TW202226435A - Holding method and holding device capable of reducing unnecessary power consumption during processing - Google Patents

Abstract

The invention provides a holding method, which includes: a supporting step for supporting the holding target object (WK) from one surface (WK1) side of the holding target object (WK) using the supporting surface (12A); a fluid supply step for supplying the fluid (WT) to the supporting surface (12A) during the front-end or back-end of the supporting step; and, a curing step for performing a curing process for curing the fluid (WT) to cure the fluid (WT) for holding the holding target object (WK) using the supporting surface (12A). In which, the curing step performs the curing process for the fluid (WT) from the side of the holding target object (WK) supported on the supporting surface (12A) by the fluid (WT).

Description

Holding method and holding device

The present invention relates to a holding method and a holding device.

A holding method of holding a holding object by a support surface is known (see, for example, Japanese Patent Laid-Open No. 2011-096929 of Document 1). The manufacturing method (holding method) of a semiconductor element described in Document 1 is to freeze (harden) the liquid 50 (fluid) supplied to the upper surface (support surface) of the temporary mounting table 3 from the support surface side. ) cooling treatment (hardening treatment) to hold the semiconductor element wafer 1A (holding object) by the support surface, therefore, it is necessary to perform the hardening treatment for each member having a support surface such as the temporary mounting table 3, so There is a problem of unnecessary consumption of energy (electricity).

An object of the present invention is to provide a holding method and a holding device capable of reducing wasteful consumption of energy (electricity) as much as possible. The present invention employs the constitution described in the claims. According to the present invention, the fluid is hardened from the side of the object to be held that is supported on the support surface by the fluid. Therefore, it is not necessary to perform the hardening process on every member having the support surface, so it is possible to maximize the Reduce unnecessary consumption of energy (electricity). In addition, if the fluid pretreatment step is performed in advance, the fluid hardening time after the object is supported and held by the support surface can be shortened.

