CN114765924B

CN114765924B - Electronic device

Info

Publication number: CN114765924B
Application number: CN202110658651.XA
Authority: CN
Inventors: 李晋棠
Original assignee: Fanglue Electronics Co ltd
Current assignee: Fanglue Electronics Co ltd
Priority date: 2020-12-30
Filing date: 2021-06-15
Publication date: 2024-03-22
Anticipated expiration: 2041-06-15
Also published as: CN114765924A

Abstract

The invention discloses an electronic device which comprises a supporting plate, an electric plate and a plurality of electronic units. The supporting plate is provided with a circuit layer. The electric plate is provided with a plate body, a plurality of through holes penetrating through the plate body, an electric layer arranged on the plate body, and a plurality of main conductive pieces respectively arranged on the through holes, wherein the plate body defines a corresponding first surface and a corresponding second surface, the through holes are communicated with the first surface and the second surface of the plate body, and the main conductive pieces are electrically connected with the electric layer to a circuit layer of the supporting plate. The electronic units are arranged on the first surface of the plate body, each electronic unit and one of the through holes are partially overlapped along the projection direction of the electric plate, and each electronic unit is provided with an electronic component and a secondary conductive piece which is electrically connected with the electronic component to the electric layer; the secondary conductive elements of the electronic units and the main conductive elements of the electric plate are arranged in a staggered mode along the projection direction of the electric plate.

Description

Electronic device

Technical Field

The present invention relates to an electronic device, and more particularly, to an electronic device with a different electrical connection technology.

Background

In the field of electronic device manufacturing, surface mount technology (Surface Mount Technology, SMT) is a technology for soldering electronic components on the surface of, for example, a printed circuit board (Printed Circuit Board, PCB), and the volume of an electronic product can be greatly reduced by using the surface mount technology, so as to achieve the purpose of being lighter, thinner, shorter and smaller.

Conventionally, the bonding of electronic components (e.g., surface mount components) to a circuit board is mainly performed by Solder Paste (Solder Paste), and the electronic components are soldered to the circuit board after being cooled by printing the Solder Paste on pads (or bonding pads) of the circuit board to be soldered, placing the electronic components on the pads to make Solder feet of the electronic components correspond to the positions of the Solder Paste, and melting the Solder Paste into a liquid by a high-temperature reflow oven.

Disclosure of Invention

The invention aims to provide an electronic device which is different from the traditional electric connection technology.

To achieve the above object, an electronic device according to the present invention includes a support plate, an electrical board, and a plurality of electronic units. The supporting plate is provided with a circuit layer; the electric plate is provided with a plate body, a plurality of through holes penetrating through the plate body, an electric layer arranged on the plate body and a plurality of main conductive pieces respectively arranged on the through holes, wherein the plate body defines a corresponding first surface and a corresponding second surface, the through holes are communicated with the first surface and the second surface of the plate body, and the main conductive pieces are electrically connected with the electric layer to a circuit layer of the supporting plate; the electronic units are arranged on the first surface of the plate body, each electronic unit and one of the through holes are partially overlapped along the projection direction of the electric plate, and each electronic unit is provided with an electronic component and a secondary conductive piece which is electrically connected with the electronic component to the electric layer; the secondary conductive elements of the electronic units and the main conductive elements of the electric plate are arranged in a staggered mode along the projection direction of the electric plate.

In one embodiment, each electronic unit has a plurality of corners, and one corner of each electronic unit is covered by one of the through holes along the projection direction of the electrical board.

In one embodiment, each of the electronic units has a plurality of corners, and one of the through holes covers one of the corners of the electronic unit along the projection direction of the electrical board.

In one embodiment, the electronic units are a plurality of electronic structures, each electronic structure has a carrier, and the electronic components are disposed on the carrier.

In one embodiment, the electronic units form an electronic structure, the electronic structure is provided with a carrier plate, and the electronic components of the electronic units are arranged on the carrier plate.

In one embodiment, the electronic units are arranged in mxn matrix, and at least one through hole of the through holes is covered along the projection direction of the electrical board, where m and n may be equal or unequal positive integers.

In one embodiment, the electronic units are arranged in a 2x2 matrix.

In one embodiment, the number of the sub-conductive elements of each electronic unit is plural, and each sub-conductive element electrically connects the corresponding electronic component to the electrical layer.

In one embodiment, the electronic components of each electronic unit are plural.

In one embodiment, the electronic component is a micro-optoelectronic chip.

In one embodiment, the electronic component is a drive component.

In one embodiment, the electrical board further includes a plurality of driving components corresponding to the electronic components of the electronic units, respectively.

In one embodiment, the number of electrical boards is multiple.

In one embodiment, the carrier plate is a rigid plate, a flexible plate, or a composite plate.

In one embodiment, the carrier plate is a transparent plate.

In one embodiment, the ratio of the projected area of the electronic unit to the projected area of the electronic component is not less than 5.

In one embodiment, the electronic component defines a component width of no greater than 80 mils.

In one embodiment, the electronic component defines a component width of no greater than 12 mils.

In one embodiment, the electronic component defines a component width of not less than 0.005 millimeters.

In one embodiment, the carrier defines a working surface on which the electronic component is disposed and a connection surface corresponding to the working surface, the carrier has a conductive layer and a through hole for connecting the working surface and the connection surface, and the secondary conductive member electrically connects the conductive layer to the electrical layer of the electrical board through the through hole.

In one embodiment, the plate bodies of the support plate and the electric plate are respectively a rigid plate, a flexible plate or a composite plate.

In one embodiment, the plate body of the support plate and/or the electrical plate is a transparent plate.

