TW202226910A - Electronic device - Google Patents

Abstract

The present invention discloses an electronic device, which includes a supporting board, an electrical board and a plurality of electronic units. The supporting board is provided with a circuit layer. The electrical board has a board body, a plurality of through holes passing through the board body, an electrical layer arranged on the board body, and a plurality of primary conductive elements respectively arranged in the through holes. The board body defines a corresponding first surface and a second surface. The through holes connects the first surface and the second surface of the board body. The primary conductive elements are electrically connected the electrical layer to the circuit layer of the supporting board. The electronic units are arranged on the first surface of the board body. Each electronic unit and one of the through holes partially overlap along a projection direction of the electrical board. Each electronic unit has an electronic component and a secondary conductive element electrically connects the electronic component to the electrical layer; wherein the secondary conductive elements of the electronic units and the primary conductive elements of the electrical board are arranged in dislocation along the projection direction of the electrical board.

Description

electronic device

The present invention relates to an electronic device, in particular to an electronic device which is different from the traditional electrical connection technology.

In the field of electronic device manufacturing, Surface Mount Technology (SMT) is a technology for soldering electronic parts on the surface of, for example, Printed Circuit Board (PCB). Reduce the volume of electronic products and achieve the purpose of being lighter, thinner and shorter.

Traditionally, to solder electronic parts (such as surface mount components) to the contacts of the circuit board, it is mainly done through solder paste (Solder Paste), as long as the solder paste is printed on the solder pads ( or pad), and then place the electronic parts on the solder pads, so that the solder feet of the electronic parts correspond to the position of the solder paste, and then melt the solder paste into a liquid through a high-temperature reflow oven, and the liquid solder paste will be covered. The solder legs of electronic parts can be soldered on the circuit board after cooling.

The purpose of the present invention is to provide an electronic device which is different from the traditional electrical connection technology.

To achieve the above objective, an electronic device according to the present invention includes a support plate, an electrical plate and a plurality of electronic units. The support board is provided with a circuit layer; the electrical board has a board body, a plurality of through holes penetrating the board body, an electrical layer arranged on the board body, and a plurality of main conductive parts respectively arranged in the through holes, The board body defines a corresponding first surface and a second surface, the through holes communicate with the first surface and the second surface of the board body, and the main conductive members electrically connect the electrical layer to the circuit layer of the support board; the Some electronic units are arranged on the first surface of the board body, each electronic unit and one of the through holes are partially overlapped along a projection direction of the electrical board, each electronic unit has an electronic component, and is electrically connected to the electronic component. The primary conductive parts of the electrical layer; wherein, the secondary conductive parts of the electronic units and the main conductive parts of the electrical board are arranged in a dislocation along the projection direction of the electrical board.

In one embodiment, each of the electronic units has a plurality of corners, and one of the corners of each of the electronic units is covered by one of the through holes along the projection direction of the electrical board.

In one embodiment, each of the electronic units has a plurality of corners, and one of the through holes covers one of the corners of the plurality of the electronic units along the projection direction of the electrical board.

In one embodiment, the electronic units are a plurality of electronic structures, each electronic structure has a carrier board, and the electronic components are arranged on the carrier board.

In one embodiment, the electronic units constitute an electronic structure, the electronic structure has a carrier board, and the electronic components of the electronic units are disposed on the carrier board.

In one embodiment, the electronic units are arranged in an mxn matrix and cover at least one through hole of the through holes along the projection direction of the electrical plate, wherein m and n may be equal or unequal positive integers.

In one embodiment, the electronic units are arranged in a 2×2 matrix.

In one embodiment, the number of secondary conductive members of each electronic unit is multiple, and each secondary conductive member is electrically connected to the corresponding electronic element to the electrical layer.

In one embodiment, there are multiple electronic components of each electronic unit.

In one embodiment, the electronic component is a micro-optoelectronic chip.

In one embodiment, the electronic element is a driving element.

In one embodiment, the electrical board further includes a plurality of driving elements, and the driving elements respectively correspond to the electronic elements of the electronic units.

In one embodiment, the number of electrical boards is multiple.

In one embodiment, the carrier board is a rigid board, a flexible board, or a composite board.

In one embodiment, the carrier plate is a transparent plate.

In one embodiment, the ratio of the projected area of the electronic unit to the projected area of the electronic component is not less than 5.

In one embodiment, the electronic components define a component width no greater than 80 mils.

In one embodiment, the electronic components define a component width of no greater than 12 mils.

In one embodiment, the electronic components define a component width of no less than 0.005 millimeters.

In one embodiment, the carrier plate defines a working surface for disposing electronic components and a connecting surface corresponding to the working surface, the carrier plate has a conductive layer, and a through hole connecting the working surface and the connecting surface, and the secondary conductive member passes through the connecting surface. The through holes electrically connect the conductive layer to the electrical layer of the electrical plate.

In one embodiment, the board bodies of the support board and the electrical board are respectively rigid boards, flexible boards, or composite boards.

In one embodiment, the board body of the support board or/and the electrical board is a transparent board.

To achieve the above objective, an electronic device according to the present invention includes a support plate, an electrical plate and a plurality of electronic units. The support board is arranged with a circuit layer. The electrical board has a board body, an electrical layer disposed on the board body, and a plurality of main conductive members electrically connected to the electrical layers respectively; wherein the board body defines a corresponding first surface and a second surface, The main conductive members are electrically connected to the electrical layer to the circuit layer of the support board. A plurality of electronic units are arranged on the first surface of the board body, and each electronic unit and one of the main conductive elements are partially overlapped along a projection direction of the electrical board; wherein, each electronic unit has an electronic component and an electrical component. The electronic components are connected to the primary conductive parts of the electrical layer; wherein, the secondary conductive parts of the electronic units and the main conductive parts of the electrical board are arranged in a dislocation along the projection direction of the electrical board.

