TW202242321A - Temperature and humidity control device including a first sensing component, a second sensing component, a third sensing component, a housing, a refrigeration device, a heating device, a humidifier and a control device - Google Patents
Temperature and humidity control device including a first sensing component, a second sensing component, a third sensing component, a housing, a refrigeration device, a heating device, a humidifier and a control device Download PDFInfo
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本發明是關於一種溫濕控制裝置,尤其係指一種可降低或升高流體之溫度及濕度之裝置。The present invention relates to a temperature and humidity control device, in particular to a device that can lower or raise the temperature and humidity of fluid.
隨著時代的發展,工業生產的品管要求逐漸提高,使得無塵環境的使用也越來越普及,產業界常使用的無塵空間,以半導體產業常設置的無塵室較為常見。With the development of the times, the quality control requirements of industrial production have gradually increased, making the use of dust-free environments more and more popular. The clean rooms often used in the industry are more common in the semiconductor industry.
無塵室,又稱淨室、潔淨室或清淨室,是指一個具有低污染水準的環境,這裡所指的污染來源有灰塵,空氣傳播的微生物,懸浮顆粒,和化學揮發性氣體。更準確地講,一個無塵室具有一個受控的污染級別,污染級別可用每立方米的顆粒數,或者用最大顆粒大小來釐定的;低階別的無塵室通常是沒有經過消毒的(如沒有受控的微生物),更在意的是無塵室中的灰塵。A clean room, also known as a clean room, a clean room or a clean room, refers to an environment with a low level of pollution. The sources of pollution referred to here include dust, airborne microorganisms, suspended particles, and chemical volatile gases. More precisely, a clean room has a controlled pollution level, which can be determined by the number of particles per cubic meter, or by the maximum particle size; low-level clean rooms are usually not sterilized ( If there are no controlled microorganisms), the dust in the clean room is more concerned.
但是在無塵空間的使用中,除了無塵環境所需的污染過濾系統外,還需要能控制無塵空間的濕度以及溫度,無塵空間的溫度與濕度主要是依據產線的工藝要求來制定,又於滿足工藝要求的條件下,也須考慮到作業人員的舒適度感。However, in the use of a clean space, in addition to the pollution filter system required for a clean environment, it is also necessary to be able to control the humidity and temperature of the clean space. The temperature and humidity of the clean space are mainly determined according to the process requirements of the production line. , and under the condition of meeting the process requirements, the comfort of the operators must also be considered.
當無塵空間的濕度、溫度過高時,將產生諸多問題,ㄧ般理想相對濕度範圍介於40~60%之間,如相對濕度高於60%且溫度也偏高的情況下,意指環境露點溫度偏高,使的冷卻水管壁上造成結露,如果發生在精密設備或電路中,將產生引起各種事故,使產品不良率上升;此外,濕度太高時,空氣中的水分子會使黏著的灰塵吸附在矽晶圓表面耐難以清除,且相對濕度越高,黏附的顆粒越難以去除,但當相對濕度低於30%時,又容易產生靜電,由於靜電力的作用使粒子也容易吸附於晶圓表面,同時大量半導體器件容易發生電擊穿。When the humidity and temperature in the clean space are too high, many problems will occur. Generally, the ideal relative humidity range is between 40% and 60%. If the relative humidity is higher than 60% and the temperature is also high, it means The ambient dew point temperature is too high, which will cause condensation on the cooling water pipe wall. If it occurs in precision equipment or circuits, it will cause various accidents and increase the defective rate of products; in addition, when the humidity is too high, the water molecules in the air will Adhering dust to the surface of the silicon wafer is difficult to remove, and the higher the relative humidity, the more difficult it is to remove the adhered particles, but when the relative humidity is lower than 30%, it is easy to generate static electricity. It is easy to adsorb on the surface of the wafer, and a large number of semiconductor devices are prone to electrical breakdown.
