TW202222139A - Cooling system of server - Google Patents

Abstract

A cooling system of server includes a tank, a case body, a multi-hole box, a first dehumidifying material, a first tube, and a second tube. The tank is configured to accommodate a dielectric fluid. The multi-hole box is disposed in the case body. The first dehumidifying material is disposed in the multi-hole box. The first tube includes a first gas-inlet/outlet end and a second gas-inlet/outlet end respectively connected to the tank and the case body. The second gas-inlet/outlet end is connected to the first dehumidifying material. The second tube includes a liquid-inlet end and a liquid-outlet end respectively connected to the case body and the tank.

Description

Server cooling system

The present disclosure relates to a cooling system for a server, and more particularly, to a single-phase immersion cooling system.

The current single-phase immersion cooling system involves the inflow of cryogenic liquid from below the tank body, and the liquid is evenly distributed throughout the tank body through the perforated plate. The temperature of the liquid flowing through electronic components (eg, servers) will rise due to the waste heat generated by the electronic components. The high-temperature liquid flows out of the tank through the outlet located at the upper part of the tank, and the heat is discharged from the system through the heat exchanger, so that the temperature of the liquid is lowered and flows into the tank again. Since the tank is not evacuated and not completely sealed, there will be air in the tank. When the air is cooled, the water vapor it contains will condense, forming liquid water. When this liquid water comes into contact with electronic components, it will cause damage.

The liquid used in the single-phase immersion cooling system is mainly divided into two categories, one is the traditionally used non-conductive oil liquid such as mineral oil, and the other is the fluorinated liquid commonly used in recent new systems. Because the fluoride solution has low viscosity and is slightly volatile, after the server is taken out of the liquid tank, the amount of liquid remaining on the surface is small. After being placed in a ventilated place for a period of time, the residual fluoride solution will evaporate completely It is convenient for users to maintain.

However, due to the high cost of fluorinated liquids and their easy volatilization compared with oils, the requirements for the tightness and pressure control of the system are also high. In addition, since the density of the fluorinated liquid is higher than that of liquid water, the condensed water will float on the fluorinated liquid tank. In order to prevent the condensed water from contacting the electronic components, it is necessary to install a water removal device.

Therefore, how to propose a cooling system for a server that can solve the above problems is one of the problems that the industry is eager to devote to R&D resources to solve.

In view of this, one objective of the present disclosure is to provide a cooling system for a server that can solve the above problems.

In order to achieve the above objective, according to an embodiment of the present disclosure, a cooling system for a server includes a tank, a box, a porous box, a first hygroscopic material, a first pipeline, and a second pipeline. The tank body is configured to accommodate the dielectric fluid. The porous box body is arranged in the box body. The first hygroscopic material is arranged in the porous box body. The first pipeline includes a first air inlet/outlet end and a second air inlet/outlet end connected to the tank body and the box body, respectively. The first air inlet/outlet end is connected to the first hygroscopic material. The second pipeline includes a liquid inlet end and a liquid outlet end connected to the tank body and the tank body, respectively.

In one or more embodiments of the present disclosure, the cooling system of the server further includes a third pipeline and a first valve. The third pipeline communicates with the space inside and outside the box. The first valve is arranged on the third pipeline.

In one or more embodiments of the present disclosure, the cooling system of the server further includes a barometer and a controller. The barometer is configured to detect the air pressure in the tank. The controller is configured to open the first valve when the air pressure value is higher than the air pressure upper limit value, and is configured to close the first valve when the air pressure value is lower than the air pressure upper limit value.

In one or more embodiments of the present disclosure, the controller is further configured to open the first valve when the air pressure value is lower than the air pressure lower limit value.

In one or more embodiments of the present disclosure, the liquid inlet end and the end of the third pipeline connecting box are located on opposite sides of the first hygroscopic material, respectively.

In one or more embodiments of the present disclosure, the cooling system of the server further includes a second valve. The second valve is arranged on the second pipeline.

In one or more embodiments of the present disclosure, the cooling system of the server further includes a liquid level sensor and a controller. The liquid level sensor is configured to sense the liquid level of the condensate in the tank. The controller is configured to open and close the second valve when the liquid level is above and below a predetermined value, respectively.

