TW202235246A - Forming device and formed raised floor casting - Google Patents

Forming device and formed raised floor casting Download PDF

Info

Publication number
TW202235246A
TW202235246A TW110108295A TW110108295A TW202235246A TW 202235246 A TW202235246 A TW 202235246A TW 110108295 A TW110108295 A TW 110108295A TW 110108295 A TW110108295 A TW 110108295A TW 202235246 A TW202235246 A TW 202235246A
Authority
TW
Taiwan
Prior art keywords
mold
pressing surface
forming device
raised floor
carrier
Prior art date
Application number
TW110108295A
Other languages
Chinese (zh)
Other versions
TWI777444B (en
Inventor
黃建德
Original Assignee
惠亞工程股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠亞工程股份有限公司 filed Critical 惠亞工程股份有限公司
Priority to TW110108295A priority Critical patent/TWI777444B/en
Priority to CN202120744946.4U priority patent/CN215902670U/en
Priority to CN202110393432.3A priority patent/CN115041632A/en
Application granted granted Critical
Publication of TWI777444B publication Critical patent/TWI777444B/en
Publication of TW202235246A publication Critical patent/TW202235246A/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22CFOUNDRY MOULDING
    • B22C9/00Moulds or cores; Moulding processes
    • B22C9/06Permanent moulds for shaped castings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22CFOUNDRY MOULDING
    • B22C9/00Moulds or cores; Moulding processes
    • B22C9/22Moulds for peculiarly-shaped castings
    • B22C9/24Moulds for peculiarly-shaped castings for hollow articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D31/00Cutting-off surplus material, e.g. gates; Cleaning and working on castings
    • B22D31/002Cleaning, working on castings
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/024Sectional false floors, e.g. computer floors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Architecture (AREA)
  • General Engineering & Computer Science (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Floor Finish (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Body Structure For Vehicles (AREA)

Abstract

A forming device for making raised floor, wherein a forming assembly is provided with a honey comb structure on a first pressing surface of a first mold, and a plurality of bumps on a second pressing surface of a second mold, such that a raised floor casting as a target is formed between the second pressing surface and the first pressing surface, and a plurality of concave portions can be formed on the target by the plurality of bumps. Therefore, when subsequently a hole is formed by stamping, a perforation can be formed at the concave portion, so that the thickness of the target is extremely thin at the place where the perforation is scheduled to be formed, and the depth of the hole is greatly reduced to facilitate processing.

Description

成形裝置及其成形的高架地板鑄件Forming device and its formed raised floor castings

本發明係有關一種模具組件,尤指一種用於製造高架地板之成形裝置及其成形的高架地板鑄件。The present invention relates to a mold assembly, especially a forming device for manufacturing raised floors and raised floor castings formed therefrom.

目前半導體廠房中,均會配置具有複數微孔之高架地板,以清淨環境之空氣品質,確保無塵室之規格。At present, semiconductor factories are equipped with raised floors with multiple micro-holes to clean the air quality of the environment and ensure the clean room specifications.

目前高架地板係採用模鑄方式製作。於模鑄成型製程中,常藉由模具製作所需之產品,且於進行模鑄成型作業前,會先塗佈離形層於該模具中,以利於後續脫模作業。At present, the raised floor system is made by mold casting. In the molding process, the required product is often made by a mold, and before the molding operation, a release layer will be coated on the mold to facilitate the subsequent demoulding operation.

習知製作高架地板之過程中,如圖1A至圖1C所示,係提供一模具組件1,其包含一具有圖案P之公模1a與一具有平面之母模1b,其中,該圖案P係用以形成蜂巢結構,再將該公模1a與母模1b相壓合;接著,藉由一供料管路10將材料供應至該公模1a與母模1b之間,以待該材料固化後,形成一高架地板半成品9,其中,該高架地板半成品9具有相對之地面側9a與蜂巢側9b。之後,藉由頂針模1c之頂針頂撞該公模1a,使該高架地板半成品9鬆脫,以從該公模1a上取出該高架地板半成品9。最後,進行成孔作業,以於該高架地板半成品9之如平面狀之地面側9a上形成複數穿孔,俾形成所需之高架地板,且該高架地板藉由該些穿孔可利用氣流排除微塵,其中,該成孔作業係以鑽頭進行,且於進行成孔作業後,可依需求於該地面側9a上黏貼一面磚8(如圖1D所示)。In the conventional process of making a raised floor, as shown in Figures 1A to 1C, a mold assembly 1 is provided, which includes a male mold 1a with a pattern P and a female mold 1b with a plane, wherein the pattern P is It is used to form a honeycomb structure, and then the male mold 1a and the female mold 1b are pressed together; then, a material is supplied between the male mold 1a and the female mold 1b through a supply pipeline 10, and the material is solidified Thereafter, a raised floor semi-finished product 9 is formed, wherein the raised floor semi-finished product 9 has opposite ground sides 9a and honeycomb sides 9b. Afterwards, the raised floor semi-finished product 9 is released by colliding against the male mold 1a with the thimble of the thimble mold 1c, so as to take out the raised floor semi-finished product 9 from the male mold 1a. Finally, the hole forming operation is carried out to form a plurality of perforations on the flat ground side 9a of the raised floor semi-finished product 9, so as to form the required raised floor, and the raised floor can use the airflow to remove dust through these perforated holes, Wherein, the hole-forming operation is performed with a drill bit, and after the hole-forming operation, a brick 8 can be pasted on the ground side 9a as required (as shown in FIG. 1D ).