由上述可知,濕度控制是無塵環境生產必須具備的重要條件,因此產業界需要一種能感測環境溫濕度之溫濕控制裝置,以調控無塵空間的溫度與濕度。From the above, it can be seen that humidity control is an important condition that must be met for production in a clean environment. Therefore, the industry needs a temperature and humidity control device that can sense the temperature and humidity of the environment to regulate the temperature and humidity of the clean space.
有鑑於上述習知技術之問題,本發明提供一種溫濕控制裝置,其係以感測組件先感測環境中流體的溫度與濕度,再將流體依序利用製冷裝置除濕,製熱裝置加溫控溫,以加濕裝置調控濕度,並利用控制裝置依第二、三感測組件之訊號控制製冷裝置、製熱裝置以及加濕裝置,以此結構感測環境之溫度與濕度,並對應需求進行溫度與濕度的調整與控制。In view of the above-mentioned problems in the prior art, the present invention provides a temperature and humidity control device, which uses a sensing component to sense the temperature and humidity of the fluid in the environment first, and then dehumidifies the fluid sequentially with a refrigeration device and heats it with a heating device Temperature control, use the humidifier to regulate the humidity, and use the control device to control the refrigeration device, heating device and humidifier according to the signals of the second and third sensing components, so as to sense the temperature and humidity of the environment with this structure, and respond to the demand Adjust and control temperature and humidity.
本發明之一目的在於提供一種溫濕控制裝置,其係以感測組件先感測環境中流體的溫度與濕度,再將流體依序利用製冷裝置除濕,製熱裝置加溫控溫,以加濕裝置調控濕度,並藉由控制裝置依另一感測組件之訊號控制製冷裝置、製熱裝置以及加濕裝置之運作,以此結構感測環境之溫度與濕度,並對應需求進行溫度與濕度的調整與控制。One object of the present invention is to provide a temperature and humidity control device, which uses a sensing component to first sense the temperature and humidity of the fluid in the environment, and then dehumidifies the fluid sequentially with a refrigeration device, and a heating device to heat and control the temperature to increase the temperature. The humidity device regulates the humidity, and the control device controls the operation of the refrigeration device, heating device and humidification device according to the signal of another sensing component, so as to sense the temperature and humidity of the environment with this structure, and adjust the temperature and humidity according to the demand. adjustment and control.
為達到上述所指稱之各目的與功效,本發明提供一種溫濕控制裝置,其係用於當一流體流經一第一感測組件後進入該溫濕控制裝置,以控制該流體之溫濕度,該第一感測組件係包含一第一溫度感測器以及一第一濕度感測器,該第一溫度感測器其係用以感測該流體之一第一溫度訊號,該第一濕度感測器其係用以感測該流體之一第一濕度訊號,該溫濕控制裝置包含:一殼體、一第二感測組件、一製冷裝置、一製熱裝置、一加濕裝置、一第三感測組件以及一控制裝置,該殼體穿設一通道,該通道之一端設置一進氣口,該通道之另一端設置一出氣口,該流體流進該進氣口,該第二感測組件設置於該通道並相鄰該進氣口,該流體流經該第二感測組件,該第二感測組件包含一第二溫度感測器以及一第二濕度感測器,該第二溫度感測器其係用以感測該流體之一第二溫度訊號,該第二濕度感測器其係用以感測該流體之一第二濕度訊號,該製冷裝置係設置於該通道並與該進氣口夾設該第二感測組件,該流體流經該第二感測組件後流入該製冷裝置,該製熱裝置係設置於該通道並與該第二感測組件夾設該製冷裝置,該流體流經該製冷裝置後流入該製熱裝置,該加濕裝置設置於該通道之該內側,該加濕裝置係設置於該通道並與該製冷裝置夾設該製熱裝置,該流體流經該製熱裝置後流入該加濕裝置,該第三感測組件設置於該通道之該內側,該出氣口與該加濕裝置夾設該第三感測組件,該流體流經該加濕裝置後流入該第三感測組件,該第三感測組件包含一第三溫度感測器以及一第三濕度感測器,該第三溫度感測器其係用以感測該流體之一第三溫度訊號,該第三濕度感測器其係用以感測該流體之一第三濕度訊號,該流體流經該第三感測組件後,流出該出氣口,該控制裝置電性連接該第一感測組件、該第二感測組件以及該第三感測組件並接收該第一溫度訊號、該第一濕度訊號、該第二溫度訊號、該第二濕度訊號、該第三溫度訊號以及該第三濕度訊號,該控制裝置電性連接並分別傳輸一控制訊號至該製冷裝置、該製熱裝置以及該加濕裝置;利用此裝置調控環境之溫度與濕度。In order to achieve the above-mentioned purposes and effects, the present invention provides a temperature and humidity control device, which is used to control the temperature and humidity of the fluid when a fluid flows through a first sensing component and then enters the temperature and humidity control device , the first sensing component includes a first temperature sensor and a first humidity sensor, the first temperature sensor is used to sense a first temperature signal of the fluid, the first The humidity sensor is used to sense a first humidity signal of the fluid, and the temperature and humidity control device includes: a housing, a