In one embodiment, the electronic unit is a surface mount component.

In one embodiment, each electronic unit has a plurality of corners, and one of the corners of each electronic unit is covered by one of the main conductive members along the projection direction of the electrical board.

In one embodiment, each electronic unit has a plurality of corners, and one of the main conductive members covers one of the corners of the plurality of electronic units along the projection direction of the electrical board.

In one embodiment, the electronic units are a plurality of electronic structures, each electronic structure has a carrier board, and the electronic components are arranged on the carrier board.

In one embodiment, the electronic components are micro-optoelectronic chips.

In one embodiment, the electronic unit further includes an encapsulation layer covering the electronic components.

In one embodiment, the electronic units constitute an electronic structure, the electronic structure has a carrier board, and the electronic components of the electronic units are disposed on the carrier board.

In one embodiment, the electronic units are arranged in an mxn matrix and cover at least one main conductive element along the projection direction of the electrical plate, wherein m and n can be equal or unequal positive integers.

In one embodiment, the electronic units are arranged in a 4×4 matrix.

In one embodiment, the number of secondary conductive members of each electronic unit is multiple, and each secondary conductive member is electrically connected to the corresponding electronic element to the electrical layer.

In one embodiment, the secondary conductive members of each electronic unit are solder balls.

In one embodiment, the electrical board further includes a plurality of driving elements, and the driving elements respectively correspond to the electronic elements of the electronic units.

In one embodiment, the driving element is a thin film transistor (TFT) or an integrated circuit (IC).

As mentioned above, in the electronic device of the present invention, the electrical layer of the electrical board is electrically connected to the circuit layer of the support board through the main conductive member, and the electronic unit is electrically connected to the conductive layer of the carrier board and the electrical board through the secondary conductive member the electrical layer; the electronic units are arranged on the first surface of the board body of the electrical board, and each electronic unit and one of the main conductive parts of the electrical board are partially overlapped along the projection direction of the electrical board; and The structural design that the secondary conductive parts of the electronic units and the main conductive parts of the electrical board are dislocated along the projection direction of the electrical board makes the electronic device of the present invention a kind of electronic device different from the traditional electrical connection technology. electronic product.

The electronic device according to some embodiments of the present invention will be described below with reference to the related drawings, wherein the same elements will be described with the same reference symbols.

Please refer to FIGS. 1A to 1C , wherein FIG. 1A is a partial schematic diagram of an electronic device according to an embodiment of the present invention, FIG. 1B is a partial exploded schematic diagram of the electronic device of FIG. 1A , and FIG. 1C is a schematic diagram of the electronic device of FIG. 1A , a schematic cross-sectional view along the 1C-1C sectional line. The electronic device in this embodiment may be an active matrix (AM) electronic device or a passive matrix (PM) electronic device, which is not limited.

The electronic device 1 of this embodiment includes a support board 11 , an electrical board 12 and a plurality of electronic units 13 . The electrical board 12 is arranged on the support plate 11 ; the electronic units 13 are arranged on the electrical board 12 . In some embodiments, the electrical board 12 is disposed on the support board 11 by gluing, for example but not limited to (the two are bonded by insulating glue), and is electrically connected to the support board 11 ; in some embodiments, the electronic For example, but not limited to, the unit 13 is disposed on the electrical board 12 by gluing (the two are bonded by insulating glue), and is electrically connected to the electrical board 12 .

In addition to the supporting function, the support plate 11 is also provided with a circuit layer 111 ( FIG. 1C ) for electrical connection. The circuit layer 111 may be located on a surface facing the electrical board 12 or/and away from the electrical board 12 . Here, the circuit layer 111 is located on the surface facing the electrical board 12 as an example. In some embodiments, the circuit layer 111 includes a conductive layer or wires for transmitting conductive signals, so that the support board 11 can be used as a driving circuit board for driving the electronic units 13 . The support board 11 can be a rigid board, a flexible board, or a composite board, which is not limited.

The electrical board 12 has a board body 121 , a plurality of through holes H1 , an electrical layer 122 and a plurality of main conductive members 123 . The plate body 121 defines a corresponding first surface S1 and a second surface S2 , and the through holes H1 pass through the plate body 121 and communicate with the first surface S1 and the second surface S2 of the plate body 121 . Here, the second surface S2 of the plate body 121 faces the support plate 11 . The electrical layer 122 in this embodiment includes a conductive layer for transmitting conductive signals, and is arranged (but not limited to) on the first surface S1 of the board body 121 . The main conductive members 123 are respectively disposed on the through holes H1 of the electrical board 12 and slightly protrude from the through holes H1 , and the main conductive members 123 are electrically connected to the electrical layer 122 to the circuit layer of the support board 11 . 111. In other words, the electrical layer 122 of the electrical board 12 is electrically connected to the circuit layer 111 of the supporting board 11 on the lower side through the main conductive member 123 located in the through hole H1 so as to pass through the electrical layer 122 and the main conductive member 123 And the circuit layer 111 transmits electrical signals. Wherein, the plate body 121 usually has a uniform thickness, but it is not limited; when the thickness of the plate body 121 is not uniform, the thickness is defined as the minimum thickness of the plate body 121 itself. In addition, the material of the circuit layer 111 and/or the electrical layer 122 may include, for example, metals such as gold, copper, or aluminum, or any combination thereof, or an alloy of any combination, or other conductive materials. In some embodiments, the holes of the through holes H1 can be further electroplated, electroplated or evaporated. In some embodiments, the board bodies 121 of the support board 11 and the electrical board 12 may be rigid boards, flexible boards, or composite boards, respectively; when the board bodies 121 of the support board 11 and the electrical board 12 are both flexible boards, The electronic device 1 can be made into a flexible electronic device that can be rolled, which is easy to store. In some embodiments, the board body 121 of the support board 11 or/and the electrical board 12 can be a transparent board or a non-transparent board; when the board bodies 121 of the support board 11 and the electrical board 12 are respectively transparent boards, the The electronic device 1 becomes a transparent electronic product, such as but not limited to a transparent display; the supporting plate 11 and the plate body 121 of the electrical plate 12 are transparent and flexible, respectively, and can achieve bidirectional light transmission. For example, when the electronic unit 13 The electronic components are Mini LEDs or Micro LEDs, etc. The electronic device 1 can be a flexible light source or flexible display with bidirectional light transmission.

