TW202231458A - Picture display unit and manufacturing method thereof - Google Patents

Picture display unit and manufacturing method thereof Download PDF

Info

Publication number
TW202231458A
TW202231458A TW110132855A TW110132855A TW202231458A TW 202231458 A TW202231458 A TW 202231458A TW 110132855 A TW110132855 A TW 110132855A TW 110132855 A TW110132855 A TW 110132855A TW 202231458 A TW202231458 A TW 202231458A
Authority
TW
Taiwan
Prior art keywords
adhesive layer
display device
image display
elastic modulus
base material
Prior art date
Application number
TW110132855A
Other languages
Chinese (zh)
Inventor
矢野孝伸
趙洪賛
仲野武史
大城創矢
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021138605A external-priority patent/JP7065239B2/en
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202231458A publication Critical patent/TW202231458A/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10018Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/022Mechanical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/023Optical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08Dimensions, e.g. volume
    • B32B2309/10Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105Thickness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00Polyalkenes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

To provide a picture display unit excellent in optical reliability and excellent in durability against various impacts, and also to provide a manufacturing method thereof. An organic EL display device 1 sequentially includes a window member 2, an impact absorption member 3, an organic EL panel member 4 and a protective member 5 on a back side thereof. The impact absorption member 3 has a total light transmittance of 60% or more, a ball impact absorption rate of 0.27%/[mu]m or more per unit thickness and a pen impact absorption rate of 0.10%/[mu]m or more per unit thickness.

Description

影像顯示裝置及其製造方法Image display device and manufacturing method thereof

本發明涉及影像顯示裝置及其製造方法。The present invention relates to an image display device and a manufacturing method thereof.

以往,已知影像顯示裝置具備影像顯示構件。對於所述影像顯示裝置要求光學可靠性高。Conventionally, an image display device is known to include an image display member. The image display device is required to have high optical reliability.

又,檢討了一種具備衝擊吸收薄膜之影像顯示裝置,即便對該影像顯示裝置施加衝擊,仍可抑制影像顯示構件之表面損傷。Furthermore, an image display device including an impact-absorbing film was examined, which can suppress surface damage to the image display member even if an impact is applied to the image display device.

例如,提出了一種於厚度方向上依序具備支持層與黏著層之衝擊吸收薄膜(例如參照下述專利文獻1)。專利文獻1之比較例記載的衝擊吸收薄膜揭示支持層為厚PET薄膜之構成。 先前技術文獻 專利文獻 For example, a shock-absorbing film including a support layer and an adhesive layer in this order in the thickness direction has been proposed (for example, refer to the following Patent Document 1). The shock-absorbing film described in the comparative example of Patent Document 1 reveals that the support layer is a thick PET film. prior art literature Patent Literature

專利文獻1:日本專利特開2020-060689號公報Patent Document 1: Japanese Patent Laid-Open No. 2020-060689

發明欲解決之課題 但,專利文獻1記載之衝擊吸收薄膜有每單位厚度的衝擊吸收率不夠充分之不良情況。此時,雖可減薄厚度,但衝擊吸收性會不佳,或者雖衝擊吸收性優異,但厚度會變厚。 The problem to be solved by the invention However, the shock-absorbing film described in Patent Document 1 has the disadvantage that the shock-absorbing rate per unit thickness is insufficient. In this case, although the thickness can be reduced, the impact absorption is not good, or the thickness is increased although the impact absorption is excellent.

尤其要求衝擊吸收薄膜要有對球造成之衝擊及筆造成之點衝擊這類各種衝擊的耐久性。In particular, the impact absorbing film is required to have durability against various impacts such as ball impact and pen point impact.

本發明提供一種光學可靠性優異且對各種衝擊的耐久性優異的影像顯示裝置及其製造方法。The present invention provides an image display device excellent in optical reliability and excellent in durability against various impacts, and a method for producing the same.

用以解決課題之手段 本發明(1)包含一種影像顯示裝置,其往厚度方向一側依序具備視窗構件、衝擊吸收構件、面板構件及保護構件;前述衝擊吸收構件具有60%以上之全光線透射率;前述衝擊吸收構件之每單位厚度的球衝擊吸收率為0.27%/µm以上,該衝擊吸收構件之每單位厚度的球衝擊吸收率係使重量10g、直徑13mm之不鏽鋼製球從20cm之高度落下至前述衝擊吸收構件來求算前述衝擊吸收構件之前述球衝擊吸收率,再將該球衝擊吸收率除以前述衝擊吸收構件之厚度而得;前述衝擊吸收構件之每單位厚度的筆衝擊吸收率為0.10%/µm以上,該衝擊吸收構件之每單位厚度的筆衝擊吸收率係使重量7g、前端部之球珠直徑0.7mm之原子筆從20cm之高度落下至前述衝擊吸收構件來求算前述衝擊吸收構件之筆衝擊吸收率,再將該筆衝擊吸收率除以前述衝擊吸收構件之厚度而得。 means of solving problems The present invention (1) includes an image display device, which includes a window member, an impact absorbing member, a panel member and a protective member in this order from one side in the thickness direction; the aforementioned impact absorbing member has a total light transmittance of 60% or more; the aforementioned impact absorbing member The ball impact absorption rate per unit thickness of the member is 0.27%/µm or more. The ball impact absorption rate per unit thickness of the impact absorption member is made by dropping a stainless steel ball with a weight of 10g and a diameter of 13mm from a height of 20cm to the aforesaid impact absorption Calculate the ball impact absorption rate of the shock absorbing member, and then divide the ball shock absorption rate by the thickness of the shock absorbing member; the pen shock absorption rate per unit thickness of the shock absorbing member is 0.10%/ µm or more, the pen shock absorption rate per unit thickness of the shock absorbing member was calculated by dropping a ballpoint pen with a weight of 7 g and a ball diameter of 0.7 mm at the tip of the shock absorbing member from a height of 20 cm to the shock absorbing member. The impact absorption rate of the pen is obtained by dividing the impact absorption rate of the pen by the thickness of the aforementioned impact absorbing member.

該影像顯示裝置中,衝擊吸收構件具有60%以上之全光線透射率。因此,影像顯示裝置之光學可靠性高。In the image display device, the shock absorbing member has a total light transmittance of 60% or more. Therefore, the optical reliability of the image display device is high.

又,該影像顯示裝置中,衝擊吸收構件之每單位厚度的球衝擊吸收率為0.27%/µm以上,且衝擊吸收構件之每單位厚度的筆衝擊吸收率為0.10%/µm以上。因此,影像顯示裝置對球之衝擊及對筆造成之衝擊的耐久性優異。因此,影像顯示裝置對各種衝擊的耐久性優異。Furthermore, in the image display device, the ball impact absorption rate per unit thickness of the shock absorbing member is 0.27%/µm or more, and the pen shock absorption rate per unit thickness of the shock absorbing member is 0.10%/µm or more. Therefore, the image display device is excellent in durability against impact to the ball and impact to the pen. Therefore, the image display device is excellent in durability against various impacts.

本發明(2)包含如(1)之影像顯示裝置,其中在將前述影像顯示裝置以前述視窗構件朝外側之方式彎折之試驗中,即使以使前述視窗構件中之朝兩外側之2個表面的間隔成為8mm之方式彎折200,000次,前述面板構件亦無損傷。The present invention (2) includes the image display device according to (1), wherein in the test of bending the image display device in such a way that the window members face outwards, even if two of the window members face outwards The surface was folded 200,000 times so that the distance between the surfaces was 8 mm, and the panel member was not damaged.

以該影像顯示裝置來說,即便於上述彎折試驗中將影像顯示裝置彎折200,000次,面板構件亦無損傷。因此,影像顯示裝置之耐彎折性優異。In this image display device, even if the image display device was bent 200,000 times in the above-mentioned bending test, the panel member was not damaged. Therefore, the bending resistance of the image display device is excellent.

本發明(3)包含如(1)或(2)之影像顯示裝置,其中前述衝擊吸收構件往前述厚度方向一側依序具備第1黏著層、基材及第2黏著層。The present invention (3) includes the image display device according to (1) or (2), wherein the shock absorbing member includes a first adhesive layer, a base material, and a second adhesive layer in this order toward one side in the thickness direction.

本發明(4)包含如(3)之影像顯示裝置,其中前述第1黏著層係接觸前述視窗構件,且前述第2黏著層係接觸前述面板構件。The present invention (4) includes the image display device according to (3), wherein the first adhesive layer is in contact with the window member, and the second adhesive layer is in contact with the panel member.

該影像顯示裝置中,第1黏著層係黏著於視窗構件上。第2黏著層係黏著於面板構件上。因此,視窗構件係透過衝擊吸收構件而黏著於面板構件上。而且,由於具備基材、以及包夾基材之第1黏著層及第2黏著層的衝擊吸收構件係黏著於視窗構件與面板構件上,故耐彎折性更優異。In the image display device, the first adhesive layer is adhered to the window member. The second adhesive layer is adhered to the panel member. Therefore, the window member is adhered to the panel member through the impact absorbing member. Furthermore, since the shock absorbing member including the base material and the first adhesive layer and the second adhesive layer sandwiching the base material is adhered to the window member and the panel member, it is more excellent in bending resistance.

本發明(5)包含如(3)或(4)之影像顯示裝置,其中前述第2黏著層在25℃下之剪切儲存彈性模數G'與前述第1黏著層在25℃下之剪切儲存彈性模數G'相同或較高。The present invention (5) includes the image display device according to (3) or (4), wherein the shear storage elastic modulus G' of the second adhesive layer at 25°C and the shear modulus of the first adhesive layer at 25°C The storage elastic modulus G' is the same or higher.

本發明(6)包含如(3)至(5)中任一項之影像顯示裝置,其中前述第1黏著層在25℃下之剪切儲存彈性模數G'為0.01MPa以上且0.05MPa以下。The present invention (6) includes the image display device according to any one of (3) to (5), wherein the shear storage elastic modulus G' of the first adhesive layer at 25° C. is 0.01 MPa or more and 0.05 MPa or less .

本發明(7)包含如(3)至(6)中任一項之影像顯示裝置,其中前述第2黏著層在25℃下之剪切儲存彈性模數G'為0.10MPa以上且0.15MPa以下。The present invention (7) includes the image display device according to any one of (3) to (6), wherein the shear storage elastic modulus G' of the second adhesive layer at 25° C. is 0.10 MPa or more and 0.15 MPa or less .

本發明(8)包含如(3)至(7)中任一項之影像顯示裝置,其中前述第2黏著層在25℃下之剪切儲存彈性模數G'減去前述第1黏著層在25℃下之剪切儲存彈性模數G'之值為0.06MPa以上。The present invention (8) includes the image display device according to any one of (3) to (7), wherein the shear storage elastic modulus G' of the second adhesive layer at 25°C minus the first adhesive layer is The value of the shear storage elastic modulus G' at 25°C is 0.06 MPa or more.

本發明(9)包含如(3)至(8)中任一項之影像顯示裝置,其中前述基材為單數。The present invention (9) includes the image display device according to any one of (3) to (8), wherein the aforementioned substrate is singular.

又,在該影像顯示裝置中,由於基材為單數,故構成簡易。Moreover, in this image display apparatus, since the base material is singular, the structure is simple.

本發明(10)包含如(3)至(8)中任一項之影像顯示裝置,其中前述基材為複數,且該影像顯示裝置更具備中間黏著層,該中間黏著層係配置於複數個前述基材之間。The present invention (10) includes the image display device according to any one of (3) to (8), wherein the substrates are plural, and the image display device further includes an intermediate adhesive layer, and the intermediate adhesive layer is disposed on the plurality of substrates. between the aforementioned substrates.

在該影像顯示裝置中,基材為複數。又,影像顯示裝置更具備中間黏著層,該中間黏著層係配置於複數個基材之間。因此,易設計符合用途及目的之各種衝擊吸收性能。In this image display device, the base material is plural. In addition, the image display device further includes an intermediate adhesive layer, and the intermediate adhesive layer is disposed between the plurality of substrates. Therefore, it is easy to design various shock absorption properties suitable for the application and purpose.

本發明(11)包含如(10)之影像顯示裝置,其中前述中間黏著層在25℃下之剪切儲存彈性模數G'為前述第1黏著層在25℃下之剪切儲存彈性模數G'以上且前述第2黏著層在25℃下之剪切儲存彈性模數G'以下。The present invention (11) includes the image display device according to (10), wherein the shear storage elastic modulus G' of the intermediate adhesive layer at 25°C is the shear storage elastic modulus G' of the first adhesive layer at 25°C G' or more and the shear storage elastic modulus G' of the said 2nd adhesive layer at 25 degreeC or less.

本發明(12)包含如(10)或(11)之影像顯示裝置,其中前述中間黏著層在25℃下之剪切儲存彈性模數G'高於前述第1黏著層在25℃下之剪切儲存彈性模數G',且低於前述第2黏著層在25℃下之剪切儲存彈性模數G'。The present invention (12) includes the image display device according to (10) or (11), wherein the shear storage elastic modulus G' of the intermediate adhesive layer at 25°C is higher than the shear modulus G' of the first adhesive layer at 25°C The shear storage elastic modulus G' is lower than the shear storage elastic modulus G' of the second adhesive layer at 25°C.

本發明(13)包含如(10)至(12)中任一項之影像顯示裝置,其中前述中間黏著層在25℃下之剪切儲存彈性模數G'大於0.05MPa且在0.15MPa以下。The present invention (13) includes the image display device according to any one of (10) to (12), wherein the shear storage elastic modulus G' of the intermediate adhesive layer at 25°C is greater than 0.05 MPa and less than 0.15 MPa.

本發明(14)包含如(10)至(13)中任一項之影像顯示裝置,其中前述基材包含:第1基材,其係接觸前述第1黏著層;及第2基材,其係接觸前述第2黏著層;並且,前述第1基材較前述第2基材更薄。The present invention (14) includes the image display device according to any one of (10) to (13), wherein the substrate comprises: a first substrate, which is in contact with the first adhesive layer; and a second substrate, which is in contact with the second adhesive layer; and the first substrate is thinner than the second substrate.

本發明(15)包含如(10)至(13)中任一項之影像顯示裝置,其中前述基材包含:第1基材,其係接觸前述第1黏著層;及第2基材,其係接觸前述第2黏著層;並且,前述第1基材較前述第2基材更厚。The present invention (15) includes the image display device according to any one of (10) to (13), wherein the substrate comprises: a first substrate, which is in contact with the first adhesive layer; and a second substrate, which is in contact with the second adhesive layer; and the first base material is thicker than the second base material.

本發明(16)包含如(3)至(15)中任一項之影像顯示裝置,其中前述基材之厚度相對於前述衝擊吸收構件之厚度的比率為0.20以上且0.35以下。The present invention (16) includes the image display device according to any one of (3) to (15), wherein the ratio of the thickness of the substrate to the thickness of the shock absorbing member is 0.20 or more and 0.35 or less.

本發明(17)包含如(3)至(16)中任一項之影像顯示裝置,其中前述基材之材料為環烯烴樹脂及/或聚酯樹脂。The present invention (17) includes the image display device according to any one of (3) to (16), wherein the material of the aforementioned substrate is a cycloolefin resin and/or a polyester resin.

本發明(18)包含如(17)之影像顯示裝置,其中前述烯烴樹脂為環烯烴樹脂。The present invention (18) includes the image display device according to (17), wherein the aforementioned olefin resin is a cycloolefin resin.

本發明(19)包含如(17)之影像顯示裝置,其中前述聚酯樹脂為聚對苯二甲酸乙二酯。The present invention (19) includes the image display device according to (17), wherein the aforementioned polyester resin is polyethylene terephthalate.

本發明(20)包含一種影像顯示裝置之製造方法,該影像顯示裝置往厚度方向一側依序具備視窗構件、第1黏著層、基材、第2黏著層、面板構件及保護構件;該製造方法具備以下步驟:第1步驟,係試作試作品;第2步驟,係評估前述試作品;第3步驟,係根據前述評估來決定製造條件;及第4步驟,係根據前述製造條件來製造製品;前述第2步驟具備以下步驟:第5步驟,係由前述試作品製作第1試樣及第2試樣;第6步驟,係使球落下至前述第1試樣,且使原子筆落下至前述第2試樣;及第7步驟,係在第6步驟後,判斷前述第1試樣及前述第2試樣有無損傷;前述第3步驟中,當評估前述試作品是在前述第1試樣有損傷時,變更前述製造條件使前述第1黏著層及前述第2黏著層之合計厚度更厚;當評估前述試作品是在前述第2試樣有損傷時,進行變更使前述基材之厚度更厚。The present invention (20) includes a method for manufacturing an image display device, the image display device includes a window member, a first adhesive layer, a substrate, a second adhesive layer, a panel member and a protective member in this order from one side in the thickness direction; the manufacturing method The method includes the following steps: the first step is to make a trial work; the second step is to evaluate the aforementioned trial work; the third step is to determine manufacturing conditions based on the aforementioned evaluation; and the fourth step is to manufacture a product based on the aforementioned manufacturing conditions ; The aforementioned second step includes the following steps: the fifth step is to make the first sample and the second sample from the aforementioned test work; the sixth step is to drop the ball to the aforementioned first sample and drop the ballpoint pen to the The second sample; and the seventh step, which is after the sixth step, to determine whether the first sample and the second sample are damaged; in the third step, when evaluating the test piece is in the first test. When the sample is damaged, the manufacturing conditions are changed to make the total thickness of the first adhesive layer and the second adhesive layer thicker; when the test piece is evaluated as being damaged in the second sample, changes are made to make the base material thicker. Thicker.

根據該製造方法,係評估試作品才決定製造條件,因此可提升產率。According to this manufacturing method, the manufacturing conditions are determined only after evaluating the trial work, so that the productivity can be improved.

發明效果 本發明影像顯示裝置之光學可靠性優異,且對各種衝擊的耐久性優異。 Invention effect The image display device of the present invention is excellent in optical reliability and excellent in durability against various impacts.

本發明製造方法可提升產率。The manufacturing method of the present invention can improve the yield.

[第1實施形態] 參照圖1說明本發明影像顯示構件之第1實施形態之有機電致發光顯示裝置。以下,有機電致發光顯示裝置僅簡稱為「有機EL顯示裝置」。圖1中,有機EL顯示裝置1之表側為使用者之視辨側,且為厚度方向另一側。背側為表側之相反側,且為厚度方向一側之一例。 [1st Embodiment] An organic electroluminescence display device according to a first embodiment of the image display member of the present invention will be described with reference to FIG. 1 . Hereinafter, the organic electroluminescence display device is simply referred to as an "organic EL display device". In FIG. 1 , the front side of the organic EL display device 1 is the visual side of the user and the other side in the thickness direction. The back side is the opposite side to the front side, and is an example of one side in the thickness direction.

如圖1所示,有機EL顯示裝置1係朝面方向延伸。面方向係與表背方向正交。有機EL顯示裝置1具有例如平板形狀。有機EL顯示裝置1具有表面21與背面22。表面21與背面22皆為平坦。表面21係可供使用者視辨之面。有機EL顯示裝置1例如可以中間部24為中心來彎折。中間部24位於2個邊23之間。2個邊23係於面方向上隔著間隔相對向。As shown in FIG. 1 , the organic EL display device 1 extends in the plane direction. The face direction is orthogonal to the front and back direction. The organic EL display device 1 has, for example, a flat plate shape. The organic EL display device 1 has a front surface 21 and a back surface 22 . Both the front surface 21 and the back surface 22 are flat. The surface 21 is the surface that can be visually recognized by the user. The organic EL display device 1 can be bent, for example, with the intermediate portion 24 as the center. The middle portion 24 is located between the two sides 23 . The two sides 23 are opposed to each other with an interval therebetween in the plane direction.

有機EL顯示裝置1往背側依序具備視窗構件2、衝擊吸收構件3、有機EL面板構件4及保護構件5。另一方面,在本實施形態中,有機EL顯示裝置1不具備偏光件。偏光件通常係配置於視窗構件2與有機EL面板構件4之間。第1實施形態之有機EL顯示裝置1係具備衝擊吸收構件3來取代偏光件。有機EL顯示裝置1宜僅具備視窗構件2、衝擊吸收構件3、有機EL面板構件4及保護構件5。The organic EL display device 1 includes a window member 2 , a shock absorbing member 3 , an organic EL panel member 4 , and a protective member 5 in this order toward the back side. On the other hand, in the present embodiment, the organic EL display device 1 does not include a polarizer. The polarizer is usually arranged between the window member 2 and the organic EL panel member 4 . The organic EL display device 1 of the first embodiment includes a shock absorbing member 3 instead of a polarizer. The organic EL display device 1 preferably includes only the window member 2 , the shock absorbing member 3 , the organic EL panel member 4 , and the protective member 5 .

視窗構件2係形成有機EL顯示裝置1之表面21。視窗構件2係朝面方向延伸。視窗構件2例如往背側依序具備硬塗層6(參照假想線)與視窗薄膜7。或者,視窗構件2僅具備視窗薄膜7。The window member 2 forms the surface 21 of the organic EL display device 1 . The window member 2 extends in the face direction. The window member 2 includes, for example, a hard coat layer 6 (refer to an imaginary line) and a window film 7 in this order toward the back side. Alternatively, the window member 2 includes only the window film 7 .

視窗薄膜7之材料若為樹脂,硬塗層6便宜設於視窗構件2上。硬塗層6係保護構件,以抑制在有機EL顯示裝置1之表面21因滑擦造成之損傷。硬塗層6例如係由硬化性組成物之硬化物或熱塑性組成物之成形體構成。硬塗層6之厚度例如為5µm以上,宜為7µm以上,又例如為30µm以下。硬塗層6例如記載於日本專利特開2020-064236號公報中。另一方面,視窗薄膜7之材料若為玻璃,硬塗層6便不設於視窗構件2上。If the material of the window film 7 is resin, the hard coat layer 6 can be inexpensively provided on the window member 2 . The hard coat layer 6 is a protective member to suppress damage due to sliding on the surface 21 of the organic EL display device 1 . The hard coat layer 6 is composed of, for example, a cured product of a curable composition or a molded body of a thermoplastic composition. The thickness of the hard coat layer 6 is, for example, 5 µm or more, preferably 7 µm or more, or, for example, 30 µm or less. The hard coat layer 6 is described in, for example, Japanese Patent Laid-Open No. 2020-064236. On the other hand, if the material of the window film 7 is glass, the hard coat layer 6 is not provided on the window member 2 .

