TW202223127A - Gas distribution module and vacuum coating device - Google Patents

Abstract

The present invention discloses a gas distribution module and a vacuum coating device. The vacuum coating device includes a vacuum chamber, a showerhead fixing unit, a gas distribution module, and a heating unit. The vacuum chamber has a side wall portion, and the substrate is disposed on the side wall portion. The showerhead fixing unit is disposed at the side wall portion, and the side wall portion is respectively connected with the showerhead fixing unit and the substrate to form a reaction space. The gas distribution module includes a plurality of showerhead units. The showerhead units are disposed side by side in the vacuum chamber through the showerhead fixing unit, and each showerhead unit includes a nozzle, and the nozzles are located in the reaction space. The heating unit is disposed at one side of the substrate away from the reaction space; wherein, the substrate includes a curved surface facing the nozzles, and the disposed positions of the showerhead units in the vacuum chamber are changed according to the shape of the curved surface.

Description

Gas distribution module and vacuum coating device

The present invention relates to a distribution module, in particular to a gas distribution module and a vacuum coating device applied to a vacuum coating device.

Commonly used coating processes today may include sputtering (Sputter) process, chemical vapor deposition (CVD) process, metal-organic chemical vapor deposition (Metal-organic CVD, MOCVD) process, or atomic layer deposition (ALD) system. Take, for example, chemical vapor deposition (CVD), a chemical technique that can be used to produce solid-state materials of high purity and performance. A typical chemical vapor deposition process is to expose the substrate to one or more different reactive precursors (Precursor), and chemical reaction (deposition) or/and chemical decomposition (etching) occur on the surface of the substrate to produce the film to be deposited.

Please refer to FIG. 1 , which is a schematic diagram of a conventional vacuum coating device. In the vacuum coating device 1 of FIG. 1 , the substrate W is set on the carrier 12 of the vacuum chamber 11 ; the gas distributor 14 is fixed in the vacuum chamber 11 and is located on the upper side of the substrate W, and the reaction precursor can be used in the The gas channel 13 enters the reaction space R of the vacuum chamber 11 through the gas distributor 14 ; the heater 15 is arranged on the bearing table 12 to heat the substrate W and the reaction space R of the vacuum chamber 11 . During the process of forming the thin film on the substrate W, the heater 15 can be heated to increase the temperature of the substrate W and the reaction space R to the temperature required for the reaction. When one or more reactants enter the vacuum chamber 11 from the air inlet channel 13, and When entering the reaction space R through the gas distributor 14, a chemical reaction or/and chemical decomposition may be performed with the substrate W to generate the thin film to be deposited.

However, most of the current vacuum coating devices are designed for flat substrates. If the substrates are not flat, but have irregular shapes such as curved surfaces or high and low undulations, such as windshields of automobiles or airplanes, or large-sized lenses, etc., because of physical Due to the shielding effect, the uniformity of the formed film will be affected. Therefore, when applied to a curved substrate, the cavity of the existing vacuum coating device needs to be customized and redesigned. If the shape of the substrate is changed, the original design cavities will not apply. In addition, when the current vacuum coating device is applied to substrates with irregular shapes such as curved surfaces or high and low undulations, the film uniformity is always worse than that of flat substrates, and products that require high film uniformity cannot be used.

The purpose of the present invention is to provide a gas distribution module and a vacuum coating device applied to a vacuum coating device. Compared with the prior art, the present invention is not only applicable to curved substrates of various shapes, but also enables thin films formed on the curved substrates. In addition to good uniformity, it can also reduce the volume of the reaction space for the film-forming reaction and improve the coating rate.

In order to achieve the above object, the present invention proposes a gas distribution module applied to a vacuum coating device, which is used in conjunction with a substrate. The gas distribution module includes: a plurality of showerhead units are arranged side by side in a vacuum chamber of the vacuum coating device, each of which is The shower head unit includes a shower head; wherein, the substrate includes a curved surface facing the shower heads, and the arrangement positions of the shower head units in the vacuum chamber are changed according to the shape of the curved surface of the substrate.

