TW202220507A - Integrated electro-optical flexible circuit board - Google Patents

Abstract

An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.

Description

Integrated electro-optical flexible circuit board

The present invention relates to an integrated circuit board, and more particularly to an integrated optical circuit with an electronic circuit board.

To support future devices such as high-performance computing (HPC) for high-speed, high-capacity data transfer, optical interconnects are the technology of choice. Traditional electronic circuits with copper interconnects are no longer adequate due to their data bandwidth limitations and signal integrity issues. Optical interconnects offer numerous advantages for high-performance devices, enabling massive data transfer rates with low attenuation/loss, delay, and power consumption, and low power consumption, while being virtually immune to electromagnetic interference and noise. Meanwhile, electrical interconnect is more suitable for power distribution and signal processing and control. Electronic interconnection is also a mature technology with a well-established infrastructure and therefore has significant cost advantages.

In recent years, flexible electronic devices have emerged as a reliable solution for device miniaturization because flexible electronic devices are Has many advantages, including higher circuit density, thinner profile, lighter weight, and good shape adaptability (foldable and bendable). In order to achieve higher circuit density, flexible electronic devices use a multi-layer circuit structure, wherein the circuits between the layers are connected through via holes filled with signal transmission materials.

By integrating the optical and electronic interconnects into a single package, the benefits of both systems can be realized. This is an attractive solution for the complex technical needs of high-performance devices such as supercomputers (supercomputers), internet of things (IoT), telecommunication networks, image detection, smart displays, etc.

However, combining two interconnection systems to achieve a compact packaging module is challenging from a material and processing point of view.

In optical circuits, optical signals are transmitted through a core material, which must be completely enclosed by a cladding material. When transmitting optical signals based on the principle of total internal reflection, the refractive index of the core material must be higher than that of the cladding material. Acting as a waveguide to transmit optical signals The core is usually made of silicon, III-V semiconductors (III-V), glass or other polymer materials. In electronic circuits, electronic signals are usually transmitted through copper wires between insulating materials.

As mentioned above, the electronic interface is well formed where copper is deposited, patterned, and etched on a dielectric surface (usually a flexible polyimide material) to form circuits. Since the requirements of each interface are significantly different, a novel material stacking combination is the key to realize the integrated electro-optical flexible circuit board module. In this regard, due to its various unique properties, glass emerges as an attractive material for both optical and electronic interconnection. In optical interfaces, glass is suitable as a cladding material for a wide range of core materials due to its relatively low refractive index. In an electronic interface, through interconnection, glass provides excellent insulating properties for copper wires and almost no dielectric losses. Glass also has excellent thermal stability and has a thermal expansion coefficient close to that of mainstream semiconductor materials such as silicon.

Numerous US patents discuss opto-electronic integration, optical adhesives, and cyclic olefin polymers. These include US Patent Publication Nos. 6,910,812 (Pommer et al.), 9,130,254 (Izadian et al.), 9,110,200 (Nichol et al.), 10,089,516 (Popovich et al.), and US Patent Application Nos. 2018/0138346 (Simavoryan et al.) and 2018/ 0226014 (Komanduri et al.) et al.

The main purpose of the present invention is to provide a method for embedding an optical circuit on a flexible electronic circuit.

Another object of the present invention is to provide an integrated electro-optical flexible circuit board.

Another object of the present invention is to provide an integrated electro-optical flexible circuit board coated with electronic and optical interconnects.

According to the purpose of the present invention, an integrated electro-optical circuit board is disclosed, comprising a first flexible substrate, at least a first optical circuit, at least a first metal wire, an optical adhesive layer, and at least one the second metal wire. The first flexible substrate has a top side and a bottom side; at least one first optical circuit is located on the bottom side of the first flexible substrate, and the bottom side of the first flexible substrate is connected through a filled via (filled via) on the top side of the first flexible substrate; at least one first metal wire is located on the top side of the first flexible substrate; an optical adhesive layer (adhesive layer) connects the bottom side of the first flexible substrate to a second flexible substrate a top side of the flexible substrate; at least one second metal wire is located on a bottom side of the second flexible substrate, and the second metal wire passes through the second flexible substrate, the optical adhesive layer and the first flexible substrate The filling hole of the substrate is connected to at least one first metal line.