second sensing component, a cooling device, a heating device, and a humidifying device , a third sensing component and a control device, the casing is pierced with a channel, one end of the channel is provided with an air inlet, the other end of the channel is provided with an air outlet, the fluid flows into the air inlet, the The second sensing element is disposed on the passage and adjacent to the air inlet, the fluid flows through the second sensing element, the second sensing element includes a second temperature sensor and a second humidity sensor , the second temperature sensor is used to sense a second temperature signal of the fluid, the second humidity sensor is used to sense a second humidity signal of the fluid, and the refrigeration device is set The second sensing component is interposed between the channel and the air inlet, the fluid flows through the second sensing component and then flows into the refrigeration device, and the heating device is arranged in the channel and connected to the second sensor The component interposes the cooling device, the fluid flows through the cooling device and then flows into the heating device, the humidifying device is arranged on the inner side of the channel, the humidifying device is arranged in the channel and interposed with the cooling device a heating device, the fluid flows through the heating device and then flows into the humidifying device, the third sensing component is arranged on the inner side of the channel, the third sensing component is sandwiched between the air outlet and the humidifying device, The fluid flows through the humidifying device and then flows into the third sensing component. The third sensing component includes a third temperature sensor and a third humidity sensor. The third temperature sensor is used to To sense a third temperature signal of the fluid, the third humidity sensor is used to sense a third humidity signal of the fluid, the fluid flows out of the air outlet after passing through the third sensing component , the control device is electrically connected to the first sensing element, the second sensing element and the third sensing element and receives the first temperature signal, the first humidity signal, the second temperature signal, the second Humidity signal, the third temperature signal and the third humidity signal, the control device is electrically connected and respectively transmits a control signal to the refrigeration device, the heating device and the humidification device; use this device to regulate the temperature and humidity of the environment humidity.
本發明之一實施例中,其中該距離係與該進氣口之一徑長成正比。In an embodiment of the present invention, the distance is proportional to the diameter of the air inlet.
本發明之一實施例中,其中該製冷裝置包含一第一熱交換器以及一第一壓縮機,該第一壓縮機連接該第一熱交換器之一端。In an embodiment of the present invention, the refrigerating device includes a first heat exchanger and a first compressor, and the first compressor is connected to one end of the first heat exchanger.
本發明之一實施例中,其中該第一熱交換器包含一第一交換管件以及複數個第一散熱鰭片。In an embodiment of the present invention, the first heat exchanger includes a first exchange tube and a plurality of first heat dissipation fins.
本發明之一實施例中,其中該製熱裝置包含一第二熱交換器以及一第二壓縮機,該第二壓縮機連接該第二熱交換器之一端。In an embodiment of the present invention, the heating device includes a second heat exchanger and a second compressor, and the second compressor is connected to one end of the second heat exchanger.
本發明之一實施例中,其中該第二熱交換器設置一第二交換管件以及複數個第二散熱鰭片。In an embodiment of the present invention, the second heat exchanger is provided with a second exchange tube and a plurality of second heat dissipation fins.
