TW202243778A - Electrical discharge machining apparatus - Google Patents

Abstract

An electrical discharge machining device comprising a carrier and an electrical discharge machining (EDM) unit is disclosed. The carrier is provided with a fixture that contains a carrier plate to hold an object to be machined, and the object is defined with a processing target area. The EDM unit applies a discharge energy to the processing target area of the object by distributing a non-uniform electric field through a discharge electrode, so that the electric field is concentrated in the forward direction. In addition, the carrier plate has an adhesive layer to adhere to the object, which can avoid vibration of the object during the EDM process, and can also avoid burr formed before the end of the EDM process, and the processing target area is located, for example, directly on the carrier plate, which can prevent the fixture from obstructing the object during the discharge process.

Description

EDM

The present invention relates to a processing device, in particular to a discharge processing device.

With the vigorous development of the semiconductor industry, electrical discharge machining technology has been commonly used to process crystal ingots or wafers. Electrical discharge machining (Electrical Discharge Machining, EDM) is a manufacturing process that generates sparks through electrical discharge to make the object to be processed into a desired shape. The dielectric material separates the two electrodes and applies a voltage to generate periodic and rapidly changing current discharges for processing the above-mentioned objects to be processed. EDM technology uses two electrodes, one of which is called tool electrode, or discharge electrode, and the other electrode is called workpiece electrode, which is connected to the above-mentioned object to be processed. During EDM, there is no actual contact between the discharge electrode and the workpiece electrode.

As the potential difference between the two electrodes increases, the electric field between the two electrodes also increases until the electric field strength exceeds the dielectric strength, at which point dielectric breakdown occurs and current flows through the two electrodes, removing some of the material. When the current flow ceases, new dielectric material flows into the electric field between the electrodes, displacing some of the aforementioned material and re-providing dielectric insulation. After the current flows, the potential difference between the two electrodes will return to before the dielectric breakdown, so that a new dielectric breakdown can be repeated.

However, the disadvantage of EDM technology is that the roughness of the cutting surface is not good, and there are quite a lot of surface cracks on the cutting surface, which may even extend along the non-cutting direction, resulting in the cracking effect in unexpected directions. Moreover, the existing electrical discharge machining technology uses jigs to clamp the periphery of the crystal ingot, that is, radially clamp the sides of the crystal ingot, to prevent rolling or displacement when cutting the crystal ingot. However, since the cutting surface of the ingot is also located in the radial direction, the traditional technology can only cut the ingot exposed to the outside of the jig, and cannot cut the area where the jig and the ingot overlap, so the traditional technology needs to stop and readjust the position , to cut again. However, no matter how the position is adjusted, there will always be some areas overlapping each other between the jig and the crystal ingot, and EDM cannot be performed.

In view of this, one or more purposes of the present invention is to provide an electric discharge machining device to solve the above-mentioned problems in the prior art.

In order to achieve the aforementioned purpose, the present invention proposes an electrical discharge machining device, which includes a stage, the stage is provided with a jig, and the jig includes a carrying plate for carrying at least one object to be processed, wherein the object to be processed is Define a processing target area; and an electrical discharge machining (EDM) unit, the electrical discharge machining (EDM) unit applies a discharge energy to the processing target area of the object to be processed through at least one discharge electrode with a non-uniform electric field distribution, thereby The object to be processed is processed along the processing target area.

Wherein, both sides of the discharge electrode are coated with an electrical shielding structure, so that the discharge energy forms the non-uniform electric field distribution.

Wherein, the discharge electrode has a recessed area, so that the discharge energy forms the non-uniform electric field distribution.

Wherein, the cross-sectional shape of the discharge electrode is T-shaped, L-shaped or elliptical, so that the discharge energy forms the non-uniform electric field distribution.

Wherein, the cross-sectional shape of the discharge electrode is circular, so that the discharge energy forms the non-uniform electric field distribution.

Wherein, the discharge electrode is in the shape of a line or a plate.

Wherein, the electrical shielding structure is a supporting structure.

Wherein, the discharge electrode or the supporting structure has a guide bump corresponding to a guide groove of a pulley of the electrical discharge machining (EDM) unit, so that the guide groove guides the guide bump.

Wherein, the discharge electrode is a magnetic element. When the discharge electrode processes the object to be processed along the processing target area, the electrical discharge machining (EDM) unit acts on the magnetic element in a non-contact manner with a magnetic attraction force, so as to fix One orientation of the discharge electrode.

Wherein, the discharge electrode includes a first conductive wire and a second conductive wire, and the thickness and/or applied voltage of the first conductive wire are different from the second conductive wire.

Wherein, it further includes a microwave or radio frequency source for supplying a microwave or radio frequency energy to the processing target area of the object to be processed through the discharge electrode of the electrical discharge machining (EDM) unit.

