TW202237711A - Fiber reinforced plastic molding material and molded body thereof - Google Patents

Fiber reinforced plastic molding material and molded body thereof Download PDF

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TW202237711A
TW202237711A TW111102622A TW111102622A TW202237711A TW 202237711 A TW202237711 A TW 202237711A TW 111102622 A TW111102622 A TW 111102622A TW 111102622 A TW111102622 A TW 111102622A TW 202237711 A TW202237711 A TW 202237711A
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resin
resin composition
thermoplastic resin
fiber
temperature
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髙橋浩之
原子涼丞
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日商日鐵化學材料股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Abstract

An object of the present invention is to provide a fiber reinforced plastic molding material capable of suppressing spring back even when a molded product is used near a processing temperature, without using a super engineering plastic which is difficult to process.
As a solution, the present invention provides a thermoplastic resin composition containing a thermoplastic resin, which becomes a matrix resin of a fiber reinforced plastic after it has been impregnated in a reinforcing fiber base material. 50 wt.% or more of the entire resin composition is a thermoplastic resin having phenoxy resin as an essential component, and when the temperature is raised to 280℃ from room temperature and lowered to room temperature again by using a rheometer, the melt viscosity exceeds 10,000 Pa.s in the temperature range of 220℃ or lower.

Description

纖維強化塑膠成形材料及其成形體 Fiber-reinforced plastic molding material and its molded body

本發明係關於纖維強化塑膠成形材料及其成形體,該纖維強化塑膠成形材料係可獲得即使置於高溫環境下也可抑制回彈且具有優異耐熱性之纖維強化塑膠成形品。 The present invention relates to a fiber-reinforced plastic molding material and a molded article thereof. The fiber-reinforced plastic molding material can obtain a fiber-reinforced plastic molded product that suppresses springback even when placed in a high-temperature environment and has excellent heat resistance.

相較於環氧樹脂等以熱硬化性樹脂作為基質樹脂之纖維強化塑膠(FRP),以熱塑性樹脂作為基質樹脂之熱塑性纖維強化塑膠(FRTP)係具有高生產性且可回收使用後的材料,故開發其實用化技術。 Compared with fiber-reinforced plastics (FRP) that use thermosetting resins as matrix resins such as epoxy resins, thermoplastic fiber-reinforced plastics (FRTP) that use thermoplastic resins as matrix resins are highly productive and recyclable materials. Therefore, its practical technology was developed.

但是以CFRTP,尤其是以碳纖維之短纖造紙所獲得的不織布作為強化纖維基材時,以熱壓製進行成形加工時,在預熱步驟或成形加工後的脫模時等基質樹脂軟化狀態中,強化纖維基材會因回復力而產生體積膨脹,故會產生樹脂的分解、成形體表面性狀的惡化、成形體中空洞的產生等問題。又,實際使用時,周邊溫度若成為接近成形加工溫度,則無法抑制強化纖維基材的回復力,而有成形體產生預定以上的尺寸變化之問題。 However, when using CFRTP, especially the non-woven fabric obtained from short-fiber carbon fiber papermaking as the reinforcing fiber base material, when forming by hot pressing, in the softened state of the matrix resin during the preheating step or demoulding after forming, The volume expansion of the reinforcing fiber base material due to the recovery force causes problems such as decomposition of the resin, deterioration of the surface properties of the molded article, and generation of voids in the molded article. In addition, in actual use, if the surrounding temperature is close to the molding processing temperature, the restoring force of the reinforcing fiber base material cannot be suppressed, and there is a problem that the molded body undergoes a predetermined or more dimensional change.

前述強化纖維基材的回復力亦稱為回彈,為了降低回彈,研究出以下方法:一種使用玻璃轉移溫度(Tg)或熔點非常高之超級工程塑膠作為基質樹 脂,並調整與強化纖維之摻配比的方法(專利文獻1);一種使用以200℃的動態黏彈性測定所得儲存模數為固定值以上者作為基質樹脂之熱塑性樹脂的方法(專利文獻2);以及一種於成為基質樹脂之熱塑性樹脂中摻配碳黑等而提高樹脂強度之方法(專利文獻3)。 The recovery force of the above-mentioned reinforced fiber substrate is also called rebound. In order to reduce the rebound, the following method has been developed: a super engineering plastic with a glass transition temperature (Tg) or a very high melting point is used as the matrix tree A method of adjusting the blending ratio of resin and reinforcing fiber (Patent Document 1); a method of using a thermoplastic resin whose storage modulus is above a fixed value as measured by dynamic viscoelasticity at 200°C as a matrix resin (Patent Document 2 ); and a method of blending carbon black or the like into a thermoplastic resin to become a matrix resin to increase the strength of the resin (Patent Document 3).

[先前技術文獻] [Prior Art Literature]

[專利文獻] [Patent Document]

專利文獻1:日本特開2016-190955。 Patent Document 1: Japanese Patent Laid-Open No. 2016-190955.

專利文獻2:日本特開2014-95034。 Patent Document 2: Japanese Patent Laid-Open No. 2014-95034.

專利文獻3:WO2015/016252。 Patent Document 3: WO2015/016252.

但使用Tg或熔點非常高之超級工程塑膠係需非常高溫度(300℃左右)的加工,而在製造FRTP時卻有技術上的困難。又,在提升樹脂於高溫時的彈性模數之手法中,在超過基質樹脂所使用之熱塑性樹脂之Tg或熔點的環境中,彈性模數會降低,故有回彈抑制效果不充分之課題。 However, the use of super engineering plastics with a very high Tg or melting point requires very high temperature (about 300°C) processing, and there are technical difficulties in the manufacture of FRTP. Also, in the method of increasing the modulus of elasticity of the resin at high temperature, the modulus of elasticity decreases in an environment exceeding the Tg or melting point of the thermoplastic resin used for the matrix resin, so there is a problem that the springback suppression effect is insufficient.

因此,本發明目的在於提供一種樹脂組成物,其可在不使用加工困難之超級工程塑膠下,藉由與先前文獻1至3相異之手法,而可獲得即使在加工溫度附近使用成形品也可抑制回彈之FRTP。 Therefore, the object of the present invention is to provide a resin composition that can obtain a molded product even when using a molded product near the processing temperature without using a super engineering plastic that is difficult to process. FRTP that can inhibit rebound.

本發明人等發現,對於強化纖維基材中含浸有包含熱塑性樹脂之樹脂組成物的纖維強化塑膠成形材料,將其作成成形體時,上述纖維強化塑膠成 形材料之成為基質樹脂組成物的在220℃以下之溫度區域中熔融黏度成為10000Pa.s以上,藉由使用如此之質樹脂組成物,可使成形體兼具優異耐熱性及尺寸穩定性,從而完成本發明。 The inventors of the present invention have found that when forming a fiber-reinforced plastic molding material in which a fiber-reinforced base material is impregnated with a resin composition containing a thermoplastic resin, the fiber-reinforced plastic composition The melt viscosity of the forming material becomes 10000Pa in the temperature region below 220℃ for the matrix resin composition. s or more, by using such a resin composition, it is possible to provide a molded article with both excellent heat resistance and dimensional stability, thereby completing the present invention.

本發明為一種包含熱塑性樹脂之熱塑性樹脂組成物,該熱塑性樹脂組成物在含浸於強化纖維基材後會成為纖維強化塑膠的基質樹脂, The present invention is a thermoplastic resin composition comprising a thermoplastic resin, the thermoplastic resin composition becomes a matrix resin of fiber-reinforced plastic after being impregnated in a reinforced fiber base material,

樹脂組成物整體的50wt%以上為以苯氧基樹脂作為必要成分之熱塑性樹脂, More than 50 wt% of the entire resin composition is a thermoplastic resin containing phenoxy resin as an essential component,

使用流變儀從室溫升溫至280℃後再降溫至室溫時,在220℃以下的溫度區域中熔融黏度超過10000Pa.s When using a rheometer to heat up from room temperature to 280°C and then cool down to room temperature, the melt viscosity exceeds 10000Pa in the temperature range below 220°C. the s

基質樹脂較佳為苯氧基樹脂(A)與第2熱塑性樹脂(B-1至3)的混合物,該基質樹脂之30wt%至70wt%以下為苯氧基樹脂(A),剩下為第2熱塑性樹脂(B-1至3),第2熱塑性樹脂(B-1至3)為選自由聚醯胺樹脂、聚碳酸酯樹脂及聚酯樹脂所成群組中之1種以上。 The matrix resin is preferably a mixture of the phenoxy resin (A) and the second thermoplastic resin (B-1 to 3), 30wt% to 70wt% of the matrix resin is the phenoxy resin (A), and the rest is the second thermoplastic resin. 2. Thermoplastic resins (B-1 to 3). The second thermoplastic resins (B-1 to 3) are at least one selected from the group consisting of polyamide resins, polycarbonate resins, and polyester resins.

又,較佳之基質樹脂係含有熱塑性樹脂及環氧樹脂(C)。 Moreover, a preferable matrix resin contains a thermoplastic resin and an epoxy resin (C).

又,較佳係成為基質樹脂之樹脂組成物顯示相互反應性或交聯性。 Also, it is preferable that the resin composition used as the matrix resin exhibit mutual reactivity or crosslinkability.

本發明為將上述樹脂組成物含浸於強化纖維基材而成的纖維強化塑膠成形材料、及將前述纖維強化塑膠成形材料成形而成的成形體。 The present invention is a fiber-reinforced plastic molding material obtained by impregnating the above-mentioned resin composition into a reinforcing fiber base material, and a molded article obtained by molding the above-mentioned fiber-reinforced plastic molding material.

本發明之成形體較佳為在與成形加工時的溫度相同的熱環境下放置10分鐘後,放冷至常溫後之纖維強化塑膠之厚度變化率為超過0%且未達10%。 The molded article of the present invention is preferably placed in a hot environment at the same temperature as the molding process for 10 minutes, and then cooled to room temperature, and the thickness change rate of the fiber-reinforced plastic is more than 0% and less than 10%.

以本發明之樹脂組成物作為基質樹脂之纖維強化塑膠,在成形加工後,即使置於成形溫度以上的環境,基質樹脂的軟化也非常小,可抑制強化纖維的回彈,故在高溫環境下之機械強度的保持率較高,不易產生成形品的變形。因此,尤其可使用作為用於汽車或航空宇宙等較嚴苛的環境下之構造構件用FRTP材料,尤其可使用作為CFRTP材料。 Fiber-reinforced plastics using the resin composition of the present invention as a matrix resin, after molding, even if placed in an environment above the molding temperature, the softening of the matrix resin is very small, and the rebound of the reinforcing fibers can be suppressed, so in high-temperature environments The retention rate of the mechanical strength is high, and the deformation of the molded product is not easy to occur. Therefore, it can be used as FRTP materials for structural members used in harsh environments such as automobiles and aerospace, especially as CFRTP materials.

又,基質樹脂係以非超級工程塑膠之通用樹脂材料而構成,故在材料面或製造面來看為較低成本。 In addition, the matrix resin is made of general-purpose resin materials that are not super engineering plastics, so the cost is relatively low in terms of materials or manufacturing.

以下詳細說明本發明。 The present invention will be described in detail below.

本發明之纖維強化塑膠成形材料所使用之基質樹脂組成物係含有熱塑性樹脂。基質樹脂亦稱為MT樹脂。 The matrix resin composition used in the fiber-reinforced plastic molding material of the present invention contains a thermoplastic resin. Matrix resin is also called MT resin.

熱塑性樹脂可舉例如苯氧基樹脂(又稱為熱塑性環氧樹脂)、聚醯胺樹脂、聚酯樹脂、聚碳酸酯樹脂、以酸酐改質之聚丙烯樹脂等聚烯烴等。尤其較佳為使用苯氧基樹脂,其與強化纖維基材的親和性及含浸性良好,分子鏈末端殘存有環氧基,且側鏈的2級羥基容易利用於交聯反應。 The thermoplastic resin can be, for example, polyolefins such as phenoxy resin (also known as thermoplastic epoxy resin), polyamide resin, polyester resin, polycarbonate resin, polypropylene resin modified with acid anhydride, and the like. It is especially preferable to use a phenoxy resin, which has good affinity and impregnation with the reinforcing fiber substrate, epoxy groups remain at the end of the molecular chain, and secondary hydroxyl groups in the side chains are easily utilized for crosslinking reactions.