本發明之一實施例中,更包含一送風裝置,其與該第二感測組件夾設該進氣口,該送風裝置電性連接該控制裝置並接收該控制訊號。In one embodiment of the present invention, it further includes an air supply device, which sandwiches the air inlet with the second sensing component, and the air supply device is electrically connected to the control device and receives the control signal.
為使 貴審查委員對本發明之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以實施例及配合說明,說明如後:In order to enable your review committee members to have a further understanding and understanding of the characteristics of the present invention and the achieved effects, the following examples and accompanying descriptions are hereby provided:
本發明提供一種溫濕控制裝置,其係一種溫濕控制裝置,其係利用一第一感測組件感測環境中一流體的溫度與濕度,再使該流體進入一殼體內,並依序經過一第二感測組件、一製冷裝置、一製熱裝置、一加濕裝置以及一第三感測組件,且利用一控制裝置依該第二感測組件及該第三感測組件之感測訊號控制該製冷裝置、該製熱裝置以及該加濕裝置,以該結構調控環境之溫度與濕度。The present invention provides a temperature and humidity control device, which is a temperature and humidity control device, which uses a first sensing component to sense the temperature and humidity of a fluid in the environment, and then makes the fluid enter a housing and pass through it in sequence A second sensing component, a cooling device, a heating device, a humidifying device, and a third sensing component, and a control device is used to sense the second sensing component and the third sensing component The signal controls the cooling device, the heating device and the humidifying device, and regulates the temperature and humidity of the environment with the structure.
請參閱第1圖,其為本發明之第一實施例之結構示意圖,如圖所示,本實施例係一種溫濕控制裝置1,其係用於當一流體A流經一第一感測組件10後進入該溫濕控制裝置1,以控制該流體A之溫濕度,該溫濕控制裝置1以一第一感測組件10感測於環境中之該流體A之溫度與濕度,該溫濕控制裝置1包含一殼體20、一第二感測組件30、一製冷裝置40、一製熱裝置50、一加濕裝置60、一第三感測組件70以及一控制裝置80;於本實施例中,該殼體20以一距離D1間隔設置於該第一感測組件10之一側,以感測該殼體20外之環境。Please refer to Figure 1, which is a schematic structural diagram of the first embodiment of the present invention. As shown in the figure, this embodiment is a temperature and
再次參閱第1圖以及參閱第2圖,第2圖為本發明之實施例之感測組件距離關係示意圖,如圖所示,於本實施例中,該第一感測組件10包含一第一溫度感測器12以及一第一濕度感測器14,該第一溫度感測器12用以感測一第一溫度訊號122,該第一濕度感測器14用以感測一第一濕度訊號142,該殼體20設置於該第一感測組件10之一側,該殼體20穿設一通道22,該通道22之一端設置一進氣口24,該通道之另一端設置一出氣口26,該第二感測組件30設置於該通道22之一內側,並相鄰該進氣口24,該第一感測組件30包含一第二溫度感測器32以及一第二濕度感測器34,該第二溫度感測器32用以感測一第二溫度訊號322,該第二濕度感測器34用以感測一第二濕度訊號342,該製冷裝置40設置於該通道22並與該進氣口24夾設該第二感測組件30,並進行降溫除濕,該製熱裝置50設置於該通道22並與該第二感測組件30夾設該製冷裝置40,並進行加溫,該加濕裝置60設置於該通道22並與該製冷裝置40夾設該製熱裝置50,且進行加濕,例如使用噴灑水霧之方式對經過之流體加濕,該第三感測組件70設置於該通道22之該內側,該出氣口26與該加濕裝置60夾設該第三感測組件70,該第三感測組件70包含一第三溫度感測器72以及一第三濕度感測器74,該第三溫度感測器72用以感測一第三溫度訊號722,該第三濕度感測器74用以感測一第三濕度訊號742,該控制裝置80電性連接該第一感測組件10、該第二感測組件30以及該第三感測組件70並接收該第一感測組件10、該第二感測組件30以及該第三感測組件70所發出之該第一溫度訊號122、該第一濕度訊號142、該第二溫度訊號322、該第二濕度訊號342、該第三溫度訊號722以及該第三濕度訊號742,用以取得該些感測器之感測訊號,且該控制裝置80電性連接並分別傳輸一控制訊號802至該製冷裝置40、該製熱裝置50以及該加濕裝置60,用以控制該些裝置。