TW202231821A - Electronic component transferring adhesive sheet, and electronic component processing method using electronic component transferring adhesive sheet - Google Patents

Abstract

Provided is an electronic component transferring adhesive sheet that is excellent in both fixing performance and releasing performance with respect to an electronic component, and that enables reception and delivery of the electronic component while preventing problems such as breakage, even if the electronic component is small and/or thin. The electronic component transferring adhesive sheet according to the present invention comprises a substrate and an adhesive layer disposed on at least one side of the substrate, wherein the adhesive layer, after irradiated with ultraviolet rays of 460 mJ/cm2, exhibits a nano indenter elastic modulus of 500 MPa or less at 25 degrees Celsius.

Description

Adhesive sheet for transfer of electronic parts and processing method of electronic parts using the adhesive sheet for transfer of electronic parts

The present invention relates to an adhesive sheet for transferring electronic parts and a method for processing electronic parts using the adhesive sheet for transferring electronic parts.

Previously, when an electronic component arranged on a specific component was transferred to another component, the electronic component was received by an adhesive sheet, and thereafter, the electronic component was handed over to other components. For example, when assembling an LED (light-emitting diode) chip into a device, temporarily transfer the LED chip formed on the component to an adhesive sheet and receive it, and then transfer the LED chip The self-adhesive sheet is transferred to a specific device or component for the transfer of LED chips.

As described above, as an adhesive sheet for temporarily fixing electronic components (ie, receiving electronic components and then transferring them), an adhesive sheet having an active energy ray-curable adhesive layer can be used. This kind of adhesive sheet can exhibit a specific adhesive force before irradiation with active energy rays (such as ultraviolet rays) to better fix electronic parts. After the active energy rays are irradiated, the adhesive layer is hardened and the adhesive force is reduced, making it easier to process electronic parts. Pickup.

In recent years, there has been a tendency to use a large number of miniaturized and thinned electronic components. Since small and thin electronic parts cannot sufficiently secure the contact area with the adhesive sheet, and are easily damaged when peeled off, it is preferable to use an active energy ray-curable adhesive layer having both fixability and peelability as described above. The adhesive sheet. However, especially in miniaturized and thinned electronic parts (for example, 100 μm or less, thickness 30 μm or less), when receiving and fixing electronic parts, the electronic parts are embedded in the adhesive layer at a high rate. After the adhesive layer is hardened, it will also be difficult to peel off and easily damaged. [Prior Art Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2020-53558

[Problems to be Solved by Invention]

The present invention has been accomplished in order to solve the above-mentioned problems, and an object of the present invention is to provide an electronic component which is excellent in both fixability and peelability, prevents defects such as breakage even if the electronic component is small and thin, and enables the electronic component to be Adhesive sheet for transfer of electronic parts received and handed over. [Technical means to solve problems]

The adhesive sheet for transferring electronic parts of the present invention includes a base material and an adhesive layer disposed on at least one side of the base material, and the adhesive layer is irradiated with 460 mJ/cm ² of ultraviolet rays at a temperature of 25°C. The elastic modulus of the meter indenter is below 500 MPa. In one embodiment, the sinking amount of the above-mentioned adhesive sheet obtained by using TMA (thermomechanical analysis, thermomechanical analysis machine) at 40° C. is 3 μm˜27 μm. In one embodiment, the thickness of the above-mentioned adhesive layer is 2.1 μm˜35 μm. In one embodiment, the elastic modulus of the above-mentioned adhesive layer at 25° C. under the normal state of the nano-indenter is 0.4 MPa or more. In one embodiment, the normal probe viscosity value of the adhesive layer is above 8 N/cm ² . In one embodiment, the above-mentioned base material contains a polyester-based resin. In one embodiment, the thickness of the above-mentioned substrate is 30 μm˜200 μm. In one embodiment, the above-mentioned electronic components are mini-LEDs or micro-LEDs. In one Embodiment, the said adhesive sheet for electronic component transcription|transfer is equipped with the said adhesive bond layer, the said base material, and another adhesive bond layer in this order. According to another aspect of the present invention, a processing method of an electronic part is provided. The processing method is a processing method of electronic parts using the above-mentioned adhesive sheet for transferring electronic parts, and includes: a step a of transferring the electronic parts arranged on the first member to the above-mentioned adhesive layer of the above-mentioned adhesive sheet. ; and step b, which picks up the electronic component by the second member, and peels the electronic component from the adhesive sheet. In one embodiment, the above-mentioned electronic components are mini-LEDs or micro-LEDs. In one embodiment, the step b includes: step b-1, which makes the second member contact the electronic component on the adhesive layer; step b-2, which irradiates the adhesive sheet with active energy rays; and In step b-3, the electronic component is picked up by the second member, and the electronic component is peeled off from the adhesive sheet. In one embodiment, the first member is a sapphire substrate. In one embodiment, the electronic component is a micro LED, and the step a includes irradiating UV (ultraviolet, ultraviolet) laser light to the sapphire substrate configured with a plurality of micro LEDs, and transferring the micro LEDs to the adhesive Sheet. In one embodiment, a portion of the micro LEDs disposed on the sapphire substrate is selectively transferred to the adhesive sheet. [Effect of invention]

According to the present invention, it is possible to provide an electronic component transfer adhesive sheet which is excellent in both the fixability and peelability of the electronic component, prevents defects even if the electronic component is small and thin, and can receive and transfer the electronic component .

A. Outline of the adhesive sheet for electronic component transfer FIG. 1 is a schematic cross-sectional view of the adhesive sheet for electronic component transfer according to one embodiment of the present invention. The adhesive sheet 100 for electronic component transfer of this embodiment includes a base material 10 and an adhesive layer 20 arranged on at least one side of the base material 10 . 2 is a schematic cross-sectional view of an adhesive sheet according to another embodiment of the present invention. The adhesive sheet 200 of this embodiment includes an adhesive layer 20 , a base material 10 and another adhesive layer 30 .

The adhesive layer 20 contains an active energy ray hardening adhesive. The adhesive layer containing the active energy ray hardening type adhesive is hardened by irradiating the active energy ray, and the adhesive force is lowered. The adhesive sheet for transfer of electronic parts of the present invention (hereinafter also simply referred to as the adhesive sheet) has a specific adhesive force before irradiation with active energy rays, so that the electronic parts can be preferably fixed. After the wire, as described above, the adhesive force is lowered, and the electronic components can be easily peeled off (transferred).

The elastic modulus of the nano-indenter at 25° C. after the adhesive layer 20 is irradiated with ultraviolet rays of 460 mJ/cm ² is below 500 MPa. Furthermore, the so-called elastic modulus of the nano-indenter refers to the continuous measurement of the load load and the indentation depth of the indenter when the indenter is pressed into the sample (such as the adhesive surface) under load and unloading. The modulus of elasticity obtained from the load load-indentation depth curve. The details of the measuring method of the elastic modulus of the nanoindenter will be described below. The above-mentioned ultraviolet irradiation is, for example, using an ultraviolet irradiation apparatus (manufactured by Nitto Seiki Co., Ltd., trade name "UM-810") to irradiate the adhesive layer with ultraviolet rays of a high-pressure mercury lamp (characteristic wavelength: 365 nm, cumulative light intensity: 460 mJ/cm ² , irradiation energy: 70 W/cm ² , irradiation time: 6.6 seconds).

Generally speaking, when fixing an electronic component on the adhesive layer, a part (or all) of the electronic component can be in a state of being embedded in the adhesive layer, thereby exhibiting a specific fixing force. On the other hand, when an electronic component is peeled off, the insertion of the electronic component becomes a factor which hinders the peelability. In the present invention, an adhesive sheet can be provided, wherein the elastic modulus of the nano-indenter of the hardened adhesive layer is in the above range, and the degree of freedom of movement of the electronic parts on the adhesive layer in the surface direction is high. , even if a part of an electronic component is embedded, the electronic component can be easily peeled off. If the adhesive sheet of the present invention is used, even when attaching small and thin electronic components (eg, mini-LED, micro-LED), it can be peeled off again without damaging the electronic components. In addition, as described above, since the better peelability is exhibited, the electronic components can be fully embedded, and as a result, the adhesive sheet of the present invention is also excellent in the fixability of the electronic components.

When the adhesive layer of the above-mentioned adhesive sheet is attached to the stainless steel plate (SUS304), the initial adhesive force at 23°C is preferably 0.1 N/20 mm～30 N/20 mm, more preferably 0.1 N/20 mm～ 15N/20mm. Within such a range, an adhesive sheet that can hold electronic components well can be obtained. The adhesive force was measured according to JIS Z 0237:2000. Specifically, the adhesive sheet was attached to a stainless steel plate (arithmetic average surface roughness Ra: 50±25 nm) by reciprocating once with a 2 kg roller, and after standing at 23°C for 30 minutes, the peeling angle was 180°C. ° Under the conditions of a tensile speed of 300 mm/min, the adhesive sheet was peeled off and measured. The adhesive force of the adhesive layer is changed by active energy ray irradiation, and in this specification, "initial adhesive force" means the adhesive force before active energy ray irradiation.