According to the purpose of the present invention, an integrated electro-optical circuit board is further disclosed, comprising a first flexible substrate, at least a first optical circuit, at least a first metal wire, an optical adhesive layer and at least one a second metal wire. The first flexible substrate has a top side and a bottom side; at least one first optical circuit is located on the bottom side of the first flexible substrate, and the bottom side of the first flexible substrate is connected through a filled via (filled via) on the top side of the first flexible substrate; at least one first metal wire is located on the top side of the first flexible substrate; an optical adhesive layer (adhesive layer) connects the bottom side of the first flexible substrate to a second flexible substrate a top side of the flexible substrate; at least one second metal line is located on a top side of the second flexible substrate, and at least one third metal line is located on the bottom side of the second flexible substrate, and the third metal line passes through a The filling hole passing through the second flexible substrate is connected to at least one second metal wire.

The present invention discloses various versions of an integrated electro-optical flexible circuit board (EOFCB). The functions of these circuit boards include electronic and optical circuits, flexible electronic components, and glass materials. Electronic circuits typically have low speed signals and are often used for power distribution with lower circuit density. Optical circuits typically have high-speed signals and higher circuit density. Flexible electronics have a small profile and are relatively inconspicuous, they usually have higher wiring densities and are foldable and bendable. Glass materials have smooth, transparent surfaces and low dielectric signal loss.

The concept of the present invention is to embed an optical circuit on a flexible electronic circuit, and fabrication will take place on the same glass plate used for the flexible electronic circuit to provide better isolation characteristics. The present invention uses an optical bonding layer to form a core-clad structure on a waveguide, and directly metallizes the glass surface with copper by machining the surface structure. The electro-optical flexible circuit board of the present invention has high coupling efficiency and low optical attenuation, wherein the coupling efficiency refers to the loss of the signal when it propagates between different interfaces/mediums, and the attenuation refers to the signal strength during the transmission process in the interface/medium Decline.

The smooth glass surface of the substrate is suitable for thin film processing to minimize transmission losses. Due to the inherent properties of glass, traces and via layouts have minimal dielectric losses. Compared with separate optical modules and electronic modules, which must be assembled on a printed circuit board (PCB) to form interconnections, the present invention achieves high-density wiring, multi-layer stack- up) and the simplification of the module assembly process, which can significantly reduce product size. Since cumbersome assembly steps can be avoided, the overall process can be simplified.

More specifically, please refer to FIG. 1, which is an isometric schematic diagram of a first preferred embodiment of the present invention. The present invention provides a flexible glass substrate 10 (substrate 10 for short) as a base film. film) material. The thickness of the glass substrate ranges from about 12.5 to 100 μm. In an alternative, the glass substrate can be replaced by a cyclic olefin polymer (COP) to obtain higher flexibility and flexibility; in addition, the core waveguide material is deposited on the substrate 10 , and the refractive index of the waveguide material should be higher than the refractive index of the substrate 10 . Various alternatives to waveguide materials include silicon, silicon dioxide, gallium arsenide, gallium phosphide, and various types of polymers of the above components, and the thickness of the waveguide material ranges from Between about 4 and 15 μm.

The waveguide material is patterned to form the optical circuit 12; tapered structures with 45° angles are formed at specific locations on the sidewalls of the waveguide, and a 45° micro-mirror 14 is deposited on the Top of the tapered structure.

The optical adhesive layer 16 is laminated by the patterned waveguide optical circuit and the substrate 10 , and the optical adhesive layer must have exactly the same refractive index as the substrate 10 . Various alternative materials for optical bonding layer 16 include epoxies, polyurethanes, silicones elastomers, UV-cured acrylics, and Cyanoacrylates, and have thickness range of about 25 to 50 μm.

Next, a flexible glass substrate 18 (referred to as substrate 18 ) as the material of the second layer of base film is laminated on the other side of the optical adhesive layer 16 , wherein the material of the substrate 18 can be flexible glass or cyclic olefin polymer material (COP), and the thickness of the substrate 18 is about 12.5 μm to 100 μm.

Through glass vias (TGVs) 20 and 22 are formed through designated interfaces. In the case of the optical through-glass via 20, it is accomplished only by passing through the substrate 10, and the diameter of the through-glass via can be 15 to 25 μm. The waveguide material can be selectively deposited to completely fill the optical through-glass via 20 .