Hereinafter, one embodiment of the present invention will be described with reference to the drawings. In addition, the X-axis, Y-axis, and Z-axis in this embodiment are in a relationship of being orthogonal to each other (perpendicularly intersecting), the X-axis and the Y-axis are axes in a predetermined plane, and the Z-axis is the same as the above-mentioned predetermined the plane orthogonal to the axis. Furthermore, in this embodiment, when viewed from the front direction of FIG. 1A to FIG. 1E parallel to the Y axis, it is used as a reference. When indicating the direction, the arrow direction of the Z axis indicates "up", and the opposite direction is "up". Indicates "down", the direction of the arrow on the X-axis is "left", the opposite direction is "right", the direction of the arrow on the Y-axis is "front", and the opposite direction is "rear". The holding device EA of the present invention includes the support means 10 for supporting the holding object WK from one surface WK1 side of the holding object WK by the support surface 12A, and a fluid supply for supplying water WT as a fluid to the support surface 12A The means 20; the hardening means 30 for performing a cooling process as a hardening process for hardening, ie, freezing, the water WT to hold the holding object WK by the support surface 12A by freezing the water WT. In addition, the holding object WK is formed of the base material WKB, and the adhesive film AS is pasted on the other surface WK2 of the base material WKB (holding object WK), thereby forming an integrated body UP. In the case of the present embodiment, the holding device EA is disposed in the peeling means 40 for peeling the adhesive sheet AS from the holding object WK, and applying tension to the adhesive sheet AS to form a plurality of pieces from the base material WKB The vicinity of the separating means 50 of the holding object WK at a predetermined interval. The support means 10 includes a linear motor (that is, a linear motion motor) 11 as a driving device, and a stage 12 as a support member which is supported on an output shaft 11A of the linear motor 11 and has a support surface 12A. The stage 12 is provided with a flow path 12C communicating with the recess 12B provided on the upper surface, and a porous member 12D made of resin, metal, etc., which is arranged in the recess 12B and whose upper surface is regarded as a support surface 12A. . On the support surface 12A, as shown in the portion marked AA in FIG. 1A , the hydrophobic portion 12E having hydrophobicity is formed in a lattice shape, and the hydrophilic portion 12F is defined by the hydrophobic portion 12E. The water-repellent portion 12E is formed by arranging a member having water repellency (non-absorbent) such as resin or metal on the inner surface of the lattice-shaped grooves formed on the support surface 12A. The hydrophilic portion 12F is subjected to rough surface treatment to form a rough surface by rough surface treatment such as rough surface processing and sandblasting. The fluid supply means 20 includes: a water tank 21 for accommodating water WT; a pressurizing means 22 such as a pressurizing pump or a turbine; a decompressing means 23 such as a decompression pump or a vacuum ejector; 22 and the pressure reducing means 23 for switching the state of communication with the water tank 21; and the valve 24 for switching the pressure side piping 21A and the pressure reducing side piping 21B connected to the water tank 21 to be connected to the flow path 12C via the piping 25A The switching valve 25 in the connected state. The hardening means 30 is provided with a plurality of arm parts, and is regarded as part of a driving machine capable of moving the work part, that is, the article supported by the front end arm part 31A, to any position and any angle within its work range. A so-called multi-joint robot arm 31; a support plate 32 supported by the front end arm portion 31A; a plurality of guide members 33 inserted through a through hole 32A formed in the support plate 32 and having a flange portion 33A on the upper end side; The cooling plate 34 is supported on the lower end side of the guide member 33 and can be cooled by a cooling means not shown such as a Peltier element (that is, a thermoelectric element) or a cooling side of a heat pipe; The cooling plate 34 has a plurality of springs 35 for urging means for applying an elastic force in a direction in which the cooling plate 34 is separated from the support plate 32; Water WT is subjected to cooling treatment. The peeling means 40 is equipped with the linear motion motor 11, and is constructed so that the linear motion motor 11 is also used as the support means 10. The separating means 50 is provided with a plurality of linear motors 51 as driving means, output shafts 51A respectively supported by the respective linear motors 51 as driving means, and holding means having a pair of holding members 52A, that is, a chuck Cylinder 52 . Next, the operation of the above-mentioned holding device EA will be described. First, for the holding device EA in which each member is arranged at the initial position shown by the solid line in FIG. 1A , the user of the holding device EA (hereinafter, simply referred to as "user") uses an operation panel, a personal computer, or the like. A signal to start automatic operation is input by an operation means not shown. In this way, the fluid supply means 20 drives the switching valves 24 and 25, as shown in FIG. 1B, the pressurizing means 22 and the water tank 21 are communicated, and the water tank 21 and the concave portion 12B are connected