In one or more embodiments of the present disclosure, the cooling system of the server further includes a second moisture absorbing material. The second hygroscopic material is arranged on the second pipeline.

In one or more embodiments of the present disclosure, the cooling system of the server further includes a second valve. The second valve is arranged on the second pipeline. The second valve and the second hygroscopic material are adjacent to the liquid inlet end and the liquid outlet end, respectively.

In one or more embodiments of the present disclosure, the tank body has opposite liquid sides and gas sides, and the liquid outlet end and the first gas inlet/outlet end are adjacent to the liquid side and the gas side, respectively.

To sum up, in the cooling system of the server of the present invention, the hot vapor in the tank caused by the electronic components immersed in the dielectric liquid that generates waste heat and the humid air entering the cooling system of the server from the outside are all absorbed Wet materials absorb water vapor and/or liquid water to avoid contact with electronic components in the cooling system of the server. Since the air entering and exiting the cooling system of the server is treated with hygroscopic material, it can effectively maintain the low humidity in the cooling system of the server. In the cooling system of the server of the present invention, the user can control the opening and closing of the valve to achieve the purpose of maintaining the air pressure between the set upper limit and lower limit and preventing the escape of the dielectric fluid. Constant air pressure and improved recovery of dielectric fluid.

The above descriptions are only used to describe the problems to be solved by the present disclosure, the technical means for solving the problems, and their effects, etc. The specific details of the present disclosure will be introduced in detail in the following embodiments and related drawings.

Several embodiments of the present disclosure will be disclosed in the following drawings, and for the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the present disclosure. That is, in some embodiments of the present disclosure, these practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some well-known structures and elements will be shown in a simple and schematic manner in the drawings. The same reference numbers will be used throughout the drawings to refer to the same or similar elements.

The structure and function of each element included in the cooling system 100 of the server according to the present embodiment and the connection relationship between the various elements will be described in detail below.

As shown in FIG. 1 , in this embodiment, the cooling system 100 of the server includes a tank body 110 , a box body 120 , a first pipeline 130 and a second pipeline 132 . The tank body 110 has opposite liquid side 110a and gas side 110b, and the dielectric liquid L1 loaded in the tank body 110 is located on the liquid side 110a. The porous box body 122 is disposed in the box body 120 . The first hygroscopic material 124 is disposed in the porous box body 122 . The first hygroscopic material 124 is configured to absorb water without absorbing the dielectric liquid L1 and the dielectric liquid vapor generated by the dielectric liquid L1. The first pipeline 130 has a first gas inlet/outlet end 130a and a second gas inlet/outlet end 130b connected to the tank body 110 and the box body 120, respectively. The second air inlet/outlet end 130b is connected to the first hygroscopic material 124 . The second pipeline 132 has a liquid inlet end 132a and a liquid outlet end 132b connected to the tank body 120 and the tank body 110, respectively. When the dielectric liquid L1 in the tank body 110 generates dielectric liquid vapor (for example, due to the heating of electronic components), the mixed gas in the tank body 110 will reach the first hygroscopic material 124 through the first pipeline 130 and be absorb the moisture in it. The gas absorbed by the water vapor then enters the box body 120 and condenses out the dielectric liquid L1 in the box body 120 .

In this embodiment, the cooling system 100 of the server further includes a third pipeline 134 . The third pipeline 134 communicates the space inside and outside the box body 120 . When the air pressure in the tank body 110 is too high (for example, the air pressure value in the tank body 110 is greater than the upper air pressure value), the cooling system 100 of the server can exhaust the air in the box body 120 to the box body through the third pipeline 134 120 to avoid excess gas in the cooling system 100 of the server. When the air pressure in the tank body 110 is too low (for example, the air pressure value in the tank body 110 is less than the lower limit value of the air pressure), the cooling system 100 of the server can introduce the humid air from the outside into the box body 120 through the third pipeline 134 , and Moisture is absorbed through the first hygroscopic material 124 . The hygroscopic dry air can then enter the tank body 110 through the first pipeline 130 to avoid too little gas in the cooling system 100 of the server. The dielectric liquid L1 obtained by condensing the air in the box 120 and the liquid water will be mixed to form the condensed liquid L2. The condensate L2 can flow into the tank body 110 through the second pipeline 132 , wherein the second hygroscopic material 126 disposed in the second pipeline 132 absorbs liquid water first, and the remaining dielectric liquid L1 then flows into the tank body 110 .