In order to achieve the above-mentioned purpose, the present invention proposes an electric discharge machining device, comprising: a stage, the stage is provided with a jig, and the jig includes a carrying plate for carrying at least one object to be processed, wherein the object to be processed is defined as There is a processing target area, and the position of the processing target area of the object to be processed is located above the carrier plate; and an electric discharge machining (EDM) unit is used to apply a discharge energy to the object to be processed through at least one discharge electrode The processing target area, so as to process the object to be processed along the processing target area.

Wherein, the jig further has two side plates arranged at both ends of the bearing plate, and the two side plates are used to respectively locate on both sides of the object to be processed.

Wherein, the jig has an adhesive layer disposed on the bearing plate, and the peripheral edge of the object to be processed is partially pasted on the adhesive layer of the jig.

Wherein, the adhesive layer is a conductive adhesive layer.

Wherein, the adhesive layer is discontinuously arranged on the bearing plate.

Wherein, the adhesive layer extends upwards from the carrier board to at least one side of the object to be processed.

Wherein, the adhesive layer penetrates into the object to be processed.

Wherein, the jig has a conductive plate set on the carrier plate, and the adhesive layer is set on the conductive plate.

Wherein, the conductive plate is a conductive metal structure with a work function below 4.5eV.

Wherein, the discharge electrode applies the discharge energy to the processing target area of the workpiece with a non-uniform electric field distribution.

Wherein, the stage adjusts the inclination of the jig relative to the discharge electrode or the electrical discharge machining (EDM) unit adjusts the inclination of the discharge electrode relative to the object to be processed, so as to adjust the processing of the object to be processed The angle between the target area and the carrier plate of the jig.

Wherein, the object to be processed and/or the jig further has a conductive enhancement layer, so as to improve the electrical contact between the object to be processed and the jig.

Wherein, a heat source is further included for heating the object to be processed on the carrier plate, so as to improve the electrical contact between the object to be processed and the jig.

Wherein, the discharge electrode cuts the processing target area of the object to be processed in a fluid.

Wherein, the discharge electrode cuts the processing target area of the object to be processed in a vacuum environment.

Wherein, the quantity of the discharge electrode is one or plural.

Wherein, the quantity of the object to be processed is one or plural.

In summary, the electrical discharge machining device of the present invention has the following advantages:

(1) With the non-uniform electric field distribution design, the electric field can be concentrated in the direction of travel.

(2) With the non-uniform electric field distribution design, the electric field distribution in the non-traveling direction can be reduced, so the surface roughness and surface cracks of the workpiece in the non-traveling direction can be reduced.

(3) By setting the adhesive layer on the jig, the shaking phenomenon of the object to be processed during the EDM process can be avoided, and the burr phenomenon before the end of the EDM process can also be avoided.

(4) By setting the adhesive layer on the jig, the jig can prevent the jig from hindering the EDM process of the object to be processed, so the EDM process can be made more flexible.

(5) Since the discharge electrode has multiple conductive wires, the cutting step and the grinding and polishing step can be performed at the same time, so the overall processing procedure can be accelerated, and a surface with low roughness can also be obtained.

(6) The electrical contact between the object to be processed and the jig can be improved by using the conductive gain layer of the object to be processed and/or the jig, so as to improve the efficiency of the EDM process.

Herein, in order to make Jun Shen have a further understanding and understanding of the technical characteristics of the present invention and the technical effects that can be achieved, the preferred embodiment and detailed description are as follows.

In order to facilitate the understanding of the technical features, content and advantages of this creation and the effects it can achieve, this creation is hereby combined with the drawings and described in detail in the form of embodiments as follows, and the ideas used in it are only for the purpose of For the purpose of illustration and auxiliary instructions, it may not be the true proportion and precise configuration of this creation after its implementation. Therefore, the scale and configuration relationship of the attached drawings should not be interpreted or limited to the scope of rights of this creation in actual implementation. In addition, for ease of understanding, the same elements in the following embodiments are described with the same symbols.

In addition, the terms used in the entire specification and patent claims generally have the ordinary meanings of each term used in this field, in the disclosed content and in the special content, unless otherwise specified. Certain terms used to describe the invention are discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance in describing the invention.

Regarding the use of "first", "second", "third", etc. in this article, it does not specifically refer to the meaning of order or order, nor is it used to limit the creation, it is just to distinguish components described with the same technical terms or operation only.

Secondly, if the words "comprising", "including", "having", "containing" etc. are used in this article, they are all open terms, meaning including but not limited to.

Please refer to Figure 1 and Figure 2, Figure 1 shows the structure of the electrical discharge machining device of the present invention, and is a schematic view obtained from the front of the jig. Fig. 2 is the structure of the electrical discharge machining device of the present invention, and is a partial schematic view obtained from the side of the jig. The electrical discharge machining device 10 of the present invention includes a stage 20 and an electrical discharge machining (EDM) unit 50, which is used to perform electrical discharge machining procedures on the object 100 to be processed, such as cutting (Cutting) and/or grinding and polishing (Electric Discharge Grinding, EDG) to be processed Object 100. The carrier 20 is provided with a jig 22 , and the carrier 20 can be a movable carrier or a fixed carrier. The jig 22 at least includes a carrier plate 24 for placing the object to be processed 100 , wherein the object to be processed 100 is defined with a processing target area 110 , and the processing target area 110 can be located at any position suitable for processing in the object to be processed 100 . The object to be processed 100 can be any conductor or semiconductor structure, such as a wafer or an ingot, but the cross section of the object to be processed 100 is not limited to a circle, and it can be in any shape.