然而,於成孔過程中,該地面側9a之厚度D(約4~10㎜)過厚,如圖1D所示,致使鑽孔深度大幅增加,導致加工不易,且容易造成應力集中於該蜂巢側9b,導致該蜂巢側9b之結構碎裂。However, during the hole forming process, the thickness D (about 4~10mm) of the ground side 9a is too thick, as shown in Figure 1D, resulting in a substantial increase in the drilling depth, making processing difficult, and easily causing stress concentration on the honeycomb side 9b, causing the structure of the honeycomb side 9b to break.

再者,該地面側9a之厚度D過厚,且於鑽孔過程中,會產生碎屑,導致後續不易清除該穿孔內之碎屑,以致於該穿孔內會殘留碎屑,故於使用該高架地板時,該高架地板之穿孔容易發生堵塞而無法排除微塵。Furthermore, the thickness D of the ground side 9a is too thick, and debris will be produced during the drilling process, which will cause subsequent difficulty in removing debris in the perforation, so that debris will remain in the perforation. When raising the floor, the perforation of the raised floor is prone to blockage and cannot remove fine dust.

因此,如何克服上述習知技術之種種問題,實已成為目前業界亟待克服之難題。Therefore, how to overcome the various problems of the above-mentioned conventional technologies has become a difficult problem to be overcome urgently in the industry at present.

鑑於上述習知技術之種種缺失,本發明提供一種成形裝置,係包括:第一模具,係具有第一壓合面;以及第二模具,係具有對應該第一壓合面配置之第二壓合面,以於該第一壓合面與第二壓合面之間形成目標物,其中,該第二壓合面上配置有複數凸塊,且該目標物係為高架地板鑄件,以藉由該複數凸塊,於該目標物上形成複數凹部。In view of the various deficiencies of the above-mentioned conventional technologies, the present invention provides a forming device comprising: a first mold having a first pressing surface; and a second mold having a second pressing surface configured corresponding to the first pressing surface. A joint surface to form a target object between the first pressure joint surface and the second pressure joint surface, wherein a plurality of protrusions are arranged on the second pressure joint surface, and the target object is a raised floor casting, so as to A plurality of recesses are formed on the target by the plurality of protrusions.

前述之成形裝置中,該第一模具與該第二模具係藉由複數滑桿連接。In the aforementioned forming device, the first mold and the second mold are connected by a plurality of slide bars.

前述之成形裝置中,該第一壓合面係形成有第一圖案,且該第一圖案係包含複數蜂巢塊及不同深度的溝槽。In the aforementioned forming device, the first pressing surface is formed with a first pattern, and the first pattern includes a plurality of honeycomb blocks and grooves of different depths.

前述之成形裝置中,該第一模具係為公模,其包含一具有該第一壓合面之第一模件、一配置於該第一模件上的抵靠件、及一承載該第一模件與該抵靠件之第一承載件,使該抵靠件位於該第一模件與該第一承載件之間,該第一模件係作為模仁,且該第一承載件係具有一用以容置該模仁之凹槽。例如,該抵靠件係形成有複數貫穿該抵靠件之第一針孔,且該第一承載件係形成有複數貫穿該第一承載件之第二針孔,以令該第二針孔對齊該第一針孔。進一步,包括一具有複數頂針之輔助模具,以令該複數頂針對應穿過該複數第一針孔與第二針孔。例如,該輔助模具與該第一模具係係藉由複數滑桿連接。In the above-mentioned forming device, the first mold is a male mold, which includes a first mold with the first pressing surface, an abutment member arranged on the first mold, and a bearing for the first mold. A module and the first supporting part of the abutting part, so that the abutting part is located between the first module and the first supporting part, the first module is used as a mold core, and the first supporting part There is a groove for accommodating the core of the mold. For example, the abutting member is formed with a plurality of first pinholes penetrating the abutting member, and the first carrier is formed with a plurality of second pinholes penetrating the first carrier, so that the second pinholes Align this first pinhole. Further, an auxiliary mold with a plurality of thimbles is included, so that the plurality of thimbles should pass through the plurality of first pinholes and second pinholes. For example, the auxiliary mold is connected with the first mold through a plurality of slide bars.

前述之成形裝置中,該第二壓合面上之該複數凸塊之頂部至該第一壓合面之最頂部的距離為0.4至1mm。In the aforementioned forming device, the distance from the top of the plurality of protrusions on the second pressing surface to the top of the first pressing surface is 0.4 to 1 mm.

前述之成形裝置中,該複數凸塊係形成第二圖案。In the aforementioned forming device, the plurality of bumps form the second pattern.

前述之成形裝置中,該凸塊相較於該第二壓合面之高度差係0.5~4.5㎜。In the aforementioned forming device, the height difference between the bump and the second pressing surface is 0.5-4.5mm.

