CN108962842A - The encapsulating structure and its manufacturing method of fingerprint recognition chip - Google Patents

The encapsulating structure and its manufacturing method of fingerprint recognition chip Download PDF

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Publication number
CN108962842A
CN108962842A CN201710704902.7A CN201710704902A CN108962842A CN 108962842 A CN108962842 A CN 108962842A CN 201710704902 A CN201710704902 A CN 201710704902A CN 108962842 A CN108962842 A CN 108962842A
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CN
China
Prior art keywords
fingerprint recognition
glass substrate
silica glass
encapsulating
sensing unit
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Pending
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CN201710704902.7A
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Chinese (zh)
Inventor
石智仁
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ChipMOS Technologies Inc
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ChipMOS Technologies Inc
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Priority to TW106117489A priority Critical patent/TWI653728B/en
Priority to TW106117489 priority
Application filed by ChipMOS Technologies Inc filed Critical ChipMOS Technologies Inc
Publication of CN108962842A publication Critical patent/CN108962842A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K9/00Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
    • G06K9/00006Acquiring or recognising fingerprints or palmprints
    • G06K9/00013Image acquisition
    • G06K9/0002Image acquisition by non-optical methods, e.g. by ultrasonic or capacitive sensing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142Sealing arrangements between parts, e.g. adhesion promotors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226Via connections in a multilevel interconnection structure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

The present invention provides the encapsulating structure and its manufacturing method of a kind of fingerprint recognition chip, including silica glass substrate, fingerprint sensing unit, fingerprint recognition control chip, multiple conductive external terminals and packing colloid.Fingerprint sensing unit is set on silica glass substrate.Fingerprint sensing unit includes multiple reconfiguration line layers, multiple insulating layers and a protective layer.These reconfiguration line layers and these insulating layers stacking alternating with each other and the covering of protected layer.Fingerprint recognition controls chip and fingerprint sensing unit is electrically connected.These conductive external terminals are set on silica glass substrate, and are electrically connected with fingerprint sensing unit.Packing colloid is set on silica glass substrate, and covers fingerprint recognition control chip and these conductive external terminals, and expose a part of these conductive external terminals.

