TW202221098A - Sealing material for organic el display element, cured article thereof and organic el display device - Google Patents

Sealing material for organic el display element, cured article thereof and organic el display device Download PDF

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TW202221098A
TW202221098A TW110142612A TW110142612A TW202221098A TW 202221098 A TW202221098 A TW 202221098A TW 110142612 A TW110142612 A TW 110142612A TW 110142612 A TW110142612 A TW 110142612A TW 202221098 A TW202221098 A TW 202221098A
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富田裕介
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日商三井化學股份有限公司
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations

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Abstract

A sealing material for an organic EL display element comprising a compound (A) having a (meth)acrylic acid thio group represented by the following general formula (1). [In the general formula (1), R1 represents a hydrogen atom or a methyl group, and * represents a bonding position.].

Description

有機EL顯示元件用密封材、其硬化物及有機EL顯示裝置Sealing material for organic EL display element, cured product thereof, and organic EL display device

本發明是有關於一種有機電致發光(electroluminescence,EL)顯示元件用密封材、其硬化物及有機EL顯示裝置。The present invention relates to a sealing material for an organic electroluminescence (EL) display element, a cured product thereof, and an organic EL display device.

於有機EL顯示元件的領域中進行了用以提高密封有機EL顯示元件的密封材的特性的研究。In the field of organic EL display elements, studies have been conducted to improve the properties of a sealing material for sealing organic EL display elements.

有機EL顯示元件由於消耗電力少,因此逐漸用於顯示器或照明裝置等中。有機EL顯示元件容易因大氣中的水分或氧而劣化,因此由各種密封構件密封而加以使用,為了實用化,期望提高各種密封構件對水分或氧的耐久性。Since organic EL display elements consume less power, they are gradually being used in displays, lighting devices, and the like. Since organic EL display elements are easily degraded by moisture or oxygen in the atmosphere, they are sealed and used by various sealing members. For practical use, it is desired to improve the durability of various sealing members against moisture or oxygen.

作為有機EL顯示元件的密封方法,可列舉將無機材料與有機材料交替地積層並進行密封的方法。例如可使用如下方法:於元件上包覆第一層的無機材料膜之後形成密封層,進而包覆第二層的無機材料膜。 由於該些無機材料膜的折射率高,因此為了抑制於與無機材料膜的界面上產生的光的反射,對與無機材料膜相接的密封層要求高的折射率。 As a sealing method of an organic EL display element, the method of laminating|stacking an inorganic material and an organic material alternately, and sealing is mentioned. For example, a method of forming a sealing layer after covering the element with the inorganic material film of the first layer, and then covering the inorganic material film of the second layer can be used. Since these inorganic material films have a high refractive index, in order to suppress reflection of light generated at the interface with the inorganic material film, a high refractive index is required for the sealing layer in contact with the inorganic material film.

此處,作為由無機材料膜包覆密封層的方法,例如可列舉藉由蒸鍍形成包含氮化矽或氧化矽的無機材料膜的方法。作為蒸鍍方法,可列舉濺鍍法或電子迴旋共振電漿化學氣相沈積(chemical vapor deposition,CVD)法等。 於蒸鍍時,密封層的表面暴露於電漿中,因此對密封層亦要求耐電漿性,即不易因電漿處理等而劣化。 Here, as a method of covering a sealing layer with an inorganic material film, the method of forming the inorganic material film containing silicon nitride or silicon oxide by vapor deposition is mentioned, for example. As a vapor deposition method, a sputtering method, an electron cyclotron resonance plasma chemical vapor deposition (chemical vapor deposition, CVD) method, etc. are mentioned. At the time of vapor deposition, since the surface of the sealing layer is exposed to plasma, the sealing layer is also required to be resistant to plasma, that is, to be less likely to be deteriorated by plasma treatment or the like.

於專利文獻1中記載一種含有硫系光硬化性單體、非-硫系光硬化性單體、及聚合起始劑的有機發光元件密封用組成物。 於專利文獻2中記載一種含有環狀(甲基)丙烯酸酯化合物及聚合起始劑的樹脂組成物。 於專利文獻3中記載一種包含含硫代環氧基的芴衍生物、及二硫醇化合物聚合而獲得的硫代環氧樹脂的硬化性組成物。 [現有技術文獻] [專利文獻] Patent Document 1 describes a composition for sealing an organic light-emitting element containing a sulfur-based photocurable monomer, a non-sulfur-based photocurable monomer, and a polymerization initiator. Patent Document 2 describes a resin composition containing a cyclic (meth)acrylate compound and a polymerization initiator. Patent Document 3 describes a curable composition comprising a thioepoxy resin obtained by polymerizing a thioepoxy group-containing fluorene derivative and a dithiol compound. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特表2019-537217號公報 [專利文獻2]日本專利特開2014-229496號公報 [專利文獻3]日本專利特開2019-172880號公報 [Patent Document 1] Japanese Patent Publication No. 2019-537217 [Patent Document 2] Japanese Patent Laid-Open No. 2014-229496 [Patent Document 3] Japanese Patent Laid-Open No. 2019-172880

[發明所欲解決之課題][The problem to be solved by the invention]

如所述般,為了抑制於與無機材料膜的界面上產生的光的反射,對有機EL顯示裝置的密封材的硬化物要求高的折射率。就所述方面而言,專利文獻1及專利文獻2中所記載的樹脂組成物的硬化物的折射率均低至未滿1.60,有改善的餘地。 另外,專利文獻2中的樹脂組成物根據(甲基)丙烯酸酯化合物的種類,有時耐電漿性低。 進而,專利文獻3中所記載的樹脂組成物由於黏度高,因此於利用網版印刷或噴墨的塗佈性方面有改善的餘地。 As described above, in order to suppress the reflection of light generated at the interface with the inorganic material film, a high refractive index is required for the cured product of the sealing material of the organic EL display device. In this respect, the refractive index of the cured product of the resin composition described in Patent Document 1 and Patent Document 2 is as low as less than 1.60, and there is room for improvement. In addition, the resin composition in Patent Document 2 may have low plasma resistance depending on the type of the (meth)acrylate compound. Furthermore, since the resin composition described in Patent Document 3 has a high viscosity, there is room for improvement in applicability by screen printing or inkjet.

本發明是鑒於該些專利文獻的記載而成者,提供一種黏度、耐電漿性及製成硬化物時的折射率的平衡優異的有機EL顯示元件用密封材。 [解決課題之手段] This invention is made in view of the description of these patent documents, and provides the sealing material for organic electroluminescent display elements which is excellent in the balance of viscosity, plasma resistance, and the refractive index at the time of making a cured product. [Means of Solving Problems]

根據本發明,可提供以下所示的有機EL顯示元件用密封材、其硬化物及有機EL顯示裝置。 [1] 一種有機EL顯示元件用密封材,含有具有下述通式(1)所表示的(甲基)丙烯酸硫基((meta)acrylic thio group)的化合物(A)。 [化1]

Figure 02_image001
[所述通式(1)中,R 1表示氫原子或甲基,*表示鍵結位置。] [2] 如[1]所述的有機EL顯示元件用密封材,其中所述化合物(A)為具有兩個以上的所述(甲基)丙烯酸硫基的化合物。 [3] 如所述[1]或[2]所述的有機EL顯示元件用密封材,更含有具有(甲基)丙烯酸基的化合物(B)(其中所述化合物(A)除外)。 [4] 如所述[3]所述的有機EL顯示元件用密封材,其中所述化合物(B)為更具有可經取代的芳香族基的化合物。 [5] 如所述[1]至[4]中任一項所述的有機EL顯示元件用密封材,其中利用E型黏度計測定的25℃、20 rpm下的黏度為5 mPa·s以上且50 mPa·s以下。 [6] 如所述[1]至[5]中任一項所述的有機EL顯示元件用密封材,用於利用噴墨法進行的塗佈。 [7] 如所述[1]至[6]中任一項所述的有機EL顯示元件用密封材,於具有依序積層有機EL顯示元件、第一無機材料膜、密封層、第二無機材料膜的結構的有機EL顯示裝置中,用於所述密封層的形成。 [8] 如所述[1]至[7]中任一項所述的有機EL顯示元件用密封材,於使用阻擋材與填充材的密封結構中,用作所述填充材。 [9] 一種硬化物,是將如所述[1]至[8]中任一項所述的有機EL顯示元件用密封材硬化而成。 [10] 一種有機EL顯示裝置,包含: 有機EL顯示元件;以及 密封層,包覆所述有機EL顯示元件, 所述密封層含有如所述[9]所述的硬化物。 [發明的效果] ADVANTAGE OF THE INVENTION According to this invention, the sealing material for organic EL display elements shown below, the hardened|cured material thereof, and an organic EL display device can be provided. [1] A sealing material for an organic EL display element, comprising a compound (A) having a (meta)acrylic thio group represented by the following general formula (1). [hua 1]
Figure 02_image001
[In the general formula (1), R 1 represents a hydrogen atom or a methyl group, and * represents a bonding position. ] [2] The sealing material for organic EL display elements according to [1], wherein the compound (A) is a compound having two or more of the (meth)acrylic thio groups. [3] The sealing material for an organic EL display element according to the above [1] or [2], further comprising a compound (B) having a (meth)acrylic group (except for the compound (A)). [4] The sealing material for an organic EL display element according to the above [3], wherein the compound (B) is a compound further having a substituted aromatic group. [5] The sealing material for an organic EL display element according to any one of the above [1] to [4], wherein the viscosity at 25° C. and 20 rpm measured by an E-type viscometer is 5 mPa·s or more and 50 mPa·s or less. [6] The sealing material for organic EL display elements according to any one of the above [1] to [5], which is used for coating by an inkjet method. [7] The sealing material for an organic EL display element according to any one of the above [1] to [6], wherein the organic EL display element, the first inorganic material film, the sealing layer, the second inorganic material are laminated in this order In an organic EL display device having a structure of a material film, it is used for the formation of the sealing layer. [8] The sealing material for organic EL display elements according to any one of the above [1] to [7], which is used as the filler in a sealing structure using a barrier material and a filler. [9] A cured product obtained by curing the sealing material for an organic EL display element according to any one of the above [1] to [8]. [10] An organic EL display device, comprising: an organic EL display element; and a sealing layer covering the organic EL display element, wherein the sealing layer contains the cured product according to the above [9]. [Effect of invention]

根據本發明,可提供一種黏度、耐電漿性(plasma resistance)及製成硬化物時的折射率的平衡優異的有機EL顯示元件用密封材。ADVANTAGE OF THE INVENTION According to this invention, the sealing material for organic electroluminescent display elements which is excellent in the balance of viscosity, plasma resistance, and the refractive index when used as a cured product can be provided.

以下,使用圖式對本發明的實施方式進行說明。再者,於所有圖式中,對同樣的結構要素標註共同的符號,並適宜省略說明。另外,於本實施方式中,關於各成分,可分別使用一種,亦可將兩種以上組合而使用。另外,表示數值範圍的「~」表示以上、以下,包含上限值及下限值兩者。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in all drawings, the common code|symbol is attached|subjected to the same component, and description is abbreviate|omitted suitably. In addition, in this embodiment, each component may be used individually by 1 type, and may be used in combination of 2 or more types. In addition, "-" which shows a numerical range shows above and below, and includes both an upper limit value and a lower limit value.

<有機EL顯示元件用密封材> (化合物(A)) 於本實施方式中,有機EL顯示元件用密封材(以下,亦適宜地簡稱為「密封材」)含有具有下述通式(1)所示的(甲基)丙烯酸硫基的化合物(A)。本實施方式的密封材的黏度、耐電漿性及製成硬化物時的折射率的平衡優異。 [化1]

Figure 02_image001
[所述通式(1)中,R 1表示氫原子或甲基,*表示鍵結位置。] <Sealing material for organic EL display elements> (Compound (A)) In the present embodiment, the sealing material for organic EL display elements (hereinafter, also abbreviated as “sealing material” appropriately) contains a compound having the following general formula (1) The compound (A) of the (meth)acrylic thio group shown. The sealing material of the present embodiment is excellent in the balance of viscosity, plasma resistance, and refractive index when used as a cured product. [hua 1]
Figure 02_image001
[In the general formula (1), R 1 represents a hydrogen atom or a methyl group, and * represents a bonding position. ]

就增大密封材的硬化物的折射率的觀點而言,化合物(A)較佳為具有兩個以上的(甲基)丙烯酸硫基的化合物。From the viewpoint of increasing the refractive index of the cured product of the sealing material, the compound (A) is preferably a compound having two or more (meth)acrylic thio groups.

作為化合物(A),可列舉以下的通式(2)所表示的化合物。 [化2]

Figure 02_image006
[所述通式(2)中,R 1與通式(1)的定義為相同含義,R 2表示可經取代的脂肪族基、可經取代的脂環族基、可經取代的芳香族基或可經取代的雜環基,所述脂肪族基及所述脂環族基具有氧原子或硫原子,n表示1以上的整數。] As a compound (A), the compound represented by the following general formula (2) is mentioned. [hua 2]
Figure 02_image006
[In the general formula (2), R 1 has the same meaning as the general formula (1), and R 2 represents a substituted aliphatic group, a substituted alicyclic group, a substituted aromatic group group or a substituted heterocyclic group, the aliphatic group and the alicyclic group have an oxygen atom or a sulfur atom, and n represents an integer of 1 or more. ]

就降低密封材的黏度的觀點而言,R 2較佳為碳數1~20,更佳為碳數1~12,進而佳為碳數1~10。 From the viewpoint of reducing the viscosity of the sealing material, R 2 preferably has 1 to 20 carbon atoms, more preferably 1 to 12 carbon atoms, and still more preferably 1 to 10 carbon atoms.