With the aforementioned structure and configuration, the cooling system 100 of the server can absorb moisture through the first hygroscopic material 124 and the second hygroscopic material 126 to achieve the effect of keeping the entire system in a dry state, and effectively prevent liquid water from contacting the electronics. element. In addition, since the dielectric liquid vapor generated by the dielectric liquid L1 in the tank body 110 can be condensed in the tank body 120 through the above-mentioned path, and then flow back to the tank body 110 through the second pipeline 132, the dielectric liquid L1 can be effectively reduced. to improve the recovery rate of the dielectric liquid L1.

In some embodiments, the dielectric liquid L1 may be a dielectric substance such as oil or fluorinated liquid, but the present disclosure is not limited thereto.

In some embodiments, the tank 120 is set at a position higher than the liquid level of the dielectric liquid L1, so that the dielectric liquid L1 condensed in the tank 120 can automatically flow back to the tank 110 based on its own gravity, but This disclosure is not limited to this.

In some embodiments, the first gas inlet/outlet end 130a is connected to the sidewall of the gas side 110b of the tank body 110 . In other embodiments, the first gas inlet/outlet end 130a protrudes into the tank body 110 through the side wall of the gas side 110b, as shown in FIG. 1 .

In some embodiments, the second air inlet/outlet end 130b is connected to the side wall of the box body 120, as shown in FIG. 1 . In other embodiments, the second gas inlet/outlet end 130b protrudes into the box body 120 through the side wall of the box body 120 .

In some embodiments, the first hygroscopic material 124 may be a molecular sieve, but the present disclosure is not limited thereto. In some embodiments, the first hygroscopic material 124 can be used with a humidity indicator, so that the user can immediately replace the first hygroscopic material 124 according to the humidity state indicated by the humidity indicator.

In some embodiments, the second hygroscopic material 126 may be a molecular sieve, but the present disclosure is not limited thereto. In some embodiments, the second hygroscopic material 126 can be used together with a humidity indicator, so that the user can instantly replace the second hygroscopic material 126 according to the humidity state indicated by the humidity indicator.

In some embodiments, the liquid inlet end 132 a of the second pipeline 132 is connected to the side wall of the tank body 120 . In other embodiments, the liquid inlet end 132a protrudes into the casing 120 through the side wall of the casing 120, as shown in FIG. 1 .

In some embodiments, the liquid outlet 132b is connected to the side wall of the liquid side 110a of the tank body 110 . In other embodiments, the liquid outlet end 132b protrudes to the liquid side 110a through the side wall of the tank body 110 on the liquid side 110a, as shown in FIG. 1 .

In some embodiments, one end of the third pipeline 134 is connected to the side wall of the tank 120 , as shown in FIG. 1 . In other embodiments, one end of the third pipeline 134 protrudes into the box body 120 through the side wall of the box body 120 .

As shown in FIG. 2 , the mixed gas mg is composed of the dielectric liquid vapor Lv and the moist air wa in the tank body 110 . When the pressure of the tank body 110 is so high that the mixed gas mg flows from the tank body 110 through the first pipeline 130 to the first hygroscopic material 124 in the porous box body 122, because the density of the dielectric liquid vapor Lv is generally greater than that of the dry air da Therefore, the concentration of the dry air da above the first hygroscopic material 124 in the box 120 is greater than the concentration of the dielectric liquid vapor Lv. The concentration of the dry air da below the first hygroscopic material 124 in the box body 120 is smaller than the concentration of the dielectric liquid vapor Lv, so that the hygroscopic dry air da is discharged out of the box body 120 through the third pipeline 134 and the dielectric liquid vapor Lv. The electro-hydraulic vapor Lv is stored in the case 120 .

As shown in FIG. 3 , when the air pressure of the tank 110 is too small, the moist air wa outside the tank 120 will flow into the tank 120 through the third pipeline 134 and be dehumidified by the first hygroscopic material 124 to become dry air da. The hygroscopic dry air da and the dielectric liquid vapor Lv in the tank 120 form a dry mixed gas dmg and flow into the tank 110 through the first pipeline 130 .