Referring again to Fig. 1 and Fig. 2, Fig. 2 is a schematic diagram of the distance relationship between the sensing elements of the embodiment of the present invention, as shown in the figure, in this embodiment, the
接續上述,於本實施例中,該殼體20之該進氣口24與該第一感測組件10之間間距一距離D1,該距離D1係與該進氣口24之一徑長D2成正比,而該徑長D2可為該進氣口24之直徑、半徑或矩形對角線之長度,例如該徑長D2為1m時,對應之該距離D1為20m,若該徑長D2為0.5m,對應之該距離D1需對應縮短,例如縮短為15m,但本發明不在此限制。Continuing the above, in this embodiment, there is a distance D1 between the
請參閱第3圖以及第4圖,第3圖為本發明之實施例之電性連接示意圖,第4圖為本發明之實施例之流體路徑示意圖,如圖所示,於本實施例中,該第一感測組件10之該第一溫度感測器12感測該流體A之溫度並傳送該第一溫度訊號122,該第一濕度感測器14感測該流體A之濕度並傳送該第一濕度訊號142,該控制裝置80接收該第一溫度訊號122及該第一濕度訊號142,並控制該溫濕控制裝置1吸入該流體A,該流體A由該進氣口24進入該通道22,該第二感測組件30之該第二溫度感測器32感測該流體A之該第二溫度訊號322,及該第二濕度感測器34感測該流體A之該第二濕度訊號342,並將該第二溫度訊號322及該第二濕度訊號342傳送至該控制裝置80,使該控制裝置80可對應控制該製冷裝置40之運作,該流體A經過該製冷裝置40進行降溫除濕,例如以冷卻凝結之方式降低該流體A之濕度。Please refer to Figure 3 and Figure 4, Figure 3 is a schematic diagram of the electrical connection of the embodiment of the present invention, and Figure 4 is a schematic diagram of the fluid path of the embodiment of the present invention, as shown in the figure, in this embodiment, The
接續上述,該流體A經過該製冷裝置40後,再經過該製熱裝置50,以加溫該製冷裝置40所降溫之該流體A,使該流體A之溫度回升,該流體A再經過該加濕裝置60,以加濕該製冷裝置40所除濕之該流體A,使該流體A之濕度回升,該製熱裝置50與該加濕裝置60用於調控該流體A之濕度及溫度,該流體A再經過該第三感測組件70,該第三溫度感測器72感測該流體A之溫度,並傳送該第三溫度訊號722,及該第三濕度感測器74感測該流體A之濕度,並傳輸該第三濕度訊號742,該控制裝置80接收該第三溫度訊號722,並對應控制該製熱裝置50之運作,該控制裝置80接收該第三濕度訊號742,並對應控制該加濕裝置60之運作,最後該流體A送出該出氣口26至後續產線;於本實施例中,該控制裝置80係以該控制訊號802控制該製冷裝置40、該製熱裝置50以及該加濕裝置60。Continuing the above, the fluid A passes through the
接續上述,於本實施例中,該製冷裝置40包含一第一熱交換器42以及一第一壓縮機44,該第一壓縮機連接44該第一熱交換器42之一端,該第一熱交換器42設置於該通道22,該第一熱交換器42包含一第一交換管件422以及複數個第一散熱鰭片424,該第一交換管件422穿設該些個第一散熱鰭片424,該些個第一散熱鰭片424各別間隔設置使該流體A通過,該第一壓縮機44於該第一交換管件422內輸送降溫後之液體至該些個第一散熱鰭片424,以對該流體A進行降溫並凝結該流體A之水氣,該第一壓縮機44接收該控制裝置80之該控制訊號802,該製熱裝置50包含一第二熱交換器52以及一第二壓縮機54,該第二壓縮機54連接該第二熱交換器52之一端,該第二熱交換器52設置於該通道22,該第二熱交換器52包含第一第二交換管件522以及複數個第二散熱鰭片524,該第二交換管件522穿設該些個第二散熱鰭片524,該些個第二散熱鰭片524各別間隔設置使該流體A通過,該第二壓縮機54於該第二交換管件522內輸送加溫後之液體至該些個第二散熱鰭片524,以對該流體A進行加溫,該第二壓縮機54接收該控制裝置80之該控制訊號802;於本實施例中,該第一交換管件422之一端凸出該殼體20,用於散熱,該第二交換管件522之一端凸出該殼體20,用於吸熱。Continuing the above, in this embodiment, the
接續上述,於本實施例中,該加濕裝置60係以噴灑水霧之方式對經過之該流體A加濕,但本發明不在此限制。Continuing from the above, in this embodiment, the
