TW202227340A - Apparatus and method for unloading connecting unit on top of a fosb - Google Patents

Abstract

An apparatus and a method for unloading a connecting unit on top of a fosb are provided. A load supporting platform, a fixing unit and an unloading unit are comprised. The fixing unit fixes the fosb laterally positioned on the load supporting platform. A top block is fixed on top of a supporting block through a screw rod, and moved upward and downward when being driven by the screw rod to push the connecting unit upward from lower rim of the connecting unit. Then, the connecting unit is unloaded. The apparatus of the present invention decreases process difficulty to unload the connecting unit on top of the fosb, avoid from damage of the fosb due to violence, and provide simple and easy operation of unloading, high efficiency and low risk.

Description

Dismantling device and dismantling method of top connector of wafer transfer cassette

The invention relates to the technical field of semiconductor manufacturing, and in particular, to a device and method for removing a connector on the top of a wafer transfer box.

In today's semiconductor manufacturing process, a variety of methods are needed to process wafers. The wafers will go through a series of process equipment and need to be transported many times during the process. Therefore, when storing and transporting wafers, it is necessary to Care should be taken not to be damaged by external impact, and management is required so that the surface of the wafer is not contaminated with impurities such as moisture, dust, and various organic substances.

Front Opening Shipping Box (FOSB) is a kind of container used to protect, transport and store wafers in semiconductor manufacturing process, and its accommodating space can accommodate multiple wafers (usually 25 wafers). In the semiconductor manufacturing process, the wafer transfer box plays an extremely important role as a tool for temporary wafer storage and wafer transfer between machines. The accommodating space of the wafer transfer box is a closed space, and the internal environment is kept stable and clean, which can avoid the direct contact between the wafer and the external environment, ensure the stability of the process and reduce the environmental impact factors.

1A and FIG. 1B are partial structural diagrams of the front-opening wafer transfer box. As shown in FIG. 1A and FIG. 1B , the wafers are loaded into the wafer transfer box and then sent to the corresponding process machine. The robotic arm extends into the wafer transfer box 10 to grab the wafer to perform related operations on the wafer. After the process machine completes the related process, the robotic arm on the machine puts the wafer into the wafer transfer box 10. Then, the wafer is transferred to the next process machine through the wafer transfer box 10 to complete the corresponding operation.

The box body of the wafer transfer box is roughly in the shape of a cuboid, and the box body includes a top 11, a base 12 and a side wall 13 connecting the top 11 and the base 12. The top 11, the base 12 and the side walls 13 are jointly formed to form an accommodating space 14, One of the side walls 13 is the door of the box body, which can be opened and closed to open or close the accommodating space 14 . A handle 15 is provided on the opposite side wall 13 , and the two handles 15 are arranged opposite to facilitate the operator to carry the wafer transfer cassette 10 . The top 11 of the box body is provided with a connector 16 for connecting with the transfer mechanism during wafer processing. That is, during the wafer processing, the transfer structure is connected to the connector 16 of the wafer transfer pod 10 , so that the wafer transfer pod 10 is moved to different processing machines through the transfer mechanism. The connecting piece 16 is generally a top handle flange. Different transfer mechanisms have different configuration requirements for the connecting piece 16. The connecting piece 16 is frequently installed/removed on a daily basis, and the packing operator needs to use a rubber hammer. and a flat-blade screwdriver to perform the daily dismantling operation of the connector 16 of the wafer transfer cassette 10 . In order to ensure the holding strength of the connector 16 at the top, the top of the box is designed with a card slot, an anti-drop buckle and a central hole top post. After the connector 16 is installed in place, it is extremely difficult to remove. damage.

The purpose of the present invention is to provide a dismantling device and dismantling method of a connector on the top of a wafer transfer box (Front Opening Shipping Box, FOSB), so as to reduce the difficulty of dismantling the connector and avoid the problem of box body damage caused by violent dismantling.

The present invention provides a device for removing a connector on the top of a wafer transfer box, comprising: a bearing platform for carrying a wafer transfer box placed on its side; a fixing unit for fixing the wafer transfer box; and a removal unit including a support A block, a screw rod and a top block, the support block is fixed on one side of the bearing platform and corresponds to the position of the connecting piece, the top block is fixed above the support block by the screw rod, and rotates The screw drives the top block to move up and down, so that the top block pushes the connecting piece upward from the lower edge of the connecting piece to remove the connecting piece.

Optionally, the top block is provided with a top tongue, and when the top block moves to the lower edge of the connecting piece, the top tongue is inserted into the slot of the connecting piece, so that the connecting piece can be connected to the connecting piece. Unlock with the top of the wafer transfer cassette.

