TW202226818A - Image processing device, method and lens module with the same - Google Patents
Image processing device, method and lens module with the same Download PDFInfo
- Publication number
- TW202226818A TW202226818A TW109146099A TW109146099A TW202226818A TW 202226818 A TW202226818 A TW 202226818A TW 109146099 A TW109146099 A TW 109146099A TW 109146099 A TW109146099 A TW 109146099A TW 202226818 A TW202226818 A TW 202226818A
- Authority
- TW
- Taiwan
- Prior art keywords
- image
- bayer
- pixel
- array
- filter
- Prior art date
Links
Images
Abstract
Description
本發明涉及圖像處理技術領域,尤其涉及一種圖像處理裝置、方法及具有該圖像處理裝置之鏡頭模組。The present invention relates to the technical field of image processing, and in particular, to an image processing device, a method and a lens module having the image processing device.
因鏡頭模組可藉由反射棱鏡對光路進行折疊,以實現於不增加手機厚度之基礎上,提高變焦能力,使得手機相機拍得更遠。然而,該反射棱鏡之設置使得鏡頭模組之散射及色散問題嚴重,影響成像品質。Because the lens module can fold the light path through the reflective prism, it can improve the zoom capability without increasing the thickness of the mobile phone, so that the mobile phone camera can shoot farther. However, the setting of the reflecting prism makes the scattering and dispersion problems of the lens module serious, which affects the image quality.
請一併參閱圖1及圖2,通常大像素之感光面積比小像素之感光面積更大。因此於同一光圈下,當同樣之一束入射光照射下,入射光入射至大像素時,更少進入相鄰像素。從而,採用大像素可有效降低像素與像素之間之顏色串擾問題。另一方面,藉由限縮入射光之進光量以降低入射光之入射角度,也可有效降低大角度散射光和色散光對相鄰像素造成之影響。因此,習知潛望式鏡頭模組藉由採用較大尺寸之像素和較小之光圈,以降低像素與像素之間之顏色串擾,從而避免大角度散射光和色散光之影響。然而,若選用大尺寸像素,於圖像感測器大小相同之條件下,會減少像素數量,影響成像清晰度。若採用較小之光圈,則影響成像亮度,不利於昏暗場景下之拍攝。例如,習知手機上搭載之潛望式鏡頭模組之光圈值大多於F5.0-F3.0範圍內,且每一像素單位面積大多於1.0-1.12微米範圍內。顯然,該種配置使得習知鏡頭模組之成像品質較差。Please refer to FIG. 1 and FIG. 2 together. Generally, the photosensitive area of a large pixel is larger than that of a small pixel. Therefore, under the same aperture, when the same beam of incident light is irradiated, when the incident light is incident on a large pixel, less of the incident light enters adjacent pixels. Therefore, the use of large pixels can effectively reduce the problem of color crosstalk between pixels. On the other hand, by limiting the amount of incoming light to reduce the incident angle of the incident light, the influence of large-angle scattered light and scattered light on adjacent pixels can also be effectively reduced. Therefore, the conventional periscope lens module uses larger-sized pixels and smaller apertures to reduce color crosstalk between pixels, thereby avoiding the effects of large-angle scattered light and chromatic light. However, if large-sized pixels are selected, the number of pixels will be reduced under the condition of the same size of the image sensor, which will affect the image clarity. If a smaller aperture is used, the image brightness will be affected, which is not conducive to shooting in dark scenes. For example, the aperture value of the periscope lens module mounted on the conventional mobile phone is mostly in the range of F5.0-F3.0, and the unit area of each pixel is mostly in the range of 1.0-1.12 microns. Obviously, this configuration makes the imaging quality of the conventional lens module poor.
鑒於以上內容,本發明提供一種圖像處理裝置、方法及具有該圖像處理裝置之鏡頭模組,以有效提高成像品質。In view of the above, the present invention provides an image processing apparatus, a method, and a lens module having the image processing apparatus, so as to effectively improve the imaging quality.
本發明第一方面提供一種圖像處理裝置,包括圖像感測器及圖像訊號處理器,所述圖像感測器包括像素陣列及濾光陣列,所述濾光陣列對應所述像素陣列設置,所述濾光陣列包括複數濾光單元,複數所述濾光單元將所述像素陣列劃分為複數像素單元,每一像素單元包括複數像素,每一所述濾光單元對應一個像素單元,且允許一種有色光入射至所述像素單元,以生成一第一拜耳圖像,所述圖像訊號處理器與所述圖像感測器電連接,用以接收所述圖像感測器輸出之第一拜耳圖像,並對所述第一拜耳圖像進行處理,以輸出第一圖像或第二圖像。A first aspect of the present invention provides an image processing device, including an image sensor and an image signal processor, the image sensor including a pixel array and a filter array, the filter array corresponding to the pixel array It is arranged that the filter array includes a plurality of filter units, the filter units divide the pixel array into a plurality of pixel units, each pixel unit includes a plurality of pixels, and each of the filter units corresponds to a pixel unit, and allowing a colored light to be incident on the pixel unit to generate a first Bayer image, the image signal processor is electrically connected to the image sensor for receiving the output of the image sensor and processing the first Bayer image to output the first image or the second image.