前述之成形裝置中,該第二模具係為母模,其包含一具有該第二壓合面之第二模件,以及一用以承載該第二模件之第二承載件,該第二模件係作為模仁,且該第二承載件係具有一用以容置該模仁之凹槽,又該第二模具配置一貫穿該第二承載件之供料管路,以將目標材供應至該第一壓合面與第二壓合面之間。In the aforementioned forming device, the second mold is a master mold, which includes a second mold with the second pressing surface, and a second carrier for carrying the second mold, the second The module is used as a mold core, and the second carrier has a groove for accommodating the mold core, and the second mold is equipped with a feeding pipeline passing through the second carrier to supply the target material between the first pressing surface and the second pressing surface.

本發明亦提供一種高架地板鑄件,係包括:板體,係具有相對之地面側與蜂巢側,且於該地面側上係形成複數個凹部,其中,該凹部之底面之厚度係小於該板體之厚度;以及架體,係形成於該蜂巢側周圍。The present invention also provides a raised floor casting, which includes: a plate body, which has a ground side and a honeycomb side opposite to each other, and a plurality of recesses are formed on the ground side, wherein the thickness of the bottom surface of the recesses is smaller than that of the plate body thickness; and the frame body is formed around the sides of the honeycomb.

前述之高架地板鑄件中,該凹部之深度為1.5~4.5公厘。In the aforementioned raised floor casting, the depth of the recess is 1.5-4.5 mm.

前述之高架地板鑄件中,該蜂巢側上係形成有複數個不同高度之肋骨。In the aforementioned raised floor casting, a plurality of ribs with different heights are formed on the side of the honeycomb.

前述之高架地板鑄件中,該凹部之底面之厚度為0.4­至1㎜。In the aforementioned raised floor casting, the bottom surface of the recess has a thickness of 0.4 to 1mm.

由上可知,本發明之成形裝置及其成形的高架地板鑄件中,主要藉由該第二模具之第二壓合面形成有複數凸塊,使該高架地板鑄件(目標物)之地面側形成有複數凹部,以令該凹部之底面與該高架地板鑄件(目標物)之蜂巢側之間的間隔距離小於該板體之厚度,故相較於習知技術,當於該凹部處形成穿孔時,該高架地板鑄件(目標物)預定形成該穿孔處之厚度已減薄,使得成孔深度大幅縮減,因而有利於加工,且於該高架地板鑄件(目標物)之地面側與蜂巢側均不會造成應力集中之問題,以避免該高架地板鑄件(目標物)發生結構碎裂之問題,進而提升高架地板之製作良率與可靠性。As can be seen from the above, in the forming device of the present invention and the raised floor casting formed therefor, a plurality of protrusions are formed on the second pressing surface of the second mold, so that the ground side of the raised floor casting (target) is formed There are a plurality of recesses, so that the distance between the bottom surface of the recess and the honeycomb side of the raised floor casting (target) is smaller than the thickness of the plate body, so compared with the conventional technology, when forming the perforation at the recess , the thickness of the raised floor casting (target) where the perforation is scheduled to be formed has been reduced, so that the depth of the hole is greatly reduced, which is conducive to processing, and the raised floor casting (target) is not on the ground side and the honeycomb side. It will cause the problem of stress concentration, so as to avoid the problem of structural fragmentation of the raised floor casting (target), thereby improving the production yield and reliability of the raised floor.

再者,藉由該高架地板鑄件(目標物)之板體之部分區域減薄,以於後續進行成孔過程中,可採用沖壓方式,使該成孔用之沖頭所產生之碎屑極少,且於沖壓過程中,該沖頭可一併將碎屑沖離穿孔,因而該穿孔內不會殘留碎屑,故相較於習知技術,當使用該高架地板時,該高架地板之穿孔內不會殘留碎屑,即保持暢通,因而該穿孔可避免發生堵塞之問題,進而有效排除微塵。Furthermore, by thinning part of the plate body of the raised floor casting (target), in the subsequent hole forming process, the stamping method can be used, so that the punch used for hole forming produces very little debris , and in the stamping process, the punch can flush the debris away from the perforation, so that no debris will remain in the perforation, so compared with the prior art, when the raised floor is used, the perforation of the raised floor There will be no debris left inside, that is, it will remain unblocked, so the perforation can avoid the problem of clogging, and then effectively remove fine dust.

以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「左」、「右」、「頂」、「底」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, terms such as "upper", "left", "right", "top", "bottom" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of this specification. The practicable scope of the invention, and the change or adjustment of its relative relationship shall also be regarded as the practicable scope of the present invention, provided there is no substantial change in the technical content.

圖2係為本發明之成形裝置2之立體示意圖。如圖2及圖2A至圖2E所示,該成形裝置2係包括一成形組件以及一輔助模具2c,該成形組件係包含有一具有第一壓合面A1之第一模具2a以及一具有第二壓合面A2之第二模具2b,且該第二壓合面A2係對應該第一壓合面A1配置,以於該第一壓合面A1與第二壓合面A2之間形成一目標物3(如圖3C所示)。Fig. 2 is a three-dimensional schematic view of the forming device 2 of the present invention. As shown in Fig. 2 and Fig. 2A to Fig. 2E, this forming device 2 comprises a forming assembly and an auxiliary mold 2c, and the forming assembly includes a first mold 2a with a first pressing surface A1 and a second mold with a second pressing surface A1. The second mold 2b of the pressing surface A2, and the second pressing surface A2 is configured corresponding to the first pressing surface A1, so as to form a target between the first pressing surface A1 and the second pressing surface A2 Object 3 (as shown in Figure 3C).