就調整密封材的聚合速度的觀點、增大密封材的硬化物的折射率的觀點而言,於通式(2)中,n較佳為2以上。另外,n的上限並無限制,例如可設為12以下、6以下或3以下。From the viewpoint of adjusting the polymerization rate of the sealing material and increasing the refractive index of the cured product of the sealing material, in the general formula (2), n is preferably 2 or more. In addition, the upper limit of n is not limited, and can be, for example, 12 or less, 6 or less, or 3 or less.

就增大密封材的硬化物的折射率的觀點、或改善密封材的硬化物的耐電漿性的觀點而言,於通式(2)中,R 2較佳為可經取代的脂肪族基且具有硫原子的基。 From the viewpoint of increasing the refractive index of the cured product of the sealing material or improving the plasma resistance of the cured product of the sealing material, in the general formula (2), R 2 is preferably a substituted aliphatic group and a group with a sulfur atom.

本實施方式的有機EL顯示元件用密封材可僅含有一種化合物(A),亦可含有多種化合物(A)。 就增大密封材的硬化物的折射率的觀點、或改善密封材的硬化物的耐電漿性的觀點而言,本實施方式的有機EL顯示元件用密封材較佳為含有通式(2)中的n的值不同的多種化合物(A)。 The sealing material for organic EL display elements of this embodiment may contain only one type of compound (A), or may contain multiple types of compound (A). From the viewpoint of increasing the refractive index of the cured product of the sealing material or improving the plasma resistance of the cured product of the sealing material, the sealing material for organic EL display elements of the present embodiment preferably contains the general formula (2) A variety of compounds (A) differing in the value of n.

通式(2)的化合物例如是由通式(3)所表示的硫醇化合物與(甲基)丙烯酸鹵化物藉由脫鹵化(dehalogenation)脫氫化(dehydrogenation)來製造。 [化3]

Figure 02_image008
[所述通式(3)中,R 2及n分別與通式(2)的R 2及n的定義為相同含義。] The compound of the general formula (2) is produced by, for example, a thiol compound represented by the general formula (3) and a (meth)acrylic acid halide by dehalogenation and dehydrogenation. [hua 3]
Figure 02_image008
[In the general formula (3), R 2 and n have the same meanings as the definitions of R 2 and n in the general formula (2), respectively. ]

通式(3)所表示的硫醇(thiol)化合物除可具有巰基(mercapto group)以外,例如亦可具有羥基。In addition to a mercapto group, the thiol compound represented by the general formula (3) may have, for example, a hydroxyl group.

下述列舉通式(3)所表示的硫醇化合物的具體例。再者,作為通式(2)中的R 2的具體例,可列舉源自下述化合物的基。 Specific examples of the thiol compound represented by the general formula (3) are listed below. In addition, as a specific example of R< 2 > in general formula (2), the group derived from the following compound is mentioned.

通式(3)所表示的硫醇化合物中,作為具有一個硫醇基的單硫醇化合物,具體而言,可列舉:甲基硫醇、乙基硫醇、丙基硫醇、丁基硫醇、戊基硫醇、己基硫醇、庚基硫醇、辛基硫醇、壬基硫醇、癸基硫醇、十一烷基硫醇、十二烷基硫醇、十三烷基硫醇、十四烷基硫醇、十六烷基硫醇、十八烷基硫醇、烯丙基硫醇、2-丁烯-1-硫醇、1-丁烯-4-硫醇、甲基烯丙基硫醇、1-戊烯基硫醇、2-異戊烯基硫醇、油烯基硫醇、環戊基硫醇、環己基硫醇、環戊基甲基硫醇、環庚基硫醇、3-甲基環戊基甲基硫醇、2-甲基環己基硫醇、3-甲基環己基硫醇、4-甲基環己基硫醇、3-甲基環己基甲基硫醇、1-環戊基硫醇、2-環己烯基硫醇、β-環己基乙基硫醇、2,2,6,6-四甲基環己基硫醇、ε-環己基戊基硫醇、膽固醇基硫醇、糠基硫醇、甲基糠基硫醇、2-巰基噻吩、3-巰基噻吩、2-乙基-3-巰基噻吩、苯硫酚、硫代甲酚、乙基苯硫酚、2,4-硫代二甲酚、2,5-硫代二甲酚、丙基苯硫酚、烯丙基苯硫酚、2-烯丙基-4-甲基苯硫酚、苯基苯硫酚、氯苯硫酚、溴苯硫酚、碘苯硫酚、硝基苯硫酚、三硝基苯硫酚、二硝基苯硫酚、硝基溴苯硫酚、硝基氯苯硫酚、甲基磺醯基苯硫酚、苯硫醇、苄基硫醇、硝基苄基硫醇、α-苯基乙基硫醇、β-苯基乙基硫醇、α-苯基丙基硫醇、γ-苯基丙基硫醇、β-苯基丙基硫醇、β-苯基-異丙基硫醇、D-β-苯基丁基硫醇、ε-苯基戊基硫醇、α,β-二苯基乙基硫醇、甲基苄基硫醇、2-硝基-對甲苯基硫醇、α-(鄰甲苯基)苄基硫醇、α-(對甲苯基)苄基硫醇、氯苄基硫醇、二氯苄基硫醇、溴苄基硫醇、α-苯基-對氯苄基硫醇、3-羥基-5-甲基苄基硫醇、肉桂基硫醇、β-γ-二苯基烯丙基硫醇、4,4'-二氯二苯甲基硫醇、三苯基甲基硫醇、α-萘硫酚、β-萘硫酚、4-氯-α-萘硫酚、4-溴-α-萘硫酚、1-硝基-β-萘硫酚、4-硝基-α-萘硫酚等。Among the thiol compounds represented by the general formula (3), specific examples of the monothiol compound having one thiol group include methyl mercaptan, ethyl mercaptan, propyl mercaptan, and butyl thiol. Alcohol, pentyl mercaptan, hexyl mercaptan, heptyl mercaptan, octyl mercaptan, nonyl mercaptan, decyl mercaptan, undecyl mercaptan, dodecyl mercaptan, tridecyl thiol Alcohol, tetradecyl mercaptan, hexadecyl mercaptan, octadecyl mercaptan, allyl mercaptan, 2-butene-1-thiol, 1-butene-4-thiol, methyl allyl mercaptan, 1-pentenyl mercaptan, 2-isopentenyl mercaptan, oleyl mercaptan, cyclopentyl mercaptan, cyclohexyl mercaptan, cyclopentyl methyl mercaptan, cyclopentyl mercaptan Heptylthiol, 3-methylcyclopentylmethylthiol, 2-methylcyclohexylthiol, 3-methylcyclohexylthiol, 4-methylcyclohexylthiol, 3-methylcyclohexylthiol Methylthiol, 1-cyclopentylthiol, 2-cyclohexenylthiol, β-cyclohexylethylthiol, 2,2,6,6-tetramethylcyclohexylthiol, ε-ring Hexylpentyl mercaptan, cholesteryl mercaptan, furfuryl mercaptan, methyl furfuryl mercaptan, 2-mercaptothiophene, 3-mercaptothiophene, 2-ethyl-3-mercaptothiophene, thiophenol, methyl thiophene Phenol, ethylthiophenol, 2,4-thioxylenol, 2,5-thioxylenol, propylthiophenol, allylthiophenol, 2-allyl-4-methyl thiophenol, phenylthiophenol, chlorothiophenol, bromothiophenol, iodothiophenol, nitrothiophenol, trinitrothiophenol, dinitrothiophenol, nitrobromobenzene Thiophenol, Nitrochlorothiophenol, Methylsulfonylthiophenol, Benzenethiol, Benzylthiol, Nitrobenzylthiol, α-Phenylethylthiol, β-Phenylethyl Thiol, α-Phenylpropylthiol, γ-Phenylpropylthiol, β-Phenylpropylthiol, β-Phenyl-Isopropylthiol, D-β-Phenylbutylthiol Alcohol, ε-phenylpentylthiol, α,β-diphenylethylthiol, methylbenzylthiol, 2-nitro-p-tolylthiol, α-(o-tolyl)benzyl Thiol, α-(p-Tolyl)benzylthiol, Chlorobenzylthiol, Dichlorobenzylthiol, Bromobenzylthiol, α-Phenyl-p-Chlorobenzylthiol, 3-Hydroxy- 5-methylbenzyl mercaptan, cinnamyl mercaptan, β-γ-diphenylallyl mercaptan, 4,4'-dichlorobenzyl mercaptan, triphenylmethyl mercaptan, α - Thionaphthalene, β-thionaphthalene, 4-chloro-α-thionaphthalene, 4-bromo-α-thionaphthalene, 1-nitro-β-thionaphthalene, 4-nitro-α-naphthalene Thiophenol, etc.