via the pressurizing side piping 21A. After the connection is made, the pressurizing means 22 is driven to increase the pressure in the water tank 21 to supply the water WT to the hydrophilic portion 12F of the support surface 12A (fluid supply step). In addition, the water WT supplied to the hydrophilic portion 12F is a fluid (not shown) composed of imaging means such as cameras and projectors, various sensors such as optical sensors and ultrasonic sensors, and the like. Monitoring is performed by a sensing means, and the fluid supply means 20 adjusts the pressure in the water tank 21 on the basis of the monitoring state of the fluid sensing means (not shown) so that the water WT supplied to the hydrophilic portion 12F does not overflow into the water tank 21. The water-repellent portion 12E. Next, the hardening means 30 preliminarily performs a fluid pretreatment step, that is, before the support means 10 supports the object to be held WK, cooling treatment is performed on the water WT to an extent that does not freeze the water WT. In other words, the hardening means 30 first drives the multi-joint robot arm 31 and the cooling means not shown, and as shown by the two-dotted chain line in FIG. 1B , the cooling plate 34 is brought close to the support surface 12A to reduce the temperature of the water WT This water WT is subjected to cooling treatment (fluid pre-treatment step) to a temperature of 2°C to 3°C, which is a temperature that does not freeze. In addition, the temperature of the water WT on the support surface 12A is monitored by unshown temperature sensing means such as thermocouples and infrared sensors, and the curing means 30 is one of these unshown temperature sensing means. The monitoring status is used as a basis to adjust the temperature of the water WT. After that, after the hardening means 30 stops driving the cooling means (not shown), the articulated robot arm 31 is driven to return the cooling plate 34 to the initial position. Next, as shown in FIG. 1A , when conveying means (not shown) such as a multi-joint robot arm or a belt conveyor conveys the integrated object UP to a predetermined position above the platform 12, the separating means 50 is driven to move linearly. The motor 51 and the collet cylinder 52 hold the adhesive film AS by a pair of holding members 52A, as shown by the two-dot chain line in FIG. 1A . Then, the separating means 50 drives the linear motor 51 to pull the adhesive sheet AS to form a plurality of holding objects WK from the base material WKB (separation step). At this time, each of the holding objects WK is widened so as to correspond to each of the hydrophilic portions 12F on the support surface 12A, respectively. Next, the support means 10 drives the linear motion motor 11, as shown in FIG. 1C, the stage 12 is raised, and the holding object WK is supported by the support surface 12A (support process). At this time, each holding object WK is supported by each hydrophilic part 12F by the water WT supplied to each hydrophilic part 12F, respectively. Then, the curing means 30 drives the multi-joint robot arm 31 and the cooling means (not shown), and as shown in FIG. 1C , the cooling plate 34 is brought close to the adhesive film AS, and the water WT is cooled from the holding object WK side. The water WT is frozen by the treatment, and the holding object WK is held by the support surface 12A (hardening step). At this time, the hardening means 30 may abut the cooling plate 34 to the adhesive film AS, or may not abut the cooling plate 34 to the adhesive film AS. In addition, for example, when the volume of the water WT expands due to freezing of the water WT, and the object to be held WK is pushed toward the cooling plate 34, the cooling plate 34 and the support plate 32 may be provided by using the The spring 35 reduces the load applied to the holding object WK. Next, the hardening means 30 stops driving the cooling means (not shown) and drives the articulated robot arm 31 to return the cooling plate 34 to the initial position. Then, the peeling means 40 drives the linear motor 11 and, as shown in FIG. 1D , lowers the stage 12 to peel the adhesive film AS from the holding object WK (peeling step). When the adhesive film AS is peeled off from all the holding objects WK and the table 12 returns to the initial position, the peeling means 40 stops the driving of the linear motor 11, and then the separating means 50 drives the linear motor 51 and the clamp. The head cylinder 52 is driven to return the grip member 52A to the initial position. In addition, the adhesive sheet AS after being no longer supported by the holding member 52A is discarded after being transferred to a user or a conveyance means not shown. Next, the frozen water WT is thawed by heating or natural thawing by heating means not shown, such as a coil heater or a heating side of a heat pipe (fluidizing step). At this time, each holding object WK supported by the hydrophilic portion 12F is positioned at a predetermined position and a predetermined angle by the action of the water WT. Then, the fluid supply means 20 drives the switching valves 24 and 25, and as shown in FIG. 1E, the decompression means 23 is communicated with the water tank 21, and the water tank 21 and the concave portion 12B are communicated through the decompression side piping 21B. , the pressure reduction means 23 is driven to lower the pressure in the water tank 21 (fluid recovery step). In this way, the water WT originally on the support surface 12A is recovered, and the holding object WK is supported on the support surface 12A in a state of being positioned