TW202236232A - Display device and method for making same - Google Patents

Abstract

Embodiments of the present disclosure provide a display device and a method for making same. The display device includes a single-axis curved substrate, a flexible display assembly on a surface of the single-axis curved substrate, a multi-axis curved substrate opposite to the single-axis curved substrate, and a packaging dam and a bonding glue on a first surface of the multi-axis curved substrate. A surface of the packaging dam opposite to the first surface is defined as a second surface. The second surface is in contact with the surface of the single-axis curved substrate with the display assembly. The curvature of the first surface is the same as that of the multi-axis curved substrate. The curvature of the second surface is the same as that of the single-axis curved substrate. The packaging dam defines a hollow cavity, and the display assembly is accommodated in the hollow cavity. The bonding glue is in the hollow cavity to bond the single-axis curved substrate and the multi-axis curved substrate.

Description

Display device and manufacturing method thereof

The present invention relates to the field of display technology, in particular to a display device and a preparation method thereof.

Although there are currently applications of curved display devices, conventional curved display devices can only achieve uniaxial bending in terms of flexibility and flexibility, and the molding technology for multi-axis curved display devices is still lacking.

A first aspect of the present invention provides a display device, which includes: A uniaxially curved substrate, a flexible display component is arranged on one surface of the uniaxially curved substrate; A transparent multi-axis curved substrate is arranged opposite to the uniaxial curved substrate, a package dam is provided on one surface of the multi-axis curved substrate, and the surface of the package dam in contact with the multi-axis curved substrate is defined as the first The surface and the surface opposite to the first surface are the second surface, the second surface is in contact with the surface on which the display component is formed on the uniaxial curved substrate, the curvature of the first surface is consistent with the curvature of the multi-axis The curved substrate is the same, the curvature of the second surface is the same as that of the uniaxial curved substrate, the enclosing dam defines a hollow cavity, and the display component is accommodated in the hollow cavity; and bonding glue, located in the hollow cavity, to bond the uniaxial curved substrate and the multi-axial curved substrate; Wherein, the side of the multi-axis curved substrate away from the display component is the side of the display device displaying a picture.

In the display device, the flexible display component is located on the surface of the uniaxial curved substrate, and the packaging dam is located on the surface of the multi-axial curved substrate. Wherein, the two opposite surfaces of the packaging dam have the same curvature as the uniaxial curved substrate and the multiaxial curved substrate respectively, and the uniaxial curved substrate formed with the display component can be bonded to the multiaxial curved substrate by the bonding glue in the packaging dam. A display device with a multi-axis curved surface can be directly obtained by bending the substrate.

The second aspect of the present invention provides a method for preparing a display device, which includes: A uniaxially curved substrate providing an apparent flexible display assembly; A package dam is formed on the surface of a transparent multi-axis curved substrate, the package dam encloses and defines a hollow cavity, and the surface of the package dam in contact with the multi-axis curved substrate is defined as a first surface, which is in contact with the said multi-axis curved substrate. The surface opposite the first surface is a second surface, the curvature of the first surface is the same as that of the multi-axis curved substrate, and the curvature of the second surface is the same as that of the uniaxial curved substrate; and Forming bonding glue in the hollow cavity to bond the uniaxial curved substrate and the multi-axial curved substrate to obtain a display device; Wherein, in the display device, the second surface of the packaging dam is in contact with the surface of the uniaxial curved substrate on which the display component is formed, the display component is housed in the hollow cavity, and the multi-axis The side of the curved substrate away from the display component is the side of the display device that displays images.

In the manufacturing method of the display device, the flexible display component is formed on the surface of the uniaxial curved substrate, and the package dam is formed on the surface of the multi-axial curved substrate. Wherein, the two opposite surfaces of the packaging dam have the same curvature as the uniaxial curved substrate and the multi-axial curved substrate respectively, and by forming bonding glue in the packaging dam, the uniaxial curved substrate formed with the display component can be bonded to the multi-axial curved substrate. A display device with a multi-axis curved surface can be obtained directly by bending the substrate.

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose, the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.