In one embodiment, the adhesive layer of the adhesive sheet is attached to a stainless steel plate (SUS304), and the adhesive force at 23°C after irradiating ultraviolet rays of 460 mJ/cm ² is preferably 0.01 N/20 mm～0.3 N /20 mm, more preferably 0.02 N/20 mm or more and less than 0.2 N/20 mm. Within such a range, an adhesive sheet excellent in releasability can be obtained. Furthermore, the adhesive force after ultraviolet irradiation can be measured by attaching the adhesive layer to the adherend and then irradiating the adhesive surface with ultraviolet rays.

The thickness of the adhesive sheet is preferably 1 μm to 300 μm, more preferably 3 μm to 200 μm.

The amount of sinking of the above-mentioned adhesive sheet at 40°C obtained by using TMA is preferably 2 μm～35 μm, more preferably 3 μm～27 μm, further preferably 4 μm～25 μm, particularly preferably 5 μm～ 20 μm. Within such a range, an electronic component as an adherend is appropriately embedded in the adhesive layer, and an adhesive sheet excellent in fixability (ie, receptivity) and peelability (ie, transferability) can be obtained. "Sinking amount in 40°C environment obtained using TMA" means the amount of sinking after 20 minutes have elapsed after the probe was brought into contact with the adhesive layer using a thermomechanical analyzer (TMA). The measurement conditions were set to probe diameter: 1.0 mm, mode: needle penetration mode, nitrogen flow rate: 50.0 ml/min, pressing load: 0.5 N, and measurement atmosphere temperature: 40°C.

B. Adhesive layer As mentioned above, the nanoindenter elastic modulus of the adhesive layer at 25° C. after ultraviolet irradiation is below 500 MPa. The elastic modulus of the nano-indenter at 25°C after the above-mentioned adhesive layer is irradiated with ultraviolet rays of 460 mJ/cm ² is more preferably 450 MPa or less, more preferably 400 MPa or less, particularly preferably 350 MPa or less, most preferably Preferably, it is 300 MPa or less. Within such a range, the above-mentioned effects become remarkable. In addition, the elastic modulus of the nano-indenter at 25°C after the above-mentioned adhesive layer is irradiated with ultraviolet rays of 460 mJ/cm ² is preferably 1 MPa or more, more preferably 5 MPa or more, and more preferably 10 MPa or more. , more preferably 50 MPa or more, and most preferably 100 MPa or more. Within such a range, an adhesive sheet that is excellent in fixability and has good positional accuracy and can be used for delivery of electronic components can be obtained. Furthermore, the elastic modulus of the adhesive layer can be determined arbitrarily by the composition of the adhesive constituting the adhesive layer, such as the structure of the polymer contained in the adhesive, and the type and amount of the cross-linking agent contained in the adhesive. Adjust in an appropriate way.

The elastic modulus of the above-mentioned adhesive layer at 25°C is preferably 0.1 MPa to 55 MPa, more preferably 0.2 MPa to 40 MPa, further preferably 0.3 MPa to 30 MPa, and particularly preferably 0.3 MPa. MPa～20MPa. Within such a range, an adhesive sheet excellent in fixability of electronic components can be obtained. "Nanoindenter elastic modulus in normal state" means the elastic modulus before irradiation with active energy rays.

In one embodiment, the normal-state nanoindenter elastic modulus of the adhesive layer at 25° C. is preferably 10 MPa or less, more preferably 8 MPa or less, and still more preferably 3 MPa or less. If it is such a range, the adhesive sheet excellent in the fixability of an electronic component especially can be obtained.

In another embodiment, the normal nanoindenter elastic modulus of the adhesive layer at 25°C is preferably 0.4 MPa or more, more preferably 0.5 MPa or more, and more preferably 0.8 MPa or more. Within such a range, the transferability when electronic parts are transferred from a specific member (for example, a sapphire substrate) to an adhesive sheet and the electronic parts are received by the adhesive sheet is improved. In this way, the adhesive sheet excellent in transferability at the time of receiving electronic parts is used, for example, in a step of selectively receiving only a part of electronic parts in which a plurality of electronic parts are arranged on a specific member by the adhesive sheet (for example, the PSLLO step). , especially useful.

The normal storage modulus of the adhesive layer at 25° C. is preferably 10 MPa or less, more preferably 5 MPa or less, and still more preferably 0.01 MPa to 3 MPa. "Normal storage modulus" means the elastic modulus before irradiation of active energy rays. The measurement method of the storage modulus will be described below.

The tensile modulus of the adhesive layer at 25° C. after irradiating ultraviolet rays of 460 mJ/cm ² is preferably 0.05 MPa to 100 MPa, more preferably 0.1 MPa to 70 MPa. The measurement method of the tensile modulus will be described below.

The thickness of the above-mentioned adhesive layer is preferably 1.5 μm to 50 μm, more preferably 2.1 μm to 35 μm, and still more preferably 3 μm to 30 μm. Within such a range, an electronic component as an adherend is appropriately embedded in the adhesive layer, and an adhesive sheet excellent in fixability (ie, receptivity) and peelability (ie, transferability) can be obtained.

In one embodiment, the thickness of the adhesive layer is preferably 40 μm or less, more preferably 30 μm or less, and still more preferably 20 μm or less. By reducing the thickness of the adhesive layer, the transferability of electronic parts from a specific member (such as a sapphire substrate) to an adhesive sheet is improved, so that the adhesive sheet can receive electronic parts. In this way, the adhesive sheet excellent in transferability at the time of receiving electronic parts is used, for example, in a step of selectively receiving only a part of electronic parts in which a plurality of electronic parts are arranged on a specific member by the adhesive sheet (for example, the PSLLO step). , especially useful.

The normal probe viscosity value of the above-mentioned adhesive layer is preferably 8 N/cm ² or more, more preferably 12 N/cm ² or more, and still more preferably 15 N/cm ² or more. Within such a range, an adhesive sheet excellent in fixability of electronic components can be obtained. The upper limit of the normal probe viscosity value of the adhesive layer is, for example, 60 N/cm ² . The measurement method of the probe viscosity value will be described below. "Normal probe viscosity value" means the probe viscosity value before irradiation with active energy rays.

The probe viscosity value of the above-mentioned adhesive layer after being irradiated with ultraviolet rays of 460 mJ/cm ² is preferably 15 N/cm ² or less, and more preferably 12 N/cm ² or less. Within such a range, an adhesive sheet excellent in releasability can be obtained.

(active energy ray hardening adhesive) As described above, the adhesive layer contains an active energy ray-curable adhesive.

Examples of the base polymer constituting the above-mentioned adhesive include acrylic polymers, rubber-based polymers (for example, natural rubber, chloroprene rubber, styrene-butadiene rubber, nitrile rubber, etc.), polyester , urethane polymer, polyether, silicone polymer, polyamide, fluorine polymer, ethylene-vinyl acetate polymer, epoxy resin, vinyl chloride polymer, cyano Acrylate-based polymer, cellulose-based polymer (nitrocellulose-based polymer, etc.), phenol resin, polyimide, polyolefin, styrene-based polymer, polyvinyl acetate, polyvinyl alcohol, polyvinyl alcohol Acetal, polyvinylpyrrolidone, polyvinyl butyral, polybenzimidazole, melamine resin, urea resin, resorcinol-based polymer, and the like. These polymers may be used alone or in combination of two or more. From the viewpoints of adhesiveness, cost, and the like, an acrylic polymer and a rubber-based polymer are preferred, and an acrylic polymer is more preferred. Furthermore, the "base polymer" refers to the main component of the polymer contained in the adhesive. The above-mentioned polymer is preferably a rubber-like polymer that exhibits rubber elasticity in a temperature region around room temperature. In addition, in this specification, unless otherwise specified, the "main component" means a component containing more than 50% by weight.

As said acrylic polymer, for example, a polymer containing an alkyl (meth)acrylate as a main monomer and a monomer raw material containing the main monomer and a copolymerizable sub-monomer is preferable. Here, the main monomer refers to a component that accounts for more than 50% by weight of the monomer composition in the above-mentioned monomer raw materials. The content ratio of the main monomer is preferably 60 parts by weight to 100 parts by weight, more preferably 70 parts by weight to 99.5 parts by weight, relative to 100 parts by weight of the total amount of monomers in the monomer raw material.

As the alkyl (meth)acrylate, for example, a compound represented by the following formula (1) is suitably used. CH ₂ =C(R ¹ )COOR ² (1) Here, R ¹ in the above formula (1) is a hydrogen atom or a methyl group. In addition, R ² is a branched or linear alkyl group having 1 to 20 carbon atoms (hereinafter, the range of such a carbon number may be expressed as "C1-20"). R ² is preferably a branched or straight-chain C1-14 alkyl group, more preferably a branched or straight-chain C6-14 alkyl group, and further preferably a branched or straight-chain C8- 12 alkyl.

