TW202227259A - 3d printing set and method for 3d inkjet printing by using the same - Google Patents

3d printing set and method for 3d inkjet printing by using the same Download PDF

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TW202227259A
TW202227259A TW110101359A TW110101359A TW202227259A TW 202227259 A TW202227259 A TW 202227259A TW 110101359 A TW110101359 A TW 110101359A TW 110101359 A TW110101359 A TW 110101359A TW 202227259 A TW202227259 A TW 202227259A
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TWI747712B (en
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陳崇賢
鄭正元
張雅婷
呂承哲
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國立臺灣科技大學
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Priority to EP21214046.1A priority patent/EP4032685A1/en
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
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    • B33Y10/00Processes of additive manufacturing
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    • C08G18/40High-molecular-weight compounds
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    • C09D11/00Inks
    • C09D11/02Printing inks
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    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0005Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
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    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0005Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
    • B29K2105/0032Pigments, colouring agents or opacifiyng agents

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Abstract

The present invention provides a method for 3D inkjet printing, which comprises: a preheating step: using an external heating source to heat a main body layer composed of a first composition to a first temperature, wherein the main body layer has a thickness of 10 μm to 500 μm and a unit density of 0.1 to 1.0 g/cm 3, and the first temperature is less than the melting point of the first composition; a heating step: a second composition is applied to the surface of the first composition at the first temperature of the composite to proceed an exothermic cross-linking polymerization, so that the main body layer is heated to a second temperature to become a molten state; and a cooling step: the main body layer in the molten state is cooled down and solidified to form.

Description

3D列印套組、以及使用其進行3D噴墨列印之方法3D printing kit, and method of using the same for 3D inkjet printing

本發明係關於立體列印技術,特別是關於一種3D噴墨列印技術。The present invention relates to three-dimensional printing technology, in particular to a 3D inkjet printing technology.

3D列印技術由於具備便捷快速成型(Rapid Prototyping,RP)、能夠減低研發成本、縮短研發週期、提高新產品開發成功率、以及滿足個人製作與現地製造的需求等等之優良特性,因而自1980年代開始萌芽起3D列印持續快速地發展,不只有關之技術、裝置、製程、方法等不斷地創新突破,3D列印機型、種類亦不斷地持續推陳出新,而且在列印的品質、速度、可列印物品大小、輸出穩定性等各方面亦顯著地提昇,近十年來,3D列印市場規模更是飛躍地成長擴大。3D printing technology has excellent characteristics such as convenient rapid prototyping (RP), can reduce R&D costs, shorten R&D cycle, improve the success rate of new product development, and meet the needs of personal production and local manufacturing. Since the 1990s, 3D printing has continued to develop rapidly. Not only related technologies, devices, processes, and methods have been continuously innovated and made breakthroughs, but also 3D printing models and types have been continuously introduced. The size of printable items, output stability and other aspects have also been significantly improved. In the past ten years, the size of the 3D printing market has grown and expanded by leaps and bounds.

基本上,3D列印成型技術是一種能夠在不使用刀具、模具或卡具之條件下,運用有如建構金字塔之層層堆疊的技術概念,自動且快速地將複雜形狀的設計圖像製作成三維立體形狀的實體物之快速成型方法。質言之,3D列印是基於切層、堆疊、加法製造的原理,將含有特定的塑膠、金屬等成分之成型材料,經溶液化、溶劑化或熔融處理後,利用3D列印設備直接精密噴墨列印在一個平面上,再藉由光能、電能、化學能予以燒結、黏合、乾燥、固化形成XY 軸2維平面層,接著於Z軸方向移動並精準定位而一層一層地疊加起來,最終形成立體形狀的三維實體物。Basically, 3D printing technology is a technology that can automatically and quickly make complex-shaped design images into three-dimensional shapes without the use of tools, molds or fixtures, using the technical concept of stacking layers like building a pyramid. A rapid prototyping method for solid objects in three-dimensional shapes. In a nutshell, 3D printing is based on the principles of slicing, stacking, and additive manufacturing. The molding materials containing specific plastics, metals, etc. are dissolved, solvated, or melted, and then directly precise using 3D printing equipment. Inkjet prints on a plane, and then sintering, bonding, drying, and curing by light energy, electrical energy, and chemical energy to form XY-axis 2-dimensional plane layers, and then move in the Z-axis direction and position them accurately to stack them layer by layer. , and finally form a three-dimensional solid object with a three-dimensional shape.

目前,3D列印方法十分多樣,舉例來說,有熔融沉積成型(Fused Deposition Modeling,FDM;又稱為Fused Filament Fabrication,FFM)、層狀物體製造(Laminated Object Manufacturing,LOM)、數位光處理(Digital Light Processing,DLP;又稱為Film Transfer Imaging,FTI)、立體平板印刷(Stereo-lithography Apparatus ,SLA)、膠水固化噴印(Plaster-based 3D printing或Powder bed and inkjet head 3D printing,3DP) 、選擇性雷射燒結(Selective Laser Sintering,SLS)、選擇性雷射熔化(Selective Laser Melting,SLM;或稱為Direct Metal Laser Sintering ,DMLS)等之立體成型方式。另外,惠普公司(Hewlett-Packaed Inc.)在2014年發表了多射流熔融技術(Multi Jet Fusion techology),此技術是利用熱泡式噴嘴噴出熱觸媒進行圖案化,經過紅外光照射後,熱觸媒被誘發而釋放熱量到達200℃熔化塑膠粉末,成為可以直接做塑膠粉末燒融之3D列印系統,並且兼具速度跟精度。At present, 3D printing methods are very diverse, for example, Fused Deposition Modeling (FDM; also known as Fused Filament Fabrication, FFM), Laminated Object Manufacturing (LOM), Digital Light Processing ( Digital Light Processing, DLP; also known as Film Transfer Imaging, FTI), stereolithography (Stereo-lithography Apparatus, SLA), glue curing jet printing (Plaster-based 3D printing or Powder bed and inkjet head 3D printing, 3DP), Three-dimensional molding methods such as Selective Laser Sintering (SLS) and Selective Laser Melting (SLM; or Direct Metal Laser Sintering, DMLS). In addition, Hewlett-Packaed Inc. published Multi Jet Fusion techology in 2014. This technology uses a hot bubble nozzle to spray a thermal catalyst for patterning. After being irradiated with infrared light, the thermal The catalyst is induced to release heat to melt the plastic powder at 200°C, becoming a 3D printing system that can directly melt plastic powder, and has both speed and precision.

然而,上述之多射流熔融技術中所使用的熱觸媒大多是包含了一些深色的吸收光波物質,因此經列印成型的成品大多為深色,若使用淺色材料可能會降低能量吸收,導致成型失敗或者成型時間延長;另外,現有的多射流熔融技術只能讓3D成型材產生物理交聯,因此在機械強度部分仍有不足。從而,如何開發一種能夠解決上述習用技術之缺點,實為相關技術領域者目前所迫切需要解決之課題。However, most of the thermal catalysts used in the above-mentioned multi-jet melting technologies contain some dark light-absorbing substances, so most of the printed products are dark. If light-colored materials are used, energy absorption may be reduced. This leads to molding failure or prolonged molding time; in addition, the existing multi-jet melting technology can only produce physical cross-linking of 3D molding materials, so there is still insufficient mechanical strength. Therefore, how to develop a solution that can solve the above-mentioned shortcomings of the conventional technology is an urgent problem to be solved by those in the related technical field.

是以,本發明人等經由潛心研究及尋找用於解決傳統技術之上述問題點的各種可能方案,進而開發出一種3D噴墨列印方法,係藉由將反應型融合劑快速噴塗在鋪層好的預熱高分子粉體列印區域,同時施加近紅外光熱源,引發反應型融合劑與高分子粉體之交聯聚合反應並放出大量熱,產生增效作用(synergistic effect),致使其溫度高於高分子粉體之熔點,因此能夠以較低的熱量將高分子粉體熔融成型,並且透過化學交聯能夠有效提升成品的機械強度。本發明列印速度比傳統3D雷射燒熔高分子粉體之技術快10 倍以上,可在短時間內完成機械性質極佳的物件,緻密及精度相當於模具射出成形,可應用的層面將更加廣泛,卻能省下開發模具的高額成本,為工業界產品打樣及數位製造建立全新里程碑。另外,由於本發明是利用化學反應熱將高分子粉體熔融,因此就算添加淺色色料進行列印也不會影響列印速度及品質。Therefore, the inventors of the present invention have developed a 3D inkjet printing method through intensive research and search for various possible solutions for solving the above-mentioned problems of the traditional technology, which is to rapidly spray the reactive fusion agent on the laminate Good preheating of the polymer powder printing area, while applying a near-infrared light heat source, triggers the cross-linking polymerization reaction between the reactive fusion agent and the polymer powder and releases a lot of heat, resulting in a synergistic effect, causing it to The temperature is higher than the melting point of the polymer powder, so the polymer powder can be melted and molded with a lower heat, and the mechanical strength of the finished product can be effectively improved through chemical cross-linking. The printing speed of the present invention is more than 10 times faster than that of the traditional 3D laser melting polymer powder technology, and objects with excellent mechanical properties can be completed in a short time, and the density and precision are equivalent to mold injection molding. More extensive, but can save the high cost of developing molds, and establish a new milestone for industrial product proofing and digital manufacturing. In addition, since the present invention uses the heat of chemical reaction to melt the polymer powder, the printing speed and quality will not be affected even if a light color material is added for printing.