FIG. 1 is an exploded schematic diagram of a display device 100 according to an embodiment of the present invention. As shown in FIG. 1 , the display device 100 includes a single-axis curved substrate 10 , a display component 20 , a multi-axis curved substrate 30 and a packaging dam 40 .

The single-axis curved base plate 10 and the multi-axis curved base plate 30 are arranged opposite to each other. Display assembly 20 and package dam 40 are located between uniaxial curved substrate 10 and multi-axial curved substrate 30 . Wherein, the display assembly 20 is flexible and bendable, and is located on the surface of the uniaxially curved substrate 10 . The package dam 40 is located on one surface of the multi-axis curved substrate 30 . The package dam 40 has opposing first and second surfaces 41 and 42 . The surface where the packaging dam 40 is in contact with the multi-axis curved substrate 30 is defined as the first surface 41 . The second surface 42 is in contact with the surface of the uniaxially curved substrate 10 on which the display assembly 20 is formed. The curvature of the first surface 41 is the same as that of the multi-axis curved substrate 30 , and the curvature of the second surface 42 is the same as that of the uniaxial curved substrate 10 . The encapsulation dam 40 defines a hollow cavity 43 , and the display unit 20 is accommodated in the hollow cavity 43 .

The display device 100 also includes a bonding glue 50 (shown in FIG. 3 ). The bonding glue 50 is located in the hollow cavity 43 to bond the single-axis curved substrate 10 and the multi-axial curved substrate 30 . The multi-axis curved substrate 30 is transparent, and the side of the multi-axis curved substrate 30 away from the display component 20 is the side of the display screen of the display device 100. The light emitted by the display component 20 passes through the transparent multi-axis curved substrate 30. After the curved substrate 30 is emitted, it is displayed.

In the display device 100 , the flexible display component 20 is disposed on the surface of the uniaxial curved substrate 10 , and the encapsulation dam 40 is disposed on the surface of the multi-axial curved substrate 30 . Wherein, the opposite two surfaces of the package dam 40 have the same curvature as the uniaxial curved substrate 10 and the multi-axial curved substrate 30 respectively, and the uniaxial curved surface formed with the display component 20 can be formed by arranging the bonding glue 50 in the package dam 40 . The substrate 10 is bonded to the multi-axis curved substrate 30 to directly obtain the display device 100 having a multi-axis curved surface. Through the design of the packaging dam 40 combined with the adhesive 50, after the display component 20 is disposed on the single-axis curved substrate 10, it can be directly attached to the multi-axis curved substrate 30 to obtain a multi-axis curved display device 100, so that the curved surface can be attached Bonding is no longer limited to bonding between uniaxially curved substrates of fixed curvature and uniaxially curved substrates of fixed curvature. In addition, the structure of the display device 100 does not limit the display size of the display device. When the display size of the display device is large, one of the known methods is to directly splice multiple display components and then directly attach them to the multi-axis curved substrate to be attached. However, when the size of the spliced curved surface is large, splicing When the final display component is directly attached to the multi-axis curved substrate, the alignment accuracy is required to be high, and the processing is not easy, so it is still difficult to implement. In the display device 100 of the embodiment of the present invention, due to the design of the packaging dam 40, the display assembly 20 can be spliced and then attached to the single-axis curved substrate 10 without considering the difference between the display assembly 20 and the curved surface of the multi-axis curved substrate 30. Alignment accuracy, simplify processing.

In some embodiments, the bonding glue 50 completely fills the hollow cavity 43 and covers the display assembly 20, so that there is no air gap between the display assembly 20 and the multi-axis curved substrate 30, compared to directly attaching a planar display device 100 is hung on the transparent multi-axis curved substrate 30 to obtain a multi-axis curved display device 100 (there will be an air layer between the planar display device 100 and the multi-axis curved substrate 30), which can prevent light from entering the air layer. The phenomenon of poor display effect due to medium refraction.