at a predetermined position and a predetermined angle. Next, the user or a conveyance means (not shown) takes out all the holding objects WK from the support surface 12A (removal step), and then repeats the same steps as described above. According to the above-described embodiment, the cooling process is performed on the water WT from the side of the holding object WK supported on the support surface 12A by the water WT, and therefore, it is not necessary for each member having the support surface 12A ( The platform 12 and the porous member 12D) are subjected to cooling treatment, so that wasteful consumption of energy (electricity) can be reduced as much as possible. As described above, the best configuration, method, etc. for carrying out the present invention have been disclosed based on the foregoing description, but the present invention is not limited thereto. In other words, although the present invention is mainly aimed at specific embodiments, and the drawings and descriptions thereof are disclosed and described, those in the technical field to which the present invention pertains, within the scope of not departing from the technical idea and purpose of the present invention, It is also conceivable to apply various modifications to the above-described embodiments in terms of the shape, material, number, and other detailed configurations. In addition, the above-mentioned descriptions that limit the shape, material, etc., are for the purpose of making the present invention easier to understand, and the descriptions in the form of illustration are not used to limit the scope of the present invention. Therefore, descriptions made by the names of members deviating from some or all of the limitations included in these shapes, materials, and the like are also included in the present invention. For example, after the support means 10 recovers the thawed water WT, the decompression means 23 or another decompression means separate from the fluid supply means 20 may be used to adsorb and hold the object to be held WK on the support surface 12A. Moreover, the direct-acting motor 11 may not also be used as the peeling means 40; and the hydrophilic portion 12F may be formed with a hole through which the water WT can pass, but the hydrophobic portion 12E may not be formed with a hole through which the water WT can pass; Pores through which the water WT can pass may be formed in both the hydrophilic portion 12F and the hydrophobic portion 12E; and a sheet, film, tape, etc. having hydrophobicity or hydrophilicity may be attached to the support surface 12A, or for the support surface 12A. Surface 12A is subjected to surface treatment or plating treatment that can exhibit hydrophobicity or hydrophilicity to form hydrophobic portion 12E or hydrophilic portion 12F; and support surface 12A may not be formed with hydrophobic portion 12E or hydrophilic portion 12F. The fluid supply means 20 may be a supply means such as a nozzle or a hose to supply the water WT to the support surface 12A from the outside of the platform 12, or may be provided in the platform 12 with another flow for recovery that is different from the flow path 12C. Furthermore, instead of using the switching valves 24 and 25, for example, the pressurizing means 22 and the depressurizing means 23 may be individually connected to the water tank 21, and the The slave water tanks 21 are individually connected to the recesses 12B. The fluid supplied by the fluid supply means 20 is not limited to water WT, and may be a liquid other than an alcohol solution or engine oil, or a gel, or a single gas that can be sublimated by cooling treatment. , mixed gas, etc., specifically, it may be, for example, adhesive, dry ice, ultraviolet (UV) hardening resin, cement, etc., as long as it is a substance that can be hardened by hardening treatment, as long as it can become Since it is harder than the state before the hardening treatment, it is sufficient to obtain a desired holding force for the holding object WK. In addition, the "hardness" referred to in this case may refer to: hardness expressed in Brinell hardness, Vickers hardness, Rockwell hardness, etc.; and may also refer to: Young's modulus, stiffness ratio, tensile strength The hardness expressed by tensile strength, compressive strength, shear strength, etc. The hardening means 30 may be water WT by using a cooling medium such as cooling air or cooling gas; and if the fluid is a material that is hardened by heat treatment as hardening treatment, for example: thermosetting resin, heat curing agent In the case of fluids, etc., heating means such as a coil heater or the heating side of a heat pipe can also be used; and if the fluid is a material that is hardened by irradiation with energy rays such as ultraviolet rays or X-rays as hardening treatments, for example: In the case of an energy ray curable resin or an energy ray hardener, etc., energy ray irradiation means such as a high-pressure mercury lamp or an LED (Light Emitting Diode) lamp capable of irradiating energy rays can also be used; It is a substance that can be hardened by drying treatment as a hardening treatment, for example, in the case of adhesives or cement, etc., a blower or heating means can also be used, considering the characteristics, characteristics, properties, material, composition and composition of the fluid, gas Various conditions such as the conditions of the phase atmosphere and other factors can be used as long as it is a means that can harden the fluid; and in the above-mentioned embodiment, although the object WK is held from the other side WK2 side (upper side) Although