所述之第一模具2a係作為公模,其第一模件21a上之第一壓合面A1上係形成有第一圖案P1。The first mold 2a is used as a male mold, and the first pattern P1 is formed on the first pressing surface A1 of the first mold part 21a.

於本實施例中,該第一圖案P1係包含複數陣列排設之蜂巢塊21及用以形成不同高度肋骨的複數不同深度之溝槽25,如圖2A所示,以於該目標物3上形成蜂巢結構。In this embodiment, the first pattern P1 includes a plurality of honeycomb blocks 21 arranged in an array and a plurality of grooves 25 of different depths for forming ribs of different heights, as shown in FIG. 2A , to be placed on the target object 3 form a honeycomb structure.

再者,如圖2B所示,該第一模具2a係包含一正面為第一壓合面A1之第一模件21a、一配置於該第一模件21a背面B1之抵靠件21c、及一用以承載該第一模件21a與該抵靠件21c之第一承載件21b。例如,該第一模件21a係作為模仁,且該抵靠件21c係形成有複數貫穿該抵靠件21c之第一針孔211。Moreover, as shown in FIG. 2B, the first mold 2a includes a first mold 21a whose front is the first pressing surface A1, a supporting member 21c disposed on the back B1 of the first mold 21a, and A first supporting part 21b for supporting the first module 21a and the abutting part 21c. For example, the first mold part 21a is used as a mold core, and the abutment part 21c is formed with a plurality of first pinholes 211 penetrating the abutment part 21c.

又,該第一承載件21b係具有一凹槽S1,以容置該第一模件21a與該抵靠件21c,使該抵靠件21c位於該第一模件21a與該第一承載件21b之間。例如,該凹槽S1之底部係形成有複數貫穿該第一承載件21b之第二針孔212,以令該第二針孔212對齊該第一針孔211。Moreover, the first carrier 21b has a groove S1 to accommodate the first module 21a and the abutment 21c, so that the abutment 21c is located between the first module 21a and the first carrier. Between 21b. For example, the bottom of the groove S1 is formed with a plurality of second pinholes 212 penetrating through the first carrier 21 b, so that the second pinholes 212 are aligned with the first pinholes 211 .

所述之輔助模具2c係具有複數頂針23,且該輔助模具2c係以可相對該第一模具2a位移之方式連接該第一模具2a。例如,該輔助模具2c係以複數(如四根)滑桿24連接該第一模具2a,使該輔助模具2c沿該滑桿24位移,以接近或遠離該第一模具2a,且各該頂針23對應穿過各該第一針孔211及第二針孔212,使該頂針23能插入或抽離各該第一針孔211及第二針孔212。The auxiliary mold 2c has a plurality of ejector pins 23, and the auxiliary mold 2c is connected to the first mold 2a in a displaceable manner relative to the first mold 2a. For example, the auxiliary mold 2c is connected to the first mold 2a with a plurality of (such as four) slide bars 24, so that the auxiliary mold 2c is displaced along the slide bars 24 to approach or move away from the first mold 2a, and each ejector pin 23 passes through each of the first pinholes 211 and the second pinholes 212 correspondingly, so that the thimble 23 can be inserted into or pulled out of the first pinholes 211 and the second pinholes 212 .

所述之第二模具2b係作為母模,其與該第一模具2a可相對位移,且該第二壓合面A2上具有複數凸塊220。The second mold 2b is used as a master mold, which can be displaced relative to the first mold 2a, and has a plurality of protrusions 220 on the second pressing surface A2.

於本實施例中,該第二壓合面A2上之複數凸塊220係陣列排設,如圖2C至圖2E所示,以形成第二圖案P2。例如,每一矩陣係具有九個凸塊220,但於該第二壓合面A2之正中央處並未形成凸塊220,且該凸塊220相較於該第二壓合面A2之高度差約0.5~4.5㎜,該第二壓合面A2為分模線。In this embodiment, the plurality of bumps 220 on the second pressing surface A2 are arranged in an array, as shown in FIG. 2C to FIG. 2E , to form the second pattern P2. For example, each matrix system has nine bumps 220, but no bumps 220 are formed at the center of the second pressing surface A2, and the height of the bumps 220 is higher than that of the second pressing surface A2 The difference is about 0.5~4.5mm, and the second pressing surface A2 is the parting line.

再者,該第一模具2a係以可相對該第二模具2b位移之方式連接該第二模具2b。例如,該第一模具2a係作為活動模,且該第二模具2b係作為固定模,並以複數(如四根)滑桿22連接該第一模具2a與該第二模具2b,使該第一模具2a沿該滑桿22位移,以接近或遠離該第二模具2b。Furthermore, the first mold 2a is connected to the second mold 2b in a manner that can displace relative to the second mold 2b. For example, the first mold 2a is used as a movable mold, and the second mold 2b is used as a fixed mold, and the first mold 2a and the second mold 2b are connected with a plurality of (such as four) slide bars 22 to make the second mold 2a A mold 2a is displaced along the slide bar 22 to approach or move away from the second mold 2b.