Description

The encapsulating structure and its manufacturing method of fingerprint recognition chip
Technical field
The present invention relates to a kind of encapsulating structure and its manufacturing method more particularly to a kind of encapsulating structures of fingerprint recognition chip And its manufacturing method.
Background technique
With the development of science and technology more and more electronic devices for needing to identify user's information come into being, such as refer to The encapsulating structure of line identification chip, the encapsulating structure of such fingerprint recognition chip can be installed in all kinds of electronic products, such as Smart phone, mobile phone, tablet computer, laptop and personal digital assistant (PDA) etc., to recognize user's Fingerprint, and the encapsulating structure that how produce the fingerprint recognition chip of low cost is that the project inquired into is wanted in this field.
Existing Fingerprint Identification Unit is to be covered chip in multilayer line institute structure using flip (Flip-Chip) encapsulation technology At sensing substrate on, and the sensing of fingerprint is carried out by the route on sensing substrate, but since this kind makes multilayer base The technology of plate often rests in particular vendor, so that the comparable height of the acquisition cost of multilager base plate, is unfavorable for Fingerprint Identification Unit Development.
Summary of the invention
The present invention provides a kind of encapsulating structure of fingerprint recognition chip, and small in size and manufacturing cost is low.
The present invention separately provides a kind of manufacturing method of the encapsulating structure of fingerprint recognition chip, can manufacture small in size and make Make fingerprint recognition chip-packaging structure at low cost.
The embodiment of the present invention provides a kind of encapsulating structure of fingerprint recognition chip, including silica glass substrate, fingerprint sensing Unit, fingerprint recognition control chip, multiple conductive external terminals and packing colloid.Fingerprint sensing unit is set to silica glass base On plate.Fingerprint sensing unit includes multiple reconfiguration line layers, multiple insulating layers and protective layer.These reconfiguration line layers with And these insulating layers stacking alternating with each other, and protected layer covers.Self is formed between these reconfiguration line layers to hand over Wrong sense line.Fingerprint recognition control chip is set on fingerprint sensing unit, and is electrically connected with fingerprint sensing unit.It is more A conductive external terminal is set on silica glass substrate, and is electrically connected with fingerprint sensing unit.Packing colloid is set to silicon glass On glass substrate, and fingerprint recognition control chip and these conductive external terminals are covered, and expose these conductive external terminals A part.
In one embodiment of this invention, these above-mentioned reconfiguration line layers further include multiple via holes.Pass through these Via hole is electrically connected the first reconfiguration line layer, the second reconfiguration line layer and in these reconfiguration line layers Three reconfiguration line layers.
In one embodiment of this invention, the encapsulating structure of above-mentioned fingerprint recognition chip further includes ink layer.Silica glass Substrate has each other relative first surface and the second surface.First surface is touch surface.Ink layer is set to first surface And at least one in second surface.
In one embodiment of this invention, these above-mentioned conductive external terminals are tin ball or conductive column.
In one embodiment of this invention, these above-mentioned conduct pieces are tin ball or bonding wire.
The embodiment of the present invention provides a kind of manufacturing method of the encapsulating structure of fingerprint recognition chip, including provides silica glass Substrate.Fingerprint sensing unit is formed on silica glass substrate.Fingerprint sensing unit includes multiple reconfiguration line layers, multiple insulation Layer and protective layer, and these reconfiguration line layers and these insulating layers stacking alternating with each other, and protected layer covers, and Self staggered sense line is formed between these reconfiguration line layers.These conduct pieces are formed in fingerprint sensing unit On.Fingerprint recognition is set and controls chip on fingerprint sensing unit, and make fingerprint recognition control chip by these conduct pieces with Fingerprint sensing unit is electrically connected.Multiple conductive external terminals are formed electrically to connect on silica glass substrate and with fingerprint sensing unit It connects.Packing colloid is formed on silica glass substrate, and packing colloid covering fingerprint recognition control chip and these external conductive ends Son, and expose a part of these conductive external terminals.
In one embodiment of this invention, the formation fingerprint sensing unit in above-mentioned production method is on silica glass substrate The step of in, the step of forming these reconfiguration line layers and these insulating layers further includes between these reconfiguration line layers Form multiple via holes.First be electrically connected in these reconfiguration line layers by these via holes reconfigures route Layer, the second reconfiguration line layer and third reconfiguration line layer.
In one embodiment of this invention, above-mentioned silica glass substrate has each other relative first surface and the second table Face.First surface is touch surface.In above-mentioned production method, fingerprint sensing unit is being formed in the step on silica glass substrate Before, further includes: form at least one of ink layer in first surface and second surface.
In one embodiment of this invention, these above-mentioned conductive external terminals are tin ball or conductive column.
In one embodiment of this invention, these above-mentioned conduct pieces are tin ball or bonding wire.