The electronic units 13 are arranged on the first surface S1 of the board body 121 , and each electronic unit 13 and one of the through holes H1 are partially overlapped along a projection direction of the electrical board 12 ( FIG. 1A ). Here, the projection direction of the electrical board 12 is the direction perpendicular to the first surface S1 of the board body 121 . In this embodiment, every four electronic units 13 share one through hole H1 , and each of the four electronic units 13 partially overlaps with the through hole H1 along the projection direction of the electrical board 12 . It should be noted that each electronic unit 13 has a plurality of corners, at least one of the electronic units 13 is covered by one of the through holes H1 along the projection direction of the electrical board 12 at one corner. In some embodiments, each electronic unit 13 is covered by one of the through holes H1 at a corner along the projection direction of the electrical board 12 . It should be noted that at least one of the through holes H1 covers one of the corresponding corners of the plurality of electronic units 13 along the projection direction of the electrical board 12 . In some embodiments, the electronic units 13 may be rectangular, for example, and arranged in an m×n matrix, wherein m and n may be equal or unequal positive integers, and the electronic units 13 are arranged along the length of the electrical board 12 . The projection direction covers at least one through hole H1 of the through holes H1. In this embodiment, the four electronic units 13 are arranged in a 2×2 matrix and cover one through hole H1 as an example. In some embodiments, the electronic units 13 can also be arranged in a 4×4 matrix and cover one through hole H1 , which is not limited in the present invention. In different embodiments, the electronic units 13 may also be arranged in other arrangements, such as a one-dimensional matrix arrangement or an irregular arrangement, which is not limited. It can be understood that the configuration and the number of angles of each electronic unit 13 are not limited, and the angle defined in each unit 13 can also extend to the geometric center or the center of mass of each electronic unit 13 . In this embodiment, each of the electronic units 13 has four corners, and one of the corners of the four electronic units 13 corresponds to one of the through holes H1 along the projection direction of the electrical board 12 and is covered by the corresponding through hole H1 . It is to be reminded that there is a gap between the two adjacent carrier plates 133 shown in FIG. 1A . It can be understood that in actual operation, the two adjacent carrier plates 133 can be tightly connected without a gap or separation The interval between two adjacent electronic units 13 on two adjacent carriers 133 is equivalent to the interval between two adjacent electronic units 13 on the same carrier 133 , thereby reducing the overall size of the electronic device 1 , improve the layout density of the electronic units 13 on the electronic device 1, or make the spliced carrier board 133 have the advantages of visual consistency and the like.

Each electronic unit 13 has at least one electronic component 131 and at least one primary conductive member 132. The secondary conductive member 132 enables the electronic component 131 to be electrically connected to the electrical layer 122 of the electrical board 12. That is, the electronic component 131 is electrically conductive through the secondary conductive member 132. The element 132 is electrically connected to the electrical layer 122 of the electrical board 12 . The numbers of the electronic components 131 and the secondary conductive members 132 of each electronic unit 13 in this embodiment are respectively plural, and each secondary conductive member 132 can electrically connect the corresponding electronic components 131 to the electrical layer 122 , in other words, each An electronic component 131 can be electrically connected to the electrical layer 122 of the electrical board 12 through the corresponding secondary conductors 132 respectively. In some embodiments, the material of the primary conductive member 123 or the secondary conductive member 132 may include, for example, but not limited to, solder paste, copper paste, or silver paste, or a combination thereof.

In some embodiments, the electronic components 131 may be millimeter-scale or micron-scale optoelectronic chips or optoelectronic packages. In some embodiments, the electronic component 131 may include, for example, but not limited to, at least one light emitting diode chip (LED chip), a nano light emitting diode chip (Mini LED chip), a micro light emitting diode chip (Micro LED chip) , Micro sensor chip (Micro sensor chip) or at least one package, or optoelectronic chip or optoelectronic package with unlimited size in millimeter scale, micron scale or below. The millimeter-scale package may include micron-scale chips. In some embodiments, the electronic unit 13 may include one optoelectronic chip or package, and the electronic unit 13 may be understood as a single pixel; in some embodiments, the electronic unit 13 may include multiple optoelectronic chips or packages, It can be understood that the electronic unit 13 includes a plurality of pixels. In some embodiments, the electronic unit 13 may include, for example, red, blue, or green LEDs, Mini LEDs, or Micro LED chips, or other colors of LEDs, Mini LEDs, or Micro LED chips or packages. When the three electronic components 131 (photoelectric chips or packages) of the electronic unit 13 are respectively red, blue and green LED, Mini LED, or Micro LED chips, a full-color LED, Mini LED, or micro LED display can be formed . The aforementioned chip can be a die of horizontal electrodes, flip-chip electrodes, or vertical electrodes, and is electrically connected to the electrodes by wire bonding or flip chip bonding. It can be understood that, when the electronic components 131 are optoelectronic chips, each electronic unit 13 further includes an encapsulation layer (not shown in the figure) that is arranged on these electronic components 131 in a continuous or discontinuous manner and can isolate external moisture and dirt. shown) is understandable. The aforementioned package is not limited to a package with active components or a passive package without active components, such as but not limited to thin film transistors (TFTs), or silicon or non-silicon integrated circuits (Silicon IC or non- Silicon IC). In some embodiments, the electronic device 1 may further include one or more active elements such as, but not limited to, thin film transistors (TFTs) or silicon semiconductor based active elements corresponding to at least one of the aforementioned electronic elements 131 . In some embodiments, the electronic element 131 itself may also be a driving element, and the driving element may include at least one thin film transistor (TFT), or an integrated circuit (IC) based on silicon (or non-silicon) semiconductors, using to drive other components or packages.