視窗構件2具備硬塗層6時,視窗薄膜7係配置於硬塗層6之背面。具體上,視窗薄膜7係接觸硬塗層6之背面全部。當視窗構件2不具備硬塗層6時,視窗薄膜7便形成有機EL顯示裝置1之表面21。視窗薄膜7之材料可舉例如樹脂及玻璃。樹脂可舉例如聚醯亞胺樹脂、丙烯酸樹脂及聚碳酸酯樹脂。視窗薄膜7之厚度例如為1µm以上,又例如為100µm以下。視窗薄膜7可使用市售物。市售物可舉例如「CPI」(KOLON公司製)、G-LEAF(Nippon Electric Glass Co.,Ltd.製)。視窗薄膜7例如記載於日本專利特開2020-064236號公報中。When the window member 2 includes the hard coat layer 6 , the window film 7 is arranged on the back surface of the hard coat layer 6 . Specifically, the window film 7 is in contact with the entire rear surface of the hard coat layer 6 . When the window member 2 does not have the hard coat layer 6 , the window film 7 forms the surface 21 of the organic EL display device 1 . As a material of the window film 7, resin and glass are mentioned, for example. Examples of resins include polyimide resins, acrylic resins, and polycarbonate resins. The thickness of the window film 7 is, for example, 1 µm or more, or, for example, 100 µm or less. A commercially available product can be used for the window film 7 . Commercially available products include, for example, "CPI" (manufactured by KOLON Corporation) and G-LEAF (manufactured by Nippon Electric Glass Co., Ltd.). The window film 7 is described in, for example, Japanese Patent Laid-Open No. 2020-064236.

視窗構件2之全光線透射率例如為80%以上,宜為85%以上。視窗構件2之全光線透射率的上限無特別限定。視窗構件2之全光線透射率的上限例如為100%。視窗構件2之全光線透射率係根據JIS K 7375-2008進行測定。以下其他構件之全光線透射率亦以與上述相同方式測定。The total light transmittance of the window member 2 is, for example, 80% or more, preferably 85% or more. The upper limit of the total light transmittance of the window member 2 is not particularly limited. The upper limit of the total light transmittance of the window member 2 is, for example, 100%. The total light transmittance of the window member 2 was measured according to JIS K 7375-2008. The total light transmittance of the following other members was also measured in the same manner as above.

衝擊吸收構件3係朝面方向延伸。衝擊吸收構件3係配置於視窗構件2之背面。具體上,衝擊吸收構件3係接觸視窗構件2之背面全部。衝擊吸收構件3係配置於與習知之有機EL顯示裝置所具備之偏光件相同之位置。衝擊吸收構件3往背側依序具備第1黏著層8、基材9及第2黏著層10。第1實施形態中,衝擊吸收構件3宜僅具備第1黏著層8、基材9及第2黏著層10。The shock absorbing member 3 extends in the face direction. The shock absorbing member 3 is arranged on the back surface of the window member 2 . Specifically, the shock absorbing member 3 is in contact with the entire rear surface of the window member 2 . The shock absorbing member 3 is arranged at the same position as the polarizer included in the conventional organic EL display device. The shock absorbing member 3 includes a first adhesive layer 8 , a base material 9 , and a second adhesive layer 10 in this order toward the back side. In the first embodiment, the shock absorbing member 3 preferably includes only the first adhesive layer 8 , the base material 9 and the second adhesive layer 10 .

第1黏著層8係朝面方向延伸。第1實施形態中,第1黏著層8係單數。第1黏著層8係形成衝擊吸收構件3之表面。第1黏著層8係配置於視窗薄膜7之背面。具體上,第1黏著層8係接觸視窗薄膜7之背面全部。第1黏著層8之材料及物性的詳細內容將於後述。The first adhesive layer 8 extends in the surface direction. In the first embodiment, the first adhesive layer 8 is a singular number. The first adhesive layer 8 forms the surface of the shock absorbing member 3 . The first adhesive layer 8 is disposed on the back surface of the window film 7 . Specifically, the first adhesive layer 8 is in contact with the entire rear surface of the window film 7 . Details of the material and physical properties of the first adhesive layer 8 will be described later.

基材9係朝面方向延伸。第1實施形態中,基材9係單數。基材9具有薄片形狀。基材9係配置於第1黏著層8之背面。具體上,基材9係接觸第1黏著層8之背面全部。基材9之材料及物性的詳細內容將於後述。The substrate 9 extends in the face direction. In the first embodiment, the base material 9 is singular. The base material 9 has a sheet shape. The base material 9 is arranged on the back surface of the first adhesive layer 8 . Specifically, the base material 9 is in contact with the entire rear surface of the first adhesive layer 8 . Details of the material and physical properties of the base material 9 will be described later.

第2黏著層10係朝面方向延伸。第2黏著層10係單數。第2黏著層10係形成衝擊吸收構件3之背面。第2黏著層10係配置於基材9之背面。具體上,第2黏著層10係接觸基材9之背面全部。第2黏著層10之材料及物性的詳細內容將於後述。The second adhesive layer 10 extends in the surface direction. The second adhesive layer has a single number of 10. The second adhesive layer 10 forms the back surface of the shock absorbing member 3 . The second adhesive layer 10 is disposed on the back surface of the base material 9 . Specifically, the second adhesive layer 10 is in contact with the entire rear surface of the substrate 9 . Details of the material and physical properties of the second adhesive layer 10 will be described later.

衝擊吸收構件3之厚度無特別限定。衝擊吸收構件3之厚度例如為40µm以上,宜為70µm以上,又例如為200µm以下,宜為150µm以下,較宜為100µm以下。衝擊吸收構件3之厚度若在上述上限以下,便容易提高每單位厚度的筆衝擊吸收率。The thickness of the shock absorbing member 3 is not particularly limited. The thickness of the shock absorbing member 3 is, for example, 40 µm or more, preferably 70 µm or more, or, for example, 200 µm or less, preferably 150 µm or less, and more preferably 100 µm or less. When the thickness of the shock absorbing member 3 is below the above-mentioned upper limit, the pen shock absorption rate per unit thickness can be easily improved.

該衝擊吸收構件3具有60%以上之全光線透射率、0.27%/µm以上之每單位厚度的球衝擊吸收率及0.10%/µm以上之每單位厚度的筆衝擊吸收率。The impact absorbing member 3 has a total light transmittance of 60% or more, a ball impact absorption rate per unit thickness of 0.27%/µm or more, and a pen impact absorption rate per unit thickness of 0.10%/µm or more.

衝擊吸收構件3之全光線透射率若低於60%,視辨性便會降低。衝擊吸收構件3之全光線透射率宜為65%以上,較宜為70%以上,更宜為80%以上,特別宜為85%以上,最宜為90%以上。衝擊吸收構件3之全光線透射率的上限無特別限定。衝擊吸收構件3之全光線透射率的上限例如為100%,又為99%。此外,視窗構件2與衝擊吸收構件3之積層體的全光線透射率若為60%以上,便可謂視窗構件2之全光線透射率為60%以上。關於其他下限值,亦可以與下限值為60%之情況相同方式來定義。When the total light transmittance of the shock absorbing member 3 is less than 60%, the visibility is lowered. The total light transmittance of the impact absorbing member 3 is preferably 65% or more, more preferably 70% or more, more preferably 80% or more, particularly preferably 85% or more, and most preferably 90% or more. The upper limit of the total light transmittance of the shock absorbing member 3 is not particularly limited. The upper limit of the total light transmittance of the shock absorbing member 3 is, for example, 100% and 99%. Moreover, if the total light transmittance of the laminated body of the window member 2 and the shock absorbing member 3 is 60% or more, it can be said that the total light transmittance of the window member 2 is 60% or more. Other lower limit values can also be defined in the same manner as in the case where the lower limit value is 60%.

衝擊吸收構件3之每單位厚度的球衝擊吸收率為0.27%/µm以上。The ball shock absorption rate per unit thickness of the shock absorbing member 3 is 0.27%/µm or more.

相對此,衝擊吸收構件3之每單位厚度的球衝擊吸收率若小於0.27%/µm,每單位厚度對球的耐衝擊性便低。因此,無法獲得效率良好之對球90(參照圖7)之衝擊吸收效果。衝擊吸收構件3之每單位厚度的球衝擊吸收率宜為0.30%/µm以上,較宜為0.32%/µm以上,更宜為0.34%/µm以上。On the other hand, if the ball impact absorption rate per unit thickness of the impact absorbing member 3 is less than 0.27%/µm, the impact resistance to balls per unit thickness is low. Therefore, an efficient impact absorbing effect on the ball 90 (see FIG. 7 ) cannot be obtained. The ball impact absorption rate per unit thickness of the impact absorbing member 3 is preferably 0.30%/µm or more, more preferably 0.32%/µm or more, and more preferably 0.34%/µm or more.

衝擊吸收構件3之每單位厚度的球衝擊吸收率係將衝擊吸收構件3之球衝擊吸收率除以衝擊吸收構件3之厚度而得之值。如圖2A所示,衝擊吸收構件3之球衝擊吸收率係以下述方式求得:使重量10g、直徑13mm之不鏽鋼製球90從20cm之高度落下至衝擊吸收構件3。The ball shock absorption rate per unit thickness of the shock absorbing member 3 is a value obtained by dividing the ball shock absorption rate of the shock absorbing member 3 by the thickness of the shock absorbing member 3 . As shown in FIG. 2A , the ball shock absorption rate of the shock absorbing member 3 was obtained by dropping a stainless steel ball 90 having a weight of 10 g and a diameter of 13 mm on the shock absorbing member 3 from a height of 20 cm.

衝擊吸收構件3之球衝擊吸收率無特別限定。衝擊吸收構件3之球衝擊吸收率例如為20%以上,宜為25%以上,較宜為30%以上,更宜為40%以上,特別宜為50%以上。衝擊吸收構件3之球衝擊吸收率的上限無特別限定。衝擊吸收構件3之球衝擊吸收率的上限為例如90%,又為85%。The spherical shock absorption rate of the shock absorbing member 3 is not particularly limited. The ball impact absorption rate of the impact absorbing member 3 is, for example, 20% or more, preferably 25% or more, more preferably 30% or more, more preferably 40% or more, and particularly preferably 50% or more. The upper limit of the spherical shock absorption rate of the shock absorbing member 3 is not particularly limited. The upper limit of the spherical shock absorption rate of the shock absorbing member 3 is, for example, 90% and 85%.

衝擊吸收構件3之每單位厚度的筆衝擊吸收率為0.10%/µm以上。The pen shock absorption rate per unit thickness of the shock absorbing member 3 is 0.10%/µm or more.

相對此,衝擊吸收構件3之每單位厚度的筆衝擊吸收率若小於0.10%/µm,每單位厚度對筆的耐衝擊性便低。因此,無法獲得效率良好之對筆(參照圖8)之衝擊吸收效果。衝擊吸收構件3之每單位厚度的筆衝擊吸收率宜為0.11%/µm以上,較宜為0.12%/µm以上,更宜為0.13%/µm以上,更以0.14%/µm以上、0.15%/µm以上、0.17%/µm以上、0.19%/µm以上、0.20%/µm以上、0.22%/µm以上為佳。On the other hand, if the pen impact absorption rate per unit thickness of the impact absorbing member 3 is less than 0.10%/µm, the impact resistance to the pen per unit thickness is low. Therefore, the impact absorption effect on the pen (see FIG. 8 ) with high efficiency cannot be obtained. The pen shock absorption rate per unit thickness of the shock absorbing member 3 should preferably be 0.11%/µm or more, more preferably 0.12%/µm or more, more preferably 0.13%/µm or more, more preferably 0.14%/µm or more, 0.15%/µm or more. µm or more, preferably 0.17%/µm or more, 0.19%/µm or more, 0.20%/µm or more, 0.22%/µm or more.

衝擊吸收構件3之每單位厚度的筆衝擊吸收率係將衝擊吸收構件3之筆衝擊吸收率除以衝擊吸收構件3之厚度而得之值。如圖3A所示,衝擊吸收構件3之筆衝擊吸收率係以下述方式求得:使重量7g、前端部之球珠96的直徑為0.7mm之筆95從20cm之高度落下至衝擊吸收構件3。The pen shock absorption rate per unit thickness of the shock absorbing member 3 is a value obtained by dividing the pen shock absorption rate of the shock absorbing member 3 by the thickness of the shock absorbing member 3 . As shown in FIG. 3A , the pen shock absorption rate of the shock absorbing member 3 was obtained by dropping a pen 95 with a weight of 7 g and a ball 96 having a diameter of 0.7 mm at the tip of the shock absorbing member 3 from a height of 20 cm. .

衝擊吸收構件3之筆衝擊吸收率無特別限定。衝擊吸收構件3之筆衝擊吸收率例如為5%以上,宜為6%以上,較宜為7%以上,更宜為8%以上,特別宜為9%以上,更以10%以上、11%以上、15%以上、20%以上、25%以上、30%以上為佳。衝擊吸收構件3之筆衝擊吸收率的上限無特別限定。衝擊吸收構件3之筆衝擊吸收率的上限為例如85%,又為80%。The pen shock absorption rate of the shock absorbing member 3 is not particularly limited. The shock absorption rate of the shock absorbing member 3 is, for example, 5% or more, preferably 6% or more, more preferably 7% or more, more preferably 8% or more, particularly preferably 9% or more, more preferably 10% or more, 11% or more Above, above 15%, above 20%, above 25%, above 30% is preferred. The upper limit of the shock absorption rate of the shock absorbing member 3 is not particularly limited. The upper limit of the shock absorption rate of the shock absorbing member 3 is, for example, 85% and 80%.

圖1所示有機EL面板構件4為面板構件之一例。有機EL面板構件4係朝面方向延伸。有機EL面板構件4係配置於衝擊吸收構件3之背面。有機EL面板構件4係接觸衝擊吸收構件3之背面全部。具體上,有機EL面板構件4係接觸第2黏著層10。有機EL面板構件4包含薄膜密封層11與面板本體12。The organic EL panel member 4 shown in FIG. 1 is an example of a panel member. The organic EL panel member 4 extends in the surface direction. The organic EL panel member 4 is arranged on the back surface of the shock absorbing member 3 . The organic EL panel member 4 is in contact with the entire rear surface of the shock absorbing member 3 . Specifically, the organic EL panel member 4 is in contact with the second adhesive layer 10 . The organic EL panel member 4 includes a film sealing layer 11 and a panel body 12 .

薄膜密封層11係稱為TFE(Thin Film Encapsulation)。薄膜密封層11係朝面方向延伸。薄膜密封層11係形成有機EL面板構件4之表面。薄膜密封層11係配置於第2黏著層10之背面。具體上,薄膜密封層11係接觸第2黏著層10之背面全部。薄膜密封層11之硬度高,但韌性低。薄膜密封層11之材料無特別限定。具體上,薄膜密封層11之材料可舉例如無機化合物及樹脂。 無機化合物可舉例如氮化矽、氧氮化矽、氮化碳及氧化鋁。 The film sealing layer 11 is called TFE (Thin Film Encapsulation). The film sealing layer 11 extends in the face direction. The thin film sealing layer 11 forms the surface of the organic EL panel member 4 . The film sealing layer 11 is arranged on the back surface of the second adhesive layer 10 . Specifically, the film sealing layer 11 is in contact with the entire rear surface of the second adhesive layer 10 . The film sealing layer 11 has high hardness but low toughness. The material of the film sealing layer 11 is not particularly limited. Specifically, the material of the thin film sealing layer 11 can be, for example, an inorganic compound and a resin. Examples of inorganic compounds include silicon nitride, silicon oxynitride, carbon nitride, and aluminum oxide.

面板本體12係朝面方向延伸。面板本體12之表面係被薄膜密封層11被覆。面板本體12係形成有機EL面板構件4之背面。雖未圖示,但面板本體12包含基板、2個電極及被2個電極包夾之有機EL層。The panel body 12 extends in the face direction. The surface of the panel body 12 is covered by the film sealing layer 11 . The panel body 12 forms the back surface of the organic EL panel member 4 . Although not shown, the panel body 12 includes a substrate, two electrodes, and an organic EL layer sandwiched by the two electrodes.

有機EL面板構件4之厚度例如為40µm以下,宜為30µm以下,較宜為20µm以下,又例如為10µm以上。The thickness of the organic EL panel member 4 is, for example, 40 µm or less, preferably 30 µm or less, more preferably 20 µm or less, and, for example, 10 µm or more.

保護構件5係朝面方向延伸。保護構件5係配置於有機EL面板構件4之背面。具體上,保護構件5係接觸有機EL面板構件4之背面全部。保護構件5係從背側保護有機EL面板構件4。保護構件5係形成有機EL顯示裝置1之背面22。保護構件5往背側依序具備表側黏著層13與保護基材14。又,保護構件5亦可例如如假想線所示,在保護基材14之背側依序具備背側黏著層15與金屬板16。此時,保護構件5往背側依序具備表側黏著層13、保護基材14、背側黏著層15及金屬板16。The protective member 5 extends in the face direction. The protection member 5 is arrange|positioned at the back surface of the organic electroluminescent panel member 4. Specifically, the protective member 5 is in contact with the entire rear surface of the organic EL panel member 4 . The protective member 5 protects the organic EL panel member 4 from the back side. The protective member 5 forms the back surface 22 of the organic EL display device 1 . The protective member 5 includes a front-side adhesive layer 13 and a protective base material 14 in this order toward the back side. In addition, the protective member 5 may include, for example, a backside adhesive layer 15 and a metal plate 16 on the backside of the protective base material 14 in this order, as shown by a phantom line. At this time, the protective member 5 includes the front side adhesive layer 13 , the protective base material 14 , the back side adhesive layer 15 and the metal plate 16 in this order toward the back side.

表側黏著層13係配置於面板本體12之背面。具體上,表側黏著層13係接觸面板本體12之背面全部。又,表側黏著層13係形成保護構件5之表面。表側黏著層13之材料無特別限定。表側黏著層13亦可由與後述第1黏著層8相同材料構成。表側黏著層13之厚度例如為1µm以上,宜為5µm以上,又例如為50µm以下,宜為40µm以下。The front side adhesive layer 13 is disposed on the back surface of the panel body 12 . Specifically, the front-side adhesive layer 13 is in contact with the entire rear surface of the panel body 12 . In addition, the surface-side adhesive layer 13 forms the surface of the protective member 5 . The material of the surface side adhesive layer 13 is not particularly limited. The surface-side adhesive layer 13 may be formed of the same material as the first adhesive layer 8 to be described later. The thickness of the surface-side adhesive layer 13 is, for example, 1 µm or more, preferably 5 µm or more, and, for example, 50 µm or less, preferably 40 µm or less.

保護基材14係配置於表側黏著層13之背面。具體上,保護基材14係接觸保護基材14之背面全部。保護基材14之材料無特別限定。保護基材14亦可由與基材9相同材料構成。保護基材14之厚度例如為5µm以上,宜為10µm以上,又例如為250µm以下,宜為100µm以下。The protective substrate 14 is disposed on the back of the front-side adhesive layer 13 . Specifically, the protective substrate 14 is in contact with the entire rear surface of the protective substrate 14 . The material of the protective substrate 14 is not particularly limited. The protective base material 14 may be made of the same material as the base material 9 . The thickness of the protective substrate 14 is, for example, 5 µm or more, preferably 10 µm or more, and, for example, 250 µm or less, preferably 100 µm or less.

保護構件5具備背側黏著層15與金屬板16時,背側黏著層15係配置於保護基材14之背面。具體上,背側黏著層15係接觸保護基材14之背面全部。背側黏著層15亦可由與後述第1黏著層8相同材料構成。背側黏著層15之厚度例如為10µm以上,宜為30µm以上,又例如為100µm以下,宜為50µm以下。When the protective member 5 includes the backside adhesive layer 15 and the metal plate 16 , the backside adhesive layer 15 is disposed on the backside of the protective substrate 14 . Specifically, the backside adhesive layer 15 is in contact with the entire backside of the protective substrate 14 . The backside adhesive layer 15 may be formed of the same material as the first adhesive layer 8 to be described later. The thickness of the backside adhesive layer 15 is, for example, 10 µm or more, preferably 30 µm or more, and, for example, 100 µm or less, preferably 50 µm or less.

金屬板16係朝面方向延伸。金屬板16係形成有機EL顯示裝置1之背面22。金屬板16係配置於背側黏著層15之背面。具體上,金屬板16係接觸背側黏著層15之背面全部。金屬板16之材料可舉例如金屬。金屬可舉例如鋁、鈦、鋼、42合金、不鏽鋼及鎂合金。金屬宜可舉不鏽鋼。金屬板16之厚度例如為5µm以上,宜為10µm以上,較宜為70µm以上,又例如為200µm以下。The metal plate 16 extends in the face direction. The metal plate 16 forms the back surface 22 of the organic EL display device 1 . The metal plate 16 is disposed on the backside of the backside adhesive layer 15 . Specifically, the metal plate 16 is in contact with the entire back surface of the backside adhesive layer 15 . The material of the metal plate 16 can be, for example, metal. Examples of metals include aluminum, titanium, steel, 42 alloy, stainless steel, and magnesium alloy. The metal should be stainless steel. The thickness of the metal plate 16 is, for example, 5 µm or more, preferably 10 µm or more, more preferably 70 µm or more, and, for example, 200 µm or less.

保護構件5之厚度例如為20µm以上,宜為25µm以上,又例如為1,000µm以下,宜為500µm以下。The thickness of the protective member 5 is, for example, 20 µm or more, preferably 25 µm or more, or, for example, 1,000 µm or less, preferably 500 µm or less.

如圖4A及圖4B所示,在將有機EL顯示裝置1以視窗構件2朝外側之方式彎折之試驗中,即使以使視窗構件2之上述表面21的間隔成為8mm之方式彎折200,000次,有機EL面板構件4宜亦無損傷。As shown in FIGS. 4A and 4B , in the test of bending the organic EL display device 1 so that the window member 2 faces the outside, even if the interval between the above-mentioned surfaces 21 of the window member 2 becomes 8 mm, 200,000 times are folded. , the organic EL panel member 4 should not be damaged.

有機EL面板構件4若不因上述次數之彎折而損傷,該有機EL顯示裝置1便可抑制在彎折後薄膜密封層11之破損。If the organic EL panel member 4 is not damaged by the above-mentioned bending times, the organic EL display device 1 can suppress the damage of the film sealing layer 11 after the bending.

宜為在將有機EL顯示裝置1以視窗構件2朝外側之方式彎折之試驗中,即使以使視窗構件2之表面21的間隔成為6mm之方式彎折200,000次,面板構件亦無損傷。因此,該有機EL顯示裝置1可抑制在彎折後薄膜密封層11之破損。In a test in which the organic EL display device 1 is bent so that the window member 2 faces outward, even if it is bent 200,000 times so that the interval between the surfaces 21 of the window member 2 is 6 mm, the panel member is not damaged. Therefore, the organic EL display device 1 can suppress breakage of the film sealing layer 11 after bending.

[衝擊吸收構件3之詳細內容] 以下,說明衝擊吸收構件3之彈性模數、材料及厚度。 [Details of the shock absorbing member 3] Hereinafter, the elastic modulus, material, and thickness of the shock absorbing member 3 will be described.