Optionally, a hand wheel is provided on the top of the screw rod, and the screw rod is rotated by rotating the hand wheel to move the top block up and down.

Optionally, the dismantling unit further includes a guide rod, the guide rod is fixed on the support block and penetrates through the top block to fix the top block in a horizontal direction.

Optionally, a balance block is further provided on the top of the screw rod, the screw rod is connected to the handwheel through the balance block, and an end of the guide rod different from the support block is fixed on the balance block.

Optionally, the removal device further includes a sliding unit, the sliding unit includes a sliding guide rail and a slider, the sliding guide rail is fixed on one side of the carrying platform, and the sliding direction of the sliding guide rail is perpendicular to the The plane where the top of the wafer transfer box is located, the support block is fixed on the slider, and the removal unit is moved by sliding the slider on the sliding guide, so that the top block is close to the horizontal direction the connector.

Optionally, the fixing unit includes a fixing pile and a fixing buckle, the fixing piles are located on both sides of the bearing platform, the fixing buckle is located on the top of the fixing pile, and the fixing buckle is located on the top of the fixing pile, and is fixed by the wafer transfer box. Handles on both sides to secure the wafer transfer cassette.

Correspondingly, the present invention also provides a method for removing the connector on the top of the wafer transfer box, using the above-mentioned removal device for the connector on the top of the round transfer box to remove the connector, including: placing the wafer transfer box on the side of the a holding table; a fixing unit to fix the wafer transfer cassette; and a top block of the dismantling unit moves up and down under the driving of the screw, and pushes the connecting piece upward from the lower edge of the connecting piece to remove the connecting piece .

Optionally, the fixing piles of the fixing unit are located on both sides of the bearing platform, and the handles on both sides of the wafer transfer box are fixed by the fixing buckles on the top of the fixing piles to fix the wafer transfer box. .

Optionally, when the top block moves to the lower edge of the connector, the top tongue provided on the top block is inserted into the slot of the connector, so as to remove the connector from the wafer. The top of the transport box is unlocked.

Optionally, the top block is moved up and down by rotating the hand wheel on the top of the screw to drive the screw.

Optionally, before the top block of the dismantling unit moves up and down under the driving of the screw rod, before the connecting element is pushed upward from the lower edge of the connecting element to dismantle the connecting element, the method further comprises: fixing the supporting block On the sliding block of the sliding unit, by sliding the sliding block on the sliding track to move the dismantling unit, the top block is brought close to the connecting piece in the horizontal direction.

In summary, in the device for removing the connector on the top of the wafer transfer box provided by the present invention, the fixing unit fixes the wafer transfer box placed on the side on the bearing table, and the top block of the removal unit is fixed above the support block by the screw rod, It moves up and down under the driving of the screw, and pushes the connecting piece upward from the lower edge of the connecting piece to remove the connecting piece. The device for removing the connector on the top of the wafer transfer box provided by the present invention reduces the difficulty of removing the connector on the top of the wafer transfer box, avoids the problem of box body damage caused by violent removal, and the removal device is simple and easy to operate , high demolition efficiency and low risk.

The following is a further detailed description of the dismantling device and dismantling method of the connector on the top of the wafer transfer box (Front Opening Shipping Box, FOSB) of the present invention with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and accompanying drawings, however, it should be noted that the concept of the technical solution of the present invention can be implemented in many different forms, and is not limited to the specific embodiments set forth herein. . The accompanying drawings are all in a very simplified form and in an inaccurate scale, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present invention.

The terms "first," "second," etc. in the specification are used to distinguish between similar elements, and are not necessarily used to describe a particular order or temporal order. It is to be understood that the terms so used are interchangeable under appropriate circumstances, eg, to enable the embodiments of the invention described herein to operate in other sequences than described or illustrated herein. Similarly, if a method described herein includes a series of steps, the order of the steps presented herein is not necessarily the only order in which the steps may be performed, and some of the steps described may be omitted and/or some not described herein Additional steps can be added to this method. If the components in a certain drawing are the same as the components in other drawings, although these components can be easily identified in all the drawings, in order to make the description of the drawings clearer, this specification will not refer to all the same components. Numbers are attached to each figure.