進一步地,所述圖像感測器還包括微透鏡陣列,所述微透鏡陣列包括複數微透鏡,每一所述微透鏡對應所述濾光陣列之一個濾光單元及所述像素陣列之一個像素單元設置。Further, the image sensor further includes a microlens array, the microlens array includes a plurality of microlenses, each of the microlenses corresponds to one filter unit of the filter array and one of the pixel arrays Pixel unit settings.
進一步地,複數所述濾光單元之數量為四個,四個所述濾光單元相鄰設置,以構成2*2之濾光陣列,並將所述像素陣列劃分為四個所述像素單元。Further, the number of the plurality of filter units is four, and the four filter units are arranged adjacent to each other to form a 2*2 filter array, and the pixel array is divided into four pixel units. .
進一步地,所述圖像訊號處理器包括切換模組,第一處理模組及第二處理模組,所述切換模組用以接收所述圖像感測器輸出之第一拜耳圖像,並根據所述圖像訊號處理器之當前模式,選擇或觸發所述第一處理模組或所述第二處理模組,以使得第一處理模組或所述第二處理模組對所述第一拜耳圖像進行處理,進而輸出所述第一圖像或第二圖像。Further, the image signal processor includes a switching module, a first processing module and a second processing module, the switching module is used for receiving the first Bayer image output by the image sensor, and according to the current mode of the image signal processor, select or trigger the first processing module or the second processing module, so that the first processing module or the second processing module The first Bayer image is processed to output the first image or the second image.
進一步地,當所述圖像訊號處理器處於第一模式時,所述第一處理模組接收所述切換模塊轉送之第一拜耳圖像,並對所述第一拜耳圖像進行像素重排,以得到第二拜耳圖像,再對所述第二拜耳圖像進行去馬賽克處理,得到所述第一圖像。Further, when the image signal processor is in the first mode, the first processing module receives the first Bayer image transmitted by the switching module, and performs pixel rearrangement on the first Bayer image , to obtain a second Bayer image, and then perform demosaic processing on the second Bayer image to obtain the first image.
進一步地,所述圖像訊號處理器還包括濾波單元,所述濾波單元用以於生成所述第二拜耳圖像之前,先對所述第一拜耳圖像中之每一像素單元進行均值濾波。Further, the image signal processor further includes a filtering unit, and the filtering unit is configured to perform mean filtering on each pixel unit in the first Bayer image before generating the second Bayer image .
進一步地,當所述圖像訊號處理器處於第二模式時,所述第二處理模組接收所述切換模塊轉送之第一拜耳圖像,並對所述第一拜耳圖像進行像素合併處理,以得到第三拜耳圖像,再對所述第三拜耳圖像進行去馬賽克處理,得到所述第二圖像。Further, when the image signal processor is in the second mode, the second processing module receives the first Bayer image transmitted by the switching module, and performs pixel combination processing on the first Bayer image , to obtain a third Bayer image, and then perform demosaic processing on the third Bayer image to obtain the second image.
本發明第二方面還提供一種鏡頭模組,包括潛望式鏡頭,所述鏡頭模組還包括如上述所述之圖像處理裝置。A second aspect of the present invention further provides a lens module, including a periscope lens, and the lens module further includes the above-mentioned image processing device.
本發明第三方面提供一種圖像處理方法,所述圖像處理方法包括:A third aspect of the present invention provides an image processing method, the image processing method comprising:
獲取一第一拜耳圖像;acquiring a first Bayer image;
根據當前模式,切換至相應之處理模組;According to the current mode, switch to the corresponding processing module;
對所述第一拜耳圖像進行圖像處理,以獲得第一圖像或第二圖像。Image processing is performed on the first Bayer image to obtain a first image or a second image.
進一步地,當處於第一模式時,對所述第一拜耳圖像進行像素重排,得到第二拜耳圖像,繼而對所述第二拜耳圖像進行去馬賽克處理,得到所述第一圖像;當處於第二模式時,對所述第一拜耳圖像進行像素合併,得到第三拜耳圖像,繼而對所述第三拜耳圖像進行去馬賽克處理,得到所述第二圖像。Further, when in the first mode, pixel rearrangement is performed on the first Bayer image to obtain a second Bayer image, and then demosaicing is performed on the second Bayer image to obtain the first image image; when in the second mode, pixel binning is performed on the first Bayer image to obtain a third Bayer image, and then demosaicing is performed on the third Bayer image to obtain the second image.