As shown in FIG. 1A , the four electronic units 13 in this embodiment are four electronic structures, each electronic structure has a carrier board 133 , and the electronic components 131 are disposed on the carrier board 133 . In other words, four independent electronic structures (electronic units 13 ) are spliced and arranged in a 2x2 matrix. Therefore, if one electronic unit is found to be faulty, it can be set (eg, attached) to the electrical board 12 before The defective electronic units are eliminated and replaced with good electronic units, so that the fault repair is relatively easy, whereby the electronic device 1 can achieve a high process yield. The present invention integrates the electronic components 131 into electronic units, and when one of the electronic components fails, only the electronic unit where the failed electronic component is located needs to be eliminated, rather than the entire electronic device 1 being eliminated; and, The present invention is applicable to electronic components of micron level or below, so that the electronic unit can be formed with a size of micron level or above which can be detected electrically, but is not limited thereto. The above-mentioned carrier board 133 can be a rigid board, a flexible board, or a composite board. In some embodiments, the carrier plate 133 can be a transparent plate or a non-transparent plate, which is not limited in the present invention.

In some embodiments, the aforementioned electronic structures (such as but not limited to) include thin film transistors (TFTs) or active components (or/and their integrated components) of silicon (or non-silicon) integrated circuits (Silicon ICs), etc. Active devices, or passive devices including capacitors, resistors, inductors, conductors, encoders, potentiometers, antennas, transformers, filters, attenuators, couplers, oscillators, radio frequency components, or microwave (or millimeter wave) components components (or/and their integrated components) and other passive components.

Referring to FIG. 1C , each carrier board 133 defines a working surface S3 on which the electronic components 131 are disposed, and a connecting surface S4 corresponding to the working surface S3; the carrier board 133 has a conductive layer 1331 and the working surfaces S3 and One of the connecting surfaces S4 is perforated H2. Here, the conductive layer 1331 is located on the working surface S3, and may include, for example, a thin-film circuit. In addition, the through hole H2 is a hole passing through the carrier plate 133 and the conductive layer 1331 , and the secondary conductive member 132 is disposed in the through hole H2 and protrudes to the outside, and covers part of the conductive layer 1331 outside the through hole H2 so that the secondary conductive member 132 can pass through the through hole H2 The conductive layer 1331 is electrically connected to the electrical layer 122 of the electrical plate 12 . In other words, the electronic component 131 is electrically connected to the electrical layer 122 of the electrical board 12 through the conductive layer 1331 of the carrier board 133 and the secondary conductive member 132 located in the through hole H2 (and the conductive layer 1331 ). In some embodiments, the electrical board 12 may further include a plurality of driving elements (not shown), and the driving elements may respectively correspond to the electronic elements 131 of the electronic unit 13 to correspond to the driving elements of the electronic unit 13 . Electronic components 131 . Here, the driving elements of the electrical board 12 may be disposed on the first surface S1 or/and the second surface S2 of the board body 121 , which is not limited. In addition, in some embodiments, since the electrical layer 122 of the electrical board 12 can be electrically connected to the circuit layer 111 of the support board 11 through the main conductive member 123 located in the through hole H1, the support board 11 may include a plurality of Driving elements (not shown), the driving elements of the support plate 11 can correspond to the electronic elements 131 of the driving electronic unit 13 through the electrical plate 12 . In addition, in some embodiments, the driving element can also be provided on the carrier board 133 of the electronic unit 13 to drive the corresponding electronic element 131 . The aforementioned driving element may include at least one thin film transistor (TFT), or an integrated circuit (IC) based on silicon (or non-silicon) semiconductors. In some embodiments, in addition to the thin film transistor, the driving element may further include other thin film elements or circuits, such as thin film resistors, capacitors, or insulating layers, which are not limited and depend on the driving method of the electronic element 131 . It can be understood that, since both the driving element of the support plate 11 or the active element of the electronic unit 13 have active driving characteristics, it can be understood as an electronic element with the same function, or the driving element is an electronic element that can cover the active element, and the electronic device 1 A plurality of driving elements (corresponding to these electronic units 13 ) can be optionally disposed on the support plate 11 , or one or more active elements (corresponding to these electronic elements 131 in this embodiment) can be disposed in each electronic unit 13 ; of course, Corresponding driving elements or active elements are simultaneously arranged on the support plate 11 and the electronic unit 13 for a specific purpose, which is not limited. It can also be understood that when the driving element or the active element is applied to the support board 11 or the electronic unit 13 , the circuit layer 111 on the support board 11 provides pure transmission current, which does not conflict with the foregoing embodiments.

In different embodiments, the carrier 133 may have a conductive layer 1331 and a through hole connecting the working surface S3 and the connection surface S4, but the through hole is closed by the conductive layer 1331 or a conductive pad extending from the conductive layer 1331 (Fig. not shown); the secondary conductive member 132 is also disposed in the through hole. In other words, when the carrier board 133 is viewed from the upper side of the carrier board 133 , the through hole may or may not be covered by the conductive layer 1331 , and the secondary conductive members 132 in the through hole can be electrically connected to the conductive layer 1331 ; in this embodiment, , the conductive layer 1331 covers the through hole and the sub-conductor 132 . In addition, in some embodiments, in addition to the conductive layer 1331 , the carrier board 133 may further include a plurality of signal lines (eg, scan lines, data lines) for transmitting corresponding driving or control signals to the electronic device 131 .