To achieve the above object, the present invention provides a vacuum coating device, which includes a vacuum chamber, a nozzle fixing unit, a gas distribution module and a heating unit. The vacuum chamber has a side wall portion, and the substrate is arranged on the side wall portion; the nozzle fixing unit is arranged on the side wall portion, and the side wall portion is respectively connected with the shower head fixing unit and the substrate to form a reaction space; the gas distribution module includes a plurality of shower head units, the The showerhead units are arranged side by side in the vacuum chamber through the showerhead fixing unit, and each showerhead unit includes a showerhead, and the showerheads are located in the reaction space; the heating unit is arranged on the side of the substrate away from the reaction space; wherein, the substrate includes facing the showerheads A curved surface, and the arrangement positions of the nozzle units in the vacuum chamber are changed according to the shape of the curved surface.

In one embodiment, the distances between the nozzles and the curved surfaces are substantially equal.

In one embodiment, the spray head has a plurality of air outlet holes, the spray head unit further includes a conduit connected with the spray head, the conduit has a flow channel, and the flow channel and the air outlet holes communicate with each other.

In one embodiment, the substrate is considered part of the vacuum chamber.

In one embodiment, the relative positions of the nozzle units and the nozzle fixing units are adjusted to change the arrangement positions of the nozzle units in the vacuum chamber.

In one embodiment, the spray head fixing unit has a plurality of through holes, and the spray head units pass through the through holes respectively and are movably closely matched with the through holes.

In one embodiment, the through holes of the nozzle fixing unit or the nozzle units are arranged in a honeycomb-like manner.

In one embodiment, a reactant enters the reaction space from an air inlet of the side wall through the nozzle units, and leaves the reaction space from an air outlet of the side wall through a gap between the nozzle units.

In one embodiment, the vacuum coating device further includes an intake manifold unit, which is disposed on the side wall and is connected to the shower head fixing unit. The intake manifold unit includes a gas injection space, and a reactant is formed from one of the side walls. The air inlet enters the gas injection space.

In one embodiment, the intake manifold unit further includes a plurality of manifold flow channels, the manifold flow channels are communicated with the gas injection space, and the gas injection space passes through the manifold flow channels, the The flow channels and the air outlet holes of each nozzle are communicated with the reaction space.

In one embodiment, the manifold flow channels are arranged corresponding to the flow channels of the conduits.

In one embodiment, the spray head fixing unit has a plurality of perforations, and a plurality of sealing members are disposed between the spray head fixing unit and the intake manifold unit, and the sealing members are arranged corresponding to the through holes.

In one embodiment, the thickness of the intake manifold unit along an extension direction of the side wall portion is positively related to the upper and lower limits of the undulations of the curved surface.

In one embodiment, the vacuum chamber further has a top, the substrate is located between the top and the gas distribution module, and the heating unit is located between the top and the substrate.

As mentioned above, in the gas distribution module and the vacuum coating device of the present invention applied to the vacuum coating device, the substrate is arranged on the side wall of the vacuum chamber, and the side wall of the vacuum chamber is respectively connected to the nozzle fixing unit and the substrate. to form a reaction space; the nozzle units of the gas distribution module are arranged side by side in the vacuum chamber through the nozzle fixing unit, and the nozzles of the nozzle units are located in the reaction space; the heating unit is arranged on the side of the substrate away from the reaction space; wherein, the substrate includes Facing the curved surfaces of the nozzles, the arrangement positions of the nozzle units in the vacuum chamber are changed according to the shape of the curved surfaces. Therefore, compared with the existing vacuum coating device, when applied to different curved substrates with different curved surface shapes, the present invention only needs to relatively adjust the shower head units of the gas distribution module according to the change of the curved surface shape The relative position of the nozzle fixing unit can be applied to curved substrates of various shapes, and at the same time, the curved substrates can have good film uniformity, thereby improving the existing problem of poor film uniformity. In addition, the vacuum coating apparatus of the present invention can also use the substrate to reduce the volume of the reaction space for the film formation reaction, so that the coating rate can be increased.