又,該第二模具2b係包含一正面為第二壓合面A2之第二模件22a、及一用以承載該第二模件22a之第二承載件22b。例如,該第二模件22a係作為模仁,且該第二承載件22b係具有一用以容置該第二模件22a之凹槽S2。Moreover, the second mold 2b includes a second mold part 22a whose front side is the second pressing surface A2, and a second carrier 22b for carrying the second mold part 22a. For example, the second module 22a is used as a mold core, and the second carrier 22b has a groove S2 for accommodating the second module 22a.

另外,該第二模具2b係配置一供料管路20,其貫穿該第二承載件22b,以將目標材供應至該第一壓合面A1與第二壓合面A2之間。例如,該供料管路20係朝該第二模具2b之背面B2凸伸。In addition, the second mold 2 b is configured with a supply pipeline 20 , which passes through the second carrier 22 b to supply the target material between the first pressing surface A1 and the second pressing surface A2 . For example, the feeding pipeline 20 protrudes toward the back side B2 of the second mold 2b.

因此,於使用該成形裝置2時,如圖3A所示,該第二模具2b固定不動,將該第一模具2a沿該滑桿22位移以靠合該第二模具2b,且該第二壓合面A2上之複數凸塊220頂部至該第一壓合面A1上之最頂部(如該蜂巢塊21頂部)的距離(或如圖4C所示之複數凹部300之厚度t)為0.4­至1mm,再藉由該供料管路20將目標材供應至該第一壓合面A1與第二壓合面A2之間。Therefore, when using the forming device 2, as shown in FIG. The distance from the top of the plurality of protrusions 220 on the bonding surface A2 to the top of the first bonding surface A1 (such as the top of the honeycomb block 21) (or the thickness t of the plurality of concave parts 300 as shown in FIG. 4C ) is 0.4 to 1 mm, and then supply the target material between the first pressing surface A1 and the second pressing surface A2 through the supply pipeline 20 .

接著,當該目標材固化後,將形成一如高架地板鑄件之目標物3,再將該第一模具2a沿該滑桿22位移以分離該第二模具2b,如圖3B所示。於本實施例中,該目標物3係具有相對之地面側3a(如圖4A所示)與蜂巢側3b(如圖4B所示),其中,該第一壓合面A1之蜂巢塊21係用以形成該蜂巢側3b上之結構,如圖4B所示之複數個不同高度之肋骨31a,31b,31c,31d,且該第二壓合面A2係藉由該些凸塊220形成複數凹部300於該地面側3a上。Then, when the target material is solidified, a target object 3 such as a raised floor casting will be formed, and then the first mold 2a is displaced along the slide bar 22 to separate the second mold 2b, as shown in FIG. 3B . In this embodiment, the target object 3 has a ground side 3a (as shown in FIG. 4A ) and a honeycomb side 3b (as shown in FIG. 4B ), wherein the honeycomb block 21 of the first pressing surface A1 is To form the structure on the honeycomb side 3b, a plurality of ribs 31a, 31b, 31c, 31d of different heights as shown in FIG. 300 on the ground side 3a.

之後,將該輔助模具2c沿該滑桿24位移,以接近該第一模具2a,如圖3C所示(圖中省略第二模具2b),使各該頂針23穿過各該第一針孔211及第二針孔212,令該頂針23從該第一針孔211伸出頂撞該第一模件21a之背面B1(如圖2B所示),致使該目標物3鬆脫,故使用者可輕易從該第一模具2a上取出該目標物3(如圖4A及4B所示),其中,作為該目標物3之高架地板鑄件係定義有一具有該地面側3a與該蜂巢側3b的板體30、形成於該蜂巢側3b上之複數個不同高度之肋骨31a,31b,31c,31d、及形成於該蜂巢側3b周圍之架體31。Afterwards, the auxiliary mold 2c is displaced along the slide bar 24 to approach the first mold 2a, as shown in Figure 3C (the second mold 2b is omitted in the figure), so that each of the ejector pins 23 passes through each of the first needle holes 211 and the second pinhole 212, so that the thimble 23 stretches out from the first pinhole 211 and bumps against the back side B1 of the first module 21a (as shown in Figure 2B), causing the target 3 to come loose, so the user The object 3 can be easily removed from the first mold 2a (as shown in FIGS. 4A and 4B ), wherein the raised floor casting as the object 3 defines a plate having the ground side 3a and the honeycomb side 3b Body 30, a plurality of ribs 31a, 31b, 31c, 31d of different heights formed on the honeycomb side 3b, and a frame body 31 formed around the honeycomb side 3b.

最後,藉由沖壓方式進行成孔作業,以於該目標物3之地面側3a上形成複數穿孔(圖略),俾形成所需之高架地板。於進行成孔作業後,可依需求於該地面側3a上黏貼一面磚(圖略)。Finally, the hole-forming operation is performed by stamping to form a plurality of perforations (not shown) on the ground side 3a of the target object 3, so as to form the required raised floor. After the hole-forming operation, a brick can be pasted on the ground side 3a as required (figure omitted).

