ), the same components as those in FIGS. 1 and 3 are denoted by the same symbols.

在圖4（a）的下模200中，以將其左右兩端的下模模腔201分別用2列突起部211夾著的方式設置突起部211。這些突起部211的列設置為與引線框架300（參照圖6）的連筋302的方向平行。該突起部211的配置與圖1（實施例1）的下模200的突起部211的配置相同。在成型模的上模和下模合模時，例如如圖1所示，這2列突起部211嵌合於連筋302，抑制或防止連筋302移動。In the lower mold 200 of FIG. 4( a ), the protrusions 211 are provided so that the lower mold cavities 201 at the left and right ends are respectively sandwiched by two rows of protrusions 211 . The rows of these protrusions 211 are arranged parallel to the direction of the ribs 302 of the lead frame 300 (see FIG. 6 ). The arrangement of the protrusions 211 is the same as the arrangement of the protrusions 211 of the lower mold 200 in FIG. 1 (Example 1). When the upper mold and the lower mold of the molding die are closed, for example, as shown in FIG. 1 , the two rows of protrusions 211 fit into the ribs 302 to restrain or prevent the ribs 302 from moving.

圖4（b）的下模200除僅在左右的最外部（兩端的下模模腔201的外側）各設置1列突起部211外，與圖4（a）的下模200相同。The lower mold 200 in FIG. 4( b ) is the same as the lower mold 200 in FIG. 4( a ) except that only one row of protrusions 211 is provided on the outermost left and right sides (outside of the lower mold cavity 201 at both ends).

在圖4（c）的下模200中，以將不僅左右兩端而是所有下模膜腔201分別用2列突起部211夾著的方式設置多個突起部211，突起部211配置於下模200整體。在圖4（d）的下模200中，多個突起部211設置為僅在左右最外部以外的內側（圖中，自外側起第2個）的下模模腔201用2列突起部211夾著下模模腔201。在圖4（e）的下模211中，在左右最外部的下模模腔201的外側的中央部，分別設置1個突起部211。In the lower mold 200 of FIG. 4( c ), a plurality of protrusions 211 are provided in such a manner that not only the left and right ends but also all the lower mold cavity 201 are sandwiched by two rows of protrusions 211 , and the protrusions 211 are arranged on the lower Die 200 overall. In the lower mold 200 of FIG. 4( d ), the plurality of protrusions 211 are provided as two rows of protrusions 211 for the lower mold cavity 201 only on the inner side (in the figure, the second from the outer side) other than the outermost left and right sides. Clamp the lower mold cavity 201. In the lower mold 211 shown in FIG. 4( e ), one protrusion 211 is provided in each of the outermost center portions of the lower mold cavities 201 on the left and right.

圖4（f）的下模200除不具有突起部211以及在兩端的下模模腔201的外側分別具有一個按壓部件222外，與圖4（a）或（b）的下模200相同。按壓部件222具有可以按壓引線框架300最外側的引線304整體的長度和寬度，設置於可以按壓最外側的引線304整體的位置。按壓部件222與圖3相同，經彈性部件221安裝在下模200的主體上，通過彈性部件221的伸縮而可以上下移動。另外，與圖3相同，按壓部件222的上端也可以設置突起部211。The lower mold 200 in FIG. 4( f ) is the same as the lower mold 200 in FIG. 4( a ) or ( b ) except that it does not have the protruding portion 211 and has a pressing member 222 on the outside of the lower mold cavity 201 at both ends. The pressing member 222 has a length and a width capable of pressing the entire outermost lead 304 of the lead frame 300 , and is provided at a position capable of pressing the entire outermost lead 304 . The pressing member 222 is the same as that in FIG. 3 , and is mounted on the main body of the lower mold 200 through the elastic member 221 , and can move up and down by the expansion and contraction of the elastic member 221 . In addition, similarly to FIG. 3 , the protrusion 211 may be provided on the upper end of the pressing member 222 .

