TW202218027A - An assembly and method of handling wafers - Google Patents

An assembly and method of handling wafers Download PDF

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TW202218027A
TW202218027A TW110135187A TW110135187A TW202218027A TW 202218027 A TW202218027 A TW 202218027A TW 110135187 A TW110135187 A TW 110135187A TW 110135187 A TW110135187 A TW 110135187A TW 202218027 A TW202218027 A TW 202218027A
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wafer
wafer holder
station
carrier
holder
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TW110135187A
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Chinese (zh)
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馬西莫 斯卡佩拉
帕斯卡 多瑪
達米恩 科斯特
馬可 歐貝利
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瑞士商伊斯美加半導體控股公司
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Publication of TW202218027A publication Critical patent/TW202218027A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Abstract

According to the present invention there is provided an assembly which comprises, at least a first and second wafer holder each of which can hold a wafer which comprises semiconductor components; a carrier which is selectively operable carry one of said wafer holders to move said wafer holder; an picking station wherein the picking station comprises means to pick semiconductor components from a wafer on the wafer holder; a loading station, wherein the loading station comprises means to load a wafer having semiconductor components onto a wafer holder; an intermediate rest station which comprises an area in which a wafer holder can be parked; a transfer means which is selectively operable to move a wafer holder from the intermediate rest station to the loading station; a controller which is configured to operate said carrier and the transfer means, so that, the carrier moves the second wafer holder from the loading station to the picking station, wherein at the picking station semiconductor components on a wafer held on the second wafer holder can be picked from the wafer; the transfer means moves the first wafer holder from the intermediate rest station to the loading station, after the carrier moves the second wafer holder from the loading station, so that a wafer comprising semiconductor components which are to be picked, is loaded onto the first wafer holder while the semiconductor components on a wafer held on the second wafer holder are picked from the wafer. There is further provided a corresponding method of handling semiconductor wafers.

Description

處理晶圓之總成及方法Assemblies and methods for processing wafers

發明領域Field of Invention

本發明係關於處理半導體晶圓之總成及方法；且特別是關於總成及方法，其中在自位於拾取站處的第一晶圓固持器拾取組件時，將包含待拾取的組件之晶圓裝載至第二晶圓固持器上。The present invention relates to assemblies and methods for processing semiconductor wafers; and in particular to assemblies and methods in which, upon picking up components from a first wafer holder located at a pickup station, a wafer containing the components to be picked will be loaded onto the second wafer holder.

發明背景Background of the Invention

用於處理半導體晶圓之現有總成及方法通常包含載體，載體在裝載站處接收晶圓且將該晶圓輸送至拾取站；在拾取站處，拾取晶圓上的半導體組件且使其移動至可旋轉塔上，可旋轉塔將相應的所拾取組件中之每一者輸送至位於塔的周邊處的一系列處理/測試站。Existing assemblies and methods for processing semiconductor wafers typically include a carrier that receives the wafer at a loading station and delivers the wafer to a pickup station where semiconductor components on the wafer are picked up and moved onto the rotatable tower, which transports each of the respective picked-up components to a series of processing/testing stations located at the perimeter of the tower.

不利的是，當晶圓上的所有半導體組件已被拾取時，塔及處理/測試站在載體自拾取站移動至裝載站時的時段期間，在載體在裝載站處被再裝載新的晶圓(具有更多待拾取的半導體組件)時的時段期間，且在載體再次自裝載站移動回至拾取站時的時段期間經受空閒的停機時間。Disadvantageously, the tower and processing/testing station is reloaded with new wafers at the loading station during the period when the carrier moves from the pickup station to the loading station when all semiconductor components on the wafer have been picked up (with more semiconductor components to be picked up), and during the period when the carrier is again moved from the loading station back to the picking station, is subject to idle downtime.

此外，在用於處理半導體晶圓之現有總成及方法中，裝載晶圓及自載體卸載晶圓是耗時的且常常需要複雜的總成。Furthermore, in existing assemblies and methods for processing semiconductor wafers, loading and unloading wafers from carriers is time-consuming and often requires complex assemblies.

本發明之一目的是消除或減輕與現有晶圓處理總成及用於處理晶圓之現有方法相關聯的缺點中之至少一些。It is an object of the present invention to eliminate or mitigate at least some of the disadvantages associated with existing wafer processing assemblies and existing methods for processing wafers.

發明概要Summary of Invention

根據本發明，提供了一種用於處理半導體晶圓之總成，其具有獨立請求項1中所述的特徵；以及一種處理半導體晶圓之方法，其包含執行請求項13中所述的步驟。According to the invention, there is provided an assembly for processing semiconductor wafers, having the features described in independent claim 1; and a method of processing semiconductor wafers, comprising performing the steps described in claim 13.

附屬請求項陳述了較佳實施例的可選特徵。The dependent claims set forth optional features of the preferred embodiment.

較佳實施例之詳細說明DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

圖1及圖2係根據本發明之示範性實施例之晶圓處理總成1的示範性實施例的透視圖，晶圓處理總成1可用於執行根據根據本發明之示範性實施例之方法。FIGS. 1 and 2 are perspective views of an exemplary embodiment of a wafer processing assembly 1 that may be used to perform a method according to an exemplary embodiment of the present invention, according to an exemplary embodiment of the present invention. .

參考圖1及圖2，可看出，總成1包含第一晶圓固持器2a及第二晶圓固持器2b，其中每一者可固持相應的晶圓3，晶圓3包含半導體組件3a。Referring to Figures 1 and 2, it can be seen that the assembly 1 includes a first wafer holder 2a and a second wafer holder 2b, each of which can hold a corresponding wafer 3, which includes a semiconductor component 3a .

總成1進一步包含載體5，其選擇性地可操作來攜載該等晶圓固持器2a、2b中之一者以將該晶圓固持器移動至總成1內的預定義的不同位置。The assembly 1 further includes a carrier 5 that is selectively operable to carry one of the wafer holders 2a, 2b for moving the wafer holder to predefined different positions within the assembly 1 .

總成包含拾取站7、裝載站8及中間休息站9。拾取站7包含用以自已由載體5送至拾取站之晶圓固持器2a、2b上的晶圓拾取半導體組件的構件。裝載站8包含用以將具有半導體組件的晶圓裝載至位於裝載站8處的晶圓固持器2a、2b上的構件。中間休息站9包含可在其中停放晶圓固持器2a、2b的區域。The assembly includes a pick-up station 7 , a loading station 8 and an intermediate rest station 9 . The pick-up station 7 comprises means for picking up semiconductor components from wafers that have been brought from the carrier 5 to the wafer holders 2a, 2b of the pick-up station. The loading station 8 contains means for loading wafers with semiconductor components onto the wafer holders 2 a, 2 b located at the loading station 8 . The intermediate rest station 9 contains an area in which the wafer holders 2a, 2b can be parked.

應理解，可使用任何適合的構件來拾取組件3a，在此實例中，使用拾取工具上的組件處理頭來拾取組件；然後移動拾取工具上的組件處理頭以將所拾取組件送至在可旋轉塔上的相應組件處理頭下方的位置；可旋轉塔上的組件處理頭然後自拾取工具上的組件處理頭拾取組件。有多個不同的處理及/或測試站位於可旋轉塔的周邊處，且塔交互地旋轉以將每個所拾取組件輸送至每個相應的處理及/或測試站。It will be appreciated that any suitable means may be used to pick up the assembly 3a, in this example, the assembly handling head on the pickup tool is used to pick up the assembly; the assembly handling head on the pickup tool is then moved to deliver the picked up assembly to the rotatable The position below the corresponding component handling head on the tower; the component handling head on the rotatable tower then picks up the component from the component handling head on the picking tool. There are a number of different processing and/or testing stations located at the perimeter of the rotatable tower, and the towers rotate alternately to deliver each picked component to each respective processing and/or testing station.

總成1進一步包含傳輸構件10，其選擇性地可操作來將晶圓固持器2a、2b自中間休息站9移動至裝載站8。在此實例中，傳輸構件10包含位於中間休息站9處的第一對夾緊構件11a,b、位於裝載站8處的第二對夾緊構件12a,b、以及傳輸臂13。傳輸臂13經組配以使得它可選擇性地移動至第一位置及第二位置，其中在該第一位置中，傳輸臂13可與由第一對夾緊構件11a,b固持之晶圓固持器2a,b機械配合以固持該晶圓固持器，且在該第二位置中，位於裝載站8處的第二對夾緊構件12a,b可夾緊由傳輸臂13固持之晶圓固持器2a,b。The assembly 1 further comprises a transfer member 10 selectively operable to move the wafer holders 2a, 2b from the intermediate rest station 9 to the loading station 8 . In this example, the transfer member 10 comprises a first pair of gripping members 11 a, b at the intermediate rest station 9 , a second pair of gripping members 12 a, b at the loading station 8 , and a transfer arm 13 . The transfer arm 13 is configured such that it can be selectively moved to a first position and a second position in which the transfer arm 13 can interact with the wafer held by the first pair of clamping members 11a,b The holders 2a,b mechanically cooperate to hold the wafer holder, and in this second position the second pair of clamping members 12a,b at the loading station 8 can clamp the wafer holder held by the transfer arm 13 device 2a,b.