基質樹脂可併用熱塑性樹脂及包含環氧樹脂的熱硬化性樹脂,但相對於基質樹脂總重量,熱塑性樹脂為50wt%以上,較佳為60至100wt%,更佳為75至100wt%。又,基質樹脂中的熱塑性樹脂若未達50wt%,則熱硬化性樹脂的影響較強,故纖維強化塑膠成形材料之成形加工時間變長、或成形體之韌性或回收性降低。 The matrix resin can be combined with thermoplastic resin and thermosetting resin including epoxy resin, but relative to the total weight of the matrix resin, the amount of thermoplastic resin is more than 50wt%, preferably 60-100wt%, more preferably 75-100wt%. Also, if the thermoplastic resin in the matrix resin is less than 50 wt%, the influence of the thermosetting resin is strong, so the molding processing time of the fiber-reinforced plastic molding material becomes longer, or the toughness or recyclability of the molded product decreases.

本發明之纖維強化塑膠成形材料係使用流變儀從室溫升溫至280℃後再降溫至室溫時,測定基質樹脂(樹脂組成物)在220℃以下的溫度區域中的熔融黏度超過10000Pa.s。基質樹脂之熔融黏度較佳為12000Pa.s以上,更佳為15000Pa.s以上。基質樹脂之熔融黏度若為10000以下,則成形體暴露於高溫環境下時,基質樹脂會過度軟化並對強化纖維基材的排斥力而流動,因而產生回彈現象。 The fiber-reinforced plastic molding material of the present invention uses a rheometer to increase the temperature from room temperature to 280°C and then cool down to room temperature, and measure the melt viscosity of the matrix resin (resin composition) in the temperature range below 220°C to exceed 10,000Pa. s. The melt viscosity of the matrix resin is preferably 12000Pa. s or more, more preferably 15000Pa. s or more. If the melt viscosity of the matrix resin is less than 10,000, when the molded article is exposed to a high temperature environment, the matrix resin will soften excessively and flow against the repulsive force of the reinforcing fiber base material, resulting in a rebound phenomenon.

又,本發明中,熔融黏度超過10000Pa.s之溫度為220℃以下的溫度區域的原因為:其所形成的CFRP即使暴露於約200℃之環境下,其耐熱性能亦充分。當然,即使在220℃以上中的熔融黏度超過10000Pa.s也可獲得本發明效果,但以約280℃為上限。 Also, in the present invention, the melt viscosity exceeds 10000Pa. The reason why the temperature of s is in the temperature range of 220° C. or lower is that the formed CFRP has sufficient heat resistance even if it is exposed to an environment of about 200° C. Of course, even if the melt viscosity exceeds 10000Pa above 220°C. s can also obtain the effect of the present invention, but the upper limit is about 280°C.

又,測定熔融黏度時,比較從室溫升溫至280℃時到達220℃時的熔融黏度(ρ 220+)與降溫時220℃以下的溫度區域中的熔融黏度之最小值(ρ 220≧)時,較佳係熔融黏度(ρ 220≧)大於熔融黏度(ρ 220+)。又,在構成基質樹脂之主要樹脂成分單獨(構成成分為等量時,為熱物性較低之樹脂成分單獨)的玻璃轉移點+100℃或熔點-5℃中,本發明之基質樹脂之熔融黏度(ρ Tg+100ρ Tm-5)更佳係高於構成前述基質樹脂之主要樹脂單獨的熔融黏度。 Also, when measuring the melt viscosity, compare the melt viscosity ( ρ 220+ ) at 220°C when the temperature rises from room temperature to 280°C, and the minimum value of the melt viscosity ( ρ 220 ≧) in the temperature range below 220°C when the temperature is lowered. , preferably the melt viscosity ( ρ 220 ≧) is greater than the melt viscosity ( ρ 220+ ). In addition, at the glass transition point +100°C or melting point -5°C of the main resin components constituting the matrix resin alone (when the constituents are equal, the resin components with low thermal properties alone), the melting of the matrix resin of the present invention The viscosity ( ρ Tg+100 , ρ Tm-5 ) is more preferably higher than the independent melt viscosity of the main resin constituting the aforementioned matrix resin.

如上述,基質樹脂組成物在升溫、降溫時,藉由使熔融黏度參數大小滿足前述關係,而可使由本發明之纖維強化塑膠成形材料所獲得的纖維強化塑膠成形體即使置於200℃之高溫環境下時,例如即便基質樹脂軟化,其流動性也被大幅抑制,故不易產生回彈現象,進一步可維持纖維強化塑膠成形體之尺寸精度或機械物性。 As mentioned above, when the temperature of the matrix resin composition is raised or lowered, by making the melt viscosity parameter satisfy the aforementioned relationship, the fiber-reinforced plastic molding obtained from the fiber-reinforced plastic molding material of the present invention can be placed at a high temperature of 200°C In the environment, for example, even if the matrix resin softens, its fluidity is greatly suppressed, so springback is less likely to occur, and the dimensional accuracy and mechanical properties of fiber-reinforced plastic moldings can be further maintained.

另一方面,本發明之纖維強化塑膠成形材料所使用基質樹脂用組成物從室溫升溫至280℃時之熔融黏度的最小值為3000Pa.s以下,在成形加工時,適用於基質樹脂良好地含浸於強化纖維基材。熔融黏度之最小值較佳為50至3000Pa.s,更佳為100至2500Pa.s。 On the other hand, the minimum melt viscosity of the matrix resin composition used in the fiber-reinforced plastic molding material of the present invention is 3000Pa when the temperature rises from room temperature to 280°C. s or less is suitable for satisfactorily impregnating the reinforcing fiber base material with the matrix resin during molding. The minimum melt viscosity is preferably 50 to 3000Pa. s, more preferably 100 to 2500Pa. s.

基質樹脂只要含有熱塑性樹脂且顯示上述特定熔融黏度行為,則無特別限定,較佳為互相具有反應性之2種以上樹脂的混合物,更佳為具有交聯性之2種以上樹脂的混合物。 The matrix resin is not particularly limited as long as it contains a thermoplastic resin and exhibits the above-mentioned specific melt viscosity behavior, but is preferably a mixture of two or more resins that are mutually reactive, and more preferably a mixture of two or more resins that are crosslinkable.

又,以流變儀將樹脂組成物升溫至280℃後直接於280℃保持30分鐘以上,藉由此時熔融黏度有無增加而判定基質樹脂組成物有無反應性。 In addition, the temperature of the resin composition was raised to 280° C. with a rheometer, and then directly kept at 280° C. for more than 30 minutes. The reactivity of the matrix resin composition was judged by whether the melt viscosity increased at this time.

較佳為在保持於280℃之期間中顯示可確認2倍以上的熔融黏度上升(△ρ)之反應性。更佳為可確認5倍以上的熔融黏度上升之反應性。 It is preferable to exhibit a reactivity in which a melt viscosity increase (Δρ) of 2 times or more can be confirmed during the period of holding at 280°C. More preferably, it is a reactivity that can confirm a melt viscosity increase of 5 times or more.

互相具有反應性之2種以上樹脂的混合物為高分子鏈末端之殘存反應基進行反應之樹脂組成物,可舉例如苯氧基樹脂與聚醯胺樹脂的組合。 A mixture of two or more resins that are reactive with each other is a resin composition in which the residual reactive groups at the end of the polymer chain react, for example, a combination of a phenoxy resin and a polyamide resin.

苯氧基樹脂(A)及聚醯胺樹脂(B)皆為具有極性基的樹脂,高分子鏈末端中,苯氧基樹脂(A)具有殘留環氧基,聚醯胺樹脂(B-1)具有殘留胺或羧基,若混合兩者則相容性良好,故兩者會進行一定程度的反應。 Phenoxy resin (A) and polyamide resin (B) are all resins with polar groups. In the end of the polymer chain, phenoxy resin (A) has residual epoxy groups, and polyamide resin (B-1 ) has a residual amine or carboxyl group, and if the two are mixed, the compatibility will be good, so the two will react to a certain extent.

苯氧基樹脂(A)與選自由聚醯胺樹脂、聚碳酸酯樹脂及芳香族聚酯樹脂所成群組中之任1種的第2熱塑性樹脂(B)之摻配比率在以兩者合計為100質量%時,可為苯氧基樹脂(A)之比率為30至70質量%,第2熱塑性樹脂(B)之比率為30至70質量%。亦即,可以(A)/(B)所示摻配比(質量比)為30/70至70/30之比率摻配。摻配比(A)/(B)較佳為70/30至40/60,更佳為70/30至50/50。摻配比(A)/(B)若超過70/30,則苯氧基樹脂(A)之比率進一步變高,摻配第2熱塑性樹 脂的耐熱性提高效果會消失。又,摻配比(A)/(B)未達30/70,且第2熱塑性樹脂(B)之比率變高時,則摻配苯氧基樹脂的剛性提高會消失,故會使高溫環境下的剛性降低。 The compounding ratio of the phenoxy resin (A) to any one of the second thermoplastic resin (B) selected from the group consisting of polyamide resin, polycarbonate resin and aromatic polyester resin is based on the ratio of both When the total is 100% by mass, the ratio of the phenoxy resin (A) may be 30 to 70% by mass, and the ratio of the second thermoplastic resin (B) may be 30 to 70% by mass. That is, the blending ratio (mass ratio) shown in (A)/(B) can be blended at a ratio of 30/70 to 70/30. The blending ratio (A)/(B) is preferably 70/30 to 40/60, more preferably 70/30 to 50/50. If the blending ratio (A)/(B) exceeds 70/30, the ratio of the phenoxy resin (A) will be further increased, and the second thermoplastic resin will be blended The effect of improving the heat resistance of the fat will disappear. Also, when the compounding ratio (A)/(B) is less than 30/70, and the ratio of the second thermoplastic resin (B) becomes high, the increase in rigidity of the compounded phenoxy resin will disappear, so the high temperature environment will lower rigidity.

苯氧基樹脂為由2價酚化合物與環氧鹵丙烷的縮合反應、或2價酚化合物與2官能環氧樹脂的複加成反應而獲得的熱塑性樹脂,可在溶液中或無溶劑下用以往公知方法獲得。又,稱為多羥基聚醚樹脂、熱塑性環氧樹脂之樹脂為苯氧基樹脂的別名,係相當於本發明之苯氧基樹脂。 Phenoxy resin is a thermoplastic resin obtained by the condensation reaction of divalent phenolic compound and epihalohydrin, or the complex addition reaction of divalent phenolic compound and bifunctional epoxy resin, which can be used in solution or without solvent Obtained by known methods in the past. Also, resins called polyhydroxypolyether resins and thermoplastic epoxy resins are another names for phenoxy resins, and are equivalent to the phenoxy resins of the present invention.

苯氧基樹脂之平均分子量作為質量平均分子量(Mw)通常為10,000至200,000,較佳為20,000至100,000,更佳為30,000至80,000。Mw過低則FRTP成形體之強度較差,過高則操作性或加工性較差。又,Mw係以凝膠滲透層析儀(GPC)測定並使用標準聚苯乙烯校準曲線所換算的值。 The average molecular weight of the phenoxy resin is generally 10,000 to 200,000, preferably 20,000 to 100,000, more preferably 30,000 to 80,000 as the mass average molecular weight (Mw). If the Mw is too low, the strength of the FRTP molded body will be poor, and if the Mw is too high, the workability or processability will be poor. In addition, Mw is the value converted using the standard polystyrene calibration curve measured by gel permeation chromatography (GPC).