亦即,本發明可以提供一種3D噴墨列印方法,其係包括:預熱步驟:使用一外部加熱源將一第一組合物所構成之主體層加熱至一第一溫度;該主體層的厚度為在10μm至500μm之間,單位密度為在0.1至1.0g/cm 3,該第一溫度為小於該第一組合物的熔點;升溫步驟:在該第一溫度下將一第二組合物塗覆於該第一組合物之表面進行交聯聚合放熱反應,使該主體層升溫至第二溫度而成為熔融態;以及冷卻步驟:使熔融態的該主體層冷卻降溫並固化成型。 That is, the present invention can provide a 3D inkjet printing method, which includes: a preheating step: using an external heating source to heat a body layer composed of a first composition to a first temperature; The thickness is between 10 μm and 500 μm, the unit density is between 0.1 and 1.0 g/cm 3 , and the first temperature is less than the melting point of the first composition; the heating step: at the first temperature, a second composition is Coating on the surface of the first composition to carry out cross-linking polymerization exothermic reaction, raising the temperature of the main body layer to a second temperature to become a molten state; and cooling step: cooling the main body layer in a molten state to cool down and solidify and form.

根據本發明之一實施例,該第一組合物係至少包含有成型材,該成型材為具有以化學式(Ⅰ) 所代表的化學結構之化合物A、以化學式(Ⅱ)所代表的化學結構之化合物B、或多胺類化合物:

Figure 02_image001
(Ⅰ);
Figure 02_image003
(Ⅱ); 在上述化學式(Ⅰ)、(Ⅱ)中,R 1、R 2、R 3、及R 4係各自獨立地表示烷基或芳烴基。 According to an embodiment of the present invention, the first composition comprises at least a molding material, and the molding material is a compound A having a chemical structure represented by chemical formula (I), a compound having a chemical structure represented by chemical formula (II) Compound B, or polyamine compounds:
Figure 02_image001
(I);
Figure 02_image003
(II); In the above chemical formulae (I) and (II), R 1 , R 2 , R 3 , and R 4 each independently represent an alkyl group or an aromatic hydrocarbon group.

根據本發明之一實施例,該第二組合物至少包括具有O=C=N-官能基的化合物C,並且在該主體層中之該成型材相對於該化合物C的重量比為在1:1至10:1之間。According to an embodiment of the present invention, the second composition comprises at least a compound C having O=C=N-functional group, and the weight ratio of the molding material to the compound C in the main body layer is 1: Between 1 and 10:1.

根據本發明之一實施例,該第一溫度與該第一組合物的熔點的差值為在10℃至100℃之間。According to an embodiment of the present invention, the difference between the first temperature and the melting point of the first composition is between 10°C and 100°C.

根據本發明之一實施例,該第二溫度為大於該第一組合物的熔點。According to an embodiment of the present invention, the second temperature is greater than the melting point of the first composition.

根據本發明之一實施例,該第二組合物進一步包含選自催化劑、物性調整劑、分散劑、助溶劑、及著色劑中之至少一種。According to an embodiment of the present invention, the second composition further comprises at least one selected from a catalyst, a physical property modifier, a dispersant, a cosolvent, and a colorant.

根據本發明之一實施例,3D噴墨列印方法其中該催化劑為二月桂酸二丁基錫(DBTDL)。According to an embodiment of the present invention, the 3D inkjet printing method wherein the catalyst is dibutyltin dilaurate (DBTDL).

根據本發明之一實施例,該物性調整劑為選自多元醇類、聚醚多元醇類、聚酯多元醇類、及其組合中之至少一種。According to an embodiment of the present invention, the physical property modifier is at least one selected from polyols, polyether polyols, polyester polyols, and combinations thereof.

根據本發明之一實施例,在該升溫步驟中,是以平塗法、濺鍍法、噴塗法、流延塗布法、輥塗法、及條塗法中之任一種方法將該第二組合物塗布於該第一組合物的表面。According to an embodiment of the present invention, in the heating step, the second combination is performed by any one of a flat coating method, a sputtering method, a spray coating method, a casting coating method, a roll coating method, and a strip coating method. The material is coated on the surface of the first composition.

根據本發明之一實施例,該第二組合物進一步包含選自催化劑、物性調整劑、分散劑、助溶劑、及著色劑中之至少一種。According to an embodiment of the present invention, the second composition further comprises at least one selected from a catalyst, a physical property modifier, a dispersant, a cosolvent, and a colorant.

根據本發明之一實施例,該催化劑為二月桂酸二丁基錫(DBTDL)。According to an embodiment of the present invention, the catalyst is dibutyltin dilaurate (DBTDL).

根據本發明之一實施例,該物性調整劑為選自多元醇類、聚醚多元醇類、聚酯多元醇類、及其組合中之至少一種。According to an embodiment of the present invention, the physical property modifier is at least one selected from polyols, polyether polyols, polyester polyols, and combinations thereof.

以下,針對本發明的實施態樣列舉不同的具體實施例而更加詳盡地敘述與說明,以便使本發明的精神與內容更為完備而易於瞭解;然而,本項技藝中具有通常知識者應當明瞭本發明當然不受限於此等實例而已,亦可利用其他相同或均等的功能與步驟順序來達成本發明。Hereinafter, the embodiments of the present invention will be described and described in more detail by listing different specific embodiments, so as to make the spirit and content of the present invention more complete and easy to understand; however, those with ordinary knowledge in the art should understand that Of course, the present invention is not limited to these examples, and other same or equivalent functions and sequence of steps can also be utilized to achieve the present invention.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之實施態樣的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是用於參照隨附圖式的方向。因此,該等方向用語僅是用於說明而非用於限制本發明,本發明當可以其他任何方式來實現。The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only used to refer to the directions of the accompanying drawings. Therefore, these directional terms are only used to illustrate rather than limit the present invention, and the present invention can be implemented in any other manner.

首先,請參閱圖1,其為顯示本發明之高速3D的標準流程圖,該方法包含預熱步驟S1、升溫步驟S2、冷卻步驟S3。First, please refer to FIG. 1 , which is a standard flow chart showing the high-speed 3D of the present invention. The method includes a preheating step S1 , a heating step S2 , and a cooling step S3 .

在預熱步驟S1中,是利用滾筒將第一組合物均勻舖層,形成一主體層,並使用一外部加熱源將該主體層加熱至第一溫度。該第一組合物至少包含有成型材,該成型材係具有以化學式(Ⅰ) 所代表的化學結構之化合物A、或以化學式(Ⅱ)所代表的化學結構之化合物B、或多胺類化合物:

Figure 02_image001
(Ⅰ);
Figure 02_image003
(Ⅱ); In the preheating step S1, the first composition is uniformly layered by a roller to form a main body layer, and an external heating source is used to heat the main body layer to a first temperature. The first composition contains at least a molding material, and the molding material is a compound A with a chemical structure represented by the chemical formula (I), or a compound B with a chemical structure represented by the chemical formula (II), or a polyamine compound :
Figure 02_image001
(I);
Figure 02_image003
(II);

根據本發明之一觀點,在上述化學式(Ⅰ)、(Ⅱ)中,R 1、R 2、R 3、及R 4係各自獨立地表示烷基、或芳烴基。舉例來說,該化合物A可以是半結晶型聚醯胺,較佳為聚醯胺-6(PA-6)、聚醯胺-66 (PA-66)、聚醯胺-610 (PA-610)、聚醯胺-1010 (PA-1010)、聚醯胺-11 (PA-11)、聚醯胺-12 (PA-12)、聚醯胺-9 (PA-9)、聚醯胺-612 (PA-612)、聚醯胺-121 (PA-121)、聚鄰苯二甲醯胺(PPA)、聚對苯二甲醯對苯二胺(PPTA);該化合物B可以是聚氨酯(PU)、較佳為熱塑型聚氨酯(TPU)。 According to one aspect of the present invention, in the above chemical formulae (I) and (II), R 1 , R 2 , R 3 , and R 4 each independently represent an alkyl group or an aromatic hydrocarbon group. For example, the compound A can be a semi-crystalline polyamide, preferably polyamide-6 (PA-6), polyamide-66 (PA-66), polyamide-610 (PA-610 ), Polyamide-1010 (PA-1010), Polyamide-11 (PA-11), Polyamide-12 (PA-12), Polyamide-9 (PA-9), Polyamide- 612 (PA-612), polyamide-121 (PA-121), polyphthalamide (PPA), polyparaphenylene terephthalamide (PPTA); the compound B can be a polyurethane ( PU), preferably thermoplastic polyurethane (TPU).

又,在一實施例中,該多胺類化合物的較佳例子包含直鏈脂肪族多胺類、支鏈脂肪族多胺類、環狀脂肪族多胺類中之至少一種;更佳為乙二胺(Ethylenediamine)、1,3-丙二胺(1,3-propanediamine)、1,4-丁二胺(1,4-butanediamine)、1,5-戊二胺(1,5-pentanediamine)、二乙烯三胺(diethylenetriamine)、1,2-丙二胺(1,2-propanediamine)、1,4-二氮環庚烷、苯二胺(phenylenediamine)。Also, in one embodiment, the preferred examples of the polyamine compounds include at least one of linear aliphatic polyamines, branched chain aliphatic polyamines, and cyclic aliphatic polyamines; more preferably ethyl acetate Ethylenediamine, 1,3-propanediamine, 1,4-butanediamine, 1,5-pentanediamine , Diethylenetriamine (diethylenetriamine), 1,2-propanediamine (1,2-propanediamine), 1,4-diazepine, phenylenediamine (phenylenediamine).