圖4（g）的下模200是圖4（f）的按壓部件222被分割為多個（此處為3個）而設置的示例。在該例中，按壓部件222被分割為相同大小，但也可以變形較大的中央部分的部件比其他部件大。分割個數和分割後的按壓部件222的大小期望配合成型物件的引線框架的形狀而設計。The lower die 200 in FIG. 4( g ) is an example in which the pressing member 222 in FIG. 4( f ) is divided into a plurality (three in this case). In this example, the pressing member 222 is divided into the same size, but the part in the central part which deforms greatly may be larger than the other parts. The number of divisions and the size of the divided pressing member 222 are expected to be designed according to the shape of the lead frame of the molded object.

在圖4（h）的下模200中，按壓部件222具有僅按壓引線框架300最外側的引線304的中央部分的長度和寬度，設置在僅按壓最外側的引線304的中央部分的位置。除此之外，圖4（h）的下模200與圖4（f）的下模200相同。圖4（h）的下模200中可適用於成型物件的引線框架的形狀在中央部分變形較大的情況。In the lower die 200 of FIG. 4( h ), the pressing member 222 has a length and width to press only the central portion of the outermost lead 304 of the lead frame 300 , and is provided at a position to press only the central portion of the outermost lead 304 . Except for this, the lower die 200 of FIG. 4( h ) is the same as the lower die 200 of FIG. 4( f ). The lower die 200 of FIG. 4( h ) is applicable to the case where the shape of the lead frame of the molded article is greatly deformed in the central portion.

另外，在本發明的成型模中，變形抑制機構的按壓部件的位置沒有特殊限制，但為了抑制或防止引線框架的變形，優選可以按壓引線框架的強度低（弱）的部分的位置。設置按壓部件的位置例如優選可以按壓連筋的位置，特別優選可以按壓最外側的連筋的位置。如上所述，因為連筋強度低，容易變形，且越外側的連筋越易變形。In addition, in the molding die of the present invention, the position of the pressing member of the deformation suppressing mechanism is not particularly limited, but in order to suppress or prevent deformation of the lead frame, it is preferably a position capable of pressing a weak (weak) portion of the lead frame. The position where the pressing member is provided is preferably, for example, a position where a rib can be pressed, and a position where the outermost rib can be pressed is particularly preferable. As mentioned above, because the strength of the connecting rib is low, it is easy to deform, and the outer connecting rib is more likely to deform.

圖4（a）～（h）是下模200的構成例，但在本發明的成型模中，如上所述，突起部和按壓部件可以設置在上模。4( a ) to ( h ) show configuration examples of the lower die 200 , but in the molding die of the present invention, as described above, the protrusions and the pressing members may be provided on the upper die.

在本發明的成型模中，抑制或防止連筋移動的突起部優選儘量設置於外側，更優選能夠抑制或防止最外側的連筋移動的位置。如上所述，因為越外側的連筋變形量越容易變大。另外，突起部例如可以如圖4（b）所示，相對於最外側的模腔成一列，也可以如圖4（a）所示，相對於最外側的模腔成兩列，也可以如圖4（c）所示，整體配置，也可以如圖4（e）所示，在最外側的模腔的中央部分別配置1個，另外，可以相對於引線框架變形大的部位的模腔進行相同設置。每列突起部的個數可以根據成型物件的引線框架的形狀適當設定。另外，在實施例1和2中，每間隔5.2mm設置1個突起部，但如上所述，本發明不限於此。只要1個突起部的大小為可以配置於載置在下模的引線框架的相鄰引線間的大小，且高度為合模時不妨礙上模和下模的合模，則無特別限制。在實施例1和2中，突起部的形狀為正方體，高度與引線框架的厚度相同，但例如突起部的形狀也可以是長方體，棱錐形狀，也可以是圓柱形。In the molding die of the present invention, the protrusion that suppresses or prevents the movement of the ribs is preferably provided on the outer side as much as possible, and is more preferably at a position that can suppress or prevent the movement of the outermost ribs. As mentioned above, this is because the deformation of the outer ribs tends to be larger. In addition, for example, the protrusions may be arranged in a row with respect to the outermost cavity as shown in FIG. 4(b), or may be arranged in two rows with respect to the outermost cavity as shown in FIG. 4(a), or as As shown in Figure 4(c), the overall arrangement can also be arranged one at the center of the outermost cavity as shown in Figure 4(e). In addition, the cavity at the position where the deformation of the lead frame is relatively large can be arranged. Make the same settings. The number of protrusions in each row can be appropriately set according to the shape of the lead frame of the molded article. In addition, in Examples 1 and 2, one protrusion was provided at intervals of 5.2 mm, but the present invention is not limited thereto as described above. There are no particular limitations on the size of one protrusion as long as it can be placed between adjacent leads of the lead frame placed on the lower mold and has a height that does not interfere with the clamping of the upper mold and the lower mold during mold closing. In Examples 1 and 2, the shape of the protrusion is a cube, and the height is the same as the thickness of the lead frame. However, for example, the shape of the protrusion may be a cuboid, a pyramid, or a cylinder.