As shown in FIG. 1 , the uniaxial curved substrate 10 is curved along a single axis, and has a curvature radius Rc. The range of Rc is 100mm~10000mm. The multi-axis curved substrate 30 is a biaxially curved substrate that is curved in two substantially perpendicular axes and has curvature radii Ra and Rb. The ranges of Ra and Rb are both between 100mm and 10000mm. In some embodiments, the curvature Ra of the multi-axis curved substrate 30 is equal to the curvature Rc of the uniaxial curved substrate, which facilitates the fabrication of the packaging dam 40 . In other embodiments, Ra, Rb and Rc may not be equal. Moreover, the multi-axis curved substrate 30 is not limited to the biaxial curved substrate, and it can be curved along three or more axes.

In some embodiments, the uniaxial curved substrate 10 can be transparent or opaque. The material of the uniaxial curved substrate 10 can be glass or plastic. For example, the material of the uniaxial curved substrate 10 may be curved tempered glass or acrylic.

In some embodiments, the multi-axis curved substrate 30 is transparent glass or plastic, which has certain rigidity and scratch resistance, and can protect the display component 20 .

In some embodiments, the display component 20 is formed by splicing a plurality of conventional light-emitting diodes (light-emitting diodes, LEDs), or splicing a plurality of mini light-emitting diodes (mini light-emitting diodes, mini LEDs) , or a plurality of microlight-emitting diodes (microlight-emitting diode, micro LED) or a plurality of organic light-emitting diodes (Organic light emitting diode, OLED) splicing. In Figure 2, the criss-cross grid lines are the splicing lines of display elements (such as traditional LED, mini LED, micro LED or OLED). Micro light-emitting diodes refer to light-emitting diodes whose size is less than 100 microns, more precisely, refers to light-emitting diodes whose size ranges from about 1 micron to 100 microns. Mini LEDs refer to LEDs that are between the size of traditional LEDs and the size of micro LEDs, more precisely, light emitting diodes with sizes in the range of about 100 microns to 200 microns. diode. Among them, a plurality of display elements (such as traditional LEDs, mini LEDs, micro LEDs, or OLEDs) can be formed into curved display elements, and then spliced and bonded on the uniaxial curved substrate 10 with an adhesive layer (such as optical glue). . That is to say, the uniaxial curved substrate 10 is used as a supporting material for carrying the spliced display elements.

As shown in FIG. 1 , after the uniaxially curved substrate 10 is bent along a single axis, it has opposite convex and concave surfaces, and the display unit 20 is formed on the convex surface of the uniaxially curved substrate 10 . The multi-axis curved substrate 30 also has opposing convex and concave surfaces, and the package dam 40 is formed on the concave surface of the multi-axis curved substrate 30 . Wherein, the encapsulation dam 40 is a structure of unequal height, which is surrounded by four sides. In each side, the closer to the middle region of the multi-axis curved substrate 30 , the higher the package dam 40 is, and the farther away from the middle region of the multi-axis curved substrate 30 . Wherein, among the opposite two sides, one side has an injection port 44 (shown in Fig. 7 and Fig. 8 ) to flow into the hollow cavity 43 for the material used to form the bonding glue 50; The outlet 45 (shown in FIGS. 7 and 8 ) is used to flow the materials used to form the adhesive 50 out of the hollow cavity 43 . Wherein, the display assembly 20 is accommodated in the hollow cavity 43 and surrounded by the encapsulation dam 40; the bonding glue 50 is formed in the hollow cavity 43 to cover the display assembly 20, and to bond the single-axis curved substrate 10 and the multi-axis Curved substrate 30. In this way, the packaging dam 40 and the bonding adhesive 50 can not only achieve the purpose of bonding the single-axis curved substrate 10 and the multi-axis curved substrate 30 for direct molding, but also achieve the packaging of the display component 20 at the same time, so as to prevent water vapor and chemical substances from affecting the display. Component 20 for erosion purposes.

In other embodiments, the display component 20 can be formed on the concave surface of the uniaxial curved substrate 10 (as shown in FIG. 2 ), and the packaging dam 40 can also be formed on the convex surface of the multi-axial curved substrate 30, which is not limited here. .