綜上所述,本發明之成形裝置2,主要藉由該第二模具2b之第二壓合面A2形成有複數凸塊220,使該目標物3之地面側3a上形成有複數凹部300,且該凹部300之深度R(1.5~4.5㎜)夠深,使該凹部300之底面300a之厚度t較薄,如圖4C所示,以令該厚度t(0.40­-1㎜)小於該板體30之厚度D1(約1.5~5㎜),故相較於習知技術,當於該凹部300處形成該穿孔時,該地面側3a預定形成該穿孔處之厚度t(即間隔距離)極薄,致使成孔深度大幅縮減,因而有利於加工,且於該地面側3a及/或該蜂巢側3b均不會造成應力集中之問題,以避免該地面側3a及/或該蜂巢側3b發生結構碎裂之問題,進而提升該高架地板之製作良率與可靠性。In summary, the forming device 2 of the present invention mainly forms a plurality of protrusions 220 on the second pressing surface A2 of the second mold 2b, so that a plurality of concave parts 300 are formed on the ground side 3a of the target object 3, And the depth R (1.5-4.5mm) of the recess 300 is deep enough to make the thickness t of the bottom surface 300a of the recess 300 thinner, as shown in Figure 4C, so that the thickness t (0.40-1mm) is smaller than the plate body The thickness D1 of 30 (about 1.5~5mm), so compared with the conventional technology, when the perforation is formed at the recess 300, the thickness t (that is, the spacing distance) at which the perforation is scheduled to be formed on the ground side 3a is extremely thin , so that the depth of the hole is greatly reduced, which is beneficial to processing, and the problem of stress concentration will not be caused on the ground side 3a and/or the honeycomb side 3b, so as to avoid the occurrence of structures on the ground side 3a and/or the honeycomb side 3b The problem of cracking can be solved, thereby improving the production yield and reliability of the raised floor.

再者,藉由該板體30之部分區域(即該凹部300處)減薄,以於成孔過程中,可採用沖壓方式,使該成孔用之沖頭所產生之碎屑極少,且於沖壓過程中,該沖頭會一併將碎屑朝遠離該穿孔之方向沖出該穿孔,因而該穿孔內不會殘留碎屑,故不會產生灰塵而造成環境汙染之問題。Furthermore, by reducing the thickness of a part of the plate body 30 (that is, the recess 300), in the process of forming the hole, the stamping method can be used, so that the punch used for forming the hole produces very little debris, and During the stamping process, the punch will push the debris out of the perforation in a direction away from the perforation, so no debris will remain in the perforation, so there will be no dust to cause environmental pollution.

又,由於該穿孔之位置係對齊該凹部300之位置,使成孔作業用之沖頭於成孔前可對準該凹部300之位置進行成孔動作,故該沖頭可從該蜂巢側3b朝向該地面側3a穿過,以順勢沖出該碎屑,因而更能避免該碎屑殘留於該穿孔中之問題,使該高架地板之穿孔能有效避免發生堵塞而能快速完成穿孔作業。Also, because the position of the perforation is aligned with the position of the recess 300, the punch used for the hole forming operation can be aligned with the position of the recess 300 before forming the hole to perform the hole forming action, so the punch can be moved from the honeycomb side 3b Pass through towards the ground side 3a to flush out the debris, thereby avoiding the problem of the debris remaining in the perforation, so that the perforation of the raised floor can effectively avoid blockage and quickly complete the perforation operation.

上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。The above-mentioned embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of the patent application described later.

1:模具組件 1a:公模 1b:母模 1c:頂針模 10,20:供料管路 2:成形裝置 2a:第一模具 2b:第二模具 2c:輔助模具 21:蜂巢塊 21a:第一模件 21b:第一承載件 21c:抵靠件 211:第一針孔 212:第二針孔 22,24:滑桿 22a:第二模件 22b:第二承載件 220:凸塊 23:頂針 25:溝槽 3:目標物 30:板體 31:架體 3a,9a:地面側 3b,9b:蜂巢側 300:凹部 300a:底面 31a,31b,31c,31d:肋骨 8:面磚 9:高架地板半成品 A1:第一壓合面 A2:第二壓合面 B1,B2:背面 D,D1:厚度 P:圖案 P1:第一圖案 P2:第二圖案 R:深度 S1,S2:凹槽 t:厚度 1: Mold components 1a: male model 1b: master model 1c: Ejector mold 10,20: Feed pipeline 2: Forming device 2a: First mold 2b: Second mold 2c: Auxiliary mold 21: Honeycomb Block 21a: first module 21b: the first carrier 21c: abutting piece 211: The first pinhole 212: Second pinhole 22,24: slider 22a: Second module 22b: the second carrier 220: bump 23: Thimble 25: Groove 3: Target 30: board body 31: frame body 3a,9a: Ground side 3b,9b: Honeycomb side 300: concave part 300a: bottom surface 31a, 31b, 31c, 31d: ribs 8: face brick 9: Raised floor semi-finished products A1: The first pressing surface A2: Second pressing surface B1, B2: back D, D1: Thickness P: pattern P1: the first pattern P2: second pattern R: Depth S1, S2: Groove t: thickness

圖1A係為習知模具組件之立體示意圖。FIG. 1A is a three-dimensional schematic diagram of a conventional mold assembly.

圖1B係為圖1A之公模之模仁之放大立體圖。Fig. 1B is an enlarged perspective view of the mold core of the male mold in Fig. 1A.