通式(3)所表示的硫醇化合物中,作為具有兩個以上的硫醇基的聚硫醇化合物,具體而言,可列舉: 甲烷二硫醇、1,2-乙烷二硫醇、1,1-丙烷二硫醇、1,2-丙烷二硫醇、1,3-丙烷二硫醇、2,2-丙烷二硫醇、1,6-己烷二硫醇、1,2,3-丙烷三硫醇、1,1-環己烷二硫醇、1,2-環己烷二硫醇、2,2-二甲基丙烷-1,3-二硫醇、3,4-二甲氧基丁烷-1,2-二硫醇、2-甲基環己烷-2,3-二硫醇、雙環[2,2,1]庚-外-順式-2,3-二硫醇、1,1-雙(巰基甲基)環己烷、硫代蘋果酸雙(2-巰基乙基酯)、2,3-二巰基琥珀酸(2-巰基乙基酯)、2,3-二巰基-1-丙醇(2-巰基乙酸酯)、2,3-二巰基-1-丙醇(3-巰基乙酸酯)、二乙二醇雙(2-巰基乙酸酯)、二乙二醇雙(3-巰基丙酸酯)、1,2-二巰基丙基甲基醚、2,3-二巰基丙基甲基醚、2,2-雙(巰基甲基)-1,3-丙烷二硫醇、雙(2-巰基乙基)醚、乙二醇雙(2-巰基乙酸酯)、乙二醇雙(3-巰基丙酸酯)、三羥甲基丙烷雙(2-巰基乙酸酯)、三羥甲基丙烷雙(3-巰基丙酸酯)、季戊四醇四(2-巰基乙酸酯)、季戊四醇四(3-巰基丙酸酯)等脂肪族聚硫醇、以及該些的氯取代體及溴取代體等鹵素取代脂肪族聚硫醇; 1,2-二巰基苯、1,3-二巰基苯、1,4-二巰基苯、1,2-雙(巰基甲基)苯、1,3-雙(巰基甲基)苯、1,4-雙(巰基甲基)苯、1,2-雙(巰基乙基)苯、1,3-雙(巰基乙基)苯、1,4-雙(巰基乙基)苯、1,2-雙(巰基亞甲基氧基)苯、1,3-雙(巰基亞甲基氧基)苯、1,4-雙(巰基亞甲基氧基)苯、1,2-雙(巰基伸乙基氧基)苯、1,3-雙(巰基伸乙基氧基)苯、1,4-雙(巰基伸乙基氧基)苯、1,2,3-三巰基苯、1,2,4-三巰基苯、1,3,5-三巰基苯、1,2,3-三(巰基甲基)苯、1,2,4-三(巰基甲基)苯、1,3,5-三(巰基甲基)苯、1,2,3-三(巰基乙基)苯、1,2,4-三(巰基乙基)苯、1,3,5-三(巰基乙基)苯、1,2,3-三(巰基亞甲基氧基)苯、1,2,4-三(巰基亞甲基氧基)苯、1,3,5-三(巰基亞甲基氧基)苯、1,2,3-三(巰基伸乙基氧基)苯、1,2,4-三(巰基伸乙基氧基)苯、1,3,5-三(巰基伸乙基氧基)苯、1,2,3,4-四巰基苯、1,2,3,5-四巰基苯、1,2,4,5-四巰基苯、1,2,3,4-四(巰基甲基)苯、1,2,3,5-四(巰基甲基)苯、1,2,4,5-四(巰基甲基)苯、1,2,3,4-四(巰基乙基)苯、1,2,3,5-四(巰基乙基)苯、1,2,4,5-四(巰基乙基)苯、1,2,3,4-四(巰基亞甲基氧基)苯、1,2,3,5-四(巰基亞甲基氧基)苯、1,2,4,5-四(巰基亞甲基氧基)苯、1,2,3,4-四(巰基伸乙基氧基)苯、1,2,3,5-四(巰基伸乙基氧基)苯、1,2,4,5-四(巰基伸乙基氧基)苯、2,2'-二巰基聯苯、4,4'-硫雙-苯硫醇、4,4'-二巰基聯苯、4,4'-二巰基聯苄、2,5-甲苯二硫醇、3,4-甲苯二硫醇、1,4-萘二硫醇、1,5-萘二硫醇、2,6-萘二硫醇、2,7-萘二硫醇、2,4-二甲基苯-1,3-二硫醇、4,5-二甲基苯-1,3-二硫醇、9,10-蒽二甲烷硫醇、1,3-二(對甲氧基苯基)丙烷-2,2-二硫醇、1,3-二苯基丙烷-2,2-二硫醇、苯基甲烷-1,1-二硫醇、2,4-二(對巰基苯基)戊烷、雙(4-巰基苯基)硫醚等芳香族聚硫醇; 2,5-二氯苯-1,3-二硫醇、1,3-二(對氯苯基)丙烷-2,2-二硫醇、3,4,5-三溴-1,2-二巰基苯、2,3,4,6-四氯-1,5-雙(巰基甲基)苯等芳香族聚硫醇的氯取代體及芳香族聚硫醇的溴取代體等鹵素取代芳香族聚硫醇; 2-甲基胺基-4,6-二硫醇-均三嗪、2-乙基胺基-4,6-二硫醇-均三嗪、2-胺基-4,6-二硫醇-均三嗪、2-嗎啉基-4,6-二硫醇-均三嗪、2-環己基胺基-4,6-二硫醇-均三嗪、2-甲氧基-4,6-二硫醇-均三嗪、2-苯氧基-4,6-二硫醇-均三嗪、2-硫代苯氧基-4,6-二硫醇-均三嗪、2-硫代丁基氧基-4,6-二硫醇-均三嗪、3,4-噻吩二硫醇、試鉍硫醇(bismuthiol)等含有雜環的聚硫醇; 1,2-雙(巰基甲硫基)苯、1,3-雙(巰基甲硫基)苯、1,4-雙(巰基甲硫基)苯、1,2-雙(巰基乙硫基)苯、1,3-雙(巰基乙硫基)苯、1,4-雙(巰基乙硫基)苯、1,2,3-三(巰基甲硫基)苯、1,2,4-三(巰基甲硫基)苯、1,3,5-三(巰基甲硫基)苯、1,2,3-三(巰基乙硫基)苯、1,2,4-三(巰基乙硫基)苯、1,3,5-三(巰基乙硫基)苯、1,2,3,4-四(巰基甲硫基)苯、1,2,3,5-四(巰基甲硫基)苯、1,2,4,5-四(巰基甲硫基)苯、1,2,3,4-四(巰基乙硫基)苯、1,2,3,5-四(巰基乙硫基)苯、1,2,4,5-四(巰基乙硫基)苯等源自芳香族化合物的核烷基化物的聚硫醇; 雙(巰基甲基)硫醚、雙(巰基乙基)硫醚、雙(巰基丙基)硫醚、雙(巰基甲硫基)甲烷、雙(2-巰基乙硫基)甲烷、雙(3-巰基丙硫基)甲烷、1,2-雙(巰基甲硫基)乙烷、1,2-雙(2-巰基乙硫基)乙烷、1,2-雙(3-巰基丙基)乙烷、1,3-雙(巰基甲硫基)丙烷、1,3-雙(2-巰基乙硫基)丙烷、1,3-雙(3-巰基丙硫基)丙烷、1,2,3-三(巰基甲硫基)丙烷、1,2,3-三(2-巰基乙硫基)丙烷、1,2,3-三(3-巰基丙硫基)丙烷、四(巰基甲硫基甲基)甲烷、四(2-巰基乙硫基甲基)甲烷、四(3-巰基丙硫基甲基)甲烷、雙(2,3-二巰基丙基)硫醚、2,5-二巰基-1,4-二噻烷、雙(巰基甲基)二硫醚、雙(巰基乙基)二硫醚、雙(巰基丙基)二硫醚等脂肪族聚硫醇、以及該些的巰基乙酸酯及巰基丙酸酯; 羥基甲基硫醚雙(2-巰基乙酸酯)、羥基甲基硫醚雙(3-巰基丙酸酯)、羥基乙基硫醚雙(2-巰基乙酸酯)、羥基乙基硫醚雙(3-巰基丙酸酯)、羥基丙基硫醚雙(2-巰基乙酸酯)、羥基丙基硫醚雙(3-巰基丙酸酯)、羥基甲基二硫醚雙(2-巰基乙酸酯)、羥基甲基二硫醚雙(3-巰基丙酸酯)、羥基乙基二硫醚雙(2-巰基乙酸酯)、羥基乙基二硫醚雙(3-巰基丙酸酯)、羥基丙基二硫醚雙(2-巰基乙酸酯)、羥基丙基二硫醚雙(3-巰基丙酸酯)、2-巰基乙基醚雙(2-巰基乙酸酯)、2-巰基乙基醚雙(3-巰基丙酸酯)、1,4-二噻烷-2,5-二醇雙(2-巰基乙酸酯)、1,4-二噻烷-2,5-二醇雙(3-巰基丙酸酯)、硫代二甘醇酸雙(2-巰基乙基酯)、硫代二丙酸雙(2-巰基乙基酯)、4,4-硫代二丁基酸雙(2-巰基乙基酯)、二巰基乙酸雙(2-巰基乙基酯)、二硫代二丙酸雙(2-巰基乙基酯)、4,4-二硫代二丁基酸雙(2-巰基乙基酯)、硫代二甘醇酸雙(2,3-二巰基丙基酯)、硫代二丙酸雙(2,3-二巰基丙基酯)、二巰基乙酸雙(2,3-二巰基丙基酯)、二硫代二丙酸雙(2,3-二巰基丙基酯)等脂肪族聚硫醇的酯; 2-巰基乙醇、3-巰基-1,2-丙二醇、甘油二(巰基乙酸酯)、1-羥基-4-巰基環己烷、2,4-二巰基苯酚、2-巰基對苯二酚、4-巰基苯酚、3,4-二巰基-2-丙醇、1,3-二巰基-2-丙醇、2,3-二巰基-1-丙醇、1,2-二巰基-1,3-丁二醇、季戊四醇三(3-巰基丙酸酯)、季戊四醇單(3-巰基丙酸酯)、季戊四醇雙(3-巰基丙酸酯)、季戊四醇三(巰基乙酸酯)、季戊四醇五(3-巰基丙酸酯)、羥基甲基-三(巰基乙硫基甲基)甲烷、1-羥基乙硫基-3-巰基乙硫基苯、4-羥基-4'-巰基二苯基碸、2-(2-巰基乙硫基)乙醇、二羥基乙基硫醚單(3-巰基丙酸酯)、二巰基乙烷單(水楊酸酯(salicylate))、羥基乙硫基甲基-三(巰基乙硫基甲基)甲烷、2,2'-((3-巰基丙烷-1,2-二基)雙(硫烷二基))雙(乙烷-1-硫醇)、3,3'-硫代雙(2-((2-巰基乙基)硫代)丙烷-1-硫醇)等聚硫醇。 進而可列舉該些的氯取代體、溴取代體等鹵素取代體。 Among the thiol compounds represented by the general formula (3), specific examples of the polythiol compound having two or more thiol groups include: Methanedithiol, 1,2-ethanedithiol, 1,1-propanedithiol, 1,2-propanedithiol, 1,3-propanedithiol, 2,2-propanedithiol , 1,6-hexanedithiol, 1,2,3-propanetrithiol, 1,1-cyclohexanedithiol, 1,2-cyclohexanedithiol, 2,2-dimethylthiol propane-1,3-dithiol, 3,4-dimethoxybutane-1,2-dithiol, 2-methylcyclohexane-2,3-dithiol, bicyclo[2, 2,1]Hept-exo-cis-2,3-dithiol, 1,1-bis(mercaptomethyl)cyclohexane, bis(2-mercaptoethyl thiomalate), 2,3 - Dimercaptosuccinic acid (2-mercaptoethyl ester), 2,3-dimercapto-1-propanol (2-mercaptoacetate), 2,3-dimercapto-1-propanol (3-mercaptoethyl ester) ester), diethylene glycol bis(2-mercaptoacetate), diethylene glycol bis(3-mercaptopropionate), 1,2-dimercaptopropyl methyl ether, 2,3-dimercapto Propyl methyl ether, 2,2-bis(mercaptomethyl)-1,3-propanedithiol, bis(2-mercaptoethyl) ether, ethylene glycol bis(2-mercaptoacetate), ethyl acetate Glycol bis(3-mercaptopropionate), Trimethylolpropane bis(2-mercaptoglycolate), Trimethylolpropane bis(3-mercaptopropionate), Pentaerythritol tetrakis(2-mercaptoglycolic acid) ester), aliphatic polythiols such as pentaerythritol tetrakis (3-mercaptopropionate), and halogen-substituted aliphatic polythiols such as chlorine and bromine substituents of these; 1,2-dimercaptobenzene, 1,3-dimercaptobenzene, 1,4-dimercaptobenzene, 1,2-bis(mercaptomethyl)benzene, 1,3-bis(mercaptomethyl)benzene, 1, 4-Bis(mercaptomethyl)benzene, 1,2-bis(mercaptoethyl)benzene, 1,3-bis(mercaptoethyl)benzene, 1,4-bis(mercaptoethyl)benzene, 1,2- Bis(mercaptomethyleneoxy)benzene, 1,3-bis(mercaptomethyleneoxy)benzene, 1,4-bis(mercaptomethyleneoxy)benzene, 1,2-bis(mercaptoethylidene) oxy)benzene, 1,3-bis(mercaptoethylideneoxy)benzene, 1,4-bis(mercaptoethylideneoxy)benzene, 1,2,3-trimercaptobenzene, 1,2, 4-Trimercaptobenzene, 1,3,5-Trimercaptobenzene, 1,2,3-Tris(mercaptomethyl)benzene, 1,2,4-Tris(mercaptomethyl)benzene, 1,3,5- Tris(mercaptomethyl)benzene, 1,2,3-tris(mercaptoethyl)benzene, 1,2,4-tris(mercaptoethyl)benzene, 1,3,5-tris(mercaptoethyl)benzene, 1,2,3-Tris(mercaptomethyleneoxy)benzene, 1,2,4-Tris(mercaptomethyleneoxy)benzene, 1,3,5-Tris(mercaptomethyleneoxy)benzene , 1,2,3-tris(mercaptoethylideneoxy)benzene, 1,2,4-tris(mercaptoethylideneoxy)benzene, 1,3,5-tris(mercaptoethylideneoxy) Benzene, 1,2,3,4-tetramercaptobenzene, 1,2,3,5-tetramercaptobenzene, 1,2,4,5-tetramercaptobenzene, 1,2,3,4-tetrakis(mercaptomethyl) yl)benzene, 1,2,3,5-tetrakis(mercaptomethyl)benzene, 1,2,4,5-tetrakis(mercaptomethyl)benzene, 1,2,3,4-tetrakis(mercaptoethyl) Benzene, 1,2,3,5-tetrakis(mercaptoethyl)benzene, 1,2,4,5-tetrakis(mercaptoethyl)benzene, 1,2,3,4-tetrakis(mercaptomethyleneoxy) ) benzene, 1,2,3,5-tetrakis(mercaptomethyleneoxy)benzene, 1,2,4,5-tetrakis(mercaptomethyleneoxy)benzene, 1,2,3,4-tetrakis (mercaptoethylideneoxy)benzene, 1,2,3,5-tetrakis(mercaptoethylideneoxy)benzene, 1,2,4,5-tetrakis(mercaptoethylideneoxy)benzene, 2, 2'-dimercaptobiphenyl, 4,4'-thiobis-benzenethiol, 4,4'-dimercaptobiphenyl, 4,4'-dimercaptobiphenyl, 2,5-toluenedithiol, 3 ,4-toluenedithiol, 1,4-naphthalenedithiol, 1,5-naphthalenedithiol, 2,6-naphthalenedithiol, 2,7-naphthalenedithiol, 2,4-dimethyl Benzene-1,3-dithiol, 4,5-dimethylbenzene-1,3-dithiol, 9,10-anthracenedimethanethiol, 1,3-bis(p-methoxyphenyl) ) propane-2,2-dithiol, 1,3-diphenylpropane-2,2-dithiol, phenylmethane-1,1-dithiol, 2,4-bis(p-mercaptophenyl ) Aromatic polythiols such as pentane and bis(4-mercaptophenyl) sulfide; 2,5-Dichlorobenzene-1,3-dithiol, 1,3-bis(p-chlorophenyl)propane-2,2-dithiol, 3,4,5-tribromo-1,2- Chlorine-substituted aromatic polythiols such as dimercaptobenzene and 2,3,4,6-tetrachloro-1,5-bis(mercaptomethyl)benzene, and halogen-substituted aromatic compounds such as bromine-substituted aromatic polythiols family of polythiols; 2-Methylamino-4,6-dithiol-s-triazine, 2-ethylamino-4,6-dithiol-s-triazine, 2-amino-4,6-dithiol - s-triazine, 2-morpholinyl-4,6-dithiol-s-triazine, 2-cyclohexylamino-4,6-dithiol-s-triazine, 2-methoxy-4, 6-Dithiol-s-triazine, 2-phenoxy-4,6-dithiol-s-triazine, 2-thiophenoxy-4,6-dithiol-s-triazine, 2- Thiobutyloxy-4,6-dithiol-s-triazine, 3,4-thiophene dithiol, bismuthiol and other heterocyclic polythiols; 1,2-bis(mercaptomethylthio)benzene, 1,3-bis(mercaptomethylthio)benzene, 1,4-bis(mercaptomethylthio)benzene, 1,2-bis(mercaptoethylthio) Benzene, 1,3-bis(mercaptoethylthio)benzene, 1,4-bis(mercaptoethylthio)benzene, 1,2,3-tris(mercaptomethylthio)benzene, 1,2,4-tris (Mercaptomethylthio)benzene, 1,3,5-tris(mercaptomethylthio)benzene, 1,2,3-tris(mercaptoethylthio)benzene, 1,2,4-tris(mercaptoethylthio) ) benzene, 1,3,5-tris(mercaptoethylthio)benzene, 1,2,3,4-tetrakis(mercaptomethylthio)benzene, 1,2,3,5-tetrakis(mercaptomethylthio) Benzene, 1,2,4,5-tetrakis(mercaptomethylthio)benzene, 1,2,3,4-tetrakis(mercaptoethylthio)benzene, 1,2,3,5-tetrakis(mercaptoethylthio) ) polythiols derived from nuclear alkylates of aromatic compounds, such as benzene, 1,2,4,5-tetrakis(mercaptoethylthio)benzene; bis(mercaptomethyl)sulfide, bis(mercaptoethyl)sulfide, bis(mercaptopropyl)sulfide, bis(mercaptomethylthio)methane, bis(2-mercaptoethylthio)methane, bis(3 -Mercaptopropylthio)methane, 1,2-bis(mercaptomethylthio)ethane, 1,2-bis(2-mercaptoethylthio)ethane, 1,2-bis(3-mercaptopropyl) Ethane, 1,3-bis(mercaptomethylthio)propane, 1,3-bis(2-mercaptoethylthio)propane, 1,3-bis(3-mercaptopropylthio)propane, 1,2, 3-Tris(Mercaptomethylthio)propane, 1,2,3-Tris(2-Mercaptoethylthio)propane, 1,2,3-Tris(3-Mercaptopropylthio)propane, Tetrakis(Mercaptomethylthio) methyl)methane, tetrakis(2-mercaptoethylthiomethyl)methane, tetrakis(3-mercaptopropylthiomethyl)methane, bis(2,3-dimercaptopropyl)sulfide, 2,5- Aliphatic polythiols such as dimercapto-1,4-dithiane, bis(mercaptomethyl)disulfide, bis(mercaptoethyl)disulfide, bis(mercaptopropyl)disulfide, and these thioglycolate and mercaptopropionate; Hydroxymethyl sulfide bis(2-mercaptoacetate), hydroxymethyl sulfide bis(3-mercaptopropionate), hydroxyethyl sulfide bis(2-mercaptoacetate), hydroxyethyl sulfide Bis(3-mercaptopropionate), hydroxypropyl sulfide bis(2-mercaptoacetate), hydroxypropyl sulfide bis(3-mercaptopropionate), hydroxymethyl disulfide bis(2-mercaptopropionate) mercaptoacetate), hydroxymethyl disulfide bis(3-mercaptopropionate), hydroxyethyl disulfide bis(2-mercaptoacetate), hydroxyethyl disulfide bis(3-mercaptopropionate) ester), hydroxypropyl disulfide bis(2-mercaptoacetate), hydroxypropyl disulfide bis(3-mercaptopropionate), 2-mercaptoethyl ether bis(2-mercaptoacetate) ), 2-mercaptoethyl ether bis(3-mercaptopropionate), 1,4-dithiane-2,5-diol bis(2-mercaptoacetate), 1,4-dithiane- 2,5-diol bis(3-mercaptopropionate), thiodiglycolate bis(2-mercaptoethyl), thiodipropionate bis(2-mercaptoethyl), 4,4 - bis(2-mercaptoethyl) thiodibutylate, bis(2-mercaptoethyl) dimercaptoacetate, bis(2-mercaptoethyl) dithiodipropionate, 4,4- Bis(2-mercaptoethyl dithiodibutylate), bis(2,3-dimercaptopropyl thiodiglycolate), bis(2,3-dimercaptopropyl thiodipropionate) esters of aliphatic polythiols such as bis(2,3-dimercaptopropyl ester), dimercaptoacetic acid bis(2,3-dimercaptopropyl ester), and dithiodipropionic acid bis(2,3-dimercaptopropyl ester); 2-mercaptoethanol, 3-mercapto-1,2-propanediol, glycerol bis(mercaptoacetate), 1-hydroxy-4-mercaptocyclohexane, 2,4-dimercaptophenol, 2-mercaptohydroquinone , 4-mercaptophenol, 3,4-dimercapto-2-propanol, 1,3-dimercapto-2-propanol, 2,3-dimercapto-1-propanol, 1,2-dimercapto-1 ,3-Butanediol, Pentaerythritol tris(3-mercaptopropionate), Pentaerythritol mono(3-mercaptopropionate), Pentaerythritol bis(3-mercaptopropionate), Pentaerythritol tris(mercaptoacetate), Pentaerythritol Penta(3-mercaptopropionate), hydroxymethyl-tris(mercaptoethylthiomethyl)methane, 1-hydroxyethylthio-3-mercaptoethylthiobenzene, 4-hydroxy-4'-mercaptodiphenyl Ethyl, 2-(2-mercaptoethylthio)ethanol, dihydroxyethyl sulfide mono(3-mercaptopropionate), dimercaptoethane mono(salicylate), hydroxyethylthio Methyl-tris(mercaptoethylthiomethyl)methane, 2,2'-((3-mercaptopropane-1,2-diyl)bis(sulfanediyl))bis(ethane-1-thiol ), 3,3'-thiobis(2-((2-mercaptoethyl)thio)propane-1-thiol) and other polythiols. Further, halogen-substituted products such as these chlorine-substituted products and bromine-substituted products can be mentioned.