Based on above-mentioned, in the encapsulating structure of the fingerprint recognition chip of the embodiment of the present invention, these reconfiguration line layers exist Self staggered sense line is formed on silica glass substrate, since silica glass substrate is at low cost, and using reconfiguring Mode come formed route can make whole fingerprint recognition chip encapsulating structure encapsulation volume it is smaller.Therefore, it is mounted with the present invention The electronic device of the encapsulating structure of the fingerprint recognition chip of embodiment both can achieve except the function of fingerprint recognition, and can be with With lesser volume and lower manufacturing cost.In addition, the embodiment of the present invention separately provides a kind of encapsulation of fingerprint recognition chip The manufacturing method of structure, to produce the encapsulating structure of above-mentioned fingerprint recognition chip, fingerprint through the embodiment of the present invention is known The encapsulating structure for the fingerprint recognition chip that the manufacturing method of the encapsulating structure of other chip produces have lesser volume with it is lower Manufacturing cost.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to cooperate attached drawing to make Carefully it is described as follows.
Detailed description of the invention
Figure 1A to Fig. 1 G is the manufacturing method of the encapsulating structure of the fingerprint recognition chip of various embodiments of the present invention.
Fig. 2 is each layer reconfiguration line layer in Fig. 1 E, each layer insulating, fingerprint recognition control chip, protective layer, silica glass The explosive view of substrate.
100,100a, 100b: the encapsulating structure of fingerprint recognition chip
110: silica glass substrate
112: first surface
114: second surface
120: fingerprint sensing unit
122: reconfiguration line layer
1221: the first reconfiguration line layers
1222: the second reconfiguration line layers
1223: third reconfiguration line layer
124: insulating layer
1241: the first insulating layers
1242: second insulating layer
130,130 ': conduct piece
140: fingerprint recognition controls chip
150: conductive external terminal
160: packing colloid
170: ink layer
AS: active surface
BS: the back side
IS: adhesion layer
PL: protective layer
V: via hole
O1: the first aperture
O2: the second aperture
Specific embodiment
Figure 1A to Fig. 1 G is the manufacturing method of the encapsulating structure of the fingerprint recognition chip of various embodiments of the present invention.Fig. 2 is Each layer reconfiguration line layer, each layer insulating, fingerprint recognition control the explosive view of chip, protective layer, silica glass substrate in Fig. 1 E. It shows for clarity, Fig. 2 omission shows conductive external terminal, the second aperture and packing colloid.
The manufacturing method of the encapsulating structure 100 of the fingerprint recognition chip of the embodiment of the present invention is introduced in the following paragraphs. Please also refer to Figure 1A, a silica glass substrate 110, e.g. a Silicon Wafer are provided.Silica glass substrate 110 has relative to each other the One surface 112 and second surface 114.In the present embodiment, first surface 112 is, for example, the lower surface of silica glass substrate 110, Second surface 114 is, for example, the upper surface of silica glass substrate 110, wherein silica glass substrate 110 can be wafer pattern, but this hair It is bright to be not limited thereto system.
Figure 1B and Fig. 2 is please referred to, forms fingerprint sensing unit 120 in the second surface 114 on silica glass substrate 110 On.Fingerprint sensing unit 120 includes multiple reconfiguration line layers 122, multiple insulating layers 124 and a protective layer PL, wherein these Reconfiguration line layer 122 and these stackings alternating with each other of insulating layer 124, and that are formed between multilayer reconfiguration line layer 122 Staggered sense line above and below this, and protective layer PL is covered in top layer, wherein have multiple first to open on protective layer PL Hole O1 and multiple second aperture O2 is to expose the external of reconfiguration line layer and internal electrical connection pad.In the present embodiment, The processing procedure of these reconfiguration line layers 122 and these insulating layers 124 is formed e.g. with exposure development processing procedure, and these are reconfigured The quantity for setting line layer 122 is, for example, three layers, and is the first reconfiguration line layer 1221, the second reconfiguration line layer 1222 respectively And third reconfiguration line layer 1223, wherein these first reconfiguration line layers 1221, the second reconfiguration line layer 1222 with And third reconfiguration line layer 1223 is electrically connected by multiple via hole V.And the quantity of insulating layer 124 is, for example, two Layer, is the first insulating layer 1241 and second insulating layer 1242 respectively.The quantity of these reconfiguration line layers 122 and these insulation The quantity of layer 124 can be adjusted according to demand, system that the present invention is not limited thereto.
Please refer to Fig. 1 C, setting fingerprint recognition controls chip 140 on fingerprint sensing unit 120, and makes fingerprint recognition control Coremaking piece 140 is electrically connected by multiple conduct pieces 130 with fingerprint sensing unit 120.In the present embodiment.Fingerprint recognition control These conduct pieces 130 on chip 140 are electrically connected by these the first aperture O1 on protective layer PL with fingerprint sensing unit 120 It connects.The embodiment of these conduct pieces 130 is, for example, conductive column (Conductive Column).In other examples, this The embodiment of a little conduct pieces 130 is also possible to tin ball (Solder Ball) and fingerprint recognition control chip 140 is, for example, with flip Mode, be set on fingerprint sensing unit 120 downward with active surface AS.Referring to Fig. 1 C and Fig. 2, come in detail It says, fingerprint recognition controls the third reconfiguration line layer that chip 140 passes through these conduct pieces 130 and fingerprint sensing unit 120 1223 are electrically connected.
