TW202220037A - Wafer pre-cleaning apparatus - Google Patents
Wafer pre-cleaning apparatus Download PDFInfo
- Publication number
- TW202220037A TW202220037A TW110127824A TW110127824A TW202220037A TW 202220037 A TW202220037 A TW 202220037A TW 110127824 A TW110127824 A TW 110127824A TW 110127824 A TW110127824 A TW 110127824A TW 202220037 A TW202220037 A TW 202220037A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- fixing ring
- fixing
- accommodating space
- carrier plate
- Prior art date
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
本發明有關於一種晶片預清潔機台,可避免固定環遮擋晶片的邊緣區域,以利於在晶片表面形成均勻且穩定的電漿,以提高預清潔後晶片厚度的均勻度。The present invention relates to a wafer pre-cleaning machine, which can prevent a fixed ring from blocking the edge area of the wafer, so as to facilitate the formation of a uniform and stable plasma on the wafer surface and improve the uniformity of the wafer thickness after pre-cleaning.
在薄膜沉積是半導體製程中常用的技術,例如在化學氣相沉積製程(CVD)及物理氣相沉積製程(PVD),主要用以在晶片的表面形成薄膜。在實際應用時晶片的表面往往會具有氧化層或氧化物,進而影響薄膜沉積的品質。此外若沉積的薄膜與晶片之間存在氧化層或氧化物,亦可能會造成接觸電阻大幅昇高,進行提高晶片損壞的機率。Thin film deposition is a commonly used technique in semiconductor manufacturing, such as chemical vapor deposition (CVD) and physical vapor deposition (PVD), which are mainly used to form thin films on the surface of wafers. In practical applications, the surface of the wafer often has an oxide layer or oxide, which affects the quality of thin film deposition. In addition, if there is an oxide layer or oxide between the deposited film and the wafer, the contact resistance may also be greatly increased, thereby increasing the probability of wafer damage.
為了解決上述的問題,目前業界在進行沉積製程前,通常會對晶片進行預清潔(pre-clean),以除去晶片表面上的氧化層或氧化物。具體而言,可將氬氣通入反應空間,並對反應空間施加磁場以形成氬電漿。而後對承載晶片的承載盤上提供負壓,使得氬離子撞擊晶片,以去除晶片表面的氧化層或氧化物。In order to solve the above problems, before the deposition process is performed in the industry, the wafer is usually pre-cleaned to remove the oxide layer or oxide on the surface of the wafer. Specifically, argon gas may be introduced into the reaction space, and a magnetic field may be applied to the reaction space to form an argon plasma. Then, a negative pressure is applied to the carrier plate that carries the wafer, so that argon ions strike the wafer to remove the oxide layer or oxide on the wafer surface.
然而晶片的邊緣區域會被晶片固定裝置所遮擋,並可能會在晶片固定裝置與晶片的邊緣區域形成擾流,進而造成晶片的中間區域與邊緣區域的蝕刻率不同。具體而言,晶片的中央區域的蝕刻率會高於邊緣區域,使得經過電漿蝕刻的晶片的中央區域的厚度會小於邊緣區域。However, the edge area of the wafer is blocked by the wafer holder, and may cause turbulence between the wafer holder and the edge area of the wafer, thereby causing different etching rates between the middle area and the edge area of the wafer. Specifically, the etch rate of the central region of the wafer is higher than that of the edge region, so that the thickness of the central region of the plasma etched wafer is smaller than that of the edge region.
為了解決上述蝕刻後的晶片厚度不均的問題,本發明提出一種晶片預清潔機台,在預清潔過程中可在晶片的表面形成均勻且穩定的流體,並可避免在晶片的邊緣位置形成擾流,以利於在預清潔後形成厚度均勻的晶片。In order to solve the problem of uneven thickness of the wafer after etching, the present invention proposes a wafer pre-cleaning machine, which can form a uniform and stable fluid on the surface of the wafer during the pre-cleaning process, and can avoid the formation of disturbance on the edge of the wafer. flow to facilitate the formation of wafers of uniform thickness after pre-cleaning.