苯氧基樹脂之羥基當量(g/eq)通常為50至1000,較佳為50至750,特佳為50至500。羥基當量過低則羥基會增加,吸水率會上升,故有機械物性降低之虞。羥基當量過高則羥基較少,故與強化纖維基材,尤其是與碳纖維的濕潤性會降低。 The hydroxyl equivalent (g/eq) of the phenoxy resin is usually 50 to 1000, preferably 50 to 750, particularly preferably 50 to 500. If the hydroxyl equivalent is too low, the number of hydroxyl groups will increase and the water absorption will increase, which may lower the mechanical properties. If the hydroxyl equivalent is too high, the number of hydroxyl groups will be low, so the wettability with the reinforcing fiber substrate, especially with carbon fibers will decrease.

苯氧基樹脂之玻璃轉移點(Tg)適合為65℃至160℃,較佳為70℃至150℃。玻璃轉移點低於65℃則成形性變好,但會有因結塊使粉體或錠粒的儲存穩定性惡化或預成形時的沾黏感(黏性惡化)等問題。若高於160℃則熔融黏度會提高,對於成形性或強化纖維基材的充填性較差,結果會需要更高溫的壓製成形。又,苯氧基樹脂之玻璃轉移點係使用示差掃描熱析儀以10℃/分鐘之升溫條件在20至280℃之範圍下測定,由第二掃描之波峰值所求得的數值。 The glass transition point (Tg) of the phenoxy resin is suitably 65°C to 160°C, preferably 70°C to 150°C. If the glass transition point is lower than 65°C, the formability will be better, but there will be problems such as deterioration of the storage stability of the powder or ingot due to agglomeration, or a sticky feeling (deterioration of viscosity) during preforming. If it is higher than 160°C, the melt viscosity will increase, and the formability and the filling property of the reinforcing fiber base material will be poor, and as a result, press molding at a higher temperature will be required. In addition, the glass transition point of the phenoxy resin is measured in the range of 20 to 280°C using a differential scanning thermal analyzer at a temperature increase of 10°C/min, and is a value obtained from the peak value of the second scan.

苯氧基樹脂之熔融黏度在Tg(至160℃)以上的溫度區域中較佳為3,000Pa.s以下,更佳為500Pa.s以下,又更佳為300Pa.s以下。另一方面,熔融黏度之下限較佳為10Pa.s以上,更佳為50Pa.s以上。又,苯氧基樹脂不具有熔點(Tm),故熔融黏度會因應溫度緩和變化。 The melt viscosity of phenoxy resin is preferably 3,000Pa in the temperature region above Tg (to 160°C). s or less, more preferably 500Pa. s or less, and more preferably 300Pa. below s. On the other hand, the lower limit of melt viscosity is preferably 10Pa. s or more, more preferably 50Pa. s or more. In addition, phenoxy resins do not have a melting point (Tm), so the melt viscosity changes moderately with temperature.

苯氧基樹脂只要滿足上述特定物性,則無特別限定,可列舉如:雙酚A型苯氧基樹脂(例如NIPPON STEEL Chemical & Material公司製,商品名Phenotote YP-50、YP-50S、YP-55U)、雙酚F型苯氧基樹脂(例如NIPPON STEEL Chemical & Material公司製,商品名Phenotote FX-316)、雙酚A與雙酚F之共聚型苯氧基樹脂(例如NIPPON STEEL Chemical & Material公司製,商品名YP-70)、或特殊苯氧基樹脂(例如NIPPON STEEL Chemical & Material公司製,商品名Phenotote YPB-43C、FX293)等,該等可單獨使用或混合2種以上使用。 The phenoxy resin is not particularly limited as long as it satisfies the above-mentioned specific physical properties, and examples thereof include: bisphenol A type phenoxy resin (such as manufactured by NIPPON STEEL Chemical & Material Co., trade names Phenotote YP-50, YP-50S, YP- 55U), bisphenol F type phenoxy resin (such as NIPPON STEEL Chemical & Material company, trade name Phenotote FX-316), bisphenol A and bisphenol F copolymerization type phenoxy resin (such as NIPPON STEEL Chemical & Material Co., Ltd., brand name YP-70), or special phenoxy resin (for example, NIPPON STEEL Chemical & Material company, brand name Phenotote YPB-43C, FX293), etc., these can be used alone or in combination of two or more.

第2熱塑性樹脂(B)係選自由聚醯胺樹脂(B-1)、聚碳酸酯樹脂(B-2)及聚酯樹脂(B-3)所成群組中之任1種,也可為該等的混合物。 The second thermoplastic resin (B) is any one selected from the group consisting of polyamide resin (B-1), polycarbonate resin (B-2) and polyester resin (B-3). is a mixture of such.

聚醯胺樹脂為藉由重複的醯胺鍵結而構成主鏈之熱塑性樹脂,可藉由內醯胺的開環聚合或內醯胺彼此的共縮聚、二胺與二羧酸經脫水縮合等而獲得。 Polyamide resin is a thermoplastic resin whose main chain is composed of repeated amide bonds. It can be formed by ring-opening polymerization of lactamides or co-condensation of lactamides, dehydration condensation of diamines and dicarboxylic acids, etc. And get.

聚醯胺樹脂係有:主鏈為脂肪族骨架所構成之全脂肪族聚醯胺樹脂(亦稱為耐綸)(例如耐綸6、耐綸11、耐綸12、耐綸66、耐綸610等),主鏈含有芳香族之半脂肪族聚醯胺樹脂或半芳香族聚醯胺樹脂(例如耐綸6I、耐綸6T、耐綸9T、耐綸M5T、耐綸MXD6等)、及主鏈僅以芳香族骨架構成之全芳香族聚醯胺樹脂(亦稱為聚芳醯胺)[Kevlar、Nomex(TORAY杜邦股份有限公司製)、Twaron、Conex(帝人股份有限公司製)]。本發明中該等皆可使用,但較佳為使用 全脂肪族聚醯胺樹脂及/或半脂肪族(半芳香族)聚醯胺樹脂,更佳為全脂肪族聚醯胺樹脂,最佳為ε-己內醯胺經開環聚合而獲得的全脂肪族聚醯胺樹脂(亦稱為耐綸6(聚醯胺6))。 Polyamide resins are: full aliphatic polyamide resin (also called nylon) whose main chain is composed of aliphatic skeleton (such as nylon 6, nylon 11, nylon 12, nylon 66, nylon 610, etc.), the main chain contains aromatic semi-aliphatic polyamide resin or semi-aromatic polyamide resin (such as nylon 6I, nylon 6T, nylon 9T, nylon M5T, nylon MXD6, etc.), and A fully aromatic polyamide resin (also known as polyaramid) whose main chain consists only of an aromatic backbone [Kevlar, Nomex (manufactured by TORAY DuPont Co., Ltd.), Twaron, Conex (manufactured by Teijin Co., Ltd.)]. All of these can be used in the present invention, but it is preferred to use Fully aliphatic polyamide resin and/or semi-aliphatic (semi-aromatic) polyamide resin, more preferably fully aliphatic polyamide resin, most preferably obtained by ring-opening polymerization of ε-caprolactam Fully aliphatic polyamide resin (also known as nylon 6 (polyamide 6)).

聚醯胺樹脂之熔點或玻璃轉移點為180℃以上、且250℃以上之溫度中的熔融黏度宜為1,000Pa.s以下。較佳為使用熔點或玻璃轉移點為200℃以上、且200至350℃的熔融黏度為1000Pa.s以下者。 The melting point or glass transition point of the polyamide resin is above 180°C and the melt viscosity at a temperature above 250°C is preferably 1,000Pa. below s. It is preferable to use a melting point or a glass transition point of 200 ° C or more, and a melt viscosity of 1000 Pa at 200 to 350 ° C. s or less.

聚醯胺樹脂之重量平均分子量(Mw)較佳為10,000以上,更佳為25,000以上。藉由使用Mw為10,000以上之聚醯胺樹脂,可確保成形體之良好的機械強度。 The weight average molecular weight (Mw) of the polyamide resin is preferably at least 10,000, more preferably at least 25,000. By using a polyamide resin having a Mw of 10,000 or more, good mechanical strength of the molded article can be secured.

與苯氧基樹脂(A)摻配之聚碳酸酯樹脂(B-2)為二羥基化合物與光氣或碳酸二酯反應而獲得的熱塑性樹脂。 The polycarbonate resin (B-2) blended with the phenoxy resin (A) is a thermoplastic resin obtained by reacting a dihydroxy compound with phosgene or a carbonic acid diester.

本發明中較佳使用之聚碳酸酯樹脂在常溫中為固形,較佳係280℃的熔融黏度為3,000Pa.s以下,更佳為2,000Pa.s以下,又更佳為1,500Pa.s以下。熔融黏度若超過3,000Pa.s,則成形加工時之樹脂流動性會降低,樹脂無法充分擴展而會成為空洞的原因,故不佳。 The polycarbonate resin preferably used in the present invention is solid at room temperature, and preferably has a melt viscosity of 3,000Pa at 280°C. s or less, more preferably 2,000Pa. s or less, and more preferably 1,500Pa. below s. If the melt viscosity exceeds 3,000Pa. s, the fluidity of the resin during molding processing will be reduced, and the resin will not be able to fully expand and cause voids, so it is not good.

聚碳酸酯樹脂中,考慮與2官能型環氧樹脂或苯氧基樹脂的相溶性,較佳為以芳香族二羥基化合物作為原料而獲得的芳香族聚碳酸酯樹脂。芳香族二羥基化合物可舉例如2,2-雙(4-羥基苯基)丙烷(雙酚A)、雙(4-羥基苯基)甲烷、1,1-雙(4-羥基苯基)乙烷、2,2-雙(4-羥基苯基)丁烷、4,4’-二羥基二苯基醚、4,4’-二羥基-3,3’-二甲基二苯基醚、雙(4-羥基苯基)苯基甲烷、2,2-雙(4-羥基苯基-3-甲基苯基)丙烷、1,1-雙(4-羥基-3-第三丁基苯基)丙烷、1,1-雙(4-羥基苯基)環戊烷、1,1-雙(4-羥基苯基)環己烷、4,4’-二羥基二苯基碸、4,4’-二羥基-3,3’-二甲基二苯基碸、 4,4’-二羥基二苯基硫醚、4,4’-二羥基二苯基亞碸、4,4’-二羥基-3,3’-二甲基二苯基亞碸、2,2-雙(4-羥基-3-溴苯基)丙烷、2,2-雙(4-羥基-3,5-二溴苯基)丙烷、2,2-雙(4-羥基-3,5-二氯苯基)丙烷等。該等可單獨使用或混合2種類以上使用。 Among the polycarbonate resins, an aromatic polycarbonate resin obtained from an aromatic dihydroxy compound as a raw material is preferable in consideration of compatibility with bifunctional epoxy resins or phenoxy resins. Aromatic dihydroxy compounds can be exemplified by 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), bis(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)ethane alkane, 2,2-bis(4-hydroxyphenyl)butane, 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxy-3,3'-dimethyldiphenyl ether, Bis(4-hydroxyphenyl)phenylmethane, 2,2-bis(4-hydroxyphenyl-3-methylphenyl)propane, 1,1-bis(4-hydroxy-3-tert-butylbenzene base) propane, 1,1-bis(4-hydroxyphenyl)cyclopentane, 1,1-bis(4-hydroxyphenyl)cyclohexane, 4,4'-dihydroxydiphenylsulfone, 4, 4'-dihydroxy-3,3'-dimethyldiphenylsulfone, 4,4'-dihydroxydiphenylsulfide, 4,4'-dihydroxydiphenylene, 4,4'-dihydroxy-3,3'-dimethyldiphenylene, 2, 2-bis(4-hydroxy-3-bromophenyl)propane, 2,2-bis(4-hydroxy-3,5-dibromophenyl)propane, 2,2-bis(4-hydroxy-3,5 -dichlorophenyl)propane and the like. These can be used individually or in mixture of 2 or more types.