總成進一步包含控制器20，其可經組配來操作該載體5及傳輸構件10，使得載體5將第二晶圓固持器2b自裝載站8移動至拾取站7，其中在拾取站7處，可自固持在第二晶圓固持器2b上的晶圓3拾取該晶圓上的上的半導體組件3a；且使得在載體5已自裝載站8移動第二晶圓固持器2b之後，傳輸構件10將第一晶圓固持器2a自中間休息站9移動至裝載站8，使得在於拾取站7處拾取固持在第二晶圓固持器2b上的晶圓3上的半導體組件3a時，將包含待拾取的半導體組件3a的晶圓3裝載至第一晶圓固持器2a上。The assembly further includes a controller 20 that can be configured to operate the carrier 5 and the transport member 10 such that the carrier 5 moves the second wafer holder 2b from the loading station 8 to the pick-up station 7, where the pick-up station 7 , the semiconductor assembly 3a on the wafer can be picked up from the wafer 3 held on the second wafer holder 2b; and after the carrier 5 has moved the second wafer holder 2b from the loading station 8, the transfer The member 10 moves the first wafer holder 2a from the intermediate rest station 9 to the loading station 8 so that when picking up the semiconductor assembly 3a on the wafer 3 held on the second wafer holder 2b at the pickup station 7, the The wafer 3 containing the semiconductor components 3a to be picked up is loaded onto the first wafer holder 2a.

在此總成1實施例中，控制器20進一步經組配來操作該載體5及傳輸構件10，使得在已拾取第二晶圓固持器2b上的晶圓3上的所有半導體組件3a之後，載體5將第二晶圓固持器2b自拾取站7移動至中間休息站9；使得在第一晶圓固持器2a位於裝載站8處的同時，第二晶圓固持器2b (它現在固持空的晶圓3 (即，不再具有半導體組件3a的晶圓3))位於中間休息站9處。In this embodiment of the assembly 1, the controller 20 is further configured to operate the carrier 5 and transport member 10 such that after all semiconductor components 3a on the wafer 3 on the second wafer holder 2b have been picked up, The carrier 5 moves the second wafer holder 2b from the pick station 7 to the intermediate rest station 9; so that while the first wafer holder 2a is at the loading station 8, the second wafer holder 2b (which is now holding empty of wafers 3 (ie, wafers 3 that no longer have semiconductor components 3 a ) are located at the intermediate rest station 9 .

應理解，在本申請中，較佳地，晶圓3包含附接至晶圓環的晶圓箔；半導體組件3位於晶圓箔上。It should be understood that in the present application, the wafer 3 preferably comprises a wafer foil attached to a wafer ring; the semiconductor components 3 are located on the wafer foil.

圖3提供第一晶圓固持器2a及第二晶圓固持器2b的透視圖(在圖3中，第一晶圓固持器2a位於中間站9處且第二晶圓固持器2b位於裝載站8處)及載體5的透視圖。第一晶圓固持器2a及第二晶圓固持器2b中之每一者包含：基底平台構件31，其包含突出部分33，晶圓箔3可支撐在突出部分33上，晶圓箔3具有附接至其的半導體組件3a；以及頂部構件34，其中頂部構件具有界定於其中的孔32，孔32可接收基底平台構件31的突出部分33。Figure 3 provides a perspective view of the first wafer holder 2a and the second wafer holder 2b (in Figure 3, the first wafer holder 2a is located at the intermediate station 9 and the second wafer holder 2b is located at the loading station 8) and a perspective view of the carrier 5. Each of the first wafer holder 2a and the second wafer holder 2b includes a base platform member 31 including a protruding portion 33 on which the wafer foil 3 can be supported, the wafer foil 3 having a semiconductor assembly 3a attached thereto; and a top member 34, wherein the top member has a hole 32 defined therein that can receive a protruding portion 33 of the base platform member 31 .

基底平台構件31進一步包含第一邊緣35，且頂部構件34包含第二邊緣36，且其中基底平台構件31及頂部構件34可經選擇性地配置來夾緊晶圓箔3所附接至的晶圓環；且其中當基底平台構件31及頂部構件34經選擇性地配置來夾緊晶圓環時，基底平台構件31的突出部分33向界定於頂部構件34中的孔32中突出，使得附接至晶圓環的晶圓箔被拉伸。The base platform member 31 further includes a first edge 35, and the top member 34 includes a second edge 36, and wherein the base platform member 31 and the top member 34 can be selectively configured to clamp the wafer to which the wafer foil 3 is attached. and wherein when the base platform member 31 and the top member 34 are selectively configured to clamp the wafer ring, the protruding portion 33 of the base platform member 31 projects into the hole 32 defined in the top member 34 so that the attachment The wafer foil attached to the wafer ring is stretched.

第一晶圓固持器2a及第二晶圓固持器2b中之每一者包含可旋轉台39，其中基底平台構件31附接至台39；其中該台39包含邊緣構件38。Each of the first wafer holder 2a and the second wafer holder 2b includes a rotatable table 39 to which the base platform member 31 is attached; wherein the table 39 includes an edge member 38 .

圖3亦展示出載體5包含致動器37；當晶圓固持器2a,b支撐在載體5上時，致動器37可與相應的晶圓固持器2a,b的邊緣構件38機械配合；且致動器可經選擇性地操作來旋轉該晶圓固持器2a,b的台39。如所展示，致動器37包含輪構件40，輪構件40包含溝槽41，且其中溝槽41所具有的尺寸使得當晶圓固持器2a,b支撐在載體5上時，台39的邊緣構件38抵接界定了溝槽41的表面；當致動器37經致動時，輪構件40旋轉，且輪構件40的旋轉將力施加至晶圓固持器2a,b的台39的邊緣構件38以實現台39的旋轉。3 also shows that the carrier 5 comprises actuators 37; when the wafer holders 2a,b are supported on the carrier 5, the actuators 37 can mechanically cooperate with the edge members 38 of the corresponding wafer holders 2a,b; And the actuators are selectively operable to rotate the stage 39 of the wafer holders 2a,b. As shown, the actuator 37 includes a wheel member 40 that includes a groove 41, and wherein the groove 41 has dimensions such that when the wafer holders 2a, b are supported on the carrier 5, the edge of the table 39 The member 38 abuts the surface defining the groove 41; when the actuator 37 is actuated, the wheel member 40 rotates, and the rotation of the wheel member 40 applies a force to the edge members of the table 39 of the wafer holders 2a,b 38 to achieve the rotation of the table 39.

致動器37進一步包含偏壓構件43(在此實例中，其包含彈簧43)，當晶圓固持器2a,b支撐在載體5上時，偏壓構件43將輪構件40朝向抵接台39之邊緣構件38偏壓。致動器37進一步包含槓桿構件43b，其經組配以使得當力施加至槓桿構件43b時，輪構件40抵抗偏壓構件43而在離開邊緣構件38的方向上移動。The actuator 37 further includes a biasing member 43 (which in this example includes a spring 43 ) which urges the wheel member 40 towards the abutment table 39 when the wafer holders 2a,b are supported on the carrier 5 The edge member 38 is biased. The actuator 37 further includes a lever member 43b configured such that when a force is applied to the lever member 43b, the wheel member 40 moves in a direction away from the edge member 38 against the biasing member 43 .

再次參考圖1，可看出，總成1進一步包含第一凸輪構件48a及第二凸輪構件48b。第一凸輪構件48a經定位以使得當載體5向中間休息站9中移動時，載體5向中間休息站9中的移動致使第一凸輪構件48a將力施加至屬於載體5之致動器37的槓桿構件43b，使得輪構件40抵抗偏壓構件43而在離開支撐在載體5上之晶圓固持器2a,b的邊緣構件38的方向上移動，然後，位於中間休息站9處的第一對夾緊構件11a,b將晶圓固持器2a,b從載體5中移出。總成進一步包含第二凸輪構件48b。第二凸輪構件48b經定位以使得當載體5向裝載站8中移動時，載體5向裝載站8中的移動致使第二凸輪構件48b將力施加至屬於載體5之致動器37的槓桿構件43b，使得輪構件40抵抗偏壓構件而移動，使得輪構件40從正在裝載站8處傳遞至載體5上之晶圓固持器2a,b的台39的邊緣構件38的路徑中移出；隨後，當載體5從裝載站8中移出時，第二凸輪構件48b施加至槓桿構件43b的力被移除且偏壓構件43使輪構件40移動以抵接已在裝載站8處傳遞至載體5上之晶圓固持器2a,b的台39的邊緣構件38。Referring again to Figure 1, it can be seen that the assembly 1 further includes a first cam member 48a and a second cam member 48b. The first cam member 48a is positioned such that when the carrier 5 is moved into the intermediate rest station 9, the movement of the carrier 5 into the intermediate rest station 9 causes the first cam member 48a to apply a force to the actuator 37 belonging to the carrier 5. Lever member 43b so that the wheel member 40 moves against the biasing member 43 in a direction away from the edge members 38 of the wafer holders 2a,b supported on the carrier 5, then the first pair at the intermediate rest stop 9 The clamping members 11a,b move the wafer holders 2a,b out of the carrier 5 . The assembly further includes a second cam member 48b. The second cam member 48b is positioned such that when the carrier 5 is moved into the loading station 8, the movement of the carrier 5 into the loading station 8 causes the second cam member 48b to apply a force to the lever member belonging to the actuator 37 of the carrier 5 43b, the wheel member 40 is moved against the biasing member so that the wheel member 40 is moved out of the path of the edge member 38 being transferred at the loading station 8 to the stage 39 of the wafer holders 2a,b on the carrier 5; then, When the carrier 5 is removed from the loading station 8, the force applied by the second cam member 48b to the lever member 43b is removed and the biasing member 43 moves the wheel member 40 into abutment that has been transferred to the carrier 5 at the loading station 8 The edge member 38 of the table 39 of the wafer holders 2a,b.