本發明提供之圖像處理裝置、方法及具有該圖像處理裝置之鏡頭模組,可適應各種焦段及場景,克服了習知潛望式鏡頭因光圈較小、像素面積較大造成之圖像解析度低和亮度低,及像素間因散射光及色散光造成之顏色串擾之問題,有效提高成像品質。The image processing device, method and lens module provided by the present invention can adapt to various focal lengths and scenes, and overcome the image resolution caused by the small aperture and large pixel area of the conventional periscope lens. Low brightness and low brightness, as well as color crosstalk caused by scattered light and chromatic light between pixels, effectively improve imaging quality.
下面將結合本發明實施例中之附圖,對本發明實施例中之技術方案進行清楚、完整地描述,顯然,所描述之實施例僅僅係本發明一部分實施例,而非全部之實施例。基於本發明中之實施例,本領域具有通常技藝者於沒有做出創造性勞動前提下所獲得之所有其他實施例,都屬於本發明保護之範圍。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work shall fall within the protection scope of the present invention.
需要說明的是,當一個元件被稱為“電連接”另一個元件,它可以直接於另一個元件上或者也可以存在居中之元件。當一個元件被認為係“電連接”另一個元件,它可以係接觸連接,例如,可以係導線連接之方式,也可以係非接觸式連接,例如,可以係非接觸式耦合之方式。It should be noted that when an element is referred to as being "electrically connected" to another element, it can be directly on the other element or an intervening element may also be present. When an element is considered to be "electrically connected" to another element, it can be connected by contact, eg, by wire connection, or by non-contact connection, eg, by non-contact coupling.
除非另有定義,本文所使用之所有技術和科學術語與屬於本發明之技術領域之技術人員通常理解之含義相同。本文中於本發明之說明書中所使用之術語僅為了描述具體之實施例之目的,而非旨於限制本發明。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
下面結合附圖,對本發明之一些實施方式作詳細說明。於不衝突之情況下,下述之實施例及實施例中之特徵可以相互組合。Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments may be combined with each other without conflict.
請參閱圖3,本發明一較佳實施方式提供一種圖像處理裝置100,其可應用於鏡頭模組200,用以提高所述鏡頭模組200之成像品質。所述圖像處理裝置100包括圖像感測器(CMOS Image Sensor,CIS)40及圖像訊號處理器(Image Signal Processor,ISP)80。所述圖像感測器40用以將採集到之光訊號轉化為電訊號,並輸出一第一拜耳圖像。所述圖像訊號處理器80與所述圖像感測器40電連接,用以接收所述第一拜耳圖像,並對所述第一拜耳圖像處理後對應輸出第一圖像或第二圖像。Referring to FIG. 3 , a preferred embodiment of the present invention provides an
請一併參閱圖4,所述圖像感測器40包括像素陣列10、濾光陣列20及微透鏡陣列30。Please also refer to FIG. 4 , the
所述像素陣列10包括複數像素11。複數所述像素11以N*M之形式構成所述陣列。其中,N與M均為正整數,N與M之值可相等,也可不等。例如,於本實施例中,所述N、M均為4,即所述像素11構成4*4之陣列。可以理解,於本實施例中,每一像素11之單位面積可小於1微米。於其中一個實施例中,每一所述像素11之單位面積為0.8微米。The
所述濾光陣列20對應所述像素陣列10設置。於本實施例中,所述濾光陣列20之形狀及大小均與所述像素陣列10對應,其包括複數濾光單元。每一濾光單元均包括至少一個濾光片,用以對入射光進行過濾,從而使得一有色光通過所述濾光陣列20入射至相應之像素11。The
於本實施例中,所述濾光陣列20包括四個濾光單元,即第一濾光單元21、第二濾光單元22、第三濾光單元23與第四濾光單元24。所述第一濾光單元21、第二濾光單元22、第三濾光單元23與第四濾光單元24彼此相鄰設置,並形成一2*2之濾光陣列。In this embodiment, the
