TW202241761A - Implanted device and packaging device using implanted device wherein the implanted device includes a base body, an implanted component, a first restricting member, a second restricting member, and an electromagnetic driver - Google Patents

Implanted device and packaging device using implanted device wherein the implanted device includes a base body, an implanted component, a first restricting member, a second restricting member, and an electromagnetic driver Download PDF

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TW202241761A
TW202241761A TW110114785A TW110114785A TW202241761A TW 202241761 A TW202241761 A TW 202241761A TW 110114785 A TW110114785 A TW 110114785A TW 110114785 A TW110114785 A TW 110114785A TW 202241761 A TW202241761 A TW 202241761A
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bracket
component
implant
restricting member
implant component
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TW110114785A
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Chinese (zh)
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黃子展
林芳旭
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萬潤科技股份有限公司
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Abstract

The invention provides an implanted device and a packaging device using the implanted device, and the implanted device comprises: a base body; an implanted component, which can be displaced relative to the base body; a first restricting member, one end of which is fixed on the base body, another end is fixed on the upper end of the implanted component; a second restricting member, one end is fixed on the seat body, and another end is fixed on the lower end of the implanted component; and an electromagnetic driver which can drive the implanted component to reciprocally displace upward and downward; thereby reducing shaking and deflection of the implanted component, so that the implanted component can stably perform the upward and downward reciprocal displacement.

Description

植入裝置及使用植入裝置的包裝設備Implantable device and packaging equipment using implantable device

本發明係有關於一種植入裝置及使用植入裝置的包裝設備,尤指一種在以間歇性旋轉流路搬送電子元件的過程中,將電子元件植入包裝用載帶的植入裝置及使用植入裝置的包裝設備。The present invention relates to an implanting device and packaging equipment using the implanting device, especially to an implanting device and its use for implanting electronic components into a carrier tape for packaging during the process of conveying electronic components in an intermittent rotating flow path. Packaging equipment for implantable devices.

按,一般對電子元件進行包裝之包裝設備,常使用一周緣環列佈設等間距鏤空載槽的載盤,該載盤以間歇性旋轉流路將複數個電子元件逐一搬送至各個工作站進行作業,該等工作站分佈對應在該載盤之周緣,例如:入料工作站、量測工作站、轉向工作站、植入工作站、排料工作站…等;其中,該植入工作站可藉由一電磁驅動器驅動一植入件上、下往復位移,將電子元件自該載槽向下壓入一載帶之容置槽內;該植入工作站可例如專利號第M256861號「包裝機之填料裝置改良(一)」所揭露,其在一主座體之上、中、下基座中分別設有供長桿狀之植入件樞設之軸孔,並藉由該中基座與該下基座之間的電磁驅動器驅動該植入件上下往復位移。According to the general packaging equipment for packaging electronic components, a carrier plate with equally spaced hollowed-out slots is often used around the periphery. The carrier plate uses intermittent rotating flow paths to transport multiple electronic components one by one to each workstation for operation. These workstations are distributed corresponding to the periphery of the tray, for example: feeding workstation, measuring workstation, steering workstation, implanting workstation, discharging workstation, etc.; wherein, the implanting workstation can drive an implant by an electromagnetic driver. The insert moves upwards and downwards, and the electronic components are pressed down from the carrier slot into the accommodating slot of a carrier tape; the implantation workstation can be, for example, Patent No. M256861 "Improvement of the filling device of the packaging machine (1)" Disclosed, it is respectively provided with the shaft hole for the pivoting of the long rod-shaped implant in the upper, middle and lower bases of a main base body, and through the middle base and the lower base An electromagnetic driver drives the implant to move up and down.

在先前技術中,由於該植入件本身呈長桿狀,在受該電磁驅動器驅動上下往復位移時極容易晃動,使樞設該植入件之該軸孔容易磨損擴孔;且因該電磁驅動器所驅動的該植入件係穿經該電磁驅動器,為使該植入件承受磁性時可敏捷地反應並作上下往復位移,該電磁驅動器並未拘束該植入件在該電磁驅動器中的旋轉能力,導致該植入件在上下往復位移時亦會同時偏轉,使該軸孔的磨耗增大。In the prior art, because the implant itself is in the shape of a long rod, it is very easy to shake when driven by the electromagnetic driver to move up and down, so that the shaft hole pivoting the implant is easy to wear and ream; and because the electromagnetic The implant driven by the driver passes through the electromagnetic driver. In order to make the implant react quickly and move up and down when it is subjected to magnetism, the electromagnetic driver does not restrict the implant in the electromagnetic driver. Due to the ability to rotate, the implant will deflect at the same time when it moves up and down, which will increase the wear of the shaft hole.