The gas distribution module and the vacuum coating device according to the preferred embodiments of the present invention will be described below with reference to the related drawings, wherein the same components will be described with the same reference symbols.

Please refer to FIGS. 2 to 3B , wherein FIG. 2 is a schematic diagram of a vacuum coating device according to an embodiment of the present invention, and FIG. 3A is a partial schematic diagram of the shower head unit of the gas distribution module in the vacuum coating device of FIG. 2 , 3B is a schematic cross-sectional view of one of the nozzle fixing units in the vacuum coating apparatus of FIG. 2 .

The vacuum coating device 2 is used in conjunction with a substrate W. The substrate W is a curved substrate having irregular shapes such as curved surfaces or high and low undulations, and has at least one curved surface W1. The curved surface W1 of the substrate W in this embodiment is an arc-shaped surface. Of course, in different embodiments, the curved surface W1 may also include a combination of multiple arc-shaped surfaces (combination of multiple curved surfaces), or include different heights such as undulations. Regular shape, or a combination thereof. In some embodiments, the substrate W is made of a light-transmitting or non-light-transmitting material, such as a sapphire (Sapphire) substrate, a gallium arsenide (GaAs) substrate, or a silicon carbide (SiC) substrate, without limitation. In some embodiments, the substrate W may have a film layer thereon.

As shown in FIG. 2 , the vacuum coating device 2 includes a vacuum chamber 21 , a nozzle fixing unit 22 , a gas distribution module 23 and a heating unit 24 . In addition, the vacuum coating device 2 of this embodiment may further include an intake manifold unit 25 , an intake passage 26 and an exhaust passage 27 .

The vacuum chamber 21 has a side wall portion 211 , and the substrate W is disposed on the side wall portion 211 . Here, the side wall portion 211 of the vacuum chamber 21 is used as a supporting mechanism for the substrate W. As shown in FIG. In addition, the vacuum chamber 21 of this embodiment further includes a bottom portion 212 connected to the side wall portion 211 , and the vacuum chamber body 21 is composed of the substrate W, the side wall portion 211 and the bottom portion 212 . In other words, in this embodiment, the substrate W1 is covered on the side wall portion 211 of the vacuum chamber 21 , so that the substrate W1 is regarded as a part of the vacuum chamber 21 . In order to make the substrate W and the side wall portion 211 closely adhered, a sealing member O1 may be provided between the substrate W and the side wall portion 211. The sealing member O1 is, for example, but not limited to, an O-ring, so as to prevent the outside gas from entering the vacuum chamber when a vacuum is formed. inside the body 21 to interfere with the process.

The shower head fixing unit 22 is used for fixing the gas distribution module (the shower head unit) as the name suggests. The shower head fixing unit 22 is disposed on the side wall portion 211 of the vacuum chamber 21 , and the side wall portion 211 is respectively connected with the shower head fixing unit 22 and the substrate W to form a reaction space R. Here, the shower head fixing unit 22 is disposed on the side of the side wall portion 211 away from the substrate W, and the side wall portion 211, the shower head fixing unit 22 and the substrate W together form a reaction space R, and the reaction space R is the reactant (for example, a reaction precursor). After entering the vacuum chamber 21, chemical reaction or/and chemical decomposition are carried out with the substrate W to generate a processing space for the thin film to be deposited.