本發明的一目的,在於提供一種晶片預清潔機台,主要包括一承載盤、一固定環及複數個固定部,其中承載盤的一承載面用以承載至少一晶片,而固定環位於承載盤及晶片的周圍。固定部設置在固定環的上表面,當固定環連接承載盤時,固定部將會接觸承載盤上的晶片,以將晶片固定在承載盤上。此外當固定環連接承載盤時,固定環的上表面的高度不大於承載盤的承載面的高度,或是固定環的上表面的高度高於承載盤的承載面,且兩者之間的高度小於5公釐,以防止固定環遮擋電漿,並可避免電漿在晶片及固定環相鄰的邊緣區域上形成擾流,藉此以提高晶片表面的電漿的均勻度,使得經過預清潔的晶片的各個區域的厚度相近。An object of the present invention is to provide a wafer pre-cleaning machine, which mainly includes a carrier plate, a fixing ring and a plurality of fixing parts, wherein a bearing surface of the carrier plate is used to carry at least one wafer, and the fixing ring is located on the carrier plate. and around the wafer. The fixing portion is arranged on the upper surface of the fixing ring, and when the fixing ring is connected to the carrier plate, the fixing portion will contact the wafer on the carrier plate to fix the wafer on the carrier plate. In addition, when the fixing ring is connected to the bearing plate, the height of the upper surface of the fixing ring is not greater than the height of the bearing surface of the bearing plate, or the height of the upper surface of the fixing ring is higher than the bearing surface of the bearing plate, and the height between the two is higher than that of the bearing plate. Less than 5 mm, to prevent the fixing ring from blocking the plasma, and to prevent the plasma from forming turbulence on the edge area adjacent to the wafer and the fixing ring, thereby improving the uniformity of the plasma on the wafer surface, so that the pre-cleaned The thickness of each region of the wafer is similar.
本發明的一目的,在於提供一種晶片預清潔機台,主要包括一承載盤、一固定環及複數個固定部,其中承載盤的一承載面用以承載至少一晶片,而固定環位於承載盤及晶片的周圍。此外固定環還設置複數個穿孔或凹槽,使得晶片表面的電漿經由承載盤的承載面移動到高度較低的固定環,並經由固定環上的穿孔或凹槽移動到固定環的下方,藉此有利於在晶片的表面形成均勻且穩定的流體及/或電漿,並可提高蝕刻晶片的均勻度。An object of the present invention is to provide a wafer pre-cleaning machine, which mainly includes a carrier plate, a fixing ring and a plurality of fixing parts, wherein a bearing surface of the carrier plate is used to carry at least one wafer, and the fixing ring is located on the carrier plate. and around the wafer. In addition, the fixed ring is also provided with a plurality of perforations or grooves, so that the plasma on the wafer surface moves to the fixed ring with a lower height through the bearing surface of the carrier plate, and moves to the lower part of the fixed ring through the perforations or grooves on the fixed ring, This facilitates the formation of a uniform and stable fluid and/or plasma on the surface of the wafer, and can improve the uniformity of etching the wafer.
本發明的一目的,在於提供一種晶片預清潔機台,其中固定環上設置至少三個定位孔,而腔體內則設置至少三個定位銷。固定環上的定位孔用以對準定位銷,藉此將固定環定位在腔體的容置空間內。An object of the present invention is to provide a wafer pre-cleaning machine, wherein at least three positioning holes are provided on the fixing ring, and at least three positioning pins are provided in the cavity. The positioning holes on the fixing ring are used for aligning the positioning pins, thereby positioning the fixing ring in the accommodating space of the cavity.