(化合物(B)) 本實施方式的有機EL顯示元件用密封材可更包含化合物(B)。化合物(B)是含(甲基)丙烯酸基的化合物(其中所述化合物(A)除外)。 此處,本說明書中,所謂(甲基)丙烯醯基是指丙烯醯基與甲基丙烯醯基中的至少一種。另外,所謂(甲基)丙烯酸是指丙烯酸或甲基丙烯酸中的至少一種。另外,所謂(甲基)丙烯酸酯是指丙烯酸酯與甲基丙烯酸酯中的至少一種。 (Compound (B)) The sealing material for organic EL display elements of this embodiment may further contain a compound (B). The compound (B) is a (meth)acrylic group-containing compound (except for the compound (A)). Here, in this specification, a (meth)acryloyl group means at least one of an acryl group and a methacryloyl group. In addition, the term "(meth)acrylic acid" refers to at least one of acrylic acid and methacrylic acid. In addition, the term "(meth)acrylate" means at least one of acrylate and methacrylate.

作為具有(甲基)丙烯醯基的(甲基)丙烯酸化合物的具體例,可列舉:一官能的單(甲基)丙烯酸化合物、二官能的二(甲基)丙烯酸化合物、三官能以上的多官能(甲基)丙烯酸化合物。Specific examples of the (meth)acrylic compound having a (meth)acryloyl group include a monofunctional mono(meth)acrylic compound, a difunctional di(meth)acrylic compound, and a trifunctional or higher poly(meth)acrylic compound. Functional (meth)acrylic compounds.

作為單(甲基)丙烯酸化合物的具體例,可列舉:(甲基)丙烯酸異冰片酯、(甲基)丙烯酸二環戊烷酯、(甲基)丙烯酸3,3,5-三甲基環己酯、(甲基)丙烯酸4-第三丁基環己酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-甲氧基乙酯、甲氧基三乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸3-甲氧基丁酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸丁氧基乙酯、乙氧基二乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸甲氧基ジキシル乙酯、二甘醇(甲基)丙烯酸乙酯、環狀三羥甲基丙烷フォルマル單(甲基)丙烯酸酯、醯亞胺(甲基)丙烯酸酯、(甲基)丙烯酸異戊酯、乙氧基化琥珀酸(甲基)丙烯酸酯、(甲基)丙烯酸三氟乙酯、ω-羧基聚己內酯單(甲基)丙烯酸酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-(2-乙氧基乙氧基)乙酯、(甲基)丙烯酸硬脂酯、二乙二醇單丁醚(甲基)丙烯酸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸辛酯/癸酯、(甲基)丙烯酸十三烷酯、己內酯(甲基)丙烯酸酯、乙氧基化(4)壬基苯酚(甲基)丙烯酸酯、甲氧基聚乙二醇(350)單(甲基)丙烯酸酯、甲氧基聚乙二醇(550)單(甲基)丙烯酸酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸甲基苯氧基乙酯、己內酯改質(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸三溴苯酯、(甲基)丙烯酸乙氧基化三溴苯酯、(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸2-苯氧基乙酯的環氧乙烷加成物、(甲基)丙烯酸2-苯氧基乙酯的環氧丙烷加成物、苯氧基二乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯、3-甲基丙烯醯氧基甲基環己烯氧化物、及3-(甲基)丙烯醯氧基甲基環己烯氧化物等。 另外,作為單(甲基)丙烯酸化合物的具體的製品名及獲取方,可列舉乙氧基化鄰苯基苯酚丙烯酸酯(NK酯(NK Ester)A-LEN-10,新中村化學工業公司製造)、丙烯酸間苯氧基苄酯(萊特丙烯酸酯(Light Acrylate)POB-A,共榮社化學公司製造)等。 Specific examples of the mono(meth)acrylic acid compound include isobornyl (meth)acrylate, dicyclopentyl (meth)acrylate, and 3,3,5-trimethyl (meth)acrylate Hexyl ester, 4-tert-butylcyclohexyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-hydroxy (meth)acrylate Ethyl ester, 4-hydroxybutyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, isooctyl (meth)acrylate, 2-methyl (meth)acrylate Oxyethyl ester, methoxytriethylene glycol (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, (meth)acrylic acid Ethoxyethyl ester, (meth)acrylate butoxyethyl ester, ethoxydiethylene glycol (meth)acrylate, (meth)acrylate methoxybisyl ethyl ester, diethylene glycol (meth) Ethyl Acrylate, Cyclic Trimethylolpropane Felmer Mono(Meth)acrylate, Imide (Meth)acrylate, Isoamyl (Meth)acrylate, Ethoxylated Succinic Acid (Meth)Acrylic Acid ester, trifluoroethyl (meth)acrylate, ω-carboxypolycaprolactone mono(meth)acrylate, cyclohexyl (meth)acrylate, 2-(2-ethoxyethyl) (meth)acrylate Oxy)ethyl ester, stearyl (meth)acrylate, diethylene glycol monobutyl ether (meth)acrylate, lauryl (meth)acrylate, isodecyl (meth)acrylate, (meth)acrylate Isooctyl acrylate, octyl/decyl (meth)acrylate, tridecyl (meth)acrylate, caprolactone (meth)acrylate, ethoxylated (4) nonylphenol (meth) Acrylate, Methoxy polyethylene glycol (350) mono(meth)acrylate, Methoxy polyethylene glycol (550) mono(meth)acrylate, phenoxyethyl (meth)acrylate, Cyclohexyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl (meth)acrylate, methylphenoxyethyl (meth)acrylate, caprolactone-modified (meth)acrylic acid Tetrahydrofurfuryl, Tribromophenyl (meth)acrylate, Tribromophenyl (meth)acrylate ethoxylate, 2-phenoxyethyl (meth)acrylate, 2-benzene (meth)acrylate Ethylene oxide adduct of oxyethyl ester, propylene oxide adduct of 2-phenoxyethyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, (methyl) ) 2-hydroxy-3-phenoxypropyl acrylate, 3-methacryloyloxymethylcyclohexene oxide, and 3-(meth)acryloyloxymethylcyclohexene oxide, and the like. In addition, as a specific product name and acquirer of the mono(meth)acrylic acid compound, ethoxylated o-phenylphenol acrylate (NK Ester) A-LEN-10, manufactured by Shin-Nakamura Chemical Industry Co., Ltd. ), m-phenoxybenzyl acrylate (Light Acrylate POB-A, manufactured by Kyōeisha Chemical Co., Ltd.), etc.