Example 1

FIG. 2 is a perspective view of the device for removing the connector on the top of the wafer transfer box provided by the present embodiment when the connector is removed, and FIG. 3A is a front view of the device for removing the connector on the top of the wafer transfer box according to the present embodiment. 3B is a side view of the device for removing the connector on the top of the wafer transfer cassette provided in this embodiment. As shown in FIG. 2 , FIG. 3A and FIG. 3B , the device 200 for removing the connector on the top of the wafer transfer box provided in this embodiment includes: a carrying table 210 for carrying the wafer transfer box 100 placed on its side; a fixing unit 220 , used to fix the wafer transfer box 100; the dismantling unit 230 includes a support block 231, a screw 232 and a top block 233, the support block 231 is fixed on one side of the carrying platform 210, and is connected with the connector The position corresponding to 160, the top block 233 is fixed above the support block 231 by the screw 232, and rotating the screw 232 drives the top block 233 to move up and down, so that the top block 233 is connected from the connection The lower edge of the piece 160 pushes the connecting piece 160 upward to remove the connecting piece 160 .

Specifically, the wafer transfer box 100 is a front-opening wafer transfer box, and a handle 150 is provided on the side wall 130 of the wafer transfer box to facilitate the operator to carry the wafer transfer box 100 . The fixing unit 220 includes a fixing pile 221 and a fixing buckle 222. The fixing piles 221 are located on both sides of the bearing platform 210. The fixing piles are set according to the positions of the handles 150 on both sides of the wafer transfer cassette 100 placed on the side. 221 , the fixing buckle 222 is located on the top of the fixing pile 221 , and the wafer transfer box 100 is fixed by fixing the handles 150 on both sides of the wafer transfer box 100 . Optionally, the fixing pile 221 is, for example, a height-adjustable pile body, and the height can be adjusted according to the handle position of the wafer transfer box to be fixed, so that the fixing buckle 222 can be accurately buckled on the two sides of the wafer transfer box. handle. Of course, the fixing unit 220 can also adopt other fixing structures, as long as the wafer transfer box can be fixed before the removal of the connector on the top of the wafer transfer box.

The connecting member 160 of the top 110 of the wafer transfer box 100 is, for example, a flange structure, and the connecting member 160 is provided with a slot (not shown in the figure). (The front opening 130 a of the wafer transfer box) is placed on the carrier table 210 , the top 110 of the wafer transfer box 100 faces the removal device 200 , and the slot on the connector 160 faces the carrier table 210 .

The top of the screw 232 is provided with a hand wheel 232a. By rotating the hand wheel 232a, the screw 232 is driven to move the top block 233 up and down, so that the top block is vertically close to the top of the wafer transfer box 100. Connector 160 . The top block 233 is provided with a top tongue 233a. When the top block 233 moves to the lower edge of the connecting piece 160, the top tongue 233a is inserted into a slot (not shown in the figure) located on the connecting piece 160. ) to unlock the connector 160 from the wafer transfer cassette 100 .

The dismantling unit further includes a guide rod 234 which is fixed on the support block 231 and penetrates through the top block 233 to fix the top block 233 in a horizontal direction. The number of the guide rods 234 is, for example, two, which are located on both sides of the top block 233 respectively. The screw 232 is located in the middle of the top block 233 and is parallel to the guide rod 234 . In other embodiments of the present invention, other numbers of guide rods 234 may also be set, and the screw rod 232 may also be located on one side of the top block 233 , which is not limited in the present invention.

The dismantling unit 230 further includes a balance block 235 disposed on the top of the screw rod 232 , the screw rod 232 is connected to the handwheel 232 a through the balance block 235 , and the guide rod 234 is different from the support block 231 One end is fixed on the balance block 235 . The balance block 235 fixes the screw rod 232 and the guide rod 234 , and is combined with the support block 231 to maintain the dismantling unit 230 in a balanced state.

The dismantling device 200 further includes a sliding unit 240, the sliding unit 240 includes a sliding guide 241 and a sliding block 242, the sliding guide 241 is fixed on one side of the bearing platform 210, and the sliding direction of the sliding guide 241 is vertical On the plane where the top of the wafer transfer cassette 100 is located, the support block 231 is fixed on the sliding block 242, and the sliding block 242 is slid on the sliding guide 241 to move the dismantling unit 230 so that the removal unit 230 is moved. The top block 233 is close to the connecting member 160 in the horizontal direction. The sliding guide 241 is, for example, an inverted "V" shape with a gradually decreasing opening. In this embodiment, the support block 231 is fixed on the slider 242, and the support block 231 is driven to move by the slider 242. In other embodiments of the present invention, the support block 231 and the slider 242 may also be for an integrated structure.