爰是,本發明的目的,在於提供一種減少植入件晃動與偏轉的植入裝置。Therefore, the object of the present invention is to provide an implant device that reduces the shaking and deflection of the implant.

本發明的另一目的,在於提供一種使用該植入裝置的包裝設備。Another object of the present invention is to provide a packaging device using the implant device.

依據本發明目的之植入裝置,包括:一座體;一植入組件,可相對該座體位移;一第一限制件,一端固設於該座體,另一端固設於該植入組件之上端;一第二限制件,一端固設於該座體,另一端固設於該植入組件之下端;一電磁驅動器,可驅動該植入組件上、下往復位移。The implant device according to the object of the present invention includes: a base; an implant component, which can be displaced relative to the base; a first limiting member, one end is fixed on the base, and the other end is fixed on the implant component. An upper end; a second restricting piece, one end of which is fixed on the seat body, and the other end is fixed on the lower end of the implant component; an electromagnetic driver can drive the implant component to move up and down.

依據本發明目的之另一植入裝置,包括:一座體,水平朝外伸設上、下相間隔且相互平行之一第一支架與一第二支架;該座體上固設有一第一限制件與一第二限制件,該第一限制件與該第二限制件上、下相間隔且相互平行地由該座體朝外伸設;該第一支架與該第二支架設於該第一限制件與該第二限制件之間;一電磁驅動器,設於該第一支架與該第二支架之間,該電磁驅動器可驅動一植入組件相對該座體上、下往復位移;該植入組件固設於該第一限制件與該第二限制件之一端; 一彈性件,設於該第二支架與該第二限制件之間,該彈性件可蓄積該植入組件向上位移時的彈性回復力。Another implanting device according to the purpose of the present invention includes: a base body, a first bracket and a second bracket extending horizontally and outwardly, spaced apart from each other and parallel to each other; a first limiting bracket is fixed on the base body. A member and a second restricting member, the first restricting member and the second restricting member are spaced up and down and extend outward from the base body in parallel to each other; the first bracket and the second bracket are arranged on the first bracket between a limiting member and the second limiting member; an electromagnetic driver, located between the first bracket and the second bracket, the electromagnetic driver can drive an implant component to move up and down relative to the base body; the The implant component is fixed at one end of the first restricting member and the second restricting member; an elastic member is arranged between the second bracket and the second restricting member, and the elastic member can accumulate the implant component for upward displacement elastic recovery force.

依據本發明另一目的之包裝設備,使用如所述植入裝置,包括:一作業平台,設有一移行槽道供一載帶承放並在該移行槽道中以間歇性移動流路進行移動;一載盤,設於該移行槽道的上方,該載盤周緣等間距環列佈設有複數個載槽供電子元件載置並以間歇性旋轉流路搬送電子元件;該電子元件植入裝置設於該載盤的上方,並藉由該植入組件的上、下往復位移將該載槽內的電子元件下壓植入該載帶之容置槽內。According to another object of the present invention, the packaging equipment uses the implanted device, including: a working platform, which is provided with a transfer channel for a carrier belt to be carried and moves in the transfer channel with an intermittent movement flow path; A carrier plate is arranged above the transfer channel, and a plurality of carrier slots are arranged at equal intervals around the periphery of the carrier plate for loading electronic components and transporting electronic components in an intermittent rotating flow path; the electronic component implantation device is set On the top of the carrier plate, the electronic components in the carrier slot are pressed down and implanted into the accommodating slot of the carrier tape by the up and down reciprocal displacement of the implant component.

本發明實施例之植入裝置及使用植入裝置的包裝設備,該植入組件係固設於該第一限制件與該第二限制件的一端,可限制該植入組件相對該電磁驅動器的偏轉;且在該植入組件受該電磁驅動器驅動時,該第一限制件與該第二限制件可保持該植入組件並隨其一同上、下微幅移動,可限制該植入組件之晃動,使該植入組件可穩固的執行上、下往復位移。In the implant device and the packaging device using the implant device according to the embodiment of the present invention, the implant component is fixed at one end of the first restricting member and the second restricting member, which can limit the implant component relative to the electromagnetic driver. deflection; and when the implant component is driven by the electromagnetic driver, the first limiting member and the second limiting member can hold the implant component and move up and down slightly with it, and can limit the implant component Shaking, so that the implant component can perform up and down reciprocal movement stably.