承上,該主體層的厚度並未特別加以限制,一般為在10μm至500μm之間;較佳為在10μm至300μm之間;更佳為在50μm至150μm之間。另外,該主體層的單位密度一般為在0.1g/cm 3至1.0g /cm 3之間;較佳為在0.2g/cm 3至0.9g/cm 3之間;最佳為在0.4g/cm 3至0.6g/cm 3之間。 On the other hand, the thickness of the main body layer is not particularly limited, and is generally between 10 μm and 500 μm; preferably between 10 μm and 300 μm; more preferably between 50 μm and 150 μm. In addition, the unit density of the main body layer is generally between 0.1g/cm 3 to 1.0g/cm 3 ; preferably between 0.2g/cm 3 to 0.9g/cm 3 ; most preferably between 0.4g/cm cm 3 to 0.6 g/cm 3 .

接著,升溫步驟S2是在該第一溫度下將一第二組合物塗覆在該第一組合物的表面,塗布方法可以是平塗法、濺鍍法、噴塗法、流延塗布法、輥塗法、及條塗法中之任一種;較佳是利用熱泡式噴頭或壓電式噴頭將第二組合物噴塗到該第一組合物的表面。該熱泡式噴頭或該壓電噴頭可經由3D列印裝置的處理單元控制噴塗的範圍,藉此符合欲列印之立體物件的多個剖面圖檔的圖案。當使用熱泡式噴頭時,該第二組合物在室溫下的黏度較佳為在4cps以下;而當使用壓電式噴頭時,該第二組合物在室溫下的黏度較佳為在6至8cps、19至23cps、或30cps。Next, the heating step S2 is to coat a second composition on the surface of the first composition at the first temperature, and the coating method can be a flat coating method, a sputtering method, a spraying method, a casting coating method, a roller Any of the coating method and the strip coating method; preferably, the second composition is sprayed onto the surface of the first composition by using a thermal bubble spray head or a piezoelectric spray head. The thermal-bubble nozzle or the piezoelectric nozzle can control the spraying range through the processing unit of the 3D printing device, thereby conforming to the patterns of a plurality of cross-sectional images of the three-dimensional object to be printed. When using a hot-bubble shower head, the viscosity of the second composition at room temperature is preferably below 4cps; and when using a piezoelectric shower head, the viscosity of the second composition at room temperature is preferably between 6 to 8cps, 19 to 23cps, or 30cps.

該第二組合物為包含具有能夠與該第一組合物進行化學反應並放出熱量的機能反應型融合劑,因此該第一組合物與該第二組合物接觸後便會發生交聯聚合反應,使該主體層升溫至第二溫度而成為熔融態。The second composition contains a functionally reactive fusion agent capable of chemically reacting with the first composition and releasing heat, so the cross-linking polymerization reaction will occur after the first composition contacts the second composition, The main body layer is heated to the second temperature to be in a molten state.

根據本發明的技術思想,該第二組合物至少包括以具有O=C=N-官能基的化合物,特別是具有以化學式(Ⅲ)所代表的化學結構之化合物C:According to the technical idea of the present invention, the second composition at least includes a compound with O=C=N-functional group, especially a compound C with a chemical structure represented by chemical formula (III):

Figure 02_image007
(III)
Figure 02_image007
(III)

在上述化學式(Ⅲ)中,R 5係表示烷基、或芳烴基;舉例來說,該化合物C可以是甲苯二異氰酸酯(TDI)、異佛爾酮二異氰酸酯(IPDI)、二苯基甲烷二異氰酸酯(MDI)、二環己基甲烷二異氰酸酯(H 12MDI)、賴氨酸二異氰酸酯(LDI)。 In the above chemical formula (III), R 5 represents an alkyl group or an aromatic hydrocarbon group; for example, the compound C can be toluene diisocyanate (TDI), isophorone diisocyanate (IPDI), diphenylmethane diisocyanate Isocyanate (MDI), dicyclohexylmethane diisocyanate (H 12 MDI), lysine diisocyanate (LDI).

另外,化合物C也可以是HDI的多聚體(HDI polyisocyanates),像是HDI 三聚體(HDI isocyanurate trimer),例如異氰尿酸三縮水甘油酯(1,3,5-triazine-2,4,6(1H, 3H, 5H)-trione)、1,3,5-三(6-異氰酸基己基)(( 1,3,5-tris(6-isocyanatohexyl)));或是HDI 縮二脲(HDI biuret),例如1,3,5-Tris(6-hydroxyhexyl)biuret triisocyanate。再者,該化合物C也可以是氰酸鹽類,像是氰酸鉀、氫酸鈉、或氰酸胺等。In addition, compound C can also be HDI polyisocyanates, such as HDI isocyanurate trimer, such as triglycidyl isocyanurate (1,3,5-triazine-2,4, 6(1H, 3H, 5H)-trione), 1,3,5-tris(6-isocyanatohexyl)(( 1,3,5-tris(6-isocyanatohexyl))); Urea (HDI biuret) such as 1,3,5-Tris(6-hydroxyhexyl)biuret triisocyanate. Furthermore, the compound C may also be cyanate salts, such as potassium cyanate, sodium hydride, or cyanamide.

承上所述,該第二組合物除了含有上述化合物C以外,還進一步包含溶劑、催化劑、物性調整劑、分散劑、助溶劑、及著色劑中之任一種或一種以上的成分。As mentioned above, in addition to the above-mentioned compound C, the second composition further includes any one or more components of a solvent, a catalyst, a physical property modifier, a dispersant, a cosolvent, and a coloring agent.

根據本發明的創作思想,該催化劑可以是二月桂酸二丁基錫(DBTDL)、三乙烯二胺、辛酸亞錫(Stannous Octoate)、二辛基馬來酸酯錫(Dioctyltin dilaurate)、甲基磺酸鉍(Bismuth methansulfonate)、及羧酸鉍(Bismuth Carboxylate)中之一種或一種以上。According to the creative idea of the present invention, the catalyst can be dibutyltin dilaurate (DBTDL), triethylenediamine, stannous octoate (Stannous Octoate), dioctyltin dilaurate (Dioctyltin dilaurate), methanesulfonic acid One or more of bismuth (Bismuth methansulfonate) and bismuth carboxylate (Bismuth Carboxylate).

又,根據本發明的創作思想,該物性調整劑可以是多元醇類(polyols),例如乙二醇(Ethylene glycol)、二乙二醇(Diethylene glycol)、丙三醇(Glycerol)、1,4-丁二醇(1,4-Butylene glycol)、1,6-己二醇(1,6-hexanediol)、三丙二醇(Tripropylene glycol)、三羥甲基丙烷(trimethylolpropane)、季戊四醇(‎Pentaerythritol);也可以是聚醚多元醇類(‎Polyether polyol),例如聚乙二醇(Polyethylene glycol, PEG)、聚丙二醇(‎Polypropylene glycol, PPG)、聚四氫呋喃(polytetramethylene ether glycol, PTMG);或是聚酯多元醇類(PE),包括脂肪族聚酯多元醇及芳香族聚脂多元醇。In addition, according to the creative idea of the present invention, the physical property modifier can be polyols, such as Ethylene glycol, Diethylene glycol, Glycerol, 1,4 -1,4-Butylene glycol, 1,6-hexanediol, Tripropylene glycol, trimethylolpropane, ‎Pentaerythritol; It can also be a polyether polyol (‎Polyether polyol), such as polyethylene glycol (PEG), polypropylene glycol (PPG), polytetramethylene ether glycol (PTMG); or polyester Polyols (PE), including aliphatic polyester polyols and aromatic polyester polyols.

另外,該著色劑可以是含有碳黑、白色顏料、紅色顏料、或黃色顏料等不同顏色的顏料,藉此能夠在進行3D列印過程中同時完成上色。In addition, the colorant may be a pigment containing carbon black, white pigment, red pigment, or yellow pigment, etc., so that coloring can be completed simultaneously during the 3D printing process.

在本發明之實施例所使用的外部加熱源為波長在1μm至700nm的近紅外光加熱器,但並不以此為限,也可以使用電阻加熱器或電磁加熱器,控制環境溫度為在第一溫度。The external heating source used in the embodiment of the present invention is a near-infrared light heater with a wavelength of 1 μm to 700 nm, but it is not limited to this, and a resistance heater or an electromagnetic heater can also be used, and the ambient temperature is controlled to be in the first a temperature.

再者,為使第一組合物與該第二組合物充分反應,該第一組合物中之成型材相對於該第二組合物中之化合物C的重量比一般為在1:1至10:1之間;較佳為在1:1至5:1之間;更佳為在1:2至1:3之間。Furthermore, in order to make the first composition and the second composition fully react, the weight ratio of the molding material in the first composition to the compound C in the second composition is generally 1:1 to 10: between 1; preferably between 1:1 and 5:1; more preferably between 1:2 and 1:3.

另外,在冷卻步驟S4中,是在一反應時間後將該外部加熱源移除,以使該主體層冷卻降溫並固化成型,即完成單層之列印。該反應時間一般為在0.05秒至100秒之間;較佳為在0.05秒至80秒之間;更佳為在0.1秒至70秒之間;最佳為在0.1秒至50秒之間In addition, in the cooling step S4, the external heating source is removed after a reaction time, so that the main body layer is cooled down and solidified to form, that is, the printing of a single layer is completed. The reaction time is generally between 0.05 seconds and 100 seconds; preferably between 0.05 seconds and 80 seconds; more preferably between 0.1 seconds and 70 seconds; most preferably between 0.1 seconds and 50 seconds

根據本發明的創作思想,該第一溫度一般為低於該第一組合物的熔點,並且該第一溫度與該第一組合物的熔點的差值較佳為在10℃至100℃之間;更佳為在10℃至80℃之間;最佳為在10℃至50℃之間。另外,該第二溫度一般為高於該第一組合物的熔點,並且該第二溫度與該第一組合物的熔點的差值較佳為在10℃至100℃之間;更佳為在10℃至80℃之間;最佳為在10℃至50℃之間。According to the creative idea of the present invention, the first temperature is generally lower than the melting point of the first composition, and the difference between the first temperature and the melting point of the first composition is preferably between 10°C and 100°C ; more preferably between 10°C and 80°C; most preferably between 10°C and 50°C. In addition, the second temperature is generally higher than the melting point of the first composition, and the difference between the second temperature and the melting point of the first composition is preferably between 10°C and 100°C; more preferably at Between 10°C and 80°C; optimally between 10°C and 50°C.