The electrical discharge machining (EDM) unit 50 has a discharge electrode 52 , and the discharge electrode 52 is, for example, a linear conductive wire, a plate-shaped conductive plate, or a conductive structure of other shapes. Taking a cylindrical crystal ingot with the object 100 to be processed as an example, the processing target area 110 is defined in the radial direction of the crystal ingot, as shown by the dotted line in FIG. 2 . However, the position of the above-mentioned processing target area 110 is only an example, and is not intended to limit the present invention. As shown in Figure 3, there is a gap between the surface of the discharge electrode 52 and the surface of the workpiece 100 in the direction of travel (cutting surface 100a) and the surface (cutting surfaces 100b, 100c) in the non-travel direction, wherein the gap is filled with Insulating materials such as air, deionized water or oil or other suitable insulating substances are used as dielectric materials. For example, if the electrical discharge machining step is performed in deionized water, the deionized water will fill the aforementioned gaps. Similarly, if the electric discharge machining step is performed in an atmospheric environment, air will be filled into the aforementioned gaps. In addition, as shown in FIG. 4, if the electric discharge machining step is performed in the heating liquid tank 59a, the heating liquid 59b will be filled in the above-mentioned gap, and the heating liquid 59b in the heating liquid tank 59a, such as thermal oil, can also be reduced. thermal shock or increased thermal uniformity. In addition, during the EDM process, the present invention can reduce vibration of the object 100 to be processed by the liquid pressure, reduce the surface roughness of the cutting surfaces 100b, 100c, and help to improve the quality of EDM. As mentioned above, although the present invention is illustrated by cutting a workpiece 100 (ie, a single solid structure) with one discharge electrode 52 (single conductive structure), as shown in FIG. 2 , the present invention is not limited thereto. The discharge electrode 52 of the present invention can also, for example, simultaneously perform discharge machining on multiple objects 100 to be processed (ie, multiple solid structures), as shown in FIG. 15 a , that is, the discharge electrode 52 can cut multiple objects 100 to be processed simultaneously. Similarly, in the present invention, multiple separated discharge electrodes 52 (multiple conductive structures) can simultaneously cut one object 100 to be processed (as shown in FIG. 15b ) or multiple objects to be processed (as shown in FIG. 15c ). . Moreover, the electrical discharge machining procedure of the present invention is not limited to the aforementioned liquid or gaseous fluids, and the electrical discharge machining procedure of the present invention can also be performed in a vacuum environment. In other words, the electric discharge machining procedure of the present invention can cut the object 100 to be processed in wet mode with the discharge electrode 52 (i.e., in the liquid tank or the heating liquid tank 59a), and can also cut the object to be processed 100 in the dry mode with the discharge electrode 52 (i.e. in the liquid tank 59a). in air or in a vacuum environment). Wherein, in the process of the discharge electrode 52 dry-cutting the workpiece 100 in the present invention, the temperature of the discharge electrode 52 can also be selectively lowered. The temperature of the discharge electrode 52 can be raised by the discharge energy, that is, no cooling fluid such as liquid or gas is used.

Please continue to refer to FIGS. 1 to 3, the electric discharge machining (EDM) unit 50 of the present invention has a power source 54, and the power source 54 is connected to the discharge electrode 52 with an electrical circuit, so that the discharge electrode 52 and the object to be processed A voltage difference is generated between 100. When the value of this voltage difference is greater than the insulation strength provided by the above-mentioned gap, discharge energy will be generated and provided to the processing target area 110 of the object to be processed 100, so that it can be processed along the The processing target area 110 processes the object 100 to be processed. In addition, taking a linear conductive wire as an example, the discharge electrode 52 of the present invention can be a single conductive wire (as shown in FIG. 3 ), or a plurality of conductive wires. Taking two conductive wires as an example, as shown in FIG. 5 , the thickness (diameter) and/or applied voltage of the first conductive wire 55a can be the same or different from that of the second conductive wire 55b. For example, the thickness of the second conductive wire 55b is substantially greater than the thickness of the first conductive wire 55a, whereby the first conductive wire 55a can be used to cut the cutting surface 100a of the workpiece 100 positioned on the traveling direction (front side). The two conductive wires 55b can be used for grinding and polishing the cut surfaces 100b, 100c of the workpiece 100 in the non-traveling direction. Wherein, the thickness of the first conductive line 55a and the second conductive line 55b and/or the applied voltage can be determined according to the required roughness of the cutting surface, so no other examples are given. The present invention can also optionally include a microwave or radio frequency source 60, for example, to supply microwave energy or radio frequency energy to the processing target area 110 of the object to be processed 100 through the first conductive wire 55a and/or the second conductive wire 55b, so as to provide The heating effect, annealing effect or grinding and polishing effect can effectively reduce the surface roughness and avoid the need for subsequent mechanical or chemical grinding and polishing steps. Similarly, if the discharge electrode 52 of the present invention is only a single conductive wire, the microwave or radio frequency source 60 of the present invention can also supply microwave energy or radio frequency energy to the processing target area 110 of the object to be processed 100 through this single conductive wire . Taking the microwave or radio frequency source 60 as an example, the microwave of the present invention has a wavelength range of about 1 mm to about 1 m, a frequency range of about 300 GHz to about 0.3 GHz, and a power range of about 200 watts to about 5,000 watts. The material of the discharge electrode 52 can be selected from, for example, copper (Copper), brass (Brass), molybdenum (Molybdenum), tungsten (Tungsten), graphite (Graphite), steel (Steel), aluminum (Aluminum) and zinc (Zinc) composed of groups. The thickness of the discharge electrode 52 is about less than 300 μm, and the thickness range is preferably about 30 μm to about 300 μm.