[彈性模數] 第2黏著層10與第1黏著層8各自之剪切儲存彈性模數G'無特別限定。第2黏著層10在25℃下之剪切儲存彈性模數G’宜與第1黏著層8在25℃下之剪切儲存彈性模數G相同或更高。第2黏著層10在25℃下之剪切儲存彈性模數G'較宜高於第1黏著層8在25℃下之剪切儲存彈性模數G。第1黏著層8及第2黏著層10各自之剪切儲存彈性模數G'係使用黏彈性測定裝置進行測定。升溫速度為5℃/分鐘,頻率為1Hz。詳細內容記載於後續之實施例。此外,第2黏著層10之剪切儲存彈性模數G'若與第1黏著層8之剪切儲存彈性模數G'相同,便於圖12所示粗線上描繪實施例。第2黏著層10之剪切儲存彈性模數G'若高於第1黏著層8之剪切儲存彈性模數G',便於較圖12所示粗線更左側上方之區域描繪實施例。 [Modulus of elasticity] The shear storage elastic modulus G' of each of the second adhesive layer 10 and the first adhesive layer 8 is not particularly limited. The shear storage elastic modulus G' of the second adhesive layer 10 at 25°C is preferably the same or higher than the shear storage elastic modulus G of the first adhesive layer 8 at 25°C. The shear storage elastic modulus G' of the second adhesive layer 10 at 25°C is preferably higher than the shear storage elastic modulus G of the first adhesive layer 8 at 25°C. The shear storage elastic modulus G' of each of the first adhesive layer 8 and the second adhesive layer 10 was measured using a viscoelasticity measuring apparatus. The heating rate was 5°C/min, and the frequency was 1 Hz. The details are described in the following examples. In addition, if the shear storage elastic modulus G' of the second adhesive layer 10 is the same as the shear storage elastic modulus G' of the first adhesive layer 8, it is convenient to describe the embodiment shown by the thick line in FIG. 12 . If the shear storage elastic modulus G' of the second adhesive layer 10 is higher than the shear storage elastic modulus G' of the first adhesive layer 8, it is convenient to describe the embodiment at the upper left area than the thick line shown in FIG. 12 .

第2黏著層10與第1黏著層8各自之剪切儲存彈性模數G'若滿足上述理想關係,該有機EL顯示裝置1之每單位厚度對球的耐衝擊性便更優異,且每單位厚度對筆的耐衝擊性便更優異。並且,有機EL顯示裝置1之耐彎折性更優異。If the shear storage elastic modulus G′ of the second adhesive layer 10 and the first adhesive layer 8 satisfies the above-mentioned ideal relationship, the organic EL display device 1 has better impact resistance per unit thickness to balls, and per unit thickness The thickness is more excellent in the impact resistance of the pen. Moreover, the bending resistance of the organic EL display device 1 is more excellent.

更具體言之,從第2黏著層10在25℃下之儲存彈性模數G'減去第1黏著層8在25℃下之剪切儲存彈性模數G’之值例如為0.03MPa以上,宜為0.06MPa以上。上述值的上限無限定。上述值的上限例如為0.15MPa。上述值若在上述下限以上,有機EL顯示裝置1每單位厚度對球的耐衝擊性便更優異。又,上述值在0.06MPa以上之區域包圖12所示細實線上方與較該實線更往左側傾斜上方之區域。More specifically, the value obtained by subtracting the shear storage elastic modulus G' of the first adhesive layer 8 at 25° C. from the storage elastic modulus G' of the second adhesive layer 10 at 25° C. is, for example, 0.03 MPa or more, It should be above 0.06MPa. The upper limit of the above-mentioned value is not limited. The upper limit of the above-mentioned value is, for example, 0.15 MPa. If the above-mentioned value is at least the above-mentioned lower limit, the organic EL display device 1 will be more excellent in impact resistance to balls per unit thickness. In addition, the area|region where the said value is 0.06 Mpa or more includes the area above the thin solid line shown in FIG. 12, and the area|region inclined to the left more than this solid line.

第1黏著層8在25℃下之剪切儲存彈性模數G'例如為0.15MPa以下,宜為0.10MPa以下,較宜為0.05MPa以下。第1黏著層8在25℃下之剪切儲存彈性模數G'之下限無限定。第1黏著層8在25℃下之剪切儲存彈性模數G'之下限例如為0.01MPa。第1黏著層8之剪切儲存彈性模數G'若在上述上限以下,有機EL顯示裝置1每單位厚度對球的耐衝擊性便優異,且每單位厚度對筆的耐衝擊性便優異。又,有機EL顯示裝置1之耐彎折性優異。第1黏著層8之剪切儲存彈性模數G'若在上述下限以上,便可確實保持衝擊吸收構件3之形狀。The shear storage elastic modulus G' of the first adhesive layer 8 at 25° C. is, for example, 0.15 MPa or less, preferably 0.10 MPa or less, and more preferably 0.05 MPa or less. The lower limit of the shear storage elastic modulus G' of the first adhesive layer 8 at 25°C is not limited. The lower limit of the shear storage elastic modulus G' of the first adhesive layer 8 at 25° C. is, for example, 0.01 MPa. If the shear storage elastic modulus G' of the first adhesive layer 8 is below the upper limit, the organic EL display device 1 has excellent impact resistance to balls per unit thickness and excellent impact resistance per unit thickness to pens. In addition, the organic EL display device 1 is excellent in bending resistance. If the shear storage elastic modulus G' of the first adhesive layer 8 is equal to or greater than the above-mentioned lower limit, the shape of the shock absorbing member 3 can be surely maintained.

第2黏著層10在25℃下之剪切儲存彈性模數G'例如為0.05MPa以上,宜為0.10MPa以上。第2黏著層10在25℃下之剪切儲存彈性模數G'的上限無限定。第2黏著層10在25℃下之剪切儲存彈性模數G'的上限為0.15MPa。第2黏著層10之剪切儲存彈性模數G'若在上述下限以上,有機EL顯示裝置1之每單位厚度的耐衝擊性便優異,且每單位厚度對筆的耐衝擊性便優異。又,有機EL顯示裝置1之耐彎折性優異。第2黏著層10之剪切儲存彈性模數G'若在上述上限以下,衝擊吸收構件3便可充分吸收外力。The shear storage elastic modulus G' of the second adhesive layer 10 at 25° C. is, for example, 0.05 MPa or more, preferably 0.10 MPa or more. The upper limit of the shear storage elastic modulus G' of the second adhesive layer 10 at 25°C is not limited. The upper limit of the shear storage elastic modulus G' of the second adhesive layer 10 at 25° C. is 0.15 MPa. When the shear storage elastic modulus G' of the second adhesive layer 10 is at least the above lower limit, the organic EL display device 1 has excellent impact resistance per unit thickness and excellent impact resistance per unit thickness to a pen. In addition, the organic EL display device 1 is excellent in bending resistance. If the shear storage elastic modulus G' of the second adhesive layer 10 is below the upper limit, the shock absorbing member 3 can sufficiently absorb the external force.

第1黏著層8及第2黏著層10各自之全光線透射率例如為80%以上,宜為85%以上。第1黏著層8及第2黏著層10各自之全光線透射率的上限無特別限定。第1黏著層8及第2黏著層10各自之全光線透射率的上限例如為100%。The total light transmittance of each of the first adhesive layer 8 and the second adhesive layer 10 is, for example, 80% or more, preferably 85% or more. The upper limit of the total light transmittance of each of the first adhesive layer 8 and the second adhesive layer 10 is not particularly limited. The upper limit of the total light transmittance of each of the first adhesive layer 8 and the second adhesive layer 10 is, for example, 100%.

基材9在25℃下之拉伸彈性模數E例如為0.1GPa以上,宜為1GPa以上,更宜為2GPa以上。基材9之拉伸彈性模數E若在上述下限以上,有機EL顯示裝置1對球之每單位厚度的耐衝擊性與對筆之每單位厚度的耐衝擊性便優異。並且,有機EL顯示裝置1之耐彎折性優異。The tensile modulus E of the base material 9 at 25° C. is, for example, 0.1 GPa or more, preferably 1 GPa or more, and more preferably 2 GPa or more. When the tensile modulus E of the base material 9 is at least the above lower limit, the organic EL display device 1 is excellent in impact resistance per unit thickness of a ball and impact resistance per unit thickness of a pen. In addition, the organic EL display device 1 is excellent in bending resistance.

基材9之拉伸彈性模數E例如為15GPa以下,宜為5GPa以下,較宜為1GPa以下。基材9之拉伸彈性模數E若在上述上限以下,每單位厚度對球的耐衝擊性便優異。The tensile modulus E of the base material 9 is, for example, 15 GPa or less, preferably 5 GPa or less, and more preferably 1 GPa or less. When the tensile modulus E of the base material 9 is equal to or less than the above-mentioned upper limit, the impact resistance to a ball per unit thickness is excellent.

基材9之拉伸彈性模數E係使用拉伸試驗機進行測定。基材9之拉伸彈性模數E的測定詳細內容記載於後續之實施例。The tensile modulus E of the base material 9 was measured using a tensile tester. The details of the measurement of the tensile modulus of elasticity E of the substrate 9 are described in the following examples.

基材9之全光線透射率例如為80%以上,宜為85%以上。基材9之全光線透射率的上限例如為100%。The total light transmittance of the base material 9 is, for example, 80% or more, preferably 85% or more. The upper limit of the total light transmittance of the base material 9 is, for example, 100%.

[材料] 第1黏著層8及第2黏著層10係由可滿足上述物性之材料構成。材料可列舉例如:丙烯酸系黏著劑、橡膠系黏著劑、乙烯基烷基醚系黏著劑、聚矽氧系黏著劑、聚酯系黏著劑、聚醯胺系黏著劑、胺甲酸酯系黏著劑、氟系黏著劑、環氧系黏著劑及聚醚系黏著劑。宜可舉丙烯酸系黏著劑。 [Material] The 1st adhesive layer 8 and the 2nd adhesive layer 10 are comprised by the material which can satisfy|fill the said physical property. Examples of materials include: acrylic adhesives, rubber-based adhesives, vinyl alkyl ether-based adhesives, polysiloxane-based adhesives, polyester-based adhesives, polyamide-based adhesives, urethane-based adhesives adhesives, fluorine-based adhesives, epoxy-based adhesives and polyether-based adhesives. Preferably, an acrylic adhesive can be cited.

丙烯酸系黏著劑可舉例如丙烯酸系基底聚合物之交聯物。丙烯酸系基底聚合物可將單體成分聚合而得。單體成分包含例如具有碳數1至24烷基部分之(甲基)丙烯酸酯作為主成分。(甲基)丙烯酸酯意指甲基丙烯酸酯及/或丙烯酸酯。 上述(甲基)丙烯酸酯之定義及用法於以下相同。烷基部分具有直鏈狀或支鏈狀。(甲基)丙烯酸酯可列舉例如:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸二級丁酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸異己酯、(甲基)丙烯酸異庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十二酯、(甲基)丙烯酸十三酯、(甲基)丙烯酸十四酯、(甲基)丙烯酸十六酯、(甲基)丙烯酸十八酯、(甲基)丙烯酸二十酯、(甲基)丙烯酸二十二酯及(甲基)丙烯酸二十四酯。由調製較硬之第2黏著層10之觀點來看,宜可舉具有碳數1至4烷基部分之(甲基)丙烯酸酯。 由調製較軟之第1黏著層8之觀點來看,宜可舉具有碳數6至24烷基部分之(甲基)丙烯酸酯。單體成分中之(甲基)丙烯酸酯之比率例如為80質量%以上,宜為90質量%以上,又例如為100質量%以下,宜為99.5質量%以下。 The acrylic adhesive may, for example, be a cross-linked product of an acrylic base polymer. The acrylic base polymer can be obtained by polymerizing monomer components. The monomer component contains, for example, a (meth)acrylate having an alkyl moiety having 1 to 24 carbon atoms as a main component. (Meth)acrylate means methacrylate and/or acrylate. The definition and usage of the above-mentioned (meth)acrylate are the same as below. The alkyl moiety has a straight-chain or branched-chain shape. Examples of (meth)acrylates include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, tertiary butyl (meth)acrylate, and tributyl (meth)acrylate. Grade butyl ester, isobutyl (meth)acrylate, amyl (meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, isohexyl (meth)acrylate, (meth)acrylate Isoheptyl acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate , decyl (meth)acrylate, isodecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, (meth)acrylic acid Cetyl (meth)acrylate, octadecyl (meth)acrylate, eicosyl (meth)acrylate, behenyl (meth)acrylate and behenyl (meth)acrylate. From the viewpoint of preparing a relatively hard second adhesive layer 10, a (meth)acrylate having an alkyl moiety having 1 to 4 carbon atoms is preferably used. From the viewpoint of preparing a relatively soft first adhesive layer 8, a (meth)acrylate having an alkyl moiety having 6 to 24 carbon atoms is preferably used. The ratio of the (meth)acrylate in the monomer component is, for example, 80 mass % or more, preferably 90 mass % or more, or, for example, 100 mass % or less, and preferably 99.5 mass % or less.

單體成分更包含含官能基之(甲基)丙烯酸酯作為任意成分。含官能基之(甲基)丙烯酸酯可舉例如含羥基之(甲基)丙烯酸酯及含醯胺基之(甲基)丙烯酸酯。含羥基之(甲基)丙烯酸酯可舉例如(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸3-羥丙酯及(甲基)丙烯酸4-羥丁酯。含醯胺基之(甲基)丙烯酸酯可舉例如(甲基)丙烯醯胺及二甲基(甲基)丙烯醯胺。此外,含醯胺基之(甲基)丙烯酸酯可包含分子內含醯胺基之(甲基)丙烯酸酯。分子內含醯胺基之(甲基)丙烯酸酯可舉例如N-乙烯基-2-吡咯啶酮。單體成分中之含官能基之(甲基)丙烯酸酯之比率例如為1質量%以上,宜為5質量%以上,又例如為25質量%以下,宜為20質量%以下。The monomer component further includes a functional group-containing (meth)acrylate as an optional component. As the functional group-containing (meth)acrylate, for example, a hydroxyl group-containing (meth)acrylate and an amide group-containing (meth)acrylate can be mentioned. As a hydroxyl-containing (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate are mentioned, for example. Examples of the amide group-containing (meth)acrylate include (meth)acrylamide and dimethyl(meth)acrylamide. In addition, the amide group-containing (meth)acrylate may include an amide group-containing (meth)acrylate in the molecule. The (meth)acrylate containing an amide group in the molecule includes, for example, N-vinyl-2-pyrrolidone. The ratio of the functional group-containing (meth)acrylate in the monomer component is, for example, 1 mass % or more, preferably 5 mass % or more, or, for example, 25 mass % or less, or preferably 20 mass % or less.

單體成分例如可在鏈轉移劑存在下進行聚合。鏈轉移劑可舉例如硫醇化合物。硫醇化合物可舉例如α-硫甘油。相對於單體成分100質量份,鏈轉移劑之質量比率例如為1質量份以上,又例如為10質量份以下。The monomer components can be polymerized, for example, in the presence of a chain transfer agent. As a chain transfer agent, a thiol compound is mentioned, for example. As a thiol compound, alpha-thioglycerol is mentioned, for example. The mass ratio of the chain transfer agent is, for example, 1 part by mass or more, or, for example, 10 parts by mass or less with respect to 100 parts by mass of the monomer component.

交聯物可藉由交聯劑對丙烯酸系基底聚合物之摻混及其反應而得。交聯劑可舉例如異氰酸酯交聯劑、矽烷耦合劑、過氧化物及具有複數個(甲基)丙烯醯基之(甲基)丙烯酸酯。異氰酸酯交聯劑可舉例如二異氰酸伸茬酯的三羥甲丙烷改質物及二異氰酸甲苯酯的三羥甲丙烷改質物。矽烷耦合劑可舉例如含環氧基之矽烷耦合劑。含環氧基之矽烷耦合劑可舉例如3-環氧丙氧基丙基三甲氧基矽烷。過氧化物可舉例如有機過氧化物。有機過氧化物可舉例如苯甲醯基過氧化物。具有複數個(甲基)丙烯醯基之(甲基)丙烯酸酯可舉例如己二醇(甲基)丙烯酸酯。該等可單獨使用或併用。相對於丙烯酸系基底聚合物100質量份,交聯劑之質量比率例如為0.1質量份以上,又例如為2質量份以下。The cross-linked product can be obtained by blending and reacting the cross-linking agent to the acrylic base polymer. The crosslinking agent includes, for example, an isocyanate crosslinking agent, a silane coupling agent, a peroxide, and (meth)acrylate having a plurality of (meth)acryloyl groups. The isocyanate crosslinking agent includes, for example, a modified trimethylolpropane of diisocyanate and a modified trimethylolpropane of tolyl diisocyanate. The silane coupling agent may, for example, be an epoxy group-containing silane coupling agent. The epoxy group-containing silane coupling agent may, for example, be 3-glycidoxypropyltrimethoxysilane. As a peroxide, an organic peroxide is mentioned, for example. As the organic peroxide, for example, benzyl peroxide can be mentioned. As the (meth)acrylate having a plurality of (meth)acryloyl groups, for example, hexanediol (meth)acrylate is exemplified. These can be used alone or in combination. The mass ratio of the crosslinking agent is, for example, 0.1 parts by mass or more, or, for example, 2 parts by mass or less with respect to 100 parts by mass of the acrylic base polymer.

可於摻混交聯劑之同時,將添加劑添加於丙烯酸系基底聚合物中。添加劑可舉例如寡聚物。寡聚物可舉例如(甲基)丙烯酸寡聚物。(甲基)丙烯酸寡聚物之重量平均分子量例如為1,000以上,宜為2,000,又例如為30,000以下,宜為10,000以下。(甲基)丙烯酸寡聚物之重量平均分子量係利用GPC進行標準聚苯乙烯換算而得。(甲基)丙烯酸寡聚物可將單體成分聚合而得。單體成分包含上述具有碳數1至24烷基部分之(甲基)丙烯酸酯、與具有碳數1至24脂環式烷基(環脂族烷基)部分之脂環式(甲基)丙烯酸酯。脂環式烷基部分可舉例如單環式及多環式。單環式之脂環式(甲基)丙烯酸酯可舉例如(甲基)丙烯酸環烷基酯。(甲基)丙烯酸環烷基酯可舉例如(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸環庚酯及(甲基)丙烯酸環辛酯。多環式之脂環式(甲基)丙烯酸酯可舉例如(甲基)丙烯酸異莰酯、(甲基)丙烯酸二環戊酯及(甲基)丙烯酸三環戊酯。單體成分中之(甲基)丙烯酸酯之比率例如為10質量%以上,宜為20質量%以上,又例如為70質量%以下,宜為45質量%以下。單體成分中之脂環式(甲基)丙烯酸酯之比率例如為30質量%以上,宜為55質量%以上,又例如為90質量%以下,宜為80質量%以下。Additives can be added to the acrylic base polymer at the same time as the crosslinking agent is blended. Examples of additives include oligomers. As an oligomer, (meth)acrylic acid oligomer is mentioned, for example. The weight average molecular weight of the (meth)acrylic oligomer is, for example, 1,000 or more, preferably 2,000, or, for example, 30,000 or less, preferably 10,000 or less. The weight average molecular weight of the (meth)acrylic oligomer is obtained by standard polystyrene conversion by GPC. The (meth)acrylic oligomer can be obtained by polymerizing monomer components. The monomer component includes the above-mentioned (meth)acrylate having an alkyl moiety having 1 to 24 carbon atoms, and an alicyclic (methyl) having an alicyclic alkyl (cycloaliphatic alkyl) moiety having 1 to 24 carbon atoms. Acrylate. The alicyclic alkyl moiety includes, for example, a monocyclic type and a polycyclic type. The monocyclic alicyclic (meth)acrylate may, for example, be cycloalkyl (meth)acrylate. Cycloalkyl (meth)acrylate may, for example, be cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, cycloheptyl (meth)acrylate, and cyclooctyl (meth)acrylate. Examples of polycyclic alicyclic (meth)acrylates include isobornyl (meth)acrylate, dicyclopentyl (meth)acrylate, and tricyclopentyl (meth)acrylate. The ratio of the (meth)acrylate in the monomer component is, for example, 10 mass % or more, preferably 20 mass % or more, or, for example, 70 mass % or less, and preferably 45 mass % or less. The ratio of the alicyclic (meth)acrylate in the monomer component is, for example, 30% by mass or more, preferably 55% by mass or more, or, for example, 90% by mass or less, or preferably 80% by mass or less.

寡聚物之玻璃轉移溫度例如為20℃以上,宜為50℃以上,較宜為80℃以上,又例如為150℃以下。寡聚物之玻璃轉移溫度係藉由Fox式算出。The glass transition temperature of the oligomer is, for example, 20°C or higher, preferably 50°C or higher, more preferably 80°C or higher, and, for example, 150°C or lower. The glass transition temperature of the oligomer was calculated by the Fox equation.

相對於丙烯酸系基底聚合物100質量份,寡聚物之質量比率例如為0.01質量份以上,又例如為1質量份以下。The mass ratio of the oligomer is, for example, 0.01 part by mass or more, or, for example, 1 part by mass or less with respect to 100 parts by mass of the acrylic base polymer.

基材9之材料係由可滿足上述物性之材料構成。基材9之材料可舉例如樹脂。樹脂可單獨使用或併用。樹脂可列舉例如:烯烴樹脂、聚酯樹脂、丙烯酸樹脂、聚碳酸酯樹脂、聚醚碸樹脂、聚芳酯樹脂、三聚氰胺樹脂、聚醯胺樹脂、聚醯亞胺樹脂、纖維素樹脂及聚苯乙烯樹脂。樹脂宜可列舉烯烴樹脂、聚酯樹脂、丙烯酸樹脂、聚碳酸酯樹脂、聚醚碸樹脂、聚芳酯樹脂、三聚氰胺樹脂、纖維素樹脂及聚苯乙烯樹脂。樹脂更宜可舉烯烴樹脂及聚酯樹脂。The material of the base material 9 is composed of a material that can satisfy the above-mentioned physical properties. The material of the base material 9 can be, for example, resin. The resins may be used alone or in combination. Examples of resins include olefin resins, polyester resins, acrylic resins, polycarbonate resins, polyether resins, polyarylate resins, melamine resins, polyamide resins, polyimide resins, cellulose resins, and polyphenylenes. vinyl. Preferable resins include olefin resins, polyester resins, acrylic resins, polycarbonate resins, polyether resins, polyarylate resins, melamine resins, cellulose resins and polystyrene resins. More suitable resins include olefin resins and polyester resins.

烯烴樹脂可舉例如聚乙烯、聚丙烯及環烯烴聚合物(COP)。烯烴樹脂宜可舉COP。COP為含環烯烴之單體成分的聚合物。環烯烴可舉例如降莰烯。As an olefin resin, polyethylene, a polypropylene, and a cyclic olefin polymer (COP) are mentioned, for example. The olefin resin is preferably COP. COP is a polymer containing a cycloolefin-containing monomer component. As a cyclic olefin, norbornene is mentioned, for example.