In some embodiments, in order to enhance the interfacial compatibility between the multi-axis curved substrate 30 and the package dam 40, before forming the package dam 40, the surface of the multi-axis curved substrate 30 (the concave surface in FIG. 1 ) is chemically treated. Or physical methods for surface treatment to improve the interface description. For example, the concave surface of the multiaxial curved substrate 30 is physically treated with oxygen ions (-O2-) and nitrogen ions (-N3-), so that the surface has complex hydroxide ions (-OH-), amino (-NH2 ) and carboxyl (-COOH). After physical or chemical treatment, the contact angle of the concave surface of the multi-axis curved substrate 30 (ie the surface for forming the package dam 40 ) is less than 90 degrees.

In some embodiments, the packaging dam 40 is made of thermosetting resin, light curing resin or thermoplastic resin 63 . That is, the material of the package dam 40 can be cured under heat or light irradiation, so as to achieve adhesive curing between the uniaxial curved substrate 10 and the multi-axial curved substrate 30 . Wherein, the light-curable resin is, for example, acrylic resin, the thermosetting resin is, for example, epoxy resin or silicon-based thermosetting resin, and the thermoplastic resin 63 is, for example, polyamide-based or polyester-based thermoplastic resin 63 .

In some embodiments, the packaging dam 40 is formed in an additive stacking manner using an additive manufacturing system 60 . If the material of the encapsulation dam 40 is thermosetting resin or photocurable resin, a step of semi-curing the thermosetting resin or photocurable resin is also included before forming the encapsulant. If the package dam 40 is made of thermoplastic resin 63 , it is directly deposited on the surface of the multi-axis curved substrate 30 without the step of semi-curing treatment.

In some embodiments, the encapsulation dam 40 contains a reinforcing material 51 (shown in FIG. 5 ) to enhance the support strength of the encapsulation dam 40, increase the reflected light of the display component 20, and reduce the Absorption of reflected light by the display assembly 20 . Wherein, the reinforcing material 51 may be reinforcing fibers or reinforcing particles. The reinforcing fibers are, for example, carbon fibers and glass fibers, and the reinforcing particles are, for example, aluminum oxide, glass microspheres, and carbon black.

In some embodiments, as shown in FIG. 3 , the number of the single-axis curved base plate 10 and the number of the multi-axis curved base plate 30 are many to one. There are a plurality of packaging dams 40 on the surface of the multi-axis curved substrate 30, and each of the single-axis curved substrate 10 and the display component 20 on the surface can be bonded to the multi-axis curved substrate 10 by one packaging dam 40. At any position on the surface of the substrate 30, the purpose of partial bonding is achieved. Wherein, each display component 20 is accommodated in the hollow cavity 43 formed by the corresponding packaging dam 40 and surrounded by the corresponding packaging dam 40 . In this way, each package dam 40 adheres to a single-axis curved substrate 10 and the multi-axis curved substrate 30 , and at the same time achieves the purpose of packaging a display component 20 to prevent erosion of the display component 20 by water vapor and chemical substances.

In some embodiments, the bonding glue 50 is made of heat-curable resin, light-curable resin or thermoplastic resin. Among them, the thermosetting resin is, for example, epoxy resin, acrylic resin, polyurethane resin, the viscosity range is 500cps~100,000cps, and the curing condition is heating reaction curing lamination. Photocurable resins are, for example, epoxy resins, acrylic resins, polyurethane resins, and silicon resins. The viscosity ranges from 500 cps to 100,000 cps, and the curing conditions are ultraviolet light reaction curing and bonding. Thermoplastic resins such as ethylene/vinyl acetate copolymer, polyester, polymethyl methacrylate, polycarbonate, polystyrene, etc., the processing temperature (or melting point) ranges from 60°C to 200°C, and is melted by hot pressing fit.

In some embodiments, the display device 100 can be applied to a bus or passenger car to display information such as bus routes, or applied to an outdoor advertising billboard, an indoor display window, and the like. In some other embodiments, the display device 100 is directly used as a multi-axis curved display, for example, it may be a TV, a computer monitor, and the like.

FIG. 4 is a schematic flowchart of a method for manufacturing a display device according to an embodiment of the present invention, which can be used to form the display device 100 shown in FIG. 1 or FIG. 3 . As shown in Figure 4, the preparation method includes the following steps.

Step S1 : providing a uniaxially curved substrate having a flexible display component on the surface.

Step S2: forming packaging dams on the surface of a multi-axis curved substrate, the packaging dams enclosing and defining a hollow cavity.