the cooling process is performed on the water WT, the water WT may be obtained from the so-called holding object WK side, such as the left, front, right obliquely rear, left obliquely front, right obliquely upper, or left obliquely upper side of the holding object WK, for example. A cooling process is performed on the water WT. The hardening means 30 may directly cool the water WT in the water tank 21 or the water WT in the pipes 21A and 25A by using the above-mentioned cooling means or cooling medium, or through at least one of the water tank 21 , the pipes 21A and 25A and the support surface 12A. One is to indirectly cool the water WT, and before the support means 10 supports the object to be held WK, a fluid pretreatment process is performed first; and the cooling means for performing the hardening process and the cooling means for performing the fluid pretreatment may be used. It is constructed by the same cooling means; and it can also be constructed by different cooling means. In addition, if the fluid pretreatment process is performed in advance, the temperature that does not harden the fluid may be 2°C or lower if the fluid is water WT, and may be 3°C or higher; if the fluid is For substances that can be hardened by heat treatment, for example, the fluid can also be heated to a temperature of 60°C or 120°C, considering the characteristics, characteristics, properties, material, composition and composition of the fluid, gas phase atmosphere After various conditions such as conditions and other factors, the temperature may be any degree (°C) as long as the fluid is not hardened. The peeling means 40 may peel off the adhesive film AS from the holding object WK without lowering the stage 12 or by raising the chuck cylinder 52 while lowering the stage 12, or on the support surface 12A. The holding object WK and the adhesive film AS are relatively rotated to peel off the adhesive film AS from the holding object WK; and the platform 12 can also be vibrated by a vibration means such as an ultrasonic vibration device or a vibrator, In order to make the adhesive film AS easy to peel off from the holding object WK, it is also possible to use a driving device that does not also serve as the support means 10, and it is also possible to use a sheet-like or tape-like adhesive tape or adhesive tape for peeling off. A tape is attached to the adhesive film AS, and tension is applied to the peeling tape to peel the adhesive film AS from the holding object WK, and this peeling means is used in combination with or in place of the above-exemplified peeling means Moreover, the holding device EA of the present invention may or may not have the peeling means 40. If the peeling means 40 is not provided, other devices may be used to peel the adhesive film AS from the holding object WK. The separating means 50 may extend the distance between the holding objects WK by applying tension in a single direction or in two or more directions to the adhesive film AS within the surface of the adhesive film AS; and If a frame member such as a ring frame integrated with the holding object WK via the adhesive film AS is used, the holding target may be expanded by supporting the frame member and applying tension to the adhesive film AS. The distance between the WKs; and the holding device EA of the present invention may be provided with or without the separation means 50, and if it is not provided with the separation means 50, other means can be used to maintain the distance between the objects WK. expand. The holding device EA may be a dust removing means such as a scraper, a wiper, or a blower capable of blowing off the fluid, which can remove the fluid or other dust remaining on the support surface 12A, and the fluid is supplied to the surface. Before the support surface 12A, or after the fluid is recovered from the support surface 12A, dust is removed from the support surface 12A; and the base material WKB may be provided with a groove penetrating in the thickness direction, or the base material may be WKB cuts the grooves that do not penetrate the thickness direction, and can split the base material WKB into a plurality of cutting blades holding the object WK or a laser cutting machine as long as tension is applied; : It is possible to form a fragile layer forming means such as a laser irradiation device or a chemical solution injection means, etc., on the base material WKB, as long as tension is applied, the base material WKB can be split into a plurality of fragile modified layers that hold the object WK; Grinding means such as a grinder or a grinder that can grind the base material WKB to reduce the thickness of the base material WKB may be provided; The base material WKB can be ground from the side opposite to the side on which the groove has been formed to reach the groove, and a plurality of grinding machines, grinders, etc., which can form a plurality of holding objects WK from the base material WKB means of grinding individual monoliths. In the holding device EA, the fluid supply process may be implemented in the front stage of the support process; the fluid supply process may be implemented in the latter stage of the support process; and the fluid supply may be implemented in both the front stage of the support process and the back stage of the support process. and may be implemented or not implemented at least one of the fluid pretreatment process, the separation process, the peeling process, the fluidization process, the fluid recovery process, and the removal process. The base material WKB may be a base material WKB in which grooves penetrating the