以下,進一步以具體實施例來說明本發明。 《 聚醯胺PA-12之熱性質分析》 Hereinafter, the present invention will be further described with specific examples. "Analysis of Thermal Properties of Polyamide PA-12"

首先,利用示差掃描熱分析儀(DSC) 對於第一組合物聚醯胺PA-12粉體進行非恆溫掃描,鑑定PA-12粉體的熱性質。使用之升溫掃描速度為5 ℃/min,從室溫掃描到200 ℃,且須先以相同條件對樣品作退火熱處理 (annealing) 的動作。PA-12之非恆溫掃描DSC曲線如圖3所示。而樣品經退火後所獲得的聚醯胺的熱性質數據記錄於表1中。First, a differential scanning calorimeter (DSC) was used to perform non-isothermal scanning on the first composition polyamide PA-12 powder to identify the thermal properties of the PA-12 powder. The heating scan speed used is 5 °C/min, and the scanning is from room temperature to 200 °C, and the sample must be annealed under the same conditions. The non-isothermal scanning DSC curve of PA-12 is shown in Figure 3. And the thermal property data of the polyamide obtained after the sample is annealed are recorded in Table 1.

表1 樣品 Onset Tm (℃) Peak Tm (℃) Total melting heat (J/g) PA-12 165.68 174.01 58.07 165.95 174.11 52.69 171.62 177.91 52.70 平均值 167.8±2.7 175.3±1.8 54.5±2.5 Table 1 sample Onset Tm (℃) Peak Tm (℃) Total melting heat (J/g) PA-12 165.68 174.01 58.07 165.95 174.11 52.69 171.62 177.91 52.70 average value 167.8±2.7 175.3±1.8 54.5±2.5

由表1及圖2進行熱性質分析可得知,本案所使用的PA-12之熔點約為175 ℃。此部分實驗結果可幫助設計3D列印過程使用之第一溫度,後續將以160、165、180 ℃作為第一溫度進行PA-12與第二組合物放熱聚合反應之DSC分析實驗。 《含有觸媒之第二組合物與聚醯胺PA-12粉體的恆溫掃描分析》 It can be known from the thermal property analysis in Table 1 and Figure 2 that the melting point of PA-12 used in this case is about 175°C. The experimental results of this part can help to design the first temperature used in the 3D printing process. The DSC analysis experiment of the exothermic polymerization reaction of PA-12 and the second composition will be carried out at 160, 165, and 180 °C as the first temperature. "Constant Scanning Analysis of the Second Composition Containing Catalyst and Polyamide PA-12 Powder"

將PA-12、H 12-MDI、及含有二月桂酸二丁基錫 (dibutyltin dilaurate (DBTDL))的N-甲基吡咯烷酮(NMP)以如表2所示之重量比混合均勻,並以如表2所示的溫度條件下以示差掃描量熱儀(Differential Scanning Calorimetry, DSC)進行恆溫掃描,並將各樣品的放熱峰時間(peak time),及樣品的放熱量記錄於表2中。其中反應型融合劑H 12-MDI是溶在丁酮(MEK)中(配製濃度為30 wt%)。 PA-12, H 12 -MDI, and N-methylpyrrolidone (NMP) containing dibutyltin dilaurate (DBTDL) were mixed uniformly in the weight ratio shown in Table 2, and the mixture was uniformly mixed as shown in Table 2. Under the indicated temperature conditions, a constant temperature scan was performed with a Differential Scanning Calorimetry (DSC), and the exothermic peak time of each sample and the exothermic heat of the sample were recorded in Table 2. The reactive fusion agent H 12 -MDI is dissolved in butanone (MEK) (the preparation concentration is 30 wt%).

表2 樣品 構成分 ( 重量比 ) 溫度 ( ) Peak time (min) Heat (J/g) a Heat (J/g) b PA-12 第二組合物 H 12MDI DBTDL/NMP 1 1 1 4×10 -3/0.396 160 2.39 10.39 24.94 2 2 1 4×10 -3/0.396 1.75 9.01 c 27.39 3 3 1 4×10 -3/0.396 1.70 7.47 c 32.87 4 4 1 4×10 -3/0.396 1.16 13.47 72.74 5 5 1 4×10 -3/0.396 1.01 16.93 108.35 6 2 1 0 1.97 27.22 81.66 7 3 1 0 1.85 24.33 97.32 8 2 1 4×10 -3/0.396 165 1.83 6.60 22.44 9 3 1 4×10 -3/0.396 1.56 10.93 48.09 10 2 1 0 2.47 33.65 100.95 11 3 1 0 1.90 30.76 123.04 12 2 1 0 180 1.41 26.43 79.29 a每克樣品(PA-12+H 12MDI)之反應放熱量(Total heat per g sample) b每克H 12MDI之反應放熱量(Total heat per g H 12MDI) c從DSC 曲線中觀察到熔融現象 Table 2 sample Composition ( weight ratio ) Temperature ( ) Peak time (min) Heat (J/g) a Heat (J/g) b PA-12 second composition H 12 MDI DBTDL/NMP 1 1 1 10-3 /0.396 160 2.39 10.39 24.94 2 2 1 10-3 /0.396 1.75 9.01c 27.39 3 3 1 10-3 /0.396 1.70 7.47c 32.87 4 4 1 10-3 /0.396 1.16 13.47 72.74 5 5 1 10-3 /0.396 1.01 16.93 108.35 6 2 1 0 1.97 27.22 81.66 7 3 1 0 1.85 24.33 97.32 8 2 1 10-3 /0.396 165 1.83 6.60 22.44 9 3 1 10-3 /0.396 1.56 10.93 48.09 10 2 1 0 2.47 33.65 100.95 11 3 1 0 1.90 30.76 123.04 12 2 1 0 180 1.41 26.43 79.29 a Total heat per g sample (PA- 12 +H 12 MDI) b Total heat per g H 12 MDI c Observed from the DSC curve melting phenomenon

圖3為顯示樣品1至5的恆溫掃描曲線比較圖,由圖3可知,PA-12與H 12-MDI在有添加觸媒狀況下,會呈現相當快速之放熱反應。另外,單獨觀察樣品1至5的恆溫掃描曲線比較圖時,可以觀察到樣品2及樣品3在放熱反應後有部分 PA-12 熔融之跡象,分別如圖4及圖5所示;又,圖6為顯示樣品1至樣品5中之PA-12與H 12-MDI進行反應的放熱量(Total heat per g sample (PA-12+H 12MDI) ),樣品2及樣品3的反應放熱量分別是9.01J/g及7.47J/g,而樣品1、樣品4及樣品5的反應放熱量分別是10.39J/g、13.47J/g、及16.93J/g,由此可知樣品2及樣品3中之PA-12與H 12-MDI的反應受到PA-12 熔融之干擾而呈現較低之放熱量。然而此現象卻未在樣品1、樣品4及樣品5中觀察到,因此PA-12/H 12-MDI 之重量比在以PA-12 粉體作為第一組合物之成分時扮演著重要的角色,較佳為採用PA-12/H 12-MDI = 2/1 或 3/1之配方。 Figure 3 is a comparison diagram showing the constant temperature scan curves of samples 1 to 5. It can be seen from Figure 3 that PA-12 and H 12 -MDI exhibit a relatively fast exothermic reaction when a catalyst is added. In addition, when observing the comparison charts of the constant temperature scanning curves of samples 1 to 5 alone, it can be observed that samples 2 and 3 have signs of partial melting of PA-12 after the exothermic reaction, as shown in Figure 4 and Figure 5, respectively; 6 shows the exothermic heat of the reaction between PA-12 and H 12 -MDI in samples 1 to 5 (Total heat per g sample (PA-12+H 12 MDI)), and the reaction exotherms of sample 2 and sample 3 are respectively are 9.01J/g and 7.47J/g, and the reaction heats of sample 1, sample 4, and sample 5 are 10.39J/g, 13.47J/g, and 16.93J/g, respectively. From this, it can be seen that sample 2 and sample 3 The reaction between PA-12 and H 12 -MDI was disturbed by the melting of PA-12 and exhibited a lower exothermic heat. However, this phenomenon was not observed in sample 1, sample 4 and sample 5, so the weight ratio of PA-12/H 12 -MDI plays an important role when using PA-12 powder as the component of the first composition , preferably using the formula of PA-12/H 12 -MDI = 2/1 or 3/1.