圖1C係為圖1A之高架地板鑄件之另一視角之放大立體圖。Fig. 1C is an enlarged perspective view of another viewing angle of the raised floor casting of Fig. 1A.

圖1D係為圖1C之局部放大剖視圖。Fig. 1D is a partially enlarged cross-sectional view of Fig. 1C.

圖2係為本發明之成形裝置之立體分解示意圖。Fig. 2 is a three-dimensional exploded schematic view of the forming device of the present invention.

圖2A係為圖2之第一模具之模仁之局部放大立體圖。FIG. 2A is a partially enlarged perspective view of the core of the first mold in FIG. 2 .

圖2B係為圖2之第一模具之立體分解圖。FIG. 2B is an exploded perspective view of the first mold in FIG. 2 .

圖2C係為圖2之第二模具之另一視角之放大立體圖。FIG. 2C is an enlarged perspective view of another viewing angle of the second mold in FIG. 2 .

圖2D係為圖2C之立體分解圖。FIG. 2D is an exploded perspective view of FIG. 2C.

圖2E係為圖2C之局部放大立體圖。FIG. 2E is a partially enlarged perspective view of FIG. 2C.

圖3A至圖3C係為本發明之成形裝置之使用過程之立體示意圖。3A to 3C are three-dimensional schematic diagrams of the use process of the forming device of the present invention.

圖4A係為本發明之高架地板鑄件之立體圖。Fig. 4A is a perspective view of the raised floor casting of the present invention.

圖4B係為圖4A之另一視角之立體圖。FIG. 4B is a perspective view of another viewing angle of FIG. 4A.

圖4C係為圖4A之局部放大剖視圖。FIG. 4C is a partially enlarged cross-sectional view of FIG. 4A.

2b:第二模具 2b: Second mold

20:供料管路 20: Feed pipeline

22:滑桿 22: Slider

22a:第二模件 22a: Second module

22b:第二承載件 22b: the second carrier

220:凸塊 220: bump

A2:第二壓合面 A2: Second pressing surface

B2:背面 B2: back

P2:第二圖案 P2: second pattern

Claims (14)

一種成形裝置,係包括: 第一模具,係具有第一壓合面;以及 第二模具,係具有對應該第一壓合面配置之第二壓合面,以於該第一壓合面與第二壓合面之間形成目標物,其中,該第二壓合面上配置有複數凸塊,且該目標物係為高架地板鑄件,以藉由該複數凸塊於該目標物上形成複數凹部。 A forming device, comprising: a first mold having a first pressing surface; and The second mold has a second pressing surface corresponding to the first pressing surface, so as to form an object between the first pressing surface and the second pressing surface, wherein the second pressing surface A plurality of protrusions are arranged, and the target is a raised floor casting, so that a plurality of recesses are formed on the target by the plurality of protrusions. 如請求項1所述之成形裝置,其中,該第一模具與該第二模具係藉由複數滑桿連接。The forming device as claimed in claim 1, wherein the first mold and the second mold are connected by a plurality of slide bars. 如請求項1所述之成形裝置,其中,該第一壓合面係形成有第一圖案,且該第一圖案係包含複數蜂巢塊及不同深度的溝槽。The forming device according to claim 1, wherein the first pressing surface is formed with a first pattern, and the first pattern includes a plurality of honeycomb blocks and grooves of different depths. 如請求項1所述之成形裝置,其中,該第一模具係為公模,其包含一具有該第一壓合面之第一模件、一配置於該第一模件上的抵靠件、及一承載該第一模件與該抵靠件之第一承載件,使該抵靠件位於該第一模件與該第一承載件之間,該第一模件係作為模仁,且該第一承載件係具有一用以容置該模仁之凹槽。The forming device as claimed in claim 1, wherein the first mold is a male mold, which includes a first mold with the first pressing surface, and an abutting member disposed on the first mold , and a first carrier carrying the first module and the abutment, so that the abutment is located between the first module and the first carrier, the first module is used as a mold core, And the first carrier has a groove for accommodating the mold core. 如請求項4所述之成形裝置,其中,該抵靠件係形成有複數貫穿該抵靠件之第一針孔,且該第一承載件係形成有複數貫穿該第一承載件之第二針孔,以令該第二針孔對齊該第一針孔。The forming device as described in claim 4, wherein the abutting member is formed with a plurality of first pinholes penetrating the abutting member, and the first bearing member is formed with a plurality of second pinholes penetrating the first bearing member. pinhole so that the second pinhole is aligned with the first pinhole. 如請求項5所述之成形裝置,復包括一具有複數頂針之輔助模具,以令該複數頂針對應穿過該複數第一針孔與第二針孔,且該輔助模具與該第一模具係係藉由複數滑桿連接。The molding device as described in claim 5 further includes an auxiliary mold with a plurality of thimbles, so that the plurality of thimbles should pass through the plurality of first pinholes and second pinholes, and the auxiliary mold is connected with the first mold are connected by a plurality of sliders. 如請求項1所述之成形裝置,其中,該第二壓合面上之該複數凸塊之頂部至該第一壓合面之最頂部的距離為0.4至1mm。The forming device according to claim 1, wherein the distance from the top of the plurality of protrusions on the second pressing surface to the top of the first pressing surface is 0.4 to 1 mm. 如請求項1所述之成形裝置,其中,該複數凸塊係形成第二圖案。The forming device as claimed in claim 1, wherein the plurality of bumps form a second pattern. 如請求項1所述之成形裝置,其中,該凸塊相較於該第二壓合面之高度差係0.5~4.5㎜。The forming device according to claim 1, wherein the height difference between the bump and the second pressing surface is 0.5-4.5 mm. 如請求項1所述之成形裝置,其中,該第二模具係為母模,其包含一具有該第二壓合面之第二模件,以及一用以承載該第二模件之第二承載件,該第二模件係作為模仁,且該第二承載件係具有一用以容置該模仁之凹槽,又該第二模具配置一貫穿該第二承載件之供料管路,以將目標材供應至該第一壓合面與第二壓合面之間。The forming device as described in claim 1, wherein the second mold is a master mold, which includes a second mold with the second pressing surface, and a second mold for carrying the second mold. The carrier, the second module is used as a mold core, and the second carrier has a groove for accommodating the mold core, and the second mold is equipped with a feed pipeline that runs through the second carrier , so as to supply the target material between the first pressing surface and the second pressing surface. 一種高架地板鑄件,係包括: 板體,係具有相對之地面側與蜂巢側,且於該地面側上係形成複數個凹部,其中,該凹部之底面之厚度係小於該板體之厚度;以及 架體,係形成於該蜂巢側周圍。 A raised floor casting comprising: a plate body having opposite ground sides and honeycomb sides, and a plurality of recesses formed on the ground side, wherein the thickness of the bottom surface of the recesses is smaller than the thickness of the plate body; and The frame body is formed around the side of the honeycomb. 如請求項11所述之高架地板鑄件,其中,該凹部之深度為1.5~4.5公厘。The elevated floor casting according to claim 11, wherein the depth of the recess is 1.5-4.5 mm. 如請求項11所述之高架地板鑄件,其中,該蜂巢側上係形成有複數個不同高度之肋骨。The raised floor casting as claimed in claim 11, wherein a plurality of ribs of different heights are formed on the side of the honeycomb. 如請求項11所述之高架地板鑄件,其中,該凹部之底面之厚度為0.4­至1㎜。The raised floor casting according to claim 11, wherein the thickness of the bottom surface of the recess is 0.4 to 1 mm.
TW110108295A 2021-03-09 2021-03-09 Forming device and formed raised floor casting TWI777444B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW110108295A TWI777444B (en) 2021-03-09 2021-03-09 Forming device and formed raised floor casting
CN202120744946.4U CN215902670U (en) 2021-03-09 2021-04-13 Forming device and formed raised floor casting
CN202110393432.3A CN115041632A (en) 2021-03-09 2021-04-13 Forming device and formed raised floor casting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110108295A TWI777444B (en) 2021-03-09 2021-03-09 Forming device and formed raised floor casting