作為二(甲基)丙烯酸化合物的具體例,可列舉二醇的二(甲基)丙烯酸酯、(聚)烷二醇的二(甲基)丙烯酸酯等。 另外,作為二(甲基)丙烯酸化合物的具體的製品名及獲取方,可列舉:1,6-己二醇二丙烯酸酯(NK酯(NK Ester)A-HD-N,新中村化學工業公司製造;萊特丙烯酸酯(Light Acrylate)1,6HX-A,共榮社化學公司製造)、1,9-壬二醇二丙烯酸酯(NK酯(NK Ester)A-NOD-N,新中村化學工業公司製造;萊特丙烯酸酯(Light Acrylate)1,9ND-A,共榮社化學公司製造)、1,10-癸二醇二丙烯酸酯(NK酯(NK Ester)A-DOD-N,新中村化學工業公司製造)、新戊二醇二丙烯酸酯(NK酯(NK Ester)A-NPG,新中村化學工業公司製造;萊特丙烯酸酯(Light Acrylate)NP-A,共榮社化學公司製造)、乙二醇二丙烯酸酯(SR206NS,阿科瑪(Arkema)公司製造)、聚乙二醇二丙烯酸酯(NK酯(NK Ester)A-400,新中村化學工業公司製造)、聚丙二醇二丙烯酸酯(NK酯(NK Ester)APG-400,新中村化學工業公司製造)、三環癸烷二甲醇二丙烯酸酯(別名:二羥甲基-三環癸烷二丙烯酸酯)(NK酯(NK Ester)A-DCP,新中村化學工業公司製造;萊特丙烯酸酯(Light Acrylate)DCP-A,共榮社化學公司製造)、1,3-丁二醇二甲基丙烯酸酯(NK酯(NK Ester)BG,新中村化學工業公司製造)、1,4-丁二醇二甲基丙烯酸酯(NK酯(NK Ester)BD,新中村化學工業公司製造)、1,6-己二醇二甲基丙烯酸酯(NK酯(NK Ester)HD-N,新中村化學工業公司製造)、1,9-壬二醇二甲基丙烯酸酯(NK酯(NK Ester)NOD-N,新中村化學工業公司製造)、1,10-癸二醇二甲基丙烯酸酯(NK酯(NK Ester)DOD-N,新中村化學工業公司製造)、1,12-十二烷二醇二丙烯酸酯(SR262,沙多瑪(Sartomer)公司製造)、新戊二醇二甲基丙烯酸酯(NK酯(NK Ester)NPG,新中村化學工業公司製造)等。 Specific examples of the di(meth)acrylic compound include di(meth)acrylates of diols, di(meth)acrylates of (poly)alkanediols, and the like. In addition, as a specific product name and acquirer of the di(meth)acrylic acid compound, 1,6-hexanediol diacrylate (NK Ester) A-HD-N, Shin-Nakamura Chemical Industry Co., Ltd. Manufacturing; Light Acrylate 1,6HX-A, manufactured by Kyōeisha Chemical Co., Ltd.), 1,9-nonanediol diacrylate (NK Ester A-NOD-N, Shin-Nakamura Chemical Industry Co., Ltd. Manufactured by the company; Light Acrylate 1,9ND-A, manufactured by Kyeisha Chemical Co., Ltd., 1,10-decanediol diacrylate (NK Ester) A-DOD-N, Shin-Nakamura Chemical Industrial Co., Ltd.), neopentyl glycol diacrylate (NK Ester A-NPG, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.; Light Acrylate NP-A, manufactured by Kyeisha Chemical Co., Ltd.), B Glycol diacrylate (SR206NS, manufactured by Arkema), polyethylene glycol diacrylate (NK Ester A-400, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), polypropylene glycol diacrylate ( NK Ester (NK Ester) APG-400, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), tricyclodecane dimethanol diacrylate (alias: dimethylol-tricyclodecane diacrylate) (NK Ester (NK Ester) A-DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.; Light Acrylate (DCP-A, manufactured by Kyōeisha Chemical Co., Ltd.), 1,3-butanediol dimethacrylate (NK Ester) BG , manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,4-butanediol dimethacrylate (NK Ester (NK Ester) BD, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,6-hexanediol dimethacrylate (NK Ester HD-N, manufactured by Shin-Nakamura Chemical Industries, Ltd.), 1,9-nonanediol dimethacrylate (NK Ester (NK Ester) NOD-N, manufactured by Shin-Nakamura Chemical Industries, Ltd.), 1,10-Decanediol dimethacrylate (NK Ester (NK Ester) DOD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,12-dodecanediol diacrylate (SR262, Sadolan ( Sartomer), neopentyl glycol dimethacrylate (NK Ester NPG, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), etc.

作為多官能(甲基)丙烯酸化合物的具體的製品名及獲取方,可列舉:三羥甲基丙烷三丙烯酸酯(NK酯(NK Ester)A-TMPT,新中村化學工業公司製造;萊特丙烯酸酯(Light Acrylate)TMP-A,共榮社化學公司製造)、乙氧基化三羥甲基丙烷三丙烯酸酯(NK酯(NK Ester)A-TMPT-EO,新中村化學工業公司製造)、乙氧基化甘油三丙烯酸酯(NK酯(NK Ester)A-GLY-6E,新中村化學工業公司製造)、丙氧基化甘油三丙烯酸酯(NK酯(NK Ester)A-GLY-3P,新中村化學工業公司製造)等三官能(甲基)丙烯酸化合物; 季戊四醇四丙烯酸酯(NK酯(NK Ester)A-TMMT,新中村化學工業公司製造)、乙氧基化季戊四醇四丙烯酸酯(NK酯(NK Ester)ATM-4E,新中村化學工業公司製造)、二-三羥甲基丙烷四丙烯酸酯(NK酯(NK Ester)AD-TMP-L,新中村化學工業公司製造)等四官能(甲基)丙烯酸化合物; 二季戊四醇五丙烯酸酯(M-402,東亞合成公司製造)等五官能(甲基)丙烯酸化合物; 二季戊四醇六丙烯酸酯(GM66G0H,國精化學公司製造)等六官能(甲基)丙烯酸化合物等。 Specific product names and acquirers of the polyfunctional (meth)acrylic compound include: Trimethylolpropane triacrylate (NK Ester) A-TMPT, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.; Wright Acrylate (Light Acrylate) TMP-A, manufactured by Kyeisha Chemical Co., Ltd.), ethoxylated trimethylolpropane triacrylate (NK Ester (NK Ester) A-TMPT-EO, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), ethyl acetate Oxylated glycerol triacrylate (NK Ester (NK Ester) A-GLY-6E, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), propoxylated glycerol triacrylate (NK Ester (NK Ester) A-GLY-3P, new Trifunctional (meth)acrylic compounds such as Nakamura Chemical Industry Co., Ltd.; Pentaerythritol tetraacrylate (NK Ester A-TMMT, manufactured by Shin-Nakamura Chemical Industries, Ltd.), ethoxylated pentaerythritol tetraacrylate (NK Ester (NK Ester) ATM-4E, manufactured by Shin-Nakamura Chemical Industries, Ltd.), Tetrafunctional (meth)acrylic compounds such as di-trimethylolpropane tetraacrylate (NK Ester AD-TMP-L, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.); Pentafunctional (meth)acrylic compounds such as dipentaerythritol pentaacrylate (M-402, manufactured by Toa Gosei Corporation); Hexafunctional (meth)acrylic compounds such as dipentaerythritol hexaacrylate (GM66G0H, manufactured by Guojing Chemical Co., Ltd.), and the like.

就增大密封材的硬化物的折射率的觀點而言,化合物(B)較佳為更具有可經取代的芳香族基的化合物。作為化合物(B)中的可經取代的芳香族基的具體例,可應用源自所述中作為通式(3)所表示的硫醇化合物而例示的化合物的基中可經取代的芳香族基。From the viewpoint of increasing the refractive index of the cured product of the sealing material, the compound (B) is preferably a compound having a more substituted aromatic group. As a specific example of the aromatic group which may be substituted in the compound (B), the aromatic group which may be substituted in the group derived from the compound exemplified as the thiol compound represented by the general formula (3) can be applied. base.

就增大密封材的硬化物的強度的觀點而言,相對於本實施方式的密封材的全部組成,化合物(A)與化合物(B)的合計量較佳為70質量%以上,更佳為90質量%以上,進而佳為95質量%以上,進而更佳為99質量%以上。From the viewpoint of increasing the strength of the cured product of the sealing material, the total amount of the compound (A) and the compound (B) is preferably 70% by mass or more with respect to the entire composition of the sealing material of the present embodiment, more preferably 90 mass % or more, more preferably 95 mass % or more, still more preferably 99 mass % or more.

相對於化合物(A)與化合物(B)的合計100質量份,化合物(A)較佳為50質量份以上且100質量份以下,進而佳為60質量份以上且100質量份以下。 另外,相對於化合物(A)與化合物(B)的合計100質量份,亦可將化合物(A)設為例如70質量份以上且100質量份以下、80質量份以上且100質量份以下。 The compound (A) is preferably 50 parts by mass or more and 100 parts by mass or less, more preferably 60 parts by mass or more and 100 parts by mass or less, based on 100 parts by mass of the compound (A) and the compound (B) in total. In addition, the compound (A) may be, for example, 70 parts by mass or more and 100 parts by mass or less and 80 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the total of the compound (A) and the compound (B).

相對於化合物(A)與化合物(B)的合計100質量份,化合物(B)較佳為0質量份以上且50質量份以下,進而佳為0質量份以上且40質量份以下。 另外,相對於化合物(A)與化合物(B)的合計100質量份,亦可將化合物(B)設為例如0質量份以上且30質量份以下、例如0質量份以上且20質量份以下。 The compound (B) is preferably 0 parts by mass or more and 50 parts by mass or less, more preferably 0 parts by mass or more and 40 parts by mass or less, with respect to 100 parts by mass of the compound (A) and the compound (B) in total. In addition, the compound (B) may be, for example, 0 parts by mass or more and 30 parts by mass or less, for example, 0 parts by mass or more and 20 parts by mass or less, based on 100 parts by mass of the compound (A) and the compound (B) in total.

(聚合起始劑) 本實施方式的密封材可更包含聚合起始劑。就於低溫下穩定地形成硬化物的觀點而言,聚合起始劑較佳為藉由紫外線或可見光線的照射而產生自由基或酸的化合物、即光聚合起始劑。 作為光聚合起始劑,可列舉:醯基氧化膦系起始劑、氧苯基乙酸酯系起始劑、苯甲醯基甲酸系起始劑及羥基苯基酮系起始劑等。 (polymerization initiator) The sealing material of this embodiment may further contain a polymerization initiator. From the viewpoint of stably forming a cured product at a low temperature, the polymerization initiator is preferably a compound that generates a radical or an acid by irradiation with ultraviolet rays or visible rays, that is, a photopolymerization initiator. As the photopolymerization initiator, an acylphosphine oxide-based initiator, an oxyphenylacetate-based initiator, a benzalic acid-based initiator, a hydroxyphenyl ketone-based initiator, and the like can be mentioned.

作為光聚合起始劑的具體例,可列舉:二苯甲酮、米其勒酮、4,4'-雙(二乙基胺基)二苯甲酮、氧雜蒽酮、硫雜蒽酮、異丙基氧雜蒽酮、2,4-二乙基硫雜蒽酮、2-乙基蒽醌、苯乙酮、2-羥基-2-甲基-4'-異丙基苯丙酮、異丙基安息香醚、異丁基安息香醚、2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、樟腦醌、苯並蒽酮、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸異戊酯、4,4'-二(第三丁基過氧基羰基)二苯甲酮、3,4,4'-三(第三丁基過氧基羰基)二苯甲酮、3,3',4,4'-四(第三丁基過氧基羰基)二苯甲酮、3,3',4,4'-四(第三己基過氧基羰基)二苯甲酮、3,3'-二(甲氧基羰基)-4,4'-二(第三丁基過氧基羰基)二苯甲酮、3,4'-二(甲氧基羰基)-4,3'-二(第三丁基過氧基羰基)二苯甲酮、4,4'-二(甲氧基羰基)-3,3'-二(第三丁基過氧基羰基)二苯甲酮、2-(4'-甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(3',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(2',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(2'-甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(4'-戊氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、4-[對-N,N-二(乙氧基羰基甲基)]-2,6-二(三氯甲基)-均三嗪、1,3-雙(三氯甲基)-5-(2'-氯苯基)-均三嗪、1,3-雙(三氯甲基)-5-(4'-甲氧基苯基)-均三嗪、2-(對二甲基胺基苯乙烯基)苯並噁唑、2-(對二甲基胺基苯乙烯基)苯並噻唑、2-巰基苯並噻唑、3,3'-羰基雙(7-二乙基胺基香豆素)、2-(鄰氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四(4-乙氧基羰基苯基)-1,2'-聯咪唑、2,2'-雙(2,4-二氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,4-二溴苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,4,6-三氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、3-(2-甲基-2-二甲基胺基丙醯基)咔唑、3,6-雙(2-甲基-2-嗎啉基丙醯基)-9-正十二烷基咔唑、雙(η5-2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1H-吡咯-1-基)-苯基)鈦、1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基-1-丙酮、1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙酮、2-羥基-1-{4-[4-(2-羥基-2-甲基-丙醯基)-苄基]苯基}-2-甲基-1-丙酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基-1-丙酮、2-(二甲基胺基)-1-(4-嗎啉基苯基)-2-苄基-1-丁酮、2-(二甲基胺基)-2-[(4-甲基苯基)甲基]-1-[4-(4-嗎啉基)苯基]-1-丁酮、氧基-苯基-乙酸2-[2-氧代-2-苯基-乙醯氧基-乙氧基]-乙基酯、氧基-苯基-乙酸2-[2-羥基-乙氧基]-乙基酯、苯甲醯基甲酸甲酯、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基膦酸酯、1-[4-(苯硫基)苯基]-1,2-辛二酮2-(O-苯甲醯基肟)、1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]-乙酮-1-(O-乙醯基肟)等。Specific examples of the photopolymerization initiator include benzophenone, Michler's ketone, 4,4'-bis(diethylamino)benzophenone, xanthone, and thioxanthone , Isopropylxanthone, 2,4-diethylthioxanthone, 2-ethylanthraquinone, acetophenone, 2-hydroxy-2-methyl-4'-isopropylpropiophenone, Isopropyl benzoin ether, isobutyl benzoin ether, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, camphorquinone, benzoanthrone, 4 - Ethyl dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 4,4'-bis(tert-butylperoxycarbonyl)benzophenone, 3,4,4 '-Tris(tert-butylperoxycarbonyl)benzophenone, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 3,3',4 ,4'-Tetrakis(3rd-hexylperoxycarbonyl)benzophenone, 3,3'-bis(methoxycarbonyl)-4,4'-bis(tert-butylperoxycarbonyl)diphenyl Methanone, 3,4'-bis(methoxycarbonyl)-4,3'-bis(tert-butylperoxycarbonyl)benzophenone, 4,4'-bis(methoxycarbonyl)- 3,3'-bis(tert-butylperoxycarbonyl)benzophenone, 2-(4'-methoxystyryl)-4,6-bis(trichloromethyl)-s-triazine , 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(2',4'-dimethoxystyrene base)-4,6-bis(trichloromethyl)-s-triazine, 2-(2'-methoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2 -(4'-Pentoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 4-[p-N,N-bis(ethoxycarbonylmethyl)]-2 ,6-bis(trichloromethyl)-s-triazine, 1,3-bis(trichloromethyl)-5-(2'-chlorophenyl)-s-triazine, 1,3-bis(trichlorophenyl) Methyl)-5-(4'-methoxyphenyl)-s-triazine, 2-(p-dimethylaminostyryl)benzoxazole, 2-(p-dimethylaminostyrene yl)benzothiazole, 2-mercaptobenzothiazole, 3,3'-carbonylbis(7-diethylaminocoumarin), 2-(o-chlorophenyl)-4,4',5,5 '-Tetraphenyl-1,2'-biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(4-ethoxycarbonylphenyl)- 1,2'-biimidazole, 2,2'-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2 '-Bis(2,4-dibromophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4,6-tri Chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 3-(2-methyl-2-dimethylaminopropionyl)carbazole, 3 ,6-bis(2-methyl-2-morpholinopropionyl)-9-n-dodecylcarbazole, bis(η5-2,4-cyclopentadien-1-yl)-bis( 2,6-Difluoro- 3-(1H-pyrrol-1-yl)-phenyl) titanium, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-[4-( 2-Hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propanone, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl )-benzyl]phenyl}-2-methyl-1-propanone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-1-propanone, 2-( Dimethylamino)-1-(4-morpholinylphenyl)-2-benzyl-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl) Methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, oxy-phenyl-acetic acid 2-[2-oxo-2-phenyl-acetoxy- Ethoxy]-ethyl ester, oxy-phenyl-acetic acid 2-[2-hydroxy-ethoxy]-ethyl ester, methyl benzallate, bis(2,4,6-trimethyl) benzyl) phenylphosphine oxide, 2,4,6-trimethylbenzyldiphenylphosphine oxide, 2,4,6-trimethylbenzyldiphenylphosphonate, 1-[4-(Phenylthio)phenyl]-1,2-octanedione 2-(O-benzyl oxime), 1-[9-ethyl-6-(2-methylbenzyl) Acetyl)-9H-carbazol-3-yl]-ethanone-1-(O-acetyloxime) and the like.