To achieve the above object, an electronic device according to the present invention includes a support plate, an electrical board, and a plurality of electronic units. The supporting plate is provided with a circuit layer; the electric plate is provided with a plate body, an electric layer arranged on the plate body and a plurality of main conductive elements respectively electrically connected with the electric layer; the main conductive piece is electrically connected with the electric layer to the circuit layer of the supporting plate; the electronic units are arranged on the first surface of the plate body, and each electronic unit and one of the main conductive pieces are partially overlapped along the projection direction of the electric plate; each electronic unit is provided with an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer; the secondary conductive piece of the electronic unit and the primary conductive piece of the electric plate are arranged in a staggered mode along the projection direction of the electric plate.

In one embodiment, the electronic unit is a surface mount device.

In one embodiment, each electronic unit has a plurality of corners, and one of the corners of each electronic unit is covered by one of the main conductors along the projection direction of the electrical board.

In one embodiment, each of the electronic units has a plurality of corners, and one of the main conductors covers one of the corners of the plurality of electronic units along a projection direction of the electrical board.

In one embodiment, the electronic unit is a plurality of electronic structures, each electronic structure has a carrier, and the electronic component is disposed on the carrier.

In one embodiment, the electronic component is a micro-optoelectronic chip.

In one embodiment, the electronic unit further comprises an encapsulation layer covering the electronic components.

In one embodiment, the electronic unit forms an electronic structure, the electronic structure has a carrier, and the electronic component of the electronic unit is disposed on the carrier.

In one embodiment, the electronic units are arranged in mxn matrix and cover at least one main conductive element along the projection direction of the electrical board, where m and n may be equal or unequal positive integers.

In one embodiment, the electronic units are arranged in a 4x4 matrix.

In one embodiment, the secondary conductive member of each electronic unit is a solder ball.

In one embodiment, the electrical board further includes a plurality of driving components, and the driving components respectively correspond to the electronic components of the electronic unit.

In one embodiment, the driving component is a thin film transistor, or an integrated circuit.

In the electronic device of the present invention, the main conductive member is electrically connected to the electrical layer of the electrical board to the circuit layer of the supporting board, and the electronic unit is electrically connected to the conductive layer of the carrier board and the electrical layer of the electrical board through the sub-conductive member; the electronic units are arranged on the first surface of the plate body of the electric plate, and each electronic unit is partially overlapped with one of the main conductive pieces of the electric plate along the projection direction of the electric plate; the secondary conductive members of the electronic units and the main conductive members of the electric plates are arranged in a staggered mode along the projection direction of the electric plates, so that the electronic device is different from the traditional electric connection technology.

Drawings

Fig. 1A is a schematic diagram of a portion of an electronic device according to an embodiment of the invention.

Fig. 1B is a partially exploded schematic view of the electronic device of fig. 1A.

FIG. 1C is a schematic cross-sectional view of the electronic device of FIG. 1A along the line 1C-1C.

Fig. 2 to fig. 4 are schematic partial views of an electronic device according to various embodiments of the invention.

Fig. 5A is a schematic diagram of a portion of an electronic device according to another embodiment of the invention.

FIG. 5B is a partially exploded view of the electronic device of FIG. 5A.

FIG. 5C is a schematic cross-sectional view of the electronic device of FIG. 5A along the line 5C-5C.

Detailed Description

An electronic device according to some embodiments of the present invention will be described below with reference to the drawings, wherein like components will be described with like reference numerals.

Referring to fig. 1A to 1C, fig. 1A is a partial schematic view of an electronic device according to an embodiment of the invention, fig. 1B is a partial exploded schematic view of the electronic device of fig. 1A, and fig. 1C is a schematic cross-sectional view along a cutting line 1C-1C in the electronic device of fig. 1A. The electronic device of the present embodiment may be an Active Matrix (AM) electronic device or a Passive Matrix (PM) electronic device, and is not limited thereto.

The electronic device 1 of the present embodiment includes a support plate 11, an electrical board 12, and a plurality of electronic units 13. The electric plate 12 is arranged on the supporting plate 11; the electronic units 13 are disposed on the electrical board 12. In some embodiments, the electrical board 12 is disposed on the supporting board 11 (both are bonded by an insulating adhesive) by, for example, but not limited to, gluing, and is electrically connected to the supporting board 11; in some embodiments, the electronic units 13 are disposed on the electrical board 12 (both are bonded by an insulating adhesive) by, for example, but not limited to, gluing, and electrically connected to the electrical board 12.

The supporting board 11 has a supporting function, and is further provided with a circuit layer 111 (fig. 1C) for electrical connection. The circuit layer 111 may be located on a surface facing the electrical board 12 and/or away from the electrical board 12, where the circuit layer 111 is exemplified as a surface facing the electrical board 12. In some embodiments, the wiring layer 111 includes a conductive layer or wire that transmits conductive signals so that the support board 11 can act as a drive circuit board for driving the electronic units 13. The support plate 11 may be a rigid plate, a flexible plate, or a composite plate, without limitation.

