TW202244672A - 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 - Google Patents

蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 Download PDF

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Publication number
TW202244672A
TW202244672A TW111115972A TW111115972A TW202244672A TW 202244672 A TW202244672 A TW 202244672A TW 111115972 A TW111115972 A TW 111115972A TW 111115972 A TW111115972 A TW 111115972A TW 202244672 A TW202244672 A TW 202244672A
Authority
TW
Taiwan
Prior art keywords
heat source
steam
body surface
flow path
capillary structure
Prior art date
Application number
TW111115972A
Other languages
English (en)
Chinese (zh)
Inventor
小田和範
高橋伸一郎
太田貴之
山木誠
小鶴洋次
武田利彦
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2022/010293 external-priority patent/WO2022191240A1/ja
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202244672A publication Critical patent/TW202244672A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW111115972A 2021-04-27 2022-04-27 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 TW202244672A (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2021075258 2021-04-27
JP2021-075258 2021-04-27
JP2021079151 2021-05-07
JP2021-079151 2021-05-07
JP2021119907 2021-07-20
JP2021-119907 2021-07-20
PCT/JP2022/010293 WO2022191240A1 (ja) 2021-03-10 2022-03-09 ベーパーチャンバ、ベーパーチャンバ用のウィックシート及び電子機器
WOPCT/JP2022/010293 2022-03-09

Publications (1)

Publication Number Publication Date
TW202244672A true TW202244672A (zh) 2022-11-16

Family

ID=83847100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111115972A TW202244672A (zh) 2021-04-27 2022-04-27 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器

Country Status (6)

Country Link
US (1) US20240224469A1 (https=)
JP (1) JPWO2022230749A1 (https=)
KR (1) KR20230175276A (https=)
CN (1) CN117255927A (https=)
TW (1) TW202244672A (https=)
WO (1) WO2022230749A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20245347A1 (en) * 2024-03-27 2025-09-28 Thermal Channel Tech Oy Evaporator and cooling element

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4352091B2 (ja) * 2008-03-27 2009-10-28 株式会社東芝 電子機器、冷却装置
US8857502B2 (en) * 2011-07-26 2014-10-14 Kunshan Jue-Chung Electronics Co., Ltd. Vapor chamber having heated protrusion
JP6057952B2 (ja) 2014-07-09 2017-01-11 東芝ホームテクノ株式会社 シート型ヒートパイプ
JP7137783B2 (ja) * 2017-08-24 2022-09-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
KR20250005523A (ko) * 2017-09-28 2025-01-09 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
WO2021070544A1 (ja) * 2019-10-09 2021-04-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器

Also Published As

Publication number Publication date
KR20230175276A (ko) 2023-12-29
JPWO2022230749A1 (https=) 2022-11-03
CN117255927A (zh) 2023-12-19
US20240224469A1 (en) 2024-07-04
WO2022230749A1 (ja) 2022-11-03

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