The gas distribution module 23 is disposed on the shower head fixing unit 22 . The gas distribution module 23 includes a plurality of shower head units 231 , and the shower head units 231 are arranged side by side in the vacuum chamber 21 through the shower head fixing unit 22 . As shown in FIG. 2 and FIG. 3B , the nozzle fixing unit 22 has a plurality of through holes H, and the nozzle units 231 are arranged corresponding to the through holes H (one-to-one correspondence). In addition, the nozzle units 231 respectively pass through the through holes H, and are movably closely matched with the through holes H, thereby adjusting (moving) and fixing the nozzle units 231 and the curved surface of the substrate W through the nozzle fixing unit 22 The distance between W1 further adjusts and fixes the positions of the shower head units 231 in the vacuum chamber 21 , and produces an airtight effect to prevent the gas in the reaction space R from leaking out in the direction of the bottom 212 .

Since the nozzle unit 231 passes through the corresponding through holes H of the nozzle fixing unit 22 , the position of the through holes H of the nozzle fixing unit 22 will determine the arrangement of the nozzle units 231 . For example, as shown in FIG. 3B , in order to achieve a relatively dense arrangement, the through holes H of the nozzle fixing unit 22 of the present embodiment are arranged in a honeycomb manner, so that the nozzle units 231 are also arranged in a honeycomb manner. arrangement. Of course, the through holes H of the showerhead fixing unit 22 or the showerhead units 231 can also be arranged in other ways, which are not limited in the present invention, and the arrangement can be adjusted according to the requirements of forming a film layer on the substrate W, which is not limited in the present invention.

As shown in FIG. 3A, each nozzle unit 231 includes a nozzle 231a and a conduit 231b connected to the nozzle 231a, the nozzle 231a has a plurality of air outlet holes h, and the conduit 231b has a flow channel C1, and the flow channel C1 of the conduit 231b is connected to The air outlet holes h of the shower head 231a are connected to each other, so the reactants can be ejected from the air outlet holes h through the flow channel C1 of the conduit 231b of the shower head unit 231, so as to be evenly distributed on the curved surface W1 of the substrate W, and at the same time, the formation of The uniformity of the film is better. The nozzles 231a in this embodiment are all located in the reaction space R, and a part of the conduits 231b are also located in the reaction space R, but another part of the conduits 231b is located in the through hole H of the nozzle fixing unit 22 .

Referring to FIG. 2 again, the heating unit 24 is disposed on the side of the substrate W away from the reaction space R. As shown in FIG. The heating unit 24 can heat the substrate and the vacuum chamber 21, so that the temperature of the substrate W and the reaction space R can reach the temperature required for the chemical reaction or/and the chemical decomposition process. Compared with the existing heaters disposed in the vacuum chamber 21 (as shown in FIG. 1 ), the heating unit 24 of the present embodiment is disposed on the side of the substrate W away from the reaction space R, so that the reaction precursors entering the reaction space R can be avoided. or other gases contaminate the heating unit 24 . In some embodiments, the heating unit 24 may be, for example, but not limited to, an infrared or electrothermal heater. In some embodiments, when the heating unit 24 is heated, the heat energy away from the substrate W may be reflected back to the substrate W by, for example, a reflector, thereby improving the heating efficiency. The reflective member is, for example, but not limited to, a reflective mirror, a reflective sheet or a reflective film layer, which can reflect the thermal energy away from the substrate W back to the substrate W again.

The intake channel 26 and the exhaust channel 27 are respectively connected to the side wall 211 of the vacuum chamber 21 , and the intake channel 26 and the exhaust channel 27 communicate with the reaction space R through the nozzle units 231 of the gas distribution module 23 . Specifically, the air inlet passage 26 of the present embodiment is connected to an air inlet I of the side wall portion 211, and the exhaust passage 27 is connected to an air outlet O of the side wall portion 211, so that the reactants (eg, reaction precursors) can be fed by the inlet. The gas channel 26 enters the reaction space R through the shower head unit 231; and, in order to make the incoming reactants evenly distributed on the curved surface W1 of the substrate W, the present embodiment uses the gas distribution module 23 to distribute the reactants, so that the reactants enter the vacuum chamber The reactants of the body 21 can be evenly distributed on the curved surface W1 located in the reaction space R, so that the film formation process can be more uniform.