The electrical board 12 has a board body 121, a plurality of through holes H1, an electrical layer 122 and a plurality of main conductive elements 123. The plate body 121 defines a first surface S1 and a second surface S2 corresponding to each other, and the through holes H1 penetrate through the plate body 121 and communicate the first surface S1 and the second surface S2 of the plate body 121. Here, the second surface S2 of the plate body 121 faces the support plate 11. The electrical layer 122 of the present embodiment includes a conductive layer for transmitting conductive signals, and is disposed (but not limited to) on the first surface S1 of the board 121. The main conductive elements 123 are respectively disposed in the through holes H1 of the electrical board 12 and slightly protrude from the through holes H1, and the main conductive elements 123 electrically connect the electrical layer 122 to the circuit layer 111 of the supporting board 11. In other words, the electrical layer 122 of the electrical board 12 is electrically connected to the circuit layer 111 of the support plate 11 below the main conductive element 123 of the through hole H1, so as to transmit electrical signals through the electrical layer 122, the main conductive element 123 and the circuit layer 111. Wherein the plate body 121 generally has a uniform thickness, but is not limited thereto; when the thickness of the plate 121 is uneven, the thickness is defined as the minimum thickness of the plate 121 itself. In addition, the material of the circuit layer 111 and/or the electrical layer 122 may include, for example, a metal such as gold, copper, or aluminum, or any combination thereof, or any combination of alloys, or other materials that may be conductive. In some embodiments, the holes of the through holes H1 may be further plated, electroless plated or vapor deposited. In some embodiments, the plate bodies 121 of the supporting plate 11 and the electrical plate 12 may be a rigid plate, a flexible plate, or a composite plate, respectively; when the supporting board 11 and the board body 121 of the electrical board 12 are both flexible boards, the electronic device 1 can be made into a flexible electronic device capable of being curled and easy to be stored. In some embodiments, the plate body 121 of the support plate 11 and/or the electrical plate 12 may be a transparent plate or a non-transparent plate; when the supporting plate 11 and the plate body 121 of the electrical plate 12 are transparent plates, the electronic device 1 can be made transparent, such as but not limited to a transparent display; the supporting board 11 and the board body 121 of the electrical board 12 are respectively transparent and flexible, so that bidirectional light transmission can be achieved, for example, when the electronic components of the electronic unit 13 are Mini LEDs or Micro LEDs, the electronic device 1 can be a bidirectional light transmission flexible light source or flexible display.

The electronic units 13 are disposed on the first surface S1 of the board 121, and each of the electronic units 13 and one of the through holes H1 are partially overlapped along the projection direction of the electrical board 12 (fig. 1A). Here, the projection direction of the electrical board 12 is a direction perpendicular to the first surface S1 of the board body 121. In this embodiment, each four electronic units 13 share a through hole H1, and each of the four electronic units 13 is partially overlapped with the through hole H1 along the projection direction of the electrical board 12. It should be noted that each electronic unit 13 has a plurality of corners, and at least one corner of one electronic unit 13 is covered by one through hole H1 along the projection direction of the electrical board 12. In some embodiments, each of the electronic units 13 is covered by one of the through holes H1 along the projection direction of the electrical board 12 at one angle (i.e., one of the electronic units 13 covers one of the through holes H1 along the projection direction of the electrical board 12). It should be noted that at least one of the through holes H1 covers a corresponding one of the corners of the plurality of electronic units 13 along the projection direction of the electrical board 12. In some embodiments, the electronic units 13 may be rectangular in the projection direction, and for example, are arranged in an mxn matrix, where m and n may be equal or non-equal positive integers, and the electronic units 13 cover at least one through hole H1 of the through holes H1 along the projection direction of the electrical board 12. The four electronic units 13 of the present embodiment are arranged in a 2x2 matrix and cover a through hole H1. In some embodiments, the electronic units 13 may also be arranged in a 4×4 matrix and cover a through hole H1, which is not limited by the present invention. In various embodiments, the electronic units 13 may be arranged in other manners, such as a one-dimensional matrix arrangement or an irregular arrangement, without limitation. It will be appreciated that the configuration of each electronics unit 13 is independent of the number of corners, and that the corners defined in each unit 13 may also extend to the geometric or center of mass of each electronics unit 13. In the present embodiment, the electronic unit 13 has four corners, and one corner of the four electronic units 13 corresponds to one of the through holes H1 along the projection direction of the electrical board 12, and is covered by the corresponding through hole H1.

It is noted that, as shown in fig. 1A, there is a gap between two adjacent carrier plates 133, it can be understood that, in actual operation, two adjacent carrier plates 133 can be closely connected without a gap, or the interval between two adjacent electronic units 13 on two adjacent carrier plates 133 corresponds to the interval between two adjacent electronic units 13 on the same carrier plate 133, so that the overall size of the electronic device 1 can be reduced, the layout density of the electronic units 13 on the electronic device 1 can be improved, or the spliced carrier plates 133 have visual consistency.

Each electronic unit 13 has at least one electronic component 131 and at least one sub-conductive element 132, and the sub-conductive element 132 enables the electronic component 131 to be electrically connected to the electrical layer 122 of the electrical board 12, that is, the electronic component 131 is electrically connected to the electrical layer 122 of the electrical board 12 through the sub-conductive element 132. The number of the electronic components 131 and the number of the sub-conductive members 132 of each electronic unit 13 are plural, and each sub-conductive member 132 can electrically connect the corresponding electronic component 131 to the electrical layer 122, in other words, each electronic component 131 can be electrically connected to the electrical layer 122 of the electrical board 12 through the corresponding sub-conductive member 132. In some embodiments, the material of the primary conductive member 123 or the secondary conductive member 132 may include, for example, but not limited to, solder paste, copper paste, or silver paste, or a combination thereof.