聚酯樹脂可舉例如聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯及聚萘二甲酸乙二酯。聚酯樹脂包含例如軟質聚酯樹脂(透明軟質聚酯樹脂)。聚酯樹脂宜可舉PET。As polyester resin, polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate are mentioned, for example. The polyester resin includes, for example, a soft polyester resin (transparent soft polyester resin). The polyester resin is preferably PET.

基材9之材料尤宜可舉COP。相較於PET,COP可更提高每單位厚度的筆衝擊吸收率。The material of the base material 9 is preferably COP. Compared to PET, COP can further improve the pen impact absorption rate per unit thickness.

基材9可使用市售物。市售物可列舉例如:Lumirror系列(PET製基材,Toray公司製)、ZEONOR系列(COP製基材,日本ZEON公司製)及OKY系列(透明軟質聚酯樹脂性基材,Bell Polyester Products,Inc.製)。As the base material 9, commercially available ones can be used. Commercially available products include, for example: Lumirror series (PET base material, manufactured by Toray Co., Ltd.), ZEONOR series (COP base material, made by Japan ZEON Co., Ltd.), and OKY series (transparent flexible polyester resin base material, Bell Polyester Products, Inc.).

[厚度] 第1黏著層8、基材9及第2黏著層10各自之厚度無特別限定。 [thickness] The thicknesses of the first adhesive layer 8 , the base material 9 and the second adhesive layer 10 are not particularly limited.

第1黏著層8及第2黏著層10各自之厚度例如為1µm以上,宜為5µm以上,又例如為50µm以下,宜為40µm以下。第2黏著層10可為與第1黏著層8相同之厚度,又亦可為與第1黏著層8不同之厚度。The thickness of each of the first adhesive layer 8 and the second adhesive layer 10 is, for example, 1 µm or more, preferably 5 µm or more, or, for example, 50 µm or less, preferably 40 µm or less. The second adhesive layer 10 may have the same thickness as the first adhesive layer 8 , or may have a different thickness from the first adhesive layer 8 .

基材9之厚度例如為5µm以上,宜為10µm以上,又例如為100µm以下,宜為75µm以下,較宜為50µm以下,更宜小於50µm,特別宜為45µm以下,最宜為30µm以下。The thickness of the substrate 9 is, for example, 5 µm or more, preferably 10 µm or more, or 100 µm or less, preferably 75 µm or less, more preferably 50 µm or less, more preferably less than 50 µm, particularly preferably 45 µm or less, and most preferably 30 µm or less.

基材9之厚度相對於衝擊吸收構件3之厚度的比率例如為0.10以上,宜為0.20以上,又例如為0.70以下,宜為0.60以下,較宜為0.40以下,更宜為0.35以下。基材9之厚度比率若為上述下限以上,耐彎折性便優異。基材9之厚度比率若為上述上限以下,每單位厚度的筆衝擊吸收率便高。The ratio of the thickness of the base material 9 to the thickness of the shock absorbing member 3 is, for example, 0.10 or more, preferably 0.20 or more, for example, 0.70 or less, preferably 0.60 or less, preferably 0.40 or less, and more preferably 0.35 or less. If the thickness ratio of the base material 9 is more than the said lower limit, it will be excellent in bending resistance. If the thickness ratio of the base material 9 is below the said upper limit, the pen shock absorption rate per unit thickness will be high.

[有機EL顯示裝置1之製造] 有機EL顯示裝置1可藉由積層視窗構件2、衝擊吸收構件3、有機EL面板構件4及保護構件5而得。 [Manufacture of Organic EL Display Device 1] The organic EL display device 1 can be obtained by laminating the window member 2 , the shock absorbing member 3 , the organic EL panel member 4 , and the protective member 5 .

此外,雖未圖示,但衝擊吸收構件3係以附剝離片之衝擊吸收構件作準備。附剝離片之衝擊吸收構件具備衝擊吸收構件3、與分別積層於其表面及背面之剝離片。將附剝離片之衝擊吸收構件中之剝離片從衝擊吸收構件3剝離,來準備衝擊吸收構件3。In addition, although not shown, the shock absorbing member 3 is prepared as a shock absorbing member with a release sheet. The shock-absorbing member with a release sheet includes a shock-absorbing member 3 and a release sheet laminated on the front and back surfaces of the shock-absorbing member 3, respectively. The shock absorbing member 3 is prepared by peeling the peeling sheet from the shock absorbing member 3 in the shock absorbing member with the peeling sheet.

又,參照圖5至圖6說明使用試作品40製造有機EL顯示裝置1之另一製造方法。如圖5所示,此方法依序具備第1步驟S1、第2步驟S2、第3步驟S3及第4步驟S4。Further, another method of manufacturing the organic EL display device 1 using the prototype 40 will be described with reference to FIGS. 5 to 6 . As shown in FIG. 5 , the method includes a first step S1 , a second step S2 , a third step S3 and a fourth step S4 in sequence.

第1步驟S1中係試作試作品。例如,試作複數個試作品40。複數個試作品40各自具有例如互相相同之構成、相同之厚度及相同之物性。複數個試作品40例如包含第1試樣61與第2試樣62,且更包含第3試樣63。試作品40亦為模擬試樣。試作品40除下述諸點外,具有與上述有機EL顯示裝置1相同之構成。試作品40之有機EL面板構件4具備ITO層35來取代薄膜密封層11。ITO層35係為評估可能會賦予薄膜密封層11之應變所致之損傷而構成。ITO層35係由氧化銦與氧化錫之複合氧化物(ITO)構成。ITO層35之厚度例如為100nm以下,宜為70nm以下,較宜為50nm以下,又例如為20nm以上。藉由變更ITO層35之厚度,可控制對應變之破裂。具備上述ITO層35與面板本體12之有機EL面板構件4為代用面板構件44。 又,試作品40中,例如第1黏著層8與第2黏著層10各自在25℃下之剪切儲存彈性模數G'為相同。 The first step S1 is a trial work. For example, a plurality of trial works 40 are produced. Each of the plurality of test pieces 40 has, for example, the same structure, the same thickness, and the same physical properties. The plurality of test pieces 40 include, for example, a first sample 61 and a second sample 62 , and further includes a third sample 63 . Sample 40 is also a mock sample. The prototype 40 has the same configuration as the above-described organic EL display device 1 except for the following points. The organic EL panel member 4 of the prototype 40 is provided with the ITO layer 35 instead of the film sealing layer 11 . The ITO layer 35 is formed to evaluate damage due to strain that may be imparted to the thin film sealing layer 11 . The ITO layer 35 is composed of a complex oxide (ITO) of indium oxide and tin oxide. The thickness of the ITO layer 35 is, for example, 100 nm or less, preferably 70 nm or less, more preferably 50 nm or less, and, for example, 20 nm or more. By varying the thickness of the ITO layer 35, cracking to strain can be controlled. The organic EL panel member 4 including the above-described ITO layer 35 and the panel body 12 is a substitute panel member 44 . In addition, in the prototype 40, for example, the shear storage elastic modulus G' at 25° C. of the first adhesive layer 8 and the second adhesive layer 10 is the same.

第2步驟S2中係評估試作品40。如圖6所示,第2步驟S2具備第5步驟S5、第6步驟S6及第7步驟S7。In the second step S2, the trial work 40 is evaluated. As shown in FIG. 6 , the second step S2 includes a fifth step S5, a sixth step S6, and a seventh step S7.

第5步驟S5中,係從試作品40選擇第1試樣61及第2試樣62。第1試樣61及第2試樣62具有互相相同之構成、相同之厚度及相同之物性。並且,亦可將第3試樣63供於後述彎折試驗。In the fifth step S5 , the first sample 61 and the second sample 62 are selected from the sample 40 . The first sample 61 and the second sample 62 have the same structure, the same thickness, and the same physical properties. In addition, the third sample 63 may be subjected to a bending test described later.

第6步驟S6中,係實施落球試驗(參照圖7)與落筆試驗(參照圖8)。In the sixth step S6, a ball drop test (refer to FIG. 7 ) and a pen drop test (refer to FIG. 8 ) are performed.

如圖7所示,落球試驗係使球90落下至第1試樣61。落球試驗中之球90的重量例如為1g以上,宜為2g以上,又例如為100g以下,宜為50g以下。落球試驗中之球90的直徑例如為1mm以上,宜為2mm以上,又例如為100mm以下,宜為50mm以下。球之材質無限定,例如為金屬。落球試驗中之球90的落下高度例如為2cm以上,宜為5cm以上,又例如為200cm以下,宜為100cm以下。As shown in FIG. 7 , in the drop ball test, the ball 90 is dropped to the first sample 61 . The weight of the ball 90 in the ball drop test is, for example, 1 g or more, preferably 2 g or more, or, for example, 100 g or less, preferably 50 g or less. The diameter of the ball 90 in the drop ball test is, for example, 1 mm or more, preferably 2 mm or more, or, for example, 100 mm or less, preferably 50 mm or less. The material of the ball is not limited, for example, it is metal. The drop height of the ball 90 in the ball drop test is, for example, 2 cm or more, preferably 5 cm or more, or, for example, 200 cm or less, preferably 100 cm or less.

如圖8所示,落筆試驗係使筆(原子筆)95落下至第2試樣62。筆95於其前端部具有球珠96。As shown in FIG. 8 , in the pen drop test, a pen (ballpoint pen) 95 is dropped on the second sample 62 . The pen 95 has a ball 96 at its front end.

落筆試驗中之筆95的重量例如為0.5g以上,宜為1g以上,又例如為50g以下,宜為30g以下。落筆試驗中之球96的直徑例如為0.01mm以上,宜為0.1mm以上,又例如為5mm以下,宜為1mm以下。落筆試驗中之落下高度例如為2cm以上,宜為5cm以上,又例如為200cm以下,宜為100cm以下。The weight of the pen 95 in the pen drop test is, for example, 0.5 g or more, preferably 1 g or more, and, for example, 50 g or less, preferably 30 g or less. The diameter of the ball 96 in the pen drop test is, for example, 0.01 mm or more, preferably 0.1 mm or more, or, for example, 5 mm or less, preferably 1 mm or less. The drop height in the pen drop test is, for example, 2 cm or more, preferably 5 cm or more, or, for example, 200 cm or less, preferably 100 cm or less.

第7步驟S7中,係判斷第1試樣61及第2試樣62有無損傷。In the seventh step S7, it is determined whether or not the first sample 61 and the second sample 62 are damaged.

然後,在第3步驟中,當評估試作品40係在第1試樣61有損傷時,變更製造條件使第1黏著層8及第2黏著層10之合計厚度更厚來做決定。又,在第3步驟中,當評估試作品40係在第2試樣62有損傷時,變更製造條件使基材9之厚度更厚來做決定。Then, in the third step, when the evaluation test piece 40 is damaged in the first sample 61, it is determined by changing the manufacturing conditions so that the total thickness of the first adhesive layer 8 and the second adhesive layer 10 is thicker. In addition, in the third step, when the second sample 62 of the evaluation test piece 40 is damaged, it is determined by changing the manufacturing conditions so that the thickness of the base material 9 is thicker.

第4步驟S4中,係根據上述製造條件來製造有機EL顯示裝置1。In the fourth step S4, the organic EL display device 1 is manufactured according to the above-mentioned manufacturing conditions.

藉此,可將有機EL顯示裝置1製成製品。Thereby, the organic EL display device 1 can be manufactured as a product.

此外,在第7步驟S7中,當判斷在第1試樣61及第2試樣62皆無損傷時,則不歷經上述第3步驟S3,亦即不變更製造條件便將有機EL顯示裝置1製成製品。In addition, in the seventh step S7, when it is determined that neither the first sample 61 nor the second sample 62 is damaged, the organic EL display device 1 is manufactured without going through the above-mentioned third step S3, that is, without changing the manufacturing conditions. finished product.

[有機EL顯示裝置1之使用] 如圖4A所示,使用者視辨有機EL顯示裝置1之表面21全部時,有機EL顯示裝置1係呈開放狀態。此時,表面21為平坦面。有機EL顯示裝置1包含中間部24、第1部17及第2部18。中間部24位於2個邊23之中間。2個邊23包含第1邊23A與第2邊23B。第1部17係包含第1邊23A之區域。第2部18係包含第2邊23B之區域。 [Use of Organic EL Display Device 1] As shown in FIG. 4A , when the user sees the entire surface 21 of the organic EL display device 1 , the organic EL display device 1 is in an open state. At this time, the surface 21 is a flat surface. The organic EL display device 1 includes an intermediate portion 24 , a first portion 17 and a second portion 18 . The middle portion 24 is located between the two sides 23 . The two sides 23 include a first side 23A and a second side 23B. The first portion 17 is an area including the first side 23A. The second portion 18 is an area including the second side 23B.

如圖4B所示,有將有機EL顯示裝置1以中間部24為中心來彎折之情形。亦即,有機EL顯示裝置1有被彎折來使用之情形。此時,中間部24係形成折痕。第1部17之表面21與第2部18之表面21係互相朝外側。此時,第1部17之背面22與第2部18之背面22係接近地相對向。As shown in FIG. 4B , there is a case where the organic EL display device 1 is bent around the intermediate portion 24 . That is, the organic EL display device 1 may be used by being bent. At this time, the intermediate portion 24 is formed with a crease. The surface 21 of the first part 17 and the surface 21 of the second part 18 face outward from each other. At this time, the back surface 22 of the first portion 17 and the back surface 22 of the second portion 18 are closely opposed to each other.

[第1實施形態之作用效果] 而且,該有機EL顯示裝置1中,衝擊吸收構件3具有60%以上之全光線透射率。具體言之,代替偏光件而設於有機EL顯示裝置1之衝擊吸收構件3之全光線透射率很高。因此,有機EL顯示裝置1之光學可靠性高。尤其,第1實施形態之有機EL顯示裝置1不具備偏光件,故光學可靠性特別高。 [Function and effect of the first embodiment] Furthermore, in the organic EL display device 1, the shock absorbing member 3 has a total light transmittance of 60% or more. Specifically, the shock absorbing member 3 provided in the organic EL display device 1 instead of the polarizer has a high total light transmittance. Therefore, the optical reliability of the organic EL display device 1 is high. In particular, since the organic EL display device 1 of the first embodiment does not include a polarizer, the optical reliability is particularly high.

又,該有機EL顯示裝置1中,衝擊吸收構件3具有0.27%/µm以上之每單位厚度的球衝擊吸收率,且具有0.10%/µm以上之每單位厚度的筆衝擊吸收率。因此,有機EL顯示裝置1對球之衝擊及對筆造成之衝擊的耐久性優異。因此,有機EL顯示裝置1對各種衝擊的耐久性優異。In addition, in the organic EL display device 1, the impact absorbing member 3 has a ball impact absorption rate per unit thickness of 0.27%/µm or more, and has a pen impact absorption rate per unit thickness of 0.10%/µm or more. Therefore, the organic EL display device 1 is excellent in durability against impact to a ball and impact to a pen. Therefore, the organic EL display device 1 is excellent in durability against various impacts.

並且,在將有機EL顯示裝置1以視窗構件2朝外側之方式彎折之試驗中,即使以使視窗構件2中之2個表面21的間隔成為8mm之方式彎折200,000次,有機EL面板構件4亦無損傷。因此,有機EL顯示裝置1之耐彎折性優異。In addition, in the test of bending the organic EL display device 1 so that the window member 2 faces the outside, even if it is bent 200,000 times so that the interval between the two surfaces 21 of the window member 2 becomes 8 mm, the organic EL panel member 4 is also not damaged. Therefore, the organic EL display device 1 is excellent in bending resistance.

又,該有機EL顯示裝置1中,第1黏著層8係黏著於視窗構件2上。第2黏著層10係黏著於有機EL面板構件4上。因此,視窗構件2係透過衝擊吸收構件3而黏著於有機EL面板構件4上。而且,由於具備基材9、以及包夾基材9之第1黏著層8及第2黏著層10的衝擊吸收構件3係黏著於視窗構件2與有機EL面板構件4上,故耐彎折性更優異。In addition, in this organic EL display device 1 , the first adhesive layer 8 is adhered to the window member 2 . The second adhesive layer 10 is adhered to the organic EL panel member 4 . Therefore, the window member 2 is adhered to the organic EL panel member 4 through the impact absorbing member 3 . Furthermore, since the shock absorbing member 3 including the base material 9 and the first adhesive layer 8 and the second adhesive layer 10 sandwiching the base material 9 is adhered to the window member 2 and the organic EL panel member 4, the bending resistance is better.

又,該有機EL顯示裝置1中,當第2黏著層10在25℃下之剪切儲存彈性模數G'與第1黏著層8在25℃下之剪切儲存彈性模數G'相同或更高時,該有機EL顯示裝置1對球之每單位厚度的耐衝擊性與對筆之每單位厚度的耐衝擊性便優異。又,該有機EL顯示裝置1之耐彎折性優異。In addition, in the organic EL display device 1, when the shear storage elastic modulus G' of the second adhesive layer 10 at 25°C is the same as the shear storage elastic modulus G' of the first adhesive layer 8 at 25°C or When it is higher, the organic EL display device 1 is excellent in the impact resistance per unit thickness of the ball and the impact resistance per unit thickness of the pen. Moreover, this organic EL display device 1 is excellent in bending resistance.

尤其,該有機EL顯示裝置1中,當第2黏著層10在25℃下之剪切儲存彈性模數G'高於第1黏著層8在25℃下之剪切儲存彈性模數G'時,該有機EL顯示裝置1對球之每單位厚度的耐衝擊性便更優異,並且對筆之每單位厚度的耐衝擊性便更優異。In particular, in the organic EL display device 1, when the shear storage elastic modulus G' of the second adhesive layer 10 at 25°C is higher than the shear storage elastic modulus G' of the first adhesive layer 8 at 25°C , the organic EL display device 1 is more excellent in impact resistance per unit thickness of balls, and more excellent in impact resistance per unit thickness of pens.

又,該有機EL顯示裝置1中,第1黏著層8在25℃下之剪切儲存彈性模數G'若為0.01MPa以上,便可確實保持衝擊吸收構件3之形狀。第1黏著層8在25℃下之剪切儲存彈性模數G'若為0.05MPa以下,有機EL顯示裝置1對球之每單位厚度的耐衝擊性便優異。In addition, in the organic EL display device 1, if the shear storage elastic modulus G' of the first adhesive layer 8 at 25°C is 0.01 MPa or more, the shape of the shock absorbing member 3 can be surely maintained. If the shear storage elastic modulus G' at 25°C of the first adhesive layer 8 is 0.05 MPa or less, the organic EL display device 1 has excellent impact resistance per unit thickness of balls.

該有機EL顯示裝置1中,第2黏著層10在25℃下之剪切儲存彈性模數G'若為0.10MPa以上,有機EL顯示裝置1之耐彎折性便優異。第2黏著層10在25℃下之剪切儲存彈性模數G'若為0.15MPa以下,衝擊吸收構件3便可充分吸收外力。In the organic EL display device 1 , when the shear storage elastic modulus G′ of the second adhesive layer 10 at 25° C. is 0.10 MPa or more, the organic EL display device 1 has excellent bending resistance. If the shear storage elastic modulus G' of the second adhesive layer 10 at 25° C. is 0.15 MPa or less, the shock absorbing member 3 can sufficiently absorb the external force.

又,該有機EL顯示裝置1中,從第2黏著層10在25℃下之剪切儲存彈性模數G'減去第1黏著層8在25℃下之剪切儲存彈性模數G'之值若為0.06MPa以上,有機EL顯示裝置1對球之每單位厚度的耐衝擊性與對筆之每單位厚度的耐衝擊性便優異。又,該有機EL顯示裝置1之與耐彎折性兩者優異。Furthermore, in the organic EL display device 1, the shear storage elastic modulus G' of the first adhesive layer 8 at 25° C. is subtracted from the shear storage elastic modulus G' of the second adhesive layer 10 at 25° C. If the value is 0.06 MPa or more, the organic EL display device 1 is excellent in the impact resistance per unit thickness of the ball and the impact resistance per unit thickness of the pen. In addition, the organic EL display device 1 is excellent in both bending resistance and bending resistance.

又,在該有機EL顯示裝置1中,基材9為單數,故構成簡易。Moreover, in this organic EL display device 1, since the base material 9 is singular, the structure is simple.

又,該有機EL顯示裝置1中,基材9之厚度相對於衝擊吸收構件3之厚度的比率若為0.20以上,對筆之每單位厚度的耐衝擊性便佳。基材9之厚度相對於衝擊吸收構件3之厚度的比率若為0.35以下,每單位厚度的球衝擊吸收率便高。In addition, in the organic EL display device 1, if the ratio of the thickness of the base material 9 to the thickness of the impact absorbing member 3 is 0.20 or more, the impact resistance per unit thickness of the pen is good. If the ratio of the thickness of the base material 9 to the thickness of the shock absorbing member 3 is 0.35 or less, the ball shock absorption rate per unit thickness is high.

又,該有機EL顯示裝置1中,基材9之材料若為烯烴樹脂及/或聚酯樹脂,便可提高每單位厚度的球衝擊吸收率及每單位厚度的筆衝擊吸收率。In addition, in the organic EL display device 1, if the material of the base material 9 is olefin resin and/or polyester resin, the ball impact absorption rate per unit thickness and the pen impact absorption rate per unit thickness can be improved.

若藉由具備上述第1步驟S1至第3步驟S3之製造方法來製造有機EL顯示裝置1,係評估試作品40才決定製造條件,因此可提升產率。If the organic EL display device 1 is manufactured by the manufacturing method including the first step S1 to the third step S3 described above, the manufacturing conditions are determined only after evaluating the trial work 40, so that the yield can be improved.

[第2實施形態] 以下第2實施形態中,關於與上述第1實施形態相同之構件及步驟係賦予相同的參照符號,並省略其詳細說明。又,第2實施形態除特別說明外,係可發揮與第1實施形態相同之作用效果。 [Second Embodiment] In the following second embodiment, the same reference numerals are assigned to the same members and steps as those of the above-described first embodiment, and detailed descriptions thereof will be omitted. In addition, unless otherwise specified, the second embodiment can exhibit the same functions and effects as those of the first embodiment.

如圖9所示,在第2實施形態中,基材9為複數個。具體上,基材9係包含第1基材25與第2基材26。又,衝擊吸收構件3更具備中間黏著層19。As shown in FIG. 9, in 2nd Embodiment, the base material 9 is a plurality of pieces. Specifically, the base material 9 includes a first base material 25 and a second base material 26 . In addition, the shock absorbing member 3 further includes an intermediate adhesive layer 19 .

第1基材25係接觸第1黏著層8。第1基材25係配置於第1黏著層8之背面。第1基材25不接觸第2黏著層10。The first base material 25 is in contact with the first adhesive layer 8 . The first base material 25 is disposed on the back surface of the first adhesive layer 8 . The first base material 25 does not contact the second adhesive layer 10 .