Fig. 1 D is please referred to, multiple conductive external terminals 150 are set on silica glass substrate 110, by protective layer PL Second aperture O2 is electrically connected with fingerprint sensing unit 120.In the present embodiment, the reality of these conductive external terminals 150 The mode of applying is, for example, tin ball (Solder Ball), in other examples, the embodiment of these conductive external terminals 150 E.g. conductive column (Conductive Column), system that the present invention is not limited thereto.Fig. 1 E is please referred to, packing colloid is formed 160 on silica glass substrate 110.Packing colloid 160 covers fingerprint recognition control chip 140 and these conductive external terminals 150, And expose a part of these conductive external terminals 150.So far, the encapsulating structure 100 of the fingerprint recognition chip of the present embodiment Generally complete.When the hand of user is touched to the first surface 112 of silica glass substrate 110, fingerprint sensing list These reconfiguration line layers 122 in member 120 can generate inductance capacitance, these reconfiguration line layers 122 with the fingerprint of user Inductance capacitance signal is transferred to fingerprint recognition by these conduct pieces 130 and controls chip 140, so that fingerprint recognition controls chip 140 sense fingerprint pattern according to the inductance capacitance signal from reconfiguration line layer 122.
Hold it is above-mentioned, in the encapsulating structure 100 of the fingerprint recognition chip of the embodiment of the present invention, these reconfiguration line layers 122 on silica glass substrate 110 formed self staggered sense line, since silica glass substrate 110 is at low cost, and benefit Route is formed with the mode reconfigured can make the encapsulation volume of the encapsulating structure 100 of whole fingerprint recognition chip smaller.Therefore, The electronic device for being mounted with the fingerprint recognition structure 100 of the embodiment of the present invention both can achieve the function of fingerprint recognition, and can With lesser volume and lower manufacturing cost.In addition, the embodiment of the present invention separately provides a kind of envelope of fingerprint recognition chip The manufacturing method of assembling structure, to produce the encapsulating structure 100 of above-mentioned fingerprint recognition chip, finger through the embodiment of the present invention The encapsulating structure 100 for the fingerprint recognition chip that the manufacturing method of the encapsulating structure of line identification chip produces has lesser volume With lower manufacturing cost.In addition, the silica glass substrate in the encapsulating structure 100 of the fingerprint recognition chip of the embodiment of the present invention 110 also have the function of protection.
Fig. 1 F is the schematic diagram according to a kind of encapsulating structure of fingerprint recognition chip of one more embodiment of the present invention.It please join Read Fig. 1 F, the master of the encapsulating structure 100 of the fingerprint recognition chip of the encapsulating structure 100a and Fig. 1 E of the fingerprint recognition chip of Fig. 1 F Difference is wanted to be, in the present embodiment, fingerprint recognition controls chip 140 and is set to silicon glass with its back surface B S and by adhesion layer IS 110 on glass substrate, and multiple conduct pieces 130 ' are formed on fingerprint sensing unit 120.In the present embodiment, these conduct pieces 130 ' implementation is, for example, bonding wire (Bonding Wire), that is to say, that the encapsulating structure of the fingerprint recognition chip of the present embodiment Manufacturer's genealogy of law of 100a connects fingerprint recognition control chip 140 electrically with fingerprint sensing unit 120 It connects.
Please refer to Fig. 1 G, the encapsulation of the fingerprint recognition chip of the encapsulating structure 100b and Fig. 1 F of the fingerprint recognition chip of Fig. 1 G The main difference of structure 100 is, is forming fingerprint sensing unit 120 before the step on silica glass substrate 110, is further including Form at least one of ink layer 170 in the first surface 112 and second surface 114 of silica glass substrate 110.Specifically For, in the present embodiment, ink layer 170 is formed in the second surface 114 of silica glass substrate 110.In other unshowned realities It applies in example, ink layer 170 can be formed at the first surface 112 of silica glass substrate 110 or be simultaneously formed in silica glass The first surface 112 of substrate 110 and the second surface 114 of silica glass substrate 110, system that the present invention is not limited thereto.
Since the encapsulating structure 100b of the fingerprint recognition chip of the embodiment of the present invention has ink layer 170, can take Color with ink layer 170 is designed appearance.For example, it if the color of ink layer 170 is black, can cover interior The route in portion.
In conclusion these reconfiguration line layers exist in the encapsulating structure of the fingerprint recognition chip of the embodiment of the present invention Self staggered sense line is formed on silica glass substrate, since silica glass substrate is at low cost, and using reconfiguring Mode come formed route can make whole fingerprint recognition chip encapsulating structure encapsulation volume it is smaller.Therefore, it is mounted with the present invention The electronic device of the structure of the fingerprint recognition chip of embodiment both can achieve except the function of fingerprint recognition, and can have Lesser volume and lower manufacturing cost.In addition, the embodiment of the present invention separately provides a kind of encapsulating structure of fingerprint recognition chip Manufacturing method, to produce the encapsulating structure of above-mentioned fingerprint recognition chip, fingerprint recognition core through the embodiment of the present invention The encapsulating structure for the fingerprint recognition chip that the manufacturing method of the encapsulating structure of piece produces has lesser volume and lower system Cause this.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any technical field Middle technical staff, without departing from the spirit and scope of the present invention, when can make some changes and embellishment, therefore protection of the invention Range is subject to view as defined in claim.