Step S3: Forming bonding glue in the hollow cavity to bond the uniaxial curved substrate and the multi-axial curved substrate.

The preparation method will be described in detail below in conjunction with accompanying drawings 5 to 8.

Step S1 : providing a uniaxially curved substrate having a flexible display component on the surface.

In some embodiments, the display component 20 is formed by splicing a plurality of conventional LEDs, or a plurality of mini LEDs, or a plurality of micro LEDs, or a plurality of OLEDs. Step S1 includes forming a plurality of display elements (such as traditional LEDs, mini LEDs, micro LEDs or OLEDs) into curved display elements, and then splicing and bonding them on the uniaxial curved substrate with an adhesive layer (such as optical glue) 10 on. That is to say, the uniaxial curved substrate 10 is used as a supporting material for carrying the spliced display elements.

In some embodiments, the display unit 20 is attached to the concave or convex surface of the uniaxially curved substrate 10 , as shown in FIG. 2 , but not limited thereto.

Step S2: forming packaging dams on the surface of a multi-axis curved substrate, the packaging dams enclosing and defining a hollow cavity.

As shown in FIG. 5 , the dam 40 is encapsulated by an additive manufacturing system 60 , formed in a build-up stack on the concave surface of the multi-axis curved substrate 30 . Wherein, the package dam 40 obtained is a structure of unequal height, which is enclosed by four sides. In each side, the closer to the middle region of the multi-axis curved substrate 30 , the higher the package dam 40 is, and the farther away from the middle region of the multi-axis curved substrate 30 . Wherein, among the opposite two sides, one side has an injection port 44 (shown in Fig. 7 and Fig. 8 ) to flow into the hollow cavity 43 for the material used to form the bonding glue 50; The outlet 45 (shown in FIG. 1 , FIG. 7 and FIG. 8 ) is used to flow the material used to form the adhesive 50 out of the hollow cavity 43 . Define the surface of the packaging dam 40 in contact with the multi-axis curved substrate 30 as a first surface 41 (shown in FIG. 1 ), and the surface opposite to the first surface 41 as a second surface 42 (shown in 1 ), the curvature of the first surface 41 is the same as that of the multi-axis curved substrate 30 , and the curvature of the second surface 42 is the same as that of the uniaxial curved substrate 10 .

In some embodiments, the packaging dam 40 is made of thermosetting resin, light curing resin or thermoplastic resin 63 . That is, the material of the package dam 40 can be cured under heat or light irradiation, so as to achieve adhesive curing between the uniaxial curved substrate 10 and the multi-axial curved substrate 30 . Wherein, the light-curable resin is, for example, acrylic resin, the thermosetting resin is, for example, epoxy resin or silicon-based thermosetting resin, and the thermoplastic resin 63 is, for example, polyamide-based or polyester-based thermoplastic resin 63 .

In some embodiments, if the material of the encapsulation dam 40 is heat-curable resin or light-curable resin, a step of semi-curing the heat-curable resin or light-curable resin is further included before forming the encapsulant. If the package dam 40 is made of thermoplastic resin 63 , it is directly deposited on the surface of the multi-axis curved substrate 30 without the step of semi-curing treatment.

In some embodiments, the encapsulation dam 40 contains a reinforcing material 51 to enhance the supporting strength of the encapsulation dam 40 , increase the reflected light of the display component 20 and reduce the absorption of the reflected light of the display component 20 . Wherein, the reinforcing material 51 may be reinforcing fibers or reinforcing particles. The reinforcing fibers are, for example, carbon fibers and glass fibers, and the reinforcing particles are, for example, aluminum oxide, glass microspheres, and carbon black.

In some embodiments, in step S2, before forming the packaging dam 40, the surface of the multi-axis curved substrate 30 (the concave surface in FIG. 5 ) is also chemically or physically treated to improve the interface. , so that after physical or chemical treatment, the contact angle of the concave surface of the multi-axis curved substrate 30 (that is, the surface used to form the package dam 40 ) is less than 90 degrees.

Step S3: Forming bonding glue in the hollow cavity to bond the uniaxial curved substrate and the multi-axial curved substrate.