本發明的一目的,在於提供一種晶片預清潔機台,其中承載盤、固定環及固定件位於一腔體的容置空間內,並透過一升降裝置連接承載盤,以驅動承載盤相對於固定環及固定件位移。升降裝置可帶動承載盤在一進出料位置及一預清潔位置之間位移,當升降裝置帶動承載盤移動至進出料位置時,可透過一機械手臂將一晶片放置到承載盤上,或者是將承載盤上完成預清潔的晶片取出。而後升降裝置會帶動承載盤及晶片移動到預清潔位置,使得承載盤及晶片位於固定環中間的一容置區域,而固定環上的固定件則會接觸承載盤上的晶片,並將晶片固定在承載盤上,以利於對承載盤上的晶片進行預清潔或蝕刻。An object of the present invention is to provide a wafer pre-cleaning machine, wherein the carrier plate, the fixing ring and the fixing member are located in the accommodating space of a cavity, and the carrier plate is connected through a lifting device to drive the carrier plate relative to the fixed part. Displacement of rings and fixings. The lifting device can drive the carrier plate to move between an in-out position and a pre-cleaning position. When the elevator device drives the carrier plate to move to the in-out position, a wafer can be placed on the carrier plate by a mechanical arm, or a wafer can be placed on the carrier plate. The pre-cleaned wafers on the carrier tray are taken out. Then the lifting device will drive the carrier plate and the wafer to move to the pre-cleaning position, so that the carrier plate and the wafer are located in a accommodating area in the middle of the fixing ring, and the fixing member on the fixing ring will contact the wafer on the carrier plate and fix the wafer. On the carrier tray, to facilitate pre-cleaning or etching of the wafers on the carrier tray.
為了達到上述的目的,本發明提出一種晶片預清潔機台,包括:一腔體,包括一容置空間;一抽氣裝置;至少一抽氣端,流體抽氣裝置及連接腔體的容置空間,其中抽氣裝置經由抽氣端抽出容置空間內的一氣體;至少一進氣端,流體連接腔體的容置空間,並用以將一清潔氣體輸送至容置空間;至少一線圈,與腔體相鄰,並電性連接一交流電源,其中交流電源提供一交流電流給線圈,以在容置空間內形成一磁場,使得容置空間內的清潔氣體受到磁場的作用而形成一電漿;一承載盤,位於容置空間內,承載盤包括一承載面用以承載至少一晶片,其中承載盤電性連接一偏壓電源,並在承載盤上形成一偏壓,使得電漿撞擊承載盤上的晶片,以清潔承載盤承載的晶片;至少一固定環,位於承載盤的周圍或上方,並位於晶片的周圍,其中固定環的一上表面的高度不高於承載盤的承載面;及複數個固定件,連接固定環,其中固定件接觸晶片的一表面,並將晶片固定在承載盤上。In order to achieve the above purpose, the present invention provides a wafer pre-cleaning machine, comprising: a cavity, including an accommodation space; an air extraction device; at least one air extraction end, a fluid extraction device and an accommodation connected to the cavity space, wherein the air extraction device extracts a gas in the accommodating space through the air extraction end; at least one air inlet end is fluidly connected to the accommodating space of the cavity, and is used to deliver a clean gas to the accommodating space; at least one coil, It is adjacent to the cavity and is electrically connected to an AC power supply, wherein the AC power supply provides an AC current to the coil to form a magnetic field in the accommodating space, so that the clean gas in the accommodating space is subjected to the action of the magnetic field to form an electric field. slurry; a carrier plate, located in the accommodating space, the carrier plate includes a bearing surface for carrying at least one wafer, wherein the carrier plate is electrically connected to a bias power source, and a bias voltage is formed on the carrier plate, so that the plasma strikes The wafers on the carrier tray are cleaned to clean the wafers carried by the carrier tray; at least one fixing ring is located around or above the carrier tray, and is located around the wafer, wherein the height of an upper surface of the fixing ring is not higher than the bearing surface of the carrier tray ; and a plurality of fixing pieces connected to the fixing ring, wherein the fixing pieces contact a surface of the wafer and fix the wafer on the carrier plate.