總成1可用於執行根據本發明之另一態樣之晶圓處理方法。應理解，本發明之方法不限於要求使用總成1，而是可使用任何適合的總成來執行本發明之該方法。將描述方法之示範性實施例，其使用上文所描述之總成1。在下文中，將描述方法之特定實施例，然而應理解，唯有在本申請案之獨立方法請求項中陳述的方法步驟是本發明必不可少的，所有其他所描述之方法步驟是可選的步驟。The assembly 1 can be used to perform a wafer processing method according to another aspect of the present invention. It should be understood that the method of the present invention is not limited to requiring the use of assembly 1, but any suitable assembly may be used to perform the method of the present invention. An exemplary embodiment of a method will be described using the assembly 1 described above. In the following, specific embodiments of the method will be described, however it should be understood that only the method steps stated in the independent method claim of the present application are essential to the present invention, all other described method steps are optional step.

本發明之方法之較佳實施例包含以下步驟， 在已於拾取站處拾取第一晶圓固持器2a上的晶圓3的半導體組件3a之後，將第一晶圓固持器2a自拾取站7移動至中間休息站9 (如圖4所例示)； 在中間休息站9處將第一晶圓固持器2a自載體5傳輸至傳輸構件10；圖5及圖6例示出當載體5使第一晶圓固持器2a向中間休息站中移動時，載體5之致動器37及第一凸輪48a的操作；因此，在方法之此階段處，在第二晶圓固持器2b位於裝載站8處的同時，第一晶圓固持器2a位於中間休息站9處。圖5及圖6例示出當載體5使第一晶圓固持器2a向中間休息站中移動時，載體5之致動器37及第一凸輪48a的操作。如圖5及圖6所例示，載體5向中間休息站9中的移動致使第一凸輪構件48a將力施加至屬於載體5之致動器37的槓桿構件43b，使得輪構件40抵抗偏壓構件43而在離開支撐在載體5上之第一晶圓固持器2a的邊緣構件38的方向上移動；然後，位於中間休息站9處的第一對夾緊構件11a,b將第一晶圓固持器2a從載體5中移出(如圖7a所展示)。 A preferred embodiment of the method of the present invention comprises the following steps, After the semiconductor assembly 3a of the wafer 3 on the first wafer holder 2a has been picked up at the pickup station, the first wafer holder 2a is moved from the pickup station 7 to the intermediate rest station 9 (as illustrated in FIG. 4 ) ; The first wafer holder 2a is transferred from the carrier 5 to the transfer member 10 at the intermediate rest station 9; FIGS. 5 and 6 illustrate the carrier 5 when the first wafer holder 2a is moved into the intermediate rest station by the carrier 5 5 of the operation of the actuator 37 and the first cam 48a; thus, at this stage of the method, the first wafer holder 2a is at the intermediate rest station while the second wafer holder 2b is at the loading station 8 9 places. 5 and 6 illustrate the operation of the actuator 37 of the carrier 5 and the first cam 48a when the carrier 5 moves the first wafer holder 2a into the intermediate rest station. As illustrated in Figures 5 and 6, the movement of the carrier 5 into the intermediate rest station 9 causes the first cam member 48a to apply a force to the lever member 43b of the actuator 37 belonging to the carrier 5, causing the wheel member 40 to oppose the biasing member 43 while moving away from the edge member 38 of the first wafer holder 2a supported on the carrier 5; the first wafer is then held by the first pair of clamping members 11a,b located at the intermediate rest station 9 The device 2a is removed from the carrier 5 (as shown in Figure 7a).

位於中間休息站9處的第一對夾緊構件11a,b移動第一晶圓固持器2a，自第一對夾緊構件11a,b傳輸至傳輸臂13；使得傳輸臂13現在固持第一晶圓固持器2a。如圖7b所展示，在第一對夾緊構件11a,b將第一晶圓固持器2a從載體5中移出之後，載體然後自中間休息站9移動至在裝載站8處的第二晶圓固持器2b下方的位置。重要的是，第二晶圓固持器2b已裝載有包含待拾取的半導體組件3a的晶圓3，且已在裝載站8中由第二對夾緊構件12a,b移動至升高位置以允許有足夠的空間供載體在第二晶圓固持器2b下方移動(因此，方法進一步包含以下步驟：給第二晶圓固持器2b裝載包含待拾取的半導體組件3a的晶圓3，以及使用第二對夾緊構件12a,b將第二晶圓固持器2b移動至裝載站8中的位置以允許有足夠的空間供載體在第二晶圓固持器2b下方移動)。如圖8所例示，第二對夾緊構件12a,b然後移動以在裝載站處將第二晶圓固持器2b傳遞至載體5上。圖8亦例示出當載體5向裝載站中移動且第二晶圓固持器被置放至載體5上時，載體5上的致動器37及第二凸輪48b的操作。當載體5向裝載站8中移動時，載體5向裝載站8中的移動致使第二凸輪構件48b將力施加至屬於載體5之致動器37的槓桿構件43b，使得輪構件40抵抗偏壓構件43而移動，使得輪構件40從正在裝載站8處傳遞至載體5上之第二晶圓固持器2b的台39的邊緣構件38的路徑中移出；隨後，當載體5從裝載站8中移出時，第二凸輪構件48b施加至槓桿構件43b的力被移除且偏壓構件43使輪構件40移動以抵接第二晶圓固持器2b的台39的邊緣構件38。The first pair of clamping members 11a,b at the intermediate rest station 9 moves the first wafer holder 2a from the first pair of clamping members 11a,b to the transfer arm 13; so that the transfer arm 13 now holds the first wafer Round holder 2a. After the first pair of clamping members 11a,b has removed the first wafer holder 2a from the carrier 5, the carrier is then moved from the intermediate rest station 9 to the second wafer at the loading station 8 as shown in FIG. 7b The position below the holder 2b. It is important that the second wafer holder 2b has been loaded with the wafer 3 containing the semiconductor components 3a to be picked up, and has been moved in the loading station 8 by the second pair of clamping members 12a,b to the raised position to allow There is enough space for the carrier to move under the second wafer holder 2b (therefore, the method further comprises the steps of: loading the second wafer holder 2b with the wafer 3 containing the semiconductor components 3a to be picked up, and using the second wafer holder 2b The second wafer holder 2b is moved to a position in the loading station 8 for the clamping members 12a,b to allow sufficient space for the carrier to move under the second wafer holder 2b). As illustrated in Figure 8, the second pair of clamping members 12a,b is then moved to transfer the second wafer holder 2b onto the carrier 5 at the loading station. FIG. 8 also illustrates the operation of the actuator 37 and the second cam 48b on the carrier 5 when the carrier 5 is moved into the loading station and the second wafer holder is placed on the carrier 5 . When the carrier 5 is moved into the loading station 8, the movement of the carrier 5 into the loading station 8 causes the second cam member 48b to apply a force to the lever member 43b of the actuator 37 belonging to the carrier 5 so that the wheel member 40 resists the bias member 43 so that the wheel member 40 is moved out of the path of the edge member 38 of the stage 39 being transferred to the second wafer holder 2b on the carrier 5 at the loading station 8; Upon removal, the force applied by the second cam member 48b to the lever member 43b is removed and the biasing member 43 moves the wheel member 40 to abut the edge member 38 of the table 39 of the second wafer holder 2b.