Referring to FIG. 1A again, the number of electronic components 131 of each electronic unit 13 in this embodiment is three, and each of them is a micro-photoelectric chip, such as a micro-LED chip, and passes through the corresponding secondary conductive member The 132 is electrically connected to the electrical layer 122 of the electrical board 12 . Of course, in different embodiments, the number of electronic components 131 of each electronic unit 13 may also be one, two, or more than three, and each electronic component 131 may be an optoelectronic chip or package of other sizes, and not limited.

In the present embodiment, the three electronic components 131 (micro-LED chips) of each electronic unit 13 may be designed for example with a common anode or a common cathode with four connection terminals. Here, a common cathode design is used as an example, so there are three corresponding positive terminals and one common negative terminal. As shown in FIG. 1B, the three positive terminals can correspond to three smaller through holes H21 (H2) and located in the Among the three secondary conductive members 132 in the through holes H21, one negative terminal can correspond to a larger through hole H22 (H2) and the secondary conductive members 132 located in the through hole H22 (the through holes H21 and H22 can be called as through holes H2), The three electronic components 131 can be electrically connected to the electrical layer 122 of the electrical board 12 through the four secondary conductive members 132 of the four through holes H2 (ie, three and H21, one H22). In addition, in the present embodiment, the secondary conductive members 132 of the electronic units 13 and the main conductive members 123 of the electrical board 12 are disposed in dislocation along the projection direction of the electrical board 12 . In other words, the four through-holes H2 corresponding to each electronic unit 13 and the corresponding through-holes H1 are also staggered along the projection direction of the electrical board 12 .

In some present embodiments, the through holes H2 of the same nature on the plurality of carriers 133 may correspond to one of the through holes H1, and the number of the through holes H1 is equal to the number of the through holes H2 of the same nature; One of the through holes H21 corresponding to the positive electrode of the red micro-LED chip on the plurality of carriers 133 corresponds to one of the through holes H1, and so on, the plurality of carriers 133 collectively correspond to at least four through holes H1; Limited to this, for example, on the same electrical board 12, the plurality of carriers 133 collectively correspond to at least four through holes H1; the plurality of carriers 133 on the plurality of electrical boards 12 can pass through one or two The conductive members are electrically connected to two adjacent electronic units 13 on two adjacent carrier boards 133, and the number of through holes is reduced to less than four. For another example, no matter on the same electrical board 12 or on multiple electrical boards 12, through the extension design of one or more extended circuit boards (such as flexible printed circuit boards, etc.), it can be further reduced to four or less. number of vias. It can be understood that one corner of each electronic unit 13 can be covered by a through hole H1, that is, four corners of each electronic unit 13 can be covered by different through holes H1; and one through hole H1 can be One corner of many electronic units 13 is covered. For example, the same through hole H1 can cover one corner of four electronic units 13 respectively, and the two define different contents, and the different contents do not conflict with each other and coexist.

In some embodiments, along the projection direction of the electrical board 12 , the ratio of the projected area of the electronic unit 13 to the projected area of the electronic component 131 is not less than 5, that is, the projected area of the electronic unit 13 / the projection of the electronic component 131 Area ≥ 5. For example, the projected area of the electronic unit 13 may be, for example, 0.4 mm*0.4 mm=0.16 mm ² , and the projected area of the electronic element 131 may be, for example, (3*0.0254) mm*(5*0.0254) mm=0.0096774 mm ² , Therefore, the projected area of the electronic unit 13/the projected area of the electronic element 131>16.53. For example, the projected area of the electronic unit 13 may be, for example, 0.8mm*0.8mm=0.64mm ² , and the projected area of the electronic element 131 may be, for example, (5*0.0254)mm*(9*0.0254)mm =0.0290322mm ² , Therefore, the projected area of the electronic unit 13/the projected area of the electronic element 131>22.04. For example, the projected area of the electronic unit 13 can be, for example, 0.4mm*0.4mm=0.16mm ² , and the projected area of the electronic element 131 can be, for example, (5*0.0254)mm*(9*0.0254)mm=0.0290322mm ² , Therefore, the projected area of the electronic unit 13/the projected area of the electronic element 131>5.51.

In some embodiments, the aforementioned ratio of the projected area of the electronic unit 13 to the projected area of the electronic element 131 may not be less than 50. For example, the projected area of the electronic unit 13 can be, for example, 0.4mm*0.4mm=0.16mm ² , and the projected area of the electronic element 131 can be, for example, 0.03mm*0.06mm=0.0018mm ² , so the projected area of the electronic unit 13/ The projected area of the electronic component 131=88.88. For example, the projected area of the electronic unit 13 can be, for example, 0.8mm*0.8mm=0.64mm ² , and the projected area of the electronic element 131 can be, for example, (3*0.0254)mm*(5*0.0254)mm=0.0096774mm ² , Therefore, the projected area of the electronic unit 13/the projected area of the electronic element 131>66.13. In some embodiments, the ratio of the projected area of the electronic unit 13 to the projected area of the electronic element 131 may not be less than 100. For example, the projected area of the electronic unit 13 may be, for example, 0.46mm*0.46mm=0.2116mm ² , and the projected area of the electronic element 131 may be, for example, 0.03mm*0.06mm=0.0018mm ² , so the projected area of the electronic unit 13 / The projected area of the electronic component 131=117.56. The above numerical values are only examples and are not intended to limit the present invention. It is worth noting that, the aforementioned projected area of the electronic unit 13 and the projected area of the electronic component 131 are usually calculated by taking a square as an example, but not limited to a square.