就提高密封材的硬化性的觀點而言,光聚合起始劑較佳為選自由1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基-1-丙酮、1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙酮、2-羥基-1-{4-[4-(2-羥基-2-甲基-丙醯基)-苄基]苯基}-2-甲基-1-丙酮、2,2-二甲氧基-2-苯基苯乙酮、氧基-苯基-乙酸2-[2-氧代-2-苯基-乙醯氧基-乙氧基]-乙基酯、氧基-苯基-乙酸2-[2-羥基-乙氧基]-乙基酯、苯甲醯基甲酸甲酯、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦(2,4,6-trimethyl benzoyl diphenyl phosphine oxide,TPO)、2,4,6-三甲基苯甲醯基二苯基膦酸酯所組成的群組中的一種或兩種以上的化合物。From the viewpoint of improving the curability of the sealing material, the photopolymerization initiator is preferably selected from 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxycyclohexyl phenyl ketone, -[4-(2-Hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propanone, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl yl-propionyl)-benzyl]phenyl}-2-methyl-1-propanone, 2,2-dimethoxy-2-phenylacetophenone, oxy-phenyl-acetic acid 2-[ 2-oxo-2-phenyl-acetoxy-ethoxy]-ethyl ester, oxy-phenyl-acetic acid 2-[2-hydroxy-ethoxy]-ethyl ester, benzyl methyl carboxylate, bis(2,4,6-trimethylbenzyl)phenylphosphine oxide, 2,4,6-trimethylbenzyldiphenylphosphine oxide (2,4,6 -trimethyl benzoyl diphenyl phosphine oxide (TPO), 2,4,6-trimethylbenzyl diphenyl phosphonate, one or more compounds in the group.

作為光聚合起始劑的具體的製品名及獲取方,可列舉:豔佳固(Irgacure)184、豔佳固(Irgacure)651、豔佳固(Irgacure)127、豔佳固(Irgacure)1173、豔佳固(Irgacure)500、豔佳固(Irgacure)2959、豔佳固(Irgacure)754、豔佳固(Irgacure)MBF、豔佳固(Irgacure)TPO(以上為巴斯夫(BASF)公司製造)、歐姆尼拉德(Omnirad)TPO H(IGM樹脂(IGM Resins)公司製造)等。Specific product names and acquirers of photopolymerization initiators include: Irgacure 184, Irgacure 651, Irgacure 127, Irgacure 1173, Irgacure 500, Irgacure 2959, Irgacure 754, Irgacure MBF, Irgacure TPO (the above are manufactured by BASF), Omnirad TPO H (manufactured by IGM Resins), etc.

就提高密封材的硬化性的觀點而言,相對於密封材的全部組成,聚合起始劑的含量較佳為0.1質量%以上,更佳為0.5質量%以上,進而佳為1質量%以上,進而更佳為2質量%以上。From the viewpoint of improving the hardenability of the sealing material, the content of the polymerization initiator is preferably 0.1 mass % or more, more preferably 0.5 mass % or more, and further preferably 1 mass % or more with respect to the entire composition of the sealing material, More preferably, it is 2 mass % or more.

另外,就抑制密封材的著色的觀點而言,相對於密封材的全部組成,聚合起始劑的含量較佳為10質量%以下,更佳為8質量%以下,進而佳為6質量%以下,進而更佳為5質量%以下。In addition, from the viewpoint of suppressing coloration of the sealing material, the content of the polymerization initiator is preferably 10 mass % or less, more preferably 8 mass % or less, and further preferably 6 mass % or less with respect to the entire composition of the sealing material. , and more preferably 5 mass % or less.

(其他成分) 本實施方式的密封材可包含選自由黏著賦予劑、填充劑、硬化促進劑、塑化劑、界面活性劑、熱穩定劑、抗氧化劑、阻燃劑、抗靜電劑、消泡劑、調平劑及紫外線吸收劑所組成的群組中的一種或兩種以上的成分作為所述以外的成分(其他成分)。 相對於密封材的全部組成,其他成分的含量較佳為5質量%以下,更佳為1質量%以下。 (other ingredients) The sealing material of the present embodiment may contain an agent selected from the group consisting of an adhesion imparting agent, a filler, a hardening accelerator, a plasticizer, a surfactant, a heat stabilizer, an antioxidant, a flame retardant, an antistatic agent, a defoaming agent, a leveling agent One or two or more components from the group consisting of a UV absorber and an ultraviolet absorber are used as components other than those described above (other components). The content of other components is preferably 5 mass % or less, more preferably 1 mass % or less, with respect to the entire composition of the sealing material.

就提高密封材的熱穩定性的觀點而言,密封材較佳為含有熱穩定劑。 作為熱穩定劑,可使用受阻酚化合物。 作為受阻酚化合物,可列舉:二丁基羥基甲苯(別名:2,6-雙(1,1-二甲基乙基)-4-甲基苯酚)(製品名BHT,和光純藥公司製造)、3,5-二-第三丁基-4-羥基甲苯、季戊四醇四[3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯](製品名易璐諾斯(IRGANOX)1010,巴斯夫(BASF)公司製造;製品名艾迪科斯塔波(Adekastab)AO-60,艾迪科(ADEKA)公司製造)、十八烷基-3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯(製品名易璐諾斯(IRGANOX)1076,巴斯夫(BASF)公司製造)等。 就進一步提高密封材的熱穩定性的觀點而言,密封材較佳為含有二丁基羥基甲苯及季戊四醇四[3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯]中的至少一種。 From the viewpoint of improving the thermal stability of the sealing material, the sealing material preferably contains a heat stabilizer. As the heat stabilizer, a hindered phenol compound can be used. Examples of the hindered phenol compound include dibutylhydroxytoluene (alias: 2,6-bis(1,1-dimethylethyl)-4-methylphenol) (product name BHT, manufactured by Wako Pure Chemical Industries, Ltd.) , 3,5-di-tert-butyl-4-hydroxytoluene, pentaerythritol tetrakis [3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] (product name Yilunuo IRGANOX 1010, manufactured by BASF (BASF); product name Adekastab (Adekastab) AO-60, manufactured by Adeka (ADEKA)), octadecyl-3-(3,5-di -Tertiary butyl-4-hydroxyphenyl) propionate (product name IRGANOX 1076, manufactured by BASF) and the like. From the viewpoint of further improving the thermal stability of the sealing material, the sealing material preferably contains dibutylhydroxytoluene and pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propane] at least one of acid esters].

作為抗氧化劑,可使用磷系抗氧化劑。 作為磷系抗氧化劑,可列舉亞磷酸酯,例如可列舉2,2-亞甲基雙(4,6-二-第三丁基苯基)辛基亞磷酸酯(製品名艾迪科斯塔波(Adekastab)HP-10,艾迪科(ADEKA)公司製造)、三(2,4-二-第三丁基苯基)亞磷酸酯(製品名易璐佛斯(IRGAFOS)168,巴斯夫(BASF)公司製造)等。 As the antioxidant, a phosphorus-based antioxidant can be used. Examples of phosphorus-based antioxidants include phosphites, and for example, 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite (product name: Edikostapo) (Adekastab) HP-10, manufactured by ADEKA Corporation), tris(2,4-di-tert-butylphenyl) phosphite (product name IRGAFOS) 168, BASF (BASF) ) made by the company) etc.

(密封材的特性) 本實施方式的密封材的性狀並無限定,但就適合於噴墨法等塗佈的觀點而言,較佳為液狀。 (Characteristics of sealing material) The properties of the sealing material of the present embodiment are not limited, but from the viewpoint of suitability for application such as ink jet method, it is preferably liquid.

另外,於實施方式中,就穩定地形成密封層的觀點而言,密封材較佳為用於塗佈的密封材,更佳為用於利用噴墨法進行的塗佈的密封材。Moreover, in embodiment, from a viewpoint of stably forming a sealing layer, it is preferable that a sealing material is a sealing material for coating, and it is more preferable that it is a sealing material for coating by an inkjet method.

就提高噴墨噴出性的觀點而言,使用E型黏度計於25℃、20 rpm下測定的密封材的黏度較佳為5 mPa·s以上,更佳為8 mPa·s以上,進而佳為10 mPa·s以上。 另外,就提高噴墨噴出性的觀點而言,所述密封材的黏度較佳為50 mPa·s以下,更佳為40 mPa·s以下,進而佳為30 mPa·s以下。 From the viewpoint of improving the inkjet ejectability, the viscosity of the sealing material measured at 25°C and 20 rpm using an E-type viscometer is preferably 5 mPa·s or more, more preferably 8 mPa·s or more, and still more preferably 10 mPa·s or more. In addition, from the viewpoint of improving the ink jet dischargeability, the viscosity of the sealing material is preferably 50 mPa·s or less, more preferably 40 mPa·s or less, and still more preferably 30 mPa·s or less.

(密封材的製造方法) 對密封材的製造方法進行說明。密封材的製造方法並無限定,包括混合例如化合物(A)、及適宜的化合物(B)、其他成分、例如視需要添加的各種添加劑。 作為混合各成分的方法,例如可列舉如下方法:單獨或併用行星式攪拌裝置、均質分散器、萬能混合機、班布里混合機、捏合機、雙輥、三輥、擠出機等公知的各種混練機,於常溫下或加熱下、常壓下、減壓下、加壓下或惰性氣體氣流下等條件下均勻地混練。 (Manufacturing method of sealing material) The manufacturing method of a sealing material is demonstrated. The manufacturing method of a sealing material is not limited, For example, a compound (A), an appropriate compound (B), other components, for example, various additives added as needed are included. As a method of mixing each component, for example, the following methods are exemplified: known methods such as planetary stirrers, homodispersers, universal mixers, Banbury mixers, kneaders, twin rolls, triple rolls, and extruders are used alone or in combination. Various kneaders are used for uniform kneading under the conditions of normal temperature or heating, normal pressure, reduced pressure, pressure or inert gas flow.

<硬化物> 本實施方式的密封材的硬化物是將本實施方式的密封材硬化而成者。 例如,本實施方式的密封材的硬化物是藉由將本實施方式的密封材塗佈於基材上並硬化而獲得。塗佈可使用噴墨法、網版印刷、分散機塗佈等公知的方法。 <hardened product> The cured product of the sealing material of the present embodiment is obtained by curing the sealing material of the present embodiment. For example, the hardened|cured material of the sealing material of this embodiment is obtained by apply|coating and hardening the sealing material of this embodiment on a base material. For the coating, known methods such as ink jet method, screen printing, and dispersion machine coating can be used.

可藉由使塗佈於基材上的密封材乾燥來進行硬化。 作為使密封材乾燥的方法,例如可藉由加熱至化合物(A)不聚合的溫度等來進行。將密封材硬化而獲得的硬化物的形狀並無限制,例如可製成膜狀或層狀。 Hardening can be performed by drying the sealing material applied on the substrate. As a method of drying the sealing material, for example, it can be performed by heating to a temperature at which the compound (A) does not polymerize. The shape of the hardened|cured material obtained by hardening a sealing material is not restrict|limited, For example, it can be made into a film shape or a layer shape.

另外,亦可對塗佈於基材上的密封材進行光硬化。作為對密封材進行光硬化的方法,例如可列舉如下方法:使用低壓水銀燈、中壓水銀燈、高壓水銀燈、超高壓水銀燈、準分子雷射、化學燈、黑光燈、微波激發水銀燈、金屬鹵素燈、鈉燈、鹵素燈、氙氣燈、紫外線-發光二極體(ultraviolet-light emitting diode,UV-LED)等LED燈、螢光燈、太陽光、電子束照射裝置等的光源進行光照射並加以硬化。In addition, photocuring may be performed on the sealing material applied on the base material. As a method of photohardening the sealing material, for example, the following methods can be mentioned: using a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, an excimer laser, a chemical lamp, a black light lamp, a microwave excited mercury lamp, a metal halide lamp, Light sources such as sodium lamps, halogen lamps, xenon lamps, ultraviolet-light emitting diodes (UV-LEDs), and other LED lamps, fluorescent lamps, sunlight, and electron beam irradiation devices are used for light irradiation and curing.