方法包含以下步驟， 在包含待拾取的半導體組件3a的晶圓3已裝載至第二晶圓固持器2b上之後，使用載體將第二晶圓固持器2b自裝載站8移動至拾取站7(如圖9所例示)； 在載體5自裝載站移動第二晶圓固持器2b之後，使用傳輸構件10將第一晶圓固持器2a自中間休息站9移動至裝載站8 (如圖10及圖11所例示)； 在拾取站處自固持在第二晶圓固持器2b上的晶圓3拾取半導體組件3a； 在於拾取站7處自固持在第二晶圓固持器2b上的晶圓3拾取該晶圓上的半導體組件3a時，在裝載站8處將包含待拾取的半導體組件3a的晶圓3裝載至第一晶圓固持器2a上(如圖12至圖14所例示)。 The method contains the following steps, After the wafer 3 containing the semiconductor components 3a to be picked up has been loaded onto the second wafer holder 2b, the second wafer holder 2b is moved from the loading station 8 to the pickup station 7 using a carrier (as illustrated in FIG. 9 ) ); After the carrier 5 moves the second wafer holder 2b from the loading station, the transfer member 10 is used to move the first wafer holder 2a from the intermediate rest station 9 to the loading station 8 (as illustrated in FIGS. 10 and 11 ); Picking up the semiconductor assembly 3a from the wafer 3 held on the second wafer holder 2b at the pick-up station; While picking up the semiconductor component 3a on the wafer from the wafer 3 held on the second wafer holder 2b at the pickup station 7, the wafer 3 containing the semiconductor component 3a to be picked up is loaded at the loading station 8 to on the first wafer holder 2a (as illustrated in FIGS. 12 to 14).

較佳方法進一步包含以下步驟， 在已拾取第二晶圓固持器2b上的晶圓3上的半導體組件3a之後，將第二晶圓固持器2b自拾取站7移動至中間休息站9；使得在方法之此階段處，在第一晶圓固持器2a位於裝載站8處的同時，第二晶圓固持器2b位於中間休息站9處； 在中間休息站9處將第二晶圓固持器2b自載體5傳輸至傳輸構件10； 將載體5自中間休息站9移動至裝載站8，且在裝載站8處將第一晶圓固持器2a傳輸至載體5上(在包含待拾取的半導體組件3a的晶圓3已裝載至第一晶圓固持器2a上之後)； 使用載體5將第一晶圓固持器2a (它現在固持具有將要在拾取站7處拾取的半導體組件3a的晶圓3)自裝載站8移動至拾取站7； 在載體自裝載站8移動第一晶圓固持器2a之後，使用傳輸構件10將第二晶圓固持器2b自中間休息站移動至裝載站8； 在拾取站8處自固持在第一晶圓固持器2a上的晶圓3拾取半導體組件； 在於拾取站7處拾取固持在第一晶圓固持器2a上的晶圓3上的半導體組件3a時，在裝載站8處將包含待拾取的半導體組件3a的晶圓3裝載至第二晶圓固持器2b上。 The preferred method further comprises the following steps, After the semiconductor assembly 3a on the wafer 3 on the second wafer holder 2b has been picked up, the second wafer holder 2b is moved from the pick-up station 7 to the intermediate rest station 9; such that at this stage of the method, at While the first wafer holder 2a is located at the loading station 8, the second wafer holder 2b is located at the intermediate rest station 9; transfer of the second wafer holder 2b from the carrier 5 to the transfer member 10 at the intermediate rest station 9; The carrier 5 is moved from the intermediate rest station 9 to the loading station 8, and at the loading station 8 the first wafer holder 2a is transferred onto the carrier 5 (after the wafer 3 containing the semiconductor components 3a to be picked up has been loaded on the after a wafer holder 2a); moving the first wafer holder 2a, which now holds the wafer 3 with the semiconductor components 3a to be picked up at the pick-up station 7, from the loading station 8 to the pick-up station 7 using the carrier 5; After the carrier has moved the first wafer holder 2a from the loading station 8, the transfer member 10 is used to move the second wafer holder 2b from the intermediate rest station to the loading station 8; Pick-up of semiconductor components at pick-up station 8 from wafer 3 held on first wafer holder 2a; While picking up the semiconductor components 3a on the wafer 3 held on the first wafer holder 2a at the pickup station 7, the wafer 3 containing the semiconductor components 3a to be picked up is loaded at the loading station 8 to the second wafer on the holder 2b.

在最佳的實施例中，將上文所提及之步驟重複多次。In a preferred embodiment, the above-mentioned steps are repeated multiple times.

如上文已提及，較佳地，晶圓3包含附接至晶圓環的晶圓箔；半導體組件3位於晶圓箔上。As already mentioned above, the wafer 3 preferably comprises a wafer foil attached to a wafer ring; the semiconductor components 3 are located on the wafer foil.

在裝載站8處將包含待拾取的半導體組件3a的晶圓3裝載至第一晶圓固持器2a上的步驟較佳地包含：將晶圓3傳輸至第一晶圓固持器2a的基底平台構件31上，晶圓3包含晶圓環，晶圓環包含附接至其的晶圓箔，且晶圓3包含附接至晶圓箔的半導體組件；以及移動第一晶圓固持器2a的頂部構件34，使得晶圓環夾緊在第一晶圓固持器2a的基底平台構件31與頂部構件34之間；以及使基底平台構件31的突出部分33向界定於頂部構件34中的孔32中移動，使得晶圓箔被拉伸。類似地，在裝載站8處將包含待拾取的半導體組件3a的晶圓3裝載至第二晶圓固持器2b上的步驟包含：將晶圓3傳輸至第二晶圓固持器2b的基底平台構件32上，晶圓3包含晶圓環，晶圓環包含附接至其的晶圓箔，且晶圓3包含附接至晶圓箔的半導體組件；以及移動第二晶圓固持器2b的頂部構件34，使得晶圓環夾緊在第二晶圓固持器2b的基底平台構件31與頂部構件34之間；以及使基底平台構件31的突出部分33向界定於頂部構件34中的孔32中移動，使得晶圓箔被拉伸。The step of loading the wafers 3 containing the semiconductor components 3a to be picked up onto the first wafer holder 2a at the loading station 8 preferably comprises: transferring the wafers 3 to the base platform of the first wafer holder 2a On the member 31, the wafer 3 includes a wafer ring, the wafer ring includes the wafer foil attached thereto, and the wafer 3 includes the semiconductor components attached to the wafer foil; and the first wafer holder 2a is moved. the top member 34 so that the wafer ring is clamped between the base platform member 31 and the top member 34 of the first wafer holder 2a; moving in so that the wafer foil is stretched. Similarly, the step of loading the wafers 3 containing the semiconductor components 3a to be picked up onto the second wafer holder 2b at the loading station 8 comprises: transferring the wafers 3 to the base platform of the second wafer holder 2b On member 32, wafer 3 includes a wafer ring that includes wafer foils attached thereto, and wafer 3 includes semiconductor components attached to the wafer foils; and a moving second wafer holder 2b the top member 34 so that the wafer ring is clamped between the base platform member 31 and the top member 34 of the second wafer holder 2b; moving in so that the wafer foil is stretched.