可以理解,於本實施例中,每一所述濾光單元僅允許一種有色光通過。例如,位於所述濾光陣列20左上角及右下角之第一濾光單元21及第四濾光單元24僅允許第一顏色之光,例如綠光通過。位於所述濾光陣列20右上角之第二濾光單元22僅允許第二顏色之光,例如紅光通過。位於所述濾光陣列20左下角之第三濾光單元23僅允許第三顏色之光,例如藍光通過。如此,所述第一濾光單元21、第二濾光單元22、第三濾光單元23及第四濾光單元24可構成一GRBG形式之四拜耳濾色陣列。當然,於其他實施例中,所述濾光陣列20構成之四拜耳濾色陣列不局限於上述所述之GRBG形式,其還可以為其他形式,例如RGGB形式或者BGGR形式。另外,所述濾光陣列20中濾光單元之設置不局限於本實施例中2*2濾光單元之設置。於其他實施例中,所述濾光陣列之濾光單元也可根據實際需求進行調整。例如,所述濾光陣列20上之濾光單元也可設置為3*3濾光單元之排列設置。It can be understood that, in this embodiment, each of the filter units only allows one type of colored light to pass through. For example, the
請參閱圖7,可以理解,於本實施例中,複數所述濾光單元將所述像素陣列10劃分為複數像素單元12。每一像素單元12包括複數所述像素11。每一濾光單元分別對應所述像素陣列10中相應之像素單元12設置,且允許一種有色光入射至所述像素單元12。即,於本實施例中,四個所述濾光單元將對應四個像素單元12,所述像素單元12之數量與所述濾光單元之數量對應。Referring to FIG. 7 , it can be understood that in this embodiment, the plurality of filter units divide the
可以理解,由於所述濾光陣列20之形狀及大小均與所述像素陣列10相對應,且每一濾光單元對應一個像素單元12。因此,所述像素陣列10依據所述像素單元12之數量劃分為相應數量之像素單元12,即劃分為4個像素單元12。其中,每一所述像素單元12均構成M1*M2之子陣列。其中,M1、M2均為大於1之正整數,兩者可相同也可不同。例如,於本實施例中,所述M1及M2均為2。It can be understood that the shape and size of the
於本實施例中,由於所述第一濾光單元21、第二濾光單元22、第三濾光單元23及第四濾光單元24分別對應所述像素陣列10上之四個相鄰像素單元12設置,故每一所述像素單元12包括2*2之像素11,且每一像素單元12中之每一像素11過濾得到相同顏色之光。In this embodiment, since the
具體地,於本實施例中,當所述濾光陣列20按照GRBG之四拜耳濾色陣列排列時,可使得特定波長之光(例如紅光、綠光或藍光)透過,進而使得所述像素陣列10輸出一第一拜耳圖像(請參閱圖7)。其中,所述第一拜耳圖像以4*4之陣列排列。其中,位於左上角之像素單元12中每一像素11之像素值為G顏色通道之像素值,位於右上角之像素單元12中每一像素11之像素值為R顏色通道之像素值,位於左下角之像素單元12中每一像素11之像素值為B顏色通道之像素值,位於右下角之像素單元12中之每一像素11之像素值為G顏色通道之像素值。即所述第一拜耳圖像中之每一像素只有RGB三種顏色通道中之一種像素值。Specifically, in this embodiment, when the
請一併參閱圖4及圖8,所述微透鏡陣列30用於對入射光進行光線聚焦,使聚焦後之入射光投射到所述濾光陣列20。所述微透鏡陣列30設置於所述濾光陣列20遠離所述像素陣列10之一側。所述微透鏡陣列30包括複數微透鏡31。每一所述微透鏡31對應所述濾光陣列20之一個濾光單元設置。即每一所述微透鏡31對應一個像素單元12設置。如此,所述像素陣列10上之每一所述像素單元12可採用相同顏色之濾光片,且共用一所述微透鏡31。Please refer to FIG. 4 and FIG. 8 together. The
可以理解,傳統之像素陣列中,由於每一像素均對應設置一微透鏡,使得每一像素與像素之間之微透鏡存於縫隙。當入射光射入微透鏡與微透鏡之間之縫隙時,會使得部分入射光不能轉化為電訊號,如此將降低入射光之利用率。而本案藉由將所述微透鏡31對應所述濾光單元及所述像素單元12設置,即複數像素11構成一像素單元,並共同一個微透鏡31,如此可有效減少微透鏡與微透鏡之間之間隔,進而提高入射光利用率。It can be understood that, in the conventional pixel array, since each pixel is correspondingly provided with a microlens, a gap exists between the microlenses between each pixel. When the incident light enters the gap between the microlens and the microlens, part of the incident light cannot be converted into electrical signals, which will reduce the utilization rate of the incident light. In this case, by arranging the
請一併參閱圖5至圖6,可以理解,所述像素陣列10上之每一像素11還設置有光電二極體(Photo Diode,PD)13及讀出電路14。所述光電二極體13用以對每一所述像素11吸收之光進行光電轉換,以得到對應之電訊號。所述讀出電路14用以讀出所述電訊號,以獲取每一所述像素11對應之默認波長之光強值。如此,根據每一像素之光強值,可獲得所述第一拜耳圖像。Referring to FIG. 5 to FIG. 6 together, it can be understood that each