In some embodiments, the electronic component 131 may be a millimeter-or micron-sized optoelectronic chip or optoelectronic package. In some embodiments, the electronic component 131 may include, for example, but not limited to, at least one light emitting diode chip (LED chip), milli-light emitting diode chip (Mini LED chip), micro-light emitting diode chip (micro LED chip), micro-sensing chip (Micro sensor chip), or at least one package, or an optoelectronic chip or optoelectronic package not limited to millimeter, micron, or less in size. Wherein the millimeter-scale package may include a chip having a micrometer scale. In some embodiments, the electronic unit 13 may comprise one optoelectronic chip or package, whereby the electronic unit 13 is understood as a single pixel; in some embodiments, the electronic unit 13 may comprise a plurality of optoelectronic chips or packages, it being understood that the electronic unit 13 comprises a plurality of pixels. In some embodiments, an LED, such as red, blue or green, a MiniLED, or a Micro LED chip, or an LED, miniLED, or Micro LED chip or package of other colors may be included in the electronic unit 13. When the three electronic components 131 (photo chips or packages) of the electronic unit 13 are red, blue and green LEDs, minileds, or Micro LED chips, respectively, full color LED, miniLED, or Micro LED displays can be constructed. The chip may be a die of a horizontal electrode, a flip-chip electrode, or a vertical electrode, and is electrically connected to the electrode by wire bonding (flip chip bonding). It is understood that when the electronic components 131 are optoelectronic chips, it is understood that each electronic unit 13 further includes a packaging layer (not shown) disposed continuously or discontinuously on the electronic components 131 to isolate external moisture and dirt. The aforementioned packages are not limited to packages with active components such as, but not limited to, thin Film Transistors (TFTs), or integrated circuits (Silicon IC or non-Silicon ICs) of Silicon or non-Silicon, or to passive packages without active components. In some embodiments, the electronic device 1 may further include one or more active components such as, but not limited to, thin Film Transistors (TFTs) or silicon semiconductor based corresponding to at least one of the aforementioned electronic components 131. In some embodiments, the electronic component 131 may itself be a driving component that may include at least one Thin Film Transistor (TFT), or a silicon (or non-silicon) semiconductor-based Integrated Circuit (IC), for driving other components or packages.

As shown in fig. 1A, the four electronic units 13 of the present embodiment are four electronic structures, each having a carrier 133, and the electronic components 131 are disposed on the carrier 133. In other words, the four independent electronic structures (electronic units 13) are spliced and arranged in a matrix of 2x2, so if a fault is found in one electronic unit, the fault electronic unit can be eliminated before being disposed (e.g. attached) to the electrical board 12, and then the good electronic unit can be replaced, so that the fault repair is quite easy, and the electronic device 1 can achieve a high process yield. The electronic component 131 is integrated to be expressed in the form of an electronic unit, when the electronic component is invalid, the electronic unit where the invalid electronic component is located is only required to be eliminated, and the whole electronic device 1 is not eliminated; in addition, the invention is applicable to electronic components with a micron level or below, so that the electronic units can be made into a size with a micron level or above, but not limited to, the size of which can be detected. The carrier plate 133 may be a rigid plate, a flexible plate, or a composite plate. In some embodiments, the carrier plate 133 may be a transparent plate or a non-transparent plate, which is not limited in the present invention.

In some embodiments, the aforementioned electronic structures (e.g., without limitation) include active devices such as Thin Film Transistors (TFTs) or active components (and/or integrated components thereof) of Silicon (or non-Silicon) integrated circuits (Silicon ICs), or passive devices such as passive components (and/or integrated components thereof) including capacitors, resistors, inductors, conductors, encoders, potentiometers, antennas, transformers, filters, attenuators, couplers, oscillators, radio frequency components, or microwave (or millimeter wave) components.

Referring to fig. 1C, each carrier 133 defines a working surface S3 on which the electronic component 131 is disposed and a connection surface S4 corresponding to the working surface S3; the carrier 133 has a conductive layer 1331 and a through hole H2 communicating with the working surface S3 and the connection surface S4. The conductive layer 1331 is located on the working surface S3 and may comprise, for example, a thin film circuit. In addition, the through hole H2 is a hole penetrating through the carrier 133 and the conductive layer 1331, and the sub-conductive member 132 is disposed in the through hole H2 and protrudes outward, and covers a portion of the conductive layer 1331 outside the through hole H2, so that the sub-conductive member 132 can electrically connect the conductive layer 1331 to the electrical layer 122 of the electrical board 12 through the through hole H2. In other words, the electronic component 131 is electrically connected to the electrical layer 122 of the electrical board 12 through the conductive layer 1331 of the carrier 133 and the sub-conductive member 132 located in the through hole H2 (and the conductive layer 1331). In some embodiments, the electrical board 12 further includes a plurality of driving components (not shown), and the driving components may respectively correspond to the electronic components 131 of the electronic unit 13, so as to correspondingly drive the electronic components 131 of the electronic unit 13. Here, the driving components of the electrical board 12 may be disposed on the first surface S1 and/or the second surface S2 of the board body 121, which is not limited. In addition, in some embodiments, since the electrical layer 122 of the electrical board 12 can be electrically connected to the circuit layer 111 of the supporting board 11 through the main conductive member 123 located in the through hole H1, the supporting board 11 can include a plurality of driving components (not shown), and the driving components of the supporting board 11 can correspondingly drive the electronic components 131 of the electronic unit 13 through the electrical board 12. In addition, in some embodiments, the driving component may also be disposed on the carrier plate 133 of the electronic unit 13 to drive the corresponding electronic component 131. The aforementioned drive components may comprise at least one Thin Film Transistor (TFT), or a silicon (or non-silicon) semiconductor based Integrated Circuit (IC). In some embodiments, the driving device may further include other thin film devices or circuits, such as thin film resistor, capacitor, or insulating film, in addition to the thin film transistor, and is not limited thereto, depending on the driving mode of the electronic device 131. It should be understood that, since the driving components of the supporting board 11 or the driving components of the electronic units 13 have active driving characteristics, it is understood that the same function of the driving components is realized, or the driving components are electronic components capable of covering the driving components, the electronic device 1 may optionally include a plurality of driving components (corresponding to the electronic units 13) on the supporting board 11, or one or more driving components (corresponding to the electronic components 131 in the present embodiment) on each electronic unit 13; of course, the corresponding driving components or active components are disposed on the supporting plate 11 and the electronic unit 13 for specific purposes, and are not limited. It will also be appreciated that when the driving or active components are applied to the support plate 11 or the electronic unit 13, the wiring layer 111 on the support plate 11 provides a pure transmission current, which is not in conflict with the previous embodiments.