在裝載站8處將包含待拾取的半導體組件3a的晶圓3裝載至第一晶圓固持器2a上的步驟在圖12至圖14中例示出；更精確地，圖12例示出空的晶圓(即，已在拾取站7處自其拾取了所有半導體組件的晶圓)的卸載，且圖13例示出將包含待拾取的半導體組件3a之新的晶圓裝載至第一晶圓固持器2a上，且圖14例示出第一晶圓固持器的閉合，使得晶圓牢固地固持在第一晶圓固持器上且晶圓的晶圓箔被拉伸。應理解，雖然圖12至圖14例示出在裝載站8處將包含待拾取的半導體組件3a的晶圓3裝載至第一晶圓固持器2a上的步驟，但是當在裝載站8處將包含待拾取的半導體組件3a的晶圓3裝載至第二晶圓固持器2b上時，執行相同的步驟。參考圖12，為了自第一晶圓固持器2a卸載空的晶圓，將第一晶圓固持器2a的頂部構件34從基底平台構件31移開，使得第一晶圓固持器2a上的空的晶圓3之晶圓環60被鬆開；一旦鬆開，就將空的晶圓3自第一晶圓固持器2a移動至匣61a中。參考圖13，然後將包含待拾取的半導體組件3a的新的晶圓3自匣61a移動至第一晶圓固持器2a中；具體而言，將新的晶圓3移動至第一晶圓固持器2a的基底平台構件31上，使得新的晶圓3定位在第一晶圓固持器2a的頂部構件34與基底平台構件31之間。參考圖14，使第一晶圓固持器2a的頂部構件34朝向基底平台構件31移動，使得新的晶圓3的晶圓環60夾緊在基底平台構件31的第一邊緣35與頂部構件34的第二邊緣36之間；此夾緊確保新的晶圓3牢固地固持在第一晶圓固持器2a上。另外，當第一晶圓固持器2a的頂部構件34朝向基底平台構件31移動時，基底平台構件31的突出部分33向界定於頂部構件34中的孔32中突出，使得新的晶圓3的晶圓箔60b被拉伸，晶圓箔60b附接至新的晶圓的晶圓環60。The step of loading the wafer 3 containing the semiconductor components 3a to be picked up onto the first wafer holder 2a at the loading station 8 is illustrated in FIGS. 12 to 14; more precisely, FIG. 12 illustrates an empty wafer unloading of the circle (ie the wafer from which all semiconductor components have been picked up at the pick station 7), and FIG. 13 illustrates the loading of a new wafer containing the semiconductor components 3a to be picked up to the first wafer holder 2a, and FIG. 14 illustrates the closure of the first wafer holder so that the wafer is held firmly on the first wafer holder and the wafer foil of the wafer is stretched. It should be understood that although FIGS. 12 to 14 illustrate the step of loading the wafer 3 containing the semiconductor components 3 a to be picked up onto the first wafer holder 2 a at the loading station 8 , when the loading station 8 will contain The same steps are performed when the wafers 3 of the semiconductor components 3a to be picked up are loaded onto the second wafer holder 2b. 12, in order to unload the empty wafer from the first wafer holder 2a, the top member 34 of the first wafer holder 2a is moved away from the base platform member 31, so that the empty space on the first wafer holder 2a is removed. The wafer ring 60 of the empty wafer 3 is released; once released, the empty wafer 3 is moved from the first wafer holder 2a into the cassette 61a. Referring to FIG. 13, a new wafer 3 containing the semiconductor components 3a to be picked up is then moved from the cassette 61a into the first wafer holder 2a; in particular, the new wafer 3 is moved to the first wafer holder on the base platform member 31 of the first wafer holder 2a so that the new wafer 3 is positioned between the top member 34 and the base platform member 31 of the first wafer holder 2a. 14, the top member 34 of the first wafer holder 2a is moved toward the base platform member 31 so that the wafer ring 60 of the new wafer 3 is clamped between the first edge 35 of the base platform member 31 and the top member 34 between the second edges 36 of the first wafer; this clamping ensures that the new wafer 3 is securely held on the first wafer holder 2a. In addition, when the top member 34 of the first wafer holder 2a is moved toward the base platform member 31, the protruding portion 33 of the base platform member 31 protrudes into the hole 32 defined in the top member 34, so that the new wafer 3 is The wafer foil 60b is stretched and the wafer foil 60b is attached to the wafer ring 60 of the new wafer.

在中間休息站9處將第二晶圓固持器2b自載體5傳輸至傳輸構件10的步驟包含：使用位於中間休息站9處的第一對夾緊構件11a,b夾緊第二晶圓固持器2b；使用第一對夾緊構件11a,b使第二晶圓固持器2b朝向傳輸臂13移動，使得傳輸臂13與第二晶圓固持器2b機械配合；以及然後將第一對夾緊構件11a,b從第二晶圓固持器2b移開，使得第二晶圓固持器2b僅僅由傳輸臂13固持。The step of transferring the second wafer holder 2b from the carrier 5 to the transfer member 10 at the intermediate rest station 9 comprises clamping the second wafer holder with the first pair of clamping members 11a,b located at the intermediate rest station 9 move the second wafer holder 2b towards the transfer arm 13 using the first pair of clamping members 11a,b so that the transfer arm 13 mechanically engages the second wafer holder 2b; and then clamp the first pair The members 11a,b are moved away from the second wafer holder 2b so that the second wafer holder 2b is held by the transfer arm 13 only.

在中間休息站9處將第一晶圓固持器2a自載體5傳輸至傳輸構件10的步驟包含：使用位於中間休息站9處的第一對夾緊構件11a,b夾緊第一晶圓固持器2a；使用第一對夾緊構件11a,b使第一晶圓固持器2a朝向傳輸臂13移動，使得傳輸臂13與第一晶圓固持器2a機械配合；以及然後將第一對夾緊構件11a,b從第一晶圓固持器2a移開，使得第一晶圓固持器2a僅僅由傳輸臂13固持。The step of transferring the first wafer holder 2a from the carrier 5 to the transfer member 10 at the intermediate rest station 9 comprises clamping the first wafer holder with a first pair of clamping members 11a,b located at the intermediate rest station 9 using the first pair of clamping members 11a,b to move the first wafer holder 2a towards the transfer arm 13 so that the transfer arm 13 mechanically cooperates with the first wafer holder 2a; and then clamping the first pair The members 11a,b are moved away from the first wafer holder 2a so that the first wafer holder 2a is held by the transfer arm 13 only.

在實施例中，使用傳輸構件10將第一晶圓固持器2a自中間休息站9移動至裝載站8的步驟包含：移動傳輸臂13，使得傳輸臂13將第一晶圓固持器2a自中間休息站9移動至裝載站8。如圖10所例示，中間休息站9處的第一對夾緊構件11a,b自載體5提升第一晶圓固持器2a；第一對夾緊構件11a,b移動第一晶圓固持器2a，使得第一晶圓固持器2a被傳輸至傳輸臂13。傳輸臂13然後沿著軌道13b自中間休息站9移動至裝載站8，從而將第一晶圓固持器2a自中間休息站9輸送至裝載站8。在裝載站8處，第二對夾緊構件12a,b移動來夾緊由傳輸臂13固持的第一晶圓固持器2a，一旦第二對夾緊構件12a,b已夾緊第一晶圓固持器2a，就自傳輸臂13釋放第一晶圓固持器2a，使得第一晶圓固持器2a僅僅由第二對夾緊構件12a,b固持。傳輸臂13然後沿著軌道13b自裝載站8移動回到中間休息站9。在較佳實施例中，如圖11所展示，第二對夾緊構件12a,b使第一晶圓固持器2a離開傳輸臂13向下移動，使得第一晶圓固持器2a不會阻礙傳輸臂13自裝載站8回到中間休息站9的移動。類似地，在實施例中，使用傳輸構件10將第二晶圓固持器2b自中間休息站9移動至裝載站8的步驟包含：移動傳輸臂13，使得傳輸臂13將第二晶圓固持器2b自中間休息站9移動至裝載站8。應理解，當將第二晶圓固持器2b自中間休息站9移動至裝載站8時，執行與上文所描述相同的步驟。In an embodiment, the step of using the transfer member 10 to move the first wafer holder 2a from the intermediate rest station 9 to the loading station 8 includes moving the transfer arm 13 such that the transfer arm 13 moves the first wafer holder 2a from the intermediate rest station 9 Rest station 9 is moved to loading station 8 . 10, the first pair of clamping members 11a,b at the intermediate rest station 9 lifts the first wafer holder 2a from the carrier 5; the first pair of clamping members 11a,b moves the first wafer holder 2a , so that the first wafer holder 2 a is transferred to the transfer arm 13 . The transfer arm 13 then moves from the intermediate rest station 9 to the loading station 8 along the track 13b, thereby transporting the first wafer holder 2a from the intermediate rest station 9 to the loading station 8 . At the loading station 8, the second pair of gripping members 12a,b moves to grip the first wafer holder 2a held by the transfer arm 13, once the second pair of gripping members 12a,b has gripped the first wafer The holder 2a, the first wafer holder 2a is released from the transfer arm 13, so that the first wafer holder 2a is held only by the second pair of clamping members 12a,b. The transfer arm 13 is then moved from the loading station 8 back to the intermediate rest station 9 along the track 13b. In a preferred embodiment, as shown in FIG. 11 , the second pair of clamping members 12a,b moves the first wafer holder 2a away from the transfer arm 13 downwardly so that the first wafer holder 2a does not obstruct the transfer Movement of the arm 13 from the loading station 8 back to the intermediate rest station 9 . Similarly, in an embodiment, the step of using the transfer member 10 to move the second wafer holder 2b from the intermediate rest station 9 to the loading station 8 includes moving the transfer arm 13 such that the transfer arm 13 moves the second wafer holder 2b 2b is moved from the intermediate rest station 9 to the loading station 8. It should be understood that when moving the second wafer holder 2b from the intermediate rest station 9 to the loading station 8, the same steps as described above are performed.