聚碳酸酯樹脂之重量平均分子量(Mw)並無特別限制,以確保成形體之機械強度之觀點來看,較佳為10,000至250,000之範圍,更佳為15,000至200,000之範圍。聚碳酸酯樹脂之Mw若過低,則有成形體之機械物性或耐熱性較差之虞,若Mw過高則操作性或加工性容易變差。又,Mw為以凝膠滲透層析儀測定並使用標準聚苯乙烯校準曲線換算的值。 The weight average molecular weight (Mw) of the polycarbonate resin is not particularly limited, but it is preferably in the range of 10,000 to 250,000, more preferably in the range of 15,000 to 200,000, from the viewpoint of securing the mechanical strength of the molded article. If the Mw of the polycarbonate resin is too low, the mechanical properties and heat resistance of the molded article may be poor, and if the Mw is too high, the handleability and processability are likely to be poor. In addition, Mw is a value measured with a gel permeation chromatography and converted using a standard polystyrene calibration curve.

聚碳酸酯樹脂之玻璃轉移溫度(Tg)可為200℃以下。較佳為140℃至170℃,更佳為145℃至165℃。聚碳酸酯樹脂之Tg若高於200℃,則熔融黏度會提高,將本實施型態之樹脂組成物例如應用於FRP時,難以在無空洞等缺陷下含浸於強化纖維基材。另一方面,Tg下限值只要加工性不會產生問題則無特別限制,約可為140℃以上。 The glass transition temperature (Tg) of the polycarbonate resin may be 200°C or lower. Preferably it is 140°C to 170°C, more preferably 145°C to 165°C. If the Tg of the polycarbonate resin is higher than 200°C, the melt viscosity will increase. When the resin composition of this embodiment is applied to FRP, for example, it is difficult to impregnate the reinforcing fiber substrate without defects such as voids. On the other hand, the lower limit of Tg is not particularly limited as long as there is no problem with workability, and may be approximately 140° C. or higher.

有關於聚碳酸酯樹脂之熔點(Tm),雖未有明顯的Tm,但可在200至300℃之範圍內,較佳為220至280℃,更佳為240至260℃。若熔點未達200℃,則例如應用於FRP時,會有在對苯氧基樹脂之強化纖維基材的含浸不充分狀態下開始交聯反應之虞,若為300℃以上,則加工時需要高溫規格之成形機。 Regarding the melting point (Tm) of polycarbonate resin, although there is no obvious Tm, it can be in the range of 200 to 300°C, preferably 220 to 280°C, more preferably 240 to 260°C. If the melting point is less than 200°C, for example, when it is applied to FRP, the crosslinking reaction may start in the state of insufficient impregnation of the reinforcing fiber base material of phenoxy resin. Forming machine with high temperature specification.

適合本發明之聚酯樹脂(B-3)為二羧酸化合物與二醇經縮聚而獲得的熔點為200℃以上之芳香族聚酯樹脂,也可為半芳香族聚酯樹脂。 The polyester resin (B-3) suitable for the present invention is an aromatic polyester resin obtained by polycondensation of a dicarboxylic acid compound and a diol with a melting point of 200° C. or higher, or a semi-aromatic polyester resin.

以該等二羧酸化合物與二醇的縮聚物作為構造單元之芳香族聚酯樹脂可列舉如:聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丙二酯、聚對苯二甲酸丁二酯、聚間苯二甲酸丙二酯、聚間苯二甲酸丁二酯、聚萘二 甲酸丁二酯、聚對苯二甲酸環己烷二亞甲酯等,共聚物可列舉如:聚間苯二甲酸丙二酯/對苯二甲酸酯、聚間苯二甲酸丁二酯/對苯二甲酸酯、聚對苯二甲酸丙二酯/萘二甲酸酯、聚對苯二甲酸丁二酯/萘二甲酸酯等芳香族聚酯樹脂等,但以提高機械物性及耐熱性之觀點來看,本發明中較佳為以芳香族二羧酸化合物與脂肪族二醇的縮聚物作為主構造單元之聚合物或共聚物,更佳為以選自對苯二甲酸及萘二羧酸之二羧酸化合物與選自乙二醇、丙二醇及1,4-丁二醇之脂肪族二醇的縮聚物作為主構造單元之聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丙二酯、聚對苯二甲酸丁二酯、聚間苯二甲酸乙二酯/對苯二甲酸酯、聚間苯二甲酸丙二酯/對苯二甲酸酯、聚間苯二甲酸丁二酯/對苯二甲酸酯、聚對苯二甲酸丁二酯/癸烷二羧酸酯、聚對苯二甲酸丁二酯/聚四亞甲基二醇等芳香族聚酯樹脂,最佳為聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚對苯二甲酸丙二酯或聚萘二甲酸丁二酯。 Examples of aromatic polyester resins that use polycondensates of dicarboxylic acid compounds and diols as structural units include polyethylene terephthalate, polyethylene naphthalate, and polytrimethylene terephthalate. ester, polybutylene terephthalate, polytrimethylene isophthalate, polybutylene isophthalate, polynaphthalene Butylene formate, polycyclohexane dimethylene terephthalate, etc. Copolymers include, for example: polytrimethylene isophthalate/terephthalate, polybutylene isophthalate/ Aromatic polyester resins such as terephthalate, polytrimethylene terephthalate/naphthalate, polybutylene terephthalate/naphthalene, etc., but to improve mechanical properties and From the viewpoint of heat resistance, in the present invention, a polycondensate of an aromatic dicarboxylic acid compound and an aliphatic diol is preferred as a polymer or a copolymer as a main structural unit, and a polymer selected from terephthalic acid and A polycondensate of a dicarboxylic acid compound of naphthalene dicarboxylic acid and an aliphatic diol selected from ethylene glycol, propylene glycol, and 1,4-butanediol as the main structural unit of polyethylene terephthalate, polyethylene naphthalate Ethylene Formate, Polytrimethylene Terephthalate, Polybutylene Terephthalate, Polyethylene Isophthalate/Terephthalate, Polytrimethylene Isophthalate/Terephthalate Dicarboxylate, polybutylene isophthalate/terephthalate, polybutylene terephthalate/decane dicarboxylate, polybutylene terephthalate/polytetramethylene Aromatic polyester resins such as diol, preferably polyethylene terephthalate, polybutylene terephthalate, polytrimethylene terephthalate or polybutylene naphthalate.

以提高機械物性此點來看,聚酯樹脂之重量平均分子量(Mw)較佳為8,000以上。又,重量平均分子量(Mw)為500,000以下時,機械物性及成形加工性之平衡優異,故較佳。重量平均分子量更佳為300,000以下,又更佳為250,000以下。 From the viewpoint of improving mechanical properties, the weight average molecular weight (Mw) of the polyester resin is preferably 8,000 or more. In addition, when the weight average molecular weight (Mw) is 500,000 or less, the balance between mechanical properties and moldability is excellent, which is preferable. The weight average molecular weight is more preferably at most 300,000, more preferably at most 250,000.

聚酯樹脂之熔點或玻璃轉移點為200℃以上,較佳為200至300℃以下,更佳為220至260℃。熔點越高則耐熱性或強度/剛性容易提高,但若過高則熔融需要高溫,成形時容易造成熱劣化,或熔融時的黏度變高,而使流動性降低。 The melting point or glass transition point of the polyester resin is above 200°C, preferably below 200 to 300°C, more preferably between 220 to 260°C. The higher the melting point, the easier it is to improve heat resistance or strength/rigidity. However, if the melting point is too high, high temperature is required for melting, thermal deterioration is likely to occur during molding, or the viscosity during melting becomes high, reducing fluidity.

在熔點以上之溫度中,熔融黏度較佳為100至2000Pa.s之範圍。藉由使用在熔點以上之溫度中熔融黏度在該範圍內之芳香族聚酯樹脂,在進行纖維強化塑膠成形材料之成形加工時,可適當地將樹脂組成物含浸於連續纖維片。 At a temperature above the melting point, the melt viscosity is preferably 100 to 2000Pa. s range. By using an aromatic polyester resin having a melt viscosity within this range at a temperature above the melting point, the continuous fiber sheet can be appropriately impregnated with the resin composition when performing molding processing of fiber-reinforced plastic molding materials.

具有交聯性之樹脂的混合物為主要利用高分子鏈的側鏈之反應性官能基而可展現三維交聯構造之樹脂組成物,而不拘有無交聯劑。如此樹脂組成物可列舉例如:苯氧基樹脂(A)與環氧樹脂(C)與酸酐(D)所構成之組成物、苯氧基樹脂(A)與聚碳酸酯樹脂(B-2)所構成之組成物、或苯氧基樹脂(A)與聚酯樹脂(B-3)所構成之組成物。 A mixture of cross-linkable resins is a resin composition that can exhibit a three-dimensional cross-linked structure mainly by utilizing the reactive functional groups of the side chains of the polymer chain, regardless of the presence or absence of a cross-linking agent. Examples of such resin compositions include: phenoxy resin (A), epoxy resin (C) and acid anhydride (D), phenoxy resin (A) and polycarbonate resin (B-2) A composition composed of, or a composition composed of a phenoxy resin (A) and a polyester resin (B-3).

如為苯氧基樹脂(A)、環氧樹脂(C)及交聯劑(D)所構成之組成物時, In the case of a composition composed of phenoxy resin (A), epoxy resin (C) and crosslinking agent (D),

苯氧基樹脂(A)可利用側鏈的2級羥基形成三維交聯構造,已知酸酐或異氰酸酯化合物、己內醯胺等可作為交聯劑。 The phenoxy resin (A) can form a three-dimensional cross-linked structure by utilizing the secondary hydroxyl group in the side chain, and known acid anhydrides, isocyanate compounds, caprolactam, etc. can be used as cross-linking agents.

要達成本發明之目的時也可僅為苯氧基樹脂(A)及交聯劑(D),但摻配該等時樹脂組成物容易凝膠化,較佳為併用環氧樹脂(C)及交聯劑(D)。 To achieve the purpose of the present invention, only the phenoxy resin (A) and the crosslinking agent (D) may be used, but the resin composition tends to gel when these are blended, and it is preferable to use the epoxy resin (C) together and a crosslinking agent (D).

環氧樹脂(C)較佳係2官能以上之環氧樹脂,可列舉如:雙酚A型環氧樹脂(例如新日鐵住金化學股份有限公司製Epotohto YD-011、Epotohto YD-7011、Epotohto YD-900)、雙酚F型環氧樹脂(例如新日鐵住金化學股份有限公司製Epotohto YDF-2001)、二苯基醚型環氧樹脂(例如新日鐵住金化學股份有限公司製YSLV-80DE)、四甲基雙酚F型環氧樹脂(例如新日鐵住金化學股份有限公司製YSLV-80XY)、雙酚硫化物型環氧樹脂(例如新日鐵住金化學股份有限公司製YSLV-120TE)、氫醌型環氧樹脂(例如新日鐵住金化學股份有限公司製Epotohto YDC-1312)、酚酚醛清漆型環氧樹脂(例如新日鐵住金化學股份有限公 司製Epotohto YDPN-638)、鄰甲酚酚醛清漆型環氧樹脂(例如新日鐵住金化學股份有限公司製Epotohto YDCN-701、Epotohto YDCN-702、Epotohto YDCN-703、Epotohto YDCN-704)、芳烷基萘二醇酚醛清漆型環氧樹脂(例如新日鐵住金化學股份有限公司製ESN-355)、三苯基甲烷型環氧樹脂(例如日本化藥股份有限公司製EPPN-502H)等,但並不限定於該等,又,該等可混合2種類以上使用。 Epoxy resin (C) is preferably an epoxy resin with more than 2 functions, such as: bisphenol A epoxy resin (such as Epotohto YD-011, Epotohto YD-7011, Epotohto YD-900), bisphenol F epoxy resin (e.g. Epotohto YDF-2001 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), diphenyl ether type epoxy resin (e.g. YSLV- 80DE), tetramethylbisphenol F-type epoxy resin (such as YSLV-80XY manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), bisphenol sulfide epoxy resin (such as YSLV-80XY manufactured by Nippon Steel & 120TE), hydroquinone epoxy resin (e.g. Epotohto YDC-1312 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), phenolic novolac epoxy resin (such as Nippon Steel & Sumikin Chemical Co., Ltd. Epotohto YDPN-638 made by the company), o-cresol novolak type epoxy resin (such as Epotohto YDCN-701, Epotohto YDCN-702, Epotohto YDCN-703, Epotohto YDCN-704 made by Nippon Steel & Sumikin Chemical Co., Ltd.), aromatic Alkylnaphthalene diol novolak type epoxy resin (such as ESN-355 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), triphenylmethane type epoxy resin (such as EPPN-502H manufactured by Nippon Kayaku Co., Ltd.), etc., However, it is not limited to these, and these can mix and use 2 or more types.