The outer surfaces of the substrates 10, 18 are processed to form a Si oligomer structure, followed by pentagonal ring coordination for stable Pd catalyst deposition. Next, a circuit pattern is formed on the processed flexible glass surface to form a copper circuit and fill through glass vias 22 to connect one side of the circuit to the other, where the copper circuit has a thickness in the range of 4 to 15 μm. Electronic interfaces are formed on the outer surfaces of the glass (or COP) substrates 10 , 18 . For example, a seed layer of nickel phosphorous (Ni-P), copper, silver, or any type of metal alloy (eg, nichrome) can be formed on the outside of the patterned substrates 10 , 18 as desired. surface. Next, copper wires are plated on the seed layer. The seed layer 24 and the copper wires 26 are located on the outer surface of the substrate 10 , and the seed layer 28 and the copper wires 30 are shown on the outer surface of the substrate 18 . The filled through-glass vias 22 connect at least one of the copper wires 30 to at least one of the copper wires 26 .

Figure 2 is a schematic isometric view of a second preferred embodiment of the present invention. Like the first embodiment, the present embodiment also provides the substrate 10 as the base film material. The thickness of the glass substrate ranges from about 12.5 to 100 μm. The core waveguide material is deposited on the substrate 10 , wherein the refractive index of the waveguide material should be higher than the refractive index of the substrate 10 . Various alternatives to waveguide materials include silicon, silicon dioxide, gallium arsenide, gallium phosphide, and various types of polymers, ranging in thickness from about 4 to 15 μm between.

The waveguide material is patterned to form the optical circuit 12; a tapered structure with a 45° angle is formed at specific locations on the sidewall of the waveguide, and a 45° micro-mirror 14 is deposited in the cone the top of the surface of the shaped structure.

The present embodiment provides a substrate 18 as the second base film material, the thickness of which is between about 12.5 to 100 μm, and the same core waveguide material as the waveguide material 12 is deposited on the substrate 18 . The waveguide material is patterned to form a second optical circuit 42 with a 45° angle tapered geometry formed at specific locations on the sidewall of the waveguide, and a second 45° micromirror 44 is deposited on this tapered surface.

Substrates 10 , 18 are laminated with optical adhesive layer material 16 . The optical circuits 12 , 42 are laminated on opposite sides in the optical adhesive layer 16 . As mentioned above, the refractive index of the optical adhesive layer 16 must be exactly the same as the refractive index of the glass materials 10,18. Alternative materials for the optical adhesive layer 16 include epoxy, polyurethane, silicone elastomers, UV-cured acrylics, and cyanoacrylates, and have thicknesses ranging from about 25 to 50 μm.

The package of this embodiment is the same as the first embodiment, wherein this embodiment has through-glass vias 20 , 40 connected to the optical circuits 12 , 42 , respectively, and the through-glass vias 22 connect the copper wires 26 on the optical circuit 12 to the substrate 18 . 30 on the copper wire.

Fig. 3 is a schematic isometric view of a third preferred embodiment of the present invention. As shown in Fig. 3, the substrate 18 is replaced by polyimide (PI), modified polyimide (MPI) ), liquid crystal polymer (LCP), polyester (PET), polyethylene-naphtalate (PEN), or polytetrafluoroethylene (polytetrafluoroethylene), or alternatives It is a laminate substrate of epoxy resin (epoxies), BT, Teflon (Teflon) or modified Teflon layer; the thickness of the substrate layer 19 ranges from 12.5 to 100um.

Optical circuit 12 and micromirrors 14 are formed on the bottom side of substrate 10; the outer surface of substrate layer 19 is processed to form a polyamic acid (PAA) layer with a thickness in the range of 5-15 nm, followed by Pd catalyst deposition ( Pd catalyst deposition), performed before the formation of the electronic circuit 53 and the seed layer 51 on the top side of the substrate layer 19 and the formation of the metal lines 30 and the seed layer 28 on the bottom side of the substrate layer 19 . Vias 54 are completed through substrate layer 19 to connect at least one of metal lines 53 on one side of substrate layer 19 to at least one of metal lines 30 on the opposite side of substrate layer 19 . At least one of the metal wires 53 on one side of the substrate layer 19 is connected to at least one of the metal wires 30 on the opposite side of the substrate layer 19 .

FIG. 4 is a schematic isometric view of a fourth preferred embodiment of the present invention. This embodiment is similar to the third embodiment, wherein the substrate 18 is replaced by polyimide (PI), modified polyimide (modified polyimide, MPI), liquid crystal polymer (liquid crystal polymer, LCP), polyester (polyester, PET), polyethylene naphthalate (polyethylene-naphtalate, PEN), polytetrafluoroethylene (polytetrafluoroethylene) ethylene), etc., or replace laminate substrates such as epoxies, BT, Teflon, or modified Teflon layers; the fourth embodiment uses a multi-metal layer (multi- metal layer substrates rather than using a single layer substrate (eg, substrate layer 19 ) with a bonding film interposed between the metal layers.