In step S3 , after laminating the single-axis curved substrate 10 and the multi-axis curved substrate 30 , a display device 100 is obtained. In the display device 100, the second surface 42 of the packaging dam 40 is in contact with the surface of the uniaxial curved substrate 10 on which the display component 20 is formed, and the display component 20 is accommodated in the hollow cavity 43 The side of the multi-axis curved substrate 30 away from the display assembly 20 is the side of the display device 100 displaying images.

In some embodiments, depending on the material of the bonding glue 50 , step S3 adopts different methods to bond the single-axis curved substrate 10 and the multi-axis curved substrate 30 . Wherein, when the material of the laminating glue 50 is a thermoplastic resin, the laminating glue 50 is formed by hot pressing; Form the laminating glue 50 in a manner.

Step S3 will be described in detail below with reference to FIG. 6 and FIG. 8 .

In some embodiments, the material of the adhesive 50 is thermoplastic resin 63 , which forms the adhesive 50 by hot pressing. As shown in FIG. 6 , the upper mold 61 of the hot-pressing mold fixes the uniaxial curved substrate 10 with the display assembly 20 (omitted in FIG. 6 ) on the fixed surface, and the lower mold 62 of the hot-pressing mold fixes the multi-axis curved substrate 10 with the package dam 40 formed on it. Curved substrate 30. That is, the upper mold 61 has the same curvature as the uniaxial curved substrate 10 , and the lower mold 62 has the same curvature as the multiaxial curved substrate 30 . The particles of thermoplastic resin 63 are then filled into the hollow cavity 43 of the packaging dam 40 , and the particles of thermoplastic resin 63 are still in a non-melted state. After the thermoplastic resin 63 particles fill the hollow cavity 43, the upper mold 61 and the lower mold 62 are heated to melt and bond the thermoplastic resin 63 particles, and at the same time, vacuum exhaust to complete lamination. Among them, the thermoplastic resin 63 is, for example, ethylene/vinyl acetate copolymer, polyester, polymethyl methacrylate, polycarbonate, polystyrene, etc., and its processing temperature (or melting point) ranges from 60°C to 200°C. Laminate by pressing, the pressure range is 0.5kg/cm ² ~50kg/cm ² .

In some embodiments, the material of the bonding glue 50 is a reactive resin 66 , such as a thermosetting resin, which is cured and bonded in a mold-fixed manner to form the bonding glue 50 . As shown in FIG. 7 , the upper mold 61 fixes the uniaxial curved substrate 10 with the display assembly 20 (omitted in FIG. 7 ) formed on the surface, and the lower mold 62 fixes the multiaxial curved substrate 30 formed with the package dam 40 . That is, the upper mold 61 has the same curvature as the uniaxial curved substrate 10 , and the lower mold 62 has the same curvature as the multiaxial curved substrate 30 . After the upper mold 61 and the lower mold 62 are closed, there is a hollow cavity 43 between the uniaxial curved substrate 10 and the multiaxial curved substrate 30 . In addition, after the upper mold 61 and the lower mold 62 are closed, the injection port 44 and the outlet port 45 of the encapsulation dam 40 can be communicated with the outside world through two pipes 65 on the mold respectively, so as to serve as passages for the inflow and outflow of the reactive resin respectively . Firstly, the upper mold 61 and the lower mold 62 are heated, so that the encapsulation dam 40 is adhered and cured to the uniaxial curved substrate 10 and the multiaxial curved substrate 30 respectively. Then, the reactive resin 66 is poured into the hollow cavity 43 through the injection port 44 of the packaging dam 40, and at the same time at the outlet 45 of the packaging dam 40, a vacuum system (such as a vacuum pump 64) is used to assist in removing air and filling, After the reactive resin 66 fills the hollow cavity 43 , the upper mold 61 and the lower mold 62 are heated again to cure the reactive resin 66 and finally complete the lamination. Wherein, thermosetting resins such as epoxy resins, acrylic resins, and polyurethane resins have a viscosity ranging from 500 cps to 100,000 cps.