In one embodiment, the discharge energy provided by the discharge electrode 52 of the present invention preferably has a non-uniform electric field distribution, and the electric field of the discharge energy provided by the discharge electrode 52 is preferably concentrated on the traveling direction of the discharge electrode 52 . That is, the electric field distribution in the advancing direction (cutting direction) of the discharge electrode 52 is larger, and the electric field distribution in the lateral direction perpendicular to the advancing direction thereof is smaller. In other words, the discharge energy provided by the discharge electrode 52 is preferably concentrated on the object to be processed 100 in the direction of travel (front side), and the discharge energy applied to the object to be processed 100 on the non-advance direction (both sides) is reduced. Therefore, the surface roughness of the cut surfaces 100b, 100c of the workpiece 100 in the non-traveling direction can be reduced, for example, the Ra and Rz values, and the surface cracks of the cut surfaces 100b, 100c can be reduced.

In order to provide the discharge energy of the non-uniform electric field distribution through the discharge electrode 52, as shown in Fig. There may be an electrical shielding structure 52b around the electrode 52 (for example, left and right sides or one side), which is, for example, an insulating material or other suitable materials. Wherein, both the recessed region 52a and the electrical shielding structure 52b can achieve the effect of reducing the electric field expansion range of the discharge electrode 52, so that the surface roughness of the cut surfaces 100b, 100c of the object 100 to be processed can be reduced. For example, the cross-sectional shape of the discharge electrode 52 can be, for example, a T-shape (as shown in FIG. 6 a ), an L-shape, or other shapes with a recessed region 52 a. Alternatively, the surroundings of the discharge electrode 52 (such as the left and right sides or one side) are coated with an electrical shielding structure 52b, and the cross-sectional shape of the discharge electrode 52 can also be T-shaped (as shown in Figure 6b) or L-shaped (as shown in Figure 6e). , Fig. 6f, Fig. 6g), circular (as Fig. 6c), ellipse (as Fig. 6d) or other appearance, and preferably only expose the front side (travel direction) of discharge electrode 52, so that discharge electrode 52 provides The electric field of the discharge energy concentrates on the traveling direction of the discharge electrode 52 . Wherein, in the EDM process, the above-mentioned recessed area 52a can play the role of fixing the discharge electrode 52 to reduce the shaking or rotation of the discharge electrode 52 during the cutting process, and can also provide the effect of leaking water.

In addition, as shown in Fig. 1 and Fig. 4, the electric discharge machining (EDM) unit 50 of the present invention can also optionally have a wire feeding reel 56a and a wire reel 56b, wherein the two ends of the discharge electrode 52 are respectively Connect to the wire feeding reel 56a and the wire reel 56b, and the wire feeding reel 56a and the wire reel 56b can use the pulleys 57a, 57b to socket the discharge electrode 52 respectively, so as to position the discharge electrode 52, and for example adjust the discharge electrode 52 tension. Therefore, the discharge electrode 52 of the electrical discharge machining (EDM) unit 50 of the present invention can also optionally have a guide bump 53a (as shown in FIG. ), and/or, the electrical shielding structure 52b can not only cover the periphery of the discharge electrode 52, but also optionally have a guide bump 53b (as shown in Figure 6d) corresponding to the guide grooves 58a, 58b of the pulleys 57a, 57b (As shown in Figure 7b), so as to serve as a supporting structure at the same time.