在本發明的成型模中，抑制或防止連筋移動的按壓部件優選儘量設置於外側，更優選能夠抑制或防止最外側的連筋移動的位置。如上所述，因為越外側的連筋變形量越容易變大。按壓部件例如可以如圖4（f）所示，以按壓最外側的引線的方式設置一個，也可以如圖4（g）或（h）所示，以按壓其他引線框架變形較大的部位的方式設置。按壓部件的形狀不限於圖4（f）～（h）所示的俯視矩形狀，例如可以是針狀、圓形。但是，考慮易於加工、施力均勻，按壓部件的形狀優選俯視矩形狀。另外，按壓部件按壓的引線框架的位置不限於引線部分，可以是引線和連筋這兩者的部分，也可以僅是連筋部分。In the molding die of the present invention, the pressing member for suppressing or preventing the movement of the ribs is preferably provided on the outer side as much as possible, more preferably at a position where the movement of the outermost ribs can be suppressed or prevented. As mentioned above, this is because the deformation of the outer ribs tends to be larger. For example, as shown in Figure 4(f), one of the pressing parts can be set to press the outermost lead, or as shown in Figure 4(g) or (h), to press other parts of the lead frame with large deformation. mode settings. The shape of the pressing member is not limited to the rectangular shape in plan view shown in FIGS. 4( f ) to ( h ), and may be, for example, needle-shaped or circular. However, considering ease of processing and uniform force application, the shape of the pressing member is preferably rectangular in plan view. In addition, the position of the lead frame pressed by the pressing member is not limited to the lead portion, and may be both the lead wire and the rib portion, or may be only the rib portion.