In addition, the intake manifold unit 25 is provided on the side wall portion 211 and is connected to the nozzle fixing unit 22 . The nozzle fixing unit 22 of this embodiment is locked and connected to the intake manifold unit 25 through a fastener T (such as a screw), and then tightly connected to the side wall portion 211, so that the intake manifold unit 25 is located on the side wall portion 211, and the nozzle is fixed. between the unit 22 and the bottom 212 . Here, there may be a plurality of sealing members O2 (such as but not limited to O-rings) between the nozzle fixing unit 22 and the intake manifold unit 25 , and the sealing members O2 correspond to the through holes H of the nozzle fixing unit 22 settings (one-to-one correspondence). In other words, when each nozzle unit 231 is inserted into the corresponding hole H of the nozzle fixing unit 22 , in order to adjust (move) and fix the setting position of each nozzle unit 231 on the nozzle fixing unit 22 , in this embodiment, the sealing elements O2 are passed through. The nozzle unit 231 can be closely matched with the through hole H, wherein when the nozzle unit 231 (the duct 231b) moves to a position in the through hole H, the seal O2 has the function of fixing the position of the nozzle unit 231 (the duct 231b) in addition to In addition, an airtight effect can also be produced to prevent the gas in the reaction space R from leaking out of the through holes H of the nozzle fixing unit 22 .

The intake manifold unit 25 of this embodiment includes a plurality of intake manifolds 251 and a gas injection space S. A plurality of manifold flow passages C2 may be formed between the intake manifolds 251 , and the manifold flow passages C2 and the flow passages C1 of the conduits 231b are correspondingly disposed (one-to-one correspondence and communication), and the aforementioned The number of seals O2 is the same as the number of manifold runners C2. In addition, the gas injection space S is located on the lower side of the intake manifold 251 (and the manifold flow channel C2 ), and is located between the intake manifold 251 and the bottom of the intake manifold unit 25 , and the gas injection space S is connected to the The manifold flow channels C2 communicate with each other, and the reactants can enter the gas injection space S through the air inlet I of the side wall portion 211 and flow into the manifold flow channels C2. In detail, the gas injection space S of the intake manifold unit 25 of the present embodiment passes through the manifold flow channels C2, the flow channels C1 of the shower head units 231, and the air outlet holes h of the shower heads 231a and The reaction space R is connected, therefore, when the reactant enters the gas injection space S, it can be ejected through the manifold flow channels C2, the flow channels C1 of the shower head units 231 and the air outlet holes h of the shower heads 231a, The film formation reaction is performed with the curved surface W1 of the substrate W. After the reaction, the excess reactants and/or by-products in the reaction space R can be discharged from the gas outlet O of the side wall portion 211 through the gaps of the shower head units 231 .

In some embodiments, before the film formation reaction is performed, an exhaust unit (not shown, such as a vacuum pump) may be used to exhaust the gas in the reaction space R through the exhaust channel 27 . In some processes, the heating unit 24 can heat the substrate W to increase the temperature of the substrate W and the reaction space R to a temperature required for the reaction, and the reactants (reaction precursors) can pass through the intake manifold unit 25 through the intake channel 26 , the gas The distribution module 23 enters the reaction space R and evenly distributes it to the curved surface W1 of the substrate W, so that the reactants can be chemically reacted or/and chemically decomposed with the substrate W, and then the excess reactants and/or excess reactants in the reaction space R are discharged through the exhaust unit. Or by-products are discharged from the gaps of the shower head units 231 through the exhaust passage 27 . In some embodiments, after the reactants enter the reaction space R and undergo chemical reaction or/and chemical decomposition, there may be excess reactants and/or by-products in the reaction space R, and non-reactants (such as inert gas) may be used. , such as nitrogen or argon) from the intake channel 26 through the intake manifold unit 25, the gas distribution module 23 into the reaction space R, and exhausted through the exhaust channel 27, in addition to purging excess reactants and by-products , the flow rate of the incoming non-reactive substances can be controlled to control the temperature of the substrate and the reaction space R, so as to improve the cooling rate of the substrate and the reaction space R (for example, the flow rate is large, and the cooling rate is faster).