In addition, please refer to FIG. 1 to FIG. 12b. In order to avoid the vibration (shaking) phenomenon of the object 100 to be processed during the electric discharge machining process by the discharge electrode 52 or to avoid the burr phenomenon before the end of the electric discharge machining process, this paper The jig 22 of the invention is more optionally provided with an adhesive layer 70 on the carrier board 24 . The periphery of the object to be processed 100 is partially pasted on the adhesive layer 70 , so that the object to be processed 100 is firmly pasted on the bearing plate 24 of the jig 20 . Wherein, the adhesive layer 70 is not limited to be disposed on the carrier board continuously (as shown in FIG. 8 b ) or discontinuously (as shown in FIG. 8 c ). Taking the discontinuous type as an example, the adhesive layer 70 is arranged on the carrier plate 24 of the jig 22 at intervals, and its position corresponds to the processing target area 110, that is, the position of the adhesive layer 70 is located in the processing target area 110 below. The location of the adhesive layer 70 is not limited to be directly below the processing target area 110 , as long as it can fix the object 100 to be processed, it can be applicable to the present invention.

Wherein, the jig 22 can also optionally have a conductive plate 72 disposed on the carrier plate 24, and the above-mentioned adhesive layer 70 is disposed on the conductive plate 72, which can be used as a buffer layer to prevent the electric discharge machining process from causing damage to the jig. 22 damaged. The conductive plate 72 is, for example, but not limited to, a material layer with a work function of about 4.5 eV or less, such as zinc, titanium, aluminum or other suitable conductive metal structures. The adhesive layer 70 also provides the functions of conducting electricity, fixing and protecting the conductive plate 72 , and has the advantage of being easy to remove. In addition, in addition to the above-mentioned adhesive layer 70 disposed on the carrier plate 24 of the jig 22, the jig 22 of the present invention may optionally include two side plates 26 disposed on both ends of the carrier plate 24 (as shown in FIG. 8a ). , wherein the two side plates 26 are respectively located on both sides of the object to be processed 100, and are preferably fixed on both sides of the object to be processed 100, such as axially holding the ingot, which can prevent the object to be processed 100 from sliding or toppling when tilting the processing angle , can also make the side plate 26 stagger the travel route of the discharge electrode 52, so as to hinder the progress of the discharge machining process. In addition, the present invention can also omit the adhesive layer 70, that is, the object 100 to be processed can be directly placed on the conductive plate 72 of the jig 22, and if the adhesive layer 70 is omitted, the present invention can also selectively use the jig 22 The two side plates 26 directly hold the two sides of the object to be processed 100 to prevent the object to be processed 100 from sliding or toppling. Wherein, the adhesive layer 70 can be a non-conductive adhesive layer or a conductive adhesive layer, as long as the object to be processed 100 can be adhered to the carrier plate 24 of the jig 20 or to the conductive plate 72, it can be suitable for this application. Invention, and there is no limit to the bonding area between the adhesive layer 70 and the object to be processed 100, as long as the object to be processed 100 can be electrically connected to the carrier plate 24 or the conductive plate 72 below it to form an electrical circuit, it can be applied to this invention. invention.

As shown in FIG. 9, the adhesive layer 70 is not limited to sticking only to the bottom of the object to be processed 100, the adhesive layer 70 can also selectively extend upward from the carrier plate 24 (ie, the bottom of the object to be processed 100) to the bottom of the object to be processed 100. At least one side can be applied to the present invention as long as it can firmly stick the object 100 to be processed. In addition, as shown in FIG. 10 , before sticking to the adhesive layer 70, the present invention can also, for example, perform a preprocessing procedure on the object 100 to be processed, so that the area of the object 100 to be processed to be pasted with the adhesive layer 70 has a rough surface or a gap Therefore, the adhesive layer 70 can further penetrate into the object to be processed 100 from the surface of the object to be processed 100 to improve the sticking effect, and if the adhesive layer 70 is made of conductive adhesive material, the conductive effect can also be improved. Wherein, the adhesive layer 70 can be any suitable material, such as commercially available conductive adhesive material or non-conductive adhesive material.

In addition, as shown in FIG. 2 to FIG. 3 and FIG. 8a, the position of the processing target area 110 of the object to be processed 100 of the present invention is preferably located above the carrier plate 24, that is, the projection line of the processing target area 110 Falling between the two side plates 26, rather than the conventional technology that the processing target area is located outside the side plates of the carrier plate, the present invention can reduce the shaking phenomenon of the object 100 to be processed in the electric discharge machining process, and can also avoid Before the EDM procedure ends, burrs are generated on the cut surfaces 100b, 100c of the workpiece 100 . In addition, in the present invention, the position of the processing target area 110 of the object to be processed 100 is located above the carrier plate 24, that is, the position of the processing target area 110 is located between the two side plates 26, so the discharge electrode 52 will only An electric discharge machining process is performed between the side plates 26 . The location of the processing target area 110 of the object to be processed 100 is not limited to be directly above the carrier plate 24 , as long as it is available for processing, the present invention can be applied. Therefore, the present invention can perform electrical discharge machining on the entire object to be processed 100, avoiding the disadvantage of the prior art that the electrical discharge machining can only be performed on the machining target area located outside the side plate of the carrier plate because it is obstructed by the side plate 26. As shown in Figures 8b and 8c, since the present invention has provided an adhesive layer 70 on the carrier plate 24 of the jig 22, and the position of the carrier plate 24 is located below the processing target area 110, it can reliably support the entire object to be processed 100 Therefore, even if the above-mentioned side plates 26 are omitted, the present invention can also achieve the effect of reducing vibration and burrs, and the electric discharge machining process will not be hindered by the side plates 26 at all.