In various embodiments, the carrier 133 may have a conductive layer 1331 and a through hole communicating the working surface S3 and the connecting surface S4, but the through hole is closed by the conductive layer 1331 or a conductive pad extending from the conductive layer 1331 (not shown); the secondary conductive element 132 is disposed in the through hole. In other words, when the carrier 133 is viewed from the top of the carrier 133, the through holes may or may not be covered by the conductive layer 1331, and the sub-conductive elements 132 in the through holes may be electrically connected to the conductive layer 1331; in this embodiment, the conductive layer 1331 covers the through hole and the sub-conductive member 132. In addition, in some embodiments, the carrier 133 may further include a plurality of signal lines (e.g. scan lines, data lines) in addition to the conductive layer 1331 for transmitting corresponding driving or control signals to the electronic component 131.

Referring to fig. 1A again, the number of the electronic components 131 of each electronic unit 13 in the present embodiment is 3, and each electronic component is a micro-electro-optical chip, for example, a micro-led chip, and is electrically connected to the electrical layer 122 of the electrical board 12 through the corresponding sub-conductive member 132. Of course, in different embodiments, the number of electronic components 131 of each electronic unit 13 may be 1, 2, or more than 3, and each electronic component 131 may be an optoelectronic chip or package with other dimensions, which is not limited.

In the present embodiment, the three electronic components 131 (micro light emitting diode chips) of each electronic unit 13 may have four connection terminals, for example, in a common anode or common cathode design. Taking the common cathode design as an example, there are 3 corresponding positive terminals and one shared negative terminal, as shown in fig. 1B, the 3 positive terminals can correspond to three smaller through holes H21 (H2) and three sub-conductive elements 132 located in the through holes H21, and one negative terminal can correspond to one larger through hole H22 (H2) and sub-conductive element 132 located in the through hole H22 (the through holes H21 and H22 can be referred to as through holes H2), so that the three electronic components 131 can be electrically connected with the electrical layer 122 of the electrical board 12 through the four sub-conductive elements 132 of the four through holes H2 (i.e., 3 and H21, 1H 22). In addition, in the present embodiment, the secondary conductive members 132 of the electronic units 13 and the main conductive members 123 of the electrical board 12 are disposed in a staggered manner along the projection direction of the electrical board 12. In other words, the four through holes H2 and the corresponding through holes H1 of each electronic unit 13 are also staggered along the projection direction of the electrical board 12.

In some embodiments, the same-property through holes H2 on the plurality of carrier plates 133 may correspond to one of the through holes H1, and the number of through holes H1 is equal to the number of the same-property through holes H2; taking the micro light emitting diode chip as an example, one of the through holes H21 corresponding to the positive electrode of the red micro light emitting diode chip on the plurality of carrier plates 133 corresponds to one of the through holes H1 together, and the like, the plurality of carrier plates 133 at least correspond to four through holes H1 together; however, the present invention is not limited thereto, for example, on the same electrical board 12, the plurality of carrier boards 133 at least correspond to the four through holes H1 together; the plurality of carrier plates 133 on the plurality of electrical boards 12 can be electrically connected to two adjacent electronic units 13 on two adjacent carrier plates 133 through one or two conductive members, and the number of through holes is reduced to less than four. For example, the number of through holes can be reduced to four or less by one or more extending circuit boards (such as flexible printed circuit board) on the same electrical board 12 or on multiple electrical boards 12. It is understood that one corner of each electronic unit 13 may be covered by one through hole H1, that is, four corners of each electronic unit 13 may be covered by different through holes H1; while one through hole H1 may cover one corner of a plurality of electronic units 13, for example, the same through hole H1 may cover one corner of four electronic units 13, respectively, which define different contents, and the different contents do not conflict and coexist.

In some embodiments, the projection area of the electronic unit 13 and the projection of the electronic component 131 are along the projection direction of the electrical board 12The ratio of the shadow area is not less than 5, i.e. the projected area of the electronic unit 13/the projected area of the electronic component 131 is not less than 5. For example, the projection area of the electronic unit 13 may be, for example, 0.4mm by 0.4 mm=0.16 mm ² The projection area of the electronic component 131 may be, for example, (3×0.0254) mm (5×0.0254) mm= 0.0096774mm ² The projected area of the electronic unit 13/the projected area of the electronic component 131>16.53. For example, the projection area of the electronic unit 13 may be, for example, 0.8mm by 0.8 mm=0.64 mm ² The projection area of the electronic component 131 may be, for example, (5×0.0254) mm (9×0.0254) mm= 0.0290322mm ² The projected area of the electronic unit 13/the projected area of the electronic component 131>22.04. For example, the projection area of the electronic unit 13 may be, for example, 0.4mm by 0.4 mm=0.16 mm ² The projection area of the electronic component 131 may be, for example, (5×0.0254) mm (9×0.0254) mm= 0.0290322mm ² The projected area of the electronic unit 13/the projected area of the electronic component 131>5.51。