本發明提出另一種晶片預清潔機台,包括:一腔體,包括一容置空間;一抽氣裝置;至少一抽氣端,流體抽氣裝置及連接腔體的容置空間,其中抽氣裝置經由抽氣端抽出容置空間內的一氣體;至少一進氣端,流體連接腔體的容置空間,並用以將一清潔氣體輸送至容置空間;至少一線圈,與腔體相鄰,並電性連接一交流電源,其中交流電源提供一交流電流給線圈,以在容置空間內形成一磁場,使得容置空間內的清潔氣體受到磁場的作用而形成一電漿;一承載盤,位於容置空間內,承載盤包括一承載面用以承載至少一晶片,其中承載盤電性連接一偏壓電源,並在承載盤上形成一偏壓,使得電漿撞擊承載盤上的晶片,以清潔承載盤承載的晶片;;至少一固定環,位於承載盤的周圍或上方,並位於晶片的周圍,其中固定環的一上表面的高度高於承載盤的承載面,且固定環的上表面與承載盤的承載面之間的高度差小於4公釐;及複數個固定件,連接固定環的上表面,其中固定件接觸晶片的一表面,並將晶片固定在承載盤上。The present invention provides another wafer pre-cleaning machine, comprising: a cavity, including an accommodating space; an air extraction device; at least one air extraction end, a fluid air extraction device and an accommodating space connected to the cavity, wherein the air extraction The device extracts a gas in the accommodating space through the suction end; at least one air inlet end is fluidly connected to the accommodating space of the cavity, and is used to deliver a clean gas to the accommodating space; at least one coil is adjacent to the cavity , and is electrically connected to an AC power supply, wherein the AC power supply provides an AC current to the coil to form a magnetic field in the accommodating space, so that the clean gas in the accommodating space is subjected to the action of the magnetic field to form a plasma; a carrying plate , located in the accommodating space, the carrying plate includes a carrying surface for carrying at least one chip, wherein the carrying plate is electrically connected to a bias power source, and a bias voltage is formed on the carrying plate, so that the plasma strikes the chip on the carrying plate , in order to clean the wafer carried by the carrier plate; at least one fixing ring is located around or above the carrier plate, and is located around the wafer, wherein the height of an upper surface of the fixing ring is higher than the bearing surface of the carrier plate, and the height of the fixing ring The height difference between the upper surface and the bearing surface of the carrier plate is less than 4 mm; and a plurality of fixing pieces are connected to the upper surface of the fixing ring, wherein the fixing pieces contact a surface of the wafer and fix the wafer on the carrier plate.
所述的晶片預清潔機台,其中固定環包括至少三個定位孔,並透過定位孔定位固定環及腔體。In the wafer pre-cleaning machine, the fixing ring includes at least three positioning holes, and the fixing ring and the cavity are positioned through the positioning holes.
所述的晶片預清潔機台,其中固定環包括複數個穿孔或複數個凹槽,複數個穿孔或複數個凹槽環繞設置在承載盤的周圍。In the wafer pre-cleaning machine, the fixing ring includes a plurality of perforations or a plurality of grooves, and the plurality of perforations or a plurality of grooves are arranged around the carrier plate.
所述的晶片預清潔機台,還包括一環形構造設置在承載盤上,環狀構造包括至少一環形凹槽,環形構造及環形凹槽環繞設置在承載盤的周圍,而固定環則環繞設置在環形構造的周圍。The wafer pre-cleaning machine also includes an annular structure arranged on the carrier plate, the annular structure includes at least one annular groove, the annular structure and the annular groove are arranged around the carrier plate, and the fixing ring is arranged around the bearing plate. around the ring formation.
所述的晶片預清潔機台,其中環形構造的一內表面連接承載盤,環形構造的一外表面則設置一斜面,而固定環的一內表面設置一斜面與環形構造的外表面的斜面契合。In the wafer pre-cleaning machine, an inner surface of the annular structure is connected to the carrier plate, an outer surface of the annular structure is provided with a slope, and an inner surface of the fixing ring is provided with a slope to fit the slope of the outer surface of the annular structure. .
所述的晶片預清潔機台,其中承載盤包括一凸起部,承載面為凸起部的一頂表面,環形構造套設於承載盤的凸起部,而環形構造的環形凹槽環繞設置在承載盤的凸起部。The wafer pre-cleaning machine, wherein the carrying plate includes a raised portion, the carrying surface is a top surface of the raised portion, the annular structure is sleeved on the raised portion of the carrying plate, and the annular groove of the annular structure surrounds on the raised portion of the carrier tray.