In the device 200 for removing the connector 160 on the top of the wafer transfer box 100 provided in this embodiment, the fixing unit 220 fixes the wafer transfer box 100 placed on the side on the supporting table 210, and the sliding unit 240 drives the The removal unit 230 is close to the connecting piece 160 on the top of the wafer transfer cassette 100 in the horizontal direction, and the top block 233 of the removing unit 230 moves up and down under the driving of the screw 232, and pushes the connecting piece 160 upward from the lower edge of the connecting piece 160. The connecting piece 160 is removed to remove the connecting piece 160 . The device 200 for removing the connector 160 on the top of the wafer transfer box 100 provided in this embodiment reduces the difficulty of removing the connector 160 on the top of the wafer transfer box 100 , and avoids the problem of damage to the box caused by violent removal. The dismantling device 200 is simple and easy to operate, with high dismantling efficiency and low risk.

The device 200 for removing the connector 160 on the top of the wafer transfer cassette 100 provided in this embodiment can be applied to, for example, the standardized FOSB shipment of 300 mm semiconductor wafers. In other embodiments of the present invention, it can also be used for other types with top Wafer cassettes for connectors.

Embodiment 2

This embodiment provides a method for removing the connector on the top of the wafer transfer box, using the device 200 for removing the connector 160 on the top of the wafer transfer box 100 provided in the first embodiment to remove the connector 160 . As shown in FIG. 4 , the method for removing the connector 160 on the top of the wafer transfer box 100 provided in this embodiment includes: step S01 : the wafer transfer box 100 is placed on the supporting table 210 on its side; step S02 : the fixing unit 220 fixes the Wafer transfer cassette 200; and Step S03: the top block 233 of the dismantling unit 200 moves up and down under the driving of the screw 232, and pushes the connecting piece 160 upward from the lower edge of the connecting piece 160 to remove the connecting piece 160 demolished.

Specifically, refer to FIG. 2 to FIG. 4 . First, the wafer transfer box 100 is placed on the carrier table 210 along the side wall 130 (the front opening 130 a of the wafer transfer box), the top 110 of the wafer transfer box 100 faces the removal device 200 , and the The slot on the connecting member 160 faces the supporting platform 210 .

Next, the fixing piles 221 of the fixing unit 220 are located on both sides of the carrying platform 210 , and the fixing buckles 222 on the top of the fixing piles 221 are used to fix the handles 150 on both sides of the wafer transfer cassette 100 to fix the The wafer transfer cassette 100 is described.

Next, the support block 231 of the dismantling unit 230 is fixed on the sliding block 242 of the sliding unit 240, and the sliding unit 240 is adjusted by sliding the sliding block 242 on the sliding track 241 so as to be perpendicular to the top of the wafer transfer box. Move the dismantling unit 230 in the horizontal direction so that the top block 233 is close to the connecting piece 160 in the horizontal direction.

Next, the screw 232 is driven by rotating the hand wheel 232a on the top of the screw 232 to move the top block 233 up and down. When the top block 233 moves to the lower edge of the connecting piece 160, the top tongue 233a provided on the top block 233 is inserted into the slot of the connecting piece 160, so as to remove the connecting piece 160 from the connecting piece 160. The top of the wafer transfer box 100 is unlocked; continue to rotate the hand wheel 232a on the top of the screw 232, the top block 233 continues to move upward under the driving of the screw 232, and the top block 233 is stuck on the connection The connector 160 pushes the connector 160 upward to push the connector 160 away from the wafer transfer cassette 100 , thereby realizing the removal of the connector 160 .

It should be noted that each embodiment in this specification is described in a related manner, and the same and similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. place. In particular, for the structural embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and reference may be made to the partial descriptions of the method embodiments for related parts.

The above description is only a description of the preferred embodiments of the present invention, and does not limit the scope of the present invention. Any changes and modifications made by those of ordinary skill in the field of the present invention according to the above disclosure belong to the protection scope of the claims.

10: Wafer transfer box 11: Top 12: Base 13: Sidewall 14: Accommodating space 15: Handle 16: Connectors 100: Wafer transfer box 110: top 130: Sidewall 130a: Front opening of wafer transfer cassette 150: handle 160: Connector 200: Remove the device 210: Bearing platform 220: Fixed unit 230: Demolition unit 231: Support block 232: Screw 233: Top Block 232a: Handwheel 233a: top tongue 234: Guide rod 235: Balance block 221: Fixed pile 222: fixed buckle 241: Sliding rails 242: Slider 240: Sliding Unit S01, S02, S03: Steps.