Claims (10)

1. a kind of encapsulating structure of fingerprint recognition chip, comprising:
Silica glass substrate;
Fingerprint sensing unit is set on the silica glass substrate, the fingerprint sensing unit include multiple reconfiguration line layers, Multiple insulating layers and protective layer, and the multiple reconfiguration line layer and the multiple insulating layer stacking alternating with each other, and Self staggered sense line is formed between the multiple reconfiguration line layer, and in the multiple reconfiguration line layer Upper protective mulch;
Fingerprint recognition controls chip, is set on the fingerprint sensing unit, and passes through multiple conduct pieces and the fingerprint sensing Unit is electrically connected;
Multiple conductive external terminals are set on the silica glass substrate and the fingerprint sensing list on the silica glass substrate Member is electrically connected;And
Packing colloid is set on the silica glass substrate, and covers the fingerprint recognition control chip and the multiple outside Conductive terminal, and expose a part of the multiple conductive external terminal.
2. the encapsulating structure of fingerprint recognition chip according to claim 1, wherein the multiple reconfiguration line layer is also wrapped Multiple via holes are included, first be electrically connected in the multiple reconfiguration line layer by the multiple via hole reconfigures Line layer, the second reconfiguration line layer and third reconfiguration line layer.
3. the encapsulating structure of fingerprint recognition chip according to claim 1, further includes:
Ink layer, the silica glass substrate have each other relative first surface and the second surface, and the first surface is touching Control face, wherein the ink layer is set at least one in the first surface and the second surface.
4. the encapsulating structure of fingerprint recognition chip according to claim 1, wherein the multiple conductive external terminal is tin Ball or conductive column.
5. the encapsulating structure of fingerprint recognition chip according to claim 1, wherein the multiple conduct piece is tin ball or weldering Line.
6. a kind of production method of the encapsulating structure of fingerprint recognition chip, comprising:
Silica glass substrate is provided;
Fingerprint sensing unit is formed on the silica glass substrate, the fingerprint sensing unit include multiple reconfiguration line layers, Multiple insulating layers and protective layer, and the multiple reconfiguration line layer and the multiple insulating layer it is alternating with each other stacking in Self staggered sense line is formed between the multiple reconfiguration line layer, and in the multiple reconfiguration line layer Protective mulch;
Multiple conduct pieces are formed on the fingerprint sensing unit;
Fingerprint recognition is set and controls chip on the fingerprint sensing unit, and it is described to pass through the fingerprint recognition control chip Multiple conduct pieces and the fingerprint sensing unit are electrically connected;
Multiple conductive external terminals are formed to be electrically connected on the silica glass substrate and with the fingerprint sensing unit;And
Packing colloid is formed on the silica glass substrate, and the packing colloid covers the fingerprint recognition control chip and institute Multiple conductive external terminals are stated, and expose a part of the multiple conductive external terminal.
7. the production method of the encapsulating structure of fingerprint recognition chip according to claim 6, wherein forming the fingerprint Sensing unit forms the multiple reconfiguration line layer and the multiple insulating layer in the step on the silica glass substrate The step of further include that multiple via holes are formed between the multiple reconfiguration line layer, electricity is given by the multiple via hole The first reconfiguration line layer, the second reconfiguration line layer and the third that property connects in the multiple reconfiguration line layer reconfigure Line layer.
8. the production method of the encapsulating structure of fingerprint recognition chip according to claim 6, wherein the silica glass substrate With each other relative first surface and the second surface, the first surface is touch surface, is forming the fingerprint sensing list Member is before the step on the silica glass substrate, further includes: forms ink layer in the first surface and second table At least one in face.
9. the production method of the encapsulating structure of fingerprint recognition chip according to claim 6, wherein lead the multiple outside Electric terminal is tin ball or conductive column.
10. the production method of the encapsulating structure of fingerprint recognition chip according to claim 6, wherein the multiple conduction Part is tin ball or bonding wire.
CN201710704902.7A 2017-05-26 2017-08-17 The encapsulating structure and its manufacturing method of fingerprint recognition chip Pending CN108962842A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW106117489A TWI653728B (en) 2017-05-26 2017-05-26 Packaging structure of fingerprint identification wafer and manufacturing method thereof
TW106117489 2017-05-26

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CN108962842A true CN108962842A (en) 2018-12-07

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