本實施方式的密封材的硬化物於室溫(25℃)下的d射線(波長587.6 nm)的折射率(nd)較佳為1.60以上,更佳為1.61以上,進而佳為1.62以上,進而佳為1.63以上,進而佳為1.64以上,進而佳為1.65以上。另外,折射率的上限並無限制,但例如可設為2.00以下、1.90以下或1.80以下。硬化後的密封材的折射率可利用阿貝折射計進行測定。The refractive index (nd) of the d-ray (wavelength: 587.6 nm) of the cured product of the sealing material of the present embodiment at room temperature (25° C.) is preferably 1.60 or more, more preferably 1.61 or more, still more preferably 1.62 or more, and further It is preferably 1.63 or more, more preferably 1.64 or more, still more preferably 1.65 or more. In addition, the upper limit of the refractive index is not limited, but can be, for example, 2.00 or less, 1.90 or less, or 1.80 or less. The refractive index of the sealing material after hardening can be measured with an Abbe refractometer.

密封材的硬化物可用作密封有機EL顯示元件的密封材料。根據本實施方式的密封材的硬化物,由於折射率高,耐電漿性優異,因此作為密封材料而較佳。The cured product of the sealing material can be used as a sealing material for sealing the organic EL display element. According to the cured product of the sealing material of the present embodiment, since the refractive index is high and the plasma resistance is excellent, it is preferable as a sealing material.

<有機EL顯示裝置> 本實施方式的有機EL顯示裝置具有:有機EL顯示元件;以及含有本實施方式的密封材的硬化物的密封層。藉由具有密封層,配置於基板上的有機EL顯示元件利用密封層進行密封,可充分地防止水分朝有機EL顯示元件內的浸入,從而將有機EL顯示元件的性能及耐久性維持得高。 <Organic EL display device> The organic EL display device of this embodiment includes: an organic EL display element; and a sealing layer including a cured product of the sealing material of this embodiment. By having the sealing layer, the organic EL display element disposed on the substrate is sealed with the sealing layer, and the penetration of moisture into the organic EL display element can be sufficiently prevented, and the performance and durability of the organic EL display element can be maintained high.

密封層亦可由無機材料膜包覆。另外,配置於基板上的有機EL顯示元件亦可於由密封層密封之前,預先由無機材料膜包覆。The sealing layer can also be covered with an inorganic material film. In addition, the organic EL display element arrange|positioned on a board|substrate may be covered with an inorganic material film in advance before sealing with a sealing layer.

具體而言,於具有依序積層有機EL顯示元件、第一無機材料膜、密封層、第二無機材料膜的結構的有機EL顯示裝置中,本實施方式的密封材是用於該密封層的形成。Specifically, in an organic EL display device having a structure in which an organic EL display element, a first inorganic material film, a sealing layer, and a second inorganic material film are laminated in this order, the sealing material of this embodiment is used for the sealing layer. form.

圖1是表示本實施方式的有機EL顯示裝置的結構例的剖面圖。 於圖1所示的有機EL顯示裝置100中,有機EL顯示元件10配置於基材50上,有機EL顯示元件10的表面由第一無機材料膜21包覆。 由第一無機材料膜21包覆的有機EL顯示元件10利用第一密封層22進行密封。 第一密封層22的表面進而由第二無機材料膜23包覆。 由第二無機材料膜23包覆的第一密封層22進而利用第二密封層24進行密封。 於第二密封層24的表面設置有表面保護層25。 FIG. 1 is a cross-sectional view showing a configuration example of an organic EL display device of the present embodiment. In the organic EL display device 100 shown in FIG. 1 , the organic EL display element 10 is disposed on the substrate 50 , and the surface of the organic EL display element 10 is covered with the first inorganic material film 21 . The organic EL display element 10 covered with the first inorganic material film 21 is sealed with the first sealing layer 22 . The surface of the first sealing layer 22 is further covered with the second inorganic material film 23 . The first sealing layer 22 covered with the second inorganic material film 23 is further sealed with the second sealing layer 24 . A surface protection layer 25 is disposed on the surface of the second sealing layer 24 .

有機EL顯示裝置100可為頂部發光結構,亦可為底部發光結構。The organic EL display device 100 may be a top emission structure or a bottom emission structure.

基材50的材料並無限定,例如可使用玻璃基板、矽基板、塑膠基板等各種材料。亦可使用在基板上包括多個薄膜電晶體(thin film transistor,TFT)及平坦化層的TFT基板。The material of the base material 50 is not limited, for example, various materials such as a glass substrate, a silicon substrate, and a plastic substrate can be used. A TFT substrate including a plurality of thin film transistors (TFTs) and a planarization layer on the substrate can also be used.

作為構成第一無機材料膜21及第二無機材料膜23的無機材料,例如可列舉:氮化矽(SiN x)、氧化矽(SiO x)、氧化鋁(Al 2O 3)等。無機材料膜可為一層,亦可為多種層的積層體。 Examples of inorganic materials constituting the first inorganic material film 21 and the second inorganic material film 23 include silicon nitride (SiN x ), silicon oxide (SiO x ), aluminum oxide (Al 2 O 3 ), and the like. The inorganic material film may be a single layer or a laminate of a plurality of layers.

作為利用第一無機材料膜21及第二無機材料膜23的包覆方法,例如於所述無機材料膜包含氮化矽或氧化矽的情況下,可列舉濺鍍法或電子迴旋共振電漿CVD法等。As a coating method using the first inorganic material film 21 and the second inorganic material film 23, for example, in the case where the inorganic material film includes silicon nitride or silicon oxide, sputtering or electron cyclotron resonance plasma CVD can be used. law, etc.

其中,濺鍍法例如可使用氬或氮等單獨或混合氣體作為載氣,於室溫、電力50 W~1000 W、壓力0.001托(Torr)~0.1 Torr的條件下進行。Among them, the sputtering method can be carried out, for example, using a single gas such as argon or nitrogen or a mixed gas as a carrier gas, under the conditions of room temperature, electric power of 50 W to 1000 W, and pressure of 0.001 Torr (Torr) to 0.1 Torr.

另外,電子迴旋共振電漿CVD法例如可使用SiH 4與O 2的混合氣體或SiH 4與N 2的混合氣體,於溫度30℃~100℃、壓力10 mTorr~1 Torr、頻率2.45 GHz、電力10 W~1000 W的條件下進行。 In addition, the electron cyclotron resonance plasma CVD method can use, for example, a mixed gas of SiH 4 and O 2 or a mixed gas of SiH 4 and N 2 at a temperature of 30°C to 100°C, a pressure of 10 mTorr to 1 Torr, a frequency of 2.45 GHz, and electric Under the conditions of 10 W to 1000 W.

本實施方式的密封層由於耐電漿性優異,因此即便藉由電子迴旋共振電漿CVD法等電漿處理於其表面形成無機材料膜,樹脂層亦不易劣化,可抑制對有機EL發光元件的損傷。Since the sealing layer of the present embodiment is excellent in plasma resistance, even if an inorganic material film is formed on the surface by plasma treatment such as electron cyclotron resonance plasma CVD, the resin layer is not easily deteriorated, and damage to the organic EL light-emitting element can be suppressed. .

第一無機材料膜21及第二無機材料膜23的厚度並無限定,但就提高阻隔性能的觀點而言,例如為0.01 μm~10 μm,較佳為0.1 μm~5 μm。The thicknesses of the first inorganic material film 21 and the second inorganic material film 23 are not limited, but from the viewpoint of improving the barrier performance, they are, for example, 0.01 μm to 10 μm, preferably 0.1 μm to 5 μm.

作為獲得密封層的方法,可列舉塗敷密封材並進行硬化的方法等。作為塗敷的方法,可使用噴墨法。另外,可藉由網版印刷、分散機塗佈、噴墨印刷、狹縫塗佈、噴塗等方法,將密封材塗佈成面狀。As a method of obtaining a sealing layer, the method of coating and hardening a sealing material, etc. are mentioned. As a coating method, an ink jet method can be used. In addition, the sealing material can be coated in a planar shape by methods such as screen printing, dispersion machine coating, ink jet printing, slit coating, and spray coating.

密封層的厚度並無限定,但就提高密封性能與撓性性能的觀點而言,例如為0.1 μm~50 μm,較佳為1 μm~20 μm。The thickness of the sealing layer is not limited, but from the viewpoint of improving sealing performance and flexibility, it is, for example, 0.1 μm to 50 μm, or preferably 1 μm to 20 μm.

再者,作為密封有機EL顯示元件的方法,有如下方法:於有機EL顯示元件的周圍利用高黏度的硬化性樹脂(阻擋材)形成阻擋層,向其中流入低黏度的硬化性樹脂(填充材)使其硬化。於使用此種阻擋材與填充材的密封結構中,可將本實施方式的密封材用作填充材。本實施方式的密封材由於黏度降低,流動性優異,因此可適合用作填充材。 [實施例] Furthermore, as a method of sealing the organic EL display element, there is a method of forming a barrier layer around the organic EL display element with a high-viscosity curable resin (barrier), and pouring a low-viscosity curable resin (filler) into the barrier layer. ) to harden it. In the sealing structure using such a barrier material and a filler, the sealing material of this embodiment can be used as a filler. Since the sealing material of this embodiment has a low viscosity and is excellent in fluidity, it can be suitably used as a filler. [Example]

以下,藉由實施例及比較例對本發明進行說明,但本發明並不限定於該些。Hereinafter, the present invention will be described with reference to Examples and Comparative Examples, but the present invention is not limited to these.

(密封材的製作) 首先,示出於以下的例子中使用的材料。 (production of sealing material) First, the materials used in the following examples are shown.

作為化合物(A),使用以下的硫代化合物A1~硫代化合物A5。 硫代化合物A1:依照日本專利特公平7-91262號公報的實施例2的記載而製備的下述式的化合物 [化4]

Figure 02_image010
硫代化合物A2:依照日本專利2708607號公報的實施例3的記載而製備的下述式的化合物 [化5]
Figure 02_image012
硫代化合物A3:依照日本專利特開平9-324023號公報的合成例6的記載而製備的下述式的化合物 [化6]
Figure 02_image014
硫代化合物A4:除將日本專利2708607號公報的實施例1的4,4'-硫雙-苯硫醇25.0份(0.10莫耳)替換為苄基硫醇24.8份(0.20莫耳)以外,藉由進行與日本專利2708607號公報的實施例1相同的操作而調整的下述式的化合物 [化7]
Figure 02_image016
硫代化合物A5:依照日本專利2708607號公報的實施例1的記載而製備的下述式的化合物 [化8]
Figure 02_image018
As the compound (A), the following thio compounds A1 to A5 were used. Thio compound A1: a compound of the following formula prepared according to the description of Example 2 of JP 7-91262 A
Figure 02_image010
Thio compound A2: a compound of the following formula prepared according to the description of Example 3 of Japanese Patent No. 2708607 [Chem. 5]
Figure 02_image012
Thio compound A3: a compound of the following formula prepared according to the description of Synthesis Example 6 of Japanese Patent Laid-Open No. 9-324023 [Chem. 6]
Figure 02_image014
Thio compound A4: Except for replacing 25.0 parts (0.10 mol) of 4,4'-thiobis-benzenethiol in Example 1 of Japanese Patent No. 2708607 with 24.8 parts (0.20 mol) of benzyl thiol, A compound of the following formula adjusted by the same operation as Example 1 of Japanese Patent No. 2708607 [Chem. 7]
Figure 02_image016
Thio compound A5: a compound of the following formula prepared according to the description of Example 1 of Japanese Patent No. 2708607 [Chem. 8]
Figure 02_image018

作為化合物(B),使用下述的(甲基)丙烯酸化合物B1~(甲基)丙烯酸化合物B4。 (甲基)丙烯酸化合物B1:乙氧基化鄰苯基苯酚丙烯酸酯,製品名NK酯(NK Ester)A-LEN-10,新中村化學工業公司製造 (甲基)丙烯酸化合物B2:丙烯酸間苯氧基苄酯,製品名萊特丙烯酸酯(Light Acrylate)POB-A,共榮社化學公司製造 (甲基)丙烯酸化合物B3:丙烯酸苄酯,製品名比斯克(Biscoat)#160,共榮社化學公司製造 (甲基)丙烯酸化合物B4:1,9-壬二醇二丙烯酸酯,製品名萊特丙烯酸酯(Light Acrylate)1,9ND-A,共榮社化學公司製造 As the compound (B), the following (meth)acrylic compounds B1 to B4 were used. (Meth)acrylic compound B1: Ethoxylated o-phenylphenol acrylate, product name NK Ester (NK Ester) A-LEN-10, manufactured by Shin-Nakamura Chemical Industry Co., Ltd. (Meth)acrylic acid compound B2: m-phenoxybenzyl acrylate, product name Light Acrylate (Light Acrylate) POB-A, manufactured by Kyeisha Chemical Co., Ltd. (Meth)acrylic acid compound B3: Benzyl acrylate, product name Biscoat #160, manufactured by Kyeisha Chemical Co., Ltd. (Meth)acrylic acid compound B4: 1,9-nonanediol diacrylate, product name Light Acrylate 1,9ND-A, manufactured by Kyōeisha Chemical Co., Ltd.