1A and 1B are partial structural schematic views of a front-opening wafer transfer cassette;

2 is a perspective view of a device for removing a connector on the top of a wafer transfer cassette according to an embodiment of the present invention when the connector is removed;

3A is a front view of a device for removing a connector on the top of a wafer transfer cassette according to an embodiment of the present invention;

3B is a side view of a device for removing a connector on the top of a wafer transfer cassette according to an embodiment of the present invention;

FIG. 4 is a flowchart of a method for removing a connector on the top of a wafer transfer cassette according to an embodiment of the present invention.

none

100: Wafer transfer box

110: top

130: Sidewall

130a: Front opening of wafer transfer cassette

150: handle

160: Connector

200: Remove the device

210: Bearing platform

220: Fixed unit

221: Fixed pile

222: fixed buckle

230: Demolition unit

231: Support block

232: Screw

233: Top Block

232a: Handwheel

234: Guide rod

235: Balance weight

240: Sliding Unit

241: Sliding rails

242: Slider

Claims (12)

A device for removing a connector on the top of a wafer transfer cassette, comprising: a carrying table for carrying a wafer transfer cassette placed on the side; a fixing unit for fixing the wafer transfer cassette; A dismantling unit, including a support block, a screw rod and a top block, the support block is fixed on one side of the bearing platform and corresponds to the position of the connecting piece, the top block is fixed on the support block through the screw rod Above, rotating the screw drives the top block to move up and down, so that the top block pushes the connecting piece upward from the lower edge of the connecting piece to remove the connecting piece. The device for removing the connecting piece on the top of the wafer transfer cassette according to claim 1, wherein a top tongue is provided on the top block, and when the top block moves to the lower edge of the connecting piece, the top tongue is inserted into the connecting piece. to unlock the connector from the top of the wafer transfer cassette. The device for removing the connector on the top of the wafer transfer box according to claim 1, wherein a hand wheel is provided on the top of the screw rod, and the screw rod is rotated by rotating the hand wheel to move the top block up and down. The device for removing the connector on the top of the wafer transfer cassette according to claim 3, wherein the removing unit further comprises a guide rod, and the guide rod is fixed on the support block and penetrates the top block to be fixed in a horizontal direction the top block. The device for removing the connecting piece on the top of the wafer transfer box according to claim 4, wherein a balance block is further provided on the top of the screw rod, the screw rod penetrates the balance block and is connected to the handwheel, and the guide rod is different from the support One end of the block is fixed on the balance block. The device for removing the connector on the top of the wafer transfer cassette according to claim 1, wherein the removing device further comprises a sliding unit, the sliding unit includes a sliding guide and a sliding block, and the sliding guide is fixed on the carrying table one side of the slide rail, and the sliding direction of the slide rail is perpendicular to the plane where the top of the wafer transfer box is located, the support block is fixed on the slider, and the dismantling unit is moved by sliding the slider on the slide rail, Bring the top block horizontally close to the connector. The device for removing the connector on the top of the wafer transfer cassette according to claim 1, wherein the fixing unit comprises a fixing stake and a fixing buckle, the fixing stake is located on both sides of the bearing platform, and the fixing buckle is located at the fixing The top of the pile, and the wafer transfer box is fixed by the handles on both sides of the wafer transfer box. A method for removing a connector on the top of a wafer transfer box, wherein the connector on the top of the wafer transfer box is removed using the device for removing the connector on the top of the wafer transfer box according to any one of claims 1-7, comprising: The wafer transfer box is placed on the carrier table; a fixing unit fixes the wafer transfer cassette; and The top block of the dismantling unit moves up and down under the driving of the screw, and pushes the connecting piece upward from the lower edge of the connecting piece to dismantle the connecting piece. The method for removing the connector on the top of the wafer transfer box according to claim 8, wherein the fixing piles of the fixing unit are located on both sides of the carrying platform, and the wafer transfer box is fixed by the fixing buckles on the top of the fixing piles handles on both sides to secure the wafer transfer cassette. The method for removing the connector on the top of the wafer transfer cassette according to claim 8, wherein when the top block moves to the lower edge of the connector, the top tongue provided on the top block is inserted into the slot located on the connector inside to unlock the connector from the top of the pod. The method for removing the connecting piece on the top of the wafer transfer cassette according to claim 8, wherein the screw is driven by rotating the hand wheel on the top of the screw to move the top block up and down. The method for removing the connector on the top of the wafer transfer cassette according to claim 8, wherein the top block of the removal unit moves up and down under the driving of the screw, and pushes the connector upward from the lower edge of the connector to remove the connector. Before the connecting piece is removed, the method further includes: the support block is fixed on the sliding block of the sliding unit, and by sliding the sliding block on the sliding track to move the removal unit, the top block is horizontally close to the connecting piece.

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