Because, when the overlapping length of the discharge electrode 52 and the object to be processed 100 is too long, the discharge electrode 52 between the pulleys 57a, 57b will easily shake during the process of cutting the object to be processed 100, causing the cutting surface to deviate or skew . And, the farther the position is from the pulleys 57a, 57b, the larger the shaking width of the discharge electrode 52 is. Therefore, the present invention may optionally include a positioning unit 62 for fixing the orientation of the discharge electrode 52 in a non-contact manner, for example. For example, the discharge electrode 52 or the electrical shielding structure 52b is, for example, a magnetic element, such as a magnet or a ferrous material, while the positioning unit 62 is, for example, a magnet or an electromagnet that can generate magnetic attraction, and the discharge electrode 52 and The positioning units 62 are respectively located on opposite sides of the machining target area 110 , so as to act on the above-mentioned magnetic elements by magnetic force, so that the discharge electrode 52 can maintain a fixed orientation during the discharge machining process.

In addition, the present invention can also, for example, adjust the angle between the machining target area 110 of the workpiece 100 and the carrier plate 24 of the jig 22, so as to perform an off-axis EDM procedure. For example, as shown in FIG. 1 and FIG. 12a, the stage 20 of the present invention can be, for example, a mobile stage with multi-axis (for example, 2-axis, 3-axis or more) motors, so as to achieve a moving position and even adjust The inclination of the jig 22 relative to the discharge electrode 52, or as shown in Figure 1 and Figure 12b, the wire feeding reel 56a and the wire reel 56b of the electrical discharge machining (EDM) unit 50 of the present invention can, for example, have multiple Shaft (for example, 2-shaft, 3-shaft or more) motors can adjust the inclination of the discharge electrode 52 relative to the workpiece 100 by adjusting the wire-feeding direction of the electrical discharge machining (EDM) unit 50 .

In addition, in order to improve the efficiency of the electrical discharge machining process, the present invention can also improve the electrical contact between the object to be processed 100 and the jig 22 through the conductive gain layer. For example, as shown in FIG. 13 , a conductive gain layer 80 can be formed on the object to be processed 100 through surface modification, such as using the aforementioned electrical discharge machining (EDM) unit 50 or laser. The composition depends on the composition of the object 100 to be processed, and the position of the conductive gain layer 80 is adjacent to the carrier plate 24 of the jig 22 or directly connected to the carrier plate 24 . The present invention improves the electrical contact between the jig 22 and the object 100 to be processed by modifying the surface of the object 100 to be processed. Alternatively, the present invention can also form the conductive gain layer 82 and/or 84 on the carrier plate 24 and/or the two side plates 26 of the jig 22 by means of coating to provide good electrical contact, and even the conductive plate 72 can also be coated. There is a conductive gain layer 86 or itself is a conductive gain layer 86 (as shown in FIG. 14 ) to provide good electrical contact, and the positions of the conductive gain layers 82 and 84 can be adjacent to or directly in contact with the object 100 to be processed. Wherein, the materials of the conductive gain layers 82 and/or 84 can be, for example, the same or different conductive materials, as long as they can provide good electrical contact, they are applicable to the present invention. In addition, the conductive plate 72, the carrier plate 24 and/or the two side plates 26 of the jig 22 can also be made of the conductive gain material of the above-mentioned conductive gain layers 82, 84 and/or 86, for example, the conductive gain material can be selected Different or the same conductive materials, such as different or the same metal materials, are applicable to the present invention as long as they can provide good electrical contact. Alternatively, during the electric discharge machining process, it is also possible to add conductive materials to the heating liquid 59b in the aforementioned heating liquid tank 59a, so as to facilitate the electric discharge machining process, especially to improve the semiconductor or poor conductor waiting to be processed 100. EDM efficiency. The work function of the aforementioned conductive gain layers 82 , 84 and/or 86 is, for example, below about 4.5 eV, but not limited thereto, as long as it helps to improve the electrical contact, it can be applied to the present invention.

Besides, the present invention can also heat the object to be processed 100 on the carrier plate 24 through the heat source 90 to improve the electrical contact between the object to be processed 100 and the jig 22 . The heat source 90 can be, for example, the aforementioned heating liquid tank 59a, the microwave or radio frequency source 60, or a laser source and/or an infrared light source. After the object 100 to be processed is in contact with the jig 22 , the heat source 90 is used for heat treatment to improve the electrical contact, so as to improve the efficiency of the subsequent EDM procedure.