接著,請參閱圖7,其為顯示100%之PA-12、樣品2、及樣品6的恆溫掃描曲線比較圖;由圖7可知,在沒有H 12-MDI存在的狀況下,PA-12本身在160 ℃並無任何化學反應發生。另外,在有添加DBTDL/NMP的樣品2中,PA-12與H 12-MDI反應所釋放的總熱量較沒有添加DBTDL/NMP的樣品6所釋放的總熱量來得小,但是樣品2之反應速率較沒有添加DBTDL/NMP的樣品6來得快,這可能是因為部分 PA-12 熔融現象干擾所致。此現象在如圖8所示樣品3、及樣品7的恆溫掃描曲線比較圖、在如圖9所示之樣品8、及樣品10的恆溫掃描曲線比較圖、以及在如圖10所示樣品9、及樣品10的恆溫掃描曲線比較圖皆可觀察到,顯示添加觸媒(DBTDL/NMP)對於PA-12與H 12-MDI反應效果不會受到PA-12與H 12-MDI的比例或是反應溫度影響,能夠有效提升反應速率。 Next, please refer to FIG. 7 , which is a comparison diagram of the constant temperature scan curves of PA- 12 , sample 2, and sample 6 showing 100%; No chemical reaction occurs at 160°C. In addition, in sample 2 with DBTDL/NMP added, the total heat released by the reaction of PA-12 and H 12 -MDI is smaller than that of sample 6 without DBTDL/NMP added, but the reaction rate of sample 2 It is faster than sample 6 without DBTDL/NMP added, which may be due to some PA-12 melting phenomenon interference. This phenomenon is shown in the comparison chart of the constant temperature scanning curve of sample 3 and sample 7 shown in FIG. 8 , the comparison chart of the constant temperature scanning curve of sample 8 and sample 10 shown in FIG. 9 , and the comparison chart of sample 9 shown in FIG. 10 . , and the constant temperature scanning curve comparison chart of sample 10 can be observed, showing that the effect of adding catalyst (DBTDL/NMP) on the reaction of PA-12 and H 12 -MDI will not be affected by the ratio of PA-12 and H 12 -MDI or The reaction temperature can effectively improve the reaction rate.

又,請參閱圖11,其為顯示樣品6、樣品10、及樣品12的恆溫掃描曲線比較圖。由圖11可知,在樣品6、樣品10、及樣品12之中,以樣品12的反應最快、樣品10次之、樣品6最慢;因此,在沒有添加觸媒(DBTDL/NMP)的情況下,相同比例的PA-12與H 12-MDI反應速度會隨著反應溫度提高而增加。 《含有觸媒之第二組合物與聚醯胺PA-12粉體的非恆溫掃描分析》 Also, please refer to FIG. 11 , which is a comparison diagram showing the constant temperature scan curves of sample 6 , sample 10 , and sample 12 . It can be seen from Figure 11 that among sample 6, sample 10, and sample 12, sample 12 has the fastest reaction, sample 10 is the second, and sample 6 is the slowest; therefore, in the case of no catalyst (DBTDL/NMP) added Under the same ratio, the reaction rate of PA-12 and H 12 -MDI increases with the increase of reaction temperature. "Non-isothermal Scanning Analysis of the Second Composition Containing Catalyst and Polyamide PA-12 Powder"

將PA-12、H 12-MDI、及含有二月桂酸二丁基錫 (dibutyltin dilaurate (DBTDL))的N-甲基吡咯烷酮(NMP)以如表3所示之重量比混合均勻後,以示差掃描量熱儀(Differential Scanning Calorimetry, DSC)進行非恆溫掃描,並將所得數據結果記錄於表3。 After mixing PA-12, H 12 -MDI, and N-methylpyrrolidone (NMP) containing dibutyltin dilaurate (DBTDL) in the weight ratio shown in Table 3, the differential scanning amount A calorimeter (Differential Scanning Calorimetry, DSC) was used to perform non-isothermal scanning, and the obtained data results were recorded in Table 3.

表3 樣品 構成分 ( 重量比 ) 放熱 (Exothermic) 吸熱 (Endothermic) PA-12 第二組合物 Onset T () Peak T () Heat a(J/g) Heat b(J/g) Onset T () Peak T () Total melting heat (J/g) H 12MDI DBTDL /NMP 13 2 1 0 103.18 130.89 11.02 33.06 149.84 166.68 66.75 14 2 1 4×10 -3/ 0.396 61.53 98.75 62.87 213.76 141.88 163.65 64.36 15 3 1 0 101.06 132.62 18.61 74.44 150.13 168.09 72.61 16 3 1 4×10 -3/ 0.396 62.31 98.45 47.77 210.19 146.65 167.39 83.48 a每克樣品(PA-12+H 12MDI)之反應放熱量(Total heat per g sample) b每克H 12MDI之反應放熱量(Total heat per g H 12MDI)   table 3 sample Composition ( weight ratio ) Exothermic _ Endothermic _ PA-12 second composition Onset T () Peak T () Heat a (J/g) Heat b (J/g) Onset T () Peak T () Total melting heat (J/g) H 12 MDI DBTDL /NMP 13 2 1 0 103.18 130.89 11.02 33.06 149.84 166.68 66.75 14 2 1 4×10 -3 / 0.396 61.53 98.75 62.87 213.76 141.88 163.65 64.36 15 3 1 0 101.06 132.62 18.61 74.44 150.13 168.09 72.61 16 3 1 4×10 -3 / 0.396 62.31 98.45 47.77 210.19 146.65 167.39 83.48 aTotal heat per g sample (PA- 12 +H 12 MDI) bTotal heat per g H 12 MDI

請參閱表3之數據並配合參閱圖12及圖13,圖12為顯示樣品13、及樣品14的非恆溫掃描曲線比較圖,圖13為顯示樣品15、及樣品16的非恆溫掃描曲線比較圖。Please refer to the data in Table 3 together with FIGS. 12 and 13 . FIG. 12 is a comparison diagram showing the non-isothermal scanning curve of sample 13 and sample 14 , and FIG. 13 is a comparison diagram showing the non-isothermal scanning curve of sample 15 and sample 16 .

由表3、圖12及圖13可知,有添加觸媒(DBTDL/NMP)的樣品14、及樣品16呈現相當快速之放熱反應,其起始反應溫度(onset temperature)與放熱反應峰頂溫度(peak temperature)皆遠低於不含觸媒之樣品13、及樣品15。另外,由表3的數據結果也可觀察到,含有觸媒之樣品14及樣品16的總放熱量亦遠大於不含觸媒樣品13及15,這些實驗數據顯示添加觸媒(DBTDL/NMP)有助於3D噴墨列印速度。From Table 3, Figure 12 and Figure 13, it can be seen that the sample 14 and sample 16 with the added catalyst (DBTDL/NMP) exhibit a very fast exothermic reaction, and the onset temperature (onset temperature) and exothermic reaction peak temperature ( peak temperature) were much lower than those of Sample 13 and Sample 15 without catalyst. In addition, from the data results in Table 3, it can also be observed that the total heat release of samples 14 and 16 with catalyst is also much greater than that of samples 13 and 15 without catalyst. These experimental data show that the addition of catalyst (DBTDL/NMP) Contributes to 3D inkjet printing speed.

又,值得注意的是,含有觸媒之 樣品14、及樣品16中之PA-12的起始熔融溫度較不含觸媒樣品13、及樣品15降得更低,此結果證實觸媒的存在與否可用來調控高分子之機械性質。 《含有物性調整劑之第二組合物與聚醯胺PA-12粉體的恆溫掃描分析》 Also, it is worth noting that the initial melting temperature of PA-12 in sample 14 with catalyst and sample 16 is lower than that of sample 13 without catalyst and sample 15, which confirms the existence of catalyst Whether it can be used to control the mechanical properties of polymers. "The Constant Temperature Scanning Analysis of the Second Composition Containing a Physical Property Adjuster and Polyamide PA-12 Powder"

將PA-12、H 12-MDI、及PEG-400以如表4所示之重量比混合均勻,並以如表4所示的溫度條件下以示差掃描量熱儀(Differential Scanning Calorimetry, DSC)進行恆溫掃描後,將各樣品的放熱峰時間(peak time),及放熱量記錄於表4中。 PA-12, H 12 -MDI, and PEG-400 were mixed uniformly at the weight ratio shown in Table 4, and the temperature conditions were shown in Table 4 with Differential Scanning Calorimetry (Differential Scanning Calorimetry, DSC) After performing the isothermal scan, the exothermic peak time for each sample, and the exothermic heat, are recorded in Table 4.

表4 樣品 構成分 ( 重量比 ) 溫度 (℃ ) Peak time (min) Heat (J/g) a Heat (J/g) b PA-12 第二組合物 H 12-MDI PPG-400 17 2 0.40 0.60 160 1.92 36.91 110.73 18 2 0.40 0.60 165 1.97 49.27 147.81 19 2 0.24 0.76 180 1.99 12.68 38.04 20 2 0.40 0.60 2.05 22.94 68.82 21 2 0.56 0.44 1.77 25.68 77.04 22 2 1 0 1.41 26.43 79.29 a每克樣品(PA-12+H 12MDI+PPG-400)之反應放熱量(Total heat per g sample) b每克H 12MDI+PPG-400之反應放熱量(Total heat per g H 12MDI+PPG-400)   Table 4 sample Composition ( weight ratio ) temperature (℃ ) Peak time (min) Heat (J/g) a Heat (J/g) b PA-12 second composition H12 -MDI PPG-400 17 2 0.40 0.60 160 1.92 36.91 110.73 18 2 0.40 0.60 165 1.97 49.27 147.81 19 2 0.24 0.76 180 1.99 12.68 38.04 20 2 0.40 0.60 2.05 22.94 68.82 twenty one 2 0.56 0.44 1.77 25.68 77.04 twenty two 2 1 0 1.41 26.43 79.29 a Total heat per g sample (PA- 12 +H 12 MDI+PPG-400) b Total heat per g H 12 MDI+PPG-400 +PPG-400)

請參閱表4之數據並配合參閱圖14及圖15,圖14為顯示樣品17、樣品18、和樣品20的恆溫掃描曲線比較圖,圖15為顯示樣品19至樣品22的恆溫掃描曲線比較圖。Please refer to the data in Table 4 in conjunction with FIGS. 14 and 15 . FIG. 14 is a comparison chart showing the constant temperature scan curves of sample 17, sample 18, and sample 20, and FIG. 15 is a comparison chart showing the constant temperature scan curves of samples 19 to 22. .