請參閱圖1,本發明實施例可以如圖所示之植入裝置為例進行說明,其設有: 一座體A; 一植入組件B,可受驅動相對該座體A位移; 一第一限制件C,一端固設於該座體A,另一端固設於該植入組件B之上端; 一第二限制件D,一端固設於該座體A,另一端固設於該植入組件B之下端; 一電磁驅動器E,可驅動該植入組件B上、下往復位移。 Please refer to Fig. 1, the embodiment of the present invention can be described as an example of the implant device as shown in the figure, which is provided with: Block A; An implant component B can be driven to displace relative to the base A; A first limiting member C, one end is fixed on the base A, and the other end is fixed on the upper end of the implant component B; A second limiting member D, one end is fixed on the base A, and the other end is fixed on the lower end of the implant component B; An electromagnetic driver E can drive the implant component B to move up and down.

請參閱圖2,該植入組件B設有一被驅動件B1與一吸嘴B2,該吸嘴B2設於該被驅動件B1下方;該被驅動件B1設有一呈桿狀之本體部B11與一受該電磁驅動器E磁吸之磁吸部B12,並設有一第一氣道B13於該本體部B11;該吸嘴B2設有一第二氣道B21,該第一氣道B13與該第二氣道B21相通;該被驅動件B1與該吸嘴B2之間接設一連接件B3,該連接件B3設有一第三氣道B31銜接該第一氣道B13與該第二氣道B21;該第一氣道B13之一端經管路(圖未示)通往一負壓源F,另一端通往該第三氣道B31,使該吸嘴B2具有負壓吸力。Please refer to Figure 2, the implant component B is provided with a driven part B1 and a suction nozzle B2, the suction nozzle B2 is located below the driven part B1; the driven part B1 is provided with a rod-shaped body part B11 and A magnetic attraction part B12 which is magnetically attracted by the electromagnetic driver E, and is provided with a first air passage B13 on the body part B11; the suction nozzle B2 is provided with a second air passage B21, and the first air passage B13 communicates with the second air passage B21 A connecting piece B3 is connected between the driven part B1 and the suction nozzle B2, and the connecting piece B3 is provided with a third airway B31 connecting the first airway B13 and the second airway B21; one end of the first airway B13 is passed through a tube A path (not shown in the figure) leads to a negative pressure source F, and the other end leads to the third airway B31, so that the suction nozzle B2 has negative pressure suction.

請參閱圖2,該座體A水平朝外伸設上、下相間隔且相互平行之一第一支架A1與一第二支架A2;該第一限制件C與該第二限制件D上、下相間隔且相互平行地由該座體A朝外伸設;該第一支架A1與該第二支架A2設於該第一限制件C與該第二限制件D之間;該第一限制件C與該第二限制件D可例如呈長方形並具彈性的金屬薄片; 該電磁驅動器E設於該第一支架A1與該第二支架A2之間並設於該第一支架A1上;位於上方之該第一支架A1設有一第一通孔A11,位於下方之該第二支架A2設有一第二通孔A21,該植入組件B可貫穿該第一通孔A11、該電磁驅動器E及該第二通孔A21,且該磁吸部B12位於該電磁驅動E與該第二支架A2之間;該第一通孔A11與該第二通孔A21的孔徑使該植入組件B不接觸該第一通孔A11與該第二通孔A21的內壁。 Please refer to FIG. 2 , the seat body A extends horizontally outwards with a first bracket A1 and a second bracket A2 spaced apart from each other and parallel to each other; The base A1 and the second bracket A2 are arranged between the first restricting part C and the second restricting part D; the first restricting The part C and the second restricting part D can be, for example, rectangular and elastic metal sheets; The electromagnetic driver E is arranged between the first bracket A1 and the second bracket A2 and is arranged on the first bracket A1; the first bracket A1 at the top is provided with a first through hole A11, and the first bracket A1 at the bottom is provided with a first through hole A11. The second bracket A2 is provided with a second through hole A21, the implant component B can pass through the first through hole A11, the electromagnetic driver E and the second through hole A21, and the magnetic attraction part B12 is located between the electromagnetic driver E and the second through hole A21. Between the second brackets A2 ; the diameters of the first through hole A11 and the second through hole A21 prevent the implant component B from contacting the inner walls of the first through hole A11 and the second through hole A21 .