In some embodiments, a small portion of the humid air wa outside the box 120 can be condensed into liquid water and stored in the box 120 without passing through the first hygroscopic material 124 when flowing into the box 120 through the third pipeline 134 . In some embodiments, the condensate L2 is composed of liquid water condensed from the humid air wa outside the tank 120 and the dielectric liquid L1 condensed inside the tank 120 .

As shown in FIGS. 1 and 4 , in this embodiment, the cooling system 100 of the server further includes a barometer 150 and a controller C. The barometer 150 is disposed in the tank body 110 and configured to detect the air pressure value in the tank body 110 . The controller C is, for example, disposed outside the cooling system 100 of the server to control the opening and closing of the first valve 140 and the second valve 142 .

In some embodiments, the first valve 140 and the second valve 142 may be solenoid valves, but the present disclosure is not limited thereto.

Please refer to FIGS. 1 , 2 and 4. In some embodiments, when the barometer 150 detects that the air pressure value of the tank body 110 is greater than the upper air pressure value, the barometer 150 sends a signal to the controller C , and then the controller C will control the first valve 140 to open, so that the mixed gas mg in the tank body 110 flows from the first inlet/outlet end 130a to the first hygroscopic material 124 through the first pipeline 130 and then is discharged through the third pipeline 134 Outside the box 120 .

Please refer to FIG. 1 and FIG. 4, in some embodiments, when the barometer 150 detects that the air pressure value of the tank body 110 is lower than the upper air pressure value, the barometer 150 sends a signal to the controller C, and then controls the The device C will control the first valve 140 to close, so that the gas in the tank body 110 and the box body 120 cannot be discharged out of the box body 120 through the third pipeline 134 .

Please refer to FIGS. 1 , 3 and 4. In some embodiments, when the barometer 150 detects that the air pressure value of the tank body 110 is lower than the lower air pressure value, the barometer 150 sends a signal to the controller C, then the controller C will control the first valve 140 to open, so that the humid air wa outside the box body 120 flows into the box body 120 through the third pipeline 134, passes through the first hygroscopic material 124, and then flows from the second air inlet/outlet end 130b flows into the tank body 110 through the first pipeline 130 .

Please refer to FIG. 1 and FIG. 4 , in some embodiments, the cooling system 100 of the server further includes a liquid level sensor 152 . The liquid level sensor 152 is disposed in the tank 120 and configured to detect the liquid level of the condensate L2 in the tank 120 . When the liquid level sensor 152 detects that the liquid level of the condensate L2 is higher than a preset value, the liquid level sensor 152 will send a signal to the controller C, and then the controller C will control the second valve 142 to open, So that the condensate L2 in the tank 120 flows into the second pipeline 132 from the liquid inlet end 132a. When passing through the second hygroscopic material 126 , the liquid water in the condensate L2 is absorbed, and the remaining dielectric liquid L1 flows into the tank body 110 from the liquid outlet end 132 b through the second pipeline 132 . When the liquid level sensor 152 detects that the liquid level of the condensate L2 is lower than the preset value, the liquid level sensor 152 will send a signal to the controller C, and then the controller C will control the second valve 142 to close. In this way, it can be ensured that only the condensate L2 flows into the tank body 110 from the tank body 120 via the second pipeline 132 .

In some embodiments, the second valve 142 and the second hygroscopic material 126 may be disposed adjacent to the liquid inlet end 132a and the liquid outlet end 132b, respectively, so that when the second hygroscopic material 126 needs to be replaced, the second line 132 does not need to be replaced first. The replacement can be performed by draining the fluid, which increases the convenience of replacement.

Referring to FIG. 4 , in some embodiments, the controller C may be a single control unit to control the first valve 140 and the second valve 142 simultaneously. In other embodiments, the controller C may include multiple control units to control the first valve 140 and the second valve 142 respectively.