請參閱第5圖以及第6圖,第5圖為本發明之實施例之送風裝置示意圖,第6圖為本發明之實施例之送風裝置電性連接示意圖,如圖所示,於本實施例中,該溫濕控制裝置1更包含一送風裝置90,該送風裝置90與該第二感測組件30夾設該進氣口24,該送風裝置90電性連接該控制裝置80並接收該控制訊號802,該控制裝置80依據該第一溫度感測器12以及該第一濕度感測器14之該第一溫度訊號122及該第一濕度訊號142傳送該控制訊號802,以控制該送風裝置90之風扇轉速。Please refer to Figure 5 and Figure 6, Figure 5 is a schematic diagram of the air supply device of the embodiment of the present invention, and Figure 6 is a schematic diagram of the electrical connection of the air supply device of the embodiment of the present invention, as shown in the figure, in this embodiment Among them, the temperature and
本實施例係利用該第一感測組件10感測該殼體20外部之該流體A(例如空氣),該控制裝置80以該第一感測組件10之該第一溫/濕度訊號122、142調整該送風裝置90吸取該流體A之吸取量,並以該第二感測組件30之該第二溫/濕度訊號322、342調整該製冷裝置40之降溫除濕效率,再以該第三感測組件70之該第三溫/濕度訊號722、742調整該製熱裝置50及該加濕裝置60之效率,該控制裝置80藉由該第二感測組件30與該第三感測組件70之訊號,避免該製冷裝置40過度降溫或除濕,同時也避免該製熱裝置50及該加濕裝置60過度加溫及加濕,進一步減少該溫濕控制裝置1之能源消耗。In this embodiment, the
綜上所述,本發明提供一種溫濕控制裝置,其係以第一感測組件先感測環境中流體的溫度與濕度,若環境過於潮濕、乾燥,即時對應增加裝置的運轉效能,再將流體依序利用製冷裝置除濕,製熱裝置加溫控溫,以加濕裝置調控濕度,並利用控制裝置依第二、三感測組件之訊號,對應控制調整製冷裝置、製熱裝置以及加濕裝置之溫度、濕度調節效能,避免過度運作,使裝置需耗費大量能源重新調節流體,以此結構感測環境之溫度與濕度,並對應需求進行溫度與濕度的調整與控制,解決無塵空間的濕度、溫度過高時,產生之諸多問題。To sum up, the present invention provides a temperature and humidity control device, which uses the first sensing component to sense the temperature and humidity of the fluid in the environment. If the environment is too humid or dry, the operating performance of the device will be increased immediately, and then The fluid is sequentially dehumidified by the cooling device, heated and controlled by the heating device, and the humidity is regulated by the humidifying device, and the control device is used to control and adjust the cooling device, heating device and humidification according to the signals of the second and third sensing components The temperature and humidity adjustment performance of the device avoids excessive operation, so that the device needs to consume a lot of energy to readjust the fluid. This structure senses the temperature and humidity of the environment, and adjusts and controls the temperature and humidity according to the demand, solving the problem of dust-free space When the humidity and temperature are too high, many problems will arise.
故本發明實為一具有新穎性、進步性及可供產業上利用者,應符合我國專利法專利申請要件無疑,爰依法提出發明專利申請,祈 鈞局早日賜准專利,至感為禱。Therefore, the present invention is novel, progressive and can be used in industry. It should meet the patent application requirements of my country's patent law. I file an invention patent application in accordance with the law. I pray that the bureau will grant the patent as soon as possible. I sincerely pray.