第2基材26係隔著間隔配置於第1基材25之背側。第2基材26係接觸第2黏著層10。第2基材26係配置於第2黏著層10之表面。第2基材26不接觸第1黏著層8。The second base material 26 is disposed on the back side of the first base material 25 with an interval therebetween. The second substrate 26 is in contact with the second adhesive layer 10 . The second base material 26 is disposed on the surface of the second adhesive layer 10 . The second base material 26 does not contact the first adhesive layer 8 .

中間黏著層19在第2實施形態中為單數。中間黏著層19係中介於第1基材25與第2基材26之間。中間黏著層19係接觸第1基材25與第2基材26。具體上,中間黏著層19係接觸第1基材25之背面與第2基材26之表面。The intermediate adhesive layer 19 is singular in the second embodiment. The intermediate adhesive layer 19 is interposed between the first base material 25 and the second base material 26 . The intermediate adhesive layer 19 is in contact with the first substrate 25 and the second substrate 26 . Specifically, the intermediate adhesive layer 19 is in contact with the back surface of the first substrate 25 and the surface of the second substrate 26 .

該衝擊吸收構件3往背側依序具備第1黏著層8、第1基材25、中間黏著層19、第2基材26及第2黏著層10。第2實施形態中,衝擊吸收構件3宜僅具備第1黏著層8、第1基材25、中間黏著層19、第2基材26及第2黏著層10。The shock absorbing member 3 includes a first adhesive layer 8 , a first base material 25 , an intermediate adhesive layer 19 , a second base material 26 , and a second adhesive layer 10 in this order toward the back side. In the second embodiment, the shock absorbing member 3 preferably includes only the first adhesive layer 8 , the first base material 25 , the intermediate adhesive layer 19 , the second base material 26 , and the second adhesive layer 10 .

[中間黏著層19之詳細內容] 中間黏著層19在25℃下之剪切儲存彈性模數G’無特別限定。宜為中間黏著層19在25℃下之剪切儲存彈性模數G'為第1黏著層8在25℃下之剪切儲存彈性模數G'以上且第2黏著層10在25℃下之剪切儲存彈性模數G'以下。 [Details of the intermediate adhesive layer 19] The shear storage elastic modulus G' of the intermediate adhesive layer 19 at 25°C is not particularly limited. Preferably, the shear storage elastic modulus G' of the intermediate adhesive layer 19 at 25°C is greater than the shear storage elastic modulus G' of the first adhesive layer 8 at 25°C and the second adhesive layer 10 is at 25°C. Shear storage elastic modulus G' or less.

可知中間黏著層19之剪切儲存彈性模數G’若在第1黏著層8之剪切儲存彈性模數G’以上且第2黏著層10在25℃下之剪切儲存彈性模數G'之值以下,有機EL顯示裝置1對球及筆之每單位厚度的耐衝擊性與耐彎折性便優異。It can be seen that if the shear storage elastic modulus G' of the intermediate adhesive layer 19 is greater than the shear storage elastic modulus G' of the first adhesive layer 8 and the shear storage elastic modulus G' of the second adhesive layer 10 at 25°C Below the value, the organic EL display device 1 is excellent in impact resistance and bending resistance per unit thickness of a ball and a pen.

較宜為中間黏著層19在25℃下之剪切儲存彈性模數G'高於第1黏著層8在25℃下之剪切儲存彈性模數G',且低於第2黏著層10在25℃下之剪切儲存彈性模數G'。此時,可更確實兼顧對球之每單位厚度的高耐衝擊性與高耐彎折性。Preferably, the shear storage elastic modulus G' of the intermediate adhesive layer 19 at 25°C is higher than the shear storage elastic modulus G' of the first adhesive layer 8 at 25°C, and lower than that of the second adhesive layer 10 at 25°C. Shear storage elastic modulus G' at 25°C. In this case, high impact resistance and high bending resistance per unit thickness of the ball can be more reliably achieved.

中間黏著層19在25℃下之剪切儲存彈性模數G'例如為0.01MPa以上,宜為0.05MPa以上,較宜大於0.05MPa,又例如為0.15MPa以下,宜為0.10MPa以下。The shear storage elastic modulus G' of the intermediate adhesive layer 19 at 25°C is, for example, 0.01 MPa or more, preferably 0.05 MPa or more, preferably more than 0.05 MPa, and for example, 0.15 MPa or less, preferably 0.10 MPa or less.

中間黏著層19之剪切儲存彈性模數G'若大於上述下限且小於上述上限,對球之每單位厚度的耐衝擊性與耐彎折性便更優異。If the shear storage elastic modulus G' of the intermediate adhesive layer 19 is larger than the above lower limit and smaller than the above upper limit, the impact resistance and bending resistance per unit thickness of the ball will be more excellent.

中間黏著層19之厚度例如為1µm以上,宜為10µm以上,又例如為40µm以下,宜為30µm以下。The thickness of the intermediate adhesive layer 19 is, for example, 1 µm or more, preferably 10 µm or more, and, for example, 40 µm or less, preferably 30 µm or less.

[第1基材25與第2基材26之詳細內容] 第1基材25與第2基材26之合計厚度相對於衝擊吸收構件3之厚度的比率係與基材9之厚度相對於上述衝擊吸收構件3之厚度的比率相同。 [Details of the first base material 25 and the second base material 26 ] The ratio of the total thickness of the first base material 25 and the second base material 26 to the thickness of the shock absorbing member 3 is the same as the ratio of the thickness of the base material 9 to the thickness of the above-mentioned shock absorbing member 3 .

第1基材25之厚度例如為1µm以上,宜為3µm以上,又例如為50µm以下,宜為20µm以下。The thickness of the first base material 25 is, for example, 1 µm or more, preferably 3 µm or more, and, for example, 50 µm or less, preferably 20 µm or less.

第2基材26之厚度例如為5以上,宜為15µm以上,又例如為100µm以下,宜為50µm以下。The thickness of the second base material 26 is, for example, 5 or more, preferably 15 µm or more, and, for example, 100 µm or less, preferably 50 µm or less.

第1基材25例如較第2基材26更厚或更薄。第1基材25亦可為與第2基材26相同厚度。宜為第1基材25較第2基材26更薄。The first base material 25 is, for example, thicker or thinner than the second base material 26 . The first base material 25 may have the same thickness as the second base material 26 . Preferably, the first base material 25 is thinner than the second base material 26 .

第1基材25若較第2基材26更薄,對球之每單位厚度的耐衝擊性便更優異。When the first base material 25 is thinner than the second base material 26 , the impact resistance per unit thickness of the ball is more excellent.

第1基材25之厚度相對於第2基材26之厚度的比率宜為0.9以下,且宜為0.7以下。又,第1基材25之厚度相對於第2基材26之厚度的比率之下限例如為0.1,又例如為0.2。The ratio of the thickness of the first base material 25 to the thickness of the second base material 26 is preferably 0.9 or less, and preferably 0.7 or less. In addition, the lower limit of the ratio of the thickness of the first base material 25 to the thickness of the second base material 26 is, for example, 0.1, or, for example, 0.2.

另一方面,第1基材25若較第2基材26更厚,對筆之每單位厚度的耐衝擊性便更優異。On the other hand, when the first base material 25 is thicker than the second base material 26, the impact resistance per unit thickness of the pen is more excellent.

第1基材25之厚度相對於第2基材26之厚度的比率宜為1.1以上,且宜為1.4以上。又,第1基材25之厚度相對於第2基材26之厚度的比率之上限例如為10,又例如為5。The ratio of the thickness of the first base material 25 to the thickness of the second base material 26 is preferably 1.1 or more, and preferably 1.4 or more. Moreover, the upper limit of the ratio of the thickness of the 1st base material 25 with respect to the thickness of the 2nd base material 26 is 10, for example, and it is 5, for example.

第1基材25與第2基材26各自在25℃下之拉伸彈性模數E係與第1實施形態之基材9在25℃下之拉伸彈性模數E相同。The tensile elastic modulus E at 25°C of each of the first base material 25 and the second base material 26 is the same as the tensile elastic modulus E at 25°C of the base material 9 of the first embodiment.

[第2實施形態之作用效果] 在該有機EL顯示裝置1中,基材9為複數。又,有機EL顯示裝置1更具備中間黏著層19,該中間黏著層19係配置於複數個基材9之間。因此,易設計符合用途及目的之各種衝擊吸收性能。 [Function and effect of the second embodiment] In this organic EL display device 1, the substrates 9 are plural. In addition, the organic EL display device 1 further includes an intermediate adhesive layer 19 , and the intermediate adhesive layer 19 is arranged between the plurality of substrates 9 . Therefore, it is easy to design various shock absorption properties suitable for the application and purpose.

又,該有機EL顯示裝置1中,中間黏著層19之剪切儲存彈性模數G’若在第1黏著層8之剪切儲存彈性模數G’以上且第2黏著層10在25℃下之剪切儲存彈性模數G'之值以下,有機EL顯示裝置1對球之每單位厚度的耐衝擊性與耐彎折性便優異。In addition, in the organic EL display device 1, if the shear storage elastic modulus G' of the intermediate adhesive layer 19 is greater than the shear storage elastic modulus G' of the first adhesive layer 8 and the second adhesive layer 10 is at 25° C. Below the value of the shear storage elastic modulus G', the organic EL display device 1 is excellent in impact resistance and bending resistance per unit thickness of the ball.

並且,該有機EL顯示裝置1中,中間黏著層19在25℃下之剪切儲存彈性模數G’若高於第1黏著層8在25℃下之剪切儲存彈性模數G’且低於第2黏著層10在25℃下之剪切儲存彈性模數G',有機EL顯示裝置1便可更確實兼顧對球之每單位厚度的高耐衝擊性與高耐彎折性。In addition, in the organic EL display device 1, if the shear storage elastic modulus G' of the intermediate adhesive layer 19 at 25°C is higher than the shear storage elastic modulus G' of the first adhesive layer 8 at 25°C and lower than With the shear storage elastic modulus G′ of the second adhesive layer 10 at 25° C., the organic EL display device 1 can more reliably achieve both high impact resistance and high bending resistance per unit thickness of balls.

具體言之,該有機EL顯示裝置1中,中間黏著層19在25℃下之剪切儲存彈性模數G'若大於0.05MPa且在0.15MPa以下,便可兼顧對球之每單位厚度的高耐衝擊性、對筆之每單位厚度的高耐衝擊性及高耐彎折性。Specifically, in the organic EL display device 1, if the shear storage elastic modulus G' of the intermediate adhesive layer 19 at 25° C. is greater than 0.05 MPa and less than 0.15 MPa, it is possible to take into account the high performance per unit thickness of the ball. Impact resistance, high impact resistance per unit thickness of the pen and high flex resistance.

又,該有機EL顯示裝置1中,第1基材25若較第2基材26更薄,便可確實兼顧對球之每單位厚度的高耐衝擊性與高耐彎折性。In addition, in the organic EL display device 1, if the first base material 25 is thinner than the second base material 26, it is possible to ensure both high impact resistance and high bending resistance per unit thickness of the ball.

另一方面,該有機EL顯示裝置1中,第1基材25若較第2基材26更厚,對筆之每單位厚度的高耐衝擊性便優異。On the other hand, in the organic EL display device 1, if the first base material 25 is thicker than the second base material 26, the high impact resistance per unit thickness of the pen is excellent.

[第2實施形態之變形例] 以下變形例中,關於與上述第2實施形態相同之構件及步驟係賦予相同的參照符號,並省略其詳細說明。又,變形例除特別註記外,係可發揮與第2實施形態相同之作用效果。並可適當組合第2實施形態及其變形例。 [Variation of the second embodiment] In the following modified examples, the same reference numerals are assigned to the same members and steps as those of the second embodiment described above, and detailed descriptions thereof will be omitted. In addition, unless otherwise noted, the modification can exhibit the same functions and effects as those of the second embodiment. The second embodiment and its modifications can be appropriately combined.

該變形例中,如圖10所示,中間黏著層19為複數。具體上,中間黏著層19係包含第1中間黏著層27與第2中間黏著層28。基材9更包含第3基材29。In this modification, as shown in FIG. 10 , the number of intermediate adhesive layers 19 is plural. Specifically, the intermediate adhesive layer 19 includes a first intermediate adhesive layer 27 and a second intermediate adhesive layer 28 . The base material 9 further includes a third base material 29 .

第1中間黏著層27係接觸第1基材25。惟,第1中間黏著層27不接觸第2基材26。第1中間黏著層27係配置於第1基材25之背面。The first intermediate adhesive layer 27 is in contact with the first substrate 25 . However, the first intermediate adhesive layer 27 does not contact the second substrate 26 . The first intermediate adhesive layer 27 is disposed on the back surface of the first base material 25 .

第2中間黏著層28係接觸第2基材26。惟,第2中間黏著層28不接觸第1基材25。第2中間黏著層28係配置於第2基材26之表面。The second intermediate adhesive layer 28 is in contact with the second substrate 26 . However, the second intermediate adhesive layer 28 does not contact the first substrate 25 . The second intermediate adhesive layer 28 is disposed on the surface of the second substrate 26 .

第3基材29係配置於第1中間黏著層27與第2中間黏著層28之間。第3基材29係接觸第1中間黏著層27之背面與第2中間黏著層28之表面。The third base material 29 is disposed between the first intermediate adhesive layer 27 and the second intermediate adhesive layer 28 . The third substrate 29 is in contact with the back surface of the first intermediate adhesive layer 27 and the surface of the second intermediate adhesive layer 28 .

該衝擊吸收構件3往背側依序具備第1黏著層8、第1基材25、第1中間黏著層27、第3基材29、第2中間黏著層28、第2基材26及第2黏著層10。該變形例中,衝擊吸收構件3宜僅具備第1基材25、第1中間黏著層27、第3基材29、第2中間黏著層28、第2基材26及第2黏著層10。The shock absorbing member 3 includes a first adhesive layer 8 , a first base material 25 , a first intermediate adhesive layer 27 , a third base material 29 , a second intermediate adhesive layer 28 , a second base material 26 and a 2 adhesive layer 10. In this modification, the shock absorbing member 3 preferably includes only the first base material 25 , the first intermediate adhesive layer 27 , the third base material 29 , the second intermediate adhesive layer 28 , the second base material 26 , and the second adhesive layer 10 .

第1基材25、第2基材26及第3基材29之合計厚度相對於衝擊吸收構件3之厚度的比率係與基材9之厚度相對於上述衝擊吸收構件3之厚度的比率相同。The ratio of the total thickness of the first base material 25 , the second base material 26 and the third base material 29 to the thickness of the shock absorbing member 3 is the same as the ratio of the thickness of the base material 9 to the thickness of the shock absorbing member 3 .

第1中間黏著層27與第2中間黏著層28各自在25℃下之剪切儲存彈性模數G'與第2實施形態之中間黏著層19在25℃下之剪切儲存彈性模數G'相同。The shear storage elastic modulus G' of each of the first intermediate adhesive layer 27 and the second intermediate adhesive layer 28 at 25°C and the shear storage elastic modulus G' of the intermediate adhesive layer 19 of the second embodiment at 25°C same.

第1實施形態中,如圖1所示,揭示了由3層構成之衝擊吸收構件3。第2實施形態中,如圖9所示,揭示了由5層構成之衝擊吸收構件3。第2實施形態之變形例中,如圖10所示,揭示了由7層構成之衝擊吸收構件3。雖未圖示,但衝擊吸收構件3亦可由[2n+1層]構成。變形例中,n為4以上之正數。變形例中,衝擊吸收構件3係由[n+1]層之黏著層與[n]層之基材構成。In the first embodiment, as shown in FIG. 1 , a shock absorbing member 3 composed of three layers is disclosed. In the second embodiment, as shown in FIG. 9, a shock absorbing member 3 composed of five layers is disclosed. In a modification of the second embodiment, as shown in FIG. 10 , a shock absorbing member 3 composed of seven layers is disclosed. Although not shown, the shock absorbing member 3 may be composed of [2n+1 layers]. In the modified example, n is a positive number of 4 or more. In the modified example, the shock absorbing member 3 is composed of the adhesive layer of the [n+1] layer and the base material of the [n] layer.

第1實施形態中,衝擊吸收構件3係接觸視窗構件2之背面與有機EL面板構件4之表面兩者。但是,衝擊吸收構件3係配置於視窗構件2與有機EL面板構件4之間即可,例如可與衝擊吸收構件3之背面隔著間隔,並與有機EL面板構件4之表面隔著間隔。又,衝擊吸收構件3亦可接觸上述背面及表面中之任一者,並與另一者隔著間隔。具體言之,如圖11所示,衝擊吸收構件3係與視窗構件2之背面接觸,並與有機EL面板構件4隔著間隔。詳細言之,衝擊吸收構件3係與有機EL面板構件4隔著偏光薄膜50及黏著層51配置。In the first embodiment, the shock absorbing member 3 is in contact with both the back surface of the window member 2 and the surface of the organic EL panel member 4 . However, the shock absorbing member 3 may be disposed between the window member 2 and the organic EL panel member 4 , for example, with a space between the rear surface of the shock absorbing member 3 and the surface of the organic EL panel member 4 . In addition, the shock absorbing member 3 may be in contact with any one of the back surface and the front surface, and may be spaced apart from the other. Specifically, as shown in FIG. 11 , the shock absorbing member 3 is in contact with the back surface of the window member 2 and is spaced apart from the organic EL panel member 4 . Specifically, the shock absorbing member 3 and the organic EL panel member 4 are arranged via the polarizing film 50 and the adhesive layer 51 .

偏光薄膜50係接觸第2黏著層10之背面。偏光薄膜50包含偏光件。偏光件可舉例如將親水性薄膜進行染色處理及延伸處理過之薄膜、將親水性薄膜進行脫水處理過之薄膜、及將聚氯乙烯薄膜進行脫鹽酸處理過之薄膜。親水性薄膜可舉例如PVA薄膜。偏光件之全光線透射率例如為30%以上,宜為35%以上,較宜為40%以上,又例如為50%以下。偏光件之厚度例如為1µm以上,宜為3µm以上,又例如為15µm以下,宜為10µm以下。偏光件記載於日本專利特開2020-149065號公報及日本專利特開2019-218513號公報中。偏光薄膜50係藉由將保護薄膜透過接著劑積層於上述偏光件而形成。The polarizing film 50 is in contact with the back surface of the second adhesive layer 10 . The polarizing film 50 includes a polarizer. As the polarizer, for example, a hydrophilic film is dyed and stretched, a hydrophilic film is dehydrated, and a polyvinyl chloride film is dehydrochlorinated. The hydrophilic film may be, for example, a PVA film. The total light transmittance of the polarizer is, for example, 30% or more, preferably 35% or more, preferably 40% or more, and, for example, 50% or less. The thickness of the polarizer is, for example, 1 µm or more, preferably 3 µm or more, and, for example, 15 µm or less, preferably 10 µm or less. Polarizers are described in Japanese Patent Laid-Open No. 2020-149065 and Japanese Patent Laid-Open No. 2019-218513. The polarizing film 50 is formed by laminating a protective film on the above-mentioned polarizer through an adhesive.

黏著層51係中介於偏光薄膜50與有機EL面板構件4之間。黏著層51係接觸偏光薄膜50之背面與有機EL面板構件4之表面。黏著層51之材料、厚度、物性等係與第1黏著層8或第2黏著層10相同。The adhesive layer 51 is interposed between the polarizing film 50 and the organic EL panel member 4 . The adhesive layer 51 is in contact with the back surface of the polarizing film 50 and the surface of the organic EL panel member 4 . The material, thickness and physical properties of the adhesive layer 51 are the same as those of the first adhesive layer 8 or the second adhesive layer 10 .

圖11之變形例之有機EL顯示裝置1中,往背側依序配置視窗構件2、衝擊吸收構件3、偏光薄膜50、黏著層51、有機EL面板構件4及保護構件5。In the organic EL display device 1 of the modification example of FIG. 11 , the window member 2 , the shock absorbing member 3 , the polarizing film 50 , the adhesive layer 51 , the organic EL panel member 4 and the protective member 5 are arranged in this order toward the back side.

對比圖1所示第1實施形態之有機EL顯示裝置1與圖11之變形例之有機EL顯示裝置1,第1實施形態之有機EL顯示裝置1不具備偏光薄膜50及黏著層51。因此,第1實施形態之有機EL顯示裝置1因偏光薄膜50中之偏光件具有上述低之全光線透射率,故光學可靠性優異。Comparing the organic EL display device 1 of the first embodiment shown in FIG. 1 with the organic EL display device 1 of the modification example of FIG. 11 , the organic EL display device 1 of the first embodiment does not include the polarizing film 50 and the adhesive layer 51 . Therefore, the organic EL display device 1 of the first embodiment is excellent in optical reliability because the polarizer in the polarizing film 50 has the above-mentioned low total light transmittance.

實施例 以下顯示實施例及比較例來更具體說明本發明。此外,本發明不受任何實施例及比較例所限。又,以下記載所用摻混比率(比率)、物性值、參數等具體數值,可替代成上述「用以實施發明之形態」中記載之與其等對應之摻混比率(比率)、物性值、參數等該記載之上限(「以下」、「小於」所定義之數值)或下限(「以上」、「大於」所定義之數值)。 Example The present invention will be described in more detail below by showing Examples and Comparative Examples. In addition, this invention is not limited to any Example and a comparative example. In addition, the specific numerical values such as the blending ratio (ratio), physical property value, and parameter used in the following description may be replaced by the blending ratio (ratio), physical property value, and parameter corresponding to the blending ratio (ratio), physical property value, and parameter described in the above-mentioned "Forms for Carrying Out the Invention". the upper limit (the numerical value defined by "below" and "less than") or the lower limit (the numerical value defined by "above" and "greater than") of such description.

[黏著片之調製] 如下述調製黏著片A至黏著片D。 [Adhesive Sheet Preparation] Adhesive Sheet A to Adhesive Sheet D were prepared as described below.

[黏著片A] 摻混丙烯酸月桂酯(LA)43質量份、丙烯酸2-乙基己酯(2EHA)44質量份、丙烯酸4-羥丁酯(4HBA)6質量份、N-乙烯基-2-吡咯啶酮(NVP)7質量份及BASF製「IRGACURE 184」0.015質量份,並照射紫外線進行聚合,而獲得基底聚合物組成物(聚合率:約10%)。 [Adhesive Sheet A] 43 parts by mass of lauryl acrylate (LA), 44 parts by mass of 2-ethylhexyl acrylate (2EHA), 6 parts by mass of 4-hydroxybutyl acrylate (4HBA), N-vinyl-2-pyrrolidone ( NVP) 7 parts by mass and 0.015 parts by mass of "IRGACURE 184" manufactured by BASF, were irradiated with ultraviolet rays and polymerized to obtain a base polymer composition (polymerization rate: about 10%).