In some embodiments, the ratio of the projected area of the electronic unit 13 to the projected area of the electronic component 131 is not less than 50. For example, the projection area of the electronic unit 13 may be, for example, 0.4mm by 0.4 mm=0.16 mm ² The projection area of the electronic component 131 may be, for example, 0.03mm by 0.06 mm=0.0018 mm ² The projected area of the electronic unit 13/the projected area of the electronic component 131=88.88. For example, the projection area of the electronic unit 13 may be, for example, 0.8mm by 0.8 mm=0.64 mm ² The projection area of the electronic component 131 may be, for example, (3×0.0254) mm (5×0.0254) mm= 0.0096774mm ² The projected area of the electronic unit 13/the projected area of the electronic component 131>66.13. In some embodiments, the ratio of the projected area of the electronic unit 13 to the projected area of the electronic component 131 may be not less than 100. For example, the projection area of the electronic unit 13 may be, for example, 0.46mm by 0.46 mm= 0.2116mm ² The projection area of the electronic component 131 may be, for example, 0.03mm by 0.06 mm=0.0018 mm ² The projected area of the electronic unit 13/the projected area of the electronic component 131= 117.56. The above values are examples only and are not intended to limit the present invention. It should be noted that the projection area and the electronic group of the electronic unit 13 are as described aboveThe projected area of member 131 is generally square for example, but is not limited to square.

In some embodiments, the electronic component 131 also defines a dimension along the projection direction of the electrical board 12 as a component width, which may be not greater than 80 mils, i.e., not greater than 80 mils. In some embodiments, the component width may be no greater than 12 mils (i.e., component width 12 mils). In some embodiments, the component width may be no less than 0.005mm (i.e., component width ≡0.005 mm), such as 0.008mm, 0.01mm, 3mil, 4mil, 5mil, or 7mil, etc.

On the above, in the electronic device 1 of the present embodiment, the through holes H1 of the electrical board 12 are connected to the first surface S1 and the second surface S2 of the board 121, and the main conductive members 123 are respectively disposed in the through holes H1 and electrically connect the electrical layer 122 of the electrical board 12 to the circuit layer 111 of the supporting board 11; the electronic units 13 are disposed on the first surface S1 of the plate body 121 of the electrical plate 12, and each electronic unit 13 and one of the through holes H1 of the electrical plate 12 are partially overlapped along the projection direction of the electrical plate 12; and, the secondary conductive members 132 (or the through holes H2) of the electronic units 13 and the main conductive members 123 (or the through holes H1) of the electrical board 12 are arranged in a staggered manner along the projection direction of the electrical board 12, so that the electronic device 1 is an electronic product different from the conventional electrical connection technology of the electronic units and the supporting board.

As shown in fig. 2, the electronic device 1 according to the present embodiment is different from the electronic device 1 according to the foregoing embodiment mainly in that, in the electronic device 1a according to the present embodiment, four electronic units 13 form an electronic structure, the electronic structure has a carrier plate 133, and the electronic components 131 of the electronic units 13 are disposed on the carrier plate 133. In other words, the four electronic units 13 form an electronic structure and share the same carrier 133, so if a fault occurs in one electronic unit, the electronic unit in the fault portion can be cut (e.g. laser cut) and removed before being disposed (e.g. bonded) to the electrical board 12, and then the well-tested electronic unit is replaced to be bonded to the electrical board 12, so that the fault repair is easy, and the electronic device 1a can achieve a high process yield.

In addition, as shown in fig. 3, the electronic device 1 is mainly different from the electronic device 1 of the foregoing embodiment in that in the electronic device 1b of the present embodiment, the number of the electrical boards 12 is plural, and the electrical boards 12 are spliced into, for example, a two-dimensional matrix shape. In this embodiment, 4 electronic units 13 are disposed on each electrical board 12, the 4 electronic units 13 are arranged in a 2x2 matrix, and the secondary conductive members 132 of the 4 electronic units 13 are disposed in a staggered manner along the projection direction of the electrical board 12 with the primary conductive members 123 of the electrical board 12.

As shown in fig. 4, the electronic device 1c according to the present embodiment is different from the electronic device 1b according to the foregoing embodiment mainly in that 9 electronic units 13 are provided on each of the electric boards 12, and the 9 electronic units 13 are arranged in a 3×3 matrix. In each electrical board 12, the 9 electronic units 13 are electrically connected to the circuit layer 111 of the supporting board 11 through the main conductive members 123 of the two through holes H1. In other words, one electronic unit 13 located between the two through holes H1 shares the two main conductors 123 of the two through holes H1 at the same time to be electrically connected with the wiring layer 111 of the support plate 11.

In the electronic device according to another embodiment of the present invention, the same applies to any of the embodiments of fig. 1A to 4, but at least one of the through holes H1 and the through holes H2 may be further omitted. Fig. 5A to 5C are respectively a partial schematic view, a partial exploded schematic view, and a sectional schematic view along a 5C-5C cutting line of the electronic device with the through hole H2 omitted.

