TW202235801A - 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 - Google Patents

蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 Download PDF

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Publication number
TW202235801A
TW202235801A TW111104350A TW111104350A TW202235801A TW 202235801 A TW202235801 A TW 202235801A TW 111104350 A TW111104350 A TW 111104350A TW 111104350 A TW111104350 A TW 111104350A TW 202235801 A TW202235801 A TW 202235801A
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TW
Taiwan
Prior art keywords
flow path
liquid flow
liquid
channel
steam
Prior art date
Application number
TW111104350A
Other languages
English (en)
Chinese (zh)
Inventor
高橋伸一郎
小田和範
井上功
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202235801A publication Critical patent/TW202235801A/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW111104350A 2021-02-03 2022-02-07 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器 TW202235801A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021015974 2021-02-03
JP2021-015969 2021-02-03
JP2021015969 2021-02-03
JP2021-015974 2021-02-03

Publications (1)

Publication Number Publication Date
TW202235801A true TW202235801A (zh) 2022-09-16

Family

ID=82741442

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111104350A TW202235801A (zh) 2021-02-03 2022-02-07 蒸氣腔、蒸氣腔用之毛細結構片材及電子機器

Country Status (3)

Country Link
JP (2) JP7769918B2 (https=)
TW (1) TW202235801A (https=)
WO (1) WO2022168801A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN218570720U (zh) * 2022-08-17 2023-03-03 荣耀终端有限公司 均热板及电子设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6121893B2 (ja) * 2013-12-24 2017-04-26 東芝ホームテクノ株式会社 シート型ヒートパイプ
JP7137783B2 (ja) * 2017-08-24 2022-09-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
JP6801700B2 (ja) * 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
CN119812143A (zh) * 2019-03-11 2025-04-11 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片

Also Published As

Publication number Publication date
JPWO2022168801A1 (https=) 2022-08-11
JP2026016727A (ja) 2026-02-03
JP7769918B2 (ja) 2025-11-14
WO2022168801A1 (ja) 2022-08-11

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