In some embodiments, along the projection direction of the electrical board 12 , the size of the electronic component 131 is also defined as a component width, and the component width may not be greater than 80 mils, that is, the component width is less than or equal to 80 mils. In some embodiments, the element width may be no greater than 12 mil (ie, element width ≤ 12 mil). In some embodiments, the element width may be no less than 0.005mm (ie, element width≥0.005mm), such as 0.008mm, 0.01mm, 3mil, 4mil, 5mil, or 7mil, and the like.

In connection with the above, in the electronic device 1 of this embodiment, the through holes H1 of the electrical board 12 communicate with the first surface S1 and the second surface S2 of the board body 121 , and the main conductive members 123 are respectively disposed on the The through hole H1 is electrically connected to the electrical layer 122 of the electrical board 12 to the circuit layer 111 of the support board 11 ; the electronic units 13 are arranged on the first surface S1 of the board body 121 of the electrical board 12 , and each electronic unit 13 partially overlap with one of the through holes H1 of the electrical board 12 along the projection direction of the electrical board 12; The structural design of the main conductive members 123 (or the through holes H1 ) of 12 is dislocated along the projection direction of the electrical board 12 , so that the electronic device 1 becomes an electronic device that is different from the traditional electronic unit and the supporting board electrical connection technology. product.

2 to 4 are partial schematic diagrams of electronic devices according to different embodiments of the present invention, respectively.

As shown in FIG. 2 , the main difference from the electronic device 1 of the previous embodiment is that, in the electronic device 1 a of the present embodiment, four electronic units 13 constitute an electronic structure, and the electronic structure has a carrier board 133 . The electronic components 131 of the electronic unit 13 are disposed on the carrier board 133 . In other words, the four electronic units 13 form an electronic structure and share the same carrier board 133. Therefore, if it is found that a certain electronic unit is faulty, it can be set (eg, attached) to the electrical board 12. Part of the electronic unit is cut (for example, by laser cutting) and removed, and then replaced with a well-tested electronic unit to be attached to the electrical board 12, so the repair of faults is also quite easy. Therefore, the electronic device 1a is also High process yield can be achieved.

In addition, as shown in FIG. 3 , the main difference from the electronic device 1 of the previous embodiment is that in the electronic device 1 b of the present embodiment, the number of electrical boards 12 is multiple, and the electrical boards 12 are spliced into a For example, a two-dimensional matrix. Each of the electrical boards 12 in this embodiment is provided with four electronic units 13 , the four electronic units 13 are arranged in a 2×2 matrix, and the sub-conductors 132 of the four electronic units 13 are connected to the electrical boards 12 . The main conductive members 123 are arranged in a dislocation along the projection direction of the electrical board 12 .

In addition, as shown in FIG. 4 , the main difference from the electronic device 1 b of the previous embodiment is that in the electronic device 1 c of the present embodiment, each electrical board 12 is provided with 9 electronic units 13 , and the 9 electronic units 13 are arranged in a 3x3 matrix. In each electrical board 12 , the nine electronic units 13 are electrically connected to the circuit layer 111 of the support board 11 through the main conductive members 123 of the two through holes H1 . In other words, one electronic unit 13 located between the two through holes H1 simultaneously shares the two main conductive members 123 of the two through holes H1 and is electrically connected to the circuit layer 111 of the support board 11 .

The electronic device according to another embodiment of the present invention can also be applied to any of the aforementioned implementations in FIGS. 1A to 4 , but at least one of the through hole H1 and the through hole H2 can be further omitted. Taking FIGS. 5A to 5C as an example, they are a partial schematic view, a partially exploded schematic view, and a cross-sectional view along the 5C-5C sectional line of the electronic device without the perforation H2, respectively.

As shown in FIGS. 5A to 5C , the carrier board 133 ′ can be provided with a plurality of conductive pads P on the connection surface S4 , and the conductive pads P can be electrically connected to the carrier board 133 ′ through a conductive layer (not shown) The electronic element 131 ′; and the electronic unit 13 ′ can electrically connect the conductive pads P to the electrical layer 122 of the electrical board 12 through a plurality of secondary conductive members 132 ′. Here, the conductive layer of the carrier board 133 ′ can be located on the working surface S3 , the connecting surface S4 , or between the two; the secondary conductive parts 132 ′ can be solder balls, solder paste or their equivalents; the secondary conductive parts 132' can be arranged on the electrical board 12 or on the carrier board 133'. When the secondary conductive members 132' are arranged on the carrier board 133', the conductive pads P may not be visible; these The number of the conductive pads P and the sub-conductors 132 ′ is not limited to be the same as the number of the aforementioned electronic components 131 using a common cathode or a common anode; each electronic unit 13 ′ can be a surface mount device (SMD), The electronic unit 13' can further cover the electronic components 131' on the carrier board 133' to have a package or a package layer. It can be understood that each electronic unit 13 ′ can be electrically connected (directly electrically connected) through the direct contact between the primary conductive member 132 ′ and the main conductive member 123 located in the through hole H1 ; The conductive member 132 ′ is electrically connected to the electrical property layer 122 of the electrical property board 12 , and is electrically connected to the main conductive piece 123 located in the through hole H1 through the electrical property layer 122 of the electrical property board 12 (indirect contact electrical connection); or, These conductive pads P can be regarded as an extension or part of the electrical layer 122 . It can be understood that when each electronic unit 13 ′ is electrically connected through direct or indirect contact between the primary conductive member 132 ′ and the main conductive member 123 located in the through hole H1 , the conductive pad P, the secondary conductive member 132 ′ and the main conductive member 132 ′ are electrically connected. Along the projection direction of the electrical board 12 , the pieces 123 can be dislocated between them, as long as they can be electrically connected to each other. Here, the staggered arrangement means that the secondary conductive member 132 ′ and the primary conductive member 123 are completely or partially staggered along the projection direction of the electrical board 12 , as long as the secondary conductive member 132 ′ and the primary conductive member 123 are not completely overlapped (complete coverage).