惟以上所述者,僅為本發明一實施例而已,並非用來限定本發明實施之範圍,故舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。However, the above is only an embodiment of the present invention, and is not used to limit the scope of the present invention. Therefore, all equivalent changes and modifications made in accordance with the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention, All should be included in the patent application scope of the present invention.
1:溫濕控制裝置 10:第一感測組件 12:第一溫度感測器 122:第一溫度訊號 14:第一濕度感測器 142:第一濕度訊號 20:殼體 22:通道 24:進氣口 26:出氣口 30:第二感測組件 32:第二溫度感測器 322:第二溫度訊號 34:第二濕度感測器 342:第二濕度訊號 40:製冷裝置 42:第一熱交換器 422:第一交換管件 424:第一散熱鰭片 44:第一壓縮機 50:製熱裝置 52:第二熱交換器 522:第二交換管件 524:第二散熱鰭片 54:第二壓縮機 60:加濕裝置 70:第三感測組件 72:第三溫度感測器 722:第三溫度訊號 74:第三濕度感測器 742:第三濕度訊號 80:控制裝置 802:控制訊號 90:送風裝置 A:流體 D1:距離 D2:徑長 1: Temperature and humidity control device 10: The first sensing component 12: The first temperature sensor 122: The first temperature signal 14: The first humidity sensor 142: The first humidity signal 20: shell 22: channel 24: air inlet 26: Air outlet 30: Second sensing component 32: Second temperature sensor 322: Second temperature signal 34: Second humidity sensor 342: The second humidity signal 40: Refrigeration device 42: First heat exchanger 422: First Exchange Fittings 424: The first cooling fin 44: First compressor 50: Heating device 52: Second heat exchanger 522: The second exchange pipe 524: Second cooling fin 54: Second compressor 60: Humidification device 70: The third sensing component 72: The third temperature sensor 722: The third temperature signal 74: The third humidity sensor 742: The third humidity signal 80: Control device 802: Control signal 90: Air supply device A: Fluid D1: distance D2: diameter length
第1圖:其為本發明之實施例之結構示意圖; 第2圖:其為本發明之實施例之感測組件距離關係示意圖; 第3圖:其為本發明之實施例之電性連接示意圖; 第4圖:其為本發明之實施例之流體路徑示意圖; 第5圖:其為本發明之實施例之送風裝置示意圖;以及 第6圖:其為本發明之實施例之送風裝置電性連接示意圖。 Figure 1: It is a structural schematic diagram of an embodiment of the present invention; Figure 2: It is a schematic diagram of the distance relationship between sensing components in an embodiment of the present invention; Figure 3: It is a schematic diagram of the electrical connection of an embodiment of the present invention; Figure 4: It is a schematic diagram of the fluid path of an embodiment of the present invention; Fig. 5: It is a schematic diagram of the air supply device of an embodiment of the present invention; and Figure 6: It is a schematic diagram of the electrical connection of the air supply device according to the embodiment of the present invention.
1:溫濕控制裝置 1: Temperature and humidity control device
10:第一感測組件 10: The first sensing component
12:第一溫度感測器 12: The first temperature sensor
14:第一濕度感測器 14: The first humidity sensor
20:殼體 20: Shell
22:通道 22: channel
24:進氣口 24: air inlet
26:出氣口 26: Air outlet
30:第二感測組件 30: Second sensing component
32:第二溫度感測器 32: Second temperature sensor
34:第二濕度感測器 34: Second humidity sensor
40:製冷裝置 40: Refrigeration device
50:製熱裝置 50: Heating device
60:加濕裝置 60: Humidification device
70:第三感測組件 70: The third sensing component
72:第三溫度感測器 72: The third temperature sensor
74:第三濕度感測器 74: The third humidity sensor
80:控制裝置 80: Control device
A:流體 A: Fluid
D1:距離 D1: distance
Claims (7)
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