另外,混合甲基丙烯酸二環戊酯(DCPMA)60質量份、甲基丙烯酸甲酯(MMA)40質量份、α-硫甘油3.5質量份及甲苯100質量份,並在氮氣環境下在70℃下攪拌1小時。接著,投入2,2'-偶氮雙異丁腈(AIBN)0.2質量份,並在70℃下使其反應2小時後,升溫至80℃,使其反應2小時。之後,將反應液加熱至130℃,並將甲苯、鏈轉移劑及未反應單體乾燥去除而獲得固態丙烯酸系寡聚物。丙烯酸系寡聚物之重量平均分子量為5100。玻璃轉移溫度(Tg)為130℃。In addition, 60 parts by mass of dicyclopentyl methacrylate (DCPMA), 40 parts by mass of methyl methacrylate (MMA), 3.5 parts by mass of α-thioglycerol, and 100 parts by mass of toluene were mixed, and the mixture was heated at 70° C. in a nitrogen atmosphere. under stirring for 1 hour. Next, after adding 0.2 mass part of 2,2'-azobisisobutyronitrile (AIBN), and making it react at 70 degreeC for 2 hours, it heated up to 80 degreeC, and was made to react for 2 hours. Then, the reaction liquid was heated to 130 degreeC, and toluene, a chain transfer agent, and an unreacted monomer were dried and removed, and a solid acrylic oligomer was obtained. The weight average molecular weight of the acrylic oligomer was 5,100. The glass transition temperature (Tg) was 130°C.

相對於基底聚合物組成物之固體成分100質量份,添加1,6-己二醇二丙烯酸酯(HDDA)0.07質量份、丙烯酸系寡聚物1質量份、矽烷耦合劑(信越化學製「KBM403」)0.3質量份後,將該等均勻混合,而調製出黏著劑組成物。With respect to 100 parts by mass of the solid content of the base polymer composition, 0.07 part by mass of 1,6-hexanediol diacrylate (HDDA), 1 part by mass of acrylic oligomer, and a silane coupling agent ("KBM403 manufactured by Shin-Etsu Chemical Co., Ltd.") were added. ”) 0.3 parts by mass, these were uniformly mixed to prepare an adhesive composition.

將黏著劑組成物塗佈於由PET薄膜(Mitsubishi Chemical Co.製「DIAFOIL MRF75」)構成之剝離片表面,然後將由另一PET薄膜(Mitsubishi Chemical Co.製「DIAFOIL MRF75」)構成之剝離片貼合於塗膜上。然後,對塗膜照射紫外線,而調製出厚度50µm之黏著片A。The adhesive composition was applied to the surface of the release sheet made of PET film ("DIAFOIL MRF75" made by Mitsubishi Chemical Co.), and then the release sheet made of another PET film ("DIAFOIL MRF75" made by Mitsubishi Chemical Co.) was attached. fit on the coating film. Then, ultraviolet rays were irradiated to the coating film to prepare an adhesive sheet A with a thickness of 50 µm.

[黏著片B] 於具備攪拌葉片、溫度計、氮氣導入管、冷卻器之四口燒瓶中饋入丙烯酸丁酯(BA)99質量份、丙烯酸4-羥丁酯(HBA)1質量份。藉此調製出單體混合物。 [Adhesive Sheet B] 99 parts by mass of butyl acrylate (BA) and 1 part by mass of 4-hydroxybutyl acrylate (HBA) were fed into a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction pipe, and a cooler. Thereby, a monomer mixture is prepared.

並相對於單體混合物100質量份,將2,2'-偶氮雙異丁腈0.1質量份與乙酸乙酯一同饋入,一邊緩慢地攪拌一邊導入氮氣進行氮取代後,將燒瓶內之液溫保持在55℃附近使其進行7小時聚合反應。之後,於所得反應液中加入乙酸乙酯,而調製出固體成分濃度調整成30%且重量平均分子量160萬之丙烯酸系基底聚合物之溶液。In addition, 0.1 part by mass of 2,2'-azobisisobutyronitrile was fed with ethyl acetate relative to 100 parts by mass of the monomer mixture, and nitrogen gas was introduced while stirring slowly for nitrogen substitution. The temperature was kept around 55°C and the polymerization was carried out for 7 hours. Then, ethyl acetate was added to the obtained reaction liquid, and the solution of the acrylic base polymer whose solid content concentration was adjusted to 30% and the weight average molecular weight of 1.6 million was prepared.

相對於丙烯酸系基底聚合物之溶液的固體成分100質量份,摻混異氰酸酯系交聯劑(商品名:TAKENATE D110N,三羥甲丙烷二異氰酸伸茬酯,三井化學公司製)0.1質量份、苯甲醯基過氧化物(商品名:Nyper BMT,日本油脂公司製)0.3質量份、矽烷耦合劑(商品名:KBM403,信越化學工業公司製)0.08質量份,而調製出丙烯酸系黏著劑組成物。With respect to 100 parts by mass of the solid content of the solution of the acrylic base polymer, 0.1 part by mass of an isocyanate-based crosslinking agent (trade name: TAKENATE D110N, trimethylolpropane diisocyanate, manufactured by Mitsui Chemicals) was blended , 0.3 part by mass of benzyl peroxide (trade name: Nyper BMT, manufactured by NOF Corporation), and 0.08 part by mass of silane coupling agent (trade name: KBM403, manufactured by Shin-Etsu Chemical Co., Ltd.), to prepare an acrylic adhesive composition.

將丙烯酸系黏著劑組成物以噴注式塗佈機均勻塗敷於由PET薄膜構成之剝離片表面,並以155℃之空氣循環式恆溫烘箱乾燥2分鐘,藉此調製出厚度20µm之黏著片B。The acrylic adhesive composition was uniformly coated on the surface of the release sheet composed of PET film by a spray coater, and dried in an air circulation constant temperature oven at 155°C for 2 minutes, thereby preparing an adhesive sheet with a thickness of 20µm B.

[黏著片C] 於具備攪拌葉片、溫度計、氮氣導入管、冷卻器之四口燒瓶中饋入丙烯酸丁酯(BA)99質量份、丙烯酸4-羥丁酯(HBA)1質量份。 [Adhesive Sheet C] 99 parts by mass of butyl acrylate (BA) and 1 part by mass of 4-hydroxybutyl acrylate (HBA) were fed into a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction pipe, and a cooler.

並相對於單體混合物100質量份,將2,2'-偶氮雙異丁腈0.1質量份與乙酸乙酯一同饋入,一邊緩慢地攪拌一邊導入氮氣進行氮取代後,將燒瓶內之液溫保持在55℃附近使其進行7小時聚合反應。之後,於所得反應液中加入乙酸乙酯及甲苯之混合溶劑(以質量比計為95/5),而調製出固體成分濃度調整成30%之丙烯酸系基底聚合物之溶液。In addition, 0.1 part by mass of 2,2'-azobisisobutyronitrile was fed with ethyl acetate relative to 100 parts by mass of the monomer mixture, and nitrogen gas was introduced while stirring slowly for nitrogen substitution. The temperature was kept around 55°C and the polymerization was carried out for 7 hours. Then, the mixed solvent of ethyl acetate and toluene (95/5 in mass ratio) was added to the obtained reaction liquid, and the solution of the acrylic base polymer whose solid content concentration was adjusted to 30% was prepared.

相對於丙烯酸系基底聚合物之溶液的固體成分100質量份,摻混三羥甲丙烷/二異氰酸甲苯酯(Nippon Polyurethane Industry Co.,Ltd.製,商品名:CORONATE L)0.15質量份與矽烷耦合劑(商品名:KBM403,信越化學工業公司製)0.08質量份,而調製出丙烯酸系黏著劑組成物。With respect to 100 parts by mass of the solid content of the solution of the acrylic base polymer, 0.15 part by mass of trimethylolpropane/toluene diisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name: CORONATE L) and 0.08 mass part of silane coupling agent (trade name: KBM403, the Shin-Etsu Chemical Co., Ltd. make), and the acrylic adhesive composition was prepared.

以噴注式塗佈機均勻塗敷於由PET薄膜構成之剝離片表面,並以155℃之空氣循環式恆溫烘箱乾燥2分鐘,藉此調製出厚度15µm之黏著片C。The surface of the release sheet composed of PET film was uniformly coated with a spray coater, and dried in an air circulation constant temperature oven at 155°C for 2 minutes to prepare an adhesive sheet C with a thickness of 15µm.

[黏著片D] 於具備攪拌葉片、溫度計、氮氣導入管、冷卻器之四口燒瓶中饋入丙烯酸丁酯(BA)99質量份、丙烯酸4-羥丁酯(HBA)1質量份。藉此調製出單體混合物。 [Adhesive Sheet D] 99 parts by mass of butyl acrylate (BA) and 1 part by mass of 4-hydroxybutyl acrylate (HBA) were fed into a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction pipe, and a cooler. Thereby, a monomer mixture is prepared.

並相對於單體混合物100質量份,將2,2'-偶氮雙異丁腈0.1質量份與乙酸乙酯一同饋入,一邊緩慢地攪拌一邊導入氮氣進行氮取代後,將燒瓶內之液溫保持在55℃附近使其進行7小時聚合反應。之後,於所得反應液中加入乙酸乙酯,而調製出固體成分濃度調整成30%且重量平均分子量160萬之丙烯酸系基底聚合物之溶液。In addition, 0.1 part by mass of 2,2'-azobisisobutyronitrile was fed with ethyl acetate relative to 100 parts by mass of the monomer mixture, and nitrogen gas was introduced while stirring slowly for nitrogen substitution. The temperature was kept around 55°C and the polymerization was carried out for 7 hours. Then, ethyl acetate was added to the obtained reaction liquid, and the solution of the acrylic base polymer whose solid content concentration was adjusted to 30% and the weight average molecular weight of 1.6 million was prepared.

相對於丙烯酸系基底聚合物之溶液的固體成分100質量份,摻混異氰酸酯系交聯劑(商品名:TAKENATE D110N,三羥甲丙烷二異氰酸伸茬酯,三井化學公司製)0.1質量份、苯甲醯基過氧化物(商品名:Nyper BMT,日本油脂公司製)0.3質量份、矽烷耦合劑(商品名:KBM403,信越化學工業公司製)0.08質量份,而調製出丙烯酸系黏著劑組成物。With respect to 100 parts by mass of the solid content of the solution of the acrylic base polymer, 0.1 part by mass of an isocyanate-based crosslinking agent (trade name: TAKENATE D110N, trimethylolpropane diisocyanate, manufactured by Mitsui Chemicals) was blended , 0.3 part by mass of benzyl peroxide (trade name: Nyper BMT, manufactured by NOF Corporation), and 0.08 part by mass of silane coupling agent (trade name: KBM403, manufactured by Shin-Etsu Chemical Co., Ltd.), to prepare an acrylic adhesive composition.

將丙烯酸系黏著劑組成物以噴注式塗佈機均勻塗敷於由PET薄膜構成之剝離片表面,並以155℃之空氣循環式恆溫烘箱乾燥2分鐘,藉此調製出厚度5µm之黏著片D。The acrylic adhesive composition was uniformly coated on the surface of the release sheet composed of PET film by a spray coater, and dried in an air circulation constant temperature oven at 155°C for 2 minutes, thereby preparing an adhesive sheet with a thickness of 5µm D.

[黏著片之剪切儲存彈性模數G’] 測定黏著片A至C各自在25℃下之剪切儲存彈性模數G'。 [Shear storage elastic modulus G' of adhesive sheet] The shear storage elastic modulus G' at 25°C of each of the adhesive sheets A to C was measured.

具體上,係剝離剝離片並將其進行外形加工成圓盤狀,以平行板包夾,並使用Rheometric Scientific公司製「Advanced Rheometric Expansion System(ARES)」,藉由以下條件之動態黏彈性測定求出黏著片之剪切儲存彈性模數G'。Specifically, the peeling sheet is peeled off, its outer shape is processed into a disk shape, and it is sandwiched by parallel plates, and is obtained by measuring the dynamic viscoelasticity under the following conditions using the "Advanced Rheometric Expansion System (ARES)" manufactured by Rheometric Scientific Co., Ltd. The shear storage elastic modulus G' of the adhesive sheet is obtained.

[測定條件] 模式:扭轉 溫度:-40℃至150℃ 升溫速度:5℃/分鐘 頻率:1Hz [Measurement conditions] Mode: Twist Temperature: -40℃ to 150℃ Heating rate: 5°C/min Frequency: 1Hz

[基材之準備] 如下述準備基材A至基材D。 [Substrate preparation] Substrates A to D were prepared as described below.

[基材A] 準備由COP構成之基材(商品名「ZEONOR」,日本ZEON公司製)作為基材A。 [Substrate A] As the base material A, a base material composed of COP (trade name "ZEONOR", manufactured by ZEON Corporation of Japan) was prepared.

[基材B] 準備由PET構成之基材(商品名「Lumirror S10」,Toray公司製)作為基材B。 [Substrate B] As the base material B, a base material made of PET (trade name "Lumirror S10", manufactured by Toray Corporation) was prepared.

[基材C] 準備由透明軟質聚酯樹脂構成之基材(商品名「OKY100」,Bell Polyester Products, Inc.製)作為基材C。 [Substrate C] As the substrate C, a substrate (trade name "OKY100", manufactured by Bell Polyester Products, Inc.) composed of a transparent flexible polyester resin was prepared.

[基材D] 準備由透明聚醯亞胺構成之基材(製品名「C_50」,KOLON公司製)作為基材D。 [Substrate D] As the base material D, a base material (product name "C_50", manufactured by KOLON Corporation) made of transparent polyimide was prepared.

[基材之拉伸彈性模數E] 測定基材A至基材D各自在25℃下之拉伸彈性模數E。 [Tensile elastic modulus E of substrate] The tensile elastic modulus E at 25° C. of each of the substrates A to D was measured.

將基材A至基材D分別進行外形加工成寬度10mm、長度100mm之矩形形狀。將基材設置於拉伸試驗機(島津製作所製 製品名「Autograph AG-IS」)上,測定以200mm/分鐘拉伸時的應變與應力,並從應變在0.05%~0.25%之範圍時的曲線的斜率算出基材之拉伸彈性模數E。基材A至基材D各自在25℃下之拉伸彈性模數E分別為3GPa、3.5GPa、0.13GPa、7GPa。Substrate A to Substrate D were processed to have a rectangular shape with a width of 10 mm and a length of 100 mm, respectively. The substrate was set on a tensile tester (product name "Autograph AG-IS" manufactured by Shimadzu Corporation), and the strain and stress when stretched at 200 mm/min were measured, and the strain and stress were measured when the strain was in the range of 0.05% to 0.25%. The slope of the curve calculates the tensile modulus of elasticity E of the substrate. The tensile modulus E of each of the substrates A to D at 25° C. is 3GPa, 3.5GPa, 0.13GPa, and 7GPa, respectively.

[對應第1實施形態之有機EL顯示裝置1之模擬試樣之製造] 實施例1 分別於由基材A構成之基材9之表面與背面各自配置由黏著片A構成之第1黏著層8與由黏著片C構成之第2黏著層10。藉此,製作出於厚度方向上依序具備第1黏著層8、基材9及第2黏著層10之衝擊吸收構件3。亦即,製作由3層構成之衝擊吸收構件3。 [Manufacture of a dummy sample corresponding to the organic EL display device 1 of the first embodiment] Example 1 The first adhesive layer 8 composed of the adhesive sheet A and the second adhesive layer 10 composed of the adhesive sheet C are respectively disposed on the front and back surfaces of the substrate 9 composed of the substrate A, respectively. Thereby, the shock absorbing member 3 including the first adhesive layer 8 , the base material 9 , and the second adhesive layer 10 in this order in the thickness direction is produced. That is, the shock absorbing member 3 composed of three layers was produced.

如圖1所示,之後積層視窗構件2、衝擊吸收構件3、有機EL面板構件4及保護構件5,而製造出有機EL顯示裝置1之模擬試樣。此外,於有機EL面板構件4之表面配置有ITO層35來取代薄膜密封層11。ITO層35之厚度為40nm。As shown in FIG. 1 , the window member 2 , the shock absorbing member 3 , the organic EL panel member 4 , and the protective member 5 were then laminated to produce a mock sample of the organic EL display device 1 . In addition, an ITO layer 35 is arranged on the surface of the organic EL panel member 4 instead of the thin film sealing layer 11 . The thickness of the ITO layer 35 is 40 nm.

視窗構件2具備:硬塗層6,其厚度為10µm且由日本專利特開2020-064236號公報之實施例1之硬化性組成物的硬化物構成;及視窗薄膜7,其厚度為80µm且由「CPI」(KOLON公司製)構成。The window member 2 includes: a hard coat layer 6 having a thickness of 10 µm and consisting of a cured product of the curable composition of Example 1 of Japanese Patent Laid-Open No. 2020-064236; and a window film 7 having a thickness of 80 µm and consisting of "CPI" (made by KOLON Corporation).

準備厚度25µm之聚醯亞胺板(商品名「UPILEX」,宇部興產公司製)作為代用面板構件44之面板本體12。A polyimide sheet (trade name "UPILEX", manufactured by Ube Industries, Ltd.) having a thickness of 25 µm was prepared as the panel body 12 of the substitute panel member 44 .

保護構件5係由與黏著片A相同之材料構成,且往背側依序配置有厚度15µm之表側黏著層13與由厚度50µm之聚醯亞胺板(商品名「UPILEX」,宇部興產公司製)構成之保護基材14。The protective member 5 is made of the same material as the adhesive sheet A, and the front side adhesive layer 13 with a thickness of 15 µm and a polyimide sheet with a thickness of 50 µm (trade name "UPILEX", Ube Kosan Co., Ltd. The protective substrate 14 constituted by the system).

實施例2至實施例10、實施例27至實施例29、比較例1至比較例5、比較例10及比較例11 依與實施例1相同方式,而製出有機EL顯示裝置1之試作品40(模擬試樣)。惟,如表1至表3及表11之記載變更第1黏著層8、基材9及/或第2黏著層10。 Example 2 to Example 10, Example 27 to Example 29, Comparative Example 1 to Comparative Example 5, Comparative Example 10 and Comparative Example 11 In the same manner as in Example 1, a prototype 40 (simulation sample) of the organic EL display device 1 was produced. However, the first adhesive layer 8 , the base material 9 and/or the second adhesive layer 10 were changed as described in Tables 1 to 3 and Table 11.

[對應第2實施形態之有機EL顯示裝置1之製造] 實施例11至實施例23 依與實施例1相同方式進行處理,而製出有機EL顯示裝置1之試作品40(模擬試樣)。惟,如圖9所示,使用由5層構成之衝擊吸收構件3。又,如表4至表8之記載變更各層。具體上,衝擊吸收構件3依序具備第1黏著層8、第1基材25、中間黏著層19、第2基材26及第2黏著層10。 [Manufacture of the organic EL display device 1 corresponding to the second embodiment] Example 11 to Example 23 Processing was carried out in the same manner as in Example 1, and a prototype 40 (simulation sample) of the organic EL display device 1 was produced. However, as shown in FIG. 9, the shock absorbing member 3 composed of five layers was used. In addition, each layer was changed as described in Table 4 to Table 8. Specifically, the shock absorbing member 3 includes the first adhesive layer 8 , the first base material 25 , the intermediate adhesive layer 19 , the second base material 26 , and the second adhesive layer 10 in this order.

[對應第2實施形態之變形例之有機EL顯示裝置1之製造] 實施例24至實施例26 依與實施例1相同方式進行處理,而製出有機EL顯示裝置1之試作品40(模擬試樣)。惟,如圖10所示,使用由7層構成之衝擊吸收構件3。又,如表9之記載變更各層。具體上,衝擊吸收構件3依序具備第1黏著層8、第1基材25、第1中間黏著層27、第3基材29、第2中間黏著層28、第2基材26及第2黏著層10。 [Manufacture of an organic EL display device 1 corresponding to a modification of the second embodiment] Example 24 to Example 26 Processing was carried out in the same manner as in Example 1, and a prototype 40 (simulation sample) of the organic EL display device 1 was produced. However, as shown in FIG. 10, the shock absorbing member 3 composed of seven layers was used. In addition, each layer was changed as described in Table 9. Specifically, the shock absorbing member 3 includes the first adhesive layer 8 , the first base material 25 , the first intermediate adhesive layer 27 , the third base material 29 , the second intermediate adhesive layer 28 , the second base material 26 , and the second base material 27 in this order. Adhesive layer 10 .

[衝擊吸收構件3僅由黏著層30構成之有機EL顯示裝置1之製造] 比較例6至比較例9 依與實施例1相同方式進行處理,而製出有機EL顯示裝置1之試作品40(模擬試樣)。惟,雖未圖示,但使用由1層構成之衝擊吸收構件3。衝擊吸收構件3係僅由黏著層30構成。如表10之記載變更黏著層30。 [Manufacture of the organic EL display device 1 in which the shock absorbing member 3 consists only of the adhesive layer 30 ] Comparative Example 6 to Comparative Example 9 Processing was carried out in the same manner as in Example 1, and a prototype 40 (simulation sample) of the organic EL display device 1 was produced. However, although not shown, the shock absorbing member 3 composed of one layer is used. The shock absorbing member 3 is composed of only the adhesive layer 30 . The adhesive layer 30 was changed as described in Table 10.

[評估] 評估下述項目。將該等結果記載於表1至表11中。 [Evaluate] Evaluate the following items. These results are described in Tables 1 to 11.

[衝擊吸收構件3之每單位厚度的球衝擊吸收率] 準備各實施例及各比較例之衝擊吸收構件3。接著,如圖2B所示,僅將視窗構件2載置於設置於不鏽鋼板91表面的PCB公司製之感測器(製品名:480C02)92之表面。此時,係使視窗薄膜7接觸感測器92之表面。使重量10g、直徑13mm之不鏽鋼製球從20cm之高度垂直落下至視窗構件2之硬塗層6之表面。以與感測器92連接之HIOKI公司製之記錄儀(製品名:MR8870)測定視窗構件2單獨之衝擊荷重的峰值SA1。 [Ball impact absorption rate per unit thickness of impact absorbing member 3] The shock absorbing member 3 of each Example and each Comparative Example was prepared. Next, as shown in FIG. 2B , only the window member 2 is placed on the surface of the sensor (product name: 480C02) 92 provided on the surface of the stainless steel plate 91 by PCB Company. At this time, the window film 7 is brought into contact with the surface of the sensor 92 . A stainless steel ball with a weight of 10 g and a diameter of 13 mm was vertically dropped onto the surface of the hard coat layer 6 of the window member 2 from a height of 20 cm. The peak value SA1 of the impact load of the window member 2 alone was measured with a recorder (product name: MR8870) manufactured by HIOKI Co., Ltd. connected to the sensor 92 .

接著,如圖2A所示,取代視窗構件2而改為將視窗構件2與衝擊吸收構件3之積層體載置於感測器92之表面。使衝擊吸收構件3之背面接觸感測器92之表面。使上述球從20cm之高度垂直落下至視窗構件2之硬塗層6之表面。以上述記錄儀測定視窗構件2與衝擊吸收構件3之積層體之衝擊荷重的峰值SB1。Next, as shown in FIG. 2A , instead of the window member 2 , a laminate of the window member 2 and the shock absorbing member 3 is placed on the surface of the sensor 92 . The rear surface of the shock absorbing member 3 is brought into contact with the surface of the sensor 92 . The above-mentioned ball was vertically dropped from a height of 20 cm to the surface of the hard coat layer 6 of the window member 2 . The peak value SB1 of the impact load of the laminated body of the window member 2 and the impact absorbing member 3 was measured with the above-mentioned recorder.

使用下述式求算衝擊吸收構件3之球衝擊吸收率。The spherical shock absorption rate of the shock absorbing member 3 was calculated using the following formula.

球衝擊吸收率(%)={(SA1-SB1)/SA1}×100 接著,將球衝擊吸收率除以衝擊吸收構件3之厚度,算出衝擊吸收構件3之每單位厚度的球衝擊吸收率。 Ball impact absorption rate (%)={(SA1-SB1)/SA1}×100 Next, the ball impact absorption rate per unit thickness of the shock absorption member 3 was calculated by dividing the ball impact absorption rate by the thickness of the impact absorption member 3 .

[衝擊吸收構件3之筆衝擊吸收率、衝擊吸收構件3之每單位厚度的筆衝擊吸收率] 準備各實施例及各比較例之衝擊吸收構件3。接著,如圖3B所示,僅將視窗構件2載置於設置於不鏽鋼板91表面的PCB公司製之感測器(製品名:480C02)92之表面。此時,係使視窗薄膜7接觸感測器92之表面。使重量7g、球珠直徑0.7mm之原子筆(Pentel股份公司製之油性原子筆「BK407黑」)從20cm之高度垂直落下至視窗構件2之硬塗層6之表面。以與感測器92連接之HIOKI公司製之記錄儀(製品名:MR8870)測定視窗構件2單獨之衝擊荷重的峰值SA2。 [Pen shock absorption rate of the shock absorbing member 3, Pen shock absorption rate per unit thickness of the shock absorbing member 3] The shock absorbing member 3 of each Example and each Comparative Example was prepared. Next, as shown in FIG. 3B , only the window member 2 is placed on the surface of the sensor (product name: 480C02) 92 provided on the surface of the stainless steel plate 91 by the PCB company. At this time, the window film 7 is brought into contact with the surface of the sensor 92 . A ballpoint pen with a weight of 7g and a ball diameter of 0.7mm (oil-based ballpoint pen "BK407 Black" manufactured by Pentel Co., Ltd.) was vertically dropped onto the surface of the hard coat layer 6 of the window member 2 from a height of 20cm. The peak value SA2 of the impact load of the window member 2 alone was measured with a recorder (product name: MR8870) manufactured by HIOKI Co., Ltd. connected to the sensor 92 .

接著,如圖3A所示,取代視窗構件2而改為將視窗構件2與衝擊吸收構件3之積層體載置於感測器92之表面。使衝擊吸收構件3之背面接觸感測器92之表面。使上述筆從20cm之高度垂直落下至視窗構件2之硬塗層6之表面。以上述記錄儀測定視窗構件2與衝擊吸收構件3之積層體之衝擊荷重的峰值SB2。Next, as shown in FIG. 3A , instead of the window member 2 , a laminate of the window member 2 and the shock absorbing member 3 is placed on the surface of the sensor 92 . The rear surface of the shock absorbing member 3 is brought into contact with the surface of the sensor 92 . The above-mentioned pen was vertically dropped to the surface of the hard coat layer 6 of the window member 2 from a height of 20 cm. The peak value SB2 of the impact load of the laminated body of the window member 2 and the impact absorbing member 3 was measured with the above-mentioned recorder.

使用下述式求算衝擊吸收構件3之筆衝擊吸收率。The pen shock absorption rate of the shock absorbing member 3 was calculated using the following formula.

筆衝擊吸收率(%)={(SA2-SB2)/SA2}×100 接著,將筆衝擊吸收率除以衝擊吸收構件3之厚度,算出衝擊吸收構件3之每單位厚度的筆衝擊吸收率。 Pen shock absorption rate (%)={(SA2-SB2)/SA2}×100 Next, the pen shock absorption rate was divided by the thickness of the shock absorbing member 3 to calculate the pen shock absorption rate per unit thickness of the shock absorbing member 3 .

[有機EL顯示裝置1之彎折試驗] (1)表面21間之距離為8mm之彎折試驗 將有機EL顯示裝置1(模擬試樣)進行外形加工而製出第3試樣63。如圖4A至圖4B所示,實施反覆200,000次撓曲及攤開之撓曲試驗。具體上係使用耐久試驗機(型號「DMLHB-FS-C」,YUASA公司製)。針對視窗構件2,將朝兩外側之2個表面21之間隔設為8mm。 利用測試機測定ITO層35在撓曲試驗後之電阻值相對於ITO層35在撓曲試驗前之電阻值的比率。 以ITO層35之電阻值的變化來評估薄膜密封層11有無損傷。 [Bending test of organic EL display device 1] (1) Bending test with a distance of 8 mm between the surfaces 21 The external shape of the organic EL display device 1 (dummy sample) was processed to produce a third sample 63 . As shown in FIGS. 4A to 4B , a flexure test of 200,000 repeated flexures and spreads was performed. Specifically, a durability tester (model "DMLHB-FS-C", manufactured by Yuasa Corporation) was used. Regarding the window member 2, the interval between the two outer surfaces 21 was set to 8 mm. The ratio of the resistance value of the ITO layer 35 after the flexure test to the resistance value of the ITO layer 35 before the flexure test was measured using a testing machine. The change in the resistance value of the ITO layer 35 was used to evaluate whether the thin film sealing layer 11 was damaged or not.

○:ITO層35在試驗後之電阻值相對於ITO層35在試驗後之電阻值的比率小於試驗前1.1倍。 ×:ITO層35在試驗後之電阻值相對於ITO層35在試驗後之電阻值的比率為試驗前1.1倍以上。 ○: The ratio of the resistance value of the ITO layer 35 after the test to the resistance value of the ITO layer 35 after the test was less than 1.1 times before the test. ×: The ratio of the resistance value of the ITO layer 35 after the test to the resistance value of the ITO layer 35 after the test is 1.1 times or more before the test.

(2)表面21間之距離為6mm之彎折試驗 針對在上述(1)中「○」評價之有機EL顯示裝置1,以使間隔成為6mm之方式實施與上述相同之彎折試驗。 (2) Bending test with a distance of 6 mm between the surfaces 21 With respect to the organic EL display device 1 evaluated by "◯" in the above (1), the same bending test as above was carried out so that the interval was 6 mm.

[衝擊吸收構件3之全光線透射率] 調製出衝擊吸收構件3與視窗構件2之積層體。使用Suga Test Instruments Co.,Ltd.製霧度計測定積層體之全光線透射率。測定係依循JIS K7105。 [Total light transmittance of the shock absorbing member 3] A laminate of the shock absorbing member 3 and the window member 2 was prepared. The total light transmittance of the laminate was measured using a haze meter manufactured by Suga Test Instruments Co., Ltd. The measurement was in accordance with JIS K7105.

從上述結果求出衝擊吸收構件3之全光線透射率。上述積層體之全光線透射率若為60%以上,亦可謂衝擊吸收構件3之全光線透射率為60%以上。The total light transmittance of the shock absorbing member 3 was obtained from the above results. If the total light transmittance of the above-mentioned laminated body is 60% or more, it can also be said that the total light transmittance of the shock absorbing member 3 is 60% or more.

為容易對比,將諸個實施例記載於複數個表中。實施例1係重複記載於表1與表2中。實施例7係重複記載於表2與表11中。實施例12係重複記載於表4與表6中。實施例13係重複記載於表4與表7中。實施例15係重複記載於表5與表6中。實施例16係重複記載於表5與表7中。For ease of comparison, the various examples are recorded in a plurality of tables. Example 1 is repeatedly described in Tables 1 and 2. Example 7 is repeated in Table 2 and Table 11. Example 12 is repeatedly described in Tables 4 and 6. Example 13 is repeated in Table 4 and Table 7. Example 15 is repeatedly described in Tables 5 and 6. Example 16 is repeatedly described in Tables 5 and 7.

於圖12顯示實施例1至實施例6之第1黏著層8之剪切儲存彈性模數G'與第2黏著層10之剪切儲存彈性模數G'。12 shows the shear storage elastic modulus G' of the first adhesive layer 8 and the shear storage elastic modulus G' of the second adhesive layer 10 of Examples 1 to 6.

[實施例與比較例之驗證] 由表3、表10、表11可知,比較例1至比較例5、比較例7、比較例10及比較例11之每單位厚度的球衝擊吸收率皆小於0.27%/µm。比較例1至比較例5、比較例7、比較例10及比較例11之每單位厚度的球衝擊吸收率不夠充分。 [Verification of Examples and Comparative Examples] It can be seen from Table 3, Table 10 and Table 11 that the ball impact absorption rate per unit thickness of Comparative Examples 1 to 5, Comparative Example 7, Comparative Example 10 and Comparative Example 11 is all less than 0.27%/µm. The ball impact absorption rate per unit thickness of Comparative Examples 1 to 5, Comparative Example 7, Comparative Example 10, and Comparative Example 11 was insufficient.

由表10可知,比較例6至比較例9之每單位厚度的筆衝擊吸收率皆小於0.10%/µm。比較例6至比較例9對筆之每單位厚度的筆衝擊吸收率不夠充分。It can be seen from Table 10 that the pen impact absorption rate per unit thickness of Comparative Examples 6 to 9 is all less than 0.10%/µm. In Comparative Examples 6 to 9, the pen shock absorption rate per unit thickness of the pen was insufficient.

比較例7在彎折時發生剝離。比較例7之耐彎折性不足。In Comparative Example 7, peeling occurred during bending. The bending resistance of Comparative Example 7 was insufficient.

相對此,由表1、表2、表4至表9及表11可知,實施例1至實施例29之每單位厚度的球衝擊吸收率皆為0.27%/µm以上,且每單位厚度的筆衝擊吸收率皆為0.10%/µm以上。因此,有機EL顯示裝置1對球90之衝擊及對筆95造成之衝擊的耐久性優異。因此,實施例1至實施例29對各種衝擊的耐久性優異。In contrast, it can be seen from Table 1, Table 2, Table 4 to Table 9 and Table 11 that the ball impact absorption rate per unit thickness of Examples 1 to 29 is all 0.27%/µm or more, and the pen per unit thickness The shock absorption rate is above 0.10%/µm. Therefore, the organic EL display device 1 is excellent in durability against impact to the ball 90 and impact to the pen 95 . Therefore, Examples 1 to 29 are excellent in durability against various impacts.

[各實施例之驗證] 由表1可知,實施例1至實施例6中,基材9雖相同,但第1黏著層8及/或第2黏著層10之剪切儲存彈性模數G'有變動。 [Verification of each embodiment] As can be seen from Table 1, in Examples 1 to 6, although the base material 9 is the same, the shear storage elastic modulus G' of the first adhesive layer 8 and/or the second adhesive layer 10 varies.

具體言之,實施例1、實施例2及實施例3各自之第1黏著層8之剪切儲存彈性模數G'為0.03MPa、0.08MPa、0.12MPa。Specifically, the shear storage elastic modulus G' of the first adhesive layer 8 in each of Example 1, Example 2, and Example 3 was 0.03 MPa, 0.08 MPa, and 0.12 MPa.

實施例1至實施例3中,實施例1與實施例2係第2黏著層10在25℃下之剪切儲存彈性模數G'高於第1黏著層8在25℃下之剪切儲存彈性模數G'之實施例。可知相較於實施例3,實施例1與實施例2對球及筆之每單位厚度的耐衝擊性更優異。In Examples 1 to 3, the shear storage elastic modulus G' of the second adhesive layer 10 at 25°C is higher than that of the first adhesive layer 8 at 25°C in Examples 1 and 2 Example of elastic modulus G'. It turned out that, compared with Example 3, Example 1 and Example 2 are more excellent in the impact resistance per unit thickness of a ball and a pen.

實施例1至實施例6中,實施例1、實施例4及實施例5係第1黏著層8在25℃下之剪切儲存彈性模數G'為0.05MPa以下之實施例。可知相較於實施例2、實施例3及實施例6,實施例1、實施例4及實施例5對球之每單位厚度的耐衝擊性更優異。Among Examples 1 to 6, Example 1, Example 4 and Example 5 are examples in which the shear storage elastic modulus G' of the first adhesive layer 8 at 25°C is 0.05 MPa or less. It can be seen that Example 1, Example 4, and Example 5 are more excellent in impact resistance per unit thickness of the ball than in Example 2, Example 3, and Example 6.

又,實施例1至實施例6中,實施例1至實施例3係第2黏著層10在25℃下之剪切儲存彈性模數G'為0.10MPa以上之實施例。可知實施例1至實施例3之耐彎折性較實施例4至實施例6更優異。In addition, among Examples 1 to 6, Examples 1 to 3 are examples in which the shear storage elastic modulus G' of the second adhesive layer 10 at 25° C. is 0.10 MPa or more. It can be seen that the bending resistance of Examples 1 to 3 is more excellent than that of Examples 4 to 6.

並且,實施例1至實施例6中,實施例1係從第2黏著層10在25℃下之剪切儲存彈性模數G'減去第1黏著層8在25℃下之剪切儲存彈性模數G'之值為0.06MPa以上之實施例。可知相較於實施例2至實施例6,實施例1可更確實兼顧對球之每單位厚度的高耐衝擊性與對筆之每單位厚度的高耐衝擊性。In addition, among Examples 1 to 6, in Example 1, the shear storage elasticity of the first adhesive layer 8 at 25° C. was subtracted from the shear storage elastic modulus G′ of the second adhesive layer 10 at 25° C. Examples in which the value of the modulus G' is 0.06 MPa or more. It can be seen that, compared with Examples 2 to 6, Example 1 can more reliably achieve both high impact resistance per unit thickness to the ball and high impact resistance per unit thickness to the pen.

由表2可知,實施例1與實施例7至實施例9中,實施例1與實施例8係基材9之厚度相對於衝擊吸收構件3之厚度的比率為0.20以上且0.35以下之實施例。可知相較於比率大於0.35之實施例7,實施例1與實施例8對球之每單位厚度的衝擊吸收性更優異。可知相較於比率小於0.20之實施例9,實施例1與實施例8對筆之每單位厚度的耐衝擊性更優異。該等傾向在基材9為複數之實施例12、實施例13及實施例15至實施例26中亦同。As can be seen from Table 2, among Examples 1 and 7 to 9, Examples 1 and 8 are examples in which the ratio of the thickness of the base material 9 to the thickness of the shock absorbing member 3 is 0.20 or more and 0.35 or less. . It can be seen that Examples 1 and 8 are more excellent in impact absorption per unit thickness of the ball than in Example 7 in which the ratio is greater than 0.35. It can be seen that Examples 1 and 8 are more excellent in impact resistance per unit thickness of the pen than in Example 9 in which the ratio is less than 0.20. These tendencies are also the same in Example 12, Example 13, and Example 15 to Example 26 in which the substrates 9 are plural.

亦即,如由表6可知,相較於比率大於0.35之實施例17,基材9之厚度具有上述比率之實施例12、實施例15及實施例18之每單位厚度的球衝擊吸收率更高。That is, as can be seen from Table 6, the ball impact absorption rate per unit thickness of Example 12, Example 15 and Example 18 in which the thickness of the substrate 9 has the above ratio is higher than that in Example 17 in which the ratio is greater than 0.35. high.

如由表7可知,相較於比率大於0.35之實施例19,基材9之厚度具有上述比率之實施例13、實施例16及實施例20之每單位厚度的球衝擊吸收率更高。As can be seen from Table 7, compared to Example 19 with a ratio greater than 0.35, Examples 13, 16 and 20 with the thickness of the substrate 9 having the above ratio have higher ball impact absorption per unit thickness.

如由表8可知,相較於比率大於0.35之實施例23,基材9之厚度具有上述比率之實施例21與實施例22之每單位厚度的球衝擊吸收率更高。As can be seen from Table 8, compared to Example 23 with a ratio greater than 0.35, Example 21 and Example 22 with the thickness of the substrate 9 having the above ratio have higher ball impact absorption per unit thickness.

如由表9可知,相較於比率大於0.35之實施例26,基材9之厚度具有上述比率之實施例24與實施例25之每單位厚度的球衝擊吸收率更高。As can be seen from Table 9, compared to Example 26 with a ratio greater than 0.35, Example 24 and Example 25 with the thickness of the substrate 9 having the above ratio have higher ball impact absorption rate per unit thickness.

又,由表2可知,實施例1與實施例10僅基材9之材料不同。可知相較於基材9之材料為PET的實施例10,基材9之材料為COP的實施例1之每單位厚度的球衝擊吸收率更高。In addition, as can be seen from Table 2, Example 1 and Example 10 differ only in the material of the base material 9 . It can be seen that the ball impact absorption rate per unit thickness of Example 1 in which the material of the substrate 9 is COP is higher than that of Example 10 in which the material of the substrate 9 is PET.

由表11可知,實施例7、實施例29及比較例11僅基材9之材料不同。可知相較於基材9之材料為聚醯亞胺樹脂的比較例11,基材9之材料為COP的實施例7與基材9之材料為聚酯樹脂的實施例29之每單位厚度的球衝擊吸收率更高。As can be seen from Table 11, Example 7, Example 29 and Comparative Example 11 differ only in the material of the base material 9. It can be seen that compared with Comparative Example 11 in which the material of the substrate 9 is polyimide resin, the material of Example 7 in which the material of the substrate 9 is COP and the material of Example 29 in which the material of the substrate 9 is polyester resin has a The ball impact absorption rate is higher.

又,由表4可知,實施例11至實施例13中,實施例11係中間黏著層19在25℃下之剪切儲存彈性模數G'高於第1黏著層8在25℃下之剪切儲存彈性模數G'且低於第2黏著層10在25℃下之剪切儲存彈性模數G'之實施例。相較於實施例12與實施例13,實施例11可更兼顧對球之每單位厚度的高耐衝擊性與高耐彎折性。In addition, it can be seen from Table 4 that among Examples 11 to 13, the shear storage elastic modulus G' of the intermediate adhesive layer 19 in Example 11 at 25°C is higher than that of the first adhesive layer 8 at 25°C. An embodiment in which the shear storage elastic modulus G' is lower than the shear storage elastic modulus G' of the second adhesive layer 10 at 25°C. Compared with Example 12 and Example 13, Example 11 can achieve both high impact resistance and high bending resistance per unit thickness of the ball.

又,由表5可知,實施例14至實施例16中,實施例14係中間黏著層19在25℃下之剪切儲存彈性模數G'高於第1黏著層8在25℃下之剪切儲存彈性模數G'且低於第2黏著層10在25℃下之剪切儲存彈性模數G'之實施例。相較於實施例15與實施例16,實施例14可更兼顧對球之每單位厚度的高耐衝擊性與高耐彎折性。In addition, it can be seen from Table 5 that among Examples 14 to 16, the shear storage elastic modulus G' of the intermediate adhesive layer 19 in Example 14 at 25°C is higher than that of the first adhesive layer 8 at 25°C. An embodiment in which the shear storage elastic modulus G' is lower than the shear storage elastic modulus G' of the second adhesive layer 10 at 25°C. Compared with Example 15 and Example 16, Example 14 can achieve both high impact resistance and high bending resistance per unit thickness of the ball.

由表4可知,實施例11至實施例13中,實施例11與實施例13係中間黏著層19在25℃下之剪切儲存彈性模數G'大於0.05MPa且在0.15MPa以下之實施例。相較於實施例12,實施例11與實施例13可更兼顧對球之每單位厚度的高耐衝擊性、對筆之每單位厚度的高耐衝擊性及高耐彎折性。It can be seen from Table 4 that among Examples 11 to 13, Examples 11 and 13 are examples in which the shear storage elastic modulus G' of the intermediate adhesive layer 19 at 25°C is greater than 0.05 MPa and less than 0.15 MPa . Compared with Example 12, Example 11 and Example 13 can better take into account the high impact resistance per unit thickness of the ball, the high impact resistance per unit thickness of the pen, and the high bending resistance.

又,由表5可知,實施例14至實施例16中,實施例14與實施例16係中間黏著層19在25℃下之剪切儲存彈性模數G'大於0.05MPa且在0.15MPa以下之實施例。相較於實施例15,實施例14與實施例16可更兼顧對球之每單位厚度的高耐衝擊性、對筆之每單位厚度的高耐衝擊性及高耐彎折性。In addition, it can be seen from Table 5 that among Examples 14 to 16, the shear storage elastic modulus G' of the intermediate adhesive layer 19 in Examples 14 and 16 at 25°C is greater than 0.05 MPa and less than 0.15 MPa. Example. Compared with Example 15, Example 14 and Example 16 can better take into account the high impact resistance per unit thickness of the ball, the high impact resistance per unit thickness of the pen, and the high bending resistance.

並且,由表8可知,實施例21與實施例22中,實施例22係第1基材25較第2基材26更厚之實施例。相較於實施例21,實施例22可更兼顧對球之每單位厚度的高耐衝擊性與高耐彎折性。In addition, as can be seen from Table 8, among Examples 21 and 22, Example 22 is an example in which the first base material 25 is thicker than the second base material 26 . Compared with Example 21, Example 22 can achieve both high impact resistance and high bending resistance per unit thickness of the ball.

由表8可知,實施例21與實施例22中,實施例21係第1基材25較第2基材26更薄之實施例。可知相較於實施例22,實施例21之每單位厚度的筆衝擊吸收率更高。As can be seen from Table 8, among Examples 21 and 22, Example 21 is an example in which the first substrate 25 is thinner than the second substrate 26 . It can be seen that compared with Example 22, Example 21 has a higher pen impact absorption rate per unit thickness.

由表9可知,實施例24與實施例25中,實施例25係第1基材25較第2基材26更薄之實施例。相較於實施例24,實施例25可更兼顧對球之每單位厚度的高耐衝擊性與高耐彎折性。As can be seen from Table 9, among Examples 24 and 25, Example 25 is an example in which the first substrate 25 is thinner than the second substrate 26 . Compared with Example 24, Example 25 can achieve both high impact resistance and high bending resistance per unit thickness of the ball.

由表11可知,實施例7、實施例29及比較例11之基材9的拉伸彈性模數E分別為3GPa、0.13GPa、7GPa。比較例11之基材9的拉伸彈性模數E過高至7GPa。因此,相對於比較例11,實施例1及實施例29之每單位厚度的球衝擊吸收率更優異。As can be seen from Table 11, the tensile elastic modulus E of the base material 9 of Example 7, Example 29 and Comparative Example 11 was 3GPa, 0.13GPa, and 7GPa, respectively. The tensile elastic modulus E of the base material 9 of Comparative Example 11 was too high to 7 GPa. Therefore, compared with Comparative Example 11, Example 1 and Example 29 were more excellent in the ball impact absorption rate per unit thickness.

並且,實施例1、實施例29及比較例11之基材9的材料分別為COP、聚酯樹脂及聚醯亞胺樹脂。相對於基材9之材料為聚醯亞胺樹脂的比較例11,基材9之材料為COP的實施例1及基材9之材料為聚酯樹脂的實施例29之每單位厚度的球衝擊吸收率更優異。In addition, the materials of the base material 9 of Example 1, Example 29 and Comparative Example 11 are COP, polyester resin and polyimide resin, respectively. Ball impact per unit thickness of Example 1 in which the material of the substrate 9 is COP and Example 29 in which the material of the substrate 9 is polyester resin compared to Comparative Example 11 in which the material of the substrate 9 is polyimide resin The absorption rate is more excellent.

[表1]

Figure 02_image001
[Table 1]
Figure 02_image001

[表2]

Figure 02_image003
[Table 2]
Figure 02_image003

[表3]

Figure 02_image005
[table 3]
Figure 02_image005

[表4]

Figure 02_image007
[Table 4]
Figure 02_image007

[表5]

Figure 02_image009
[table 5]
Figure 02_image009

[表6]

Figure 02_image011
[Table 6]
Figure 02_image011

[表7]

Figure 02_image013
[Table 7]
Figure 02_image013

[表8]

Figure 02_image015
[Table 8]
Figure 02_image015

[表9]

Figure 02_image017
[Table 9]
Figure 02_image017

[表10]

Figure 02_image019
[Table 10]
Figure 02_image019

[表11]

Figure 02_image021
[Table 11]
Figure 02_image021

此外,上述發明雖提供作為本發明例示之實施形態,但僅為例示,不得作限定解釋。該技術領域之熟知此項技藝之人士明瞭可知本發明變形例包含於後述申請專利範圍中。In addition, although the above-mentioned invention provides the embodiment as an example of this invention, it is only an illustration, and should not be construed as a limitation. It will be apparent to those skilled in the art that modifications of the present invention are included in the scope of the patent application described later.

產業上之可利用性 影像顯示構件係作為例如有機電致發光顯示裝置來使用。 industrial availability The image display member is used as, for example, an organic electroluminescence display device.

1:有機EL顯示裝置 2:視窗構件 3:衝擊吸收構件 4:有機EL面板構件 5:保護構件 6:硬塗層 7:視窗薄膜 8:第1黏著層 9:基材 10:第2黏著層 11:薄膜密封層 12:面板本體 13:表側黏著層 14:保護基材 15:背側黏著層 16:金屬板 17:第1部 18:第2部 19:中間黏著層 21:表面 22:背面 23:邊 23A:第1邊 23B:第2邊 24:中間部 25:第1基材 26:第2基材 27:第1中間黏著層 28:第2中間黏著層 29:第3基材 35:ITO層 40:試作品 44:代用面板構件 50:偏光薄膜 51:黏著層 61:第1試樣 62:第2試樣 63:第3試樣 90:球 91:不鏽鋼板 92:感測器 95:筆 96:球珠(筆的前端部) S1:第1步驟 S2:第2步驟 S3:第3步驟 S4:第4步驟 S5:第5步驟 S6:第6步驟 S7:第7步驟 1: Organic EL display device 2: Window widget 3: Shock Absorber 4: Organic EL panel components 5: Protective components 6: Hard coating 7: Window film 8: The first adhesive layer 9: Substrate 10: 2nd adhesive layer 11: Film sealing layer 12: Panel body 13: Adhesive layer on the surface side 14: Protect the substrate 15: Back Adhesive Layer 16: sheet metal 17: Part 1 18: Part 2 19: Middle adhesive layer 21: Surface 22: Back 23: Sides 23A: Side 1 23B: Side 2 24: Middle part 25: 1st substrate 26: 2nd substrate 27: The first intermediate adhesive layer 28: The second intermediate adhesive layer 29: 3rd substrate 35: ITO layer 40: Trial works 44: Substitute panel components 50: polarizing film 51: Adhesive layer 61: 1st sample 62: 2nd sample 63: 3rd sample 90: Ball 91: stainless steel plate 92: Sensor 95: Pen 96: Ball (the tip of the pen) S1: Step 1 S2: Step 2 S3: Step 3 S4: Step 4 S5: Step 5 S6: Step 6 S7: Step 7

圖1係本發明影像顯示構件之第1實施形態之有機EL顯示裝置的截面圖。 圖2中,圖2A及圖2B係說明落球試驗;圖2A係求算視窗構件與衝擊吸收構件之積層體的衝擊;圖2B係求算視窗構件單獨的衝擊荷重。 圖3中,圖3A及圖3B係說明落筆試驗;圖3A係求算視窗構件與衝擊吸收構件之積層體的衝擊荷重;圖3B係求算視窗構件單獨的衝擊荷重。 圖4中,圖4A及圖4B係說明有機EL顯示裝置之彎折;圖4A係彎折前之有機EL顯示裝置;圖4B係彎折後之有機EL顯示裝置。 圖5係有機EL顯示裝置之製造方法的步驟圖。 圖6係第2步驟的步驟圖。 圖7係對第1試樣之落球試驗。 圖8係對第2試樣之落筆試驗。 圖9係第2實施形態之有機EL顯示裝置。 圖10係第2實施形態之變形例之有機EL顯示裝置。 圖11係變形例之有機EL顯示裝置。 圖12係顯示實施例1至實施例6之第1黏著層與第2黏著層之剪切儲存彈性模數G'的圖表。 FIG. 1 is a cross-sectional view of an organic EL display device according to a first embodiment of the image display member of the present invention. In Fig. 2, Fig. 2A and Fig. 2B illustrate the falling ball test; Fig. 2A calculates the impact of the laminated body of the window member and the impact absorbing member; Fig. 2B calculates the impact load of the window member alone. In Fig. 3, Figs. 3A and 3B illustrate the pen drop test; Fig. 3A calculates the impact load of the laminated body of the window member and the impact absorbing member; Fig. 3B calculates the impact load of the window member alone. In FIG. 4 , FIGS. 4A and 4B illustrate the bending of the organic EL display device; FIG. 4A is the organic EL display device before bending; and FIG. 4B is the organic EL display device after bending. FIG. 5 is a process diagram of a method of manufacturing an organic EL display device. FIG. 6 is a step diagram of the second step. Figure 7 shows the drop ball test on the first sample. Figure 8 shows the pen-drop test on the second sample. FIG. 9 shows an organic EL display device according to the second embodiment. FIG. 10 shows an organic EL display device according to a modification of the second embodiment. FIG. 11 shows an organic EL display device of a modification example. FIG. 12 is a graph showing the shear storage elastic modulus G′ of the first adhesive layer and the second adhesive layer of Examples 1 to 6. FIG.

1:有機EL顯示裝置 1: Organic EL display device

2:視窗構件 2: Window widget

3:衝擊吸收構件 3: Shock Absorber

4:有機EL面板構件 4: Organic EL panel components

5:保護構件 5: Protective components

6:硬塗層 6: Hard coating

7:視窗薄膜 7: Window film

8:第1黏著層 8: The first adhesive layer

9:基材 9: Substrate

10:第2黏著層 10: 2nd adhesive layer

11:薄膜密封層 11: Film sealing layer

12:面板本體 12: Panel body

13:表側黏著層 13: Adhesive layer on the surface side

14:保護基材 14: Protect the substrate

15:背側黏著層 15: Back Adhesive Layer

16:金屬板 16: sheet metal

21:表面 21: Surface

22:背面 22: Back

23:邊 23: Sides

24:中間部 24: Middle part

35:ITO層 35: ITO layer

40:試作品 40: Trial works

44:代用面板構件 44: Substitute panel components

61:第1試樣 61: 1st sample

62:第2試樣 62: 2nd sample

Claims (20)

一種影像顯示裝置,其往厚度方向一側依序具備視窗構件、衝擊吸收構件、面板構件及保護構件; 前述衝擊吸收構件具有60%以上之全光線透射率; 前述衝擊吸收構件之每單位厚度的球衝擊吸收率為0.27%/µm以上,該衝擊吸收構件之每單位厚度的球衝擊吸收率係使重量10g、直徑13mm之不鏽鋼製球從20cm之高度落下至前述衝擊吸收構件來求算前述衝擊吸收構件之前述球衝擊吸收率,再將該球衝擊吸收率除以前述衝擊吸收構件之厚度而得; 前述衝擊吸收構件之每單位厚度的筆衝擊吸收率為0.10%/µm以上,該衝擊吸收構件之每單位厚度的筆衝擊吸收率係使重量7g、前端部之球珠直徑0.7mm之原子筆從20cm之高度落下至前述衝擊吸收構件來求算前述衝擊吸收構件之筆衝擊吸收率,再將該筆衝擊吸收率除以前述衝擊吸收構件之厚度而得。 An image display device, which is provided with a window member, an impact absorbing member, a panel member and a protection member in this order from one side in the thickness direction; The aforementioned impact absorbing member has a total light transmittance of more than 60%; The ball impact absorption rate per unit thickness of the aforementioned shock absorbing member is 0.27%/µm or more, and the ball shock absorption rate per unit thickness of the shock absorbing member is a stainless steel ball with a weight of 10g and a diameter of 13mm dropped from a height of 20cm. The aforementioned impact absorbing member is used to calculate the aforementioned ball impact absorption rate of the aforementioned impact absorbing member, and then the ball impact absorption rate is divided by the thickness of the aforementioned impact absorbing member to obtain; The pen shock absorption rate per unit thickness of the shock absorbing member is 0.10%/µm or more, and the pen shock absorption rate per unit thickness of the shock absorbing member is such that a ball pen with a weight of 7 g and a ball diameter of 0.7 mm at the front end is The pen shock absorption rate of the shock absorption member was calculated by dropping the shock absorption member from a height of 20 cm, and then the pen shock absorption rate was divided by the thickness of the shock absorption member. 如請求項1之影像顯示裝置,其中在將前述影像顯示裝置以前述視窗構件朝外側之方式彎折之試驗中,即使以使前述視窗構件中之朝兩外側之2個表面的間隔成為8mm之方式彎折200,000次,前述面板構件亦無損傷。The image display device according to claim 1, wherein in the test of bending the image display device in such a way that the window member faces the outside, even if the distance between the two outer surfaces of the window member is 8 mm The method was bent 200,000 times, and the aforementioned panel members were not damaged. 如請求項1或請求項2之影像顯示裝置,其中前述衝擊吸收構件往前述厚度方向一側依序具備第1黏著層、基材及第2黏著層。The image display device according to claim 1 or claim 2, wherein the shock absorbing member includes a first adhesive layer, a base material, and a second adhesive layer in this order toward one side in the thickness direction. 如請求項3之影像顯示裝置,其中前述第1黏著層係接觸前述視窗構件,且 前述第2黏著層係接觸前述面板構件。 The image display device of claim 3, wherein the first adhesive layer contacts the window member, and The second adhesive layer is in contact with the panel member. 如請求項3之影像顯示裝置,其中前述第2黏著層在25℃下之剪切儲存彈性模數G'與前述第1黏著層在25℃下之剪切儲存彈性模數G'相同或較高。The image display device according to claim 3, wherein the shear storage elastic modulus G' of the second adhesive layer at 25°C is the same as or higher than the shear storage elastic modulus G' of the first adhesive layer at 25°C high. 如請求項3之影像顯示裝置,其中前述第1黏著層在25℃下之剪切儲存彈性模數G'為0.01MPa以上且0.05MPa以下。The image display device according to claim 3, wherein the shear storage elastic modulus G' of the first adhesive layer at 25°C is 0.01 MPa or more and 0.05 MPa or less. 如請求項3之影像顯示裝置,其中前述第2黏著層在25℃下之剪切儲存彈性模數G'為0.10MPa以上且0.15MPa以下。The image display device according to claim 3, wherein the shear storage elastic modulus G' of the second adhesive layer at 25°C is 0.10 MPa or more and 0.15 MPa or less. 如請求項3之影像顯示裝置,其中前述第2黏著層在25℃下之剪切儲存彈性模數G'減去前述第1黏著層在25℃下之剪切儲存彈性模數G'之值為0.06MPa以上。The image display device according to claim 3, wherein the value of the shear storage elastic modulus G' of the second adhesive layer at 25°C minus the shear storage elastic modulus G' of the first adhesive layer at 25°C 0.06MPa or more. 如請求項3之影像顯示裝置,其中前述基材為單數。The image display device of claim 3, wherein the aforementioned substrate is singular. 如請求項3之影像顯示裝置,其中前述基材為複數,且 該影像顯示裝置更具備中間黏著層,該中間黏著層係配置於複數個前述基材之間。 The image display device of claim 3, wherein the substrates are plural, and The image display device further includes an intermediate adhesive layer, and the intermediate adhesive layer is disposed between a plurality of the aforementioned substrates. 如請求項10之影像顯示裝置,其中前述中間黏著層在25℃下之剪切儲存彈性模數G'為前述第1黏著層在25℃下之剪切儲存彈性模數G'以上且前述第2黏著層在25℃下之剪切儲存彈性模數G'以下。The image display device of claim 10, wherein the shear storage elastic modulus G' of the intermediate adhesive layer at 25°C is greater than the shear storage elastic modulus G' of the first adhesive layer at 25°C and the first 2 The shear storage elastic modulus G' of the adhesive layer at 25°C is below. 如請求項10之影像顯示裝置,其中前述中間黏著層在25℃下之剪切儲存彈性模數G'高於前述第1黏著層在25℃下之剪切儲存彈性模數G',且低於前述第2黏著層在25℃下之剪切儲存彈性模數G'。The image display device of claim 10, wherein the shear storage elastic modulus G' of the intermediate adhesive layer at 25°C is higher than the shear storage elastic modulus G' of the first adhesive layer at 25°C, and lower The shear storage elastic modulus G' of the second adhesive layer at 25°C. 如請求項10之影像顯示裝置,其中前述中間黏著層在25℃下之剪切儲存彈性模數G'大於0.05MPa且在0.15MPa以下。The image display device of claim 10, wherein the shear storage elastic modulus G' of the intermediate adhesive layer at 25°C is greater than 0.05 MPa and less than 0.15 MPa. 如請求項10之影像顯示裝置,其中前述基材包含: 第1基材,其係接觸前述第1黏著層;及 第2基材,其係接觸前述第2黏著層; 並且,前述第1基材較前述第2基材更薄。 The image display device of claim 10, wherein the aforementioned substrate comprises: a first substrate in contact with the first adhesive layer; and a second substrate, which is in contact with the second adhesive layer; Moreover, the said 1st base material is thinner than the said 2nd base material. 如請求項10之影像顯示裝置,其中前述基材包含: 第1基材,其係接觸前述第1黏著層;及 第2基材,其係接觸前述第2黏著層; 並且,前述第1基材較前述第2基材更厚。 The image display device of claim 10, wherein the aforementioned substrate comprises: a first substrate in contact with the first adhesive layer; and a second substrate, which is in contact with the second adhesive layer; Moreover, the said 1st base material is thicker than the said 2nd base material. 如請求項3之影像顯示裝置,其中前述基材之厚度相對於前述衝擊吸收構件之厚度的比率為0.20以上且0.35以下。The image display device according to claim 3, wherein the ratio of the thickness of the base material to the thickness of the shock absorbing member is 0.20 or more and 0.35 or less. 如請求項3之影像顯示裝置,其中前述基材之材料為烯烴樹脂及/或聚酯樹脂。The image display device according to claim 3, wherein the material of the substrate is olefin resin and/or polyester resin. 如請求項17之影像顯示裝置,其中前述烯烴樹脂為環烯烴樹脂。The image display device according to claim 17, wherein the olefin resin is a cycloolefin resin. 如請求項17之影像顯示裝置,其中前述聚酯樹脂為聚對苯二甲酸乙二酯。The image display device of claim 17, wherein the polyester resin is polyethylene terephthalate. 一種影像顯示裝置之製造方法,該影像顯示裝置往厚度方向一側依序具備視窗構件、第1黏著層、基材、第2黏著層、面板構件及保護構件; 該製造方法具備以下步驟: 第1步驟,係試作試作品; 第2步驟,係評估前述試作品; 第3步驟,係根據前述評估來決定製造條件;及 第4步驟,係根據前述製造條件來製造製品; 前述第2步驟具備以下步驟: 第5步驟,係由前述試作品製作第1試樣及第2試樣; 第6步驟,係使球落下至前述第1試樣,且使原子筆落下至前述第2試樣;及 第7步驟,係在第6步驟後,判斷前述第1試樣及前述第2試樣有無損傷; 前述第3步驟中,當評估前述試作品是在前述第1試樣有損傷時,變更前述製造條件使前述第1黏著層及前述第2黏著層之合計厚度更厚;當評估前述試作品是在前述第2試樣有損傷時,進行變更使前述基材之厚度更厚。 A method of manufacturing an image display device, the image display device is provided with a window member, a first adhesive layer, a base material, a second adhesive layer, a panel member and a protection member in this order from one side in the thickness direction; The manufacturing method has the following steps: The first step is a trial work; The second step is to evaluate the aforementioned trial works; The third step is to determine the manufacturing conditions based on the aforementioned evaluation; and The fourth step is to manufacture the product according to the aforementioned manufacturing conditions; The aforementioned second step has the following steps: The fifth step is to make the first sample and the second sample from the aforementioned test work; The sixth step is to drop the ball to the first sample, and drop the ballpoint pen to the second sample; and The seventh step is to judge whether the first sample and the second sample are damaged after the sixth step; In the third step, when the first sample is evaluated for damage, the manufacturing conditions are changed to make the total thickness of the first adhesive layer and the second adhesive layer thicker; when the sample is evaluated as When the second sample was damaged, the thickness of the base material was changed to be thicker.
TW110132855A 2020-09-04 2021-09-03 Picture display unit and manufacturing method thereof TW202231458A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020-149278 2020-09-04
JP2020149278 2020-09-04
JP2021138605A JP7065239B2 (en) 2020-09-04 2021-08-27 Image display device and its manufacturing method
JP2021-138605 2021-08-27

Publications (1)

Publication Number Publication Date
TW202231458A true TW202231458A (en) 2022-08-16

Family

ID=80491006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110132855A TW202231458A (en) 2020-09-04 2021-09-03 Picture display unit and manufacturing method thereof

Country Status (4)

Country Link
KR (1) KR20230130165A (en)
CN (1) CN116018264A (en)
TW (1) TW202231458A (en)
WO (1) WO2022050315A1 (en)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006011461A1 (en) * 2004-07-27 2006-02-02 Jsr Corporation Shock absorber, shock absorption laminate structure, shock absorption laminate structure for liquid crystal display, shock absorption laminate structure for plasma display, shock absorption laminate structure for organic electroluminescece display and display apparatus
JP2010078733A (en) * 2008-09-25 2010-04-08 Dainippon Printing Co Ltd Impact absorbing material for image display device and composite filter for image display device
KR102538093B1 (en) * 2016-06-28 2023-05-30 삼성디스플레이 주식회사 Display device
JP7056878B2 (en) * 2016-09-21 2022-04-19 スリーエム イノベイティブ プロパティズ カンパニー Protective display film containing glass
JP2018091993A (en) * 2016-12-02 2018-06-14 株式会社Kalbas Protective cover for flat display
JP7196851B2 (en) * 2017-09-29 2022-12-27 大日本印刷株式会社 Optical film and image display device
JP2021523413A (en) * 2018-05-10 2021-09-02 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Interchangeable cover lens for flexible display
KR102568167B1 (en) * 2018-09-12 2023-08-18 삼성디스플레이 주식회사 Flexible window and flexible display device comprising the same
JP2020060689A (en) 2018-10-10 2020-04-16 日立化成株式会社 Image display device and impact absorption film
JP7300906B2 (en) * 2018-11-16 2023-06-30 住友化学株式会社 Optical layered body and image display device provided with the same
JP7253903B2 (en) * 2018-11-21 2023-04-07 日東電工株式会社 Adhesive sheet, method for producing same, and method for producing image display device
JP7292051B2 (en) * 2019-02-22 2023-06-16 住友化学株式会社 FLEXIBLE LAMINATED BODY AND IMAGE DISPLAY DEVICE INCLUDING THE SAME
US20210407341A1 (en) * 2019-08-19 2021-12-30 Boe Technology Group Co., Ltd. Flexible display apparatus and fabrication method thereof
JP6856720B2 (en) * 2019-08-20 2021-04-07 日東電工株式会社 An image display device including a laminated body with a glass layer and the laminated body with the glass layer.
JP2021061141A (en) * 2019-10-04 2021-04-15 日東電工株式会社 Display device and base material multilayer body

Also Published As

Publication number Publication date
CN116018264A (en) 2023-04-25
KR20230130165A (en) 2023-09-11
WO2022050315A1 (en) 2022-03-10
KR20230038802A (en) 2023-03-21

Similar Documents

Publication Publication Date Title
JP7253590B2 (en) Adhesive layer for flexible image display device, laminate for flexible image display device, and flexible image display device
JP7171569B2 (en) Low dielectric constant optically clear adhesive for flexible electronic displays
CN108064202B (en) Acrylic-based flexible component layer
US20190077999A1 (en) Pressure-sensitive adhesive sheet
JP4813509B2 (en) Double-sided pressure-sensitive adhesive sheet, method for producing the same, and method for fixing plastic film
TW202300333A (en) Layered body for flexible image display device, and flexible image display device
US20160208148A1 (en) Double-sided pressures-sensitive-adhesive sheet and image display device
CN109415612B (en) Adhesive film, optical member including the same, and optical display device including the same
JP6943726B2 (en) Adhesive composition for optical film, adhesive layer, optical member, and image display device
JP2013006892A (en) Optical double-sided pressure-sensitive adhesive sheet
KR102513258B1 (en) Adhesive agent and adhesive sheet
CN106118554B (en) Adhesive layer and adhesive film
JP7253903B2 (en) Adhesive sheet, method for producing same, and method for producing image display device
JP6013092B2 (en) Double-sided adhesive sheet
JP2011111462A (en) Optical double-sided pressure-sensitive adhesive sheet
JP7065239B2 (en) Image display device and its manufacturing method
KR102614889B1 (en) Surface protecting film and optical member
TW201910460A (en) Laminate for flexible image display device and flexible image display device
US20140065403A1 (en) Double-sided pressure-sensitive adhesive sheet
TW202231458A (en) Picture display unit and manufacturing method thereof
JP7353399B2 (en) Laminated body for flexible image display device and flexible image display device
KR102668102B1 (en) Image display device and manufacturing method thereof
WO2022219957A1 (en) Protecting member, and organic electroluminescence display device
WO2023100866A1 (en) Adhesive sheet and method for manufacturing adhesive sheet
WO2021261120A1 (en) Optical multilayer body, optical multilayer body with adhesive layer, and image display device