另外，本發明的成型模的變形抑制機構不限於此。例如，本發明的成型模的變形抑制機構如上所述，可以包括抑制或防止連筋移動的突起部和按壓引線框架而抑制或防止連筋移動的按壓部件兩者，也可以只包括其中一種。在變形抑制機構包括抑制或防止連筋移動的突起部時，突起部可以設置於上模和下模兩者，也可以僅設置於其中任一個。在變形抑制機構包括抑制或防止連筋移動的按壓部件時，按壓部件可以設置於上模和下模兩者，也可以設置於其中任一個。圖5（a）～（d）的截面圖示出了其中的一部分示例。圖5（a）～（d）分別是僅放大成型模1000的上模100和下模200的各自最外部的截面圖。圖5（a）是按壓部件設置於上模100和下模200兩者，且突起部設置於下模200的按壓部件的示例。在圖5（a）中，上模100具有與圖1的上模100相同的變形抑制機構120（包括彈性部件121和按壓部件122）。在圖5（a）中，下模200具有與圖3的下模200相同的變形抑制機構220（包括彈性部件221和按壓部件222），與圖3相同，按壓部件222的上端設置有突起部211。圖5（b）是上模100和下模200均沒有設置按壓部件，僅下模200設置有突起部211的示例。圖5（c）是上模100沒有設置按壓部件和突起部，下模200設置有與圖3和圖5（a）相同的變形抑制機構220（包括彈性部件221和按壓部件222）和突起部211的示例。圖5（d）是上模100設置有與圖1和圖5（a）相同的變形抑制機構120（包括彈性部件121和按壓部件122）而沒有設置突起部，下模200沒有設置按壓部件而僅設置有突起部211的示例。In addition, the deformation suppression mechanism of the molding die of the present invention is not limited thereto. For example, the deformation suppressing mechanism of the molding die of the present invention may include both the protrusion for suppressing or preventing the movement of the rib and the pressing member for pressing the lead frame to suppress or prevent the movement of the rib as described above, or may include only one of them. When the deformation suppressing mechanism includes a protrusion that suppresses or prevents movement of the rib, the protrusion may be provided on both the upper mold and the lower mold, or may be provided on only one of them. When the deformation suppressing mechanism includes a pressing member that suppresses or prevents movement of the ribs, the pressing member may be provided on both the upper die and the lower die, or may be provided on any one of them. The sectional views of FIGS. 5( a ) to ( d ) show some examples thereof. FIGS. 5( a ) to ( d ) are cross-sectional views in which only the upper mold 100 and the lower mold 200 of the molding die 1000 are enlarged, respectively. FIG. 5( a ) is an example of a pressing member provided on both the upper mold 100 and the lower mold 200 , and the protrusion is provided on the lower mold 200 . In FIG. 5( a ), the upper mold 100 has the same deformation suppression mechanism 120 (including an elastic member 121 and a pressing member 122 ) as the upper mold 100 of FIG. 1 . In FIG. 5( a ), the lower mold 200 has the same deformation suppression mechanism 220 (including the elastic member 221 and the pressing member 222 ) as the lower mold 200 of FIG. 3 , and the upper end of the pressing member 222 is provided with a protrusion as in FIG. 211. FIG. 5( b ) is an example in which neither the upper mold 100 nor the lower mold 200 is provided with a pressing member, and only the lower mold 200 is provided with a protrusion 211 . Fig. 5(c) shows that the upper die 100 is not provided with pressing parts and protrusions, and the lower die 200 is provided with the same deformation suppression mechanism 220 (including elastic parts 221 and pressing parts 222) and protrusions as in Fig. 3 and Fig. 5(a) 211 example. Figure 5(d) shows that the upper mold 100 is provided with the same deformation suppression mechanism 120 (including the elastic member 121 and the pressing member 122) as in Figure 1 and Figure 5(a) without a protrusion, and the lower mold 200 is not provided with a pressing member. Only an example where the protruding portion 211 is provided.

本發明的成型模的變形抑制機構如上所述，按壓部件可以設置在上模和下模兩者，也可以僅設置在其中任一個，也可以不設置。按壓部件特別優選僅設置在下模，不設置於上模。上模不設置按壓部件時，不會如圖1（b）所示般連筋302被上模的按壓部件122按壓變形，因此易於將引線框架的變形量抑制得更小。另外，下模設置按壓部件時，例如如圖3（b）所示，下模的按壓部件222也可以起到防止從下模模腔201洩漏樹脂的攔截作用。另外，變形抑制機構的突起部如上所述，可以設置於上模和下模兩者，可以僅設置於其中任一個，也可以不設置，但優選突起部至少設置於下模。在下模設置有突起部時，例如如圖3（a）所示，在將引線框架300載置於下模200的同時，使下模的突起部221嵌合於引線框架300，因此可以抑制或防止連筋302移動。另外，特別優選下模設置有按壓部件，該下模的按壓部件設置有突起部。由於該構成例如如圖3（a）～（b）所示，通過設置於按壓部件222的突起部211易於抑制或防止連筋302移動，同時，如上所述，下模的按壓部件222也可以起到防止從下模模腔201洩漏樹脂的攔截作用。As described above in the deformation suppressing mechanism of the molding die of the present invention, the pressing member may be provided on both the upper die and the lower die, may be provided on only one of them, or may not be provided. It is particularly preferable that the pressing member is provided only on the lower mold and not on the upper mold. When the pressing part is not provided on the upper die, the connecting rib 302 will not be deformed by pressing the pressing part 122 of the upper die as shown in FIG. In addition, when the lower mold is provided with a pressing part, for example as shown in FIG. In addition, as mentioned above, the protrusion of the deformation suppressing mechanism may be provided on both the upper mold and the lower mold, may be provided on only one of them, or may not be provided, but it is preferable that the protrusion is provided on at least the lower mold. When the lower mold is provided with a protrusion, for example, as shown in FIG. Prevent connecting rib 302 from moving. In addition, it is particularly preferable that the lower mold is provided with a pressing member, and the pressing member of the lower mold is provided with a protrusion. Due to this structure, for example, as shown in FIGS. It plays an intercepting role to prevent leakage of resin from the lower mold cavity 201.