為了保存作為粉體之基質樹脂組成物,環氧樹脂(C)又更佳可為在室溫為固體、熔點為75℃至145℃、160℃的熔融黏度為1.0Pa.s以下之結晶性環氧樹脂。若超過1.0Pa.s,則基質樹脂組成物對強化纖維基材的充填性較差,所獲得的成形體之均質性差,故不佳。 In order to preserve the matrix resin composition as a powder, the epoxy resin (C) is more preferably solid at room temperature, has a melting point of 75°C to 145°C, and a melt viscosity of 1.0Pa at 160°C. Crystalline epoxy resin below s. If it exceeds 1.0Pa. s, the filling ability of the matrix resin composition to the reinforcing fiber base material is poor, and the homogeneity of the molded body obtained is poor, so it is unfavorable.

又,結晶性環氧樹脂之熔融黏度遠低於固形環氧樹脂,故可藉由摻配結晶性環氧樹脂而提高基質樹脂的含浸性。因此適合於與高熔融黏度之苯氧基樹脂併用。 Also, the melt viscosity of crystalline epoxy resin is much lower than that of solid epoxy resin, so the impregnation of matrix resin can be improved by blending crystalline epoxy resin. Therefore, it is suitable for use with phenoxy resins with high melt viscosity.

相對於苯氧基樹脂(A)100重量份,環氧樹脂(C)可以成為5至85重量份之方式摻配。較佳為9至83重量份,更佳為10至70重量份。環氧樹脂(C)之摻配量若超過85重量份,則環氧樹脂的硬化需要時間,故無法在短時間內獲得脫模所需強度,且會使FRP之回收性降低。另一方面,環氧樹脂(C)之摻配量若未達5重量份,則無法獲得摻配環氧樹脂的效果,基質樹脂組成物之硬化物難以展現160℃以上之玻璃轉移溫度(Tg)。 The epoxy resin (C) can be blended so as to be 5 to 85 parts by weight with respect to 100 parts by weight of the phenoxy resin (A). Preferably it is 9 to 83 parts by weight, more preferably 10 to 70 parts by weight. If the compounding amount of the epoxy resin (C) exceeds 85 parts by weight, it will take time to harden the epoxy resin, so the required strength for demoulding cannot be obtained in a short time, and the recyclability of FRP will be reduced. On the other hand, if the blending amount of the epoxy resin (C) is less than 5 parts by weight, the effect of blending the epoxy resin cannot be obtained, and it is difficult for the cured product of the matrix resin composition to exhibit a glass transition temperature (Tg) of 160°C or higher. ).

交聯劑(D)只要為與苯氧基樹脂側鏈之2級羥基反應並形成三維交聯構造者,則可為酸二酐或異氰酸酯化合物、己內醯胺等而無特別限定,因有過度進行交聯反應、或交聯距離變短使樹脂組成物容易凝膠化之虞,故較佳為併用環氧樹脂(C)。 The cross-linking agent (D) is not particularly limited as long as it reacts with the secondary hydroxyl group of the side chain of the phenoxy resin to form a three-dimensional cross-linked structure. It is preferable to use an epoxy resin (C) in combination because the crosslinking reaction proceeds excessively or the crosslinking distance becomes short and the resin composition is likely to be gelled.

因此,較佳為具有與環氧樹脂(C)的反應性且為多官能體之酸二酐。尤其焦蜜石酸酐或4,4‘-氧雙鄰苯二甲酸酐、雙酚A雙鄰苯二甲酸酐(BisDA)等芳香族酸二酐,其反應點較多且可提高交聯密度,使交聯硬化物之Tg大幅提高,故為特佳。 Therefore, an acid dianhydride which has reactivity with an epoxy resin (C) and is a polyfunctional body is preferable. In particular, aromatic acid dianhydrides such as pyromelite anhydride or 4,4'-oxydiphthalic anhydride, bisphenol A diphthalic anhydride (BisDA) have many reaction points and can increase the crosslinking density. The Tg of the cross-linked hardened product can be greatly increased, so it is especially good.

交聯劑(D)之摻配量通常為相對於苯氧基樹脂(A)之2級羥基1莫耳為酸酐基0.6至1.3莫耳之範圍。較佳為0.9至1.3莫耳之範圍,更佳為0.9至1.1莫耳之範圍。酸酐基量若過少,則相對於苯氧基樹脂(A)之2級羥基,反應性酸酐基不足,故交聯密度低且剛性較差,酸酐基量若過多,則酸酐相對於苯氧基樹脂(A)之2級羥基會過剩,未反應酸酐會對硬化特性或交聯密度造成不良影響。又,考量併存有藉由交聯劑之酸酐基(COOH)而直接使苯氧基樹脂交聯、及透過環氧樹脂使苯氧基樹脂交聯等2種類形態,交聯劑之COOH會被苯氧基樹脂之2級OH及環氧樹脂之環氧基所消耗,故推測硬化物中幾乎無COOH殘留。 The blending amount of the crosslinking agent (D) is usually in the range of 0.6 to 1.3 moles of acid anhydride groups relative to 1 mole of secondary hydroxyl groups of the phenoxy resin (A). It is preferably in the range of 0.9 to 1.3 mol, more preferably in the range of 0.9 to 1.1 mol. If the amount of acid anhydride groups is too small, the reactive acid anhydride groups will be insufficient relative to the secondary hydroxyl groups of the phenoxy resin (A), so the crosslinking density will be low and the rigidity will be poor. A) The secondary hydroxyl group will be excessive, and the unreacted acid anhydride will adversely affect the hardening properties and crosslinking density. Also, considering that there are two forms of crosslinking the phenoxy resin directly through the acid anhydride group (COOH) of the crosslinking agent and crosslinking the phenoxy resin through the epoxy resin, the COOH of the crosslinking agent will be The secondary OH of phenoxy resin and the epoxy group of epoxy resin are consumed, so it is speculated that almost no COOH remains in the hardened product.

如為苯氧基樹脂(A)及聚碳酸酯樹脂(B-2)或芳香族聚酯樹脂(B-3)所構成之組成物時,雖皆為熱塑性樹脂,但藉由將樹脂組成物加熱至280℃以上,例如280至320℃,較佳為280至300℃之範圍之溫度,藉此可進行不可逆硬化,其後可顯示幾乎不熔的特徵行為。 If it is a composition composed of phenoxy resin (A), polycarbonate resin (B-2) or aromatic polyester resin (B-3), although they are all thermoplastic resins, by mixing the resin composition Heating to a temperature above 280°C, such as 280 to 320°C, preferably in the range of 280 to 300°C, enables irreversible hardening and thereafter exhibits a characteristic behavior of being almost infusible.

此時的硬化機制仍不明確,但推測是苯氧基樹脂中所含的主要為2級羥基與聚碳酸酯樹脂或芳香族聚酯樹脂之酯基之間產生酯交換反應,在2官能型環氧樹脂鏈或苯氧基樹脂鏈與聚碳酸酯樹脂鏈之間形成交聯,而形成三維網絡構造並硬化。 The hardening mechanism at this time is still unclear, but it is speculated that there is a transesterification reaction between the mainly secondary hydroxyl contained in the phenoxy resin and the ester group of the polycarbonate resin or aromatic polyester resin. The epoxy resin chains or phenoxy resin chains are cross-linked with the polycarbonate resin chains to form a three-dimensional network structure and harden.

本發明之纖維強化塑膠材料之基質樹脂組成物可在不損及其效果之範圍內摻配其他熱塑性樹脂或熱硬化性樹脂、以及有機溶媒、交聯劑、無機填料、體質顏料、著色劑、抗氧化劑、抗紫外線劑、阻燃劑、阻燃助劑等。 The matrix resin composition of the fiber-reinforced plastic material of the present invention can be blended with other thermoplastic resins or thermosetting resins, as well as organic solvents, crosslinking agents, inorganic fillers, extender pigments, colorants, Antioxidants, anti-ultraviolet agents, flame retardants, flame retardant additives, etc.

本發明亦包括將本發明之樹脂組成物含浸於強化纖維基材作成基質樹脂之強化纖維塑膠成形材料(以下稱為「預浸體」)。 The present invention also includes a fiber-reinforced plastic molding material (hereinafter referred to as "prepreg") in which the resin composition of the present invention is impregnated into a fiber-reinforced substrate to form a matrix resin.

含浸成為基質樹脂組成物之樹脂組成物之強化纖維基材的材質並無特別限制,例如可使用碳纖維、玻璃纖維、芳綸纖維、氧化鋁纖維、硼纖維、金屬纖維、玄武岩纖維等無機或有機纖維,該等可使用1種或併用2種以上。其中以比強度、比剛性較高且具輕量化效果之觀點來看,較佳為使用PAN系、瀝青系之碳纖維。 The material of the reinforcing fiber substrate impregnated into the resin composition of the matrix resin composition is not particularly limited, for example, carbon fiber, glass fiber, aramid fiber, alumina fiber, boron fiber, metal fiber, basalt fiber and other inorganic or organic fibers can be used. Fiber, these can be used 1 type or in combination of 2 or more types. Among them, it is preferable to use PAN-based and pitch-based carbon fibers from the viewpoint of high specific strength and specific rigidity and light weight effect.

又,強化纖維可為連續纖維所構成單方向強化纖維基材、或平織、斜紋織等布材、或不連續強化纖維所構成之不織布。一般回彈現象在使用不連續強化纖維,例如使用短纖維之不織布基材時較為顯著,但使用連續纖維之基材在積層大量預浸體並進行加壓成形時等,也會產生與不織布基材相同的回彈現象。 In addition, the reinforcing fiber can be a unidirectional reinforcing fiber substrate composed of continuous fibers, or a fabric such as plain weave or twill weave, or a non-woven fabric composed of discontinuous reinforcing fibers. Generally, the rebound phenomenon is more obvious when discontinuous reinforcing fibers are used, such as non-woven fabric substrates with short fibers, but when continuous fiber substrates are used to laminate a large number of prepregs and perform press molding, etc. The same springback phenomenon as the material.

強化纖維基材之上漿處理可為任意。本發明之樹脂組成物與強化纖維的親和性良好,故即使不進行上漿處理,也可使基質樹脂與強化纖維緊固接著,但可使用配合所摻配樹脂種類以最佳上漿劑處理之強化纖維基材。 The sizing treatment of the reinforcing fiber substrate may be optional. The resin composition of the present invention has good affinity with reinforcing fibers, so even without sizing treatment, the matrix resin and reinforcing fibers can be firmly bonded, but it can be treated with an optimal sizing agent according to the type of resin to be blended. The reinforced fiber base material.

本發明之FRP成形用材料可使用公知方法於強化纖維基材附著或含浸成為基質樹脂之樹脂組成物,但此時較佳為使用不使用溶劑之方法。 The material for FRP molding of the present invention can be attached or impregnated with a resin composition as a matrix resin on a reinforcing fiber base material by a known method, but in this case, it is preferable to use a method that does not use a solvent.