由表4、及圖14可知,樣品17、樣品18、和樣品20的放熱峰時間依序分別為1.92、1.97、和1.99分鐘,顯示在沒有添加觸媒的情形下,仍能夠使反應在2分鐘內進行。另外,樣品20的反應放熱量為22.94J/g,明顯低於樣品17和樣品18的36.91 J/g和49.27 J/g,可能是部分 PA-12 熔融之干擾而造成此結果。From Table 4 and Figure 14, it can be seen that the exothermic peak times of Sample 17, Sample 18, and Sample 20 are 1.92, 1.97, and 1.99 minutes, respectively, indicating that the reaction can still be made in 2 without adding a catalyst. within minutes. In addition, the reaction exotherm of sample 20 was 22.94 J/g, which was significantly lower than the 36.91 J/g and 49.27 J/g of sample 17 and 18, which may be caused by the interference of partial melting of PA-12.

再者,由表4及圖15可知,和樣品22的結果相比,樣品19至樣品21的反應速率皆呈現較低之反應速率;並且隨著PPG-400的含量增加時,反應速率以及總放熱量皆隨之明顯下降。Furthermore, it can be seen from Table 4 and Figure 15 that, compared with the results of sample 22, the reaction rates of samples 19 to 21 all showed lower reaction rates; and as the content of PPG-400 increased, the reaction rates and total The calorific value decreased significantly.

接著,觀察反應完畢之樣品17至22的成型品外觀,樣品17與樣品18的成型品結構鬆散,無法延伸;而在樣品19至22在相同的溫度條件(180℃)下,反應完畢的樣品的延伸性會隨著PEG-400含量增加而增加。由此可知,在第二組合物中進一步添加物性調整劑(如PEG-400)能夠改變樣品的物性,藉以列印產生多用途之複合高分子材料。 《含有觸媒之第二組合物與熱塑性聚氨酯TPU(粉體)的恆溫掃描分析》 Next, the appearance of the molded products of the samples 17 to 22 after the reaction was observed, the molded products of the samples 17 and 18 were loose in structure and could not be extended; while the samples 19 to 22 were under the same temperature condition (180°C), the samples after the reaction were completed. The extensibility of PEG-400 increases with increasing PEG-400 content. From this, it can be seen that further adding a physical property modifier (eg PEG-400) to the second composition can change the physical properties of the sample, thereby producing a multi-purpose composite polymer material by printing. "The Constant Temperature Scanning Analysis of the Second Composition Containing Catalyst and Thermoplastic Polyurethane TPU (Powder)"

首先,確認本發明中所使用的TPU高分子粉體熔點。以示差掃描熱分析儀(DSC) 對於TPU粉體進行非恆溫掃描,使用之升溫掃描速度為5 ℃/min,從室溫掃描到250 ℃,且須先以相同條件對樣品作退火熱處理 (annealing) 的動作。TPU之非恆溫掃描DSC曲線圖如圖16所示。而樣品經退火後所獲得的聚醯胺熱性質數據記錄於表5。First, the melting point of the TPU polymer powder used in the present invention was confirmed. Differential scanning calorimetry (DSC) was used to scan the TPU powder at a non-constant temperature, and the scanning speed was 5 °C/min, from room temperature to 250 °C, and the samples had to be annealed under the same conditions. ) Actions. The non-isothermal scanning DSC curve of TPU is shown in FIG. 16 . And the thermal property data of polyamide obtained after the sample is annealed are recorded in Table 5.

表5 樣品 Onset Tm (℃) Peak Tm (℃) Total melting heat (J/g) TPU 113 143 6.16 table 5 sample Onset Tm (℃) Peak Tm (℃) Total melting heat (J/g) TPU 113 143 6.16

從表5圖17進行熱性質分析可得知,TPU之熔點約為143 ℃。此部分實驗結果可幫助設計3D列印過程使用之樣品預熱溫度,因此後續以90 ℃作為第一溫度進行TPU粉體與第二組合物放熱聚合反應之分析。From Table 5 and Figure 17, the thermal property analysis shows that the melting point of TPU is about 143°C. The experimental results in this part can help design the sample preheating temperature used in the 3D printing process. Therefore, 90 °C was used as the first temperature for the analysis of the exothermic polymerization reaction of the TPU powder and the second composition.

接著,將TPU、H 12-MDI、及含有二月桂酸二丁基錫 (dibutyltin dilaurate (DBTDL))的N-甲基吡咯烷酮(NMP)以如表6所示之重量比混合均勻,並以90 ℃的溫度條件以示差掃描量熱儀(Differential Scanning Calorimetry, DSC)進行恆溫掃描後,將各樣品的放熱峰時間(peak time),及放熱量記錄於表6。 Next, TPU, H 12 -MDI, and N-methylpyrrolidone (NMP) containing dibutyltin dilaurate (DBTDL) were mixed uniformly in the weight ratio shown in Table 6, and the mixture was heated at 90° C. Temperature Conditions After constant temperature scanning was performed with a Differential Scanning Calorimetry (DSC), the exothermic peak time (peak time) and exothermic heat of each sample were recorded in Table 6.

表6 樣品 構成分 ( 重量比 ) T ( ) Peak time (min) Heat (J/g) a Heat (J/g) b TPU 第二組合物 H 12MDI DBTDL/NMP 23 1 1 4×10 -3/0.396 90 0.80 36.49 87.58 24 2 1 4×10 -3/0.396 0.93 52.17 177.38 25 3 1 4×10 -3/0.396 1.07 42.31 186.16 a每克樣品(TPU+H 12MDI)之反應放熱量(Total heat per g sample) b每克H 12MDI之反應放熱量(Total heat per g H 12MDI)   Table 6 sample Composition ( weight ratio ) T ( ) Peak time (min) Heat (J/g) a Heat (J/g) b TPU second composition H 12 MDI DBTDL/NMP twenty three 1 1 10-3 /0.396 90 0.80 36.49 87.58 twenty four 2 1 10-3 /0.396 0.93 52.17 177.38 25 3 1 10-3 /0.396 1.07 42.31 186.16 a Total heat per g sample (TPU+H 12 MDI) b Total heat per g H 12 MDI

請參閱表6之數據並配合參閱圖17,圖17為顯示樣品23、樣品24、和樣品25的恆溫掃描曲線比較圖。Please refer to the data in Table 6 in conjunction with FIG. 17 . FIG. 17 is a comparison diagram showing the isothermal scan curves of Sample 23, Sample 24, and Sample 25.

由表6及圖17可知,樣品23、24、及25 的放熱鋒時間分別為0.8、0.93、及1.07分鐘,皆短於前述樣品1至22中以PA-12和H 12-MDI的反應時間,而且所需的反應溫度更低,顯示以TPU、H 12-MDI在有添加觸媒進行反應的情形下,其效果比以PA-12和H 12-MDI的反應效果更佳,且更節省能源。 It can be seen from Table 6 and Figure 17 that the exothermic front times of samples 23, 24, and 25 are 0.8, 0.93, and 1.07 minutes, respectively, which are all shorter than the reaction times of PA-12 and H 12 -MDI in the aforementioned samples 1 to 22 , and the required reaction temperature is lower, showing that the reaction with TPU and H 12 -MDI is better and more economical than the reaction with PA-12 and H 12 -MDI when a catalyst is added for the reaction. energy.

接著,根據上述分析結果來進行本發明之3D噴墨列印試驗。 《製備例1至4》(製備第二組合物) Next, according to the above analysis results, the 3D inkjet printing test of the present invention is carried out. "Preparation Examples 1 to 4" (preparation of the second composition)

將H 12-MDI、丁桐(MEK)、含有1%之二月桂酸二丁基錫 (dibutyltin dilaurate (DBTDL))的N-甲基吡咯烷酮(NMP)、以及PEG-400以如表7所示之重量百分比混合均勻,分別獲得第二組合物P1、P2、P3、及P4。 H 12 -MDI, butitrone (MEK), N-methylpyrrolidone (NMP) containing 1% dibutyltin dilaurate (DBTDL), and PEG-400 were combined in the weights shown in Table 7. The percentages were mixed uniformly to obtain the second compositions P1, P2, P3, and P4, respectively.

表7   製備例1 製備例2 第二組合物 P1 P2 H 12-MDI(wt%) 30 15 MEK(wt%) 70 70 1%DBTDL/NMP(wt%) 0 0 PEG-400(wt%) 0 15 物性 黏度(cP) 1.59 0.66 《實施例1及2》 Table 7 Preparation Example 1 Preparation Example 2 second composition P1 P2 H 12 -MDI (wt%) 30 15 MEK(wt%) 70 70 1%DBTDL/NMP(wt%) 0 0 PEG-400(wt%) 0 15 physical property Viscosity (cP) 1.59 0.66 "Examples 1 and 2"

在實施例1及2中使用聚酰胺12(簡稱PA-12;供應商:Sinterit;型號:PA12 Smooth;粉體內含有碳黑,粒徑範圍20-100 µm、平均粒徑38 µm、熔點182 ℃、軟化點170 ℃)作為第一組合物之成分。使用的3D列印機台是以研能科技公司的ComeTrue T10機台系統為基礎進行改裝,所使用之噴印模組為熱泡式噴墨技術,是以興立台公司之 ST-201 固定式噴碼機做為驅動器,搭配熱泡式噴頭和墨匣一體的 SINLETAL INK 51645A 之熱泡式噴頭墨水匣,並以 4 支近紅外光加熱器(電壓110 V、功率max 1 kW、波長 1 µm、有效發熱區長度80 mm)進行加熱動作。Polyamide 12 (PA-12 for short) was used in Examples 1 and 2; Supplier: Sinterit; Model: PA12 Smooth; the powder contained carbon black, with a particle size range of 20-100 µm, an average particle size of 38 µm, and a melting point of 182 °C , softening point 170 ℃) as a component of the first composition. The 3D printing machine used is modified on the basis of the ComeTrue T10 machine system of Yanneng Technology Company. As the driver, it is equipped with the SINLETAL INK 51645A hot-bubble printhead ink cartridge which integrates the hot-bubble printhead and the ink cartridge, and uses 4 near-infrared light heaters (voltage 110 V, power max 1 kW, wavelength 1 µm, effective heating area length 80 mm) for heating operation.