可以理解,當入射光進入時,所述入射光將依次經過所述微透鏡陣列30、濾光陣列20及所述像素陣列10。其中,所述入射光先經由所述微透鏡陣列30彙聚,接著所述濾光陣列20中之每一濾光單元對彙聚後之入射光進行過濾,並入射至所述像素陣列10,使得與每一濾光單元對應之像素單元12被RGB三種顏色光中之其中一種照射。每一所述像素11上之所述光電二極體13及讀出電路14再獲取每一所述像素11對應有色光之光強值,以生成所述第一拜耳圖像。It can be understood that when incident light enters, the incident light will pass through the
請再次參閱圖3,所述圖像訊號處理器80與所述圖像感測器40電連接,用以獲取所述圖像感測器40生成之第一拜耳圖像,並根據所述圖像訊號處理器80之當前模式對所述第一拜耳圖像進行相應處理,以輸出第一圖像或第二圖像。Please refer to FIG. 3 again, the
於本實施例中,所述圖像訊號處理器80包括切換模組50、第一處理模組60及第二處理模組70。所述切換模組50與所述圖像感測器40電連接。所述第一處理模組60及第二處理模組70均與所述切換模組50電連接。所述切換模組50用以接收所述圖像感測器40輸出之第一拜耳圖像,並根據所述圖像訊號處理器80之當前模式,選擇或觸發所述第一處理模組60或所述第二處理模組70,以使得所述第一處理模組60或所述第二處理模組70對所述第一拜耳圖像進行處理,進而輸出所述第一圖像或第二圖像。In this embodiment, the
例如,當所述切換模組50接收所述第一拜耳圖像,並判斷所述圖像訊號處理器80處於第一模式時,將選擇或觸發所述第一處理模組60。所述第一處理模組60接收所述切換模組50傳送之第一拜耳圖像,並對所述第一拜耳圖像進行像素重排(Remosaic)處理,以得到第二拜耳圖像(請參閱圖9),再對所述第二拜耳圖像進行去馬賽克(Demosaic)處理,得到所述第一圖像。For example, when the
請一併參閱圖9,所述像素重排係指將圖7所示所述第一拜耳圖像處理為所述第二拜耳圖像(參圖9),即將四拜耳濾色陣列圖像處理為具有標準拜耳濾色陣列之拜耳圖像。顯然,相比於圖7所示之四拜耳濾色陣列,圖9所示之標準拜耳濾色陣列由8個綠色像素、4個藍色像素和4個紅色像素排列形成,使得除位於邊緣之綠色像素外,所述第二拜耳圖像中每個綠色像素之四周,分佈著2個紅色像素、2個藍色像素及4個綠色像素。可以理解,所述第二拜耳圖像亦為拜耳圖像,即所述第二拜耳圖像中每一像素僅具有RGB三通道中任意一顏色通道之像素值。Please also refer to FIG. 9 , the pixel rearrangement refers to processing the first Bayer image shown in FIG. 7 into the second Bayer image (see FIG. 9 ), that is, processing a four-Bayer color filter array image is a Bayer image with a standard Bayer filter array. Obviously, compared with the four Bayer color filter array shown in FIG. 7, the standard Bayer color filter array shown in FIG. In addition to the green pixels, 2 red pixels, 2 blue pixels and 4 green pixels are distributed around each green pixel in the second Bayer image. It can be understood that the second Bayer image is also a Bayer image, that is, each pixel in the second Bayer image only has a pixel value of any one color channel of the three RGB channels.
所述去馬賽克處理係指將所述第二拜耳圖像處理為RGB圖像,即所述第一圖像。顯然,所述第一圖像為每一像素帶有RGB三種顏色通道之像素值之RGB圖像。所述像素重排處理及去馬賽克處理可藉由不同之插值演算法實現,如線性插值、均值插值等演算法,於此不再贅述。The demosaic processing refers to processing the second Bayer image into an RGB image, that is, the first image. Obviously, the first image is an RGB image in which each pixel has pixel values of three color channels of RGB. The pixel rearrangement processing and the demosaicing processing can be implemented by different interpolation algorithms, such as linear interpolation, mean interpolation and other algorithms, which will not be repeated here.