如此方法可列舉例如以下方法:於連續纖維所構成之強化纖維基材熔融含浸經膜化的樹脂組成物的方法(壓入法、膜堆疊法);將樹脂組成物紡成之連續纖維與強化纖維進行混織之方法(混合法);或將粉末化之樹脂組成物撒布/塗布於 強化纖維基材中之方法(粉末塗層法、粉體塗布法)。其中混合法及粉末塗層法在製作FRP成形用材料時強化纖維不易折損,且具有柔軟性及通氣性,故即使積層多層也可獲得不易產生內部氣泡之FRP成形用材料,故為更佳方法。 Such methods include, for example, the following methods: a method of impregnating a film-formed resin composition by melting and impregnating a reinforcing fiber base material composed of continuous fibers (press-in method, film stacking method); continuous fibers spun from a resin composition and reinforcement The method of blending fibers (mixing method); or spreading/coating powdered resin composition on Methods in reinforcing fiber substrates (powder coating method, powder coating method). Among them, the mixing method and the powder coating method are the better methods when the reinforcing fibers are not easily broken when making FRP molding materials, and have flexibility and air permeability. Therefore, even if multiple layers are laminated, FRP molding materials that are less likely to generate internal air bubbles can be obtained. .

又,強化纖維為短纖維時可列舉以下方法:於加工為不織布狀態之強化纖維基材中,使樹脂組成物含浸成粉末或熔融狀態作為乳液之方法;或一邊將短纖維及樹脂組成物之粉末或短纖維一起攪拌混合,一邊堆積或集合以作成預浸體之方法。 In addition, when the reinforcing fibers are short fibers, the following methods can be mentioned: the method of impregnating the resin composition into a powder or molten state as an emulsion in the reinforcing fiber substrate processed into a non-woven state; or mixing the short fibers and the resin composition together. The powder or short fibers are stirred and mixed together, and piled up or assembled to make a prepreg.

使用本發明之熱塑性樹脂組成物的FRP成形用材料中,基質樹脂之附著量(樹脂比率:RC)以重量比為20至50%,較佳為25至45%,更佳為25至40%。RC若超過50%,則FRP之拉伸、彎曲彈性模數等機械物性會降低,若低於10%,則樹脂附著量極少,故在基材內部的基質樹脂含浸不足,會有熱物性及機械物性降低之虞。 In the FRP molding material using the thermoplastic resin composition of the present invention, the adhesion amount of the matrix resin (resin ratio: RC) is 20 to 50% by weight, preferably 25 to 45%, more preferably 25 to 40% . If RC exceeds 50%, the mechanical properties such as tensile and flexural modulus of FRP will decrease. If it is less than 10%, the amount of resin adhesion is very small, so the matrix resin in the base material is not impregnated enough, and there will be thermal and physical properties. There is a risk of degradation of mechanical properties.

使用本發明之熱塑性樹脂組成物之FRP成形用材料可單獨或積層複數層,藉由加熱且加壓而可簡便地製造FRP成形物。亦即,藉由熱壓所進行的加壓成形,而可同時進行賦型及基質樹脂對強化纖維基材的完全含浸。使用FRP成形用材料之成形只要為加熱加壓成形,則可配合目的之FRP成形物之大小或形狀,而適當地選擇高壓釜成形或使用模具之熱壓成形等各種成形法而實施。 The FRP molding material using the thermoplastic resin composition of the present invention can be used alone or in multiple layers, and an FRP molding can be easily produced by heating and pressing. That is, by press molding by hot pressing, shaping and complete impregnation of the reinforcing fiber base material with the matrix resin can be performed simultaneously. As long as the molding using FRP molding materials is heating and press molding, various molding methods such as autoclave molding or hot press molding using molds can be appropriately selected according to the size or shape of the desired FRP molding.

加熱加壓成形的成形溫度例如為160至260℃,較佳為180℃至250℃,更佳為180℃至240℃。成形溫度若超過上限溫度,則會施加必要以上之過剩的熱,故有樹脂過剩流出或熱劣化之虞,此外升溫或冷卻需要時間,故成形時間(節拍時間)會變長且生產性變差。另一方面,若低於下限溫度,則基質樹脂 之熔融黏度較高,故對強化纖維基材之基質樹脂的含浸性變差。成形時間通常可進行30至60分鐘。 The forming temperature of heating and pressing forming is, for example, 160 to 260°C, preferably 180°C to 250°C, more preferably 180°C to 240°C. If the molding temperature exceeds the upper limit temperature, excess heat will be applied more than necessary, so there is a risk of excess outflow of resin or thermal deterioration. In addition, it takes time to heat up or cool down, so the molding time (takt time) will become longer and the productivity will deteriorate. . On the other hand, if it is lower than the lower limit temperature, the matrix resin The melt viscosity is high, so the impregnation of the matrix resin of the reinforced fiber substrate becomes poor. Forming times can generally be performed for 30 to 60 minutes.

由本發明之纖維強化塑膠成形材料所獲得的FRTP成形體即使承受近300℃的熱也幾乎不會變形,並大幅提高高溫的剛性,故不僅發熱較大的電氣電子機器用的殼體或零件,亦適用作為引擎蓋等需要高耐熱性之汽車或產業機器用的成形零件。 The FRTP molded body obtained from the fiber-reinforced plastic molding material of the present invention will hardly deform even if it is subjected to heat of nearly 300°C, and the rigidity at high temperature is greatly improved. It is also suitable as molded parts for automobiles or industrial machines that require high heat resistance, such as hoods.

[實施例] [Example]

以下以實施例進一步具體說明本發明,但本發明並不限定於該等實施例。又,實施例及比較例中的各種物性之試驗及測定方法如下。 The present invention will be further specifically described below with examples, but the present invention is not limited to these examples. In addition, the test and measurement methods of various physical properties in Examples and Comparative Examples are as follows.

平均粒徑(D50) Average particle size (D50)

平均粒徑是藉由雷射繞射/散射式粒徑分佈測定裝置(microtrac MT3300EX,日機裝製)以體積基準測定累積體積成為50%時的粒徑。 The average particle diameter is the particle diameter when the cumulative volume becomes 50% measured on a volume basis with a laser diffraction/scattering type particle size distribution measuring device (microtrac MT3300EX, manufactured by Nikkiso).

熔融黏度 Melt viscosity

(ρ 220≧、ρ min之測定) (measurement of ρ 220 ≧, ρ min )

使用流變儀(AntonPaar公司製)將加工成四邊150mm且厚度為0.4mm之膜狀的基質樹脂用組成物(MT樹脂)夾於平行板,一邊以5℃/min升溫且接著降溫,一邊以頻率1Hz、負荷應變0.2%之條件測定從室溫升溫至280℃時及從280℃降溫至70℃時的MT樹脂的各種熔融黏度。 Using a rheometer (manufactured by Anton Paar Co., Ltd.), the composition for matrix resin (MT resin) processed into a film with four sides of 150 mm and a thickness of 0.4 mm was sandwiched between parallel plates, and the temperature was raised at 5° C./min and then lowered. Under the conditions of frequency 1Hz and load strain 0.2%, various melt viscosities of MT resin were measured when the temperature was raised from room temperature to 280°C and when the temperature was lowered from 280°C to 70°C.

表1中,「ρ 220≧」表示降溫時220℃以下之溫度區域中的熔融黏度之最小值,「ρ(220+)」表示從室溫升溫至280℃時,在到達220℃時之熔融黏度,「ρ min」表示升溫時的熔融黏度之最小值。 In Table 1, " ρ 220 ≧" indicates the minimum value of the melt viscosity in the temperature range below 220°C when the temperature is lowered, and " ρ ( 220+ )" indicates the melting point at 220°C when the temperature is raised from room temperature to 280°C Viscosity, " ρ min " indicates the minimum value of the melt viscosity when the temperature rises.

(ρ Tg+100ρ Tm-5之測定) (Determination of ρ Tg+100 and ρ Tm-5 )

使用流變儀(AntonPaar公司製)將預浸體壓製成形加工時滲出的基質樹脂用組成物的粉碎物約100mg夾於平行板,一邊以5℃/min升溫,一邊以頻率1Hz、負荷應變0.2%之條件測定從室溫升溫至280℃時的各種熔融黏度。 Using a rheometer (manufactured by Anton Paar Co., Ltd.), about 100 mg of the pulverized material of the matrix resin composition exuded during prepreg compression molding was sandwiched between parallel plates, and the temperature was raised at 5°C/min while the frequency was 1 Hz and the load strain was 0.2 % conditions to measure the various melt viscosities when the temperature rises from room temperature to 280°C.

表1中,「ρ(Tg+100)」表示在作成樹脂組成物的主成分之樹脂之玻璃轉移點+100℃的熔融黏度,「ρ(Tm-5)」表示在成為樹脂組成物的主成分之樹脂之熔點-5℃的熔融黏度。 In Table 1, " ρ ( Tg+100 )" represents the melt viscosity at +100°C of the glass transition point of the resin constituting the main component of the resin composition, and " ρ ( Tm-5 )" represents the melt viscosity at the temperature of the main component of the resin composition. The melt viscosity of the resin whose melting point is -5°C.

反應性之確認 confirmation of reactivity

使用流變儀(AntonPaar公司製)將粉末狀基質樹脂用組成物(MT樹脂)夾於平行板,一邊以5℃/min升溫至280℃其後在280℃保持30分鐘,一邊以頻率1Hz、負荷應變0.2%之條件測定MT樹脂之熔融黏度。表1所示測定結果(△ρ)的範例如下。又,基準熔融黏度為到達280℃之時間點的熔融黏度。 Using a rheometer (manufactured by Anton Paar Co., Ltd.), the powder matrix resin composition (MT resin) was sandwiched between parallel plates, and the temperature was raised to 280° C. at 5° C./min and then kept at 280° C. for 30 minutes. The melt viscosity of MT resin was measured under the condition of 0.2% load strain. Examples of the measurement results ( Δρ ) shown in Table 1 are as follows. In addition, the reference|standard melt viscosity is the melt viscosity at the time point which reached 280 degreeC.

◎:在280℃保持期間中確認到熔融黏度上升5倍以上。 ⊚: Increase in melt viscosity by 5 times or more was confirmed during the holding period at 280°C.

○:在280℃保持期間中確認到熔融黏度上升2倍以上。 ◯: During the holding period at 280° C., an increase in the melt viscosity was confirmed to be 2 times or more.

△:在280℃保持期間中確認到熔融黏度上升未達2倍。 Δ: During the holding period at 280° C., a rise in melt viscosity was not confirmed to be 2 times.

×:在280℃保持期間中熔融黏度幾乎沒有上升。 X: There was almost no rise in the melt viscosity during the holding period at 280°C.

玻璃轉移溫度(Tg) Glass transition temperature (Tg)

將基質樹脂用組成物以模具壓縮成形,使用鑽石切割機裁切為厚度2mm、直徑6mm的尺寸之試驗片。試驗片係使用動態黏彈性測定裝置(Perkin Elmer製DMA7e)以5℃/分鐘之升溫條件在25至280℃之範圍測定,以所獲得的tan δ之極大波峰為玻璃轉移點。 The matrix resin composition was compression-molded with a mold, and cut into test pieces with a thickness of 2 mm and a diameter of 6 mm using a diamond cutter. The test piece was measured using a dynamic viscoelasticity measuring device (DMA7e manufactured by Perkin Elmer) in the range of 25 to 280°C at a temperature increase of 5°C/min, and the maximum peak of tan δ obtained was taken as the glass transition point.

熔點(Tm) Melting point (Tm)

根據JIS K 7121:1987塑膠之轉移溫度測定方法,使用示差掃描熱析儀(DSC)測定。 According to the JIS K 7121:1987 method for measuring the transition temperature of plastics, it is measured using a differential scanning calorimeter (DSC).

回彈(S/B)性評價 Springback (S/B) evaluation

以在大氣烘箱中接受200℃、30分鐘之熱歷程後的成形品與25℃的成形品的厚度變化量,而判定成形品的回彈。 The springback of the molded product is determined by the amount of thickness change between the molded product after receiving a heat history at 200°C for 30 minutes and the molded product at 25°C in an atmospheric oven.