請參閱圖3,該第一支架A1上設有一例如電容式感應器之第一位置感應器A12,該第二支架A2上設有一例如例如電容式感應器之第二位置感應器A22,該第一位置感應器A12的一第一感應端A121與該第二位置感應器A22的一第二感應端A221相向設置;該第二支架A2與該第二限制件D之間設有一彈性件G,可蓄積該植入組件B之該磁吸部B12受該電磁驅動器E磁吸而向上位移時的彈性回復力; 該植入組件B上設有一被感應件B4於該磁吸部B12下方,該被感應件B4凸設有一被感應部B41於該第一感應端A121與該第二感應端A221之間;該被感應件B4與該電磁驅動器E之間設有一例如橡膠片之第一緩衝件B5,可避免該磁吸部B12直接與該電磁驅動器E接觸;該被感應件B4與該第二支架A2之間設有一例如橡膠片之第二緩衝件B6,可避免該被感應件B4直接與該第二支架A2接觸。 Referring to Fig. 3, a first position sensor A12 such as a capacitive sensor is provided on the first support A1, and a second position sensor A22 such as a capacitive sensor is provided on the second support A2. A first sensing end A121 of a position sensor A12 is arranged opposite to a second sensing end A221 of the second position sensor A22; an elastic member G is arranged between the second bracket A2 and the second limiting member D, It can accumulate the elastic recovery force when the magnetic attraction part B12 of the implant component B is magnetically attracted by the electromagnetic driver E and moves upward; The implant component B is provided with a sensed part B4 below the magnetic attraction part B12, and the sensed part B4 is provided with a sensed part B41 protrudingly between the first sensing end A121 and the second sensing end A221; Between the induced part B4 and the electromagnetic driver E, there is a first buffer part B5 such as a rubber sheet, which can prevent the magnetic attraction part B12 from directly contacting the electromagnetic driver E; the induced part B4 and the second bracket A2 A second buffer member B6 such as a rubber sheet is disposed therebetween to prevent the sensed member B4 from directly contacting the second bracket A2.

請參閱圖4、5,本發明實施例之植入裝置係使用於如圖所示的包裝設備中,其設有: 一作業平台H,設有一移行槽道H1供一載帶T承放;該載帶T一側等距排列設有複數個針孔T1,另一側等距排列設有複數個容置槽T2供例如被動元件之電子元件W容置;該載帶T受一驅動機構H2之針輪(圖未示)對其針孔T1嵌扣驅動,使該載帶T可在該移行槽道H1中以間歇性移動流路進行移動; 一載盤K,設於該作業平台H且其周緣的一部分罩覆於該移行槽道H1的上方,該載盤K周緣等間距環列佈設有複數個載槽K1供電子元件W容置;該載盤K可接收自一送料裝置M送入之電子元件W並以順時針之間歇性旋轉流路搬送電子元件W; 該植入裝置設於該載盤K的上方,當電子元件W被該載盤K搬送至該移行槽道H1上方時,可藉由該植入組件B的上、下往復位移,將該載槽K1內的電子元件W下壓植入該載帶T對應之容置槽T2內。 Please refer to Figures 4 and 5, the implanted device of the embodiment of the present invention is used in the packaging equipment as shown in the figure, which is equipped with: A working platform H is provided with a moving channel H1 for carrying a carrier tape T; a plurality of pinholes T1 are equidistantly arranged on one side of the carrier tape T, and a plurality of accommodating slots T2 are equidistantly arranged on the other side Electronic components W such as passive components are accommodated; the carrier tape T is driven by a pin wheel (not shown) of a drive mechanism H2 to engage with its pinhole T1, so that the carrier tape T can be in the travel channel H1 Move with an intermittent moving flow path; A loading plate K is arranged on the working platform H and a part of its peripheral edge is covered above the moving channel H1, and a plurality of loading slots K1 are arranged in a ring at equal intervals on the surrounding edge of the loading plate K for accommodating electronic components W; The tray K can receive the electronic components W fed in from a feeding device M and transport the electronic components W in a clockwise intermittent rotating flow path; The implanting device is arranged above the carrier K, and when the electronic component W is transported by the carrier K to the upper part of the transfer channel H1, the implant component B can be moved up and down to move the carrier component B up and down. The electronic component W in the slot K1 is pressed down and implanted into the corresponding accommodating slot T2 of the carrier tape T.