Specific examples of the above-mentioned alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and isopropyl (meth)acrylate. , n-butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, amyl (meth)acrylate, isoamyl (meth)acrylate, (meth)acrylate Hexyl acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, ( isononyl meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, (meth)acrylate ) Tridecyl acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate ester, octadecyl (meth)acrylate, nonadecyl (meth)acrylate, eicosyl (meth)acrylate, and the like. These alkyl (meth)acrylates may be used individually by 1 type, or may be used in combination of 2 or more types. Among them, 2-ethylhexyl acrylate (2EHA) and dodecyl (meth)acrylate (LA, LMA) are preferred.

In one embodiment, an alkyl (meth)acrylate in which R ² is a branched or linear alkyl group having 8 or more carbon atoms is used. If such a monomer is used as the main monomer, an adhesive sheet having a better elastic modulus before and after curing, and particularly excellent in fixability and peelability of electronic parts can be obtained. Examples of alkyl (meth)acrylates in which R ² is a branched or linear alkyl group having 8 or more carbon atoms include 2EHA, octyl (meth)acrylate, and isooctyl (meth)acrylate. ester, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, dodecyl (meth)acrylate, and the like. The content ratio of the structural unit derived from the (meth)acrylate alkyl ester in which R ² is a branched or linear alkyl group having 8 or more carbon atoms is preferably 60 parts by weight to 100 parts by weight of the base polymer 100 parts by weight, more preferably 70 parts by weight to 95 parts by weight.

The sub-monomer which is copolymerizable with the alkyl (meth)acrylate as the main monomer can contribute to the introduction of a cross-linking point to the acrylic polymer or improve the cohesive force of the acrylic polymer. Moreover, it is preferable to use the monomer which has a functional group (functional group a) which can react with the functional group (functional group b) of the following carbon-carbon double bond-containing monomer as a sub-monomer. As the sub-monomer, for example, only one of the functional group-containing monomer components shown below may be used alone, or two or more of them may be used in combination. Carboxyl-containing monomers: for example, ethylenically unsaturated monocarboxylic acids such as acrylic acid (AA), methacrylic acid (MAA), and crotonic acid; ethylenically unsaturated dicarboxylic acids such as maleic acid, itaconic acid, and citraconic acid Acids and their anhydrides (maleic anhydride, itaconic anhydride, etc.); Hydroxyl-containing monomers: such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, etc. Hydroxyalkyl (meth)acrylates; unsaturated alcohols such as vinyl alcohol and allyl alcohol; 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, etc. ether compounds; Amine group-containing monomers: such as aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, tert-butylaminoethyl (meth)acrylate; Epoxy group-containing monomers: such as glycidyl (meth)acrylate, methyl glycidyl (meth)acrylate, allyl glycidyl ether; Cyano-containing monomers: such as acrylonitrile, methacrylonitrile; Ketone group-containing monomers: such as diacetone (meth)acrylamide, diacetone (meth)acrylate, vinyl methyl ketone, vinyl ethyl ketone, allyl acetoacetate, vinyl acetoacetate ; Monomers with nitrogen-containing rings: such as N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine, N-vinylpiperidone, N-vinylpyrimidine , N-vinylpiperidine, N-vinylpyridine, N-vinylpyrrole, N-vinylimidazole, N-vinyloxazole, N-vinylpyridine, N-vinylcaprolactam, N-(meth)acrylohydrin; Alkoxysilane-containing monomers: such as 3-(meth)acryloyloxypropyltrimethoxysilane, 3-(meth)acryloyloxypropyltriethoxysilane, 3-(methyl) ) Acrylooxypropylmethyldimethoxysilane, 3-(meth)acrylooxypropylmethyldiethoxysilane; Isocyanate group-containing monomers: (meth)acryloyl isocyanate, 2-(meth)acryloyloxyethyl isocyanate, m-isopropenyl-α,α-dimethylbenzyl isocyanate. Furthermore, it is preferable not to use the amide|amido group containing monomer which can generate|occur|produce a polymer with high affinity with a metal from a viewpoint of maintaining peelability.

In one embodiment, as the above-mentioned secondary monomer, a hydroxyl group-containing monomer is preferably used, and 2-hydroxyethyl (meth)acrylate can be more preferably used. If this monomer is used, it is possible to obtain an adhesive sheet having a better elastic modulus before and after curing, and particularly excellent in fixability and releasability of electronic parts.

The content ratio of the structural unit derived from the above-mentioned sub-monomer is preferably 0.1 part by weight to 40 parts by weight, more preferably 1 part by weight to 30 parts by weight with respect to 100 parts by weight of the base polymer. Within such a range, an adhesive layer having high cohesive force and excellent adhesiveness can be formed.

In addition, when a base polymer having a carbon-carbon double bond is used as the base polymer as described below, as a sub-monomer, it is preferable to use a compound B having a carbon-carbon double bond which can be combined with the following. The sub-monomer of the functional group (functional group a) reacted with the functional group (functional group b). In this case, the kind of the sub-monomer is determined by the kind of the compound B described above. As the sub-monomer having the functional group a, for example, a carboxyl group-containing monomer, an epoxy group-containing monomer, a hydroxyl group-containing monomer, and an isocyanate group-containing monomer are preferable, and a hydroxyl group-containing monomer is particularly preferable. The acrylic polymer has a hydroxyl group by using a hydroxyl group-containing monomer as a sub-monomer. On the other hand, by using an isocyanate group-containing monomer as the compound B having a carbon-carbon double bond, the hydroxyl group of the above-mentioned acrylic polymer reacts with the isocyanate group of the above-mentioned compound, and the carbon derived from the above-mentioned compound B is reacted. - Carbon double bonds are introduced into the acrylic polymer.

In addition, for the purpose of improving the cohesion of the acrylic polymer, etc., other copolymerization components other than the above-mentioned sub-monomers can be used. Examples of the copolymerization component include vinyl ester monomers such as vinyl acetate and vinyl propionate; aromatic vinyl compounds such as styrene, substituted styrene (α-methylstyrene, etc.), and vinyltoluene. ; Cycloalkyl (meth)acrylates such as (meth)acrylates such as cyclohexyl (meth)acrylate and cyclopentyl di(meth)acrylate; (meth)acrylates such as cycloalkyl (meth)acrylates; (Phenyl (meth)acrylate), aryloxyalkyl (meth)acrylate (eg phenoxyethyl (meth)acrylate), aralkyl (meth)acrylate (eg (meth)acrylic acid) (meth)acrylates containing aromatic rings such as benzyl ester); olefin monomers such as ethylene, propylene, isoprene, butadiene, isobutylene; chlorine-containing monomers such as vinyl chloride and vinylidene chloride; Alkoxy-containing monomers such as methoxyethyl (meth)acrylate and ethoxyethyl (meth)acrylate; vinyl ether-based monomers such as methyl vinyl ether and ethyl vinyl ether; etc. . These other copolymerization components other than a sub-monomer may be used individually by 1 type, or may be used in combination of 2 or more types. The amount of the other copolymerization components is, for example, 2 to 20 parts by weight relative to 100 parts by weight of the total amount of monomers in the monomer raw material.

Furthermore, a multifunctional monomer can be used as a copolymerizable component for the purpose of crosslinking treatment of an acrylic polymer or the like. As the above-mentioned polyfunctional monomer, hexanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate can be used base) acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate , polyester acrylate, urethane acrylate, etc. 1 or more. The quantity of the said polyfunctional monomer is 30 weight part or less with respect to 100 weight part of total monomers in a monomer raw material, for example.

The above-mentioned acrylic polymer can be obtained by any appropriate polymerization method. For example, a solution polymerization method, an emulsion polymerization method, a block polymerization method, a suspension polymerization method, etc. are mentioned.

Preferably, a carbon-carbon double bond is introduced into the above-mentioned base polymer (preferably an acrylic polymer). By using a base polymer having a carbon-carbon double bond, an adhesive layer hardened by active energy rays (representatively, ultraviolet rays) can be formed. Furthermore, in the present invention, in addition to this method, a curable adhesive layer can be formed using an adhesive containing a polymerizable monomer or oligomer and an acrylic polymer, but an adhesive sheet excellent in releasability can be obtained. From the viewpoint of the material, it is preferable to form the curable adhesive layer using a base polymer having a carbon-carbon double bond.

Any appropriate method can be adopted as a method for producing the base polymer having a carbon-carbon double bond. For example, the method of reacting the compound B which has a functional group (functional group b) and a carbon-carbon double bond which can react with this functional group a, and the polymer A which has a functional group a can be mentioned. At this time, it is preferable to carry out the reaction so that the carbon-carbon double bond does not disappear, and for example, a condensation reaction, an addition reaction, or the like can be used. As the polymer A, as described above, for example, a polymer obtained by copolymerizing an alkyl (meth)acrylate as a main monomer and a sub-monomer having a functional group a can be used.

As a combination of the said functional group a and functional group b, the combination of a carboxyl group and an epoxy group, a combination of a carboxyl group and an aziridine group, a combination of a hydroxyl group and an isocyanate group, etc. are mentioned. Among them, from the viewpoint of tracking reactivity, a combination of a hydroxyl group and an isocyanate group is preferable. From the viewpoint of polymer design, etc., a combination in which the acrylic polymer has a hydroxyl group and the above-mentioned compound has an isocyanate group is particularly preferable.