可以理解,於本實施例中,所述圖像訊號處理器80還包括濾波單元61。所述濾波單元61與所述第一處理模組60電連接。所述濾波單元61用以於生成所述第二拜耳圖像之前,先對所述第一拜耳圖像中之每一像素單元12進行均值濾波。如此,以降低散射光及色散光對所述第一拜耳圖像之影響,進而有效減少生成之所述第二拜耳圖像中之像素之噪點。It can be understood that, in this embodiment, the
可以理解,當所述切換模組50接收所述第一拜耳圖像,並判斷所述圖像訊號處理器80處於第二模式時,將選擇或觸發所述第二處理模組70。所述第二處理模組70接收所述切換模組50傳送之第一拜耳圖像,並對所述第一拜耳圖像進行像素合併處理,以得到第三拜耳圖像(請參閱圖10),再對所述第三拜耳圖像進行去馬賽克(Demosaic)處理,得到所述第二圖像。It can be understood that when the
可以理解,請參閱圖10,於本實施例中,所述第三拜耳圖像亦為拜耳圖像。於其中一個實施例中,經過像素合併後,所述第三拜耳圖像中之像素數量與所述像素單元12之數量一致,且所述第三拜耳圖像中每個像素之面積為所述像素單元12之面積。It can be understood that, referring to FIG. 10 , in this embodiment, the third Bayer image is also a Bayer image. In one embodiment, after pixel binning, the number of pixels in the third Bayer image is the same as the number of
可以理解,由於所述第一圖像係由所述第一拜耳圖像經過像素重排及去馬賽克處理得到,即所述第一圖像之生成過程中未進行像素合併處理,故所述第一圖像之像素數量與所述第一拜耳圖像之像素數量一致,所述第一圖像中每一像素之面積與所述第一拜耳圖像每一像素之面積相等。而所述第二圖像係由所述第一拜耳圖像經過四像素合併得到,所述第二圖像之像素數量與所述第一拜耳圖像之像素單元之數量一致,所述第二圖像中每一像素之面積與所述第一拜耳圖像每一像素單元之面積一致。如此,所述第一圖像之像素數量係所述第二圖像之像素數量之四倍,但所述第二圖像與所述第一圖像之大小相等。通常情況下,圖像大小相等之圖像,像素數量越多,圖像解析度越高,圖像越清晰。同樣,相同大小之圖像,每一像素面積越大,將吸收越多光訊號。故所述第一圖像相比所述第二圖像之圖像解析度更高。而所述第二圖像相比所述第一圖像之亮度更高。It can be understood that, since the first image is obtained from the first Bayer image through pixel rearrangement and demosaicing, that is, pixel merging is not performed during the generation of the first image, the The number of pixels in an image is the same as the number of pixels in the first Bayer image, and the area of each pixel in the first image is equal to the area of each pixel in the first Bayer image. The second image is obtained by combining four pixels of the first Bayer image. The number of pixels in the second image is the same as the number of pixel units in the first Bayer image. The area of each pixel in the image is the same as the area of each pixel unit of the first Bayer image. Thus, the number of pixels of the first image is four times that of the second image, but the second image is the same size as the first image. Generally, for images of the same size, the more pixels, the higher the resolution and the clearer the image. Similarly, for images of the same size, the larger the area of each pixel, the more light signals will be absorbed. Therefore, the image resolution of the first image is higher than that of the second image. And the brightness of the second image is higher than that of the first image.
顯然,於本實施例中,所述第一模式為Remosaic模式,所述第二模式為Binning模式。所述Remosaic模式基於所述第一拜耳圖像之每個像素進行處理,輸出之第一圖像具有較高之解析度,且藉由所述濾波單元61對所述第一拜耳圖像進行濾波處理,提高雜散光裕度,降低像素與像素之間之顏色串擾。Obviously, in this embodiment, the first mode is the Remosaic mode, and the second mode is the Binning mode. The Remosaic mode is processed based on each pixel of the first Bayer image, the output first image has a higher resolution, and the first Bayer image is filtered by the
所述Binning模式藉由將與每一濾光單元對應之每一像素單元12之複數像素合併為一個像素進行處理,增大每一像素面積,從而提高感光度,且提高雜散光裕度,降低像素與像素之間之顏色串擾。The Binning mode is processed by combining the plurality of pixels of each
可以理解,本發明之圖像處理裝置100藉由每一濾光單元對應一個像素單元12設置,每一所述濾光單元僅允許一種有色光通過,且每一微透鏡對應一濾光單元及一像素單元設置。結合圖像訊號處理器80之Remosaic模式,使像素陣列10之排列恢復到拜耳陣列排列方式,且藉由濾波處理,提高雜散光裕度,降低像素與像素之間之顏色串擾,從而可搭配小尺寸像素使用,以輸出高解析度之圖像。結合所述圖像訊號處理器80之 Binning模式下,等同於光線入射更大面積之像素,提高雜散光裕度及感光度,從而可搭配使用更大之光圈鏡頭。即本發明提供之圖像處理裝置100可適應各種焦段及場景,克服了習知潛望式鏡頭因光圈較小、像素面積較大造成之圖像解析度低和亮度低,及像素間因散射光及色散光造成之顏色串擾之問題,有效提高成像品質。It can be understood that in the
請再次參閱圖1,所述鏡頭模組200還包括潛望式鏡頭90。所述潛望式鏡頭90用以容納入射光通過,從而光學成像於所述圖像感測器40上。Please refer to FIG. 1 again, the
其中,所述潛望式鏡頭90可為望遠端及/或廣角端。可以理解,當潛望式鏡頭90為所述望遠端或所述廣角端時,所述圖像處理裝置100均可輸出所述第一圖像或所述第二圖像。The
可以理解,所述潛望式鏡頭90為望遠端時,對焦距離遠,入射光角度較小,進光量較小。當所述圖像訊號處理器80處於所述第一模式時,使輸出之所述第一圖像之像素排列恢復至一般拜耳陣列,提高所述第一圖像之解析度。當所述圖像訊號處理器80處於所述第二模式,藉由像素合併,降低雜散光並提高輸出之第二圖像之感光度,且輸出之所述第二圖像之串擾雜訊較少。It can be understood that when the
可以理解,所述潛望式鏡頭90為廣角端時,對焦距離近,入射光角度較大,進光量較大。當所述圖像訊號處理器80處於所述第一模式,使輸出之所述第一圖像之像素排列恢復至一般拜耳陣列,提高所述第一圖像之解析度,且藉由均值濾波較少像素與像素之間之顏色串擾,如此,所述第一模式更加適用於光亮場景。當所述圖像訊號處理器80處於所述第二模式,藉由像素合併,提高輸出之第二圖像之感光度,如此,所述第二模式更加適用於昏暗場景。It can be understood that when the
顯然,所述鏡頭模組200藉由所述圖像處理裝置100之設置,可有效克服習知潛望式鏡頭獲得之圖像解析度低和亮度低之問題。Apparently, the
請一併參閱圖11,本發明還提供一種圖像處理方法,所述圖像處理方法至少包括以下步驟。Please also refer to FIG. 11 , the present invention further provides an image processing method, and the image processing method at least includes the following steps.