In the fourth preferred embodiment, the optical circuit 12 and the micromirror 14 are formed on the bottom side of the substrate 10, the seed layer 51 and the metal wire 53 are formed on the top side of the substrate layer 19, and the seed layer 56 and the metal wire 58 are formed on the top side of the substrate layer 19. formed on the bottom side of the substrate layer 19 . The through holes 54 pass through the substrate layer 19 to connect at least one of the metal wires 53 on one side of the substrate layer 19 to at least one of the metal wires 58 on the other side of the substrate layer 19 . Similarly, the seed layer 62 and the metal wire 64 are formed on one side of the substrate layer 49 , wherein the material of the substrate layer 49 can be polyimide (PI), modified polyimide (MPI) , liquid crystal polymer (LCP), polyester (PET), polyethylene-naphtalate (PEN), polytetrafluoroethylene (poly tetra fluoro ethylene), etc., or It is a laminate substrate of epoxy resin (epoxies), BT, Teflon (Teflon) or modified Teflon layer. The substrate layers 19 and 49 are laminated together with an adhesive layer 50 therebetween. The adhesive layer may be a fiber-reinforced adhesive film such as epoxy, cyanide, acrylic adhesive, modified polyimide (MPI) with epoxy, etc., having a thickness of about 10 to 50 μm. thickness in between, and preferably about 25 μm.

As mentioned above, the multi-metal substrate (consisting of substrate layer 19 , adhesive layer 50 , substrate layer 49 ) is laminated to substrate 10 using optical adhesive layer 16 , and then top and bottom vias and traces are formed. Through glass vias 20 , 22 are formed through substrate 10 and optical adhesive layer 16 ; optionally, a waveguide material may be deposited to completely fill optical via 20 . The outer surface of the substrate 10 is processed to form a Si oligomer structure, followed by pentagonal ring coordination for stable Pd catalyst deposition; an electronic interface is formed on the outer surface of the substrate 10 . For example, a seed layer composed of nickel phosphorous (Ni-P), copper, silver or any type of metal alloy (eg, Nickel-Chromium) can be applied to the patterned substrate 10 as required. formed on the outer surface. Next, copper wires are plated on the seed layer, and the seed layer 24 and the copper wires 26 are formed on the outer surface of the substrate 10 . The filled through-glass vias 22 connect at least one of the copper wires 26 to at least one of the copper wires 53 on the flexible multi-metal substrate (substrate layer 19).

Likewise, the through holes 60 and 61 pass through the base film 49 and the adhesive film 50 of the flexible multi-metal substrate. The outer surface of substrate 49 is processed to form a polyamic acid layer with a thickness ranging from 5 to 15 nm, followed by Pd catalyst deposition, and then electronic circuit 80 with seed layer 78 is formed on the outer surface of base film layer 49 .

FIG. 5 is a cross-sectional view of a fifth preferred embodiment of the present invention. In this embodiment, there is a folded flexible polyimide substrate 47 (flexible substrate 47 for short). The substrate 10 (or Chip on Film (COF) substrate) is located between the two ends of the folded flexible substrate 47 . On one surface of the substrate 10 is a glass or film on chip packaging substrate, and a waveguide circuit 12 with a micromirror 14 thereon is formed on the glass or film on chip packaging substrate; the optical adhesive layer 14 connects the substrate 10 to the Flexible substrate 47 . On the opposite surface of the substrate 10 , an adhesive film 50 connects the substrate 10 to an opposite arm of the flexible substrate 47 .

Figure 6 is a sectional view of a complete package of the present invention, the flexible circuit board is similar to Figure 1 of the first embodiment. However, it should be understood that any of the first to fifth embodiments may be used in the manufacturing steps now described. Electronic devices 100 such as amplifiers and driver ICs are mounted on top of copper wires 26 on one outer surface of the flexible circuit board; such as a vertical-cavity surface-emitting laser (VCSEL) A type of optoelectronic device 102 and a photo detector (PD) module are mounted on copper wires 26 on the same outer surface of the flexible circuit board. The electronic device 102 is aligned with the optical through-glass hole 20. For example, the electronic device 100, 102 can be mounted to a surface mount device (SMD) 90 by surface mount technology (SMT), the surface mount The technology may be flip chip or wire bonding, for example. The optical interface 104 acts as a waveguide (medium) for incoming signals 106 from any other modules, or for outgoing signals from modules of this package architecture.