In summary, the electrical discharge machining device of the present invention has the following advantages:

(1) With the non-uniform electric field distribution design, the electric field can be concentrated in the direction of travel.

(2) With the non-uniform electric field distribution design, the electric field distribution in the non-traveling direction can be reduced, so the surface roughness and surface cracks of the workpiece in the non-traveling direction can be reduced.

(3) By setting the adhesive layer on the jig, the shaking phenomenon of the object to be processed during the EDM process can be avoided, and the burr phenomenon before the end of the EDM process can also be avoided.

(4) By setting the adhesive layer on the jig, the jig can prevent the jig from hindering the EDM process of the object to be processed, so the EDM process can be made more flexible.

(5) Since the discharge electrode has multiple conductive wires, the cutting step and the grinding and polishing step can be performed at the same time, so the overall processing procedure can be accelerated, and a surface with low roughness can also be obtained.

(6) The electrical contact between the object to be processed and the jig can be improved by using the conductive gain layer of the object to be processed and/or the jig, so as to improve the efficiency of the EDM process.

The above descriptions are illustrative only, not restrictive. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the scope of the appended patent application.

10: Electrical discharge machining device 20: Carrier 22: Fixture 24: Loading board 26: side panel 50: Electrical discharge machining (EDM) unit 52: discharge electrode 52a: Recessed area 52b: Electric shielding structure 53a, 53b: guide bump 54: Power source 59a: Heating Liquid Tank 59b: Heating Liquids 55a: first conductive line 55b: second conductive wire 56a: Wire feeding reel 56b: Take-up reel 57a, 57b: pulleys 58a, 58b: guide groove 60: Microwave or RF source 62: Positioning unit 70: adhesive layer 72: Conductive plate 100: to be processed 100a: cutting surface 100b: cutting surface 100c: cutting surface 110: Processing target area 80, 82, 84, 86: conductive gain layer 90: heat source

Fig. 1 shows the structure of the electrical discharge machining device of the present invention, and is a schematic diagram obtained from the front of the jig.

Fig. 2 is the structure of the electrical discharge machining device of the present invention, and is a partial schematic view obtained from the side of the jig.

3 is a partially enlarged schematic view of the discharge machining device of the present invention during the discharge machining process, wherein the discharge electrode is a single conductive wire.

Fig. 4 shows the structure of the electrical discharge machining device of the present invention, and is a schematic diagram of the electrical discharge machining procedure performed in the heating liquid tank.

FIG. 5 is a partially enlarged schematic view of the discharge machining device of the present invention during the discharge machining process, wherein the discharge electrodes are a plurality of conductive wires.

6a to 6g are schematic diagrams of the discharge electrode capable of generating non-uniform electric field distribution and its electrical shielding structure in the discharge machining device of the present invention.

7a to 7b are schematic diagrams of the discharge electrode and its electrical shielding structure of the discharge machining device of the present invention having guide bumps corresponding to the guide grooves of the pulley.

8a to 8c are exploded schematic diagrams of the object to be processed, the jig and the carrier of the electric discharge machining device of the present invention.

FIG. 9 is a schematic diagram of the adhesive layer of the jig extending to the side of the object to be processed in the electrical discharge machining device of the present invention.

FIG. 10 is a schematic diagram of the adhesive layer of the jig of the electrical discharge machining device of the present invention penetrating into the object to be processed.

FIG. 11 is a schematic diagram of the electrical discharge machining device of the present invention using the positioning unit to fix the orientation of the discharge electrode during the electrical discharge machining procedure.

12a to 12b are schematic diagrams of the off-axis EDM procedure performed by the EDM device of the present invention.

Fig. 13 is a schematic diagram of a conductive gain layer in the present invention.

FIG. 14 is a schematic diagram of the conductive plate as the conductive gain layer in the present invention.

Figure 15a is a schematic diagram of cutting multiple objects to be processed with a single discharge electrode in the present invention, Figure 15b is a schematic diagram of cutting a single object to be processed with multiple discharge electrodes in the present invention, and Figure 15c is a schematic diagram of cutting multiple objects to be processed with multiple discharge electrodes in the present invention Schematic diagram of the processed object, where the viewing angle of Fig. 15a is different from that of Fig. 15b and Fig. 15c.