方法較佳地包含以下步驟：在傳輸構件10將第二晶圓固持器2b自中間休息站9移動至裝載站8之後，使用位於裝載站8處的第二對夾緊構件12a,b夾緊第二晶圓固持器2b；以及使用第二對夾緊構件12a,b將第二晶圓固持器2b從傳輸臂13移開，使得第二晶圓固持器2b僅僅由第二對夾緊構件12a,b固持。類似地，方法較佳地包含以下步驟：在傳輸構件10將第一晶圓固持器2a自中間休息站9移動至裝載站8之後，使用位於裝載站8處的第二對夾緊構件12a,b夾緊第一晶圓固持器2a；以及使用第二對夾緊構件12a,b將第一晶圓固持器2a從傳輸臂13移開，使得第一晶圓固持器2a僅僅由第二對夾緊構件12a,b固持。在此等實施例中，在第一晶圓固持器或第二晶圓固持器已裝載有待拾取的半導體組件之後，載體5自夾緊構件12a,b接收經裝載的晶圓固持器2a,b，然後將經裝載的晶圓固持器2a,b輸送至拾取站7。The method preferably comprises the steps of: after the transfer member 10 has moved the second wafer holder 2b from the intermediate rest station 9 to the loading station 8, clamping with a second pair of clamping members 12a,b located at the loading station 8 the second wafer holder 2b; and using the second pair of clamping members 12a,b to move the second wafer holder 2b away from the transfer arm 13 so that the second wafer holder 2b is only held by the second pair of clamping members 12a,b hold. Similarly, the method preferably comprises the steps of using the second pair of clamping members 12a located at the loading station 8 after the transfer member 10 has moved the first wafer holder 2a from the intermediate rest station 9 to the loading station 8, b clamping the first wafer holder 2a; and using the second pair of clamping members 12a,b to move the first wafer holder 2a away from the transfer arm 13 so that the first wafer holder 2a is only held by the second pair The clamping members 12a,b hold. In these embodiments, the carrier 5 receives the loaded wafer holders 2a,b from the clamping members 12a,b after the first wafer holder or the second wafer holder has been loaded with the semiconductor components to be picked up , the loaded wafer holders 2 a, b are then transported to the pick-up station 7 .

在實施例中，在裝載站8處將包含待拾取的半導體組件的晶圓裝載至第二晶圓固持器2b上的步驟是在第二晶圓固持器2b僅僅由第二對夾緊構件12a,b固持時進行。類似地，在裝載站8處將包含待拾取的半導體組件的晶圓裝載至第一晶圓固持器2a上的步驟是在第一晶圓固持器2a僅僅由第二對夾緊構件12a,b固持時進行。In an embodiment, the step of loading the wafer containing the semiconductor components to be picked up onto the second wafer holder 2b at the loading station 8 is performed at the second wafer holder 2b by only the second pair of clamping members 12a , b is carried out while holding. Similarly, the step of loading the wafer containing the semiconductor components to be picked up onto the first wafer holder 2a at the loading station 8 is performed in the first wafer holder 2a by only the second pair of clamping members 12a,b Hold while holding.

在不脫離如所附申請專利範圍中定義的本發明之範疇的情況下，本發明所述實施例之各種修改及變化對於熟習此項技術者來說將顯而易見。儘管已經結合特定較佳實施例描述了本發明，但是應理解，所主張之本發明不應不適當地限於此種特定實施例。Various modifications and variations of the described embodiments of this invention will become apparent to those skilled in the art without departing from the scope of the invention as defined in the appended claims. Although the present invention has been described in connection with specific preferred embodiments, it should be understood that the invention as claimed should not be unduly limited to such specific embodiments.

1:總成 2a:第一晶圓固持器 2b:第二晶圓固持器 3:晶圓 3a:半導體組件 5:載體 7:拾取站 8:裝載站 9:中間休息站 10:傳輸構件 11a,11b:第一對夾緊構件 12a,12b:第二對夾緊構件 13:傳輸臂 13b:軌道 20:控制器 31:基底平台構件 32:孔 33:突出部分 34:頂部構件 35:第一邊緣 36:第二邊緣 37:致動器 38:邊緣構件 39:可旋轉台 40:輪構件 41:溝槽 43:偏壓構件 43b:槓桿構件 48a:第一凸輪構件 48b:第二凸輪構件 60:晶圓環 60b:晶圓箔 61a:匣 1: Assembly 2a: First wafer holder 2b: Second wafer holder 3: Wafer 3a: Semiconductor components 5: Carrier 7: Pickup Station 8: Loading Station 9: Intermediate rest stop 10: Transmission components 11a, 11b: The first pair of clamping members 12a, 12b: Second pair of clamping members 13: Transmission arm 13b: Orbit 20: Controller 31: Base Platform Components 32: Hole 33: Highlights 34: Top member 35: First Edge 36: Second Edge 37: Actuator 38: Edge Components 39: rotatable table 40: Wheel member 41: Groove 43: Biasing member 43b: Lever member 48a: first cam member 48b: Second cam member 60: Wafer Ring 60b: Wafer foil 61a: Box

在描述中揭示本發明的示範性實施例且藉由圖式例示出該等實施例，在圖式中： 圖1及圖2提供根據本發明之實施例之總成1的透視圖； 圖3提供在圖1及圖2之總成中使用的第一及第二晶圓固持器及載體的透視圖； 圖4例示出載體將晶圓固持器自拾取站移動至總成的中間休息站的步驟； 圖5及圖6例示出當載體使晶圓固持器向中間休息站中移動時，總成的致動器及凸輪的操作； 圖7a例示出其中藉由第一對夾緊構件提升中間休息站中的第一晶圓固持器以便自載體移除第一晶圓固持器的步驟；圖7a亦例示出已藉由第二對夾緊構件將裝載站中的第二晶圓固持器移動至升高位置以便提供空間來允許載體在第二晶圓固持器下方移動；圖7b例示出在第二晶圓固持器下方移動的載體。 圖8例示出其中使裝載站中的第二晶圓固持器離開圖7所展示的升高位置向下移動至載體上的步驟；且亦例示出在第二晶圓固持器已置放於載體上之後，致動器對載體的操作； 圖9例示出其中將第二晶圓固持器自裝載站移動至拾取站的步驟，第二晶圓固持器已裝載有具有待拾取的半導體組件的晶圓(參見圖7)； 圖10例示出其中藉由傳輸臂將第一晶圓固持器自中間休息站移動至裝載站的步驟； 圖11例示出其中將第一晶圓固持器自傳輸臂傳輸至位於裝載站處的第一對夾緊構件的步驟； 圖12例示出其中將第一晶圓固持器上的空的晶圓(即，已從中拾取了所有半導體組件的晶圓)自第一晶圓固持器移除且置放至匣中的步驟； 圖13例示出其中將具有待拾取的半導體組件的晶圓自匣裝載至第一晶圓固持器上的步驟； 圖14例示出其中將第一晶圓固持器組配來夾緊晶圓且拉伸晶圓箔的步驟；且藉由第一對夾緊構件提升第一晶圓固持器以便提供空間來允許載體在第一晶圓固持器下方移動。 Exemplary embodiments of the invention are disclosed in the description and illustrated by the drawings, in which: 1 and 2 provide perspective views of an assembly 1 according to an embodiment of the present invention; Figure 3 provides a perspective view of the first and second wafer holders and carriers used in the assembly of Figures 1 and 2; Figure 4 illustrates the steps in which the carrier moves the wafer holder from the pick station to the intermediate rest station of the assembly; Figures 5 and 6 illustrate the operation of the actuators and cams of the assembly as the carrier moves the wafer holder into the intermediate rest station; Figure 7a illustrates a step in which the first wafer holder in the intermediate rest station is lifted by a first pair of clamping members for removal from the carrier; Figure 7a also illustrates The clamping member moves the second wafer holder in the loading station to a raised position to provide space to allow the carrier to move under the second wafer holder; Figure 7b illustrates the carrier moving under the second wafer holder . FIG. 8 illustrates the step in which the second wafer holder in the loading station is moved down onto the carrier from the raised position shown in FIG. 7; and also illustrates after the second wafer holder has been placed on the carrier After loading, the actuator operates on the carrier; FIG. 9 illustrates a step in which a second wafer holder is moved from a loading station to a pickup station, the second wafer holder already loaded with wafers with semiconductor components to be picked up (see FIG. 7 ); 10 illustrates the steps in which the first wafer holder is moved from the intermediate rest station to the loading station by the transfer arm; 11 illustrates the steps in which the first wafer holder is transferred from the transfer arm to the first pair of clamping members located at the loading station; 12 illustrates a step in which an empty wafer on the first wafer holder (ie, the wafer from which all semiconductor components have been picked up) is removed from the first wafer holder and placed into a cassette; 13 illustrates a step in which a wafer with semiconductor components to be picked is loaded from a cassette onto a first wafer holder; Figure 14 illustrates the steps in which the first wafer holder is assembled to clamp the wafer and stretch the wafer foil; and the first wafer holder is lifted by the first pair of clamping members to provide space to allow the carrier Move under the first wafer holder.