thickness direction are formed and a plurality of holding objects WK are formed by the grooves, or grooves that do not penetrate the thickness direction may be formed. , as long as tension is applied, it can be split into a plurality of base materials WKB of the holding object WK; and a fragile modified layer can also be formed, as long as tension is applied, it can be split into a plurality of base materials of the holding object WK WKB; and it can also be the base material WKB without the adhesive film AS. The holding target WK may be a holding target WK that is not attached with the adhesive film AS, or may be a holding target WK that is not formed from the base material WKB but is initially arranged at a predetermined interval. The unitary body UP may be a unitary body UP which is supported by the adhesive film AS on the frame member. The frame member, in addition to the ring-shaped frame, may be a non-annular frame (the outer peripheries are not connected together), or a circular, oval, polygonal or other shaped frame. In the above-described embodiment, the holding target object described as an example is an example of a plurality of holding target objects WK, but the holding target object may be only one. The means and steps in the present invention are not limited at all as long as they can exhibit the operations, functions, or steps described with respect to these means and steps, and are not limited to the above-mentioned embodiments, which are merely an embodiment. The limitations of the components and processes. For example, the supporting process may be any process as long as it is a process of supporting the object to be held from one of its sides by using a support surface. In contrast to the technical common sense at the time of filing the patent application, as long as the object is supported As long as it is within the technical scope, it is not limited at all (the same applies to other means and steps). The material, type, shape, etc. of the adhesive sheet AS, the base material WKB, the object to be held WK, and the peeling tape are not particularly limited. For example: adhesive sheet AS, base material WKB, holding object WK, and tape for peeling; polygonal shapes such as circle, ellipse, triangle, and square, and other shapes are also possible; adhesive sheet AS and peeling tape The tape may also be: pressure-sensitive adhesive, heat-sensitive adhesive and other adhesive forms of film and tape; if the thermal-adhesive film and tape are used, as long as the setting can be used for the adhesive film AS and the peeling tape. A suitable heating method, such as a coil heater or the heating side of a heat pipe, can be used for adhesion. Furthermore, the adhesive sheet AS and the tape for peeling may be, for example, a sheet and tape with only a single layer of the adhesive layer, a sheet and tape with an intermediate layer between the substrate and the adhesive layer, On the upper surface of the base material, there are three or more layers of films and tapes, such as a cover layer; in addition, there may be a so-called double-sided adhesive film that can peel the base material from the adhesive layer. The double-sided adhesive film can also be a single-layer or double-sided adhesive film with multiple intermediate layers, or a single-layer or multiple-layer double-sided adhesive film without intermediate layers. Further, examples of the base material WKB and the holding object WK include food, resin containers, semiconductor wafers such as silicon semiconductor wafers or compound semiconductor wafers, circuit boards, information memory boards such as optical discs, etc. A single product such as a glass plate, steel plate, pottery, wood board, or resin may be used, and a composite of two or more of the above-mentioned articles may also be used, and a member or article of any form may be targeted. Furthermore, the adhesive sheet AS may be, for example, a label for recording information, a label for decoration, a protective sheet, a tape for wafer dicing, a dicing film, a chip sticker, etc. Any film, film, tape, etc., such as a laminating tape, a resin film for forming a recording layer, etc. can be used. The drive machine in the foregoing embodiment can be used except for: electric machines, pneumatic cylinders, etc. In addition to actuators such as hydraulic cylinders, rodless cylinders, and rotary cylinders, it is also possible to use drive machines that directly or indirectly combine these devices. In the aforementioned embodiment, if a means for supporting (holding) a supported member (member to be held) such as a supporting (holding) means or a supporting (holding) member, etc. is used, a mechanical chuck or a clamp may be used. Holding means of head press cylinder, etc., Coulomb force, adhesive (adhesive film, adhesive tape), adhesive (adhesive film, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, drive machine, etc. to support (Maintaining) the structure of the supported member; if the member to be cut, such as the cutting means or the cutting member, can be cut, or the member to be cut can be formed by means of cutting grooves or cutting lines , can also use cutting edge, laser cutting machine, ion beam, fire, heat, water pressure, electric heating wire, blowing gas or liquid, etc. to cut the means to replace or use the above-mentioned examples at the same time; In addition, it is also possible to use a means combined with an appropriate driving machine to move the object to be cut and cut; and if a spring push means is used, it can also be composed of a spring, rubber, resin, or a driving machine, etc. Push means.