It should be noted that, in this embodiment, the thickness d of the intake manifold unit 25 along an extension direction D of the side wall portion 211 is positively related to the upper and lower limits of the undulations of the curved surface W1. In other words, the thickness d of the intake manifold unit 25 can determine the upper and lower limits of the undulations of the curved surface W1 .

In addition, in order to make the film formation of the substrate W with the curved surface W1 more uniform, the arrangement of the shower head units 231 of the gas distribution module 23 needs to match the shape of the curved surface W1 of the substrate W. Specifically, in order to make the film formed on the curved surface W1 have good uniformity, the installation positions of the nozzle units 231 of the gas distribution module 23 in the present embodiment in the vacuum chamber 21 are based on the shape of the curved surface W1 of the substrate W. change to change. Here, when the nozzle unit 231 passes through and is fixed to the through hole H of the nozzle fixing unit 22 , the distance between each nozzle unit 231 and the corresponding curved surface W1 can be adjusted (moved) according to the shape change of the curved surface W1 of the substrate W. distance, and then adjust the relative position of each nozzle unit 231 and the nozzle fixing unit 22, thereby changing the setting positions of the nozzle units 231 in the vacuum chamber 21 (or the reaction space R), so that the nozzle units 231 The distances between the nozzles 231a and the curved surface W1 are substantially equal (due to setting errors, the distances between the nozzles 231a and the curved surface W1 may be slightly different, but in general, the distances between all the nozzles 231a and the curved surface W1 are substantially the same).

Therefore, when applied to different curved substrates with different curved surface shapes, the vacuum coating apparatus 2 of this embodiment only needs to relatively adjust the shower head units 231 and the shower head fixing units of the gas distribution module 23 according to the change of the curved surface shape The relative position of 22 can be suitable for curved substrates of various shapes, so that the uniformity of the thin film formed on the curved substrate is good, thereby improving the problem of poor uniformity of the thin film formed on the curved substrate in the prior art. In addition, in the vacuum coating apparatus 2, the substrate W is disposed on the side wall portion 211 of the vacuum chamber 21, and the side wall portion 211 is respectively connected to the shower head fixing unit 22 and the substrate W to form the reaction space R, therefore, the substrate W1 is used To form a reaction space R (the substrate W1 can be regarded as a part of the vacuum chamber 21 ), the volume of the reaction space R for the film formation reaction can be reduced, and the film deposition rate can be improved.

FIG. 4 is a schematic diagram of the application of the vacuum coating apparatus of the present invention with different substrates, and FIG. 5 is a schematic diagram of the vacuum coating apparatus of different embodiments of the present invention.

As shown in FIG. 4 , the vacuum coating device 2 a of the present embodiment is substantially the same as the vacuum coating device 2 of the previous embodiment in terms of the component composition and the connection relationship between the components. The difference is that the shape of the curved surface W1 of the substrate Wa in this embodiment is different from that of the substrate W in the vacuum coating apparatus 2 . Here, the shape of the curved surface W1 of the substrate Wa includes a plurality of continuous curved surfaces (combination of a plurality of curved surfaces) undulating up and down. Therefore, the configuration of the shower head units 231 of the gas distribution module 23 of this embodiment is the same as that of the substrate Wa. The shapes of the curved surfaces W1 are matched with each other. In other words, in order to make the film formation process of the curved surface W1 of the undulating substrate Wa more uniform, each shower head unit 231 of the gas distribution module 23 of this embodiment moves in each of the through holes H according to the shape of the curved surface W1 of the substrate Wa, so that the The installation position of each shower head unit 231 in the vacuum chamber 21 is changed according to the shape change of the curved surface W1 of the substrate Wa that is undulating up and down, so that the distance between the shower heads 231a of the shower head units 231 and the curved surface W1 of the substrate Wa is substantially All are equal.