本發明實施例植入裝置及使用植入裝置的包裝設備在實施上,該載盤K以間歇性旋轉流路搬送電子元件W至該植入組件B的下方,並以該吸嘴B2吸附保持對應之載槽K1內的電子元件W,使電子元件W暫時懸空於對應之容置槽T2的上方不至於掉落該容置槽T2; 在電子元件W受該吸嘴B2吸附保持後,該電磁驅動器E解除對該植入組件B的磁吸力,使該植入組件B受該彈性件G之彈性回復力作用而向下位移,將電子元件W自該載槽K1下壓植入該容置槽T2內; 在電子元件W植入該容置槽T2內後,該吸嘴B2解除對電子元件W的吸附,且該電磁驅動器E回復對該植入組件B的磁吸力,使該植入組件B向上位移離開該容置槽T2及該載槽K1; 在該植入組件B離開該容置槽T2及該載槽K1後,該載盤K接續搬送另一個電子元件W至該植入組件B的下方,並重複上述的動作。 In the implementation of the implant device and the packaging equipment using the implant device according to the embodiment of the present invention, the carrier K transports the electronic component W to the bottom of the implant component B through an intermittent rotating flow path, and absorbs and holds it with the suction nozzle B2 For the electronic component W in the corresponding loading tank K1, the electronic component W is temporarily suspended above the corresponding accommodating tank T2 so as not to fall into the accommodating tank T2; After the electronic component W is sucked and held by the suction nozzle B2, the electromagnetic driver E releases the magnetic attraction force on the implant component B, so that the implant component B is displaced downward by the elastic restoring force of the elastic member G, and the The electronic component W is pressed down from the loading slot K1 and implanted into the accommodating slot T2; After the electronic component W is implanted in the accommodating groove T2, the suction nozzle B2 releases the adsorption of the electronic component W, and the electromagnetic driver E restores the magnetic attraction force to the implant component B, so that the implant component B is displaced upward Leaving the receiving tank T2 and the loading tank K1; After the implant component B leaves the accommodating slot T2 and the carrier slot K1 , the tray K transports another electronic component W to the bottom of the implant component B, and repeats the above actions.

本發明實施例之植入裝置及使用植入裝置的包裝設備,該植入組件B係固設於該第一限制件C與該第二限制件D的一端,可限制該植入組件B相對該電磁驅動器E的偏轉;且在該植入組件B受該電磁驅動器E驅動時,該第一限制件C與該第二限制件D可保持該植入組件B並隨其一同上、下微幅移動,可限制該植入組件B之晃動,使該植入組件B可穩固的執行上、下往復位移。In the implant device and the packaging device using the implant device according to the embodiment of the present invention, the implant component B is fixed at one end of the first restricting member C and the second restricting member D, so that the implant component B can be restricted from facing each other. The deflection of the electromagnetic driver E; and when the implant component B is driven by the electromagnetic driver E, the first limiting member C and the second limiting member D can hold the implant component B and move up and down slightly along with it The wide movement can limit the shaking of the implanted component B, so that the implanted component B can perform up and down reciprocal movement stably.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。But the above-mentioned ones are only preferred embodiments of the present invention, and should not limit the scope of the present invention with this, that is, all simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the description of the invention, All still belong to the scope covered by the patent of the present invention.