10: Supporting means 11: Direct motor 11A: Output shaft 12: Platform 12A: bearing surface 12B: Recess 12C: flow path 12D: Porous Components 12E: hydrophobic part 12F: Hydrophilic part 20: Fluid supply means 21: Sink 21A: Pressurized side piping 21B: Decompression side piping 22: Pressure means 23: Decompression means 24: Switching valve 25: Switching valve 25A: Piping 30: Hardening means 31: Multi-joint robotic arm 31A: Front end arm 32: support plate 32A: Through hole 33: Guide member 33A: Flange 34: Cooling Plate 35: Spring 40: Stripping Means 50: Separate means 51: Direct motor 51A: output shaft 52: Chuck Cylinder 52A: Holding member EA: holding device AS: Adhesive Diaphragm UP: One thing WK: keep the object WKB: Base Metal WT: water

1A is an explanatory diagram of a holding device according to an embodiment of the present invention. 1B is an explanatory diagram of the holding device according to one embodiment of the present invention. [ Fig. 1C ] An explanatory diagram of the holding device according to one embodiment of the present invention. 1D is an explanatory diagram of the holding device according to one embodiment of the present invention. 1E is an explanatory diagram of a holding device according to one embodiment of the present invention.

10: Supporting means

11A: Output shaft

12: Platform

12A: bearing surface

25A: Piping

30: Hardening means

31: Multi-joint robotic arm

32: support plate

34: Cooling Plate

35: Spring

50: Separate means

51: Direct motor

52: Chuck Cylinder

52A: Holding member

AS: Adhesive Diaphragm

WK: keep the object

WK1: One Side

WK2: The other side

WT: water

Claims (3)

A holding method characterized by: implementing A supporting step of supporting the object to be held from one side of the object to be held by using a support surface; A fluid supply process for supplying fluid to the aforesaid support surface in a preceding stage or a subsequent stage of the aforementioned support process; and A hardening process of hardening the fluid to harden the fluid so as to hold the object to be held by the support surface is performed; and In the hardening step, the hardening treatment is performed on the fluid from the holding object side supported on the support surface by the fluid. The holding method according to claim 1, wherein, in the hardening step, before the holding object is supported in the supporting step, the fluid is subjected to the hardening treatment to the extent that the fluid is not hardened. Fluid pretreatment process. A holding device is characterized by: having A support means for supporting the object to be held from one side of the object to be held by a support surface; fluid supply means for supplying fluid to the aforementioned support surface; and hardening means for holding the object to be held with the support surface by performing a hardening treatment for hardening the fluid to harden the fluid; and The hardening means performs the hardening treatment on the fluid from the holding object side supported on the support surface by the fluid.

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