From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that, in the cooling system of the server of the present invention, the hot vapor in the tank caused by the electronic components immersed in the dielectric liquid that generates waste heat and the The humid air entering the cooling system of the server from the outside absorbs water vapor and/or liquid water through the hygroscopic material, so as to avoid contact between the liquid water and the electronic components in the cooling system of the server. Since the air entering and exiting the cooling system of the server is treated with hygroscopic material, it can effectively maintain the low humidity in the cooling system of the server. In addition, in the cooling system of the server of the present invention, the user can control the opening and closing of the valve to achieve the purpose of maintaining the air pressure between the set upper and lower limits and preventing the escape of the dielectric fluid, so it can effectively to keep the air pressure constant and improve the recovery rate of the dielectric fluid.

In one embodiment of the present invention, the cooling system of the present invention can be applied to a server, and the server can be used for artificial intelligence (AI) computing, edge computing, and can also be used as 5G Server, cloud server or car network server use.

Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection of the present disclosure The scope shall be determined by the scope of the appended patent application.

100: Cooling system for the server 110: tank body 110a: Liquid side 110b: Gas side 120: Box 122: Porous Box 124: The first hygroscopic material 126: Second hygroscopic material 130: The first pipeline 130a: First inlet/outlet end 130b: Second inlet/outlet port 132: Second pipeline 132a: liquid inlet 132b: Liquid outlet 134: The third pipeline 140: First valve 142: Second valve 150: Barometer 152: Liquid level sensor C: controller L1: Dielectric Fluid L2: Condensate

In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows: FIG. 1 is a schematic diagram illustrating a cooling system of a server according to an embodiment of the present disclosure. FIG. 2 is a partial schematic diagram illustrating the exhaust gas of the cooling system of the server according to an embodiment of the present disclosure. FIG. 3 is a partial schematic diagram illustrating the intake air of the cooling system of the server according to an embodiment of the present disclosure. FIG. 4 is a functional block diagram illustrating some elements of a cooling system of a server according to an embodiment of the present disclosure.

100: Cooling system for the server

110: tank body

110a: Liquid side

110b: Gas side

120: Box

122: Porous Box

124: The first hygroscopic material

126: Second hygroscopic material

130: The first pipeline

130a: First inlet/outlet end

130b: Second inlet/outlet port

132: Second pipeline

132a: liquid inlet

132b: liquid outlet

134: The third pipeline

140: First valve

142: Second valve

150: Barometer

152: Liquid level sensor

L1: Dielectric Fluid

L2: Condensate

Claims (10)

A cooling system for a server, comprising: a tank body configured to accommodate a dielectric fluid; a box; a porous box body, arranged in the box body; a first hygroscopic material disposed in the porous box body; a first pipeline, comprising a first air inlet/outlet end and a second air inlet/outlet end respectively connected to the tank body and the box body, and the second air inlet/outlet end connected to the first hygroscopic material; and A second pipeline includes a liquid inlet end and a liquid outlet end respectively connected to the tank body and the tank body. The cooling system for the server of claim 1, further comprising: a third pipeline, connecting the space inside and outside the box; and A first valve is arranged on the third pipeline. The cooling system of the server of claim 2, further comprising: a barometer configured to detect an air pressure value within the tank; and A controller configured to open the first valve when the air pressure value is greater than an air pressure upper limit value, and configured to close the first valve when the air pressure value is smaller than the air pressure upper limit value. The cooling system for a server as claimed in claim 3, wherein the controller is further configured to open the first valve when the air pressure value is less than a lower air pressure value. The cooling system of the server according to claim 2, wherein the liquid inlet end and the end of the third pipeline connected to the box are located on opposite sides of the first hygroscopic material, respectively. The cooling system for the server of claim 1, further comprising: A second valve is arranged on the second pipeline. The cooling system of the server of claim 6, further comprising: a level sensor configured to sense a level of a condensate in the tank; and a controller configured to open and close the second valve when the liquid level is higher and lower than a preset value, respectively. The cooling system of the server according to claim 1, further comprising a second hygroscopic material disposed in the second pipeline. The cooling system of the server of claim 8, further comprising: A second valve is disposed on the second pipeline, wherein the second valve and the second hygroscopic material are respectively adjacent to the liquid inlet end and the liquid outlet end. The cooling system for a server according to claim 1, wherein the tank body has a liquid side and a gas side opposite, and the liquid outlet and the first inlet/outlet end are adjacent to the liquid side and the gas side, respectively .

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