As shown in fig. 5A to 5C, the carrier 133' may be provided with a plurality of conductive pads P on the connection surface S4, and the conductive pads P may be electrically connected to the electronic component 131' through a conductive layer (not shown) of the carrier 133 '; and the electronic unit 13 'can electrically connect the conductive pads P to the electrical layer 122 of the electrical board 12 through a plurality of sub-conductive elements 132'. Here, the conductive layer of the carrier 133' may be located on the working surface S3, the connecting surface S4, or between the working surface S3 and the connecting surface S4; the secondary conductive elements 132' may be solder balls, solder paste, or the like; the secondary conductive elements 132 'may be disposed on the electrical board 12 or the carrier 133', and when the secondary conductive elements 132 'are disposed on the carrier 133', the conductive pads P may not be visually available; the number of the conductive pads P and the sub-conductive members 132' is not limited to be the same as that when the electronic component 131 employs the common cathode or the common anode; each electronic unit 13 'may be a Surface Mount Device (SMD), and the electronic units 13' may further cover the electronic components 131 'on the carrier plate 133' to have a package or a packaging layer. It will be appreciated that each electronic unit 13 'may be electrically connected by one of the secondary conductors 132' being in direct contact with the primary conductor 123 located in the through hole H1 (direct contact electrical connection); or the secondary conductive elements 132 'of each electronic unit 13' are electrically connected to the electrical layer 122 of the electrical board 12, and are electrically connected to the main conductive element 123 (indirect contact electrical connection) located in the through hole H1 through the electrical layer 122 of the electrical board 12; alternatively still, these conductive pads P may be considered extensions or portions of the electrical layer 122. It can be understood that, when each of the electronic units 13' is electrically connected by directly or indirectly contacting one of the secondary conductive members 132' with the main conductive member 123 located in the through hole H1, the conductive pads P, the secondary conductive members 132', and the main conductive member 123 can be disposed in a staggered manner along the projection direction of the electrical board 12, so long as they can be electrically connected with each other. The offset arrangement refers to that the secondary conductive element 132 'and the primary conductive element 123 are completely offset or partially offset along the projection direction of the electrical board 12, so long as the secondary conductive element 132' and the primary conductive element 123 do not completely overlap (completely cover).

In other words, when the carrier 133' is viewed from the top side of the carrier 133', at least a portion or all of the sub-conductive members 132' are not visually accessible due to the coverage of the carrier 133', and when one main conductive member 123 (the same as the above embodiment) located in the through hole H1 is covered by a plurality of carriers 133', the main conductive member 123 may be completely shielded or slightly exposed. In the present embodiment, the electronic component 131' is electrically connected to the electrical layer 122 of the electrical board 12 through the conductive layer (and the conductive pad P) of the carrier 133', the secondary conductive element 132', and the electrical layer 122 of the electrical board 12 is electrically connected to the circuit layer 111 of the support plate 11 below the primary conductive element 123 through the through hole H1, so as to transmit electrical signals through the circuit layer 111, the electrical layer 122, and the primary conductive element 123. It will also be appreciated that one corner of each electronics unit 13 'may be covered by one main conductor 123, i.e., four corners of each electronics unit 13' may be covered by different main conductors 123; while one main conductor 123 may cover one corner of a plurality of electronic units 13', for example, the same main conductor 123 may cover one corner of four electronic units 13', respectively, both defining different contents, and the different contents do not conflict and coexist with each other.

In another embodiment of the present invention, the electronic device is equally applicable to any of the embodiments of fig. 1A to 4, but the through hole H1 (not shown) may be further omitted. The through hole H1 is omitted, and the electrical layer of the electrical board is electrically connected to the circuit layer of the supporting board by adopting a surface mounting technology. The electronic units can be placed on the electric plate before or after the electric plate is placed on the supporting plate, and the sequence is not limited. In some embodiments, the electronic unit may complete the step of mounting the electronic unit on the electrical board before the electrical board is mounted on the support board, so that the electronic unit and the electrical board may together form a unit or a module.

In another embodiment of the present invention, the electronic device can be applied to any of the embodiments shown in fig. 1A to 4, but the through hole H1 and the through hole H2 can be omitted at the same time, which is not repeated here.

In summary, in the electronic device of the present invention, the main conductive member is electrically connected to the circuit layer of the supporting plate, the electronic unit is electrically connected to the conductive layer of the carrier plate and the electrical layer of the electrical plate through the sub-conductive member, and the sub-conductive members of the electronic unit and the main conductive member of the electrical plate are arranged in a staggered manner along the projection direction of the electrical plate, so that the electronic device of the present invention is an electronic product different from the conventional electrical connection technology; the electronic device of the invention has the following advantages: the overall size of the electronic device is reduced, the layout density of electronic units on the electronic device is improved, the carrier plate or the electric plate has visual consistency (pitch) even though the carrier plate or the electric plate is spliced, defective products are easy to eliminate or repair, and the yield of the electronic device is improved; or, the main conductive piece can achieve the effect of electric connection through the dislocation arrangement of the main conductive piece and the secondary conductive piece, and the projection size of the main conductive piece is not reduced due to the reduction of the spacing of the electronic component, so that the improvement of the placement density of the electronic component and the like is facilitated. By means of the structure of the electronic device and the electrical connection relation of the components of the electronic device, if one of the electronic units is found to be faulty, the faulty electronic unit can be eliminated before being arranged on the electrical plate, and then the good electronic unit is used for replacing the faulty electronic unit, so that the fault repair is quite easy, and the high process yield can be achieved. The electronic component is integrated into the electronic unit, when one of the electronic components fails, the electronic unit where the failed electronic component is positioned is only needed to be eliminated, instead of eliminating the whole electronic device, so that the electronic device is easy to eliminate or repair defective products, and the yield of the electronic device can be improved. In addition, it is understood that the electronic unit, the electrical board, and the support board can be individually used as an independent electronic component, and the staggered electrical connection can be achieved through the technologies such as through holes or surface mounting.

The foregoing is by way of example only and is not intended as limiting. Any equivalent modifications or variations to the present invention without departing from the spirit and scope of the present invention are intended to be included in the scope of the following claims.