In other words, when the carrier board 133' is viewed from the upper side of the carrier board 133', at least a part or all of each secondary conductor 132' will not be visible due to the covering of the carrier board 133'. The board 133 ′ also covers a main conductive member 123 located in the through hole H1 (same as the above-mentioned embodiment), and the main conductive member 123 may also be completely covered or slightly exposed. In this embodiment, the electronic element 131 ′ is electrically connected to the electrical layer 122 of the electrical board 12 through the conductive layer (and the conductive pad P) of the carrier board 133 ′ and the secondary conductive member 132 ′, and the electrical board 12 is electrically connected to the electrical layer 122 of the electrical board 12 . The electrical layer 122 is electrically connected to the circuit layer 111 of the support plate 11 on the lower side through the main conductive member 123 located in the through hole H1 , so as to transmit electrical signals through the circuit layer 111 , the electrical layer 122 and the main conductive member 123 . It can also be understood that one corner of each electronic unit 13 ′ can be covered by one main conductive member 123 , that is, the four corners of each electronic unit 13 ′ can be covered by different main conductive members 123 ; and One main conductive element 123 can cover one corner of many electronic units 13', for example, the same main conductive element 123 can cover one corner of four electronic units 13' respectively, and the two define different contents, and the different contents are not the same. conflict and coexist.

The electronic device according to another embodiment of the present invention can also be applied to any of the aforementioned implementations in FIGS. 1A to 4 , but the through hole H1 (not shown) can be further omitted. Here, the through hole H1 is omitted from the electrical board, and the surface mount technology is used to electrically connect the electrical layer of the electrical board to the circuit layer of the support board. The electronic unit can be mounted on the electrical board before or after the electrical board is mounted on the support board, and the sequence is not limited. In some embodiments, the step of placing the electronic unit on the electrical board can be completed before the electrical board is placed on the support board, so that the electronic unit and the electrical board can together form a unit or a module.

In another embodiment of the present invention, the electronic device can also be applied to any of the aforementioned implementations in FIGS. 1A to 4 , but the through hole H1 and the through hole H2 can be omitted at the same time, and details are not described herein again.

To sum up, in the electronic device of the present invention, the electrical layer of the electrical board is electrically connected to the circuit layer of the support board through the main conductive member, and the electronic unit is electrically connected to the conductive layer of the carrier board and the electrical board through the secondary conductive member The electrical layer, and the secondary conductive parts of the electronic units and the main conductive parts of the electrical board are staggered along the projection direction of the electrical board. The structural design makes the electronic device of the present invention a different Electronic products based on traditional electrical connection technology; the electronic device of the present invention has the following advantages: reducing the overall size of the electronic device, increasing the layout density of the electronic units on the electronic device, and making the carrier board or the electrical board still visually visible even through splicing Consistency (such as pitch), easy to eliminate or repair defective products, and improve the yield of electronic devices; or, the main conductive member can achieve the effect of electrical connection through the dislocation of the main conductive member and the secondary conductive member. The projected size of the main conductive member It does not shrink due to the shrinking of the pitch of electronic components, so it is beneficial to improve the density of electronic components. With the structure of the electronic device in this case and the electrical connection relationship of its components, if one of the electronic units is found to be faulty, the faulty electronic unit can be eliminated before setting it on the electrical board, and the good product can be reused. The electronic unit is replaced by the original one, so the fault repair is relatively easy, thereby achieving a high process yield. The present invention integrates electronic components into electronic units, and when one of the electronic components fails, only the electronic unit where the failed electronic component is located needs to be eliminated, not the entire electronic device. The electronic device is also easy to eliminate or repair defective products, which can improve the yield of the electronic device. In addition, it can be understood that the electronic unit, the electrical board, and the support board can each be used as an independent electronic component, and the dislocation electrical connection can be achieved by technology such as through-hole or surface mount.

The above description is exemplary only, not limiting. Any equivalent modifications or changes that do not depart from the spirit and scope of the present invention shall be included in the appended patent application scope.

1,1a,1b,1c,1': electronic device 11: Support plate 111: circuit layer 12: Electrical board 121: Board body 122: Electrical layer 123: Main conductor 13,13': Electronic unit 131,131': Electronic components 132,132': Secondary Conductor 133,133': carrier board 1331: Conductive layer 1C-1C, 5C-5C: cutting line H1: Through hole H2, H21, H22: perforation P: Conductive gasket S1: The first side S2: Second side S3: Work surface S4: Connection Surface

FIG. 1A is a partial schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 1B is a partial exploded schematic view of the electronic device of FIG. 1A . FIG. 1C is a schematic cross-sectional view of the electronic device of FIG. 1A along the secant line 1C-1C. 2 to 4 are partial schematic diagrams of electronic devices according to different embodiments of the present invention, respectively. FIG. 5A is a partial schematic diagram of an electronic device according to another embodiment of the present invention. FIG. 5B is a partial exploded schematic view of the electronic device of FIG. 5A . FIG. 5C is a schematic cross-sectional view of the electronic device of FIG. 5A along the sectional line 5C-5C.