In some embodiments, the adhesive 50 is made of a reactive resin 66 , such as a thermosetting resin or a light-curing resin, which is wrapped in a vacuum bag 67 to cure and attach to form the adhesive 50 . As shown in FIG. 8 , the uniaxial curved substrate 10 formed with the display assembly 20 and the multiaxial curved substrate 30 formed with the packaging dam 40 are arranged oppositely and placed in a vacuum bag 67 . Wherein, two opposite openings of the vacuum bag 67 are respectively sealed by the sealant 68 . In this step, the injection port 44 and the outflow port 45 of the package dam 40 are communicated with the outside through two pipes 65 , so as to serve as passages for inflow and outflow of the reactive resin. Firstly, the ambient temperature is heated to make the encapsulation dam 40 and the uniaxial curved substrate 10 and the multiaxial curved substrate 30 adhere and solidify respectively. Then, the reactive resin 66 is poured into the hollow cavity 43 through the injection port 44 of the packaging dam 40 , and at the same time at the outlet 45 of the packaging dam 40 , a vacuum system (such as a vacuum pump 64 ) is used to assist in removing air and filling. After the reactive resin 66 fills the hollow cavity 43 , the reactive resin 66 is cured and laminated by heating the ambient temperature or irradiating ultraviolet light. Among them, the thermosetting resin or light-curing resin, such as epoxy resin, acrylic resin, polyurethane resin, and silicon resin, has a viscosity range of 500 cps to 100,000 cps.

In the manufacturing method of the display device, the flexible display component 20 is formed on the surface of the uniaxial curved substrate 10 , and the package dam 40 is formed on the surface of the multi-axial curved substrate 30 . Utilizing that the two opposite surfaces of the packaging dam 40 have the same curvature as the uniaxial curved substrate 10 and the multiaxial curved substrate 30 respectively, the bonding glue 50 is provided in the packaging dam 40 by vacuum system assisted injection or hot pressing, so that the formed The uniaxially curved substrate 10 of the display component 20 is bonded to the multiaxially curved substrate 30 to directly obtain the display device 100 having a multiaxially curved surface. Through the design of the packaging dam 40 combined with the adhesive 50, after the display component 20 is disposed on the single-axis curved substrate 10, it can be directly attached to the multi-axis curved substrate 30 to obtain a multi-axis curved display device 100, so that the curved surface can be attached Bonding is no longer limited to the lamination between the uniaxially curved substrate 10 of fixed curvature and the uniaxially curved substrate 10 of fixed curvature. In addition, the manufacturing method of the display device 100 does not limit the display size of the display device. When the display size of the display device is large, one of the known methods is to splice a plurality of display components and directly paste them on the multi-axis curved substrate to be bonded. When the display components are directly attached to the multi-axis curved substrate, the alignment accuracy is required to be high, and the processing is not easy, so it is still difficult to implement. However, in the manufacturing method of the display device according to the embodiment of the present invention, due to the design of the packaging dam 40, the display assembly 20 can be spliced and attached to the single-axis curved substrate 10 without considering the curved surfaces of the display assembly 20 and the multi-axis curved substrate 30. Between the alignment accuracy, simplify processing.

The above embodiments are only used to illustrate the technical solutions of the present invention without limitation. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced. Without departing from the spirit and scope of the technical solutions of the present invention.

100: display device 10: Uniaxial curved base plate 20: Display components 30: Multi-axis curved base plate 40: Encapsulation Dam 41: First Surface 42:Second surface 43: Hollow cavity 44: injection port 45: outlet 50: Laminating glue 51: Reinforcing material 60: Additive manufacturing system 61: upper mold 62: Lower mold 63: thermoplastic resin 64: Vacuum pump 65: pipeline 66: Reactive resin 67: Vacuum bag 68: sealant

FIG. 1 is an exploded schematic diagram of a display device according to an embodiment of the present invention.

FIG. 2 is a schematic structural view of the uniaxial curved substrate and display components in FIG. 1 .

FIG. 3 is a schematic structural diagram of a display device according to another embodiment of the present invention.

FIG. 4 is a schematic flowchart of a method for manufacturing a display device according to an embodiment of the present invention.

FIG. 5 is a structural schematic diagram of each step of forming an encapsulation dam in the manufacturing method of the display device shown in FIG. 4 .