A:座體 A1:第一支架 A11:第一通孔 A12:第一位置感應器 A121:第一感應端 A2:第二支架 A21:第二通孔 A22:第二位置感應器 A221:第二感應端 B:植入組件 B1:被驅動件 B11:本體部 B12:磁吸部 B13:第一氣道 B2:吸嘴 B21:第二氣道 B3:連接件 B31:第三氣道 B4:被感應件 B41:被感應部 B5:第一緩衝件 B6:第二緩衝件 C:第一限制件 D:第二限制件 E:電磁驅動器 F:負壓源 G:彈性件 H:作業平台 H1:移行槽道 H2:驅動機構 K:載盤 K1:載槽 M:送料裝置 T:載帶 T1:針孔 T2:容置槽 W:電子元件 A: Seat body A1: The first bracket A11: First through hole A12: The first position sensor A121: The first sensing terminal A2: Second bracket A21: Second through hole A22:Second position sensor A221: The second sensing terminal B: implant components B1: driven part B11: Body part B12:Magnetic part B13: First airway B2: Nozzle B21: Second airway B3: Connector B31: Third airway B4: Inducted part B41: Sensed part B5: The first buffer B6: Second buffer C: The first restriction D: The second restriction E: electromagnetic drive F: negative pressure source G: Elastic piece H: work platform H1: Migration channel H2: drive mechanism K: Carrier K1: loading tank M: Feeding device T: carrier tape T1: pinhole T2: holding tank W: electronic components

圖1係本發明實施例中植入裝置之立體示意圖。 圖2係本發明實施例中植入裝置之剖面示意圖。 圖3係本發明實施例中植入裝置之部分側面示意圖。 圖4係本發明實施例中包裝設備之立體示意圖。 圖5係本發明實施例中載盤之載槽內的電子元件被植入載帶之容置槽內之示意圖。 Fig. 1 is a three-dimensional schematic diagram of an implant device in an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view of the implant device in the embodiment of the present invention. Fig. 3 is a partial side view of the implant device in the embodiment of the present invention. Fig. 4 is a three-dimensional schematic diagram of the packaging equipment in the embodiment of the present invention. FIG. 5 is a schematic diagram of the electronic components in the carrier groove of the carrier disc being implanted into the accommodating groove of the carrier tape according to the embodiment of the present invention.

A:座體 A: Seat body

B:植入組件 B: implant components

C:第一限制件 C: The first restriction

D:第二限制件 D: The second restriction

E:電磁驅動器 E: electromagnetic drive

Claims (10)