步驟S1,獲取一第一拜耳圖像。Step S1, acquiring a first Bayer image.
可以理解,於步驟S1中,所述第一拜耳圖像可藉由上述所述圖像感測器40得到。所述圖像感測器40之具體結構及工作原理參上所述,於此不再贅述。It can be understood that, in step S1, the first Bayer image can be obtained by the
步驟S2,根據當前模式,切換至相應之處理模組。Step S2, according to the current mode, switch to the corresponding processing module.
可以理解,於步驟S2中,所述圖像訊號處理器80如上述所述,於此不再贅述。當所述切換模組50接收所述第一拜耳圖像,判斷所述圖像訊號處理器80處於第一模式時,選擇或觸發所述第一處理模組60。當所述切換模組50接收所述第一拜耳圖像,判斷所述圖像訊號處理器80處於第二模式時,選擇或觸發所述第二處理模組70。It can be understood that in step S2, the
步驟S3,對所述第一拜耳圖像進行圖像處理,以獲得第一圖像或第二圖像。Step S3, performing image processing on the first Bayer image to obtain a first image or a second image.
其中,當所述圖像訊號處理器80工作於第一模式時,所述第一處理模組60接收所述切換模組50傳送之第一拜耳圖像,並對所述第一拜耳圖像進行像素重排,以得到第二拜耳圖像,再對所述第二拜耳圖像進行去馬賽克處理,得到所述第一圖像。Wherein, when the
當所述圖像訊號處理器80處於第二模式時,所述第二處理模組70接收所述切換模組50傳送之第一拜耳圖像,並對所述第一拜耳圖像進行像素合併處理,以得到第三拜耳圖像,再對所述第三拜耳圖像進行去馬賽克處理,得到所述第二圖像。When the
以上實施方式僅用以說明本發明之技術方案而非限制,儘管參照以上較佳實施方式對本發明進行了詳細說明,本領域之普通技術人員應當理解,可以對本發明之技術方案進行修改或等同替換都不應脫離本發明技術方案之精神和範圍。本領域具有通常技藝者還可於本發明精神內做其它變化等用於本發明之設計,只要其不偏離本發明之技術效果均可。這些依據本發明精神所做之變化,都應包含於本發明所要求保護之範圍之內。The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced. Neither should depart from the spirit and scope of the technical solutions of the present invention. Those skilled in the art can also make other changes within the spirit of the present invention for the design of the present invention, as long as it does not deviate from the technical effect of the present invention. These changes made according to the spirit of the present invention should be included within the scope of the claimed protection of the present invention.
100:圖像處理裝置 10:像素陣列 11:像素 12:像素單元 13:光電二極體 14:讀出電路 20:濾光陣列 21:第一濾光單元 22:第二濾光單元 23:第三濾光單元 24:第四濾光單元 30:微透鏡陣列 31:微透鏡 40:圖像感測器 50:切換模組 60:第一處理模組 61:濾波單元 70:第二處理模組 80:圖像訊號處理器 200:鏡頭模組 90:潛望式鏡頭 100: Image processing device 10: Pixel array 11: Pixels 12: Pixel unit 13: Photodiode 14: Readout circuit 20: Filter array 21: The first filter unit 22: The second filter unit 23: The third filter unit 24: Fourth filter unit 30: Micro lens array 31: Micro lens 40: Image sensor 50: Switch modules 60: The first processing module 61: Filter unit 70: Second processing module 80: Image signal processor 200: Lens Module 90: Periscope Lens
圖1係習知技術中雜散光進入小像素之示意圖。FIG. 1 is a schematic diagram of stray light entering a small pixel in the prior art.
圖2係習知技術中雜散光進入大像素之示意圖。FIG. 2 is a schematic diagram of stray light entering a large pixel in the prior art.
圖3係本發明一較佳實施例提供之鏡頭模組之功能框圖。FIG. 3 is a functional block diagram of a lens module provided by a preferred embodiment of the present invention.