1: Electronic device

11: Support plate

111: circuit layer

12: Electrical board

121: Board body

122: Electrical layer

123: Main conductor

13: Electronic unit

131: Electronic Components

132: Secondary conductors

133: carrier board

1331: Conductive layer

H1: Through hole

H2: perforated

S1: The first side

S2: Second side

S3: Work surface

S4: Connection Surface

Claims (36)

An electronic device, comprising: a support plate, which is provided with a circuit layer; an electrical board, comprising a board body, a plurality of through holes penetrating the board body, an electrical layer arranged on the board body, and a plurality of main conductive members respectively disposed in the through holes; wherein, the The board body defines a corresponding first surface and a second surface, the through holes communicate with the first surface and the second surface of the board body, and the main conductive members electrically connect the electrical layer to the support plate the line layer; and A plurality of electronic units are arranged on the first surface of the board body, each of the electronic units and one of the through holes are partially overlapped along a projection direction of the electrical board; wherein, each of the electronic units has a An electronic component, and a primary conductive member electrically connecting the electronic component to the electrical layer; Wherein, the secondary conductive parts of the electronic units and the main conductive parts of the electrical board are arranged in a staggered position along the projection direction of the electrical board. The electronic device of claim 1, wherein each of the electronic units has a plurality of corners, and one of the corners of each of the electronic units is covered by one of the through holes along the projection direction of the electrical board . The electronic device of claim 1, wherein each of the electronic units has a plurality of corners, and one of the through holes covers one of the corners of the plurality of the electronic units along the projection direction of the electrical board. The electronic device as claimed in claim 1, wherein the electronic units are a plurality of electronic structures, each of the electronic structures has a carrier board, and the electronic components are disposed on the carrier board. The electronic device of claim 1, wherein the electronic units constitute an electronic structure, the electronic structure has a carrier board, and the electronic components of the electronic units are disposed on the carrier board. The electronic device according to claim 1, wherein the electronic units are arranged in an mxn matrix and cover at least one through hole of the through holes along the projection direction of the electrical plate, wherein m and n may be equal or different equal positive integers. The electronic device of claim 6, wherein the electronic units are arranged in a 2x2 matrix. The electronic device as claimed in claim 1, wherein the number of the secondary conductive members of each electronic unit is plural, and each of the secondary conductive members electrically connects the corresponding electronic element to the electrical layer. The electronic device according to claim 8, wherein the electronic components of each electronic unit are plural. The electronic device of claim 1, wherein the electronic component is a micro-photoelectric chip. The electronic device of claim 1, wherein the electronic component is a driving component. The electronic device of claim 1, wherein the electrical board further comprises a plurality of driving elements, and the driving elements correspond to the electronic elements of the electronic units respectively. The electronic device of claim 1, wherein the number of the electrical boards is multiple. The electronic device according to claim 1, wherein the support board and the board body of the electrical board are respectively a rigid board, a flexible board, or a composite board. The electronic device as claimed in claim 14, wherein the support board or/and the board body of the electrical board is a transparent board. The electronic device according to claim 1, wherein the ratio of the projected area of the electronic unit to the projected area of the electronic component is not less than 5. The electronic device of claim 1, wherein the electronic component defines a component width of no greater than 80 mils. The electronic device of claim 17, wherein the electronic component defines a width of the component no greater than 12 mils. The electronic device of claim 17, wherein the electronic component defines a width of the component that is not less than 0.005 mm. The electronic device as claimed in claim 4 or 5, wherein the carrier board defines a work surface on which the electronic component is disposed, and a connection surface corresponding to the work surface, the carrier board has a conductive layer and communicates with the work surface and a through hole of the connection surface, the secondary conductive element electrically connects the conductive layer to the electrical layer of the electrical plate through the through hole. The electronic device according to claim 4 or 5, wherein the carrier board is a rigid board, a flexible board, or a composite board. The electronic device of claim 21, wherein the carrier board is a transparent board. An electronic device, comprising: a support plate, which is provided with a circuit layer; an electrical board, which has a board body, an electrical layer disposed on the board body, and a plurality of main conductive elements electrically connected to the electrical layer respectively; wherein, the board body defines a corresponding first surface and a second surface, the main conductive members electrically connect the electrical layer to the circuit layer of the support board; and A plurality of electronic units are arranged on the first surface of the board body, and each of the electronic units and one of the main conductive elements are partially overlapped along a projection direction of the electrical board; wherein, each of the electronic units has an electronic component, and a primary conductive member electrically connecting the electronic component to the electrical layer; Wherein, the secondary conductive parts of the electronic units and the main conductive parts of the electrical board are arranged in a staggered position along the projection direction of the electrical board. The electronic device of claim 23, wherein the electronic unit is a surface mount component. The electronic device of claim 23, wherein each of the electronic units has a plurality of corners, and one of the corners of each of the electronic units is located along the projection direction of the electrical board by one of the main conductive members covered. The electronic device of claim 23, wherein each of the electronic units has a plurality of corners, and one of the main conductive members covers one of the corners of the plurality of the electronic units along the projection direction of the electrical board . The electronic device as claimed in claim 23, wherein the electronic units are a plurality of electronic structures, each of the electronic structures has a carrier board, and the electronic components are disposed on the carrier board. The electronic device of claim 23, wherein the electronic component is a micro-photoelectric chip. The electronic device of claim 23, wherein the electronic unit further comprises an encapsulation layer covering the electronic component. The electronic device of claim 23, wherein the electronic units constitute an electronic structure, the electronic structure has a carrier board, and the electronic components of the electronic units are disposed on the carrier board. The electronic device of claim 23, wherein the electronic units are arranged in an mxn matrix and cover at least one main conductive member along the projection direction of the electrical plate, wherein m and n can be equal or unequal positive integers . The electronic device of claim 31, wherein the electronic units are arranged in a 4x4 matrix. The electronic device as claimed in claim 23, wherein the number of the secondary conductive members of each of the electronic units is plural, and each of the secondary conductive members electrically connects the corresponding electronic element to the electrical layer. The electronic device of claim 23, wherein the secondary conductive member of each electronic unit is a solder ball. The electronic device of claim 23, wherein the electrical board further comprises a plurality of driving elements, and the driving elements correspond to the electronic elements of the electronic units respectively. The electronic device of claim 35, wherein the driving element is a thin film transistor or an integrated circuit.

Images