As a compound which has the said carbon-carbon double bond and a functional group b, an isocyanate group-containing monomer (an isocyanate group-containing compound) is mentioned, for example. Among them, 2-(meth)acryloyloxyethyl isocyanate is more preferred.

The compounding amount of the isocyanate group-containing monomer is preferably 1 to 40 parts by weight, more preferably 5 parts by weight, relative to 100 parts by weight of the polymer (ie, polymer A) before the introduction of carbon-carbon double bonds ~ 30 parts by weight, more preferably 8 parts by weight to 15 parts by weight.

In addition, a carbon-carbon double bond can be introduced so that the hydroxyl group contained in the polymer A remains. In this way, when the adhesive layer is heated, the degree of crosslinking can be increased. In this case, it is preferable that the molar ratio (a/b) of the hydroxyl group which is the functional group a and the isocyanate group which is the functional group b exceeds 1, and is preferably 1.1 or more.

The weight average molecular weight Mw of the above-mentioned base polymer (preferably an acrylic polymer) is preferably 10×10 ⁴ to 500×10 ⁴ , more preferably 20×10 ⁴ to 200×10 ⁴ , and more preferably 30× 10 ⁴ to 100×10 ⁴ . If it is such a range, the adhesive bond layer which is excellent in adhesiveness with few paste residues can be formed. Furthermore, in this specification, Mw refers to a value in terms of standard polystyrene obtained by GPC (gel permeation chromatography, gel permeation chromatography).

Preferably, the above-mentioned adhesive contains a crosslinking agent. As a cross-linking agent, for example, an isocyanate-based cross-linking agent, an epoxy-based cross-linking agent, an oxazoline-based cross-linking agent, an aziridine-based cross-linking agent, a melamine-based cross-linking agent, and a peroxide-based cross-linking agent may, for example, be mentioned. Linking agent, urea-based cross-linking agent, metal alkoxide-based cross-linking agent, metal chelate-based cross-linking agent, metal salt-based cross-linking agent, carbodiimide-based cross-linking agent, amine-based cross-linking agent, etc. . These crosslinking agents may be used alone or in combination of two or more.

The content ratio of the crosslinking agent is preferably 0.1 to 10 parts by weight, more preferably 0.2 to 8 parts by weight, relative to 100 parts by weight of the base polymer of the adhesive. Within such a range, an adhesive layer with an appropriately adjusted elastic modulus of the nanoindenter can be formed.

In one embodiment, an isocyanate-based crosslinking agent is preferably used. The isocyanate-based crosslinking agent is preferable in that it can react with various functional groups. Specific examples of the above-mentioned isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophor Alicyclic isocyanates such as Erone diisocyanate; Aromatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; Trimethylolpropane/toluene Diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industries, trade name "Coronate L"), trimethylolpropane/hexamethylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industries, trade name "Coronate HL"), isocyanurate of hexamethylene diisocyanate (manufactured by Japan Polyurethane Industry Co., Ltd., trade name "Coronate HX") and other isocyanate adducts; etc. It is preferable to use the crosslinking agent which has 3 or more isocyanate groups.

The number of functional groups of the isocyanate-based cross-linking agent in the above-mentioned isocyanate-based cross-linking agent is preferably 10 mol% to 50 mol% relative to the number of functional groups in the base polymer that can react with the isocyanate-based cross-linking agent. Adding, it is more preferable to add so that it may become 20 mol% - 40 mol%. If added in such an amount, an adhesive layer with an appropriately adjusted elastic modulus of the nanoindenter can be formed.

The above-mentioned adhesive may further contain any appropriate additives as needed. Examples of such additives include photopolymerization initiators, adhesion imparting agents, plasticizers (for example, trimellitate-based plasticizers, pyromellitic acid-based plasticizers), pigments, dyes, Fillers, anti-aging agents, conductive materials, ultraviolet absorbers, light stabilizers, peeling regulators, softeners, surfactants, flame retardants, antioxidants, solvents, etc.

C. Substrate The above-mentioned substrate may contain any suitable resin. Examples of the resin include polyolefin-based resins such as polyethylene-based resins, polypropylene-based resins, polybutene-based resins, and polymethylpentene-based resins, polyurethane-based resins, and polyester-based resins. Resin, polyimide resin, polyetherketone resin, polystyrene resin, polyvinyl chloride resin, polyvinylidene chloride resin, fluorine resin, silicone resin, cellulose resin, ionic polymer resin, etc.

In one embodiment, as the above-mentioned base material, a base material containing a polyester-based resin can be used. It is preferable that the base material containing polyester-based resin has rigidity, and if this base material is used, positional displacement when fixing electronic parts can be prevented.

The thickness of the base material is preferably 2 μm to 300 μm, more preferably 5 μm to 200 μm, and still more preferably 10 μm to 200 μm.

In one embodiment, a substrate having a thickness of 30 μm to 200 μm (preferably a substrate containing polyester-based resin) is used. If the base material of this thickness is used, positional deviation when fixing electronic parts can be prevented.

D. Another Adhesive Layer The above-mentioned another adhesive layer may contain any suitable adhesive. The adhesive can be a hardening adhesive or a pressure-sensitive adhesive. The above-mentioned another adhesive layer includes, for example, an adhesive such as an acrylic adhesive, a rubber-based adhesive, and a silicone-based adhesive.

The thickness of the other adhesive layer is, for example, 1 μm˜100 μm.

E. Manufacturing Method of Adhesive Sheet The above-mentioned adhesive sheet can be manufactured by any appropriate method. The adhesive sheet can be obtained by, for example, coating the above-mentioned adhesive on a base material. As the coating method, bar coater coating, air knife coating, gravure coating, reverse gravure coating, reverse roll coating, die lip coating, die die coating, dip coating, offset coating can be used Printing, flexographic printing, screen printing and other methods. Moreover, after forming an adhesive bond layer in a release liner, the method of bonding it to a base material etc. can also be employ|adopted.

F. Method of Using Adhesive Sheet ( Processing Method of Electronic Parts ) The adhesive sheet of the present invention can be used in any appropriate processing steps of electronic parts, when transferring the electronic parts between components. For example, in one embodiment, there is provided a processing method of an electronic part using the above-mentioned adhesive sheet, the processing method comprising: (a) step a of transferring the electronic part arranged on the first member to the above-mentioned adhesive sheet On the adhesive layer of the material (the adhesive sheet receives the electronic parts); and (b) step b, which picks up the electronic parts by the second member, and peels the electronic parts from the above-mentioned adhesive sheet (self-adhesive sheet handover electronic parts); Components). Any suitable processing steps can be performed before step a, between step a and step b, and after step b.

In one embodiment, a plurality of the above-mentioned electronic components are arranged on the first member. In one Embodiment, in the said step a, all the electronic components arrange|positioned on the 1st member are transcribe|transferred on the said adhesive sheet. In another embodiment, a part of the electronic component arrange|positioned in a 1st member is selectively transcribe|transferred on the said adhesive sheet.

In one embodiment, the above-mentioned step b includes: step b-1, which makes the second member contact the electronic parts on the above-mentioned adhesive layer; layer) irradiating active energy rays; and step b-3, which picks up the electronic component by the second member, and peels the electronic component from the adhesive sheet.

In one embodiment, the above-mentioned electronic components can be LEDs. In one embodiment, mini-LEDs or micro-LEDs can be used as the LEDs. The so-called mini LED, for example, has a size of 100 μm or more on one side of an LED chip, and has a structure in which a growth support substrate such as a sapphire substrate and a light-emitting (epitaxial) layer mainly composed of gallium nitride are adjacent to each other. In this specification, even if one side is 100 μm or less, an LED chip having a growth support substrate such as a sapphire substrate is defined as a mini LED. One side of the mini LED chip is, for example, 50 μm to 500 μm, and the thickness is, for example, 30 μm to 200 μm. In addition, the so-called micro LED, for example, one side of the LED chip is 100 μm or less, and has a light-emitting (epitaxy) layer mainly composed of gallium nitride. It is separated from a growth support substrate such as a sapphire substrate and consists of only a light-emitting (epitaxy) layer. the structure. In this specification, even if one side is 100 μm or more, an LED chip that does not have a growth support substrate such as a sapphire substrate is defined as a micro LED. One side of the micro LED chip is, for example, 5 μm to 200 μm, and the thickness is, for example, 3 μm to 30 μm.

In one embodiment, the electronic component is an LED (preferably a micro LED), and the first member is a sapphire substrate. In this embodiment, in step a, UV laser light is irradiated to the sapphire substrate on which the LEDs are arranged, and the LEDs are transferred to the above-mentioned adhesive sheet. Here, by irradiating with UV laser light, the interface between the sapphire substrate and the LED is chemically decomposed, and the LED is peeled off from the sapphire substrate. Specifically, the gallium nitride existing near the interface between the sapphire substrate and the LED is decomposed into liquid metal gallium and gaseous nitrogen by irradiation with UV laser light, so that the LED is separated from the sapphire substrate. In one embodiment, all the LEDs arranged on the sapphire substrate are transferred onto the above-mentioned adhesive sheet. In another embodiment, a portion of the LEDs disposed on the sapphire substrate is selectively transferred onto the above-mentioned adhesive sheet. [Example]

Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to these examples. The tests and evaluation methods in the examples are as follows. In addition, unless otherwise specified, "parts" and "%" are based on weight.