厚度測定係使用以測微計進行3處測定的平均值,用下述式計算回彈量。 The thickness measurement uses the average value measured at three places with a micrometer, and the springback amount is calculated by the following formula.

S/B量(%)=熱歷程後之成形體尺寸厚度/25℃之成形體厚度×100。 S/B amount (%)=dimension thickness of molded body after heat history/thickness of molded body at 25°C×100.

FRP彎曲試驗 FRP bending test

根據JIS K 7074:1988纖維強化塑膠之彎曲試驗方法測定所獲得的金屬-FRP複合體之機械物性(彎曲強度及彎曲彈性模數)。 The mechanical properties (bending strength and flexural modulus) of the obtained metal-FRP composite were measured according to JIS K 7074:1988 Bending test method for fiber reinforced plastics.

以成形後厚度成為1.0mm之方式積層FRP成形用材料,並以各實施例、比較例所示條件進行熱壓接。接著使用鑽石切割機調整為寬度15mm、長度60mm,藉此製作彎曲試驗用FRP複合體的樣品。 FRP molding materials were laminated so that the thickness after molding became 1.0 mm, and thermocompression bonding was performed under the conditions shown in the respective examples and comparative examples. Next, a sample of the FRP composite body for a bending test was produced by adjusting the width to 15 mm and the length to 60 mm using a diamond cutter.

又,作為測定時的前處理,將樣品於設定為220℃之大氣烘箱靜置10min後,取出並放冷至室溫。 Also, as a pretreatment during the measurement, the sample was left to stand in an atmospheric oven set at 220° C. for 10 minutes, then taken out and left to cool to room temperature.

負載變形溫度之測定 Determination of load deflection temperature

參考JIS K 7191塑膠-負載變形溫度之求取方法,測定成為試驗片之纖維強化塑膠之負載變形溫度。 Refer to JIS K 7191 Plastics - Calculation method of load deflection temperature, and measure the load deflection temperature of the fiber-reinforced plastic used as the test piece.

構成熱塑性樹脂組成物之樹脂成分係如下所示。 The resin components constituting the thermoplastic resin composition are as follows.

苯氧基樹脂(A) Phenoxy resin (A)

Phenotote YP-50S(新日鐵住金化學製,雙酚A型,Mw=40,000,羥基當量=284g/eq),250℃的熔融黏度=90Pa.s。 Phenotote YP-50S (manufactured by Nippon Steel & Sumitomo Metal Chemicals, bisphenol A type, Mw=40,000, hydroxyl equivalent=284g/eq), melt viscosity at 250°C=90Pa. s.

聚醯胺樹脂(B-1) Polyamide resin (B-1)

CM1017(TORAY製,聚醯胺6),250℃的熔融黏度=125Pa.s,Tm=225℃。 CM1017 (manufactured by TORAY, polyamide 6), melt viscosity at 250°C = 125Pa. s, Tm=225°C.

聚碳酸酯樹脂(B-2) Polycarbonate resin (B-2)

Iupilon S3000F(三菱工程塑膠股份有限公司製,Mw=36,000),280℃的熔融黏度=1,000Pa.s,Tg=160℃,Tm=230至260℃。 Iupilon S3000F (manufactured by Mitsubishi Engineering Plastics Co., Ltd., Mw=36,000), melt viscosity at 280°C=1,000Pa. s, Tg=160°C, Tm=230 to 260°C.

芳香族聚酯樹脂(B-3) Aromatic polyester resin (B-3)

NEH-2070(UNITIKA公司製,聚對苯二甲酸乙二酯),270℃的熔融黏度=914Pa.s,Tg=77℃,Tm=250℃。 NEH-2070 (manufactured by UNITIKA, polyethylene terephthalate), melt viscosity at 270° C. = 914 Pa. s, Tg=77°C, Tm=250°C.

環氧樹脂(C) Epoxy resin (C)

YSLV-80XY(新日鐵住金化學股份有限公司製,四甲基雙酚F型,環氧基當量=192,Tm=72℃)。 YSLV-80XY (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., tetramethylbisphenol F type, epoxy group equivalent=192, Tm=72°C).

交聯劑(D) Cross-linking agent (D)

BisDA(雙酚A,雙鄰苯二甲酸酐,酸酐當量:260,熔點:184℃,SABIC公司)。 BisDA (bisphenol A, diphthalic anhydride, acid anhydride equivalent: 260, melting point: 184°C, SABIC).

製作例1 Production example 1

準備50重量份之YP-50S及50重量份之S3000F,分別將其粉碎並分級,而形成平均粒徑D50為100μm以下之粉體,將該粉體以乾式粉體混合機進行乾摻,藉此調製樹脂組成物E1。 Prepare 50 parts by weight of YP-50S and 50 parts by weight of S3000F, crush and classify them respectively to form a powder with an average particle diameter D50 of 100 μm or less, and dry blend the powder with a dry powder mixer , thereby preparing the resin composition E1.

製作例2 Production example 2

準備77重量份之YP-50S及23重量份之YSLV-80XY,分別將其粉碎並分級,而形成平均粒徑D50為100μm以下之粉體,在該粉體中將BisDA以相對 於YP-50S之羥基當量成為1.0當量之方式摻配,使用乾式粉體混合機進行乾摻,藉此調製樹脂組成物E2。 Prepare 77 parts by weight of YP-50S and 23 parts by weight of YSLV-80XY, which are respectively pulverized and classified to form a powder with an average particle diameter D50 of 100 μm or less. In this powder, BisDA is compared to YP -50S was blended so that the hydroxyl equivalent of 50S became 1.0 equivalent, and dry blended using a dry powder mixer to prepare resin composition E2.

製作例3 Production example 3

準備50重量份之YP-50S及50重量份之CM1017,分別將其粉碎並分級,而形成平均粒徑D50為100μm以下之粉體,將該粉體以乾式粉體混合機(愛知電氣公司製Rocking Mixer)進行乾摻,藉此調製樹脂組成物E3。 Prepare 50 parts by weight of YP-50S and 50 parts by weight of CM1017, pulverize and classify them respectively, and form a powder with an average particle diameter D50 of 100 μm or less, and dry the powder with a dry powder mixer (Aichi Electric Co., Ltd. Resin composition E3 was prepared by dry blending with Rocking Mixer manufactured by the company.

製作例4 Production example 4

準備70重量份之YP-50S及30重量份之NEH-2070,分別將其粉碎並分級,而形成平均粒徑D50為100μm以下之粉體,將該粉體以乾式粉體混合機(愛知電氣公司製Rocking Mixer)進行乾摻,藉此調製樹脂組成物E4。 Prepare 70 parts by weight of YP-50S and 30 parts by weight of NEH-2070, pulverize and classify them respectively, and form a powder whose average particle diameter D50 is below 100 μm , and use the powder in a dry powder mixer ( Aichi Electric Co., Ltd. Rocking Mixer) was dry blended to prepare resin composition E4.

實施例1 Example 1

準備基質用樹脂之樹脂組成物E1之短纖維狀樹脂纖維(纖維徑29μm,平均纖維長50mm)、及作為強化纖維之短纖維狀碳纖維(三菱化學公司製TR50S,纖維徑7μm,平均纖維長50mm),混合比率為50/50。將該等混合者投入於前處理機,經過前處理步驟後,投入梳棉機,製作樹脂組成物E2之短纖維狀樹脂纖維及短纖維狀碳纖維均一混合的網。將該網以針扎法交織成一體,製作成厚度7mm之複合墊所構成之CFRP預浸體。 Short fibrous resin fibers (fiber diameter 29 μm , average fiber length 50 mm) and short fibrous carbon fibers (TR50S manufactured by Mitsubishi Chemical Corporation, fiber diameter 7 μm , The average fiber length is 50mm), and the mixing ratio is 50/50. These blenders are put into a pre-processing machine, and after the pre-treatment step, they are put into a carding machine to make a web in which short-fibrous resin fibers and short-fibrous carbon fibers of the resin composition E2 are uniformly mixed. The mesh was interwoven into one body by needle-punching to make a CFRP prepreg composed of a composite mat with a thickness of 7 mm.

重疊積層5片所獲得的CFRP預浸體,在加熱至280℃之壓製機以5MPa壓製10分鐘,藉此製作CFRP成形體。 The CFRP prepreg obtained by stacking 5 sheets was pressed in a press machine heated to 280° C. at 5 MPa for 10 minutes to produce a CFRP molded body.

實施例2 Example 2

將製作例1所獲得的樹脂組成物E1以去除上漿劑之SA3202(SAKAI OVEX股份有限公司製,平織之解纖碳纖維布材)作為強化纖維基材,在靜電場中以電 荷60kV、吹氣空氣量60L/min之條件以成形後之Vf成為60%之方式進行粉體塗布。其後用烘箱以250℃加熱熔融3分鐘,使樹脂組成物熱熔接於碳纖維,而製作厚度為0.9mm、樹脂比率(RC)為30%之CFRP預浸體。 The resin composition E1 obtained in Production Example 1 was used as a reinforcing fiber base material to remove the sizing agent SA3202 (manufactured by SAKAI OVEX Co., Ltd., flat-woven defiberized carbon fiber cloth), and was charged with an electric charge in an electrostatic field. Under the conditions of load 60kV and blowing air volume 60L/min, powder coating was performed so that Vf after molding became 60%. Thereafter, heat and melt in an oven at 250°C for 3 minutes to thermally fuse the resin composition to the carbon fibers to produce a CFRP prepreg with a thickness of 0.9 mm and a resin ratio (RC) of 30%.

將所獲得的CFRP預浸體在加熱至280℃之壓製機以5MPa壓製10分鐘,藉此製作CFRP成形體。 The obtained CFRP prepreg was pressed at 5 MPa for 10 minutes in a press machine heated to 280° C., thereby producing a CFRP molded body.

實施例3 Example 3

準備作為基質用樹脂之製作例2所獲得的樹脂組成物E2、及利用作為強化纖維之回收碳纖維(Ai-Carbon股份有限公司製,平均纖維長50mm)以針扎法所製作之短纖維狀碳纖維基材(單位面積重量400g/m2),使用粉體塗布裝置以電荷60kV、吹氣空氣量60L/min之條件以成形後之Vf成為60%之方式進行粉體塗布。其後用烘箱以250℃加熱熔融3分鐘,使樹脂組成物熱熔接於碳纖維,而製作厚度7mm之複合墊所構成之CFRP預浸體。 Prepare the resin composition E2 obtained in Production Example 2 of resin for matrix, and short fibrous carbon fibers produced by needle-punching using recycled carbon fibers (manufactured by Ai-Carbon Co., Ltd., average fiber length: 50 mm) as reinforcing fibers The base material (weight per unit area: 400g/m 2 ) was powder-coated using a powder coating device so that the Vf after molding would be 60% under the conditions of a charge of 60kV and a blowing air volume of 60L/min. Thereafter, heat and melt in an oven at 250° C. for 3 minutes to thermally fuse the resin composition to the carbon fiber, and produce a CFRP prepreg composed of a composite mat with a thickness of 7 mm.

重疊積層5片所獲得的CFRP預浸體,在加熱至240℃之壓製機以5MPa壓製10分鐘,藉此製作CFRP成形體。 The CFRP prepreg obtained by stacking five sheets was pressed in a press machine heated to 240° C. at 5 MPa for 10 minutes to produce a CFRP molded body.