Various embodiments of integrated electro-optical flexible circuit boards have been described herein. The electro-optical flexible circuit board of the present invention provides technical features such as high coupling efficiency, low optical attenuation, high-density wiring with significantly reduced size, and multi-layer stacking.

Although the preferred embodiments of the present invention and the details thereof have been disclosed above, those skilled in the art will readily appreciate that various modifications can be made without departing from the spirit of the invention or the scope of the appended claims.

10, 18: Substrate 12, 42: Optical circuits 14, 44: Micromirror 16: Optical Adhesive Layer 19, 49: Substrate layer 20, 22, 40: Through glass hole 24, 28, 51, 56, 62, 66, 72, 78: seed layer 26, 30: copper wire 47: Flexible substrate 50: Adhesive layer 54, 60, 61, 76: Through hole 53, 58, 64, 68, 74: Metal Wire 80: Electronic circuits 90: Surface Mount Devices 100, 102: Electronic devices 104: Optical Interface 106: Signal

Figure 1 is an isometric schematic view of a first preferred embodiment of the present invention. Figure 2 is a schematic isometric view of a second preferred embodiment of the present invention. Figure 3 is a schematic isometric view of a third preferred embodiment of the present invention. Figure 4 is a schematic isometric view of a fourth preferred embodiment of the present invention. Fig. 5 is a cross-sectional view of a fifth preferred embodiment of the present invention. Figure 6 is a cross-sectional view of a complete package of the present invention.

10, 18: Substrate

12: Optical circuit

14: Micromirror

16: Optical Adhesive Layer

20, 40: glass through hole

24, 28: seed layer

26, 30: copper wire

Claims (22)