Claims

1. An electronic device, comprising:

the support plate is provided with a circuit layer;

the electric plate is provided with a plate body, a plurality of through holes penetrating through the plate body, an electric layer arranged on the plate body and a plurality of main conductive pieces respectively arranged on the through holes; the through holes are communicated with the first surface and the second surface of the plate body, and the main conductive piece is electrically connected with the electrical layer to the circuit layer of the supporting plate; and

the electronic units are arranged on the first surface of the plate body, and each electronic unit and one of the through holes are partially overlapped along the projection direction of the electric plate; each electronic unit is provided with an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer;

the secondary conductive piece of the electronic unit and the primary conductive piece of the electrical board are arranged in a staggered manner along the projection direction of the electrical board;

The ratio of the projection area of the electronic unit to the projection area of the electronic component is not less than 5.

2. The electronic device of claim 1, wherein each of the electronic units has a plurality of corners, one of the corners of each of the electronic units being covered by one of the through holes along the projection direction of the electrical board.

3. The electronic device of claim 1, wherein each of the electronic units has a plurality of corners, one of the through holes covering one of the corners of the electronic unit along the projection direction of the electrical board.

4. The electronic device of claim 1, wherein the electronic unit is a plurality of electronic structures, each of the electronic structures having a carrier, the electronic component being disposed on the carrier.

5. The electronic device of claim 1, wherein the electronic unit constitutes an electronic structure having a carrier board, the electronic component of the electronic unit being disposed on the carrier board.

6. The electronic device of claim 1, wherein the electronic units are arranged in an mxn matrix and cover at least one of the through holes along the projection direction of the electrical board, wherein m, n may be equal or non-equal positive integers.

7. The electronic device of claim 6, wherein the electronic units are arranged in a 2x2 matrix.

8. The electronic device of claim 1, wherein the number of the sub-conductive elements of each electronic unit is plural, and each sub-conductive element electrically connects the corresponding electronic component to the electrical layer.

9. The electronic device of claim 8, wherein the electronic component of each of the electronic units is a plurality of.

10. The electronic device of claim 1, wherein the electronic component is a micro-optoelectronic chip.

11. The electronic device of claim 1, wherein the electronic component is a drive component.

12. The electronic device of claim 1, wherein the electrical board further comprises a plurality of driving components, the driving components corresponding to the electronic components of the electronic unit, respectively.

13. The electronic device of claim 1, wherein the number of electrical boards is a plurality.

14. The electronic device of claim 1, wherein the support plate and the plate body of the electrical plate are respectively a rigid plate, a flexible plate, or a composite plate.

15. The electronic device of claim 14, wherein the support plate and/or the plate body of the electrical plate is a transparent plate.

16. The electronic device of claim 1, wherein the electronic component defines a component width of no greater than 80 mils.

17. The electronic device of claim 16, wherein the electronic component defines the component width to be no greater than 12 mils.

18. The electronic device of claim 16, wherein the electronic component defines the component width of not less than 0.005 millimeters.

19. The electronic device according to claim 4 or 5, wherein the carrier defines a working surface on which the electronic component is disposed and a connection surface corresponding to the working surface, the carrier has a conductive layer and a through hole communicating the working surface and the connection surface, and the sub-conductive member electrically connects the conductive layer to the electrical layer of the electrical board through the through hole.

20. The electronic device of claim 4 or 5, wherein the carrier plate is a rigid plate, a flexible plate, or a composite plate.

21. The electronic device of claim 20, wherein the carrier plate is a transparent plate.

22. An electronic device, comprising:

the support plate is provided with a circuit layer;

the electric plate is provided with a plate body, an electric layer arranged on the plate body and a plurality of main conductive pieces respectively and electrically connected with the electric layer; the main conductive element is electrically connected with the electrical layer to the circuit layer of the supporting plate; and

The electronic units are arranged on the first surface of the plate body, and each electronic unit and one of the main conductors are partially overlapped along the projection direction of the electric plate; each electronic unit is provided with an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer;

23. The electronic device of claim 22, wherein the electronic unit is a surface mount component.

24. The electronic device of claim 22, wherein each of the electronic units has a plurality of corners, one of the corners of each of the electronic units being covered by one of the main conductors along the projection direction of the electrical board.

25. The electronic device of claim 22, wherein each of the electronic units has a plurality of corners, one of the main conductors covering one of the corners of the plurality of electronic units along the projection direction of the electrical plate.

26. The electronic device of claim 22, wherein the electronic unit is a plurality of electronic structures, each of the electronic structures having a carrier, the electronic component being disposed on the carrier.

27. The electronic device of claim 22, wherein the electronic component is a micro-optoelectronic chip.

28. The electronic device of claim 22, wherein the electronic unit further comprises an encapsulation layer covering the electronic component.

29. The electronic device of claim 22, wherein the electronic unit forms an electronic structure having a carrier, the electronic component of the electronic unit being disposed on the carrier.

30. The electronic device of claim 22, wherein the electronic units are arranged in an mxn matrix and cover at least one of the main conductors along the projection direction of the electrical board, wherein m and n may be equal or non-equal positive integers.

31. The electronic device of claim 30, wherein the electronic units are arranged in a 4x4 matrix.

32. The electronic device of claim 22, wherein the number of the sub-conductive elements of each electronic unit is plural, and each sub-conductive element electrically connects the corresponding electronic component to the electrical layer.

33. The electronic device of claim 22, wherein the secondary conductive element of each of the electronic units is a solder ball.

34. The electronic device of claim 22, wherein the electrical board further comprises a plurality of driving components, the driving components corresponding to the electronic components of the electronic unit, respectively.

35. The electronic device of claim 34, wherein the driving component is a thin film transistor, or an integrated circuit.