所述的晶片預清潔機台,其中固定件包括一底部及一固定部,底部設置在固定環的上表面,而固定部連接底部,並朝晶片的方向延伸。In the wafer pre-cleaning machine, the fixing member includes a bottom portion and a fixing portion, the bottom portion is arranged on the upper surface of the fixing ring, and the fixing portion is connected to the bottom portion and extends toward the direction of the wafer.
請參閱圖1,為本發明晶片預清潔機台一實施例的剖面示意圖。如圖所示,晶片預清潔機台10主要包括一腔體11、一承載盤13、一固定環15、複數個固定件17及一線圈19,其中腔體11具有一容置空間12,承載盤13、固定環15及固定件17位於腔體11的容置空間12內。Please refer to FIG. 1 , which is a schematic cross-sectional view of an embodiment of a wafer pre-cleaning machine according to the present invention. As shown in the figure, the wafer pre-cleaning
腔體11設置至少一進氣端111及一抽氣端113,其中進氣端111及抽氣端113流體連接腔體11的容置空間12。抽氣端113可連接一抽氣裝置114,並用以抽出容置空間12內的氣體。進氣端111可連接一氣體源112,其中氣體源112可為儲存一清潔氣體的容器,並經由進氣端111將清潔氣體輸送至容置空間12內。例如清潔氣體可為氬氣或其他惰性氣體,而抽氣裝置114可為幫浦,並可於預清潔之前、預清潔當下及/或預清潔後抽出容置空間12內的氣體。The
線圈19電性連接一交流電源191,其中交流電源191提供一交流電流給線圈19,使得線圈19在腔體11的容置空間12內形成一磁場。容置空間12內的清潔氣體受到磁場的作用形成一電漿,例如使得氬氣形成氬離子。線圈19與腔體11相鄰,並位於腔體11的上方或側邊,基本上只要使得線圈19可以在腔體11的容置空間12內產生磁場,並在容置空間12內形成電漿即可。The
承載盤13包括一承載面131用以承載至少一晶片14,承載盤13電性連接一偏壓電源137,其中偏壓電源137用以在承載盤13上形成一電壓,例如偏壓電源137可為交流電源或直流電源。具體而言,承載盤13可為導體,而偏壓電源137則用以在承載盤13形成負電壓,以吸引帶正電的氬離子(Ar+),使得氬離子撞擊承載盤13上的晶片14,藉此以去除晶片14表面的氧化層或氧化物,並達到預清潔(pre-clean)晶片14的目的。The
如圖3至圖4所示,固定環15包括一上表面151、一下表面153、一外表面155及一內表面157,其中上表面151及下表面153可為環形構造。外表面155及內表面157則是連接上表面151及下表面153的側表面,其中外表面155及內表面157的俯視近似圓形,且外表面155的半徑大於內表面157。As shown in FIG. 3 to FIG. 4 , the
複數個固定件17設置在固定環15的上表面151,其中固定件17的數量為三個以上,便可達到固定晶片14的目的。固定件17由固定環15的外表面155朝內表面157的方向延伸,其中有部分的固定件17會凸出固定環15的內表面157。在本發明一實施例中,固定環15的外觀近似圓環狀,而固定件17則沿著固定環15的徑向延伸設置。A plurality of
固定環15可連接承載盤13,並位於承載盤13及/或晶片14的周圍,其中固定環15及固定件13可為陶瓷、石英或金屬材質。當固定環15設置在承載盤13上時,位於固定環15上表面151的固定件17會接觸承載盤13承載的晶片14,藉此將晶片14固定在承載盤13上。The
為了提高晶片14表面蝕刻的均勻性,本發明提出固定環15的上表面151的高度不高於承載盤13的承載面131的高度,或是固定環15的上表面151的高度高於承載盤13的承載面131,但兩者之間的高度小於5公釐,其中承載面131為承載盤13用以承載或接觸晶片14的表面。In order to improve the uniformity of the etching on the surface of the
當固定環15連接承載盤13時,固定環15的內表面157會面對承載盤13,而固定環15的上表面151則約略與承載盤13的承載面131平行。本發明的固定環15的上表面151與承載盤13的承載面131可具有一間隔,其中固定環15的上表面151的高度不高於承載盤13的承載面131,如圖3及圖4所示,固定環15的上表面151的高度低於承載盤13的承載面131。如圖6所示,固定環15的上表面151的高度高於承載盤13的承載面131,但兩者之間的高度小於5公釐。此外亦可如圖5所示,固定環15的上表面151約略與承載盤13的承載面131切齊。圖3至圖6所示的設置方式,皆可避免固定環15遮擋晶片14的邊緣區域,並可減少在晶片14的邊緣區域形成擾流,而有利於提高晶片14表面蝕刻的均勻度。When the
在實際應用時,如圖7及圖8所示,固定環15可設置至少三個定位孔154,而腔體11內可設置至少三個定位銷(未顯示),其中固定環15的定位孔154可對準腔體11的定位銷,並定位及設置在腔體11的容置空間12內。在本發明一實施例中,腔體11內可設置一擋件,並透過擋件承載固定環15,擋件的一端形成一圓形的容置空間,用以容置承載盤13及晶片14,此外擋件上可設置定位銷,以定位擋件及固定環15。盤承載盤13可連接一升降裝置18,其中升降裝置18用以驅動承載盤13及晶片14相對於固定環15位移。In practical application, as shown in FIGS. 7 and 8 , the
具體而言,如圖1所示,升降裝置18可帶動承載盤13下降至入料位置,並透過一機械手臂經由進出料口115將晶片14輸送至承載盤13的承載面131。而後升降裝置18帶動承載盤13及晶片14上升,使得承載盤13接觸及連接固定環15,而承載盤13上的晶片14則會接觸固定件17,並以固定件17將晶片14固定在承載盤13上。Specifically, as shown in FIG. 1 , the lifting
在本發明一實施例中,承載盤13上可設置一環形構造16,其中環形構造16包括一環形凹槽161,環形構造16及環形凹槽161環繞設置在承載盤13的周圍。具體而言,承載盤13包括一凸起部133及一底部135,其中凸起部133設置在底部135上,且底部135的截面積大於凸起部133。承載面131為凸起部133的頂表面,而環形構造16則套設在承載盤13的凸起部133,使得環形構造16及環形凹槽161環繞設置在承載盤13的凸起部133周圍。在不同實施例中,環形構造16亦可整合在承載盤13上,使得環形構造16及承載盤13為單一構件。In an embodiment of the present invention, an
環形構造16可包括一內表面163及一外表面165,其中環形構造16套設在承載盤13的凸起部133時,環形構造16的內表面163會接觸承載盤13的凸起部133的表面,而環形構造16的外表面165則接觸固定環15的內表面157。如圖3及圖4所示,環形構造16的外表面165可為一斜面,而固定環15的內表面157亦為一斜面,其中固定環15的內表面157上的斜面與環形構造16的外表面165的斜面契合,並具有相近的傾斜角度。當升降裝置18驅動承載盤13上升並連接固定環15時,可透過兩者的外表面165及內表面157的斜面,將固定環15引導至承載盤13的固定位置。The
在本發明一實施例中,固定件17可包括一底部171及一固定部173,其中固定件17的底部171連接固定環15的上表面151,而固定部173的一端連接底部171,而另一端則朝著晶片14及/或承載盤13的方向延伸,並凸出固定環15的內表面157。此外固定件17的底部171的寬度、厚度及/或截面積可小於固定部173。In an embodiment of the present invention, the fixing
在本發明另一實施例中,如圖7所示,固定環15上可設置複數個穿孔152,其中各個穿孔152連通固定環15的上表面151及下表面153,並環繞設置在晶片14及承載盤13的周圍。In another embodiment of the present invention, as shown in FIG. 7 , a plurality of through-
本發明的固定環15上表面151的高度不高於承載盤13的承載面131及晶片14的高度,或者是固定環15的上表面151的高度高於承載盤13的承載面131,且兩者之間的高度小於5公釐,使得被承載盤13的電壓吸引的電漿會撞擊晶片14的表面,而後由承載盤13的承載面131移動至固定環15,並進一步由固定環15上的穿孔152輸送至固定環15的下方。如此一來將有利於在承載盤13及晶片14的表面形成均勻且穩定的流體及/或電漿,以提高蝕刻晶片14的均勻度,並可避免先前技術所述晶片的邊緣區域與中央區域的厚度不均的問題。In the present invention, the height of the
在本發明另一實施例中,如圖8所示,亦可於固定環15的邊緣設置複數個凸部156及凹部158,其中凸部156沿著固定環15的徑向向外凸出,並於凸部156上設置定位孔154。凸部156及凹部158以相鄰的方式環繞設置在晶片14及承載盤13的周圍,在實際應用時設置在固定環15上的凹部158及穿孔152可達到相近的功能。In another embodiment of the present invention, as shown in FIG. 8 , a plurality of
以上所述者,僅為本發明之一較佳實施例而已,並非用來限定本發明實施之範圍,即凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Modifications should be included within the scope of the patent application of the present invention.
10:晶片預清潔機台 11:腔體 111:進氣端 112:氣體源 113:抽氣端 114:抽氣裝置 115:進出料口 12:容置空間 13:承載盤 131:承載面 133:凸起部 135:底部 137:偏壓電源 14:晶片 15:固定環 151:上表面 152:穿孔 153:下表面 154:定位孔 155:外表面 156:凸部 157:內表面 158:凹部 16:環形構造 161:環形凹槽 163:內表面 165:外表面 17:固定件 171:底部 173:固定部 18:升降裝置 19:線圈 191:交流電源 10: Wafer pre-cleaning machine 11: Cavity 111: Intake end 112: Gas source 113: exhaust end 114: Air extraction device 115: inlet and outlet 12: Accommodating space 13: Carrier plate 131: Bearing surface 133: Raised part 135: Bottom 137: Bias power supply 14: Wafer 15: Fixed ring 151: Upper surface 152: perforation 153: Lower Surface 154: Positioning hole 155: outer surface 156: convex part 157: inner surface 158: Recess 16: Ring structure 161: Annular groove 163: inner surface 165: outer surface 17: Fixtures 171: Bottom 173: Fixed part 18: Lifting device 19: Coil 191: AC Power
[圖1]為本發明晶片預清潔機台一實施例的剖面示意圖。1 is a schematic cross-sectional view of an embodiment of a wafer pre-cleaning machine according to the present invention.
[圖2]為本發明晶片預清潔機台的固定環、固定件及載台一實施例的立體剖面示意圖。FIG. 2 is a schematic three-dimensional cross-sectional view of an embodiment of the fixing ring, the fixing member and the carrier of the wafer pre-cleaning machine of the present invention.
[圖3]為本發明晶片預清潔機台的固定環、固定件及載台一實施例的剖面示意圖。3 is a schematic cross-sectional view of an embodiment of a fixing ring, a fixing member and a stage of the wafer pre-cleaning machine of the present invention.
[圖4]為本發明晶片預清潔機台的固定環、固定件及載台一實施例的立體剖面示意圖。4 is a schematic three-dimensional cross-sectional view of an embodiment of the fixing ring, the fixing member and the carrier of the wafer pre-cleaning machine of the present invention.
[圖5]為本發明晶片預清潔機台的固定環、固定件及載台又一實施例的剖面示意圖。5 is a schematic cross-sectional view of another embodiment of the fixing ring, the fixing member and the carrier of the wafer pre-cleaning machine according to the present invention.
[圖6]為本發明晶片預清潔機台的固定環、固定件及載台又一實施例的剖面示意圖。6 is a schematic cross-sectional view of another embodiment of the fixing ring, the fixing member and the carrier of the wafer pre-cleaning machine according to the present invention.
[圖7]為本發明晶片預清潔機台的固定環及固定件一實施例的俯視圖。FIG. 7 is a top view of an embodiment of the fixing ring and the fixing member of the wafer pre-cleaning machine of the present invention.
[圖8]為本發明晶片預清潔機台的固定環及固定件又一實施例的俯視圖。8 is a top view of another embodiment of the fixing ring and the fixing member of the wafer pre-cleaning machine of the present invention.
10:晶片預清潔機台 10: Wafer pre-cleaning machine
11:腔體 11: Cavity
111:進氣端 111: Intake end
112:氣體源 112: Gas source
113:抽氣端 113: exhaust end
114:抽氣裝置 114: Air extraction device
115:進出料口 115: inlet and outlet
12:容置空間 12: Accommodating space
13:承載盤 13: Carrier plate
137:偏壓電源 137: Bias power supply
14:晶片 14: Wafer
15:固定環 15: Fixed ring
17:固定件 17: Fixtures
18:升降裝置 18: Lifting device
19:線圈 19: Coil
191:交流電源 191: AC Power
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110127824A TWI761270B (en) | 2020-11-13 | 2020-11-13 | Wafer pre-cleaning apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110127824A TWI761270B (en) | 2020-11-13 | 2020-11-13 | Wafer pre-cleaning apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI761270B TWI761270B (en) | 2022-04-11 |
TW202220037A true TW202220037A (en) | 2022-05-16 |
Family
ID=82199239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110127824A TWI761270B (en) | 2020-11-13 | 2020-11-13 | Wafer pre-cleaning apparatus |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI761270B (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201301124D0 (en) * | 2013-01-22 | 2013-03-06 | Oxford Instr Nanotechnology Tools Ltd | Substrate carrier |
JP6622661B2 (en) * | 2016-06-29 | 2019-12-18 | 東京応化工業株式会社 | Support body separating apparatus and support body separating method |
JP6999368B2 (en) * | 2017-11-01 | 2022-01-18 | 東京エレクトロン株式会社 | Plasma processing equipment |
TWI794475B (en) * | 2018-05-09 | 2023-03-01 | 德商索萊爾有限公司 | Holding device for receiving a plurality of substrates for the treatment of the latter, treatment system, and treatment method |
JP7228989B2 (en) * | 2018-11-05 | 2023-02-27 | 東京エレクトロン株式会社 | PLACE, EDGE RING POSITIONING METHOD, AND SUBSTRATE PROCESSING APPARATUS |
-
2020
- 2020-11-13 TW TW110127824A patent/TWI761270B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI761270B (en) | 2022-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108346614B (en) | Wafer chuck and processing device | |
US10431489B2 (en) | Substrate support apparatus having reduced substrate particle generation | |
JP5638405B2 (en) | Substrate plasma processing method | |
TWI629747B (en) | In-situ removable electrostatic chuck | |
US10903055B2 (en) | Edge ring for bevel polymer reduction | |
TWI762978B (en) | Grounding mechanism for multi-layer for electrostatic chuck, and related methods | |
US20180130692A1 (en) | Substrate holding member | |
TW200938011A (en) | Apparatus and method for depositing electrically conductive pasting material | |
TWI761270B (en) | Wafer pre-cleaning apparatus | |
TWM620754U (en) | Wafer carrying and fixing device and thin film deposition equipment using the wafer carrying and fixing device | |
TWI747611B (en) | Wafer pre-cleaning apparatus | |
TWI799120B (en) | Wafer pre-cleaning apparatus | |
TW202117912A (en) | Substrate support and plasma processing apparatus | |
TWM610049U (en) | Thin film deposition equipment capable of inhibiting dust and shielding component thereof | |
TWI732656B (en) | Wafer fixing mechanism and wafer pre-cleaning machine using the wafer fixing mechanism | |
CN112563164B (en) | Wafer pre-cleaning machine | |
TWM609307U (en) | Chip pre-cleaning machine | |
CN112885738B (en) | Wafer fixing mechanism and wafer pre-cleaning machine using same | |
KR20190001227A (en) | Lightweight vacuum chuck for precise transfer of semiconductor wafers | |
TWI646573B (en) | Focusing ring and plasma processing device | |
KR101310109B1 (en) | Electrostatic Chuck formed pad in edge of ceramic body | |
TWM609424U (en) | Swing type chip fixing mechanism and chip pre-cleaning machine using the same | |
TWI745240B (en) | Wafer carrying and fixing device and thin film deposition equipment using the wafer carrying and fixing device | |
TWM611157U (en) | Wafer fixing mechanism and wafer pre-cleaning machine using the same | |
JP2004134437A (en) | Method and apparatus for manufacturing semiconductor device |