(1) The elastic modulus of the nanoindenter Using a nanoindenter (manufactured by Hysitron Inc, trade name "Triboindenter TI-950"), a single indentation method at a specific temperature (25°C) was used to measure it at about 500 Under the measurement conditions of the pressing speed of nm/sec, the pulling speed of about 500 nm/sec, and the pressing depth of about 3000 nm, the elastic mode of the surface of the adhesive layer in the normal state and after irradiating ultraviolet rays of 460 mJ/cm ² was measured. number.

8 mm尺寸，設置於ARES-G2之探針。自-50℃至200℃以5℃/min.之升溫速度進行測定。根據所獲得之資料擷取25℃下之儲存模數G'之值。 (2) Storage modulus of the adhesive layer in normal state Using a dynamic viscoelasticity measuring device (manufactured by TA instruments, trade name "ARES-G2"), the storage modulus at a measurement frequency of 1 Hz, strain of 0.05%, and 25°C was measured. G' and loss coefficient tanδ were measured. Specifically, an adhesive sheet having a thickness of 50 μm without a substrate was produced using the normal adhesive obtained in the Examples and Comparative Examples, and the adhesive sheets were laminated so that the thickness was 1.0 mm or more, and a jig was used. stamping as

8 mm size, set on the probe of ARES-G2. The measurement is carried out at a heating rate of 5°C/min. from -50°C to 200°C. According to the obtained data, the value of the storage modulus G' at 25°C was extracted.

(3) Tensile modulus of the adhesive layer after being irradiated with ultraviolet rays of 460 ^mJ /cm %, and the tensile modulus E' at 25°C was measured. Specifically, using the adhesives obtained in Examples and Comparative Examples, an adhesive sheet having a thickness of 50 μm without a base material was produced, and the adhesive sheets were laminated so that the thickness would be 200 μm or more. With the release liner attached to both sides of the sample, the release liner was removed after irradiating ultraviolet rays of 460 mJ/cm ² once from both sides, and the obtained adhesive layer was set as a sample with a width of 10 mm. In addition, the distance between the chucks was set to 20 mm, and the measurement was performed at a temperature increase rate of 5°C/min. from 0°C to 200°C. From the data obtained, the value of the tensile modulus E' at 25°C was extracted.

之SUS製之探針端子於探針下降速度(Immersion speed)：120 mm/min、測試速度(tests peed)：600 mm/min、密接荷重(Prelod)：20 gf、密接保持時間(press time)：1秒之條件下，測量暴露之黏著劑層面之探針黏性值、及對暴露之黏著劑層面照射460 mJ/cm ²之紫外線後之探針黏性值。測定係於N＝5下實施，將該等測定值之平均值設為探針黏性值。又，關於實施例17～22之黏著片材，使用2 kg手壓輥將與評價面之黏著劑層為相反側之黏著劑面貼附於上述載玻片，以與上述相同之條件測量探針黏性值。 (4) Probe Adhesion The entire surface of the surface opposite to the adhesive layer on the evaluation surface of the adhesive sheet (width 20 mm × length 50 mm) was passed through a double-sided tape (Nitto Denko Co., Ltd., trade name "No. 5600"), and attached to a glass slide (manufactured by Songnami Glass Industry Co., Ltd., 26 mm×76 mm) using a 2 kg hand roller. Next, using a probe viscosity measuring machine (manufactured by RHESCA, trade name "TACKINESS Model TAC-II"), 5 mm

The probe terminal made of SUS is at the probe descending speed (Immersion speed): 120 mm/min, test speed (tests speed): 600 mm/min, close contact load (Prelod): 20 gf, close contact retention time (press time) : Under the condition of 1 second, measure the probe viscosity value of the exposed adhesive layer and the probe viscosity value after irradiating the exposed adhesive layer with 460 mJ/ ^cm2 of ultraviolet light. The measurement was carried out at N=5, and the average value of these measurement values was taken as the probe viscosity value. In addition, regarding the adhesive sheets of Examples 17 to 22, the adhesive surface on the opposite side to the adhesive layer on the evaluation surface was adhered to the above-mentioned glass slide using a 2 kg hand roller, and the probe was measured under the same conditions as above. Needle viscosity value.

(5) Adhesion The adhesive layer of the adhesive sheet was attached to SUS304BA by a method according to JIS Z 0237:2000 (lamination conditions: 2 kg roller 1 reciprocation, stretching speed: 300 mm/min, peeling Angle 180°, measurement temperature: 23°C), the relative adhesive force of the adhesive sheet was measured. Furthermore, the adhesive layer of the adhesive sheet was adhered to a polyethylene terephthalate film (manufactured by Toray Industries, Ltd., trade name "Lumirror S10", thickness: 25 μm), and the Method (bonding conditions: one reciprocation of a 2 kg roller, stretching speed: 300 mm/min, peeling angle 180°, measurement temperature: 23°C), the adherend was peeled off from the adhesive sheet, and the adhesive sheet was measured Adhesion relative to polyethylene terephthalate film. In addition, after sticking to the adherend as described above, the adhesive force after irradiating the adhesive layer with ultraviolet rays of 460 mJ/cm ² was measured by the method described above.

1.0 mm之探針，以針入模式於氮氣流量：50.0 ml/min、壓入荷重：0.5 N、測定氛圍溫度：40℃、壓入負載時間：20 min之條件下，自黏著劑層側測量黏著片材之下沉深度。測定係於N＝5下實施，將除該等測定值中之最大值及最小值以外之N＝3之平均值設為樣本之下沉深度。 (6) TMA subsidence depth A thermomechanical analyzer (manufactured by TA-instrument, trade name "TMA Q400") was used, and the

1.0 mm probe, measured from the adhesive layer side in the needle penetration mode under the conditions of nitrogen flow rate: 50.0 ml/min, pressing load: 0.5 N, measurement atmosphere temperature: 40°C, pressing load time: 20 min The subsidence depth of the adhesive sheet. The measurement was carried out at N=5, and the average value of N=3 excluding the maximum and minimum values among the measured values was set as the subsidence depth of the sample.

(7) Chip embedment during bonding When the subsidence depth of the adhesive sheet measured by thermomechanical analysis (TMA) was 3 μm or more and less than 27 μm, the embeddability was excellent (0 in the table), and when it was 27 μm or more, the Excessive embeddedness (x in the table).

(8) Deformation of the base material A value obtained by subtracting the thickness of the adhesive layer of the adhesive sheet from the subsidence depth of the adhesive sheet measured by thermomechanical analysis (TMA) was calculated as the deformation amount of the substrate. When the subsidence depth of the adhesive sheet is less than the thickness of the adhesive layer, the deformation of the substrate is set as no.

(9) Positional accuracy of the wafer When the deformation amount of the substrate calculated from the subsidence depth of the adhesive sheet measured by thermomechanical analysis (TMA) did not reach 20 μm, the positional accuracy at the time of receiving the wafer was excellent (0 in the table), In the case of 20 μm or more, the positional accuracy at the time of receiving the wafer is insufficient (X in the table).

(10) Shear Adhesion after Irradiation of 460 mJ/cm ² of Ultraviolet Light The adhesive sheets (dimensions: 20 mm×20 mm) obtained in Examples and Comparative Examples were attached to the opposite side of the adhesive layer It is fixed on a specific substrate (such as a 26 mm × 76 mm glass slide manufactured by Songlang Glass Industry Co., Ltd.), and a 1 mm × 1 mm silicon wafer is arranged on the surface of the adhesive layer of the adhesive sheet. The silicon wafer was subjected to thermocompression bonding for 1 minute under the bonding conditions of 40° C. and 0.05 MPa to prepare a sample for evaluation. Furthermore, the other adhesive sheets that do not have an adhesive layer are fixed to the substrate using double-sided tape (Nitto Denko Co., Ltd., trade name "No. 5600"). From the specific base side of the obtained sample for evaluation, an ultraviolet irradiation device (manufactured by Nitto Seiki Co., Ltd., trade name "UM-810") was used to irradiate the adhesive layer of the adhesive sheet with the silicon wafer with ultraviolet rays from a high-pressure mercury lamp (Characteristic wavelength: 365 nm, cumulative light intensity: 460 mJ/cm ² , irradiation energy: 70 W/cm ² , irradiation time: 6.6 seconds) to prepare a sample for evaluation. For this evaluation sample, at an ambient temperature of 25°C, a dage4000 manufactured by Nordson Corporation was used, and a measurement terminal was placed on the side of a 1 mm × 1 mm silicon wafer at a height of 50 μm from the attachment surface, and a measurement of 500 μm/ The shear rate of sec. applies external force to the wafer and the horizontal direction, thereby obtaining a load-displacement curve, and reading the maximum failure load from the load-displacement curve, which is set as the shear adhesion force at an ambient temperature of 25°C. The measurement was carried out at N=5, and the average value of N=3 excluding the maximum value and the minimum value among the measured values was taken as the shear adhesion force of the sample.