1:總成 1: Assembly

2a:第一晶圓固持器 2a: First wafer holder

2b:第二晶圓固持器 2b: Second wafer holder

3:晶圓 3: Wafer

3a:半導體組件 3a: Semiconductor components

5:載體 5: Carrier

7:拾取站 7: Pickup Station

8:裝載站 8: Loading Station

9:中間休息站 9: Intermediate rest stop

10:傳輸構件 10: Transmission components

11a,11b:第一對夾緊構件 11a, 11b: The first pair of clamping members

12a,12b:第二對夾緊構件 12a, 12b: Second pair of clamping members

13:傳輸臂 13: Transmission arm

20:控制器 20: Controller

48a:第一凸輪構件 48a: first cam member

48b:第二凸輪構件 48b: Second cam member

Claims (22)

一種總成，其包含， 至少一第一晶圓固持器及一第二晶圓固持器，其中每一者可固持一包含半導體組件的晶圓； 一載體，其選擇性地可操作來攜載該等晶圓固持器中之一者以移動該晶圓固持器； 一拾取站，其中該拾取站包含用以自該晶圓固持器上的一晶圓拾取半導體組件的構件； 一裝載站，其中該裝載站包含用以將一具有半導體組件的晶圓裝載至一晶圓固持器上的構件； 一中間休息站，其包含一可在其中停放一晶圓固持器的區域； 一傳輸構件，其選擇性地可操作來將一晶圓固持器自該中間休息站移動至該裝載站； 一控制器，其經組配來操作該載體及該傳輸構件，使得， 該載體將該第二晶圓固持器自該裝載站移動至該拾取站，其中在該拾取站處，可自固持在該第二晶圓固持器上的一晶圓拾取該晶圓上的半導體組件； 在該載體自該裝載站移動該第二晶圓固持器之後，該傳輸構件將該第一晶圓固持器自該中間休息站移動至該裝載站，使得在自固持在該第二晶圓固持器上的一晶圓拾取該晶圓上的半導體組件時，將一包含待拾取的半導體組件的晶圓裝載至該第一晶圓固持器上。 An assembly comprising, at least a first wafer holder and a second wafer holder, each of which can hold a wafer containing semiconductor components; a carrier selectively operable to carry one of the wafer holders for moving the wafer holder; a pick-up station, wherein the pick-up station includes means for picking up semiconductor components from a wafer on the wafer holder; a loading station, wherein the loading station includes means for loading a wafer with semiconductor components onto a wafer holder; an intermediate rest station including an area in which a wafer holder can be parked; a transfer member selectively operable to move a wafer holder from the intermediate rest station to the loading station; a controller configured to operate the carrier and the transport member such that, The carrier moves the second wafer holder from the loading station to the pickup station, where the semiconductor on the wafer can be picked up from a wafer held on the second wafer holder at the pickup station components; After the carrier moves the second wafer holder from the loading station, the transfer member moves the first wafer holder from the intermediate rest station to the loading station such that the second wafer holder is self-retaining at the second wafer holder When a wafer on the carrier picks up the semiconductor components on the wafer, a wafer containing the semiconductor components to be picked up is loaded onto the first wafer holder. 如請求項1之總成，其中該控制器進一步經組配來操作該載體及傳輸構件，使得在已拾取該第二晶圓固持器上的該晶圓上的半導體組件之後，該載體將該第二晶圓固持器自該拾取站移動至該中間休息站；使得在該第一晶圓固持器位於該裝載站處的同時，該第二晶圓固持器位於該中間休息站處。The assembly of claim 1, wherein the controller is further configured to operate the carrier and transport member such that after the semiconductor components on the wafer on the second wafer holder have been picked up, the carrier The second wafer holder is moved from the pick station to the intermediate rest station; such that the second wafer holder is located at the intermediate rest station while the first wafer holder is located at the loading station. 如請求項1至2中任一項之總成，其中該傳輸構件包含：位於該中間休息站處的第一對夾緊構件；位於該裝載站處的第二對夾緊構件；以及一傳輸臂；其中該傳輸臂經組配以使得它可選擇性地移動至第一位置及第二位置，其中在該第一位置中，該傳輸臂可與由該第一對夾緊構件固持之一晶圓固持器機械配合以固持該晶圓固持器，且在該第二位置中，位於該裝載站處的該第二對夾緊構件可夾緊由該傳輸臂固持之該晶圓固持器。2. The assembly of any one of claims 1 to 2, wherein the transfer member comprises: a first pair of gripping members at the intermediate rest station; a second pair of gripping members at the loading station; and a transfer an arm; wherein the transfer arm is configured such that it can be selectively moved to a first position and a second position, wherein in the first position the transfer arm is engageable with one of the gripping members held by the first pair The wafer holder mechanically cooperates to hold the wafer holder, and in the second position, the second pair of clamping members at the loading station can clamp the wafer holder held by the transfer arm. 如請求項1至3中任一項之總成，其中該第一晶圓固持器及該第二晶圓固持器中之每一者包含：一基底平台構件，其包含一突出部分，一晶圓箔可支撐在該突出部分上，該晶圓箔具有附接至其上的半導體組件；以及一頂部構件，其中該頂部構件具有界定於其中的一孔，該孔可接收該基底平台構件的該突出部分。The assembly of any one of claims 1-3, wherein each of the first wafer holder and the second wafer holder comprises: a base platform member comprising a protrusion, a wafer A round foil can be supported on the protruding portion, the wafer foil having the semiconductor components attached thereto; and a top member, wherein the top member has a hole defined therein that can receive the substrate platform member's the protruding part. 如請求項4之總成，其中該基底平台構件進一步包含一第一邊緣，且該頂部構件包含一第二邊緣，且其中該基底平台構件及該頂部構件可經選擇性地配置來夾緊晶圓環；且其中當該基底平台構件及該頂部構件經選擇性地配置來夾緊該晶圓環時，該基底平台構件的該突出部分向界定於該頂部構件中的該孔中突出，使得附接至該晶圓環的一晶圓箔被拉伸。The assembly of claim 4, wherein the base platform member further includes a first edge and the top member includes a second edge, and wherein the base platform member and the top member are selectively configurable to clamp the crystal and wherein when the base platform member and the top member are selectively configured to clamp the wafer ring, the protruding portion of the base platform member projects into the hole defined in the top member such that A wafer foil attached to the wafer ring is stretched. 如請求項4或5之總成，其中該第一晶圓固持器及該第二晶圓固持器中之每一者包含一可旋轉台，其中該基底平台構件附接至該可旋轉台；其中該可旋轉台包含一邊緣構件。The assembly of claim 4 or 5, wherein each of the first wafer holder and the second wafer holder comprises a rotatable table, wherein the base platform member is attached to the rotatable table; Wherein the rotatable table includes an edge member. 如請求項6之總成，其中該載體包含一致動器，當該晶圓固持器支撐在該載體上時，該致動器可與該邊緣構件機械配合；且其中該致動器可經選擇性地操作來旋轉該可旋轉台。The assembly of claim 6, wherein the carrier includes an actuator that can mechanically cooperate with the edge member when the wafer holder is supported on the carrier; and wherein the actuator is selectable operate to rotate the rotatable table. 如請求項7之總成，其中該致動器包含一輪構件，該輪構件包含一溝槽，且其中該溝槽所具有的尺寸使得當該晶圓固持器支撐在該載體上時，該可旋轉台的該邊緣構件抵接一界定出該溝槽的表面。The assembly of claim 7, wherein the actuator includes a wheel member, the wheel member includes a groove, and wherein the groove has dimensions such that when the wafer holder is supported on the carrier, the The edge member of the rotary table abuts a surface defining the groove. 如請求項7或8之總成，其中該致動器進一步包含一偏壓構件，當該晶圓固持器支撐在該載體上時，該偏壓構件將該輪構件朝向該可旋轉台之抵接邊緣構件偏壓；且其中該偏壓構件進一步包含一槓桿構件，該槓桿構件經組配以使得當一力施加至該槓桿構件時，該輪構件抵抗該偏壓構件而在離開該邊緣構件的一方向上移動。The assembly of claim 7 or 8, wherein the actuator further comprises a biasing member that abuts the wheel member toward the rotatable table when the wafer holder is supported on the carrier an edge member is biased; and wherein the biasing member further comprises a lever member configured such that when a force is applied to the lever member, the wheel member resists the biasing member away from the edge member move in the direction. 如請求項9之總成，其中該總成進一步包含一第一凸輪構件，其中該第一凸輪構件經定位以使得當該載體向該中間休息站中移動時，該載體向該中間休息站中的該移動致使該第一凸輪構件將一力施加至該槓桿構件，使得位於該中間休息站處的該第一對夾緊構件將該晶圓固持器從該載體移開之前，該輪構件抵抗該偏壓構件而在離開該邊緣構件的一方向上移動。The assembly of claim 9, wherein the assembly further comprises a first cam member, wherein the first cam member is positioned such that when the carrier moves into the intermediate rest station, the carrier moves toward the intermediate rest station The movement of causes the first cam member to apply a force to the lever member such that the wheel member resists the first pair of clamping members at the intermediate rest stop before moving the wafer holder from the carrier The biasing member moves in a direction away from the edge member. 如請求項9之總成，其中該總成進一步包含一第二凸輪構件，其中該第二凸輪構件經定位以使得當該載體向該裝載中移動時，該載體向該裝載站中的該移動致使該第二凸輪構件將一力施加至該槓桿構件，使得該輪構件抵抗該偏壓構件而移動，使得該輪構件從正在該裝載站處傳遞至該載體上之該晶圓固持器的該可旋轉台的該邊緣構件的路徑中移出。