進一步，本發明不限於上述實施例，在不脫離本發明的主旨範圍內，可根據需要進行任意且適當地組合、變更或選擇使用。Furthermore, the present invention is not limited to the above-mentioned embodiments, and can be combined, changed or selected arbitrarily and appropriately as required without departing from the gist of the present invention.

本申請主張2021年5月31日提交的日本專利申請2021-091680為基礎的優先權，其公開的所有內容納入於本文。This application claims priority based on Japanese Patent Application No. 2021-091680 filed on May 31, 2021, and all the disclosures thereof are incorporated herein.

1:樹脂成型裝置 2:供給模組 4:搬出模組 5:運送機構（裝料器） 6:運送機構（卸料器） 7:基板供給模組 8:樹脂供給模組 9:控制部 71:基板送出部 72:基板供給部 81:樹脂送出部 82:樹脂供給部 100:上模 101:上模模腔 120:引線框架按壓機構（變形抑制機構） 121:彈性部件 122:按壓部件 200:下模 201:下模模腔 211:突起部（變形抑制機構） 220:引線框架按壓機構（變形抑制機構） 221:彈性部件 222:按壓部件 300:引線框架 301:基島 302:連筋 303:懸吊引腳 311:連結部件 401:基板收納部 1000:成型模 1000A、1000B:樹脂成型模組 A:示出引線框架300不具有框部件的框線 B:示出連筋302較長的框線 T:樹脂片 X11、X12、X21、X22、X31、X32:示出下模200上升方向的箭頭 Y11、Y12、Y13:示出向連筋302施加平行方向的力的箭頭 1: Resin molding device 2: supply module 4: Move out the module 5: Transport mechanism (loader) 6: Conveying mechanism (unloader) 7: Substrate supply module 8: Resin supply module 9: Control Department 71: Substrate sending part 72: Substrate supply department 81:Resin sending part 82: Resin supply department 100: upper mold 101: upper mold cavity 120: Lead frame pressing mechanism (deformation suppression mechanism) 121: Elastic parts 122: Press parts 200: lower mold 201: Lower mold cavity 211: Protrusion (deformation suppression mechanism) 220: Lead frame pressing mechanism (deformation suppression mechanism) 221: Elastic parts 222: Press parts 300: lead frame 301: base island 302: even ribs 303: Suspension pin 311: link parts 401: substrate storage part 1000: forming mold 1000A, 1000B: resin molding module A: Frame lines showing lead frame 300 without frame components B: Show the longer frame line of connecting rib 302 T: resin sheet X11, X12, X21, X22, X31, X32: arrows showing the rising direction of the lower die 200 Y11, Y12, Y13: Arrows showing force in a parallel direction applied to the connecting rib 302

圖1（a）～（c）是示出本發明的成型模和使用其的本發明的樹脂成型品的製造方法的一例的工序截面圖。1( a ) to ( c ) are process cross-sectional views showing an example of the molding die of the present invention and the method for producing a resin molded article of the present invention using the same.

圖2是示出本發明的樹脂成型裝置的整體構成的一例的平面圖。Fig. 2 is a plan view showing an example of the overall configuration of the resin molding apparatus of the present invention.