(11) Transferability When the shear adhesion force after irradiating ultraviolet rays of 460 mJ/cm ² did not reach 2000 N/cm ² , the transferability at the time of wafer transfer was excellent (0 in the table), and at 2000 N In the case of more than 2400 N/cm ² and less than 2400 N/cm ² , the transferability at the time of wafer transfer is good (△ in the table), and when it is more than 2400 N/cm ² , the transferability at the time of wafer transfer is not good. Sufficient (X in the table).

[Production Example 1] Preparation of Acrylic Polymer A 88.8 parts by weight of 2-ethylhexyl acrylate (2-EHA), 11.2 parts by weight of hydroxyethyl acrylate (HEA), 0.2 parts by weight of a polymerization initiator (manufactured by NOF Corporation, trade name "Nyper BW") and toluene Mix. The obtained mixture was polymerized under nitrogen flow at 60° C. to obtain an acrylic copolymer having a weight average molecular weight (Mw) of about 600,000. 12 parts by weight of methacryloyloxyethyl isocyanate (MOI) and 0.06 part by weight of butyltin dilaurate were added to the toluene solution containing 100 parts by weight of the acrylic copolymer, and the MOI was subjected to an addition reaction to prepare a carbon-carbon double bond The acrylic polymer A.

[Production Example 2] Preparation of Acrylic Polymer B 91 parts by weight of lauryl methacrylate (LMA), 9.3 parts by weight of 2-ethylhexyl methacrylate (2-HEMA), and 0.2 weight part of a polymerization initiator (manufactured by NOF Corporation, trade name "Nyper BW") parts and toluene were mixed. The obtained mixture was polymerized at 60° C. under a nitrogen stream to obtain an acrylic copolymer. To the toluene solution containing 100 parts by weight of the acrylic copolymer, 9.1 parts by weight of methacryloyloxyethyl isocyanate (MOI) and 0.04 parts by weight of butyltin dilaurate were added, and the MOI was subjected to an addition reaction to prepare a carbon-carbon double bond The acrylic polymer B.

[Production Example 3] Preparation of Acrylic Polymer C 100 parts by weight of 2-ethylhexyl acrylate (2-EHA), 25.5 parts by weight of acrylonitrile (ACMO), 18.5 parts by weight of hydroxyethyl acrylate (HEA), a polymerization initiator (manufactured by NOF Corporation, commodity (name "Nyper BW") 0.2 weight part and toluene were mixed. The obtained mixture was polymerized under nitrogen flow at 60° C. to obtain an acrylic copolymer having a weight average molecular weight (Mw) of about 900,000. To the toluene solution containing 100 parts by weight of the acrylic copolymer, 8.5 parts by weight of methacryloyloxyethyl isocyanate (MOI) and 0.04 part by weight of butyltin dilaurate were added, and the MOI was subjected to an addition reaction to prepare a carbon-carbon double bond. The acrylic polymer C.

[Production Example 4] Preparation of Acrylic Polymer D 75 parts by weight of 2-ethylhexyl acrylate (2-EHA), 15 parts by weight of acrylonitrile (ACMO), 22 parts by weight of hydroxyethyl acrylate (HEA), a polymerization initiator (manufactured by NOF Corporation, commodity (name "Nyper BW") 0.2 weight part and toluene were mixed. The obtained mixture was polymerized at 60° C. under a nitrogen stream to obtain an acrylic copolymer. 17.7 parts by weight of methacryloyloxyethyl isocyanate (MOI) and 0.04 part by weight of butyltin dilaurate were added to the toluene solution containing 100 parts by weight of the acrylic copolymer, and the MOI was subjected to an addition reaction to prepare a carbon-carbon double bond The acrylic polymer D.

[Production Example 5] Preparation of Acrylic Polymer E 50 parts by weight of butyl acrylate (BA), 39 parts by weight of ethyl acrylate (EA), 20 parts by weight of hydroxyethyl acrylate (HEA), and a polymerization initiator (manufactured by NOF Corporation, trade name "Nyper BW") 0.3 The parts by weight and toluene are mixed. The obtained mixture was polymerized at 60° C. under a nitrogen stream to obtain an acrylic copolymer. 19.5 parts by weight of methacryloyloxyethyl isocyanate (MOI) and 0.06 part by weight of butyltin dilaurate were added to the toluene solution containing 100 parts by weight of the acrylic copolymer, and the MOI was subjected to an addition reaction to prepare a carbon-carbon double bond The acrylic polymer E.

[Production Example 6] Preparation of Acrylic Polymer F 30 parts by weight of 2-ethylhexyl acrylate (2-EHA), 70 parts by weight of methyl acrylate (MA), 10 parts by weight of acrylic acid (AA), a polymerization initiator (manufactured by NOF Corporation, trade name "Nyper BW ”) 0.4 parts by weight and toluene were mixed, and then heated at 70° C. to prepare a toluene solution of the acrylic copolymer (acrylic polymer F).

[Example 1] To the toluene solution of the above-mentioned acrylic polymer A, 3 parts by weight of an isocyanate-based crosslinking agent (manufactured by Japan Polyurethane Industry Co., Ltd., trade name "Coronate L"), and light were added to 100 parts by weight of the solid content of the acrylic polymer. Polymerization initiator (manufactured by BASF, trade name "Omnirad" (Omnirad127): 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl }-2-methyl-propan-1-one) 3 parts by weight to prepare an adhesive. The adhesive was coated on one side of a PET (polyethylene terephthalate, polyethylene terephthalate) substrate (100 μm, “Lumirror S1N” manufactured by Toray Corporation) to obtain a UV-curable adhesive layer (thickness : 2 μm) of adhesive sheet A (adhesive layer/PET substrate). The obtained adhesive sheet A was used for the above evaluation. The results are shown in Table 1.

[Examples 2 to 16, Example 23, Comparative Examples 1 to 3] In addition to using the acrylic polymer, crosslinking agent, adhesion imparting agent, photopolymerization initiator shown in Table 1 and using the base material shown in Table 1 according to the formulation amounts shown in Table 1 and Table 2, to In the same manner as in Example 1, an adhesive sheet was obtained. The obtained adhesive sheet was used for the above evaluation. The results are shown in Table 1 and Table 2. Compounds and the like used in Examples and Comparative Examples are shown below. ・"YS POLYSTER S145": Terpene phenol-based adhesion imparting agent, manufactured by Yasuhara Chemical Co., Ltd. ・"UV-1700": Active energy ray curable oligomer (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., trade name "Purple UV-1700B") ・"Omnirad651": manufactured by BASF, trade name "Omnirad651" ・"PET (printed matter)": PET film manufactured by Dasan Paper Co., Ltd. (thickness: 50 μm, light red solid printing) ・"PO": A propylene-based thermoplastic elastomer (manufactured by Mitsubishi Chemical Corporation, trade name "Zelas") containing a propylene component and an ethylene propylene rubber component was supplied to a T-die molding machine manufactured by PLACO Corporation (set temperature: 230°C), Base material obtained by molding into a film with a thickness of 80 μm

[Example 17] An adhesive sheet i ( adhesive layer/PET substrate). In a toluene solution containing 100 parts by weight of acrylic polymer G (a copolymer of 95 parts by weight of 2-ethylhexyl acrylate (2-EHA) and 5 parts by weight of acrylic acid (AA)), an epoxy-based crosslinking agent was added (Mitsubishi Gas Chemical Co., Ltd. make, trade name "Tetrad C") 0.6 weight part, and the coating liquid was prepared. The coating solution was applied to the surface of the PET substrate of the above-mentioned adhesive sheet i on the opposite side to the adhesive layer to obtain an adhesive sheet 1 (adhesive layer/PET substrate/another adhesive layer (thickness: 30 μm)). The obtained adhesive sheet was used for the above evaluation. The results are shown in Table 3.

[Examples 18 to 22] An adhesive sheet was obtained in the same manner as in Example 17, except that the substrates having the thicknesses shown in Tables 3 and 4 were used. The obtained adhesive sheet was used for the above evaluation. The results are shown in Table 3 and Table 4.

[Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 adhesive layer base polymer Type of polymer polymer A polymer A polymer A polymer A polymer A cross-linking agent Types of crosslinkers Isocyanate series Isocyanate series Isocyanate series Isocyanate series Isocyanate series Coronate/L Coronate/L Coronate/L Coronate/L Coronate/L Amount of cross-linking agent [parts by weight] 3 3 3 3 3 Additives (adhesion imparting agents/oligomers) Add resin type - - - - - - - - - - Add resin compounding amount [weight part] - - - - - photopolymerization initiator Types of photopolymerization initiators α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series Omnirad127 Omnirad127 Omnirad127 Omnirad127 Omnirad127 Types of photopolymerization initiators preparation amount [parts by weight] 3 3 3 3 3 Thickness [μm] 2 5 10 15 30 substrate material PET(Lumirror S1N) PET(Lumirror S1N) PET(Lumirror S1N) PET(Lumirror S1N) PET(Lumirror S1N) Thickness [μm] 100 100 100 100 100 Evaluation adhesive layer Normal storage modulus G'[MPa] 0.13 0.13 0.13 0.13 0.13 Normal state nanoindenter elastic modulus Er[MPa] 1.2 1.2 1.2 1.2 1.2 Tensile modulus E'[MPa] after UV irradiation 34.9 34.9 34.9 34.9 34.9 Nanoindenter elastic modulus Er[MPa] after UV irradiation 295.8 295.8 295.8 295.8 295.8 Normal probe viscosity [N/cm ² ] 19.9 33.5 29.2 27.9 48.9 adhesive sheet Thickness [μm] 102 105 110 115 130 Normal adhesion (to SUS304) [N/20 mm] 0.12 0.14 0.15 0.17 0.22 Adhesion after UV curing (460 mJ/cm ² ) (to SUS304) [N/20 mm] 0.03 0.03 0.03 0.04 0.04 Normal Adhesion (to PET) [N/20 mm] 0.18 0.31 0.53 0.71 0.96 Adhesion (to PET) after UV curing (460 mJ/cm ² ) [N/20 mm] 0.04 0.04 0.04 0.04 0.04 TMA subsidence depth [μm] 2.8 7.7 9.9 17.8 26.5 Chip embeddability during bonding × 〇 〇 〇 〇 Substrate deformation [μm] 0.8 2.7 0.0 2.8 0.0 The positional accuracy of the chip 〇 〇 〇 〇 〇 Shear Adhesion After UV Curing (460 mJ/cm ² ) [N/cm ² ] 2098.7 1698.7 1801.7 1927.3 2174.3 transferability △ 〇 〇 〇 △ Example 6 Example 7 Example 8 Example 9 Example 10 adhesive layer base polymer Type of polymer polymer A polymer A polymer A polymer A polymer A cross-linking agent Types of crosslinkers Isocyanate series Isocyanate series Isocyanate series Isocyanate series Isocyanate series Coronate/L Coronate/L Coronate/L Coronate/L Coronate/L Amount of cross-linking agent [parts by weight] 3 1 1 1 0.2 Additives (adhesion imparting agents/oligomers) Add resin type - - - - - - - - - - Add resin compounding amount [weight part] - - - - - photopolymerization initiator Types of photopolymerization initiators α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series Omnirad127 Omnirad127 Omnirad127 Omnirad127 Omnirad127 Types of photopolymerization initiators preparation amount [parts by weight] 3 3 3 3 3 Thickness [μm] 40 10 20 30 5 substrate material PET(Lumirror S1N) PET(Lumirror S1N) PET(Lumirror S1N) PET(Lumirror S1N) PET (print) Thickness [μm] 100 100 100 100 50 Evaluation adhesive layer Normal storage modulus G'[MPa] 0.13 0.05 0.05 0.05 0.03 Normal state nanoindenter elastic modulus Er[MPa] 1.2 0.5 0.5 0.5 0.4 Tensile modulus E'[MPa] after UV irradiation 34.9 25.8 25.8 25.8 22.5 Nanoindenter elastic modulus Er[MPa] after UV irradiation 295.8 222.8 222.8 222.8 196.1 Normal probe viscosity [N/cm ² ] 50.1 34.8 44.2 43.7 43.2 adhesive sheet Thickness [μm] 140 110 120 130 55 Normal adhesion (to SUS304) [N/20 mm] 0.26 0.30 0.39 0.50 4.25 Adhesion after UV curing (460 mJ/cm ² ) (to SUS304) [N/20 mm] 0.04 0.04 0.04 0.05 0.05 Normal Adhesion (to PET) [N/20 mm] 0.99 1.92 2.40 2.53 4.44 Adhesion (to PET) after UV curing (460 mJ/cm ² ) [N/20 mm] 0.05 0.04 0.05 0.06 0.05 TMA subsidence depth [μm] 28.9 12.9 19.0 29.5 8.0 Chip embeddability during bonding × 〇 〇 × 〇 Substrate deformation [μm] 0.0 2.9 0.0 0.0 3.0 The positional accuracy of the chip 〇 〇 〇 〇 〇 Shear Adhesion After UV Curing (460 mJ/cm ² ) [N/cm ² ] 2297.6 1596.1 2045.3 2228.0 562.2 transferability △ 〇 △ △ 〇

[Table 2] Example 11 Example 12 Example 13 Example 14 Example 15 adhesive layer base polymer Type of polymer polymer A polymer A polymer A polymer A polymer B cross-linking agent Types of crosslinkers Isocyanate series Isocyanate series Isocyanate series Isocyanate series Isocyanate series Coronate/L Coronate/L Coronate/L Coronate/L Coronate/L Amount of cross-linking agent [parts by weight] 0.2 0.2 0.2 0.2 0.5 Additives (adhesion imparting agents/oligomers) Add resin type - - - Terpene phenols - - - - YS POLYSTER S145 - Add resin compounding amount [weight part] - - - 5 - photopolymerization initiator Types of photopolymerization initiators α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series Omnirad127 Omnirad127 Omnirad127 Omnirad127 Omnirad127 Types of photopolymerization initiators preparation amount [parts by weight] 3 3 3 3 3 Thickness [μm] 10 15 20 10 10 substrate material PET (print) PET (print) PET (print) PET (print) PET(Lumirror S1N) Thickness [μm] 50 50 50 50 100 Evaluation adhesive layer Normal storage modulus G'[MPa] 0.03 0.03 0.03 0.03 0.05 Normal state nanoindenter elastic modulus Er[MPa] 0.4 0.4 0.4 0.4 0.5 Tensile modulus E'[MPa] after UV irradiation 22.5 22.5 22.5 17.0 48.2 Nanoindenter elastic modulus Er[MPa] after UV irradiation 196.1 196.1 196.1 150.8 400.8 Normal probe viscosity [N/cm ² ] 33.5 30.6 38.5 40.3 40.3 adhesive sheet Thickness [μm] 60 65 70 60 110 Normal adhesion (to SUS304) [N/20 mm] 6.70 7.38 7.96 8.26 6.13 (Cohesion failure) Adhesion after UV curing (460 mJ/cm ² ) (to SUS304) [N/20 mm] 0.04 0.04 0.05 0.06 0.04 Normal Adhesion (to PET) [N/20 mm] 4.81 5.04 5.08 6.65 9.07 (Cohesion Destruction) Adhesion (to PET) after UV curing (460 mJ/cm ² ) [N/20 mm] 0.05 0.05 0.06 0.07 0.05 (sticky) TMA subsidence depth [μm] 10.8 19.3 22.5 9.6 11.0 Chip embeddability during bonding 〇 〇 〇 〇 〇 Substrate deformation [μm] 0.8 4.3 2.5 0.0 1.0 The positional accuracy of the chip 〇 〇 〇 〇 〇 Shear Adhesion After UV Curing (460 mJ/cm ² ) [N/cm ² ] 617.1 822.2 869.9 691.2 2169.1 transferability 〇 〇 〇 〇 △ Example 16 Example 23 Comparative Example 1 Comparative Example 2 Comparative Example 3 adhesive layer base polymer Type of polymer polymer C polymer A polymer D polymer E Polymer F cross-linking agent Types of crosslinkers Isocyanate series Isocyanate series Isocyanate series Isocyanate series Isocyanate series Coronate/L Coronate/L Coronate/L Coronate/L Coronate/L Amount of cross-linking agent [parts by weight] 4 0.2 0.5 0.2 3.5 Additives (adhesion imparting agents/oligomers) Add resin type - - - - UV oligomer - - - - UV-1700 Add resin compounding amount [weight part] 100 photopolymerization initiator Types of photopolymerization initiators α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series Omnirad651 Omnirad127 Omnirad127 Omnirad127 Omnirad127 Types of photopolymerization initiators preparation amount [parts by weight] 3 3 3 3 3 Thickness [μm] 10 20 10 10 10 substrate material PET(Lumirror S1N) PO PET(Lumirror S1N) PET(Lumirror S1N) PET(Lumirror S1N) Thickness [μm] 100 80 100 100 100 Evaluation adhesive layer Normal storage modulus G'[MPa] 0.58 0.03 0.07 0.08 0.10 Normal state nanoindenter elastic modulus Er[MPa] 5.1 0.4 0.7 0.8 1.0 Tensile modulus E'[MPa] after UV irradiation 50.3 22.5 147.0 109.6 1672.2 Nanoindenter elastic modulus Er[MPa] after UV irradiation 416.7 196.1 1140.2 865.5 11160.6 Normal probe viscosity [N/cm ² ] 22.0 34.5 31.2 45.0 38.4 adhesive sheet Thickness [μm] 110 100 110 110 110 Normal adhesion (to SUS304) [N/20 mm] 0.45 9.80 6.50 4.08 22.48 Adhesion after UV curing (460 mJ/cm ² ) (to SUS304) [N/20 mm] 0.06 0.08 0.02 0.03 0.02 Normal Adhesion (to PET) [N/20 mm] 3.85 5.78 8.24 8.39 (grasping failure) 12.23 (Grasping failure) Adhesion (to PET) after UV curing (460 mJ/cm ² ) [N/20 mm] 0.07 (sticky) 0.08 0.03 (sticky) 0.04 (sticky) 0.02 (sticky) TMA subsidence depth [μm] 10.7 32.5 9.6 10.1 9.8 Chip embeddability during bonding 〇 × 〇 〇 〇 Substrate deformation [μm] 0.7 12.5 0.0 0.1 0.0 The positional accuracy of the chip 〇 〇 〇 〇 〇 Shear Adhesion After UV Curing (460 mJ/cm ² ) [N/cm ² ] 2288.8 1269.9 2308.6 2359.4 2400.5 transferability △ 〇 × × ×