FIG. 6 is a schematic diagram of various steps of forming a pasting glue by hot pressing in the manufacturing method of the display device shown in FIG. 4 .

FIG. 7 is a schematic diagram of various steps of forming a bonding glue in a fixed mold manner in the manufacturing method of the display device shown in FIG. 4 .

FIG. 8 is a schematic diagram of each step of forming a bonding glue in a vacuum bag film wrapping method in the manufacturing method of the display device shown in FIG. 4 .

100: display device

10: Uniaxial curved base plate

20: Display components

30: Multi-axis curved base plate

40: Encapsulation Dam

41: First Surface

42:Second surface

43: Hollow cavity

45: outlet

Claims (10)

A display device, the improvement of which includes: A uniaxial curved substrate, a flexible display component is arranged on a surface of the uniaxial curved substrate; A transparent multi-axis curved substrate is arranged opposite to the uniaxial curved substrate, a package dam is arranged on one surface of the multi-axis curved substrate, and the surface where the package dam contacts the multi-axis curved substrate is defined as a first surface, The surface opposite to the first surface is a second surface, the second surface is in contact with the surface of the uniaxial curved substrate on which the display component is formed, the curvature of the first surface is the same as that of the multi-axial curved substrate, and the second surface is The curvature of the two surfaces is the same as that of the uniaxially curved substrate, the packaging dam encloses and defines a hollow cavity, and the display component is accommodated in the hollow cavity; and a bonding glue, located in the hollow cavity, to bond the uniaxial curved substrate and the multi-axial curved substrate; Wherein, the side of the multi-axis curved substrate away from the display component is the side of the display device displaying a picture. The display device according to Claim 1, wherein the display component is a plurality of conventional light emitting diodes, a plurality of miniature light emitting diodes, a plurality of micro light emitting diodes or a plurality of organic light emitting diodes. The display device according to claim 1, wherein the number of the single-axis curved substrate and the number of the multi-axis curved substrate are many-to-one, and there are a plurality of packaging dams on one surface of the multi-axis curved substrate, each of the The uniaxial curved substrate is bonded to the multi-axial curved substrate through the bonding glue in the hollow cavity of the packaging dam. The display device according to claim 1, wherein the encapsulation dam is made of thermosetting resin, light curing resin or thermoplastic resin. The display device according to claim 1, wherein the encapsulation dam contains a reinforcing material to enhance the support strength of the encapsulation dam, increase the reflected light of the display component, and reduce the absorption of the reflected light of the display component. The display device according to claim 1, wherein the bonding glue is made of thermosetting resin, light curing resin or thermoplastic resin. A method of manufacturing a display device, comprising: providing a uniaxially curved substrate for a display assembly having flexibility on its surface; An encapsulation dam is formed on a surface of a transparent multi-axis curved substrate, the encapsulation dam encloses and defines a hollow cavity, and the surface of the encapsulation dam in contact with the multi-axis curved substrate is defined as a first surface, which is in contact with the second the opposite surface of one surface is a second surface, the first surface has the same curvature as the multi-axis curved substrate, the second surface has the same curvature as the uniaxial curved substrate; and forming a bonding glue in the hollow cavity to bond the uniaxial curved substrate and the multi-axial curved substrate to obtain a display device; Wherein, in the display device, the second surface of the packaging dam is in contact with the surface of the uniaxial curved substrate on which the display component is formed, the display component is accommodated in the hollow cavity, and the part of the multi-axial curved substrate is far away from the display One side of the component is the side where the display device displays a picture. The method for manufacturing a display device according to claim 7, wherein the step of forming the encapsulation dam on the surface of the multi-axis curved substrate includes treating the surface of the multi-axis curved substrate by physical or chemical methods, so that the The surface of the polyaxially curved substrate used to form the package dam has a contact angle of less than 90 degrees. The method for manufacturing a display device as claimed in item 7, wherein the package dam is formed in a stacked manner. The method for preparing a display device according to claim 7, wherein the bonding adhesive is made of thermoplastic resin, and the bonding adhesive is formed by hot pressing; or the bonding adhesive is made of thermosetting resin or photocuring resin , forming the bonding glue by curing and bonding.

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