The assembly of claim 9, wherein the assembly further comprises a second cam member, wherein the second cam member is positioned such that when the carrier moves into the loading, the carrier moves into the loading station causing the second cam member to apply a force to the lever member causing the wheel member to move against the biasing member such that the wheel member is transferred from the loading station to the wafer holder on the carrier The edge member of the rotatable table is moved out of the path. 如請求項11之總成，其中當該載體從該裝載站中移出時，該第二凸輪施加至該槓桿構件的該力被移除且該偏壓構件使該輪構件移動到已傳遞至該載體上之該晶圓固持器的該可旋轉台的抵接邊緣構件。The assembly of claim 11, wherein when the carrier is removed from the loading station, the force applied by the second cam to the lever member is removed and the biasing member moves the wheel member to a position that has been transmitted to the The abutment edge member of the rotatable stage of the wafer holder on the carrier. 一種使用如請求項1之總成處理半導體晶圓之方法，該方法包含以下步驟， 使用該載體將該第二晶圓固持器自該裝載站移動至該拾取站； 在該載體自該裝載站移動該第二晶圓固持器之後，使用該傳輸構件將該第一晶圓固持器自該中間休息站移動至該裝載站； 在該拾取站處自固持在該第二晶圓固持器上的一晶圓拾取半導體組件； 在自固持在該第二晶圓固持器上的一晶圓拾取該晶圓上的半導體組件時，在該裝載站處將一包含待拾取的半導體組件的晶圓裝載至該第一晶圓固持器上。 A method of processing a semiconductor wafer using the assembly of claim 1, the method comprising the steps of, moving the second wafer holder from the loading station to the pickup station using the carrier; using the transfer member to move the first wafer holder from the intermediate rest station to the loading station after the carrier moves the second wafer holder from the loading station; Picking up semiconductor components from a wafer held on the second wafer holder at the pick station; When picking up semiconductor components on a wafer held on the second wafer holder, a wafer containing the semiconductor components to be picked up is loaded onto the first wafer holder at the loading station on the device. 如請求項13之方法，其進一步包含以下步驟， 在已拾取該第二晶圓固持器上的該晶圓上的半導體組件之後，將該第二晶圓固持器自該拾取站移動至該中間休息站，使得在該第一晶圓固持器位於該裝載站處的同時，該第二晶圓固持器位於該中間休息站處； 在該中間休息站處將該第二晶圓固持器自該載體傳輸至該傳輸構件； 將該載體自該中間休息站移動至該裝載站，且將該第一晶圓固持器傳輸至該載體上； 使用該載體將該第一晶圓固持器自該裝載站移動至該拾取站； 在該載體自該裝載站移動該第一晶圓固持器之後，使用該傳輸構件將該第二晶圓固持器自該中間休息站移動至該裝載站。 The method of claim 13, further comprising the steps of, After the semiconductor components on the wafer on the second wafer holder have been picked up, the second wafer holder is moved from the pickup station to the intermediate rest station such that the first wafer holder is located at While at the loading station, the second wafer holder is located at the intermediate rest station; transferring the second wafer holder from the carrier to the transfer member at the intermediate rest station; moving the carrier from the intermediate rest station to the loading station and transferring the first wafer holder onto the carrier; moving the first wafer holder from the loading station to the pickup station using the carrier; After the carrier moves the first wafer holder from the loading station, the second wafer holder is moved from the intermediate rest station to the loading station using the transfer member. 如請求項13或14之方法，其進一步包含以下步驟， 在該拾取站處自固持在該第一晶圓固持器上的一晶圓拾取半導體組件； 在自固持在該第一晶圓固持器上的一晶圓拾取該晶圓上的半導體組件時，在該裝載站處將一包含待拾取的半導體組件的晶圓裝載至該第二晶圓固持器上。 The method of claim 13 or 14, further comprising the steps of, Picking up semiconductor components from a wafer held on the first wafer holder at the pick station; When picking up semiconductor components on a wafer held on the first wafer holder, a wafer containing the semiconductor components to be picked up is loaded at the loading station to the second wafer holder on the device. 如請求項13、14及15之方法，其中該方法進一步包含將請求項13至15之該等步驟重複多次。The method of claims 13, 14 and 15, wherein the method further comprises repeating the steps of claims 13 to 15 multiple times. 如請求項13之方法，其中在該裝載站處將一包含待拾取的半導體組件的晶圓裝載至該第一晶圓固持器上的該步驟包含：將一晶圓環傳輸至該第一晶圓固持器的一基底平台構件上，該晶圓環包含附接至其上的一晶圓箔，且該晶圓包含附接至該晶圓箔的半導體組件；以及移動該第一晶圓固持器的一頂部構件，使得該晶圓環夾緊在該第一晶圓固持器的該基底平台構件與該頂部構件之間；以及使該基底平台構件的一突出部分向界定於該頂部構件中的一孔中移動，使得該晶圓箔被拉伸。The method of claim 13, wherein the step of loading a wafer containing semiconductor components to be picked onto the first wafer holder at the loading station comprises: transferring a wafer ring to the first wafer on a base platform member of a circular holder, the wafer ring includes a wafer foil attached thereto, and the wafer includes semiconductor components attached to the wafer foil; and moving the first wafer holder a top member of the first wafer holder so that the wafer ring is clamped between the base platform member and the top member of the first wafer holder; and a protruding portion of the base platform member is defined in the top member move in a hole so that the wafer foil is stretched. 如請求項15之方法，其中在該裝載站處將一包含待拾取的半導體組件的晶圓裝載至該第二晶圓固持器上的該步驟包含：將一晶圓環傳輸至該第二晶圓固持器的一基底平台構件上，該晶圓環包含附接至其上的一晶圓箔，且該晶圓包含附接至該晶圓箔的半導體組件；以及移動該第二晶圓固持器的一頂部構件，使得該晶圓環夾緊在該第二晶圓固持器的該基底平台構件與該頂部構件之間；以及使該基底平台構件的一突出部分向界定於該頂部構件中的一孔中移動，使得該晶圓箔被拉伸。16. The method of claim 15, wherein the step of loading a wafer containing semiconductor components to be picked onto the second wafer holder at the loading station comprises: transferring a wafer ring to the second wafer on a base platform member of a circular holder, the wafer ring includes a wafer foil attached thereto, and the wafer includes semiconductor components attached to the wafer foil; and moving the second wafer holder a top member of the second wafer holder so that the wafer ring is clamped between the base platform member and the top member of the second wafer holder; and a protruding portion of the base platform member is defined in the top member move in a hole so that the wafer foil is stretched. 如請求項14之方法，其中在該中間休息站處將該第二晶圓固持器自載該體傳輸至該傳輸構件的該步驟包含：使用位於該中間休息站處的第一對夾緊構件夾緊該第二晶圓固持器；使用該第一對夾緊構件使該第二晶圓固持器朝向一傳輸臂移動，使得該傳輸臂與該第二晶圓固持器機械配合；將該第一對夾緊構件從該第二晶圓固持器移開，使得該第二晶圓固持器僅僅由該傳輸臂固持。15. The method of claim 14, wherein the step of self-carrying the body to the transfer member at the intermediate rest station by transferring the second wafer holder comprises: using a first pair of clamping members located at the intermediate rest station clamping the second wafer holder; using the first pair of clamping members to move the second wafer holder toward a transfer arm so that the transfer arm mechanically cooperates with the second wafer holder; A pair of clamping members are moved away from the second wafer holder so that the second wafer holder is held only by the transfer arm. 如請求項14之方法，其中使用該傳輸構件將該第二晶圓固持器自該中間休息站移動至該裝載站的該步驟包含：移動該傳輸臂，使得該傳輸臂將該第二晶圓固持器自該中間休息站移動至該裝載站。The method of claim 14, wherein the step of using the transfer member to move the second wafer holder from the intermediate rest station to the loading station comprises: moving the transfer arm such that the transfer arm moves the second wafer The holder moves from the intermediate rest station to the loading station. 如請求項20之方法，其包含以下步驟：使用位於該裝載站處的第二對夾緊構件夾緊該第二晶圓固持器；使用該第二對夾緊構件將該第二晶圓固持器從該傳輸臂移開，使得該第二晶圓固持器僅僅由該第二對夾緊構件固持。20. The method of claim 20, comprising the steps of: clamping the second wafer holder using a second pair of clamping members at the loading station; holding the second wafer using the second pair of clamping members The carrier is removed from the transfer arm so that the second wafer holder is held only by the second pair of clamping members. 如請求項21之方法，其中在該裝載站處將一包含待拾取的半導體組件的晶圓裝載至該第二晶圓固持器上的該步驟，是在該第二晶圓固持器僅僅由該第二對夾緊構件固持時進行。21. The method of claim 21, wherein the step of loading a wafer containing semiconductor components to be picked onto the second wafer holder at the loading station is performed at the loading station by the second wafer holder only by the This is done while the second pair of clamping members is being held.
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