An integrated electro-optical circuit board includes: a first flexible substrate having a top side and a bottom side; At least one first optical circuit is located on the bottom side of the first flexible substrate, and the bottom side of the first flexible substrate is connected to the bottom side of the first flexible substrate through a filled via top side; at least one first metal wire on the top side of the first flexible substrate; an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate; and At least one second metal wire is located on a bottom side of the second flexible substrate, and the second metal wire passes through a hole passing through the second flexible substrate, the optical adhesive layer and the first flexible substrate The hole is filled to connect to the at least one first metal line. The integrated electro-optical circuit board of claim 1, wherein the first flexible substrate comprises glass or a cyclic olefin polymer (COP) with a thickness of about 12.5-100 μm. The integrated electro-optical circuit board of claim 1, wherein the at least one first optical circuit is a waveguide, and the waveguide includes silicon, silicon dioxide, and gallium arsenide. arsenide), gallium phosphide (gallium phosphide) or a polymer thereof, the at least one first optical circuit has a thickness of 4-15 μm, and the at least one first optical circuit has a higher refractive index than the first optical circuit. Refractive index of a flexible substrate. The integrated electro-optical circuit board of claim 3, further comprising a 45° micro-mirror between the first optical circuit and the filling hole. The integrated electro-optical circuit board according to claim 1, wherein the material of the optical adhesive layer comprises epoxy resins, polyurethanes, silicone elastomers with a thickness of 25 to 50 μm, and is cured by ultraviolet light. acrylics (UV-cured acrylics) or cyanoacrylates (Cyanoacrylates), wherein the refractive index of the optical adhesive layer (refractive index) is the same as the refractive index of the first flexible substrate. The integrated electro-optical circuit board of claim 1, wherein the first metal line and the second metal line comprise copper with a thickness of 4 to 15 μm and nickel phosphide (Ni- P) seed layer (seed layer). The integrated electro-optical circuit board 1 according to claim 1, further comprising: At least one second optical circuit is located on the top side of the second flexible substrate. The integrated electro-optical circuit board of claim 1, wherein the second flexible substrate comprises flexible glass or cyclic olefin polymer (COP) with a thickness of about 12.5-100 μm. The integrated electro-optical circuit board as claimed in claim 1 further comprises: at least one electrical device mounted on the at least one first metal wire; and At least one optoelectronic device is mounted on the at least one first optical circuit. The integrated electro-optical circuit board of claim 9, wherein the at least one electronic device and the at least one optoelectronic device are mounted through surface mount technology (SMT), and the surface mount technology includes flip chip (flip chip) ) and wire bonding. An integrated electro-optical circuit board includes: a first flexible substrate having a top side and a bottom side; at least one first optical circuit is located on the bottom side of the first flexible substrate, and the bottom side of the first flexible substrate is connected to the top side through a filled via; at least one first metal wire on the top side of the first flexible substrate; an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate; and At least one second metal line is located on a top side of the second flexible substrate, and at least one third metal line is located on the bottom side of the second flexible substrate, and the third metal line passes through the second flexible substrate through a The filling hole of the flexible substrate is connected to the at least one second metal wire. The integrated electro-optical circuit board of claim 11, wherein the first flexible substrate comprises glass or a cyclic olefin polymer (COP) with a thickness of 12.5-100 μm. The integrated electro-optical circuit board of claim 11, wherein the at least one first optical circuit is a waveguide, and the waveguide includes silicon, silicon dioxide, and gallium arsenide. arsenide), gallium phosphide (gallium phosphide) or a polymer thereof, the at least one first optical circuit has a thickness of 4-15 μm, and the at least one first optical circuit has a higher refractive index than the first flexible the refractive index of the substrate. The integrated electro-optical circuit board of claim 13, further comprising a 45° micro-mirror between the first optical circuit and the filling hole. The integrated electro-optical circuit board of claim 11, wherein the material of the optical adhesive layer comprises epoxy resins, polyurethanes, and silicones elastomers with a thickness of between 25 and 50 μm, UV-cured acrylics or cyanoacrylates, wherein the refractive index of the optical adhesive layer is the same as the refractive index of the first flexible substrate. The integrated electro-optical circuit board of claim 11, wherein the first metal line, the second metal line, and the third metal line comprise copper with a thickness of 4 to 15 μm and phosphorus with a thickness of 0.01 to 0.5 μm thereunder Nickel (Ni-P) seed layer (seed layer). The integrated electro-optical circuit board of claim 11, wherein the second flexible substrate comprises polyimide (PI), modified polyimide (MPI), liquid crystal polymer (liquid crystal polymer) At least one of crystal polymer (LCP), polyester (PET), polyethylene-naphtalate (PEN), polytetrafluoroethylene (poly tetra fluoro ethylene), or including epoxy Laminate substrates of epoxies, BT, Teflon or modified Teflon layer and have a thickness range of 12.5 to 100um. The integrated electro-optical circuit board of claim 11, wherein the second flexible substrate comprises a multi-metal layer substrate. The integrated electro-optical circuit board of claim 18, wherein the multi-metal layer substrate comprises a third flexible substrate and a fourth flexible substrate, the third flexible substrate and the fourth flexible substrate There is a bonding film between the substrates, wherein the fourth metal line and the fifth metal line are formed on and pass through the third flexible substrate, and the sixth metal line and the seventh metal line are formed on and pass through Through the fourth flexible substrate and the adhesive layer, any one of the third flexible substrate and the fourth flexible substrate includes polyimide (PI), modified polyimide (PI) polyimide (MPI), liquid crystal polymer (LCP), polyester (PET), polyethylene-naphtalate (PEN), polytetrafluoroethylene (poly tetra fluoro ethylene) At least one, or a laminate substrate comprising epoxy, BT, Teflon or modified Teflon layer, and has a thickness ranging from 12.5 to 100 um. The integrated electro-optical circuit board of claim 18, wherein: The multi-metal layer substrate includes a third flexible substrate, the third flexible substrate includes polyimide (PI), modified polyimide (MPI), liquid crystal polymer (liquid crystal polymer) At least one of crystal polymer (LCP), polyester (PET), polyethylene-naphtalate (PEN), polytetrafluoroethylene (poly tetra fluoro ethylene), or including epoxy Laminate substrates of epoxies, BT, Teflon or modified Teflon layer and have a thickness range of 12.5 to 100um; the fourth metal line is formed on and through a first half of the third flexible substrate; The second metal line and the third metal line are formed on and through a second half of the third flexible substrate; an adhesive film connects the first half of the third flexible substrate to a top side of the first flexible substrate; forming an electrical connection between the first metal line and the second metal line; and The optical adhesive layer connects the bottom side of the first flexible substrate to the second half of the third flexible substrate. The integrated electro-optical circuit board as claimed in claim 11, further comprising: at least one electrical device mounted on the at least one first metal wire; and At least one optoelectronic device is mounted on the at least one first optical circuit. The integrated electro-optical circuit board of claim 21, wherein the at least one electronic device and the at least one optoelectronic device are mounted through surface mount technology (SMT), and the surface mount technology includes flip chip (flip chip) ) and wire bonding.

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