將PA-12放置於3D列印機台的成型平台中,並以滾輪來回滾動使PA-12形成厚度均勻的主體層,該主體層的厚度及單位密度為如表8所示。然後再以近紅外光加熱器將主體層加熱至如表8所示之第一溫度。The PA-12 was placed on the forming platform of the 3D printing machine, and rolled back and forth with a roller to form the PA-12 into a main layer with a uniform thickness. The thickness and unit density of the main layer are shown in Table 8. Then, the main body layer was heated to the first temperature shown in Table 8 with a near-infrared light heater.

接著,將如表8所示之第二組合物以熱泡式噴頭均勻噴塗至該主體層表面的特定區域以進行交聯聚合放熱反應,該特定區域的面積為25mm×25mm,噴塗量為20mg,在該特定區域中之PA-12與第二組合物中之H 12-MDI的重量比(PA-12:H 12-MDI)為67:33。 Next, the second composition shown in Table 8 was uniformly sprayed onto a specific area on the surface of the main body layer with a hot-bubble nozzle to carry out cross-linking polymerization exothermic reaction, the area of the specific area was 25mm×25mm, and the spraying amount was 20mg , the weight ratio of PA-12 in the specific region to H 12 -MDI in the second composition (PA-12:H 12 -MDI) was 67:33.

經過如表8所示之反應時間後,該主體層中之該特定區域變成熔融態,然後關閉該近紅外光加熱器,使該特定區域將降溫並固化,形成單層立體物件。反覆上述步驟三次後獲得成品S1至S4,分別記錄完成成品S1至S4的所需時間後換算出列印速度,然後測試成品S1至S4的拉伸彈性模數、斷裂強度及斷裂伸長率,並將數值填入表8中。 《比較例1》 After the reaction time as shown in Table 8, the specific area in the main body layer becomes molten, and then the near-infrared light heater is turned off, so that the specific area will be cooled and solidified to form a single-layer three-dimensional object. After repeating the above steps three times, the finished products S1 to S4 are obtained, the time required to complete the finished products S1 to S4 is recorded respectively, and then the printing speed is converted, and then the tensile modulus of elasticity, breaking strength and elongation at break of the finished products S1 to S4 are tested, and Fill in the values in Table 8. "Comparative Example 1"

在比較例1中使用與前述實施例1及2相同的PA-12作為第一組合物之成分進行3D列印,但未使用第二組組合物P1或第二組合物P2,其他3D列印條件與實施例1相同,進而獲得成品T1,記錄完成成品T1的所需時間後換算出列印速度。接著,測試成品T1的拉伸彈性模數、斷裂強度及斷裂伸長率,並將數值填入表8中。In Comparative Example 1, the same PA-12 as in the previous Examples 1 and 2 was used as the component of the first composition for 3D printing, but the second composition P1 or the second composition P2 was not used, and other 3D printing was carried out. The conditions are the same as in Example 1, and a finished product T1 is obtained, and the printing speed is converted after recording the time required to complete the finished product T1. Next, the tensile modulus of elasticity, breaking strength and elongation at break of the finished product T1 were tested, and the values were filled in Table 8.

表8   比較例1 實施例1 實施例2 第一組合物 PA-12 PA-12 PA-12 第二組合物 - P1 P2 3D列印條件 主體層厚度(mm) 0.1 0.1 0.1 主體層單位密度(g/cm 3) 0.45 0.45 0.45 第二組合物噴印量 - 20mg 20mg 噴印電壓(V) - 11.04 11.04 噴印脈衝(µs) - 4 4 噴印解析度(dpi) - 600 600 第一溫度(℃) 180 170 170 反應時間(s) 40 30 30 列印速度(mm/s) - 15 15 成品 T1 S1 S2 成品機械特性 彈性模數(MPa) 141 47 68 極限抗拉強度強度(MPa) 14.41 3.17 14.6 斷裂伸長率(%) 10.18 6.66 21.22 Table 8 Comparative Example 1 Example 1 Example 2 first composition PA-12 PA-12 PA-12 second composition - P1 P2 3D printing conditions Main layer thickness (mm) 0.1 0.1 0.1 Main layer unit density (g/cm 3 ) 0.45 0.45 0.45 Second composition print volume - 20mg 20mg Printing voltage (V) - 11.04 11.04 Print Pulse (µs) - 4 4 Printing resolution (dpi) - 600 600 The first temperature (℃) 180 170 170 Response time (s) 40 30 30 Printing speed (mm/s) - 15 15 finished product T1 S1 S2 Finished Mechanical Properties Elastic modulus (MPa) 141 47 68 Ultimate tensile strength (MPa) 14.41 3.17 14.6 Elongation at break (%) 10.18 6.66 21.22

由上表8的結果可知,成品T1成型後的極限抗拉強度為14.41Mpa、延伸率為10.18%;而成品S2成型後的極限抗拉強度為14.6Mpa與對照組相近,但成品S2的延伸率為21.22%,較對照組大幅提升約208%。另外,成品S1成型後的極限抗拉強度為3.17Mpa,較成品T1降低約78%、樣品22的延伸率為6.66%,較成品T1降低約35%。由於成品S1與成品S2在極限抗拉強度與延伸率皆有顯著差異,顯示在第二組合物中進一步添加物性調整劑(如PEG-400)能夠改變樣品的物性,藉以列印產生多用途之複合高分子材料。另外,請參閱圖18A至C,圖18A為PA12尚未被加熱時的SEM圖、圖18C為成品T1的SEM圖、及圖18C成品S2的SEM圖;從圖18B可看到成品T1的型態與圖18A中未經加熱的PA12類似,並無明顯燒結的情形發生,而從圖18B可看到成品S2有明顯燒結的情形,進而改變整體機械性質。From the results in Table 8 above, it can be seen that the ultimate tensile strength of the finished product T1 after molding is 14.41Mpa, and the elongation is 10.18%; while the ultimate tensile strength of the finished product S2 after molding is 14.6Mpa, which is similar to the control group, but the extension of the finished product S2 is 14.6Mpa. The rate was 21.22%, a significant increase of about 208% compared with the control group. In addition, the ultimate tensile strength of the finished product S1 after molding is 3.17Mpa, which is about 78% lower than that of the finished product T1, and the elongation of the sample 22 is 6.66%, which is about 35% lower than that of the finished product T1. Since the ultimate tensile strength and elongation of the finished product S1 and the finished product S2 are significantly different, it shows that further adding a physical property modifier (such as PEG-400) to the second composition can change the physical properties of the sample, so as to produce a multi-purpose composite polymer materials. In addition, please refer to FIGS. 18A to C, FIG. 18A is the SEM image of the PA12 when the PA12 has not been heated, FIG. 18C is the SEM image of the finished product T1, and FIG. 18C is the SEM image of the finished product S2; from FIG. 18B, the shape of the finished product T1 can be seen Similar to the unheated PA12 in FIG. 18A , no obvious sintering occurs, and it can be seen from FIG. 18B that the finished product S2 has obvious sintering, thereby changing the overall mechanical properties.

另外,在實施例1及實施例2中,僅需要加熱至170℃即可進行3D列印,而比較例1則需要加熱至180℃,顯示本發明之3D列印方法能夠有效利用化學反應熱作為熔化該主體層的一部份熱源,進而降低外部加熱源的熱量以達到節能之作用。In addition, in Example 1 and Example 2, the 3D printing only needs to be heated to 170°C, while the comparative example 1 needs to be heated to 180°C, which shows that the 3D printing method of the present invention can effectively utilize the heat of chemical reaction As a part of the heat source for melting the main body layer, the heat of the external heating source is reduced to achieve the effect of energy saving.

上面結合附圖對本發明的實施例進行了描述,但是本發明並不局限於上述的具體實施方式,上述的具體實施方式僅僅是示意性的,而不是限制性的,本領域的普通技術人員在本發明的啟示下,在不脫離本發明宗旨和申請專利範圍所保護的範圍情況下,還可做出很多形式,這些均屬於本發明的保護之內。The embodiments of the present invention have been described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific embodiments, which are merely illustrative rather than restrictive. Under the inspiration of the present invention, without departing from the spirit of the present invention and the scope protected by the scope of the patent application, many forms can be made, which all belong to the protection of the present invention.