Publications (2)

Publication Number Publication Date
TWI777444B TWI777444B (en) 2022-09-11
TW202235246A true TW202235246A (en) 2022-09-16

Family

ID=80286327

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110108295A TWI777444B (en) 2021-03-09 2021-03-09 Forming device and formed raised floor casting

Country Status (2)

Country Link
CN (2) CN215902670U (en)
TW (1) TWI777444B (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101340637B1 (en) * 2012-07-25 2013-12-11 박태복 Panel for clean room and manufacturing method of the same
TWM612896U (en) * 2021-03-09 2021-06-01 惠亞工程股份有限公司 Forming device and formed raised floor casting

Also Published As

Publication number Publication date
CN115041632A (en) 2022-09-13
TWI777444B (en) 2022-09-11
CN215902670U (en) 2022-02-25

Similar Documents

Publication Publication Date Title
TWM612896U (en) Forming device and formed raised floor casting
TWM613181U (en) Forming device and formed raised floor casting
CN111673836A (en) Anti-adhesion flexible circuit board stamping die
TW202235246A (en) Forming device and formed raised floor casting
TWI771894B (en) Forming device
JP2952469B2 (en) Replaceable nesting die casting mold
CN106003590A (en) Light guide plate die
CN216860391U (en) Insert die for punching hardware titanium palladium in die
CN213829570U (en) Oblique core for refractory brick production
JP2002187727A5 (en)
CN201537681U (en) Bottom box for low pressure, counter pressure or vacuum casting
US3202025A (en) Tool for producing fissures in mineral felt
CN206689298U (en) A kind of simple general negative mold in a state of excitement
CN216606903U (en) Negative angle forming die
TW201945098A (en) Die casting device capable of easily replacing metal mold at movable side
CN217168955U (en) Manufacturing mold for irregular porous silica bricks
JP5543531B2 (en) Microstructure transfer molding device with release plate
CN202727081U (en) Lower die frame of building block making machine applied to randomly distributing fabric
CN211542143U (en) A mould for processing accurate backlight frame
TWI304372B (en) Stamper and mold for manufacturing light guide plate
CN209466539U (en) A kind of novel die being convenient for changing template
CN207789650U (en) A kind of half shell injection mold
JP2748320B2 (en) Manufacturing method of molded substrate
JP2003285125A (en) Pressing device
KR20110003333A (en) A mould and a method of its manufacture

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent