TW202230974A - Ultrasonic driving circuit - Google Patents

Abstract

An ultrasonic driving circuit, the ultrasonic driving circuit includes an ultrasonic transducer pixel. The ultrasonic transducer pixel includes at least one ultrasonic transducer, a first diode and a second diode. The at least one ultrasonic transducer is configured to convert a high frequency output signal to an output ultrasound or convert a sonic resonance to a high frequency input signal. A first terminal of the first diode is electrically coupled to the at least one ultrasonic transducer, a second terminal of the first diode is configured to receive a DC signal. The DC signal is configured to enhance the high frequency output signal or the high frequency input signal. A first terminal of the second diode is electrically coupled to the second terminal of the first diode, a second terminal of the second diode is electrically coupled to a receive and transmit circuit. The second diode is configured to transmit the high frequency output signal or the high frequency input signal.

Description

Ultrasonic drive circuit

This case is about an ultrasonic drive circuit, especially an ultrasonic drive circuit for sending or receiving high-frequency signals.

In the current technology, the ultrasonic driving circuit may be composed of a capacitive mechanical ultrasonic transducer (Capacitive Micromachined Ultrasonic Transducer; CMUT) or a piezoelectric mechanical ultrasonic transducer (Piezoelectric Micromachined Ultrasonic Transducer; PMUT). Among them, the capacitive mechanical ultrasonic sensor has the advantages of high sensitivity, frequency bandwidth, high electromechanical conversion efficiency, low self-noise and easy fabrication.

The present disclosure provides an ultrasonic driving circuit, which includes ultrasonic sensing pixels. The ultrasonic sensor pixel includes at least one ultrasonic sensor and a first diode. At least one ultrasonic sensor is used for converting high frequency output signal into output ultrasonic wave or converting sonic resonance into high frequency input signal. The first end of the first diode is electrically coupled to at least one ultrasonic sensor, and the second end of the first diode is used for receiving the DC signal, and the DC signal is used for enhancing the high frequency output signal or the high frequency input signal.

The present disclosure provides another ultrasonic driving circuit. The ultrasonic driving circuit includes a pixel array and a plurality of first diodes. Each of the ultrasonic sensor pixels includes an ultrasonic sensor, a plurality of first wires, and a plurality of second wires. The ultrasonic sensor is used to convert high-frequency output signal into output ultrasonic wave or convert sonic resonance into high-frequency input signal. Any one of the plurality of first wires is electrically coupled to the ultrasonic sensor pixels located in the same row among the ultrasonic sensor pixels. Any one of the plurality of second leads is electrically coupled to the ultrasonic sensor pixels located in the same row among the ultrasonic sensor pixels. The plurality of first diodes are respectively electrically coupled to the first wires for transmitting a DC signal, wherein the DC signal is used to enhance the high frequency output signal or the high frequency input signal.

The present disclosure provides yet another ultrasonic driving circuit, which includes a pixel array. The pixel array includes a plurality of ultrasonic sensing pixels and a first diode, wherein each of the ultrasonic sensing pixels includes an ultrasonic sensor, and the ultrasonic sensor is used to output high-frequency signals Convert to output ultrasound or convert sonic resonance to high frequency input signal. The first diode is electrically coupled to the ultrasonic sensor for transmitting a DC signal, wherein the DC signal is used to enhance the high-frequency output signal or the high-frequency input signal.

To sum up, the ultrasonic driving circuit provided by the present disclosure utilizes the first diode to transmit the DC signal.

The following examples are described in detail in conjunction with the accompanying drawings, but the provided examples are not intended to limit the scope of the present disclosure, and the description of the structure and operation is not intended to limit its execution order. The structure and the resulting device with equal efficacy are all within the scope of the present disclosure. In addition, the drawings are for illustrative purposes only, and are not drawn according to the original size. For ease of understanding, the same or similar elements in the following description will be described with the same symbols.

The terms used throughout the specification and the scope of the patent application, unless otherwise specified, generally have the ordinary meaning of each term used in the field, in the content disclosed herein and in the specific content.

In addition, the terms "comprising", "including", "having", "containing" and the like used in this document are all open-ended terms, ie, meaning "including but not limited to". In addition, the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

In this document, when an element is referred to as being "coupled" or "connected", it may be referred to as "electrically coupled" or "electrically connected". "Coupled" or "connected" may also be used to indicate the cooperative operation or interaction between two or more elements. In addition, although terms such as "first", "second", . . . are used herein to describe different elements, the terms are only used to distinguish elements or operations described by the same technical terms.

Generally speaking, a Capacitive Micromachined Ultrasonic Transducer (CMUT) needs to operate under a DC signal, so the ultrasonic sensor is electrically coupled to a resistor for receiving the DC signal, and is electrically coupled for transmission Capacitors for high frequency AC signals. The aforementioned DC signal is used to enhance the high-frequency AC signal of the ultrasonic sensor. In addition, the aforementioned resistor is used for transmitting the DC signal, and the aforementioned capacitor is used for transmitting the high-frequency AC signal and blocking the DC signal transmitted by the resistor. Therefore, the structure of the aforementioned resistor and capacitor can be understood as a Bias Tee.

However, in a situation where the ultrasonic sensor pixels are getting smaller and denser (for example, an ultrasonic sensor may contain 128 ultrasonic sensor pixels in a single ultrasonic sensor circuit) , In order to transmit DC or AC signals, installing T-shaped biasers in each corresponding ultrasonic sensing pixel will greatly increase the circuit area and increase the volume of the ultrasonic driving circuit. Therefore, the present disclosure provides an ultrasonic driving circuit, which can replace the aforementioned T-type biaser with a diode, thereby reducing the volume of the ultrasonic driving circuit.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of an ultrasonic driving circuit 100 according to an embodiment of the disclosure. The ultrasonic drive circuit 100 may be a capacitive mechanical ultrasonic drive circuit. The ultrasonic driving circuit 100 includes an ultrasonic sensing pixel P1, a first diode PD1, a second diode PD2, and a receiving and transmitting circuit TRC. The ultrasonic sensor pixel P1 includes at least one ultrasonic sensor 110 (only one ultrasonic sensor 110 is shown in FIG. 1 as an example). The ultrasonic sensor 110 may be a capacitive mechanical ultrasonic sensor. The reception and transmission circuit TRC includes a transmission and reception switch 120 , a transmission circuit TX, a reception circuit RX, and a control circuit 130 . The transmitting circuit TX includes a voltage amplifier HVAMP (High Voltage Amplifier; HVAMP), a pulse generator HVP (High-Voltage Pulser; HVP) and a digital analog converter (DAC). The receiving circuit RX includes a low-noise amplifier LNA (Low-Noise Amplifier; LNA), a programmable gain amplifier PGA (Programmable Gain Amplifier; PGA), a low-pass filter LPF (Low Pass Fliter; LPF) and an analog-to-digital converter ADC ( Analog Digital Converter; ADC).

Structurally, the first end (eg, the cathode end) of the first diode PD1 is electrically coupled to the ultrasonic sensor 110 , and the second end (eg, the anode end) of the first diode PD1 is used for receiving the DC signal V _DC , the first terminal (eg, the anode terminal) of the first diode PD1 is used for receiving the DC signal V _DC , and the first diode PD1 is used for transmitting the DC signal V _DC to the ultrasonic sensor 110 . The first terminal (eg, the cathode terminal) of the second diode PD2 is electrically coupled to the ultrasonic sensor 110 , and the second terminal (eg, the anode terminal) of the second diode PD2 is electrically coupled to the receiving-transmitting switch 120 , The second diode PD2 is used for transmitting the high frequency input signal _VRFin or the high frequency output signal _VRFout . The transceiving switch 120 has a first terminal, a second terminal and a third terminal. The first terminal of the transceiving switch 120 is electrically coupled to the anode terminal of the second diode PD2, the second terminal of the transceiving switch 120 is electrically coupled to the transmitting circuit TX, and the third terminal of the transceiving switch 120 is electrically coupled Receive circuit RX. The transmitting circuit TX is used for generating the high frequency output signal _VRFout , and the receiving circuit RX is used for receiving the high frequency input signal _VRFin . The control circuit 130 is used to control the transmitting circuit TX and the receiving circuit RX.

Specifically, when the ultrasonic sensor 110 transmits and outputs ultrasonic waves, the transmitting circuit TX is electrically connected to the anode terminal of the second diode PD2 through the transceiving switch 120, and the transmitting circuit TX transmits the high-frequency output signal V _RFout is transmitted to the ultrasonic sensor 110 through the transceiver switch 120 and the second diode PD2, so that the ultrasonic sensor 110 converts the high-frequency output signal V _RFout into ultrasonic output.

When the ultrasonic sensor 110 receives ultrasonic resonance, the receiving circuit RX is electrically connected to the anode terminal of the second diode PD2 through the transceiving switch 120 . And, in response to the ultrasonic sensor 110 sending the output ultrasonic wave, the ultrasonic sensor 110 receives the ultrasonic resonance generated by the return (reflection) of the output ultrasonic wave to the object, and converts the ultrasonic resonance into a high-frequency input signal _VRFin , and then converts the ultrasonic resonance into a high-frequency input signal VRFin. The high-frequency input signal _VRFin is transmitted to the receiving circuit RX through the second diode PD2 and the transceiver switch 120 .

It is worth noting that the first diode PD1 and the second diode PD2 in this disclosure are implemented by PIN diodes. PIN diodes are composed of intrinsic (I-type) semiconductors with high resistance and very low inter-terminal capacitance. Among them, the inter-terminal capacitance can be regarded as the amount of charge accumulated when a reverse bias voltage is applied to the diode. Therefore, the PIN diode behaves like a resistor under forward bias, and like a capacitor under reverse voltage. In detail, under forward bias, the PIN diode can be regarded as a resistor with a resistance value of 0.1Ω~10Ω. Under reverse bias, the capacitance of the PIN diode hardly changes with the magnitude of the bias, but remains between about 0.1pF and 10pF. That is, PIN diodes can transmit high-frequency signals with very low loss (or no ringing of signal waveforms) under reverse bias.

Therefore, in this disclosure, since the first diode PD1 is operated under a forward bias voltage and is used to transmit the DC signal V _DC to the ultrasonic sensor 110 and filter the high frequency input signal V _RFin and the high frequency output signal V _RFout , Therefore, the first diode PD1 can be regarded as a resistor. On the other hand, since the second diode PD2 operates under reverse bias and is used to transmit the high-frequency input signal V _RFin and the high-frequency output signal V _RFout , and filter the DC signal V _DC , the transmission of the DC signal V _DC is avoided. to the transmitting circuit TX or the receiving circuit RX, so the second diode PD2 can be regarded as a capacitor. In addition, the first diode PD1 and the second diode PD2 have the advantage of being very small in size, so the area of the driving circuit can be reduced in the ultrasonic driving circuit 100 , thereby increasing the number of pixels that can be arranged in the ultrasonic driving circuit 100 . space, thereby increasing the pixel density of the ultrasonic driving circuit 100 .

It is worth mentioning that the structure of the second diode PD2 includes a P-type semiconductor, an I-type semiconductor and an N-type semiconductor. The thickness of the P-type semiconductor may be 10 nm, and the thickness of the N-type semiconductor may be 30 nm. And the thickness of the I-type semiconductor may be 1000 nm. Assuming that the capacitive reactance (Χ _C ) of the circuit is 50Ω, the high-pass cutoff frequency (that is, the AC signal transmitted by the second diode PD2 under the reverse bias voltage (for example, the high-frequency input signal V _RFin or the high-frequency output signal) The frequency of V _RFout ) was set to 10 ⁶ Hz. And set the capacitance value at 3×10 ⁻⁹ Farads, and calculate the required area of the second diode PD2 according to the following formula.

的面積便可傳送高頻輸入訊號V _RFin或是高頻輸出訊號V _RFout，從而節省超音波驅動電路100的電路面積。 As shown in the above formula, the second diode PD2 only needs

The high-frequency input signal V _RFin or the high-frequency output signal V _RFout can be transmitted with a small area, thereby saving the circuit area of the ultrasonic driving circuit 100 .

Please also refer to FIG. 2. FIG. 2 is a schematic diagram of a circuit structure of an ultrasonic driving circuit 100a disclosed in an embodiment. The ultrasonic driving circuit 100a includes ultrasonic sensing pixels P1-P128. Each of the ultrasonic sensor pixels P1 to P128 includes a plurality of ultrasonic sensors 110 that are electrically connected in series. In the same ultrasonic sensor pixels P1-P128, a plurality of ultrasonic sensors 110 electrically connected in series can enhance the signal strength. Therefore, only three ultrasonic sensors 110 are shown in FIG. 2 as an example. The ultrasonic sensor pixels P1 to P128 may include one ultrasonic sensor 110 or other ultrasonic sensors 110, which should not be limited in this case. . In addition, the ultrasonic sensor 110 in FIG. 2 can be implemented by the ultrasonic sensor 110 in FIG. 1 .

In each of the ultrasonic sensor pixels P1 ˜ P128 , a plurality of ultrasonic sensors 110 electrically connected in series are electrically coupled to the ground terminal GND, the cathode terminal of the first diode PD1 and the second diode between the cathode terminals of body PD2. The anode terminals of each of the first diodes PD1 in the ultrasonic driving circuit 100a are respectively used for receiving the DC signals V _{DC1 ˜V DC128} , and each of the first diodes PD1 respectively transmits the DC signals V _{DC1 ˜V DC128} to the corresponding ultrasonic signals. Sound wave sensor pixels P1~P128. Each of the second diodes PD2 in the ultrasonic driving circuit 100a is used to transmit the high-frequency output signals V _{RFout1 ˜V RFout128} or the high-frequency input signals _{VRFin1 ˜V RFin128 , respectively} .

Although the receiving and transmitting circuit TRC is not shown in FIG. 2, the anode terminal of each second diode PD2 in the ultrasonic driving circuit 100a can be electrically coupled to the corresponding receiving and transmitting circuit TRC, the receiving and transmitting circuit The TRC may include multiple transceiving switches 120, multiple receiving circuits RX, and multiple transmitting circuits TX. Each of the plurality of second diodes PD2 in the ultrasonic driving circuit 100 a is electrically coupled to a corresponding one of the plurality of transceiver switches 120 . Each of the plurality of transceiver switches 120 is electrically coupled to a corresponding one of the plurality of receiving circuits RX and a corresponding one of the plurality of transmitting circuits TX.

In detail, taking a single second diode PD2 as an example, the anode end of the second diode PD2 is electrically coupled to the first end of the transmit-receive switch 120 , and the second end of the transmit-receive switch 120 is electrically coupled to In the transmitting circuit TX, the third terminal of the transceiving switch 120 is electrically coupled to the receiving circuit RX.

The transmitting circuit TX is used for providing a high frequency output signal V _RFout , and transmits the high frequency output signal V _RFout to the ultrasonic sensor 110 through the transceiver switch 120, so that the ultrasonic sensor 110 converts the high frequency output signal V _RFout into an output ultrasonic wave . In other words, the second diode PD2 transmits the high frequency output signal V _RFout from the transmitting circuit TX to the ultrasonic sensor 110 .

And, in response to the ultrasonic sensor 110 sending the output ultrasonic wave, the ultrasonic sensor 110 receives the ultrasonic resonance generated by the return (reflection) of the output ultrasonic wave to the object, and converts the ultrasonic resonance into a high-frequency input signal _VRFin , and then converts the ultrasonic resonance into a high-frequency input signal VRFin. The high-frequency input signal _VRFin is transmitted to the receiving circuit RX through the second diode PD2 and the transceiver switch 120 . In other words, the second diode PD2 transmits the high-frequency input signal V _RFin from the ultrasonic sensor 110 to the transmitting circuit TX. In addition, the first diode PD1 is used for transmitting the DC signal V _DC to the ultrasonic sensor 110 to enhance the high-frequency input signal V _RFin and the high-frequency output signal V _RFout of the ultrasonic sensor 110 .

Since the first diode PD1 and the second diode PD2 have the advantage of being very small in size, the area of the driving circuit can be reduced in the ultrasonic driving circuit 100a, thereby increasing the number of pixels that can be arranged in the ultrasonic driving circuit 100a. space, thereby increasing the pixel density of the ultrasonic driving circuit 100a. In addition, the operation of the ultrasonic driving circuit 100a is similar to that of the ultrasonic driving circuit 100 in FIG. 1, and details are not repeated here.

Please refer to FIG. 3. FIG. 3 is a schematic diagram of a circuit structure of an ultrasonic driving circuit 100b disclosed in an embodiment. The ultrasonic driving circuit 100b includes a pixel array A1, a multiplexer 140, a plurality of first diodes PD1 and a plurality of second diodes PD2. The pixel array A1 includes a plurality of pixels P1, a plurality of second wires L2 and a plurality of first wires L1. Each pixel P1 contains an ultrasonic sensor 110 . The plurality of second wires L2 are respectively electrically coupled to the ultrasonic sensing pixels P1 in the same row, and the ultrasonic sensing pixels P1 in the same row are electrically coupled to the multiplexer 140 through the second wires L2. The multiplexer 140 is used for selecting the ultrasonic sensor pixel P1 outputting the high frequency output signal V _RFout , and for selecting the high frequency input signal _VRFin of the ultrasonic sensor pixel P1 to be read by the receiving circuit RX. The plurality of first wires L1 are respectively electrically coupled to the ultrasonic sensing pixels P1 located in the same row, and the plurality of first wires L1 are respectively electrically coupled to the plurality of first diodes PD1 and the plurality of second diodes body PD2, so that the ultrasonic sensing pixels P1 in the same row are electrically coupled to the cathode terminal of the first diode PD1 and the cathode terminal of the second diode PD2 through the first wire L1. The anode end of the first diode PD1 is used for receiving the DC signal V _DC . The anode terminal of the second diode PD2 is electrically coupled to the receiving-transmitting switch 120 for transmitting the high-frequency output signal V _RFout or the high-frequency input signal _VRFin .

Although the receiving and transmitting circuit TRC is not shown in FIG. 3, the anode terminal of each second diode PD2 in the ultrasonic driving circuit 100b may be electrically coupled to the corresponding receiving and transmitting circuit TRC. The receiving and transmitting circuit TRC may include multiple transceiving switches 120, multiple receiving circuits RX, and multiple transmitting circuits TX. Each of the plurality of second diodes PD2 in the ultrasonic driving circuit 100b is electrically coupled to a corresponding one of the plurality of transceiver switches 120 . Each of the plurality of transceiver switches 120 is electrically coupled to a corresponding one of the plurality of receiving circuits RX and a corresponding one of the plurality of transmitting circuits TX.

Taking a single ultrasonic sensor pixel P1 as an example, the transmitting circuit TX is used to provide a high-frequency output signal V _RFout , and transmit the high-frequency output signal V _RFout to the ultrasonic sensor 110 through the transceiver switch 120 , so that the ultrasonic sensor 110 converts the high frequency output signal V _RFout into output ultrasound. In other words, the second diode PD2 transmits the high frequency output signal V _RFout from the transmitting circuit TX to the ultrasonic sensor 110 .

And, in response to the ultrasonic sensor 110 sending the output ultrasonic wave, the ultrasonic sensor 110 receives the ultrasonic resonance generated by the return (reflection) of the output ultrasonic wave to the object, and converts the ultrasonic resonance into a high-frequency input signal _VRFin , and then converts the ultrasonic resonance into a high-frequency input signal VRFin. The high-frequency input signal _VRFin is transmitted to the receiving circuit RX through the second diode PD2 and the transceiver switch 120 . In other words, the second diode PD2 transmits the high-frequency input signal V _RFin from the ultrasonic sensor 110 to the transmitting circuit TX. In addition, the first diode PD1 is used for transmitting the DC signal V _DC to the ultrasonic sensor 110 to enhance the high-frequency input signal V _RFin and the high-frequency output signal V _RFout of the ultrasonic sensor 110 .

Since the first diode PD1 and the second diode PD2 have the advantage of being very small in size, the area of the driving circuit can be reduced in the ultrasonic driving circuit 100b, thereby increasing the number of pixels that can be arranged in the ultrasonic driving circuit 100b. space, thereby increasing the pixel density of the ultrasonic driving circuit 100b. The operation of the ultrasonic driving circuit 100b is similar to that of the ultrasonic driving circuit 100 in FIG. 1, and will not be repeated here.

Please refer to FIG. 4. FIG. 4 is a schematic diagram of a circuit structure of an ultrasonic driving circuit 100c disclosed in an embodiment. The ultrasonic driving circuit 100c includes a pixel array A2, a gate driver 150, a plurality of first diodes PD1 and a plurality of second diodes PD2. The pixel array A2 includes a plurality of ultrasonic sensing pixels P1, a plurality of second wires L2 and a plurality of first wires L1. Each ultrasonic sensor pixel P1 includes an ultrasonic sensor 110 and a transistor T1. The plurality of second wires L2 are respectively electrically coupled to the ultrasonic sensing pixels P1 in the same row, and the ultrasonic sensing pixels P1 in the same row are electrically coupled to the gate driver 150 through the second wires L2. The gate driver 150 is used for providing the corresponding scanning signal to the corresponding ultrasonic sensing pixel P1.

In each ultrasonic sensing pixel P1, the first terminal (eg, the drain terminal) of the transistor T1 is electrically coupled to the first wire L1, and the second terminal (eg, the source terminal) of the transistor T1 is electrically coupled to The ultrasonic sensor 110 is connected, and the gate terminal of the transistor T1 is electrically coupled to the second wire L2.

The plurality of first wires L1 are respectively electrically coupled to the ultrasonic sensing pixels P1 located in the same row, and the first wires L1 are electrically coupled to the first diode PD1 and the second diode PD2 so as to be located in the same row The ultrasonic sensing pixel P1 is electrically coupled to the cathode terminal of the first diode PD1 and the cathode terminal of the second diode PD2 through the first wire L1. The anode end of the first diode PD1 is used for receiving the DC signal V _DC . The anode terminal of the second diode PD2 is electrically coupled to the receiving-transmitting switch 120 for transmitting the high-frequency output signal V _RFout or the high-frequency input signal _VRFin .

Although the receiving and transmitting circuit TRC is not shown in FIG. 4, the anode terminal of each second diode PD2 in the ultrasonic driving circuit 100c may be electrically coupled to the corresponding receiving and transmitting circuit TRC. The receiving and transmitting circuit TRC may include multiple transceiving switches 120, multiple receiving circuits RX, and multiple transmitting circuits TX. Each of the plurality of second diodes PD2 in the ultrasonic driving circuit 100c is electrically coupled to a corresponding one of the plurality of transceiver switches 120 . Each of the plurality of transceiver switches 120 is electrically coupled to a corresponding one of the plurality of receiving circuits RX and a corresponding one of the plurality of transmitting circuits TX.

Taking a single ultrasonic sensor pixel P1 as an example, when the gate drive circuit 160 turns on the transistor T1 in the ultrasonic sensor pixel P1 through the second wire L2, the ultrasonic sensor 110 is connected to the ultrasonic sensor through the first wire L1. When the cathode terminal of the first diode PD1 and the cathode terminal of the second diode PD2 are used, the transmitting circuit TX is used to provide the high frequency output signal V _RFout and transmit the high frequency output signal V _RFout through the transceiver switch 120 To the ultrasonic sensor 110, the ultrasonic sensor 110 converts the high-frequency output signal V _RFout into output ultrasonic waves. In other words, the second diode PD2 transmits the high frequency output signal V _RFout from the transmitting circuit TX to the ultrasonic sensor 110 .

And, in response to the ultrasonic sensor 110 sending the output ultrasonic wave, the ultrasonic sensor 110 receives the ultrasonic resonance generated by the return (reflection) of the output ultrasonic wave to the object, and converts the ultrasonic resonance into a high-frequency input signal _VRFin , and then converts the ultrasonic resonance into a high-frequency input signal VRFin. The high-frequency input signal _VRFin is transmitted to the receiving circuit RX through the second diode PD2 and the transceiver switch 120 . In other words, the second diode PD2 transmits the high-frequency input signal V _RFin from the ultrasonic sensor 110 to the transmitting circuit TX. In addition, the first diode PD1 is used for transmitting the DC signal V _DC to the ultrasonic sensor 110 to enhance the high-frequency input signal V _RFin and the high-frequency output signal V _RFout of the ultrasonic sensor 110 .

Since the first diode PD1 and the second diode PD2 have the advantage of being very small in size, the area of the driving circuit can be reduced in the ultrasonic driving circuit 100c, thereby increasing the number of pixels that can be arranged in the ultrasonic driving circuit 100c. space, thereby increasing the pixel density of the ultrasonic driving circuit 100c. The operation of the ultrasonic driving circuit 100c is similar to that of the ultrasonic driving circuit 100 in FIG. 1, and will not be repeated here.

Please refer to FIG. 5. FIG. 5 is a schematic diagram of a circuit structure of an ultrasonic driving circuit 100d disclosed in an embodiment. The ultrasonic driving circuit 100d includes a pixel array A3, a gate driver 150 and a plurality of second diodes PD2. The pixel array A2 includes a plurality of ultrasonic sensing pixels P1, a plurality of second wires L2 and a plurality of first wires L1. Each ultrasonic sensor pixel P1 includes an ultrasonic sensor 110, a transistor T1 and a first diode PD1. The plurality of second wires L2 are respectively electrically coupled to the ultrasonic sensing pixels P1 in the same row, and the ultrasonic sensing pixels P1 in the same row are electrically coupled to the gate driver 150 through the second wires L2. The gate driver 150 is used for providing the corresponding scanning signal to the corresponding ultrasonic sensing pixel P1.

In each ultrasonic sensing pixel P1, the first terminal (eg, the drain terminal) of the transistor T1 is electrically coupled to the first wire L1, and the second terminal (eg, the source terminal) of the transistor T1 is electrically coupled to The ultrasonic sensor 110 is connected, and the gate terminal of the transistor T1 is electrically coupled to the second wire L2. The cathode end of the first diode PD1 is electrically coupled to the ultrasonic sensor 110 , and the anode end of the first diode PD1 is used for receiving the DC signal V _DC .

The plurality of first wires L1 are respectively electrically coupled to the ultrasonic sensing pixels P1 in the same row, and the plurality of first wires L1 are respectively electrically coupled to the plurality of second diodes PD2, so that the ultrasonic sensor pixels P1 in the same row are electrically coupled to each other. The sound wave sensing pixel P1 is electrically coupled to the cathode terminal of the second diode PD2 through the first wire L1. The anode terminal of the second diode PD2 is electrically coupled to the receiving-transmitting switch 120 for transmitting the high-frequency output signal V _RFout or the high-frequency input signal _VRFin .

Although the receiving and transmitting circuit TRC is not shown in FIG. 5, the anode terminal of each second diode PD2 in the ultrasonic driving circuit 100d may be electrically coupled to the corresponding receiving and transmitting circuit TRC. The receiving and transmitting circuit TRC may include multiple transceiving switches 120, multiple receiving circuits RX, and multiple transmitting circuits TX. Each of the plurality of second diodes PD2 in the ultrasonic driving circuit 100d is electrically coupled to a corresponding one of the plurality of transceiver switches 120 . Each of the plurality of transceiver switches 120 is electrically coupled to a corresponding one of the plurality of receiving circuits RX and a corresponding one of the plurality of transmitting circuits TX.

Taking a single ultrasonic sensor pixel P1 as an example, when the gate drive circuit 160 turns on the transistor T1 in the ultrasonic sensor pixel P1 through the second wire L2, the ultrasonic sensor 110 is connected to the ultrasonic sensor through the first wire L1. When the cathode terminal of the second diode PD2 is used, the transmitting circuit TX is used for providing the high-frequency output signal V _RFout , and transmits the high-frequency output signal V _RFout to the ultrasonic sensor 110 through the transceiver switch 120 , so that the ultrasonic sensor 110 Convert the high frequency output signal V _RFout to output ultrasound. In other words, the second diode PD2 transmits the high frequency output signal V _RFout from the transmitting circuit TX to the ultrasonic sensor 110 .

And, in response to the ultrasonic sensor 110 sending the output ultrasonic wave, the ultrasonic sensor 110 receives the ultrasonic resonance generated by the return (reflection) of the output ultrasonic wave to the object, and converts the ultrasonic resonance into a high-frequency input signal _VRFin , and then converts the ultrasonic resonance into a high-frequency input signal VRFin. The high-frequency input signal _VRFin is transmitted to the receiving circuit RX through the second diode PD2 and the transceiver switch 120 . In other words, the second diode PD2 transmits the high-frequency input signal V _RFin from the ultrasonic sensor 110 to the transmitting circuit TX. In addition, the first diode PD1 is used for transmitting the DC signal V _DC to the ultrasonic sensor 110 to enhance the high-frequency input signal V _RFin and the high-frequency output signal V _RFout of the ultrasonic sensor 110 .

Since the first diode PD1 and the second diode PD2 have the advantage of being very small in size, the area of the driving circuit can be reduced in the ultrasonic driving circuit 100d, thereby increasing the number of pixels that can be arranged in the ultrasonic driving circuit 100d. space, thereby increasing the pixel density of the ultrasonic driving circuit 100d. The operation of the ultrasonic driving circuit 100d is similar to that of the ultrasonic driving circuit 100 in FIG. 1, and will not be repeated here.

To sum up, the ultrasonic driving circuits 100 , 100 a , 100 b , 100 c and 100 d provided by the present disclosure operate the first diode PD1 under forward bias to transmit the DC signal using the first diode PD1 as a resistor V _DC , and the second diode PD2 can be operated under reverse bias to transmit the high frequency output signal V _RFout or the high frequency input signal V _RFin using the second diode PD2 as a capacitor. In addition, it can be known from the above deduction that the second diode PD2 can transmit the high-frequency output signal V _RFout or the high-frequency input signal V _RFin of about 1 MHz with an area of only 0.027 mm, thereby greatly reducing the circuit area.

Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. The scope of protection disclosed shall be determined by the scope of the appended patent application.

In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the descriptions of the appended symbols are as follows: 100, 100a, 100b, 100c, 100d: ultrasonic drive circuit 110: ultrasonic sensor 120: transceiver Transfer switch 130: Control circuit 140: Multiplexer 150: Gate driver PD1: First diode PD2: Second diode TRC: Receiving and transmitting circuit TX: Transmitting circuit RX: Receiving circuit P1~P128: Ultrasonic Sensing pixels V _RFout ,V _RFout1 ~V _RFout128 : high frequency output signal V _RFin ,V _RFin1 ~V _RFin128 : high frequency input signal V _DC ,V _DC1 ~V _DC128 : DC signal A1,A2,A3: pixel array L1: First lead L2: Second lead HVAMP: Voltage amplifier HVP: Pulse generator DAC: Digital to analog converter LNA: Low noise amplifier PGA: Programmable gain amplifier LPF: Low pass filter ADC: Analog to digital converter GND: ground terminal

In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows: FIG. 1 is a schematic diagram of an ultrasonic driving circuit according to an embodiment of the disclosure. FIG. 2 is a schematic diagram of a circuit structure of an ultrasonic driving circuit according to an embodiment of the disclosure. FIG. 3 is a schematic diagram of a circuit structure of an ultrasonic driving circuit according to an embodiment of the disclosure. FIG. 4 is a schematic diagram of a circuit structure of an ultrasonic driving circuit according to an embodiment of the disclosure. FIG. 5 is a schematic diagram of a circuit structure of an ultrasonic driving circuit according to an embodiment of the disclosure.

Domestic storage information (please note in the order of storage institution, date and number) none Foreign deposit information (please note in the order of deposit country, institution, date and number) none

100: Ultrasonic drive circuit

110: Ultrasonic sensor

120: Transceiver switch

130: Control circuit

PD1: first diode

PD2: Second Diode

TRC: Receive and Transmit Circuits

TX: transmit circuit

RX: receiving circuit

P1: Ultrasonic sensor pixel

V _RFout : high frequency output signal

V _RFin : high frequency input signal

V _DC : DC signal

HVAMP: Voltage Amplifier

HVP: Pulse Wave Generator

DAC: Digital to Analog Converter

LNA: Low Noise Amplifier

PGA: Programmable Gain Amplifier

LPF: Low Pass Filter

ADC: Analog to Digital Converter

Claims (10)

An ultrasonic drive circuit, comprising: One ultrasonic sensor pixel, including: at least one ultrasonic sensor for converting a high frequency output signal into an output ultrasonic wave or converting a sonic resonance into a high frequency input signal; and a first diode, the first end of which is electrically coupled to the at least one ultrasonic sensor, and the second end of which is used for receiving a DC signal, and the DC signal is used to enhance the high-frequency output signal or the high-frequency input signal . The ultrasonic drive circuit according to claim 1, further comprising: A second diode, the first end of which is electrically coupled to the second end of the first diode and the at least one ultrasonic sensor, and the second end of which is electrically coupled to a receiving and transmitting circuit. The ultrasonic drive circuit of claim 2, wherein the receiving and transmitting circuit comprises: a transceiving switch having a first terminal, a second terminal and a third terminal, wherein the first terminal of the transceiving switch is electrically coupled to the second terminal of the second diode; a transmitting circuit electrically coupled to the second end of the transceiving switch for providing the high frequency output signal to the at least one ultrasonic sensor; and a receiving circuit electrically coupled to the third end of the transceiving switch for receiving the high frequency input signal from the at least one ultrasonic sensor. An ultrasonic drive circuit, comprising: A pixel array containing: A plurality of ultrasonic sensor pixels, wherein each of the ultrasonic sensor pixels includes an ultrasonic sensor, and the ultrasonic sensor is used to convert a high frequency output signal into an output ultrasonic wave or to A sonic resonance is converted into a high frequency input signal; a plurality of first wires, any one of the first wires is electrically coupled to the ultrasonic sensor pixels located in the same row among the ultrasonic sensor pixels; and a plurality of second wires, any one of the second wires is electrically coupled to the ultrasonic sensor pixels located in the same row among the ultrasonic sensor pixels; and A plurality of first diodes are respectively electrically coupled to the first wires for transmitting a DC signal, wherein the DC signal is used to enhance the high frequency output signal or the high frequency input signal. The ultrasonic drive circuit according to claim 4, further comprising: A plurality of second diodes are respectively electrically coupled to the first wires and the first diodes for transmitting the high frequency output signal or the high frequency input signal. The ultrasonic drive circuit according to claim 4, further comprising: A multiplexer is electrically coupled to the second wires. The ultrasonic drive circuit according to claim 4, further comprising: A gate driver is electrically coupled to the second wires for providing corresponding scanning signals to the corresponding ultrasonic sensing pixels. An ultrasonic drive circuit, comprising: A pixel array containing: a plurality of ultrasonic sensor pixels, wherein each of the ultrasonic sensor pixels includes: an ultrasonic sensor for converting a high frequency output signal into an output ultrasonic wave or converting a sonic resonance into a high frequency input signal; and A first diode, the ultrasonic sensor, is used for transmitting a direct current signal, wherein the direct current signal is used to enhance the high frequency output signal or the high frequency input signal. The ultrasonic drive circuit according to claim 8, further comprising: A plurality of second diodes are used to transmit the high-frequency output signal or the high-frequency input signal, wherein the pixel array further includes a plurality of first wires, and any one of the first wires is electrically coupled Among the ultrasonic sensor pixels, the ultrasonic sensor pixels are located in the same row, and the first wires are electrically coupled to the second diodes, respectively. The ultrasonic drive circuit according to claim 8, further comprising: a gate driver for providing a corresponding scanning signal to a corresponding ultrasonic sensor pixel, wherein the pixel array further includes a plurality of second wires, any one of the second wires is electrically coupled to the The ultrasonic sensor pixels are located in the same row among the ultrasonic sensor pixels, and the second wires are electrically coupled to the gate driver.

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