實施例4 Example 4

將製作例2所獲得的樹脂組成物E2以去除上漿劑之SA3202作為強化纖維基材,在靜電場中以電荷60kV、吹氣空氣量60L/min之條件以成形後之Vf成為60%之方式進行粉體塗布。其後用烘箱以250℃加熱熔融3分鐘,使樹脂組成物熱熔接於碳纖維,而製作厚度為0.9mm、樹脂比率(RC)為30%之CFRP預浸體。 The resin composition E2 obtained in Production Example 2 was made of SA3202 without the sizing agent as the reinforcing fiber substrate, and the Vf after molding was 60% under the conditions of charge 60kV and blowing air volume 60L/min in the electrostatic field. method for powder coating. Thereafter, heat and melt in an oven at 250°C for 3 minutes to thermally fuse the resin composition to the carbon fibers to produce a CFRP prepreg with a thickness of 0.9 mm and a resin ratio (RC) of 30%.

將所獲得的CFRP預浸體在加熱至200℃之壓製機以5MPa壓製10分鐘,藉此製作CFRP成形體。 The obtained CFRP prepreg was pressed at 5 MPa for 10 minutes in a press machine heated to 200° C., thereby producing a CFRP molded body.

實施例5 Example 5

製作例1所獲得的樹脂組成物E1以去除上漿劑之SA3202作為強化纖維基材,在靜電場中以電荷60kV、吹氣空氣量60L/min之條件以成形後之Vf成為60%之方式進行粉體塗布。其後用烘箱以250℃加熱熔融3分鐘,使樹脂組成物熱熔接於碳纖維,而製作厚度為0.9mm、樹脂比率(RC)為30%之CFRP預浸體。 The resin composition E1 obtained in production example 1 uses SA3202 without sizing agent as the reinforcing fiber base material, and the Vf after molding becomes 60% under the conditions of charge 60kV and blowing air volume 60L/min in an electrostatic field Perform powder coating. Thereafter, heat and melt in an oven at 250°C for 3 minutes to thermally fuse the resin composition to the carbon fibers to produce a CFRP prepreg with a thickness of 0.9 mm and a resin ratio (RC) of 30%.

將所獲得的CFRP預浸體在加熱至280℃之壓製機以5MPa壓製10分鐘,藉此製作CFRP成形體。將所獲得的CFRP成形體X1冷卻後,測定機械性強度(破裂點應力及彈性模數)。其結果示於表1。 The obtained CFRP prepreg was pressed at 5 MPa for 10 minutes in a press machine heated to 280° C., thereby producing a CFRP molded body. After cooling the obtained CFRP molded body X1, the mechanical strength (stress at rupture point and modulus of elasticity) was measured. The results are shown in Table 1.

實施例6 Example 6

製作例4所獲得的樹脂組成物E4以去除上漿劑之SA3202作為強化纖維基材,在靜電場中以電荷60kV、吹氣空氣量60L/min之條件以成形後之Vf成為60%之方式進行粉體塗布。其後用烘箱以270℃加熱熔融3分鐘,使樹脂組成物熱熔接於碳纖維,而製作厚度為0.9mm、樹脂比率(RC)為30%之CFRP預浸體。 The resin composition E4 obtained in production example 4 uses SA3202 without sizing agent as the reinforcing fiber base material, and the Vf after molding becomes 60% under the conditions of charge 60kV and blowing air volume 60L/min in an electrostatic field Perform powder coating. Thereafter, heat and melt the resin composition at 270°C for 3 minutes in an oven to thermally fuse the resin composition to the carbon fibers to produce a CFRP prepreg with a thickness of 0.9 mm and a resin ratio (RC) of 30%.

將所獲得的CFRP預浸體在加熱至270℃之壓製機以2MPa壓製15分鐘,藉此製作CFRP成形體。將所獲得的CFRP成形體X1冷卻後,測定機械性強度(破裂點應力及彈性模數)。其結果示於表1。 The obtained CFRP prepreg was pressed in a press machine heated to 270° C. at 2 MPa for 15 minutes to produce a CFRP molded body. After cooling the obtained CFRP molded body X1, the mechanical strength (stress at rupture point and modulus of elasticity) was measured. The results are shown in Table 1.

比較例1 Comparative example 1

單獨使用以D50成為100μm以下之方式粉碎並分級之YP-50S,除此之外以與實施例1相同方式而製作厚度為0.9mm、樹脂比率(RC)為30%之CFRP預浸體。 A CFRP prepreg having a thickness of 0.9 mm and a resin ratio (RC) of 30% was produced in the same manner as in Example 1 except that YP-50S crushed and classified so that D50 became 100 μm or less was used alone.

將所獲得的CFRP預浸體在加熱至280℃之壓製機以5MPa壓製10分鐘,藉此製作CFRP成形體。將所獲得的CFRP成形體X1冷卻後,測定機械性強度(破裂點應力及彈性模數)。其結果示於表1。 The obtained CFRP prepreg was pressed at 5 MPa for 10 minutes in a press machine heated to 280° C., thereby producing a CFRP molded body. After cooling the obtained CFRP molded body X1, the mechanical strength (stress at rupture point and modulus of elasticity) was measured. The results are shown in Table 1.

比較例2 Comparative example 2

將以D50成為100μm以下之方式粉碎並分級之YP-50S以去除上漿劑之SA3202作為強化纖維基材,在靜電場中以電荷60kV、吹氣空氣量60L/min之條件以成形後之Vf成為60%之方式進行粉體塗布。其後用烘箱以250℃加熱熔融3分鐘,使樹脂組成物熱熔接於碳纖維,而製作厚度為0.9mm、樹脂比率(RC)為30%之CFRP預浸體。 YP-50S crushed and classified so that D50 becomes less than 100 μm and SA3202 with sizing agent removed are used as reinforcing fiber base material, and the Vf after molding is determined under the conditions of charge 60kV and blowing air volume 60L/min in an electrostatic field 60% of the way to powder coating. Thereafter, heat and melt in an oven at 250°C for 3 minutes to thermally fuse the resin composition to the carbon fibers to produce a CFRP prepreg with a thickness of 0.9 mm and a resin ratio (RC) of 30%.

將所獲得的CFRP預浸體在加熱至280℃之壓製機以5MPa壓製10分鐘,藉此製作CFRP成形體。將所獲得的CFRP成形體X1冷卻後,測定機械性強度(破裂點應力及彈性模數)。其結果示於表1。 The obtained CFRP prepreg was pressed at 5 MPa for 10 minutes in a press machine heated to 280° C., thereby producing a CFRP molded body. After cooling the obtained CFRP molded body X1, the mechanical strength (stress at rupture point and modulus of elasticity) was measured. The results are shown in Table 1.

比較例3 Comparative example 3

取代樹脂組成物E2而單獨使用以D50成為100μm以下之方式粉碎並分級之CM1017,除此之外以與實施例2相同方式而製作樹脂比率(RC)為30%之CFRTP預浸體及CFRTP成形體,測定機械性強度(破裂點應力及彈性模數)。 In place of resin composition E2, except that CM1017 pulverized and classified so that D50 becomes 100 μm or less was used alone, a CFRTP prepreg with a resin ratio (RC) of 30% was produced in the same manner as in Example 2 and For the CFRTP molded body, the mechanical strength (stress at rupture point and modulus of elasticity) was measured.

[表1]

Figure 111102622-A0202-12-0025-1
[Table 1]
Figure 111102622-A0202-12-0025-1

由表1所示結果可知,相較於單獨使用構成材料的情形,以本發明之樹脂組成物作為基質樹脂製作之CFRP,即使置於高溫環境下回彈量亦較小,且負載變形溫度也提高。 As can be seen from the results shown in Table 1, compared with the case where the constituent materials are used alone, the CFRP made of the resin composition of the present invention as the matrix resin has a smaller springback value and a lower load deflection temperature even when placed in a high temperature environment. improve.

如上述,使成為CFRP之基質樹脂之樹脂組成物之熔融黏度參數成為如申請專利範圍,藉此可一邊以熱塑性樹脂為主成分一邊展現加工溫度以上的高耐熱性,雖非超級工程塑膠等需要高溫加工之高耐熱樹脂,亦可顯示與其相當的性能,在要求熱環境下之耐熱性或機械強度之汽車材料或航空宇宙領域中,以加工或成本面等來看為有用的材料。 As mentioned above, the melt viscosity parameter of the resin composition that becomes the matrix resin of CFRP is within the scope of the patent application, so that it can exhibit high heat resistance above the processing temperature while using thermoplastic resin as the main component, although it is not required by super engineering plastics. High heat-resistant resins processed at high temperatures can also exhibit equivalent performance, and are useful materials in terms of processing and cost in automotive materials and aerospace fields that require heat resistance or mechanical strength in a hot environment.

(產業上之可利用性) (industrial availability)

本發明之樹脂組成物可利用於汽車或航空宇宙等在嚴苛環境下使用之構造構件用的FRTP材料,尤其是CFRTP材料。 The resin composition of the present invention can be used in FRTP materials, especially CFRTP materials, for structural members used in severe environments such as automobiles and aerospace.

Claims (7)

一種熱塑性樹脂組成物,係含有熱塑性樹脂,該熱塑性樹脂組成物在含浸於強化纖維基材後會成為纖維強化塑膠的基質樹脂, A thermoplastic resin composition, which contains a thermoplastic resin, and the thermoplastic resin composition will become a matrix resin of fiber reinforced plastic after being impregnated in a reinforced fiber base material, 樹脂組成物整體的50wt%以上為以苯氧基樹脂作為必要成分之熱塑性樹脂, More than 50 wt% of the entire resin composition is a thermoplastic resin containing phenoxy resin as an essential component, 使用流變儀從室溫升溫至280℃後再降溫至室溫時,在220℃以下的溫度區域中熔融黏度超過10000Pa.s。 When using a rheometer to heat up from room temperature to 280°C and then cool down to room temperature, the melt viscosity exceeds 10000Pa in the temperature range below 220°C. s. 如請求項1所述之熱塑性樹脂組成物,其中基質樹脂為苯氧基樹脂(A)與第2熱塑性樹脂(B-1至3)的混合物,前述基質樹脂含有苯氧基樹脂(A)30wt%以上70wt%以下,剩下為第2熱塑性樹脂(B-1至3),第2熱塑性樹脂(B-1至3)為選自由聚醯胺樹脂(B-1)、聚碳酸酯樹脂(B-2)及聚酯樹脂(B-3)所成群組中之1種以上。 The thermoplastic resin composition as described in Claim 1, wherein the matrix resin is a mixture of phenoxy resin (A) and the second thermoplastic resin (B-1 to 3), and the aforementioned matrix resin contains phenoxy resin (A) 30wt % above 70wt%, the rest is the second thermoplastic resin (B-1 to 3), and the second thermoplastic resin (B-1 to 3) is selected from polyamide resin (B-1), polycarbonate resin ( One or more of the group consisting of B-2) and polyester resin (B-3). 如請求項1所述之熱塑性樹脂組成物,其中基質樹脂係含有熱塑性樹脂及環氧樹脂(C)。 The thermoplastic resin composition according to claim 1, wherein the matrix resin contains a thermoplastic resin and an epoxy resin (C). 如請求項1所述之熱塑性樹脂組成物,其中成為基質樹脂之樹脂組成物係顯示相互反應性或交聯性。 The thermoplastic resin composition according to claim 1, wherein the resin composition to be the matrix resin exhibits mutual reactivity or crosslinkability. 一種纖維強化塑膠成形材料,係將如請求項1至4中任一項所述之熱塑性樹脂組成物含浸於強化纖維基材而成者。 A fiber-reinforced plastic molding material, which is obtained by impregnating the thermoplastic resin composition as described in any one of Claims 1 to 4 in a reinforced fiber base material. 一種成形體,係將如請求項5所述之纖維強化塑膠成形材料成形而成者。 A molded body formed by molding the fiber-reinforced plastic molding material as described in Claim 5. 如請求項6所述之成形體,其中在與成形加工時的溫度相同的熱環境下放置10分鐘後,放冷至常溫後之纖維強化塑膠之厚度變化率超過0%且未達10%。 The molded article according to Claim 6, wherein the thickness change rate of the fiber-reinforced plastic after being left to cool to normal temperature after being left in a hot environment at the same temperature as the molding process for 10 minutes is more than 0% and less than 10%.
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