[table 3] Example 17 Example 18 Example 19 adhesive layer base polymer Type of polymer polymer A polymer A polymer A cross-linking agent Types of crosslinkers Isocyanate series Isocyanate series Isocyanate series Coronate/L Coronate/L Coronate/L Amount of cross-linking agent [parts by weight] 0.2 0.2 0.2 Additives (adhesion imparting agents/oligomers) Add resin type Terpene phenols Terpene phenols Terpene phenols YS POLYSTER S145 YS POLYSTER S145 YS POLYSTER S145 Add resin compounding amount [weight part] S 5 5 photopolymerization initiator Types of photopolymerization initiators α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series Omnirad127 Omnirad127 Omnirad127 Types of photopolymerization initiators preparation amount [parts by weight] 3 3 3 Thickness [μm] 10 10 10 substrate material PET(Lumirror S1N) PET(Lumirror S1N) PET(Lumirror S1N) Thickness [μm] 12 25 38 another adhesive layer base polymer Type of polymer polymer G polymer G polymer G cross-linking agent Types of crosslinkers Epoxy system Epoxy system Epoxy system Tetrad/C Tetrad/C Tetrad/C Amount of cross-linking agent [parts by weight] 0.6 0.6 0.6 Thickness [μm] 30 30 30 Evaluation adhesive layer Normal storage modulus G'[MPa] 0.03 0.03 0.03 Normal state nanoindenter elastic modulus Er[MPa] 0.4 0.4 0.4 Tensile modulus E'[MPa] after UV irradiation 17.0 17.0 17.0 Nanoindenter elastic modulus Er[MPa] after UV irradiation 150.8 150.8 150.8 Normal probe viscosity [N/cm ² ] 54.8 44.1 43.6 adhesive sheet Thickness [μm] 52 65 78 Normal adhesion (to SUS304) [N/20 mm] 4.20 5.67 6.64 Adhesion after UV curing (460 mJ/cm ² ) (to SUS304) [N/20 mm] 0.05 0.04 0.05 Normal Adhesion (to PET) [N/20 mm] 4.64 6.37 6.55 Adhesion (to PET) after UV curing (460 mJ/cm ² ) [N/20 mm] 0.07 0.07 0.06 TMA subsidence depth [μm] 35.0 28.5 26.6 Chip embeddability during bonding × × 〇 Substrate deformation [μm] 25.0 18.5 16.6 The positional accuracy of the chip × 〇 〇 Shear Adhesion After UV Curing (460 mJ/cm ² ) [N/cm ² ] 93.1 154.8 319.5 transferability 〇 〇 〇

[Table 4] Example 20 Example 21 Example 22 adhesive layer base polymer Type of polymer polymer A polymer A polymer A cross-linking agent Types of crosslinkers Isocyanate series Isocyanate series Isocyanate series Coronate/L Coronate/L Coronate/L Amount of cross-linking agent [parts by weight] 0.2 0.2 0.2 Additives (adhesion imparting agents/oligomers) Add resin type Terpene phenols Terpene phenols Terpene phenols YS POLYSTER S145 YS POLYSTER S145 YS POLYSTER S145 Add resin compounding amount [weight part] 5 5 5 photopolymerization initiator Types of photopolymerization initiators α-Hydroxyketone series α-Hydroxyketone series α-Hydroxyketone series Omnirad127 Omnirad127 Omnirad127 Types of photopolymerization initiators preparation amount [parts by weight] 3 3 3 Thickness [μm] 10 10 10 substrate material PET(Lumirror S1N) PET(Lumirror S1N) PET(Lumirror S1N) Thickness [μm] 50 100 188 another adhesive layer base polymer Type of polymer polymer G polymer G polymer G cross-linking agent Types of crosslinkers Epoxy system Epoxy system Epoxy system Tetrad/C Tetrad/C Tetrad/C Amount of cross-linking agent [parts by weight] 0.6 0.6 0.6 Thickness [μm] 30 30 30 Evaluation adhesive layer Normal storage modulus G'[MPa] 0.03 0.03 0.03 Normal state nanoindenter elastic modulus Er[MPa] 0.4 0.4 0.4 Tensile modulus E'[MPa] after UV irradiation 17.0 17.0 17.0 Nanoindenter elastic modulus Er[MPa] after UV irradiation 150.8 150.8 150.8 Normal probe viscosity [N/cm ² ] 53.8 55.6 44.7 adhesive sheet Thickness [μm] 90 140 228 Normal adhesion (to SUS304) [N/20 mm] 6.68 3.57 1.01 Adhesion after UV curing (460 mJ/cm ² ) (to SUS304) [N/20 mm] 0.05 0.06 0.06 Normal Adhesion (to PET) [N/20 mm] 6.74 6.59 6.62 Adhesion (to PET) after UV curing (460 mJ/cm ² ) [N/20 mm] 0.06 0.07 0.07 TMA subsidence depth [μm] 20.0 11.0 5.0 Chip embeddability during bonding 〇 〇 〇 Substrate deformation [μm] 10.0 1.0 0.0 The positional accuracy of the chip 〇 〇 〇 Shear Adhesion After UV Curing (460 mJ/cm ² ) [N/cm ² ] 648.4 1918.2 1663.1 transferability 〇 〇 〇

10: Substrate 20: Adhesive layer 30: Another adhesive layer 100: Adhesive sheet 200: Adhesive sheet

FIG. 1 is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention. 2 is a schematic cross-sectional view of an adhesive sheet according to another embodiment of the present invention.

10: Substrate

20: Adhesive layer

100: Adhesive sheet

Claims (15)

An adhesive sheet for transferring electronic parts, comprising a base material and an adhesive layer disposed on at least one side of the base material, the adhesive layer being irradiated with ultraviolet rays of 460 mJ/cm ² at 25° C. The elastic modulus of the meter indenter is below 500 MPa. The adhesive sheet for electronic parts transfer according to claim 1, wherein the amount of sinking of the above-mentioned adhesive sheet obtained by using TMA in a 40°C environment is 3 μm to 27 μm. The adhesive sheet for electronic parts transfer according to claim 1 or 2, wherein the thickness of the above-mentioned adhesive layer is 2.1 μm to 35 μm. The adhesive sheet for transfer of electronic parts according to any one of claims 1 to 3, wherein the elastic modulus of the adhesive layer at 25° C. under a normal state nanoindenter is 0.4 MPa or more. The adhesive sheet for electronic parts transfer according to any one of claims 1 to 4, wherein the normal probe viscosity value of the adhesive layer is 8 N/cm ² or more. The adhesive sheet for electronic component transfer according to any one of claims 1 to 5, wherein the base material comprises a polyester-based resin. The adhesive sheet for electronic parts transfer according to any one of claims 1 to 6, wherein the thickness of the substrate is 30 μm to 200 μm. The adhesive sheet for transferring electronic parts according to any one of claims 1 to 7, wherein the electronic parts are mini LEDs or micro LEDs. The adhesive sheet for electronic component transfer according to any one of claims 1 to 8, comprising the above-mentioned adhesive layer, the above-mentioned base material, and another adhesive layer in this order. A processing method of electronic parts using the adhesive sheet for electronic parts transfer according to any one of claims 1 to 9, and includes: Step a, which transfers the electronic parts arranged on the first member to the above-mentioned adhesive layer of the above-mentioned adhesive sheet; and In step b, the electronic component is picked up by the second member, and the electronic component is peeled off from the adhesive sheet. The processing method of electronic parts according to claim 10, wherein the electronic parts are mini LEDs or micro LEDs. The processing method of electronic parts as claimed in claim 10 or 11, wherein The above step b includes: Step b-1, which makes the second member contact the electronic component on the adhesive layer; Step b-2, which irradiates the above-mentioned adhesive sheet with active energy rays; and In step b-3, the electronic component is picked up by the second member, and the electronic component is peeled off from the adhesive sheet. The processing method of an electronic part according to claim 11 or 12, wherein the first member is a sapphire substrate. The processing method of electronic parts as claimed in claim 13, wherein the electronic parts are micro LEDs, In the above-mentioned step a, including irradiating UV laser light to the above-mentioned sapphire substrate configured with a plurality of micro-LEDs, and transferring the micro-LEDs to the above-mentioned adhesive sheet. The processing method of electronic parts according to claim 14, wherein a part of the micro LEDs arranged on the sapphire substrate is selectively transferred to the adhesive sheet.

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