圖3（a）～（c）是示出本發明的成型模和使用其的本發明的樹脂成型品的製造方法的另一例的工序截面圖。3( a ) to ( c ) are process cross-sectional views showing another example of the molding die of the present invention and the method of manufacturing the resin molded article of the present invention using the same.

圖4（a）是示出本發明的成型模的下模的一例的平面圖，圖4（b）～（h）是示出本發明的成型模的下模的另一例的平面圖。圖4（i）是在圖4（a）的下模配置引線框架時的局部放大圖。4( a ) is a plan view showing an example of the lower mold of the molding die of the present invention, and FIGS. 4( b ) to (h) are plan views showing other examples of the lower mold of the molding die of the present invention. Fig. 4(i) is a partially enlarged view when a lead frame is arranged on the lower mold of Fig. 4(a).

圖5（a）是示出本發明的成型模的變形抑制機構的一例的截面圖。圖5（b）是示出本發明的成型模的變形抑制機構的另一例的截面圖。圖5（c）是示出本發明的成型模的變形抑制機構的其他例的截面圖。圖5（d）是示出本發明的成型模的變形抑制機構的其他例的截面圖。FIG. 5( a ) is a cross-sectional view showing an example of the deformation suppression mechanism of the molding die of the present invention. FIG. 5( b ) is a cross-sectional view showing another example of the deformation suppression mechanism of the molding die of the present invention. FIG. 5( c ) is a cross-sectional view showing another example of the deformation suppression mechanism of the molding die of the present invention. FIG. 5( d ) is a cross-sectional view showing another example of the deformation suppression mechanism of the molding die of the present invention.

圖6（a）是示出用於本發明的成型模和使用其的本發明的樹脂成型品的製造方法的引線框架的一例的平面圖。圖6（b）是圖6（a）引線框架的局部放大圖。圖6（c）是圖6（b）示出的部分的立體圖。圖6（d）是將圖6（a）的引線框架配置在一般的成型模的下模時的截面簡略圖。6( a ) is a plan view showing an example of a lead frame used in the molding die of the present invention and the method of manufacturing a resin molded article of the present invention using the same. Fig. 6(b) is a partially enlarged view of the lead frame in Fig. 6(a). FIG. 6( c ) is a perspective view of the portion shown in FIG. 6( b ). FIG. 6( d ) is a schematic cross-sectional view when the lead frame of FIG. 6( a ) is disposed on a lower die of a general molding die.

圖7是示出圖6所示的引線框架的連筋變形的情形的示意圖。FIG. 7 is a schematic view showing a state in which ribs of the lead frame shown in FIG. 6 are deformed.

圖8（a）～（c）是示出圖6所示的引線框架的連筋變形的情形的工序截面圖。8( a ) to ( c ) are process cross-sectional views showing how the ribs of the lead frame shown in FIG. 6 are deformed.

100:上模 100: upper mold

101:上模模腔 101: upper mold cavity

120:引線框架按壓機構(變形抑制機構) 120: Lead frame pressing mechanism (deformation suppression mechanism)

121:彈性部件 121: Elastic parts

122:按壓部件 122: Press parts

200:下模 200: lower mold

201:下模模腔 201: Lower mold cavity

211:突起部(變形抑制機構) 211: Protrusion (deformation suppression mechanism)

300:引線框架 300: lead frame

301:基島 301: base island

303:懸吊引腳 303: Suspension pin

304:引線 304: Lead

1000:成型模 1000: forming mold

X11、X12:示出下模200上升方向的箭頭 X11, X12: the arrow showing the rising direction of the lower die 200

Claims (10)