100: to be processed

10: Electrical discharge machining device

20: Carrier

22: Fixture

24: Loading board

50: Electrical discharge machining (EDM) unit

52: discharge electrode

54: Power source

56a: Wire feeding reel

56b: Take-up reel

57a, 57b: pulleys

60: Microwave or RF source

70: adhesive layer

72: Conductive plate

Claims (29)

An electrical discharge machining device, comprising: A carrier, the carrier is provided with a jig, the jig includes a carrying plate for carrying at least one object to be processed, wherein the object to be processed defines a processing target area; and An electric discharge machining (EDM) unit, which applies a discharge energy to the processing target area of the object to be processed through at least one discharge electrode with a non-uniform electric field distribution, so as to process along the processing target area The object to be processed. The discharge machining device as claimed in claim 1, wherein both sides of the discharge electrode are coated with an electrical shielding structure, so that the discharge energy forms the non-uniform electric field distribution. The discharge machining device as claimed in claim 1, wherein the discharge electrode has a recessed region, so that the discharge energy forms the non-uniform electric field distribution. The discharge machining device as claimed in claim 1 or 2, wherein the cross-sectional shape of the discharge electrode is T-shaped, L-shaped or elliptical, so that the discharge energy forms the non-uniform electric field distribution. The discharge machining device as claimed in claim 2, wherein the cross-sectional shape of the discharge electrode is circular, so that the discharge energy forms the non-uniform electric field distribution. The electrical discharge machining device according to claim 1, wherein the discharge electrode is in the shape of a wire or a plate. The electrical discharge machining device as claimed in claim 2, wherein the electrical shielding structure is a supporting structure. The electrical discharge machining device as claimed in item 7, wherein the discharge electrode or the support structure has a guide bump corresponding to a guide groove of a pulley of the electrical discharge machining (EDM) unit, so as to utilize the The guide groove guides the guide bump. The discharge machining device as described in claim 1, wherein the discharge electrode is a magnetic element, and when the discharge electrode processes the workpiece along the machining target area, the discharge machining (EDM) unit uses a magnetic attraction force The contact type acts on the magnetic element, so as to fix the orientation of the discharge electrode. The discharge machining device as described in claim 1, wherein the discharge electrode comprises a first conductive wire and a second conductive wire, the thickness of the first conductive wire and/or the applied voltage are different from the second conductive wire Wire. The electrical discharge machining device as described in claim 1 further includes a microwave or radio frequency source for supplying a microwave or radio frequency energy to the machining target area of the workpiece through the discharge electrode of the electrical discharge machining (EDM) unit. An electric discharge machining device, comprising: A carrier, the carrier is provided with a jig, the jig includes a bearing plate for carrying at least one object to be processed, wherein the object to be processed defines a processing target area, and the processing target area of the object to be processed is located above the carrier plate; and An electric discharge machining (EDM) unit is used for applying a discharge energy to the processing target area of the object to be processed through at least one discharge electrode, so as to process the object to be processed along the processing target area. The electric discharge machining device as described in Claim 12, wherein the jig further has two side plates disposed on both ends of the supporting plate, and the two side plates are used to respectively locate on both sides of the object to be processed. The electric discharge machining device according to claim 12, wherein the jig has an adhesive layer disposed on the carrier plate, and the peripheral edge of the object to be processed is partially pasted on the adhesive layer of the jig. The electrical discharge machining device according to claim 14, wherein the adhesive layer is a conductive adhesive layer. The electrical discharge machining device as claimed in claim 14, wherein the adhesive layer is discontinuously disposed on the carrier plate. The electrical discharge machining device as claimed in claim 14, wherein the adhesive layer extends upward from the carrier plate to at least one side of the object to be processed. The electrical discharge machining device according to claim 14, wherein the adhesive layer penetrates into the object to be processed. The electrical discharge machining device as claimed in claim 12, wherein the jig has a conductive plate disposed on the supporting plate. The electrical discharge machining device as claimed in claim 14, 15, 16, 17 or 18, wherein the jig has a conductive plate disposed on the carrier plate, and the adhesive layer is disposed on the conductive plate. The electrical discharge machining device as claimed in claim 19, wherein the conductive plate is a conductive metal structure with a work function of 4.5 eV or less. The electrical discharge machining device according to claim 12, wherein the discharge electrode applies the discharge energy to the machining target area of the object to be machined with a non-uniform electric field distribution. The electrical discharge machining device according to claim 12, wherein the stage adjusts the inclination of the jig relative to the discharge electrode or the electrical discharge machining (EDM) unit adjusts the inclination of the discharge electrode relative to the object to be processed , so as to adjust the included angle of the processing target area of the object to be processed relative to the bearing plate of the jig. The electrical discharge machining device according to claim 1 or 12, wherein the object to be processed and/or the jig further has a conductive gain layer, so as to improve the electrical contact between the object to be processed and the jig. The electrical discharge machining device as claimed in claim 1 or 12 further includes a heat source for heating the object to be processed on the carrier plate, so as to improve the electrical contact between the object to be processed and the jig. The electrical discharge machining device as claimed in claim 1 or 12, wherein the discharge electrode cuts the machining target area of the object to be machined in a fluid. The electrical discharge machining device as claimed in claim 1 or 12, wherein the discharge electrode cuts the machining target area of the object to be machined in a vacuum environment. The electrical discharge machining device according to claim 1 or 12, wherein the number of the discharge electrodes is one or plural. The electric discharge machining device according to claim 1 or 12, wherein the number of the objects to be processed is one or more.

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