圖4係圖3所示鏡頭模組中圖像感測器之分解示意圖。FIG. 4 is an exploded schematic view of the image sensor in the lens module shown in FIG. 3 .
圖5係圖4所示圖像感測器之組裝示意圖。FIG. 5 is an assembly schematic diagram of the image sensor shown in FIG. 4 .
圖6係沿圖5所示圖像感測器中VI-VI線之剖面圖。FIG. 6 is a cross-sectional view taken along line VI-VI of the image sensor shown in FIG. 5 .
圖7為圖5所示圖像感測器輸出第一拜耳圖像之示意圖。FIG. 7 is a schematic diagram of the image sensor shown in FIG. 5 outputting a first Bayer image.
圖8係當設置圖4所示微透鏡陣列後所述濾光陣列中濾光單元之排列示意圖。FIG. 8 is a schematic diagram of the arrangement of filter units in the filter array after the microlens array shown in FIG. 4 is arranged.
圖9為圖3所示鏡頭模組中第一處理模組輸出第二拜耳圖像之示意圖。FIG. 9 is a schematic diagram of outputting a second Bayer image by the first processing module in the lens module shown in FIG. 3 .
圖10為圖3所示鏡頭模組中第二處理模組輸出第三拜耳圖像之示意圖。FIG. 10 is a schematic diagram of outputting a third Bayer image by the second processing module in the lens module shown in FIG. 3 .
圖11為本發明一較佳實施例提供之圖像處理方法之流程圖。FIG. 11 is a flowchart of an image processing method provided by a preferred embodiment of the present invention.
無none
200:鏡頭模組 200: Lens Module
100:圖像處理裝置 100: Image processing device
40:圖像感測器 40: Image sensor
50:切換模組 50: Switch modules
60:第一處理模組 60: The first processing module
61:濾波單元 61: Filter unit
70:第二處理模組 70: Second processing module
80:圖像訊號處理器 80: Image signal processor
90:潛望式鏡頭 90: Periscope Lens
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109146099A TWI760993B (en) | 2020-12-24 | 2020-12-24 | Image processing device, method and lens module with the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109146099A TWI760993B (en) | 2020-12-24 | 2020-12-24 | Image processing device, method and lens module with the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI760993B TWI760993B (en) | 2022-04-11 |
TW202226818A true TW202226818A (en) | 2022-07-01 |
Family
ID=82198815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109146099A TWI760993B (en) | 2020-12-24 | 2020-12-24 | Image processing device, method and lens module with the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI760993B (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7522341B2 (en) * | 2005-07-12 | 2009-04-21 | Micron Technology, Inc. | Sharing of microlenses among pixels in image sensors |
KR102037283B1 (en) * | 2013-06-18 | 2019-10-28 | 삼성전자주식회사 | Image sensor, image signal processor and electronic device including the same |
JP6080190B2 (en) * | 2014-09-15 | 2017-02-15 | エスゼット ディージェイアイ テクノロジー カンパニー リミテッドSz Dji Technology Co.,Ltd | Demosaicing method |
-
2020
- 2020-12-24 TW TW109146099A patent/TWI760993B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI760993B (en) | 2022-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20230362507A1 (en) | Image sensor and image-capturing device | |
US20210358981A1 (en) | Image-capturing device and image sensor | |
US7483065B2 (en) | Multi-lens imaging systems and methods using optical filters having mosaic patterns | |
US9497370B2 (en) | Array camera architecture implementing quantum dot color filters | |
US8208052B2 (en) | Image capture device | |
US8106994B2 (en) | Image pickup apparatus having a microlens array | |
US8514319B2 (en) | Solid-state image pickup element and image pickup apparatus | |
KR20170024599A (en) | Backside illumination image sensor, manufacturing method thereof and image-capturing device | |
JP4983271B2 (en) | Imaging device | |
US7138663B2 (en) | Color separation device of solid-state image sensor | |
WO2020177123A1 (en) | Color imaging system | |
JP2014003116A (en) | Image pickup device | |
US20110181763A1 (en) | Image pickup device and solid-state image pickup element of the type illuminated from both faces | |
JP2001210812A (en) | Solid-state image pickup device and solid-state image pickup system provided with the same | |
US20140307060A1 (en) | Image sensor | |
CN114666469B (en) | Image processing device, method and lens module with image processing device | |
TWI760993B (en) | Image processing device, method and lens module with the same | |
US20100165156A1 (en) | Image capture device comprising focusing adjustment means | |
EP4246959A1 (en) | Image sensor and imaging apparatus | |
JP2011254265A (en) | Multi-eye camera device and electronic information apparatus | |
JP2013157531A (en) | Solid state image sensor and electronic information device | |
RU2736780C1 (en) | Device for colour image forming (embodiments) | |
JP7383876B2 (en) | Imaging element and imaging device | |
JP2008103628A (en) | Solid-state image pickup element | |
CN116471468A (en) | Imaging module and terminal equipment |