一種成型模，用於使其的引線框架的基島的背面露出而進行樹脂成型，所述成型模包括： 上模；以及 下模， 其中所述上模和所述下模中的至少一個具備在合模時抑制或防止所述引線框架變形的變形抑制機構。 A molding die for exposing the backside of a base island of a lead frame for resin molding, the molding die comprising: the upper mold; and die, Wherein at least one of the upper mold and the lower mold is provided with a deformation suppression mechanism that suppresses or prevents deformation of the lead frame during mold clamping. 如請求項1所述的成型模，其中 所述引線框架除所述基島外，還具有引線、連筋和懸吊引腳， 所述基島通過所述懸吊引腳從所述連筋懸吊下來， 所述引線框架不具有包圍包括所述基島、所述引線、所述連筋和所述懸吊引腳整體的框部件。 Forming die as described in claim item 1, wherein In addition to the base island, the lead frame also has leads, ribs and suspension pins, the base island is suspended from the connecting rod by the suspension pin, The lead frame does not have a frame member surrounding the entirety of the base island, the leads, the ribs, and the suspension pins. 如請求項1或2所述的成型模，其中所述變形抑制機構包括抑制或防止所述連筋移動的突起部。The molding die according to claim 1 or 2, wherein the deformation suppressing mechanism includes a protrusion that suppresses or prevents movement of the rib. 如請求項3所述的成型模，其中所述突起部設置於所述下模。The molding die according to claim 3, wherein the protrusion is provided on the lower die. 如請求項1至4任一項所述的成型模，其中所述變形抑制機構包括按壓所述引線框架而抑制或防止所述連筋移動的按壓部件。The molding die according to any one of claims 1 to 4, wherein the deformation suppressing mechanism includes a pressing member that presses the lead frame to suppress or prevent movement of the tie rib. 如請求項5所述的成型模，其中所述按壓部件設置於所述上模和所述下模中的至少一個。The molding die according to claim 5, wherein the pressing member is provided on at least one of the upper die and the lower die. 如請求項5或6所述的成型模，其中所述按壓部件上設置有抑制或防止所述連筋移動的突起部。The molding die as claimed in claim 5 or 6, wherein the pressing member is provided with a protrusion that restrains or prevents the movement of the connecting rib. 如請求項5至7任一項所述的成型模，其中所述按壓部件設置於能夠按壓所述引線框架最外部的位置。The molding die according to any one of claims 5 to 7, wherein the pressing member is disposed at a position capable of pressing the outermost portion of the lead frame. 一種樹脂成型裝置，其包括請求項1至8任一項所述的成型模。A resin molding device comprising the molding die described in any one of Claims 1 to 8. 一種樹脂成型品的製造方法，其使用成型模使引線框架的基島的背面露出而進行樹脂成型， 所述成型模是請求項1至8任一項所述的成型模， 所述引線框架除所述基島外，還具有引線、連筋和懸吊引腳， 所述基島通過所述懸吊引腳從所述連筋懸吊下來， 所述引線框架不具有包圍包括所述基島、所述連筋和所述懸吊引腳整體的框部件， 所述樹脂成型品的製造方法包括： 引線框架載置工序，其將所述引線框架載置於所述下模；以及 連筋移動抑制工序，其通過所述變形抑制機構抑制或防止所述連筋移動， 在通過所述變形抑制機構抑制或防止所述連筋移動的狀態下，所述上模和所述下模合模，對所述引線框架進行樹脂成型。 A method of manufacturing a resin molded article, which uses a molding die to expose the back surface of a base island of a lead frame to perform resin molding, The molding die is the molding die described in any one of claims 1 to 8, In addition to the base island, the lead frame also has leads, ribs and suspension pins, the base island is suspended from the connecting rod by the suspension pin, The lead frame does not have a frame member surrounding the entirety of the base island, the ribs and the suspension pins, The manufacturing method of the resin molded product comprises: a lead frame placing step of placing the lead frame on the lower mold; and a connecting-beam movement suppression step of suppressing or preventing movement of the connecting-beam by the deformation suppressing mechanism, In a state in which movement of the rib is suppressed or prevented by the deformation suppressing mechanism, the upper mold and the lower mold are mold-closed to perform resin molding of the lead frame.
TW111105742A 2021-05-31 2022-02-17 Mold, resin molding device, and method for manufacturing resin molded product TWI800266B (en)

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