一種植入裝置,包括: 一座體; 一植入組件,可相對該座體位移; 一第一限制件,一端固設於該座體,另一端固設於該植入組件之上端; 一第二限制件,一端固設於該座體,另一端固設於該植入組件之下端; 一電磁驅動器,可驅動該植入組件上、下往復位移。 An implant device comprising: a body; an implant component, which can be displaced relative to the base; A first restricting piece, one end is fixed on the base body, and the other end is fixed on the upper end of the implant component; A second restricting piece, one end is fixed on the base body, and the other end is fixed on the lower end of the implant component; An electromagnetic driver can drive the implant component to move up and down. 如請求項1所述電子元件植入裝置,其中,該植入組件設有一被驅動件與一吸嘴,該吸嘴設於該被驅動件下方;該被驅動件設有一第一氣道,該吸嘴設有一第二氣道,該第一氣道與該第二氣道相通。The electronic component implantation device as described in claim 1, wherein the implant component is provided with a driven part and a suction nozzle, and the suction nozzle is arranged under the driven part; the driven part is provided with a first airway, the The suction nozzle is provided with a second airway, and the first airway communicates with the second airway. 如請求項2所述電子元件植入裝置,其中,該被驅動件與該吸嘴之間接設一連接件,該連接件設有一第三氣道銜接該第一氣道與該第二氣道;該第一氣道之一端通往一負壓源,另一端通往該第三氣道。The implanting device for electronic components as described in Claim 2, wherein a connecting piece is connected between the driven part and the suction nozzle, and the connecting piece is provided with a third airway connecting the first airway and the second airway; One end of an airway leads to a negative pressure source, and the other end leads to the third airway. 如請求項1所述電子元件植入裝置,其中,該第一限制件與該第二限制件上、下相隔間且相互平行;該電磁驅動器設於該第一限制件與該第二限制件之間。The electronic component implantation device according to claim 1, wherein the first restricting member and the second restricting member are spaced above and below and parallel to each other; the electromagnetic driver is arranged on the first restricting member and the second restricting member between. 如請求項1所述電子元件植入裝置,其中,該座體水平朝外伸設一第一支架與一第二支架,該電磁驅動器設於該第一支架與該第二支架之間且該第一支架與該第二支架設於該第一限制件與該第二限制件之間。The implanting device for electronic components as described in claim 1, wherein a first bracket and a second bracket extend outward horizontally from the base body, the electromagnetic driver is arranged between the first bracket and the second bracket, and the The first bracket and the second bracket are arranged between the first limiting component and the second limiting component. 如請求項5所述電子元件植入裝置,其中,該第一支架設有一第一通孔,該第二支架設有一第二通孔,該植入組件貫穿該第一通孔、該電磁驅動器及該第二通孔。The implanting device for electronic components as described in Claim 5, wherein the first bracket is provided with a first through hole, the second bracket is provided with a second through hole, and the implant component passes through the first through hole, the electromagnetic driver and the second through hole. 如請求項5所述電子元件植入裝置,其中,該第一支架上設有一第一位置感應器,該第二支架上設有一第二位置感應器,該第一位置感應器的一第一感應端與該第二位置感應器的一第二感應端相向設置;該植入組件上設有一被感應件,其凸設有一被感應部於該第一感應端與該第二感應端之間。The implanting device for electronic components as described in claim 5, wherein a first position sensor is provided on the first support, a second position sensor is provided on the second support, and a first position sensor of the first position sensor The sensing end is arranged opposite to a second sensing end of the second position sensor; a sensed part is provided on the implant component, and a sensed part protrudes between the first sensing end and the second sensing end . 如請求項7所述電子元件植入裝置,其中,該被感應件與該電磁驅動器之間設有一第一緩衝件,該被感應件與該第二支架之間設有一第二緩衝件。The electronic component implantation device as described in claim 7, wherein a first buffer is provided between the induced part and the electromagnetic driver, and a second buffer is provided between the induced part and the second bracket. 一種植入裝置,包括: 一座體,水平朝外伸設上、下相間隔且相互平行之一第一支架與一第二支架;該座體上固設有一第一限制件與一第二限制件,該第一限制件與該第二限制件上、下相間隔且相互平行地由該座體朝外伸設;該第一支架與該第二支架設於該第一限制件與該第二限制件之間; 一電磁驅動器,設於該第一支架與該第二支架之間,該電磁驅動器可驅動一植入組件相對該座體上、下往復位移;該植入組件固設於該第一限制件與該第二限制件之一端; 一彈性件,設於該第二支架與該第二限制件之間,該彈性件可蓄積該植入組件向上位移時的彈性回復力。 An implant device comprising: A base body, a first support and a second support that are spaced apart from each other and parallel to each other extend horizontally outwards; a first restriction member and a second restriction member are fixed on the seat body, and the first restriction member The upper and lower sides of the second restricting member are spaced apart from each other and extend outward from the seat body; the first bracket and the second bracket are arranged between the first restricting member and the second restricting member; An electromagnetic driver is arranged between the first bracket and the second bracket, and the electromagnetic driver can drive an implant component to move up and down relative to the base body; the implant component is fixed between the first limiting member and the second bracket. one end of the second restraint; An elastic member is arranged between the second bracket and the second restricting member, and the elastic member can accumulate elastic recovery force when the implant component is displaced upward. 一種包裝設備,使用如請求項1至9任一項所述植入裝置,包括: 一作業平台,設有一移行槽道供一載帶承放並在該移行槽道中以間歇性移動流路進行移動; 一載盤,設於該移行槽道的上方,該載盤周緣等間距環列佈設有複數個載槽供電子元件載置並以間歇性旋轉流路搬送電子元件; 該電子元件植入裝置設於該載盤的上方,並藉由該植入組件的上、下往復位移將該載槽內的電子元件下壓植入該載帶之容置槽內。 A packaging device using the implant device described in any one of claims 1 to 9, comprising: A working platform is provided with a moving channel for carrying a carrier belt and moves in the moving channel with an intermittent moving flow path; A carrier plate is arranged above the transfer channel, and a plurality of carrier slots are arranged in an equidistant ring around the periphery of the carrier plate for placing electronic components and transporting electronic components through intermittent rotating flow paths; The electronic component implanting device is arranged above the carrier plate, and the electronic components in the carrier slot are pressed down and implanted into the accommodating slot of the carrier tape through the upward and downward displacement of the implant component.
TW110114785A 2021-04-23 2021-04-23 Implanted device and packaging device using implanted device wherein the implanted device includes a base body, an implanted component, a first restricting member, a second restricting member, and an electromagnetic driver TW202241761A (en)

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