S1~S4:步驟S1~S4: Steps

圖1為顯示本發明之高速3D噴墨列印的標準流程圖。 圖2 為顯示本發明之實施例中PA-12之非恆溫掃描曲線比較圖。 圖3為顯示本發明之樣品1至樣品5的恆溫掃描曲線比較圖。 圖4為顯示本發明之樣品2的恆溫掃描曲線比較圖。 圖5為顯示本發明之樣品3的恆溫掃描曲線比較圖。 圖6為顯示本發明之樣品1至樣品5中PA-12與H12-MDI進行反應的放熱量比較圖。 圖7為顯示本發明之樣品2、及樣品6的恆溫掃描曲線比較圖。 圖8為顯示本發明之樣品3、及樣品7的恆溫掃描曲線比較圖。 圖9為顯示本發明之樣品8、及樣品10的恆溫掃描曲線比較圖。 圖10為顯示本發明之樣品9、及樣品10的恆溫掃描曲線比較圖。 圖11為顯示本發明之樣品6、樣品10、及樣品12的恆溫掃描曲線比較圖。 圖12為顯示本發明之樣品13、及樣品14的非恆溫掃描曲線比較圖。 圖13為顯示本發明之樣品15、及樣品16的恆溫掃描曲線比較圖。 圖14為顯示本發明之樣品17、樣品18、和樣品20的恆溫掃描曲線比較圖。 圖15為顯示本發明之樣品19至樣品22的恆溫掃描曲線比較圖。 圖16為顯示本發明之實施例中TPU之非恆溫掃描曲線比較圖 圖17為顯示本發明之樣品23、樣品24、和樣品25的恆溫掃描曲線比較圖。 圖18A至C為分別顯示PA12、成品T1、成品S2的SEM圖。 FIG. 1 is a standard flow chart showing the high-speed 3D inkjet printing of the present invention. FIG. 2 is a graph showing the comparison of non-isothermal scanning curves of PA-12 in the embodiment of the present invention. FIG. 3 is a comparison diagram showing the constant temperature scan curves of samples 1 to 5 of the present invention. FIG. 4 is a comparison diagram showing the constant temperature scanning curve of the sample 2 of the present invention. FIG. 5 is a comparison diagram showing the constant temperature scanning curve of the sample 3 of the present invention. FIG. 6 is a graph showing the comparison of the exothermic heat of the reaction of PA-12 and H12-MDI in samples 1 to 5 of the present invention. FIG. 7 is a graph showing the comparison of the constant temperature scan curves of Sample 2 and Sample 6 of the present invention. FIG. 8 is a graph showing the comparison of the constant temperature scan curves of Sample 3 and Sample 7 of the present invention. FIG. 9 is a graph showing the comparison of the constant temperature scan curves of the sample 8 and the sample 10 of the present invention. FIG. 10 is a graph showing the comparison of the constant temperature scan curves of the sample 9 and the sample 10 of the present invention. FIG. 11 is a graph showing the comparison of constant temperature scan curves of Sample 6, Sample 10, and Sample 12 of the present invention. FIG. 12 is a graph showing the comparison of the non-isothermal scanning curves of the sample 13 and the sample 14 of the present invention. FIG. 13 is a graph showing the comparison of the constant temperature scan curves of the sample 15 and the sample 16 of the present invention. FIG. 14 is a graph showing the comparison of isothermal scan curves of Sample 17, Sample 18, and Sample 20 of the present invention. FIG. 15 is a graph showing the comparison of isothermal scanning curves of samples 19 to 22 of the present invention. FIG. 16 is a comparison diagram showing the non-constant temperature scanning curve of TPU in the embodiment of the present invention FIG. 17 is a graph showing the comparison of isothermal scan curves of Sample 23, Sample 24, and Sample 25 of the present invention. 18A to C are SEM images showing PA12, finished product T1, and finished product S2, respectively.

S1~S4:步驟 S1~S4: Steps

Claims (10)

一種3D噴墨列印方法,其係包括: 預熱步驟:使用一外部加熱源將一第一組合物所構成之主體層加熱至一第一溫度;該主體層的厚度為在10μm至500μm之間,單位密度為在0.1至1.0g/cm 3,該第一溫度為小於該第一組合物的熔點; 升溫步驟:在該第一溫度下將一第二組合物塗覆於該主體層之表面進行交聯聚合放熱反應,使該主體層升溫至第二溫度而成為熔融態;以及 冷卻步驟:使熔融態的該主體層冷卻降溫並固化成型;其中 該第一組合物係至少包含有成型材,該成型材為以化學式(Ⅰ) 所代表的化學結構之化合物A、以化學式(Ⅱ)所代表的化學結構之化合物B、或多胺類化合物:
Figure 03_image001
(Ⅰ);
Figure 03_image003
(Ⅱ); 在上述化學式(Ⅰ)、(Ⅱ)中,R 1、R 2、R 3、及R 4係各自獨立地表示烷基、或芳烴基; 該第二組合物至少包括具有O=C=N-官能基的化合物C,並且在該主體層中之該成型材相對於該化合物C的重量比為在1:1至10:1之間; 該列印方法是利用化學反應熱作為熔化該主體層的一部份熱源,藉此降低該外部加熱源的熱量。
A 3D inkjet printing method, comprising: preheating step: using an external heating source to heat a main body layer composed of a first composition to a first temperature; the thickness of the main body layer is between 10 μm and 500 μm Between 0.1 and 1.0 g/cm 3 , the unit density is between 0.1 and 1.0 g/cm 3 , and the first temperature is less than the melting point of the first composition; the temperature rise step: apply a second composition on the main body layer at the first temperature A cross-linking polymerization exothermic reaction is carried out on the surface, so that the main body layer is heated to a second temperature to become a molten state; and a cooling step: the main body layer in the molten state is cooled and cooled to solidify and form; wherein the first composition at least comprises a component Profile, which is compound A with chemical structure represented by chemical formula (I), compound B with chemical structure represented by chemical formula (II), or polyamine compound:
Figure 03_image001
(I);
Figure 03_image003
(II); In the above chemical formulas (I) and (II), R 1 , R 2 , R 3 , and R 4 each independently represent an alkyl group or an aromatic hydrocarbon group; The second composition at least comprises a group having O= C=N-functional compound C, and the weight ratio of the molding material to the compound C in the main body layer is between 1:1 and 10:1; the printing method uses the heat of chemical reaction as a A portion of the heat source of the bulk layer is melted, thereby reducing the heat of the external heat source.
如請求項1所記載之3D噴墨列印方法,其中該第一溫度與該第一組合物的熔點的差值為在10℃至100℃之間。The 3D inkjet printing method as claimed in claim 1, wherein the difference between the first temperature and the melting point of the first composition is between 10°C and 100°C. 如請求項1所記載之3D噴墨列印方法,其中該第二溫度為大於該第一組合物的熔點。The 3D inkjet printing method as claimed in claim 1, wherein the second temperature is greater than the melting point of the first composition. 如請求項1所記載之3D噴墨列印方法,其中該第二組合物進一步包含選自催化劑、物性調整劑、分散劑、助溶劑、及著色劑中之至少一種。The 3D inkjet printing method according to claim 1, wherein the second composition further comprises at least one selected from the group consisting of catalysts, physical property modifiers, dispersants, cosolvents, and colorants. 如請求項4所記載之3D噴墨列印方法,其中該催化劑為二月桂酸二丁基錫(DBTDL)。The 3D inkjet printing method according to claim 4, wherein the catalyst is dibutyltin dilaurate (DBTDL). 如請求項4所記載之3D噴墨列印方法,其中該物性調整劑為選自多元醇類、聚醚多元醇類、聚酯多元醇類、及其組合中之至少一種。The 3D inkjet printing method according to claim 4, wherein the physical property modifier is at least one selected from polyols, polyether polyols, polyester polyols, and combinations thereof. 請求項1所記載之3D噴墨列印方法,其中在該升溫步驟中,是以平塗法、濺鍍法、噴塗法、流延塗布法、輥塗法、及條塗法中之任一種方法將該第二組合物塗布於該第一組合物的表面。The 3D inkjet printing method according to claim 1, wherein in the heating step, any one of a flat coating method, a sputtering method, a spray coating method, a casting coating method, a roll coating method, and a bar coating method is used The method coats the second composition on the surface of the first composition. 一種用於3D列印之套組,其係包含有: 第一組合物,其為至少包含有一成型材,該成型材為以化學式(Ⅰ) 所代表的化學結構之化合物A、以化學式(Ⅱ)所代表的化學結構之化合物B、或多胺類化合物:
Figure 03_image001
(Ⅰ);
Figure 03_image003
(Ⅱ); 在上述化學式(Ⅰ)、(Ⅱ)中,R 1、R 2、R 3、及R 4係各自獨立地表示烷基、或芳烴基;以及 第二組合物,該第二組合物至少包括具有O=C=N-官能基的化合物C,並且該第一組合物中之該成型材相對於該第二組合物中之該化合物C的重量比為在1:1至10:1之間。
A kit for 3D printing, comprising: a first composition, which comprises at least one molding material, the molding material is a compound A with a chemical structure represented by chemical formula (I), and a compound A with chemical formula (II) ) represented by the chemical structure of compound B, or polyamine compounds:
Figure 03_image001
(I);
Figure 03_image003
(II); In the above chemical formulas (I) and (II), R 1 , R 2 , R 3 , and R 4 each independently represent an alkyl group or an aromatic hydrocarbon group; and a second composition, the second combination The compound at least includes a compound C having an O=C=N-functional group, and the weight ratio of the molding material in the first composition to the compound C in the second composition is 1:1 to 10: between 1.
如請求項8所記載之用於3D列印之套組,其中該第二組合物進一步包含有選自催化劑、物性調整劑、分散劑、助溶劑、及著色劑中之至少一種成分。The kit for 3D printing according to claim 8, wherein the second composition further comprises at least one component selected from the group consisting of catalysts, physical property modifiers, dispersants, cosolvents, and colorants. 如請求項9所記載之用於3D列印之套組,其中該催化劑為二月桂酸二丁基錫(DBTDL),該物性調整劑為多元醇類、聚醚多元醇類、聚酯多元醇類、及其組合中之至少一種。The kit for 3D printing according to claim 9, wherein the catalyst is dibutyltin dilaurate (DBTDL), and the physical property modifier is polyols, polyether polyols, polyester polyols, and at least one of its combinations.
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