In addition, as shown in FIG. 5 , the vacuum coating device 2 b of the present embodiment is substantially the same as the vacuum coating device 2 of the previous embodiment in terms of the component composition and the connection relationship between the components. The difference is that in the vacuum coating apparatus 2b of this embodiment, the vacuum chamber 21b further has a top 213, the substrate W is located between the top 213 and the gas distribution module 23, and the heating unit 24 is located between the top 213 and the substrate W between. In different embodiments, the heating unit 24 may also be located on the side of the top portion 213 away from the substrate W (ie, the upper side of the top portion 213 ), which is not limited in the present invention. The feature that the vacuum chamber 21b has the top 213 can also be applied to other embodiments of the present invention.

To sum up, in the gas distribution module and the vacuum coating device of the present invention applied to the vacuum coating device, the substrate is disposed on the side wall of the vacuum chamber, and the side wall of the vacuum chamber is respectively connected to the shower head fixing unit and the substrate to form a reaction space; the nozzle units of the gas distribution module are arranged side by side in the vacuum chamber through the nozzle fixing unit, and the nozzles of the nozzle units are located in the reaction space; the heating unit is arranged on the side of the substrate away from the reaction space; wherein, the substrate includes Facing the curved surfaces of the nozzles, the arrangement positions of the nozzle units in the vacuum chamber are changed according to the shape of the curved surfaces. Therefore, compared with the existing vacuum coating device, when applied to different curved substrates with different curved surface shapes, the present invention only needs to relatively adjust the shower head units of the gas distribution module according to the change of the curved surface shape The relative position of the nozzle fixing unit can be applied to curved substrates of various shapes, and at the same time, the curved substrates can have good film uniformity, thereby improving the existing problem of poor film uniformity. In addition, the vacuum coating apparatus of the present invention can also use the substrate to reduce the volume of the reaction space for the film formation reaction, so that the coating rate can be increased.

The above description is exemplary only, not limiting. Any equivalent modifications or changes that do not depart from the spirit and scope of the present invention shall be included in the appended patent application scope.

1, 2, 2a, 2b: Vacuum coating device 11, 21, 21b: Vacuum chamber 12: Bearing platform 13,26: Intake channel 14: Gas distributor 15: Heater 211: side wall 212: Bottom 213: Top 22: Nozzle fixing unit 23: Gas distribution module 231: Nozzle unit 231a: Sprinkler 231b: Catheter 24: Heating unit 25: Intake manifold unit 251: intake manifold 27: Exhaust channel C1: runner C2: Manifold runner d: thickness D: extension direction h: vent hole H: perforated I: Air intake O: air outlet O1,O2: Seals R: reaction space S: Gas injection space T: lock firmware W, Wa: substrate W1: Surface

FIG. 1 is a schematic diagram of a conventional vacuum coating device. FIG. 2 is a schematic diagram of a vacuum coating apparatus according to an embodiment of the present invention. FIG. 3A is a partial schematic view of the shower head unit of the gas distribution module in the vacuum coating apparatus of FIG. 2 . FIG. 3B is a schematic cross-sectional view of one of the nozzle fixing units in the vacuum coating apparatus of FIG. 2 . FIG. 4 is a schematic diagram of the cooperating application of the vacuum coating device of the present invention with different substrates. 5 is a schematic diagram of a vacuum coating apparatus according to different embodiments of the present invention.