作為熱穩定劑,使用季戊四醇四[3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯](製品名艾迪科斯塔波(Adekastab)AO-60,艾迪科(ADEKA)公司製造)。作為光自由基起始劑,使用2,4,6-三甲基苯甲醯基二苯基氧化膦(製品名歐姆尼拉德(Omnirad)TPO H,IGM樹脂(IGM Resins)公司製造)。As a heat stabilizer, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] (trade name Adekastab AO-60, Adi Section (ADEKA) company manufacture). As a photoradical initiator, 2,4,6-trimethylbenzyldiphenylphosphine oxide (product name Omnirad TPO H, manufactured by IGM Resins) was used.

以成為表1所示的調配組成的方式調配各成分,獲得液狀的密封材。 表1中的化合物(A)及化合物(B)的調配組成的單元是相對於化合物(A)與化合物(B)的合計100質量份而言的化合物(A)或化合物(B)的質量份。另外,表1中的熱穩定劑及光自由基起始劑的調配組成的單元為相對於密封材的全部組成的質量%。 Each component was prepared so that it might become the preparation composition shown in Table 1, and the liquid sealing material was obtained. The unit of the compounding composition of compound (A) and compound (B) in Table 1 is the part by mass of compound (A) or compound (B) with respect to 100 parts by mass of the total of compound (A) and compound (B) . In addition, the unit of the preparation composition of the thermal stabilizer and the photo-radical initiator in Table 1 is the mass % with respect to the whole composition of a sealing material.

利用以下的方法測定所獲得的密封材的物性。將測定結果示於表1。The physical properties of the obtained sealing material were measured by the following methods. The measurement results are shown in Table 1.

(黏度) 對於所獲得的密封材,使用E型黏度計(LV DV-II+Pro,博勒飛(BROOKFIELD)公司製造)於25℃、20 rpm的條件下測定黏度。評價是按照下述基準進行。將結果示於表1。 ○:5 mPa·s~50 mPa·s ×:未滿5 mPa·s或大於50 mPa·s (viscosity) The viscosity of the obtained sealing material was measured under the conditions of 25° C. and 20 rpm using an E-type viscometer (LV DV-II+Pro, manufactured by BROOKFIELD). Evaluation was performed according to the following criteria. The results are shown in Table 1. ○: 5 mPa·s~50 mPa·s ×: Less than 5 mPa·s or more than 50 mPa·s

(折射率) 利用以下的方法評價使所獲得的密封材硬化而成的硬化膜的折射率。 將100 μm厚的鐵氟龍(註冊商標)片材作為模框,於透明聚對苯二甲酸乙二酯(PET)膜上放置該模框,向其中流入利用所述方法獲得的密封材,於其上進而載置透明PET膜,藉此將密封材夾入至兩張透明PET膜之間,利用波長395 nm的UV-LED於照度1000 mW/cm 2、累計光量1500 mJ/cm 2的條件下使其硬化,藉此獲得硬化膜。 對於所獲得的硬化膜,利用阿貝折射計(愛拓(Atago)公司製造,DR-M4)測定室溫(25℃)下的d射線(波長587.6 nm)下的硬化後的膜的折射率(nd)。評價是按照下述基準進行。將結果示於表1。 ○:1.60以上 ×:未滿1.60 (Refractive index) The refractive index of the cured film obtained by hardening the obtained sealing material was evaluated by the following method. Using a 100 μm-thick Teflon (registered trademark) sheet as a mold frame, the mold frame was placed on a transparent polyethylene terephthalate (PET) film, and the sealing material obtained by the method was poured into it, A transparent PET film was placed thereon, the sealing material was sandwiched between two transparent PET films, and a UV-LED with a wavelength of 395 nm was used under an illumination intensity of 1000 mW/cm 2 and a cumulative light intensity of 1500 mJ/cm 2 . By making it harden under conditions, a hardened film is obtained. About the obtained cured film, the refractive index of the cured film under d rays (wavelength: 587.6 nm) at room temperature (25°C) was measured with an Abbe refractometer (manufactured by Atago, DR-M4). (nd). Evaluation was performed according to the following criteria. The results are shown in Table 1. ○: 1.60 or more ×: less than 1.60

(耐電漿性) 作為耐電漿性,利用以下的方法評價使用平行平板型的電子迴旋共振電漿CVD裝置的電漿處理步驟中的元件損傷。 將利用所述方法而獲得的密封材導入至噴墨盒DMC-11610(富士膠片德麥特克斯(Dimatix)公司製造)中。將該噴墨盒設置於噴墨裝置DMP-2831(富士膠片德麥特克斯(Dimatix)公司製造)中,並進行噴出狀態的調整後,以硬化後的厚度成為10 μm的方式,以15 mm×15 mm的尺寸塗佈於玻璃基板上。 將所獲得的塗膜放入氮氣流動且調整為室溫(25℃)的箱中,靜置5分鐘,繼而使用波長395 nm的UV-LED於照度1000 mW/cm 2、累計光量1500 mJ/cm 2的條件下進行照射,藉此形成硬化膜。 使用平行平板型的電子迴旋共振電漿CVD裝置,於功率100 W、硬化膜表面溫度100℃的條件下,於硬化膜的表面蒸鍍膜厚1 μm的無機材料膜(SiN x膜)。 將所獲得的樣品投入85℃且85%的恆溫恆濕槽中並觀察240小時後的外觀。評價是按照下述基準進行。將結果示於表1。 ○:未白化 ×:白化 (Plasma resistance) As the plasma resistance, element damage in the plasma processing step using a parallel-plate type electron cyclotron resonance plasma CVD apparatus was evaluated by the following method. The sealing material obtained by the said method was introduce|transduced into the ink jet cartridge DMC-11610 (manufactured by Fujifilm Dimatix). This ink-jet cartridge was set in an ink-jet device DMP-2831 (manufactured by Fujifilm Dimatix), and after adjusting the ejection state, the thickness after curing was 10 μm, and the thickness was 15 μm. The size of mm × 15 mm is coated on a glass substrate. The obtained coating film was placed in a box adjusted to room temperature (25° C.) with nitrogen flow, left for 5 minutes, and then UV-LED with a wavelength of 395 nm was used at an illuminance of 1000 mW/cm 2 and a cumulative light intensity of 1500 mJ/ By irradiating on the conditions of cm 2 , a cured film is formed. Using a parallel plate type electron cyclotron resonance plasma CVD apparatus, under the conditions of a power of 100 W and a surface temperature of the cured film of 100°C, an inorganic material film (SiN x film) with a thickness of 1 μm was vapor-deposited on the surface of the cured film. The obtained sample was put into a constant temperature and humidity tank at 85°C and 85%, and the appearance after 240 hours was observed. Evaluation was performed according to the following criteria. The results are shown in Table 1. ○: Not whitened ×: Whitened

[表1] 表1    實施例 比較例 1 2 3 4 5 6 7 8 9 1 2 3 4 化合物(A)(質量份) 硫代化合物A1 100 95 90 90 90 95 97 70 97             硫代化合物A2                5                      硫代化合物A3                   3                   硫代化合物A4                      30                硫代化合物A5                         3             化合物(B)(質量份) (甲基)丙烯酸化合物B1    5                      100          (甲基)丙烯酸化合物B2       10                      100       (甲基)丙烯酸化合物B3          10                      100    (甲基)丙烯酸化合物B4             10                      100 熱穩定劑(相對於密封材的全部組成的質量%) 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 光自由基起始劑(相對於密封材的全部組成的質量%) 3 3 3 3 3 3 3 3 3 3 3 3 3 黏度 (mPa·s) 24 30 22 18 20 32 40 18 45 135 20 3 6 評價 × × 折射率 (nd) 1.64 1.63 1.63 1.63 1.62 1.64 1.64 1.62 1.65 1.59 1.57 1.52 1.47 評價 × × × × 耐電漿性 評價 × × × [Table 1] Table 1 Example Comparative example 1 2 3 4 5 6 7 8 9 1 2 3 4 Compound (A) (parts by mass) Thio compound A1 100 95 90 90 90 95 97 70 97 Thio compound A2 5 Thio compound A3 3 Thio compound A4 30 Thio compound A5 3 Compound (B) (parts by mass) (Meth)acrylic compound B1 5 100 (Meth)acrylic compound B2 10 100 (Meth)acrylic compound B3 10 100 (Meth)acrylic compound B4 10 100 Heat stabilizer (mass % relative to the entire composition of the sealing material) 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Photoradical initiator (mass % relative to the entire composition of the sealing material) 3 3 3 3 3 3 3 3 3 3 3 3 3 viscosity (mPa s) twenty four 30 twenty two 18 20 32 40 18 45 135 20 3 6 Evaluation × × refractive index (nd) 1.64 1.63 1.63 1.63 1.62 1.64 1.64 1.62 1.65 1.59 1.57 1.52 1.47 Evaluation × × × × Plasma resistance Evaluation × × ×

如表1所示般,關於各實施例中獲得的密封材及其硬化物,相對於電漿照射的元件損傷的抑制效果優異,並且折射率高,具有適於塗佈的低的黏度。As shown in Table 1, the sealing material and its cured product obtained in each example were excellent in the effect of suppressing element damage by plasma irradiation, had a high refractive index, and had a low viscosity suitable for coating.

本申請案主張以2020年11月18日提出申請的日本專利申請案特願2020-191965號為基礎的優先權,將其揭示的全部內容併入本文中。This application claims priority based on Japanese Patent Application No. 2020-191965 for which it applied on Nov. 18, 2020, the entire disclosure of which is incorporated herein.

10:有機EL顯示元件 21:第一無機材料膜 22:第一密封層 23:第二無機材料膜 24:第二密封層 25:表面保護層 50:基材 100:有機EL顯示裝置 10: Organic EL display element 21: The first inorganic material film 22: The first sealing layer 23: The second inorganic material film 24: Second sealing layer 25: Surface protection layer 50: Substrate 100: Organic EL Display Device

圖1是表示實施方式的有機EL顯示裝置的結構例的剖面圖。FIG. 1 is a cross-sectional view showing a configuration example of an organic EL display device according to an embodiment.

10:有機EL顯示元件 10: Organic EL display elements

21:第一無機材料膜 21: The first inorganic material film

22:第一密封層 22: The first sealing layer

23:第二無機材料膜 23: The second inorganic material film

24:第二密封層 24: Second sealing layer

25:表面保護層 25: Surface protection layer

50:基材 50: Substrate

100:有機EL顯示裝置 100: Organic EL Display Device

Claims (10)

一種有機電致發光顯示元件用密封材,含有具有下述通式(1)所表示的(甲基)丙烯酸硫基的化合物(A), [化1]
Figure 03_image001
[所述通式(1)中,R 1表示氫原子或甲基,*表示鍵結位置]。
A sealing material for an organic electroluminescence display element, comprising a compound (A) having a (meth)acrylic thio group represented by the following general formula (1), [Chem. 1]
Figure 03_image001
[In the general formula (1), R 1 represents a hydrogen atom or a methyl group, and * represents a bonding position].
如請求項1所述的有機電致發光顯示元件用密封材,其中所述化合物(A)為具有兩個以上的所述(甲基)丙烯酸硫基的化合物。The sealing material for organic electroluminescence display elements according to claim 1, wherein the compound (A) is a compound having two or more of the (meth)acrylic thio groups. 如請求項1所述的有機電致發光顯示元件用密封材,更含有具有(甲基)丙烯酸基的化合物(B)(其中所述化合物(A)除外)。The sealing material for organic electroluminescence display elements according to claim 1, further comprising a compound (B) having a (meth)acrylic group (except for the compound (A)). 如請求項3所述的有機電致發光顯示元件用密封材,其中所述化合物(B)為更具有可經取代的芳香族基的化合物。The sealing material for organic electroluminescence display elements according to claim 3, wherein the compound (B) is a compound further having a substituted aromatic group. 如請求項1所述的有機電致發光顯示元件用密封材,其中利用E型黏度計測定的25℃、20 rpm下的黏度為5 mPa·s以上且50 mPa·s以下。The sealing material for organic electroluminescence display elements according to claim 1, wherein the viscosity at 25°C and 20 rpm measured by an E-type viscometer is 5 mPa·s or more and 50 mPa·s or less. 如請求項1所述的有機電致發光顯示元件用密封材,用於利用噴墨法進行的塗佈。The sealing material for organic electroluminescence display elements according to claim 1 is used for coating by an inkjet method. 如請求項1所述的有機電致發光顯示元件用密封材,於具有依序積層有機電致發光顯示元件、第一無機材料膜、密封層、第二無機材料膜的結構的有機電致發光顯示裝置中,用於所述密封層的形成。The sealing material for an organic electroluminescence display element according to claim 1, wherein the organic electroluminescence display element, the first inorganic material film, the sealing layer, and the second inorganic material film are laminated in this order. In a display device, it is used for the formation of the sealing layer. 如請求項1所述的有機電致發光顯示元件用密封材,於使用阻擋材與填充材的密封結構中,用作所述填充材。The sealing material for organic electroluminescence display elements according to claim 1 is used as the filling material in a sealing structure using a barrier material and a filling material. 一種硬化物,是將如請求項1所述的有機電致發光顯示元件用密封材硬化而成。A cured product obtained by curing the sealing material for an organic electroluminescence display element according to claim 1. 一種有機電致發光顯示裝置,包含: 有機電致發光顯示元件;以及 密封層,包覆所述有機電致發光顯示元件, 所述密封層含有如請求項9所述的硬化物。 An organic electroluminescence display device, comprising: organic electroluminescent display elements; and a sealing layer covering the organic electroluminescence display element, The said sealing layer contains the hardened|cured material as described in Claim 9.
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