2: Vacuum coating device

21: Vacuum chamber

211: side wall

212: Bottom

22: Nozzle fixing unit

23: Gas distribution module

231: Nozzle unit

231a: Sprinkler

231b: Catheter

24: Heating unit

25: Intake manifold unit

251: intake manifold

26: Intake channel

27: Exhaust channel

C1: runner

C2: Manifold runner

d: thickness

D: extension direction

h: vent hole

H: perforated

I: Air intake

O: air outlet

O1,O2: Seals

R: reaction space

S: Gas injection space

T: lock firmware

W: substrate

W1: Surface

Claims (17)

A gas distribution module applied to a vacuum coating device, which is used in conjunction with a substrate, the gas distribution module comprising: A plurality of spray head units are arranged side by side in a vacuum chamber of the vacuum coating device, and each of the spray head units includes a spray head; Wherein, the substrate includes a curved surface facing the nozzles, and the arrangement positions of the nozzle units in the vacuum chamber are changed according to the shape of the curved surface of the substrate. The gas distribution module of claim 1, wherein the distances between the nozzles and the curved surface are substantially equal. The gas distribution module of claim 1, wherein the shower head has a plurality of air outlet holes, the shower head unit further comprises a conduit connected with the shower head, the conduit has a flow channel, and the flow channel and the air outlet holes communicate with each other . The gas distribution module of claim 1, wherein the substrate is regarded as a part of the vacuum chamber. A vacuum coating device is used in cooperation with a substrate, and the vacuum coating device comprises: a vacuum chamber having a side wall on which the substrate is disposed; a shower head fixing unit disposed on the side wall portion, and the side wall portion is respectively connected with the shower head fixing unit and the substrate to form a reaction space; a gas distribution module including a plurality of showerhead units, the showerhead units are arranged side by side in the vacuum chamber through the showerhead fixing unit, and each of the showerhead units includes a showerhead, and the showerheads are located in the reaction space; and a heating unit, disposed on the side of the substrate away from the reaction space; Wherein, the substrate includes a curved surface facing the nozzles, and the arrangement positions of the nozzle units in the vacuum chamber are changed according to the shape of the curved surface. The vacuum coating device according to claim 5, wherein the relative positions of the spray head units and the spray head fixing unit are adjusted to change the arrangement positions of the spray head units in the vacuum chamber. The vacuum coating device according to claim 5, wherein the distances between the nozzles and the curved surface are substantially equal. The vacuum coating device according to claim 5, wherein the shower head fixing unit has a plurality of through holes, the shower head units respectively pass through the through holes, and are movably closely matched with the through holes. The vacuum coating device according to claim 8, wherein the through holes of the shower head fixing unit or the shower head units are arranged in a honeycomb-like manner. The vacuum coating device according to claim 5, wherein a reactant enters the reaction space from an air inlet of the side wall portion through the shower head units, and passes through an outlet of the side wall portion through the gaps of the shower head units. The gas port leaves the reaction space. The vacuum coating device according to claim 5, wherein the shower head has a plurality of air outlet holes, the shower head unit further comprises a conduit connected with the shower head, the conduit has a flow channel, and the flow channel and the air outlet holes communicate with each other. The vacuum coating device according to claim 11, further comprising: An intake manifold unit is disposed on the side wall portion and connected to the nozzle fixing unit, the intake manifold unit includes a gas injection space, and a reactant enters the gas injection space through an air inlet of the side wall portion . The vacuum coating device according to claim 12, wherein the intake manifold unit further comprises a plurality of manifold flow channels, the manifold flow channels communicate with the gas injection space, and the gas injection space passes through the manifolds The flow channels, the flow channels of the nozzle units and the air outlet holes of the nozzles are communicated with the reaction space. The vacuum coating device according to claim 13, wherein the manifold flow channels are arranged corresponding to the flow channels of the conduits. The vacuum coating device according to claim 12, wherein the shower head fixing unit has a plurality of perforations, a plurality of sealing members are arranged between the shower head fixing unit and the intake manifold unit, and the sealing members are arranged corresponding to the through holes . The vacuum coating device according to claim 12, wherein the thickness of the intake manifold unit along an extension direction of the side wall portion is positively related to the upper and lower limits of the undulations of the curved surface. The vacuum coating device according to claim 5, wherein the vacuum chamber further has a top, the substrate is located between the top and the gas distribution module, and the heating unit is located between the top and the substrate.

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